CN115895136A - Chip tray plastic sucking part and preparation method thereof - Google Patents
Chip tray plastic sucking part and preparation method thereof Download PDFInfo
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- CN115895136A CN115895136A CN202211467272.3A CN202211467272A CN115895136A CN 115895136 A CN115895136 A CN 115895136A CN 202211467272 A CN202211467272 A CN 202211467272A CN 115895136 A CN115895136 A CN 115895136A
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Abstract
The application relates to the field of plastic suction products, and particularly discloses a chip tray plastic suction piece and a preparation method thereof. The chip tray plastic sucking part comprises the following raw materials in parts by weight: 40-70 parts of polystyrene; 6-8 parts of a toughening agent; 0.1-0.5 part of antistatic agent; 5-8 parts of a filling agent; 6-10 parts of a compatilizer; 0.5-1 part of a dispersant; 5-7 parts of pigment master batch; 10-20 parts of ultrahigh molecular weight polyethylene; 4-9 parts of modified glass beads; the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand; the modified glass bead is prepared by the following steps: mixing a silane coupling agent and an acetone solution according to a mass ratio of 1 (6-8) to obtain a modified solution, dispersing glass beads in the modified solution, stirring and mixing uniformly, evaporating acetone for 30-50min, and drying in an oven to obtain the modified glass beads. The chip tray plastic sucking part shows excellent wearability and heat resistance, and then can guarantee that the chip is difficult for appearing the damage in the transportation in the application.
Description
Technical Field
The application relates to the field of plastic suction products, in particular to a chip tray plastic suction piece and a preparation method thereof.
Background
After the production of chip is accomplished, need transport the chip of making to suitable position, for avoiding adjacent chip to receive external force to bump and cause the damage of chip in the transportation, just adopted the chip tray, and the chip tray is used for holding some electronic product or accessories, the tray packing of an adoption blister technology processing procedure of convenient transportation.
The chip tray is mostly obtained by a vacuum forming process. Firstly, uniformly mixing plastic particles and functional master batches, then carrying out melt extrusion, casting into a thick sheet to obtain a plastic sheet, heating and softening the flat plastic sheet, deforming the plastic sheet by virtue of the air pressure difference and the mechanical pressure of two surfaces of the sheet, then applying the deformed plastic sheet on a specific mold profile surface, cooling and shaping, and trimming and finishing to obtain the plastic sheet.
In view of the above-mentioned related technologies, the inventor believes that only the molding effect is considered in the manufacturing process of the conventional chip tray, but when the weight of the chip is heavy, the chip is continuously shaken and rubbed in the tray due to the vibration impact during long-time transportation, and heat generated by the friction between the tray and the tray is diffused to the chip due to the friction, which easily causes damage to the structure and performance of the chip.
Disclosure of Invention
In order to improve the friction resistance of the chip tray and take low heat conductivity into consideration, and to ensure that the chip is not easy to damage in the transportation process, the application provides a chip tray plastic sucking part and a preparation method thereof.
In a first aspect, the present application provides a chip tray blister, which adopts the following technical scheme:
a chip tray plastic sucking part comprises the following raw materials in parts by weight:
40-70 parts of polystyrene;
6-8 parts of a toughening agent;
0.1-0.5 part of antistatic agent;
5-8 parts of a filling agent;
6-10 parts of a compatilizer;
0.5-1 part of a dispersant;
5-7 parts of pigment master batch;
10-20 parts of ultrahigh molecular weight polyethylene;
4-9 parts of modified glass beads;
the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand;
the modified glass bead is prepared by the following steps:
mixing a silane coupling agent and an acetone solution according to a mass ratio of 1: (6-8) mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 20-30min at 60-70 ℃, and drying in an oven to obtain the modified glass beads.
By adopting the technical scheme, the polystyrene is thermoplastic noncrystalline resin, is polymerized by styrene monomers, has good fluidity, good processing performance and excellent dimensional stability, is used as a main raw material of the chip tray plastic sucking part, and is a good mixed matrix in the subsequent melting process. The ultra-high molecular weight polyethylene has ultra-strong wear resistance and self-lubricating property, higher strength, stable chemical property and strong anti-aging performance, and can complement each other in performance with polystyrene, and a formed blending system can show excellent physical crosslinking effect. On the basis, the modified glass beads can be uniformly dispersed in the blending system and have better acting force with each other, the interaction between molecules is enhanced, and the modified glass beads also serve as physical cross-linking points in the blending system to form an entanglement network of organic-inorganic materials, can limit the movement of a high-molecular chain segment when being heated and rubbed, show excellent wear resistance and heat resistance, and further ensure that the chip is not easy to damage in the transportation process of the obtained chip tray plastic sucking piece in the application process.
Preferably, the filler is any one or a mixture of more of talcum powder, glass fiber, carbon nano tube, nano alumina and potassium titanate whisker.
Through adopting above-mentioned technical scheme, the use of above-mentioned filler, dispersion that can be even is between each component raw materials to and form firm adhesion bonding between the polymer macromolecule, can exert excellent stress transmission effect and resist the ability of grit wearing and tearing, and can also demonstrate excellent heat resistance, can make chip tray plastic uptake spare in long-time transportation and when receiving the vibration impact, can guarantee that the difficult emergence of chip that its held is damaged.
Preferably, the filler consists of talcum powder, nano-alumina and potassium titanate whisker according to the mass ratio of 1 (0.3-0.7) to (1.1-1.6).
By adopting the technical scheme, the talcum powder has a unique microscopic flaky structure, the nano aluminum oxide has excellent filling property, the potassium titanate whisker has an excellent stress bearing effect, and the talcum powder, the nano aluminum oxide and the potassium titanate whisker are mixed according to a specific proportion for use, so that not only are excellent dispersibility shown in a mixed system, but also the nano aluminum oxide and the potassium titanate whisker can be matched with each other, a multistage cross type abrasion-proof and heat-resistant system is formed, further, the friction between chip tray plastic parts and the friction between the chip tray plastic parts and chips can be effectively reduced, the generation and concentration of a large amount of friction heat can be effectively avoided, and further, the chip can be effectively protected.
Preferably, the filler consists of talcum powder, nano alumina and potassium titanate whisker in a mass ratio of 1.
By adopting the technical scheme, the talcum powder, the nano-alumina and the potassium titanate whisker which are matched in proportion can exert the best effect in the application process, so that the chip tray plastic sucking part has the most excellent protection effect on the chip when being subjected to vibration impact in the long-time transportation process.
Preferably, 3-5 parts by weight of diatomite is added into the raw materials of the chip tray plastic sucking piece.
By adopting the technical scheme, the diatomite has stronger adsorbability and can serve as a carrier, the diatomite can be stably combined with the modified glass beads in the application process, and serves as a more stable physical cross-linking point in a blending system formed by the ultra-high molecular weight polyethylene and the polystyrene, the formed organic-inorganic material entanglement network is more excellent and stable, the overall quality of the chip tray plastic-absorbing part can be greatly improved, and the effect that the chip is not easy to damage in the transportation process is also more excellent.
Preferably, the diatomite is subjected to modification treatment and comprises the following steps:
s1, roasting diatomite at 400-500 ℃ for 1.8-2.4h, cooling, soaking in 70-80% sulfuric acid solution at 65-75 ℃ for 3-4h, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine according to the mass ratio of 1 (2-5) to obtain a mixed solution, dispersing the pretreated diatomite into the mixed solution, stirring and soaking at 70-80 ℃ for 1.5-2.5h, taking out and drying to constant weight to obtain the modified diatomite.
By adopting the technical scheme, most impurities and active substances contained in the modified diatomite can be effectively removed, the specific surface area is remarkably increased, the bonding effect with the modified glass microspheres is more excellent, the thermal stability of the diatomite is also improved, the organic-inorganic material entanglement network can be greatly improved, and the protection capability of the obtained chip tray plastic sucking piece on the chip is greatly improved when the chip tray plastic sucking piece is in a long-time transportation process and is subjected to vibration impact.
Preferably, the mass ratio of the modified diatomite to the ultrahigh molecular weight polyethylene to the modified glass beads is 15.
By adopting the technical scheme, the diatomite, the ultra-high molecular weight polyethylene and the modified glass beads after modification treatment in the proportion can form the best matching effect in the application process, and then the chip tray plastic sucking piece with excellent quality is obtained.
Preferably, the toughening agent is any one of a styrene-butadiene thermoplastic elastomer, an acrylonitrile-butadiene-styrene copolymer and an ethylene-vinyl acetate copolymer.
By adopting the technical scheme, the toughening agent of the kind has stable and excellent bonding property with other component raw materials, the impact strength of the chip tray plastic suction piece can be improved, the external mechanical energy has better absorption capacity under the condition of not being damaged, and the obtained chip tray plastic suction piece is not easy to damage in the long-time transportation process and when being subjected to vibration and impact.
Preferably, the dispersing agent is any one or a mixture of more of stearamide, microcrystalline paraffin, magnesium stearate and calcium stearate.
By adopting the technical scheme, the dispersing agent of the type can improve the mixing uniformity of raw materials of each component in the processing process in the application process, and avoid the sedimentation and agglomeration of solid particles, thereby obtaining the chip tray plastic sucking part with excellent and stable quality.
In a second aspect, the application provides a method for preparing a chip tray blister, which adopts the following technical scheme:
a preparation method of a chip tray plastic sucking part comprises the following steps:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batches, ultra-high molecular weight polyethylene and modified glass beads according to a ratio;
(2) Uniformly mixing the raw materials in the step (1), and then putting the mixture into a double-screw extruder for extrusion molding to obtain a plastic uptake sheet;
(3) And (3) softening the plastic sheet by hot melting, placing the plastic sheet right above the mold, and performing blank pressing, vacuum plastic sucking and cutting by plastic sucking molding equipment to obtain the chip tray plastic sucking part.
By adopting the technical scheme, the preparation steps of the chip tray plastic sucking part are fewer, the process is simple, and the large-scale production is facilitated. Meanwhile, the raw materials are subjected to step-by-step operation such as mixing, melt extrusion, plastic suction molding and the like, and the quality control is easily performed in the process, so that the quality of the chip tray plastic suction piece is ensured.
In summary, the present application has the following beneficial effects:
1. the blending system formed by the ultra-high molecular weight polyethylene and the polystyrene is utilized, the modified glass beads are used as physical cross-linking points in the blending system to form an entanglement network of organic-inorganic materials, the movement of a high molecular chain segment can be limited when the modified glass beads are heated and rubbed, the excellent wear resistance and heat resistance are shown, and the obtained chip tray plastic-absorbing part can ensure that the chip is not easy to damage in the transportation process in the application process;
2. the talcum powder, the nano-alumina and the potassium titanate whisker are mixed and used according to a specific proportion, so that a multistage cross type abrasion-proof and heat-resistant system can be formed, the friction between chip tray plastic parts and the friction between the chip tray plastic parts and a chip can be effectively reduced, the generation and concentration of a large amount of friction heat can be effectively avoided, and the chip can be effectively protected;
3. the diatomite can be stably combined with the modified glass beads, and serves as a more stable physical crosslinking point in a blending system formed by the ultra-high molecular weight polyethylene and the polystyrene, so that the formed organic-inorganic material entanglement network is more excellent and stable; and the modified diatomite has more excellent application effect, so that the chip tray plastic sucking piece has greatly improved chip protection capability in the long-time transportation process and under the vibration impact.
Detailed Description
The present application will be described in further detail with reference to examples.
The raw materials used in the examples of the present application are commercially available, except for the specific description:
the glass beads are purchased from hollow glass beads HS60 of Zhengzhou Shenglaite hollow bead new material company Limited;
diatomaceous earth was purchased from QILE diatomaceous earth, inc. of Shijiazhuang, and was TUFA-020.
Examples of preparation of raw materials and/or intermediates
Preparation example 1
Modified glass beads, which are obtained by the following steps:
mixing a silane coupling agent and an acetone solution according to a mass ratio of 1:7, mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 25min at 65 ℃, and drying in an oven to obtain modified glass beads; wherein the silane coupling agent is KH-550 silane coupling agent.
Preparation example 2
The modified glass beads were different from those of preparation example 1 in that: the mass ratio of the silane coupling agent to the acetone solution is 1:6.
preparation example 3
The modified glass beads were different from those of preparation example 1 in that: the mass ratio of the silane coupling agent to the acetone solution is 1:8.
preparation example 4
The modified glass beads are different from those in preparation example 1 in that: in operation, the mixture was stirred well and kept stirring at 70 ℃ for 20min.
Preparation example 5
The modified glass beads were different from those of preparation example 1 in that: in operation, the mixture was stirred uniformly and stirred continuously at 60 ℃ for 30min.
Preparation example 6
The diatomite is subjected to modification treatment and comprises the following steps:
s1, roasting diatomite at 450 ℃ for 2.1h, cooling, soaking in 75% sulfuric acid solution at 70 ℃ for 3.5h, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine according to a mass ratio of 1; wherein stearic acid is selected as stearic acid 1801.
Preparation example 7
The diatomite is subjected to modification treatment and comprises the following steps:
s1, roasting diatomite at 400 ℃ for 2.4 hours, cooling, soaking in 70% sulfuric acid solution at 65 ℃ for 4 hours, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine according to a mass ratio of 1:2 to obtain a mixed solution, dispersing pretreated diatomite in the mixed solution, stirring and soaking at 70 ℃ for 2.5 hours, taking out and drying to constant weight to obtain modified diatomite; wherein stearic acid is selected from stearic acid 1801.
Preparation example 8
The diatomite is subjected to modification treatment and comprises the following steps:
s1, roasting diatomite at 500 ℃ for 1.8h, cooling, soaking in 80 mass percent sulfuric acid solution at 75 ℃ for 3h, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine according to a mass ratio of 1:2 to obtain a mixed solution, dispersing pretreated diatomite into the mixed solution, stirring and soaking at 80 ℃ for 1.5 hours, taking out and drying to constant weight to obtain modified diatomite; wherein stearic acid is selected as stearic acid 1801.
Examples
Example 1
A chip tray blister, the components and their respective weights are shown in Table 1, and is prepared by the following steps:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batches, ultra-high molecular weight polyethylene and modified glass beads according to a ratio;
(2) Uniformly mixing the raw materials in the step (1), putting the mixture into a double-screw extruder, and performing extrusion molding to obtain a blister sheet;
(3) And (3) softening the plastic sheet by hot melting, placing the plastic sheet right above the mold, and performing blank pressing, vacuum plastic sucking and cutting by plastic sucking molding equipment to obtain the chip tray plastic sucking part.
Note: the polystyrene in the steps is purchased from general-grade polystyrene of GPPS 525 in the medium petrochemistry; antistatic agents are available from clariant SAS93; the compatilizer is purchased from Akema AX8900; the filler is talcum powder; the toughening agent is a styrene-butadiene thermoplastic elastomer, purchased from Povidon MD6700; the dispersant is stearamide; the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 300 ten thousand; modified glass beads were obtained from preparation example 1.
Examples 2 to 3
A chip tray blister was different from example 1 in that the components and their respective weights are shown in table 1.
TABLE 1 Components and weights (kg) thereof in examples 1-3
Example 4
A chip tray blister was different from example 1 in that the ultra-high molecular weight polyethylene was a unbranched linear polyethylene having a molecular weight of 200 ten thousand.
Example 5
A chip tray blister was different from example 1 in that the ultra-high molecular weight polyethylene was a unbranched linear polyethylene having a molecular weight of 400 ten thousand.
Example 6
A chip tray blister different from example 1 in that the modified glass beads were taken from preparation example 2.
Example 7
A chip tray blister different from example 1 in that the modified glass beads were taken from preparation example 3.
Example 8
A chip tray blister different from example 1 in that modified glass beads were taken from preparation example 4.
Example 9
A chip tray blister different from example 1 in that the modified glass beads were taken from preparation example 5.
Example 10
A chip tray plastic sucking part is different from that in the embodiment 1 in that a filling agent consists of talcum powder, nano alumina and potassium titanate whiskers according to a mass ratio of 1.
Example 11
A chip tray plastic sucking part is different from that in the embodiment 1 in that a filling agent consists of talcum powder, nano alumina and potassium titanate whiskers according to a mass ratio of 1.
Example 12
A chip tray plastic sucking part is different from that in the embodiment 1 in that a filling agent consists of talcum powder, nano alumina and potassium titanate whiskers according to a mass ratio of 1.
Example 13
The chip tray plastic sucking part is different from the chip tray plastic sucking part in example 1 in that a filling agent is composed of talcum powder, nano alumina and potassium titanate whisker according to a mass ratio of 1.
Example 14
A chip tray plastic sucking part is different from the chip tray plastic sucking part in the embodiment 1 in that diatomite with the weight part of 4 parts is added into the raw materials in the step (1).
Example 15
A chip tray blister, which is different from example 14 in that 3 parts by weight of diatomite is further added to the raw material in the step (1).
Example 16
A chip tray blister, which is different from example 14 in that 5 parts by weight of diatomite is further added to the raw material in the step (1).
Example 17
A chip tray blister, which is different from example 14 in that the original used diatomaceous earth and the like was replaced with the diatomaceous earth after the modification treatment in preparation example 6.
Example 18
A chip tray blister different from example 14 in that the original diatomaceous earth and the like was replaced with the diatomaceous earth modified in preparation example 7.
Example 19
A chip tray blister different from example 14 in that the original diatomaceous earth and the like was replaced with the diatomaceous earth modified in preparation example 8.
Example 20
A chip tray plastic sucking part, which is different from the embodiment 17 in that 15 parts of ultra-high molecular weight polyethylene are used, and the mass ratio of modified diatomite to the ultra-high molecular weight polyethylene to the modified glass beads is 15.
Example 21
The chip tray plastic sucking part is different from the chip tray plastic sucking part in the embodiment 1 in that a filling agent is composed of talcum powder and nano alumina according to the mass ratio of 1.
Example 22
A chip tray plastic sucking part is different from the chip tray plastic sucking part in example 1 in that a filling agent is composed of talcum powder and potassium titanate whisker according to a mass ratio of 1.3.
Example 23
The chip tray plastic sucking part is different from the chip tray plastic sucking part in the embodiment 1, wherein a filling agent is composed of nano alumina and potassium titanate whisker according to the mass ratio of 0.5.
Example 24
A chip tray blister differs from example 1 in that the toughening agent is acrylonitrile-butadiene-styrene copolymer, available from qimei PA-757.
Example 25
A chip tray blister, which is different from example 1 in that the dispersing agent is magnesium stearate and calcium stearate in a mass ratio of 1:1.
Comparative example
Comparative example 1
A chip tray blister was different from example 1 in that the ultra-high molecular weight polyethylene was a unbranched linear polyethylene having a molecular weight of 180 ten thousand.
Comparative example 2
A chip tray blister differs from example 1 in that the ultra high molecular weight polyethylene is unbranched linear polyethylene having a molecular weight of 420 million.
Comparative example 3
The difference between the chip tray plastic sucking piece and the embodiment 1 is that the qualities of modified glass beads and the like in the preparation example are replaced by the glass beads before modification.
Comparative example 4
A chip tray blister, which is different from example 1 in that the raw materials do not contain ultra-high molecular weight polyethylene.
Comparative example 5
A chip tray blister, which is different from example 1 in that the raw materials do not contain modified glass beads.
Comparative example 6
A chip tray blister, which is different from example 1 in that the raw materials do not contain modified glass beads and ultra-high molecular weight polyethylene.
Comparative example 7
A chip tray blister as in example 14, except that the starting material did not contain ultra high molecular weight polyethylene.
Comparative example 8
A chip tray blister as in example 14, except that the raw materials did not contain modified glass beads.
Comparative example 9
A chip tray blister as in example 14, except that the raw materials did not contain modified glass beads and ultra high molecular weight polyethylene.
Performance testing test samples: the chip tray preforms obtained in examples 1 to 25 were used as example test samples 1 to 25, and the chip tray preforms obtained in comparative examples 1 to 9 were used as comparative example control samples 1 to 9.
The test method comprises the following steps: taking an RS232 driving transceiver chip with the model of MAX3232E series of MAX3232ESE + T as a test chip, respectively using chip tray plastic parts in test samples 1-25 and comparison samples 1-9 to contain the test chip, wherein each tray plastic part contains 10 chips, then respectively taking 100 chip tray plastic parts in the corresponding test samples 1-25 and comparison samples 1-9 to complete containing the test chip, stacking, packaging and packaging by using a paper box, finally respectively carrying out vibration test, wherein the vibration frequency during test is 120Hz, the vibration frequency is respectively 90min along the three axial directions (x, y, z), detecting the test chips contained in the test samples 1-25 and the comparison samples 1-9 after stopping, and calculating the chip damage rate.
TABLE 2 test results of test samples 1-25 and control samples 1-9
It can be seen from the combination of examples 1-9 and comparative examples 4-6 and table 2 that the use of ultra-high molecular weight polyethylene and modified glass beads can achieve good compounding and synergy effects in a chip tray blister using polystyrene as a main raw material, and can prove that the chip has a low damage rate when being subjected to vibration impact in the transportation process. And when one of the ultra-high molecular weight polyethylene and the modified glass beads is independently applied, the damage rate of the chip is obviously improved. In combination with comparative examples 1-2, it can be seen that the ultra-high molecular weight polyethylene is unbranched linear polyethylene with a molecular weight of 200-400 ten thousand, and the best matching effect with the modified glass microspheres is achieved, and the damage rate is increased when the molecular weight is lower or higher than the above range. In combination with comparative example 3, it can be seen that the glass beads before modification can not be well matched with the ultrahigh molecular weight polyethylene.
It can be seen from the combination of examples 10 to 13 and examples 21 to 23 and table 2 that the use of talc powder, nano alumina, and potassium titanate whiskers in a specific ratio in combination can effectively reduce friction between the blister of the chip tray and the chip, and can effectively avoid the generation and concentration of a large amount of frictional heat, thereby significantly reducing the damage rate of the chip. Any two of talcum powder, nano-alumina and potassium titanate whisker are combined, and the excellent compounding effect of the talcum powder, the nano-alumina and the potassium titanate whisker is far less. Wherein, when the mass ratio of the talcum powder to the nano alumina to the potassium titanate whisker is 1.5.
It can be seen from the combination of example 1 and examples 14-16 and table 2 that the use of diatomaceous earth greatly reduces the rate of damage to the chips when subjected to vibrational impact in the chip tray blister. And the modified diatomite can further improve the quality of the chip tray plastic sucking piece and greatly reduce the damage rate of the chip in the test process by combining with the embodiments 17-19. And combining with example 20, it can be seen that when the mass ratio of the modified diatomite to the ultra-high molecular weight polyethylene to the modified glass beads is 15. Finally, the combination of the comparative examples 7-9 shows that the effect of the combination of the modified diatomite and one of the ultra-high molecular weight polyethylene and the modified glass beads is effective and far less than the combination effect of the ultra-high molecular weight polyethylene, the modified glass beads and the modified diatomite.
The specific embodiments are only for explaining the present application and are not limiting to the present application, and those skilled in the art can make modifications to the embodiments without inventive contribution as required after reading the present specification, but all the embodiments are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. The chip tray plastic sucking part is characterized by comprising the following raw materials in parts by weight:
40-70 parts of polystyrene;
6-8 parts of a toughening agent;
0.1-0.5 part of antistatic agent;
5-8 parts of a filling agent;
6-10 parts of a compatilizer;
0.5-1 part of a dispersant;
5-7 parts of pigment master batch;
10-20 parts of ultrahigh molecular weight polyethylene;
4-9 parts of modified glass beads;
the ultra-high molecular weight polyethylene is unbranched linear polyethylene with the molecular weight of 200-400 ten thousand;
the modified glass bead is prepared by the following steps:
mixing a silane coupling agent and an acetone solution according to a mass ratio of 1: (6-8) mixing to obtain a modified solution, dispersing the glass beads in the modified solution, stirring and mixing uniformly, continuously stirring for 20-30min at 60-70 ℃, and drying in an oven to obtain the modified glass beads.
2. The chip tray blister of claim 1, wherein: the filler is any one or a mixture of more of talcum powder, glass fiber, carbon nano tube, nano alumina and potassium titanate whisker.
3. The chip tray blister according to claim 2, wherein: the filler consists of talcum powder, nano alumina and potassium titanate crystal whisker in a mass ratio of 1 (0.3-0.7) to 1.1-1.6.
4. The chip tray blister according to claim 3, wherein: the filler is composed of talcum powder, nano alumina and potassium titanate whisker according to the mass ratio of 1.5.
5. The chip tray blister according to claim 1, wherein: 3-5 parts of diatomite by weight is added into the raw materials of the chip tray plastic sucking piece.
6. The chip tray blister according to claim 5, wherein: the diatomite is subjected to modification treatment and comprises the following steps:
s1, roasting diatomite at 400-500 ℃ for 1.8-2.4h, cooling, soaking in 70-80% sulfuric acid solution at 65-75 ℃ for 3-4h, taking out, washing and drying to obtain pretreated diatomite;
s2, stirring and mixing stearic acid and anhydrous ethanolamine according to the mass ratio of 1 (2-5) to obtain a mixed solution, dispersing the pretreated diatomite into the mixed solution, stirring and soaking at 70-80 ℃ for 1.5-2.5h, taking out and drying to constant weight to obtain the modified diatomite.
7. The chip tray blister of claim 6, wherein: the mass ratio of the modified diatomite to the ultrahigh molecular weight polyethylene to the modified glass beads is (15).
8. The chip tray blister according to claim 1, wherein: the toughening agent is any one of styrene-butadiene thermoplastic elastomer, acrylonitrile-butadiene-styrene copolymer and ethylene-vinyl acetate copolymer.
9. The chip tray blister of claim 1, wherein: the dispersing agent is any one or a mixture of more of stearamide, microcrystalline paraffin, magnesium stearate and calcium stearate.
10. The method of making a blister for a chip tray of claim 1, comprising the steps of:
(1) Preparing raw materials comprising polystyrene, a toughening agent, an antistatic agent, a filler, a compatilizer, a dispersing agent, pigment master batches, ultra-high molecular weight polyethylene and modified glass beads according to a ratio;
(2) Uniformly mixing the raw materials in the step (1), putting the mixture into a double-screw extruder, and performing extrusion molding to obtain a blister sheet;
(3) And (3) softening the plastic sheet by hot melting, placing the plastic sheet right above the mold, and performing blank pressing, vacuum plastic sucking and cutting by plastic sucking molding equipment to obtain the chip tray plastic sucking part.
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| CN112626634A (en) * | 2020-12-14 | 2021-04-09 | 九江中科鑫星新材料有限公司 | Injection molding grade antibacterial ultra-high molecular weight polyethylene fiber and preparation method thereof |
| CN113563659A (en) * | 2021-08-24 | 2021-10-29 | 胜利油田胜机石油装备有限公司 | Polyethylene composite material and application thereof in preparation of high-temperature-resistant lining oil pipe |
| CN115160703A (en) * | 2022-08-01 | 2022-10-11 | 东藤（上海）新材料有限公司 | Antistatic high-strength chip tray and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101875824A (en) * | 2005-03-29 | 2010-11-03 | 大科能树脂有限公司 | Anti-static resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film and their preparation method |
| US20060252873A1 (en) * | 2005-05-05 | 2006-11-09 | General Electric Company | IC trays and compositions thereof |
| CN106977791A (en) * | 2017-04-21 | 2017-07-25 | 河南省金航工程塑料有限公司 | A kind of ultra-high molecular weight polyethylene emulates slab |
| CN112626634A (en) * | 2020-12-14 | 2021-04-09 | 九江中科鑫星新材料有限公司 | Injection molding grade antibacterial ultra-high molecular weight polyethylene fiber and preparation method thereof |
| CN113563659A (en) * | 2021-08-24 | 2021-10-29 | 胜利油田胜机石油装备有限公司 | Polyethylene composite material and application thereof in preparation of high-temperature-resistant lining oil pipe |
| CN115160703A (en) * | 2022-08-01 | 2022-10-11 | 东藤（上海）新材料有限公司 | Antistatic high-strength chip tray and preparation method thereof |
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