WO2007043192A1 - Welding device - Google Patents

Welding device Download PDF

Info

Publication number
WO2007043192A1
WO2007043192A1 PCT/JP2005/022925 JP2005022925W WO2007043192A1 WO 2007043192 A1 WO2007043192 A1 WO 2007043192A1 JP 2005022925 W JP2005022925 W JP 2005022925W WO 2007043192 A1 WO2007043192 A1 WO 2007043192A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
welding apparatus
opening
reactor
heat
Prior art date
Application number
PCT/JP2005/022925
Other languages
French (fr)
Japanese (ja)
Inventor
Shinsuke Shimabayashi
Motoyasu Nagano
Naoki Kobayashi
Yoshiyuki Tabata
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2007043192A1 publication Critical patent/WO2007043192A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/003Cooling means

Definitions

  • the present invention relates to a welding apparatus that mounts a heat generating component such as an inverter circuit to generate an arc.
  • inverter-controlled welding apparatuses equipped with an inverter circuit capable of high-speed switching in a power control circuit have become widespread. Also, as the control frequency is increased, the heat generated by the switching element increases, and cooling of the switching element is regarded as important.
  • a conventional inverter welding apparatus disclosed in Japanese Utility Model Laid-Open No. 61-53074 or Japanese Patent Laid-Open No. 8-214549 has a cooling fin for cooling a semiconductor element necessary for driving the inverter and generates heat. It is equipped with a transformer and reactor that reach high temperatures. They are all arranged in one area inside the enclosure, and cooling fins, transformers and reactors are cooled by large cooling fans.
  • the semiconductor element is a switching element such as a diode, a thyristor, or a transistor.
  • FIG. 5 is a side perspective view of a conventional welding apparatus 5001 disclosed in Japanese Utility Model Laid-Open No. 61-53074.
  • the welding apparatus 5001 includes a semiconductor element 102 such as a thyristor transistor, a cooling fin 103 for cooling the semiconductor element 102, a transformer 104 for converting electric power, a reactor 105 for smoothing an output current, a cooling fin 103, and a transformer. 104 and a fan 106 for cooling the reactor 105, a control device 107 for controlling the semiconductor element 102, and a partition member 108 provided to secure an area for preventing the control device 107 from dust. These are arranged in the housing 101.
  • the fan 106 is installed so that the wind flows in the vertical direction.
  • the partition member 108 divides the interior of the housing 101 above the fan 106 into an upper region 111 and a lower region 109.
  • a control device 107 is arranged in the area 111.
  • the semiconductor element 102 that generates heat at a high temperature in the region 109, the cooling fin 103 that cools the semiconductor element 102, the transformer 104, and the reactor 105 are arranged to exhaust or absorb external air
  • the fan 106 enters and is blown to cool it.
  • the welding apparatus 5001 further includes wiring and various components necessary for welding, but a description thereof is omitted.
  • FIG. 6 is a side perspective view of another conventional welding apparatus 5002 disclosed in Japanese Patent Laid-Open No. 8-214549.
  • the welding apparatus 5002 includes a semiconductor element 2102 necessary for driving the inverter, a cooling fin 2103 for cooling the semiconductor element 2102, a transformer 2104 for converting electric power, a reactor 2105 for smoothing the output current, and a cooling P fin. 2103, fan lance 2104, fan 106 for cooling reactor 2105, control device 2107 for controlling inverter drive, partition member 2108 for securing an area for preventing semiconductor element 2102 and control device 2107 from dust These are arranged inside the housing 2101.
  • the partition member 2108 is provided with a through hole 2110 having a size that allows the semiconductor element 2102 to pass therethrough.
  • the partition member 2108 separates the inside of the housing 2101 into an upper region 2111 and a lower region 2109.
  • the semiconductor element 2102 is passed through the through hole 2110 of the partition member 2108.
  • a control device 2107 is arranged on the partition member 2108 in the region 2111.
  • cooling fins 2103, a transformer 2104, and a reactor 2105 for cooling a semiconductor element 2102 that generates heat at a high temperature are arranged in a region 2109, and a fan 2106 that exhausts or sucks air from the outside is used to generate air. Is hit and cooled. Fan 2106 blows wind horizontally.
  • the welding apparatus 5002 further includes wiring and various components necessary for welding, but the description is omitted.
  • the fan 106 is relatively large and cools all the heating elements in the regions 109 and 2109 so that the wind flows in a wide range in the regions 109 and 2109.
  • components that generate heat at high temperatures such as transformer 104 and reactor 105, are arranged in the same region 109 as cooling fin 103. Therefore, the temperature in the region 109 increases due to the heat generated by the transformer 104, and the cooling efficiency of the cooling fin 103 decreases due to the influence.
  • the fan 106 since the region 109 is wide, the fan 106 needs to be enlarged. Even if the fan 106 is large-sized, the cooling air generated by the fan 106 is diffused in the region 109, and high-temperature parts such as the transformer 104 can be preferentially cooled, so that it cannot be locally cooled. Therefore, cooling fin 103, The cooling efficiency of the lance 104 and the reactor 105 is lowered, and the reliability of the welding devices 5001 and 5002 is lowered.
  • the amount of heat generated in the region 109 increases, so that the temperature in the region 109 further increases.
  • This welding apparatus has a casing, a partition member that divides the interior of the casing into a first region and a second region, and a tunnel-shaped passage that allows air to flow through the first region and the second region.
  • FIG. 1 is a circuit block diagram of a welding apparatus in an embodiment of the present invention.
  • FIG. 2 is a perspective perspective view of the welding apparatus in the embodiment.
  • FIG. 3 is a perspective perspective view of the welding apparatus in the embodiment.
  • FIG. 4 is a perspective view of a heat dissipation unit used in the welding apparatus in the embodiment.
  • FIG. 5 is a side perspective view of a conventional welding apparatus.
  • FIG. 6 is a side perspective view of another conventional welding apparatus.
  • FIG. 1 is a circuit block diagram of welding apparatus 1001 according to the embodiment of the present invention.
  • the voltage supplied from the commercial power source 21 is rectified by the rectifier diode 22 and smoothed by the reactor 23 and the smoothing capacitor 24 to become a DC voltage.
  • the DC voltage is switched by the semiconductor element 25. It is switched to a high frequency voltage.
  • the main transformer 26 boosts the high frequency voltage.
  • the boosted high-frequency voltage is converted into a DC voltage by the rectifier diode 27.
  • the high frequency component of the DC voltage is cut by the reactor 28 to improve the quality of the weld.
  • a torch cable 29A and a base material cable 29B are connected to the output terminal 29, so that welding force S can be achieved.
  • the control device 30 includes a DC power supply board 31 and a control board 32, and controls the semiconductor element 25 in order to realize a value set by the operator, thereby stabilizing the quality of welding.
  • the semiconductor element 25 has a snubber 14 for overvoltage protection.
  • the reactor 23, the smoothing capacitor 24, the main transformer 26, and the reactor 28 are electric elements that generate a large amount of heat.
  • the rectifier diode 22, the semiconductor element 25, the rectifier diode 27, and the snubber 14 are electrical elements that generate a large amount of heat and require heat dissipation.
  • the control device 30 is an electric element that is less susceptible to heat than these electric elements and whose reliability decreases at a high temperature.
  • FIG. 2 and 3 are perspective perspective views of the welding apparatus 1001.
  • FIG. The welding apparatus 1001 has a housing 1.
  • the partition members 2 and 3 divide the inside of the housing 1 into a plurality of regions. That is, the interior of the housing 1 is divided into an upper region 4 and a region 4 above the partition member 2, a region 5 below the partition member 2 and above the partition member 3, and a region 6 below the partition member 3. Regions 4, 5, and 6 are located from the top.
  • the welding apparatus 1001 includes a grommet 7, a heat radiating unit 8 provided in the region 5, a fan 11, a side plate 12 constituting the housing 1, a snubber 14, and a bottom plate 16 constituting the housing 1. Include.
  • the fan 11 is provided in the opening 9 of the heat dissipation unit 8.
  • An opening 13 is formed in a portion of the side plate 12 facing the region 5.
  • An opening 15 is provided in a portion of the side plate 12 facing the region 6.
  • An opening 17 is formed in the bottom plate 16.
  • a control device 30 is arranged in the region 4 of the housing 1.
  • the partition member 2 that separates the region 4 and the region 5 is provided with a hole 7A for passing the wiring.
  • Grommet 7 is attached to hole 7A so that air does not enter from area 5 to area 4 through hole 7A, allowing only wiring to pass.
  • the heat dissipating unit 8 includes an outer peripheral portion 8B that forms a hollow portion inside, and has a substantially tunnel shape for allowing air to flow between the region 5 and the region 6.
  • An opening 9 and an opening 10 through which air flows are provided at both ends of the cavity of the heat dissipation unit 8. Opening 9 is located in region 5.
  • the opening 10 is located on the surface of the partition member 3 or in the region 6 and opens in the region 6.
  • the fan 11 is disposed in the opening 9, and air is circulated through the cavity of the heat dissipation unit 8.
  • the partition member 3 is provided with a through-hole having the same size as the opening 10 at a position facing the opening 10.
  • FIG. 4 is a perspective view of the heat dissipation unit 8.
  • the heat radiating fins 18 are disposed substantially in parallel with the flow of air flowing through the cavity 8 A in the heat radiating unit 8. The explanation is omitted because it is the same as
  • a rectifier diode 22 and a semiconductor element 25 are arranged in direct contact with the outer peripheral portion 8B of the heat dissipation unit 8.
  • the smoothing capacitor 24 is indirectly disposed at a predetermined interval from the outer peripheral portion 8B of the heat dissipation unit 8.
  • a plurality of openings 13 are provided at positions facing the region 5 of the side plate 12 constituting the housing 1. When the cooling fan 11 is driven, outside air is sucked into the housing 1 from the opening 13 and the sucked air flows into the fan 11.
  • the opening position and the number of the openings 13 are appropriately determined so that the air flowing into the fan 11 wraps around the smoothing capacitor 24 and the snubber 14, and the smoothing capacitor 24 and the snubber 14 are efficiently cooled.
  • the partition member 3 that separates the region 5 and the region 6 is provided with a hole 7B through which wiring is passed.
  • a grommet 7 is attached to the hole 7B and only the wiring passes.
  • a reactor 23, a main transformer 26, and a reactor 28 are disposed below the opening 10 of the heat dissipating unit 8 in the region 6.
  • the heat radiation unit 8 may be arranged at a position where the reactor 23, the main transformer 26, and the reactor 28 have a high cooling effect. Since the main transformer 26 and the reactor 28 generate a large amount of heat, it is effective to arrange the opening 10 of the heat radiating unit 8 directly above the main transformer 26 and the reactor 28. With such an arrangement, the air that has passed through the cavity 8A of the heat radiating unit 8 and is blown out from the opening 10 directly hits the main transformer 26 and the reactor 28, and these can be efficiently cooled. The same effect can be obtained by fixing the heat radiating unit 8 without changing the position and disposing the main transformer 26 and the reactor 28 directly below the opening 10 of the heat radiating unit 8.
  • a plurality of openings 15 are provided at positions facing the region 6 of the side plate 12 constituting the housing 1.
  • a plurality of openings 17 are provided at positions facing the region 6 of the bottom plate 16 constituting the housing 1. Air in the heated area 6 is discharged from the openings 15, 17 to the outside of the housing 1. , The temperature in region 6 can be lowered. Air flows from the opening 10 of the heat dissipation unit 8 into the region 6 by the fan 11, flows so as to wrap around the reactor 23, the main transformer 26, and the reactor 28, and is discharged from the opening 15 and 17 to the outside of the housing 1. Is done. The positions and number of the openings 15 and 17 are determined so as to obtain the air flow that cools the reactor 23, the main transformer 26, and the reactor 28 most efficiently.
  • the air from the region 5 does not enter the region 4 where the control device 30 is located by the partition member 2 and the grommet 7. Therefore, the temperature in the region 4 can be kept lower than the temperature in the region 5 heated by the semiconductor element 25 or the like, and the reliability of the control device 30 can be improved.
  • the main transformer 26 and reactors 23 and 28 arranged in the region 6 have a very high temperature in the region 6 that generates a large amount of heat.
  • the temperature in the region 5 is determined from the reactor 23, the main transformer 26, and the reactor 28. It can be kept at a relatively low temperature without being affected by the heat. Accordingly, since the air in the region 5 sent to the heat radiating unit 8 by the fan 11 is relatively low in temperature, the rectifier diode 22 and the semiconductor element 25 arranged directly on the outer peripheral portion 8B of the heat radiating unit 8 are efficiently cooled.
  • the partition member 3 when the partition member 3 is not present, air heated by a member having a large calorific value such as the reactor 23, the main transformer 26, the reactor 28, etc. disposed in the region 6 Get in. In this case, the air is sucked into the fan 11 arranged in the region 5, and the heated air flows in the cavity 8A of the heat radiating unit 8, so that the heat radiating efficiency of the heat radiating unit 8 is lowered.
  • the heat dissipation efficiency of the heat dissipation unit 8 is lowered, the temperature of the rectifier diode 22 and the semiconductor element 25 is increased, and the reliability of the rectifier diode 22 and the semiconductor element 25 is lowered.
  • the temperature difference between the region 5 and the region 6 when the partition member 3 is provided is about 20 ° C.
  • the rectifier diode 27 is also directly mounted on the outer peripheral portion 8 B of the heat radiating unit 8. Like the diode 22 and the semiconductor element 25, the rectifier diode 27 can be efficiently cooled and improved in reliability by separating the interior of the housing 1 into the regions 5 and 6 by the cutting member 3. it can.
  • a main transformer 26 and a reactor 28, which generate heat and become high temperature, are disposed below the opening 10 of the heat dissipation unit 8 through which air from the fan 11 is blown. With this arrangement, air can be directly applied to the main transformer 26 and the reactor 28, and the main transformer 26 and the reactor 28 can be efficiently cooled.
  • the side plate 12 can be replaced to change the opening.
  • the position and number of the part 13 and the opening 15 can be changed.
  • the position and number of the openings 17 can be changed by replacing the bottom plate 16.
  • the direction of the wind can be changed so that the wind flows through the parts to be cooled, and the cooling efficiency can be increased.
  • the dust in the region 6 can be discharged to the lower side of the bottom plate 17 through the opening 17 and the accumulation of dust in the region 6 can be suppressed.
  • the height of the side plate 12 is changed and the attachment position of the partition member 2 is changed even if the number of parts of the control apparatus 30 and the size of the parts are changed. By changing it, the height of area 4 can be changed, and the necessary space can be secured. Even in this case, since the basic structure of the welding apparatus 1001 does not change, the above-described effects relating to cooling can be obtained.
  • the interior of the housing 1 is divided into three regions by two partition members.
  • the number of partition members and areas is not limited to this one
  • the inside of the housing 1 can be divided into two areas, for example, the area 4 and the area 5 or the area 5 and the area 6 can be divided.
  • the interior of the housing 1 may be divided into four or more areas by three or more partition members.
  • the embodiment is widely useful not only for welding apparatuses but also for apparatuses that incorporate an electrical element with a large amount of heat generation and require cooling.
  • the welding apparatus according to the present invention can efficiently cool a member provided in the casing, and is useful as an electric device incorporating a member that generates high heat.

Abstract

Disclosed is a welding device comprising a casing, a partition member for dividing the inner space of the casing into a first region and a second region, a tunnel-shaped heat dissipating unit for circulating the air between the first region and the second region, a fan for passing the air through a hollow portion of the heat dissipating unit, a first electric element arranged in the first region, and a second electric element arranged in the second region. This welding device attains high reliability since the temperature in the second region is lowered.

Description

明 細 書  Specification
溶接装置  Welding equipment
技術分野  Technical field
[0001] 本発明はインバータ回路等の発熱部品を搭載してアークを発生する溶接装置に関 する。  TECHNICAL FIELD [0001] The present invention relates to a welding apparatus that mounts a heat generating component such as an inverter circuit to generate an arc.
背景技術  Background art
[0002] 近年、溶接装置の小型化や高性能化を図るため、電力制御回路に高速スィッチン グが可能なインバータ回路を搭載したインバータ制御の溶接装置が普及している。ま た、制御周波数の高周波化に伴いスイッチング素子の発熱が高くなり、スイッチング 素子の冷却が重要視されてレ、る。  In recent years, in order to reduce the size and performance of welding apparatuses, inverter-controlled welding apparatuses equipped with an inverter circuit capable of high-speed switching in a power control circuit have become widespread. Also, as the control frequency is increased, the heat generated by the switching element increases, and cooling of the switching element is regarded as important.
[0003] 実開昭 61— 53074号公報ゃ特開平 8— 214549号公報に開示されている従来の インバータ溶接装置は、インバータ駆動に必要な半導体素子を冷却するための冷却 フィンと、発熱して高温となるトランスやリアクタとを備えている。それらが筐体内部の 1 つの領域内に全て配置されているおり、大型の冷却ファンにより冷却フィンやトランス やリアクタを冷却する。半導体素子は、例えば、ダイオードやサイリスタ、トランジスタ 等のスイッチング素子である。  [0003] A conventional inverter welding apparatus disclosed in Japanese Utility Model Laid-Open No. 61-53074 or Japanese Patent Laid-Open No. 8-214549 has a cooling fin for cooling a semiconductor element necessary for driving the inverter and generates heat. It is equipped with a transformer and reactor that reach high temperatures. They are all arranged in one area inside the enclosure, and cooling fins, transformers and reactors are cooled by large cooling fans. The semiconductor element is a switching element such as a diode, a thyristor, or a transistor.
[0004] 図 5は実開昭 61— 53074号公報に開示されている従来の溶接装置 5001の側面 透視図である。溶接装置 5001は、サイリスタゃトランジスタなどの半導体素子 102と 、半導体素子 102を冷却するための冷却フィン 103と、電力を変換するトランス 104と 、出力電流を平滑するリアクタ 105と、冷却フィン 103とトランス 104とリアクタ 105を冷 却するためのファン 106と、半導体素子 102を制御する制御装置 107と、制御装置 1 07を粉塵から防ぐための領域を確保するために設けられた仕切り部材 108とを備え 、これらは筐体 101内に配置されている。ファン 106は鉛直方向に風を流すように取 り付けられている。仕切り部材 108はファン 106の上側に筐体 101の内部を上側の領 域 111と下側の領域 109に分離する。領域 111内に制御装置 107が配置されてレ、る 。領域 109内に高温に発熱する半導体素子 102と半導体素子 102を冷却する冷却 フィン 103とトランス 104とリアクタ 105が配置され、外部からの空気を排出または吸 入するファン 106により風が当てられて冷却される。なお溶接装置 5001は溶接に必 要な配線や様々な構成物をさらに備えるが、説明を省略する。 FIG. 5 is a side perspective view of a conventional welding apparatus 5001 disclosed in Japanese Utility Model Laid-Open No. 61-53074. The welding apparatus 5001 includes a semiconductor element 102 such as a thyristor transistor, a cooling fin 103 for cooling the semiconductor element 102, a transformer 104 for converting electric power, a reactor 105 for smoothing an output current, a cooling fin 103, and a transformer. 104 and a fan 106 for cooling the reactor 105, a control device 107 for controlling the semiconductor element 102, and a partition member 108 provided to secure an area for preventing the control device 107 from dust. These are arranged in the housing 101. The fan 106 is installed so that the wind flows in the vertical direction. The partition member 108 divides the interior of the housing 101 above the fan 106 into an upper region 111 and a lower region 109. A control device 107 is arranged in the area 111. The semiconductor element 102 that generates heat at a high temperature in the region 109, the cooling fin 103 that cools the semiconductor element 102, the transformer 104, and the reactor 105 are arranged to exhaust or absorb external air The fan 106 enters and is blown to cool it. The welding apparatus 5001 further includes wiring and various components necessary for welding, but a description thereof is omitted.
[0005] 図 6は特開平 8— 214549号公報に開示されている他の従来の溶接装置 5002の 側面透視図である。溶接装置 5002は、インバータ駆動に必要な半導体素子 2102と 、半導体素子 2102を冷却するための冷却フィン 2103と、電力を変換するトランス 21 04と、出力電流を平滑するリアクタ 2105と、冷去 Pフィン 2103や卜ランス 2104やリアク タ 2105を冷却するためのファン 106と、インバータ駆動を制御する制御装置 2107と 、半導体素子 2102と制御装置 2107を粉塵から防ぐための領域を確保するための 仕切り部材 2108とを備え、これらは筐体 2101の内部に配置されている。仕切り部材 2108には、半導体素子 2102が揷通可能な大きさの貫通孔 2110が設けられている 。仕切り部材 2108は筐体 2101の内部を上側の領域 2111と下側の領域 2109に分 離する。仕切り部材 2108の貫通孔 2110から半導体素子 2102が揷通されている。 領域 2111の仕切り部材 2108上に制御装置 2107が配置されている。溶接装置 500 2では、領域 2109内に高温に発熱する半導体素子 2102を冷却する冷却フィン 210 3とトランス 2104とリアクタ 2105が配置されており、外部からの空気を排出または吸 入するファン 2106によって風が当られて冷却される。ファン 2106は水平方向に風を 流す。なお溶接装置 5002は溶接に必要な配線や様々な構成物をさらに備えるが、 説明を省略する。 FIG. 6 is a side perspective view of another conventional welding apparatus 5002 disclosed in Japanese Patent Laid-Open No. 8-214549. The welding apparatus 5002 includes a semiconductor element 2102 necessary for driving the inverter, a cooling fin 2103 for cooling the semiconductor element 2102, a transformer 2104 for converting electric power, a reactor 2105 for smoothing the output current, and a cooling P fin. 2103, fan lance 2104, fan 106 for cooling reactor 2105, control device 2107 for controlling inverter drive, partition member 2108 for securing an area for preventing semiconductor element 2102 and control device 2107 from dust These are arranged inside the housing 2101. The partition member 2108 is provided with a through hole 2110 having a size that allows the semiconductor element 2102 to pass therethrough. The partition member 2108 separates the inside of the housing 2101 into an upper region 2111 and a lower region 2109. The semiconductor element 2102 is passed through the through hole 2110 of the partition member 2108. A control device 2107 is arranged on the partition member 2108 in the region 2111. In the welding apparatus 5002, cooling fins 2103, a transformer 2104, and a reactor 2105 for cooling a semiconductor element 2102 that generates heat at a high temperature are arranged in a region 2109, and a fan 2106 that exhausts or sucks air from the outside is used to generate air. Is hit and cooled. Fan 2106 blows wind horizontally. The welding apparatus 5002 further includes wiring and various components necessary for welding, but the description is omitted.
[0006] 従来の溶接装置 5001、 5002では、領域 109、 2109内の広範囲に風が流れるよう に、ファン 106は比較的大型であり領域 109, 2109内部の全ての発熱体を冷却する  [0006] In conventional welding apparatuses 5001 and 5002, the fan 106 is relatively large and cools all the heating elements in the regions 109 and 2109 so that the wind flows in a wide range in the regions 109 and 2109.
[0007] 従来の溶接装置 5001では、トランス 104やリアクタ 105といった高温に発熱する部 品が冷却フィン 103と同じ領域 109に配置されている。したがって、トランス 104ゃリ ァクタ 105の発熱により領域 109内の温度が高くなり、その影響により冷却フィン 103 の冷却効率が低下する。 In conventional welding apparatus 5001, components that generate heat at high temperatures, such as transformer 104 and reactor 105, are arranged in the same region 109 as cooling fin 103. Therefore, the temperature in the region 109 increases due to the heat generated by the transformer 104, and the cooling efficiency of the cooling fin 103 decreases due to the influence.
[0008] また、領域 109は広いのでファン 106を大型にする必要がある。ファン 106を大型 にしても、ファン 106が生じる冷却風は領域 109内で散漫し、トランス 104等の高温の 部品を優先的に冷却するために局所的に冷却できなレ、。よって、冷却フィン 103、ト ランス 104、リアクタ 105の冷却効率が低下し、溶接装置 5001、 5002の信頼性が低 下する。 [0008] Further, since the region 109 is wide, the fan 106 needs to be enlarged. Even if the fan 106 is large-sized, the cooling air generated by the fan 106 is diffused in the region 109, and high-temperature parts such as the transformer 104 can be preferentially cooled, so that it cannot be locally cooled. Therefore, cooling fin 103, The cooling efficiency of the lance 104 and the reactor 105 is lowered, and the reliability of the welding devices 5001 and 5002 is lowered.
[0009] 溶接装置の仕様に基づきトランス 104やリアクタ 105などの部品の数が増えた場合 、領域 109内の発熱量が増えるので、さらに領域 109内の温度が上昇する。  When the number of parts such as the transformer 104 and the reactor 105 is increased based on the specifications of the welding apparatus, the amount of heat generated in the region 109 increases, so that the temperature in the region 109 further increases.
発明の開示  Disclosure of the invention
[0010] この溶接装置は、筐体と、筐体の内部を第 1の領域と第 2の領域に分ける仕切り部 材と、第 1の領域と第 2の領域に空気を流通させるトンネル形状の放熱ユニットと、放 熱ユニットの空洞部に空気を流通させるためのファンと、第 1の領域内に設けられた 第 1の電気素子と、第 2の領域内に設けられた第 2の電気素子とを備える。  [0010] This welding apparatus has a casing, a partition member that divides the interior of the casing into a first region and a second region, and a tunnel-shaped passage that allows air to flow through the first region and the second region. A heat dissipating unit, a fan for circulating air in the cavity of the heat dissipating unit, a first electric element provided in the first region, and a second electric element provided in the second region With.
[0011] この溶接装置では、第 2の領域の温度が下げられ信頼性が高い。  [0011] In this welding apparatus, the temperature in the second region is lowered and the reliability is high.
図面の簡単な説明  Brief Description of Drawings
[0012] [図 1]図 1は本発明の実施の形態における溶接装置の回路ブロック図である。  FIG. 1 is a circuit block diagram of a welding apparatus in an embodiment of the present invention.
[図 2]図 2は実施の形態における溶接装置の斜視透視図である。  FIG. 2 is a perspective perspective view of the welding apparatus in the embodiment.
[図 3]図 3は実施の形態における溶接装置の斜視透視図である。  FIG. 3 is a perspective perspective view of the welding apparatus in the embodiment.
[図 4]図 4は実施の形態における溶接装置に用いる放熱ユニットの斜視図である。  FIG. 4 is a perspective view of a heat dissipation unit used in the welding apparatus in the embodiment.
[図 5]図 5は従来の溶接装置の側面透視図である。  FIG. 5 is a side perspective view of a conventional welding apparatus.
[図 6]図 6は他の従来の溶接装置の側面透視図である。  FIG. 6 is a side perspective view of another conventional welding apparatus.
符号の説明  Explanation of symbols
1 筐体  1 housing
2 仕切り部材  2 Partition material
3 仕切り部材  3 Partition material
4 領域  4 areas
5 領域 (第 2の領域)  5 area (second area)
6 領域 (第 1の領域)  6 areas (first area)
7 グロメッ卜  7 Grommet
8 放熱ユニット  8 Heat dissipation unit
8A 空洞部  8A cavity
8B 外周部 9 1開口部(第 1の開口部) 8B outer periphery 9 1 opening (first opening)
10 開口部(第 2の開口部)  10 opening (second opening)
11 ファン  11 fans
12 側板  12 Side plate
13 開口部  13 opening
14 スナバ  14 Snubber
15 開口部  15 opening
16 底板  16 Bottom plate
17 開口部  17 opening
18 放熱フィン  18 Radiation fin
21 商用電源  21 Commercial power supply
22 整流ダイオード(第 2の電気素子)  22 Rectifier diode (second electrical element)
23 リアクタ(第 1の電気素子)  23 Reactor (first electrical element)
24 平滑コンデンサ(第 2の電気素子)  24 Smoothing capacitor (second electrical element)
25 半導体素子 (第 2の電気素子)  25 Semiconductor element (second electrical element)
26 主トランス(第 1の電気素子)  26 Main transformer (first electrical element)
27 整流ダイオード(第 2の電気素子)  27 Rectifier diode (second electrical element)
28 リアクタ(第 1の電気素子)  28 reactor (first electrical element)
29 出力端子  29 Output terminal
29A トーチケーブル  29A torch cable
29B 母材ケーブル  29B Base material cable
30 制御装置  30 Control unit
31 直流電源基板  31 DC power supply board
32 制御基板  32 Control board
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
図 1は本発明の実施の形態における溶接装置 1001の回路ブロック図である。商用 電源 21から供給される電圧は整流ダイオード 22にて整流され、リアクタ 23、平滑コン デンサ 24にて平滑化されて直流電圧となる。その直流電圧は半導体素子 25によりス イッチングされて高周波電圧となる。主トランス 26はその高周波電圧を昇圧する。昇 圧された高周波電圧は整流ダイオード 27により直流電圧となる。溶接の品質を向上 させるために、その直流電圧の高周波成分がリアクタ 28によってカットされる。出力端 子 29にはトーチケーブル 29A及び母材ケーブル 29Bが接続されており、溶接を行う こと力 Sできる。制御装置 30は直流電源基板 31と制御基板 32とを含み、作業者の設 定する値を実現するために半導体素子 25を制御し、溶接の品質を安定させる。半導 体素子 25には過電圧保護のためのスナバ 14が取り付けられている。リアクタ 23、平 滑コンデンサ 24、主トランス 26、リアクタ 28は発熱量の大きい電気素子である。整流 ダイオード 22、半導体素子 25、整流ダイオード 27、スナバ 14は発熱量が多ぐかつ 放熱の必要な電気素子である。制御装置 30はこれらの電気素子に比べて熱に弱ぐ 高温度になると信頼性が低下する電気素子である。 FIG. 1 is a circuit block diagram of welding apparatus 1001 according to the embodiment of the present invention. The voltage supplied from the commercial power source 21 is rectified by the rectifier diode 22 and smoothed by the reactor 23 and the smoothing capacitor 24 to become a DC voltage. The DC voltage is switched by the semiconductor element 25. It is switched to a high frequency voltage. The main transformer 26 boosts the high frequency voltage. The boosted high-frequency voltage is converted into a DC voltage by the rectifier diode 27. The high frequency component of the DC voltage is cut by the reactor 28 to improve the quality of the weld. A torch cable 29A and a base material cable 29B are connected to the output terminal 29, so that welding force S can be achieved. The control device 30 includes a DC power supply board 31 and a control board 32, and controls the semiconductor element 25 in order to realize a value set by the operator, thereby stabilizing the quality of welding. The semiconductor element 25 has a snubber 14 for overvoltage protection. The reactor 23, the smoothing capacitor 24, the main transformer 26, and the reactor 28 are electric elements that generate a large amount of heat. The rectifier diode 22, the semiconductor element 25, the rectifier diode 27, and the snubber 14 are electrical elements that generate a large amount of heat and require heat dissipation. The control device 30 is an electric element that is less susceptible to heat than these electric elements and whose reliability decreases at a high temperature.
[0015] 図 2と図 3は溶接装置 1001の斜視透視図である。溶接装置 1001は筐体 1を有す る。仕切り部材 2、 3は筐体 1内を複数の領域に分ける。すなわち、筐体 1内は、仕切 り部材 2の上方の領域 4と、仕切り部材 2の下方でかつ仕切り部材 3の上方の領域 5、 仕切り部材 3の下方の領域 6と上下方向に分けられており、上から領域 4、 5、 6が位 置する。溶接装置 1001は、グロメット 7と、領域 5内に設けられた放熱ユニット 8と、フ アン 11と、筐体 1を構成する側板 12と、スナバ 14と、筐体 1を構成する底板 16とを含 む。ファン 11は放熱ユニット 8の開口部 9に設けられる。側板 12の領域 5に面する部 分に開口部 13が形成されている。側板 12の領域 6に面する部分に開口部 15が設け られてレ、る。底板 16には開口部 17が形成されてレ、る。  2 and 3 are perspective perspective views of the welding apparatus 1001. FIG. The welding apparatus 1001 has a housing 1. The partition members 2 and 3 divide the inside of the housing 1 into a plurality of regions. That is, the interior of the housing 1 is divided into an upper region 4 and a region 4 above the partition member 2, a region 5 below the partition member 2 and above the partition member 3, and a region 6 below the partition member 3. Regions 4, 5, and 6 are located from the top. The welding apparatus 1001 includes a grommet 7, a heat radiating unit 8 provided in the region 5, a fan 11, a side plate 12 constituting the housing 1, a snubber 14, and a bottom plate 16 constituting the housing 1. Include. The fan 11 is provided in the opening 9 of the heat dissipation unit 8. An opening 13 is formed in a portion of the side plate 12 facing the region 5. An opening 15 is provided in a portion of the side plate 12 facing the region 6. An opening 17 is formed in the bottom plate 16.
[0016] 筐体 1の領域 4には制御装置 30が配置されている。領域 4と領域 5を分離している 仕切り部材 2には配線を通すための穴 7Aが設けられている。穴 7Aを通して空気が 領域 5から領域 4に入らないように、穴 7Aにはグロメット 7が装着されて配線のみが通 る。放熱ユニット 8は内側に空洞部を形成する外周部 8Bを備え、領域 5と領域 6との 間で空気を流通させるための略トンネル形状を有する。放熱ユニット 8の空洞部の両 端には空気が流通する開口部 9と開口部 10が設けられている。開口部 9は領域 5に 位置する。開口部 10は仕切り部材 3の面上あるいは領域 6に位置し、領域 6に開口し ている。ファン 11は開口部 9に配置され、放熱ユニット 8の空洞部に空気を流通させ る。仕切り部材 3には開口部 10と面する位置に開口部 10と同じ程度の大きさの貫通 孔が設けられている。 A control device 30 is arranged in the region 4 of the housing 1. The partition member 2 that separates the region 4 and the region 5 is provided with a hole 7A for passing the wiring. Grommet 7 is attached to hole 7A so that air does not enter from area 5 to area 4 through hole 7A, allowing only wiring to pass. The heat dissipating unit 8 includes an outer peripheral portion 8B that forms a hollow portion inside, and has a substantially tunnel shape for allowing air to flow between the region 5 and the region 6. An opening 9 and an opening 10 through which air flows are provided at both ends of the cavity of the heat dissipation unit 8. Opening 9 is located in region 5. The opening 10 is located on the surface of the partition member 3 or in the region 6 and opens in the region 6. The fan 11 is disposed in the opening 9, and air is circulated through the cavity of the heat dissipation unit 8. The The partition member 3 is provided with a through-hole having the same size as the opening 10 at a position facing the opening 10.
[0017] 図 4は放熱ユニット 8の斜視図である。放熱フィン 18は放熱ユニット 8内の空洞部 8 Aを流通する空気の流れと略平行に配設されている。と同様のため、説明を省略する  FIG. 4 is a perspective view of the heat dissipation unit 8. The heat radiating fins 18 are disposed substantially in parallel with the flow of air flowing through the cavity 8 A in the heat radiating unit 8. The explanation is omitted because it is the same as
[0018] 図 2と図 4に示すように、放熱ユニット 8の外周部 8Bには整流ダイオード 22と半導体 素子 25が直接的に接して配置されている。平滑コンデンサ 24は放熱ユニット 8の外 周部 8Bと所定の間隔をおいて間接的に配置されている。筐体 1を構成する側板 12 の領域 5に面する位置に複数の開口部 13が設けられている。冷却ファン 11が駆動さ れると開口部 13から筐体 1の内部に外部の空気が吸入され、吸入した空気がファン 1 1に流れ込む。ファン 11に流れ込む空気が平滑コンデンサ 24やスナバ 14を包み込 んで流れるように、開口部 13の開口位置や数が適切に決定され、平滑コンデンサ 24 やスナバ 14が効率的に冷却される。 As shown in FIGS. 2 and 4, a rectifier diode 22 and a semiconductor element 25 are arranged in direct contact with the outer peripheral portion 8B of the heat dissipation unit 8. The smoothing capacitor 24 is indirectly disposed at a predetermined interval from the outer peripheral portion 8B of the heat dissipation unit 8. A plurality of openings 13 are provided at positions facing the region 5 of the side plate 12 constituting the housing 1. When the cooling fan 11 is driven, outside air is sucked into the housing 1 from the opening 13 and the sucked air flows into the fan 11. The opening position and the number of the openings 13 are appropriately determined so that the air flowing into the fan 11 wraps around the smoothing capacitor 24 and the snubber 14, and the smoothing capacitor 24 and the snubber 14 are efficiently cooled.
[0019] 領域 5と領域 6を分離している仕切り部材 3には配線を通すための穴 7Bが設けられ ている。穴 7Bを通して空気が領域 6から領域 5に入らないように、穴 7Bにはグロメット 7が装着されて配線のみが通る。  [0019] The partition member 3 that separates the region 5 and the region 6 is provided with a hole 7B through which wiring is passed. In order to prevent air from entering the region 5 from the region 6 through the hole 7B, a grommet 7 is attached to the hole 7B and only the wiring passes.
[0020] 領域 6内の放熱ユニット 8の開口部 10の下方にリアクタ 23と主トランス 26とリアクタ 2 8が配置されてレ、る。リアクタ 23と主トランス 26とリアクタ 28の大きさや形状によりそれ らの配置が制約される場合、放熱ユニット 8をリアクタ 23と主トランス 26とリアクタ 28の 冷却効果の高い位置に配置してもよい。主トランス 26とリアクタ 28の発熱量が多いの で、放熱ユニット 8の開口部 10を主トランス 26とリアクタ 28の真上に配置するのが効 果的である。このような配置により、放熱ユニット 8の空洞部 8A内を通過して開口部 1 0から吹き出された空気が主トランス 26とリアクタ 28に直接あたり、これらを効率的に 冷却できる。なお、放熱ユニット 8の位置を変えずに固定し、主トランス 26とリアクタ 28 を放熱ユニット 8の開口部 10の真下に配置しても同様の効果を得ることができる。  [0020] A reactor 23, a main transformer 26, and a reactor 28 are disposed below the opening 10 of the heat dissipating unit 8 in the region 6. When the arrangement of the reactor 23, the main transformer 26, and the reactor 28 is restricted by the size and shape of the reactor 23, the heat radiation unit 8 may be arranged at a position where the reactor 23, the main transformer 26, and the reactor 28 have a high cooling effect. Since the main transformer 26 and the reactor 28 generate a large amount of heat, it is effective to arrange the opening 10 of the heat radiating unit 8 directly above the main transformer 26 and the reactor 28. With such an arrangement, the air that has passed through the cavity 8A of the heat radiating unit 8 and is blown out from the opening 10 directly hits the main transformer 26 and the reactor 28, and these can be efficiently cooled. The same effect can be obtained by fixing the heat radiating unit 8 without changing the position and disposing the main transformer 26 and the reactor 28 directly below the opening 10 of the heat radiating unit 8.
[0021] 筐体 1を構成する側板 12の領域 6に面する位置に複数の開口部 15が設けられて いる。筐体 1を構成する底板 16の領域 6に面する位置に複数の開口部 17が設けら れている。熱せられた領域 6内の空気は開口部 15、 17から筐体 1の外部へ排出され 、領域 6内の温度を下げることができる。空気は、ファン 11により放熱ユニット 8の開口 部 10から領域 6内に流れ込み、リアクタ 23、主トランス 26、リアクタ 28を包み込むよう に流れ、開口部 15、開口部 17から筐体 1の外部へ排出される。リアクタ 23、主トラン ス 26、リアクタ 28を最も効率よく冷却する空気の流れが得られるように、開口部 15、 1 7の位置や数が決定される。 A plurality of openings 15 are provided at positions facing the region 6 of the side plate 12 constituting the housing 1. A plurality of openings 17 are provided at positions facing the region 6 of the bottom plate 16 constituting the housing 1. Air in the heated area 6 is discharged from the openings 15, 17 to the outside of the housing 1. , The temperature in region 6 can be lowered. Air flows from the opening 10 of the heat dissipation unit 8 into the region 6 by the fan 11, flows so as to wrap around the reactor 23, the main transformer 26, and the reactor 28, and is discharged from the opening 15 and 17 to the outside of the housing 1. Is done. The positions and number of the openings 15 and 17 are determined so as to obtain the air flow that cools the reactor 23, the main transformer 26, and the reactor 28 most efficiently.
[0022] 溶接装置 1001では、制御装置 30が位置する領域 4に領域 5からの空気が仕切り 部材 2とグロメット 7により入り込まなレ、。したがって、領域 4内の温度は半導体素子 25 などによって熱せられている領域 5内の温度より低く抑えることができ、制御装置 30の 信頼性を向上することができる。  [0022] In the welding device 1001, the air from the region 5 does not enter the region 4 where the control device 30 is located by the partition member 2 and the grommet 7. Therefore, the temperature in the region 4 can be kept lower than the temperature in the region 5 heated by the semiconductor element 25 or the like, and the reliability of the control device 30 can be improved.
[0023] 領域 6に配置されている主トランス 26やリアクタ 23、 28は発熱量が多ぐ領域 6内の 温度は非常に高くなる。溶接装置 1001においては、仕切り部材 3とグロメット 7により 高温の領域 6内の空気が領域 5に入り込むことを防ぐことができるので、領域 5内の温 度はリアクタ 23や主トランス 26、リアクタ 28からの熱に影響されることなぐ比較的低 温に保つことができる。したがって、ファン 11によって放熱ユニット 8に送られる領域 5 内の空気は比較的低温なので、放熱ユニット 8の外周部 8B上に直接配置されている 整流ダイオード 22や半導体素子 25は効率よく冷却される。  [0023] The main transformer 26 and reactors 23 and 28 arranged in the region 6 have a very high temperature in the region 6 that generates a large amount of heat. In the welding apparatus 1001, since the partition member 3 and the grommet 7 can prevent the air in the high-temperature region 6 from entering the region 5, the temperature in the region 5 is determined from the reactor 23, the main transformer 26, and the reactor 28. It can be kept at a relatively low temperature without being affected by the heat. Accordingly, since the air in the region 5 sent to the heat radiating unit 8 by the fan 11 is relatively low in temperature, the rectifier diode 22 and the semiconductor element 25 arranged directly on the outer peripheral portion 8B of the heat radiating unit 8 are efficiently cooled.
[0024] 溶接装置 1001において、仕切り部材 3が存在しない場合には、領域 6に配置され ているリアクタ 23、主トランス 26、リアクタ 28等の発熱量の多い部材によって熱せられ た空気が領域 5内に入り込む。この場合、その空気が領域 5に配置されたファン 11に 吸入され、熱せられた空気が放熱ユニット 8の空洞部 8A内を流れるので、放熱ュニッ ト 8の放熱効率が低下する。放熱ユニット 8の放熱効率が低下すると、整流ダイオード 22と半導体素子 25の温度が高くなり、整流ダイオード 22や半導体素子 25の信頼性 を低下させる。なお、実施の形態では、仕切り部材 3が有る場合の領域 5と領域 6との 温度差は約 20°Cあった。  [0024] In the welding apparatus 1001, when the partition member 3 is not present, air heated by a member having a large calorific value such as the reactor 23, the main transformer 26, the reactor 28, etc. disposed in the region 6 Get in. In this case, the air is sucked into the fan 11 arranged in the region 5, and the heated air flows in the cavity 8A of the heat radiating unit 8, so that the heat radiating efficiency of the heat radiating unit 8 is lowered. When the heat dissipation efficiency of the heat dissipation unit 8 is lowered, the temperature of the rectifier diode 22 and the semiconductor element 25 is increased, and the reliability of the rectifier diode 22 and the semiconductor element 25 is lowered. In the embodiment, the temperature difference between the region 5 and the region 6 when the partition member 3 is provided is about 20 ° C.
[0025] 図 3に示すように、整流ダイオード 27も放熱ユニット 8の外周部 8B上に直接的に取 り付けられている。整流ダイオード 27は、ダイオード 22と半導体素子 25と同様に、仕 切り部材 3によって筐体 1の内部を領域 5と領域 6とに分離することで、効率良く冷却 されて信頼性を向上することができる。 [0026] 溶接装置 1001においては、ファン 11による空気が吹き出される放熱ユニット 8の開 口部 10の下側に、発熱して高温となる主トランス 26やリアクタ 28が配置されている。 この配置により、空気を主トランス 26やリアクタ 28に直接あてることができ、主トランス 26やリアクタ 28を効率よく冷却できる。 As shown in FIG. 3, the rectifier diode 27 is also directly mounted on the outer peripheral portion 8 B of the heat radiating unit 8. Like the diode 22 and the semiconductor element 25, the rectifier diode 27 can be efficiently cooled and improved in reliability by separating the interior of the housing 1 into the regions 5 and 6 by the cutting member 3. it can. In the welding apparatus 1001, a main transformer 26 and a reactor 28, which generate heat and become high temperature, are disposed below the opening 10 of the heat dissipation unit 8 through which air from the fan 11 is blown. With this arrangement, air can be directly applied to the main transformer 26 and the reactor 28, and the main transformer 26 and the reactor 28 can be efficiently cooled.
[0027] 領域 5、 6において、整流ダイオード 22と半導体素子 25といった半導体素子や平 滑コンデンサ 24やスナバ 14などの部品の配置が変更された場合であっても、側板 1 2を取り換えることで開口部 13や開口部 15の位置や数を変更できる。開口部 13、開 口部 15の位置や数を変更することにより冷却したい部品に風が流れるように風向き を変えることができ、冷却効率を高めることができる。  [0027] In the regions 5 and 6, even if the arrangement of the semiconductor elements such as the rectifier diode 22 and the semiconductor element 25 or the arrangement of the components such as the smoothing capacitor 24 and the snubber 14 is changed, the side plate 12 can be replaced to change the opening. The position and number of the part 13 and the opening 15 can be changed. By changing the position and number of the openings 13 and 15, the wind direction can be changed so that the wind flows through the parts to be cooled, and the cooling efficiency can be improved.
[0028] 領域 6において部品の配置が変更された場合でもあっても、底板 16を取り換えるこ とで開口部 17の位置や数を変更することが可能である。開口部 17の位置や数を変 更することで、冷却したい部品に風が流れるように風向きを変えることができ、冷却効 率を高めることができる。開口部 17を通して領域 6内の粉塵を底板 17の下側に排出 することができ、粉塵が領域 6内に堆積することを抑制することができる。  [0028] Even if the arrangement of parts in the region 6 is changed, the position and number of the openings 17 can be changed by replacing the bottom plate 16. By changing the position and number of the openings 17, the direction of the wind can be changed so that the wind flows through the parts to be cooled, and the cooling efficiency can be increased. The dust in the region 6 can be discharged to the lower side of the bottom plate 17 through the opening 17 and the accumulation of dust in the region 6 can be suppressed.
[0029] 筐体 1を構成する側板 12と仕切り部材 2、 3を変更することにより、溶接装置 1001 の全体の高さや、領域 4、 5あるいは 6の高さを変更することが可能である。  [0029] By changing the side plate 12 and the partition members 2 and 3 constituting the casing 1, it is possible to change the overall height of the welding apparatus 1001 and the height of the region 4, 5 or 6.
[0030] 溶接装置 1001の容量や仕様が変更された場合に、制御装置 30の部品点数や部 品の大きさが変わっても、側板 12の高さを変更したり仕切り部材 2の取り付け位置を 変更することにより領域 4の高さを変えることができ、必要な空間を確保することがで きる。この場合でも、溶接装置 1001の基本構造は変わらないので、上記で説明した 冷却に関する効果が得られる。  [0030] When the capacity and specifications of the welding apparatus 1001 are changed, the height of the side plate 12 is changed and the attachment position of the partition member 2 is changed even if the number of parts of the control apparatus 30 and the size of the parts are changed. By changing it, the height of area 4 can be changed, and the necessary space can be secured. Even in this case, since the basic structure of the welding apparatus 1001 does not change, the above-described effects relating to cooling can be obtained.
[0031] 溶接装置 1001の容量や仕様が変更された場合に、リアクタ、トランスなどの数が増 えても、側板 12の高さを変更したり仕切り部材 3の取り付け位置を変更することにより 領域 6の高さを変えることでき、必要な空間を確保することができる。この場合でも、溶 接装置 1001の基本構造は変わらないので、上記で説明した冷却に関する効果が得 られる。  [0031] When the capacity and specifications of the welding apparatus 1001 are changed, even if the number of reactors, transformers, etc. increases, the height of the side plate 12 or the mounting position of the partition member 3 can be changed to change the region 6 The height of the can be changed, and the necessary space can be secured. Even in this case, since the basic structure of the welding apparatus 1001 is not changed, the above-described effect on cooling can be obtained.
[0032] なお、実施の形態による溶接装置 1001では、 2つの仕切り部材により筐体 1の内部 を 3つの領域を 3つに分ける。仕切り部材と領域の数はこれに限るものではなぐ 1つ の仕切り部材で筐体 1内部を 2つの領域、例えば領域 4と領域 5に分けてもよぐまた は領域 5と領域 6に分けてもよレ、。 3つ以上の仕切り部材で筐体 1の内部を 4つ以上 の領域に分けても良い。 [0032] Note that in the welding apparatus 1001 according to the embodiment, the interior of the housing 1 is divided into three regions by two partition members. The number of partition members and areas is not limited to this one The inside of the housing 1 can be divided into two areas, for example, the area 4 and the area 5 or the area 5 and the area 6 can be divided. The interior of the housing 1 may be divided into four or more areas by three or more partition members.
[0033] また、実施の形態による数値は一例にすぎない。 [0033] The numerical values according to the embodiments are merely examples.
[0034] また、実施の形態は、溶接装置のみならず、発熱量の多い電気素子を内蔵して冷 却を必要とする装置に広く有用である。  [0034] The embodiment is widely useful not only for welding apparatuses but also for apparatuses that incorporate an electrical element with a large amount of heat generation and require cooling.
産業上の利用可能性  Industrial applicability
[0035] 本発明による溶接装置は、筐体内に設けられた部材を効率的に冷却することがで き、高熱を発生する部材を内蔵する電気機器として有用である。 The welding apparatus according to the present invention can efficiently cool a member provided in the casing, and is useful as an electric device incorporating a member that generates high heat.

Claims

請求の範囲 The scope of the claims
[1] 筐体と、  [1] a housing;
前記筐体の内部を第 1の領域と第 2の領域に分ける仕切り部材と、  A partition member that divides the interior of the housing into a first region and a second region;
空洞部を内部に形成する外周部を有し、前記第 1の領域と前記第 2の領域に空気を 流通させるトンネル形状の放熱ユニットと、  A tunnel-shaped heat dissipating unit having an outer peripheral portion that forms a hollow portion therein, and that circulates air through the first region and the second region;
前記筐体内に設けられており前記放熱ユニットの前記空洞部に空気を流通させるた めのファンと、  A fan provided in the housing for circulating air through the cavity of the heat dissipation unit;
前記第 1の領域内に設けられた第 1の電気素子と、  A first electrical element provided in the first region;
前記第 2の領域内に設けられた第 2の電気素子と、  A second electrical element provided in the second region;
を備えた溶接装置。  Welding device equipped with.
[2] 前記第 2の領域は前記第 1の領域の上方に位置する、請求項 1記載の溶接装置。  2. The welding apparatus according to claim 1, wherein the second region is located above the first region.
[3] 前記放熱ユニットは前記空洞部の両端にそれぞれ設けられた第 1の開口部と第 2の 開口部を有し、 [3] The heat dissipation unit has a first opening and a second opening provided at both ends of the cavity,
前記放熱ユニットの前記第 1の開口部は前記第 2の領域に位置し、  The first opening of the heat dissipation unit is located in the second region;
前記放熱ユニットの前記第 2の開口部は前記第 1の領域に開口し、  The second opening of the heat dissipating unit opens to the first region;
前記ファンは前記第 1の開口部に設けられた、請求項 1記載の溶接装置。  The welding apparatus according to claim 1, wherein the fan is provided in the first opening.
[4] 前記第 1の電気素子は前記放熱ユニットの前記第 2の開口部の下方に配設された、 請求項 3に記載の溶接装置。 4. The welding apparatus according to claim 3, wherein the first electric element is disposed below the second opening of the heat dissipation unit.
[5] 前記第 2の電気素子は前記放熱ユニットの前記外周部上に直接的に配置された、請 求項 1記載の溶接装置。 [5] The welding apparatus according to claim 1, wherein the second electric element is disposed directly on the outer peripheral portion of the heat dissipation unit.
[6] 前記第 2の電気素子は前記放熱ユニットの前記外周部から所定の間隔をおいて配 置された、請求項 1記載の溶接装置。 6. The welding apparatus according to claim 1, wherein the second electric element is disposed at a predetermined interval from the outer peripheral portion of the heat radiating unit.
[7] 前記第 2の電気素子は半導体素子を含む、請求項 1記載の溶接装置。 7. The welding apparatus according to claim 1, wherein the second electric element includes a semiconductor element.
[8] 前記第 1の電気素子はリアクタとトランスのうちの一方を含む、請求項 1記載の溶接装 置。 8. The welding apparatus according to claim 1, wherein the first electric element includes one of a reactor and a transformer.
[9] 前記筐体は、前記第 2の領域に面する位置に複数の開口部が形成された側板を有 する、請求項 1に記載の溶接装置。  [9] The welding apparatus according to claim 1, wherein the casing includes a side plate in which a plurality of openings are formed at a position facing the second region.
[10] 前記側板は取り換え可能である、請求項 9に記載の溶接装置。 10. The welding apparatus according to claim 9, wherein the side plate is replaceable.
[11] 前記側板の高さを変更して前記第 1の領域と前記第 2の領域のうちの少なくとも一方 の高さを変更できる、請求項 9に記載の溶接装置。 11. The welding apparatus according to claim 9, wherein a height of at least one of the first region and the second region can be changed by changing a height of the side plate.
[12] 前記仕切り部材の位置を変更して前記第 1の領域と前記第 2の領域の高さを変更で きる、請求項 1に記載の溶接装置。 12. The welding apparatus according to claim 1, wherein the height of the first region and the second region can be changed by changing the position of the partition member.
[13] 前記筐体は、複数の開口部が形成された底板を有する、請求項 1に記載の溶接装 置。 13. The welding apparatus according to claim 1, wherein the casing has a bottom plate in which a plurality of openings are formed.
PCT/JP2005/022925 2005-10-11 2005-12-14 Welding device WO2007043192A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-296308 2005-10-11
JP2005296308A JP2007105741A (en) 2005-10-11 2005-10-11 Welding equipment

Publications (1)

Publication Number Publication Date
WO2007043192A1 true WO2007043192A1 (en) 2007-04-19

Family

ID=37942459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/022925 WO2007043192A1 (en) 2005-10-11 2005-12-14 Welding device

Country Status (3)

Country Link
JP (1) JP2007105741A (en)
CN (1) CN100488691C (en)
WO (1) WO2007043192A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100922181B1 (en) * 2008-11-28 2009-10-19 김순기 Carbon dioxide arc welding machine
KR200447665Y1 (en) 2009-03-11 2010-02-11 최금주 Inverter welding machine
CN102189358B (en) * 2010-03-10 2015-09-30 株式会社大亨 The source of welding current
JP5641645B2 (en) * 2010-11-17 2014-12-17 株式会社ダイヘン Welding power source
JP6387530B2 (en) * 2013-10-21 2018-09-12 パナソニックIpマネジメント株式会社 Power control device
JP6319074B2 (en) * 2014-12-15 2018-05-09 富士電機株式会社 Power converter
CN112789165B (en) 2018-09-28 2023-04-04 大日本印刷株式会社 Decorative sheet and decorative material using same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136586U (en) * 1981-02-20 1982-08-26
JPS61187399A (en) * 1985-02-15 1986-08-21 松下電器産業株式会社 Cooler for heat generating body
JP2000196274A (en) * 1998-12-22 2000-07-14 Esab Group Inc:The Power feeder

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243925Y2 (en) * 1972-03-06 1977-10-05
JPS5393519U (en) * 1976-12-28 1978-07-31
JPS55154688U (en) * 1979-04-23 1980-11-07
JPS56142885U (en) * 1980-03-31 1981-10-28
JPS5977578U (en) * 1982-11-16 1984-05-25 株式会社三社電機製作所 Cooling device for small welding machine
JPH0293077U (en) * 1989-01-06 1990-07-24
JPH0697688A (en) * 1992-09-16 1994-04-08 Toshiba Corp Cooling structure of electronic device
JPH0686872U (en) * 1993-05-19 1994-12-20 東洋電機株式会社 Plasma arc cutting / welding machine
JP2907746B2 (en) * 1995-01-31 1999-06-21 株式会社三社電機製作所 Power supply
JP3253882B2 (en) * 1997-01-14 2002-02-04 株式会社ケンウッド Forced air cooling radiator
JP3323418B2 (en) * 1997-03-17 2002-09-09 株式会社三社電機製作所 Power supply case

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136586U (en) * 1981-02-20 1982-08-26
JPS61187399A (en) * 1985-02-15 1986-08-21 松下電器産業株式会社 Cooler for heat generating body
JP2000196274A (en) * 1998-12-22 2000-07-14 Esab Group Inc:The Power feeder

Also Published As

Publication number Publication date
CN100488691C (en) 2009-05-20
JP2007105741A (en) 2007-04-26
CN101039773A (en) 2007-09-19

Similar Documents

Publication Publication Date Title
CA2189932C (en) Welding power supply housing
WO2007043192A1 (en) Welding device
WO2006001273A1 (en) Arc welding control device
JP2008103576A (en) Motor controller
JP6433631B2 (en) Power converter
JP2012119588A (en) Control unit with cooling function
JP2006210516A (en) Cooling structure of electronic equipment
JP2015053385A (en) Power supply device
JP6026059B1 (en) Electronics
US9320179B2 (en) Gas cooled traction drive inverter
JP5962326B2 (en) Forced air cooling heat sink
JP6074346B2 (en) Switchboard equipment
JP5260249B2 (en) Semiconductor equipment heatsink
JP4360123B2 (en) Power converter
JPH04338074A (en) Elevator control panel
JP2013252006A (en) Motor driving device and air conditioner including the same
JP4969927B2 (en) DC high voltage generator
JPH02249755A (en) Control device for rolling stock
WO2021117413A1 (en) Power conversion device
JP4431896B2 (en) Battery charge control device
CN210129816U (en) Converter with a voltage regulator
JP2011129644A (en) High frequency power source device
JP2011097824A (en) Power converter
JPH09325831A (en) Heat radiation structure of module
KR200308896Y1 (en) Inverter welding machine

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200580001646.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 05816816

Country of ref document: EP

Kind code of ref document: A1