Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
  • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
  • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
  • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
  • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
  • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
  • G01P15/0802—Details
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
  • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
  • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
  • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
  • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
  • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
  • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
  • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
  • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
  • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
  • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
  • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
  • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Definitions

• tester 1 according to the first embodiment of the present invention will be described.
• this three-axis acceleration sensor is a piezoresistive type, and a piezoresistive element as a detecting element is provided as a diffused resistor.
• This piezoresistive acceleration sensor can use an inexpensive IC process, and the resistance element as a detection element can be made small. Even if formed, there is no reduction in sensitivity, which is advantageous for downsizing and cost reduction.
• the piezoresistive element has a property that its resistance value changes due to the applied strain (piezoresistance effect). In the case of tensile strain, the resistance value increases and the pressure value increases. In the case of shrinkage, the resistance value decreases.
• X-axis direction detection piezoresistive element Rxl ⁇ Rx4 shown as piezoresistive elements R Z 1 ⁇ Rz4 Gurley for detection along the Y-axis piezoresistive element Ryl ⁇ Ry4 and Z-axis direction detected! /
• FIG. 9 is a diagram illustrating the relationship between gravitational acceleration (input) and sensor output.
• step S4 when it is determined that the test sound wave is a desired test sound wave, the control unit 20 proceeds to the next step S5 and measures the characteristic value of the detection chip. Specifically, the characteristic value is measured by the measurement unit 25 based on the electrical signal transmitted through the probe needle 4 (step S5).
• step S2a to S4 are executed in advance before the test is started, and the speaker control unit 30 stores a corrected control value for outputting a desired test sound wave.
• the speaker control unit 30 controls the input to the speaker 2 with the recorded control value, thereby omitting the processes in steps S3 and S4 during the test described above. Is also possible.
• the amplification factor is set to 18 times (X 18).
• the gain is set to 15 times (X 15).
• the gain is set to 7 times (X 7).
• Comparator 110 compares the input voltage transmitted to node NO and node N1, and transmits the result to node N2.
• Resistive element 103 is electrically coupled between nodes N2 and N1.
• Resistance adjusting unit 120 is electrically coupled between nodes N1 and N5.
• Resistive element 104 is electrically coupled between nodes N5 and N7.
• the comparator 111 compares the input voltages transmitted to the node N5 and the node N6 and transmits the result to the node N7.
• Resistive element 101 is electrically coupled between nodes N2 and N3.
• Resistive element 105 is electrically coupled between nodes N7 and N8.
• the comparator 112 compares the input voltages transmitted to the node N3 and the node N8, and transmits the result to the node N4.
• Resistive element 102 is electrically coupled between nodes N3 and N4.
• Resistive element 106 is electrically coupled between nodes N8 and N9.
• the offset voltage adjustment unit 200 includes a comparator 210 and a voltage adjustment unit 220.
• FIG. 15 is a diagram illustrating adjustment of the amplification factor according to the first embodiment of the present invention.
• the bonder 60 described above receives test result information from the tester 1 and executes wire bonding based on the test result information will be described.
• a method for compensating for variations in sensor sensitivity at the manufacturing stage based on correction data included in a test inspection result according to a test sound wave according to the first embodiment of the present invention will be described.
• chip TP In chip TP according to the first embodiment of the present invention, a plurality of resistance elements are provided in the pad region around sensor portion SN. Each of the plurality of resistance elements is electrically coupled between the plurality of pads.
• the plurality of resistance elements RbO to RbM-1 constituting the voltage adjusting unit 220 are also configured on the chip TP and provided between the pads PDbO to PDbM.
• pad PDbO is electrically coupled to power supply voltage Vdd.
• Nod PDbM is electrically coupled to ground voltage GND. Therefore, a plurality of resistance elements are connected in series between the power supply voltage Vd d and the ground voltage GND, and the voltage value output from each pad P Db can be adjusted by resistance division. Therefore, a desired voltage value according to the resistance division is supplied to the input node of the comparator 210 by changing the position of the pad PDb connected to the node Nil.
• the comparator 210 is a voltage follower, a desired voltage value according to this resistance division is transmitted to the node N9 and output to the amplifier 100 as an offset voltage value.
• the offset voltage value included in the characteristic value of the amplifier 100 can be adjusted by a simple method. In this example, for example, when the power supply voltage Vdd is 5 V, 2.5 V is set as a reference offset voltage value (hereinafter also referred to as an offset reference value).
• the offset voltage correction values are subdivided into groups 1 to 42, and the offset voltage correction values (adjustment values) of the amplifiers are determined based on them.
• it shows the case where it is classified into lmV units within the range of 20mV to 20mV based on the offset reference value.
• the offset voltage correction value the value obtained by adding the offset voltage correction value as the correction value to the detected voltage detected for the offset is approximately within the range of ⁇ 0.5 mV to 0.5 mV with respect to the offset reference value. It has been decided to fit. As a result, the offset can be almost canceled and amplification in a highly accurate amplifier becomes possible.
• the tester 1 calculates the detection voltage q, determines the offset voltage correction value determined based on the classification result, and outputs the test result information to the bonder. Output to 60.
• the bonder 60 receives the offset voltage correction value, and electrically couples the predetermined pad PDb and the node Ni l by the voltage adjustment unit 220 so as to obtain a desired offset voltage by wire bonding.
• the detection voltage q corresponds to a value obtained by subtracting the offset reference value from the output reference value force output from the chip TP.
• the output result from the chip TP is a voltage signal waveform that swings around the reference output reference value. Therefore, it is possible to easily measure the reference output reference value by obtaining an average value in a certain measurement section.
• a program for causing a computer to execute the classification method of at least one of the sensor sensitivity and the offset voltage correction value according to the first embodiment of the present invention described above is a storage medium such as an FD, a CD-ROM, or a hard disk in advance. It is also possible to memorize it.
• the tester 1 is provided with a driver device that reads the program stored in the recording medium, and the control unit 20 in the tester 1 receives the program via the driver device, and the allowable range described above It is also possible to execute this determination.
• the program can be downloaded from Sano.
• the second embodiment of the present invention a method for adjusting the characteristics of the sensor will be described.
• the tester 1 in the tester 1 according to the same method as described in the first embodiment. Perform wafer test. Then, the test result information of the tester 1 is output to the ROM data writing device 45.
• the ROM data writing device 45 writes data for determining the characteristics of the amplifier into the storage unit 450 via the ROM interface (IZF) (not shown).
• IZF ROM interface
• the gain of the program amplifier 400 is adjusted by writing the gain adjustment data for adjusting the gain included in the characteristics of the amplifier in the storage unit 450, and the value of the output signal after amplification is adjusted. Can be adjusted.
• adjustments are made before packaging, so in the pre-shipment inspection process after packaging / caging, the output can be set so as not to saturate during the inspection. Time is shortened.
• V V, ru.
• the test result information card OM data writing device 45 in the tester 1 it is input to the test result information card OM data writing device 45 in the tester 1, and the ROM data writing device 45 writes the coarse adjustment data in the storage unit 450.
• the amplification factor is roughly adjusted so that the detection output is not saturated.
• the finished product test apparatus 2 After knocking, here, a case is shown in which inspection is performed by the finished product test apparatus 2 in the pre-shipment inspection process.
• the finished product test apparatus 2 also has a storage unit similar to the tester 1 for executing the classification determination described in FIG. 13 although not shown.
• the finished product test device 2 performs a final test on the device before shipment after knocking.
• an accelerometer is used in the acceleration sensor.
• the finished product test apparatus 2 executes the same classification judgment as FIG. 13 for the variation in the sensor sensitivity of the device based on the detected voltage. Then, the amplification factor is determined and the test result information is output to the ROM data writing device 45 #.
• the ROM data writing device 45 # writes the final adjustment data in the storage unit 450 based on the test result information. That is, the ROM data writing device 45 # re-adjusts the amplification factor of the device after packaging based on the test result information.
• FIG. 20 is a diagram illustrating a process flow for adjusting the characteristics of the amplifying unit according to the modification of the second embodiment of the present invention.
• This device simplifies a system that does not require a separate ROM data writing device.
• a finished product test device 2 it is possible to separately provide a finished product test device 2 and a ROM data writing device.
• the finished product test device 2 # It is also possible to provide a ROM data writing device 45 as a single device. This improves installation efficiency and controllability.
• the chip CP formed for the acceleration sensor has been described.
• the present invention is not limited to the acceleration sensor and can be applied to a MEMS device having other movable parts. It is.
• a microphone 70 includes a substrate 80, an oxide film 81 formed on the substrate 80, and a vibration plate 71 (vibration plate formed on the oxide film 81).
• An extension portion 76 extending from the outside to the outside), a fixing portion 74 provided on the diaphragm 71 and formed of an insulating material, and a back electrode 72 provided on the fixing portion 74.
• a space 73 is formed between the diaphragm 71 and the back electrode 72 by the fixing portion 74.
• the back electrode 72 is provided with a plurality of through holes as acoustic holes 75.
• a back electrode extraction electrode 77 is provided on the surface of the back electrode 72
• a vibration plate extraction electrode 78 is provided on the surface of the extension 76 of the vibration plate 71.
• the diaphragm 71 is provided in a substantially central portion of the substrate 80 and has a rectangular shape.
• a rectangular fixing part 74a to 74d are provided adjacent to the four sides constituting the diaphragm 71, and a back electrode 72 is provided on the fixing part 74.
• the back electrode 72 has an octagonal shape including four sides (straight lines) connecting the four sides of the fixed portion 74 on the diaphragm side and the adjacent fixed portions 74 (for example, adjacent apexes that are the shortest distance between 74a and 74b). is doing.
• a piezoresistive pressure sensor 90 has a diaphragm 91 formed on a silicon substrate by anisotropic etching, and a diffusive piezoresistive element 92a to 92d at the center of its end. Is arranged. The pressure is detected by using a piezoresistive effect in which stress is applied to diffusion type piezoresistive elements 92a to 92d formed on the surface of the diaphragm due to the pressure and its electric resistance changes.
• a piezoresistive pressure sensor 90 is a cross-sectional view taken along ID-ID #. As shown here, diffusion type piezoresistive elements 92a and 92c are arranged on the surface of the diaphragm 91 !.
• FIG. 22 (c) is a wiring diagram when diffusion type piezoresistive elements 92a to 92d are bridge-connected.
• the pressure can be detected by amplifying the detected electrical output by the amplifying unit as described above and measuring the input / output voltage.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Micromachines (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
• Pressure Sensors (AREA)
• Wire Bonding (AREA)

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Citations (3)

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• 2005
  • 2005-07-29 JP JP2005221691A patent/JP4712474B2/ja not_active Expired - Fee Related
• 2006
  • 2006-07-28 TW TW095127909A patent/TW200720660A/zh not_active IP Right Cessation
  • 2006-07-28 WO PCT/JP2006/314957 patent/WO2007013580A1/ja not_active Ceased

Patent Citations (3)

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