Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
  • H04R19/00—Electrostatic transducers
  • H04R19/04—Microphones
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
  • H04R1/00—Details of transducers, loudspeakers or microphones
  • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
  • H04R19/00—Electrostatic transducers
  • H04R19/01—Electrostatic transducers characterised by the use of electrets
  • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
  • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
  • H04R2499/10—General applications
  • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/04—Soldering or other types of metallurgic bonding
  • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting

Definitions

• the present invention relates to a SMD type electret condenser microphone assembly, and more particularly to a SMD electret condenser microphone assembly which may be easily mounted on and unmounted from a main PCB.
• a SMT Surface Mount Technology
• a component mounting technology of a SMD is essential to small-sized electronic devices such as a cellular phone and a PDA. Therefore, most of components used in the cellular phone and so forth is developed and used as parts for the SMD having a robust temperature characteristic so that a SMD technology may be applied.
• an electret condenser microphone used in the cellular phone and so forth comprises a voltage bias element (commonly, consists of an electret), a pair of a diaphragm/backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal.
• the electret condenser microphone includes an electret formed on one of the diaphragm and the backplate, and the electret is commonly formed by injecting a charge into an organic film.
• the electret condenser microphone is manufactured by forcibly injecting the charge into the organic film, a performance of the electret is degraded when a humidity or a temperature is high due to breakaway of a charged electron. Therefore, it is difficult to apply the SMD to the electret condenser microphone.
• the SMD type electret condenser microphone of the registered utility patent may be mounted on a main PCB of a product such as the cellular phone where a microphone is surface-mounted.
• a SMD type microphone that may adaptively correspond with the microphone connection pattern of the main PCB. Disclosure of Invention
• a SMD type microphone assembly to be mounted on a main PCB by a SMD method, the assembly comprising: an SMD type microphone capsule; and for mounting the SMD type microphone capsule on the main PCB, a connection mediating body having an upper connection pattern formed on an upper surface thereof for connecting to the SMD type microphone capsule, and a lower connection pattern formed on a lower surface thereof for connecting to a connection pattern of the main PCB, the upper connection pattern and the lower connection pattern being electrically connected, wherein the lower connection pattern extrude with respect to the SMD type microphone capsule for locally heating the lower connection pattern.
• connection mediating body comprises a cross-shaped FPCB
• the microphone capsule and the connection mediating body are bonded by a laser welding, a soldering or a conductive adhesive
• the upper connection pattern comprises a circular metal pattern to corresponding to a shape of an electrode of the microphone capsule
• the lower connection pattern comprises three negative electrode metal patterns and a positive electrode metal pattern to correspond to a connection pad of the main PCB.
• the SMD type microphone assembly in accordance with the present invention may adaptively correspond with the microphone connection pattern of the main PCB of a product having the microphone surface-mounted thereon so that the SMD type microphone assembly in accordance with the present invention may easily be surface-mounted on various application products.
• the SMD type condenser microphone assembly in accordance with the present invention may easily be unmounted by heating a extruding portion of a connection mediating body with a soldering gun during a repair (rework) process, and a defective SMD type condenser microphone assembly be easily replaced with a new microphone capsule by heating the extruding portion of the connection mediating body with the soldering gun without applying a heat to the new microphone capsule.
• FIG. 1 is a diagram illustrating a state prior to attaching a connection mediating body to a microphone capsule in accordance with the present invention.
• FIG. 2 is a diagram illustrating an upper pattern of a connection mediating body in accordance with the present invention.
• FIG. 3 is a diagram illustrating a lower pattern of a connection mediating body in accordance with the present invention.
• FIG. 4 is a diagram illustrating a microphone assembly wherein a connection mediating body is bonded to a microphone capsule in accordance with the present invention.
• Fig. 5 is a plane view illustrating the microphone assembly of Fig. 4.
• Fig. 6 is a bottom view illustrating the microphone assembly of Fig. 4.
• Fig. 7 is a state diagram illustrating the microphone assembly attached to a main
• FIG. 1 is a diagram illustrating a state prior to attaching a connection mediating body to a microphone capsule in accordance with the present invention
• Fig. 2 is a diagram illustrating an upper pattern of a connection mediating body in accordance with the present invention
• Fig. 3 is a diagram illustrating a lower pattern of a connection mediating body in accordance with the present invention.
• the SMD type electret condenser microphone assembly comprises a microphone capsule 100 capable of a SMD and a connection mediating body 200 for connecting the microphone capsule to a connection pattern of a main PCB.
• the microphone capsule 100 has a shape of a cylinder as shown in Fig. 1, and is assembled by inserting common components such as a diaphragm and a back electret into a casing 102 and then by curling an end portion of the casing after inserting a PCB 104.
• connection terminal of a positive electrode 106 and a connection terminal of a negative electrode 108 are formed on a surface of the PCB 104 of the microphone to transmit an electrical signal of the microphone to outside through the connection terminals 106 and 108. That is, the connection terminal of the positive electrode 106 having a circular shape for connecting to a power supply/output (Vdd/Out) is disposed at a center portion and the connection terminal of the negative electrode having a circular shape for connecting to ground is disposed at an outer portion spaced apart from the connection terminal 106.
• Vdd/Out power supply/output
• connection mediating body 200 is a FPCB 202 having a cross shape
• a metal pattern 212 of a positive electrode and a metal pattern 214 of a negative electrode corresponding to a connection electrode of the microphone capsule 100 are formed on an upper surface 210 which is in contact with the microphone capsule 100.
• a shape of the metal pattern contacting the microphone capsule 100 includes the inner metal pattern 212 having a circular shape for contacting the positive electrode 106 of the microphone and the metal pattern 214 having a ring shape for contacting the negative electrode 108 of the microphone.
• connection mediating body 200 may be employed as a method for bonding the connection mediating body 200 to the connection terminals 106 and 108 of the microphone capsule 100.
• Three negative electrode metal pattern 222-1, 222-2 and 222-3 having a rectangular shape and corresponding to a negative electrode pad of the main PCB, and a positive electrode metal pattern 224 having a rectangular shape and corresponding to a positive electrode pad of the main PCB are formed on an lower surface 220 which is in contact with the main PCB.
• Each metal pattern includes through-holes 230-1, 230-2, 230-3 and 230-4 for an electrical connection to metals on the other surface.
• FIG. 4 is a diagram illustrating a microphone assembly wherein a connection mediating body is bonded to a microphone capsule in accordance with the present invention
• Fig. 5 is a plane view illustrating the microphone assembly of Fig. 4
• Fig. 6 is a bottom view illustrating the microphone assembly of Fig. 4
• Fig. 7 is a state diagram illustrating the microphone assembly attached to a main PCB.
• connection mediating body 200 is attached to a typical SMD type microphone capsule 100 by a laser welding, a soldering or a conductive adhesive.
• the condenser microphone assembly may be mounted through the connection mediating body 200 by SMD method on a main PCB (300 of Fig. 7) of a product such as a cellular phone where the microphone capsule 100 is mounted.
• the microphone capsule 100 is a cylinder type, and the microphone capsule 100 may be connected to the connection pattern of the main PCB 300 through the connection mediating body 200 consisting of the FPCB by SMD method.
• connection portion of the connection mediating body extrudes in four directions of the cylinder type microphone capsule 100.
• the extruding portion of the connection mediating body 200 may be heated with a soldering gun during a repair (rework) process to unmount the microphone capsule 100, and a defective SMD type condenser microphone assembly be easily replaced with a new microphone capsule by heating only the extruding portion of the connection mediating body 200 with the soldering gun without applying a heat to the new microphone capsule 100.
• SMD type electret condenser microphone assembly for facile mount/unmount of an SMD type microphone.
• SMD type electret condenser microphone assembly which may adaptively correspond with a microphone connection pattern of a main PCB.

Landscapes

• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Acoustics & Sound (AREA)
• Signal Processing (AREA)
• Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=36991870

Family Applications (1)

Country Status (2)

Cited By (1)

Families Citing this family (1)

Citations (3)

Family Cites Families (2)

• 2005
  • 2005-03-18 KR KR1020050022694A patent/KR100675506B1/ko not_active IP Right Cessation
  • 2005-08-11 WO PCT/KR2005/002621 patent/WO2006098536A1/en active Application Filing

Patent Citations (3)

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