WO2006104133A1 - Antistatic resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film, and process for producing the same - Google Patents

Antistatic resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film, and process for producing the same Download PDF

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Publication number
WO2006104133A1
WO2006104133A1 PCT/JP2006/306254 JP2006306254W WO2006104133A1 WO 2006104133 A1 WO2006104133 A1 WO 2006104133A1 JP 2006306254 W JP2006306254 W JP 2006306254W WO 2006104133 A1 WO2006104133 A1 WO 2006104133A1
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Prior art keywords
component
antistatic
group
mass
polymer
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PCT/JP2006/306254
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French (fr)
Japanese (ja)
Inventor
Masaaki Mawatari
Tetsuya Kubota
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Techno Polymer Co., Ltd.
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Publication date
Application filed by Techno Polymer Co., Ltd. filed Critical Techno Polymer Co., Ltd.
Priority to CN2006800144143A priority Critical patent/CN101166784B/en
Priority to KR1020077022040A priority patent/KR101243090B1/en
Publication of WO2006104133A1 publication Critical patent/WO2006104133A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • C09J153/025Vinyl aromatic monomers and conjugated dienes modified
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof

Definitions

  • Antistatic resin composition antistatic / adhesive resin composition, adhesive film, and method for producing the same
  • the present invention relates to an antistatic resin composition that gives a molded article such as a film or sheet having excellent antistatic properties.
  • Antistatic 'adhesive resin composition suitable for forming a highly antistatic adhesive layer on molded articles such as films and sheets, and an antistatic adhesive layer comprising the antistatic' adhesive resin composition The present invention relates to an adhesive film comprising: More specifically, the present invention is excellent in antistatic properties and transparency, antistatic resin composition excellent in surface appearance when formed into a film or the like, excellent in antistatic properties and adhesiveness, The present invention relates to an antistatic adhesive resin composition that allows easy control of adhesive strength, molded articles such as an adhesive film, a sheet, and a laminate using these compositions, and a method for producing the same.
  • Adhesive films in which an adhesive layer is disposed on a support are widely used in the fields of household appliances, construction materials, liquid crystal, and mobile phones. For example, partitions, windows, etc. It is used as a surface protective film for various articles.
  • the pressure-sensitive adhesive film usually has a pressure-sensitive adhesive layer formed on one side of the support, or a force that winds up in a tool-like form by providing a pressure-sensitive adhesive layer on one side of the support and a release layer on the other side. It is rolled up with a release paper attached to it. In the former case, the pressure-sensitive adhesive film is peeled from the release layer, and the pressure-sensitive adhesive layer is adhered to the adherend.
  • the release paper is removed and the adhesive layer is attached to the adherend during use.
  • the adhesive film is peeled off when the adherend is used, but static electricity is generated at this time (hereinafter referred to as peeling charge), and the film after peeling is removed.
  • peeling charge static electricity is generated at this time
  • dust was attached to the peeled film and it was easy to get dirty.
  • Such problems are caused by the pressure-sensitive adhesive layer and those caused by the support, both of which are desired to be solved.
  • the above problem is particularly a problem of peeling charging in the protective film on the polarizing plate surface of the liquid crystal display device.
  • LCDs have larger screens, higher definition, smaller frames, and thinner walls IC circuits are becoming narrower and their resistance to static electricity tends to be reduced, and peeling electrification causes a decrease in product yield.
  • Patent Document 1 discloses that a release layer is provided on one surface of a support having a polyethylene terephthalate (PET) film force, and an adhesive layer is provided on the other surface via an antistatic layer.
  • PET polyethylene terephthalate
  • Patent Document 2 discloses an adhesive film having an adhesive layer containing a charge control agent. Although the release charge generated in the adhesive layer can be eliminated to some extent, it is still static due to the support. There was a problem that occurred.
  • Patent Document 3 discloses a surface protective film having a polyolefin film as a support film and a styrene polymer block and a block copolymer having a conjugate power as a conjugation polymer block as an adhesive. Discloses a surface protective film using a polyolefin film as a support film and a block copolymer obtained by hydrogenating the conjugation polymer portion of the block copolymer as an adhesive.
  • these surface protective films which have been required in recent years as described above, do not satisfy the requirements for preventing anti-peeling, and Patent Document 5 also describes film strength such as polyolefin-based resin.
  • a surface protective film in which a binder layer is laminated on an antistatic layer laminated on one or both sides of a sheet-like substrate, and a pressure-sensitive adhesive layer is laminated on the binder layer.
  • this film has a problem that it is inferior in economic efficiency because an organic solvent is used when forming the antistatic layer, the process is complicated, and measures to prevent environmental pollution are necessary.
  • this film has another problem that even if an antistatic layer is provided in the middle, the antistatic effect is not sufficient, and in particular, the antistatic property on the sheet-like substrate side is not sufficient.
  • Patent Document 1 Japanese Patent Laid-Open No. 8-134416
  • Patent Document 2 JP 2004-155977 A
  • Patent Document 3 Japanese Patent Laid-Open No. 54-126243
  • Patent Document 4 Japanese Patent Laid-Open No. 61-103975
  • Patent Document 5 Japanese Unexamined Patent Publication No. 2000-328024 Disclosure of the invention
  • the adhesive film it is desired to improve the antistatic property for both the adhesive layer and the support.
  • any molded product must have at least a practically acceptable appearance.
  • An object of the present invention is to provide an antistatic resin composition which is excellent in antistatic properties and transparency and excellent in surface appearance when formed into a molded article such as a film.
  • Another object of the present invention is to provide an antistatic adhesive resin composition which is excellent in antistatic property and adhesiveness, easily controls adhesive force, and suitable for forming an adhesive layer.
  • Still another object of the present invention is to provide a support and an antistatic adhesive layer comprising the above antistatic adhesive resin composition, wherein the support and the adhesive layer are bonded with sufficient strength. It is in providing the adhesive film excellent in electroconductivity, and its manufacturing method, Preferably, it is providing the adhesive film excellent in transparency further, and its manufacturing method.
  • Still another object of the present invention is to provide various antistatic molded articles and antistatic laminates such as films and sheets, or to provide a support for the adhesive film. Furthermore, it is providing the antistatic resin composition excellent in heat resistance and the external appearance of a molded article.
  • compositions containing a predetermined amount of a polyolefin resin, a specific block copolymer, and a specific conjugation polymer have found that a composition containing a predetermined amount of a polyolefin resin, a specific block copolymer, and a specific conjugation polymer.
  • the present inventors have used a polyolefin resin containing a cyclic olefin component such as norbornene at a certain ratio as the polyolefin resin. It was found that a resin composition having excellent heat resistance while maintaining excellent antistatic properties can be obtained. A molded product with excellent antistatic properties can be obtained by molding this resin composition, and even when molded into a sheet or film and stacked on other molded products, the antistatic property is excellent. It has been found that a laminate can be provided.
  • the antistatic resin composition of the present invention can provide a molded product such as a film excellent in transparency and appearance as well as antistatic properties.
  • An antistatic adhesive resin composition is provided.
  • the antistatic adhesive resin composition of the present invention is not only antistatic but also excellent in transparency and appearance In addition to providing a molded product such as a film, it can be suitably used to form a transparent adhesive layer on a support having a polymer composition.
  • antistatic 'adhesive rosin composition of the present invention 0 to 40% by mass of the component (8), 6 to 25% by mass of the component (B), Antistatic adhesive composition containing 35 to 94% by mass of the above component (C) (provided that the total of the above component (A), component (B) and component (C) is 100% by mass). Is provided.
  • the antistatic adhesive resin composition according to the first preferred embodiment can be suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film having polyolefin resin-repelling power.
  • the component (A) is modified with polyolefin ( ⁇ '-1) and ⁇ or a functional group.
  • Polyolefin ( ⁇ ′-2) wherein the component (C) is a hydrogenated product of a polymer mainly composed of conjugated genie compound units and aromatic beryl compound units, and the component ( ⁇ ) 0
  • An antistatic adhesive resin composition comprising: -59% by mass, the above component ( ⁇ ) 3-60% by mass, and the above component (C) 40-97% by mass is provided.
  • the component (C) is preferably hydrogenated.
  • the antistatic adhesive resin composition according to the second preferred embodiment forms a transparent film by forming a transparent adhesive layer on a support film made of various polymer compositions such as styrene resin. It can be used suitably to obtain.
  • Examples of preferable laminates according to the present invention include the following forms (1) to (4).
  • a support composed of a polyolefin resin composition, and an antistatic adhesive resin composition of the present invention, preferably disposed on at least one side of the support, preferably the first embodiment Anti-adhesive Finolem characterized by comprising an anti-static adhesive layer comprising an anti-static adhesive composition.
  • a support made of a thermoplastic polymer composition, and at least one surface side of the support, and the antistatic adhesive layer according to the first or second embodiment of the present invention An adhesive sheet or film-like laminate comprising an antistatic adhesive layer that also has a fat composition.
  • the sheet or film according to the above (1) to (4) is characterized by comprising a step of co-extruding the resin composition constituting the support and the antistatic adhesive resin composition of the present invention. It can be produced by a method for producing an adhesive sheet or film.
  • the above-mentioned component (A) is a polyolefin containing a cyclic olefin unit and having a glass transition temperature of 60 to 200 ° C.
  • the component (C) is composed of a polymer block (cl) mainly composed of a conjugated diene compound unit and an aromatic group. It is preferably at least one polymer selected from the group consisting of a block copolymer containing a polymer block (c2) mainly composed of vinyl compound units and a hydrogen additive thereof.
  • the antistatic resin composition and the antistatic adhesive resin composition of the present invention further comprise components (E1), (E2), (E2), Component (E3) and Component (E4) At least one antistatic agent (E) selected from the group consisting of a sufficient amount of the antistatic resin composition in an amount sufficient to improve the antistatic properties, Usually, it is preferable to contain 0.01-30 mass parts with respect to 100 mass parts in total of the said component (A), a component (B), and a component (C).
  • the antistatic resin composition of the present invention includes a predetermined amount of each of the specific components (A), (B) and (C), and thus has excellent antistatic properties and transparency. Outside the surface when molded products such as Excellent view.
  • the component (A) also has the above polyolefin resin (A-1) and (A-2) strength, a molded product having heat resistance can be obtained.
  • the antistatic adhesive composition of the present invention contains a specific amount of specific components (A), (B), and (C), the antistatic property, transparency, and adhesiveness are each included. Excellent adhesiveness and easy control of adhesive strength.
  • the antistatic adhesive composition of the present invention provides an antistatic adhesive layer having excellent adhesion to a support.
  • the adhesive film as a whole is excellent in antistatic properties and has a surface resistivity of 10 9 ⁇ or less under a predetermined condition. can do.
  • the pressure-sensitive adhesive film is excellent not only in antistatic properties but also in transparency, appearance, and adhesion between the support and the antistatic adhesive layer. According to the method for producing a pressure-sensitive adhesive film of the present invention, a pressure-sensitive adhesive film having excellent adhesion between the support and the antistatic pressure-sensitive adhesive layer can be easily formed.
  • (co) polymerization means homopolymerization and copolymerization
  • (meth) acryl means acryl and cocoon or methacryl
  • (Meth) atalylate means attalate and cocoon or metatalerate.
  • the antistatic resin composition of the present invention comprises (ii) polyolefin-based resin (also referred to as “component (ii)” in the present invention, except for the following (iii)): 30 to 95% by mass , ( ⁇ ) a block copolymer containing an olefin polymer block and a hydrophilic polymer block (also referred to as “component ( ⁇ )” in the present invention) 5 to 20% by mass, and (C) a conjugate At least one polymer selected from the group consisting of a polymer comprising a pheny compound unit and its hydrogenated product force (also referred to as “component (C)” in the present invention) is 0 to 50% by mass. (Provided that the total of component (A), component (B) and component (C) is 100% by mass).
  • the above component (A) is a polymer containing olefins having 2 or more carbon atoms as constituent monomer units. There is no particular limitation as long as it is an olefin-based resin and other than the component (B) described later.
  • a preferred component (A) is a (co) polymer containing olefins having 2 to 10 carbon atoms as constituent monomer units.
  • Preferred embodiments of the component (A) according to the present invention include: (1) a constituent monomer unit mainly composed of at least one selected from olefins having 2 or more carbon atoms (co) Polymer (hereinafter referred to as “polymer (1)”); (2) At least one selected from olefins having 2 or more carbon atoms, and a compound power capable of copolymerizing with the olefins At least one selected Examples include (co) polymer (2) (hereinafter referred to as “polymer (2)”) in which the constituent monomer units are mainly composed of species and force. These can be used alone or in combination of two or more.
  • polystyrene-based resin those obtained by a known polymerization method such as a high-pressure polymerization method, a low-pressure polymerization method, a metalocene catalyst method, and the like can be used.
  • acyclic olefins are typically used. Specific examples thereof include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene. 3-methyl-1-pentene, 4-methyl-1-pentene, 3-ethyl 1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl- Examples include 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, and other a-olefins. These can be used alone or in combination of two or more. Of these, ethylene, propylene, 1-butene, 3-methyl-1-butene, and 4-methyl-1 pentene are preferable, and ethylene and propylene are
  • olefins As the olefins, cyclic olefins can also be used. Cyclic olefins are usually used in combination with the non-cyclic olefins.
  • cyclic olefin is not particularly limited as long as it is an alicyclic compound having one double bond, and examples thereof include compounds exemplified in JP-A-5-310845.
  • cyclic olefin is a compound having 11 or less carbon atoms.
  • norbornene having a carbon number of 11 or less is preferred. It is preferable that the enes (norbornene and Z or norbornene derivatives) occupy 50% by mass or more of the entire cyclic olefin.
  • norbornene include 2-norbornene (bicyclo [2.2.1] hept-2ene), 6-methylbicyclo [2.2.1] hept-2-ene, 6ethylbicyclo [2 2. 1] Hepto-2, 6- n-butylbicyclo [2.2.1] Hepto-2, 6 isobutylbicyclo [2.2.1] Hepto-2, 5, 6 dimethylbicyclo [ 2. 2.
  • cyclic olefins having 12 or more carbon atoms can be used alone or in combination with the above-mentioned compounds having 11 or less carbon atoms.
  • examples of the compound copolymerizable with the olefins in the polymer (2) include non-conjugated genie compounds.
  • examples of the non-conjugated genie compound include an acyclic geny compound and an alicyclic geny compound. These can be used alone or in combination of two or more.
  • Examples of acyclic gen compounds include straight chain acyclic gen compounds such as 1,4 monohexagen, 1,5 hexagen, 1,6-hexagen, 1,9-decadiene, etc .; 4-methyl-1,4 Kisagene, 5- Methinore 1,4 1-Hexagen, 7-Methinore 1,6-Octagen, 3,7 Dimethyl-1,6-Octagen, 5,7 Dimethylocta-1,6 Gen, 3,7 Dimethyl 1,7-Octagen 7 branched chain acyclic gen compounds such as methyl otater 1,6 gen and dihydromyrcene. These can be used alone or in combination of two or more.
  • the component (A) may be crystalline or amorphous, but preferably has a crystallinity of 20% or more by X-ray diffraction at room temperature. It is. In order to adjust the crystallinity, a known crystal nucleating agent may be added to the component (A).
  • the melting point (based on JIS K7121) of the component (A) is preferably 40 ° C or higher.
  • the molecular weight of the component (A) is not particularly limited, but from the viewpoint of moldability, melt flow rate (according to JIS K7210) ⁇ , preferably ⁇ 0.00-500g / 10 min, more preferably ⁇ . 01 ⁇ 500g / 10min, more preferably 0.05 ⁇ : LOOg / 10min, each value is preferred with a molecular weight corresponding to this value.
  • the polymer (1) includes polyethylene (high density polyethylene, low density polyethylene, linear polyethylene, meta-catalyzed polyethylene, etc.), ethylene copolymer (Copolymer containing 50% by mass or more of ethylene units based on all monomer units), ethylene 1-butene copolymer, polypropylene, propylene 'ethylene copolymer, propylene copolymer (propylene unit Copolymer containing 50% by mass or more based on the monomer unit), poly 1-butene, and the like.
  • polyethylene, polypropylene, and propylene / ethylene copolymers are preferred.
  • the propylene / ethylene copolymer a force random copolymer having a random copolymer, a block copolymer and the like is particularly preferable. These can be used alone or in combination of two or more.
  • the melting point (in accordance with JIS K7121) of the above polyethylene or ethylene copolymer (ethylene 'a-olefin copolymer, etc.) is preferably 40 ° C or higher, and the molecular weight is not particularly limited. Therefore, the melt flow rate (conforming to JIS K6922) is preferably 0.001 to 500 gZlO, more preferably 0.01 to LOOgZlO, and preferably has a molecular weight corresponding to each value.
  • the melting point of the above-mentioned polypropylene or propylene copolymer is preferably 40 ° C or higher, and the molecular weight is not particularly limited, but from the viewpoint of moldability.
  • the melt flow rate (conforming to JIS K7210) is preferably 0.01 to 500 gZl0 minutes, more preferably 0.05 to LOOgZlO, each value Those having a molecular weight corresponding to are preferred.
  • the polymer (2) includes an ethylene'norbornene copolymer, a propylene-norbornene copolymer, an ethylene'propylene-5 ethylidene 2-norbornene copolymer, and the like. Can be mentioned. These can be used alone or in combination of two or more. These polymers are preferably those produced by the metamouth catalyst method. In addition, each content of the monomer unit which comprises said copolymer is not specifically limited.
  • the component (A) contains a cyclic olefin unit as a constituent monomer unit and has a glass transition temperature of 60 to 200 ° C. It is preferable to use both the polyolefin-based resin (A-1) and the polyolefin-based resin (A-2) containing no cyclic olefin units.
  • the polyolefin resin (A-1) and (A-2) are also referred to as the component (A-1) and the component (A-2), respectively.
  • the glass transition temperature of the polyolefin resin (A-1) is preferably 60 to 200 ° C, more preferably 70 to 200 ° C, still more preferably 70 to 190 ° C, and particularly preferably 75. ⁇ 185 ° C. If this glass transition temperature is too low, the effect of imparting heat resistance is not sufficient, while if it is too high, the surface appearance of the molded product may deteriorate. In order to obtain a polymer having the above glass transition temperature, it is preferable that the cyclic olefin is copolymerized in the range of 40 to 90% by mass with respect to the whole component (A-1).
  • the glass transition temperature can be measured by a known method such as using a differential scanning calorimeter (DSC).
  • DSC differential scanning calorimeter
  • the melt flow rate (measured at a temperature of 260 ° C. and a load of 2.16 kg according to ISO 1133) of this polyolefin resin (A-1) is preferably from 0.1 to LOOmlZlO. Furthermore, it is preferable that this polyolefin resin (A-1) is amorphous.
  • the polyolefin resin (A-2) used in combination with the polyolefin resin (A-1) use all the components (A) that do not contain a cyclic olefin unit as a constituent monomer unit. The description of the component (A) can be applied to the polyolefin resin (A-2) as it is.
  • the mixing ratio of the polyolefin-based resin (A-1) and the polyolefin-based resin (A-2) is When the total of these is 100% by mass, the component (A-1) is 1 to 95% by mass and the component (A-2) is 99 to 5% by mass, preferably the component (A-1) is 10 to 90%.
  • the content of component (A) is 30 to 30% when the sum of component (A), component (B) and component (C) is 100% by mass. It is 95% by mass, preferably 42 to 92% by mass, more preferably 49 to 92% by mass, and particularly preferably 49 to 90% by mass. If this content is less than 30% by mass, the rigidity tends to decrease, while if it exceeds 95% by mass, the antistatic property tends to be inferior.
  • Component (B) according to the present invention comprises an olefin polymer block (also referred to as “polymer block (bl)” in the present invention) and a hydrophilic polymer block (in the present invention, “polymer block”). (b2) ”))).
  • This component (B) can impart antistatic properties to the antistatic resin composition of the present invention.
  • this component (B) can be used alone or in combination of two or more.
  • the arrangement of the polymer blocks (bl) and (b2) is not particularly limited, and may have a block structure exemplified in the following (1) to (5). it can.
  • ml is an integer of 1 or more
  • m2 and m2 ′ are both integers of 2 or more, and may be the same or different.
  • each structure when there are a plurality of polymer blocks (bl) and (b2), each block may be the same as or different from each other.
  • block structures (1), (2) and (3) that is, polymer blocks (bl) and (b 2) It is preferable to arrange alternately repeatedly.
  • the component (B) is a force component (B) mainly composed of the above-mentioned block copolymer, and other (co) blocks such as a polyamide block and a polyester block in a proportion of 20% by mass or less. Polymer blocks can also be included.
  • the bond form of the polymer blocks (bl) and (b2) is preferably an ester bond, an amide bond, an ether bond, a urethane bond or an imide bond.
  • the polymer block (bl) is a block having a polymer strength mainly composed of olefin units, and examples of the compound forming the polymer include acyclic olefins having 2 or more carbon atoms and cyclic olefins. It is done.
  • Examples of acyclic olefins include ethylene and propylene, 1-butene, 1 pentene, 1-hexene, 3-methyl 1-butene, 4-methyl 1-pentene, 3-methylhexene 1
  • Examples include olefin.
  • An example of cyclic olefin is norbornene. These compounds can be used alone or in combination of two or more.
  • the polymer block (bl) includes 4-methyl-1,4 monohexagen, 5-methinoleyl 1,4 monohexagen, 7-methylenole 1,6-octagen, 1,9-decadene. It may be a polymer containing non-conjugated gen as a constituent monomer unit.
  • both ends of the molecule of the polymer block (bl) are A carboxyl group, a hydroxyl group, an amino group, an acid anhydride group, an oxazoline group, and an epoxy group.
  • Examples of a method for imparting these functional groups include a method of subjecting a polymer having a double bond at the molecular end obtained by a thermal degradation method to an addition reaction of an unsaturated compound having the above functional group.
  • the number average molecular weight of the above polymer block (bl) in terms of polystyrene by gel permeation chromatography (GPC) is preferably ⁇ 800 to 20,000, more preferably ⁇ 100 to : L0, 000, more preferred ⁇ is 1,200 to 6,000.
  • the polymer block (bl) may be contained alone or in combination of two or more in the component (B).
  • the polymer block (b2) is a polymer-strength block having a hydrophilic group such as a hydroxyl group, an amino group, or an ether group, and preferably has a polymer force having an ether bond in the main chain. is there.
  • the polymer include polyether (b2-a), polyether-containing hydrophilic polymer (b2-b), and eron polymer (b2-c).
  • polyether (b2-a) examples include polyether diol, polyether diamine, and modified products thereof.
  • polyether-containing hydrophilic polymer (b2-b) examples include polyether ester amide having a polyether diol segment, polyether amide imide having a polyether diol segment, polyether ester having a polyether diol segment, Polyether amides having a segment of ether diamine and polyether urethanes having a segment of polyether diol or polyether diamine.
  • the er-on polymer (b2-c) has a dicarboxylic acid having a sulfo group and a polyether (b2-a) as essential constituent units, and preferably 2 to 80 units in one molecule.
  • Preferable examples are eron polymers having 3 to 60 sulfo groups.
  • polymer block (b2) may be composed of only one type of block, or may contain two or more types of blocks.
  • a preferred component (b2) is a polyether (b2-a), more preferably a polyether diol and a polyetheramine, and particularly preferably a polyetherdiol.
  • polyether diol in the polyether (b2-a) is represented by the general formula (1):
  • Examples include those represented by ⁇ .
  • E 1 is a divalent hydroxyl group-containing compound, and the residue is a residue excluding the hydroxyl group
  • a 1 is an alkylene group having 2 to 4 carbon atoms
  • n and are integers of usually 1 to 300, preferably 2 to 250, particularly preferably 10 to 100.
  • N may be the same or different.
  • Examples of the divalent hydroxyl group-containing compound include a compound containing two alcoholic or phenolic hydroxyl groups in one molecule, that is, a dihydroxy compound. Specifically, Examples include dihydric alcohols, dihydric phenols, and diols containing tertiary amino groups. These can be used alone or in combination of two or more.
  • the dihydric alcohol is preferably a compound having 2 to 12 carbon atoms which may be aliphatic, alicyclic or aromatic.
  • aliphatic dihydric alcohol examples include ethylene glycol, alkylene glycol such as propylene glycol such as 1,3 propylene glycol, 1,4 butanediol, 1,6-hexanediol, 1,9-nonanediol, and neopentyl glycol. 1, 12-dodecanediol and the like.
  • alicyclic dihydric alcohols examples include 1,2- and 1,3-cyclopentanediol, 1,2-, 1,3 and 1,4-cyclohexanediol, and 1,4-cyclohexane. Examples include dimethanol.
  • aromatic dihydric alcohol examples include xylene diol.
  • the divalent phenol is preferably a compound having 6 to 18 carbon atoms such as monocyclic divalent phenol, bisphenol, condensed polycyclic divalent phenol and the like.
  • Examples of the monocyclic divalent phenol include hydroquinone, catechol, resorcin, and urushiol.
  • bisphenol examples include bisphenol A, bisphenol F, bisphenol S, 4,4′-dihydroxydiphenyl-1,2-butane, dihydroxybiphenyl, dihydroxydiphenyl ether, and the like.
  • Examples of the condensed polycyclic divalent phenol include dihydroxynaphthalene and binaphthol.
  • examples of the tertiary amino group-containing diol include N alkyl dialkylanolamines having 1 to 8 carbon atoms.
  • E 2 represents a hydroxyl group from the divalent hydroxyl group-containing compound described in the general formula (1).
  • the residue A 2 except at least part of the general formula (3) —CHR—CHR ′ (wherein one of RR ′ is represented by the general formula (4) CH 0 (A 3 0) R And the other is H.
  • X is 1 10 integer
  • R represents H or C 1 10 alkyl group, group, an alkyl ⁇ aryl group, ⁇ reel alkyl or Ashiru group, A 3 4 2 carbon atoms
  • the remaining alkylene group may be a C 24 alkyl group.
  • the m (OA 2 ) and the (A 2 0) may be the same or different.
  • M may be the same as or different from m.
  • the polyether diol represented by the general formula (1) can be produced by addition reaction of an alkylene oxide to a divalent hydroxyl group-containing compound.
  • alkylene oxide examples include alkylene oxides having 24 carbon atoms, such as ethylene oxide, propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide, 2,3-butylene oxide, 1,3-butylene oxide, and these Two or more combined systems are used.
  • the bond type may be random and ⁇ or block or misaligned.
  • Preferred as alkylene oxides are block and soot or random addition with ethylene oxide alone and in combination with ethylene oxide and other alkylene oxides.
  • the number of alkylene oxides added is preferably an integer of 1300, more preferably 2250, and particularly preferably 10 to L00 per hydroxyl group of the divalent hydroxyl group-containing compound.
  • Preferable methods for producing the polyether diol represented by the general formula (2) include the following methods (1) and (II).
  • a 4 is an alkylene group having 24 carbon atoms, p is an integer of 1 10, R 1 is H or an alkyl group having 1 10 carbon atoms, an aryl group, an alkyl aryl group, an aryl alkyl group. Group or acyl group.
  • alkylene oxide having 2 to 4 carbon atoms used here all of those described above can be used.
  • the polyether diamine the polymer represented by the general formula (1) can be used in which a hydroxyl group is substituted with an amino group by a known method.
  • the polyether amide is composed of polyamide and polyether diamine.
  • the polyether amide imide is composed of a polyamide imide having at least one imide ring and a polyether diol.
  • the polyether ester is composed of polyester and polyether diol.
  • the polyether ester amide is composed of a polyamide having a carboxyl group at the terminal and a polyether diol.
  • the polyether urethane is composed of an organic diisocyanate and a polyether diol, or is composed of an organic diisocyanate, a polyether diamine, and a chain extender.
  • the arion polymer (b2-c) can be obtained by modifying the polymer block, and has, for example, a block composed of polyether diol and Z or polyether diamine and a sulfonyl group. It is preferable to copolymerize with dicarboxylic acid units. Can yield a polymer having 2 to 80, more preferably 3 to 60, sulfo groups.
  • the component contains at least one salt (H) selected from the group consisting of alkali metals and alkaline earth metals.
  • H salt
  • these components can be contained before polymerization of component (B), during polymerization of component (B), or after polymerization of component (B).
  • it can be blended when the antistatic resin composition of the present invention is produced, or can be contained by a method combining these.
  • Component (H) includes organic acids such as alkali metals such as lithium, sodium and potassium, and alkaline earth metals such as Z, magnesium and calcium, sulfonic acids, salts of inorganic acids, and halides.
  • organic acids such as alkali metals such as lithium, sodium and potassium, and alkaline earth metals such as Z, magnesium and calcium, sulfonic acids, salts of inorganic acids, and halides.
  • component (H) include lithium chloride, sodium chloride, potassium salt, alkali metal halides such as lithium bromide, sodium bromide, potassium bromide; Inorganic acid salts of alkali metals such as lithium borate, sodium perchlorate and potassium perchlorate; organic acid salts of alkali metals such as potassium acetate and lithium stearate; octyl sulfonic acid, dodecyl sulfonic acid, tetradecyl sulfonic acid, stearyl Alkali metal salts of alkyl sulfonic acids having 8 to 24 carbon atoms in the alkyl group, such as sulfonic acid, tetracosyl sulfonic acid and 2-ethylhexyl sulfonic acid; aromatic sulfonic acids such as phenyl sulfonic acid and naphthyl sulfonic acid Alkali metal salts; oct
  • the polymer blocks (bl) and (b2) have the above block structure.
  • the structures (1) to (5) are preferably constituted by the arrangements shown in the block structures (1) to (3).
  • composition ratio (bl) / (b2) of the polymer blocks (bl) and (b2) is preferably 10 to 90% by mass, ZlO to 90% by mass, more preferably when the total of these is 100% by mass Is 20 to 80 mass% Z20 to 80 mass%, more preferably 30 to 70 mass% Z30 to 70 mass%.
  • the average repeat number of the polymer blocks (b 1) and (b2) is preferably 2 to 50.
  • the component (B) can be obtained by polymerizing the olefin polymer block (bl) and the hydrophilic polymer block (b2) by a known method.
  • it can be produced by polymerizing the polymer block (bl) and the polymer block (b2) at 200 to 250 ° C. under reduced pressure.
  • a known polymerization catalyst can be used in the polymerization reaction.
  • Tin-based catalysts such as monobutyltin oxide, antimony-based catalysts such as antimony trioxide and antimony dioxide, tetrabutyl titanate, and the like Titanium-based catalyst, zirconium hydroxide, zirconium-based catalyst such as zirconium oxide, zirconium acetate, and the like, Group organic acid salt Catalytic power One or a combination of two or more selected.
  • the component (B) can be produced, for example, by the method described in JP-A-2001-278985, JP-A-2003-48990, and the like.
  • the content of component (B) is 5 to 5 when the total of component (A), component (B) and component (C) is 100% by mass. It is 20% by mass, preferably 8 to 18% by mass, more preferably 8 to 16% by mass, and particularly preferably 10 to 16% by mass. If the content is less than 5% by mass, the antistatic property tends to be inferior, whereas if it exceeds 20% by mass, the surface appearance of the molded product tends to be inferior.
  • Component (C) according to the present invention is a polymer containing a conjugated pheny compound unit (also referred to as “union (Cl)”. And a hydrogenated product of the polymer (CI) (also referred to as “polymer (C2)” in the present invention).
  • the polymer (C1) may be a polymer containing only a conjugated diene compound unit, or a polymer containing the conjugated diene compound unit and an aromatic vinyl compound unit.
  • Conjugated Genie compounds constituting the conjugated Genie compound unit include 1,3-butadiene, isoprene, hexagen, 2,3-dimethyl-1,3-butadiene, 1,3-penta. Gen etc. are mentioned. These can be used alone or in combination of two or more. Of these, 1,3-butadiene and isoprene are preferred. Therefore, examples of the polymer (C1) containing only the above conjugated diene compound unit include polybutadiene and polyisoprene.
  • examples of the aromatic vinyl compound constituting the aromatic vinyl compound unit include styrene, (X-methylstyrene, hydroxystyrene, etc. These may be used alone. Alternatively, two or more types can be used in combination, and among these, styrene is preferred, with styrene and ⁇ -methylstyrene being preferred.
  • each compound may be contained singly or in combination of two or more.
  • the content of the conjugated conjugated compound unit in the polymer (C1) is preferably 30 to 95 when the total of the conjugated genic compound unit and the aromatic conjugated compound unit is 100% by mass. mass 0/0, more preferably 50 to 95 weight 0/0, particularly preferably Ru 60 to 93% by mass.
  • the content of the aromatic vinyl compound unit in the polymer (C1) is preferably when the total of the synergistic pheny compound unit and the aromatic vinyl compound unit is 100% by mass. Is 5 to 70% by mass, more preferably 5 to 50% by mass, and particularly preferably 7 to 40% by mass.
  • the total amount of the conjugated conjugated compound unit and the aromatic vinyl compound compound unit is preferably 80% by mass or more, more preferably 90%, based on all monomer units constituting the polymer (C1). It is at least mass%.
  • the polymer (C1) includes a conjugation compound unit and an aromatic bur compound unit
  • the polymer (C1) is copolymerized with the aromatic bur compound and the conjugated gen compound. It may further comprise other units that also provide possible compound power. In addition, this unit may be included alone or in combination of two or more.
  • the polymer (C1) may be a block copolymer, a random copolymer, or a bond in which a random copolymer and a block copolymer are mixed. It may be in a form. These can be used alone or in combination of two or more. Of these, block copolymers are preferred.
  • the polymer (C1) includes a conjugated gen compound unit and an aromatic bur compound unit
  • the conjugated gen compound unit mainly (preferably 80% by mass with respect to all monomer units). Or more, more preferably 90% by mass or more, more preferably 99% by mass or more) from the polymer block (cl) and the aromatic vinyl compound compound unit (preferably 80% by mass with respect to all monomer units).
  • a block copolymer containing the above polymer block (c2) is preferred.
  • the polymer block (cl) and the polymer block (c2) may include the aromatic beryl compound unit and the conjugated Jen compound unit, respectively.
  • the polymer block (cl) usually has a vinyl bond, and its content (total) is not particularly limited. That is, it may be 50% or more, or less than 50%. In the former case, it is usually 50 to 95% with respect to the polymer block (cl). In the latter case, it becomes easy to adjust the rigidity and transparency of the molded product.
  • polymer block (c2) force conjugation compound unit In the case where the polymer block (c2) force conjugation compound unit is included, it may have a bull bond.
  • the polymer block (cl) is a block in which the polymer block (cl) is bonded in any form of a random shape, a block shape, and a tapered block shape, particularly when two or more kinds of conjugated genie compound units are included. May be.
  • this polymer block (cl) is a polymer block having a different bull bond content derived from a conjugation compound unit which may contain 1 to 10 taper blocks in which aromatic vinyl compound units gradually increase. Isopower may be included as appropriate.
  • the polymer (C1) is known in the technical field of anion polymerization.
  • JP-B 47-28915, JP-B 47-3252, JP-B 48-2423 This is disclosed in Japanese Patent Publication No. 48-20038.
  • the weight with taper block A method for producing a coalescence is disclosed in JP-A-60-81217 and the like.
  • Adjustment of the amount of bull bonds (1, 2 and 3, 4-bond content) contained in the polymer block (C1) is N, N, ⁇ ', ⁇ , -tetramethylethylenediamine, Amines such as trimethylamine, triethylamine, diazocyclo (2, 2, 2) octane, ethers such as tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol dibutyl ether, thioethers, phosphines, phosphoamides, alkylbenzene sulfonates, potassium Or sodium alkoxide.
  • Amines such as trimethylamine, triethylamine, diazocyclo (2, 2, 2) octane
  • ethers such as tetrahydrofuran
  • diethylene glycol dimethyl ether diethylene glycol dibutyl ether
  • thioethers thioethers
  • phosphines phosphines
  • phosphoamides alkyl
  • a polymer in which a polymer molecular chain is extended or branched via a coupling agent residue using a coupling agent can also be used.
  • Coupling agents used here include jetyl adipate, dibutenebenzene, methyldichlorosilane, silicon tetrachloride, butyl trichloro silicon, tetra black tin, butyl tri black tin, dimethyl black silicon, tetra black germanium, 1 1,2 dibromoethane, 1,4 chloromethylbenzene, bis (trichlorosilyl) ethane, epoxidized amateur oil, tolylene diisocyanate, 1,2,4 benzene triisocyanate and the like.
  • the content of vinyl bonds (1, 2 and 3, 4 bonds) derived from the conjugation compound in the polymer (C1) is preferably in the range of 5 to 80%.
  • the number average molecular weight of the above polymer (C1) is preferably ⁇ 10,000 to 1,000,000, more preferably ⁇ 20,000 to 500,000, more preferred ⁇ more 20 , 000 to 300,000, specially preferred ⁇ or 20,000 to 200,000.
  • the number average molecular weight is determined by gel permeation chromatography (GPC), and the same applies to the following.
  • Preferred examples of the block copolymer as the polymer (C1) include polymers having structures represented by the following formulas (IV) to (XI).
  • c 1 is a polymer block composed of a homopolymer or a copolymer containing only a conjugated diene compound unit or a conjugated diene compound unit, and further comprising an aromatic belief.
  • C 2 is a polymer block mainly containing an aromatic vinyl compound unit, and if it is a polymer block substantially having an aromatic vinyl compound, Further, a polymer block containing 90% by mass or more, more preferably 99% by mass or more of an aromatic bur compound, which may contain a partially conjugated Jen compound.
  • X is a residue of the coupling agent
  • C 11 is a polymer block mainly containing a conjugated gen compound unit, and a bull bond amount is 20% or more
  • C 12 is mainly containing a conjugated gen compound unit
  • It is a polymer block having a bulle bond amount of less than 20%
  • y is an integer of 1 to 5
  • z is an integer of 1 to 5
  • z ' is an integer of 1 to 5.
  • C 1 s when there are a plurality of C 1 s , they may be the same or different.
  • C 2 is the same. ]
  • the content of vinyl bonds (1, 2 and 3, 4 bonds) derived from the conjugated conjugated compound in the block copolymer preferable as the polymer (C1) is preferably in the range of 5 to 80%.
  • the number average molecular weight of the block copolymer is preferably 10,000 to 1,000,000, more preferably ⁇ 20, 000 to 500,000, specially preferred ⁇ It is 20, 000 to 300, 000.
  • the number average molecular weight of the polymer block c 1 (c 11 and c 12 ) is preferably 5,000 to 200,000, and the number average of the polymer block C 2
  • the molecular weight is preferably 3,000 to 150,000.
  • the use ratio of the aromatic vinyl compound and the conjugated genie compound is as follows: aromatic vinyl compound conjugated genie compound
  • ⁇ 70 ⁇ 30 ⁇ 90 mass 0/0 and more preferably the range of the preferred tool 15 ⁇ 65 ⁇ 35 ⁇ 85 mass 0/0, and particularly preferably from 20 ⁇ 60 ⁇ 40 ⁇ 80 mass 0/0.
  • block copolymers preferred from the viewpoint of impact resistance is a polymer having in the range of 1 to 10 tapered blocks in which aromatic vinyl compounds are gradually increased in block (c2), and Z or A radial block type that has been coupled.
  • polymer (C1) a commercially available product can be used, for example, “TR200 manufactured by JSR Corporation. Can use "0”, “TR2500”, “TR2600”, “TR2827” (named above, product name).
  • the polymer (C2) is a hydrogenated product of the polymer (C1). That is, the polymer (C2)
  • (C2) is obtained by hydrogenating at least a part of the carbon-carbon double bond derived from the conjugation compound unit.
  • the hydrogenation rate is preferably 10-100%, more preferably
  • polymer (C2) a force capable of using one or more of hydrogenated polymers having the structures represented by the above formulas (IV) to (XI) can be used.
  • Polymer before hydrogenation as (C1) in particular, a vinyl bond content of the polymer is preferably tool in the polymer block C 1 of the formula (VI) is 6
  • Hydrogenation to the polymer (C1) is, for example, JP-B-42-8704, JP-B-43.
  • the polymer (C2) a commercially available product can be used.
  • “DYNALON 1320P”, “DYNARON 1321P”, “DYNARON 2324P”, “DYNARON 6200P”, “DYNARON” manufactured by JSR Corporation can be used.
  • “4400P”, “Dynalon 4600P”, “Tuftec H1041” (trade name) manufactured by Asahi Kasei Co., Ltd., etc. can be used.
  • the melt mass flow rate of the component (C) is preferably used in any of the polymers (C1) and (C2). Is from 0.5 to 50 gZlO, more preferably from 1 to 20 gZlO.
  • the above polymers (C1) and (C2) can be used in combination.
  • fraction (CI) / (C2) is 0-80 mass 0 / OZl00 ⁇ 20 mass 0/0, more preferably. -60 mass 0 / oZl 00-40 mass%, more preferably 0-40 mass% Z100-60 mass%.
  • the content of component (C) is 0 to 0 when the total of component (A), component (B) and component (C) is 100% by mass. 50% by weight, preferably 0-4 0% by mass, more preferably 0-35% by mass. When this content exceeds 50% by mass, the rigidity tends to decrease. In particular, when used as a support for an adhesive film, the rigidity is lacking.
  • the antistatic resin composition of the present invention further comprises at least one antistatic property selected from the group consisting of the following component (E1), component (E2), component (E3) and component (E4): It may contain an agent (E) (also referred to as “component (E)” in the present invention). These components may be used alone or in combination.
  • Component (E1) a salt having a cation moiety having a fluorinated alkylsulfol group
  • Component (E2) a polymer containing a unit represented by the following general formula ( ⁇ ),
  • Component (E3) a boron compound containing a unit represented by the following general formula ( ⁇ ),
  • Ingredient (E4) nonionic surfactant.
  • R 5 represents a hydrocarbon group, preferably an alkylene group
  • R 5 ′ represents a hydrogen atom, a halogen atom or a hydrocarbon group
  • X represents a hydrogen atom, a hydrocarbon group, a urethane residue or an ester residue.
  • a hydrocarbon group having a group or a hydrophilic group, preferably an anionic hydrophilic group, and m represents a number of 1 or more.
  • the salt (El) having a key moiety having a fluorinated alkylsulfol group is a fluorinated alkylsulfol group.
  • the number of fluorine atoms bonded to the carbon atom of the fluorinated alkylsulfonyl group is not particularly limited, and any one of 1 to 3 fluorine atoms may be bonded to one carbon atom. Further, the number of sulfo groups is not particularly limited.
  • Examples of the fluorinated alkylsulfonyl group contained in the cation moiety include fluorinated lower alkylsulfol groups such as trifluoromethanesulfonic acid and pentafluoroethanesulfonic acid, in particular. And perfluoroalkylsulfol groups.
  • the cation constituting component (E1) is preferably trifluoromethanesulfonic acid itself, one or more of bis (trifluoromethanesulfol) imide, tris (trifluoromethanesulfonyl) methide, etc.
  • Derivatives such as methide and ammonia in which a hydrogen atom is substituted with a trifluoromethanesulfol group may be mentioned.
  • Specific examples of the key-on portion include CFSO-, (CFSO) N-, and (CFSO) C-.
  • CFSO-, (CFSO) N-, and (CFSO) C- As the cation part, Li
  • Alkali metal ions such as +, Na + and K + can be mentioned, and among these, Li + is preferable.
  • lithium trifluoromethanesulfonate bis (trifluoromethanesulfol) imide lithium, bis (trifluoromethanesulfol) imide sodium, bis (trifluoromethanesulfol) Examples include potassium imide, tris (trifluoromethanesulfol) methide lithium, tris (trifluoromethanesulfol) methide sodium, and tris (trifluoromethanesulfol) methide potassium. These can be used alone or in combination of two or more. Of these, lithium trifluoromethanesulfonate, lithium bis (trifluoromethanesulfol) imide and tris (trifluoromethyl). Tansulfol) Methidolithium is preferred.
  • the above component (E1) when used, it can be used as it is, dissolved in a solvent such as water, bis [2- (2-butoxyethoxy) ethyl] adipate, bis (2-butoxychetyl) phthalate, etc. It may be used in the form of a solution obtained by mixing with a polymer having an ether bond, such as the above component (B), and used in the form of a masterbatch.
  • a polymer having an ether bond include polyethylene glycol, polyethylene oxide, a block copolymer composed of a polyamide block and a polyethylene glycol block, and a block copolymer composed of a polyester block and a polyethylene glycol block.
  • the concentration is preferably in the range of 0.1 to 80% by mass, more preferably 1 to 60% by mass.
  • the component (E1) a commercially available product can be used.
  • “Sanconol AQ—50 ⁇ ” above, trade name
  • “Sanconol ⁇ -25” (trade name) manufactured by Sanko Chemical Industry Co., Ltd. can be used.
  • the component (E1) can be used alone or in combination of two or more.
  • component (E1) When component (E1) is used alone as component ( ⁇ ), the content of component ( ⁇ ) in the antistatic resin composition of the present invention is such that components (A), ( ⁇ ) and When the total of (C) is 100 parts by mass, it is preferably 0.01-30 parts by mass, more preferably 0.01-20 parts by mass, still more preferably 0.1-10 parts by mass, particularly preferably 0.1 to 5 parts by mass. If the content of this component (E1) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
  • the polymer ( ⁇ 2) (also referred to as “component ( ⁇ 2)” in the present invention) containing the unit represented by the above general formula (XII) is preferably 10 to: LOO mass. 0/0, more preferably. 20 to: LOO wt%, more preferably 30: a polymer containing LOO mass%.
  • the above units are at least 2 in the polymer constituting the component ( ⁇ 2). More than 1, preferably 3 It is preferable to contain 30 pieces.
  • R 5 is a hydrocarbon group, preferably an alkylene group having 24 carbon atoms, and particularly preferably an ethylene group.
  • R 5 ′ is a hydrogen atom, a halogen atom or a hydrocarbon group.
  • the halogen atom include a chlorine atom, a bromine atom and an iodine atom.
  • the hydrocarbon group include an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, and a cycloalkenyl group. There are no particular limitations on the number of carbon atoms in these groups.
  • alkyl group examples include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec butyl group, a tbutyl group, an n pentyl group, an isopentinole group, and a sec pentinole group.
  • T pentinole group T pentinole group, n-hexenole group, sec hexinole group, n-heptyl group, sec heptyl group, n-octyl group, 2-ethyl hexyl group, sec octyl group, n-nor group, sec-nor group, n-decyl group, sec-decyl group, n-undecyl group, sec undecyl group, n-dodecyl group, sec dodecyl group, n tridecyl group, isotridecyl group, sec tridecyl group, n-tetradecyl group , Sec-tetradecyl group, n-xadecyl group, sec-hexadecyl group, stearyl group, icosyl group, docosyl group, tetracosyl group, triaconsyl group, 2-butyloctyl group
  • alkenyl group examples include a butyl group, a allyl group, a probe group, a butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptul group, and an otatur group.
  • aryl group a phenyl group, a tolyl group, a xylyl group, a tertyl group, a mesityl group, a benzyl group, a phenethyl group, a styryl group, a cinnamyl group, a benzhydryl group, a trityl group, an ethylphenol group, a propylphenol group, Group, butylphenol group, pentylphenol group, Xylphenyl, heptylphenyl, octylphenyl, norphenyl, decylphenyl, undecylphenyl, dodecylphenyl, phenylphenyl, benzylphenol, styrenated Group, p-taylphenol group, dinol-phenol group, 0C naphthyl group, ⁇ -naphthyl
  • Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a methylcyclopentyl group, a methylcyclohexyl group, and a methylcycloheptyl group.
  • Examples of the cycloalkenyl group include a cyclopentyl group, a cyclohexenyl group, a cycloheptyl group, a methylcyclopentyl group, a methylcyclohexyl group, and a methylcycloheptenyl group.
  • R 5 ' is preferably a hydrogen atom, a chlorine atom, or a bromine atom, which is preferably a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 36 carbon atoms from the viewpoint of miscibility with and compatibility with resin. More preferred are alkyl groups having 1 to 24 carbon atoms and aryl groups having 2 to 24 carbon atoms.
  • X is a hydrogen atom, a hydrocarbon group, a hydrocarbon group having a urethane residue or an ester residue, or a hydrophilic group (for example, an anionic hydrophilic group).
  • the hydrocarbon group the hydrocarbon group described above as R 5 ′ can be applied. That is, an alkyl group, an alkyl group, an aryl group, a cycloalkyl group, a cycloalkenyl group and the like can be mentioned. Of these, alkyl groups having 1 to 4 carbon atoms are preferred, and alkyl groups having 1 to 4 carbon atoms are most preferred.
  • the urethane residue means an atomic group after the isocyanate group in the monoisocyanate has reacted.
  • the monoisocyanate include methyl isocyanate, ethyl isocyanate, propyl isocyanate, butyl isocyanate, hexyl isocyanate, octyl isocyanate, lauryl isocyanate, octadecyl isocyanate, cyclohexane.
  • Examples include xyl isocyanate, phenyl isocyanate, tolylene isocyanate, and oleyl isocyanate.
  • ester group in the hydrocarbon group having an ester residue examples include a acetyl group, propionyl group, petityl group, isoptylyl group, valeryl group, isovaleryl group, bivalyl group, lauroyl group, myristoyl group, noremitoyl group, Stearoyl group, behyl group, acryl Group, propioroyl group, methacrylyl group, crotonol group, oleiroyl group, benzoyl group, phthaloyl group, succinyl group and the like.
  • an alkylsulfonic acid group C H SO M (k is an integer of 2 to 4 k 2k 3
  • Rate group CH COOM and the like.
  • M is a hydrogen atom, a metal atom, or ammonia (including quaternary ammonia).
  • M is a metal atom
  • an alkali metal atom such as lithium, sodium or potassium
  • an alkaline earth metal atom such as magnesium or calcium (however, since the alkaline earth metal atom is usually divalent, 1Z2 ) And the like.
  • sodium and potassium are preferred.
  • M is ammonia
  • its forming substances are ammonia, methylamine, dimethylamine, ethylamine, jetylamine, (iso) propylamine, di (iso) propylamine, monoethanolamine, N methylmonoethanolamine.
  • m is a number of 1 or more, preferably 1 to 300, more preferably 1 to 200, and still more preferably 5 to L00.
  • the component ( ⁇ 2) includes a unit consisting of alkylene oxide adduct (N1) of dehydration condensate of phenol or a phenol having a substituent and a formaldehyde; alkylene oxide of this compound (N1) Compound obtained by etherification of the chain end with a hydrocarbon group () 2) Unit also having a force; Compound (N3) wherein the end of the alkylene oxide chain of the compound (N1) is substituted with a hydrocarbon group having an isocyanate group or an ester group ( ⁇ 3 From the compound ( ⁇ 4) in which a terionic hydrophilic group (sulfonic acid group, sulfate group, phosphate group, carboxylate group, etc.) is introduced at the end of the alkylene oxide chain of the compound (N1) And polymers containing one or more of the above units.
  • a compound that can be co-condensed with phenol or a phenol having a substituent for example,
  • a polymer obtained by reacting one or more of the compounds (N1) to (N4) can be used as the component (E2).
  • phenol or a phenol having a substituent may be substituted with ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran (1, 4-butylene oxide), long chain a one-year-old refin oxide.
  • alkylene oxides such as styrene oxide, etc.
  • (R 5 — O) part represented by the above general formula (XII) is formed by addition polymerization of alkylene oxides, etc.
  • the type of (R 5 — ⁇ ) is determined by the type of alkylene oxide to be added.
  • the form of polymerization of added alkylene oxide or the like is not particularly limited, and homopolymerization of one type of alkylene oxide or the like, random copolymerization of two or more types of alkylene oxide, block copolymerization, or random Z block copolymerization. Any of these may be used.
  • R 5 is preferably an alkylene group having 2 to 4 carbon atoms, particularly preferably an ethylene group.
  • the (R 5 — 5 ) moiety is formed by copolymerization of two or more types of alkylene oxides, one of them is preferably ethylene oxide.
  • m is preferably 1 to 300, more preferably 1 to 200, still more preferably 5 to: L00.
  • the compound (N4) is publicly known by using a compound having a terionic hydrophilic group exemplified above for part or all of the terminal (usually a hydroxyl group) of the compound (N1). The reaction can be obtained from this method.
  • component (E2) a commercially available product can be used.
  • “Adecanol AS-113” (trade name) manufactured by Asahi Denka Kogyo Co., Ltd. can be used.
  • the component (E2) can be used alone or in combination of two or more.
  • component (E2) when component (E2) is used alone as component (E), the content of component (E) in the antistatic resin composition of the present invention is such that components (A), (B) and When the total of (C) is 100 parts by mass, it is preferably 0.01-30 parts by mass, more preferably 0.1-30 parts by mass, and still more preferably 1 to 25 parts by mass, particularly preferably 3 to 20 parts by mass. If the content of this component (E2) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
  • the boron compound (E3) (also referred to as "component (E3)" in the present invention) containing the unit represented by the above general o ( ⁇ ) is preferably represented by 90 to: LOO mass%, more preferably 95-100 mass%, still more preferably 98-: a compound containing LOO mass%.
  • (E3) is preferably a polymer compound containing at least 5 units.
  • Examples of the compound containing the unit represented by the general formula ( ⁇ ) include a semipolar organic boron polymer compound represented by the following general formula (XIV) and a total number of carbon atoms having a hydroxyl group of 5 It is preferably a polymer charge transfer conjugate which is a reaction product of one boron atom to one basic nitrogen atom with one or more of ⁇ 82 tertiary amines.
  • T 2 is
  • R 9 is a hydrocarbon group having 1 to 82 carbon atoms.
  • R 1U is a hydrocarbon group having 2 to 13 carbon atoms.
  • S, t and u are respectively
  • R 6 , R 7 and R 8 are the same or different organic groups, and r is 10 to: L 000. ]
  • examples of R 7 and R 8 include a hydrocarbon group, an alkoxy group, a phenoxy group, a benzyloxy group, and an alkylene glycol group. These groups may have a functional group such as a hydroxyl group, or may have a substituent.
  • Examples of the charge transfer-type conjugate include conjugate forces represented by the following chemical formulas (XV) to (XXII).
  • XV conjugate forces represented by the following chemical formulas
  • XXII conjugate forces represented by the following chemical formulas
  • a terminal carbon atom and oxygen atom are usually bonded to a hydrogen atom or a hydroxyl group, respectively.
  • R ′ is a residue of polybutene having an average degree of polymerization of 20.
  • the polymer charge-transfer conjugate can be produced by the method described in Japanese Patent No. 2573986.
  • component (E3) a commercially available product can be used.
  • “NOI BORON 400N” (trade name) manufactured by Boron International Co., Ltd. is preferable.
  • the above component (E3) may be blended alone in the production of the composition, or a mixture (composition) comprising the above component (A), component (B), component (C) and the like.
  • An example of the latter is “NOBOLON MB400N-8LDPE” (trade name) manufactured by Boron International, Inc., which is a master batch using polyethylene as a matrix.
  • the component (E3) can be used alone or in combination of two or more.
  • component (E3) When component (E3) is used alone as component (E), the content of component (E3) in the antistatic resin composition of the present invention is such that component (A), component (B) And when the total of component (C) is 100 parts by mass, it is preferably 0.01 to 30 parts by mass, more preferably 0.05 to 20 parts by mass, and even more preferably 0.1 to: part by mass of LO. Particularly preferred is 0.3 to 5 parts by mass. If the content of this component (E3) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
  • nonionic surfactant (E4) also referred to as “component (E4)” in the present invention
  • component (E4) examples include esters of polyhydric alcohols, nitrogen-containing compounds, and the like.
  • ester of the polyhydric alcohol examples include glycerin ester, polyglycerin ester, sonorevitane ester, ethylene glycol ester, propylene glycol ester and the like.
  • examples of the glycerin ester include glycerin monolaurate, glycerin monomyristate, daricerine monopalmitate, glycerin monostearate, glycerin monobehenate, and glycerin monooleate.
  • polyglycerol ester examples include diglycerol monolaurate, diglycerol monomyristate, diglycerol monopalmitate, diglycerol monostearate, diglycerol monobenzoate, and diglycerol monooleate.
  • sorbitan esters include sorbitan monooleate, sorbitan monobehenate, sorbitan monostearate, sorbitan monoisostearate, sorbitan monolaurate, sorbitan monopalmitate, and the like.
  • Examples of the ethylene glycol ester include ethylene glycol monostearate.
  • propylene glycol ester examples include propylene glycol monostearate.
  • glycerol monostearate diglycerol monostearate, glycerol monolaurate, diglycerol monolaurate and sorbitan monostearate are preferred.
  • nitrogen-containing compounds include ammine compounds and amido compounds.
  • amine compounds include lauryl diethanolamine, myristyl diethanolamine, palmityl diethanolamine, stearyl diethanolamine, oleyljetanolamine, lauryl diisopropanolamine, myristyl diisopropanolamine, normityl diisopropanol.
  • Dialkanols such as amines, stearyldiisopropanolamines, oleyldiisopropanolamines, N, N-bishydroxyethylalkylamines (however, the carbon number of the alkyl group is usually 12-22). Min etc. are mentioned.
  • the amide compounds include lauryl diethanolamide, myristyl diethanolamide, palmityl diethanolamide, behyl-butanolamide, oleyljetanolamide, lauryl diisopropanolamide, myristyl diisopropanolamide, noremithyl diisopropanolamide. , Stearyl diisopropanolamide, and oleyl diisopropanolamide.
  • lauryl diethanolamine and stearyl diamine are preferred for the amine compound.
  • Ethanolamine is particularly preferred.
  • the above component (E4) may be incorporated alone in the production of the composition, or a mixture (composition) comprising the above component (A), component (B), component (C) and the like. ). In the latter case, miscibility can be improved in the composition.
  • the component (E4) can be used alone or in combination of two or more.
  • component (E4) When component (E4) is used alone as component (E), the content of component (D4) in the antistatic resin composition of the present invention is such that component (A), component (B) And when the total of component (C) is 100 parts by mass, preferably 0.01 to 30 parts by mass, more preferably 0.05 to 20 parts by mass, still more preferably 0.1 to: LO parts by mass, Particularly preferred is 0.5 to 5 parts by mass. If the content of this component (E4) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may be insufficient.
  • component (E4) When the above component (E4) is used, a higher alcohol having 12 to 18 carbon atoms, a lubricant, silica, calcium silicate, etc. may be blended in order to further improve the antistatic property of the component. Good.
  • a master batch can be used for the purpose of improving miscibility. In such a prescription, it is preferable to use a composition containing 20% by mass or more of component (E4).
  • a compound such as component (E4) of the present invention can be obtained as Kao's electro stripper TS-5, EA, TS-3B, TS-2B, TS-13B, TS-7B (trade name) and the like.
  • the component (E) may be a combination of two or more selected from the component (E1), the component (E2), the component (E3), and the component (E4) force. it can. Particularly preferred is a combination of the above components (E1) and (E4). Component (E1), Component (E2), Component (E3), and Component (E4) Strength When using two or more selected combinations in combination, the total amount is determined by component (A), component (B) and When the total of component (C) is 100 parts by mass, it is preferably 0.01 to 30 parts by mass, more preferably 0.01 to 15 parts by mass, still more preferably 0.1 to: part by mass of LO. Particularly preferred is 0.5 to 7 parts by mass. If the content of component (E) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
  • the antistatic resin composition of the present invention further comprises an antistatic property-imparting additive, an additive depending on the purpose and application.
  • an antistatic property-imparting additive an additive depending on the purpose and application.
  • Engineering aids fillers, antioxidants, heat stabilizers, plasticizers, fillers, UV absorbers, weathering agents, light-proofing agents, antistatic agents, flame retardants, lubricants, sliding agents, coloring agents, foaming agents, antibacterial agents
  • Additives such as nucleating agents and crystal nucleating agents can be blended.
  • an antistatic property-imparting aid in order to further improve the antistatic property by component (1), it is preferable to contain an antistatic property-imparting aid.
  • These antistatic agents can be used alone or in combination of two or more.
  • antistatic agent examples include alkali metal salts such as lithium, sodium and potassium; alkaline earth metal salts such as magnesium and calcium.
  • the types of salts include inorganic hydroacid salts (halogenated compounds), sulfates, perchlorates, etc .; carboxylates, dicarboxylates, alkane sulfonates, aromatic sulfonates ( And organic acid salts such as fluorinated sulfonic acid salts.
  • halide examples include lithium chloride, sodium chloride salt, potassium salt salt, lithium bromide, sodium bromide, potassium bromide and the like.
  • perchlorates examples include lithium perchlorate, sodium perchlorate, and potassium perchlorate.
  • Examples of the carboxylate include potassium acetate and lithium stearate.
  • alkanesulfonic acid salts include alkanesulfonic acids having 8 to 24 carbon atoms such as octylsulfonic acid, dodecylsulfonic acid, tetradecylsulfonic acid, stearylsulfonic acid, tetracosylsulfonic acid, 2-ethylhexylsulfonic acid, and the like. Salts are preferred.
  • Aromatic sulfonates include: phenyl sulfonic acid, naphthyl sulfonic acid, octyl sulfonic acid, dodecyl sulfonic acid, dibutyl sulfonic acid, dimethyl sulfonic acid, dimethyl naphthyl sulfonic acid, diisopropyl naphthyl sulfonic acid.
  • the antistatic property-imparting aid can be blended in the production of the antistatic oil composition of the present invention.
  • the blending amount of the antistatic agent is preferably 0.001 to 10 parts by mass, more preferably 0.01 to 5 parts by mass when the component (B) is 100 parts by mass.
  • the processing aid is not particularly limited as long as it does not impair transparency and antistatic properties.
  • an acrylic polymer, a styrene polymer, a fluorine polymer, and the like can be given. These are all preferably ultra-high molecular weight compounds (weight average molecular weight of 1 million or more), and can be used singly or in combination of two or more.
  • the amount of the processing aid is preferably 0.1 to 10 parts by mass when the total of component (A), component (B) and component (C) is 100 parts by mass. By setting this range, the compatibility of the component (A), the component (B) and the component (C) can be improved, and the extrusion moldability of the antistatic resin composition can be improved. .
  • Fillers include metals, alloys, inorganic compounds, organic compounds, polymer compounds, inorganic, organic composites, etc., powders, lumps, hollows, plates, fibers (whiskers) Etc.) can be used depending on the purpose and application. It may be conductive. These fillers can be used alone or in combination of two or more.
  • Fillers include glass fiber, glass flake, glass fiber milled fiber, glass bead, hollow glass bead, carbon fiber, carbon fiber milled fiber, aramid fiber, phenolic resin fiber, polyester fiber, zinc oxide whisker, titanium Potassium oxide whisker, aluminum borate whisker, alumina, silica, talc, calcium carbonate, wollastonite, my strength, kaolin, montmorillonite, hectorite, organically treated smectite, tin-coated titanium oxide, tin-coated silica, nickel Examples include coated carbon fiber, silver, copper, brass, iron, and vigorous black. These can be used alone or in combination of two or more.
  • the filler those treated with a known coupling agent, surface treatment agent, sizing agent or the like can be used for the purpose of improving dispersibility.
  • the coupling agent include a silane coupling agent, a titanate coupling agent, and an aluminum coupling agent.
  • the blending amount of the filler is preferably 0.1 to 200 parts by mass when the total of the components (A), (B) and (C) is 100 parts by mass.
  • the colorant known dyes, pigments and the like can be used.
  • the blending amount of the colorant is preferably 0.001 to 20 parts by mass, more preferably 1 to 200 parts by mass when the total of the components (A), (B) and (C) is 100 parts by mass. It is.
  • the antistatic coagulant composition of the present invention may further include, as necessary, a thermoplastic coagulant, a thermoplastic elastomer, a thermosetting coagulant, etc. It may contain other polymers.
  • thermoplastic resin polyamide resin
  • polyester resin such as polybutylene terephthalate, polyethylene terephthalate, polyarylate, liquid crystalline polyester
  • polyphenylene ether such as polybutylene terephthalate, polyethylene terephthalate, polyarylate, liquid crystalline polyester
  • polyphenylene ether such as polybutylene terephthalate, polyethylene terephthalate, polyarylate, liquid crystalline polyester
  • polyphenylene ether polyphenylene sulfide
  • aromatic polycarbonate thermoplastic polyurethane
  • phenoxy resin PMMA resin, ABS resin, ASA resin, AES resin, HIPS AS resin, PS resin, MS resin, copolymer of methyl methacrylate and maleimide compound, styrene and maleimide compound And the like.
  • thermoplastic elastomers include polyamide elastomers and polyester elastomers.
  • thermosetting resin examples include epoxy resin, phenol resin, urea resin, and the like.
  • the above-described components, additives, and the like are charged into various extruders, Banbury mixers, aders, continuous rolls, rolls, etc., and melt kneaded under heating. Can be obtained. Each component may be added all at once and kneaded with force, or may be added separately and kneaded.
  • known molding methods such as injection molding, press molding, calendar molding, T-die extrusion molding, inflation molding, profile extrusion molding, and foaming molding can be applied. Further, vacuum forming or the like can be further applied to the sheet or the like obtained by the above method.
  • the antistatic resin composition of the present invention and a molded article using the same have a surface resistivity of preferably 5 x 10 12 ⁇ or less under conditions of a temperature of 23 ° C and a humidity of 50% RH. It is preferably 9 ⁇ 10 11 ⁇ or less, more preferably 9 ⁇ 10 10 ⁇ or less, and particularly preferably 5 ⁇ 10 9 ⁇ or less.
  • the shape of the molded product may be in accordance with the purpose, application, etc., such as a sheet, a film, etc.
  • Thin bodies thinness: LOOmm
  • rod-like bodies such as round bars and square bars; and further modifications thereof; trays, cases, and the like.
  • the thickness thereof is preferably 0.2 to: LOmm, more preferably 0.5 to 5 mm.
  • the thickness is preferably 5 to 200 ⁇ m, more preferably 10 to 150 ⁇ .
  • one or both sides of the sheet and film may have an uneven part, a groove part, a hole part, etc. depending on the purpose and application. Moreover, you may have a through-hole.
  • a molded article using the antistatic resin composition of the present invention is a composite article integrated with a molded article made of another material other than the single molded article, for example, an adhesive film described later, It is also suitable for forming multi-layer sheets and the like. Therefore, in the above composite article, when the antistatic resin composition of the present invention is used and the formed part is on the outermost surface, the surface specific resistance under the above conditions can be maintained. Excellent electrical properties. When the other material has transparency, the composite article as a whole is excellent in transparency.
  • the antistatic adhesive composition according to the present invention comprises 0 to 59% by mass of the above-described component ( ⁇ ) polyolefin-based resin (excluding the following component ( ⁇ )), and a block of the above component ( ⁇ ). Copolymer 3 to 60% by mass, polymer of component (C) and soot or hydrogenated product 35 to 97% by mass (provided that the above component ( ⁇ ), component ( ⁇ ) and component ( The sum of C) is 100% by mass.)
  • the component ( ⁇ ), component ( ⁇ ) and component (C) of the antistatic adhesive composition of the present invention are as described above for each component with respect to the antistatic resin composition of the present invention. Can be applied as is.
  • component (ii), component (ii) and component (C) are 0 to 40% by mass, 6 to 25% by mass and 35 to 94% by mass, respectively, preferably 0 to 35% by mass, 8 to 20% by mass and 45-92% by mass, more preferably 0-30% by mass, 8-18% by mass and 52-92% by mass, more preferably 0-25% by mass, 8-16% by mass and 59%. It is -92 mass%.
  • the adhesiveness to other members can be adjusted by selecting the type and content of component (C). That is, this Excellent tackiness is exhibited if the bull bond content contained in the polymer block (cl) forming the component (C) is preferably 60 to 90%, more preferably 70 to 85%.
  • “Dynalon 1320P”, “Dynalon 1 321P” (trade name) manufactured by JSR, etc. are preferably used.
  • the adhesiveness can be easily adjusted by appropriately blending a polymer hydrogenated product containing a polymer block (cl) having a vinyl bond content of less than 60% as part of the component (C). It becomes.
  • the content of the component (B) is too large, the appearance of the molded product may be deteriorated. If the amount is too small, the antistatic property may decrease.
  • the antistatic property may be lowered. If the amount is too small, the tackiness may not be sufficient.
  • the antistatic adhesive resin composition according to the first preferred embodiment can be suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film made of polyolefin resin.
  • the component (A) is modified with polyolefin ( ⁇ '-1) and ⁇ or a functional group, and the polyolefin ( ⁇ '-2), wherein the component (C) is a hydrogenated product of a polymer mainly composed of a conjugated genie compound unit and an aromatic beryl compound unit, and the component ( ⁇ ) 0 to 59 mass %,
  • the above component ( ⁇ ) 3 to 60% by mass, and the above component (C) 40 to 97% by mass an antistatic adhesive resin composition is provided.
  • the antistatic adhesive resin composition according to the second preferred embodiment is suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film having various polymer strengths such as styrene resin. it can.
  • the component (A) in the antistatic 'adhesive resin composition according to this second preferred embodiment is a polyolefin resin ( ⁇ '-1) and a polyolefin resin modified with a resin or functional group ( ⁇ '). — 2) There will be power.
  • Polyolefin resin ( ⁇ '-1) is a modified polyolefin resin, and the content of the polyolefin resin ( ⁇ ) described in the above antistatic resin composition of the present invention is as follows. all Applicable, a polymer containing at least one olefin having at least 2 carbon atoms: LO as a constituent monomer unit is preferred, and a polymer containing ethylene as a main component is particularly preferred.
  • the polyolefin resin ( ⁇ '-1) has a molecular weight sufficient as a molding resin at room temperature.
  • the melt flow rate measured according to JIS 6922 is preferably 0.01 to: LOOgZlO content, more preferably 0.03 to 70 gZlO content. belongs to.
  • the polyethylene used here any of high density polyethylene, low density polyethylene, and linear low density polyethylene can be used.
  • the above component ( ⁇ '-2) is a polyolefin modified with a functional group. It is fat.
  • the polyolefin resin is polypropylene or polyethylene, more preferably low molecular weight polypropylene or low molecular weight polyethylene, and particularly preferably low molecular weight polyethylene.
  • the weight average molecular weight of the low molecular weight polyolefin is preferably 1,000 to 100,000, more preferably ⁇ 5,000 or 6,000 to 60,000, specially preferred ⁇ or 8,000 to 50,000, 000.
  • the low molecular weight polyolefin can be obtained from a polymerization method or a thermal degradation method of high molecular weight polyolefin. The ones that are preferred due to their functional modification are those obtained by the thermal degradation method.
  • the low molecular weight polyolefin by thermal degradation is, for example, a method in which high molecular weight polyolefin is thermally degraded in an inert gas, usually at 300 ° C. to 450 ° C. for 0.5 hours to 10 hours (for example, JP-A-3- No. 62804).
  • Modification methods using functional groups include unsaturated acids, unsaturated acid anhydrides, epoxy group-containing unsaturated compounds, hydroxyl group-containing unsaturated compounds, oxazoline group-containing unsaturated compounds, amino group-containing unsaturated compounds, substitution This is a method of adding an amino group-containing unsaturated compound or the like.
  • Preferred are unsaturated acids and unsaturated acid anhydrides.
  • unsaturated acid used here examples include acrylic acid, methacrylic acid, crotonic acid, ketonic acid, itaconic acid, maleic acid, and the like. These may be used alone or in combination of two or more. Can be used. Further, as the unsaturated acid anhydride, there are maleic anhydride, itaconic anhydride, black mouth itaconic anhydride, black mouth maleic anhydride, citraconic anhydride, etc. These can be used alone or in combination of two or more. Preferred is maleic anhydride.
  • the amount of the functional group-containing unsaturated compound in the above component 2) is preferably 0.5 to 25% by mass, more preferably 1 to 20% by mass, particularly preferably 100% by mass of polyolefin resin. 1 to 15% by mass.
  • the modification method using the functional group-containing unsaturated compound can be obtained, for example, by modifying the functional group-containing unsaturated compound in a polyolefin resin by a method such as a solution method or a melting method in the presence of an organic peroxide if necessary. Can do.
  • the material corresponding to the above component ( ⁇ ′-2) can be obtained on the market as, for example, Yumetus 1001, 1003, 1010, 100TS, HOTS, 2000, CA60 (trade name) manufactured by Sanyo Chemical Industries.
  • the above component ( ⁇ '-1) is used for the purpose of adjusting the tackiness of the pressure-sensitive adhesive.
  • the above component ( ⁇ '-2) is used for the purpose of improving the adhesion between the pressure-sensitive adhesive and the support when producing the pressure-sensitive adhesive film, and the easy-adhesive coated on the support. .
  • the amount of the component ( ⁇ ) used is 100 mass in total of the components ( ⁇ ) and ( ⁇ ) of the present invention. % In the range of 0 to 59% by weight, preferably 1 to 59% by weight, more preferably 1 to 48% by weight, even more preferably 2 to 45% by weight, particularly preferably 3 to 40% by weight. is there.
  • the preferred amounts of the component ( ⁇ '-1) and the component ( ⁇ '-2) are both ( ⁇ 2) to 37% by mass, more preferably 2 to 35% by mass, and particularly preferably 5 to 30% by mass with respect to 100% by mass of the total of component ()) and component (ii) (C).
  • the adhesive adjustment function is poor, and if it exceeds the range, the stickiness is poor.
  • the component ( ⁇ ′-2) is less than the above range, adhesion such as adhesion between the pressure-sensitive adhesive and the support when producing an adhesive film, adhesion between the easy-adhesive coated on the support and the like If the improvement is not sufficient and the range is exceeded, the tackiness tends to be inferior, which is not preferable.
  • the component ( ⁇ ) is a block copolymer containing an olefin polymer block and a hydrophilic polymer block.
  • the above description regarding the antistatic oil-absorbing composition is applicable as it is.
  • the above components ( ⁇ ) is a block copolymer containing an olefin polymer block and a hydrophilic polymer block.
  • the amount of B) used is 3 to 60% by weight, preferably 3 to 50% by weight, based on the total 100% by weight of component (B) and component (C) when component (A) is not included.
  • the content is preferably 5 to 40% by mass, and particularly preferably 5 to 35% by mass. When the content is less than 3% by mass, the antistatic property is inferior, and when it exceeds 60% by mass, the tackiness is lowered.
  • the amount of component (B) used is 3 to 60% by mass, preferably 100% by mass of component (A), component (B) and component (C), preferably 3 to 59% by mass, more preferably 3 to 49% by mass, still more preferably 5 to 48% by mass, and particularly preferably 5 to 42% by mass. If it exceeds the mass%, the adhesiveness will decrease.
  • the component (C) comprises the component (C) as a conjugate conjugated compound unit and an aromatic vinyl compound. It is a hydrogenated product of a polymer mainly composed of units, and the contents described with respect to the antistatic resin composition of the present invention apply as it is.
  • component (C) of the antistatic adhesive resin composition of this second preferred embodiment the aromatic belieu compound unit and the conjugated genie compound unit are random copolymers, It is also possible to use a block copolymer in which each block is a block, or to form a combined form in which a random copolymer and a block copolymer are mixed.
  • a preferred component (C) is a hydrogen of a block copolymer containing a polymer block (cl) mainly composed of conjugated diene compound units and a polymer block (c2) mainly composed of aromatic beryl compound units. It is an additive.
  • the structure particularly preferred as the component (C) is as follows: In view of the ease of adjusting the adhesive strength and the ease of developing transparency as an adhesive, it has the structure of (VII) above.
  • the hydrogenated product as the component (c) of the antistatic adhesive resin composition of the second preferred embodiment is mainly hydrogenated at least part of the carbon-carbon double bond of the conjugation compound. Is. That is, as the component (C), one obtained by partially or completely hydrogenating the carbon-carbon double bond of the conjugation moiety of the copolymer described above is used.
  • the preferred hydrogenation rate is 10 to: LOO%, more preferably 50 to: L00%, and particularly preferably 90 to 100%.
  • the amount of component (C) used is that when component (A) is not included, component (B) and component (C) In the total of 100% by mass, 40 to 97% by mass, preferably 50 to 97% by mass, more preferably 60 to 95% by mass, and particularly preferably 65 to 95% by mass. When the amount exceeds 97% by mass, the antistatic property is poor.
  • the amount of component (C) used when it contains component (A) is 40 to 97% by mass, preferably 50 to 97% of the total of 100% by mass of component (A), component (B) and component (C).
  • the mass% is more preferably 50 to 93% by mass, particularly preferably 55 to 92% by mass. If it is less than 40% by mass, the tackiness is lowered, and if it exceeds 97% by mass, the antistatic property is inferior.
  • the antistatic adhesive rubber composition according to the first and second embodiments further includes a component (E) and various additives that can be blended in the antistatic resin composition of the present invention.
  • component (E) various additives that can be blended in the antistatic resin composition of the present invention.
  • other polymers can be contained.
  • the description of the antistatic resin composition of the present invention can be applied to these types and contents as they are.
  • the antistatic pressure-sensitive adhesive composition of the present invention comprises the above components (A), (B), (C), additives and the like in various extruders, Banbury mixers, aders, continuous -It can be obtained by putting it in a roll or roll and melt-kneading under heating. Each component may be mixed and then kneaded, or may be divided and added.
  • known molding methods such as injection molding, press molding, calendar molding, T-die extrusion molding, inflation molding, profile extrusion molding, and foam molding can be applied. Further, vacuum forming or the like can be further applied to the sheet or the like obtained by the above method.
  • the antistatic 'adhesive resin composition of the present invention and a molded article using the same have a surface resistivity at a temperature of 23 ° C and a humidity of 50% RH, preferably 5 X 10 12 ⁇ . Or less, more preferably 9 ⁇ 10 11 ⁇ or less, further preferably 9 ⁇ 10 10 ⁇ or less, particularly preferably 5 ⁇ 10 9 ⁇ or less It can be.
  • the shape of the molded product can be determined according to the purpose, application, etc., and thin sheets such as sheets and films; rod-shaped bodies such as round bars and square bars; can do.
  • the thickness thereof is preferably 0.2 to: LOmm, more preferably 0.5 to 5 mm.
  • the thickness is preferably 5 to 200 ⁇ m, more preferably 10 to 150 ⁇ .
  • one or both sides of the sheet and film may have an uneven part, a groove part, a hole part, etc. depending on the purpose and application. Moreover, you may have a through-hole.
  • a molded article using the antistatic adhesive pressure-sensitive resin composition of the present invention is also suitable for forming a composite article integrated with a molded article made of another material, for example, a multilayer sheet described later. is there. Therefore, in the above composite article, when the molded part using the antistatic adhesive adhesive composition of the present invention is on the outermost surface, the surface resistivity can be maintained under the above conditions. Excellent antistatic and adhesive properties. Further, when the other materials have transparency, the composite article as a whole is excellent in transparency.
  • the antistatic adhesive resin composition of the present invention can be used to form an adhesive layer on a support composed of various thermoplastic polymer compositions.
  • a support composed of various thermoplastic polymer compositions and the antistatic adhesive resin composition of the present invention which is disposed on at least one surface side of the support.
  • An adhesive film comprising the antistatic adhesive layer is provided.
  • thermoplastic polymers that can be used as the composition constituting the support generally include elastomers, rubbers and rosins. These can be used alone or in combination of two or more.
  • elastomers include olefin elastomers; styrene elastomers such as styrene 'butadiene' styrene block copolymers and styrene 'isoprene' styrene block copolymers; polyester elastomer elastomers; urethane elastomers; Polyvinyl chloride elastomer; Poly Examples include amide elastomers; fluoro rubber elastomers and the like. These can be used alone or in combination of two or more.
  • Examples of rubbers include polybutadiene, polyisoprene and other gen-based rubbers, styrene 'butadiene (block) copolymers, styrene' isoprene (block) copolymers, acrylonitrile 'butadiene copolymers, butadiene' (metabolites).
  • Acrylic acid ester copolymer hydrogenated styrene 'butadiene block copolymer, hydrogenated butadiene-based polymer, ethylene' a-olefin copolymer, ethylene ' a- olefin-polyethylene copolymer, acrylic rubber, silicone rubber , Fluorine rubber, butyl rubber, ethylene ionomer and the like.
  • the styrene / butadiene block copolymer and the styrene / isoprene block copolymer include those having an AB type, ABA type, tapered type, or radial teleblock type structure.
  • the hydrogenated butadiene polymer is a hydride of a polymer having a styrene block and a styrene / butadiene random copolymer block, and a 1,2-vinyl bond, in addition to the hydride of the block copolymer. Examples include hydrides of polymers composed of polybutadiene blocks having a content of 20% by mass or less and polybutadiene blocks having a 1,2-bule bond content of more than 20% by weight.
  • the above rubbers can be used alone or in combination of two or more.
  • Thermoplastic resins include polyolefin resins such as polyethylene and polypropylene, acrylic resins such as polymethyl methacrylate, polystyrene, styrene resins such as rubber-reinforced styrene resin, polyethylene terephthalate, Polyester resin such as polybutylene terephthalate, polyamide resin such as nylon 6, nylon 66, nylon 46, polycarbonate resin, fluorine resin, polysulfone, polyphenylene sulfide, liquid crystal polymer and the like. These can be used alone or in combination of two or more. Of these, polyolefin resins, acrylic resins, styrene resins, polyester resins, polyamide resins and polycarbonate resins are particularly preferred. Polyolefin resins and styrene resins are preferred. .
  • the polyolefin resin composition useful as a molding material for the support is not particularly limited as long as it contains a polyolefin resin, and may be only a polyolefin resin, or a polyolefin resin. A mixture of fat and other ingredients (additives, other polymers, etc.) May be. In the latter case, the antistatic resin composition of the present invention may be used as it is, or other composition may be used. When antistatic properties are required, it is particularly preferable to use the antistatic resin composition of the present invention.
  • the polyolefin resin is a homopolymer of olefins having 2 or more carbon atoms, a copolymer of two or more ⁇ -olefins, and a copolymer of ⁇ -olefin and other bur monomers.
  • low density polyethylene LDPE
  • medium density polyethylene high density polyethylene
  • HDPE high density polyethylene
  • UHMPE ultra high molecular weight polyethylene
  • ethylene propylene, 1-butene, 1 pentene, 1-hexene, 4-methinole 1-Pentene, 1-Otaten, 1-decene, etc., C3-C12 (Copolymer with X-olefins; Polypropylene (PP); Propylene, 1-butene, 1-pentene, 1-hexene, 4— Copolymers with ⁇ -olefins having 4 to 12 carbon atoms such as methyl 1-pentene, 1-octene, 1-decene; polyolefin resin that can be blended in the antistatic resin composition of the present invention (A — Ethylene / cyclic olefin copolymers, propylene / cyclic olefin copolymers; ethylene 'propylene' gen copolymers;
  • the component (A) contained in the antistatic resin composition of the present invention may be used, and the component (A) and the component (B) may be used in combination.
  • the antistatic property of the support and the antistatic property as an adhesive film are excellent.
  • polyethylene, polypropylene, propylene and ethylene copolymers are preferred polymers containing 50% by mass or more of propylene units based on the total monomer units, that is, polypropylene, propylene and ethylene copolymers. Coalescence is more preferred.
  • a power random copolymer having a random copolymer, a block copolymer and the like is particularly preferable. Further, these polymers and the above antistatic resin of the present invention.
  • Heat resistance as an adhesive film can be achieved by combining ethylene 'cyclic polyolefin copolymer, propylene' cyclic polyolefin copolymer, etc., contained in the polyolefin resin (A-1) that can be blended in the composition. Even better.
  • this polyolefin resin (A-1) force is 40% by mass or more (preferably 50% by mass or more, more preferably 60% by mass or more) with respect to the above support, 70 ° C or more At a temperature (preferably 80 ° C. or higher, more preferably 90 ° C. or higher), a support that does not undergo deformation such as warping or twisting can be obtained.
  • the styrene-based resin composition useful as a molding material for the support is not particularly limited as long as it contains a styrene-based resin, and may be only a styrene-based resin, It may be a mixture with other components (additives, other polymers, etc.).
  • Styrenic resin (D) (also referred to as “component (D)” in the present invention) is obtained by polymerizing a monomer component containing an aromatic vinyl compound in the presence of a rubbery polymer.
  • This is a resin obtained by polymerizing a monomer component containing an aromatic vinyl compound in the absence of resin and Z or rubber polymer.
  • the rubber polymer include polybutadiene, polyisoprene, styrene'butadiene (block) copolymer, styrene'isoprene (block) copolymer, acrylonitrile 'butadiene copolymer, and butadiene (meth) acrylate.
  • Copolymer hydrogenated styrene 'butadiene block copolymer, hydrogenated butadiene polymer, ethylene' a-olefin copolymer (eg, ethylene 'propylene copolymer, ethylene' propylene, non-conjugated gen copolymer) , Ethylene.butene-1 copolymer, ethylene'butene-1 non-conjugated gen copolymer, etc.), ethylene'a-olefin'polyene copolymer, acrylic rubber, silicone rubber, silicone 'acrylic IPN rubber A polymer block mainly composed of aromatic beryl compounds described in the above component (C), and A block copolymer containing a polymer block mainly composed of conjugation and a hydrogenated product thereof.
  • ethylene' a-olefin copolymer eg, ethylene 'propylene copolymer, ethylene' propylene, non-conjugated gen copolymer
  • polystyrene-based resin those containing a rubbery polymer having a flexible surface when used as a support film are preferable.
  • rubbery polymer content in the styrene-based ⁇ is a styrene ⁇ to 100 mass 0/0, preferably 3-80% by weight. More preferably, it is 5-70 mass%, Most preferably, it is 10-60 mass%.
  • the gel content of the rubber polymer is not particularly limited, but when a rubber polymer is obtained by emulsion polymerization, the gel content is preferably 98% by mass or less, more preferably 40 to 98 mass 0. / 0 . Within this range, the appearance when formed into a film is excellent.
  • the said gel content rate can be calculated
  • gel content (mass 0/0) [ ⁇ W2 (g) -Wl (g) ⁇ / l (g)] X 100 ⁇ ⁇ (1)
  • the gel content is adjusted by appropriately setting the type and amount of the molecular weight regulator, the polymerization time, the polymerization temperature, the polymerization conversion rate, etc. during the production of the rubbery polymer.
  • Examples of the aromatic vinyl compound constituting the vinyl monomer used in the styrene-based resin include styrene, ⁇ -methylstyrene, hydroxystyrene, and the like. These may be used alone or in combination. Two or more types can be used in combination. Of these, styrene and ⁇ -methylstyrene are preferred.
  • bull monomers copolymerizable with aromatic beryl compounds include vinylcyan compounds, (meth) acrylic acid ester compounds, maleimide compounds, and other functional group-containing unsaturated compounds. Compounds and the like.
  • a styrene-based resin used as a support for a protective film for a display device which is one of the objects of the present invention, a preferable vinyl monomer that is preferably used for transparency is aromatic.
  • One or two or more compounds selected from the group consisting of vinyl cyanide compounds and maleimide compounds are used in combination, as required, with an aromatic vinyl ester compound and a (meth) acrylic acid alkyl ester compound as essential components.
  • at least one of various other functional group-containing compounds is used in combination.
  • unsaturated functional group-containing unsaturated compounds include unsaturated acid compounds and epoxy group-containing Examples thereof include unsaturated compounds, substituted or unsubstituted amino group-containing unsaturated compounds, and oxazoline group-containing unsaturated compounds.
  • the above other various functional group-containing unsaturated compounds can be used alone or in combination of two or more.
  • Examples of cyanobi-louis compounds used here include acrylonitrile, methacrylonitrile, etc., and these can be used alone or in combination of two or more. .
  • a cyan compound When a cyan compound is used, chemical resistance can be imparted.
  • the amount used is preferably 1 to 60% by mass, more preferably 5 to 50% by mass in the monomer component.
  • (meth) acrylic acid ester compounds include methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, butyl methacrylate, and the like. These may be used alone or in combination of two or more. Can be used. Particularly preferred are methyl methacrylate, in the case of using polybutadiene as the rubber polymer, Toru range of usage 20 ⁇ 30Z70 ⁇ 80 wt% styrene Z main methacrylic acid methyl (total 100 mass 0/0) A styrene-based resin having excellent lightness can be obtained.
  • maleimide compounds include maleimide, ⁇ -maleimide, ⁇ -cyclohexylmaleimide, and the like. These may be used alone or in combination of two or more.
  • maleic anhydride may be copolymerized and subsequently imidized.
  • heat resistance is imparted.
  • the amount used is preferably 1 to 60% by mass, more preferably 5 to 50% by mass in the monomer component.
  • unsaturated acid compounds include acrylic acid, methacrylic acid, ethacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, and the like. These may be used alone or in combination. A combination of the above can be used.
  • epoxy group-containing unsaturated compound examples include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, and the like. These may be used alone or in combination of two or more.
  • hydroxyl-containing unsaturated compounds examples include 3-hydroxy-1-propene, 4-hydroxy-1-butene, cis-4-hydroxy-2-butene, trans-4-hydroxy-2-butene, 3 Hydroxy 1-methyl 1-propene, 2 Hydroxyethyl methacrylate, 2 Hydroxetyl acrylate, N- (4-Hydroxyphenol) maleimide, and so on. Or two or more types can be used in combination.
  • Examples of the acid anhydride group-containing unsaturated compound include maleic anhydride, itaconic anhydride, citraconic anhydride, and the like. These may be used alone or in combination of two or more. I'll do it.
  • oxazoline group-containing unsaturated compound examples include bruoxazoline, and these can be used alone or in combination of two or more.
  • substituted or unsubstituted amino group-containing unsaturated compounds include aminoethyl acrylate, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, phenylaminoethyl methacrylate, N-biethylethylamine, N-acetylethylamine, acrylamine. , Methacrylamine, N-methylacrylamine, acrylamide, N-methylacrylamide, p-aminostyrene, etc., and these can be used alone or in combination of two or more.
  • the amount of the above other various functional group-containing unsaturated compounds used is the total amount of the functional group-containing unsaturated compounds used in the styrene-based resin, and is 0.1 to 20 with respect to the entire styrene-based resin. 0.1% to 10% by mass is more preferable.
  • the styrene-based resin of the present invention can be produced by a known polymerization method, for example, emulsion polymerization, bulk polymerization, solution polymerization, suspension polymerization, or a combination of these.
  • a known polymerization method for example, emulsion polymerization, bulk polymerization, solution polymerization, suspension polymerization, or a combination of these.
  • preferred polymerization methods for a polymer obtained by (co) polymerizing a vinyl monomer in the presence of a rubbery polymer are emulsion polymerization and solution polymerization.
  • preferred polymerization methods for polymers obtained by (co) polymerizing vinyl monomers in the absence of rubbery polymers are bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization. .
  • a polymerization initiator In the case of producing by emulsion polymerization, a polymerization initiator, a chain transfer agent, an emulsifier and the like are used, and all of these known ones can be used.
  • tamennoide mouth peroxide As polymerization initiators, tamennoide mouth peroxide, p-menthannoide mouth peroxide, diisopropylbenzene hydride mouth peroxide, tetramethylbutyl hydride mouth peroxide, tert-butyl hydride mouth peroxide, potassium persulfate, azobisisobutane Chiguchi-Trill and the like.
  • redox systems such as various reducing agents, sugar-containing iron pyrophosphate formulations, sulfoxylate formulations, etc. as polymerization initiation aids.
  • chain transfer agent examples include octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, n-xyl mercaptan, terpinolene and the like.
  • the emulsifier examples include alkylbenzene sulfonates such as sodium dodecylbenzene sulfonate, aliphatic sulfonates such as sodium lauryl sulfate, higher fatty acid salts such as potassium laurate, potassium stearate, potassium oleate, and potassium palmitate.
  • alkylbenzene sulfonates such as sodium dodecylbenzene sulfonate
  • aliphatic sulfonates such as sodium lauryl sulfate
  • higher fatty acid salts such as potassium laurate, potassium stearate, potassium oleate, and potassium palmitate.
  • a rosinate such as potassium rosinate can be used.
  • the method of using the rubbery polymer and the bull monomer may be carried out by adding a vinyl monomer all at once in the presence of the total amount of the rubbery polymer. It may be polymerized by dividing or continuously adding. A part of the rubber polymer may be added during the polymerization.
  • the obtained latex after emulsion polymerization is usually coagulated with a coagulant, washed with water and dried to obtain a styrene-based resin powder.
  • a coagulant used here, inorganic salts such as calcium chloride, magnesium sulfate and magnesium chloride, or acids such as sulfuric acid, hydrochloric acid, acetic acid, citrate and malic acid can be used.
  • Solvents that can be used in the production of styrene-based resins by solution polymerization are inert polymerization solvents that are used in ordinary radical polymerization, for example, aromatic hydrocarbons such as ethylbenzene and toluene. , Ketones such as methyl ethyl ketone and acetone, acetonitrile
  • the polymerization temperature is preferably in the range of 80 140 ° C, more preferably 85 120 ° C.
  • a polymerization initiator may be used, or polymerization may be performed by thermal polymerization without using a polymerization initiator.
  • Polymerization initiators include ketone peroxide, dialkyl peroxide, disilver oxide, peroxyester, hydrated peroxide, azobisisobutyronitrile, benzoyl peroxide, 1, ⁇ -azobis (cyclohexane-1—power (Both-tolyl) and the like are preferably used.
  • a chain transfer agent for example, mercaptans, terpinolenes, OC-methylstyrene dimer, etc. can be used.
  • the polymerization initiator, chain transfer agent, etc. described in the solution polymerization can be used.
  • the amount of monomer remaining in the styrene-based resin obtained by the above polymerization method is preferably 10, OOOppm or less, more preferably 5, OOOppm or less.
  • a styrene-based resin obtained by polymerizing a butyl monomer in the presence of a rubbery polymer is usually a copolymer obtained by graft-copolymerizing the vinyl monomer to a rubbery polymer. And grafted to a rubbery polymer, and contains an ungrafted component (the (co) polymer of the vinyl monomer).
  • the styrene-based resin obtained by polymerizing a bulu monomer in the presence of a rubber polymer preferably has a draft rate of 20 to 200% by mass, more preferably 30 to 150% by mass, and particularly preferably. It is 40-120 mass%, and a graft ratio can be calculated
  • T represents styrene-based lg obtained by polymerizing a bulu monomer in the presence of a rubbery polymer, and the mixture is shaken with a shaker for 2 hours in 20 ml of acetone.
  • the intrinsic viscosity [ ⁇ ] (measured at 30 ° C using methyl ethyl ketone as the solvent) of the acetone-soluble component of the component related to the styrene-based resin of the present invention is preferably 0. 2 to 1.2 dlZg, more preferably 0.3 to 1 Odl / g, and particularly preferably 0.3 to 0.8 dl / g.
  • the average particle size of the grafted rubber polymer particles dispersed in the styrene-based resin obtained by polymerizing the vinyl monomer in the presence of the rubber polymer is preferably 500 to 30,000 OA. This is in the range of ⁇ 10000 or 20,000 to 2,000 mm, especially in the range of ⁇ 500 or more to 1,500 to 8, or ⁇ .
  • the average particle diameter can be measured by a known method using an electron microscope.
  • the composition constituting the support may be a thermoplastic polymer alone or may contain an antistatic agent.
  • the amount of antistatic agent used is the sum of thermoplastic polymer and antistatic agent 1 When it is 00 mass%, it is 3-30 mass%, Preferably it is 5-25 mass%, More preferably, it is 8-20 mass%, Most preferably, it is 10-20 mass%. If the amount used is less than 3% by mass, the desired antistatic property cannot be obtained. If it exceeds 30% by mass, a uniform film cannot be obtained.
  • the antistatic agent is not particularly limited. A known antistatic agent can be used. A preferable antistatic agent is one that does not impair transparency when an antistatic agent is added.
  • the antistatic agent (F) also acts as a polyamide block (F-2-1) and a hydrophilic polymer block (F-2-2).
  • Polyamides used here include ethylene diamine, tetramethylene diamine, hexamethylene diamine, decamethylene diamine, 2, 3, 4 or 2, 4, 4-trimethylene hexamethylene diamine, 1 , 3 or 1,4-bis (aminomethyl) cyclohexane, bis (p-aminohexyl) methane, phenoldiamine, m-xylenediamine, p-xylendiamine, aliphatic, alicyclic, or aromatic Polyamides, force prolactams derived from diamine components such as diamine and aliphatic, alicyclic or aromatic dicarboxylic acids such as adipic acid, suberic acid, sebacic acid, cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, polyamide obtained by
  • hydrophilic polymer block (F-2-2) used here any of those described for the hydrophilic polymer block (b2) can be used.
  • This preferred polymerization method of the antistatic agent (F) is a heat melt polymerization method, and specific examples thereof are shown below.
  • a particularly preferable method is the method (i).
  • alkali metal and Z or alkaline earth metal salts (H) described in the explanation of the polymer block (b2) can be used.
  • Examples of the dicarboxylic acid used to carboxylate the molecular ends of the polyamide component include adipic acid, suberic acid, sebacic acid, maleic acid, citraconic acid, maleic anhydride, citraconic anhydride, and cyclohexane.
  • Examples include dicarboxylic acid, terephthalic acid, and isophthalic acid.
  • the number average molecular weight of the polyamide of the present invention is preferably in the range of 500 to 20,000, more preferably 500 to 10,000, particularly preferably 500 to 5,000. S The object of the present invention is achieved. In addition, it is preferable.
  • the mass ratio (F—2-1ZF—2-2) of the polyamide block (F—2-1) and the hydrophilic polymer block (F—2-2) is 90Z 10 to 10Z90. It is more preferable that it is in the range of 80Z20 to 20Z80, particularly preferably 70 to 30 to 70.
  • the molecular weight of the antistatic agent (F) is not particularly limited, but the reduced viscosity (7? Sp / C) (measured in formic acid solution, 0.5gZl00ml, 25 ° C) is in the range of 1 to 3dlZg More preferably, it is 1.2 to 2.5 dlZg.
  • antistatic agent (F) can be used alone or in combination of two or more.
  • the antistatic agent (F) is available as Pelestat NC6321, M-140 (trade name) manufactured by Sanyo Chemical Industries.
  • thermoplastic polymer can be obtained by various extruders, Banbury mixers, aders, continuous-kinders, rolls, and the like.
  • the thickness of the film is preferably 10 to 200 m from the viewpoint of handling.
  • This film is known It is preferable to use the calendar method, T-die method, inflation method, etc.
  • thermoplastic polymers include known weathering (light) agents, antioxidants, lubricants, plasticizers, colorants, dyes, foaming agents, processing aids (ultra high molecular weight acrylic polymers, ultra high molecular weight polymers). Molecular weight styrene polymer) and the like can be appropriately blended.
  • the antistatic adhesive pressure-sensitive resin composition of the present invention it is preferable to use a polyolefin-based resin composition as the thermoplastic polymer composition constituting the support.
  • a polyolefin-based resin composition As the polyolefin resin composition, the use of the antistatic resin composition of the present invention is preferred from the viewpoint of the antistatic property of the adhesive film (first embodiment of the adhesive film).
  • thermoplastic polymer composition constituting the support. Second embodiment).
  • Examples of the adhesive film using the antistatic adhesive resin composition of the first embodiment of the present invention include a support (hereinafter referred to as “support (1)”) having only the component (A).
  • An embodiment comprising an antistatic adhesive layer [i], a support (hereinafter referred to as “support (2)”) also having an antistatic resin composition power of the present invention, and an antistatic adhesive layer.
  • composition constituting the support (3) in the above embodiment [iii] it contains the component (A) and the component (C), and does not contain the component (B)! ⁇ Composition; contains component (B) and component (C) and does not contain component (A)! ⁇ Composition; contains component (A) and other than component (B) and component (C) A composition containing component (B), a component containing component (B) and other components other than component (A) and component (C); a polyolefin system other than component (A) and component (B) Examples include compositions containing rosin.
  • the supports (2) and (3) may contain an additive additive that can be blended in the antistatic resin composition of the present invention.
  • the content of the additive is that of the present invention.
  • the description in the antistatic oil-absorbing composition can be applied.
  • the content of the additive is the total amount of the components (A), (B) and (C) in the antistatic resin composition of the present invention, and the polyolefin.
  • the amount described in the antistatic oil composition of the present invention can be applied by replacing the total amount of the system oil composition.
  • the antistatic resin composition of the present invention (the above embodiment [ii]) is preferable.
  • the component (as component (A-1) and component (A-2) it is preferable to use the component (as component (A-1) and component (A-2) as a combination).
  • the thickness of the support of the pressure-sensitive adhesive film is preferably 10 to 200 111, more preferably 10 to: LOO ⁇ m.
  • a portion where the antistatic adhesive layer is disposed may have a groove, a concave portion, a convex portion, or the like.
  • the thickness of the antistatic adhesive layer is preferably 1 to: LOO ⁇ m, more preferably 5 to 50 ⁇ m.
  • the thickness of the antistatic adhesive layer is usually smaller than the thickness of the support.
  • the antistatic adhesive layer may be on one side of the support or on both sides. In the latter case, it is a double-sided adhesive film. Further, it may be a part of each surface or the entire surface.
  • the first and second embodiments of the above-mentioned pressure-sensitive adhesive film are also excellent in adhesiveness between the support and the antistatic pressure-sensitive adhesive layer, and also the surface of the support and the antistatic pressure-sensitive adhesive layer.
  • the peel strength according to the conditions in Examples described later can be preferably 3 OOgZl5 mm or more, more preferably 400 gZl5 mm or more, and even more preferably 500 gZl5 mm or more.
  • antistatic properties surface resistivity under conditions of temperature 23 ° C and humidity 50% RH
  • 5 X 10 12 ⁇ or less preferably 5 X 10 12 ⁇ or less, more preferably 9 X 10 11 ⁇ or less, depending on the support surface. More preferably, it is 9 ⁇ 10 10 ⁇ or less, and particularly preferably 5 ⁇ 10 9 ⁇ or less.
  • the adhesive film of the present invention can be provided with a protective layer on the surface of the antistatic adhesive layer for the purpose of protecting the antistatic adhesive layer and the like.
  • the constituent material of the protective layer is not particularly limited, but when peeled off, the antistatic adhesive layer is A material having a material strength that is less likely to be damaged is preferable.
  • a material having a material strength that is less likely to be damaged is preferable.
  • Specific examples include a polyester film such as polyethylene terephthalate (PET), a polypropylene film, a styrene-based resin, a resin film, and a polyamide film.
  • An adhesive film 1 in FIG. 1 includes a support 11 and an antistatic adhesive layer 12 disposed on one surface of the support 11.
  • the adhesive film 1 ′ in FIG. 2 includes a support 11, an antistatic adhesive layer 12 disposed on the surface of the support 11, and a protective layer 13 disposed on the surface of the antistatic adhesive layer 12. Is provided.
  • the adhesive film 1 "in FIG. 3 is disposed on the surface of the support 11, the antistatic adhesive layers 12a and 12b disposed on both surfaces of the support 11, and the antistatic adhesive layers 12a and 12b.
  • the pressure-sensitive adhesive film can be produced by a known method, and the production method is not particularly limited.
  • thermoplastic polymer composition such as a polyolefin resin composition or a styrene resin composition and the antistatic adhesive resin composition of the present invention are coextruded.
  • the manufacturing method of an adhesive film provided with the process to do is suitable.
  • Specific methods of coextrusion include a T-die method and an inflation method.
  • Each composition is normally used in a molten state.
  • the temperature during processing is usually selected from the melting temperature, melt viscosity, etc. of each composition in consideration of the shape, thickness, etc. of the molded product.
  • thermoplastic polymer composition and an antistatic adhesive composition obtained by previously melt-kneading the adhesive resin composition by the above method may be used
  • Thermoplastic polymer composition and antistatic 'A mixture of the components of the adhesive resin composition may be melt kneaded at the time of coextrusion.
  • Thermoplastic polymer composition and antistatic' The components of the adhesive resin composition may be added at the time of coextrusion, and a method in which the above (1), (2), and (3) are combined may be used.
  • thermoplastic polymer composition a polyolefin resin composition, a styrene resin composition, etc. can be used conveniently.
  • the preferred method for obtaining the pressure-sensitive adhesive film of the present invention by coextrusion is thermoplasticity as a support.
  • the polymer composition is prepared by melt kneading in advance, and the antistatic adhesive resin composition is a method of coextrusion by the methods (2) and (3) above.
  • the pressure-sensitive adhesive film of the present invention can be produced by the following method in addition to the method by coextrusion.
  • thermoplastic polymer composition is formed into a film by a calendering method, a ⁇ die method, an inflation method, etc., and then a support is formed, and then surface treatment is performed as necessary to control the antistatic property.
  • a method of extrusion laminating a fat composition is performed.
  • each molded body (preferably Is a method where the adhesive surface of the support is subjected to surface treatment as necessary and extrusion laminated (dry lamination method).
  • a sheet preferably polyethylene terephthalate coated with an easily peelable compound such as a silicone compound is charged with an organic solvent such as toluene or cyclohexane.
  • an organic solvent such as toluene or cyclohexane.
  • a solution in which the product is dissolved, or a melt-kneaded antistatic adhesive resin composition is applied and dried to obtain a sheet with an antistatic adhesive layer.
  • the antistatic adhesive layer is transferred to the support by pressure-bonding the sheet with the antistatic adhesive layer and a support prepared using the polyolefin resin composition separately.
  • Specific examples of the surface treatment include corona discharge treatment, flame treatment, oxidation treatment, plasma treatment, UV treatment, ion bombardment treatment, and solvent treatment. These may be performed continuously in combination.
  • a primer layer containing a resin component such as polyethyleneimine, polyurethane, and acrylic resin can be formed on the surface of the support before adhesion to the antistatic adhesive layer.
  • the thickness of the primer layer is preferably as it is thinner, for example, 0.1 to: about LO / z m is preferable, and 0.1 to 5 / z m is more preferable.
  • the primer layer can be usually formed by applying a solvent (including water) solution by a known method and drying it.
  • a protective layer is provided on the surface of the antistatic adhesive layer, it may be simultaneously with the formation of the support and the antistatic adhesive layer (may be co-extruded at the same time !,;) Take it at the same time as winding!
  • the antistatic resin composition of the present invention is also suitable for multilayer sheets, multilayer films and the like.
  • a laminate of a sheet (or film) comprising the antistatic resin composition of the present invention; a sheet (or film) also comprising the antistatic resin composition of the present invention; and other materials A two-layer sheet (or a two-layer film) comprising a sheet (or film) that also has a force; two sheets (or films) composed of the antistatic resin composition of the present invention, and disposed therebetween, Examples thereof include a three-layer sheet (or three-layer film) provided with a sheet (or film) that has other material strength.
  • the primer layer in the description of the pressure-sensitive adhesive film of the present invention is disposed between the layers.
  • the antistatic resin composition of the present invention contains 40% by mass or more (preferably 50% by mass or more, more preferably 60% by mass or more) of the above polyolefin resin (A-1), 70 Deformation such as warping and twisting hardly occurs at a temperature of ° C or higher (preferably 80 ° C or higher, more preferably 90 ° C or higher), and a multilayer sheet (multilayer film) can be obtained.
  • a polyolefin resin, a styrene resin or the like alone or a composition containing one or more of these is preferable.
  • the composition contains various fillers, antistatic agents, etc. for the purpose of improving rigidity, heat resistance, etc. and imparting antistatic properties.
  • the thickness of the layer having the antistatic resin composition power of the present invention is preferably 10 for the purpose of stably developing the antistatic property. m or more, more preferably 50 ⁇ m or more, particularly preferably 80 ⁇ m or more.
  • the three-layer type sheet 2 in FIG. 4 includes an intermediate layer 22 having other material strengths, and layers 21a and 21b using the above antistatic resin composition.
  • the method for producing the multilayer sheet is preferably a coextrusion method such as a force T-die method or an inflation method, which can be the same as the method for producing the adhesive film.
  • the sheet and film thus obtained can be further formed into a molded product such as a tray by vacuum forming or the like, if necessary.
  • the antistatic adhesive resin composition of the present invention is also suitable for a double-sided adhesive film or the like.
  • the antistatic adhesive composition of the present invention is formed on both sides of the support composed of the antistatic resin composition of the present invention described in the adhesive film of the present invention.
  • the antistatic adhesive layer made of the antistatic / adhesive resin composition of the present invention is provided on both surfaces of the support made of another material.
  • the thicknesses of the support and the antistatic adhesive layer in this embodiment can be the same as the thicknesses of the support and the antistatic adhesive layer in the description of the adhesive film of the present invention.
  • thermoplastic polymers such as various polyolefin resin compositions, styrene resin compositions, or compositions containing the same.
  • a composition a composition containing the component (A) contained in the above antistatic resin composition is preferable.
  • the composition may contain various additives for the purpose of improving rigidity and heat resistance and imparting antistatic properties.
  • the double-sided pressure-sensitive adhesive film can also be provided with a protective layer on the surface of the antistatic pressure-sensitive adhesive layer for the purpose of protecting the antistatic pressure-sensitive adhesive layer and the like, similarly to the pressure-sensitive adhesive film of the present invention.
  • the constituent material of this protective layer is also as described above.
  • the molded product according to the present invention is a variety of members and parts in the electronic-electric field, the household electrical appliance field, the vehicle field, the sanitary field, the building material field, etc. It is particularly suitable as a member, component, etc. in which static electricity damage is a serious problem.
  • cases such as relay cases, wafer cases, reticle cases, mask cases; trays such as liquid crystal trays, chip trays, memory trays, CCD trays, IC trays; carrier types such as IC carriers; polarizing films; Sheets such as protective sheets of sheets; bobbins of sheets' films; surface protection films such as liquid crystal display devices, light guide plates, plasma displays, polarizing plates, semiconductor-related protective films, protective films in clean rooms, etc. Films; Sheets used in clean rooms; Antistatic bags; Useful for internal parts of equipment such as vending machines.
  • Component (C) (bonded styrene content, vinyl bond content, number average molecular weight, and hydrogenation rate of the polymer);
  • Component (D) (physical properties of rubbery polymer, graft ratio, and intrinsic viscosity);
  • the number average particle diameter of the rubbery polymer latex used for forming the component (D) was measured by a light scattering method.
  • the measuring machine used was LPA-3100 manufactured by Otsuka Electronics Co., Ltd., and the Mummland method was used with 70 integration. It was confirmed with an electron microscope that the particle size of the dispersed graft rubber-like polymer particles in component (D) was almost the same as the latitudus particle size.
  • the following surface of the adhesive film was subjected to 5KV electrification using a static horn meter H-0101 manufactured by SHISID ELECTRIC CO., LTD., And the time for the charge to decay to OV was measured. Applied to the electrically styrene-based resin side.
  • Antistatic property-2 Applied to the adhesive side.
  • Slightly transparent (printed material is faintly visible when a test piece is placed on the printed material).
  • the surface appearance on both sides of the test piece was visually evaluated according to the following criteria.
  • the antistatic adhesive layer was peeled 90 degrees at a speed of 300 mmZ from a support of a 15 mm wide adhesive film, and the peel strength (unit: g) was measured.
  • a peel strength (unit: g) was measured by performing a 180 ° peel test on the antistatic adhesive layer at a speed of 300 mmZ from a support of an adhesive film having a width of 25 mm.
  • Adhesion between antistatic adhesive layer and triacetyl cellulose (TAC) film was measured by performing a 180 ° peel test on the antistatic adhesive layer at a speed of 300 mmZ from a support of an adhesive film having a width of 25 mm. (7) Adhesion between antistatic adhesive layer and triacetyl cellulose (TAC) film
  • a TAC film with a width of 25 mm was placed on the adhesive surface of the antistatic adhesive layer of the adhesive film, and a 2 kg roller was reciprocated once for pasting. Thereafter, the film was peeled 180 ° at a speed of 300 mmZ, and the peel strength (unit: g) was measured.
  • A3 polyethylene produced using a meta-catalyst catalyst
  • Kernel KF270 (trade name) manufactured by Nippon Polyethylene Co., Ltd. was used.
  • TOPAS6013 (trade name) manufactured by Polyplastics was used.
  • the norbornene unit amount is 75 to 80%, and the glass transition temperature is 140 ° C.
  • TOPAS8007X10 (trade name) manufactured by Polyplastics was used.
  • the norbornene unit content is 65% and the glass transition temperature is 80 ° C.
  • a solution obtained by reacting titanocene dichloride and triethylaluminum in cyclohexane was added to the remaining block copolymer solution, and a hydrogenation reaction was carried out for 40 minutes under a hydrogen pressure of 50 ° C. and 50 kgfZcm 2 .
  • 2,6G tert-butylcatechol was added in an amount of 0.3 part to 100 parts of the block copolymer, and then the solvent was removed to obtain a block copolymer C5.
  • the amount of n-butyllithium used was increased under the conditions of Production Example 1 to obtain a block copolymer C6 having the same structure as the block copolymer C5 and a number average molecular weight of 100,000.
  • the rubber-modified styrene-based resin obtained in Production Example 3 below was used.
  • the graft ratio of this product was 55%, and the intrinsic viscosity [7?] Of the acetone-soluble component was 0.45.
  • E1 50% aqueous solution of tris (trifluoromethanesulfol) methide lithium
  • Sanconol AQ-50T trade name
  • Electrode TS-5 (trade name) manufactured by Kao Corporation with 100% stearyl monoglyceride was used.
  • Examples 1-1 to 1-18 were all excellent in antistatic property, transparency and appearance of the molded product.
  • the content ratio of the component (A), (B) or (C) is outside the scope of the present invention, and any of antistatic properties, transparency, and appearance of the molded product It was inferior.
  • pellet X an antistatic resin composition
  • the pellet X and the component (A3) were co-extruded using a multilayer inflation extruder (a cylinder, die set temperature; 190 ° C.). After forming a film with a thickness of 25 m for both layers and a total thickness of 50 m, the layer with antistatic resin composition strength becomes the surface side.
  • the bag was manufactured as follows. The transparency and the appearance of the molded product were good. Moreover, the surface resistivity was 7 ⁇ 10 6 ⁇ , and the antistatic property was excellent.
  • Example 1-1 60 parts of component (A3) and 26 parts of component (IV) were changed to 86 parts of component (A3).
  • the transparency and the appearance of the molded product were good.
  • the surface resistivity was 1 X 10 7 ⁇ , and the antistatic property was excellent.
  • Experimental Example 1 1 and Experimental Example 1 The film (100 mm ⁇ 100 mm) was observed for smoothness after standing for 1 hour at a temperature of 80 ° C. Experimental example 1 The film of 10 showed a slight wrinkle. The film of Experimental example 1-1 showed almost no change.
  • pellet X obtained above and component (A3) were mixed with a multi-layer inflation extruder (set temperature of cylinder and die: 190 ° C), and antistatic resin composition A three-layer film in which (pellet X) is both surface layers was produced.
  • the thickness of each layer was 15Z20Z15 m.
  • the transparency and the appearance of the molded product were good.
  • the surface resistivity was 7 7 10 6 ⁇ , and the antistatic property was excellent.
  • Examples 2-1 to 2-16 were all excellent in antistatic property, transparency and appearance of the molded product.
  • the content ratio of the component (B) or (C) was outside the scope of the present invention, and the antistatic property, transparency, and appearance of the molded product were inferior.
  • Example 3-1 to 3-17 First, as a composition for forming a support, the above components (A), (B), (C) and (E) were mixed by a Henschel mixer at the blending ratios shown in Tables 6 to 8, Pellets were obtained by melt-kneading using a screw extruder (set temperature of the cylinder: 220 ° C.).
  • composition for forming the antistatic adhesive layer is also prepared by mixing the above components (A), (B), (C) and (E) with a tumbler at the blending ratios shown in Tables 6 to 8. Was obtained.
  • each of the above-mentioned composition for forming the support and the antistatic adhesive layer was coextruded using a multilayer inflation extruder (set temperature of the cylinder; 210 to 240 ° C) to obtain the thickness of the support.
  • An adhesive film having a thickness of 0 m and an antistatic adhesive layer thickness of 20 m was obtained.
  • antistatic property, transparency, appearance of molded product, adhesion between support and antistatic adhesive layer on each surface of support and antistatic adhesive layer, and control of adhesive film Electric adhesion The adhesion between the surface of the layer and the TAC film was evaluated. The results are shown in Tables 6-8.
  • Examples 3-1 to 3-17 all have antistatic properties, transparency, appearance of the molded product, adhesion between the support and the antistatic adhesive layer, and the adhesive film. Excellent adhesion between the antistatic adhesive layer surface and the TAC film.
  • Example 3 Adhesion of 12 The film was slightly warped.
  • the adhesive film of Examples 3 to 13 had no change at all. Since it contains component (A4), it can be seen that it has excellent heat resistance.
  • Each component of the pressure-sensitive adhesive and styrene-based resin was mixed with a Henschel mixer at the blending ratio shown in Table 9, and then melt-kneaded with a twin-screw extruder (cylinder setting temperature 220 ° C.) to form pellets.
  • Styrenic resin produced a 50 m support film by a calendering method. After corona discharge treatment on one side of the film, a polyethyleneimine layer was formed on the corona discharge treatment surface.
  • a pressure-sensitive adhesive layer having a thickness of 20 ⁇ m was formed on the polyethyleneimine layer side of the film by extrusion lamination.
  • the antistatic property, the adhesiveness between the antistatic adhesive layer and the TAC film, and the adhesive strength between the support (styrene-based film layer) and the antistatic adhesive layer were evaluated by the above evaluation method. (Adhesiveness 1) was evaluated. In addition, the transparency and appearance of the film were visually evaluated.
  • the adhesive films of Examples ⁇ 1 to ⁇ -13 of the present invention have excellent antistatic properties and excellent adhesive strength between the support and the adhesive. It is also easy to control the adhesiveness with the TAC film. Furthermore, it is a film with excellent transparency and appearance.
  • Comparative Example ⁇ 1 is an example in which the amount of component (C) used in the present invention is large outside the scope of the invention, and the amount of component (B) used is small outside the scope of the invention, but antistatic properties are manifested. do not do.
  • Comparative Example 2 is an example in which the amount of component (C) used in the present invention is small outside the scope of the invention, and the amount of component (B) used is large outside the scope of the invention, and there is no problem with antistatic properties. The appearance of the film is inferior and not practical.
  • the above components (A), (B), (C) and (E) are used as the composition for forming the first layer and the third layer.
  • the mixture was melt-kneaded using a twin-screw extruder (cylinder set temperature; 220 ° C.) to obtain pellets (antistatic resin composition).
  • pellets for forming the second layer which is an intermediate layer, pellets having polymer strength described in Table 10 were used.
  • Experimental Examples 1-2 to 1-9 are all three-layer sheets in which the first layer and the third layer are formed using the antistatic resin composition of the present invention. Yes, it has excellent antistatic properties on both surfaces, and the second layer (intermediate layer) contains the same component (A) used to form the first and third layers. It was also excellent.
  • the antistatic resin composition of the present invention is excellent in antistatic property and appearance of a molded product, and also excellent in transparency. Therefore, it is useful as a molding material for molded products such as films and sheets used in fields where static electricity damage is a major problem.
  • the antistatic adhesive resin composition of the present invention is excellent in antistatic properties, transparency and appearance of molded products, molding of molded products such as pressure-sensitive adhesive films and multilayer sheets used in fields where static electricity damage is a major problem. Useful as a material.
  • the molded article such as an adhesive film and multilayer sheet comprising the antistatic resin composition and the antistatic adhesive composition of the present invention is excellent in antistatic property and appearance of the molded article, and is transparent depending on the embodiment. Because of its excellent properties, it is useful as a molding material for molded products such as adhesive films and multilayer sheets used in fields where static electricity damage is a major problem.
  • FIG. 1 is a schematic cross-sectional view showing an example of an adhesive film of the present invention.
  • FIG. 2 is a schematic sectional view showing an example of an adhesive film in which a protective layer is disposed on the surface of the antistatic adhesive layer.
  • FIG. 3 is a schematic cross-sectional view showing an example of an adhesive film in which an antistatic adhesive layer and a protective layer are arranged on both sides of a support.
  • FIG. 4 is a schematic sectional view showing an example of a three-layer sheet using the antistatic resin composition of the present invention.
  • Adhesive film 11; Support, 12, 12a and 12b; Antistatic adhesive layer, 13, 13a and 13b; Protective layer, 2; Three-layer sheet, 21a and 21b A layer formed using the antistatic resin composition of the present invention, 22 an intermediate layer.

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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

[PROBLEMS] To provide a molding material which is excellent in antistatic properties and molding appearance and preferably excellent also in transparency and heat resistance and is usable as a molding material for the pressure-sensitive adhesive layer and substrate of a pressure-sensitive adhesive film. [MEANS FOR SOLVING PROBLEMS] An antistatic resin composition which comprises (A) a polyolefin resin, (B) a block copolymer comprising an olefin polymer block and a hydrophilic polymer block, and (C) at least one polymer selected from the group consisting of polymers containing conjugated diene compound units and products of hydrogenation of the polymers. Tackiness can be controlled by regulating the amount of the ingredient (A) to be incorporated. When the ingredient (A) comprises a polyolefin resin containing cycloolefin units and having a glass transition temperature of 60-200°C, heat resistance is improved. Preferred examples of the ingredient (C) are a block copolymer comprising a polymer block of a conjugated diene compound and a polymer block of an aromatic vinyl compound and a product of hydrogenation of this block copolymer.

Description

明 細 書  Specification
制電性樹脂組成物、制電 ·粘着性樹脂組成物並びに粘着フィルム及び その製造方法  Antistatic resin composition, antistatic / adhesive resin composition, adhesive film, and method for producing the same
技術分野  Technical field
[0001] 本発明は、制電性に優れたフィルム、シート等の成形品を与える制電性榭脂組成物 The present invention relates to an antistatic resin composition that gives a molded article such as a film or sheet having excellent antistatic properties.
、フィルム、シート等の成形品に制電性の高い粘着層を形成するに好適な制電'粘 着性樹脂組成物、並びに、該制電 '粘着性樹脂組成物からなる制電性粘着層を備え てなる粘着フィルム及びその製造方法に関する。更に詳しくは、本発明は、制電性及 び透明性に優れ、フィルム等の成形品とした場合の表面外観にも優れた制電性榭脂 組成物、制電性及び粘着性に優れ、粘着力の制御が容易な制電 '粘着性榭脂組成 物、並びにこれらの組成物を用いてなる粘着フィルム、シート、積層体等の成形品及 びその製造方法に関する。 Antistatic 'adhesive resin composition suitable for forming a highly antistatic adhesive layer on molded articles such as films and sheets, and an antistatic adhesive layer comprising the antistatic' adhesive resin composition The present invention relates to an adhesive film comprising: More specifically, the present invention is excellent in antistatic properties and transparency, antistatic resin composition excellent in surface appearance when formed into a film or the like, excellent in antistatic properties and adhesiveness, The present invention relates to an antistatic adhesive resin composition that allows easy control of adhesive strength, molded articles such as an adhesive film, a sheet, and a laminate using these compositions, and a method for producing the same.
背景技術  Background art
[0002] 支持体に粘着層が配設された粘着フィルムは、 ΟΑ·家電分野、建材分野、液晶関 連分野、携帯電話分野で幅広く使用されており、例えば、間仕切り (パーティション) 、窓ガラス等の各種物品の表面保護フィルム等として用いられている。粘着フィルム は、通常、支持体の一方の面に粘着層を設け他方の面に剥離層を設けてそのまま口 ール状に巻き取る力、または、支持体の一方の面に形成された粘着層に剥離紙等を 貼り付けて巻き取られている。前者の場合、粘着フィルムを剥離層から剥離して粘着 層を被着体に貼着させる。後者の場合、使用時に剥離紙を取り外して粘着層を被着 体へ貼着させる。粘着フィルムを被着体の表面保護に用いる場合、粘着フィルムは 被着体の使用時に剥離されるが、この際に静電気が発生し (以下、剥離帯電と記す。 )、剥がした後のフィルムの取り扱い、すなわち作業性が低下する、又、剥がしたフィ ルムに埃が付着して汚れやすい等の問題点があった。このような問題点は、粘着層 に起因するものと支持体に起因するものとがあり、何れも解決が望まれている。  [0002] Adhesive films in which an adhesive layer is disposed on a support are widely used in the fields of household appliances, construction materials, liquid crystal, and mobile phones. For example, partitions, windows, etc. It is used as a surface protective film for various articles. The pressure-sensitive adhesive film usually has a pressure-sensitive adhesive layer formed on one side of the support, or a force that winds up in a tool-like form by providing a pressure-sensitive adhesive layer on one side of the support and a release layer on the other side. It is rolled up with a release paper attached to it. In the former case, the pressure-sensitive adhesive film is peeled from the release layer, and the pressure-sensitive adhesive layer is adhered to the adherend. In the latter case, the release paper is removed and the adhesive layer is attached to the adherend during use. When the adhesive film is used for protecting the surface of the adherend, the adhesive film is peeled off when the adherend is used, but static electricity is generated at this time (hereinafter referred to as peeling charge), and the film after peeling is removed. There was a problem that handling, that is, workability was lowered, and dust was attached to the peeled film and it was easy to get dirty. Such problems are caused by the pressure-sensitive adhesive layer and those caused by the support, both of which are desired to be solved.
上記問題点は、特に液晶表示装置の偏光板表面の保護フィルムでは、剥離帯電が 大きな問題となる。液晶表示装置の大画面化、高精細化、小額縁化、薄肉化に伴い 、 IC回路の狭線幅化が進み静電気耐性が低下する傾向にあり、剥離帯電は、製品 の歩留まりの低下の原因となって 、る。 The above problem is particularly a problem of peeling charging in the protective film on the polarizing plate surface of the liquid crystal display device. As LCDs have larger screens, higher definition, smaller frames, and thinner walls IC circuits are becoming narrower and their resistance to static electricity tends to be reduced, and peeling electrification causes a decrease in product yield.
上記問題点を解決する手段として、特許文献 1には、ポリエチレンテレフタレート (PE T)フィルム力 なる支持体の一方の面に剥離層を設け、他方の面に帯電防止層を 介して粘着層を設けた粘着テープが提案されて!ヽるが、剥離帯電を防止する効果が 十分でなぐ支持体に起因して静電気が発生するという問題があった。特許文献 2に は、電荷制御剤を含む粘着層を備えた粘着フィルムが開示されているが、粘着層で 発生する剥離帯電の解消はある程度達成できたものの、やはり、支持体に起因して 静電気が発生するという問題があった。  As means for solving the above problems, Patent Document 1 discloses that a release layer is provided on one surface of a support having a polyethylene terephthalate (PET) film force, and an adhesive layer is provided on the other surface via an antistatic layer. However, there has been a problem that static electricity is generated due to a support that is not sufficiently effective in preventing peeling electrification. Patent Document 2 discloses an adhesive film having an adhesive layer containing a charge control agent. Although the release charge generated in the adhesive layer can be eliminated to some extent, it is still static due to the support. There was a problem that occurred.
[0003] 更に、特許文献 3には、ポリオレフインフィルムを支持体フィルムとしスチレン重合体ブ ロックと共役ジェン重合体ブロック力 なるブロック共重合体を粘着剤とする表面保護 フィルムが、また、特許文献 4には、ポリオレフインフィルムを支持体フィルムとし上記 ブロック共重合体の共役ジェン重合体部分を水素添加したブロック共重合体を粘着 剤とする表面保護フィルムが開示されている。し力しながら、これらの表面保護フィル ムは、上述の如き近年要求されて 、る剥離帯電防止の要求を充足するものではな 、 また、特許文献 5には、ポリオレフイン系榭脂等のフィルム力もなるシート状基材の片 面又は両面に積層した帯電防止層にバインダ層を積層し、さら〖こ当該バインダ層上 に粘着剤層を積層してなる表面保護フィルムが開示されている。しかし、このフィルム は、帯電防止層の形成時に有機溶剤を用いており、工程が煩雑であり、環境汚染を 防止する対策が必要であること等から、経済性に劣るといった問題がある。また、この フィルムは、中間に帯電防止層を備えても、帯電防止効果が十分でなぐ特に、シー ト状基材側の制電性が十分ではな 、と 、つた問題もあった。 [0003] Further, Patent Document 3 discloses a surface protective film having a polyolefin film as a support film and a styrene polymer block and a block copolymer having a conjugate power as a conjugation polymer block as an adhesive. Discloses a surface protective film using a polyolefin film as a support film and a block copolymer obtained by hydrogenating the conjugation polymer portion of the block copolymer as an adhesive. However, these surface protective films, which have been required in recent years as described above, do not satisfy the requirements for preventing anti-peeling, and Patent Document 5 also describes film strength such as polyolefin-based resin. There is disclosed a surface protective film in which a binder layer is laminated on an antistatic layer laminated on one or both sides of a sheet-like substrate, and a pressure-sensitive adhesive layer is laminated on the binder layer. However, this film has a problem that it is inferior in economic efficiency because an organic solvent is used when forming the antistatic layer, the process is complicated, and measures to prevent environmental pollution are necessary. In addition, this film has another problem that even if an antistatic layer is provided in the middle, the antistatic effect is not sufficient, and in particular, the antistatic property on the sheet-like substrate side is not sufficient.
[0004] 特許文献 1 :特開平 8— 134416号公報 [0004] Patent Document 1: Japanese Patent Laid-Open No. 8-134416
特許文献 2 :特開 2004— 155977号公報  Patent Document 2: JP 2004-155977 A
特許文献 3 :特開昭 54— 126243号公報  Patent Document 3: Japanese Patent Laid-Open No. 54-126243
特許文献 4:特開昭 61— 103975号公報  Patent Document 4: Japanese Patent Laid-Open No. 61-103975
特許文献 5:特開 2000 - 328024号公報 発明の開示 Patent Document 5: Japanese Unexamined Patent Publication No. 2000-328024 Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0005] 以上詳述のとおり、粘着フィルムにおいては、粘着層及び支持体の何れについても 制電性の改善が望まれて 、る。  As described above in detail, in the adhesive film, it is desired to improve the antistatic property for both the adhesive layer and the support.
また、粘着フィルムやシートの使用用途によっては、透明性、耐熱性などの特性が更 に要求されることがある。耐熱性については、例えば、粘着フィルムの支持体側に印 刷を行う場合等においては、印刷後の乾燥において 80°C以上の温度に耐えうるもの が必要であり、制電性シートの場合は高温でソリ、カール等の変形が生じないことが 要求される。また、何れの成形品においても、少なくとも実用上容認できる外観を備 えることが必要である。  Depending on the intended use of the adhesive film or sheet, properties such as transparency and heat resistance may be further required. With regard to heat resistance, for example, when printing on the support side of an adhesive film, a material that can withstand temperatures of 80 ° C or higher is required for drying after printing. Therefore, it is required that deformation such as warping and curling does not occur. In addition, any molded product must have at least a practically acceptable appearance.
[0006] 本発明の目的は、制電性及び透明性に優れ、フィルム等の成形品とした場合の表面 外観にも優れた制電性榭脂組成物を提供することにある。  [0006] An object of the present invention is to provide an antistatic resin composition which is excellent in antistatic properties and transparency and excellent in surface appearance when formed into a molded article such as a film.
本発明の別の目的は、制電性及び粘着性に優れ、粘着力の制御が容易で、粘着層 の形成に好適な制電'粘着性榭脂組成物を提供することにある。  Another object of the present invention is to provide an antistatic adhesive resin composition which is excellent in antistatic property and adhesiveness, easily controls adhesive force, and suitable for forming an adhesive layer.
本発明の更に別の目的は、支持体と上記制電 '粘着性榭脂組成物からなる制電性 粘着層とを備え、該支持体と該粘着層とが十分な強度をもって接着された制電性に 優れた粘着フィルム及びその製造方法を提供することにあり、好ましくは、さらに透明 性に優れた粘着フィルム及びその製造方法を提供することにある。  Still another object of the present invention is to provide a support and an antistatic adhesive layer comprising the above antistatic adhesive resin composition, wherein the support and the adhesive layer are bonded with sufficient strength. It is in providing the adhesive film excellent in electroconductivity, and its manufacturing method, Preferably, it is providing the adhesive film excellent in transparency further, and its manufacturing method.
本発明のまた更に別の目的は、フィルム、シート等の各種制電性成形品及び制電性 積層体を提供することができ、又は、上記粘着フィルムの支持体を提供することもで き、さらに、耐熱性及び成形品外観に優れた制電性榭脂組成物を提供することにあ る。  Still another object of the present invention is to provide various antistatic molded articles and antistatic laminates such as films and sheets, or to provide a support for the adhesive film. Furthermore, it is providing the antistatic resin composition excellent in heat resistance and the external appearance of a molded article.
課題を解決するための手段  Means for solving the problem
[0007] 本発明者等は、上記目的を達成すべく鋭意検討した結果、ポリオレフイン樹脂と、特 定のブロック共重合体と、特定の共役ジェン系重合体とを所定量含有する組成物が[0007] As a result of intensive studies to achieve the above object, the present inventors have found that a composition containing a predetermined amount of a polyolefin resin, a specific block copolymer, and a specific conjugation polymer.
、制電性及び透明性に優れることを見出した。また、これらの成分を所定量含有して なる組成物は、更に粘着性に優れることを見出し、特に、ポリオレフイン樹脂の種類 及び配合量を選択することにより、粘着力の制御が容易となることがわかった。更に、 上記粘着性の組成物を用いた粘着層を適当な榭脂組成物カゝらなる支持体の表面に 形成することにより、支持体と粘着層との接着性に優れ、更に透明性に優れた制電 性粘着フィルムが得られることを見出した。 It was found that the antistatic property and transparency were excellent. In addition, a composition comprising a predetermined amount of these components has been found to be more excellent in tackiness, and in particular, the adhesive strength can be easily controlled by selecting the type and blending amount of the polyolefin resin. all right. Furthermore, By forming a pressure-sensitive adhesive layer using the above-mentioned pressure-sensitive adhesive composition on the surface of a support made of an appropriate resin composition, the adhesion between the support and the pressure-sensitive adhesive layer is excellent, and further transparency is excellent. It was found that an antistatic adhesive film can be obtained.
さらに、本発明者等は、上記目的を達成すべく鋭意検討した結果、前記ポリオレフィ ン系榭脂として、ノルボルネン等の環状ォレフィン成分を含有するポリオレフイン系榭 脂を一定の割合で使用することで、優れた制電性を維持しながら耐熱性にも優れた 榭脂組成物が得られることを見出した。そして、この榭脂組成物を成形することにより 制電性に優れた成形品が得られ、シートやフィルムに成形して他の榭脂成形品に積 層した場合でも、制電性に優れた積層体を提供することができることを見出した。  Furthermore, as a result of intensive studies to achieve the above object, the present inventors have used a polyolefin resin containing a cyclic olefin component such as norbornene at a certain ratio as the polyolefin resin. It was found that a resin composition having excellent heat resistance while maintaining excellent antistatic properties can be obtained. A molded product with excellent antistatic properties can be obtained by molding this resin composition, and even when molded into a sheet or film and stacked on other molded products, the antistatic property is excellent. It has been found that a laminate can be provided.
[0008] 力くして、本発明の一局面によれば、  [0008] Forcibly, according to one aspect of the present invention,
(A)ポリオレフイン系榭脂 (但し、下記成分 (B)を除く。) 30〜95質量%と、  (A) Polyolefin resin (except for the following component (B)) 30 to 95% by mass,
(B)ォレフィン重合体ブロックと親水性ポリマーブロックとを含むブロック共重合体 5〜 20質量%と、  (B) 5-20% by mass of a block copolymer containing an olefin polymer block and a hydrophilic polymer block;
(C)共役ジェンィ匕合物単位を含む重合体およびその水素添加物からなる群より選ば れた少なくとも 1種の重合体 0〜50質量%と、  (C) 0-50% by mass of at least one polymer selected from the group consisting of a polymer containing a conjugated diene compound unit and a hydrogenated product thereof;
を含有する(但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質量%である 。)ことを特徴とする制電性榭脂組成物が提供される。  (However, the total of the component (A), the component (B) and the component (C) is 100% by mass).
本発明の制電性榭脂組成物は、制電性のみならず、透明性及び外観に優れたフィ ルム等の成形品を提供することができる。  The antistatic resin composition of the present invention can provide a molded product such as a film excellent in transparency and appearance as well as antistatic properties.
[0009] 本発明の他の局面によれば、  [0009] According to another aspect of the invention,
(A)ポリオレフイン系榭脂 (但し、下記成分 (B)を除く。)0〜59質量%と、  (A) Polyolefin resin (except for the following component (B)) 0 to 59% by mass,
(B)ォレフィン重合体ブロックと親水性ポリマーブロックとを含むブロック共重合体 3〜 60質量%と、  (B) 3 to 60% by mass of a block copolymer containing an olefin polymer block and a hydrophilic polymer block;
(C)共役ジェンィ匕合物単位を含む重合体およびその水素添加物からなる群より選ば れた少なくとも 1種の重合体 35〜97質量%と、  (C) 35 to 97% by mass of at least one polymer selected from the group consisting of a polymer containing a conjugated diene compound unit and a hydrogenated product thereof,
を含有する(但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質量%である 。 )ことを特徴とする制電'粘着性樹脂組成物が提供される。  (However, the total of the component (A), the component (B) and the component (C) is 100% by mass).) An antistatic adhesive resin composition is provided.
本発明の制電'粘着性榭脂組成物は、制電性のみならず、透明性及び外観に優れ たフィルム等の成形品を提供することができるだけでなく、重合体組成物力もなる支 持体上に透明な粘着層を形成するのに好適に使用できる。 The antistatic adhesive resin composition of the present invention is not only antistatic but also excellent in transparency and appearance In addition to providing a molded product such as a film, it can be suitably used to form a transparent adhesive layer on a support having a polymer composition.
[0010] 本発明の制電 '粘着性榭脂組成物の第一の好ましい実施形態によれば、上記成分( 八)0〜40質量%と、上記成分(B) 6〜25質量%と、上記成分(C) 35〜94質量%と を含有する(但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質量%である 。)制電'粘着性樹脂組成物が提供される。  [0010] According to a first preferred embodiment of the antistatic 'adhesive rosin composition of the present invention, 0 to 40% by mass of the component (8), 6 to 25% by mass of the component (B), Antistatic adhesive composition containing 35 to 94% by mass of the above component (C) (provided that the total of the above component (A), component (B) and component (C) is 100% by mass). Is provided.
この第一の好ましい実施形態による制電'粘着性榭脂組成物は、ポリオレフイン榭脂 力もなる支持体フィルムに透明な粘着層を形成して透明フィルムを得るのに好適に 使用できる。  The antistatic adhesive resin composition according to the first preferred embodiment can be suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film having polyolefin resin-repelling power.
[0011] 本発明の制電 '粘着性榭脂組成物の第二の好ましい実施形態によれば、上記成分( A)がポリオレフイン (Α' - 1)及び Ζ又は官能基で変性されて 、るポリオレフイン (Α' - 2)であり、上記成分 (C)が共役ジェンィ匕合物単位及び芳香族ビ-ルイ匕合物単位 力も主としてなる重合体の水素添加物であり、上記成分 (Α) 0〜59質量%、上記成 分 (Β) 3〜60質量%、及び上記成分 (C) 40〜97質量%力 なる制電 '粘着性榭脂 組成物が提供される。ここにおいて、上記成分 (C)成分は、水素添加されたものであ ることが好ましい。  [0011] According to a second preferred embodiment of the antistatic 'adhesive rosin composition of the present invention, the component (A) is modified with polyolefin (Α'-1) and Ζ or a functional group. Polyolefin (Α′-2), wherein the component (C) is a hydrogenated product of a polymer mainly composed of conjugated genie compound units and aromatic beryl compound units, and the component (Α) 0 An antistatic adhesive resin composition comprising: -59% by mass, the above component (Β) 3-60% by mass, and the above component (C) 40-97% by mass is provided. Here, the component (C) is preferably hydrogenated.
この第二の好ましい実施形態による制電'粘着性榭脂組成物は、スチレン系榭脂な どの各種重合体組成物カゝらなる支持体フィルムに透明な粘着層を形成して透明フィ ルムを得るのに好適に使用できる。  The antistatic adhesive resin composition according to the second preferred embodiment forms a transparent film by forming a transparent adhesive layer on a support film made of various polymer compositions such as styrene resin. It can be used suitably to obtain.
[0012] カゝくして、本発明の制電性榭脂組成物と本発明の制電 '粘着性榭脂組成物を用いて 各種の積層体を得ることができる。 [0012] As a result, various laminates can be obtained using the antistatic resin composition of the present invention and the antistatic adhesive resin composition of the present invention.
本発明による好ましい積層体としては、例えば、下記(1)〜 (4)の形態が例示できる Examples of preferable laminates according to the present invention include the following forms (1) to (4).
(1)ポリオレフイン系榭脂組成物からなる支持体と、該支持体の少なくとも 1面側に配 設され、且つ、本発明の制電'粘着性榭脂組成物、好ましくは上記第一の実施形態 による制電 '粘着性榭脂組成物カゝらなる制電性粘着層とを備えることを特徴とする粘 着フイノレム。 (1) A support composed of a polyolefin resin composition, and an antistatic adhesive resin composition of the present invention, preferably disposed on at least one side of the support, preferably the first embodiment Anti-adhesive Finolem characterized by comprising an anti-static adhesive layer comprising an anti-static adhesive composition.
(2)上記ポリオレフイン系榭脂組成物が、本発明の制電性榭脂組成物である上記(1 )項に記載の粘着フィルム。 (3)熱可塑性重合体組成物からなる支持体と、該支持体の少なくとも 1面側に配設さ れ、且つ、本発明の制電'粘着性榭脂組成物、好ましくは上記第二の実施形態によ る制電'粘着性樹脂組成物カゝらなる制電性粘着層とを備えることを特徴とする粘着フ イノレム。 (2) The pressure-sensitive adhesive film as described in (1) above, wherein the polyolefin resin composition is the antistatic resin composition of the present invention. (3) A support made of a thermoplastic polymer composition, disposed on at least one side of the support, and the antistatic adhesive resin composition of the present invention, preferably the second An antistatic adhesive layer comprising an antistatic adhesive layer comprising an antistatic adhesive resin composition according to an embodiment.
(4)熱可塑性重合体組成物からなる支持体と、該支持体の少なくとも 1面側に配設さ れ、且つ、本発明の上記第一又は第二の実施形態による制電'粘着性榭脂組成物 力もなる制電性粘着層とを備えることを特徴とする粘着性のシートまたはフィルム状の 積層体。  (4) A support made of a thermoplastic polymer composition, and at least one surface side of the support, and the antistatic adhesive layer according to the first or second embodiment of the present invention An adhesive sheet or film-like laminate comprising an antistatic adhesive layer that also has a fat composition.
上記(1)〜 (4)のシートまたはフィルムは、支持体を構成する榭脂組成物と、本発明 の制電'粘着性榭脂組成物とを共押出する工程を備えることを特徴とする粘着シート またはフィルムの製造方法によって製造できる。  The sheet or film according to the above (1) to (4) is characterized by comprising a step of co-extruding the resin composition constituting the support and the antistatic adhesive resin composition of the present invention. It can be produced by a method for producing an adhesive sheet or film.
[0013] 本発明の制電性榭脂組成物及び制電,粘着性榭脂組成物において、上記成分 (A) 力 環状ォレフィン単位を含み且つガラス転移温度が 60〜200°Cであるポリオレフィ ン系榭脂 (A— 1)と、環状ォレフィン単位を含まな 、ポリオレフイン系榭脂 (A— 2)と からなり、両者の含有量の比( (A— 1) Z (A- 2) )が 95Z5〜: LZ99 (質量比)である 場合、耐熱性が向上する。  [0013] In the antistatic resin composition and the antistatic and adhesive resin composition of the present invention, the above-mentioned component (A) is a polyolefin containing a cyclic olefin unit and having a glass transition temperature of 60 to 200 ° C. System resin (A-1) and polyolefin resin without cyclic olefin units (A-2), and the ratio of the two contents ((A-1) Z (A-2)) is 95Z5 ~: When LZ99 (mass ratio), heat resistance is improved.
[0014] 本発明の制電性榭脂組成物及び制電,粘着性榭脂組成物において、上記成分 (C) は、共役ジェンィ匕合物単位から主としてなる重合体ブロック (cl)と芳香族ビニル化合 物単位から主としてなる重合体ブロック (c2)とを含むブロック共重合体およびその水 素添加物からなる群より選ばれた少なくとも 1種の重合体であることが好ましい。  [0014] In the antistatic resin composition and the antistatic and adhesive resin composition of the present invention, the component (C) is composed of a polymer block (cl) mainly composed of a conjugated diene compound unit and an aromatic group. It is preferably at least one polymer selected from the group consisting of a block copolymer containing a polymer block (c2) mainly composed of vinyl compound units and a hydrogen additive thereof.
[0015] 本発明の制電性榭脂組成物及び制電'粘着性榭脂組成物は、制電性向上のために 、さらに、下記に詳述する成分 (E1)、成分 (E2)、成分 (E3)及び成分 (E4)力 なる 群より選ばれた少なくとも 1種の制電性改良剤 (E)を、前記制電性榭脂組成物の制 電性を改良するに十分な量、通常、前記成分 (A)、成分 (B)及び成分 (C)の合計 10 0質量部に対して 0. 01〜30質量部含有することが好ましい。  [0015] The antistatic resin composition and the antistatic adhesive resin composition of the present invention further comprise components (E1), (E2), (E2), Component (E3) and Component (E4) At least one antistatic agent (E) selected from the group consisting of a sufficient amount of the antistatic resin composition in an amount sufficient to improve the antistatic properties, Usually, it is preferable to contain 0.01-30 mass parts with respect to 100 mass parts in total of the said component (A), a component (B), and a component (C).
発明の効果  The invention's effect
[0016] 本発明の制電性榭脂組成物は、特定の成分 (A)、 (B)及び (C)を、各々、所定量含 有することから、制電性及び透明性に優れ、フィルム等の成形品とした場合の表面外 観にも優れる。特に、成分 (A)が、上記のポリオレフイン系榭脂 (A—1)及び (A— 2) 力もなる場合には、耐熱性をも備えた成形品を得ることができる。 [0016] The antistatic resin composition of the present invention includes a predetermined amount of each of the specific components (A), (B) and (C), and thus has excellent antistatic properties and transparency. Outside the surface when molded products such as Excellent view. In particular, when the component (A) also has the above polyolefin resin (A-1) and (A-2) strength, a molded product having heat resistance can be obtained.
[0017] 本発明の制電'粘着性榭脂組成物は、特定の成分 (A)、 (B)及び (C)を、各々、所 定量含有することから、制電性、透明性及び粘着性に優れ、粘着力の制御も容易で ある。 [0017] Since the antistatic adhesive composition of the present invention contains a specific amount of specific components (A), (B), and (C), the antistatic property, transparency, and adhesiveness are each included. Excellent adhesiveness and easy control of adhesive strength.
本発明の制電'粘着性榭脂組成物は、支持体との接着性に優れた制電性粘着層を 与える。特に、支持体フィルムが、本発明の制電性榭脂組成物カゝらなる場合には、粘 着フィルム全体として、制電性に優れ、所定条件下における表面固有抵抗を 109 Ω 以下とすることができる。 The antistatic adhesive composition of the present invention provides an antistatic adhesive layer having excellent adhesion to a support. In particular, when the support film is the antistatic resin composition of the present invention, the adhesive film as a whole is excellent in antistatic properties and has a surface resistivity of 10 9 Ω or less under a predetermined condition. can do.
支持体フィルムが本発明の制電性榭脂組成物カゝらなる場合、制電性のみならず、透 明性、外観及び支持体と制電性粘着層との接着性に優れた粘着フィルムが得られる 本発明の粘着フィルムの製造方法によれば、支持体と制電性粘着層との接着性に優 れた粘着フィルムを容易に形成することができる。  When the support film is the antistatic resin composition of the present invention, the pressure-sensitive adhesive film is excellent not only in antistatic properties but also in transparency, appearance, and adhesion between the support and the antistatic adhesive layer. According to the method for producing a pressure-sensitive adhesive film of the present invention, a pressure-sensitive adhesive film having excellent adhesion between the support and the antistatic pressure-sensitive adhesive layer can be easily formed.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0018] 以下、本発明を詳しく説明する。尚、本明細書において、「(共)重合」とは、単独重合 及び共重合を意味し、「(メタ)アクリル」とは、アクリル及び Ζ又はメタクリルを意味し、[0018] Hereinafter, the present invention will be described in detail. In the present specification, “(co) polymerization” means homopolymerization and copolymerization, and “(meth) acryl” means acryl and cocoon or methacryl,
「 (メタ)アタリレート」とは、アタリレート及び Ζ又はメタタリレートを意味する。 “(Meth) atalylate” means attalate and cocoon or metatalerate.
[0019] 1.制電性榭脂組成物  [0019] 1. Antistatic resin composition
本発明の制電性榭脂組成物は、(Α)ポリオレフイン系榭脂 (本発明において、「成 分 (Α)」ともいう。但し、下記 (Β)を除く。) 30〜95質量%と、(Β)ォレフィン重合体ブ ロックと親水性ポリマーブロックとを含むブロック共重合体 (本発明にお 、て、「成分( Β)」ともいう。) 5〜20質量%と、(C)共役ジェンィ匕合物単位を含む重合体およびそ の水素添加物力もなる群より選ばれた少なくとも 1種の重合体 (本発明において、「成 分 (C)」ともいう。)0〜50質量%とを含有 (但し、上記成分 (A)、成分 (B)及び成分( C)の合計は 100質量%である。 )することを特徴とする。  The antistatic resin composition of the present invention comprises (ii) polyolefin-based resin (also referred to as “component (ii)” in the present invention, except for the following (iii)): 30 to 95% by mass , (Β) a block copolymer containing an olefin polymer block and a hydrophilic polymer block (also referred to as “component (Β)” in the present invention) 5 to 20% by mass, and (C) a conjugate At least one polymer selected from the group consisting of a polymer comprising a pheny compound unit and its hydrogenated product force (also referred to as “component (C)” in the present invention) is 0 to 50% by mass. (Provided that the total of component (A), component (B) and component (C) is 100% by mass).
[0020] 1 1.成分 (A)  [0020] 1 1. Component (A)
上記成分 (A)は、炭素数が 2以上のォレフィン類を構成単量体単位として含むポリ ォレフィン系榭脂であり、後述する成分 (B)以外であれば、特に限定されない。本発 明において、好ましい成分 (A)は、炭素数 2〜 10のォレフィン類を構成単量体単位 として含む (共)重合体である。 The above component (A) is a polymer containing olefins having 2 or more carbon atoms as constituent monomer units. There is no particular limitation as long as it is an olefin-based resin and other than the component (B) described later. In the present invention, a preferred component (A) is a (co) polymer containing olefins having 2 to 10 carbon atoms as constituent monomer units.
本発明に係る成分 (A)の好まし 、態様としては、 (1)炭素数 2以上のォレフィン類 カゝら選ばれた少なくとも 1種によって主として構成単量体単位が構成されてなる(共) 重合体 (以下、「重合体(1)」という。 ); (2)炭素数 2以上のォレフィン類から選ばれた 少なくとも 1種と、該ォレフイン類と共重合可能な化合物力 選ばれた少なくとも 1種と 力も主として構成単量体単位が構成されてなる (共)重合体 (2) (以下、「重合体 (2)」 という。)等が挙げられる。これらは、 1種単独でまたは 2種以上を組み合わせて用い ることがでさる。  Preferred embodiments of the component (A) according to the present invention include: (1) a constituent monomer unit mainly composed of at least one selected from olefins having 2 or more carbon atoms (co) Polymer (hereinafter referred to as “polymer (1)”); (2) At least one selected from olefins having 2 or more carbon atoms, and a compound power capable of copolymerizing with the olefins At least one selected Examples include (co) polymer (2) (hereinafter referred to as “polymer (2)”) in which the constituent monomer units are mainly composed of species and force. These can be used alone or in combination of two or more.
上記のポリオレフイン系榭脂としては、公知の重合方法である高圧重合法、低圧重 合法、メタ口セン触媒法等により得られたもの等が全て使用できる。  As the polyolefin-based resin, those obtained by a known polymerization method such as a high-pressure polymerization method, a low-pressure polymerization method, a metalocene catalyst method, and the like can be used.
[0021] 上記ォレフィン類としては、代表的には非環状ォレフィン類が用いられ、その具体 例としては、エチレン、及びプロピレン、 1—ブテン、 1—ペンテン、 1—へキセン、 3- メチルー 1ーブテン、 3—メチルー 1 ペンテン、 4ーメチルー 1 ペンテン、 3 ェチ ルー 1—ペンテン、 4—メチル—1—へキセン、 4, 4 ジメチルー 1—ペンテン、 4— ェチル—1—へキセン、 3—ェチル—1—へキセン、 1—オタテン、 1—デセン、 1—ド デセン、 1ーテトラデセン、 1一へキサデセン、 1ーォクタデセン、 1 エイコセン等の aーォレフインが挙げられる。これらは、 1種単独でまたは 2種以上を組み合わせて 用いることができる。また、これらのうち、好ましくは、エチレン、プロピレン、 1—ブテン 、 3—メチルー 1ーブテン、 4ーメチルー 1 ペンテンであり、特に好ましくはエチレン 及びプロピレンである。 [0021] As the olefins, acyclic olefins are typically used. Specific examples thereof include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene. 3-methyl-1-pentene, 4-methyl-1-pentene, 3-ethyl 1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl- Examples include 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, and other a-olefins. These can be used alone or in combination of two or more. Of these, ethylene, propylene, 1-butene, 3-methyl-1-butene, and 4-methyl-1 pentene are preferable, and ethylene and propylene are particularly preferable.
[0022] また、上記ォレフィン類として、環状ォレフィンを使用することもできる。環状ォレフィ ンは、通常、上記非環状ォレフィンと併用して使用される。  [0022] As the olefins, cyclic olefins can also be used. Cyclic olefins are usually used in combination with the non-cyclic olefins.
環状ォレフィンとしては、二重結合を 1つ有する脂環式ィヒ合物であれば、特に限定 されず、例えば、特開平 5— 310845号公報等に例示された化合物が挙げられる。 好まし 、環状ォレフィンは、炭素数が 11以下の化合物である。  The cyclic olefin is not particularly limited as long as it is an alicyclic compound having one double bond, and examples thereof include compounds exemplified in JP-A-5-310845. Preferably, cyclic olefin is a compound having 11 or less carbon atoms.
上記環状ォレフィンとしては、ノルボルネン類が好ましぐ炭素数 11以下のノルボル ネン類(ノルボルネン及び Z又はノルボルネン誘導体)が環状ォレフィン全体の 50質 量%以上を占めることが好ましい。ノルボルネン類としては、具体的には、 2—ノルボ ルネン(ビシクロ [2. 2. 1]ヘプトー 2 ェン)、 6—メチルビシクロ [2. 2. 1]ヘプトー 2 —ェン、 6 ェチルビシクロ [2. 2. 1]ヘプトー 2 ェン、 6— n—ブチルビシクロ [2. 2 . 1]ヘプトー 2 ェン、 6 イソブチルビシクロ [2. 2. 1]ヘプトー 2 ェン、 5, 6 ジ メチルビシクロ [2. 2. 1]ヘプトー 2—ェン、 1—メチルビシクロ [2. 2. 1]ヘプトー 2— ェン、 7—メチルビシクロ [2. 2. 1]ヘプト— 2 ェン、トリシクロ [4. 3. 0. I2· 5]— 3— デセン、 2—メチノレトリシクロ [4. 3. 0. I2· 5]— 3 デセン、 5—メチノレトリシクロ [4. 3. 0. I2· 5]— 3 デセン、トリシクロ [4. 4. 0. I2· 5]— 3 ゥンデセン等が挙げられる。こ れらは、 1種単独でまたは 2種以上を組み合わせて用いることができる。 As the above-mentioned cyclic olefin, norbornene having a carbon number of 11 or less is preferred. It is preferable that the enes (norbornene and Z or norbornene derivatives) occupy 50% by mass or more of the entire cyclic olefin. Specific examples of norbornene include 2-norbornene (bicyclo [2.2.1] hept-2ene), 6-methylbicyclo [2.2.1] hept-2-ene, 6ethylbicyclo [2 2. 1] Hepto-2, 6- n-butylbicyclo [2.2.1] Hepto-2, 6 isobutylbicyclo [2.2.1] Hepto-2, 5, 6 dimethylbicyclo [ 2. 2. 1] Hepto-2-ene, 1-methylbicyclo [2. 2. 1] Hepto-2-ene, 7-methylbicyclo [2. 2. 1] hept-2-ene, tricyclo [4. 3. 0. I 2 · 5 ] — 3— Decene, 2-Methylenotritricyclo [4. 3. 0. I 2 · 5 ] — 3 Decene, 5 — Methyloretricyclo [4. 3. 0. I 2 · 5 ]-3 decene, tricyclo [4. 4. 0. I 2 · 5 ]-3 undecene. These can be used alone or in combination of two or more.
尚、炭素数が 12以上の環状ォレフィンを単独でまたは上記の炭素数が 11以下の 化合物と併用することができる。  Incidentally, cyclic olefins having 12 or more carbon atoms can be used alone or in combination with the above-mentioned compounds having 11 or less carbon atoms.
また、上記重合体(2)における上記ォレフィン類と共重合可能な化合物としては、 例えば、非共役ジェンィ匕合物が挙げられる。非共役ジェンィ匕合物としては、非環式 ジェンィ匕合物、脂環式ジェンィ匕合物等が挙げられる。これらは、 1種単独でまたは 2 種以上を組み合わせて用いることができる。  In addition, examples of the compound copolymerizable with the olefins in the polymer (2) include non-conjugated genie compounds. Examples of the non-conjugated genie compound include an acyclic geny compound and an alicyclic geny compound. These can be used alone or in combination of two or more.
非環式ジェン化合物としては、 1, 4一へキサジェン、 1, 5 へキサジェン、 1, 6- へキサジェン、 1, 9ーデカジエン等の直鎖の非環式ジェン化合物; 4ーメチルー 1, 4 一へキサジェン、 5ーメチノレー 1, 4一へキサジェン、 7—メチノレー 1, 6—ォクタジェン 、 3, 7 ジメチル— 1, 6—ォクタジェン、 5, 7 ジメチルォクタ— 1, 6 ジェン、 3, 7 ジメチルー 1, 7—ォクタジェン、 7 メチルオタター 1, 6 ジェン、ジヒドロミルセン 等の分岐連鎖の非環式ジェン化合物等が挙げられる。これらは、 1種単独でまたは 2 種以上を組み合わせて用いることができる。 Examples of acyclic gen compounds include straight chain acyclic gen compounds such as 1,4 monohexagen, 1,5 hexagen, 1,6-hexagen, 1,9-decadiene, etc .; 4-methyl-1,4 Kisagene, 5- Methinore 1,4 1-Hexagen, 7-Methinore 1,6-Octagen, 3,7 Dimethyl-1,6-Octagen, 5,7 Dimethylocta-1,6 Gen, 3,7 Dimethyl 1,7-Octagen 7 branched chain acyclic gen compounds such as methyl otater 1,6 gen and dihydromyrcene. These can be used alone or in combination of two or more.
また、脂環式ジェンィ匕合物としては、テトラヒドロインデン、メチルテトラヒドロインデン 、ジシクロペンタジェン、ビシクロ [2. 2. 1]—ヘプター 2, 5 ジェン、 5—メチレン一 2 ノルボルネン、 5 ェチリデン 2 ノルボルネン、 5—プロべ-ルー 2 ノルボル ネン、 5 イソプロピリデンー2 ノルボルネン、 5 シクロへキシリデン 2 ノルボル ネン、 5 ビュルー2 ノルボルネン等が挙げられる。これらは、 1種単独でまたは 2種 以上を組み合わせて用いることができる。 Cyclohydroindene, methyltetrahydroindene, dicyclopentagen, bicyclo [2. 2. 1] -hepter 2,5 gen, 5-methylene 1-2 norbornene, 5 ethylidene 2 norbornene 5-propylene 2 norbornene, 5 isopropylidene 2 norbornene, 5 cyclohexylidene 2 norbornene, 5 bureau 2 norbornene, and the like. These are one kind alone or two kinds A combination of the above can be used.
[0024] 上記成分 (A)は、結晶性であってよいし、非晶性であってもよいが、好ましくは、室 温下、 X線回折により、 20%以上の結晶化度を有するものである。尚、結晶性の調整 のために、上記成分 (A)に公知の結晶核剤を配合してもよい。  [0024] The component (A) may be crystalline or amorphous, but preferably has a crystallinity of 20% or more by X-ray diffraction at room temperature. It is. In order to adjust the crystallinity, a known crystal nucleating agent may be added to the component (A).
上記成分 (A)の融点 (JIS K7121に準拠)は、好ましくは 40°C以上である。  The melting point (based on JIS K7121) of the component (A) is preferably 40 ° C or higher.
また、上記成分 (A)の分子量は特に限定されないが、成形性の観点から、メルトフ ローレート (JIS K7210に準拠) ίま、好ましく ίま 0. 001〜500g/10分、より好ましく ίま 0. 01〜500g/10分、更【こ好ましく ίま 0. 05〜: LOOg/10分であり、各値【こネ目当 する分子量を有するものが好まし ヽ。  The molecular weight of the component (A) is not particularly limited, but from the viewpoint of moldability, melt flow rate (according to JIS K7210) ί, preferably ί 0.00-500g / 10 min, more preferably ί. 01 ~ 500g / 10min, more preferably 0.05 ~: LOOg / 10min, each value is preferred with a molecular weight corresponding to this value.
[0025] 従って、上記成分 (A)のうち、上記重合体(1)としては、ポリエチレン (高密度ポリエ チレン、低密度ポリエチレン、直鎖状ポリエチレン、メタ口セン触媒ポリエチレン等)、 エチレン共重合体 (エチレン単位を全単量体単位に対して、 50質量%以上含む共 重合体)、エチレン · 1ーブテン共重合体、ポリプロピレン、プロピレン 'エチレン共重 合体、プロピレン共重合体 (プロピレン単位を全単量体単位に対して、 50質量%以 上含む共重合体)、ポリ 1—ブテン等が挙げられる。これらのうち、ポリエチレン、ポリ プロピレン、プロピレン 'エチレン共重合体が好ましい。尚、上記プロピレン 'エチレン 共重合体としては、ランダム共重合体、ブロック共重合体等がある力 ランダム共重合 体が特に好ましい。これらは、 1種単独で、または 2種以上を組み合わせて用いること ができる。  [0025] Accordingly, among the above components (A), the polymer (1) includes polyethylene (high density polyethylene, low density polyethylene, linear polyethylene, meta-catalyzed polyethylene, etc.), ethylene copolymer (Copolymer containing 50% by mass or more of ethylene units based on all monomer units), ethylene 1-butene copolymer, polypropylene, propylene 'ethylene copolymer, propylene copolymer (propylene unit Copolymer containing 50% by mass or more based on the monomer unit), poly 1-butene, and the like. Of these, polyethylene, polypropylene, and propylene / ethylene copolymers are preferred. As the propylene / ethylene copolymer, a force random copolymer having a random copolymer, a block copolymer and the like is particularly preferable. These can be used alone or in combination of two or more.
上記のポリエチレン又はエチレン共重合体 (エチレン' aーォレフイン共重合体等) の融点 (JIS K7121に準拠)は、好ましくは 40°C以上であり、分子量は特に限定さ れないが、成形性の観点から、メルトフローレート (JIS K6922〖こ準拠)は、好ましく は 0. 001〜500gZlO分、より好ましくは 0. 01〜: LOOgZlO分であり、各値に相当 する分子量を有するものが好まし ヽ。  The melting point (in accordance with JIS K7121) of the above polyethylene or ethylene copolymer (ethylene 'a-olefin copolymer, etc.) is preferably 40 ° C or higher, and the molecular weight is not particularly limited. Therefore, the melt flow rate (conforming to JIS K6922) is preferably 0.001 to 500 gZlO, more preferably 0.01 to LOOgZlO, and preferably has a molecular weight corresponding to each value.
また、上記のポリプロピレン又はプロピレン共重合体(プロピレン' aーォレフイン共 重合体等)の融点 Clis K7121に準拠)は、好ましくは 40°C以上であり、分子量は特 に限定されないが、成形性の観点から、メルトフローレート (JIS K7210に準拠)は、 好ましくは 0. 01〜500gZl0分、より好ましくは 0. 05〜: LOOgZlO分であり、各値 に相当する分子量を有するものが好ましい。 Further, the melting point of the above-mentioned polypropylene or propylene copolymer (such as propylene'a-olefin copolymer) is preferably 40 ° C or higher, and the molecular weight is not particularly limited, but from the viewpoint of moldability. From the above, the melt flow rate (conforming to JIS K7210) is preferably 0.01 to 500 gZl0 minutes, more preferably 0.05 to LOOgZlO, each value Those having a molecular weight corresponding to are preferred.
[0026] また、上記成分 (A)のうち、上記重合体(2)としては、エチレン 'ノルボルネン共重 合体、プロピレン.ノルボルネン共重合体、エチレン 'プロピレン · 5 ェチリデン 2— ノルボルネン共重合体等が挙げられる。これらは、 1種単独でまたは 2種以上を組み 合わせて用いることができる。これらの重合体は、メタ口セン触媒法で製造されたもの が好ましい。尚、上記の共重合体を構成する単量体単位の各含有量は、特に限定さ れない。  [0026] Among the components (A), the polymer (2) includes an ethylene'norbornene copolymer, a propylene-norbornene copolymer, an ethylene'propylene-5 ethylidene 2-norbornene copolymer, and the like. Can be mentioned. These can be used alone or in combination of two or more. These polymers are preferably those produced by the metamouth catalyst method. In addition, each content of the monomer unit which comprises said copolymer is not specifically limited.
[0027] 本発明の制電性榭脂組成物が耐熱性を要求される場合、成分 (A)として、環状ォ レフイン単位を構成単量体単位として含み且つガラス転移温度が 60〜200°Cのポリ ォレフィン系榭脂 (A— 1)と、環状ォレフィン単位を含まな 、ポリオレフイン系榭脂 (A —2)とを併用することが好ましい。なお、本発明において、上記ポリオレフイン系榭脂 (A- 1)及び (A— 2)は、それぞれ、成分 (A— 1)及び成分 (A— 2)とも 、う。  [0027] When the antistatic resin composition of the present invention is required to have heat resistance, the component (A) contains a cyclic olefin unit as a constituent monomer unit and has a glass transition temperature of 60 to 200 ° C. It is preferable to use both the polyolefin-based resin (A-1) and the polyolefin-based resin (A-2) containing no cyclic olefin units. In the present invention, the polyolefin resin (A-1) and (A-2) are also referred to as the component (A-1) and the component (A-2), respectively.
[0028] ポリオレフイン系榭脂(A— 1)のガラス転移温度は、好ましくは 60〜200°Cであり、 より好ましくは 70〜200°C、更に好ましくは 70〜190°C、特に好ましくは 75〜185°C である。このガラス転移温度が低すぎると、耐熱性の付与効果が十分でなぐ一方、 高すぎると、成形品の表面外観が低下する場合がある。上記ガラス転移温度を有す る重合体を得るには、環状ォレフィンが成分 (A— 1)全体に対して 40〜90質量%の 範囲で共重合されて ヽることが好ま ヽ。  [0028] The glass transition temperature of the polyolefin resin (A-1) is preferably 60 to 200 ° C, more preferably 70 to 200 ° C, still more preferably 70 to 190 ° C, and particularly preferably 75. ~ 185 ° C. If this glass transition temperature is too low, the effect of imparting heat resistance is not sufficient, while if it is too high, the surface appearance of the molded product may deteriorate. In order to obtain a polymer having the above glass transition temperature, it is preferable that the cyclic olefin is copolymerized in the range of 40 to 90% by mass with respect to the whole component (A-1).
尚、ガラス転移温度は、示差走査熱量計 (DSC)を用いる等公知の方法で測定す ることがでさる。  The glass transition temperature can be measured by a known method such as using a differential scanning calorimeter (DSC).
また、このポリオレフイン系榭脂(A—1)のメルトフローレート(ISO 1133に準じ、 温度 260°C、荷重 2. 16kgで測定)は、好ましくは 0. 1〜: LOOmlZlO分である。 更に、このポリオレフイン系榭脂 (A—1)は、非晶性であることが好ましい。 ポリオレフイン系榭脂 (A— 1)と併用するポリオレフイン系榭脂 (A— 2)としては、上 記成分 (A)のうち環状ォレフィン単位を構成単量体単位として含まな ヽものは全て使 用でき、かかる (A)成分に関する記述は、ポリオレフイン系榭脂 (A— 2)にそのまま当 てはまる。  The melt flow rate (measured at a temperature of 260 ° C. and a load of 2.16 kg according to ISO 1133) of this polyolefin resin (A-1) is preferably from 0.1 to LOOmlZlO. Furthermore, it is preferable that this polyolefin resin (A-1) is amorphous. For the polyolefin resin (A-2) used in combination with the polyolefin resin (A-1), use all the components (A) that do not contain a cyclic olefin unit as a constituent monomer unit. The description of the component (A) can be applied to the polyolefin resin (A-2) as it is.
[0029] 上記ポリオレフイン系榭脂 (A— 1)及びポリオレフイン系榭脂 (A— 2)の混合割合は 、これらの合計を 100質量%とした場合、成分 (A— 1) 1〜95質量%及び成分 (A— 2) 99〜5質量%でぁり、好ましくは成分 (A—1) 10〜90質量%及び成分 (A—2) 90 〜10質量%、より好ましくは成分 (A— 1) 20〜80質量%及び成分 (A— 2) 80-20 質量%、特に好ましくは成分 (A— 1) 40〜80質量%及び成分 (A— 2) 60〜20質量 %である。上記各範囲で併用することにより、優れた耐熱性及び成形品外観が発揮 される。 [0029] The mixing ratio of the polyolefin-based resin (A-1) and the polyolefin-based resin (A-2) is When the total of these is 100% by mass, the component (A-1) is 1 to 95% by mass and the component (A-2) is 99 to 5% by mass, preferably the component (A-1) is 10 to 90%. % By weight and component (A-2) 90-10% by weight, more preferably component (A-1) 20-80% by weight and component (A-2) 80-20% by weight, particularly preferably component (A-1) 40-80% by mass and component (A-2) 60-20% by mass. When used in the above ranges, excellent heat resistance and molded product appearance are exhibited.
[0030] 本発明の制電性榭脂組成物において、成分 (A)の含有量は、成分 (A)、成分 (B) 及び成分 (C)の合計を 100質量%とした場合、 30〜95質量%であり、好ましくは 42 〜92質量%、更に好ましくは 49〜92質量%、特に好ましくは 49〜90質量%である 。この含有量が 30質量%未満では、剛性が低下する傾向があり、一方、 95質量%を 超えると、制電性が劣る傾向にある。  [0030] In the antistatic resin composition of the present invention, the content of component (A) is 30 to 30% when the sum of component (A), component (B) and component (C) is 100% by mass. It is 95% by mass, preferably 42 to 92% by mass, more preferably 49 to 92% by mass, and particularly preferably 49 to 90% by mass. If this content is less than 30% by mass, the rigidity tends to decrease, while if it exceeds 95% by mass, the antistatic property tends to be inferior.
[0031] 1 2.成分 (B)  [0031] 1 2. Component (B)
本発明に係る成分 (B)は、ォレフィン重合体ブロック (本発明にお 、て、「重合体ブ ロック (bl)」ともいう。)と、親水性ポリマーブロック (本発明において、「重合体ブロック (b2)」ともいう。)とを含むブロック共重合体である。この成分 (B)により、本発明の制 電性榭脂組成物に制電性を付与することができる。また、この成分 (B)は、 1種単独 でまたは 2種以上を組み合わせて用いることができる。  Component (B) according to the present invention comprises an olefin polymer block (also referred to as “polymer block (bl)” in the present invention) and a hydrophilic polymer block (in the present invention, “polymer block”). (b2) "))). This component (B) can impart antistatic properties to the antistatic resin composition of the present invention. In addition, this component (B) can be used alone or in combination of two or more.
[0032] 上記成分 (B)においては、重合体ブロック (bl)及び (b2)の配列は特に限定される ものではなく、下記(1)〜(5)に例示されるブロック構造を有することができる。但し、 mlは、 1以上の整数であり、 m2及び m2'は、何れも 2以上の整数であり、同一でもよ いし、異なっていてもよい。また、各構造において、重合体ブロック (bl)及び (b2)が 複数ある場合は、各ブロックは、互いに同一であってよいし、異なってもよい。  In the component (B), the arrangement of the polymer blocks (bl) and (b2) is not particularly limited, and may have a block structure exemplified in the following (1) to (5). it can. However, ml is an integer of 1 or more, and m2 and m2 ′ are both integers of 2 or more, and may be the same or different. In each structure, when there are a plurality of polymer blocks (bl) and (b2), each block may be the same as or different from each other.
(1) (bl -b2)  (1) (bl -b2)
ml  ml
(2) bl - (b2-bl)  (2) bl-(b2-bl)
ml  ml
(3) b2- (bl -b2)  (3) b2- (bl -b2)
ml  ml
(4) (bl) (b2)  (4) (bl) (b2)
(5) bl -bl - (b2-b2-bl -bl)  (5) bl -bl-(b2-b2-bl -bl)
ml  ml
これらのうち、(1)、(2)及び(3)のブロック構造、即ち、重合体ブロック (bl)及び (b 2)が繰り返し交互に配列して 、ることが好ま 、。 Of these, the block structures (1), (2) and (3), that is, polymer blocks (bl) and (b 2) It is preferable to arrange alternately repeatedly.
[0033] また、成分 (B)は、上記したブロック共重合体を主体とするものである力 成分 (B) 中に 20質量%以下の割合でポリアミドブロック、ポリエステルブロック等の他の(共) 重合体ブロックを含有させることもできる。 [0033] In addition, the component (B) is a force component (B) mainly composed of the above-mentioned block copolymer, and other (co) blocks such as a polyamide block and a polyester block in a proportion of 20% by mass or less. Polymer blocks can also be included.
上記ブロック構造(1)〜(5)において、重合体ブロック (bl)及び (b2)の結合形態 は、エステル結合、アミド結合、エーテル結合、ウレタン結合又はイミド結合であること が好ましい。  In the block structures (1) to (5), the bond form of the polymer blocks (bl) and (b2) is preferably an ester bond, an amide bond, an ether bond, a urethane bond or an imide bond.
[0034] 重合体ブロック (bl)は、ォレフィン単位を主体とする重合体力 なるブロックであり、 この重合体を形成する化合物としては、炭素数が 2以上の非環状ォレフィン、環状ォ レフイン等が挙げられる。非環状ォレフィンの例としては、エチレン、およびプロピレン 、 1—ブテン、 1 ペンテン、 1—へキセン、 3—メチル 1—ブテン、 4—メチル 1— ペンテン、 3—メチルへキセン一 1等の α—ォレフィンなどが挙げられる。また、環状 ォレフィンの例としては、ノルボルネン等が挙げられる。これらの化合物は、 1種単独 でまたは 2種以上を組み合わせて用いることができる。  [0034] The polymer block (bl) is a block having a polymer strength mainly composed of olefin units, and examples of the compound forming the polymer include acyclic olefins having 2 or more carbon atoms and cyclic olefins. It is done. Examples of acyclic olefins include ethylene and propylene, 1-butene, 1 pentene, 1-hexene, 3-methyl 1-butene, 4-methyl 1-pentene, 3-methylhexene 1 Examples include olefin. An example of cyclic olefin is norbornene. These compounds can be used alone or in combination of two or more.
尚、重合体ブロック (bl)は、上記化合物の他に、 4ーメチルー 1, 4一へキサジェン 、 5—メチノレー 1, 4一へキサジェン、 7—メチノレー 1, 6—ォクタジェン、 1, 9ーデカジ ェン等の非共役ジェンを構成単量体単位として含有してなる重合体であってもよい。  In addition to the above compounds, the polymer block (bl) includes 4-methyl-1,4 monohexagen, 5-methinoleyl 1,4 monohexagen, 7-methylenole 1,6-octagen, 1,9-decadene. It may be a polymer containing non-conjugated gen as a constituent monomer unit.
[0035] 重合体ブロック (bl)及び (b2)の結合形態を、エステル結合、アミド結合、エーテル 結合、ウレタン結合又はイミド結合とするために、上記重合体ブロック (bl)の分子の 両末端は、カルボキシル基、ヒドロキシル基、アミノ基、酸無水物基、ォキサゾリン基、 エポキシ基等であることが好ましい。これらの官能基を付与する方法としては、熱減 成法により得られた分子末端に二重結合を有する重合体に、上記の官能基を有する 不飽和化合物を付加反応させる方法等が挙げられる。  [0035] In order to make the bonding form of the polymer blocks (bl) and (b2) an ester bond, an amide bond, an ether bond, a urethane bond or an imide bond, both ends of the molecule of the polymer block (bl) are A carboxyl group, a hydroxyl group, an amino group, an acid anhydride group, an oxazoline group, and an epoxy group. Examples of a method for imparting these functional groups include a method of subjecting a polymer having a double bond at the molecular end obtained by a thermal degradation method to an addition reaction of an unsaturated compound having the above functional group.
[0036] 上記重合体ブロック(bl)のゲルパーミエーシヨンクロマトグラフィー(GPC)によるポ ジスチレン換算の数平均分子量は、好まし <は 800〜20, 000、より好まし <は 1, 00 0〜: L0, 000、更に好まし <は 1, 200〜6, 000である。  [0036] The number average molecular weight of the above polymer block (bl) in terms of polystyrene by gel permeation chromatography (GPC) is preferably <800 to 20,000, more preferably <100 to : L0, 000, more preferred <is 1,200 to 6,000.
重合体ブロック (bl)は、上記成分 (B)中に、 1種単独でまたは 2種以上を組み合わ せて含まれてもよい。 [0037] 上記重合体ブロック (b2)は、ヒドロキシル基、アミノ基、エーテル基等の親水基を有 する重合体力 なるブロックであり、好ましくは、主鎖にエーテル結合を有する重合体 力もなるものである。この重合体としては、ポリエーテル (b2— a)、ポリエーテル含有 親水性ポリマー(b2— b)、およびァ-オン性ポリマー(b2— c)が挙げられる。 The polymer block (bl) may be contained alone or in combination of two or more in the component (B). [0037] The polymer block (b2) is a polymer-strength block having a hydrophilic group such as a hydroxyl group, an amino group, or an ether group, and preferably has a polymer force having an ether bond in the main chain. is there. Examples of the polymer include polyether (b2-a), polyether-containing hydrophilic polymer (b2-b), and eron polymer (b2-c).
ポリエーテル(b2— a)としては、ポリエーテルジオール、ポリエーテルジァミン、およ びこれらの変性物が挙げられる。  Examples of the polyether (b2-a) include polyether diol, polyether diamine, and modified products thereof.
ポリエーテル含有親水性ポリマー(b2—b)としては、ポリエーテルジオールのセグメ ントを有するポリエーテルエステルアミド、ポリエーテルジオールのセグメントを有する ポリエーテルアミドイミド、ポリエーテルジオールのセグメントを有するポリエーテルエ ステル、ポリエーテルジァミンのセグメントを有するポリエーテルアミド、および、ポリエ 一テルジオールまたはポリエーテルジァミンのセグメントを有するポリエーテルウレタ ンが挙げられる。  Examples of the polyether-containing hydrophilic polymer (b2-b) include polyether ester amide having a polyether diol segment, polyether amide imide having a polyether diol segment, polyether ester having a polyether diol segment, Polyether amides having a segment of ether diamine and polyether urethanes having a segment of polyether diol or polyether diamine.
ァ-オン性ポリマー(b2— c)としては、スルホ -ル基を有するジカルボン酸とポリェ 一テル (b2— a)とを必須構成単位とし、かつ一分子内に好ましくは 2〜80個、更に好 ましくは 3〜60個のスルホ -ル基を有するァ-オン性ポリマーが挙げられる。  The er-on polymer (b2-c) has a dicarboxylic acid having a sulfo group and a polyether (b2-a) as essential constituent units, and preferably 2 to 80 units in one molecule. Preferable examples are eron polymers having 3 to 60 sulfo groups.
これらは、直鎖状であっても、また分岐状であってよい。また、重合体ブロック (b2) は、 1種のブロックのみからなるものであってよいし、 2種以上のブロックを含むもので あってもよい。好ましい (b2)成分は、ポリエーテル (b2— a)であり、より好ましくはポリ エーテルジオール及びポリエーテルァミンであり、特に好ましくはポリエーテルジォー ルである。  These may be linear or branched. Further, the polymer block (b2) may be composed of only one type of block, or may contain two or more types of blocks. A preferred component (b2) is a polyether (b2-a), more preferably a polyether diol and a polyetheramine, and particularly preferably a polyetherdiol.
[0038] ポリエーテル(b2— a)のうちのポリエーテルジオールとしては、一般式(1):  [0038] The polyether diol in the polyether (b2-a) is represented by the general formula (1):
H- (OA1)— O— E1— O— (Α'θ) 一 Hで表されるもの、及び一般式(2): H- (OA 1 ) — O— E 1 — O— (Α′θ) i One represented by H and the general formula (2):
n n'  n n '
Η- (ΟΑ2) — Ο— Ε2— Ο— (Α20) 一 Ηで表されるもの等が挙げられる。 Η- (ΟΑ 2 ) — Ο— Ε 2 — Ο— (Α 2 0) Examples include those represented by Η.
一般式(1)中、 E1は二価の水酸基含有ィ匕合物力も水酸基を除いた残基、 A1は炭素 数 2〜4のアルキレン基、 nおよび は前記二価の水酸基含有ィ匕合物の水酸基 1個 当たりのアルキレンオキサイド付加数を表す。 n個の(OA1)と 個の(八1。)とは、同 一であっても異なっていてもよぐまた、これらが 2種以上のォキシアルキレン基で構 成される場合の結合形式はブロックもしくはランダムまたはこれらの組み合わせの ヽ ずれでもよい。 nおよび は、通常 1〜300、好ましくは 2〜250、特に好ましくは 10 〜 100の整数である。また、 nと は、同一であっても異なっていてもよい。 In the general formula (1), E 1 is a divalent hydroxyl group-containing compound, and the residue is a residue excluding the hydroxyl group, A 1 is an alkylene group having 2 to 4 carbon atoms, n and are the divalent hydroxyl group-containing groups. It represents the number of alkylene oxides added per hydroxyl group in the compound. coupling case and is of n (OA 1) and number of (eight 1.), which Yogumata be different even identical, they are made up of two or more Okishiarukiren groups The format is block or random or a combination of these Misalignment is acceptable. n and are integers of usually 1 to 300, preferably 2 to 250, particularly preferably 10 to 100. N may be the same or different.
[0039] 上記二価の水酸基含有ィ匕合物としては、一分子中にアルコール性またはフエノー ル性の水酸基を 2個含む化合物、即ち、ジヒドロキシィ匕合物が挙げられ、具体的には 、二価アルコール、二価フエノールおよび第 3級ァミノ基含有ジオール等が挙げられ る。これらは、 1種単独でまたは 2種以上を組み合わせて用いることができる。 [0039] Examples of the divalent hydroxyl group-containing compound include a compound containing two alcoholic or phenolic hydroxyl groups in one molecule, that is, a dihydroxy compound. Specifically, Examples include dihydric alcohols, dihydric phenols, and diols containing tertiary amino groups. These can be used alone or in combination of two or more.
二価アルコールとしては、脂肪族、脂環式及び芳香族のいずれでもよぐ炭素数 2 〜 12の化合物が好ましい。  The dihydric alcohol is preferably a compound having 2 to 12 carbon atoms which may be aliphatic, alicyclic or aromatic.
脂肪族二価アルコールとしては、例えば、エチレングリコール、 1, 3 プロピレング リコールなどのプロピレングリコール等のアルキレングリコール、 1, 4 ブタンジォー ル、 1, 6—へキサンジオール、 1, 9ーノナンジオール、ネオペンチルグリコール、 1, 12—ドデカンジオール等が挙げられる。  Examples of the aliphatic dihydric alcohol include ethylene glycol, alkylene glycol such as propylene glycol such as 1,3 propylene glycol, 1,4 butanediol, 1,6-hexanediol, 1,9-nonanediol, and neopentyl glycol. 1, 12-dodecanediol and the like.
脂環式二価アルコールとしては、例えば、 1, 2—および 1, 3—シクロペンタンジォ ール、 1, 2—、 1, 3 および 1, 4ーシクロへキサンジオール、 1, 4ーシクロへキサン ジメタノール等が挙げられる。  Examples of alicyclic dihydric alcohols include 1,2- and 1,3-cyclopentanediol, 1,2-, 1,3 and 1,4-cyclohexanediol, and 1,4-cyclohexane. Examples include dimethanol.
芳香族二価アルコールとしては、例えば、キシレンジオール等が挙げられる。  Examples of the aromatic dihydric alcohol include xylene diol.
二価フエノールとしては、単環二価フエノール、ビスフエノール、縮合多環二価フエ ノール等が挙げられる力 炭素数 6〜18の化合物が好ましい。  The divalent phenol is preferably a compound having 6 to 18 carbon atoms such as monocyclic divalent phenol, bisphenol, condensed polycyclic divalent phenol and the like.
単環二価フエノールとしては、ハイドロキノン、カテコール、レゾルシン、ウルシォー ル等が挙げられる。  Examples of the monocyclic divalent phenol include hydroquinone, catechol, resorcin, and urushiol.
ビスフエノールとしては、ビスフエノール A、ビスフエノール F、ビスフエノール S、 4、 4 ' ージヒドロキシジフエニル一 2, 2—ブタン、ジヒドロキシビフエニル、ジヒドロキシジフ ェ-ルエーテル等が挙げられる。  Examples of bisphenol include bisphenol A, bisphenol F, bisphenol S, 4,4′-dihydroxydiphenyl-1,2-butane, dihydroxybiphenyl, dihydroxydiphenyl ether, and the like.
縮合多環二価フエノールとしては、ジヒドロキシナフタレン、ビナフトール等が挙げら れる。  Examples of the condensed polycyclic divalent phenol include dihydroxynaphthalene and binaphthol.
更に、第 3級ァミノ基含有ジオールとしては、炭素数 1〜8の N アルキルジァルカ ノールァミン等が挙げられる。  Furthermore, examples of the tertiary amino group-containing diol include N alkyl dialkylanolamines having 1 to 8 carbon atoms.
[0040] 一般式 (2)中、 E2は、一般式(1)で記載した二価の水酸基含有ィ匕合物から水酸基 を除いた残基、 A2は、少なくとも一部が一般式(3) -CHR— CHR' (式中、 R R' の一方は、一般式 (4) CH 0 (A30) R で表される基、他方は Hである。一 In the general formula (2), E 2 represents a hydroxyl group from the divalent hydroxyl group-containing compound described in the general formula (1). The residue A 2 , except at least part of the general formula (3) —CHR—CHR ′ (wherein one of RR ′ is represented by the general formula (4) CH 0 (A 3 0) R And the other is H.
2 X  2 X
般式 (4)中、 Xは 1 10の整数、 R は Hまたは炭素数 1 10の、アルキル基、 ル基、アルキルァリール基、ァリールアルキル基またはァシル基、 A3は炭素数 2 4 のアルキレン基である。)で表される置換アルキレン基であり、残りは炭素数 2 4のァ ルキレン基であってもよい。 m個の(OA2)と 個の(A20)とは同一であっても異な つていてもよい。 mおよび は 1 300の整数であることが好ましぐ更に 2 250 特に 10〜: L00が好ましい。また mと とは、同一でも異なっていてもよい。 In general formula (4), X is 1 10 integer, R represents H or C 1 10 alkyl group, group, an alkyl § aryl group, § reel alkyl or Ashiru group, A 3 4 2 carbon atoms An alkylene group. The remaining alkylene group may be a C 24 alkyl group. The m (OA 2 ) and the (A 2 0) may be the same or different. m and are preferably integers of 1 300, more preferably 2 250, especially 10 to: L00. M may be the same as or different from m.
[0041] 上記一般式(1)で示されるポリエーテルジオールは、二価の水酸基含有化合物に アルキレンオキサイドを付加反応させることにより製造することができる。アルキレンォ キサイドとしては、炭素数 2 4のアルキレンオキサイド、例えばエチレンオキサイド、 プロピレンオキサイド、 1, 2—ブチレンオキサイド、 1, 4ーブチレンオキサイド、 2, 3 ーブチレンオキサイド、および 1, 3 ブチレンオキサイド並びにこれらの 2種以上の 併用系が用いられる。 2種以上のアルキレンオキサイドを併用するときの結合形式は ランダムおよび Ζまたはブロックの 、ずれでもよ 、。アルキレンオキサイドとして好まし いものは、エチレンオキサイド単独およびエチレンオキサイドと他のアルキレンォキサ イドとの併用によるブロックおよび Ζまたはランダム付加である。アルキレンオキサイド の付加数は、前記二価の水酸基含有化合物の水酸基 1個当たり、好ましくは 1 30 0、更に好ましくは 2 250、特に好ましくは 10〜: L00の整数である。  [0041] The polyether diol represented by the general formula (1) can be produced by addition reaction of an alkylene oxide to a divalent hydroxyl group-containing compound. Examples of the alkylene oxide include alkylene oxides having 24 carbon atoms, such as ethylene oxide, propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide, 2,3-butylene oxide, 1,3-butylene oxide, and these Two or more combined systems are used. When two or more alkylene oxides are used in combination, the bond type may be random and Ζ or block or misaligned. Preferred as alkylene oxides are block and soot or random addition with ethylene oxide alone and in combination with ethylene oxide and other alkylene oxides. The number of alkylene oxides added is preferably an integer of 1300, more preferably 2250, and particularly preferably 10 to L00 per hydroxyl group of the divalent hydroxyl group-containing compound.
[0042] 上記一般式(2)で示されるポリエーテルジオールの好ま 、製造方法としては下記 の (1)、 (II)方法等が挙げられる。  [0042] Preferable methods for producing the polyether diol represented by the general formula (2) include the following methods (1) and (II).
[0043] (I)上記二価の水酸基含有ィ匕合物を出発物質として、一般式 (5)  [0043] (I) Using the above divalent hydroxyl group-containing compound as a starting material, the compound represented by the general formula (5)
[化 5]  [Chemical 5]
C H 2— C H— C H 2— 0- (A40) p— R 1 ·' (5)
Figure imgf000018_0001
CH 2 — CH— CH 2 — 0- (A 4 0) p — R 1 · '(5)
Figure imgf000018_0001
O  O
(一般式(5)中の A4は炭素数 2 4のアルキレン基、 pは 1 10の整数、 R1は H ま たは炭素数 1 10のアルキル基、ァリール基、アルキルァリール基、ァリールアルキ ル基またはァシル基である。 ) (In formula (5), A 4 is an alkylene group having 24 carbon atoms, p is an integer of 1 10, R 1 is H or an alkyl group having 1 10 carbon atoms, an aryl group, an alkyl aryl group, an aryl alkyl group. Group or acyl group. )
で表されるグリシジルエーテルを重合、または炭素数 2〜4のアルキレンオキサイドと 共重合する方法。  A method of polymerizing glycidyl ether represented by the formula (1) or copolymerizing with an alkylene oxide having 2 to 4 carbon atoms.
[0044] (Π)上記二価の水酸基含有化合物を出発物質として、側鎖にクロロメチル基を有す るポリエーテルを経由する方法。更に具体的には、ェピクロルヒドリン、またはェピクロ ルヒドリンとアルキレンオキサイドを付加共重合し、側鎖にクロロメチル基を有するポリ エーテルを得た後、該ポリエーテルと炭素数 2〜4のポリアルキレングリコールと (R1は上記したもの、 Xは Cl、 Brまたは I)をアルカリ存在下で反応させるか、または該 ポリエーテルと炭素数 2〜4のポリアルキレングリコールモノカルビルエーテルをアル カリ存在下で反応させる方法。 [0044] (i) A method in which the above divalent hydroxyl group-containing compound is used as a starting material and a polyether having a chloromethyl group in the side chain is passed. More specifically, epichlorohydrin, or epichlorohydrin and alkylene oxide are addition-copolymerized to obtain a polyether having a chloromethyl group in the side chain, and then the polyether and a C 2-4 polyether. Alkylene glycol and (R 1 is as described above, X is Cl, Br or I) are reacted in the presence of an alkali, or the polyether and a polyalkylene glycol monocarbyl ether having 2 to 4 carbon atoms are present in the presence of alkali. How to react with.
[0045] ここで使用される炭素数 2〜4のアルキレンオキサイドとしては、前記したものが全て 使用できる。  [0045] As the alkylene oxide having 2 to 4 carbon atoms used here, all of those described above can be used.
[0046] 上記ポリエーテルジァミンは、上記一般式(1)で表された重合体にぉ 、て、ヒドロキ シル基を公知の方法によりアミノ基に置換したものを用いることができる。  [0046] As the polyether diamine, the polymer represented by the general formula (1) can be used in which a hydroxyl group is substituted with an amino group by a known method.
上記ポリエーテルアミドは、ポリアミドと、ポリエーテルジァミンとから構成されたもの である。  The polyether amide is composed of polyamide and polyether diamine.
上記ポリエーテルアミドイミドは、少なくとも 1個のイミド環を有するポリアミドイミドと、 ポリエーテルジオールと力も構成されたものである。  The polyether amide imide is composed of a polyamide imide having at least one imide ring and a polyether diol.
上記ポリエーテルエステルは、ポリエステルと、ポリエーテルジオールと力も構成さ れたものである。  The polyether ester is composed of polyester and polyether diol.
上記ポリエーテルエステルアミドは、末端にカルボキシル基を有するポリアミドと、ポ リエーテルジオールとから構成されたものである。  The polyether ester amide is composed of a polyamide having a carboxyl group at the terminal and a polyether diol.
また、上記ポリエーテルウレタンは、有機ジイソシァネートと、ポリエーテルジオール とから構成されたもの、又は、有機ジイソシァネートと、ポリエーテルジァミンと、鎖延 長剤とから構成されたものである。  The polyether urethane is composed of an organic diisocyanate and a polyether diol, or is composed of an organic diisocyanate, a polyether diamine, and a chain extender.
上記ァ-オン性ポリマー (b2— c)は、上記重合体ブロックを変性して得ることができ 、例えば、ポリエーテルジオール及び Z又はポリエーテルジァミンからなるブロックと 、スルホ二ル基を有するジカルボン酸力 なる単位とを共重合して、分子内に好ましく は 2〜80個、より好ましくは 3〜60個のスルホ -ル基を有する重合体を得ることができ る。 The arion polymer (b2-c) can be obtained by modifying the polymer block, and has, for example, a block composed of polyether diol and Z or polyether diamine and a sulfonyl group. It is preferable to copolymerize with dicarboxylic acid units. Can yield a polymer having 2 to 80, more preferably 3 to 60, sulfo groups.
[0047] 本発明の目的である制電性を更に向上させる目的から、成分 )に、アルカリ金属 およびアルカリ土類金属カゝらなる群より選ばれた少なくとも 1種の塩 (H)を含有させる ことができる。これらの成分は、成分 (B)の重合前、成分 (B)の重合時に含有させるこ ともできるし、成分 (B)の重合後に含有させることもできる。また、本発明の制電性榭 脂組成物を製造する際に配合することも、またこれらを組み合わせた方法で含有させ ることちでさる。  [0047] For the purpose of further improving the antistatic property which is the object of the present invention, the component) contains at least one salt (H) selected from the group consisting of alkali metals and alkaline earth metals. be able to. These components can be contained before polymerization of component (B), during polymerization of component (B), or after polymerization of component (B). In addition, it can be blended when the antistatic resin composition of the present invention is produced, or can be contained by a method combining these.
成分 (H)としては、リチウム、ナトリウム、カリウム等のアルカリ金属および Zまたはマ グネシゥム、カルシウム等のアルカリ土類金属の有機酸、スルホン酸、無機酸の塩、 及びハロゲンィ匕物等が挙げられる。  Component (H) includes organic acids such as alkali metals such as lithium, sodium and potassium, and alkaline earth metals such as Z, magnesium and calcium, sulfonic acids, salts of inorganic acids, and halides.
[0048] 成分 (H)の具体的な好ましい例として、塩化リチウム、塩ィ匕ナトリウム、塩ィ匕カリウム 、臭化リチウム、臭化ナトリウム、臭化カリウム等のアルカリ金属のハロゲンィ匕物;過塩 素酸リチウム、過塩素酸ナトリウム、過塩素酸カリウム等のアルカリ金属の無機酸塩、 酢酸カリウム、ステアリン酸リチウム等のアルカリ金属の有機酸塩;ォクチルスルホン 酸、ドデシルスルホン酸、テトラデシルスルホン酸、ステアリルスルホン酸、テトラコシ ルスルホン酸、 2—ェチルへキシルスルホン酸等の、アルキル基の炭素数が 8〜24 のアルキルスルホン酸のアルカリ金属塩;フエ-ルスルホン酸、ナフチルスルホン酸 等の芳香族スルホン酸のアルカリ金属塩;ォクチルフエ-ルスルホン酸、ドデシルフェ ニルスルホン酸、ジブチルフエ-ルスルホン酸、ジノユルフェ-ルスルホン酸等の、了 ルキル基の炭素数が 6〜 18のアルキルベンゼンスルホン酸のアルカリ金属塩;ジメチ ルナフチルスルホン酸、ジイソプロピルナフチルスルホン酸、ジブチルナフチルスル ホン酸等の、アルキル基の炭素数が 2〜18のアルキルナフタレンスルホン酸のアル カリ金属塩;トリフルォロメタンスルホン酸等のフッ化スルホン酸等のアルカリ金属塩 等が挙げられ、これらは、 1種単独で、または 2種以上を併用して用いることができる。 上記成分 (H)は、本発明の成分 (B)に対して、好ましくは 0. 001〜10質量%、更に 好ましくは 0. 01〜5質量%の範囲で用いることができる。  [0048] Specific preferred examples of component (H) include lithium chloride, sodium chloride, potassium salt, alkali metal halides such as lithium bromide, sodium bromide, potassium bromide; Inorganic acid salts of alkali metals such as lithium borate, sodium perchlorate and potassium perchlorate; organic acid salts of alkali metals such as potassium acetate and lithium stearate; octyl sulfonic acid, dodecyl sulfonic acid, tetradecyl sulfonic acid, stearyl Alkali metal salts of alkyl sulfonic acids having 8 to 24 carbon atoms in the alkyl group, such as sulfonic acid, tetracosyl sulfonic acid and 2-ethylhexyl sulfonic acid; aromatic sulfonic acids such as phenyl sulfonic acid and naphthyl sulfonic acid Alkali metal salts; octyl phenyl sulfonic acid, dodecyl phenyl sulfonic acid, dibutyl phenol sulfo Alkali metal salts of alkylbenzene sulfonic acids having 6 to 18 carbon atoms in the alkyl group, such as acids and dinoylphenol sulfonic acids; alkyl groups such as dimethyl naphthyl sulfonic acid, diisopropyl naphthyl sulfonic acid and dibutyl naphthyl sulfonic acid Alkali metal salts of alkyl naphthalene sulfonic acids having 2 to 18 carbon atoms; alkali metal salts such as fluorinated sulfonic acids such as trifluoromethane sulfonic acid, etc., which are used alone or in combination of two or more Can be used in combination. The component (H) can be used in an amount of preferably 0.001 to 10% by mass, more preferably 0.01 to 5% by mass, based on the component (B) of the present invention.
[0049] 本発明に係る成分 (B)は、上記の重合体ブロック (bl)及び (b2)が上記ブロック構 造(1)〜(5)等、好ましくはブロック構造(1)〜(3)に示される配列によって構成され ている。 [0049] In the component (B) according to the present invention, the polymer blocks (bl) and (b2) have the above block structure. The structures (1) to (5) are preferably constituted by the arrangements shown in the block structures (1) to (3).
重合体ブロック (bl)及び (b2)の構成割合 (bl) / (b2)は、これらの合計を 100質 量%とした場合、好ましくは、 10〜90質量%ZlO〜90質量%、より好ましくは、 20 〜80質量%Z20〜80質量%、更に好ましくは、 30〜70質量%Z30〜70質量% である。  The composition ratio (bl) / (b2) of the polymer blocks (bl) and (b2) is preferably 10 to 90% by mass, ZlO to 90% by mass, more preferably when the total of these is 100% by mass Is 20 to 80 mass% Z20 to 80 mass%, more preferably 30 to 70 mass% Z30 to 70 mass%.
上記成分 (B)力 Sブロック構造 (2)又は(3)の配列を備える場合、重合体ブロック (b 1 )及び (b2)の平均繰り返し数は、好ましくは 2〜50である。  When the component (B) force S block structure (2) or (3) is provided, the average repeat number of the polymer blocks (b 1) and (b2) is preferably 2 to 50.
また、上記成分 (B)は、上記ォレフィン重合体ブロック (bl)と親水性ポリマーブロッ ク (b2)を公知の方法で重合することによって得ることができる。例えば、重合体ブロッ ク (bl)と重合体ブロック (b2)を減圧下 200〜250°Cで重合反応を行うことにより製造 することができる。また、重合反応に際し公知の重合触媒を使用することができる。  The component (B) can be obtained by polymerizing the olefin polymer block (bl) and the hydrophilic polymer block (b2) by a known method. For example, it can be produced by polymerizing the polymer block (bl) and the polymer block (b2) at 200 to 250 ° C. under reduced pressure. A known polymerization catalyst can be used in the polymerization reaction.
[0050] また、重合反応に際し公知の重合触媒を使用することができる力 好ましいものは、 モノブチルスズオキサイド等のスズ系触媒、三酸ィ匕アンチモン、二酸化アンチモン等 のアンチモン系触媒、テトラブチルチタネート等のチタン系触媒、ジルコニウム水酸 化物、酸ィ匕ジルコニウム、酢酸ジルコ-ル等のジルコニウム系触媒、 ΠΒ族有機酸塩 触媒力 選ばれる 1種または 2種以上の組み合わせである。  [0050] In addition, the ability to use a known polymerization catalyst in the polymerization reaction is preferable. Tin-based catalysts such as monobutyltin oxide, antimony-based catalysts such as antimony trioxide and antimony dioxide, tetrabutyl titanate, and the like Titanium-based catalyst, zirconium hydroxide, zirconium-based catalyst such as zirconium oxide, zirconium acetate, and the like, Group organic acid salt Catalytic power One or a combination of two or more selected.
また、上記成分 (B)は、例えば、特開 2001— 278985号公報、特開 2003— 4899 0号公報等に記載された方法により製造することができる。  The component (B) can be produced, for example, by the method described in JP-A-2001-278985, JP-A-2003-48990, and the like.
[0051] 尚、成分 )としては、市販品を用いることができ、例えば、三洋化成社製「ペレスタ ッ卜シリーズ」の 300、 303、 230等力 子適である。  [0051] Commercially available products can be used as the component). For example, 300, 303, 230 isotonic force of “Pelestat series” manufactured by Sanyo Kasei Co., Ltd. is suitable.
[0052] 本発明の制電性榭脂組成物において、成分 (B)の含有量は、成分 (A)、成分 (B) 及び成分 (C)の合計を 100質量%とした場合、 5〜20質量%であり、好ましくは 8〜1 8質量%、更に好ましくは 8〜16質量%、特に好ましくは 10〜16質量%である。この 含有量が 5質量%未満では、制電性が劣る傾向にあり、一方、 20質量%を超えると、 成形品の表面外観が劣る傾向にある。  [0052] In the antistatic resin composition of the present invention, the content of component (B) is 5 to 5 when the total of component (A), component (B) and component (C) is 100% by mass. It is 20% by mass, preferably 8 to 18% by mass, more preferably 8 to 16% by mass, and particularly preferably 10 to 16% by mass. If the content is less than 5% by mass, the antistatic property tends to be inferior, whereas if it exceeds 20% by mass, the surface appearance of the molded product tends to be inferior.
[0053] 1 3.成分 (C)  [0053] 1 3. Ingredient (C)
本発明に係る成分 (C)は、共役ジヱンィ匕合物単位を含む重合体 (本発明では、「重 合体 (Cl)」ともいう。)および該重合体 (CI)の水素添加物 (本発明では、「重合体( C2)」ともいう。)からなる群より選ばれた少なくとも 1種の重合体である。 Component (C) according to the present invention is a polymer containing a conjugated pheny compound unit ( Also referred to as “union (Cl)”. And a hydrogenated product of the polymer (CI) (also referred to as “polymer (C2)” in the present invention).
上記重合体 (C1)は、共役ジェン化合物単位のみを含む重合体であってよいし、該 共役ジェンィ匕合物単位と芳香族ビニルイ匕合物単位とを含む重合体であってもよい。  The polymer (C1) may be a polymer containing only a conjugated diene compound unit, or a polymer containing the conjugated diene compound unit and an aromatic vinyl compound unit.
[0054] 上記共役ジェンィ匕合物単位を構成する共役ジェンィ匕合物としては、 1, 3—ブタジ ェン、イソプレン、へキサジェン、 2, 3—ジメチルー 1, 3—ブタジエン, 1, 3—ペンタ ジェン等が挙げられる。これらは、 1種単独でまたは 2種以上を組み合わせて用いる ことができる。また、これらのうち、 1, 3—ブタジエン及びイソプレンが好ましい。従つ て、上記共役ジェンィ匕合物単位のみを含む重合体 (C1)としては、ポリブタジエン、 ポリイソプレン等が挙げられる。  [0054] Conjugated Genie compounds constituting the conjugated Genie compound unit include 1,3-butadiene, isoprene, hexagen, 2,3-dimethyl-1,3-butadiene, 1,3-penta. Gen etc. are mentioned. These can be used alone or in combination of two or more. Of these, 1,3-butadiene and isoprene are preferred. Therefore, examples of the polymer (C1) containing only the above conjugated diene compound unit include polybutadiene and polyisoprene.
[0055] また、上記芳香族ビニルイ匕合物単位を構成する芳香族ビ-ルイ匕合物としては、ス チレン、 (X—メチルスチレン、ヒドロキシスチレン等が挙げられる。これらは、 1種単独 でまたは 2種以上を組み合わせて用いることができる。これらのうち、スチレン及び α ーメチルスチレンが好ましぐスチレンが特に好ましい。  [0055] Further, examples of the aromatic vinyl compound constituting the aromatic vinyl compound unit include styrene, (X-methylstyrene, hydroxystyrene, etc. These may be used alone. Alternatively, two or more types can be used in combination, and among these, styrene is preferred, with styrene and α-methylstyrene being preferred.
[0056] 上記重合体 (C1)が、共役ジェン化合物単位及び芳香族ビュル化合物単位を含 む場合、各化合物は、それぞれ、 1種単独でまたは 2種以上で含まれてよい。  [0056] When the polymer (C1) contains a conjugation compound unit and an aromatic bur compound unit, each compound may be contained singly or in combination of two or more.
上記重合体 (C1)における上記共役ジェンィ匕合物単位の含有量は、共役ジェン化 合物単位及び芳香族ビ-ルイ匕合物単位の合計を 100質量%とした場合、好ましくは 30〜95質量0 /0、より好ましくは 50〜95質量0 /0、特に好ましくは 60〜93質量%であ る。また、上記重合体 (C1)における上記芳香族ビニルイ匕合物単位の含有量は、共 役ジェンィ匕合物単位及び芳香族ビ-ルイ匕合物単位の合計を 100質量%とした場合 、好ましくは 5〜70質量%、より好ましくは 5〜50質量%、特に好ましくは 7〜40質量 %である。 The content of the conjugated conjugated compound unit in the polymer (C1) is preferably 30 to 95 when the total of the conjugated genic compound unit and the aromatic conjugated compound unit is 100% by mass. mass 0/0, more preferably 50 to 95 weight 0/0, particularly preferably Ru 60 to 93% by mass. In addition, the content of the aromatic vinyl compound unit in the polymer (C1) is preferably when the total of the synergistic pheny compound unit and the aromatic vinyl compound unit is 100% by mass. Is 5 to 70% by mass, more preferably 5 to 50% by mass, and particularly preferably 7 to 40% by mass.
尚、上記共役ジェンィ匕合物単位及び芳香族ビニルイ匕合物単位の合計量は、重合 体 (C1)を構成する全単量体単位に対して、好ましくは 80質量%以上、より好ましく は 90質量%以上である。  The total amount of the conjugated conjugated compound unit and the aromatic vinyl compound compound unit is preferably 80% by mass or more, more preferably 90%, based on all monomer units constituting the polymer (C1). It is at least mass%.
[0057] 上記重合体 (C1)が、共役ジェン化合物単位及び芳香族ビュル化合物単位を含 む場合は、該重合体 (C1)は、芳香族ビュル化合物及び共役ジェン化合物と共重合 可能な化合物力もなる他の単位を更に含んでもよい。また、この単位は、 1種単独で または 2種以上で含まれてょ 、。 [0057] When the polymer (C1) includes a conjugation compound unit and an aromatic bur compound unit, the polymer (C1) is copolymerized with the aromatic bur compound and the conjugated gen compound. It may further comprise other units that also provide possible compound power. In addition, this unit may be included alone or in combination of two or more.
[0058] 上記重合体 (C1)は、ブロック共重合体であってょ 、し、ランダム共重合体であって もよいし、更には、ランダム共重合体とブロック共重合体が混合された結合形態にな つているものでもよい。これらは、 1種単独でまたは 2種以上を組み合わせて用いるこ とができる。また、これらのうち、ブロック共重合体が好ましい。  [0058] The polymer (C1) may be a block copolymer, a random copolymer, or a bond in which a random copolymer and a block copolymer are mixed. It may be in a form. These can be used alone or in combination of two or more. Of these, block copolymers are preferred.
[0059] 上記重合体 (C1)が、共役ジェン化合物単位及び芳香族ビュル化合物単位を含 む場合は、共役ジェンィ匕合物単位から主として (全単量体単位に対して好ましくは 8 0質量%以上、より好ましくは 90質量%以上、更に好ましくは 99質量%以上)なる重 合体ブロック (cl)と、芳香族ビニルイ匕合物単位から主として (全単量体単位に対して 好ましくは 80質量%以上)なる重合体ブロック(c2)とを含むブロック共重合体が好ま しい。尚、上記の重合体ブロック(cl)及び重合体ブロック(c2)においては、それぞ れ、上記芳香族ビ-ルイ匕合物単位及び共役ジェンィ匕合物単位を含んでもょ ヽ。  [0059] When the polymer (C1) includes a conjugated gen compound unit and an aromatic bur compound unit, the conjugated gen compound unit mainly (preferably 80% by mass with respect to all monomer units). Or more, more preferably 90% by mass or more, more preferably 99% by mass or more) from the polymer block (cl) and the aromatic vinyl compound compound unit (preferably 80% by mass with respect to all monomer units). A block copolymer containing the above polymer block (c2) is preferred. The polymer block (cl) and the polymer block (c2) may include the aromatic beryl compound unit and the conjugated Jen compound unit, respectively.
[0060] 上記重合体ブロック (cl)は、通常、ビニル結合を有し、その含有量 (の合計)は、特 に限定されない。即ち、 50%以上であってよいし、 50%未満であってもよい。前者の 場合、重合体ブロック (cl)に対して、通常、 50〜95%である。後者の場合、成形品 とした場合の剛性及び透明性の調整が容易となる。  [0060] The polymer block (cl) usually has a vinyl bond, and its content (total) is not particularly limited. That is, it may be 50% or more, or less than 50%. In the former case, it is usually 50 to 95% with respect to the polymer block (cl). In the latter case, it becomes easy to adjust the rigidity and transparency of the molded product.
尚、重合体ブロック (c2)力 共役ジェン系化合物単位を含む場合には、ビュル結 合を有してもよい。  In the case where the polymer block (c2) force conjugation compound unit is included, it may have a bull bond.
[0061] 上記重合体ブロック (cl)は、特に、 2種以上の共役ジェンィ匕合物単位を含む場合 は、それらがランダム状、ブロック状及びテーパーブロック状のいずれの形態で結合 したブロックであってもよい。また、この重合体ブロック(cl)は、芳香族ビニル化合物 単位が漸増するテーパーブロックを 1〜10個の範囲で含んでもよぐ共役ジェン化合 物単位に由来するビュル結合含有量の異なる重合体ブロック等力 適宜、含まれて いてもよい。  [0061] The polymer block (cl) is a block in which the polymer block (cl) is bonded in any form of a random shape, a block shape, and a tapered block shape, particularly when two or more kinds of conjugated genie compound units are included. May be. In addition, this polymer block (cl) is a polymer block having a different bull bond content derived from a conjugation compound unit which may contain 1 to 10 taper blocks in which aromatic vinyl compound units gradually increase. Isopower may be included as appropriate.
[0062] 尚、上記重合体 (C1)は、ァニオン重合の技術分野で公知のものであり、例えば、 特公昭 47— 28915号公報、特公昭 47— 3252号公報、特公昭 48— 2423号公報、 特公昭 48— 20038号公報等に開示されている。また、テーパーブロックを有する重 合体の製造方法につ!、ては、特開昭 60— 81217号公報等に開示されて 、る。 [0062] The polymer (C1) is known in the technical field of anion polymerization. For example, JP-B 47-28915, JP-B 47-3252, JP-B 48-2423 This is disclosed in Japanese Patent Publication No. 48-20038. Also, the weight with taper block A method for producing a coalescence is disclosed in JP-A-60-81217 and the like.
[0063] 上記重合体ブロック (C1)に含まれるビュル結合量(1, 2 及び 3, 4—結合含有量 )の調整は、 N, N, Ν' , Ν,—テトラメチルエチレンジァミン、トリメチルァミン、トリェチ ルァミン、ジァゾシクロ(2, 2, 2)オクタン等のアミン類、テトラヒドロフラン、ジエチレン グリコールジメチルエーテル、ジエチレングリコールジブチルエーテル等のエーテル 類、チォエーテル類、ホスフィン類、ホスホアミド類、アルキルベンゼンスルホン酸塩、 カリウムやナトリウムのアルコキシド等を用いて行うことができる。 [0063] Adjustment of the amount of bull bonds (1, 2 and 3, 4-bond content) contained in the polymer block (C1) is N, N, Ν ', Ν, -tetramethylethylenediamine, Amines such as trimethylamine, triethylamine, diazocyclo (2, 2, 2) octane, ethers such as tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol dibutyl ether, thioethers, phosphines, phosphoamides, alkylbenzene sulfonates, potassium Or sodium alkoxide.
上記方法で重合体を得た後、カップリング剤を使用して重合体分子鎖がカップリン グ剤残基を介して延長または分岐された重合体も使用できる。ここで用いられるカツ プリング剤としては、アジピン酸ジェチル、ジビュルベンゼン、メチルジクロロシラン、 四塩化珪素、ブチルトリクロ口珪素、テトラクロ口錫、ブチルトリクロ口錫、ジメチルクロ口 珪素、テトラクロ口ゲルマニウム、 1, 2 ジブロモェタン、 1, 4 クロロメチルベンゼン 、ビス(トリクロロシリル)ェタン、エポキシ化アマ-油、トリレンジイソシァネート、 1, 2, 4 ベンゼントリイソシァネート等が挙げられる。  After obtaining a polymer by the above method, a polymer in which a polymer molecular chain is extended or branched via a coupling agent residue using a coupling agent can also be used. Coupling agents used here include jetyl adipate, dibutenebenzene, methyldichlorosilane, silicon tetrachloride, butyl trichloro silicon, tetra black tin, butyl tri black tin, dimethyl black silicon, tetra black germanium, 1 1,2 dibromoethane, 1,4 chloromethylbenzene, bis (trichlorosilyl) ethane, epoxidized amateur oil, tolylene diisocyanate, 1,2,4 benzene triisocyanate and the like.
[0064] 上記重合体 (C1)の共役ジェン化合物に由来するビニル結合量(1, 2 及び 3, 4 結合)含有量は、好ましくは 5〜80%の範囲である。上記重合体 (C1)の数平均分 子量は、好まし <は 10, 000〜1, 000, 000、更に好まし <は 20, 000〜500, 000、 更【こより好まし <ίま 20, 000〜300, 000、特【こ好まし <ίま 20, 000〜200, 000であ る。尚、この数平均分子量は、ゲルパーミエーシヨンクロマトグラフィー(GPC)による ものであり、以下も同様である。 [0064] The content of vinyl bonds (1, 2 and 3, 4 bonds) derived from the conjugation compound in the polymer (C1) is preferably in the range of 5 to 80%. The number average molecular weight of the above polymer (C1) is preferably <10,000 to 1,000,000, more preferably <20,000 to 500,000, more preferred <more 20 , 000 to 300,000, specially preferred <ί or 20,000 to 200,000. The number average molecular weight is determined by gel permeation chromatography (GPC), and the same applies to the following.
[0065] 上記重合体 (C1)として好ま ヽブロック共重合体としては、下記式 (IV)〜 (XI)で 表される構造を有する重合体が挙げられる。 [0065] Preferred examples of the block copolymer as the polymer (C1) include polymers having structures represented by the following formulas (IV) to (XI).
(C1 C2) (IV) (C 1 C 2 ) (IV)
y  y
(c1 C2) -X (V) (c 1 C 2 ) -X (V)
y  y
(C2— C1) -C2 (VI) (C 2 — C 1 ) -C 2 (VI)
z  z
(C2— C11 C12) (VII) (C 2 — C 11 C 12 ) (VII)
y  y
(c -c12) (VIII) (c -c 12 ) (VIII)
z  z
(c -c12) z -x (IX) (c12 c11 c12) , (X) (c -c 12 ) z -x (IX) (c 12 c 11 c 12 ), (X)
z,  z,
(c12 c11 c12) ,一 X (XI) (c 12 c 11 c 12 ), X (XI)
z,  z,
〔各式中、 c1は、共役ジェンィ匕合物単位のみを含む単独重合体もしくは共重合体に より構成される重合体ブロック、または、共役ジェン化合物単位を主として含み、更に 芳香族ビ-ルイ匕合物単位等を含む重合体ブロックであり、 c2は、芳香族ビニル化合 物単位を主として含む重合体ブロックであり、実質的に芳香族ビ-ルイ匕合物力 なる 重合体ブロックであれば、一部共役ジェンィ匕合物が含まれていてもよぐ好ましくは 芳香族ビュル化合物を 90質量%以上、更に好ましくは 99質量%以上含有する重合 体ブロックである。 Xはカップリング剤の残基であり、 C11は、共役ジェン化合物単位を 主として含み、ビュル結合量が 20%以上の重合体ブロックであり、 C12は、共役ジェ ン化合物単位を主として含み、ビュル結合量が 20%未満の重合体ブロックであり、 y は 1〜5の整数、 zは 1〜5の整数、 z'は 1〜5の整数である。尚、各式において、 C1が 複数ある場合は、互いに同一でも異なってもよい。 C2も同様である。〕 [In each formula, c 1 is a polymer block composed of a homopolymer or a copolymer containing only a conjugated diene compound unit or a conjugated diene compound unit, and further comprising an aromatic belief. C 2 is a polymer block mainly containing an aromatic vinyl compound unit, and if it is a polymer block substantially having an aromatic vinyl compound, Further, a polymer block containing 90% by mass or more, more preferably 99% by mass or more of an aromatic bur compound, which may contain a partially conjugated Jen compound. X is a residue of the coupling agent, C 11 is a polymer block mainly containing a conjugated gen compound unit, and a bull bond amount is 20% or more, C 12 is mainly containing a conjugated gen compound unit, It is a polymer block having a bulle bond amount of less than 20%, y is an integer of 1 to 5, z is an integer of 1 to 5, and z 'is an integer of 1 to 5. In each formula, when there are a plurality of C 1 s , they may be the same or different. C 2 is the same. ]
[0066] 上記重合体 (C1)として好ましいブロック共重合体における共役ジェンィ匕合物に由 来するビニル結合量(1, 2 及び 3, 4 結合)含有量は、好ましくは 5〜80%の範 囲であり、該ブロック共重合体の数平均分子量は、好ましくは 10, 000〜1, 000, 00 0、更【こ好まし <ίま 20, 000〜500, 000、特【こ好まし <ίま 20, 000〜300, 000であ る。上記式 (IV)〜 (XI)にお 、て、重合体ブロック c1 (c11及び c12)の数平均分子量 は、好ましくは 5, 000〜200, 000、重合体ブロック C2の数平均分子量は、好ましく は 3, 000〜150, 000である。 [0066] The content of vinyl bonds (1, 2 and 3, 4 bonds) derived from the conjugated conjugated compound in the block copolymer preferable as the polymer (C1) is preferably in the range of 5 to 80%. The number average molecular weight of the block copolymer is preferably 10,000 to 1,000,000, more preferably <20, 000 to 500,000, specially preferred < It is 20, 000 to 300, 000. In the above formulas (IV) to (XI), the number average molecular weight of the polymer block c 1 (c 11 and c 12 ) is preferably 5,000 to 200,000, and the number average of the polymer block C 2 The molecular weight is preferably 3,000 to 150,000.
上記重合体 (C1)として好ましいブロック共重合体における、芳香族ビニル化合物と 共役ジェンィ匕合物の使用割合は、芳香族ビ-ルイ匕合物 Ζ共役ジェンィ匕合物 = 10 In the block copolymer preferred as the polymer (C1), the use ratio of the aromatic vinyl compound and the conjugated genie compound is as follows: aromatic vinyl compound conjugated genie compound
〜70Ζ30〜90質量0 /0の範囲が好ましぐ更に好ましくは 15〜65Ζ35〜85質量0 /0 、特に好ましくは 20〜60Ζ40〜80質量0 /0の範囲である。 ~70Ζ30~90 mass 0/0 and more preferably the range of the preferred tool 15~65Ζ35~85 mass 0/0, and particularly preferably from 20~60Ζ40~80 mass 0/0.
上記ブロック共重合体の内、耐衝撃性の点から好ましいものは、ブロック (c2)に芳 香族ビニルイ匕合物が漸増するテーパーブロックを 1〜10個の範囲で有する重合体、 及び Z又は、カップリング処理されたラジアルブロックタイプのものである。  Among the above block copolymers, preferred from the viewpoint of impact resistance is a polymer having in the range of 1 to 10 tapered blocks in which aromatic vinyl compounds are gradually increased in block (c2), and Z or A radial block type that has been coupled.
[0067] 上記重合体 (C1)としては、市販品を用いることができ、例えば、 JSR社製「TR200 0」、「TR2500」、「TR2600」、「TR2827」(以上、商品名)等を用 ヽること力できる。 [0067] As the polymer (C1), a commercially available product can be used, for example, “TR200 manufactured by JSR Corporation. Can use "0", "TR2500", "TR2600", "TR2827" (named above, product name).
[0068] 一方、重合体 (C2)は、上記重合体 (C1)の水素添加物である。即ち、上記重合体 On the other hand, the polymer (C2) is a hydrogenated product of the polymer (C1). That is, the polymer
(C2)は、共役ジェン化合物単位に由来する炭素—炭素二重結合の少なくとも一部 が水素添加されたものである。水素添加率は、好ましくは 10〜100%、より好ましくは (C2) is obtained by hydrogenating at least a part of the carbon-carbon double bond derived from the conjugation compound unit. The hydrogenation rate is preferably 10-100%, more preferably
50〜: L00%、特に好ましくは 90〜: L00%である。 50-: L00%, particularly preferably 90-: L00%.
[0069] 上記重合体 (C2)としては、上記式 (IV)〜 (XI)で表される構造を有する重合体の 水素添加物の 1種以上を用いることができる力 水素添加前の重合体 (C1)として、 特に、式 (VI)で表される重合体が好ましぐ重合体ブロック C1中のビニル結合量が 6[0069] As the polymer (C2), a force capable of using one or more of hydrogenated polymers having the structures represented by the above formulas (IV) to (XI) can be used. Polymer before hydrogenation as (C1), in particular, a vinyl bond content of the polymer is preferably tool in the polymer block C 1 of the formula (VI) is 6
0〜 90%のものが好ましく、 70〜85 %のものが特に好まし!/、。 0 to 90% is preferable, and 70 to 85% is particularly preferable! /.
[0070] 上記重合体 (C1)への水素添カ卩は、例えば、特公昭 42— 8704号公報、特公昭 43[0070] Hydrogenation to the polymer (C1) is, for example, JP-B-42-8704, JP-B-43.
— 6636号公報、特公昭 63— 4841号公報、特公昭 63— 5401号公報、特開平 2—— 6636, JP-B 63-4841, JP-B 63-5401, JP-A-2-
133406号公報、特開平 1— 297413号公報等に開示されている公知の方法により 行うことができる。 This can be carried out by known methods disclosed in 133406, JP-A-1-297413, and the like.
[0071] 上記重合体 (C2)としては、市販品を用いることができ、例えば、 JSR社製「ダイナ口 ン 1320P」、「ダイナロン 1321P」、「ダイナロン 2324P」、「ダイナロン 6200P」、「ダイ ナロン 4400P」、「ダイナロン 4600P」、旭化成社製「タフテック H1041」(以上、商品 名)等を用いることができる。  [0071] As the polymer (C2), a commercially available product can be used. For example, “DYNALON 1320P”, “DYNARON 1321P”, “DYNARON 2324P”, “DYNARON 6200P”, “DYNARON” manufactured by JSR Corporation can be used. “4400P”, “Dynalon 4600P”, “Tuftec H1041” (trade name) manufactured by Asahi Kasei Co., Ltd., etc. can be used.
[0072] 上記成分(C)のメルトマスフローレート(ASTM D1238に準じ、温度 230°C、荷 重 2. 16kgで測定)は、上記の重合体 (C1)及び (C2)のいずれにおいても、好ましく は 0. 5〜50gZlO分、更に好ましくは l〜20gZlO分である。  [0072] The melt mass flow rate of the component (C) (measured at a temperature of 230 ° C and a load of 2.16 kg according to ASTM D1238) is preferably used in any of the polymers (C1) and (C2). Is from 0.5 to 50 gZlO, more preferably from 1 to 20 gZlO.
[0073] 上記成分 (C)としては、上記の重合体 (C1)及び (C2)を組み合わせて用いること ができる。  [0073] As the component (C), the above polymers (C1) and (C2) can be used in combination.
また、上記成分 (C)としては、上記重合体 (C2)を単独で、並びに、上記の重合体( C1)及び (C2)を組み合わせて用いることが好ま 、。好ま 、割合 (CI) / (C2)は 0〜80質量0 /oZl00〜20質量0 /0であり、より好ましくは。〜 60質量0 /oZl00〜40質 量%、更に好ましくは 0〜40質量%Z100〜60質量%である。 Further, as the component (C), it is preferable to use the polymer (C2) alone and in combination with the polymers (C1) and (C2). Preferred, fraction (CI) / (C2) is 0-80 mass 0 / OZl00~20 mass 0/0, more preferably. -60 mass 0 / oZl 00-40 mass%, more preferably 0-40 mass% Z100-60 mass%.
[0074] 本発明の制電性榭脂組成物において、成分 (C)の含有量は、成分 (A)、成分 (B) 及び成分 (C)の合計を 100質量%とした場合、 0〜50質量%であり、好ましくは 0〜4 0質量%、更に好ましくは 0〜35質量%である。この含有量が 50質量%を超えると剛 性が低下する傾向にあり、特に、粘着フィルムの支持体に用いた場合、その剛性感 に欠ける。 [0074] In the antistatic resin composition of the present invention, the content of component (C) is 0 to 0 when the total of component (A), component (B) and component (C) is 100% by mass. 50% by weight, preferably 0-4 0% by mass, more preferably 0-35% by mass. When this content exceeds 50% by mass, the rigidity tends to decrease. In particular, when used as a support for an adhesive film, the rigidity is lacking.
1 4.他の成分 1 4. Other ingredients
本発明の制電性榭脂組成物は、更に、下記成分 (E1)、成分 (E2)、成分 (E3)及 び成分 (E4)力 なる群より選ばれた少なくとも 1種の制電性改良剤 (E) (本発明にお いて「成分 (E)」ともいう)を含有したものとすることができる。これらの成分は、単独で 用いてよいし、組み合わせて用いてもよい。  The antistatic resin composition of the present invention further comprises at least one antistatic property selected from the group consisting of the following component (E1), component (E2), component (E3) and component (E4): It may contain an agent (E) (also referred to as “component (E)” in the present invention). These components may be used alone or in combination.
成分 (E1):フッ素化アルキルスルホ -ル基を備えたァ-オン部を有する塩、 成分 (E2):下記一般式 (ΧΠ)で表される単位を含む重合体、 Component (E1): a salt having a cation moiety having a fluorinated alkylsulfol group, Component (E2): a polymer containing a unit represented by the following general formula (ΧΠ),
成分 (E3):下記一般式 (ΧΙΠ)で表される単位を含むホウ素化合物、 Component (E3): a boron compound containing a unit represented by the following general formula (ΧΙΠ),
成分 (E4):非イオン性界面活性剤。 Ingredient (E4): nonionic surfactant.
[化 6]  [Chemical 6]
Figure imgf000027_0001
Figure imgf000027_0001
(式中、 R5は炭化水素基、好ましくはアルキレン基を表し、 R5'は水素原子、ハロゲン 原子又は炭化水素基を表し、 Xは水素原子、炭化水素基、ウレタン残基若しくはエス テル残基を有する炭化水素基、又は親水基、好ましくはァニオン性親水基を表し、 m は 1以上の数を表す。 ) (Wherein R 5 represents a hydrocarbon group, preferably an alkylene group, R 5 ′ represents a hydrogen atom, a halogen atom or a hydrocarbon group, X represents a hydrogen atom, a hydrocarbon group, a urethane residue or an ester residue. A hydrocarbon group having a group or a hydrophilic group, preferably an anionic hydrophilic group, and m represents a number of 1 or more.
[化 7]
Figure imgf000028_0001
[Chemical 7]
Figure imgf000028_0001
[0076] 上記のフッ素化アルキルスルホ -ル基を備えたァ-オン部を有する塩 (El) (本発 明において、「成分 (El)」ともいう。)は、フッ素化アルキルスルホ -ル基を 1以上備え てなるァ-オン部と適当なカチオン部とからなる塩を意味する。フッ素化アルキルス ルホニル基の炭素原子に結合したフッ素原子の数は、特に限定されず、 1つの炭素 原子に 1〜3のうちのいくつのフッ素原子が結合していてもよい。また、スルホ -ル基 の数も、特に限定されない。 [0076] The salt (El) having a key moiety having a fluorinated alkylsulfol group (also referred to as "component (El)" in the present invention) is a fluorinated alkylsulfol group. Means a salt composed of a cation moiety having one or more of the above and an appropriate cation moiety. The number of fluorine atoms bonded to the carbon atom of the fluorinated alkylsulfonyl group is not particularly limited, and any one of 1 to 3 fluorine atoms may be bonded to one carbon atom. Further, the number of sulfo groups is not particularly limited.
[0077] ァ-オン部中に含まれるフッ素化アルキルスルホ-ル基としては、例えば、トリフル ォロメタンスルホン酸、ペンタフルォロエタンスルホン酸などのフッ素化された低級ァ ルキルスルホ -ル基、特に、パーフルォロアルキルスルホ-ル基などが挙げられる。 成分 (E1)を構成するァ-オンとしては、トリフルォロメタンスルホン酸自体の他、ビス (トリフルォロメタンスルホ -ル)イミド、トリス(トリフルォロメタンスルホニル)メチドなど の一以上の好ましくは複数のトリフルォロメタンスルホ-ル基で水素原子が置換され たメチド、アンモニア等の誘導体が挙げられる。ァ-オン部としては、具体的には、 C F SO―、 (CF SO ) N―、 (CF SO ) C—等が挙げられる。カチオン部としては、 Li [0077] Examples of the fluorinated alkylsulfonyl group contained in the cation moiety include fluorinated lower alkylsulfol groups such as trifluoromethanesulfonic acid and pentafluoroethanesulfonic acid, in particular. And perfluoroalkylsulfol groups. The cation constituting component (E1) is preferably trifluoromethanesulfonic acid itself, one or more of bis (trifluoromethanesulfol) imide, tris (trifluoromethanesulfonyl) methide, etc. Derivatives such as methide and ammonia in which a hydrogen atom is substituted with a trifluoromethanesulfol group may be mentioned. Specific examples of the key-on portion include CFSO-, (CFSO) N-, and (CFSO) C-. As the cation part, Li
3 3 3 2 2 3 2 3 3 3 3 2 2 3 2 3
+、 Na+、 K+等のアルカリ金属イオンが挙げられ、これらのうち、 Li+が好ましい。  Alkali metal ions such as +, Na + and K + can be mentioned, and among these, Li + is preferable.
[0078] 従って、成分(E1)としては、トリフルォロメタンスルホン酸リチウム、ビス(トリフルォロ メタンスルホ -ル)イミドリチウム、ビス(トリフルォロメタンスルホ -ル)イミドナトリウム、 ビス(トリフルォロメタンスルホ -ル)イミドカリウム、トリス(トリフルォロメタンスルホ -ル) メチドリチウム、トリス(トリフルォロメタンスルホ -ル)メチドナトリウム、トリス(トリフルォ ロメタンスルホ -ル)メチドカリウム等が挙げられる。これらは、 1種単独でまたは 2種以 上を組み合わせて用いることができる。また、これらのうち、トリフルォロメタンスルホン 酸リチウム、ビス(トリフルォロメタンスルホ -ル)イミドリチウム及びトリス(トリフルォロメ タンスルホ -ル)メチドリチウムが好ま U、。 Therefore, as component (E1), lithium trifluoromethanesulfonate, bis (trifluoromethanesulfol) imide lithium, bis (trifluoromethanesulfol) imide sodium, bis (trifluoromethanesulfol) Examples include potassium imide, tris (trifluoromethanesulfol) methide lithium, tris (trifluoromethanesulfol) methide sodium, and tris (trifluoromethanesulfol) methide potassium. These can be used alone or in combination of two or more. Of these, lithium trifluoromethanesulfonate, lithium bis (trifluoromethanesulfol) imide and tris (trifluoromethyl). Tansulfol) Methidolithium is preferred.
[0079] 尚、上記成分 (E1)の使用に際しては、そのまま用いてもよぐ水、ビス〔2— (2—ブ トキシエトキシ)ェチル〕アジペート、ビス(2—ブトキシェチル)フタレート等の溶媒に 溶解させてなる溶液の形態で用いてよいし、上記成分 (B)等の、エーテル結合を有 する重合体と、予め、混合し、マスターバッチ等とした形態で用いてもよい。エーテル 結合を有する重合体の他の例としては、ポリエチレングリコール、ポリエチレンォキサ イド、ポリアミドブロック及びポリエチレングリコールブロックからなるブロック共重合体 、ポリエステルブロック及びポリエチレングリコールブロックからなるブロック共重合体 等が挙げられる。成分 (E1)を溶解する場合の濃度は、好ましくは 0. 1〜80質量%、 更に好ましくは 1〜60質量%の範囲である。  [0079] When the above component (E1) is used, it can be used as it is, dissolved in a solvent such as water, bis [2- (2-butoxyethoxy) ethyl] adipate, bis (2-butoxychetyl) phthalate, etc. It may be used in the form of a solution obtained by mixing with a polymer having an ether bond, such as the above component (B), and used in the form of a masterbatch. Other examples of the polymer having an ether bond include polyethylene glycol, polyethylene oxide, a block copolymer composed of a polyamide block and a polyethylene glycol block, and a block copolymer composed of a polyester block and a polyethylene glycol block. . When the component (E1) is dissolved, the concentration is preferably in the range of 0.1 to 80% by mass, more preferably 1 to 60% by mass.
[0080] 上記成分 (E1)は、市販品を用いることができ、例えば、溶液では、三光化学工業 社製「サンコノール 0862— 20R」、 「サンコノール 0862— 13T」、 「サンコノール 086 2— 10Τ」、「サンコノール AQ— 50Τ」(以上、商品名)等を用いることができる。また、 マスターバッチでは、三光化学工業社製「サンコノール ΤΒΧ— 25」(商品名)等を用 いることがでさる。  [0080] As the component (E1), a commercially available product can be used. For example, in the solution, “Sanconol 0862-20R”, “Sanconol 0862-13T”, “Sanconol 086 2-10—” manufactured by Sanko Chemical Co., Ltd. “Sanconol AQ—50Τ” (above, trade name) can be used. In the master batch, “Sanconol ΤΒΧ-25” (trade name) manufactured by Sanko Chemical Industry Co., Ltd. can be used.
上記成分 (E1)は、 1種単独でまたは 2種以上を組み合わせて用いることができる。  The component (E1) can be used alone or in combination of two or more.
[0081] 成分 (Ε)として、成分 (E1)を単独で用いる場合、本発明の制電性榭脂組成物にお ける成分 (Ε)の含有量は、成分 (A)、 (Β)及び (C)の合計を 100質量部とした場合、 好ましくは 0. 01〜30質量部であり、より好ましくは 0. 01〜20質量部、更に好ましく は 0. 1〜10質量部、特に好ましくは 0. 1〜5質量部である。この成分 (E1)の含有量 が多すぎると、成形品外観が劣る場合があり、少なすぎると、制電性改良効果が十分 でない場合がある。 [0081] When component (E1) is used alone as component (Ε), the content of component (Ε) in the antistatic resin composition of the present invention is such that components (A), (Β) and When the total of (C) is 100 parts by mass, it is preferably 0.01-30 parts by mass, more preferably 0.01-20 parts by mass, still more preferably 0.1-10 parts by mass, particularly preferably 0.1 to 5 parts by mass. If the content of this component (E1) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
[0082] 上記一般式 (XII)で表される単位を含む重合体 (Ε2) (本発明では、「成分 (Ε2)」と もいう。)は、該単位を、好ましくは 10〜: LOO質量0 /0、より好ましくは 20〜: LOO質量% 、更に好ましくは 30〜: LOO質量%含む重合体である。この単位の割合が少ない場合 には、制電性の十分な改良が発揮されにくぐ強度等の物性が低下する場合がある 尚、上記単位は、成分 (Ε2)を構成する重合体に少なくとも 2個以上、好ましくは 3 30個含有されて 、ることが好まし 、。 [0082] The polymer (Ε2) (also referred to as “component (Ε2)” in the present invention) containing the unit represented by the above general formula (XII) is preferably 10 to: LOO mass. 0/0, more preferably. 20 to: LOO wt%, more preferably 30: a polymer containing LOO mass%. When the proportion of these units is small, sufficient improvement in antistatic properties may be exerted, and physical properties such as strength that may be difficult to decrease may be deteriorated. The above units are at least 2 in the polymer constituting the component (Ε2). More than 1, preferably 3 It is preferable to contain 30 pieces.
[0083] 上記一般式 (XII)において、 R5は炭化水素基である力 好ましくは炭素数 2 4の アルキレン基であり、特に好ましくは、エチレン基である。 In the above general formula (XII), R 5 is a hydrocarbon group, preferably an alkylene group having 24 carbon atoms, and particularly preferably an ethylene group.
上記一般式 (XII)において、 R5'は、水素原子、ハロゲン原子又は炭化水素基であ る。ハロゲン原子としては、塩素原子、臭素原子、ヨウ素原子等が挙げられる。また、 炭化水素基としては、アルキル基、ァルケ-ル基、ァリール基、シクロアルキル基、シ クロアルケニル基等が挙げられる。これらの基の炭素数は、いずれも、特に限定され ない。 In the above general formula (XII), R 5 ′ is a hydrogen atom, a halogen atom or a hydrocarbon group. Examples of the halogen atom include a chlorine atom, a bromine atom and an iodine atom. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, and a cycloalkenyl group. There are no particular limitations on the number of carbon atoms in these groups.
[0084] アルキル基としては、メチル基、ェチル基、 n—プロピル基、イソプロピル基、 n—ブ チル基、イソブチル基、 sec ブチル基、 t ブチル基、 n ペンチル基、イソペンチ ノレ基、 sec ペンチノレ基、 t ペンチノレ基、 n—へキシノレ基、 sec へキシノレ基、 n— ヘプチル基、 sec へプチル基、 n—ォクチル基、 2—ェチルへキシル基、 sec オタ チル基、 n—ノ-ル基、 sec ノ-ル基、 n—デシル基、 sec デシル基、 n—ゥンデシ ル基、 sec ゥンデシル基、 n—ドデシル基、 sec ドデシル基、 n トリデシル基、イソ トリデシル基、 sec トリデシル基、 n—テトラデシル基、 sec—テトラデシル基、 n キサデシル基、 sec へキサデシル基、ステアリル基、ィコシル基、ドコシル基、テトラ コシル基、トリアコンシル基、 2—ブチルォクチル基、 2—ブチルデシル基、 2—へキシ ルォクチル基、 2—へキシルデシル基、 2—ォクチルデシル基、 2—へキシルドデシ ル基、 2—オタチルドデシル基、 2—デシルテトラデシル基、 2—ドデシルへキサデシ ル基、 2—へキサデシルォクタデシル基、 2—テトラデシルォクタデシル基、モノメチ ル分枝—イソステアリル基等が挙げられる。  [0084] Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec butyl group, a tbutyl group, an n pentyl group, an isopentinole group, and a sec pentinole group. , T pentinole group, n-hexenole group, sec hexinole group, n-heptyl group, sec heptyl group, n-octyl group, 2-ethyl hexyl group, sec octyl group, n-nor group, sec-nor group, n-decyl group, sec-decyl group, n-undecyl group, sec undecyl group, n-dodecyl group, sec dodecyl group, n tridecyl group, isotridecyl group, sec tridecyl group, n-tetradecyl group , Sec-tetradecyl group, n-xadecyl group, sec-hexadecyl group, stearyl group, icosyl group, docosyl group, tetracosyl group, triaconsyl group, 2-butyloctyl group, 2-butyldecyl group Group, 2-hexyloctyl group, 2-hexyldecyl group, 2-octyldecyl group, 2-hexyldecyl group, 2-octyldodecyl group, 2-decyltetradecyl group, 2-dodecylhexadecyl group, 2 —Hexadecyloctadecyl group, 2-tetradecyloctadecyl group, monomethyl branched-isostearyl group, and the like.
[0085] ァルケ-ル基としては、ビュル基、ァリル基、プロべ-ル基、ブテュル基、イソブテ- ル基、ペンテ-ル基、イソペンテ-ル基、へキセ-ル基、ヘプテュル基、オタテュル 基、ノネニル基、デセニル基、ゥンデセニル基、ドデセニル基、テトラデセニル基、ォ レイル基等が挙げられる。  [0085] Examples of the alkenyl group include a butyl group, a allyl group, a probe group, a butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptul group, and an otatur group. Group, nonenyl group, decenyl group, undecenyl group, dodecenyl group, tetradecenyl group, and oleyl group.
[0086] ァリール基としては、フエニル基、トルィル基、キシリル基、タメ-ル基、メシチル基、 ベンジル基、フエネチル基、スチリル基、シンナミル基、ベンズヒドリル基、トリチル基、 ェチルフエ-ル基、プロピルフエ-ル基、ブチルフエ-ル基、ペンチルフエ-ル基、へ キシルフエ-ル基、ヘプチルフエ-ル基、ォクチルフエ-ル基、ノ-ルフエ-ル基、デ シルフヱニル基、ゥンデシルフヱニル基、ドデシルフヱニル基、フヱニルフヱニル基、 ベンジルフエ-ル基、スチレン化フエ-ル基、 p タミルフエ-ル基、ジノ-ルフエ-ル 基、 0C ナフチル基、 β ナフチル基等が挙げられる。 [0086] As the aryl group, a phenyl group, a tolyl group, a xylyl group, a tertyl group, a mesityl group, a benzyl group, a phenethyl group, a styryl group, a cinnamyl group, a benzhydryl group, a trityl group, an ethylphenol group, a propylphenol group, Group, butylphenol group, pentylphenol group, Xylphenyl, heptylphenyl, octylphenyl, norphenyl, decylphenyl, undecylphenyl, dodecylphenyl, phenylphenyl, benzylphenol, styrenated Group, p-taylphenol group, dinol-phenol group, 0C naphthyl group, β-naphthyl group and the like.
[0087] シクロアルキル基としては、シクロペンチル基、シクロへキシル基、シクロへプチル基 、メチルシクロペンチル基、メチルシクロへキシル基、メチルシクロへプチル基等が挙 げられる。  [0087] Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a methylcyclopentyl group, a methylcyclohexyl group, and a methylcycloheptyl group.
シクロアルケ-ル基としては、シクロペンテ-ル基、シクロへキセニル基、シクロヘプ テュル基、メチルシクロペンテ-ル基、メチルシクロへキセ-ル基、メチルシクロヘプ テニル基等が挙げられる。  Examples of the cycloalkenyl group include a cyclopentyl group, a cyclohexenyl group, a cycloheptyl group, a methylcyclopentyl group, a methylcyclohexyl group, and a methylcycloheptenyl group.
[0088] R5'としては、榭脂との混和性や相溶性の面から、水素原子、ハロゲン原子、及び 炭素数 1〜36の炭化水素基が好ましぐ水素原子、塩素原子、臭素原子、炭素数 1 〜24のアルキル基、及び炭素数 2〜24のァリール基がより好ましい。 [0088] R 5 'is preferably a hydrogen atom, a chlorine atom, or a bromine atom, which is preferably a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 36 carbon atoms from the viewpoint of miscibility with and compatibility with resin. More preferred are alkyl groups having 1 to 24 carbon atoms and aryl groups having 2 to 24 carbon atoms.
[0089] 上記一般式 (XII)にお 、て、 Xは、水素原子、炭化水素基、ウレタン残基若しくはェ ステル残基を有する炭化水素基、又は親水基 (例えばァニオン性親水基)である。 炭化水素基としては、上記の R5'として説明した炭化水素基を適用することができる 。即ち、アルキル基、ァルケ-ル基、ァリール基、シクロアルキル基、シクロアルケ- ル基等が挙げられる。これらのうち、炭素数 1〜6のアルキル基が好ましぐ炭素数 1 〜4のアルキル基が最も好まし 、。 [0089] In the above general formula (XII), X is a hydrogen atom, a hydrocarbon group, a hydrocarbon group having a urethane residue or an ester residue, or a hydrophilic group (for example, an anionic hydrophilic group). . As the hydrocarbon group, the hydrocarbon group described above as R 5 ′ can be applied. That is, an alkyl group, an alkyl group, an aryl group, a cycloalkyl group, a cycloalkenyl group and the like can be mentioned. Of these, alkyl groups having 1 to 4 carbon atoms are preferred, and alkyl groups having 1 to 4 carbon atoms are most preferred.
[0090] ウレタン残基は、モノイソシァネート中のイソシァネート基が反応した後の原子団を 意味する。上記モノイソシァネートとしては、メチルイソシァネート、ェチルイソシァネ ート、プロピルイソシァネート、ブチルイソシァネート、へキシルイソシァネート、ォクチ ルイソシァネート、ラウリルイソシァネート、ォクタデシルイソシァネート、シクロへキシ ルイソシァネート、フエ二ルイソシァネート、トリレンイソシァネート、ォレイルイソシァネ ート等が挙げられる。  [0090] The urethane residue means an atomic group after the isocyanate group in the monoisocyanate has reacted. Examples of the monoisocyanate include methyl isocyanate, ethyl isocyanate, propyl isocyanate, butyl isocyanate, hexyl isocyanate, octyl isocyanate, lauryl isocyanate, octadecyl isocyanate, cyclohexane. Examples include xyl isocyanate, phenyl isocyanate, tolylene isocyanate, and oleyl isocyanate.
[0091] エステル残基を有する炭化水素基におけるエステル基としては、ァセチル基、プロ ピオニル基、プチリル基、イソプチリル基、バレリル基、イソバレリル基、ビバリル基、ラ ゥロイル基、ミリストイル基、ノ レミトイル基、ステアロイル基、ベへ-ル基、ァクロィル 基、プロピオロイル基、メタクロィル基、クロトノィル基、ォレイロイル基、ベンゾィル基、 フタロイル基、スクシニル基等が挙げられる。 [0091] Examples of the ester group in the hydrocarbon group having an ester residue include a acetyl group, propionyl group, petityl group, isoptylyl group, valeryl group, isovaleryl group, bivalyl group, lauroyl group, myristoyl group, noremitoyl group, Stearoyl group, behyl group, acryl Group, propioroyl group, methacrylyl group, crotonol group, oleiroyl group, benzoyl group, phthaloyl group, succinyl group and the like.
[0092] ァ-オン性親水基としては、アルキルスルホン酸基 C H SO M (kは2〜4の整 k 2k 3  [0092] As the ionic hydrophilic group, an alkylsulfonic acid group C H SO M (k is an integer of 2 to 4 k 2k 3
数である。)、サルフェート基— SO M、ホスフェート基— PO M、メチルカルボキシ  Is a number. ), Sulfate group—SO M, phosphate group—PO M, methylcarboxy
3 3 2  3 3 2
レート基 CH COOM等が挙げられる。  Rate group CH COOM and the like.
2  2
尚、各基において、 Mは、水素原子、金属原子又はアンモ-ゥム (4級アンモ-ゥム を含む)である。  In each group, M is a hydrogen atom, a metal atom, or ammonia (including quaternary ammonia).
[0093] Mが金属原子である場合、リチウム、ナトリウム、カリウム等のアルカリ金属原子;マ グネシゥム、カルシウム等のアルカリ土類金属原子 (但し、アルカリ土類金属原子は 通常 2価であるから、 1Z2)等が挙げられる。これらのうち、ナトリウム及びカリウムが 好ましい。  [0093] When M is a metal atom, an alkali metal atom such as lithium, sodium or potassium; an alkaline earth metal atom such as magnesium or calcium (however, since the alkaline earth metal atom is usually divalent, 1Z2 ) And the like. Of these, sodium and potassium are preferred.
また、 Mがアンモ-ゥムである場合、その形成物質として、アンモニア、メチルァミン 、ジメチルァミン、ェチルァミン、ジェチルァミン、 (イソ)プロピルァミン、ジ (イソ)プロ ピルァミン、モノエタノールァミン、 N メチルモノエタノールァミン、 N ェチルェタノ ールァミン、ジエタノールァミン、トリエタノールァミン、モルホリン、モノプロパノールァ ミン、ジプロパノールァミン、トリプロパノールァミン、 2 アミノー 2—メチルー 1, 3— プロパンジオパール、アミノエチルエタノールァミン、 N, N, Ν' , Ν,一テトラキス(2 ーヒドロキシプロピル)エチレンジァミン等が挙げられる。  In addition, when M is ammonia, its forming substances are ammonia, methylamine, dimethylamine, ethylamine, jetylamine, (iso) propylamine, di (iso) propylamine, monoethanolamine, N methylmonoethanolamine. N ethyl etheramine, diethanolamine, triethanolamine, morpholine, monopropanolamine, dipropanolamine, tripropanolamine, 2 amino-2-methyl-1,3-propanediopearl, aminoethylethanolamine, N, N, Ν ', Ν, monotetrakis (2-hydroxypropyl) ethylenediamine, and the like.
[0094] 上記一般式 (XII)において、 mは 1以上の数であり、好ましくは 1〜300、より好まし く ίま 1〜200、更に好ましく ίま 5〜: L00である。  In the above general formula (XII), m is a number of 1 or more, preferably 1 to 300, more preferably 1 to 200, and still more preferably 5 to L00.
[0095] 上記成分 (Ε2)としては、フ ノール又は置換基を有するフ ノールとホルムアルデ ヒドとの脱水縮合物のアルキレンオキサイド付加物(N1)カゝらなる単位;この化合物( N1)のアルキレンオキサイド鎖の末端を炭化水素基でエーテルィ匕したィ匕合物 (Ν2) 力もなる単位;前記化合物 (N1)のアルキレンオキサイド鎖の末端をイソシァネート基 若しくはエステル基を有する炭化水素基で置換した化合物 (Ν3)力もなる単位;前記 化合物 (N1)のアルキレンオキサイド鎖の末端にァ-オン性親水基 (スルホン酸基、 サルフェート基、ホスフェート基、カルボキシレート基等)を導入したィ匕合物(Ν4)から なる単位等の 1種以上を含む重合体等が挙げられる。 尚、上記化合物 (Nl)の形成に際し、フエノール又は置換基を有するフエノールと 共縮合可能な化合物、例えば、レゾルシン、カテコール、ハイドロキノン、ァ-ソール 等を併用してもよい。 [0095] The component (Ε2) includes a unit consisting of alkylene oxide adduct (N1) of dehydration condensate of phenol or a phenol having a substituent and a formaldehyde; alkylene oxide of this compound (N1) Compound obtained by etherification of the chain end with a hydrocarbon group () 2) Unit also having a force; Compound (N3) wherein the end of the alkylene oxide chain of the compound (N1) is substituted with a hydrocarbon group having an isocyanate group or an ester group (Ν3 From the compound (Ν4) in which a terionic hydrophilic group (sulfonic acid group, sulfate group, phosphate group, carboxylate group, etc.) is introduced at the end of the alkylene oxide chain of the compound (N1) And polymers containing one or more of the above units. In the formation of the compound (Nl), a compound that can be co-condensed with phenol or a phenol having a substituent, for example, resorcin, catechol, hydroquinone, and azole may be used in combination.
従って、上記化合物 (N1)〜 (N4)のうちの 1種以上を反応させて得られた重合体 を上記成分 (E2)として用いることができる。  Therefore, a polymer obtained by reacting one or more of the compounds (N1) to (N4) can be used as the component (E2).
[0096] また、上記化合物 (N1)の形成に際し、フエノール又は置換基を有するフエノール に、エチレンオキサイド、プロピレンオキサイド、ブチレンオキサイド、テトラヒドロフラン (1, 4ーブチレンオキサイド)、長鎖 a一才レフインオキサイド、スチレンオキサイド等 のアルキレンオキサイド等を付加重合する力 このアルキレンオキサイド等を付加重 合することによって、上記一般式 (XII)で表された、(R5— O) の部分を形成する場 合は、付加させるアルキレンオキサイド等の種類により(R5— Ο)の種類が決定される 。付加されるアルキレンォキシド等の重合形態は、特に限定されず、 1種類のアルキ レンオキサイド等の単独重合、 2種類以上のアルキレンオキサイド等のランダム共重 合、ブロック共重合又はランダム Zブロック共重合等のいずれであってもよい。 (R5- O) の部分がポリアルキレンオキサイドである場合は、 R5は、好ましくは炭素数 2〜4 のアルキレン基、特に好ましくはエチレン基である。また、(R5— Ο) の部分が 2種類 以上のアルキレンオキサイド等の共重合により形成される場合は、そのうちの一種は エチレンオキサイドであることが好ましい。このときの mは、好ましくは 1〜300であり、 より好ましくは 1〜200、更に好ましくは 5〜: L00である。 [0096] Further, in the formation of the above compound (N1), phenol or a phenol having a substituent may be substituted with ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran (1, 4-butylene oxide), long chain a one-year-old refin oxide. The ability of addition polymerization of alkylene oxides such as styrene oxide, etc. When the (R 5 — O) part represented by the above general formula (XII) is formed by addition polymerization of alkylene oxides, etc. The type of (R 5 — Ο) is determined by the type of alkylene oxide to be added. The form of polymerization of added alkylene oxide or the like is not particularly limited, and homopolymerization of one type of alkylene oxide or the like, random copolymerization of two or more types of alkylene oxide, block copolymerization, or random Z block copolymerization. Any of these may be used. When the moiety (R 5 -O) is a polyalkylene oxide, R 5 is preferably an alkylene group having 2 to 4 carbon atoms, particularly preferably an ethylene group. When the (R 55 ) moiety is formed by copolymerization of two or more types of alkylene oxides, one of them is preferably ethylene oxide. In this case, m is preferably 1 to 300, more preferably 1 to 200, still more preferably 5 to: L00.
[0097] また、上記化合物 (N4)は、化合物 (N1)の末端 (通常、ヒドロキシル基)の一部又 は全部に対し、上記例示したァ-オン性親水基を有する化合物を用いて、公知の方 法で反応させること〖こより得ることができる。  [0097] Further, the compound (N4) is publicly known by using a compound having a terionic hydrophilic group exemplified above for part or all of the terminal (usually a hydroxyl group) of the compound (N1). The reaction can be obtained from this method.
[0098] 上記成分 (E2)は、市販品を用いることができ、例えば、旭電化工業社製「アデカノ ール AS— 113」(商品名)等を用いることができる。  As the component (E2), a commercially available product can be used. For example, “Adecanol AS-113” (trade name) manufactured by Asahi Denka Kogyo Co., Ltd. can be used.
上記成分 (E2)は、 1種単独でまたは 2種以上を組み合わせて用いることができる。  The component (E2) can be used alone or in combination of two or more.
[0099] 成分 (E)として、成分 (E2)を単独で用いる場合、本発明の制電性榭脂組成物にお ける成分 (E)の含有量は、成分 (A)、 (B)及び (C)の合計を 100質量部とした場合、 好ましくは 0. 01〜30質量部であり、より好ましくは 0. 1〜30質量部、更に好ましくは 1〜25質量部、特に好ましくは 3〜20質量部である。この成分 (E2)の含有量が多す ぎると、成形品外観が劣る場合があり、少なすぎると、制電性改良効果が十分でない 場合がある。 [0099] When component (E2) is used alone as component (E), the content of component (E) in the antistatic resin composition of the present invention is such that components (A), (B) and When the total of (C) is 100 parts by mass, it is preferably 0.01-30 parts by mass, more preferably 0.1-30 parts by mass, and still more preferably 1 to 25 parts by mass, particularly preferably 3 to 20 parts by mass. If the content of this component (E2) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
[0100] 上記一般o (ΧΙΠ)で表される単位を含むホウ素化合物 (E3) (本発明にお 、て、「 成分 (E3)」ともいう。)は、該単位を、好ましくは 90〜: LOO質量%、より好ましくは 95 〜100質量%、更に好ましくは 98〜: LOO質量%含む化合物である。  [0100] The boron compound (E3) (also referred to as "component (E3)" in the present invention) containing the unit represented by the above general o (ΧΙΠ) is preferably represented by 90 to: LOO mass%, more preferably 95-100 mass%, still more preferably 98-: a compound containing LOO mass%.
尚、成分 基  In addition, component basis
(E3)は、上記単位を少なくとも 5個以上含有した高分子化合物であること が好ましい。  (E3) is preferably a polymer compound containing at least 5 units.
[0101] 上記一般式 (ΧΙΠ)で表される単位を含む化合物としては、下記一般式 (XIV)で表 されるような、半極性有機ホウ素高分子化合物と、ヒドロキシル基を有する合計炭素 数 5〜82の第 3級ァミンの 1種又は 2種以上との、ホウ素原子 1個対塩基性窒素原子 1個の割合の反応生成物である高分子電荷移動型結合体であることが好ましい。  [0101] Examples of the compound containing the unit represented by the general formula (ΧΙΠ) include a semipolar organic boron polymer compound represented by the following general formula (XIV) and a total number of carbon atoms having a hydroxyl group of 5 It is preferably a polymer charge transfer conjugate which is a reaction product of one boron atom to one basic nitrogen atom with one or more of ~ 82 tertiary amines.
[化 8]  [Chemical 8]
Figure imgf000034_0001
Figure imgf000034_0001
〔式中、 qは、 0又は 1であり、 q= lのとき、 Tは、 - (Τ1) - (Τ — (但し、 Τ1 及び Τ3は、互いに同一又は異なって、 1つの末端エーテル残基を有し且つ炭素数の 合計が 100以下の含酸素炭化水素基であり、 Τ2は、 [Wherein q is 0 or 1 and when q = l, T is-(Τ 1 )-(-— (where 但1 and Τ 3 are the same or different from each other, and the total number of carbon atoms having an ether residue is 100 less oxygenated hydrocarbon radical, T 2 is
[化 9]
Figure imgf000034_0002
[Chemical 9]
Figure imgf000034_0002
(但し、 R9は、炭素数 1から 82の炭化水素基である。 ) 又は、 (However, R 9 is a hydrocarbon group having 1 to 82 carbon atoms.) Or
[化 o 10]  [Chemical o 10]
-  -
NHI 一基 One NHI
〔但し、 R1Uは、炭素数 2 NHI〜 13の炭化水素基である。)であり、 s、 t及び uは、それぞれ[However, R 1U is a hydrocarbon group having 2 to 13 carbon atoms. ), S, t and u are respectively
、 0又は 1である。)であり、 R6、 R7及び R8は、互いに同一又は異なる有機基であり、 r は、 10〜: L 000である。〕 , 0 or 1. R 6 , R 7 and R 8 are the same or different organic groups, and r is 10 to: L 000. ]
[0102] 上記一般式 (XIV)における 、 R7及び R8としては、炭化水素基、アルコキシ基、フ エノキシ基、ベンジロキシ基、アルキレングリコール基等が挙げられる。これらの基は、 ヒドロキシル基等の官能基を有してもょ 、し、置換基を有してもよ 、。 In the above general formula (XIV), examples of R 7 and R 8 include a hydrocarbon group, an alkoxy group, a phenoxy group, a benzyloxy group, and an alkylene glycol group. These groups may have a functional group such as a hydroxyl group, or may have a substituent.
[0103] 上記電荷移動型結合体としては、下記化学式 (XV)〜 (XXII)で表される結合体力 挙げられる。尚、下記の各化学式において、末端の炭素原子及び酸素原子には、通 常、それぞれ、水素原子又はヒドロキシル基が結合している。 [0103] Examples of the charge transfer-type conjugate include conjugate forces represented by the following chemical formulas (XV) to (XXII). In the following chemical formulas, a terminal carbon atom and oxygen atom are usually bonded to a hydrogen atom or a hydroxyl group, respectively.
[化 11]  [Chemical 11]
Figure imgf000035_0001
Figure imgf000035_0001
[化 12]
Figure imgf000036_0001
[Chemical 12]
Figure imgf000036_0001
〔式中、 R' は、 平均重合度 20のポリブテンの残基である。〕 [Wherein R ′ is a residue of polybutene having an average degree of polymerization of 20. ]
[化 13][Chemical 13]
Figure imgf000036_0002
Figure imgf000036_0002
[化 14][Chemical 14]
Figure imgf000036_0003
Figure imgf000036_0003
[化 15] m
Figure imgf000037_0001
[Chemical 15] m
Figure imgf000037_0001
urn
Figure imgf000037_0002
Figure imgf000037_0003
urn
Figure imgf000037_0002
Figure imgf000037_0003
SZ90£/900Zd /lDd 9£ 0I/900Z OAV
Figure imgf000038_0001
SZ90 £ / 900Zd / lDd 9 £ 0I / 900Z OAV
Figure imgf000038_0001
[0104] 上記高分子電荷移動型結合体は、特許第 2573986号公報に記載された方法等 により製造することができる。 [0104] The polymer charge-transfer conjugate can be produced by the method described in Japanese Patent No. 2573986.
尚、成分 (E3)としては、市販品を用いることができ、例えば、ボロンインターナショ ナル社製「ノヽイボロン 400N」(商品名)等が好適である。  As the component (E3), a commercially available product can be used. For example, “NOI BORON 400N” (trade name) manufactured by Boron International Co., Ltd. is preferable.
[0105] 上記成分 (E3)は、組成物の製造の際に、単独で配合してよいし、上記の成分 (A) 、成分 (B)、成分 (C)等とからなる混合物 (組成物)として配合することもできる。後者 の例としては、ポリエチレンをマトリックスとしたマスターバッチである、ボロンインター ナショナル社製「ノヽイボロン MB400N— 8LDPE」(商品名)等が挙げられる。  [0105] The above component (E3) may be blended alone in the production of the composition, or a mixture (composition) comprising the above component (A), component (B), component (C) and the like. ). An example of the latter is “NOBOLON MB400N-8LDPE” (trade name) manufactured by Boron International, Inc., which is a master batch using polyethylene as a matrix.
上記成分 (E3)は、 1種単独でまたは 2種以上を組み合わせて用いることができる。  The component (E3) can be used alone or in combination of two or more.
[0106] 成分 (E)として、成分 (E3)を単独で用いる場合、本発明の制電性榭脂組成物にお ける成分 (E3)の含有量は、成分 (A)、成分 (B)及び成分 (C)の合計を 100質量部と した場合、好ましくは 0. 01〜30質量部であり、より好ましくは 0. 05〜20質量部、更 に好ましくは 0. 1〜: LO質量部、特に好ましくは 0. 3〜5質量部である。この成分 (E3 )の含有量が多すぎると、成形品外観が劣る場合があり、少なすぎると、制電性改良 効果が十分でな 、場合がある。  [0106] When component (E3) is used alone as component (E), the content of component (E3) in the antistatic resin composition of the present invention is such that component (A), component (B) And when the total of component (C) is 100 parts by mass, it is preferably 0.01 to 30 parts by mass, more preferably 0.05 to 20 parts by mass, and even more preferably 0.1 to: part by mass of LO. Particularly preferred is 0.3 to 5 parts by mass. If the content of this component (E3) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
[0107] 上記の非イオン系界面活性剤 (E4) (本発明にお 、て、「成分 (E4)」とも 、う。 )とし ては、多価アルコールのエステル、含窒素化合物等が挙げられる。  [0107] Examples of the nonionic surfactant (E4) (also referred to as "component (E4)" in the present invention) include esters of polyhydric alcohols, nitrogen-containing compounds, and the like. .
[0108] 多価アルコールのエステルとしては、グリセリンエステル、ポリグリセリンエステル、ソ ノレビタンエステノレ、エチレングリコールエステル、プロピレングリコールエステル等が 挙げられる。 グリセリンエステルとしては、グリセリンモノラウレート、グリセリンモノミリステート、ダリ セリンモノパルミテート、グリセリンモノステアレート、グリセリンモノべへネート、グルセ リンモノォレート等が挙げられる。 [0108] Examples of the ester of the polyhydric alcohol include glycerin ester, polyglycerin ester, sonorevitane ester, ethylene glycol ester, propylene glycol ester and the like. Examples of the glycerin ester include glycerin monolaurate, glycerin monomyristate, daricerine monopalmitate, glycerin monostearate, glycerin monobehenate, and glycerin monooleate.
ポリグリセリンエステルとしては、ジグリセリンモノラウレート、ジグリセリンモノミリステ ート、ジグリセリンモノパルミテート、ジグリセリンモノステアレート、ジグリセリンモノべ へネート、ジグリセリンモノォレート等が挙げられる。  Examples of the polyglycerol ester include diglycerol monolaurate, diglycerol monomyristate, diglycerol monopalmitate, diglycerol monostearate, diglycerol monobenzoate, and diglycerol monooleate.
[0109] ソルビタンエステルとしては、ソルビタンモノォレエート、ソルビタンモノべへネート、 ソルビタンモノステアレート、ソルビタンモノイソステアレート、ソルビタンモノラウレート 、ソルビタンモノパルミテート等が挙げられる。  [0109] Examples of sorbitan esters include sorbitan monooleate, sorbitan monobehenate, sorbitan monostearate, sorbitan monoisostearate, sorbitan monolaurate, sorbitan monopalmitate, and the like.
エチレングリコールエステルとしては、モノステアリン酸エチレングリコール等が挙げ られる。  Examples of the ethylene glycol ester include ethylene glycol monostearate.
また、プロピレングリコールエステルとしては、モノステアリン酸プロピレングリコール 等が挙げられる。  Examples of the propylene glycol ester include propylene glycol monostearate.
これらのうち、グリセリンモノステアレート、ジグリセリンモノステアレート、グリセリンモ ノラウレート、ジグリセリンモノラウレート及びソルビタンモノステアレートが好ましい。  Of these, glycerol monostearate, diglycerol monostearate, glycerol monolaurate, diglycerol monolaurate and sorbitan monostearate are preferred.
[0110] 含窒素化合物としては、ァミン化合物、アミドィ匕合物等が挙げられる。 [0110] Examples of nitrogen-containing compounds include ammine compounds and amido compounds.
ァミン化合物としては、ラウリルジエタノールァミン、ミリスチルジエタノールァミン、パ ルミチルジエタノールァミン、ステアリルジエタノールァミン、ォレイルジェタノールアミ ン、ラウリルジイソプロパノールァミン、ミリスチルジイソプロパノールァミン、ノ ルミチル ジイソプロパノールァミン、ステアリルジイソプロパノールァミン、ォレイルジイソプロパ ノールァミン、 N, N—ビスヒドロキシェチルアルキルアミン(但し、アルキル基の炭素 数は、通常、 12〜22である。)等のジアルカノールァミン等が挙げられる。  Examples of amine compounds include lauryl diethanolamine, myristyl diethanolamine, palmityl diethanolamine, stearyl diethanolamine, oleyljetanolamine, lauryl diisopropanolamine, myristyl diisopropanolamine, normityl diisopropanol. Dialkanols such as amines, stearyldiisopropanolamines, oleyldiisopropanolamines, N, N-bishydroxyethylalkylamines (however, the carbon number of the alkyl group is usually 12-22). Min etc. are mentioned.
[0111] また、アミド化合物としては、ラウリルジエタノールアミド、ミリスチルジエタノールアミ ド、パルミチルジエタノールアミド、ベへ-ルジェタノールアミド、ォレイルジェタノ一 ルアミド、ラウリルジイソプロパノールアミド、ミリスチルジイソプロパノールアミド、ノ レミ チルジイソプロパノールアミド、ステアリルジイソプロパノールアミド、ォレイルジイソプ ロパノールアミド等が挙げられる。 [0111] The amide compounds include lauryl diethanolamide, myristyl diethanolamide, palmityl diethanolamide, behyl-butanolamide, oleyljetanolamide, lauryl diisopropanolamide, myristyl diisopropanolamide, noremithyl diisopropanolamide. , Stearyl diisopropanolamide, and oleyl diisopropanolamide.
これらのうち、ァミン化合物が好ましぐラウリルジエタノールァミン及びステアリルジ エタノールァミンが特に好まし 、。 Of these, lauryl diethanolamine and stearyl diamine are preferred for the amine compound. Ethanolamine is particularly preferred.
[0112] 上記成分 (E4)は、組成物の製造の際に、単独で配合してよいし、上記の成分 (A) 、成分 (B)、成分 (C)等とからなる混合物 (組成物)として配合することもできる。後者 の場合、組成物において、混和性を向上させることができる。  [0112] The above component (E4) may be incorporated alone in the production of the composition, or a mixture (composition) comprising the above component (A), component (B), component (C) and the like. ). In the latter case, miscibility can be improved in the composition.
上記成分 (E4)は、 1種単独でまたは 2種以上を組み合わせて用いることができる。  The component (E4) can be used alone or in combination of two or more.
[0113] 成分 (E)として、成分 (E4)を単独で用いる場合、本発明の制電性榭脂組成物にお ける成分 (D4)の含有量は、成分 (A)、成分 (B)及び成分 (C)の合計を 100質量部 とした場合、好ましくは 0. 01〜30質量部であり、より好ましくは 0. 05〜20質量部、 更に好ましくは 0. 1〜: LO質量部、特に好ましくは 0. 5〜5質量部である。この成分 (E 4)の含有量が多すぎると、成形品外観が劣る場合があり、少なすぎると、制電性改良 効果が十分でな 、場合がある。  [0113] When component (E4) is used alone as component (E), the content of component (D4) in the antistatic resin composition of the present invention is such that component (A), component (B) And when the total of component (C) is 100 parts by mass, preferably 0.01 to 30 parts by mass, more preferably 0.05 to 20 parts by mass, still more preferably 0.1 to: LO parts by mass, Particularly preferred is 0.5 to 5 parts by mass. If the content of this component (E4) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may be insufficient.
[0114] 尚、上記成分 (E4)を用いる場合には、該成分による制電性を更に向上させるため に、炭素数 12〜18の高級アルコール、滑剤、シリカ、珪酸カルシウム等を配合しても よい。また、混和性を向上させる目的で、マスターバッチ化したものを用いることがで きる。このような処方では、成分 (E4)を 20質量%以上が含有するものを用いることが 好ましい。  [0114] When the above component (E4) is used, a higher alcohol having 12 to 18 carbon atoms, a lubricant, silica, calcium silicate, etc. may be blended in order to further improve the antistatic property of the component. Good. In addition, for the purpose of improving miscibility, a master batch can be used. In such a prescription, it is preferable to use a composition containing 20% by mass or more of component (E4).
本発明の成分 (E4)の如き化合物は、花王社製エレクトロストリッパー TS— 5、 EA、 TS - 3B、 TS - 2B、 TS- 13B、 TS - 7B (商品名)等として入手することができる。  A compound such as component (E4) of the present invention can be obtained as Kao's electro stripper TS-5, EA, TS-3B, TS-2B, TS-13B, TS-7B (trade name) and the like.
[0115] 上記のように、成分 (E)としては、上記の成分 (E1)、成分 (E2)、成分 (E3)及び成 分 (E4)力 選ばれた 2種以上を組み合わせて用いることができる。特に好ましくは、 上記の成分 (E1)及び成分 (E4)の組み合わせである。上記の成分 (E1)、成分 (E2 )、成分 (E3)及び成分 (E4)力 選ばれた 2種以上を組み合わせて用いる場合、そ の合計量は、成分 (A)、成分 (B)及び成分 (C)の合計を 100質量部とした場合、好 ましくは 0. 01〜30質量部であり、より好ましくは 0. 01〜15質量部、更に好ましくは 0. 1〜: LO質量部、特に好ましくは 0. 5〜7質量部である。この成分 (E)の含有量が 多すぎると、成形品外観が劣る場合があり、少なすぎると、制電性改良効果が十分で ない場合がある。 [0115] As described above, the component (E) may be a combination of two or more selected from the component (E1), the component (E2), the component (E3), and the component (E4) force. it can. Particularly preferred is a combination of the above components (E1) and (E4). Component (E1), Component (E2), Component (E3), and Component (E4) Strength When using two or more selected combinations in combination, the total amount is determined by component (A), component (B) and When the total of component (C) is 100 parts by mass, it is preferably 0.01 to 30 parts by mass, more preferably 0.01 to 15 parts by mass, still more preferably 0.1 to: part by mass of LO. Particularly preferred is 0.5 to 7 parts by mass. If the content of component (E) is too large, the appearance of the molded product may be inferior, and if it is too small, the antistatic effect may not be sufficient.
[0116] 本発明の制電性榭脂組成物は、目的、用途に応じて、更に、制電性付与助剤、加 工助剤、充填剤、酸化防止剤、熱安定剤、可塑剤、充填剤、紫外線吸収剤、耐候剤 、耐光剤、帯電防止剤、難燃剤、滑剤、摺動剤、着色剤、発泡剤、抗菌剤、結晶核 剤等の添加剤を配合したものとすることができる。 [0116] The antistatic resin composition of the present invention further comprises an antistatic property-imparting additive, an additive depending on the purpose and application. Engineering aids, fillers, antioxidants, heat stabilizers, plasticizers, fillers, UV absorbers, weathering agents, light-proofing agents, antistatic agents, flame retardants, lubricants, sliding agents, coloring agents, foaming agents, antibacterial agents Additives such as nucleating agents and crystal nucleating agents can be blended.
[0117] 本発明においては、成分 )による制電性を一層向上させるために、制電性付与 助剤を含有したものとすることが好ましい。この制電性付与助剤は、 1種単独でまたは 2種以上を組み合わせて用いることができる。  [0117] In the present invention, in order to further improve the antistatic property by component (1), it is preferable to contain an antistatic property-imparting aid. These antistatic agents can be used alone or in combination of two or more.
[0118] 制電性付与助剤としては、リチウム、ナトリウム、カリウム等のアルカリ金属の塩;マグ ネシゥム、カルシウム等のアルカリ土類金属の塩等が挙げられる。  [0118] Examples of the antistatic agent include alkali metal salts such as lithium, sodium and potassium; alkaline earth metal salts such as magnesium and calcium.
塩の種類としては、ハロゲンィ匕水素酸塩 (ハロゲンィ匕物)、硫酸塩、過塩素酸塩等 の無機酸塩;カルボン酸塩、ジカルボン酸塩、アルカンスルホン酸塩、芳香族スルホ ン酸塩(アルキルベンゼンスルホン酸塩を含む)、フッ化スルホン酸塩等の有機酸塩 等が挙げられる。  The types of salts include inorganic hydroacid salts (halogenated compounds), sulfates, perchlorates, etc .; carboxylates, dicarboxylates, alkane sulfonates, aromatic sulfonates ( And organic acid salts such as fluorinated sulfonic acid salts.
[0119] ハロゲン化物としては、塩化リチウム、塩ィ匕ナトリウム、塩ィ匕カリウム、臭化リチウム、 臭化ナトリウム、臭化カリウム等が挙げられる。  [0119] Examples of the halide include lithium chloride, sodium chloride salt, potassium salt salt, lithium bromide, sodium bromide, potassium bromide and the like.
過塩素酸塩としては、過塩素酸リチウム、過塩素酸ナトリウム、過塩素酸カリウム等 が挙げられる。  Examples of perchlorates include lithium perchlorate, sodium perchlorate, and potassium perchlorate.
カルボン酸塩としては、酢酸カリウム、ステアリン酸リチウム等が挙げられる。  Examples of the carboxylate include potassium acetate and lithium stearate.
[0120] アルカンスルホン酸塩としては、ォクチルスルホン酸、ドデシルスルホン酸、テトラデ シルスルホン酸、ステアリルスルホン酸、テトラコシルスルホン酸、 2—ェチルへキシル スルホン酸等の炭素数 8〜24のアルカンスルホン酸の塩が好ましい。 [0120] Examples of the alkanesulfonic acid salts include alkanesulfonic acids having 8 to 24 carbon atoms such as octylsulfonic acid, dodecylsulfonic acid, tetradecylsulfonic acid, stearylsulfonic acid, tetracosylsulfonic acid, 2-ethylhexylsulfonic acid, and the like. Salts are preferred.
芳香族スルホン酸塩としては、フエ-ルスルホン酸、ナフチルスルホン酸、ォクチル フエ-ルスルホン酸、ドデシルフヱ-ルスルホン酸、ジブチルフヱ-ルスルホン酸、ジ ノ-ルフエ-ルスルホン酸、ジメチルナフチルスルホン酸、ジイソプロピルナフチルス ルホン酸、ジブチルナフチルスルホン酸等の炭素数 6〜 18の芳香族スルホン酸の塩 が好ましい。  Aromatic sulfonates include: phenyl sulfonic acid, naphthyl sulfonic acid, octyl sulfonic acid, dodecyl sulfonic acid, dibutyl sulfonic acid, dimethyl sulfonic acid, dimethyl naphthyl sulfonic acid, diisopropyl naphthyl sulfonic acid. Preferred are salts of aromatic sulfonic acids having 6 to 18 carbon atoms such as acid and dibutylnaphthyl sulfonic acid.
[0121] 制電性付与助剤は、本発明の制電性榭脂組成物の製造時に配合することができる 力 例えば、成分 (B)の重合前、成分 (B)の重合途中、及び成分 (B)の重合後のい ずれの時期に配合することもできる。 上記制電性付与助剤の配合量は、成分 (B)を 100質量部とした場合、好ましくは 0 . 001〜 10質量部、更に好ましくは 0. 01〜5質量部である。 [0121] The antistatic property-imparting aid can be blended in the production of the antistatic oil composition of the present invention. For example, before polymerization of component (B), during polymerization of component (B), and component It can be blended at any time after the polymerization of (B). The blending amount of the antistatic agent is preferably 0.001 to 10 parts by mass, more preferably 0.01 to 5 parts by mass when the component (B) is 100 parts by mass.
[0122] 加工助剤としては、透明性及び制電性を損なうものでなければ、特に限定されない 。例えば、アクリル系重合体、スチレン系重合体、フッ素系重合体等が挙げられる。こ れらは、いずれも超高分子量体 (重量平均分子量 100万以上)が好ましぐそれぞれ 、 1種単独でまたは 2種以上を組み合わせて用いることができる。 [0122] The processing aid is not particularly limited as long as it does not impair transparency and antistatic properties. For example, an acrylic polymer, a styrene polymer, a fluorine polymer, and the like can be given. These are all preferably ultra-high molecular weight compounds (weight average molecular weight of 1 million or more), and can be used singly or in combination of two or more.
上記加工助剤の配合量は、成分 (A)、成分 (B)及び成分 (C)の合計を 100質量部 とした場合、好ましくは 0. 1〜10質量部である。この範囲とすることで、成分 (A)、成 分 (B)及び成分 (C)の相溶性を向上させることができ、制電性榭脂組成物の押出成 形性を改良することができる。  The amount of the processing aid is preferably 0.1 to 10 parts by mass when the total of component (A), component (B) and component (C) is 100 parts by mass. By setting this range, the compatibility of the component (A), the component (B) and the component (C) can be improved, and the extrusion moldability of the antistatic resin composition can be improved. .
[0123] 充填剤としては、金属、合金、無機化合物、有機化合物、高分子化合物、無機,有 機複合物等からなるものを、粉末状、塊状、中空状、板状、繊維状 (ゥイスカーを含む )等として、 目的、用途等に応じて用いることができる。導電性を有するものであっても よい。この充填剤は、 1種単独でまたは 2種以上を組み合わせて用いることができる。 充填剤としては、ガラス繊維、ガラスフレーク、ガラス繊維のミルドファイバー、ガラス ビーズ、中空ガラスビーズ、炭素繊維、炭素繊維のミルドファイバー、ァラミド繊維、フ エノール榭脂繊維、ポリエステル繊維、酸化亜鉛ゥイスカー、チタン酸カリウムウイスカ 一、ホウ酸アルミニウムウイスカー、アルミナ、シリカ、タルク、炭酸カルシウム、ワラスト ナイト、マイ力、カオリン、モンモリロナイト、ヘクトライト、有機処理されたスメクタイト、 錫コート酸ィ匕チタン、錫コートシリカ、ニッケルコート炭素繊維、銀、銅、黄銅、鉄、力 一ボンブラック等が挙げられる。これらは、 1種単独でまたは 2種以上を組み合わせて 用いることができる [0123] Fillers include metals, alloys, inorganic compounds, organic compounds, polymer compounds, inorganic, organic composites, etc., powders, lumps, hollows, plates, fibers (whiskers) Etc.) can be used depending on the purpose and application. It may be conductive. These fillers can be used alone or in combination of two or more. Fillers include glass fiber, glass flake, glass fiber milled fiber, glass bead, hollow glass bead, carbon fiber, carbon fiber milled fiber, aramid fiber, phenolic resin fiber, polyester fiber, zinc oxide whisker, titanium Potassium oxide whisker, aluminum borate whisker, alumina, silica, talc, calcium carbonate, wollastonite, my strength, kaolin, montmorillonite, hectorite, organically treated smectite, tin-coated titanium oxide, tin-coated silica, nickel Examples include coated carbon fiber, silver, copper, brass, iron, and vigorous black. These can be used alone or in combination of two or more.
[0124] 尚、上記充填剤は、分散性を向上させる等の目的から、公知のカップリング剤、表 面処理剤、集束剤等で処理したものを用いることができる。このカップリング剤として は、シラン系カップリング剤、チタネート系カップリング剤、アルミニウム系カップリング 剤等が挙げられる。  [0124] As the filler, those treated with a known coupling agent, surface treatment agent, sizing agent or the like can be used for the purpose of improving dispersibility. Examples of the coupling agent include a silane coupling agent, a titanate coupling agent, and an aluminum coupling agent.
上記充填剤の配合量は、上記の成分 (A)、(B)及び (C)の合計を 100質量部とし た場合、好ましくは 0. 1〜200質量部である。 [0125] 着色剤としては、公知の染料、顔料等を用いることができる。 The blending amount of the filler is preferably 0.1 to 200 parts by mass when the total of the components (A), (B) and (C) is 100 parts by mass. [0125] As the colorant, known dyes, pigments and the like can be used.
上記着色剤の配合量は、上記の成分 (A)、 (B)及び (C)の合計を 100質量部とし た場合、好ましくは 0. 001〜20質量部、更に好ましくは 1〜200質量部である。  The blending amount of the colorant is preferably 0.001 to 20 parts by mass, more preferably 1 to 200 parts by mass when the total of the components (A), (B) and (C) is 100 parts by mass. It is.
[0126] 本発明の制電性榭脂組成物は、要求される性能を得るために、必要に応じて、更 に、熱可塑性榭脂、熱可塑性エラストマ一、熱硬化性榭脂等の、他の重合体を含有 してちよい。 [0126] In order to obtain the required performance, the antistatic coagulant composition of the present invention may further include, as necessary, a thermoplastic coagulant, a thermoplastic elastomer, a thermosetting coagulant, etc. It may contain other polymers.
熱可塑性榭脂としては、ポリアミド榭脂;ポリブチレンテレフタレート、ポリエチレンテ レフタレート、ポリアリレート、液晶ポリエステル等のポリエステル榭脂;ポリフエ-レン エーテル;ポリフエ-レンスルフイド;芳香族ポリカーボネート;熱可塑性ポリウレタン; フエノキシ榭脂; PMMA榭脂、 ABS榭脂、 ASA榭脂、 AES榭脂、 HIPSゝ AS榭脂、 PS榭脂、 MS榭脂、メタクリル酸メチルとマレイミド系化合物との共重合体、スチレンと マレイミド系化合物との共重合体等が挙げられる。また、熱可塑性エラストマ一として は、ポリアミドエラストマ一、ポリエステルエラストマ一等が挙げられる。  As the thermoplastic resin, polyamide resin; polyester resin such as polybutylene terephthalate, polyethylene terephthalate, polyarylate, liquid crystalline polyester; polyphenylene ether; polyphenylene sulfide; aromatic polycarbonate; thermoplastic polyurethane; phenoxy resin ; PMMA resin, ABS resin, ASA resin, AES resin, HIPS AS resin, PS resin, MS resin, copolymer of methyl methacrylate and maleimide compound, styrene and maleimide compound And the like. Examples of thermoplastic elastomers include polyamide elastomers and polyester elastomers.
更に、熱硬化性榭脂としては、エポキシ榭脂、フエノール榭脂、尿素樹脂等が挙げ られる。  Furthermore, examples of thermosetting resin include epoxy resin, phenol resin, urea resin, and the like.
[0127] 1 5.製造方法及び成形品  [0127] 1 5. Manufacturing method and molded product
本発明の制電性榭脂組成物は、上記の構成成分、添加剤等を各種押出機、バン バリーミキサー、エーダー、連続-一ダー、ロール等に投入し、加熱下で溶融混練す ることにより得ることができる。各成分は、一括投入して力も混練してよいし、分割して 投入して混練してもよい。混練後、そのまま成形品とする場合には、射出成形、プレ ス成形、カレンダー成形、 Tダイ押出成形、インフレーション成形、異形押出成形、発 泡成形等公知の成形方法を適用することができる。また、前記方法で得られたシート 等に対して、更に真空成形等を適用することもできる。  In the antistatic resin composition of the present invention, the above-described components, additives, and the like are charged into various extruders, Banbury mixers, aders, continuous rolls, rolls, etc., and melt kneaded under heating. Can be obtained. Each component may be added all at once and kneaded with force, or may be added separately and kneaded. In the case of forming a molded product as it is after kneading, known molding methods such as injection molding, press molding, calendar molding, T-die extrusion molding, inflation molding, profile extrusion molding, and foaming molding can be applied. Further, vacuum forming or the like can be further applied to the sheet or the like obtained by the above method.
[0128] 本発明の制電性榭脂組成物及びこれを用いてなる成形品は、温度 23°C、湿度 50 %RHの条件における表面固有抵抗を、好ましくは 5 X 1012 Ω以下、より好ましくは 9 X 1011 Ω以下、更に好ましくは 9 X 1010 Ω以下、特に好ましくは 5 X 109 Ω以下とする ことができる。 [0128] The antistatic resin composition of the present invention and a molded article using the same have a surface resistivity of preferably 5 x 10 12 Ω or less under conditions of a temperature of 23 ° C and a humidity of 50% RH. It is preferably 9 × 10 11 Ω or less, more preferably 9 × 10 10 Ω or less, and particularly preferably 5 × 10 9 Ω or less.
[0129] 成形品の形状は、目的、用途等に応じたものとすることができ、シート、フィルム等 の薄様体 (厚み 〜: LOOmm);丸棒、角棒等の棒状体;更にはこれらの変形物; トレイ、ケース等とすることができる。 [0129] The shape of the molded product may be in accordance with the purpose, application, etc., such as a sheet, a film, etc. Thin bodies (thickness: LOOmm); rod-like bodies such as round bars and square bars; and further modifications thereof; trays, cases, and the like.
上記成形品がシートである場合は、その厚さが、好ましくは 0. 2〜: LOmm、より好ま しくは 0. 5〜5mmである。  When the molded article is a sheet, the thickness thereof is preferably 0.2 to: LOmm, more preferably 0.5 to 5 mm.
また、フィルムである場合は、その厚さが、好ましくは 5〜200 μ m、より好ましくは 1 0〜150 πιである。  In the case of a film, the thickness is preferably 5 to 200 μm, more preferably 10 to 150 πι.
尚、シート及びフィルムの、片面又は両面には、目的、用途等に応じて、凹凸部、溝 部、穴部等を有してもよい。また、貫通孔を有してもよい。  Note that one or both sides of the sheet and film may have an uneven part, a groove part, a hole part, etc. depending on the purpose and application. Moreover, you may have a through-hole.
[0130] 本発明の制電性榭脂組成物を用いてなる成形品は、上記の単独成形体以外に、 他の材料からなる成形品と一体化した複合物品、例えば、後述する粘着フィルム、多 層シート等の形成にも好適である。従って、上記複合物品において、本発明の制電 性榭脂組成物を用 、てなる成形部が最表面にある場合には、上記条件における表 面固有抵抗を維持することができ、特に、制電性に優れる。また、上記他の材料が透 明性を有する場合には、複合物品全体として、透明性にも優れる。 [0130] A molded article using the antistatic resin composition of the present invention is a composite article integrated with a molded article made of another material other than the single molded article, for example, an adhesive film described later, It is also suitable for forming multi-layer sheets and the like. Therefore, in the above composite article, when the antistatic resin composition of the present invention is used and the formed part is on the outermost surface, the surface specific resistance under the above conditions can be maintained. Excellent electrical properties. When the other material has transparency, the composite article as a whole is excellent in transparency.
[0131] 2.制電,粘着性榭脂組成物  [0131] 2. Antistatic, adhesive resin composition
本発明の制電 '粘着性榭脂組成物は、上記成分 (Α)のポリオレフイン系榭脂 (但し 、下記成分 (Β)を除く。)0〜59質量%と、上記成分 (Β)のブロック共重合体 3〜60 質量%と、上記成分 (C)の重合体及び Ζ又はその水素添加物 35〜97質量%とを含 有 (但し、上記成分 (Α)、成分 (Β)及び成分 (C)の合計は 100質量%である。)する ことを特徴とする。尚、本発明の制電'粘着性榭脂組成物の成分 (Α)、成分 (Β)及び 成分 (C)は、上記本発明の制電性榭脂組成物に関して各成分について上記した記 述がそのまま適用できる。  The antistatic adhesive composition according to the present invention comprises 0 to 59% by mass of the above-described component (Α) polyolefin-based resin (excluding the following component (Β)), and a block of the above component (Β). Copolymer 3 to 60% by mass, polymer of component (C) and soot or hydrogenated product 35 to 97% by mass (provided that the above component (Α), component (Β) and component ( The sum of C) is 100% by mass.) The component (Α), component (Β) and component (C) of the antistatic adhesive composition of the present invention are as described above for each component with respect to the antistatic resin composition of the present invention. Can be applied as is.
[0132] 本発明の制電 '粘着性榭脂組成物の第一の好ましい実施形態によれば、上記成分  [0132] According to a first preferred embodiment of the antistatic 'adhesive resin composition of the present invention, the above components
(Α)、成分 (Β)及び成分 (C)の含有量は、それぞれ、 0〜40質量%、 6〜25質量% 及び 35〜94質量%であり、好ましくは 0〜35質量%、 8〜20質量%及び 45〜92質 量%、より好ましくは 0〜30質量%、 8〜18質量%及び 52〜92質量%、更に好まし くは 0〜25質量%、 8〜16質量%及び 59〜92質量%である。成分(C)の種類及び 含有量の選択により、他の部材に対する粘着性を調整することができる。即ち、この 成分 (C)を形成することとなる上記重合体ブロック (cl)に含まれるビュル結合含量が 、好ましくは 60〜90%、より好ましくは 70〜85%であれば、優れた粘着性を発揮す ることができ、力かる成分 (C)としては、 JSR社製「ダイナロン 1320P」、「ダイナロン 1 321P」(以上、商品名)等が好ましく用いられる。また、該ビニル結合含量が 60%未 満の重合体ブロック (cl)を含む重合体の水素添加物を、成分 (C)の一部として適宜 、配合することで、粘着性の調整がより容易となる。 The contents of (ii), component (ii) and component (C) are 0 to 40% by mass, 6 to 25% by mass and 35 to 94% by mass, respectively, preferably 0 to 35% by mass, 8 to 20% by mass and 45-92% by mass, more preferably 0-30% by mass, 8-18% by mass and 52-92% by mass, more preferably 0-25% by mass, 8-16% by mass and 59%. It is -92 mass%. The adhesiveness to other members can be adjusted by selecting the type and content of component (C). That is, this Excellent tackiness is exhibited if the bull bond content contained in the polymer block (cl) forming the component (C) is preferably 60 to 90%, more preferably 70 to 85%. As the component (C) that can be used, “Dynalon 1320P”, “Dynalon 1 321P” (trade name) manufactured by JSR, etc. are preferably used. In addition, the adhesiveness can be easily adjusted by appropriately blending a polymer hydrogenated product containing a polymer block (cl) having a vinyl bond content of less than 60% as part of the component (C). It becomes.
尚、上記成分 (A)の含有量が多すぎると、粘着性が十分でない場合がある。  In addition, when there is too much content of the said component (A), adhesiveness may not be enough.
上記成分 (B)の含有量が多すぎると、成形品外観が低下する場合がある。また、少 なすぎると、制電性が低下する場合がある。  If the content of the component (B) is too large, the appearance of the molded product may be deteriorated. If the amount is too small, the antistatic property may decrease.
上記成分 (C)の含有量が多すぎると、制電性が低下する場合がある。また、少なす ぎると、粘着性が十分でない場合がある。  If the content of the component (C) is too large, the antistatic property may be lowered. If the amount is too small, the tackiness may not be sufficient.
上記第一の好ましい実施形態による制電 '粘着性榭脂組成物は、ポリオレフイン榭 脂からなる支持体フィルムに透明な粘着層を形成して透明フィルムを得るのに好適 に使用できる。  The antistatic adhesive resin composition according to the first preferred embodiment can be suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film made of polyolefin resin.
本発明の制電 '粘着性榭脂組成物の第二の好ましい実施形態によれば、上記成分 (A)がポリオレフイン (Α' - 1)及び Ζ又は官能基で変性されて 、るポリオレフイン (Α ' - 2)であり、上記成分 (C)が共役ジェンィ匕合物単位及び芳香族ビ-ルイ匕合物単位 力も主としてなる重合体の水素添加物であり、上記成分 (Α) 0〜59質量%、上記成 分 (Β) 3〜60質量%、及び上記成分 (C) 40〜97質量%力 なる制電 '粘着性榭脂 組成物が提供される。  According to a second preferred embodiment of the antistatic 'adhesive rosin composition of the present invention, the component (A) is modified with polyolefin (Α'-1) and Ζ or a functional group, and the polyolefin (Α '-2), wherein the component (C) is a hydrogenated product of a polymer mainly composed of a conjugated genie compound unit and an aromatic beryl compound unit, and the component (Α) 0 to 59 mass %, The above component (Β) 3 to 60% by mass, and the above component (C) 40 to 97% by mass, an antistatic adhesive resin composition is provided.
この第二の好ましい実施形態による制電'粘着性榭脂組成物は、スチレン系榭脂な どの各種重合体力 なる支持体フィルムに透明な粘着層を形成して透明フィルムを 得るのに好適に使用できる。  The antistatic adhesive resin composition according to the second preferred embodiment is suitably used to obtain a transparent film by forming a transparent adhesive layer on a support film having various polymer strengths such as styrene resin. it can.
この第二の好ましい実施形態による制電 '粘着性榭脂組成物における成分 (A)は 、ポリオレフイン榭脂 (Α'— 1)及び Ζ又は官能基で変性されて 、るポリオレフイン榭 脂 (Α'— 2)力もなる。  The component (A) in the antistatic 'adhesive resin composition according to this second preferred embodiment is a polyolefin resin (Α'-1) and a polyolefin resin modified with a resin or functional group (Α'). — 2) There will be power.
ポリオレフイン榭脂 (Α' - 1)は、変性されて 、な 、ポリオレフイン榭脂であり、本発 明の上記制電性榭脂組成物にっ 、て記述したポリオレフイン榭脂 (Α)の内容が全て あてはまり、炭素数 2〜: LOのォレフィン類の少なくとも 1種を構成単量体単位として含 有する重合体であることが好ましく、特に好ましくはエチレンを主成分とする重合体で ある。 Polyolefin resin (Α'-1) is a modified polyolefin resin, and the content of the polyolefin resin (Α) described in the above antistatic resin composition of the present invention is as follows. all Applicable, a polymer containing at least one olefin having at least 2 carbon atoms: LO as a constituent monomer unit is preferred, and a polymer containing ethylene as a main component is particularly preferred.
[0134] この第二の好ましい実施形態による制電 '粘着性榭脂組成物において、ポリオレフィ ン榭脂 (Α' - 1)は、常温にお 、て成形用榭脂として十分な分子量を有するものが用 いられ、例えばエチレンが主成分である場合、 JIS Κ6922に準拠して測定したメルト フローレ一卜力 好ましくは 0. 01〜: LOOgZlO分、より好ましくは 0. 03〜70gZlO分 に相当する分子量のものである。ここで使用されるポリエチレンとしては、高密度ポリ エチレン、低密度ポリエチレン、直鎖状低密度ポリエチレンのいずれもが使用できる 上記成分 (Α' - 2)は、官能基で変性されて 、るポリオレフイン榭脂である。好ま 、 ポリオレフイン榭脂としては、ポリプロピレン、ポリエチレンであり、更に好ましくは低分 子量ポリプロピレン、低分子量ポリエチレンであり、特に好ましくは低分子量ポリェチ レンである。上記低分子量ポリオレフインの重量平均分子量は、好ましくは 1, 000〜 100, 000、更【こ好まし <ίま 5, 000〜60, 000、特【こ好まし <ίま 8, 000〜50, 000で ある。当該低分量ポリオレフインは、重合法または高分子量ポリオレフインの熱減成 法〖こより得られる。官能基での変性のしゃすさから好まし ヽものは熱減成法で得られ たものである。熱減成法による低分子量ポリオレフインは、例えば、高分子量ポリオレ フィンを不活性ガス中、通常 300°C〜450°Cで 0. 5時間から 10時間熱減成する方法 (例えば、特開平 3— 62804号公報記載の方法)等により得ることができる。  [0134] In the antistatic adhesive rubber composition according to the second preferred embodiment, the polyolefin resin (榭 '-1) has a molecular weight sufficient as a molding resin at room temperature. For example, when ethylene is the main component, the melt flow rate measured according to JIS 6922 is preferably 0.01 to: LOOgZlO content, more preferably 0.03 to 70 gZlO content. belongs to. As the polyethylene used here, any of high density polyethylene, low density polyethylene, and linear low density polyethylene can be used. The above component (Α'-2) is a polyolefin modified with a functional group. It is fat. Preferably, the polyolefin resin is polypropylene or polyethylene, more preferably low molecular weight polypropylene or low molecular weight polyethylene, and particularly preferably low molecular weight polyethylene. The weight average molecular weight of the low molecular weight polyolefin is preferably 1,000 to 100,000, more preferably <5,000 or 6,000 to 60,000, specially preferred <ί or 8,000 to 50,000, 000. The low molecular weight polyolefin can be obtained from a polymerization method or a thermal degradation method of high molecular weight polyolefin. The ones that are preferred due to their functional modification are those obtained by the thermal degradation method. The low molecular weight polyolefin by thermal degradation is, for example, a method in which high molecular weight polyolefin is thermally degraded in an inert gas, usually at 300 ° C. to 450 ° C. for 0.5 hours to 10 hours (for example, JP-A-3- No. 62804).
[0135] 官能基による変性方法は、不飽和酸、不飽和酸無水物、エポキシ基含有不飽和化 合物、水酸基含有不飽和化合物、ォキサゾリン基含有不飽和化合物、アミノ基含有 不飽和化合物、置換アミノ基含有不飽和化合物等を付加させる方法である。好まし いものは、不飽和酸、不飽和酸無水物である。 [0135] Modification methods using functional groups include unsaturated acids, unsaturated acid anhydrides, epoxy group-containing unsaturated compounds, hydroxyl group-containing unsaturated compounds, oxazoline group-containing unsaturated compounds, amino group-containing unsaturated compounds, substitution This is a method of adding an amino group-containing unsaturated compound or the like. Preferred are unsaturated acids and unsaturated acid anhydrides.
ここで使用される不飽和酸としては、例えばアクリル酸、メタクリル酸、クロトン酸、ケ ィヒ酸、ィタコン酸、マレイン酸等があり、これらは 1種単独で、または 2種以上を組み 合わせて用いることができる。また、不飽和酸無水物としては、無水マレイン酸、無水 ィタコン酸、クロ口無水ィタコン酸、クロ口無水マレイン酸、無水シトラコン酸等があり、 これらは、 1種単独で、または 2種以上を組み合わせて用いることができる。好ましい ものは、無水マレイン酸である。 Examples of the unsaturated acid used here include acrylic acid, methacrylic acid, crotonic acid, ketonic acid, itaconic acid, maleic acid, and the like. These may be used alone or in combination of two or more. Can be used. Further, as the unsaturated acid anhydride, there are maleic anhydride, itaconic anhydride, black mouth itaconic anhydride, black mouth maleic anhydride, citraconic anhydride, etc. These can be used alone or in combination of two or more. Preferred is maleic anhydride.
[0136] 上記成分 — 2)における前記官能基含有不飽和化合物量は、ポリオレフイン榭 脂 100質量%として、好ましくは 0. 5〜25質量%、更に好ましくは 1〜20質量%、特 に好ましくは 1〜 15質量%である。前記官能基含有不飽和化合物による変性方法は 、例えばポリオレフイン樹脂に官能基含有不飽和化合物を必要により有機過酸ィ匕物 の存在下、溶液法または溶融法等の方法で変性することにより得ることができる。 上記成分 (Α'— 2)に該当する材料は、例えば、三洋化成工業社製ユーメッタス 10 01、 1003、 1010、 100TS、 HOTS, 2000、 CA60 (商品名)等として市場で入手 できる。 [0136] The amount of the functional group-containing unsaturated compound in the above component 2) is preferably 0.5 to 25% by mass, more preferably 1 to 20% by mass, particularly preferably 100% by mass of polyolefin resin. 1 to 15% by mass. The modification method using the functional group-containing unsaturated compound can be obtained, for example, by modifying the functional group-containing unsaturated compound in a polyolefin resin by a method such as a solution method or a melting method in the presence of an organic peroxide if necessary. Can do. The material corresponding to the above component (Α′-2) can be obtained on the market as, for example, Yumetus 1001, 1003, 1010, 100TS, HOTS, 2000, CA60 (trade name) manufactured by Sanyo Chemical Industries.
[0137] 上記成分 (Α'— 1)は、粘着剤の粘着性を調整する目的で使用される。一方上記成 分 (Α' - 2)は、粘着フィルムを製造する際の粘着剤と支持体の接着性、支持体にコ ートした易接着剤との接着性を向上させる目的で使用される。  [0137] The above component (Α'-1) is used for the purpose of adjusting the tackiness of the pressure-sensitive adhesive. On the other hand, the above component (Α'-2) is used for the purpose of improving the adhesion between the pressure-sensitive adhesive and the support when producing the pressure-sensitive adhesive film, and the easy-adhesive coated on the support. .
この第二の好ましい実施形態による制電 '粘着性榭脂組成物において、上記成分( Α)の使用量は、本発明の (Α)成分と (Β)成分 (C)成分との合計 100質量%に対し、 0〜59重量%、好ましくは 1〜59質量%、更に好ましくは 1〜48質量%、更により好 ましくは 2〜45質量%、特に好ましくは 3〜40質量%の範囲である。また、上記成分( A' - 2)の使用効果を高めるために、上記成分 (Α' - 1)及び成分 (Α' - 2)の好まし い使用量は、何れも、本発明の (Α)成分と (Β)成分 (C)成分との合計 100質量%に 対し、 2〜37質量%、更な好ましくは 2〜35質量%、特に好ましくは 5〜30質量%で ある。上記成分 (Α'— 1)が上記の範囲未満であると粘着性の調整機能が劣り、又範 囲を超えると粘着性が劣る。一方、上記成分 (Α'— 2)が上記の範囲未満であると粘 着フィルムを製造する際の粘着剤と支持体の接着性、支持体にコートした易接着剤 との接着性等の接着性を向上が十分でなぐまた範囲を超えると粘着性が劣る傾向 にあり好ましくない。  In the antistatic adhesive rubber composition according to the second preferred embodiment, the amount of the component (Α) used is 100 mass in total of the components (Α) and (Β) of the present invention. % In the range of 0 to 59% by weight, preferably 1 to 59% by weight, more preferably 1 to 48% by weight, even more preferably 2 to 45% by weight, particularly preferably 3 to 40% by weight. is there. In order to enhance the use effect of the component (A'-2), the preferred amounts of the component (Α'-1) and the component (Α'-2) are both (Α 2) to 37% by mass, more preferably 2 to 35% by mass, and particularly preferably 5 to 30% by mass with respect to 100% by mass of the total of component ()) and component (ii) (C). If the above component (Α'-1) is less than the above range, the adhesive adjustment function is poor, and if it exceeds the range, the stickiness is poor. On the other hand, if the component (Α′-2) is less than the above range, adhesion such as adhesion between the pressure-sensitive adhesive and the support when producing an adhesive film, adhesion between the easy-adhesive coated on the support and the like If the improvement is not sufficient and the range is exceeded, the tackiness tends to be inferior, which is not preferable.
[0138] この第二の好ましい実施形態による制電 '粘着性榭脂組成物において、成分 (Β) は、ォレフィン重合体ブロックと親水性ポリマーブロックとを含むブロック共重合体であ り、本発明の制電性榭脂組成物に関して上記した記述がそのまま当てはまる。 この第二の好ましい実施形態による制電 '粘着性榭脂組成物において、上記成分([0138] In the antistatic adhesive resin composition according to the second preferred embodiment, the component (Β) is a block copolymer containing an olefin polymer block and a hydrophilic polymer block. The above description regarding the antistatic oil-absorbing composition is applicable as it is. In the antistatic adhesive rubber composition according to the second preferred embodiment, the above components (
B)の使用量は、成分 (A)を含有しない場合、成分 (B)及び成分 (C)の合計 100質 量%に対して、 3〜60質量%、好ましくは 3〜50質量%、更に好ましくは 5〜40質量 %、特に好ましくは 5〜35質量%であり、 3質量%未満では制電性が劣り、 60質量% を超えると粘着性が低下する。成分 (A)を含有する場合の成分 (B)の使用量は、成 分 (A)、成分 (B)及び成分 (C)の合計 100質量%に対して、 3〜60質量%、好ましく は 3〜59質量%、更に好ましくは 3〜49質量%、更により好ましくは 5〜48質量%、 特に好ましくは 5〜42質量%の範囲であり、 3質量%未満では制電性が劣り、 59質 量%を超えると粘着性が低下する。 The amount of B) used is 3 to 60% by weight, preferably 3 to 50% by weight, based on the total 100% by weight of component (B) and component (C) when component (A) is not included. The content is preferably 5 to 40% by mass, and particularly preferably 5 to 35% by mass. When the content is less than 3% by mass, the antistatic property is inferior, and when it exceeds 60% by mass, the tackiness is lowered. In the case of containing component (A), the amount of component (B) used is 3 to 60% by mass, preferably 100% by mass of component (A), component (B) and component (C), preferably 3 to 59% by mass, more preferably 3 to 49% by mass, still more preferably 5 to 48% by mass, and particularly preferably 5 to 42% by mass. If it exceeds the mass%, the adhesiveness will decrease.
[0139] 本発明の制電 '粘着性榭脂組成物における第二の好ましい実施形態において、上 記成分 (C)は、成分 (C)が共役ジェンィ匕合物単位及び芳香族ビニルイ匕合物単位か ら主としてなる重合体の水素添加物であり、本発明の上記制電性榭脂組成物に関し て記述した内容がそのまま当てはまる。  [0139] In a second preferred embodiment of the antistatic adhesive resin composition of the present invention, the component (C) comprises the component (C) as a conjugate conjugated compound unit and an aromatic vinyl compound. It is a hydrogenated product of a polymer mainly composed of units, and the contents described with respect to the antistatic resin composition of the present invention apply as it is.
この第二の好ましい実施形態の制電 '粘着性榭脂組成物の成分 (C)において、芳 香族ビ-ルイ匕合物単位と共役ジェンィ匕合物単位は、ランダム共重合体であってもよく 、それぞれがブロックになっているブロック共重合体になっているものでもよぐ更にラ ンダム共重合体とブロック共重合体が混合された結合形態になって 、るものでもよ 、 。好ましい成分 (C)は、共役ジェンィ匕合物単位から主としてなる重合体ブロック (cl) と芳香族ビ-ルイ匕合物単位力 主としてなる重合体ブロック(c2)とを含むブロック共 重合体の水素添加物である。  In component (C) of the antistatic adhesive resin composition of this second preferred embodiment, the aromatic belieu compound unit and the conjugated genie compound unit are random copolymers, It is also possible to use a block copolymer in which each block is a block, or to form a combined form in which a random copolymer and a block copolymer are mixed. A preferred component (C) is a hydrogen of a block copolymer containing a polymer block (cl) mainly composed of conjugated diene compound units and a polymer block (c2) mainly composed of aromatic beryl compound units. It is an additive.
この第二の好ましい実施形態の制電 '粘着性榭脂組成物を、表示装置用の保護フ イルムとして使用される粘着剤として用いる場合、上記成分 (C)成分として特に好まし い構造は、粘着力の調整の容易さ、及び粘着剤としての透明性の発現のし易さから 、上記(VII)の構造のものである。  When the antistatic adhesive resin composition of the second preferred embodiment is used as an adhesive used as a protective film for a display device, the structure particularly preferred as the component (C) is as follows: In view of the ease of adjusting the adhesive strength and the ease of developing transparency as an adhesive, it has the structure of (VII) above.
[0140] この第二の好ましい実施形態の制電 '粘着性榭脂組成物の成分 (C)において、芳 香族ビニル化合物と共役ジェン化合物の使用割合は、芳香族ビニル化合物 Z共役 ジェン化合物 = 5〜70Z30〜95質量%の範囲が好ましぐ更に好ましくは 10〜65 Ζ35〜90質量%、特に好ましくは 15〜60Ζ40〜85質量%の範囲である。 この第二の好ましい実施形態の制電 '粘着性榭脂組成物の成分 (c)である水素添 加物は、主として共役ジェン化合物の炭素一炭素二重結合の少なくとも一部が水素 添加されたものである。すなわち、成分 (C)として、上記した共重合体の共役ジェン 部分の炭素一炭素二重結合を部分的にまたは完全に水素添加したものが用いられ[0140] In the component (C) of the antistatic 'adhesive resin composition of the second preferred embodiment, the use ratio of the aromatic vinyl compound and the conjugated gen compound is: aromatic vinyl compound Z conjugated gen compound = The range of 5 to 70 Z is preferably 30 to 95% by mass, more preferably 10 to 65% 35 to 90% by mass, and particularly preferably 15 to 60% 40 to 85% by mass. The hydrogenated product as the component (c) of the antistatic adhesive resin composition of the second preferred embodiment is mainly hydrogenated at least part of the carbon-carbon double bond of the conjugation compound. Is. That is, as the component (C), one obtained by partially or completely hydrogenating the carbon-carbon double bond of the conjugation moiety of the copolymer described above is used.
、好ましい水素添力卩率は 10〜: LOO%のものであり、更に好ましくは 50〜: L00%、特に 好ましくは 90〜 100%である。 The preferred hydrogenation rate is 10 to: LOO%, more preferably 50 to: L00%, and particularly preferably 90 to 100%.
[0141] この第二の好ましい実施形態の制電 '粘着性榭脂組成物において、成分 (C)の使 用量は、成分 (A)を含有しない場合は、成分 (B)と成分 (C)の合計 100質量%中 40 〜97質量%、好ましくは 50〜97質量%、更に好ましくは 60〜95質量%、特に好ま しくは 65〜95質量%の範囲であり、 40質量%未満では粘着性が低下し、 97質量% を超えると制電性が劣る。成分 (A)を含有する場合の成分 (C)の使用量は、成分 (A )と成分 (B)と成分 (C)との合計 100質量%中 40〜97質量%、好ましくは 50〜97質 量%、更に好ましくは 50〜93質量%、特に好ましくは 55〜92質量%の範囲であり、 40質量%未満では粘着性が低下し、 97質量%を超えると制電性が劣る。  [0141] In the antistatic adhesive rubber composition of this second preferred embodiment, the amount of component (C) used is that when component (A) is not included, component (B) and component (C) In the total of 100% by mass, 40 to 97% by mass, preferably 50 to 97% by mass, more preferably 60 to 95% by mass, and particularly preferably 65 to 95% by mass. When the amount exceeds 97% by mass, the antistatic property is poor. The amount of component (C) used when it contains component (A) is 40 to 97% by mass, preferably 50 to 97% of the total of 100% by mass of component (A), component (B) and component (C). The mass% is more preferably 50 to 93% by mass, particularly preferably 55 to 92% by mass. If it is less than 40% by mass, the tackiness is lowered, and if it exceeds 97% by mass, the antistatic property is inferior.
[0142] 上記第一及び第二の実施形態による制電'粘着性榭脂組成物は、更に、上記本発 明の制電性榭脂組成物に配合可能な成分 (E)、各種添加剤、他の重合体等を含有 したものとすることができる。これらの種類及び含有量は、上記本発明の制電性榭脂 組成物における説明をそのまま適用することができる。  [0142] The antistatic adhesive rubber composition according to the first and second embodiments further includes a component (E) and various additives that can be blended in the antistatic resin composition of the present invention. In addition, other polymers can be contained. The description of the antistatic resin composition of the present invention can be applied to these types and contents as they are.
[0143] 本発明の制電 '粘着性榭脂組成物は、上記の成分 (A)、成分 (B)、成分 (C)、添 加剤等を各種押出機、バンバリ一ミキサー、エーダー、連続-一ダー、ロール等に投 入し、加熱下で溶融混練することにより得ることができる。各成分は、一括投入してか ら混練してよいし、分割して投入してもよい。混練後、そのまま成形品とする場合には 、射出成形、プレス成形、カレンダー成形、 Tダイ押出成形、インフレーション成形、 異形押出成形、発泡成形等公知の成形方法を適用することができる。また、前記方 法で得られたシート等に対して、更に真空成形等を適用することもできる。  [0143] The antistatic pressure-sensitive adhesive composition of the present invention comprises the above components (A), (B), (C), additives and the like in various extruders, Banbury mixers, aders, continuous -It can be obtained by putting it in a roll or roll and melt-kneading under heating. Each component may be mixed and then kneaded, or may be divided and added. In the case of forming a molded product as it is after kneading, known molding methods such as injection molding, press molding, calendar molding, T-die extrusion molding, inflation molding, profile extrusion molding, and foam molding can be applied. Further, vacuum forming or the like can be further applied to the sheet or the like obtained by the above method.
[0144] 本発明の制電 '粘着性榭脂組成物及びこれを用いてなる成形品は、温度 23°C、湿 度 50%RHの条件における表面固有抵抗を、好ましくは 5 X 1012 Ω以下、より好まし くは 9 X 1011 Ω以下、更に好ましくは 9 X 1010 Ω以下、特に好ましくは 5 X 109 Ω以下 とすることができる。 [0144] The antistatic 'adhesive resin composition of the present invention and a molded article using the same have a surface resistivity at a temperature of 23 ° C and a humidity of 50% RH, preferably 5 X 10 12 Ω. Or less, more preferably 9 × 10 11 Ω or less, further preferably 9 × 10 10 Ω or less, particularly preferably 5 × 10 9 Ω or less It can be.
[0145] 成形品の形状は、目的、用途等に応じたものとすることができ、シート、フィルム等 の薄様体;丸棒、角棒等の棒状体;更にはこれらの変形物等とすることができる。 上記成形品がシートである場合は、その厚さが、好ましくは 0. 2〜: LOmm、より好ま しくは 0. 5〜5mmである。  [0145] The shape of the molded product can be determined according to the purpose, application, etc., and thin sheets such as sheets and films; rod-shaped bodies such as round bars and square bars; can do. When the molded article is a sheet, the thickness thereof is preferably 0.2 to: LOmm, more preferably 0.5 to 5 mm.
また、フィルムである場合は、その厚さが、好ましくは 5〜200 μ m、より好ましくは 1 0〜150 πιである。  In the case of a film, the thickness is preferably 5 to 200 μm, more preferably 10 to 150 πι.
尚、シート及びフィルムの、片面又は両面には、目的、用途等に応じて、凹凸部、溝 部、穴部等を有してもよい。また、貫通孔を有してもよい。  Note that one or both sides of the sheet and film may have an uneven part, a groove part, a hole part, etc. depending on the purpose and application. Moreover, you may have a through-hole.
[0146] 本発明の制電'粘着性榭脂組成物を用いてなる成形品は、他の材料からなる成形 品と一体化した複合物品、例えば、後述する多層シート等の形成にも好適である。従 つて、上記複合物品において、本発明の制電'粘着性榭脂組成物を用いてなる成形 部が最表面にある場合には、上記条件における表面固有抵抗を維持することができ 、特に、制電性及び粘着性に優れる。また、上記他の材料が透明性を有する場合に は、複合物品全体として、透明性にも優れる。 [0146] A molded article using the antistatic adhesive pressure-sensitive resin composition of the present invention is also suitable for forming a composite article integrated with a molded article made of another material, for example, a multilayer sheet described later. is there. Therefore, in the above composite article, when the molded part using the antistatic adhesive adhesive composition of the present invention is on the outermost surface, the surface resistivity can be maintained under the above conditions. Excellent antistatic and adhesive properties. Further, when the other materials have transparency, the composite article as a whole is excellent in transparency.
[0147] 3.粘着フィルム [0147] 3. Adhesive film
3- 1.粘着フィルムの構成  3- 1. Composition of adhesive film
上記本発明の制電'粘着性樹脂組成物は、各種熱可塑性重合体組成物からなる 支持体に粘着層を形成するのに用いることができる。  The antistatic adhesive resin composition of the present invention can be used to form an adhesive layer on a support composed of various thermoplastic polymer compositions.
したがって、本発明によれば、各種熱可塑性重合体組成物からなる支持体と、該支 持体の少なくとも 1面側に配置され、且つ、上記本発明の制電'粘着性榭脂組成物か らなる制電性粘着層を備えてなる粘着フィルムが提供される。  Therefore, according to the present invention, there is provided a support composed of various thermoplastic polymer compositions and the antistatic adhesive resin composition of the present invention which is disposed on at least one surface side of the support. An adhesive film comprising the antistatic adhesive layer is provided.
支持体を構成する組成物として使用可能な熱可塑性重合体としては、一般的に、 エラストマ一、ゴム及び榭脂が挙げられる。これらは、単独でまたは 2種以上組み合わ せて用いることができる。  The thermoplastic polymers that can be used as the composition constituting the support generally include elastomers, rubbers and rosins. These can be used alone or in combination of two or more.
エラストマ一としては、ォレフィン系エラストマ一;スチレン 'ブタジエン 'スチレンブロ ック共重合体、スチレン 'イソプレン'スチレンブロック共重合体等のスチレン系エラス トマ一;ポリエステノレ系エラストマ一;ウレタン系エラストマ一;塩ビ系エラストマ一;ポリ アミド系エラストマ一;フッ素ゴム系エラストマ一等が挙げられる。これらは、 1種単独で または 2種以上を組み合わせて用いることができる。 Examples of elastomers include olefin elastomers; styrene elastomers such as styrene 'butadiene' styrene block copolymers and styrene 'isoprene' styrene block copolymers; polyester elastomer elastomers; urethane elastomers; Polyvinyl chloride elastomer; Poly Examples include amide elastomers; fluoro rubber elastomers and the like. These can be used alone or in combination of two or more.
[0148] ゴムとしては、ポリブタジエン、ポリイソプレン等のジェン系ゴム、スチレン'ブタジェ ン(ブロック)共重合体、スチレン 'イソプレン(ブロック)共重合体、アクリロニトリル 'ブ タジェン共重合体、ブタジエン'(メタ)アクリル酸エステル共重合体、水素化スチレン 'ブタジエンブロック共重合体、水素化ブタジエン系重合体、エチレン' aーォレフィ ン共重合体、エチレン' aーォレフイン'ポリェン共重合体、アクリル系ゴム、シリコー ンゴム、フッ素ゴム、ブチルゴム、エチレン系アイオノマー等が挙げられる。 [0148] Examples of rubbers include polybutadiene, polyisoprene and other gen-based rubbers, styrene 'butadiene (block) copolymers, styrene' isoprene (block) copolymers, acrylonitrile 'butadiene copolymers, butadiene' (metabolites). ) Acrylic acid ester copolymer, hydrogenated styrene 'butadiene block copolymer, hydrogenated butadiene-based polymer, ethylene' a-olefin copolymer, ethylene ' a- olefin-polyethylene copolymer, acrylic rubber, silicone rubber , Fluorine rubber, butyl rubber, ethylene ionomer and the like.
尚、上記スチレン 'ブタジエンブロック共重合体及び上記スチレン 'イソプレンブロッ ク共重合体には、 AB型、 ABA型、テーパー型、ラジアルテレブロック型の構造を有 するものも含まれる。更に、上記水素化ブタジエン系重合体は、上記ブロック共重合 体の水素化物のほ力に、スチレンブロックとスチレン 'ブタジエンランダム共重合ブロ ックを有する重合体の水素化物、 1, 2—ビニル結合含有量が 20質量%以下のポリ ブタジエンブロックと 1, 2—ビュル結合含量が 20重量%を超えるポリブタジエンブロ ックとからなる重合体の水素化物等が含まれる。  The styrene / butadiene block copolymer and the styrene / isoprene block copolymer include those having an AB type, ABA type, tapered type, or radial teleblock type structure. Further, the hydrogenated butadiene polymer is a hydride of a polymer having a styrene block and a styrene / butadiene random copolymer block, and a 1,2-vinyl bond, in addition to the hydride of the block copolymer. Examples include hydrides of polymers composed of polybutadiene blocks having a content of 20% by mass or less and polybutadiene blocks having a 1,2-bule bond content of more than 20% by weight.
上記ゴムは、 1種単独でまたは 2種以上を組み合わせて用いることができる。  The above rubbers can be used alone or in combination of two or more.
[0149] 熱可塑性榭脂としては、ポリエチレン、ポリプロピレン等のポリオレフイン系榭脂、ポ リメタクリル酸メチル等のアクリル系榭脂、ポリスチレン、ゴム強化スチレン系榭脂等の スチレン系榭脂、ポリエチレンテレフタレート、ポリブチレンテレフタレート等のポリエス テル榭脂、ナイロン 6、ナイロン 66、ナイロン 46等のポリアミド榭脂、ポリカーボネート 榭脂、フッ素榭脂、ポリスルホン、ポリフエ-レンスルフイド、液晶ポリマー等が挙げら れる。これらは、 1種単独でまたは 2種以上を組み合わせて用いることができる。また、 これらのうち、ポリオレフイン系榭脂、アクリル系榭脂、スチレン系榭脂、ポリエステル 榭脂、ポリアミド榭脂及びポリカーボネート榭脂が好ましぐ特に、ポリオレフイン系榭 脂及びスチレン系榭脂が好ま 、。  [0149] Thermoplastic resins include polyolefin resins such as polyethylene and polypropylene, acrylic resins such as polymethyl methacrylate, polystyrene, styrene resins such as rubber-reinforced styrene resin, polyethylene terephthalate, Polyester resin such as polybutylene terephthalate, polyamide resin such as nylon 6, nylon 66, nylon 46, polycarbonate resin, fluorine resin, polysulfone, polyphenylene sulfide, liquid crystal polymer and the like. These can be used alone or in combination of two or more. Of these, polyolefin resins, acrylic resins, styrene resins, polyester resins, polyamide resins and polycarbonate resins are particularly preferred. Polyolefin resins and styrene resins are preferred. .
[0150] 支持体の成形材料として有用なポリオレフイン系榭脂組成物は、ポリオレフイン系榭 脂を含有するものであれば、特に限定されず、ポリオレフイン系榭脂のみであってよ いし、ポリオレフイン系榭脂と、他の成分 (添加剤、他の重合体等)との混合物であつ てもよい。後者の場合、上記本発明の制電性榭脂組成物をそのまま用いてよいし、そ れ以外の他の組成物を用いてもよい。制電性が求められる場合には、本発明の制電 性榭脂組成物を用いることが特に好まし 、。 [0150] The polyolefin resin composition useful as a molding material for the support is not particularly limited as long as it contains a polyolefin resin, and may be only a polyolefin resin, or a polyolefin resin. A mixture of fat and other ingredients (additives, other polymers, etc.) May be. In the latter case, the antistatic resin composition of the present invention may be used as it is, or other composition may be used. When antistatic properties are required, it is particularly preferable to use the antistatic resin composition of the present invention.
上記ポリオレフイン系榭脂は、炭素数が 2以上のォレフィン類の単独重合体、 2種以 上の α—ォレフインの共重合体、 α—ォレフインとその他のビュル系モノマーとの共 重合体である。具体的には、低密度ポリエチレン (LDPE)、中密度ポリエチレン、高 密度ポリエチレン(HDPE)、超高分子量ポリエチレン(UHMPE);エチレンと、プロ ピレン、 1ーブテン、 1 ペンテン、 1一へキセン、 4ーメチノレー 1 ペンテン、 1—オタ テン、 1ーデセン等の炭素数 3〜12の (Xーォレフインとの共重合体;ポリプロピレン(P P);プロピレンと、 1—ブテン、 1—ペンテン、 1—へキセン、 4—メチル 1—ペンテン 、 1—オタテン、 1—デセン等の炭素数 4〜12の α—ォレフィンとの共重合体;上記本 発明の制電性榭脂組成物に配合可能なポリオレフイン系榭脂 (A— 1)に含まれる、 エチレン ·環状ォレフィン共重合体、プロピレン ·環状ォレフィン共重合体;エチレン' プロピレン'ジェン共重合体;ポリメチルペンテン(ΜΡΧ);エチレンと、酢酸ビュル、ァ クリル酸ェチル、メタクリル酸、メタクリル酸ェチル、マレイン酸、無水マレイン酸等のビ -ル系モノマーとの共重合体;前記ポリエチレンもしくはエチレンと aーォレフインと の共重合体を、アクリル酸、マレイン酸等の不飽和カルボン酸又はその誘導体で変 性された共重合体等が挙げられる。更に、上記本発明の制電性榭脂組成物に含有 された成分 (B)を用いることもできる。これらは、 1種単独でまたは 2種以上を組み合 わせて用いることができる。  The polyolefin resin is a homopolymer of olefins having 2 or more carbon atoms, a copolymer of two or more α-olefins, and a copolymer of α-olefin and other bur monomers. Specifically, low density polyethylene (LDPE), medium density polyethylene, high density polyethylene (HDPE), ultra high molecular weight polyethylene (UHMPE); ethylene, propylene, 1-butene, 1 pentene, 1-hexene, 4-methinole 1-Pentene, 1-Otaten, 1-decene, etc., C3-C12 (Copolymer with X-olefins; Polypropylene (PP); Propylene, 1-butene, 1-pentene, 1-hexene, 4— Copolymers with α-olefins having 4 to 12 carbon atoms such as methyl 1-pentene, 1-octene, 1-decene; polyolefin resin that can be blended in the antistatic resin composition of the present invention (A — Ethylene / cyclic olefin copolymers, propylene / cyclic olefin copolymers; ethylene 'propylene' gen copolymers; polymethylpentene (ΜΡΧ); ethylene and butyl acetate Copolymers with beryl monomers such as ethyl acrylate, methacrylate, ethyl methacrylate, maleic acid, maleic anhydride; copolymers of polyethylene or ethylene and a-olefin are used as acrylic acid, maleic acid And a copolymer modified with an unsaturated carboxylic acid such as a derivative thereof, etc. Furthermore, the component (B) contained in the antistatic resin composition of the present invention can also be used. Can be used singly or in combination of two or more.
従って、上記本発明の制電性榭脂組成物に含有された成分 (A)のみを用いてょ ヽ し、該成分 (A)及び成分 (B)を併用してもよい。後者の場合、支持体における制電性 及び粘着フィルムとしての制電性に優れる。  Therefore, only the component (A) contained in the antistatic resin composition of the present invention may be used, and the component (A) and the component (B) may be used in combination. In the latter case, the antistatic property of the support and the antistatic property as an adhesive film are excellent.
また、これらのうち、ポリエチレン、ポリプロピレン、プロピレン 'エチレン共重合体が 好ましぐプロピレン単位を全単量体単位に対して、 50質量%以上含む重合体、即 ち、ポリプロピレン、プロピレン 'エチレン共重合体がより好ましい。尚、上記プロピレン •エチレン共重合体としては、ランダム共重合体、ブロック共重合体等がある力 ラン ダム共重合体が特に好ましい。更に、これらの重合体と、上記本発明の制電性榭脂 組成物に配合可能なポリオレフイン系榭脂 (A— 1)に含まれる、エチレン '環状ォレフ イン共重合体、プロピレン '環状ォレフィン共重合体等とを組み合わせることにより、粘 着フィルムとしての耐熱性が一段と優れる。特に、このポリオレフイン系榭脂 (A—1) 力 上記支持体に対して、 40質量%以上 (好ましくは 50質量%以上、より好ましくは 60質量%以上)含まれる場合には、 70°C以上 (好ましくは 80°C以上、より好ましくは 90°C以上)の温度において、反り、ねじれ等の変形が発生しない支持体とすることが できる。 Among these, polyethylene, polypropylene, propylene and ethylene copolymers are preferred polymers containing 50% by mass or more of propylene units based on the total monomer units, that is, polypropylene, propylene and ethylene copolymers. Coalescence is more preferred. As the propylene / ethylene copolymer, a power random copolymer having a random copolymer, a block copolymer and the like is particularly preferable. Further, these polymers and the above antistatic resin of the present invention. Heat resistance as an adhesive film can be achieved by combining ethylene 'cyclic polyolefin copolymer, propylene' cyclic polyolefin copolymer, etc., contained in the polyolefin resin (A-1) that can be blended in the composition. Even better. In particular, when this polyolefin resin (A-1) force is 40% by mass or more (preferably 50% by mass or more, more preferably 60% by mass or more) with respect to the above support, 70 ° C or more At a temperature (preferably 80 ° C. or higher, more preferably 90 ° C. or higher), a support that does not undergo deformation such as warping or twisting can be obtained.
支持体の成形材料として有用なスチレン系榭脂組成物は、スチレン系榭脂を含有 するものであれば、特に限定されず、スチレン系榭脂のみであってよいし、スチレン 系榭脂と、他の成分 (添加剤、他の重合体等)との混合物であってもよい。  The styrene-based resin composition useful as a molding material for the support is not particularly limited as long as it contains a styrene-based resin, and may be only a styrene-based resin, It may be a mixture with other components (additives, other polymers, etc.).
スチレン系榭脂 (D) (本発明にお 、て「成分 (D)」とも 、う)は、ゴム質重合体の存在 下に芳香族ビニル化合物を含む単量体成分を重合して得られる榭脂及び Z又はゴ ム質重合体の非存在下に、芳香族ビニル化合物を含む単量体成分を重合して得ら れる榭脂である。上記ゴム質重合体としては、例えば、ポリブタジエン、ポリイソプレン 、スチレン 'ブタジエン(ブロック)共重合体、スチレン 'イソプレン(ブロック)共重合体 、アクリロニトリル 'ブタジエン共重合体、ブタジエン.(メタ)アクリル酸エステル共重合 体、水素化スチレン 'ブタジエンブロック共重合体、水素化ブタジエン系重合体、ェチ レン' aーォレフイン共重合体(例えば、エチレン 'プロピレン共重合体、エチレン'プ ロピレン.非共役ジェン共重合体、エチレン.ブテン 1共重合体、エチレン'ブテン —1 ·非共役ジェン共重合体など)、エチレン' a—ォレフイン'ポリェン共重合体、ァ クリル系ゴム、シリコーンゴム、シリコーン 'アクリル系 IPNゴム、及び上記成分(C)で 述べた芳香族ビ-ルイ匕合物力 主としてなる重合体ブロックと共役ジェンから主とし てなる重合体ブロックとを含有するブロック共重合体及びその水素添加物等である。 これらは、 1種単独でまたは 2種以上を組み合わせて用いることができる。好ましいも のは、ポリブタジエン、ブタジエン 'スチレン共重合体及びその水素添加物、エチレン 'プロピレン共重合体、エチレン 'プロピレン '非共役ジェン共重合体、アクリルゴム、 シリコーンゴムである。特に好ましいものは、ポリブタジエン、ブタジエン 'スチレン共 重合体である。ここで用いられるブタジエン 'スチレン共重合体としては、通常、ブロッ ク及び zまたはランダム共重合体が用いられる。スチレン系榭脂として、支持体フィ ルムとしたときに柔軟性の面力 ゴム質重合体を含有するものが好ましい。 Styrenic resin (D) (also referred to as “component (D)” in the present invention) is obtained by polymerizing a monomer component containing an aromatic vinyl compound in the presence of a rubbery polymer. This is a resin obtained by polymerizing a monomer component containing an aromatic vinyl compound in the absence of resin and Z or rubber polymer. Examples of the rubber polymer include polybutadiene, polyisoprene, styrene'butadiene (block) copolymer, styrene'isoprene (block) copolymer, acrylonitrile 'butadiene copolymer, and butadiene (meth) acrylate. Copolymer, hydrogenated styrene 'butadiene block copolymer, hydrogenated butadiene polymer, ethylene' a-olefin copolymer (eg, ethylene 'propylene copolymer, ethylene' propylene, non-conjugated gen copolymer) , Ethylene.butene-1 copolymer, ethylene'butene-1 non-conjugated gen copolymer, etc.), ethylene'a-olefin'polyene copolymer, acrylic rubber, silicone rubber, silicone 'acrylic IPN rubber A polymer block mainly composed of aromatic beryl compounds described in the above component (C), and A block copolymer containing a polymer block mainly composed of conjugation and a hydrogenated product thereof. These can be used alone or in combination of two or more. Preferable are polybutadiene, butadiene'styrene copolymer and its hydrogenated product, ethylene'propylene copolymer, ethylene'propylene'non-conjugated gen copolymer, acrylic rubber, and silicone rubber. Particularly preferred are polybutadiene and butadiene'styrene copolymers. The butadiene 'styrene copolymer used here is usually a block. And z or random copolymers are used. As the styrene-based resin, those containing a rubbery polymer having a flexible surface when used as a support film are preferable.
[0153] スチレン系榭脂におけるゴム質重合体含有量は、スチレン系榭脂を 100質量0 /0とし て、好ましくは 3〜80質量%。更に好ましくは 5〜70質量%、特に好ましくは 10〜60 質量%である。 [0153] rubbery polymer content in the styrene-based榭脂is a styrene榭脂to 100 mass 0/0, preferably 3-80% by weight. More preferably, it is 5-70 mass%, Most preferably, it is 10-60 mass%.
上記ゴム質重合体のゲル含率は、特に限定しないが、乳化重合でゴム質重合体を 得る場合、ゲル含率は、好ましくは 98質量%以下であり、更に好ましくは 40〜98質 量0 /0である。この範囲において、フィルム化した際の外観に優れる。 The gel content of the rubber polymer is not particularly limited, but when a rubber polymer is obtained by emulsion polymerization, the gel content is preferably 98% by mass or less, more preferably 40 to 98 mass 0. / 0 . Within this range, the appearance when formed into a film is excellent.
尚、上記ゲル含率は、以下に示す方法により求めることができる。すなわち、ゴム質 重合体 lgをトルエン 100mlに投入し、室温で 48時間静置したのち、 100メッシュの 金網(質量を W1グラムとする)で濾過したトルエン不溶分と金網を 80°Cで 6時間真空 乾燥して秤量 (質量を W2グラムとする)し、下記式(1)により算出する。  In addition, the said gel content rate can be calculated | required by the method shown below. That is, the rubber polymer lg was put into 100 ml of toluene and allowed to stand at room temperature for 48 hours, and then the toluene insoluble matter and the wire mesh filtered through a 100 mesh wire mesh (with a mass of W1 gram) were heated at 80 ° C for 6 hours. Vacuum dry, weigh (weight is W2 grams), and calculate by the following formula (1).
[0154] ゲル含率 (質量0 /0) = [ {W2 (g)-Wl (g)}/l (g) ] X 100· ·· (1) [0154] gel content (mass 0/0) = [{W2 (g) -Wl (g)} / l (g)] X 100 · ·· (1)
ゲル含率は、ゴム質重合体の製造時に、分子量調節剤の種類及び量、重合時間、 重合温度、重合転化率等を適宜設定することにより調整される。  The gel content is adjusted by appropriately setting the type and amount of the molecular weight regulator, the polymerization time, the polymerization temperature, the polymerization conversion rate, etc. during the production of the rubbery polymer.
[0155] 上記スチレン系榭脂で使用されるビニル単量体を構成する芳香族ビニル化合物と しては、スチレン、 α—メチルスチレン、ヒドロキシスチレン等が挙げられ、これらは 1 種単独で、または 2種以上を組み合わせて用いることができる。また、これらのうち、ス チレン、 α—メチルスチレンが好ましい。 [0155] Examples of the aromatic vinyl compound constituting the vinyl monomer used in the styrene-based resin include styrene, α-methylstyrene, hydroxystyrene, and the like. These may be used alone or in combination. Two or more types can be used in combination. Of these, styrene and α-methylstyrene are preferred.
芳香族ビ-ルイ匕合物と共重合可能な他のビュル単量体としては、ビニルシアンィ匕 合物、(メタ)アクリル酸エステル化合物、マレイミドィ匕合物、及び、その他の各種官能 基含有不飽和化合物等が挙げられる。本発明の目的の 1つである表示装置用の保 護フィルムの支持体に使用されるスチレン系榭脂としては、透明性を有することが好 ましぐ使用される好ましいビニル単量体は、芳香族ビニルイ匕合物及び (メタ)アクリル 酸アルキルエステル化合物を必須成分として、必要に応じて、シアン化ビニル化合 物、及びマレイミドィ匕合物からなる群より選ばれる 1種または 2種以上が併用され、ま た必要に応じて、その他の各種官能基含有ィ匕合物の少なくとも 1種が併用される。そ の他の各種官能基含有不飽和化合物としては、不飽和酸化合物、エポキシ基含有 不飽和化合物、置換または非置換のアミノ基含有不飽和化合物、ォキサゾリン基含 有不飽和化合物等が挙げられる。上記その他の各種官能基含有不飽和化合物は 1 種単独で、または 2種以上組み合わせて使用できる。 Other bull monomers copolymerizable with aromatic beryl compounds include vinylcyan compounds, (meth) acrylic acid ester compounds, maleimide compounds, and other functional group-containing unsaturated compounds. Compounds and the like. As a styrene-based resin used as a support for a protective film for a display device, which is one of the objects of the present invention, a preferable vinyl monomer that is preferably used for transparency is aromatic. One or two or more compounds selected from the group consisting of vinyl cyanide compounds and maleimide compounds are used in combination, as required, with an aromatic vinyl ester compound and a (meth) acrylic acid alkyl ester compound as essential components. In addition, if necessary, at least one of various other functional group-containing compounds is used in combination. Other unsaturated functional group-containing unsaturated compounds include unsaturated acid compounds and epoxy group-containing Examples thereof include unsaturated compounds, substituted or unsubstituted amino group-containing unsaturated compounds, and oxazoline group-containing unsaturated compounds. The above other various functional group-containing unsaturated compounds can be used alone or in combination of two or more.
[0156] ここで使用されるシアンィ匕ビ-ルイ匕合物としては、アクリロニトリル、メタタリロニトリル 等が挙げられ、これらは、 1種単独で、または 2種以上を組み合わせて用いることがで きる。シアン化合物を使用すると、耐薬品性が付与できる。シアン化合物を使用する 場合、その使用量は、単量体成分中、好ましくは 1〜60質量%、更に好ましくは 5〜 50質量%ある。 [0156] Examples of cyanobi-louis compounds used here include acrylonitrile, methacrylonitrile, etc., and these can be used alone or in combination of two or more. . When a cyan compound is used, chemical resistance can be imparted. When a cyan compound is used, the amount used is preferably 1 to 60% by mass, more preferably 5 to 50% by mass in the monomer component.
(メタ)アクリル酸エステル化合物としては、アクリル酸メチル、アクリル酸ェチル、ァク リル酸ブチル、メタクリル酸メチル、メタクリル酸ブチル等が挙げられ、これらは、 1種 単独で、または 2種以上を組み合わせて用いることができる。特に好ましいものはメタ クリル酸メチルであり、ゴム質重合体としてポリブタジエンを用いた場合、スチレン Zメ タクリル酸メチルの使用量 20〜30Z70〜80質量% (合計 100質量0 /0)の範囲で透 明性に優れたスチレン系榭脂を得ることができる。 Examples of (meth) acrylic acid ester compounds include methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, butyl methacrylate, and the like. These may be used alone or in combination of two or more. Can be used. Particularly preferred are methyl methacrylate, in the case of using polybutadiene as the rubber polymer, Toru range of usage 20~30Z70~80 wt% styrene Z main methacrylic acid methyl (total 100 mass 0/0) A styrene-based resin having excellent lightness can be obtained.
マレイミド化合物として、マレイミド、 Ν—フエ-ルマレイミド、 Ν—シクロへキシルマレ イミド等が挙げられ、これらは、 1種単独で、または 2種以上を組み合わせて用いるこ とができる。また、マレイミド単位を導入するために、無水マレイン酸を共重合させ、後 イミドィ匕してもよい。マレイミド化合物を使用すると、耐熱性が付与される。マレイミド化 合物を使用する場合、その使用量は、単量体成分中、好ましくは 1〜60質量%、さら に好ましくは 5〜50質量%である。  Examples of maleimide compounds include maleimide, Ν-maleimide, Ν-cyclohexylmaleimide, and the like. These may be used alone or in combination of two or more. In order to introduce a maleimide unit, maleic anhydride may be copolymerized and subsequently imidized. When a maleimide compound is used, heat resistance is imparted. When a maleimide compound is used, the amount used is preferably 1 to 60% by mass, more preferably 5 to 50% by mass in the monomer component.
[0157] 不飽和酸化合物としては、アクリル酸、メタクリル酸、ェタクリル酸、マレイン酸、フマ ル酸、ィタコン酸、クロトン酸、桂皮酸等が挙げられ、これらは、 1種単独で、または 2 種以上を組み合わせて用いることができる。 [0157] Examples of unsaturated acid compounds include acrylic acid, methacrylic acid, ethacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, and the like. These may be used alone or in combination. A combination of the above can be used.
エポキシ基含有不飽和化合物としては、グリシジルアタリレート、グリシジルメタクリレ ート、ァリルグリシジルエーテル等が挙げられ、これらは、 1種単独で、または 2種以上 を組み合わせて用いることができる。  Examples of the epoxy group-containing unsaturated compound include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, and the like. These may be used alone or in combination of two or more.
水酸基含有不飽和化合物としては、 3—ヒドロキシー 1 プロペン、 4ーヒドロキシー 1ーブテン、シスー4ーヒドロキシ 2 ブテン、トランスー4ーヒドロキシ 2 ブテン、 3 ヒドロキシ一 2—メチル 1—プロペン、 2 ヒドロキシェチルメタタリレート、 2 ヒ ドロキシェチルアタリレート、 N- (4ーヒドロキシフエ-ル)マレイミド等が挙げられ、こ れらは、 1種単独で、または 2種以上を組み合わせて用いることができる。 Examples of hydroxyl-containing unsaturated compounds include 3-hydroxy-1-propene, 4-hydroxy-1-butene, cis-4-hydroxy-2-butene, trans-4-hydroxy-2-butene, 3 Hydroxy 1-methyl 1-propene, 2 Hydroxyethyl methacrylate, 2 Hydroxetyl acrylate, N- (4-Hydroxyphenol) maleimide, and so on. Or two or more types can be used in combination.
[0158] 酸無水物基含有不飽和化合物としては、無水マレイン酸、無水ィタコン酸、無水シ トラコン酸等が挙げられ、これらは、 1種単独で、または 2種以上を組み合わせて用い ることがでさる。 [0158] Examples of the acid anhydride group-containing unsaturated compound include maleic anhydride, itaconic anhydride, citraconic anhydride, and the like. These may be used alone or in combination of two or more. I'll do it.
ォキサゾリン基含有不飽和化合物としては、ビュルォキサゾリン等が挙げられ、これ らは 1種単独で、または 2種以上を組み合わせて用いることができる。  Examples of the oxazoline group-containing unsaturated compound include bruoxazoline, and these can be used alone or in combination of two or more.
置換または非置換のアミノ基含有不飽和化合物としては、アクリル酸アミノエチル、 アクリル酸プロピルアミノエチル、メタクリル酸ジメチルアミノエチル、メタクリル酸フエ- ルアミノエチル、 N ビ-ルジェチルァミン、 N ァセチルビ-ルァミン、アクリルアミ ン、メタクリルァミン、 N メチルアクリルァミン、アクリルアミド、 N メチルアクリルアミ ド、 p—アミノスチレン等があり、これらは、 1種単独で、または 2種以上を組み合わせ て用いることができる。  Examples of substituted or unsubstituted amino group-containing unsaturated compounds include aminoethyl acrylate, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, phenylaminoethyl methacrylate, N-biethylethylamine, N-acetylethylamine, acrylamine. , Methacrylamine, N-methylacrylamine, acrylamide, N-methylacrylamide, p-aminostyrene, etc., and these can be used alone or in combination of two or more.
上記その他の各種官能基含有不飽和化合物の使用量は、スチレン系榭脂中に使 用される該官能基含有不飽和化合物の合計量で、スチレン系榭脂全体に対して 0. 1〜20質量%が好ましぐ 0. 1〜10質量%が更に好ましい。  The amount of the above other various functional group-containing unsaturated compounds used is the total amount of the functional group-containing unsaturated compounds used in the styrene-based resin, and is 0.1 to 20 with respect to the entire styrene-based resin. 0.1% to 10% by mass is more preferable.
[0159] 本発明のスチレン系榭脂は、公知の重合法、例えば、乳化重合、塊状重合、溶液 重合、懸濁重合およびこれらを組み合わせた重合法で製造することができる。これら のうち、ゴム質重合体の存在下に、ビニル単量体を (共)重合して得られる重合体の 好ましい重合法は、乳化重合および溶液重合である。一方、ゴム質重合体の非存在 下に、ビニル系単量体を (共)重合して得られる重合体の好ましい重合法は、塊状重 合、溶液重合、懸濁重合、および乳化重合である。 [0159] The styrene-based resin of the present invention can be produced by a known polymerization method, for example, emulsion polymerization, bulk polymerization, solution polymerization, suspension polymerization, or a combination of these. Among these, preferred polymerization methods for a polymer obtained by (co) polymerizing a vinyl monomer in the presence of a rubbery polymer are emulsion polymerization and solution polymerization. On the other hand, preferred polymerization methods for polymers obtained by (co) polymerizing vinyl monomers in the absence of rubbery polymers are bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization. .
[0160] 乳化重合で製造する場合、重合開始剤、連鎖移動剤、乳化剤等が用いられるが, これらは公知のものが全て使用できる。 [0160] In the case of producing by emulsion polymerization, a polymerization initiator, a chain transfer agent, an emulsifier and the like are used, and all of these known ones can be used.
重合開始剤としては、タメンノヽイド口パーオキサイド、 p—メンタンノヽイド口パーォキサ イド、ジイソプロピルベンゼンハイド口パーオキサイド、テトラメチルブチルハイド口パー オキサイド、 tert—ブチルハイド口バーオキサォイド、過硫酸カリウム、ァゾビスイソブ チ口-トリル等が挙げられる。 As polymerization initiators, tamennoide mouth peroxide, p-menthannoide mouth peroxide, diisopropylbenzene hydride mouth peroxide, tetramethylbutyl hydride mouth peroxide, tert-butyl hydride mouth peroxide, potassium persulfate, azobisisobutane Chiguchi-Trill and the like.
また、重合開始助剤として、各種還元剤、含糖ピロリン酸鉄処方、スルホキシレート 処方等のレドックス系を用いることが好まし 、。  Further, it is preferable to use redox systems such as various reducing agents, sugar-containing iron pyrophosphate formulations, sulfoxylate formulations, etc. as polymerization initiation aids.
連鎖移動剤としては、ォクチルメルカプタン、 n—ドデシルメルカプタン、 t—ドデシ ルメルカプタン、 n キシルメルカプタン、ターピノーレン類等が挙げられる。  Examples of the chain transfer agent include octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, n-xyl mercaptan, terpinolene and the like.
乳化剤としては、ドデシルベンゼンスルホン酸ナトリウム等のアルキルベンゼンスル ホン酸塩、ラウリル硫酸ナトリウム等の脂肪族スルホン酸塩、ラウリル酸カリウム、ステ アリン酸カリウム、ォレイン酸カリウム、パルミチン酸カリウム等の高級脂肪酸塩、ロジ ン酸カリウム等のロジン酸塩等を用いることができる。  Examples of the emulsifier include alkylbenzene sulfonates such as sodium dodecylbenzene sulfonate, aliphatic sulfonates such as sodium lauryl sulfate, higher fatty acid salts such as potassium laurate, potassium stearate, potassium oleate, and potassium palmitate. A rosinate such as potassium rosinate can be used.
[0161] 尚、乳化重合にぉ 、て、ゴム質重合体およびビュル系単量体の使用方法は、ゴム 質重合体全量の存在下にビニル系単量体を一括添加して重合してもよく、分割もしく は連続添加して重合してもよい。また、ゴム質重合体の一部を重合途中で添加しても よい。 [0161] Incidentally, in the emulsion polymerization, the method of using the rubbery polymer and the bull monomer may be carried out by adding a vinyl monomer all at once in the presence of the total amount of the rubbery polymer. It may be polymerized by dividing or continuously adding. A part of the rubber polymer may be added during the polymerization.
乳化重合後の、得られたラテックスは、通常、凝固剤により凝固させ、水洗、乾燥す ることにより、スチレン系榭脂の粉末を得る。この際、乳化重合で得た 2種以上のラテ ックスを適宜ブレンドしたあと、凝固してもよい。ここで使用される凝固剤としては、塩 化カルシウム、硫酸マグネシウム、塩ィ匕マグネシウム等の無機塩、または硫酸、塩酸 、酢酸、クェン酸、リンゴ酸等の酸を用いることができる。  The obtained latex after emulsion polymerization is usually coagulated with a coagulant, washed with water and dried to obtain a styrene-based resin powder. At this time, two or more kinds of latexes obtained by emulsion polymerization may be appropriately blended and then coagulated. As the coagulant used here, inorganic salts such as calcium chloride, magnesium sulfate and magnesium chloride, or acids such as sulfuric acid, hydrochloric acid, acetic acid, citrate and malic acid can be used.
[0162] 溶液重合によりスチレン系榭脂を製造する場合に用いることのできる溶剤は、通常 のラジカル重合で使用される不活性重合溶媒であり、例えば、ェチルベンゼン、トル ェン等の芳香族炭化水素、メチルェチルケトン、アセトン等のケトン類、ァセトニトリル[0162] Solvents that can be used in the production of styrene-based resins by solution polymerization are inert polymerization solvents that are used in ordinary radical polymerization, for example, aromatic hydrocarbons such as ethylbenzene and toluene. , Ketones such as methyl ethyl ketone and acetone, acetonitrile
、ジメチルホルムアミド、 N—メチルピロリドン等が挙げられる。 , Dimethylformamide, N-methylpyrrolidone and the like.
重合温度は、好ましくは 80 140°C、更に好ましくは 85 120°Cの範囲である。重 合に際し、重合開始剤を用いてもよいし、重合開始剤を使用せずに、熱重合で重合 してもよい。重合開始剤としては、ケトンパーオキサイド、ジアルキルパーオキサイド、 ジァシルバーオキサイド、パーォキシエステル、ハイド口パーオキサイド、ァゾビスイソ ブチロニトリル、ベンゾィルパーオキサイド、 1, Γ—ァゾビス(シクロへキサン— 1—力 ーボ-トリル)等が好ましく用いられる。 また、連鎖移動剤を用いる場合、例えば、メルカブタン類、ターピノーレン類、 OC— メチルスチレンダイマー等を用いることができる。 The polymerization temperature is preferably in the range of 80 140 ° C, more preferably 85 120 ° C. In the polymerization, a polymerization initiator may be used, or polymerization may be performed by thermal polymerization without using a polymerization initiator. Polymerization initiators include ketone peroxide, dialkyl peroxide, disilver oxide, peroxyester, hydrated peroxide, azobisisobutyronitrile, benzoyl peroxide, 1, Γ-azobis (cyclohexane-1—power (Both-tolyl) and the like are preferably used. When a chain transfer agent is used, for example, mercaptans, terpinolenes, OC-methylstyrene dimer, etc. can be used.
また、塊状重合、懸濁重合で製造する場合、溶液重合において説明した重合開始 剤、連鎖移動剤等を用いることができる。  In the case of production by bulk polymerization or suspension polymerization, the polymerization initiator, chain transfer agent, etc. described in the solution polymerization can be used.
上記重合法によって得たスチレン系榭脂中に残存する単量体量は、好ましくは 10 , OOOppm以下、更に好ましくは 5, OOOppm以下である。  The amount of monomer remaining in the styrene-based resin obtained by the above polymerization method is preferably 10, OOOppm or less, more preferably 5, OOOppm or less.
[0163] また、ゴム質重合体の存在下にビュル単量体を重合して得られるスチレン系榭脂は 、通常、上記ビニル系単量体がゴム質重合体にグラフト共重合した共重合体とゴム質 重合体にグラフトして 、な 、未グラフト成分 (上記ビニル系単量体の(共)重合体)が 含まれる。 [0163] Further, a styrene-based resin obtained by polymerizing a butyl monomer in the presence of a rubbery polymer is usually a copolymer obtained by graft-copolymerizing the vinyl monomer to a rubbery polymer. And grafted to a rubbery polymer, and contains an ungrafted component (the (co) polymer of the vinyl monomer).
ゴム質重合体の存在下にビュル単量体を重合して得られるスチレン系榭脂のダラ フト率は、好ましくは 20〜200質量%、更に好ましくは 30〜150質量%、特に好まし くは 40〜120質量%であり、グラフト率は、下記式(2)により求めることができる。  The styrene-based resin obtained by polymerizing a bulu monomer in the presence of a rubber polymer preferably has a draft rate of 20 to 200% by mass, more preferably 30 to 150% by mass, and particularly preferably. It is 40-120 mass%, and a graft ratio can be calculated | required by following formula (2).
[0164] グラフト率 (質量0 /0) = { (T— S) /S} X 100· ·· (2) [0164] Graft ratio (mass 0/0) = {(T- S) / S} X 100 · ·· (2)
上記式(2)中、 Tはゴム質重合体の存在下にビュル単量体を重合して得られるスチ レン系榭脂 lgをアセトン 20mlに投入し、振とう機により 2時間振とうした後、遠心分離 機(回転数; 23, OOOrpm)で 60分間遠心分離し、不溶分と可溶分とを分離して得ら れる不溶分の質量 (g)であり、 Sは成分 (D) lgに含まれるゴム質重合体の質量 (g)で ある。  In the above formula (2), T represents styrene-based lg obtained by polymerizing a bulu monomer in the presence of a rubbery polymer, and the mixture is shaken with a shaker for 2 hours in 20 ml of acetone. , The mass (g) of insoluble matter obtained by centrifuging for 60 minutes in a centrifuge (rotation speed: 23, OOOrpm) and separating the insoluble matter and the soluble matter, and S is the component (D) lg Is the mass (g) of the rubbery polymer contained in.
[0165] また、本発明のスチレン系榭脂に関わる成分のアセトン可溶分の極限粘度 [ η ] (溶 媒としてメチルェチルケトンを使用し、 30°Cで測定)は、好ましくは 0. 2〜1. 2dlZg、 更【こ好ましく ίま 0. 2〜1. Odl/g、特【こ好ましく ίま 0. 3〜0. 8dl/gである。  [0165] In addition, the intrinsic viscosity [η] (measured at 30 ° C using methyl ethyl ketone as the solvent) of the acetone-soluble component of the component related to the styrene-based resin of the present invention is preferably 0. 2 to 1.2 dlZg, more preferably 0.3 to 1 Odl / g, and particularly preferably 0.3 to 0.8 dl / g.
ゴム質重合体の存在下にビニル単量体を重合して得られるスチレン系榭脂中に分 散するグラフトイ匕ゴム質重合体粒子の平均粒径は、好ましくは 500〜30, 000OA、 更【こ好まし <ίま 1, 000〜20, 000 Α、特【こ好まし < ίま 1, 500〜8, ΟΟθΑの範囲で ある。平均粒径は、電子顕微鏡を用いる公知の方法で測定できる。  The average particle size of the grafted rubber polymer particles dispersed in the styrene-based resin obtained by polymerizing the vinyl monomer in the presence of the rubber polymer is preferably 500 to 30,000 OA. This is in the range of <10000 or 20,000 to 2,000 mm, especially in the range of <500 or more to 1,500 to 8, or ΟΟθΑ. The average particle diameter can be measured by a known method using an electron microscope.
[0166] 支持体を構成する組成物は、熱可塑性重合体のみでもよぐまた帯電防止剤を含 有していてもよい。帯電防止剤の使用量は、熱可塑性重合体と帯電防止剤の合計 1 00質量%としたとき、 3〜30質量%、好ましくは 5〜25質量%、更に好ましくは 8〜2 0質量%、特に好ましくは 10〜20質量%である。その使用量が 3質量%未満である と目的の制電性が得られない。 30質量%を超えると均一なフィルムが得られない。 帯電防止剤は特に限定されない。公知の帯電防止剤が使用できる。好ましい帯電 防止剤としては、帯電防止剤添加で透明性を損なわないものがよい。好ましい帯電 防止剤としては、上記成分 (B)及び下記に示すポリアミドブロック (F— 2— 1)と親水 性ポリマーブロック (F— 2— 2)とを有するブロック共重合体力 なる帯電防止剤 (F) が挙げられる。特に好ましくは、下記に示す帯電防止剤 (F)である。 [0166] The composition constituting the support may be a thermoplastic polymer alone or may contain an antistatic agent. The amount of antistatic agent used is the sum of thermoplastic polymer and antistatic agent 1 When it is 00 mass%, it is 3-30 mass%, Preferably it is 5-25 mass%, More preferably, it is 8-20 mass%, Most preferably, it is 10-20 mass%. If the amount used is less than 3% by mass, the desired antistatic property cannot be obtained. If it exceeds 30% by mass, a uniform film cannot be obtained. The antistatic agent is not particularly limited. A known antistatic agent can be used. A preferable antistatic agent is one that does not impair transparency when an antistatic agent is added. As a preferable antistatic agent, an antistatic agent (F) having the above-mentioned component (B) and a block copolymer having a polyamide block (F-2-1) and a hydrophilic polymer block (F-2-2) shown below (F ). Particularly preferred is the antistatic agent (F) shown below.
[0167] 帯電防止剤 (F)は、ポリアミドブロック (F— 2— 1)と親水性ポリマーブロック (F— 2 —2)力もなる。ここで使用されるポリアミドとしては、エチレンジァミン、テトラメチレンジ ァミン、へキサメチレンジァミン、デカメチレンジァミン、 2, 3, 4もしくは 2, 4, 4ートリメ チレンへキサメチレンジァミン、 1, 3もしくは 1, 4—ビス(アミノメチル)シクロへキサン 、ビス(p—ァミノへキシル)メタン、フエ-ルジァミン、 m—キシレンジァミン、 p—キシレ ンジァミン等の脂肪族、脂環族、または芳香族ジァミン等のジァミン成分と、アジピン 酸、スベリン酸、セバシン酸、シクロへキサンジカルボン酸、テレフタル酸、イソフタル 酸等の脂肪族、脂環族または芳香族ジカルボン酸とから導かれるポリアミド、力プロラ クタム、ラウリルラタタム等のラタタム類の開環重合によって得られるポリアミド、 ω—ァ ミノカプロン酸、 ω—アミノエナン酸、アミノウンデカン酸、 1, 2—アミノドデカン酸等の アミノカルボン酸力 導かれるポリアミド、ならびにこれらの共重合ポリアミドがあり、更 にこれらの混合ポリアミドが挙げられる。 [0167] The antistatic agent (F) also acts as a polyamide block (F-2-1) and a hydrophilic polymer block (F-2-2). Polyamides used here include ethylene diamine, tetramethylene diamine, hexamethylene diamine, decamethylene diamine, 2, 3, 4 or 2, 4, 4-trimethylene hexamethylene diamine, 1 , 3 or 1,4-bis (aminomethyl) cyclohexane, bis (p-aminohexyl) methane, phenoldiamine, m-xylenediamine, p-xylendiamine, aliphatic, alicyclic, or aromatic Polyamides, force prolactams derived from diamine components such as diamine and aliphatic, alicyclic or aromatic dicarboxylic acids such as adipic acid, suberic acid, sebacic acid, cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, polyamide obtained by ring-opening polymerization of Ratatamu such as lauryl rata Tam, .omega. § Minokapuron acid, omega - Aminoena Acid, aminoundecanoic acid, 1, 2-amino-dodecanoic acid and amino acids forces polyamides derived, as well has these copolymerized polyamides, further to include mixtures polyamides.
[0168] ここで使用される親水性ポリマーブロック (F— 2— 2)としては、前記親水性ポリマー ブロック (b2)で述べたものが全て使用できる。  [0168] As the hydrophilic polymer block (F-2-2) used here, any of those described for the hydrophilic polymer block (b2) can be used.
上記の帯電防止剤 (F)のこの好まし 、重合方法は加熱溶融重合法であり、その好 まし 、具体例を下記に示す。  This preferred polymerization method of the antistatic agent (F) is a heat melt polymerization method, and specific examples thereof are shown below.
(i)ポリアミドを重合した後、ジカルボン酸ィ匕合物を添加し、ポリアミド成分の両末端を カルボキシル化し、ポリ(アルキレンォキシド)グリコールを添加重合しポリエーテルポ リアミドを得る方法。  (i) A method in which a polyamide is polymerized, a dicarboxylic acid compound is added, the both ends of the polyamide component are carboxylated, and poly (alkylene oxide) glycol is added and polymerized to obtain a polyether polyamide.
(ii)ポリアミド重合時に分子両末端が実質上カルボキシルイ匕されるようにジカルボン 酸化合物を過剰に添加重合し、更にポリ(アルキレンォキシド)グリコールを添加重合 し、ポリエーテルポリアミドを得る方法。 (ii) Dicarboxylic acid so that both ends of the molecule are substantially carboxylated during polyamide polymerization. A method of obtaining a polyether polyamide by polymerizing an excessive addition of an acid compound and further polymerizing a poly (alkylene oxide) glycol.
(iii)ポリアミド生成成分と過剰にジカルボン酸ィ匕合物、ポリ(アルキレンォキシド)ダリ コールを規定量一括添加重合しポリエーテルポリアミドを得る方法。  (iii) A method for obtaining a polyether polyamide by batch polymerization of a polyamide-forming component and an excessive amount of a dicarboxylic acid compound and poly (alkyleneoxide) diol in a specified amount.
上記方法で、特に好ましい方法は、上記 (i)の方法である。  In the above method, a particularly preferable method is the method (i).
又、前記重合体ブロック (b2)の説明で述べたアルカリ金属および Zまたはアルカリ 土類金属の塩 (H)を使用することができる。  In addition, alkali metal and Z or alkaline earth metal salts (H) described in the explanation of the polymer block (b2) can be used.
[0169] 上記ポリアミド成分の分子末端をカルボキシルイ匕するために用いられるジカルボン 酸としては、アジピン酸、スベリン酸、セバシン酸、マレイン酸、シトラコン酸、無水マレ イン酸、無水シトラコン酸、シクロへキサンジカルボン酸、テレフタル酸、イソフタル酸 等がある。本発明の上記ポリアミドの数平均分子量は、好ましくは 500〜20, 000、 更に好ましくは 500〜10, 000、特に好ましくは 500〜5, 000の範囲であること力 S本 発明の目的を達成するうえで好ましい。 [0169] Examples of the dicarboxylic acid used to carboxylate the molecular ends of the polyamide component include adipic acid, suberic acid, sebacic acid, maleic acid, citraconic acid, maleic anhydride, citraconic anhydride, and cyclohexane. Examples include dicarboxylic acid, terephthalic acid, and isophthalic acid. The number average molecular weight of the polyamide of the present invention is preferably in the range of 500 to 20,000, more preferably 500 to 10,000, particularly preferably 500 to 5,000. S The object of the present invention is achieved. In addition, it is preferable.
上記帯電防止剤 (F)におけるポリアミドブロック (F— 2— 1)と親水性ポリマーブロッ ク(F— 2— 2)の質量割合(F— 2— 1ZF— 2— 2)は、 90Z 10〜 10Z90の範囲にあ ることが好ましぐ更に好ましくは 80Z20〜20Z80、特に好ましくは 70Ζ30〜30Ζ 70である。  In the above antistatic agent (F), the mass ratio (F—2-1ZF—2-2) of the polyamide block (F—2-1) and the hydrophilic polymer block (F—2-2) is 90Z 10 to 10Z90. It is more preferable that it is in the range of 80Z20 to 20Z80, particularly preferably 70 to 30 to 70.
上記帯電防止剤 (F)の分子量は特に限定されるものではないが、還元粘度( 7? sp /C) (ギ酸溶液中、 0. 5gZl00ml、 25°Cで測定)は、 l〜3dlZgの範囲にあること が好ましぐ更に好ましくは 1. 2〜2. 5dlZgである。  The molecular weight of the antistatic agent (F) is not particularly limited, but the reduced viscosity (7? Sp / C) (measured in formic acid solution, 0.5gZl00ml, 25 ° C) is in the range of 1 to 3dlZg More preferably, it is 1.2 to 2.5 dlZg.
更に、上記帯電防止剤 (F)は、 1種単独で、または 2種以上を組み合わせて使用す ることがでさる。  Further, the antistatic agent (F) can be used alone or in combination of two or more.
上記帯電防止剤 (F)は、三洋化成工業社製ペレスタツト NC6321、 M— 140 (商品 名)として入手できる。  The antistatic agent (F) is available as Pelestat NC6321, M-140 (trade name) manufactured by Sanyo Chemical Industries.
[0170] 上記熱可塑性重合体は、各種押出機、バンバリ一ミキサー、エーダー、連続-一 ダー、ロール等により、それぞれの組成物を得ることができる。  [0170] Each composition of the thermoplastic polymer can be obtained by various extruders, Banbury mixers, aders, continuous-kinders, rolls, and the like.
熱可塑性重合体力もなる支持体を用いて基材フィルムを製造する場合のフィルム の厚みは 10〜200 mのものが取り扱いの面からこのましい。このフィルムは、公知 の方法であるカレンダ一法、 Tダイ法、インフレーション法等で製造できる力 好まし V、方法はカレンダ一法である。 When manufacturing a base film using a support that also has thermoplastic polymer strength, the thickness of the film is preferably 10 to 200 m from the viewpoint of handling. This film is known It is preferable to use the calendar method, T-die method, inflation method, etc.
[0171] 上記熱可塑性重合体には、公知の耐候 (光)剤、酸化防止剤、滑剤、可塑剤、着色 剤、染料、発泡剤、加工助剤 (超高分子量アクリル系重合体、超高分子量スチレン系 重合体)等を適宜配合することができる。 [0171] The above thermoplastic polymers include known weathering (light) agents, antioxidants, lubricants, plasticizers, colorants, dyes, foaming agents, processing aids (ultra high molecular weight acrylic polymers, ultra high molecular weight polymers). Molecular weight styrene polymer) and the like can be appropriately blended.
[0172] 3- 2.粘着フィルムの好ましい実施形態 [0172] 3- 2. Preferred embodiment of adhesive film
本発明の制電'粘着性榭脂組成物の第一の実施形態の場合、支持体を構成する 熱可塑性重合体組成物として、ポリオレフイン系榭脂組成物を用いることが好ま 、。 ポリオレフイン系榭脂組成物としては、上記本発明の制電性榭脂組成物を使用する と、粘着フィルムの制電性の点で好まし 、 (粘着フィルムの第一の実施形態)。  In the first embodiment of the antistatic adhesive pressure-sensitive resin composition of the present invention, it is preferable to use a polyolefin-based resin composition as the thermoplastic polymer composition constituting the support. As the polyolefin resin composition, the use of the antistatic resin composition of the present invention is preferred from the viewpoint of the antistatic property of the adhesive film (first embodiment of the adhesive film).
本発明の制電'粘着性榭脂組成物の第二の実施形態の場合、支持体を構成する 熱可塑性重合体組成物として、スチレン系榭脂を使用することが好ま ヽ (粘着フィ ルムの第二の実施形態)。  In the case of the second embodiment of the antistatic adhesive resin composition of the present invention, it is preferable to use a styrene resin as the thermoplastic polymer composition constituting the support. Second embodiment).
本発明の第一の実施形態の制電'粘着性榭脂組成物を用いた粘着フィルムとして は、成分 (A)のみ力もなる支持体 (以下、「支持体 (1)」という。)と、制電性粘着層とを 備える態様〔i〕、上記本発明の制電性榭脂組成物力もなる支持体 (以下、「支持体 (2 )」という。)と、制電性粘着層とを備える態様〔ii〕、及び成分 (A)及び成分 (B)の何れ か一方とこれら成分 (A)及び成分 (B)以外の成分を含有するポリオレフイン系榭脂組 成物力もなる支持体 (以下、「支持体 (3)」という。)と、制電性粘着層とを備える態様〔 iiij力 Sある。  Examples of the adhesive film using the antistatic adhesive resin composition of the first embodiment of the present invention include a support (hereinafter referred to as “support (1)”) having only the component (A). An embodiment comprising an antistatic adhesive layer [i], a support (hereinafter referred to as “support (2)”) also having an antistatic resin composition power of the present invention, and an antistatic adhesive layer. A mode (ii) to be provided, and a support (hereinafter referred to as a polyolefin-based resin composition) containing either one of the components (A) and (B) and components other than these components (A) and (B) , “Support (3)”) and an antistatic adhesive layer [iiij force S.
[0173] 尚、上記態様〔iii〕における支持体(3)を構成する組成物の具体例としては、上記 成分 ( A)及び成分 (C)を含有し、成分 (B)を含有しな!ゝ組成物;成分 (B)及び成分( C)を含有し、成分 ( A)を含有しな!ヽ組成物;成分 ( A)を含有し、成分 (B)及び成分( C)以外のその他の成分を含有する組成物;成分 (B)を含有し、成分 ( A)及び成分( C)以外のその他の成分を含有する組成物;成分 (A)及び成分 (B)以外のポリオレフ イン系榭脂を含有する組成物等が挙げられる。  [0173] As a specific example of the composition constituting the support (3) in the above embodiment [iii], it contains the component (A) and the component (C), and does not contain the component (B)!ゝ Composition; contains component (B) and component (C) and does not contain component (A)! ヽ Composition; contains component (A) and other than component (B) and component (C) A composition containing component (B), a component containing component (B) and other components other than component (A) and component (C); a polyolefin system other than component (A) and component (B) Examples include compositions containing rosin.
[0174] 上記支持体 (2)及び (3)は、上記本発明の制電性榭脂組成物に配合可能な添カロ 剤を含有してもよい。上記支持体 (2)の場合、該添加剤の含有量は、上記本発明の 制電性榭脂組成物における説明を適用することができる。また、上記支持体 (3)の場 合、該添加剤の含有量は、上記本発明の制電性榭脂組成物における成分 (A)、 (B )及び (C)の合計量と、ポリオレフイン系榭脂組成物の合計量とを置き換えて、上記 本発明の制電性榭脂組成物における記載の量を適用することができる。 [0174] The supports (2) and (3) may contain an additive additive that can be blended in the antistatic resin composition of the present invention. In the case of the support (2), the content of the additive is that of the present invention. The description in the antistatic oil-absorbing composition can be applied. In the case of the support (3), the content of the additive is the total amount of the components (A), (B) and (C) in the antistatic resin composition of the present invention, and the polyolefin. The amount described in the antistatic oil composition of the present invention can be applied by replacing the total amount of the system oil composition.
特に、粘着フィルムに制電性が求められる場合には、本発明の制電性榭脂組成物 (上記態様〔ii〕)が好ましい。また、耐熱性が求められる場合には、成分 ( として、 成分 (A— 1)及び成分 (A— 2)を併用することが好ま 、。  In particular, when the adhesive film is required to have antistatic properties, the antistatic resin composition of the present invention (the above embodiment [ii]) is preferable. In addition, when heat resistance is required, it is preferable to use the component (as component (A-1) and component (A-2) as a combination).
粘着フィルムの支持体の厚さは、好ましくは10〜200 111、より好ましくは 10〜: LOO μ mであ 。  The thickness of the support of the pressure-sensitive adhesive film is preferably 10 to 200 111, more preferably 10 to: LOO μm.
上記支持体の各表面において、制電性粘着層が配設される部分には、溝、凹部、 凸部等を有してもよい。  On each surface of the support, a portion where the antistatic adhesive layer is disposed may have a groove, a concave portion, a convex portion, or the like.
また、制電性粘着層の厚さは、好ましくは 1〜: LOO μ m、より好ましくは 5〜50 μ mで ある。尚、上記制電性粘着層の厚さは、通常、支持体の厚さよりも小さい。  The thickness of the antistatic adhesive layer is preferably 1 to: LOO μm, more preferably 5 to 50 μm. In addition, the thickness of the antistatic adhesive layer is usually smaller than the thickness of the support.
上記制電性粘着層は、上記支持体の片面側にあってよいし、両面側にあってもよ い。後者の場合は、両面粘着フィルムである。また、各表面の一部であってよいし、全 面であってもよい。  The antistatic adhesive layer may be on one side of the support or on both sides. In the latter case, it is a double-sided adhesive film. Further, it may be a part of each surface or the entire surface.
[0175] 上記の粘着フィルムの第一及び第二の実施形態の!/、ずれも、支持体と制電性粘着 層との接着性に優れ、更に、支持体表面及び制電性粘着層表面の制電性に優れる 接着性については、後述する実施例における条件による剥離強度を、好ましくは 3 OOgZl5mm以上、より好ましくは 400gZl5mm以上、更に好ましくは 500gZl5m m以上とすることができる。  [0175] The first and second embodiments of the above-mentioned pressure-sensitive adhesive film are also excellent in adhesiveness between the support and the antistatic pressure-sensitive adhesive layer, and also the surface of the support and the antistatic pressure-sensitive adhesive layer. With regard to the adhesive property with excellent antistatic properties, the peel strength according to the conditions in Examples described later can be preferably 3 OOgZl5 mm or more, more preferably 400 gZl5 mm or more, and even more preferably 500 gZl5 mm or more.
制電性 (温度 23°C、湿度 50%RHの条件における表面固有抵抗)については、支 持体表面にっ 、て、好ましくは 5 X 1012 Ω以下、より好ましくは 9 X 1011 Ω以下、更に 好ましくは 9 X 1010 Ω以下、特に好ましくは 5 X 109 Ω以下とすることができる。 For antistatic properties (surface resistivity under conditions of temperature 23 ° C and humidity 50% RH), preferably 5 X 10 12 Ω or less, more preferably 9 X 10 11 Ω or less, depending on the support surface. More preferably, it is 9 × 10 10 Ω or less, and particularly preferably 5 × 10 9 Ω or less.
[0176] 本発明の粘着フィルムは、制電性粘着層の保護等の目的で、該制電性粘着層の 表面に、保護層を備えることができる。 [0176] The adhesive film of the present invention can be provided with a protective layer on the surface of the antistatic adhesive layer for the purpose of protecting the antistatic adhesive layer and the like.
上記保護層の構成材料は、特に限定されないが、剥離した際に、制電性粘着層が 損傷等することの少ない材料力もなるものが好ましい。具体的には、ポリエチレンテレ フタレート(PET)等のポリエステルフィルム、ポリプロピレンフィルム、スチレン系榭脂 フイノレム、ポリアミドフィルム等が挙げられる。 The constituent material of the protective layer is not particularly limited, but when peeled off, the antistatic adhesive layer is A material having a material strength that is less likely to be damaged is preferable. Specific examples include a polyester film such as polyethylene terephthalate (PET), a polypropylene film, a styrene-based resin, a resin film, and a polyamide film.
[0177] 本発明の粘着フィルムを、図を用いて説明する。 [0177] The pressure-sensitive adhesive film of the present invention will be described with reference to the drawings.
図 1の粘着フィルム 1は、支持体 11と、この支持体 11の 1表面に配された制電性粘 着層 12とを備える。  An adhesive film 1 in FIG. 1 includes a support 11 and an antistatic adhesive layer 12 disposed on one surface of the support 11.
図 2の粘着フィルム 1 'は、支持体 11と、この支持体 11の表面に配された制電性粘 着層 12と、この制電性粘着層 12の表面に配された保護層 13とを備える。  The adhesive film 1 ′ in FIG. 2 includes a support 11, an antistatic adhesive layer 12 disposed on the surface of the support 11, and a protective layer 13 disposed on the surface of the antistatic adhesive layer 12. Is provided.
図 3の粘着フィルム 1"は、支持体 11と、この支持体 11の両面に配された制電性粘 着層 12a及び 12bと、これらの制電性粘着層 12a及び 12bの各表面に配された保護 層 13a及び 13bとを備える。  The adhesive film 1 "in FIG. 3 is disposed on the surface of the support 11, the antistatic adhesive layers 12a and 12b disposed on both surfaces of the support 11, and the antistatic adhesive layers 12a and 12b. Protective layers 13a and 13b.
[0178] 3- 3.粘着フィルムの製造方法 [0178] 3- 3. Manufacturing method of adhesive film
粘着フィルムは、公知の方法で製造することができ、その製造方法は特に制限され ない。  The pressure-sensitive adhesive film can be produced by a known method, and the production method is not particularly limited.
し力しながら、本発明においては、ポリオレフイン系榭脂組成物やスチレン系榭脂 組成物などの熱可塑性重合体組成物と、上記本発明の制電 '粘着性榭脂組成物と を共押出する工程を備える粘着フィルムの製造方法が好適である。  However, in the present invention, a thermoplastic polymer composition such as a polyolefin resin composition or a styrene resin composition and the antistatic adhesive resin composition of the present invention are coextruded. The manufacturing method of an adhesive film provided with the process to do is suitable.
共押出の具体的な方法としては、 Tダイ法、インフレーション法等が挙げられる。各 組成物は、通常、溶融状態で用いられる力 加工時の温度は、成形品の形状、厚さ 等を考慮し、通常、各組成物の溶融温度、溶融粘度等から選択される。  Specific methods of coextrusion include a T-die method and an inflation method. Each composition is normally used in a molten state. The temperature during processing is usually selected from the melting temperature, melt viscosity, etc. of each composition in consideration of the shape, thickness, etc. of the molded product.
[0179] 粘着フィルムを共押出で得る工程において、(1)熱可塑性重合体組成物及び制電 •粘着性榭脂組成物を予め前記方法で溶融混練したものを用いてもよぐ(2)熱可塑 性重合体組成物及び制電 '粘着性榭脂組成物の各成分を混合したものを共押出時 に溶融混練してもよぐ更に(3)熱可塑性重合体組成物及び制電'粘着性榭脂組成 物の各成分を共押出時に添加してもよぐ更に上記(1)、 (2)、及び(3)を組みあわ せた方法でよい。上記熱可塑性重合体組成物としては、ポリオレフイン系榭脂組成物 、スチレン系榭脂組成物等が好適に使用できる。 [0179] In the step of obtaining the adhesive film by coextrusion, (1) a thermoplastic polymer composition and an antistatic adhesive composition obtained by previously melt-kneading the adhesive resin composition by the above method may be used (2) Thermoplastic polymer composition and antistatic 'A mixture of the components of the adhesive resin composition may be melt kneaded at the time of coextrusion. (3) Thermoplastic polymer composition and antistatic' The components of the adhesive resin composition may be added at the time of coextrusion, and a method in which the above (1), (2), and (3) are combined may be used. As said thermoplastic polymer composition, a polyolefin resin composition, a styrene resin composition, etc. can be used conveniently.
本発明の粘着フィルムを共押出により得る好ましい方法は、支持体となる熱可塑性 重合体組成物は、予め溶融混練したものを用い、制電'粘着性榭脂組成物について は、上記(2)、 (3)の方法で共押出する方法である。 The preferred method for obtaining the pressure-sensitive adhesive film of the present invention by coextrusion is thermoplasticity as a support. The polymer composition is prepared by melt kneading in advance, and the antistatic adhesive resin composition is a method of coextrusion by the methods (2) and (3) above.
[0180] 本発明の粘着フィルムは、共押出による方法以外にも、下記の方法により製造する ことちでさる。 [0180] The pressure-sensitive adhesive film of the present invention can be produced by the following method in addition to the method by coextrusion.
(1)先ず、熱可塑性重合体組成物を、カレンダ一法、 τダイ法、インフレーション法等 により皮膜化して支持体を形成した後、必要に応じて表面処理を行い、制電'粘着性 榭脂組成物を押出ラミネートする方法。  (1) First, a thermoplastic polymer composition is formed into a film by a calendering method, a τ die method, an inflation method, etc., and then a support is formed, and then surface treatment is performed as necessary to control the antistatic property. A method of extrusion laminating a fat composition.
(2)熱可塑性重合体組成物と、制電'粘着性榭脂組成物とを用いて、支持体及び制 電性粘着層 (フィルム又はシート)を別々に作製した後、各成形体 (好ましくは支持体 の)の粘着面に対して、必要に応じて表面処理し、押出ラミネートする方法 (ドライラミ ネート法)。  (2) After separately producing a support and an antistatic adhesive layer (film or sheet) using a thermoplastic polymer composition and an antistatic adhesive adhesive composition, each molded body (preferably Is a method where the adhesive surface of the support is subjected to surface treatment as necessary and extrusion laminated (dry lamination method).
(3)先ず、シリコーンィ匕合物等の易剥離性ィ匕合物を塗布したシート (好ましくはポリエ チレンテレフタレート)に、トルエン、シクロへキサン等の有機溶媒に制電 '粘着性榭 脂組成物を溶解させた溶液、又は、溶融混練した制電'粘着性樹脂組成物を塗布、 乾燥し、制電性粘着層付きシートを得る。その後、この制電性粘着層付きシートと、別 途、ポリオレフイン系榭脂組成物を用いて作製した支持体とを圧着することにより、制 電性粘着層を支持体に転写させる方法。  (3) First, a sheet (preferably polyethylene terephthalate) coated with an easily peelable compound such as a silicone compound is charged with an organic solvent such as toluene or cyclohexane. A solution in which the product is dissolved, or a melt-kneaded antistatic adhesive resin composition is applied and dried to obtain a sheet with an antistatic adhesive layer. Thereafter, the antistatic adhesive layer is transferred to the support by pressure-bonding the sheet with the antistatic adhesive layer and a support prepared using the polyolefin resin composition separately.
[0181] 上記表面処理の具体的な方法としては、コロナ放電処理、火炎処理、酸化処理、 プラズマ処理、 UV処理、イオンボンバード処理、溶剤処理等が挙げられる。これらは 、組み合わせて連続して行ってもよい。  [0181] Specific examples of the surface treatment include corona discharge treatment, flame treatment, oxidation treatment, plasma treatment, UV treatment, ion bombardment treatment, and solvent treatment. These may be performed continuously in combination.
更に、制電性粘着層との粘着前において、支持体の表面に、ポリエチレンィミン、ポ リウレタン、アクリル榭脂等の榭脂成分を含むプライマー層を形成させることができる 。このプライマー層の厚さは、より薄いほど好ましぐ例えば、 0. 1〜: LO /z m程度が好 ましぐ 0. l〜5 /z mがより好ましい。また、該プライマー層は、通常、溶剤(水を含む) 溶液を公知の方法で塗布し、乾燥すること〖こより形成することができる。  Furthermore, a primer layer containing a resin component such as polyethyleneimine, polyurethane, and acrylic resin can be formed on the surface of the support before adhesion to the antistatic adhesive layer. The thickness of the primer layer is preferably as it is thinner, for example, 0.1 to: about LO / z m is preferable, and 0.1 to 5 / z m is more preferable. Further, the primer layer can be usually formed by applying a solvent (including water) solution by a known method and drying it.
[0182] 制電性粘着層の表面に保護層を配設する場合には、支持体及び制電性粘着層の 形成と同時であつてよい(同時に共押出してもよ!、;)し、巻き取りと同時であつてよ!/、。  [0182] When a protective layer is provided on the surface of the antistatic adhesive layer, it may be simultaneously with the formation of the support and the antistatic adhesive layer (may be co-extruded at the same time !,;) Take it at the same time as winding!
[0183] 4.多層シート(多層フィルム) 本発明の制電性榭脂組成物は、多層シート、多層フィルム等にも好適である。その 態様としては、本発明の制電性榭脂組成物カゝらなるシート (又はフィルム)の積層体; 本発明の制電性榭脂組成物力もなるシート(又はフィルム)と、他の材料力もなるシー ト(又はフィルム)とを備える 2層型シート (又は 2層型フィルム);本発明の制電性榭脂 組成物からなる 2つのシート(又はフィルム)と、その間に配された、他の材料力もなる シート (又はフィルム)とを備える 3層型シート (又は 3層型フィルム)等が挙げられる。 尚、各層の間には、上記本発明の粘着フィルムの説明におけるプライマー層を配設 することちでさる。 [0183] 4. Multilayer sheet (Multilayer film) The antistatic resin composition of the present invention is also suitable for multilayer sheets, multilayer films and the like. As an aspect thereof, a laminate of a sheet (or film) comprising the antistatic resin composition of the present invention; a sheet (or film) also comprising the antistatic resin composition of the present invention; and other materials A two-layer sheet (or a two-layer film) comprising a sheet (or film) that also has a force; two sheets (or films) composed of the antistatic resin composition of the present invention, and disposed therebetween, Examples thereof include a three-layer sheet (or three-layer film) provided with a sheet (or film) that has other material strength. In addition, the primer layer in the description of the pressure-sensitive adhesive film of the present invention is disposed between the layers.
本発明の制電性榭脂組成物が、上記ポリオレフイン系榭脂 (A— 1)を 40質量%以 上 (好ましくは 50質量%以上、より好ましくは 60質量%以上)含む場合には、 70°C以 上 (好ましくは 80°C以上、より好ましくは 90°C以上)の温度において、反り、ねじれ等 の変形が発生しにく 、多層シート(多層フィルム)とすることができる。  When the antistatic resin composition of the present invention contains 40% by mass or more (preferably 50% by mass or more, more preferably 60% by mass or more) of the above polyolefin resin (A-1), 70 Deformation such as warping and twisting hardly occurs at a temperature of ° C or higher (preferably 80 ° C or higher, more preferably 90 ° C or higher), and a multilayer sheet (multilayer film) can be obtained.
[0184] 他の材料としては、ポリオレフイン系榭脂、スチレン系榭脂等を単独で、または、こ れらの 1種以上を含む組成物が好ましい。特に、上記本発明の制電性榭脂組成物に 含有される成分 (A)を単独で、または、これを含む組成物を用いることが好ましい。 該組成物は、剛性、耐熱性等の改良、制電性の付与等の目的から、各種充填剤、帯 電防止剤等を含有して!/、てもよ!/、。  [0184] As other materials, a polyolefin resin, a styrene resin or the like alone or a composition containing one or more of these is preferable. In particular, it is preferable to use the component (A) contained in the antistatic resin composition of the present invention alone or a composition containing the component (A). The composition contains various fillers, antistatic agents, etc. for the purpose of improving rigidity, heat resistance, etc. and imparting antistatic properties.
[0185] 上記多層シート(多層フィルム)にお 、て、本発明の制電性榭脂組成物力もなる層 の厚さは、安定的に制電性を発現させる等の目的から、好ましくは 10 m以上、更に 好ましくは 50 μ m以上、特に好ましくは 80 μ m以上である。  [0185] In the multilayer sheet (multilayer film), the thickness of the layer having the antistatic resin composition power of the present invention is preferably 10 for the purpose of stably developing the antistatic property. m or more, more preferably 50 μm or more, particularly preferably 80 μm or more.
[0186] 上記多層シートとして、 3層型シートを、図を用いて説明する。  [0186] As the multilayer sheet, a three-layer sheet will be described with reference to the drawings.
図 4の 3層型シート 2は、他の材料力もなる中間層 22と、上記の制電性榭脂組成物 を用いてなる層 21a及び 21bとを備える。  The three-layer type sheet 2 in FIG. 4 includes an intermediate layer 22 having other material strengths, and layers 21a and 21b using the above antistatic resin composition.
[0187] 上記多層シート(多層フィルム)の製造方法としては、上記の粘着フィルムの製造方 法と同様とすることができる力 Tダイ法、インフレーション法等の共押出法が好ましい 。このようにして得られたシート及びフィルムは、必要に応じて、更に真空成形等によ りトレイ等の成形品とすることができる。  [0187] The method for producing the multilayer sheet (multilayer film) is preferably a coextrusion method such as a force T-die method or an inflation method, which can be the same as the method for producing the adhesive film. The sheet and film thus obtained can be further formed into a molded product such as a tray by vacuum forming or the like, if necessary.
[0188] 5.両面粘着フィルム 本発明の制電'粘着性榭脂組成物は、両面粘着フィルム等にも好適である。その態 様としては、上記本発明の粘着フィルムにおいて説明した、本発明の制電性榭脂組 成物からなる支持体の両面に、上記本発明の制電 '粘着性榭脂組成物からなる制電 性粘着層を備えた態様以外に、他の材料からなる支持体の両面に、上記本発明の 制電 ·粘着性榭脂組成物からなる制電性粘着層を備えた態様である。 [0188] 5. Double-sided adhesive film The antistatic adhesive resin composition of the present invention is also suitable for a double-sided adhesive film or the like. As for the mode, the antistatic adhesive composition of the present invention is formed on both sides of the support composed of the antistatic resin composition of the present invention described in the adhesive film of the present invention. In addition to the aspect provided with the antistatic adhesive layer, the antistatic adhesive layer made of the antistatic / adhesive resin composition of the present invention is provided on both surfaces of the support made of another material.
この態様における支持体及び制電性粘着層の各厚さは、上記本発明の粘着フィル ムの説明における支持体及び制電性粘着層の各厚さと同様とすることができる。  The thicknesses of the support and the antistatic adhesive layer in this embodiment can be the same as the thicknesses of the support and the antistatic adhesive layer in the description of the adhesive film of the present invention.
[0189] 他の材料としては、上記本発明の制電性榭脂組成物以外に、各種のポリオレフイン 系榭脂組成物、スチレン系榭脂組成物又はそれを含む組成物等の熱可塑性重合体 組成物が挙げられる。特に、上記の制電性榭脂組成物に含有される成分 (A)を含む 組成物が好ましい。該組成物は、剛性、耐熱性等の改良、制電性の付与等の目的か ら、各種添加剤を含有していてもよい。  [0189] In addition to the antistatic resin composition of the present invention, other materials include thermoplastic polymers such as various polyolefin resin compositions, styrene resin compositions, or compositions containing the same. A composition. In particular, a composition containing the component (A) contained in the above antistatic resin composition is preferable. The composition may contain various additives for the purpose of improving rigidity and heat resistance and imparting antistatic properties.
[0190] 上記両面粘着フィルムも、上記本発明の粘着フィルムと同様に、制電性粘着層の 保護等の目的で、該制電性粘着層の表面に、保護層を備えることができる。この保護 層の構成材料も上記のとおりである。  [0190] The double-sided pressure-sensitive adhesive film can also be provided with a protective layer on the surface of the antistatic pressure-sensitive adhesive layer for the purpose of protecting the antistatic pressure-sensitive adhesive layer and the like, similarly to the pressure-sensitive adhesive film of the present invention. The constituent material of this protective layer is also as described above.
[0191] 本発明に係る成形品、すなわち上記制電性榭脂組成物力もなる成形品は、電子- 電気分野、 ΟΑ·家電分野、車両分野、サニタリー分野、建材分野等の各種部材、部 品等として好適であり、静電気障害が大きな問題となる部材、部品等として特に好適 である。具体的には、リレーケース、ウェハーケース、レチクルケース、マスクケース等 のケース類;液晶トレイ、チップトレイ、メモリートレイ、 CCDトレイ、 ICトレイ等のトレィ 類; ICキャリア一等のキャリア一類;偏光フィルムの保護シート等のシート類;シート' フィルムのボビン類;液晶を用いた表示装置、導光板、プラズマディスプレイ、偏光板 等の表面保護フィルム、半導体関連の保護フィルム、クリーンルーム内の保護フィル ム等のフィルム類;クリーンルーム内で使用されるシート類;制電バッグ;自動販売機 等の装置の内部部材等に有用である。  [0191] The molded product according to the present invention, that is, the molded product having the above-described antistatic resin composition strength, is a variety of members and parts in the electronic-electric field, the household electrical appliance field, the vehicle field, the sanitary field, the building material field, etc. It is particularly suitable as a member, component, etc. in which static electricity damage is a serious problem. Specifically, cases such as relay cases, wafer cases, reticle cases, mask cases; trays such as liquid crystal trays, chip trays, memory trays, CCD trays, IC trays; carrier types such as IC carriers; polarizing films; Sheets such as protective sheets of sheets; bobbins of sheets' films; surface protection films such as liquid crystal display devices, light guide plates, plasma displays, polarizing plates, semiconductor-related protective films, protective films in clean rooms, etc. Films; Sheets used in clean rooms; Antistatic bags; Useful for internal parts of equipment such as vending machines.
実施例  Example
[0192] 以下に実施例を挙げ、本発明を更に詳細に説明する力 本発明の主旨を超えない 限り、本発明は力かる実施例に限定されるものではない、尚、下記において、部及び %は、特に断らない限り、質量基準である。 [0192] The ability to explain the present invention in more detail with reference to the following examples, the present invention is not limited to the powerful examples as long as it does not exceed the gist of the present invention. % Is based on mass unless otherwise specified.
[0193] 1.評価方法  [0193] 1. Evaluation method
下記の実施例及び比較例における、各評価項目の測定方法を以下に示す。  The measuring method of each evaluation item in the following examples and comparative examples is shown below.
[0194] (1) (C)成分 (重合体の結合スチレン量、ビニル結合量、数平均分子量、および水素 添加率); [0194] (1) Component (C) (bonded styrene content, vinyl bond content, number average molecular weight, and hydrogenation rate of the polymer);
(1一 1)結合スチレン量;  (1 1 1) Amount of bound styrene;
水素添加前の重合体で測定した。 699cm_1のフエニル基の吸収に基づいた赤外法 による検量線力も求めた。 It was measured on the polymer before hydrogenation. Calibration curve force by the infrared method based on the absorption of the phenyl groups of the 699cm _1 was also determined.
(1一 2)数平均分子量;  (1 1 2) number average molecular weight;
水素添加前の重合体で測定した。ゲルパ—ミエ—シヨンクロマトグラフィ—(GPC)か ら求めた。  It was measured on the polymer before hydrogenation. Obtained from gel permeation chromatography (GPC).
(1一 3)ビニル結合量;  (1-3) Vinyl bond amount;
水素添加前重合体で測定した。赤外法 (モレロ法)により求めた。  Measured with the polymer before hydrogenation. Obtained by infrared method (Morello method).
(1 4)水素添加率;  (1 4) Hydrogenation rate;
水素添加後の重合体で測定した。四塩ィ匕エチレンを溶媒として用い、 15%濃度で測 定した 100MHの1 H— NMR ^ベクトルの不飽和二重結合のスペクトル減少から算 Measurements were taken on the polymer after hydrogenation. Calculated from the spectrum reduction of unsaturated double bonds in 100MH 1 H-NMR ^ vector measured at 15% concentration using tetrasalt ethylene as solvent.
z  z
出した。  I put it out.
[0195] (2) (D)成分 (ゴム質重合体の物性、グラフト率、および極限粘度);  [0195] (2) Component (D) (physical properties of rubbery polymer, graft ratio, and intrinsic viscosity);
(2— 1)ゴム質重合体のゲル含率;前記の方法に従った。  (2-1) Gel content of rubbery polymer: according to the above method.
(2—2)ゴム質重合体ラテックスの数平均粒子径;  (2-2) Number average particle diameter of rubbery polymer latex;
成分 (D)の形成に用いるゴム質重合体ラテックスの数平均粒子径は、光散乱法で測 定した。測定機は、大塚電子社製 LPA— 3100型を使用し、 70回積算でミュムラント 法を用いた。尚、成分 (D)中の分散グラフトイ匕ゴム質重合体粒子の粒子径は、ラテツ タス粒子径とほぼ同じであることを電子顕微鏡で確認した。  The number average particle diameter of the rubbery polymer latex used for forming the component (D) was measured by a light scattering method. The measuring machine used was LPA-3100 manufactured by Otsuka Electronics Co., Ltd., and the Mummland method was used with 70 integration. It was confirmed with an electron microscope that the particle size of the dispersed graft rubber-like polymer particles in component (D) was almost the same as the latitudus particle size.
(2— 3)成分 (D)のグラフト率;前記の方法に従った。  (2-3) Graft ratio of component (D): According to the method described above.
(2 4)成分 (D)の極限粘度〔 7?〕;前記の方法に従った。  (2 4) Intrinsic viscosity [7?] Of component (D);
[0196] (3)制電性 [0196] (3) Antistatic
(3— 1)表面固有抵抗 試験片を、温度 23°C、湿度 50%RHの条件下、 48時間放置した後、表面固有抵 抗(Ω )を、抵抗率計 (商品名「ハイレスター UP MCP— HT450」、三菱化学社製) により、印加電圧 500Vで測定した。 (3-1) Surface resistivity The specimen is left for 48 hours under conditions of a temperature of 23 ° C and a humidity of 50% RH, and then the surface resistivity (Ω) is measured with a resistivity meter (trade name “Hirester UP MCP-HT450”, Mitsubishi Chemical Corporation). Measured at an applied voltage of 500V.
(3— 2)制電性の測定 (3-2) Antistatic measurement
シシド静電気株式会社製スタティックォネストメーター H— 0110を用い粘着フィル ムの下記面に 5KVの帯電処理を行 、、その帯電が OVまで減衰する時間を測定した 制電性ー 1;支持体 (制電性スチレン系榭脂)側に印加した。  The following surface of the adhesive film was subjected to 5KV electrification using a static horn meter H-0101 manufactured by SHISID ELECTRIC CO., LTD., And the time for the charge to decay to OV was measured. Applied to the electrically styrene-based resin side.
制電性ー 2;粘着剤側に印加した。 Antistatic property-2: Applied to the adhesive side.
(4)透明性  (4) Transparency
下記基準で評価した。  Evaluation was made according to the following criteria.
〇(又は「透明」);透明感がある(印刷物上に試験片を置いたとき、印刷物が透け て見える)。  ○ (or “transparent”); there is a clear feeling (when the test piece is placed on the printed matter, the printed matter can be seen through).
△;やや透明感がある(印刷物上に試験片を置いたとき、印刷物がぼんやりと見え る)。  Δ: Slightly transparent (printed material is faintly visible when a test piece is placed on the printed material).
X;不透明である(印刷物上に試験片を置いたとき、印刷物が判読できない)。 X: Opaque (when the test piece is placed on the printed material, the printed material cannot be read).
(5)成形品外観 (5) Molded product appearance
試験片両面の表面外観を下記基準で目視評価した。  The surface appearance on both sides of the test piece was visually evaluated according to the following criteria.
〇(又は「良好」);平滑性に優れ、良好である。  ◯ (or “good”): excellent in smoothness and good.
△;一部平滑性に劣る部分がある。  Δ: There is a part inferior in smoothness.
X (又は「不良」);平滑 ¾ ^こ劣り、不良である。  X (or “bad”); smooth ¾ ^ poor and bad.
(6)支持体と制電性粘着層との接着性 (6) Adhesiveness between support and antistatic adhesive layer
(6— 1)接着性一 1 (6— 1) Adhesiveness 1
幅 15mmの粘着フィルムの支持体から、制電性粘着層を、速度 300mmZ分で 90 度剥離させ、剥離強度 (単位; g)を測定した。  The antistatic adhesive layer was peeled 90 degrees at a speed of 300 mmZ from a support of a 15 mm wide adhesive film, and the peel strength (unit: g) was measured.
(6— 2)接着性一 2 (6-2) Adhesiveness 1
幅 25mmの粘着フィルムの支持体から、制電性粘着層を、速度 300mmZ分で 18 0度剥離試験を行う剥離強度 (単位; g)を測定した。 (7)制電性粘着層とトリァセチルセルロース (TAC)フィルムとの粘着性 A peel strength (unit: g) was measured by performing a 180 ° peel test on the antistatic adhesive layer at a speed of 300 mmZ from a support of an adhesive film having a width of 25 mm. (7) Adhesion between antistatic adhesive layer and triacetyl cellulose (TAC) film
粘着フィルムの制電性粘着層の粘着面に、幅 25mmの TACフィルムを配置し、 2k gのローラーを 1往復させて貼着した。その後、速度 300mmZ分で 180度剥離し、剥 離強度 (単位; g)を測定した。 A TAC film with a width of 25 mm was placed on the adhesive surface of the antistatic adhesive layer of the adhesive film, and a 2 kg roller was reciprocated once for pasting. Thereafter, the film was peeled 180 ° at a speed of 300 mmZ, and the peel strength (unit: g) was measured.
2.制電性榭脂組成物及び制電 '粘着性榭脂組成物の原料成分  2. Antistatic resin composition and antistatic material component
2— 1.成分 (A) 2— 1. Component (A)
(1) A1 (ホモタイプポリプロピレン)  (1) A1 (Homo type polypropylene)
日本ポリプロ社製「ノバテック pp MG2TJ (商品名)を用いた。  “NOVATEC pp MG2TJ (trade name) manufactured by Nippon Polypro Co., Ltd. was used.
(2) A2 (ランダムタイプポリプロピレン)  (2) A2 (Random type polypropylene)
日本ポリプロ社製「ノバテック pp EG7F」(商品名)を用いた。  “NOVATEC pp EG7F” (trade name) manufactured by Nippon Polypro was used.
(3) A3 (メタ口セン触媒を用いて製造されたポリエチレン)  (3) A3 (polyethylene produced using a meta-catalyst catalyst)
日本ポリエチレン社製「カーネル KF270」(商品名)を用いた。  “Kernel KF270” (trade name) manufactured by Nippon Polyethylene Co., Ltd. was used.
(4) A4 (エチレン'ノルボルネン共重合体)  (4) A4 (ethylene norbornene copolymer)
ポリプラスチック社製「TOPAS6013」(商品名)を用いた。ノルボルネン単位量は 7 5〜80%、ガラス転移温度は 140°Cである。  “TOPAS6013” (trade name) manufactured by Polyplastics was used. The norbornene unit amount is 75 to 80%, and the glass transition temperature is 140 ° C.
(5) A5 (ホモタイプポリプロピレン)  (5) A5 (Homo type polypropylene)
日本ポリプロ社製「ノバテック pp FY6CJ (商品名)を用いた。  “NOVATEC pp FY6CJ (trade name) manufactured by Nippon Polypro Co., Ltd. was used.
(6) A6 (低密度ポリエチレン)  (6) A6 (low density polyethylene)
日本ポリエチレン社製「ノバテック LL UF422」(商品名)を用いた。  “NOVATEC LL UF422” (trade name) manufactured by Nippon Polyethylene Co., Ltd. was used.
(7) A7 (低密度ポリエチレン)  (7) A7 (low density polyethylene)
日本ポリエチレン社製「ノバテック LD LF122J (商品名)を用いた。  “NOVATEC LD LF122J (trade name) manufactured by Nippon Polyethylene Co., Ltd. was used.
(8) A8 (無水マレイン酸変性ポリエチレン)  (8) A8 (maleic anhydride modified polyethylene)
三洋化成工業社製「ユーメッタス 2000」(商品名)を用いた。  “Yumettas 2000” (trade name) manufactured by Sanyo Chemical Industries, Ltd. was used.
(9) A9 (エチレン 'ノルボルネン共重合体)  (9) A9 (ethylene 'norbornene copolymer)
ポリプラスチック社製「TOPAS8007X10」(商品名)を用いた。ノルボルネン単位 量は 65%、ガラス転移温度は 80°Cである。  “TOPAS8007X10” (trade name) manufactured by Polyplastics was used. The norbornene unit content is 65% and the glass transition temperature is 80 ° C.
( 10) A10 (気相法メタ口セン系ポリエチレン)  (10) A10 (Gas phase process meta-polycene polyethylene)
日本ポリエチレン社製「ノヽーモレックス NF464N」(商品名)を用いた。 [0199] 2- 2.成分 (B) “Nomolex NF464N” (trade name) manufactured by Nippon Polyethylene Co., Ltd. was used. [0199] 2- 2. Component (B)
(1) B1 (ポリオレフイン ·ポリエーテルマルチブロック共重合体)  (1) B1 (Polyolefin / Polyether multiblock copolymer)
三洋化成工業社製「ペレスタツト 230」(商品名)を用いた。  “Pelestat 230” (trade name) manufactured by Sanyo Chemical Industries, Ltd. was used.
(2) B2 (ポリプロピレン.ポリエーテルマルチブロック共重合体)  (2) B2 (Polypropylene / polyether multi-block copolymer)
三洋化成工業社製「ペレスタツト 303」(商品名)を用いた。  “Pelestat 303” (trade name) manufactured by Sanyo Chemical Industries, Ltd. was used.
[0200] 2- 3.成分 (C)  [0200] 2- 3. Component (C)
(1) C1 (ハイビニルタイプ水素添加重合体)  (1) C1 (High vinyl type hydrogenated polymer)
JSR社製「DYNARON 1321 P」(商品名)を用 、た。  JSR "DYNARON 1321 P" (trade name) was used.
(2) C2 (ポリエチレンブロックを有する水素添加重合体)  (2) C2 (hydrogenated polymer with polyethylene block)
JSR社製「DYNARON6200P」(商品名 )を用いた。  “DYNARON6200P” (trade name) manufactured by JSR was used.
(3) C3 (ハイビニルタイプ水素添加重合体)  (3) C3 (High vinyl type hydrogenated polymer)
JSR社製「DYNARON1320P」(商品名)を用いた。  “DYNARON1320P” (trade name) manufactured by JSR was used.
(4) C4 (スチレン ·ブタジエン ·スチレンブロック共重合体)  (4) C4 (Styrene / Butadiene / Styrene Block Copolymer)
JSR社製「TR2500」(商品名 )を用いた。  JSR “TR2500” (trade name) was used.
[0201] (5) C5 (水素添加スチレン ブタジエンブロック共重合体)  [0201] (5) C5 (hydrogenated styrene butadiene block copolymer)
下記製造例 1で得た水素添加スチレン ブタジエンブロック共重合体を用 V、た。 靈列 1  The hydrogenated styrene butadiene block copolymer obtained in Production Example 1 was used. Row 1
攪拌機及びジャケット付きオートクレープを乾燥、窒素置換し、シクロへキサンとブタ ジェン 35部溶液を投入した。ついで、 n—ブチルリチウムを添カ卩し、 50°Cの等温重合 を行った。添加率が 100%になった時点で、テトラヒドロフラン 0. 75部、ブタジエン 4 5部、スチレン 15部を添加し、 50°C力も 80°Cに昇温重合を行った。転化率 100%と なった時点でスチレン 5部をカ卩え、更に重合反応を行い、水素添加前 A— B1— B2ト リブロック共重合体を得た。得られたブロック重合体溶液の一部をサンプリングし、 2, 6 ジー tert ブチルカテコールをブロック共重合体 100部に対して 0. 3部添加し、 その後、溶媒を加熱除去した。スチレンブロック 5% (Aブロック)、ブタジエン部分の 1 , 2 ビュル含量 35%、スチレン含量 15%のスチレン 'ブタジエンブロック 60% (B1 ブロック)、 1, 2 ビュル含量 8%のブタジエンブロック 35% (B2ブロック)力もなる数 平均分子量 200, 000の重合体であった。 残りのブロック共重合体溶液にチタノセンジクロライドとトリェチルアルミニウムをシク 口へキサン中で反応させた溶液をカ卩え、 50°c、 50kgfZcm2の水素圧下、 40分水素 化反応を行った。 2, 6 ジー tert—ブチルカテコールをブロック共重合体 100部に 対し 0. 3部添加し、その後、溶媒を除去しブロック共重合体 C5を得た。 The stirrer and the jacketed autoclave were dried and purged with nitrogen, and a solution of cyclohexane and 35 parts of butadiene was added. Subsequently, n-butyllithium was added to carry out isothermal polymerization at 50 ° C. When the addition rate reached 100%, 0.75 parts of tetrahydrofuran, 45 parts of butadiene, and 15 parts of styrene were added, and the temperature rising polymerization was performed at 80 ° C. at 50 ° C. force. When the conversion rate reached 100%, 5 parts of styrene was added, and a polymerization reaction was further performed to obtain an A—B1-B2 triblock copolymer before hydrogenation. A part of the resulting block polymer solution was sampled, 0.3 part of 2,6-di-tert-butylcatechol was added to 100 parts of the block copolymer, and then the solvent was removed by heating. Styrene block 5% (A block), 1,2 Bull content of butadiene part 35%, Styrene styrene content 15% Styrene 'Butadiene block 60% (B1 block), 1,2 Bull content 8% butadiene block 35% (B2 The number average molecular weight was 200,000. A solution obtained by reacting titanocene dichloride and triethylaluminum in cyclohexane was added to the remaining block copolymer solution, and a hydrogenation reaction was carried out for 40 minutes under a hydrogen pressure of 50 ° C. and 50 kgfZcm 2 . 2,6G tert-butylcatechol was added in an amount of 0.3 part to 100 parts of the block copolymer, and then the solvent was removed to obtain a block copolymer C5.
[0202] (6) C6 (水素添加スチレン ブタジエンブロック共重合体) [0202] (6) C6 (hydrogenated styrene butadiene block copolymer)
下記製造例 2で得た水素添加スチレン ブタジエンブロック共重合体を用いた。 製造例 2  The hydrogenated styrene butadiene block copolymer obtained in Production Example 2 below was used. Production example 2
製造例 1の条件で n ブチルリチウムの使用量を多くして、ブロック共重合体 C5と 同じ構造で数平均分子量が 100, 000のブロック共重合体 C6を得た。  The amount of n-butyllithium used was increased under the conditions of Production Example 1 to obtain a block copolymer C6 having the same structure as the block copolymer C5 and a number average molecular weight of 100,000.
[0203] 2-4.成分 (D) [0203] 2-4. Ingredient (D)
(D DI (ゴム変性スチレン系榭脂)  (D DI (Rubber-modified styrene-based resin)
下記製造例 3で得たゴム変性スチレン系榭脂用いた。  The rubber-modified styrene-based resin obtained in Production Example 3 below was used.
靈列 3  Row 3
攪拌機およびジャケット付きオートクレープを窒素置換した後、ポリブタジエンラテツ タス(平均粒子径 2, 500A) 50部(固形分)、ラウリル酸カリウム 0. 5部、イオン交換 水 120部を投入し、攪拌を開始した。メタクリル酸メチル 9. 2部、スチレン 3. 3部を投 入した後、昇温を行い、内温力 0°Cに到達した時点で、スルホキシレート系開始助 剤水溶液とクメンハイド口パーオキサイド 0. 04部を添加し、重合反応を開始した。 重合開始から 1時間後から、メタクリル酸メチル 27. 5部、スチレン 10部、 tert—ドデ シルメルカプタン 0. 5部、ラウリル酸カリウム 0. 5部、イオン交換水 20部からなるエマ ルジョン液、タメンノヽイド口バーオキサォイド 0. 1部、又スルホキシレート系開始助剤 の水溶液を 4時間かけて連続的に添加しながら重合反応をおこなった後、更に 2時 間攪拌を継続したのち、 50°Cまで冷却し、重合反応を終了させた。反応生成物のラ テックスを硫酸水溶液で凝固、水洗したのち乾燥をおこな ヽゴム変性スチレン系榭脂 D1を得た。  After replacing the agitator and jacketed autoclave with nitrogen, add 50 parts of polybutadiene latus (average particle size 2,500A) (solid content), 0.5 part of potassium laurate, 120 parts of ion-exchanged water, and start stirring. did. After adding 9.2 parts of methyl methacrylate and 3.3 parts of styrene, the temperature was raised, and when the internal temperature reached 0 ° C, the sulfoxylate-based aqueous starting agent solution and cumene hydride peroxide 0 04 parts were added to initiate the polymerization reaction. 1 hour after the start of polymerization, an emulsion solution consisting of 27.5 parts of methyl methacrylate, 10 parts of styrene, 0.5 part of tert-dodecyl mercaptan, 0.5 part of potassium laurate, and 20 parts of ion-exchanged water, The polymerization reaction was carried out while continuously adding 0.1 part of a tamennoide-mouthed baroxide and an aqueous solution of a sulfoxylate-based starting aid over 4 hours, and then stirring was continued for another 2 hours, followed by 50 ° The polymerization reaction was terminated by cooling to C. The reaction product latex was coagulated with an aqueous sulfuric acid solution, washed with water and then dried to obtain rubber-modified styrene-based resin D1.
このもののグラフト率は 55%、アセトン可溶分の極限粘度 [ 7? ]は 0. 45であった。  The graft ratio of this product was 55%, and the intrinsic viscosity [7?] Of the acetone-soluble component was 0.45.
[0204] (2) D2 (ゴム質重合体非存在のスチレン系榭脂) [0204] (2) D2 (Styrenic resin without rubbery polymer)
下記製造例 4で得たスチレン系榭脂用いた。 製造例 4 The styrene-based resin obtained in Production Example 4 below was used. Production Example 4
攪拌機、ジャケット付きオートクレープを窒素置換した後、窒素気流中でメタクリル 酸メチル 73. 4部、スチレン 26. 6部、トルエン 20部、 tert—ドデシルメルカプタン 0. 1部を投入したのち攪拌及び昇温を開始した。内温が 50°Cに到達した時点で、ベン ゾィルパーオキサイド 0. 5部を添カ卩し、更に昇温し、 80°Cに達した後、 80°C—定で 制御しながら重合反応を行わせた、反応開始後 6時間目から 1時間を要して 120°Cま で昇温し、更に 2時間反応を行って終了した。 100°Cまで冷却後、反応混合物をォ 一トクレーブより抜き出し、水蒸気蒸留により未反応物と溶媒を留去したあと、粉砕し 、 VENT付き押出機で脱揮しペレット化し、ゴム質重合体非存在のスチレン系榭脂 D 2を得た。このものの極限粘度 [ 7? ]は 0. 45であった。  After replacing the stirrer and jacketed autoclave with nitrogen, in a nitrogen stream, 73.4 parts of methyl methacrylate, 26.6 parts of styrene, 20 parts of toluene, 0.1 part of tert-dodecyl mercaptan were added and stirred and heated. Started. When the internal temperature reaches 50 ° C, 0.5 part of benzoyl peroxide is added, the temperature is further increased, and after reaching 80 ° C, polymerization is performed while controlling at 80 ° C-constant. It took 1 hour from the 6th hour after the start of the reaction to raise the temperature to 120 ° C, and the reaction was further completed for 2 hours. After cooling to 100 ° C, the reaction mixture is extracted from the autoclave, unreacted substances and solvent are distilled off by steam distillation, pulverized, devolatilized with an extruder equipped with VENT, pelletized, and no rubber polymer is present. Styrene-based resin D2 was obtained. This had an intrinsic viscosity [7?] Of 0.45.
[0205] 2- 5.成分 ) [0205] 2- 5. Ingredients)
(1) E1 (トリス(トリフルォロメタンスルホ -ル)メチドリチウムの 50%水溶液) 三光化学工業社製「サンコノール AQ— 50T」(商品名)を用いた。  (1) E1 (50% aqueous solution of tris (trifluoromethanesulfol) methide lithium) “Sanconol AQ-50T” (trade name) manufactured by Sanko Chemical Industry Co., Ltd. was used.
(2) Ε2 (高分子型帯電防止剤)  (2) Ε2 (polymer type antistatic agent)
高分子帯電防止剤の含有量 65%の旭電ィ匕工業社製「アデ力ノール AS— 113」( 商品名)を用いた。  “Ade force Nord AS-113” (trade name) manufactured by Asahi Denki Kogyo Co., Ltd. with a polymer antistatic agent content of 65% was used.
(3) E3 (有機ホウ素化合物を 7%含有するポリエチレンマスターバッチ)  (3) E3 (polyethylene masterbatch containing 7% organoboron compound)
ボロンインターナショナル社製「ノヽイボロン MB400N— 8LDPE」(商品名)を用い た。  Boron International Co., Ltd. “NOI BORON MB400N-8LDPE” (trade name) was used.
(4) E4 (非イオン界面活性剤)  (4) E4 (Nonionic surfactant)
ステアリルモノグリセライド 100%の花王社製「エレクトロストリッパー TS— 5」(商品 名)を用いた。  “Electrostripper TS-5” (trade name) manufactured by Kao Corporation with 100% stearyl monoglyceride was used.
[0206] 2-6.成分 (F) [0206] 2-6. Ingredient (F)
三洋化成工業社製ポリアミド一ポリエーテルマルチブロック共重合体"ペレスタツト N C6321" (商品名)を用いた。  A polyamide-polyether multi-block copolymer “Pelestat N C6321” (trade name) manufactured by Sanyo Chemical Industries, Ltd. was used.
2- 7.成分 (G) (加工助剤)  2- 7. Ingredient (G) (Processing aid)
三菱レイヨン社製超高分子アクリル系重合体"メタプレン P531A" (商品名)を用い [0207] 3.制電性榭脂組成物の製造及び評価 Using Mitsubishi Rayon's ultra-high molecular weight acrylic polymer "Metaprene P531A" (trade name) [0207] 3. Manufacture and evaluation of antistatic resin composition
実施例 1 1〜 1 14及び比較例 1 1〜 1 5  Examples 1 1 to 1 14 and Comparative Examples 1 1 to 1 5
上記の成分 (A)、 (B)、 (C)及び (E)を、表 1及び表 2に記載の配合割合でヘンシ エルミキサーにより混合した後、二軸押出機 (シリンダーの設定温度; 220°C)を用い て溶融混練し、ペレット (制電性榭脂組成物)を得た。  After mixing the above components (A), (B), (C) and (E) with a Henschel mixer at the blending ratios shown in Tables 1 and 2, a twin-screw extruder (cylinder set temperature; 220 The mixture was melt-kneaded using (C) to obtain pellets (antistatic resin composition).
ペレットを十分に乾燥した後、射出成形機 (シリンダーの設定温度; 220°C)を用い て成形し、肉厚 1. 6mmの平板状試験片を得た。本試験片を用い、制電性 (表面固 有抵抗)、透明性及び成形品外観の評価を行った。その結果を表 1及び表 2に示す  After the pellets were sufficiently dried, they were molded using an injection molding machine (set temperature of the cylinder; 220 ° C) to obtain a flat plate test piece having a thickness of 1.6 mm. Using this test piece, the antistatic property (surface resistance), transparency and appearance of the molded product were evaluated. The results are shown in Table 1 and Table 2.
[0208] 実施例 1 15〜1 18 [0208] Examples 1 15 to 1 18
上記の成分 (A)、 (B)、 (C)及び (E)を、表 3に記載の配合割合でヘンシェルミキサ 一により混合した後、二軸押出機 (シリンダーの設定温度; 220°C)を用いて溶融混 練し、ペレット (制電性榭脂組成物)を得た。  After mixing the above components (A), (B), (C) and (E) with a Henschel mixer at the blending ratio shown in Table 3, a twin screw extruder (cylinder set temperature; 220 ° C) Was used for melting and kneading to obtain pellets (antistatic resin composition).
ペレットを十分に乾燥した後、インフレーション押出機 (シリンダー、ダイの設定温度 ;実施例 1— 15及び 1 - 16では 190°C、実施例 1— 17及び 1 - 18では 160°C)を用 いて押出し、肉厚 50 /z mのフィルム力もなる袋を得た。本フィルムを用い、制電性 (表 面固有抵抗)、透明性及び成形品外観の評価を行った。その結果を表 3に示す。  After the pellets have been thoroughly dried, use an inflation extruder (cylinder, die set temperature; 190 ° C for Examples 1-15 and 1-16, 160 ° C for Examples 1-17 and 1-18) Extrusion was carried out to obtain a bag having a film thickness of 50 / zm. Using this film, the antistatic property (surface resistivity), transparency and appearance of the molded product were evaluated. The results are shown in Table 3.
[0209] [表 1] [0209] [Table 1]
^ 表
Figure imgf000074_0001
^ Table
Figure imgf000074_0001
s¾ 表 2 s¾ Table 2
Figure imgf000075_0001
Figure imgf000075_0001
表 3 Table 3
Figure imgf000076_0001
Figure imgf000076_0001
[0212] 表 1〜表 3より、以下のことが明らかである。 [0212] From Table 1 to Table 3, the following is clear.
実施例 1— 1〜1— 18は、いずれも、制電性、透明性及び成形品外観に優れてい た。一方、比較例 1— 1〜1— 5は、成分 (A)、(B)又は (C)の含有割合が、本発明の 範囲外であり、制電性、透明性及び成形品外観のいずれかに劣っていた。  Examples 1-1 to 1-18 were all excellent in antistatic property, transparency and appearance of the molded product. On the other hand, in Comparative Examples 1-1 to 1-5, the content ratio of the component (A), (B) or (C) is outside the scope of the present invention, and any of antistatic properties, transparency, and appearance of the molded product It was inferior.
[0213] 4. 2層型構造の袋の製造及び評価 [0213] 4. Manufacture and evaluation of bags with two-layer structure
実験例 1 1  Experimental example 1 1
先ず、上記の成分 (A3) 60部と、成分 (A4) 26部と、成分 (B2) 14部と、成分 (E1) 2部とを、ヘンシェルミキサーにより混合した後、二軸押出機 (シリンダーの設定温度; 220°C)を用いて溶融混練し、ペレット X(制電性榭脂組成物)を作製し、十分に乾燥 させた。その後、このペレット Xと、成分 (A3)とを、多層インフレーション押出機 (シリ ンダ一、ダイの設定温度; 190°C)を用いて共押出した。両層の厚さがいずれも 25 m、全厚さが 50 mのフィルムとした後、制電性榭脂組成物力もなる層が表面側とな るように袋を製造した。透明性及び成形品外観は良好であった。また、表面固有抵抗 は、 7 X 106 Ωであり、制電性に優れていた。 First, 60 parts of the above component (A3), 26 parts of component (A4), 14 parts of component (B2), and 2 parts of component (E1) were mixed with a Henschel mixer, and then a twin screw extruder (cylinder Was then melt-kneaded at 220 ° C. to produce pellet X (an antistatic resin composition), which was sufficiently dried. Thereafter, the pellet X and the component (A3) were co-extruded using a multilayer inflation extruder (a cylinder, die set temperature; 190 ° C.). After forming a film with a thickness of 25 m for both layers and a total thickness of 50 m, the layer with antistatic resin composition strength becomes the surface side. The bag was manufactured as follows. The transparency and the appearance of the molded product were good. Moreover, the surface resistivity was 7 × 10 6 Ω, and the antistatic property was excellent.
実験例 1 10  Experimental example 1 10
実験例 1—1において、成分 (A3) 60部、成分 (Α4) 26部を、成分 (A3) 86部に変 更した以外は同様に製造した。透明性及び成形品外観は良好であった。また、表面 固有抵抗は、 1 X 107 Ωであり、制電性に優れていた。 In Example 1-1, 60 parts of component (A3) and 26 parts of component (IV) were changed to 86 parts of component (A3). The transparency and the appearance of the molded product were good. The surface resistivity was 1 X 10 7 Ω, and the antistatic property was excellent.
実験例 1 1と実験例 1 10のフィルム(100mm X 100mm)について、温度 80°C の条件下、 1時間放置した後の平滑性を観察した。実験例 1 10のフィルムは若干 の皺が見られた力 実験例 1—1のフィルムは、ほとんど変化が見られな力つた。  Experimental Example 1 1 and Experimental Example 1 The film (100 mm × 100 mm) was observed for smoothness after standing for 1 hour at a temperature of 80 ° C. Experimental example 1 The film of 10 showed a slight wrinkle. The film of Experimental example 1-1 showed almost no change.
[0214] 5. 3層型構造のフィルムの製造及び評価 [0214] 5. Manufacture and evaluation of films with three-layer structure
実験例 1 11  Example 1 11
実験例 1— 1にお 、て得られたペレット Xと、成分 (A3)とを多層インフレーション押 出機 (シリンダー、ダイの設定温度; 190°C)を用いて、制電性榭脂組成物(ペレット X )が両表層となる 3層のフィルムを製造した。各層の厚さは 15Z20Z15 mとした。 透明性及び成形品外観は良好であった。また、表面固有抵抗は、 7 Χ 106 Ωであり、 制電性に優れていた。 Using Experimental Example 1-1, pellet X obtained above and component (A3) were mixed with a multi-layer inflation extruder (set temperature of cylinder and die: 190 ° C), and antistatic resin composition A three-layer film in which (pellet X) is both surface layers was produced. The thickness of each layer was 15Z20Z15 m. The transparency and the appearance of the molded product were good. The surface resistivity was 7 7 10 6 Ω, and the antistatic property was excellent.
実験例 1 12  Experimental example 1 12
実験例 1— 11におけるペレット Xの製造にあたって、成分 (A3) 60部、成分 (Α4) 2 6部を、成分 (A3) 86部に変更した以外は同様に製造した。得られた 3層フィルムの 透明性及び成形品外観は良好であった。また、表面固有抵抗は、 1 X 107であり、制 電性に優れていた。 In the production of Pellet X in Experimental Examples 1-11, the production was the same except that 60 parts of component (A3) and 6 parts of component (成分 4) 2 were changed to 86 parts of component (A3). The resulting three-layer film had good transparency and molded product appearance. In addition, the surface resistivity was 1 × 10 7 and the antistatic property was excellent.
実験例 1— 11と実験例 1— 12のフィルム(100mm X 100mm)について、温度 80 °Cの条件下、 1時間放置した後の平滑性を観察した。実験例 1 12のフィルムは若 干の皺が見られた力 実験例 1— 11のフィルムは、ほとんど変化が見られな力つた。  The smoothness of the films of Experimental Example 1-11 and Experimental Example 1-12 (100 mm × 100 mm) after standing for 1 hour at a temperature of 80 ° C. was observed. Experimental example 1 The film of 12 showed a force with a slight wrinkle. The film of Experimental example 1-11 had a force with almost no change.
[0215] 6.制電'粘着性榭脂組成物の製造及び評価 [0215] 6. Manufacturing and evaluation of antistatic adhesive composition
実施例 2— 1〜2— 16及び比較例 2— 1  Examples 2-1 to 2-16 and Comparative Example 2-1
上記の成分 (A)、 (B)、 (C)及び (E)を、表 4及び表 5に記載の配合割合でヘンシ エルミキサーにより混合した後、二軸押出機 (シリンダーの設定温度; 220°C)を用い て溶融混練し、ペレット (制電'粘着性榭脂組成物)を得た。 After mixing the above components (A), (B), (C) and (E) with a Henschel mixer at the blending ratios shown in Tables 4 and 5, a twin screw extruder (set temperature of the cylinder; 220 ° C) And kneaded to obtain pellets (antistatic adhesive rubber composition).
ペレットを十分に乾燥した後、射出成形機 (シリンダーの設定温度; 220°C)を用い て成形し、肉厚 1. 6mmの平板状試験片を得た。本試験片を用い、制電性 (表面固 有抵抗)、透明性及び成形品外観の評価を行った。その結果を表 4及び表 5に示す [表 4] After the pellets were sufficiently dried, they were molded using an injection molding machine (set temperature of the cylinder; 220 ° C) to obtain a flat plate test piece having a thickness of 1.6 mm. Using this test piece, the antistatic property (surface resistance), transparency and appearance of the molded product were evaluated. The results are shown in Table 4 and Table 5 [Table 4]
表 4^ 〔〕〔a0217Table 4 ^ () (a0217
Figure imgf000079_0001
Figure imgf000079_0001
Figure imgf000080_0001
Figure imgf000080_0001
[0218] 表 4及び表 5より、以下のことが明らかである。  From Table 4 and Table 5, the following is clear.
実施例 2— 1〜2— 16は、いずれも、制電性、透明性及び成形品外観に優れてい た。一方、比較例 2—1は、成分 (B)又は (C)の含有割合が、本発明の範囲外であり 、制電性、又は、透明性及び成形品外観に劣っていた。  Examples 2-1 to 2-16 were all excellent in antistatic property, transparency and appearance of the molded product. On the other hand, in Comparative Example 2-1, the content ratio of the component (B) or (C) was outside the scope of the present invention, and the antistatic property, transparency, and appearance of the molded product were inferior.
[0219] 7.粘着フィルムの製造及び評価 [0219] 7. Manufacture and evaluation of adhesive films
実施例3— 1〜3— 17 まず、支持体の形成用組成物として、上記の成分 (A)、 (B)、 (C)及び (E)を、表 6 〜表 8に記載の配合割合でヘンシェルミキサーにより混合した後、二軸押出機 (シリ ンダ一の設定温度; 220°C)を用いて溶融混練し、ペレットを得た。 Example 3-1 to 3-17 First, as a composition for forming a support, the above components (A), (B), (C) and (E) were mixed by a Henschel mixer at the blending ratios shown in Tables 6 to 8, Pellets were obtained by melt-kneading using a screw extruder (set temperature of the cylinder: 220 ° C.).
一方、制電性粘着層の形成用組成物も、上記の成分 (A)、(B)、(C)及び (E)を、 表 6〜表 8に記載の配合割合でタンブラ一により混合することにより得た。  On the other hand, the composition for forming the antistatic adhesive layer is also prepared by mixing the above components (A), (B), (C) and (E) with a tumbler at the blending ratios shown in Tables 6 to 8. Was obtained.
[0220] その後、上記の支持体及び制電性粘着層の各形成用組成物を、多層インフレーシ ヨン押出機 (シリンダーの設定温度; 210〜240°C)を用いて共押出し、支持体の厚さ 力 0 mであり且つ制電性粘着層の厚さが 20 mである粘着フィルムを得た。本粘 着フィルムを用い、支持体及び制電性粘着層の各表面における制電性、透明性、成 形品外観、支持体と制電性粘着層との接着性、並びに、粘着フィルムの制電性粘着 層表面と TACフィルムとの粘着性を評価した。その結果を表 6〜表 8に示す。  [0220] Thereafter, each of the above-mentioned composition for forming the support and the antistatic adhesive layer was coextruded using a multilayer inflation extruder (set temperature of the cylinder; 210 to 240 ° C) to obtain the thickness of the support. An adhesive film having a thickness of 0 m and an antistatic adhesive layer thickness of 20 m was obtained. Using this adhesive film, antistatic property, transparency, appearance of molded product, adhesion between support and antistatic adhesive layer on each surface of support and antistatic adhesive layer, and control of adhesive film Electric adhesion The adhesion between the surface of the layer and the TAC film was evaluated. The results are shown in Tables 6-8.
[0221] [表 6] [0221] [Table 6]
表 6 Table 6
Figure imgf000082_0001
7] 表 7
Figure imgf000082_0001
7] Table 7
Figure imgf000083_0001
8] 表 8
Figure imgf000083_0001
8] Table 8
Figure imgf000084_0001
Figure imgf000084_0001
表 6〜表 8より、実施例 3— 1〜3— 17は、いずれも、制電性、透明性、成形品外観 、支持体と制電性粘着層との接着性、並びに、粘着フィルムの制電性粘着層表面と TACフィルムとの粘着性に優れてレ、た。  From Table 6 to Table 8, Examples 3-1 to 3-17 all have antistatic properties, transparency, appearance of the molded product, adhesion between the support and the antistatic adhesive layer, and the adhesive film. Excellent adhesion between the antistatic adhesive layer surface and the TAC film.
また、実施例 3— 12及び 3— 13の粘着フィルム(100mm X 100mm)について、温 度 80°Cの条件下、 1時間放置した後の反りの程度を観察した。実施例 3— 12の粘着 フィルムは、若干の反りが見られた力 実施例 3— 13の粘着フィルムは、全く変化が なかった。成分 (A4)を含有しているため、耐熱性に優れていることが分かる。 In addition, the degree of warping of the adhesive films of Examples 3-12 and 3-13 (100 mm × 100 mm) after being allowed to stand for 1 hour at a temperature of 80 ° C. was observed. Example 3—Adhesion of 12 The film was slightly warped. The adhesive film of Examples 3 to 13 had no change at all. Since it contains component (A4), it can be seen that it has excellent heat resistance.
[0225] 実施例 3'— 1〜^一 13 、比較例 3 '— 1〜^一 2 [0225] Example 3'— 1 to ^ 1 13 and Comparative Example 3 '— 1 to ^ 1 2
表 9記載の配合割合で粘着剤及びスチレン系榭脂の各構成成分をヘンシェルミキ サ一で混合した後、二軸押出機 (シリンダー設定温度 220°C)で溶融混練し、ペレット 化した。  Each component of the pressure-sensitive adhesive and styrene-based resin was mixed with a Henschel mixer at the blending ratio shown in Table 9, and then melt-kneaded with a twin-screw extruder (cylinder setting temperature 220 ° C.) to form pellets.
スチレン系榭脂は、カレンダー加工法で 50 mの支持体フィルムを製造した。フィル ムの片面にコロナ放電処理したあと、コロナ放電処理面にポリエチレンイミン層を形 成させた。  Styrenic resin produced a 50 m support film by a calendering method. After corona discharge treatment on one side of the film, a polyethyleneimine layer was formed on the corona discharge treatment surface.
該フィルムのポリエチレンイミン層側に押出しラミネート法で 20 μ mの厚みの粘着剤 層を形成させた。本粘着フィルムを用いて、前記の評価方法で、制電性、制電性粘 着層と TACフィルムとの粘着性、及び支持体 (スチレン系フィルム層)と制電性粘着 剤層の接着強度 (接着性一 2)を評価した。また、フィルムの透明性及び外観をそれ ぞれ目視で評価した。  A pressure-sensitive adhesive layer having a thickness of 20 μm was formed on the polyethyleneimine layer side of the film by extrusion lamination. Using this adhesive film, the antistatic property, the adhesiveness between the antistatic adhesive layer and the TAC film, and the adhesive strength between the support (styrene-based film layer) and the antistatic adhesive layer were evaluated by the above evaluation method. (Adhesiveness 1) was evaluated. In addition, the transparency and appearance of the film were visually evaluated.
表 9に示される結果から、以下のことが明らかである。  From the results shown in Table 9, the following is clear.
本発明の実施例^ 1〜^― 13の粘着フィルムは、制電性に優れ、又支持体と粘 着剤の接着強度も優れる。又 TACフィルムとの粘着性のコントロールも容易である。 更に透明性 ·外観に優れたフィルムである。  The adhesive films of Examples ^ 1 to ^ -13 of the present invention have excellent antistatic properties and excellent adhesive strength between the support and the adhesive. It is also easy to control the adhesiveness with the TAC film. Furthermore, it is a film with excellent transparency and appearance.
一方、比較例^ 1は、本発明の (C)成分の使用量が発明の範囲外で多ぐ (B) 成分の使用量が発明の範囲外で少ない例であるが,制電性が発現しない。比較例 2 は、本発明の(C)成分の使用量が発明の範囲外で少なぐ(B)成分の使用量が発明 の範囲外で多い例であるり、制電性は問題ないが、フィルムの外観が劣り実用に供し ない。  On the other hand, Comparative Example ^ 1 is an example in which the amount of component (C) used in the present invention is large outside the scope of the invention, and the amount of component (B) used is small outside the scope of the invention, but antistatic properties are manifested. do not do. Comparative Example 2 is an example in which the amount of component (C) used in the present invention is small outside the scope of the invention, and the amount of component (B) used is large outside the scope of the invention, and there is no problem with antistatic properties. The appearance of the film is inferior and not practical.
[0226] [表 9] 表 9 [0226] [Table 9] Table 9
Figure imgf000086_0001
Figure imgf000086_0001
[0227] 8. 3層型シートの製造及び評価 [0227] 8. Production and evaluation of 3-layer sheet
実験例 1 2〜1 9  Experimental example 1 2 to 1 9
図 4に示すような 3層型シートを製造するために、第 1層及び第 3層の形成用組成物 として、上記の成分 (A)、 (B)、 (C)及び (E)を、表 10に記載の配合割合でヘンシ ルミキサーにより混合した後、二軸押出機 (シリンダーの設定温度; 220°C)を用いて 溶融混練し、ペレット (制電性榭脂組成物)を得た。一方、中間層である第 2層の形成 用組成物として、表 10に記載の重合体力もなるペレットを用いた。  In order to produce a three-layer type sheet as shown in FIG. 4, the above components (A), (B), (C) and (E) are used as the composition for forming the first layer and the third layer. After mixing with a hencil mixer at the blending ratio shown in Table 10, the mixture was melt-kneaded using a twin-screw extruder (cylinder set temperature; 220 ° C.) to obtain pellets (antistatic resin composition). On the other hand, as the composition for forming the second layer, which is an intermediate layer, pellets having polymer strength described in Table 10 were used.
上記の各ペレットを十分に乾燥した後、 2種 3層の Tダイ押出機を用い、厚さ 0. 8m mの第 2層の両面側に、厚さ 0. 1mmの第 1層及び第 3層が配された 3層型シートを 得た。本 3層型シートを用い、制電性、透明性及び成形品外観の評価を行った。その 結果を表 10に示す。  After sufficiently drying each of the above pellets, using a T-die extruder of type 2 and layer 3, on both sides of the second layer having a thickness of 0.8 mm, the first and third layers having a thickness of 0.1 mm A three-layer sheet with layers was obtained. Using this three-layer sheet, the antistatic property, transparency and appearance of the molded product were evaluated. The results are shown in Table 10.
[0228] [表 10] [0228] [Table 10]
Figure imgf000088_0001
Figure imgf000088_0001
[0229] 表 10より、実験例 1— 2〜1— 9は、いずれも、本発明の制電性榭脂組成物を用い て第 1層及び第 3層を形成させてなる 3層シートであり、両表面における制電性に優 れており、第 2層(中間層)が、第 1層及び第 3層の形成に用いた同じ成分 (A)を含む ため、透明性及び成形品外観にも優れていた。  [0229] From Table 10, Experimental Examples 1-2 to 1-9 are all three-layer sheets in which the first layer and the third layer are formed using the antistatic resin composition of the present invention. Yes, it has excellent antistatic properties on both surfaces, and the second layer (intermediate layer) contains the same component (A) used to form the first and third layers. It was also excellent.
産業上の利用可能性  Industrial applicability
[0230] 本発明の制電性榭脂組成物は、制電性及び成形品外観に優れ、透明性にも優れ るため、静電気障害が大きな問題となる分野で利用されるフィルム、シート等の成形 品の成形材料として有用である。 [0230] The antistatic resin composition of the present invention is excellent in antistatic property and appearance of a molded product, and also excellent in transparency. Therefore, it is useful as a molding material for molded products such as films and sheets used in fields where static electricity damage is a major problem.
本発明の制電'粘着性樹脂組成物は、制電性、透明性及び成形品外観に優れる ため、静電気障害が大きな問題となる分野で利用される粘着フィルム、多層シート等 の成形品の成形材料として有用である。  Since the antistatic adhesive resin composition of the present invention is excellent in antistatic properties, transparency and appearance of molded products, molding of molded products such as pressure-sensitive adhesive films and multilayer sheets used in fields where static electricity damage is a major problem. Useful as a material.
本発明の制電性榭脂組成物及び制電 '粘着性榭脂組成物からなる、粘着フィルム 、多層シート等の成形品は、制電性及び成形品外観に優れ、その実施形態によって は透明性にも優れるため、静電気障害が大きな問題となる分野で利用される粘着フ イルム、多層シート等の成形品の成形材料として有用である。  The molded article such as an adhesive film and multilayer sheet comprising the antistatic resin composition and the antistatic adhesive composition of the present invention is excellent in antistatic property and appearance of the molded article, and is transparent depending on the embodiment. Because of its excellent properties, it is useful as a molding material for molded products such as adhesive films and multilayer sheets used in fields where static electricity damage is a major problem.
図面の簡単な説明  Brief Description of Drawings
[0231] [図 1]本発明の粘着フィルムの 1例を示す概略断面図である。  FIG. 1 is a schematic cross-sectional view showing an example of an adhesive film of the present invention.
[図 2]制電性粘着層の表面に保護層が配された粘着フィルムの 1例を示す概略断面 図である。  FIG. 2 is a schematic sectional view showing an example of an adhesive film in which a protective layer is disposed on the surface of the antistatic adhesive layer.
[図 3]支持体の両面側に制電性粘着層及び保護層が配された粘着フィルムの 1例を 示す概略断面図である。  FIG. 3 is a schematic cross-sectional view showing an example of an adhesive film in which an antistatic adhesive layer and a protective layer are arranged on both sides of a support.
[図 4]本発明の制電性榭脂組成物を用いてなる 3層型シートの 1例を示す概略断面 図である。  FIG. 4 is a schematic sectional view showing an example of a three-layer sheet using the antistatic resin composition of the present invention.
符号の説明  Explanation of symbols
[0232] 1, 1,及び 1" ;粘着フィルム、 11 ;支持体、 12, 12a及び 12b ;制電性粘着層、 13, 13a及び 13b ;保護層、 2 ; 3層型シート、 21a及び 21b ;本発明の制電性榭脂組成物 を用いてなる層、 22 ;中間層。  [0232] 1, 1, and 1 "; Adhesive film, 11; Support, 12, 12a and 12b; Antistatic adhesive layer, 13, 13a and 13b; Protective layer, 2; Three-layer sheet, 21a and 21b A layer formed using the antistatic resin composition of the present invention, 22 an intermediate layer.

Claims

請求の範囲 The scope of the claims
[1] (A)ポリオレフイン系榭脂 (但し、下記成分 (B)を除く。) 30〜95質量%と、  [1] (A) Polyolefin resin (excluding the following component (B)) 30 to 95% by mass;
(B)ォレフィン重合体ブロックと親水性ポリマーブロックとを含むブロック共重合体 5〜 20質量%と、  (B) 5-20% by mass of a block copolymer containing an olefin polymer block and a hydrophilic polymer block;
(C)共役ジェンィ匕合物単位を含む重合体およびその水素添加物からなる群より選ば れた少なくとも 1種の重合体 0〜50質量%と、  (C) 0-50% by mass of at least one polymer selected from the group consisting of a polymer containing a conjugated diene compound unit and a hydrogenated product thereof;
を含有する(但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質量%である 。)ことを特徴とする制電性榭脂組成物。  (However, the total of the said component (A), a component (B), and a component (C) is 100 mass%).) The antistatic resin composition characterized by the above-mentioned.
[2] 上記成分 (A)力 環状ォレフィン単位を含み且つガラス転移温度が 60〜200°Cであ るポリオレフイン系榭脂 (A— 1)と、環状ォレフィン単位を含まな 、ポリオレフイン系榭 脂 (A— 2)とからなり、両者の含有量の比( (A— 1) / (A- 2) )が 95Z5〜: LZ99 ( 質量比)である請求項 1に記載の制電性榭脂組成物。  [2] Component (A) Force Polyolefin resin (A-1) containing a cyclic olefin unit and having a glass transition temperature of 60 to 200 ° C, and a polyolefin resin (A-1) containing no cyclic olefin unit ( 2. The antistatic oil composition according to claim 1, wherein the content ratio of the two (A-1) / (A-2)) is 95Z5: LZ99 (mass ratio). object.
[3] 上記成分 (C)が、共役ジェン化合物単位力 主としてなる重合体ブロック (cl)と芳香 族ビ-ルイ匕合物単位力 主としてなる重合体ブロック(c2)とを含むブロック共重合体 およびその水素添加物からなる群より選ばれた少なくとも 1種の重合体である請求項 1に記載の制電性榭脂組成物。  [3] A block copolymer in which the component (C) includes a polymer block (cl) mainly comprising a conjugated diene compound unit force and a polymer block (c2) mainly comprising an aromatic beryl compound unit force and 2. The antistatic resin composition according to claim 1, which is at least one polymer selected from the group consisting of the hydrogenated product.
[4] さらに、下記成分 (E1)、成分 (E2)、成分 (E3)及び成分 (E4)からなる群より選ばれ た少なくとも 1種の制電性改良剤 (E)を、前記制電性榭脂組成物の制電性を改良す るに十分な量だけ含有する請求項 1記載の制電性榭脂組成物。  [4] Furthermore, at least one antistatic agent (E) selected from the group consisting of the following component (E1), component (E2), component (E3) and component (E4) is added to the antistatic property. 2. The antistatic resin composition according to claim 1, which is contained in an amount sufficient to improve the antistatic property of the resin composition.
成分 (E1):フッ素化アルキルスルホ -ル基を備えたァ-オン部を有する塩、 成分 (E2):下記一般式 (ΧΠ)で表される単位を含む重合体、  Component (E1): a salt having a cation moiety having a fluorinated alkylsulfol group, Component (E2): a polymer containing a unit represented by the following general formula (ΧΠ),
成分 (E3):下記一般式 (ΧΙΠ)で表される単位を含むホウ素化合物、  Component (E3): a boron compound containing a unit represented by the following general formula (ΧΙΠ),
成分 (E4):非イオン性界面活性剤。  Ingredient (E4): nonionic surfactant.
[化 1]
Figure imgf000091_0001
[Chemical 1]
Figure imgf000091_0001
(式中、 R5は炭化水素基を表し、 R5'は水素原子、ハロゲン原子又は炭化水素基を 表し、 Xは水素原子、炭化水素基、ウレタン残基若しくはエステル残基を有する炭化 水素基、又は親水基を表し、 mは 1以上の数を表す。 ) (Wherein R 5 represents a hydrocarbon group, R 5 ′ represents a hydrogen atom, a halogen atom or a hydrocarbon group, X represents a hydrocarbon group having a hydrogen atom, a hydrocarbon group, a urethane residue or an ester residue. Or represents a hydrophilic group, and m represents a number of 1 or more.
[化 2]  [Chemical 2]
Figure imgf000091_0002
Figure imgf000091_0002
[5] (A)ポリオレフイン系榭脂 (但し、下記成分 (B)を除く。)0〜59質量%と、 [5] (A) Polyolefin resin (excluding the following component (B)) 0 to 59% by mass;
(B)ォレフィン重合体ブロックと親水性ポリマーブロックとを含むブロック共重合体 3〜 60質量%と、  (B) 3 to 60% by mass of a block copolymer containing an olefin polymer block and a hydrophilic polymer block;
(C)共役ジェンィ匕合物単位を含む重合体およびその水素添加物からなる群より選ば れた少なくとも 1種の重合体 35〜97質量%と、  (C) 35 to 97% by mass of at least one polymer selected from the group consisting of a polymer containing a conjugated diene compound unit and a hydrogenated product thereof,
を含有する(但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質量%である (However, the total of the above component (A), component (B) and component (C) is 100% by mass)
。)ことを特徴とする制電 '粘着性樹脂組成物。 . ) Antistatic 'adhesive resin composition characterized by that.
[6] 上記成分 (A) 0〜40質量%と、上記成分 (B) 6〜25質量%と、上記成分 (C) 35〜9[6] The above component (A) 0 to 40% by mass, the above component (B) 6 to 25% by mass, and the above component (C) 35 to 9
4質量%とを含有する (但し、上記成分 (A)、成分 (B)及び成分 (C)の合計は 100質 量%である。 )請求項 5に記載の制電'粘着性榭脂組成物。 (However, the total of the component (A), the component (B) and the component (C) is 100% by mass.) The antistatic adhesive rubber composition according to claim 5 object.
[7] 上記成分 (A)力 環状ォレフィン単位を含み且つガラス転移温度が 60〜200°Cであ るポリオレフイン系榭脂 (A— 1)と、環状ォレフィン単位を含まな 、ポリオレフイン系榭 脂 (A— 2)とからなり、両者の含有量の比( (A— 1) / (A- 2) )が 95Z5〜: LZ99 ( 質量比)である請求項 6に記載の制電'粘着性榭脂組成物。 [7] The component (A) force includes a cyclic olefin unit and has a glass transition temperature of 60 to 200 ° C. Polyolefin resin (A-1) and polyolefin resin (A-2) that does not contain a cyclic olefin unit, and the ratio of both ((A-1) / (A-2) ) Is from 95Z5 to: LZ99 (mass ratio).
[8] 上記成分 (C)が、共役ジェン化合物単位力 主としてなる重合体ブロック (cl)と芳香 族ビ-ルイ匕合物単位力 主としてなる重合体ブロック(c2)とを含むブロック共重合体 およびその水素添加物からなる群より選ばれた少なくとも 1種の重合体である請求項 6に記載の制電'粘着性榭脂組成物。  [8] A block copolymer in which the component (C) comprises a polymer block (cl) mainly comprising a conjugated diene compound unit force and a polymer block (c2) mainly comprising an aromatic beryl compound unit force and 7. The antistatic adhesive resin composition according to claim 6, which is at least one polymer selected from the group consisting of the hydrogenated product.
[9] さらに、下記成分 (E1)、成分 (E2)、成分 (E3)及び成分 (E4)からなる群より選ばれ た少なくとも 1種の制電性改良剤 (E)を、前記制電'粘着性榭脂組成物の制電性を 改良するに十分な量だけ含有する請求項 6記載の制電'粘着性榭脂組成物。  [9] Furthermore, at least one antistatic agent (E) selected from the group consisting of the following component (E1), component (E2), component (E3) and component (E4) is added to the antistatic agent. 7. The antistatic pressure-sensitive adhesive composition according to claim 6, which is contained in an amount sufficient to improve the antistatic property of the adhesive resin composition.
成分 (E1):フッ素化アルキルスルホ -ル基を備えたァ-オン部を有する塩、 成分 (E2):下記一般式 (ΧΠ)で表される単位を含む重合体、  Component (E1): a salt having a cation moiety having a fluorinated alkylsulfol group, Component (E2): a polymer containing a unit represented by the following general formula (ΧΠ),
成分 (E3):下記一般式 (ΧΙΠ)で表される単位を含むホウ素化合物、  Component (E3): a boron compound containing a unit represented by the following general formula (ΧΙΠ),
成分 (E4):非イオン性界面活性剤。  Ingredient (E4): nonionic surfactant.
[化 3]  [Chemical 3]
Figure imgf000092_0001
Figure imgf000092_0001
(式中、 R5は炭化水素基を表し、 R5'は水素原子、ハロゲン原子又は炭化水素基を 表し、 Xは水素原子、炭化水素基、ウレタン残基若しくはエステル残基を有する炭化 水素基、又は親水基を表し、 mは 1以上の数を表す。 ) (Wherein R 5 represents a hydrocarbon group, R 5 ′ represents a hydrogen atom, a halogen atom or a hydrocarbon group, X represents a hydrocarbon group having a hydrogen atom, a hydrocarbon group, a urethane residue or an ester residue. Or represents a hydrophilic group, and m represents a number of 1 or more.
[化 4]
Figure imgf000093_0001
[Chemical 4]
Figure imgf000093_0001
[10] 上記成分 (A)がポリオレフイン (Α' - 1)及び Ζ又は官能基で変性されて 、るポリオレ フィン (Α' - 2)であり、上記成分 (C)が共役ジェンィ匕合物単位及び芳香族ビ-ルイ匕 合物単位から主としてなる重合体の水素添加物であり、上記成分 (Α) 0〜59質量%[10] The component (A) is polyolefin (Α'-1) and polyolefin (Α'-2) modified with Ζ or a functional group, and the component (C) is a conjugate conjugated compound unit. And a hydrogenated product of a polymer mainly composed of aromatic beer compound units, and the above component (Α) 0 to 59% by mass
、上記成分 (Β) 3〜60質量%、及び上記成分 (C) 40〜97質量%からなる請求項 5 に記載の制電'粘着性榭脂組成物。 The antistatic pressure-sensitive adhesive composition according to claim 5, comprising 3 to 60% by mass of the component (Β) and 40 to 97% by mass of the component (C).
[11] 上記成分 (C)が、共役ジェン化合物単位力 主としてなる重合体ブロック (cl)と芳香 族ビ-ルイ匕合物単位力 主としてなる重合体ブロック(c2)とを含むブロック共重合体 およびその水素添加物からなる群より選ばれた少なくとも 1種の重合体である請求項[11] A block copolymer in which the component (C) comprises a polymer block (cl) mainly comprising a conjugated diene compound unit force and a polymer block (c2) mainly comprising an aromatic beryl compound unit force and The polymer is at least one polymer selected from the group consisting of the hydrogenated product.
10に記載の制電'粘着性榭脂組成物。 10. The antistatic pressure-sensitive adhesive composition according to 10.
[12] 上記成分 (C)成分の共役ジェンィ匕合物単位力もなる部分の水素添加率が 10〜: L00[12] The hydrogenation rate of the part of the component (C), which also has a conjugated unity compound unit force, is 10 to: L00
%である請求項 11記載の制電 '粘着性榭脂組成物。 The antistatic adhesive rubber composition according to claim 11, wherein the antistatic adhesive composition is%.
[13] 熱可塑性重合体組成物からなる支持体と、該支持体の少なくとも 1面側に配設され、 且つ、請求項 5乃至 12のいずれか 1項に記載の制電 '粘着性榭脂組成物からなる制 電性粘着層とを備えることを特徴とする粘着フィルム。 [13] A support made of a thermoplastic polymer composition, disposed on at least one side of the support, and the antistatic adhesive resin according to any one of claims 5 to 12. An adhesive film comprising: an antistatic adhesive layer comprising the composition.
[14] 上記熱可塑性重合体組成物がポリオレフイン系榭脂組成物であり、上記制電性粘着 層が請求項 5乃至 9のいずれか 1項に記載の制電 '粘着性榭脂組成物力 なる請求 項 13に記載の粘着フィルム。 [14] The thermoplastic polymer composition is a polyolefin resin composition, and the antistatic adhesive layer has an antistatic adhesive composition according to any one of claims 5 to 9. The pressure-sensitive adhesive film according to claim 13.
[15] 上記ポリオレフイン系榭脂組成物力 請求項 1乃至 4のいずれ力 1項に記載の制電性 榭脂組成物である請求項 14に記載の粘着フィルム。 15. The pressure-sensitive adhesive film according to claim 14, wherein the polyolefin resin-based resin composition is the antistatic resin composition according to any one of claims 1 to 4.
[16] 上記制電性粘着層が請求項 10乃至 12のいずれか 1項に記載の制電 '粘着性榭脂 組成物からなる請求項 13に記載の粘着フィルム。 16. The pressure-sensitive adhesive film according to claim 13, wherein the antistatic pressure-sensitive adhesive layer comprises the antistatic pressure-sensitive adhesive composition according to any one of claims 10 to 12.
[17] 上記熱可塑性重合体組成物がスチレン系榭脂組成物である請求項 16に記載の粘 着フイノレム。 [17] The viscosity according to claim 16, wherein the thermoplastic polymer composition is a styrene-based resin composition. Chaohu Inolem.
[18] 請求項 13乃至 17のいずれか 1項に記載の粘着フィルムを備えてなる表示装置用の 保護フィルム。  [18] A protective film for a display device, comprising the adhesive film according to any one of claims 13 to 17.
[19] 請求項 1乃至 4の何れか 1項に記載の制電性榭脂組成物からなる成形品。  [19] A molded article comprising the antistatic resin composition according to any one of [1] to [4].
[20] フィルムである請求項 19記載の成形品。 20. The molded article according to claim 19, which is a film.
[21] 熱可塑性重合体組成物と、請求項 5乃至 12のいずれか 1項に記載の制電 '粘着性 榭脂組成物とを共押出する工程を備えることを特徴とする粘着フィルムの製造方法。  [21] Production of pressure-sensitive adhesive film comprising a step of co-extruding the thermoplastic polymer composition and the antistatic adhesive pressure-sensitive resin composition according to any one of claims 5 to 12. Method.
[22] 上記熱可塑性重合体組成物がポリオレフイン系榭脂組成物であり、上記制電 '粘着 性榭脂組成物が請求項 5乃至 9の 、ずれか 1項に記載の組成物である請求項 21に 記載の粘着フィルムの製造方法。 [22] The thermoplastic polymer composition is a polyolefin resin composition, and the antistatic adhesive composition is the composition according to any one of claims 5 to 9. Item 22. The method for producing an adhesive film according to Item 21.
[23] 上記ポリオレフイン系榭脂組成物力 請求項 1乃至 4のいずれ力 1項に記載の制電性 榭脂組成物である請求項 22に記載の粘着フィルムの製造方法。 [23] The strength of the polyolefin-based resin composition according to any one of claims 1 to 4, wherein the antistatic resin composition according to any one of claims 1 to 4.
[24] 上記制電 '粘着性榭脂組成物が請求項 10乃至 12の 、ずれか 1項に記載の組成物 力 なる請求項 21に記載の粘着フィルムの製造方法。 [24] The method for producing an adhesive film according to [21], wherein the antistatic adhesive resin composition has the composition according to any one of claims 10 to 12.
[25] 上記熱可塑性重合体組成物がスチレン系榭脂組成物である請求項 24に記載の粘 着フィルムの製造方法。 25. The method for producing an adhesive film according to claim 24, wherein the thermoplastic polymer composition is a styrene-based resin composition.
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CN103374312A (en) * 2012-04-23 2013-10-30 泰州现代塑料有限公司 Polyolefin bonding resin for ultra-high molecular weight polyethylene (UHMWPE) composite
CN103374312B (en) * 2012-04-23 2015-12-02 泰州现代塑料有限公司 A kind of Polyofefine adhesive resin for ultra-high molecular weight polyethylene composite material

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KR101243090B1 (en) 2013-03-13
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KR20080002777A (en) 2008-01-04
CN101875824B (en) 2014-07-23

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