WO2006100742A1 - Rfidタグ - Google Patents
Rfidタグ Download PDFInfo
- Publication number
- WO2006100742A1 WO2006100742A1 PCT/JP2005/005026 JP2005005026W WO2006100742A1 WO 2006100742 A1 WO2006100742 A1 WO 2006100742A1 JP 2005005026 W JP2005005026 W JP 2005005026W WO 2006100742 A1 WO2006100742 A1 WO 2006100742A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rfid tag
- thin plate
- antenna
- radio wave
- long
- Prior art date
Links
- 239000000463 material Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 description 11
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/28—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements
- H01Q19/30—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
- H01Q19/12—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces wherein the surfaces are concave
- H01Q19/13—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces wherein the surfaces are concave the primary radiating source being a single radiating element, e.g. a dipole, a slot, a waveguide termination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Definitions
- the present invention relates to an RFID tag.
- RFID tags are widely known. Generally, RFID tags are equipped with a dipole antenna. A dipole antenna is composed of antenna wires corresponding to the length specified by ⁇ ⁇ 2. Based on these antenna lines, RFID tags can send and receive the required radio signals.
- the RFID tag If the transmission power of a wireless signal is increased, the RFID tag can sufficiently establish wireless communication even if the RFID tag moves away from the wireless signal transmission source.
- the maximum value of transmission power is regulated by law, for example. Therefore, as disclosed in, for example, US Pat. No. 6,417,740, a technique for expanding the communication distance from the transmission source to the RFID tag without increasing the transmission power of the radio signal is sought.
- Patent Document 1 US Patent No. 6441740
- Patent Document 2 U.S. Patent No. 6535175
- the present invention has been made in view of the above circumstances, and an object thereof is to provide an RFID tag capable of extending a communication distance without increasing the transmission power of a radio signal.
- a thin resin plate, an antenna wire embedded in the thin plate, and a metal radio wave reflector embedded in the thin plate and extending parallel to the antenna wire are provided.
- An RFID tag characterized by comprising:
- the radio wave entering toward the thin plate is reflected by the radio wave reflecting material.
- the reflected radio wave can be guided to the antenna line.
- Radio wave reflectors increase the amount of radio waves received by antenna wires.
- RFID tags greatly contribute to an increase in communication distance.
- the electromagnetic wave reflecting material is embedded in the thin plate, the conventional use can be ensured. If a reflector is added to the outside of the RFID tag, the application of the RFID tag will be severely limited.
- the antenna line may be a dipole antenna or a held dipole antenna.
- the antenna consists of an antenna line corresponding to the length specified by ⁇ 2. This RFID tag can send and receive the required radio signals based on this antenna line.
- the radio wave reflecting material may be composed of a plurality of long members that are arranged apart from each other and that define a flat surface that is inclined at an arbitrary inclination angle around an axis parallel to the antenna line. With such a long member, radio wave reflection can be realized on a flat surface. Due to the action of the flat surface, the electromagnetic wave can be directed to the antenna line.
- the plurality of long members are arranged along the surface of the thin plate, and the first long member group is arranged to force the outer end far from the antenna line close to the back surface of the thin plate, and the back surface of the thin plate And a second group of long members that move the outer end of the antenna line force closer to the surface of the thin plate.
- radio waves entering the thin plate from the surface are reflected by the flat surface of the second long member group.
- the reflected radio wave is directed toward the antenna line.
- the radio waves entering the back surface thin plate are reflected by the flat surface of the first long member group.
- the reflected radio wave is guided to the antenna line.
- Radio wave reflectors can increase the amount of radio waves received from two directions with antenna wires.
- the plurality of long members include a long member group that is arranged along the back surface of the thin plate and that brings the outer end far away from the antenna line force toward the surface of the thin plate.
- a metal shield plate may be attached to the back surface of the thin plate in the Tatsu RFID tag. According to such an RFID tag, radio waves can always be collected on the antenna line satisfactorily regardless of the type of material in contact with the back surface of the thin plate.
- the radio wave reflecting material may be composed of a plurality of long members that are arranged away from each other and define a semi-cylindrical surface composed of a bus parallel to the antenna line. With such a long member, radio wave reflection can be realized on the semi-cylindrical surface. Due to the semi-cylindrical surface, radio waves can be guided to the antenna line.
- the plurality of long members are disposed along the surface of the thin plate, and are disposed along the back surface of the thin plate, the first long member group that faces the semi-cylindrical surface to the back surface of the thin plate, And a second group of elongated members facing the semi-cylindrical surface to the surface of the thin plate.
- radio waves entering the thin plate from the surface are reflected by the semi-cylindrical surface of the second long member group.
- the reflected radio wave is guided to the antenna line.
- radio waves entering the thin plate from the back are reflected by the semi-cylindrical surface of the first long member group.
- the reflected radio wave is directed to the antenna line.
- Radio wave reflectors can increase the amount of radio waves incident from two directions with antenna wires.
- the plurality of long members may include a long member group that is disposed along the surface of the thin plate and faces the semicylindrical surface to the back surface of the thin plate.
- a metal shield plate can be attached to the back of a thin plate.
- the radio wave reflecting material may be composed of a plurality of long members that are arranged away from each other and that define a cylindrical surface formed by a bus parallel to the antenna line.
- the radio wave reflecting material may be composed of a plurality of long member forces that define a plurality of hemispheres arranged in parallel to the antenna line.
- FIG. 1 is a plan view of an RFID tag according to a first embodiment of the present invention.
- FIG. 2 is an enlarged partial cross-sectional view of the RFID tag taken along line 2-2 in FIG.
- FIG. 3 is an enlarged cross-sectional view of the RFID tag taken along line 3-3 in FIG.
- FIG. 4 is a plan view of a metal thin film schematically showing a manufacturing process of an RFID tag.
- FIG. 5 is an enlarged cross-sectional view of an RFID tag according to a modification of the first embodiment corresponding to FIG.
- FIG. 6 is an enlarged cross-sectional view of an RFID tag according to another modification of the first embodiment, corresponding to FIG.
- FIG. 7 is an enlarged partial perspective view schematically showing a hemispheric surface defined by a long member.
- FIG. 8 is an enlarged cross-sectional view of an RFID tag according to still another modification of the first embodiment, corresponding to FIG.
- FIG. 9 corresponds to FIG. 3 and is an enlarged cross-sectional view of an RFID tag according to a second embodiment of the present invention.
- FIG. 10 is an enlarged cross-sectional view of an RFID tag according to a modification of the second embodiment corresponding to FIG.
- FIG. 11 is an enlarged cross-sectional view of an RFID tag according to another modification of the second embodiment corresponding to FIG. The
- FIG. 12 is an enlarged cross-sectional view of an RFID tag according to a third embodiment of the present invention corresponding to FIG.
- FIG. 13 is an enlarged cross-sectional view of an RFID tag according to a modification of the third embodiment corresponding to FIG.
- FIG. 14 is an enlarged cross-sectional view of an RFID tag according to another modification of the third embodiment, corresponding to FIG.
- FIG. 15 is an enlarged cross-sectional view of an RFID tag according to still another modification of the third embodiment, corresponding to FIG.
- FIG. 16 is a perspective view of a radio wave reflecting material according to a fourth embodiment of the present invention.
- FIG. 17 is a perspective view of a radio wave reflecting material according to a modification of the fourth embodiment.
- FIG. 18 is a perspective view of a radio wave reflecting material according to another modification of the fourth embodiment.
- FIG. 1 shows an RFID tag 11 according to a first embodiment of the present invention.
- the RFID tag 11 includes a thin resin sheet 12.
- a semiconductor chip 13 is embedded in the thin plate 12.
- a wireless transmission / reception circuit, a logic circuit, and a memory are incorporated in the semiconductor chip 13.
- predetermined information is stored in the memory.
- the antenna device 14 is embedded in the thin plate 12.
- the antenna device 14 includes a pair of antenna wires 14a and 14b that constitute a so-called dipole antenna.
- the antenna device 14 is connected to the semiconductor chip 13. Electric power is generated in the semiconductor chip 13 in accordance with the radio wave received by the antenna device 14. Based on this power, the semiconductor chip 13 performs a predetermined operation. For example, information in the memory can be transmitted from the antenna device 14.
- a radio wave reflecting material 15 is embedded in the thin plate 12.
- the radio wave reflecting material 15 is also composed of a metal material such as iron, aluminum, or copper.
- the radio wave reflecting material 15 is also configured with a plurality of long braids 15a 15b 15c 15d force extending in parallel with the antenna wires 14a 14b.
- the long members 15a to 15d are arranged apart from each other, for example. Details of the long members 15a to 15d will be described later.
- the thin plate 12 is made of a resin material such as polyester or polyimide.
- Powered substrate 16 is provided.
- the semiconductor chip 13 is placed in the window hole of the substrate 16.
- a pair of conductive contacts 17 is formed on the semiconductor chip 13.
- Each conductive contact 17 receives one end of each antenna wire 14a, 14b.
- One end of each of the antenna wires 14 a and 14 b is joined to the conductive contact 17 by, for example, a bump 18.
- the antenna wires 14a and 14b and the semiconductor chip 13 are electrically connected.
- the semiconductor chip 13 is covered with the sealing material 19 on the substrate 16.
- the sealing material 19 may be constituted by, for example, a resin material material.
- the substrate 16 is sandwiched between a pair of thin film materials 21 and 21.
- the thin film material 21 is composed of an inner adhesive material 22 and an outer covering material 23.
- Adhesive 22 may be composed of, for example, ethyl beer acetate, peticular resin, or silicone resin adhesive.
- the covering material 23 may be made of, for example, polyester, polyimide, polyethylene, etc., or a high-strength polymer material.
- the semiconductor chip 13, the antenna device 14, and the radio wave reflecting material 15 are sandwiched between the thin film materials 21. In this way, the semiconductor chip 13, the antenna device 14, and the radio wave reflecting material 15 are embedded in the thin plate 12.
- FIG. 3 shows the radio wave reflector 15 according to the first embodiment of the present invention.
- Each of the long members 15a, 15b, 15c, and 15d defines a flat surface 24 that is inclined at an arbitrary inclination angle ⁇ around an axis parallel to the antenna wires 14a and 14b. Based on such an inclination angle a, the flat surface 24 brings the outer end far from the antenna wires 14a and 14b closer to the surface of the thin plate 12 by force. The flat surface 24 spreads over the entire length of the long brackets 15a-15d. Individual long attachments 15a ⁇ 15b ⁇ 15c ⁇ 15d need only have a uniform cross section.
- the inclination angle oc of the flat surface 24 may be determined based on the assumed incident direction of the radio wave 25 and the relative positions of the long members 15a-15d and the antenna wires 14a, 14b. According to such an RFID tag 11, as is clear from FIG. 3, the radio wave 25 entering the thin plate 12 from the surface is reflected by the flat surface 24. The reflected radio wave is guided to the antenna wires 14a and 14b. The radio wave reflector 15 increases the amount of radio waves received by the antenna wires 14a and 14b. RFID tags 1 1 greatly contribute to an increase in communication distance.
- a long metal thin plate 27 is prepared.
- a pair of support members 27a, 27a extend in the longitudinal direction.
- the distance W between the support members 27a is the total length of the long members 15a and 15b Secured larger than the length.
- a plurality of rows of thin plate pieces 27b, 27c,... are arranged in the longitudinal direction of the thin metal plate.
- the arrangement of the thin plate pieces 27b, 27c,... Reflects the arrangement of the long members 15a to 15d in the RFID tag 11.
- the support member 27a is bent between the thin plate pieces 27b based on the inclination angle a of the corresponding long members 15a-15d.
- the metal thin plate 27 is used for forming the substrate 12.
- the bent metal sheet 27 is placed in the cavity of a mold (not shown).
- the metal thin plate 27 is encased in a resin material within the cavity.
- the molded resin board is removed from the mold.
- Such a resin board power board 12 is cut out.
- the substrate 12 may include the specified thin plate pieces 27b, 27c,. Based on such a substrate 12, the RFID tag 11 described above can be manufactured. However, the RFID tag 11 may be manufactured based on other methods.
- semi-cylindrical surfaces 28 may be defined on the individual long members 15a, 15b, 15c, 15d instead of the flat surface 24.
- the semi-cylindrical surface 28 is constituted by a bus parallel to the antenna wires 14a and 14b.
- the semi-cylindrical surface 28 may extend over the entire length of the long members 15a-15d. Individual long attachments 15a ⁇ 15b ⁇ 15c ⁇ 15d need only have a uniform cross section.
- the semi-cylindrical surface 28 faces one plane including the surface of the thin plate 12. Therefore, the radio wave 25 entering the thin plate 12 with a surface force is reflected by the semi-cylindrical surface 28. The reflected radio waves are guided toward the antenna wires 14a and 14b. The radio wave reflector 15 increases the amount of radio waves received by the antenna wires 14a and 14b. The RFID tag 11 greatly contributes to an increase in communication distance.
- the cross-sectional shape of the semi-cylindrical surface 28 can be defined not only based on a circle but also based on an ellipse, for example.
- the cylindrical surfaces 29 are provided on the individual long members 15a, 15b, 15c, 15d. May be specified.
- the cylindrical surface 29 is constituted by a bus parallel to the antenna wires 14a and 14b.
- the cylindrical surface 29 may extend over the entire length of the long members 15a-15d.
- the individual long members 15a, 15b, 15c, and 15d may have a uniform cross section. According to such an RFID tag 11, the same effect as the RFID tag 11 described above can be obtained.
- the cross-sectional shape of the cylindrical surface 29 is regulated based on the circle. For example, it may be defined based on an ellipse.
- a plurality of hemispherical surfaces 31 may be defined on the long members 15a and 15d!
- the hemispherical surface 31 may be arranged over the entire length of the long members 15a-15d. According to such an RFID tag 11, for example, as shown in FIG. 8, the same effects as those of the RFID tag 11 can be obtained.
- FIG. 9 shows a radio wave reflector 15 according to the second embodiment of the present invention.
- the radio wave reflecting material 15 includes a first long member group 32 disposed along the surface of the thin plate 12 and a second long member group 33 disposed along the back surface of the thin plate 12.
- the individual long members 32a, 32b, 32c, 32d, 33a, 33b, 33c, 33d included in the first long member group 32 and the second long member group 33 are the long members 15a-15d described above. What is necessary is just to be comprised similarly.
- each of the long members 33a, 33b, 33c, 33d has a flat surface 24 that brings the outer end far from the antenna wires 14a, 14b closer to the surface of the thin plate 12 by force. It is prescribed. According to such an RFID tag 11, the radio wave 25 entering the surface force thin plate 12 is reflected by the flat surface 24 of the second long members 33a to 33d.
- the reflected radio wave is guided to the antenna wires 14a and 14b.
- the radio wave 34 entering the thin plate 12 also reflects on the flat surface 24 of the first long members 32a-32d.
- the reflected radio waves are directed to the antenna wires 14a and 14b.
- the radio wave reflector 15 can increase the amount of received radio waves incident from two directions by the antenna wires 14a and 14b.
- a semicylindrical surface 26 and a semispherical surface 31 may be defined in 32d, 33a, 33b, 33c, and 33d.
- the semi-cylindrical surface 26 and the semi-spherical surface 31 only need to face one plane including the back surface of the thin plate 12.
- the semi-cylindrical surface 26 and the semi-spherical surface 31 only need to face one plane including the surface of the thin plate 12.
- FIG. 12 shows a radio wave reflector 15 according to a third embodiment of the present invention.
- the radio wave reflecting material 15 includes a long member group 35 disposed along the back surface of the thin plate 12.
- a metal shield plate 36 is attached to the back surface of the thin plate 12.
- the individual long members 35a, 35b, 35c, and 35d of the long member group 35 are configured in the same manner as the long members 15a to 15d described above.
- a flat surface 24 is defined in which the outer ends far from the antenna wires 14a and 14b are brought close to the surface of the thin plate 12 by force.
- the shield plate 36 is attached to the back surface of the thin plate 12.
- a semi-cylindrical surface 28 may be defined as shown in FIG. 13 instead of the flat surface 24 as shown in FIG.
- the cylindrical surface 29 may be defined as shown in FIG. 15, or the hemispherical surface 31 may be defined as shown in FIG.
- FIG. 16 shows a radio wave reflector 15 according to the fourth embodiment of the present invention.
- the radio wave reflector 15 includes a reflector 41 that surrounds the virtual semi-cylindrical surface outside the RFID tag 11.
- the antenna lines 14a and 14b of the RFID tag 11 are arranged along the axis of the virtual semi-cylindrical surface.
- the RFID tag 11 is fixed to the support member 42.
- the support member 42 is fixed to the reflection plate 41.
- a plurality of long members 43 extending in parallel with the axis of the semi-cylindrical surface are fixed inside the reflecting plate 41.
- the elongate member 43 defines a semi-cylindrical surface 44 composed of a generatrix parallel to the axis of the semi-cylindrical surface.
- the semi-cylindrical surface 44 may extend over the entire length of the long member 43.
- Each long member 43 may have a uniform cross section.
- a reflector 41 radio waves are collected on the antenna wires 14a and 14b. Therefore, the amount of radio waves received increases on the antenna wires 14a and 14b.
- the force of the semi-cylindrical surface 44 enables the radio waves to be reliably collected on the antenna wires 14a and 14b even if radio waves are incident on any directional force.
- Such a reflector 41 greatly contributes to an increase in communication distance.
- an array of hemispherical surfaces 31, 31,... May be used instead of the long member 43.
- a reflector 45 composed of two flat plates may be used as shown in FIG. 17, for example. Good.
- the semi-cylindrical surfaces 44, 44,... May be arranged in parallel to the antenna wires 14a, 14b.
- an array of semi-spherical surfaces 31, 31,... instead of the semi-cylindrical surface 44, an array of semi-spherical surfaces 31, 31,...
- a reflector 46 surrounding the hemispherical surface may be used in the radio wave reflector 15. In this case, the hemispherical surfaces 31, 31...
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Aerials With Secondary Devices (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05721176A EP1863126A4 (en) | 2005-03-18 | 2005-03-18 | RFID-LABEL |
JP2007509096A JPWO2006100742A1 (ja) | 2005-03-18 | 2005-03-18 | Rfidタグ |
CNA2005800491784A CN101142714A (zh) | 2005-03-18 | 2005-03-18 | Rfid标签 |
PCT/JP2005/005026 WO2006100742A1 (ja) | 2005-03-18 | 2005-03-18 | Rfidタグ |
US11/898,778 US20080012714A1 (en) | 2005-03-18 | 2007-09-14 | Radio frequency identification tag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/005026 WO2006100742A1 (ja) | 2005-03-18 | 2005-03-18 | Rfidタグ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/898,778 Continuation US20080012714A1 (en) | 2005-03-18 | 2007-09-14 | Radio frequency identification tag |
Publications (1)
Publication Number | Publication Date |
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WO2006100742A1 true WO2006100742A1 (ja) | 2006-09-28 |
Family
ID=37023439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/005026 WO2006100742A1 (ja) | 2005-03-18 | 2005-03-18 | Rfidタグ |
Country Status (5)
Country | Link |
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US (1) | US20080012714A1 (ja) |
EP (1) | EP1863126A4 (ja) |
JP (1) | JPWO2006100742A1 (ja) |
CN (1) | CN101142714A (ja) |
WO (1) | WO2006100742A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008146472A (ja) * | 2006-12-12 | 2008-06-26 | Hitachi Plant Mechanics Co Ltd | Rfidタグホルダ及びrfidタグ読取距離制限方法 |
JP2008245101A (ja) * | 2007-03-28 | 2008-10-09 | Brother Ind Ltd | パターンアンテナ、タグアンテナ、及びパターン伝送路 |
DE102007022865A1 (de) * | 2007-05-15 | 2008-11-20 | Thermo Tex Nagel Gmbh | Transponder zur Kennzeichnung von Wäscheteilen |
US11213773B2 (en) | 2017-03-06 | 2022-01-04 | Cummins Filtration Ip, Inc. | Genuine filter recognition with filter monitoring system |
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JP2009017291A (ja) * | 2007-07-05 | 2009-01-22 | Toshiba Tec Corp | 無線タグリーダライタ及び無線タグリーダライタの通信方法 |
JP4666038B2 (ja) * | 2008-09-22 | 2011-04-06 | 富士ゼロックス株式会社 | 無線通信システム |
CN103303564A (zh) * | 2012-03-06 | 2013-09-18 | 黄胜昌 | 具有辨识功能的容器盖体及制法 |
US9159015B2 (en) | 2012-04-23 | 2015-10-13 | Assa Abloy Ab | Flexible tag |
CN108400417B (zh) * | 2018-01-10 | 2021-02-09 | 常熟市浙大紫金光电技术研究中心 | 微波空间功率合成器件及合成方法 |
US11775532B1 (en) * | 2020-07-15 | 2023-10-03 | Walgreen Co. | Systems and methods for resolving relationships within data sets |
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- 2005-03-18 JP JP2007509096A patent/JPWO2006100742A1/ja active Pending
- 2005-03-18 CN CNA2005800491784A patent/CN101142714A/zh active Pending
- 2005-03-18 EP EP05721176A patent/EP1863126A4/en not_active Withdrawn
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2007
- 2007-09-14 US US11/898,778 patent/US20080012714A1/en not_active Abandoned
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JPH08139507A (ja) * | 1994-11-04 | 1996-05-31 | Yagi Antenna Co Ltd | アンテナ補助アームの取付け金具 |
JPH08195112A (ja) * | 1995-01-19 | 1996-07-30 | Matsushita Electric Works Ltd | 照明器具 |
JPH10206183A (ja) * | 1997-01-22 | 1998-08-07 | Tec Corp | 移動体位置検出システム |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008146472A (ja) * | 2006-12-12 | 2008-06-26 | Hitachi Plant Mechanics Co Ltd | Rfidタグホルダ及びrfidタグ読取距離制限方法 |
JP2008245101A (ja) * | 2007-03-28 | 2008-10-09 | Brother Ind Ltd | パターンアンテナ、タグアンテナ、及びパターン伝送路 |
DE102007022865A1 (de) * | 2007-05-15 | 2008-11-20 | Thermo Tex Nagel Gmbh | Transponder zur Kennzeichnung von Wäscheteilen |
US11213773B2 (en) | 2017-03-06 | 2022-01-04 | Cummins Filtration Ip, Inc. | Genuine filter recognition with filter monitoring system |
Also Published As
Publication number | Publication date |
---|---|
EP1863126A1 (en) | 2007-12-05 |
JPWO2006100742A1 (ja) | 2008-08-28 |
US20080012714A1 (en) | 2008-01-17 |
CN101142714A (zh) | 2008-03-12 |
EP1863126A4 (en) | 2009-04-29 |
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