CN115895136B - Chip tray plastic sucking part and preparation method thereof - Google Patents
Chip tray plastic sucking part and preparation method thereof Download PDFInfo
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- CN115895136B CN115895136B CN202211467272.3A CN202211467272A CN115895136B CN 115895136 B CN115895136 B CN 115895136B CN 202211467272 A CN202211467272 A CN 202211467272A CN 115895136 B CN115895136 B CN 115895136B
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Abstract
The application relates to the field of plastic suction products, and particularly discloses a chip tray suction piece and a preparation method thereof. The chip tray plastic sucking piece comprises the following raw materials in parts by weight: 40-70 parts of polystyrene; 6-8 parts of a toughening agent; 0.1-0.5 part of antistatic agent; 5-8 parts of filler; 6-10 parts of compatilizer; 0.5-1 part of dispersing agent; 5-7 parts of pigment master batch; 10-20 parts of ultra-high molecular weight polyethylene; 4-9 parts of modified glass beads; the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand; the modified glass beads are prepared by the following steps: mixing a silane coupling agent and an acetone solution according to the mass ratio of (6-8) to obtain a modified solution, dispersing glass beads in the modified solution, stirring and mixing uniformly, evaporating acetone for 30-50min, and drying in an oven to obtain the modified glass beads. The chip tray plastic sucking piece provided by the application has excellent wear resistance and heat resistance, and further, the chip is not easy to damage in the transportation process in the application process.
Description
Technical Field
The application relates to the field of plastic suction products, in particular to a chip tray suction piece and a preparation method thereof.
Background
After the chip is produced, the manufactured chip is required to be transported to a proper position, a chip tray is adopted in order to avoid the damage of the chip caused by the collision of the adjacent chips due to external force in the transportation process, and the chip tray is used for containing some electronic products or spare parts, and is convenient for transportation, and a tray package adopting a plastic sucking process is adopted.
The chip tray is mostly obtained through a vacuum plastic sucking process. Firstly, mixing plastic particles and functional master batches, carrying out melt extrusion, casting into thick sheets to obtain plastic sheets, heating and softening the flat plastic sheets, deforming the plastic sheets by means of air pressure difference and mechanical pressure on two sides of the sheets, applying the plastic sheets on a specific die contour surface, cooling and shaping, and trimming to obtain the plastic sheets.
In view of the above related art, the inventor believes that the existing chip tray only considers the molding effect in the production and preparation process, but when the weight of the chip is large, vibration impact in the long-time transportation process causes continuous shaking and friction of the chip in the tray, and heat generated by friction between the tray and the tray is also diffused to the chip due to friction, which is easy to cause damage to the chip structure and performance, so that a proposal is needed to solve the above technical problem.
Disclosure of Invention
The application provides a chip tray plastic sucking piece and a preparation method thereof, in order to improve the friction resistance of a chip tray and ensure that chips are not easy to damage in the transportation process.
In a first aspect, the present application provides a chip tray plastic uptake member, which adopts the following technical scheme:
a chip tray plastic sucking piece comprises the following raw materials in parts by weight:
40-70 parts of polystyrene;
6-8 parts of a toughening agent;
0.1-0.5 part of antistatic agent;
5-8 parts of filler;
6-10 parts of compatilizer;
0.5-1 part of dispersing agent;
5-7 parts of pigment master batch;
10-20 parts of ultra-high molecular weight polyethylene;
4-9 parts of modified glass beads;
the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand;
the modified glass beads are prepared by the following steps:
the silane coupling agent and the acetone solution are mixed according to the mass ratio of 1: (6-8) mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 20-30min at 60-70 ℃, and drying in an oven to obtain the modified glass beads.
By adopting the technical scheme, the polystyrene is thermoplastic noncrystalline resin, is polymerized by styrene monomer, has good fluidity, good processing performance and excellent dimensional stability, and is a good mixed matrix in the subsequent melting process as the main raw material of the chip tray plastic sucking piece. The ultra-high molecular weight polyethylene has ultra-strong wear resistance and self-lubricating property, high strength, stable chemical property and strong ageing resistance, and can complement with polystyrene in performance, and the formed blending system can show excellent physical crosslinking effect. On the basis, the modified glass beads can be uniformly dispersed in the blending system and have good acting force, the interaction among molecules is enhanced, the modified glass beads also act as physical crosslinking points in the blending system to form an entanglement network of organic-inorganic materials, when heated and rubbed, the movement of a high polymer chain segment can be limited, excellent wear resistance and heat resistance are shown, and further the obtained chip tray plastic sucking piece can ensure that the chip is not damaged easily in the transportation process in the application process.
Preferably, the filler is any one or a mixture of a plurality of talcum powder, glass fiber, carbon nano tube, nano aluminum oxide and potassium titanate whisker.
Through adopting above-mentioned technical scheme, the use of above-mentioned filler can be even dispersion between each component raw materials to form firm adhesion and combine with the polymer macromolecule, can exert excellent stress transfer effect and resist the ability that abrasive particle worn out, and can also demonstrate excellent heat resistance, can make the chip tray plastic uptake piece in long-time transportation and when receiving vibration impact, can guarantee that the chip of its holding is difficult for taking place the damage.
Preferably, the filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker in the mass ratio of 1 (0.3-0.7) to 1.1-1.6.
By adopting the technical scheme, talcum powder has a unique microscopic sheet structure, nano aluminum oxide has excellent filling property, potassium titanate whisker has excellent stress bearing effect, and talcum powder, nano aluminum oxide and potassium titanate whisker are mixed according to a specific proportion for use, so that the talcum powder, the nano aluminum oxide and the potassium titanate whisker not only show excellent dispersibility in a mixed system, but also can be matched with each other to form a multistage cross-shaped anti-wear and heat-resistant system, further, the friction between chip tray plastic sucking pieces and chips can be effectively reduced, and the generation and concentration of a large amount of friction heat can be effectively avoided, so that an effective protection effect on chips is achieved.
Preferably, the filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.5:1.3.
By adopting the technical scheme, the talcum powder, the nano aluminum oxide and the potassium titanate whisker which are matched in proportion can exert the best effect in the application process, so that the obtained chip tray plastic suction piece has the most excellent protection effect on the chip when being subjected to vibration impact in the long-time transportation process.
Preferably, 3-5 parts by weight of diatomite is added into the raw materials of the chip tray plastic sucking piece.
Through adopting above-mentioned technical scheme, diatomaceous earth has stronger adsorptivity, and can act as the effect at the carrier, and it can be in the same place with the stable combination of modified glass microballon in the application process to in the blending system that ultra-high molecular weight polyethylene and polystyrene formed, act as more stable physical crosslinking point, the organic-inorganic material entanglement network that forms is more excellent stable, and then can be greatly high chip tray plastic uptake's overall quality, and guarantee that the chip is difficult for appearing the effect of damage also more excellent in the transportation.
Preferably, the diatomite is modified, and comprises the following steps:
s1, roasting diatomite at 400-500 ℃ for 1.8-2.4 hours, cooling, soaking in a sulfuric acid solution with the mass fraction of 70% -80% at 65-75 ℃ for 3-4 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine with the mass ratio of 1 (2-5) to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking at 70-80 ℃ for 1.5-2.5h, and then taking out and drying to constant weight to obtain the diatomite after modification treatment.
Through adopting above-mentioned technical scheme, the diatomaceous earth after the modification treatment can effectively get rid of most impurity and the active material that contains wherein, specific surface area is showing and is increasing, and is more excellent with the bonding effect between the modified glass microballon, and diatomaceous earth self thermal stability also obtains improving, can bring great promotion to organic-inorganic material entanglement network, and then makes the chip tray plastic uptake piece that obtains in long-time transportation and when receiving vibration impact, improves the protection ability to the chip greatly.
Preferably, the mass ratio of the diatomite after modification treatment to the ultra-high molecular weight polyethylene to the modified glass beads is 15:6:4.
By adopting the technical scheme, the diatomite subjected to the modification treatment in the proportion and the ultra-high molecular weight polyethylene and the modified glass beads can form the best matching effect in the application process, so that the chip tray plastic sucking piece with excellent quality is obtained.
Preferably, the toughening agent is any one of a styrene-butadiene thermoplastic elastomer, an acrylonitrile-butadiene-styrene copolymer and an ethylene-vinyl acetate copolymer.
Through adopting above-mentioned technical scheme, above-mentioned kind of toughener has stable excellent conjunctivity with other each component raw materials, can improve the impact strength of chip tray plastic uptake piece, under the condition that does not receive the destruction, has better absorption ability to external mechanical energy, guarantees that the chip tray plastic uptake piece that obtains is in long-time transportation and when receiving vibration impact, is difficult for taking place to damage.
Preferably, the dispersing agent is any one or more of stearamide, microcrystalline paraffin, magnesium stearate and calcium stearate.
Through adopting above-mentioned technical scheme, above-mentioned kind of dispersing agent, in the application process, can improve the miscibility of each component raw materials in the course of working, avoid settling and the agglomeration of solid particle, and then obtain the excellent stable chip tray plastic uptake piece of quality.
In a second aspect, the application provides a method for preparing a chip tray plastic sucking part, which adopts the following technical scheme:
the preparation method of the chip tray plastic sucking piece comprises the following steps:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batch, ultra-high molecular weight polyethylene and modified glass beads according to a proportion;
(2) Uniformly mixing the raw materials in the step (1), and then putting the mixture into a double-screw extruder for extrusion molding to obtain a plastic-absorbing sheet;
(3) And (3) after the plastic sucking sheet is softened by hot melting, placing the plastic sucking sheet right above a die, and obtaining the chip tray plastic sucking piece after edge pressing, vacuum plastic sucking and cutting by plastic sucking forming equipment.
By adopting the technical scheme, the chip tray plastic sucking piece has fewer preparation steps and simple process, and is convenient for mass production. Meanwhile, the raw materials are subjected to step-by-step operations such as mixing, melt extrusion, plastic sucking molding and the like, the quality control is easy to carry out in the process, and the quality of the chip tray plastic sucking piece is guaranteed.
In summary, the application has the following beneficial effects:
1. the blending system formed by the ultra-high molecular weight polyethylene and the polystyrene is utilized, and the modified glass beads act as physical crosslinking points in the blending system to form an entanglement network of the organic-inorganic material, so that the movement of a high molecular chain segment can be limited when the chip tray is heated and rubbed, excellent wear resistance and heat resistance are shown, and further, the chip tray plastic uptake piece can be prevented from being damaged easily in the transportation process of the chip in the application process;
2. the talcum powder, the nano aluminum oxide and the potassium titanate whisker are mixed according to a specific proportion, so that a multistage cross-type anti-abrasion and heat-resistant system can be formed, further friction between chip tray plastic sucking parts and friction between the chip tray plastic sucking parts and chips can be effectively reduced, generation and concentration of a large amount of friction heat can be effectively avoided, and further an effective protection effect on the chips is achieved;
3. the diatomite can be stably combined with the modified glass beads and serves as a more stable physical crosslinking point in a blending system formed by the ultra-high molecular weight polyethylene and the polystyrene, so that the formed organic-inorganic material entanglement network is more excellent and stable; and the application effect of the modified diatomite is more excellent, so that the protection capability of the chip tray plastic sucking piece on the chip is greatly improved when the chip tray plastic sucking piece is subjected to vibration impact in the long-time transportation process.
Detailed Description
The present application will be described in further detail with reference to examples.
The raw materials used in the examples of the present application are all commercially available except for the specific descriptions:
glass beads were purchased from hollow glass beads HS60, new materials limited of holly hollow beads, zheng;
diatomaceous earth was purchased from Qilu diatomaceous earth Inc. of Shijia, model TUFA-020.
Examples of preparation of starting materials and/or intermediates
Preparation example 1
The modified glass beads are prepared by the following steps:
the silane coupling agent and the acetone solution are mixed according to the mass ratio of 1:7, mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 25min at 65 ℃, and drying in an oven to obtain modified glass beads; wherein the silane coupling agent is KH-550 silane coupling agent.
Preparation example 2
The modified glass beads differ from the preparation example 1 in that: the mass ratio of the silane coupling agent to the acetone solution is 1:6.
preparation example 3
The modified glass beads differ from the preparation example 1 in that: the mass ratio of the silane coupling agent to the acetone solution is 1:8.
preparation example 4
The modified glass beads differ from the preparation example 1 in that: in operation, the mixture was stirred and mixed well and continued stirring at 70℃for 20min.
Preparation example 5
The modified glass beads differ from the preparation example 1 in that: in operation, the mixture was stirred and mixed well and stirred continuously at 60℃for 30min.
Preparation example 6
The diatomite is modified, and comprises the following steps:
s1, roasting diatomite at 450 ℃ for 2.1 hours, cooling, soaking in a sulfuric acid solution with the mass fraction of 75% at 70 ℃ for 3.5 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine in a mass ratio of 1:3.5 to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking for 2 hours at 75 ℃, and then taking out and drying to constant weight to obtain modified diatomite; wherein stearic acid is selected from stearic acid 1801.
Preparation example 7
The diatomite is modified, and comprises the following steps:
s1, roasting diatomite at 400 ℃ for 2.4 hours, cooling, soaking in a sulfuric acid solution with the mass fraction of 70% at 65 ℃ for 4 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine in a mass ratio of 1:2 to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking for 2.5 hours at 70 ℃, and then taking out and drying to constant weight to obtain modified diatomite; wherein stearic acid is selected from stearic acid 1801.
Preparation example 8
The diatomite is modified, and comprises the following steps:
s1, roasting diatomite at 500 ℃ for 1.8 hours, cooling, soaking in 80% sulfuric acid solution at 75 ℃ for 3 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine in a mass ratio of 1:2 to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking for 1.5 hours at 80 ℃, and then taking out and drying to constant weight to obtain modified diatomite; wherein stearic acid is selected from stearic acid 1801.
Examples
Example 1
The chip tray plastic sucking piece is prepared by the following steps of:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batch, ultra-high molecular weight polyethylene and modified glass beads according to a proportion;
(2) Uniformly mixing the raw materials in the step (1), and then putting the mixture into a double-screw extruder for extrusion molding to obtain a plastic-absorbing sheet;
(3) And (3) after the plastic sucking sheet is softened by hot melting, placing the plastic sucking sheet right above a die, and obtaining the chip tray plastic sucking piece after edge pressing, vacuum plastic sucking and cutting by plastic sucking forming equipment.
Note that: the polystyrene in the above step was purchased from general grade polystyrene of GPPS 525, medium petrifaction; antistatic agent was purchased from clahn SAS93; the compatibilizer is available from Axma 8900; the filler is talcum powder; the toughening agent is a styrene-butadiene thermoplastic elastomer, available from priwan MD6700; the dispersing agent is stearamide; the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 300 ten thousand; the modified glass beads were taken from preparation example 1.
Examples 2 to 3
A chip tray blister differing from example 1 in that the components and their respective weights are shown in table 1.
TABLE 1 Components and weights (kg) of the components in examples 1-3
Example 4
A chip tray blister was different from example 1 in that the ultra high molecular weight polyethylene was unbranched linear polyethylene having a molecular weight of 200 tens of thousands.
Example 5
A chip tray blister was different from example 1 in that the ultra high molecular weight polyethylene was an unbranched linear polyethylene having a molecular weight of 400 tens of thousands.
Example 6
A chip tray blister was different from example 1 in that modified glass beads were taken from preparation 2.
Example 7
A chip tray blister was different from example 1 in that modified glass beads were taken from preparation 3.
Example 8
A chip tray blister was different from example 1 in that modified glass beads were taken from preparation 4.
Example 9
A chip tray blister was different from example 1 in that modified glass beads were taken from preparation 5.
Example 10
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.5:1.3.
Example 11
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.5:1.35.
Example 12
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.3:1.1.
Example 13
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.7:1.6.
Example 14
A chip tray plastic uptake part is different from the embodiment 1 in that 4 parts by weight of diatomite is added into the raw material of the step (1).
Example 15
A chip tray plastic uptake part is different from example 14 in that 3 parts by weight of diatomite is added into the raw material of step (1).
Example 16
A chip tray plastic uptake part is different from example 14 in that 5 parts by weight of diatomite is added into the raw material of step (1).
Example 17
A chip tray suction molding was different from example 14 in that the original diatomaceous earth was replaced with diatomaceous earth after the modification treatment in preparation example 6 in terms of the same mass.
Example 18
A chip tray suction molding was different from example 14 in that the original diatomaceous earth was replaced with diatomaceous earth after the modification treatment in preparation example 7 in terms of the same mass.
Example 19
A chip tray suction molding was different from example 14 in that the original diatomaceous earth was replaced with diatomaceous earth after the modification treatment in preparation example 8 in terms of the same mass.
Example 20
A chip tray plastic uptake piece is different from example 17 in that 15 parts of ultra-high molecular weight polyethylene is used, and the mass ratio of diatomite after modification treatment to ultra-high molecular weight polyethylene and modified glass beads is 15:6:4.
Example 21
A chip tray plastic sucking piece is different from the chip tray plastic sucking piece in that a filling agent consists of talcum powder and nano alumina according to the mass ratio of 1:0.5.
Example 22
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of talcum powder and potassium titanate whisker according to the mass ratio of 1:1.3.
Example 23
A chip tray plastic sucking piece is different from the embodiment 1 in that a filler consists of nano aluminum oxide and potassium titanate whisker according to the mass ratio of 0.5:1.3.
Example 24
A chip tray blister was different from example 1 in that the toughening agent was an acrylonitrile-butadiene-styrene copolymer, available from churian et PA-757.
Example 25
A chip tray plastic sucking piece is different from the chip tray plastic sucking piece in that a dispersing agent is composed of magnesium stearate and calcium stearate according to a mass ratio of 1:1.
Comparative example
Comparative example 1
A chip tray blister was different from example 1 in that the ultra high molecular weight polyethylene was an unbranched linear polyethylene having a molecular weight of 180 tens of thousands.
Comparative example 2
A chip tray blister was different from example 1 in that the ultra high molecular weight polyethylene was an unbranched linear polyethylene of molecular weight 420 tens of thousands.
Comparative example 3
The chip tray plastic uptake piece is different from the embodiment 1 in that the quality of the modified glass beads in the preparation example is replaced by glass beads before modification.
Comparative example 4
A chip tray blister was different from example 1 in that the raw material did not contain ultra-high molecular weight polyethylene.
Comparative example 5
The chip tray plastic part is different from the embodiment 1 in that the raw material does not contain modified glass beads.
Comparative example 6
A chip tray plastic sucking piece is different from the embodiment 1 in that the raw materials do not contain modified glass beads and ultra-high molecular weight polyethylene.
Comparative example 7
A chip tray blister was prepared in accordance with example 14, except that the raw material contained no ultra-high molecular weight polyethylene.
Comparative example 8
A chip tray blister part, example 14, differs in that the raw material does not contain modified glass microspheres.
Comparative example 9
A chip tray plastic uptake piece, example 14 is different in that the raw materials do not contain modified glass beads and ultra-high molecular weight polyethylene.
Performance test samples: the chip tray suction members obtained in examples 1 to 25 were used as example test samples 1 to 25, and the chip tray suction members obtained in comparative examples 1 to 9 were used as comparative example control samples 1 to 9.
The test method comprises the following steps: RS232 driving transceiver chips with the model number of MAX3232E and the model number of ESE+T are used as test chips, chip tray plastic sucking pieces in test samples 1-25 and control samples 1-9 are used for accommodating the test chips, each tray plastic sucking piece is used for accommodating 10 chips, then 100 chip tray plastic sucking pieces are respectively taken from corresponding test samples 1-25 and control samples 1-9 to complete accommodating the test chips, then stacking is carried out, packaging is carried out by using a paper box, finally, vibration tests are respectively carried out, the vibration frequency during testing is 120Hz, the test chips are respectively detected along the three axial directions (x, y and z) for 90min, and the chip damage rate is calculated after stopping.
TABLE 2 test results for test samples 1-25 and control samples 1-9
By combining examples 1-9 and comparative examples 4-6 and combining Table 2, it can be seen that the use of ultra-high molecular weight polyethylene and modified glass beads can achieve good compound synergy in chip tray plastic uptake using polystyrene as a main raw material, and can demonstrate that the chip has a lower damage rate when being subjected to vibration impact in the transportation process. And the chip damage rate can be obviously improved by independently applying one of the ultra-high molecular weight polyethylene and the modified glass beads. As can be seen by combining comparative examples 1-2, the ultra-high molecular weight polyethylene is unbranched linear polyethylene with a molecular weight of 200-400 ten thousand, and has the best matching effect with the modified glass beads, and the molecular weight lower or higher than the above range can lead to the increase of the damage rate. It can be seen from comparative example 3 that the glass beads before being modified cannot be used to achieve a good blending effect with ultra-high molecular weight polyethylene.
It can be seen from the combination of examples 10-13 and examples 21-23 and the combination of table 2 that the use of talc powder, nano alumina and potassium titanate whisker in a specific ratio can effectively reduce the friction between the chip tray plastic parts and the chips, and can effectively avoid the generation and concentration of a large amount of frictional heat, thereby obviously reducing the damage rate of the chips. Any two of talcum powder, nano aluminum oxide and potassium titanate whisker are combined, so that the effect of compounding the talcum powder, the nano aluminum oxide and the potassium titanate whisker is far less than excellent. Wherein, when the mass ratio of talcum powder, nano aluminum oxide and potassium titanate whisker is 1:0.5:1.3, the effect of the whole is most excellent.
It can be seen from the combination of examples 1 and examples 14-16 and Table 2 that the use of diatomaceous earth can greatly reduce the rate of damage to the chip when subjected to vibration impact in the chip tray blister. And by combining the embodiments 17-19, the quality of the chip tray plastic sucking piece can be further improved by modifying diatomite, and the chip damage rate in the test process is greatly reduced. And in combination with the embodiment 20, when the mass ratio of the diatomite after the modification treatment to the ultra-high molecular weight polyethylene to the modified glass beads is 15:6:4, the performance of the chip tray plastic sucking piece is most excellent. Finally, in combination with comparative examples 7-9, it can be seen that the effect of selecting one of the ultra-high molecular weight polyethylene and the modified glass beads to be matched with the modified diatomite is effective and is far less than the excellent effect of compounding the ultra-high molecular weight polyethylene, the modified glass beads and the modified diatomite.
The present embodiment is only for explanation of the present application and is not to be construed as limiting the present application, and modifications to the present embodiment, which may not creatively contribute to the present application as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present application.
Claims (9)
1. The chip tray plastic uptake piece is characterized by comprising the following raw materials in parts by weight:
40-70 parts of polystyrene;
6-8 parts of a toughening agent;
0.1-0.5 part of antistatic agent;
5-8 parts of filler;
6-10 parts of compatilizer;
0.5-1 part of dispersing agent;
5-7 parts of pigment master batch;
10-20 parts of ultra-high molecular weight polyethylene;
4-9 parts of modified glass beads;
the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand;
the modified glass beads are prepared by the following steps:
the silane coupling agent and the acetone solution are mixed according to the mass ratio of 1: (6-8) mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 20-30min at 60-70 ℃, and drying in an oven to obtain the modified glass beads.
2. The chip tray suction molding of claim 1, wherein: the filler is any one or a mixture of a plurality of talcum powder, glass fiber, carbon nano tube, nano aluminum oxide and potassium titanate whisker.
3. The chip tray suction molding of claim 2, wherein: the filler consists of talcum powder, nano alumina and potassium titanate whisker in the mass ratio of 1 (0.3-0.7) to 1.1-1.6.
4. A chip tray blister according to claim 3, wherein: the filler consists of talcum powder, nano aluminum oxide and potassium titanate whisker according to the mass ratio of 1:0.5:1.3.
5. The chip tray suction molding of claim 1, wherein: the raw materials of the chip tray plastic sucking piece are further added with 3-5 parts by weight of diatomite.
6. The chip tray suction molding of claim 5, wherein: the diatomite is modified, and comprises the following steps:
s1, roasting diatomite at 400-500 ℃ for 1.8-2.4 hours, cooling, soaking in a sulfuric acid solution with the mass fraction of 70% -80% at 65-75 ℃ for 3-4 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine with the mass ratio of 1 (2-5) to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking at 70-80 ℃ for 1.5-2.5h, and then taking out and drying to constant weight to obtain the diatomite after modification treatment.
7. The chip tray suction molding of claim 1, wherein: the toughening agent is any one of a styrene-butadiene thermoplastic elastomer, an acrylonitrile-butadiene-styrene copolymer and an ethylene-vinyl acetate copolymer.
8. The chip tray suction molding of claim 1, wherein: the dispersing agent is any one or a mixture of more of stearamide, microcrystalline paraffin, magnesium stearate and calcium stearate.
9. The method for manufacturing the chip tray plastic sucking member as claimed in claim 1, comprising the steps of:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batch, ultra-high molecular weight polyethylene and modified glass beads according to a proportion;
(2) Uniformly mixing the raw materials in the step (1), and then putting the mixture into a double-screw extruder for extrusion molding to obtain a plastic-absorbing sheet;
(3) And (3) after the plastic sucking sheet is softened by hot melting, placing the plastic sucking sheet right above a die, and obtaining the chip tray plastic sucking piece after edge pressing, vacuum plastic sucking and cutting by plastic sucking forming equipment.
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| CN112626634A (en) * | 2020-12-14 | 2021-04-09 | 九江中科鑫星新材料有限公司 | Injection molding grade antibacterial ultra-high molecular weight polyethylene fiber and preparation method thereof |
| CN113563659A (en) * | 2021-08-24 | 2021-10-29 | 胜利油田胜机石油装备有限公司 | Polyethylene composite material and application thereof in preparation of high-temperature-resistant lining oil pipe |
| CN115160703A (en) * | 2022-08-01 | 2022-10-11 | 东藤（上海）新材料有限公司 | Antistatic high-strength chip tray and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060252873A1 (en) * | 2005-05-05 | 2006-11-09 | General Electric Company | IC trays and compositions thereof |
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| CN101875824A (en) * | 2005-03-29 | 2010-11-03 | 大科能树脂有限公司 | Anti-static resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film and their preparation method |
| CN106977791A (en) * | 2017-04-21 | 2017-07-25 | 河南省金航工程塑料有限公司 | A kind of ultra-high molecular weight polyethylene emulates slab |
| CN112626634A (en) * | 2020-12-14 | 2021-04-09 | 九江中科鑫星新材料有限公司 | Injection molding grade antibacterial ultra-high molecular weight polyethylene fiber and preparation method thereof |
| CN113563659A (en) * | 2021-08-24 | 2021-10-29 | 胜利油田胜机石油装备有限公司 | Polyethylene composite material and application thereof in preparation of high-temperature-resistant lining oil pipe |
| CN115160703A (en) * | 2022-08-01 | 2022-10-11 | 东藤（上海）新材料有限公司 | Antistatic high-strength chip tray and preparation method thereof |
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