WO2007042497A2 - Module de detection - Google Patents

Module de detection Download PDF

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Publication number
WO2007042497A2
WO2007042497A2 PCT/EP2006/067187 EP2006067187W WO2007042497A2 WO 2007042497 A2 WO2007042497 A2 WO 2007042497A2 EP 2006067187 W EP2006067187 W EP 2006067187W WO 2007042497 A2 WO2007042497 A2 WO 2007042497A2
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
housing
sealing body
circuit board
assembly according
Prior art date
Application number
PCT/EP2006/067187
Other languages
German (de)
English (en)
Other versions
WO2007042497A3 (fr
Inventor
Markus Christoph
Harald Schmidt
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2007042497A2 publication Critical patent/WO2007042497A2/fr
Publication of WO2007042497A3 publication Critical patent/WO2007042497A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a sensor assembly according to the upper ⁇ concept of the independent claims.
  • Sensor assemblies with a arranged in a housing sensor element which are Müs ⁇ sen by the housing against the environmental influence in damp or dirt intensive environments, such as are used in a motor vehicle for example. If it is the sensor element to such an electronic device that responds to ambient sizes - accommodate the matterssgrö ⁇ SSE concerned must the sensor element - a pressure sensor for measuring the ambient air pressure, for example. Other existing electronic components in the sensor assembly, however, must be reliably protected against environmental influences.
  • a sensor module is known for example from DE 44 47 513 Al.
  • the housing of this sensor assembly is formed water ⁇ tight and has an upper part and a lower part and an arrange between the upper part and the lower part ⁇ te seal. Between the upper part and the lower part, a printed circuit board is accommodated when the housing is assembled, on which a pressure sensor is arranged.
  • the pressure sensor is surrounded by a sealing cushion that is pressed in assembled housing of the upper part against the circuit board and seals the interior of the housing against a fürgangsska ⁇ nal, which is formed by a one-piece with the upper part formed pipe socket through which the pressure-sensitive surface the pressure sensor with ambient ⁇ pressure fluctuation can be acted upon.
  • the pressure sensor enclosing the sealing pad is provided with a membrane.
  • the known sensor assembly is mounted, for example, in vehicle side doors for impact detection. there an absolute water tightness ⁇ is necessary for reasons of functional reliability, as in the below the discs arranged door cavity water and dirt from entering.
  • a sensor module is further known from WO 00/71978 Al ⁇ known.
  • the sensor assembly described there are vermin ⁇ derter requirements placed on the water and dirt-tightness of the housing, although in a humidity, pollution ⁇ tongues or other harsh environmental conditions exposed space certain parameters can be sensed.
  • the sensor assembly is arranged on one side of a wall which, for example, separates a moist space from a drying space and detects the parameter to be sensed through the wall.
  • the housing interior which houses electronic circuits and the like, is protected from the effects of harmful environmental conditions beyond the wall.
  • the sensor element is suitable for sensing temperatures, humidities, pressure fluctuations, etc.
  • the sensor assembly is used in a vehicle side door, which is provided with a running in the vehicle longitudinal direction partition that divides the side door into rooms.
  • a dry room the entire electronics to be arranged in the vehicle door, such as window motors, closing electronics, etc. is arranged.
  • the drying room is through the partition wall opposite the outside door wet room, in the moisture, dirt, etc., separated, separated.
  • the sensor module can be arranged on its housing on the partition wall within the drying room angeord ⁇ net, the pressure prevailing in the dampening of the vehicle door pressure is sensed.
  • the two described sensor modules each have the disadvantage that the production of a, the interior of the housing towards the environment, necessary sealing using a variety of components, whereby the risk of incorrect assembly of the individual components is given and thus the necessary tightness not achieved. Due to the variety of components is also the time required for assembly of the sensor assembly and its installation at the intended site relatively time and thus costly.
  • the sensor package according to the invention comprises in a first embodiment of a housing, a valve disposed in the housing the sensor element, a sensor surface of the sensor element to ⁇ imaging sealing body which seals the interior of the housing towards the surroundings and a pipe socket on one end of which bears sealingly against the sealing body , wherein the pipe ⁇ connection via a channel has a connection to the environment.
  • the sensor element is a Sensorge ⁇ housing on with a surrounding the sensor surface collar-shaped member having one end to which overlapped one end of the pipe socket, wherein one of the two ends of at least partially immersed in the made of a gel material sealing body and the other of the two end forms a externa ⁇ ßere limit for the sealing body.
  • the assembly can be significantly simplified the sensor assembly, wherein an absolute water tightness is achieved ge ⁇ geninate the arranged inside the housing electronic components.
  • the sensor module according to the invention can also be arranged in a moist space, for example a door cavity of a motor vehicle door, in which water and dirt penetrate.
  • the use of a sealing body made of a gel material has the further Before ⁇ part with that single incorrect mounting during assembly ⁇ ner components of the sensor assembly, including one another due to inaccuracies in the relative arrangement of two components, is almost impossible due to large tolerances and thus a very high reliability of the sensor assembly ge ⁇ is guaranteed.
  • the sensor element may be suitable, for example, for sensing temperatures, humidities, pressure fluctuations, etc.
  • the one end of the pipe nozzle in the form of an annular groove is formed from ⁇ , in which the sealing body formed of gel material is introduced and immersed ⁇ into which the collar shaped member.
  • the collar-shaped element for the sealing body formed from gel material forms a reservoir on the sensor housing, wherein one end of the pipe socket dips into the sealing body.
  • the pipe socket is formed integrally with the housing.
  • the pipe socket can also be produced as a component that is separate from the housing (possibly also from a different material) and can be positively connected to it.
  • the collar-shaped element and the sensor housing are integrally formed from a plastic material.
  • the sensor housing and the collar-shaped element can be produced as part of an injection molding process in which the sensor element is surrounded by the housing material. It will be understood that in addition other materials, such as e.g. Metals or the like, come into consideration.
  • a cost-effective manufacture is obtained by further since ⁇ that the sensor element is designed as a Surface Mounted Device (SMD) component, wherein the sensor housing in the region of the sensor surface has a surrounding of the collar-shaped element opening.
  • the opening serves to expose the sensor surface of the sensor element, so that a sizing of the environmental parameter is possible.
  • the production of a sensor element according to the invention is thus possible with well ⁇ th manufacturing method in which only an injection mold in modified form must be provided.
  • a membrane is arranged above the sensor surface.
  • a gel material is arranged on the sensor surface. This particularly is concerned, when the sealing body is formed in the annular trench of one end of the pipe socket from ⁇ into which the collar shaped member is immersed. Further protection of the sensor element in the variant in which the gel material is introduced into the formed by the collar-shaped element from ⁇ reservoir is not necessary, since the sensor surface is already covered by the gel material.
  • the one end of the pipe socket and / or the one end of the collar-shaped element with sensor element mounted in the housing bears free from compressive forces in the sealing body. In other words, this means that the storage of the sensor element in the housing no special requirements are made and in particular mounting elements are unnecessary, which exert a bias on the sensor element or a support member supporting the sensor element to produce a sufficient seal to the sealing body.
  • a sensor assembly according to the invention according to a second Va ⁇ riante comprises a housing and a valve disposed in the housing on a circuit board sensor element.
  • the Sensorele ⁇ ment is applied without a surrounding this sensor housing with the sensor surface facing the circuit board on a ers ⁇ th main page of the circuit board, which is formed with an opening connecting the sensor surface with the environment.
  • an underfill is arranged between the sensor element and the first main side of the circuit board, which surrounds the sensor surface and seals the interior of the housing to the environment.
  • a low-viscosity liquid ⁇ speed is placed next to the flip-chip on the circuit board ⁇ ordered sensor element.
  • the capillary allows the liquid, the underfill, KISSING under the sensor element flowing ⁇ .
  • mechanical retention of the sensor element on the printed circuit board and reliable protection against the ingress of moisture are achieved.
  • the underfill process is used, the bottom, that is to encapsulate the sensor of the ⁇ element facing the main printed circuit board.
  • the sensor assembly according to the second variant is characterized in that the sensor element on the main side of the Circuit board can be arranged, typically further electronic components, for example on the values for the off ⁇ determined by the sensor element environment Para ⁇ meter, are located. By only necessary on one side assembly of the circuit board can be achieved significant cost advantages.
  • a arranged on a second main side of the printed circuit board sealing body is provided, which is formed with a connecting the sensor surface with the surrounding passageway and the inner ⁇ space of the housing seals to the environment.
  • the sensor assembly is mountable on a wall, wherein the through-channel of the sealing body in the installed state of the sensor assembly is connected through an opening of the wall with the environment.
  • the wall may, for example, be the partition wall in the body side door, which divides it into a dry space and a damp room. Because the sealing body adjoining the printed circuit board directly adjoins the wall in the installed state of the sensor module, it can be realized with only a few structural components.
  • the sealing body forms a cover of the housing for protecting the second main side of the Lei ⁇ terplatte. This means that the sealing body extends to ⁇ at least over the entire surface of the circuit board.
  • a function closing the housing can be provided.
  • the sealing body has a first, the printed circuit board facing Hauptsei ⁇ te and a second wall facing page on which are each provided with an adhesive, and which in the installed state each intimately abut the circuit board or the wall.
  • the sealing body may be in the simplest case so that a double-sided tape act a ge ⁇ given thickness.
  • conventional materials customary for sealing cushions for example silicone.
  • the sensor element according to another embodiment is a pressure sensor in both variants.
  • FIG. 1 is a plan view of an inventive Sen ⁇ sorbaurios according to a first variant
  • 2a, 2b are each a sectional view along the Li ⁇ lines AA and BB of FIG. 1 in a first embodiment
  • FIG. 4 is an exploded view of a sensor assembly according to the invention according to a second variant of the invention.
  • FIG. 5 is a bottom view of the assembled sensor assembly of FIG. 4,
  • FIG. 6 is an assembled sensor assembly according to FIG. 4 in a plan view
  • Fig. 7 is a sectional view taken along the line AA of Fig. 6, and Fig. 8 is an enlarged view of the designated in Fig. 7 with X section.
  • Fig. 1 shows a top view of an inventive Sen ⁇ sorbaurios 1 according to a first embodiment.
  • the sensor module has a housing 2 with flanges 5 formed thereon, in each of which an opening 6 for fastening ⁇ tion of the housing 2 is formed on a wall, not shown in the figure.
  • the figure shows the sensor assembly 1 from the side with which it is attached to the wall. To fix the position is located provided from the sheet plane réellere ⁇ ADORABLE lead. 7
  • the figure shows the sensor assembly 1 without cover, whereby the arranged inside the housing and mounted circuit board 3 can be seen. On this unspecified electronic Bauelemen ⁇ te are arranged.
  • FIG. 2a and 2b show a first embodiment of the first variant, wherein in Fig. 2a is a section along the line AA and in Fig. 2b shows a section along the line BB through the sensor assembly shown in Fig. 1.
  • the circuit board 3 is accommodated, on which a pressure sensor 10 is mounted.
  • the pressure sensor 10 is mounted on egg ⁇ ner, the electronic components opposite, the main side of the circuit board 3 and a Rohrstut ⁇ zen 18, which is integrally formed with the housing 2, facing.
  • the pressure sensor 10 is provided as a surface-mountable Bauele ⁇ ment (Surface Mounted Device SMD) is formed, wherein the sensor element, the sensor surface having applied to a lead frame (not shown) which are surrounded by a group consisting of plastic sensor housing. 11 In the FIGS. 2a and 2b discernible are the connecting legs 14 projecting from the sensor housing 11, which are connected to corresponding contacts of the printed circuit board 3.
  • the sensor housing 11 has a pipe stub 18 facing ⁇ opening 12, so that the sensor surface of the Sensorele ⁇ ment is freely accessible.
  • a collar-shaped element 13 Around the opening 12 around a collar-shaped element 13, whose end facing the pipe socket extends in overlap to an end 16 of the pipe socket 18 extends.
  • the end 16 of the pipe socket 18 is formed in the form of a trench, in which a gel material is introduced as a sealing body 15, which ensures the Ab ⁇ seal the interior of the housing 2 from the environment.
  • the pipe socket 18 is connected via a along the lower side of the housing in the figure extending channel 17 with the environment.
  • the sensor module 1 is arranged with the housing plane designated by the reference numeral 9 on a wall, not shown in the figure.
  • the wall may be, for example, the partition wall formed in a vehicle door, which separates the interior of the vehicle door into a drying room and a wet room. Due to the structural design of the sensor assembly 1 according to the invention according to the first variant, however, it is not absolutely necessary that the sensor assembly is arranged in the drying space.
  • the Sensorbau ⁇ group may instead be mounted in the damp room. It is also conceivable to mount the sensor assembly 1 not on a wall, but on a correspondingly formed holder.
  • FIGS. 3a and 3b show a second embodiment of the first variant according to FIG. 1, again showing a section along AA (FIG. 3a) and BB (FIG. 3b) through the sensor assembly 1 according to FIG. Since the basic Although the structure of this second embodiment is identical to the above-described first embodiment, only differences will be described below.
  • the collar-shaped element 13 forms a reservoir for the sealing body 15 formed from gel material.
  • the first end of the merely exemplary tapered pipe socket dips into the sealing body 15 ⁇ .
  • the diameter of the first end 16 of the pipe socket 18 is smaller than the diameter of the annularly extending collar-shaped element 13.
  • the gel material is introduced into the ring-shaped trench at the end 16 of the pipe socket 18.
  • the Lei ⁇ terplatte is introduced with the already mounted pressure sensor 10 in the housing 2 and the printed circuit board 3 with the bearing surfaces designated by the reference numeral 19 of the housing 2 in Appendix ,
  • the collar-shaped element 13 at least partially immersed in the still viscous gel.
  • the circuit board 3 may additionally be fixed on small lugs or latching hooks.
  • FIGS. 4 to 8 show a sensor module 1 according to the invention according to a second variant.
  • the sensor module 1 comprises a substantially trough-shaped housing 50, on which a plug connection 52 is formed in a known manner.
  • a plug connection 52 is formed in a known manner.
  • a circuit board 51 is introduced up ⁇ 53 is placed on the upper side is embodied as a pressure sensor sensing element.
  • the sensor element 53 the closed part of the housing 2 is assigned.
  • a sealing body 54 is connected, which has the same dimensions as the conductor plate 51 approximately.
  • the sealing body 54 which is formed, for example, in the form of a double-sided adhesive tape having a predetermined thickness, has a through-channel in the region of the sensor element 53, via which a sensor surface of the sensor element 53 is connected to the environment.
  • two further apertures 56 in the printed circuit board are merely exemplary
  • Fig. 5 shows the sensor assembly 1 in a representation from below. From this it is readily apparent that the sealing body 54 forms a kind of cover of the housing 50. In the sealing body 54, the passage 55 can be seen, which is arranged corresponding to an opening 58 in the circuit board 51.
  • This embodiment can be better seen from the sectional view of FIG. 7, which shows a section along the line A-Al of the plan view of the sensor assembly 1 shown in FIG. From Fig. 7, the particular advantage of the sensor assembly according to the invention is particularly clear.
  • the sensor element 53 is flip-chip disposed on the inside of the housing facing the circuit board (top) on the circuit board 51, on which optionally also other electronic compo ⁇ elements of the sensor assembly are arranged.
  • the sensor surface and the contacts necessary for contacting the sensor element 53 are thus located on the same main side of the chip.
  • an underfill 59 is arranged between the main side facing the printed circuit board 51 and the printed circuit board. Due to the characteristics typical for Underfill, a seal can be achieved between the environment-related opening 58 and the interior of the housing.
  • the advantage of this approach is that it can be completely dispensed with a sensor housing of the sensor element, since the sensor element flip-chip is mounted on the circuit board. That is, a bare chip is placed on the printed circuit board 51, in which below the Sensorflä ⁇ 58 che the opening of the printed circuit board 51 is located so that the environmental parameters detected by the sensor surface.
  • the annular relining of the sensor element with the underfill in the region of solder balls (bumps) for electronic contacting ensures protection of the electronic components applied to the inside of the housing 50 on the printed circuit board 51.
  • the sealing body 54 which, if it is designed as a double-sided adhesive tape, the same time ⁇ can take over the connection to a wall.
  • the wall can be, for example, the dividing wall formed in a vehicle door, which separates the interior of the vehicle door into the drying room and a moist space.
  • the sensor module 1 according to the second variant is arranged in the drying room. It is understood that a passage corresponding to the passage 55 of the sealing body. must be arranged in the wall to the damp room, so that a detection of the environmental parameter is possible.
  • the flip-chip mounting of the sensor element 53 on the conductor ⁇ plate 51 brings significant mounting advantages with it, which is significantly cheaper manufacturing costs.
  • the underfill can be made in a single operation, the passage to the sensor surface of the sensor element and at the same time a waterproofing ⁇ tion of the housing interior are made.
  • the configuration of the pins provided for contacting the sensor module 1 can also be seen from the sectional view of FIG. 7.
  • the vertically extending portion of the pin 61 is inserted through the circuit board 51 Runaway ⁇ .
  • the opening 57 is provided in the region of the pin section. Contrary to the drawing, this does not have to completely penetrate the sealing body 54.

Abstract

La présente invention concerne un module de détection (1) dont une première variante comprend un boîtier (2), au moins un élément de détection (10) disposé dans le boîtier (2), un corps d'étanchéité (15) qui entoure une surface de détection de l'élément de détection et qui rend étanche l'espace intérieur du boîtier (2) vis-à-vis de l'extérieur, et une tubulure (18) dont une extrémité est en contact étanche avec le corps d'étanchéité (15), la tubulure présentant une liaison vers l'extérieur matérialisée par un canal (17). Selon l'invention, l'élément de détection (10) présente un boîtier de détection (11) qui comprend un élément en forme de col (13) qui entoure la surface de détection, dont une extrémité se superpose à une extrémité de la tubulure (18), l'une des deux extrémités étant plongée au moins partiellement dans le corps d'étanchéité (15) réalisé en une matière de type gel, et l'autre extrémité formant une délimitation extérieure pour le corps d'étanchéité (15). Une seconde variante du module de détection (1) comprend un boîtier (50) et un élément de détection (53) disposé dans le boîtier (50) sur une carte de circuits imprimés (51). L'élément de détection (53) est mis en place sans être entouré d'un boîtier de détection, avec la surface de détection, en étant orienté vers la carte de circuits imprimés (51) (puce retournée), sur un premier côté principal de la carte de circuits imprimés (51) qui présente une ouverture (58) qui relie la surface de détection à l'extérieur, un sous-remplissage (59) se trouvant entre l'élément de détection (53) et le premier côté principal de la carte de circuits imprimés (51), ledit sous-remplissage entourant la surface de détection et rendant étanche l'espace intérieur du boîtier (50) vis-à-vis de l'extérieur.
PCT/EP2006/067187 2005-10-10 2006-10-09 Module de detection WO2007042497A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005048396.8 2005-10-10
DE200510048396 DE102005048396A1 (de) 2005-10-10 2005-10-10 Sensorbaugruppe

Publications (2)

Publication Number Publication Date
WO2007042497A2 true WO2007042497A2 (fr) 2007-04-19
WO2007042497A3 WO2007042497A3 (fr) 2007-07-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/067187 WO2007042497A2 (fr) 2005-10-10 2006-10-09 Module de detection

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DE (1) DE102005048396A1 (fr)
WO (1) WO2007042497A2 (fr)

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CN107430955A (zh) * 2015-03-31 2017-12-01 松下神视株式会社 光电传感器

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DE102014215920A1 (de) * 2014-08-12 2016-02-18 Continental Automotive Gmbh Sensorbaugruppe mit einem Schaltungsträger und einer Sensorelektronik sowie Verfahren zu deren Herstellung
FR3081672B1 (fr) * 2018-05-22 2021-04-09 A Raymond Et Cie Boitier de protection d'un dispositif electronique
DE102020200832B4 (de) 2020-01-24 2022-11-10 Continental Automotive Technologies GmbH Aufprallsensor mit einem schlauchförmigen Körper

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DE4447513A1 (de) * 1994-07-28 1996-02-01 Siemens Ag Wasserdichtes Gehäuse zum Schutz von Elektronikschaltkreisen
WO1997027624A1 (fr) * 1996-01-24 1997-07-31 Cornell Research Foundation, Inc. Encapsulation de circuits integres sous pression par remplissage de la partie inferieure dudit circuit
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DE19711939A1 (de) * 1997-03-21 1998-09-24 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine
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WO2003067657A2 (fr) * 2002-02-07 2003-08-14 Infineon Technologies Ag Composant semi-conducteur presentant une surface de capteur ou d'actionneur et procede pour le produire
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CN103185606A (zh) * 2011-12-30 2013-07-03 浙江盾安禾田金属有限公司 传感器芯体的封装结构及芯体和传感器
CN107430955A (zh) * 2015-03-31 2017-12-01 松下神视株式会社 光电传感器
CN107430955B (zh) * 2015-03-31 2019-03-15 松下神视株式会社 光电传感器
US10641652B2 (en) 2015-03-31 2020-05-05 Panasonic Industrial Devices Sunx Co., Ltd. Photoelectric sensor

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