JP2003064328A - Adhesive sheet for processing semiconductor substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a semiconductor substrate with which the generation of electrostatic charge during a semiconductor manufacturing process is prevented, and the breakage of a semiconductor device and the deterioration of a product attributable to the electrostatic charge is prevented. SOLUTION: The adhesive sheet for processing a semiconductor substrate is obtained by applying an adhesive consisting of a base polymer, a radiation polymerizable compound and a radiation polymerization initiator on a surface of a resin film base material prepared by adding 1-80 pts.wt. of a polymer-type antistatic agent to 100 pts.wt. of polypropylene to form an adhesive layer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape used in the process of manufacturing various semiconductors. More specifically, for example, a patterned wafer is cut into individual patterns and divided into semiconductor elements. The present invention relates to a radiation-curable pressure-sensitive adhesive tape for fixing a semiconductor wafer, which has an antistatic effect.

[0002]

2. Description of the Related Art Conventionally, a semiconductor wafer and a package that have been collectively sealed are attached to each other, dicing, expanding, etc. are performed, and then they are mounted at the same time as mounting (in the case of a package, they are stored in a tray).
As a semiconductor processing sheet used at this time, a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer that undergoes a polymerization and curing reaction by ultraviolet rays and / or electron beams is applied on a base material that is transparent to ultraviolet rays and / or electron beams is used for dicing. There is known a method of subsequently irradiating the pressure-sensitive adhesive layer with ultraviolet rays and / or electron beams to polymerize and cure the pressure-sensitive adhesive layer to reduce the pressure-sensitive adhesive force and pick up a semiconductor wafer or a cut package. For example, in JP-A-60-196956 and JP-A-60-223139, trimethylolpropane triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate are used as photopolymerizable initiators constituting the adhesive layer. It has been proposed to use an acrylic resin-based compound having at least two UV- and / or electron-beam polymerizable carbon-carbon double bonds in the molecule, such as oligoester acrylate.

However, in recent years, with the high integration of semiconductor devices, circuits have become more detailed, and problems such as product destruction due to electrification and operational problems have arisen. Charges that are a concern during the process include charging due to peeling when peeling the sheet from the separator, charging due to friction between the blade and the sheet during dicing, peeling charging when removing the sheet from the suction table after dicing, and high-pressure discharge during cleaning. There are charging due to friction between the cleaning liquid and the sheet, charging generated by rotating the table at a high speed during cleaning and drying, charging due to peeling when picking up the chip and the package. These electrifications cause problems such as destruction of semiconductor devices and deterioration of performance, and problems in subsequent operations. Therefore, a method of kneading an antistatic agent into a sheet base material is used.

A low molecular weight type antistatic agent generally used as an antistatic agent kneaded into a sheet base material can be formed by forming a conductive layer (single to multimolecular layer) of the antistatic agent whose mechanism of action bleeds out to the surface of the molded article. Therefore, the effect may not be exhibited in the early stage of molding, and the effect may disappear when the chip shavings are washed with water under high pressure during dicing. On the other hand, the polymeric antistatic agent exhibits its effect by existing in the resin matrix in a micro-layer separated state and forming a conductive layer oriented on the resin surface during molding. Therefore, it requires a larger amount of addition than the low-molecular type, but since the effect is exhibited immediately after molding and there is no bleed-out, it has the characteristics that it does not contaminate contacted substances and does not lose the effect even if washed.
As the kelp poetry type antistatic agent, polyether ester amide, polyether / polyolefin block polymer and the like are generally known.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems, prevent the occurrence of electrification during the semiconductor manufacturing process, and prevent the destruction of semiconductor devices and the deterioration of products due to the electrification. It is to provide an adhesive sheet for semiconductor processing.

[0006]

Means for Solving the Problems As a result of intensive studies conducted by the present inventors in order to achieve the above object, as a result of the fact that a base film having a polymer type antistatic agent is charged. Based on this finding, the present invention has been completed.

That is, the present invention relates to polypropylene 100.
A pressure-sensitive adhesive comprising a base polymer, a radiation-polymerizable compound, and a radiation-polymerizable polymerization initiator is applied on the surface of a film substrate obtained by adding 1 to 80 parts by weight of a polymeric antistatic agent to parts by weight. 1 to 80 parts by weight of a polymer type antistatic agent, based on 100 parts by weight of a resin composition containing polypropylene as a main component. In the pressure-sensitive adhesive sheet for semiconductor substrate processing, which is a film base material obtained by adding 1 part by weight of the film base material, 1-80 parts by weight of a polymeric antistatic agent is added to 100 parts by weight of polypropylene. Is a pressure-sensitive adhesive sheet for processing a semiconductor substrate, which is a multi-layer film substrate comprising a film made of the same and a resin film.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
The film base material used in the present invention is 1 to 80 parts by weight with respect to 100 parts by weight of polypropylene resin (PP),
It preferably comprises 10 to 50 parts by weight of a mixture with a polymeric antistatic agent. The number of polymer antistatic agents added is 1.
If it is less than 80 parts by weight, the antistatic effect may not be obtained, and if it is more than 80 parts by weight, the appearance may be deteriorated when the sheet is prepared.

Examples of the polymeric antistatic agent used in the present invention include those having a quaternary ammonium salt in the molecule, polyamides, alkylene oxides of bisphenols and the like. Further, in order to enhance the ionic conductivity, the polymer type antistatic agent can be polymerized by using an oxidative polymerization agent in the presence of a dopant such as an inorganic acid or an organic sulfonic acid.

Examples of the above-mentioned dopant include chlorine,
Bromine, halogens of iodine, Lewis acids such as phosphorus pentafluoride, hydrogen chloride, protonic acid of sulfuric acid, transition metal chlorides of ferric chloride, silver perchlorate, transition metal compounds such as silver boron fluoride, and sodium. , Alkali metals such as lithium and potassium.

Further, as the above-mentioned oxidative polymerization agent, permanganic acid (salt) such as permanganate and potassium permanganate is used.
Chromic acids such as chromium trioxide, nitrates such as silver nitrate, halogens such as chlorine bromine and iodine, hydrogen peroxide, peroxides such as benzoyl peroxide, peroxodisulfuric acid, peroxodisulfate such as potassium peroxodisulfate Examples thereof include acids (salts), hypochlorite, oxyacid salts such as potassium chlorite, transition metal chlorides such as ferric chloride, and metal oxides such as silver oxide.

The base film used in the present invention is
A resin composition containing polypropylene as a main component, which is composed of a composition obtained by blending polypropylene with another resin, can be used. The other resin blended with polypropylene is not particularly limited as long as it is a resin having good radiation transmittance. For example, low density polyethylene,
Linear low density polyethylene, polypropylene, ethylene-
Propylene copolymer, ethylene-vinyl acetate copolymer,
Polymethylpentene, ethylene-acrylic acid copolymer,
Ethylene-methacrylic acid copolymer, ethylene-acrylic acid ester copolymer, ethylene-methacrylic acid ester copolymer, ethylene-propylene-diene copolymer, styrene-isoprene copolymer, styrene-butadiene copolymer , A homopolymer such as a styrene-ethylene-butene copolymer, a conventionally known one such as a copolymer, or a mixture thereof, or a mixture with another resin and an elastomer, and the like, required properties of a base film, cost The kind of resin and blending ratio can be arbitrarily selected according to various circumstances.

As a mixing means for adjusting the resin of the present invention, a heating roll, a Banbury mixer, a pressure kneader, a twin-screw kneader, etc. are generally adopted. When the above-mentioned mixing means is used, mixing is easy and reliable, and thus the obtained base material film also has an effect that the whitening phenomenon does not occur even when it is bent. Further, a sheet can be formed by a general and arbitrary molding method such as calender molding or extrusion molding.

In the present invention, a multi-layer film comprising a polypropylene resin as the central layer and a film made of another resin can be mainly used. The film for forming a multilayer is, for example, a compatible resin, a conventionally known one such as a resin which is difficult to be compatible but satisfies the requirements, or a compound made of these compounds, the required characteristics of the base film, It is arbitrarily selected according to various circumstances such as cost. The thickness of this film can be arbitrarily selected within the thickness of the film made of polypropylene resin.

As a method for producing the multi-layer film, a conventionally known co-extrusion method, a laminating method or the like is used. At this time, an adhesive agent is applied between the multi-layer films as is usually carried out in the production of a usual laminated film. May be interposed. As such an adhesive, a conventionally known adhesive such as an ethylene-vinyl acetate copolymer or a derivative thereof modified with maleic acid can be used.

From the viewpoint of the strength and elongation characteristics and the radiation transparency, the thickness of the substrate film is usually 30 to 300 μm. The thickness ratio of the central layer of the base film is arbitrarily set according to the required characteristics of the base film, but is usually preferably 10% or more based on the total thickness of the base film, and is 50 to 90.
% Is more preferable.

In the present invention, the base polymer used for the pressure-sensitive adhesive is not particularly limited, and examples thereof include polymers consisting of acrylic acid, methacrylic acid and their esters, acrylic acid, methacrylic acid and their esters. A copolymer with an unsaturated monomer which can be copolymerized, for example, vinyl acetate, styrene, acrylonitrile or the like is used. In addition, the adhesive of the present invention includes a rosin resin, a terpene resin, a coumarone resin, in order to enhance cohesive force,
A tackifier such as a phenol resin, a styrene resin, an aliphatic petroleum resin, an aromatic petroleum resin, or an aliphatic aromatic copolymer petroleum resin may be added.

The radiation-polymerizable compound used in the present invention is not particularly limited and, for example, urethane acrylate, acrylic monomer and the like are used.

The urethane acrylate is a urethane acrylate having 2 to 4 acryloyl groups in the molecule and is a compound synthesized by diisocyanate, polyol and hydroxy (meth) acrylate, and preferably 2 acryloyl groups. It is a urethane acrylate that has. As the above-mentioned isocyanate,
For example, toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, phenylene diisocyanate, dicyclohexylmethane diisocyanate, xylene diisocyanate, tetramethyl xylene diisocyanate, naphthalene diisocyanate and the like can be mentioned. Examples of the polyol include ethylene glycol, propylene glycol, butanediol, hexanediol and the like. Examples of the hydroxy (meth) acrylate include 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate.

Examples of the acrylate monomer include trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetrachloride, dipentaerythritol monohydroxypentaacrylate and dipentaerythritol hexaacrylate.

Examples of the radiation-polymerizable polymerization initiator include 2-2-dimethoxy-1,2-diphenylethan-1-one, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl. Diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β
-Crawl anthraquinone etc. are mentioned.

In the pressure-sensitive adhesive used in the present invention, the mixing ratio of the radiation-polymerizable compound and the radiation-polymerizable polymerization initiator is 50 to 200 parts by weight of the radiation-polymerizable compound with respect to 100 parts by weight of the base polymer, and the radiation-polymerizable compound. Polymerization initiator 0.
The mixing ratio is from 03 to 22.5 parts by weight. If the proportion of the radiation-polymerizable compound is less than 50 parts by weight, the adhesive strength after curing will not be sufficiently reduced, making it difficult to pick up the device, and if it exceeds 200 parts by weight, the cohesive strength of the adhesive layer will be insufficient, which is not preferable. . The ratio of radiation-polymerizable polymerization initiator is 0.0
If the amount is less than 3 parts by weight, the curing reaction of the radiation-polymerizable compound upon irradiation with ultraviolet rays and / or electron beams becomes poor and the adhesive strength is insufficiently reduced. If it exceeds 22.5 parts by weight, heat or fluorescent lamp may be used. Is not preferable because the stability of is deteriorated.

In the present invention, the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably about 5 to 35 μm. In the present invention, the pressure-sensitive adhesive layer is formed on the base material, and in order to produce a pressure-sensitive adhesive paper for semiconductor wafer processing, the components constituting the pressure-sensitive adhesive layer are used as they are or after they are dissolved in a suitable organic solvent and applied. Alternatively, it can be obtained by applying the composition on a base material by spraying or the like, and drying it by heat treatment or the like for about 30 to 10 minutes at 80 to 100 ° C.

A known method can be used to use the pressure-sensitive adhesive sheet for semiconductors of the present invention. For example, after the pressure-sensitive adhesive sheet for semiconductor processing is attached and fixed to a semiconductor wafer, the semiconductor device is cut into small pieces by a rotary round blade. Disconnect. After that, ultraviolet rays and / or electron beams are irradiated from the base material side of the processing pressure-sensitive adhesive sheet, and then the processing pressure-sensitive adhesive sheet is radially expanded using a special jig to spread the chips at regular intervals, and then the device is It may be pushed up with a needle or the like and picked up by a method such as suction with a vacuum collet or air tweezers, and at the same time stored in a mounting or tray.

[0025]

EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto. [Example 1] 10 parts by weight of a copolymer (A) having a weight average molecular weight of 500,000 obtained by copolymerizing 70 parts by weight of butyl acrylate, 25 parts by weight of 2-ethylhexyl acrylate and 5 parts by weight of vinyl acetate. Weight-average molecular weight of 300,000 obtained by copolymerizing 50 parts by weight of 2-ethylhexyl acrylate, 10 parts by weight of butyl acrylate, 37 parts by weight of vinyl acetate, and 3 parts by weight of 2-hydroxyethyl methacrylate.
To 100 parts by weight of a base resin consisting of 90 parts by weight of the copolymer (B), a radiation-polymerizable compound having a molecular weight of 110
30 parts by weight of 00 bifunctional urethane acrylate (C),
3 of 5-functional acrylate monomer (D) with a molecular weight of 500
0 parts by weight, 5 parts by weight of 2,2-dimethoxy-2-phenylacetophenone as a photopolymerization initiator (E), and 6 parts by weight of a polyisocyanate cross-linking agent (F) were added to prepare a resin solution for a pressure-sensitive adhesive layer. Then, the peeled polyester film having a thickness of 38 μm was coated so that the thickness after drying would be 10 μm, and dried at 80 ° C. for 5 minutes. After that, 100 parts by weight of polypropylene and polyether / polyolefin block polymer Perestat 3 which is a polymer type antistatic agent
A thickness of 90 μm created by kneading 15 parts by weight of 00 (manufactured by Sanyo Kasei Kogyo) with a twin-screw kneader and then extruding with an extruder.
The above sheet was laminated to produce an adhesive sheet for semiconductor processing. The following evaluations were carried out after peeling the release-treated polyester film. After the obtained adhesive sheet for semiconductor processing was matured at room temperature for 7 days or more, the decay time at the time of electrification was measured, and the sheet was actually used to assemble a package and to evaluate the presence or absence of package breakage. The results are shown in Table 1.

Comparative Example 1 A sample was prepared and evaluated in the same manner as in Example 1 except that the polyether / polyolefin polymer was changed to 0.5 part by weight. [Comparative Example 2] A sample was prepared and evaluated in the same manner as in Example 1 except that the amount of the polyether / polyolefin polymer was changed to 100 parts by weight.

[0027]

[Table 1]

The following evaluation methods were used to evaluate the examples and comparative examples. -Measurement of decay time STAT manufactured by electo-tech system
Using IC DECAY METER, 5kV on the sheet
Evaluation was carried out by performing the charging treatment of No. 1 and measuring the time for the charging to decay to 0V.

[0029]

The semiconductor processing sheet of the present invention is characterized in that the film substrate is a resin film in which 1 to 80 parts by weight of a polymer antistatic agent is added to 100 parts by weight of polypropylene, It is possible to prevent the occurrence of electrification during the semiconductor manufacturing process, and to prevent the destruction of semiconductor devices and the deterioration of products due to the electrification.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/301 C08L 101: 00 // (C08L 23/12 H01L 21/78 M 101: 00) F term ( reference) 4F006 AA12 AA56 AB24 AB64 BA01 CA08 EA03 4F071 AA20 AE16 AF38 AH12 BC01 4J002 AA072 BB121 CH052 CL002 FD102 GF00 GJ01 GQ00 4J004 AA01 AA07 AA09 AA10 AB01 AB06 CA03 CA04 CC02 CC03 EA06 FA04 FA05 FA08 4J040 BA172 BA202 DB022 DF011 DF041 DF051 DK012 DN032 DN071 EB032 EF221 EL051 FA08 HB19 HC18 HD01 JA09 JB09 KA13 NA20 PA23

Claims (3)

[Claims] 1. To 100 parts by weight of polypropylene,
A pressure-sensitive adhesive comprising a base polymer, a radiation-polymerizable compound, and a radiation-polymerizable polymerization initiator is applied on the surface of a film substrate formed by adding 1 to 80 parts by weight of a polymer type antistatic agent,
A pressure-sensitive adhesive sheet for semiconductor substrate processing, comprising a pressure-sensitive adhesive layer. 2. A polymer type antistatic agent 1 to 100 parts by weight of a resin composition containing polypropylene as a main component.
For processing a semiconductor substrate, which comprises forming a pressure-sensitive adhesive layer by applying a pressure-sensitive adhesive comprising a base polymer, a radiation-polymerizable compound and a radiation-polymerizable polymerization initiator on the surface of a film substrate formed by adding 80 parts by weight. Adhesive sheet. 3. With respect to 100 parts by weight of polypropylene,
From a base polymer, a radiation-polymerizable compound, and a radiation-polymerizable polymerization initiator, on the surface of a multilayer film substrate composed of a film obtained by adding 1 to 80 parts by weight of a polymeric antistatic agent and another resin film. A pressure-sensitive adhesive sheet for processing a semiconductor substrate, which is obtained by applying a pressure-sensitive adhesive to form a pressure-sensitive adhesive layer.