WO2006080335A1 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- WO2006080335A1 WO2006080335A1 PCT/JP2006/301113 JP2006301113W WO2006080335A1 WO 2006080335 A1 WO2006080335 A1 WO 2006080335A1 JP 2006301113 W JP2006301113 W JP 2006301113W WO 2006080335 A1 WO2006080335 A1 WO 2006080335A1
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- WIPO (PCT)
- Prior art keywords
- heat transfer
- display device
- heat
- transfer means
- display panel
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Definitions
- the present invention relates to a flat type display device such as a plasma display device.
- Plasma display panels have become widespread as display devices typified by flat-screen televisions.
- PDP is a display device that enables thin and large screen display, and like LCD panels, its production volume is growing dramatically year by year.
- a number of technical documents have already been published for the display technology of the plasma display device using the PDP (for example, see Non-Patent Document 1).
- FIG. 11 shows a configuration example of a conventional plasma display device using a PDP as a display device.
- Fig. 11 (a) is a view of the plasma display device from the back (however, excluding the back force bar 18 described later), and
- Fig. 11 (b) is the VB-VB line in Fig. 11 (a).
- FIG. 2 is a cross-sectional view of the plasma display device taken along the line.
- a substantially rectangular chassis 12 (rear member) having a slightly larger area than the PDP 11 is joined and fixed to the rear surface of the substantially rectangular PDP 11. And fixed to the legs 13 functioning as a pedestal of the plasma display device 150.
- a front cover 15 is disposed on the front side of the PDP 11, and the front cover 15 has an opening corresponding to the display surface of the PDP 11, and the protective panel 14 faces the opening. 15 is disposed.
- the rear cover of the chassis 12 is also a spacer S. It is fixed at regular intervals through.
- a back cover 18 is attached to the leg portion 13 so as to wrap the PDP 11, the chassis 12, the electronic component 16 and the circuit board 17 from the back thereof, and the front cover 15 is arranged in front of the back cover 18. It is attached to the part.
- air is exhausted to the outside from the plurality of intake holes 19a, 19b, 19c and the plasma display device 150, which function as holes through which air flows into the plasma display device 150, at appropriate positions on the back cover 18.
- a plurality of exhaust holes 19d and 19e functioning as holes to be made are provided.
- the PDP 11 is more susceptible to high temperature due to image display by discharge light emission than other display bodies such as liquid crystal panels and cathode ray tubes.
- the drive voltage of the PDP 11 is higher than other display bodies (drive voltage: 200 to 300 V)
- the electronic component 16 for example, driver LSI
- the driving voltage of the driver LSI there is a tendency to increase the driving voltage of the driver LSI, which makes the thermal problem of the plasma display device 160 more apparent.
- a plurality of rod-shaped heat transfer members 20a and 20b are provided for the purpose of efficiently dissipating heat generated in the PDP 11 and the electronic component 16 to the back cover 18.
- One end of each of the members 20a and 20b is brought into contact with at least one of the PDP 11 and the circuit board 17 via the chassis 12 (an example of contact with the PDP 11 is shown in FIG. 11), and the rod-shaped heat transfer.
- the other ends of the members 20a and 20b are in contact with the back cover 18.
- the rod-like heat transfer member 20 a, 20 b force PDP 11 and circuit board 17 are arranged so as to be capable of transferring heat between at least one of them and back cover 18.
- the rod-like heat transfer members 20a and 20b are evenly disposed on the lower half of the back cover 18 and the upper half of the back cover 18,
- the upper half of the back cover 18 has three rod-like heat transfer members 20a that connect the back cover 18 and the PDP 11 to the plasma display device 150. They are arranged side by side in the left-right direction.
- three rod-like heat transfer members 20 b that connect the back cover 18 and the PDP 11 are arranged side by side in the left-right direction of the plasma display device 150.
- a heat conductive sheet such as silicone rubber is attached to improve the heat transfer coefficient between the PDP and the heat conductive plate.
- a plasma display device intended to efficiently suppress local heat generation of the PDP by arranging a plurality of heat pipes, heat radiating fins and a heat radiating fan at the top of the heat conduction plate is shown. (Refer to Patent Document 2).
- a linear uneven structure is formed on the inner surface of a PDP rear frame (for example, an aluminum metal plate) with excellent thermal conductivity, which makes it possible to maintain weight and maintain strength and heat dissipation.
- a rear frame for DP can be obtained (see Patent Document 4).
- Non-Patent Document 1 Flat Panel Display 1999 (Nikkei Microdevices)
- Patent Document 1 JP 2000-338904 A
- Patent Document 2 JP-A-11 251777
- Patent Document 3 Japanese Patent Laid-Open No. 2000-347578
- Patent Document 4 Japanese Patent Laid-Open No. 2001-242792
- the heat generated by the PDP or the like is quickly released through the casing 120 to the outside, which is a design technology that is indispensable for making the plasma display device thinner and fanless.
- the number of the rod-shaped heat transfer members 20a, 20b in FIG. 11 is increased as much as possible to increase the total cross-sectional area of the rod-shaped heat transfer members 20a, 20b, the rod-shaped heat transfer members 20a, 20b, and the back cover 18 Increasing the contact area with PDP11 as much as possible is essential for efficient heat dissipation design.
- the temperature equalization of the internal temperature of the plasma display device (surface temperature of the casing 120 of the plasma display device) is also ignored in the heat dissipation design of the plasma display device. It is an element that cannot be done. Nevertheless, the present inventors believe that the heat dissipation design of the plasma display device 150 shown in FIG. 11 lacks such consideration.
- the plasma display device 150 shown in FIG. 11 it is located at the lower end portion of the knock cover 18 through the path shown by the dotted line shown in FIG. 11 (b) based on the principle of air buoyancy.
- the upper part of the plasma display device 150 (the upper half shown in FIG. 11) tends to be hotter than the lower part (the lower half shown in FIG. 11). Therefore, the surface (outer surface) temperature of the upper half of the back cover 18 in the upper half of the plasma display device 150 easily rises. This is locally applied to the upper half of the back cover 18 that is likely to be touched by consumers. Heat will be given.
- the present invention has been made in view of such problems, and provides a display device capable of preventing the casing from being locally heated to equalize the surface temperature of the casing.
- the purpose is to.
- a display device includes a display panel in which a plurality of pixels are arranged in a plane and an image is displayed by emission light control for each pixel, and the emission light.
- An electronic component that constitutes a control circuit that executes control is a display device housed in a housing, and a planar heat conduction is provided between the display panel, the electronic component, and the housing. It is a device that is provided with a sheet.
- the heat generated by the display panel, electronic components, and the like is diffused in the surface direction by the sheet-like heat conductive sheet having excellent heat conduction characteristics, and then transmitted to the housing. Therefore, it is possible to prevent the casing from being locally heated.
- the above configuration also provides an effect that the heat dissipation efficiency is increased as compared with the case where the casing is locally heated as in the conventional case.
- At least one of the display panel and the electronic component and the heat conductive sheet may be configured to be capable of heat transfer via a first heat transfer means. good.
- the display panel or electronic component with a large amount of heat generation and the heat conductive sheet are configured to be capable of heat transfer via the first heat transfer means, so that the display panel or electronic component can be transferred from the display panel or electronic component to the heat conductive sheet. Since heat is efficiently transferred, it is possible to suppress the display panel or the electronic component from becoming high temperature.
- examples of the first heat transfer means include the display panel and the electronic component.
- a first heat transfer member for connecting at least one of the heat transfer sheet and the heat transfer sheet.
- the heat transfer efficiency from the display panel or the electronic component to the heat conductive sheet can be increased with a simple configuration.
- the first heat transfer means includes a first radiating member connected to at least one of the display panel and the electronic component, and a first radiating member connected to the heat conductive sheet. And the second radiating member absorbs the heat generated from the first radiating member.
- the heat transfer means for transmitting heat can be reduced in size and weight.
- this configuration since heat can be transferred through the space, there is an advantage that it is not necessary to consider insulation.
- a back member for making the heat distribution of the display panel uniform along the surface direction of the back panel is disposed on the back surface of the display panel. good.
- At least one of the back member and the electronic component and the heat conductive sheet may be configured to be capable of heat transfer via a second heat transfer means.
- Heat transfer from the back member to the heat transfer sheet is performed with high efficiency by enabling the heat transfer of the back member that can become high temperature and the heat transfer sheet through the second heat transfer means. Therefore, it is suppressed that the back member becomes high temperature, and the heat dissipation effect of the back member is enhanced.
- an example of the second heat transfer means is the second heat transfer member that connects the back member and the heat conduction sheet.
- the second heat transfer means is a third radiating portion connected to the back member. And a fourth radiating member connected to the heat conductive sheet, and the fourth radiating member absorbs heat generated by the third radiating member.
- the heat transfer means can be reduced in size and weight by adopting a configuration in which heat is transmitted spatially by radiation and absorption of heat.
- this configuration since heat can be transferred through the space, there is an advantage that it is not necessary to worry about insulation.
- the heat conductive sheet used in the above configuration is an anisotropic heat conductive member whose surface direction thermal conductivity is higher than its thickness direction thermal conductivity.
- Viewpoint power of thermalization One example of such an anisotropic heat conductive member that is desired is a sheet containing graphite. Since such graphite has the property of blocking electromagnetic waves, this increases the shielding performance of electromagnetic waves emitted from display panels and electronic components, and electromagnetic waves generated inside the casing leak to the outside of the casing. Can be suppressed.
- the casing of the first heat transfer means (or the second heat transfer means) arranged in the lower half of the casing.
- the sum of the minimum cross-sectional areas orthogonal to the direction of heat transfer to the body is the first heat transfer means (or second heat transfer means) disposed in the upper half of the case to the case. It is larger than the sum of the minimum cross-sectional areas of the cross-sections orthogonal to the heat transfer direction!
- the heat generation of the lower half of the casing due to the heat generated in the display panel and electronic components and the casing due to the heat of high-temperature convection air heated by heat exchange with the display panel and electronic components It is possible to achieve a uniform temperature distribution in the in-plane heat distribution on the entire surface of the housing, with a good balance between the degree of heating in the upper half of the housing.
- the sum of the minimum cross-sectional areas of the first heat transfer means (or the second heat transfer means) provided in the lower half of the casing is set to the first half of the casing. In the heat transfer means (or second heat transfer means) If the numerical value divided by the sum of the small cross-sectional areas is 1.5 or more, the in-plane temperature distribution of the casing can be properly heated.
- first heat transfer means (or the second heat transfer means) is a bar member, and one end of the bar member contacts at least one of the display panel and the electronic component. At the same time, the other end of the bar member may be in contact with the heat conductive sheet.
- first heat transfer means (or the second heat transfer means) is an annular member, and the first portion of the annular member includes at least the display panel and the electronic component.
- the annular member excluding the first and second portions is in contact with at least one of the indications by contacting any one of them and the second portion of the annular member contacting the heat conducting sheet. It may be arranged and configured to enable heat transfer between any one of the panel and the electronic component and the heat conductive sheet.
- the first ventilation hole disposed in the lower half of the housing and the second ventilation hole disposed in the upper half of the housing may be configured.
- the air hole is an air intake hole for taking air into the housing in the lower half of the housing, and the second ventilation hole exhausts the internal force of the housing to the upper half of the housing. Air exhaust holes may be used.
- a third body is provided with a support body that holds the display panel via a back surface member of the display panel, and is arranged to allow heat transfer between the back surface member and the support body.
- the heat transfer means may constitute a part of the support.
- the display panel is configured to include a support that holds the display panel via a back member, and the back member and the support are connected via a fourth heat transfer means. It may be configured.
- the thermal conductivity of the first heat transfer means is preferably 80 jZmsK or more from the viewpoint of achieving rapid heat conduction. Therefore, a material example of the first heat transfer means is made of a material containing any one of aluminum, iron, copper, magnesium, silver, graphite, and diamond.
- an example of the display panel is a plasma display panel.
- FIG. 1 is an exploded perspective view of a plasma display device.
- FIG. 2 is a cross-sectional view of the plasma display device taken along line AA in FIG.
- FIG. 3 is a cross-sectional view showing a configuration example of a plasma display device according to a second embodiment.
- FIG. 4 is a cross-sectional view showing another configuration example of the plasma display device according to the second embodiment.
- FIG. 5 is a cross-sectional view showing another configuration example of the plasma display device according to the second embodiment.
- FIG. 6 is a cross-sectional view of a plasma display device according to a modification of the first and second embodiments.
- FIG. 7 is a diagram showing a configuration example of a plasma display device according to an embodiment of the third invention.
- FIG. 8 is a view showing an example of a rod-like heat transfer member that is not the same shape along the longitudinal direction corresponding to the heat transfer direction.
- FIG. 9 is a diagram showing a three-dimensional model of the plasma display device according to the third embodiment for numerical calculation.
- FIG. 10 is obtained based on the physical quantity calculation data of each element of the analysis model shown in FIG.
- FIG. 6 is a temperature contour diagram of the surface of the back cover.
- FIG. 11 is a diagram showing a configuration example of a conventional plasma display device.
- FIG. 12 is a diagram showing a three-dimensional model of a conventional plasma display device for numerical calculation.
- FIG. 13 is a temperature contour diagram of the surface of the back cover obtained based on physical quantity calculation data of each element of the analysis model shown in FIG.
- FIG. 14 is a diagram showing an example of an analysis result obtained by appropriately changing the configuration of the analysis model shown in FIG.
- FIG. 15 is a diagram showing a configuration of a plasma display device according to Modification 1 of the third exemplary embodiment.
- FIG. 16 is a diagram showing a configuration of a plasma display device according to a second modification of the third embodiment.
- FIG. 17 is a diagram showing a configuration of a plasma display device according to modification 3 of the third embodiment.
- FIG. 18 is a diagram showing a configuration of a plasma display device according to Modification 4 of the third embodiment.
- FIG. 19 is a diagram showing a configuration of a plasma display device according to Modification 5 of the third embodiment.
- FIG. 20 is a cross-sectional view showing a configuration example of a plasma display device according to a fourth embodiment.
- FIG. 21 is a cross-sectional view showing another configuration example of the plasma display device according to the fourth exemplary embodiment.
- FIG. 1 is an exploded perspective view of the plasma display device 10 according to the first exemplary embodiment.
- the plasma display device 10 includes a housing 120, a PDP (display panel) 11 housed in the housing 120, a chassis 12 (back member) as a metal support plate that supports the PDP 11, and a control circuit.
- a plurality of circuit boards 17 are provided.
- the PDP 11 is configured such that a plurality of pixels are arranged in a plane and an image is displayed by emission light control for each pixel, and the front panel 151 and the rear panel 152 are arranged to face each other in parallel with each other.
- a display electrode pair, a dielectric layer, and a protective layer are sequentially arranged on the opposite surface of the front glass substrate.
- address electrodes, a dielectric layer, and barrier ribs are sequentially arranged on the opposite surface of the rear glass substrate, and a phosphor layer is formed between the barrier ribs.
- the phosphor layers are repeatedly arranged in the order of red, green, and blue.
- the front panel 151 and the back panel 152 are bonded to each other with a sealing material at the periphery, and the gap between the two panels is partitioned by a stripe-shaped partition wall, thereby discharging discharge. A gap (not shown) is formed, and a discharge gas is sealed in the discharge space.
- the PDP 11 receives a signal from the control circuit of the circuit board 17 and displays an image on the image display surface 153.
- the chassis 12 is a plate-like member having an aluminum force, for example.
- the rear panel 152 of the PDP 11 and the chassis 12 are bonded together with an adhesive having excellent heat conduction, such as silicone paste.
- the chassis 12 By disposing the chassis 12 on the back side of the P11, the heat dissipation efficiency of the PDP 11 can be improved.
- the circuit board 17 provided on the rear surface of the chassis 17 is configured to include a plurality of electronic components, and thus, a control circuit for executing emission light control for each pixel of the PDP 11 is incorporated.
- the casing 120 is composed of, for example, a front cover 15 and a back cover 18 made of aluminum. That is, the front cover 15 and the back cover 18 are fitted into one housing.
- a protective panel 14 having a glass power for protecting the image display surface 153 of the PDP 11 is incorporated in the opening portion of the front cover 15.
- a graph eye sheet 140 (heat conduction sheet) is adhered to the inner surface of the back cover 18 over substantially the entire main surface and upper, lower, left and right side surfaces.
- the graphite sheet 140 is a sheet that also has a graphite force, and has anisotropic thermal conductivity in which the thermal conductivity in the plane direction is higher than the thermal conductivity in the thickness direction.
- a graphite sheet 140 having a thermal conductivity of, for example, 300 WZm'K in the plane direction and 20 WZm ⁇ K in the thickness direction is used.
- the downward force of the plasma display device 10 is also directed upward at an appropriate position of the back cover 18 in order to escape the high-temperature air staying in the internal space of the casing 120 of the plasma display device 10 to the outside.
- a plurality of air intake / exhaust holes 19 for forming air convection are provided.
- a specific arrangement example of the air intake / exhaust holes 19 is the same as that of the third embodiment described later. This will be described in detail in relation to Next, the effect of the plasma display device 10 will be described with reference to FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- the PDP 11 is fixed to the housing 120 on a cross section different from the cross section shown in FIG.
- members that mainly generate heat are the PDP 11, electronic components 16 a to 16 e mounted on the circuit board 17, and the like.
- these electronic components for example, the amount of heat generated from the CPU, power transistors 16a, 16c, etc. is large.
- the plasma display device of the conventional configuration has a defect that the vicinity of a high temperature component such as a PDP or an electronic component in the casing is locally high.
- the graph eye sheet 140 is attached to the inner surface of the casing 120, and the graph eye sheet 140 has a thickness of 300 WZm • K in the surface direction. Since the heat conductivity in the direction is 20 WZm'K, the heat generated from the PDP 11 and the electronic components 16a to 16e reaches the nearby graph eye sheet 140 via air, and then the graph eye sheet 140 After being diffused in the plane direction, the light is transmitted to the entire casing 120. As a result, the housing 120 can be prevented from becoming locally hot.
- casing 120 is locally heated to a high temperature as in the conventional configuration.
- the heat dissipation efficiency of the housing 120 is higher than the case.
- a plasma display device according to a second embodiment will be described with reference to FIGS.
- the second embodiment is connected to the first embodiment by a heat transfer member that transfers heat between the electronic component and the chassis and the graph eye sheet.
- This is the difference in configuration, and the others are the same as in the first embodiment described above. Therefore, the difference will be described mainly, and the description of the overlapping configuration will be omitted.
- FIG. 3 is a cross-sectional view of an example of a plasma display device according to the second embodiment.
- the aluminum chassis 12 (the display panel 11 via the chassis 12) and the graphite sheet 140 are connected by a heat transfer member 71 having an aluminum force.
- the adhesion between the heat transfer member 71, the chassis 12, and the graphite sheet 140 is enhanced by applying, for example, a silicone paste.
- a silicone paste As described above, as a material of the main heat transfer member that connects the chassis 12 and the graphite sheet 140 so as to be capable of heat transfer, an aluminum bar member is used, and one end of the bar member and the chassis 12 are connected to each other.
- Adhesive material such as silicone resin (grease-like or sheet-like material) is attached to the connecting part between the two and the other connecting part between the other end of the bar member and the graphite sheet 140. It is desirable to use it.
- chassis 12 and the heat transfer member 71 are made of the same type of metal (here, aluminum) having excellent heat conduction characteristics, the chassis 12 and the heat transfer member 71 are In some cases, it can be physically processed to reduce manufacturing costs.
- the power transistor 16a that generates a large amount of heat and the graphite sheet 140 are connected by a silicone rubber 72 as a heat transfer member.
- the adhesion between the silicone rubber 72, the power transistor 16a and the graphite sheet 140 is enhanced by applying, for example, a silicone paste.
- the connection to the plasma display device 10 can be reduced compared to the connection with a metal having poor flexibility.
- the vibration impact of the power transistor 16a may be alleviated during unexpected excitation.
- FIG. 4 is a cross-sectional view of another example of the plasma display device according to the second embodiment, which is different from the plasma display device shown in FIG.
- the power transistor 16a is sandwiched between a spring plate 81 and a metal heat radiating plate 82 made of, for example, aluminum and having heat radiating fins.
- the metal heat sink 82 and the graphite sheet 140 are connected by a silicone rubber 83 to enhance adhesion. Since this configuration is described in Japanese Patent Application Laid-Open No. 2000-338904, detailed description thereof is omitted.
- the heat dissipation efficiency of the electronic component 16a is improved by transferring heat to the metal heat sink 82 having a heat dissipation fin and high thermal conductivity, so the electronic component 16a becomes hot. "Become.
- the heat generated from the electronic component 16a is transmitted to the graphite sheet 140 through the metal heat sink 82 and the silicone rubber 83 with high efficiency, so that the electronic component 16a can be prevented from becoming high temperature.
- the electronic component 16d is also sandwiched between the spring plate 81 and the metal heat radiating plate 82, and the metal heat radiating plate 82 and the graph sheet 140 are connected by the silicone rubber 73. This suppresses the electronic component 16d from becoming high temperature.
- FIG. 5 is a cross-sectional view of another example of the plasma display device according to the second embodiment, and is configured differently from the plasma display device shown in FIGS. 3 and 4.
- a ceramic sheet 91 having a high emissivity is attached to the surface of the CPU 16f mounted on the circuit board 17.
- a ceramic sheet 92 is adhered to a region of the surface of the graphite sheet 140 facing the ceramic sheet 91.
- the heat generated from the CPU 16 f is transmitted to the ceramic sheet 91 and then radiated as infrared rays from the ceramic sheet 91.
- the infrared rays are mainly absorbed by the ceramic sheet 92 disposed at a position opposite to the ceramic sheet 91 and transferred as heat from the ceramic sheet 92 to the graphite sheet 140.
- the heat generated from the CPU 16f is transferred to the graph eye sheet 140 with high efficiency, so that the CPU 16f can be prevented from reaching a high temperature.
- a ceramic sheet 93 is attached to a predetermined region of the chassis 12. Then, a ceramic sheet 94 is adhered to a region facing the ceramic sheet 93 on the surface of the graph eye sheet 140.
- the heat generated from the PDP 11 and transferred to the chassis 12 is transmitted to the ceramic sheet 93 and then radiated as infrared rays from the ceramic sheet 93.
- the infrared rays are mainly absorbed by the ceramic sheet 94 disposed at a position opposite to the ceramic sheet 93 and transferred as heat from the ceramic sheet 94 to the graph eye sheet 140.
- the heat generated from the PDP 11 is transmitted to the graph eye sheet 140 with high efficiency, so that the P DPI 1 can be prevented from becoming high temperature.
- the emissivity of heat can be improved by matting the surface. Therefore, instead of using the ceramic sheet 93, the surface of the chassis 12 is frosted to radiate heat from the chassis 12 as infrared rays, and the ceramic sheets 92 and 94 attached to the graphite sheet 140 apply the infrared rays. By absorbing the heat, heat may be transferred from the chassis 12 to the graph eye sheet 140.
- chassis 12 when the chassis 12 also has an aluminum force, it is preferable to treat the surface of the chassis 12 with black alumite in order to increase the heat emissivity of the chassis 12.
- the heat is transmitted spatially by the radiation and absorption of heat.
- the heat transfer means for transmitting heat can be made small and light.
- the heat transfer members 71 to 73, 82, 83, etc. need to be designed so as to be insulated from the control circuit.
- the graph eye sheet 140 is provided on the inner surface of the casing 120. Since the graphite sheet 140 has a thermal conductivity of 300 WZm'K in the surface direction and 20 W Zm'K in the thickness direction, the PDP11 and electronic components 16a, 16d, 16f, 16g The generated heat is transmitted to the graph eye sheet 140 by each of the above-described heat transfer means, and then diffused in the surface direction by the graph eye sheet 140 and then transmitted to the entire housing 120. It is possible to prevent local high temperature.
- the heat generated from PDP11 and electronic components 16a, 16d, 16f, and 16g is intentionally concentrated on each of the heat transfer means with excellent thermal conductivity to efficiently radiate heat quickly to the housing 120 side.
- the force that the casing 120 located in the vicinity of the heat transfer means is easily heated locally is such a demerit.
- the use of the sheet 140 is preferable because it can be improved.
- casing 120 is locally heated to a high temperature as in the conventional configuration.
- the heat dissipation efficiency of the housing 120 is higher than the case.
- the heat generated by the PDP 11 and the electronic components 16a to 16e is generated by the inner surface portion 126 of the casing 124. Then, it is transmitted to the graph eye sheet 142, diffused in the surface direction in the graph eye sheet 142, and then transmitted to the entire outer surface 127 of the casing 124.
- the graph eye sheet 142 is disposed between the PDP 11 and the electronic components 16a, 16b, 16c, 16d, and 16e and the outer surface 127.
- a new planar material with anisotropic thermal conductivity whose thermal conductivity in the plane direction is higher than that in the thickness direction, will be developed in the future, and this material is required for the casing 120 of the plasma display device.
- forming the casing 120 using the material can also suppress the local temperature of the casing 120 from becoming high temperature and the heat dissipation efficiency of the casing 120. Can be increased.
- the electronic component 16a and the graph eye sheet 140 are connected by the silicone rubber 72 as shown in FIG. 3, and the electronic component 16d and the graph eye sheet 140 are connected as shown in FIG.
- the plate 81, the metal heat sink 82 and the silicone rubber 83 are connected to each other, and the chassis 12 and the graph eye sheet 140 are connected to each other by the ceramic sheets 93 and 94 disposed at the opposite positions as shown in FIG. It is good.
- a plasma display device has been described as an example of a display device using a flat display panel, but in addition to a plasma display device, for example, a liquid crystal display device or a FED (Field Emission Display) device.
- the present invention can be similarly applied to a display device in which the local part of the housing can become high temperature.
- it is possible to suppress the local temperature of the housing from becoming high temperature and to obtain an effect of increasing the heat dissipation effect.
- a graph sheet as a planar heat transfer member having anisotropy, an effect of shielding electromagnetic waves emitted inside the housing can be obtained.
- FIG. 7 is a diagram showing a configuration example of the plasma display device according to the present embodiment
- FIG. 7 (a) is a view of the plasma display device from the back
- FIG. 7 (b)
- FIG. 8 is a cross-sectional view of the plasma display device taken along line IB—IB in FIG. 7 (a).
- Fig. 7 (a) shows a state excluding the back cover 18 described later (hereinafter the same in Fig. 9, Fig. 11, Fig. 12, Fig. 15, Fig. 16, Fig. 17, Fig. 18, and Fig. 19). .
- a substantially rectangular chassis 12 (back member) is mounted on the back of the substantially rectangular PDP 11.
- the chassis 12 is arranged so as to be joined to and fixed to the PI 1, and the chassis 12 is held together with the PDP 11 on the legs 13 that function as a base of the plasma display device 100.
- the front cover 15 (a part of the casing 120 of the plasma display device 100) has an opening corresponding to the display surface of the PDP 11, and an electromagnetic shielding sheet, a color correction film, tempered glass, etc.
- a protection panel 14 configured as described above and functioning as an optical filter is attached to the front cover 15, thereby enabling electromagnetic wave shielding, color purity adjustment, and external impact protection of the plasma display device 100. Note that the protective panel 14 can be directly attached to the surface of the PDP 11.
- a circuit board 17 on which an electronic component 16 such as a dry LSI for driving the PDP 11 through an appropriate spacer S is mounted is fixed to the chassis 12.
- a back cover 18 (a part of the casing 120 of the plasma display device 100) is provided so as to wrap the back surface of the chassis 12 and the circuit board 17 together with the back surface opposite to the display surface of the PDP 11. Functions as a design case of the plasma display device 100 together with the front cover 15.
- the back cover 18 is attached to the leg portion 13, and the back cover 18 and the front cover 15 are joined by appropriate fixing means (adhesion, mechanical fitting, etc.).
- a substantially round or rectangular exhaust hole 19d, 19e is provided.
- a substantially round or rectangular suction hole 19a, 19b and 19c are provided.
- a forced convection of air by an appropriate air fan may be generated to configure the plasma display device with the intake holes 19a, 19b, 19c as exhaust holes and the exhaust holes 19d, 19e as intake holes.
- the plasma display device configured as described above may be beneficial depending on the arrangement of electronic components.
- exhaust air heated by such forced convection is used for indoor heating, for example, it is desirable to exhaust air from below the plasma display device.
- inside of the plasma display device 100 means that the central force of the cross section of the back cover 18 of the plasma display device 100 shown in FIG. It means the area on the center of gravity side of the device 100.
- a plurality of cylindrical rod-like heat transfer members 20a, 20b heat transfer means; rod members
- heat transfer means rod members
- One end of each rod-shaped heat transfer member 20a, 20b is in contact with the PDP 11 through the chassis 12), and the other end force on the back surface of the back cover 18
- the plasma display device 100 is disposed at a proper position so as to be in thermal contact.
- each rod-shaped heat transfer member 20a, 20b extends from the contact position force with the PDP 11 toward the back cover 18 in the thickness direction of the plasma display device, and the circuit board 17 and electronic components mounted thereon The other end of each of the rod-like heat transfer members 20a and 20b is in contact with the back surface of the back cover 18 through the hole formed in the circuit board 17 without coming into contact with 16.
- the plasma display device 100 is arranged side by side in the left-right direction of the plasma display device 100, while the area corresponding to the lower half of the back cover 18 (hereinafter, this area is simply referred to as the lower half)
- Eight rod-shaped heat transfer members 20b that are connected to the PDP 11 so as to be able to move heat are arranged in the left and right direction of the plasma display device 100, and plasma display The device 100 is arranged in two rows in the vertical direction.
- the total number of the rod-like heat transfer members 20b thermally connected to the lower half of the back cover 18 is larger than the total number of the rod-like heat transfer members 20a thermally connected to the upper half of the knock cover 18.
- the rod-like heat transfer members 20 a and 20 b are arranged at appropriate positions inside the plasma display device 100.
- each of the rod-shaped heat transfer members 20a is configured such that the total number of the rod-shaped heat transfer members 20b contacting the lower half of the knock cover 18 is greater than the total number of the rod-shaped heat transfer members 20a contacting the upper half of the notch cover 18. Due to the in-plane arrangement of 20b on the back cover 18, it depends on the degree of heating of the lower half of the back cover 18 due to the heat generated by the PDP 11 and the heat of the high-temperature convection air heated by heat exchange with the electronic components 16 etc. The inventors of the present application believe that the heating degree of the upper half of the knock cover 18 can be well balanced and the in-plane heat distribution on the entire surface of the back cover 18 can be equalized. .
- the heat generated by the circuit board 17 (mainly the electronic component 16 mounted on the circuit board) is dissipated by heat exchange with the convection air flowing inside the plasma display device 100, while the circuit The heat transfer from the board 17 to the PDP 11 is properly blocked (usually, the amount of heat generated by the electronic component 16 is greater than the amount of heat generated by the PDP 11), and the PD generated by the heat generated from the circuit board 17 (mainly the electronic component 16) It is expected that Pl l thermal damage (eg phosphor thermal degradation) can be adequately prevented.
- Pl l thermal damage eg phosphor thermal degradation
- the heat distribution effect of the in-plane heat distribution of the back cover 18 according to the present embodiment makes it possible to properly design the heat dissipation of the plasma display device 100 even if the exhaust or intake fans are reduced or eliminated.
- the noise problem of the plasma display device 100 due to such a fan is solved, and the cost and power associated with the fan installation are saved, which is preferable.
- FIG. 8 is a diagram showing an example of such a cylindrical rod-shaped heat transfer member
- the left diagram in FIG. 8 is a diagram viewed along the longitudinal direction of the rod-shaped heat transfer member.
- the right figure is an example of the rod-like heat transfer member as seen from the direction perpendicular to the longitudinal direction.
- the rod-shaped heat transfer members 20a and 20b in FIG. 8 are configured such that these portions are narrowed so as to minimize the cross section of the central portion in the longitudinal direction.
- the portion corresponding to the minimum cross-sectional area of the cross-section along the heat transfer direction (for example, the rod-shaped heat transfer member shown in Fig. 8
- the rod-shaped heat transfer members 20a and 20b in the longitudinal center portion are regions that govern the amount of heat transfer by heat conduction of the rod-shaped heat transfer members 20a and 2 Ob.
- the soaking effect of the in-plane heat distribution of the back cover 18 brought about by the arrangement of the rod-shaped heat transfer members is the amount of heat transferred between the PDP 11 in the lower half of the knock cover 18 and the back surface of the back cover 18. It should be demonstrated by increasing the amount of heat transferred between the PDP 11 in the upper half of the back cover 18 and the back surface of the back cover 18.
- the rod-shaped heat transfer member 20b disposed in the lower half of the back cover 18 is orthogonal to the heat transfer direction to the back cover 18.
- (Round cut) The sum of the minimum cross-sectional areas of the cross section is the upper half of the back cover 18
- the surface of the back cover 18 according to the present embodiment is made larger than the sum of the minimum cross-sectional areas of the cross-sections (circular cuts) of the rod-shaped heat transfer member 20a arranged in the minute in the direction of heat transfer to the back cover 18. It is thought that the effect of soaking the internal heat distribution can be achieved.
- the material for the rod-like heat transfer members 20a and 20b shown in FIG. 7 it is desirable to use a member having a thermal conductivity of 80 jZmsK from the viewpoint of achieving rapid heat transfer.
- specific material examples of the rod-shaped heat transfer members 20a and 20b include aluminum (thermal conductivity: 237jZmsK), iron (80.
- FIG. 9 is a diagram in which the plasma display according to the present embodiment shown in FIG. 7 is three-dimensionally modeled for numerical calculation. Only the rod-shaped heat transfer member 20b inside the plasma display 100 in FIG. 7 is analyzed. It is modeled as a rod-shaped heat transfer member.
- Fig. 9 (a) is a view of the analysis model for the plasma display device from the back
- Fig. 9 (b) is a cross-sectional view of the analysis model along the ⁇ - ⁇ line in Fig. 9 (a). is there.
- FIG. 12 is a diagram in which the conventional plasma display device shown in FIG. 11 is three-dimensionally modeled for numerical calculation, and is a model for comparison with the analysis result by the analysis model 130 of FIG. Fig. 12 (a) is a view of the analysis model for the plasma display device from the back, and Fig. 12 (b) is a cross-sectional view of the analysis model along the VIB-VIB line in Fig. 12 (a). It is.
- analysis model 130 in Fig. 9 and analysis model 160 in Fig. 12 is simplified compared to plasma display devices 100 and 150 shown in Figs. 7 and 11 within a range that does not affect the numerical calculation. Has been.
- the legs 13, the front cover 15, and the protective panel 14 are forces removed from these analysis models 130 and 160. This has no influence on the evaluation of the numerical analysis.
- the rod-shaped heat transfer member 20 shown in the analysis models 130 and 160 is also connected to the electronic component 16. Simplified and modeled. Thus, the number of elements corresponding to the unit analysis area for numerical calculation is reduced as much as possible to save the storage capacity and calculation time of the computer.
- the substantially rectangular back with the front open A substantially rectangular PDP11 is placed on the open surface of the cover 18 so that it also serves as a lid, and a substantially rectangular chassis 12 that fixes the PDP11 is placed in contact with the back of the PDP11! RU
- a circuit board 17 is disposed on the rear surface of the chassis 12 via a spacer S, and an electronic component 16 is mounted on the circuit board 17.
- the shape of the electronic component 16 in plan view is modeled as a rectangle arranged in substantially the entire area of the circuit board 17 for the purpose of simplifying the model.
- the eight rod-shaped heat transfer members 20 are connected so that heat can be transferred between the back surface of the lower half of the back cover 18 and the electronic component 16. Is disposed only in the lower half of the back cover 18.
- the in-plane arrangement pattern of the rod-shaped heat transfer member 20 on the back cover 18 is the same as the arrangement pattern of the rod-shaped heat transfer member 20b of the plasma display device 100 (FIG. 7).
- each bar-shaped heat transfer member 20 is in contact with the electronic component 16, and each bar-shaped heat transfer member 20 extends from the contact position toward the back cover 18 in the thickness direction of the plasma display device. The other end of the member 20 is in contact with the back surface of the back cover 18.
- the heating value of the PDP 11 and the electronic component 16 was set to 200 W.
- the thermal conductivity corresponding to the material of each member is input, and the thermal resistance between the members is not set.
- Aluminum (thermal conductivity: 237 J, msK) was selected as the material for the rod-shaped heat transfer member 20 and the back cover 18.
- An appropriate opening ratio corresponding to the opening 19g is input to the element on the upper end surface of the knock cover 18, and an appropriate opening ratio corresponding to the opening 19f is also input to the element on the lower end surface of the back cover 18.
- air is ventilated between the inside of the analysis model 130 and the outside of the analysis model 130.
- the analysis model 160 shown in FIG. 12 is the same as the analysis model 130 shown in FIG. 9 except for the number of rod-shaped heat transfer members and the in-plane arrangement of the rod-shaped heat transfer members on the back cover 18, where The description of the configuration common to both is omitted.
- the three rod-shaped heat transfer connections are made so that heat transfer is possible between the back surface of the lower half of the knock cover 18 and the electronic component 16.
- Three rod-shaped heat transfer members 20 are arranged side by side in the left-right direction of the analytical model 160 and connected so that heat transfer is possible between the rear surface of the upper half of the knock cover 18 and the electronic component 16.
- the members 20 are arranged side by side in the left-right direction of the analysis model 160. That is, the rod-like heat transfer members 20 are evenly arranged on the lower half and the upper half of the back cover 18.
- thermal fluid numerical calculation of analysis model 130 shown in FIG. 9 and analysis model 160 shown in FIG. 12 is a general-purpose thermal fluid analysis program (thermal fluid analysis software manufactured by Software Cradle Co., Ltd .; STREAM (registered trademark)) Was executed using.
- the finite volume method As a specific analysis method, a discretization method called the finite volume method is used, and the analysis target region including each analysis model 130, 160 is divided into fine spaces with hexahedral element forces (number of elements). About 30000), solving general relations governing heat transfer and fluid flow based on the balance of heat and fluid exchanged between these fine elements, and repeating until the result converges The operation will be executed.
- FIG. 10 is a temperature contour diagram of the surface of the back force bar obtained based on the temperature data of each element of the analysis model shown in FIG. 9 (the difference from room temperature (20 ° C) is shown).
- Fig. 13 shows the temperature contour map of the back cover surface obtained based on the temperature data of each element of the analysis model shown in Fig. 12 (difference from room temperature (20 ° C)! ).
- Fig. 14 is obtained by appropriately changing the arrangement of the rod-shaped heat transfer members in the analysis model shown in Fig. 9.
- the horizontal axis shows the result of dividing the number of bar-shaped heat transfer members 20 arranged in the lower half of the back cover by the total number of bar-shaped heat transfer members 20.
- the vertical axis shows the maximum temperature of the back cover surface (difference from room temperature (20 ° C)) on the vertical axis. ).
- the back force is within the range of (number of bar-shaped heat transfer members 20 arranged in the lower half of the back cover 18 Z total number of bar-shaped heat transfer members 20) ⁇ 0.6. It is estimated that the maximum temperature of the surface of the bar 18 (difference from room temperature) can be adjusted to 15 ° C. or less, which is preferable because the temperature of the surface of the back cover 18 can be appropriately equalized.
- the number of the rod-shaped heat transfer members 20 in the lower half of the knock cover 18 (corresponding to the sum of the minimum cross-sectional areas of the bar-shaped heat transfer members 20 arranged in the lower half of the back force bar 18) is 1.5 or more divided by the number of rod-shaped heat transfer members 20 in the upper half of 18 (corresponding to the sum of the above minimum cross-sectional areas of the bar-shaped heat transfer members 20 arranged in the upper half of 18) Therefore, uneven distribution of more rod-shaped heat transfer members 20 in the lower half of the upper half of the knock cover 18 may cause the temperature of the surface of the back cover 18 to increase. It is thought that the viewpoint power of temperature uniformity is also desirable.
- FIG. 15 is a diagram showing the configuration of the plasma display device according to the first modification of the third embodiment
- FIG. 15 (a) is a diagram of the plasma display device as viewed from the back
- FIG. b) is a sectional view of the plasma display device taken along line IXB-IXB in FIG.
- the same components as those in the third embodiment are denoted by the same reference numerals, and description thereof is omitted.
- the first portion 30A of the annular heat transfer member 30 is placed at the right and left positions of the plasma display device 190 at PDP1 1 (exactly The second part 30B of the annular heat transfer member 30 and the back surface of the lower half of the back cover 18 by removing the first and second parts 30A and 30B.
- the annular heat transfer member 30 is configured such that the partial force PDP 11 and the lower half of the back cover 18 are arranged to be able to transfer heat.
- the second portion 30B of the annular heat transfer member 30 is in contact with the back surface of the back cover 18 in the lower half of the back cover 18.
- the first portion 30A of the annular heat transfer member 30 is extended as much as possible along the vertical direction of the PDP 11 so as to straddle the lower half from the lower half of the back cover 18 as shown in FIG. 15 (c). Is preferable. As a result, more heat generated in the PDP 11 can be conducted to the lower half of the back cover 18.
- FIG. 16 is a diagram showing a configuration of a plasma display device according to the second modification of the third embodiment.
- FIG. 16 (a) is a view of the plasma display device as viewed from the back
- FIG. 16 (b) is a cross-sectional view of the plasma display device along the line XB-XB in FIG. 16 (a).
- the same components as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.
- a rod-shaped heat transfer member 20c is provided to connect the circuit board 17 on which the electronic component 16 is mounted so as to be capable of heat transfer, and the back cover 18 and the PDP 11 shown in FIG.
- a rod-like heat transfer member 20d that connects the back cover 18 and the circuit board 17 on which the electronic component 16 is mounted so as to be capable of heat transfer is provided.
- the knock cover 18 and the circuit board 17 on which the electronic component 16 is mounted can be thermally transferred to the upper half of the knock cover 18.
- the three rod-shaped heat transfer members 20c connected to the circuit board 17 are arranged side by side in the left-right direction of the plasma display device 200, while the circuit board 17 on which the back cover 18 and the electronic component 16 are mounted in the lower half of the back cover 18 Are connected to the back cover 18 and the PDP 11 through the through hole of the circuit board 17 above the rod-shaped heat transfer member 20d.
- Four rod-like heat transfer members 20 b (second stage) connected so as to be capable of heat transfer are arranged side by side in the left-right direction of the plasma display device 200.
- FIG. 17 is a diagram showing a configuration of a plasma display device according to Modification 3 of the third embodiment
- FIG. 17 (a) is a diagram of the plasma display device as viewed from the back
- FIG. b) It is sectional drawing of the plasma display apparatus along the XIB-XIB line of (a).
- the same components as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.
- the plasma display device 210 of this modification instead of the columnar rod-shaped heat transfer members 20a and 20b shown in FIG. 7, a plurality of annular heat transfer members formed in a ring shape by joining rods having a substantially rectangular cross section. 30, 31 (heat transfer means; annular member) are provided.
- the configuration of the annular heat transfer member 30 is the same as that described in the first modification, and thus detailed description thereof is omitted.
- the knock cover 18 is equally divided in the vertical direction, the first portion 31A of the annular heat transfer member 31 is placed in the electronic component 16 (exactly in the center of the plasma display device 210).
- the second part of the annular heat transfer member 30 and the back surface of the lower half of the 31B force back cover 18 to contact the first and second parts.
- the partial force of the annular heat transfer member 31 excluding 31A and 31B is disposed between the electronic component 16 and the lower half of the back cover 18 so as to be capable of heat transfer.
- FIG. 18 is a diagram showing the configuration of the plasma display device according to the modification 4 of the third embodiment
- FIG. 18 (a) is a diagram of the plasma display device as viewed from the back
- FIG. FIG. 18 (b) is a cross-sectional view of the plasma display device taken along line ⁇ - ⁇ in FIG. 18 (a).
- the same components as those in the third embodiment are denoted by the same reference numerals and description thereof is omitted.
- a rod-shaped heat transfer member 20a that connects the back cover 18 and the PDP 11 shown in FIG.
- three rod-shaped heat transfer members 20c that connect the back cover 18 and the circuit board 17 on which the electronic component 16 is mounted so as to be capable of heat transfer are provided, and in the lower half of the knock cover 18, Instead of the rod-shaped heat transfer member 20b that connects the back cover 18 and the PDP 11 shown in Fig. 7 so that heat transfer is possible, the knock cover 18 and the circuit board 17 on which the electronic component 16 is mounted are connected so that heat transfer is possible.
- Eight rod-shaped heat transfer members 20d are provided.
- the in-plane arrangement pattern of the rod-shaped heat transfer members 20c, 20d on the back cover 18 is the same as the arrangement pattern described in the third embodiment (FIG. 7).
- the chassis 12 disposed on the back surface of the PDP 11 and the PDP 11 are held via the chassis 12 and the plasma display is performed.
- the heat transfer member 40 heat transfer means arranged so as to be able to transfer heat between the legs 13 also functioning as a support of the device 220 is attached to the legs 13 so as to form a part of the legs 13. It is formed as a unit.
- examples of desirable materials for the heat transfer member 40 and the leg 13 are aluminum (thermal conductivity: 237jZmsK), iron (80. jZmsK), copper (401jZm sK) as described in the third embodiment. ), Magnesium (156jZmsK), silver (429jZmsK), graphite (parallel to the layer) (196 Oj / msK) and diamond (1360-2320j / msK).
- the heat generated by both the PDP 11 and the circuit board 17 (mainly the electronic component 16) is dissipated to the back cover 18.
- the direct heat transfer between the PDP 11 and the circuit board 17 via the heat transfer member is blocked, and the heat damage of the PDP 11 due to the heat generated from the circuit board 17 can be prevented.
- FIG. 19 is a diagram showing a configuration of a plasma display device according to Modification 5 of the third embodiment.
- FIG. 19 (a) is a diagram of the plasma display device as viewed from the back
- FIG. FIG. 19 (b) is a cross-sectional view of the plasma display device taken along line ⁇ - ⁇ in FIG. 19 (a).
- the same components as those in the third embodiment are designated by the same reference numerals, and the description thereof is omitted.
- a rod-like heat transfer member 20a that connects the back cover 18 and the PDP 11 shown in FIG.
- three rod-like heat transfer members 20c are provided to connect the back cover 18 and the circuit board 17 on which the electronic component 16 is mounted so that heat transfer is possible, and the lower half of the knock cover 18 is shown in FIG.
- the rod-shaped heat transfer member 20b that connects the back cover 18 and the PDP 11 so that they can be moved by heat
- 8 rods that connect the knock cover 18 and the circuit board 17 on which the electronic components 16 are mounted so that they can move by heat.
- a heat transfer member 20d is provided.
- the in-plane arrangement pattern of the rod-shaped heat transfer members 20c, 20d on the back cover 18 is the same as the arrangement pattern described in the third embodiment (FIG. 7).
- the chassis 12 disposed on the back surface of the PDP 11 and the PDP 11 are held via the chassis 12 and the plasma display is performed.
- the leg portion 13 that also functions as a support for the device 230 is connected to each other via a rod-like heat transfer member 50 (heat transfer means) that extends integrally with the lower end portion of the chassis 12. Yes.
- the heat transfer member 50 is connected to the back cover 18 so as to be capable of heat transfer by appropriate fixing means.
- examples of desirable materials for the heat transfer member 50 and the leg 13 are aluminum (thermal conductivity: 237jZmsK), iron (80. jZmsK), copper (401jZm sK) as described in the third embodiment. ), Magnesium (156jZmsK), silver (429jZmsK), graphite (parallel to the layer) (196 Oj / msK) and diamond (1360-2320j / msK).
- the PDP 11 and the circuit board are dissipated in the back cover 18 while the heat generated by both the PDP 11 and the circuit board 17 (mainly the electronic component 16) is radiated to the back cover 18.
- the direct heat transfer through the heat transfer member between 17 is blocked, and the heat damage of the PDP 11 due to the heat generated from the circuit board 17 can be prevented.
- the case-equalizing technology for the case of the plasma display device has been described as an example of a display device using a flat display panel, but it is the same as in the first and second embodiments.
- the technology described here is not limited to the application of a plasma display device, but has a rectangular and flat housing, and a flat panel display device having a member that generates heat in the internal space of the housing. Any device can be applied as long as it is.
- a rod-like backlight light source as a heating element inside the housing of the liquid crystal display device, and this technology is considered useful.
- the backlights of liquid crystal display devices, field emission displays (FEDs), and organic EL panels also generate heat, so this technology can be applied to liquid crystal display devices, FED display devices, and organic EL display devices.
- the plasma display device includes a soaking effect on the surface temperature of the housing by the graph eye sheet housing arrangement of the second embodiment, and the lower half of the housing of the heat transfer member of the third embodiment. It is a device that can achieve both the effect of uniforming the surface temperature of the housing due to the uneven distribution.
- each plasma display device shown in the third embodiment (and its modification) (the device shown in FIGS. 7, 15, 16, 17, 18, 18 and 19) Even if the configuration of these plasma display devices is modified so as to incorporate the soaking design by the graph eye sheet housing arrangement (second embodiment), the same effect can be obtained. Since the configuration of is easily understood from the following description, the description of the configuration is omitted here.
- FIG. 20 is a cross-sectional view showing a configuration example of the plasma display device according to the fourth embodiment. More specifically, FIG. 20 shows the third embodiment in the plasma display device described in FIG. It is sectional drawing of the example of an apparatus incorporating the housing
- FIG. 21 is a cross-sectional view showing a configuration example of the plasma display device according to the fourth embodiment. More specifically, the plasma display device described in FIG. 5 includes the third embodiment. It is sectional drawing of the example of an apparatus incorporating the housing
- FIG. 20 Of the components of the plasma display device shown in FIG. 20 (or FIG. 21), FIG. In addition, the same reference numerals are given to the same constituent members as those in FIG. 5), and description of the constituent members common to both will be omitted or simplified.
- the case 1 20 when the aluminum heat transfer member 171 (heat transfer means) connecting the chassis 12 and the graph eye sheet 140 equally divides the case 120 in the vertical direction, the case 1 20 is located in the lower half area.
- a ceramic sheet 193 (a radiating member as a heat transfer means) is provided in the region of the chassis 12 corresponding to the lower half of the casing 120. Is attached, and a ceramic sheet 194 (a radiating member as a heat transfer means) is attached to a region of the surface of the graph eye sheet 140 facing the ceramic sheet 193.
- the profile shown in FIG. 20 is used from the viewpoint of equalizing the housing surface temperature based on the balance between heat radiation by the heat transfer means and heat radiation by the convection air.
- the sum of the minimum cross-sectional areas of heat transfer member 171 (aluminum) and heat transfer member 73 (silicone rubber) placed in the lower half of the case 120 is placed in the upper half of the case 120
- the value divided by the sum of the minimum cross-sectional areas of the heat transfer member 72 (silicone rubber) is preferably 1.5 or more.
- the sum of the surface areas of the ceramic sheet 90 and the ceramic sheet 193 disposed in the region corresponding to the lower half of the casing 120 is the upper half of the casing 120. It is desirable that the value obtained by dividing the total surface area of the ceramic sheet 91 disposed in the region corresponding to is 1.5 or more.
- the graph eye sheet 140 is adhered to the inner surface of the casing 120, and the graph eye sheet 140 is 300 WZm * K in the surface direction and in the thickness direction. Since it has a thermal conductivity of 20 WZm'K, the heat generated from the PDP 11 and the electronic components 16a, 16d, 16f, and 16g is generated by the above-mentioned heat transfer members (heat transfer means). After being transmitted to 140, after being diffused in the plane direction by the graph eye sheet 140, it is transmitted to the entire case 120, so that the case 120 can be prevented from becoming locally hot.
- the heat generated from the PDP 11 and the electronic components 16a, 16d, 16f, and 16g is intentionally concentrated on each of the heat transfer members having excellent thermal conductivity, and the heat is quickly radiated to the housing 120 side efficiently.
- This is a reflective disadvantage of adopting a design philosophy such as The casing 120 located in the vicinity of these heat transfer members was easily heated locally, but such disadvantages can be improved by employing the graphite sheet 140 of the present embodiment. .
- the area (minimum cross-sectional area or surface area) of the heat transfer member located in the lower half of the casing 120 is the heat transfer located in the upper half of the back cover 18. If the area (minimum cross-sectional area or surface area) of the member is larger, the heat transfer means out of the heat generated by the heating elements (PDP and electronic parts) is arranged by the in-plane arrangement of the heat transfer means on the casing 120. The balance between the degree of heating in the lower half of the case 120 due to the heat transmitted through the heat and the degree of heating in the upper half of the case 120 due to the heat of the high-temperature convection air heated by heat exchange with such a heating element is well balanced. As a result, the surface of the casing 120 can be evenly heated.
- the casing surface temperature distribution effect by the arrangement of the graphite sheet casing and the casing by the uneven distribution of the lower half of the casing of the heat transfer member The optimal heat dissipation design of the plasma display device has been made so that the surface temperature can be equalized at the same time.
- the display device of the present invention it is possible to equalize the surface of the casing for a flat type display device, which is useful, for example, as a display device for a flat-screen television.
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/594,155 US7705536B2 (en) | 2005-01-25 | 2006-01-25 | Display device |
JP2007500536A JPWO2006080335A1 (ja) | 2005-01-25 | 2006-01-25 | 表示装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-017423 | 2005-01-25 | ||
JP2005017423 | 2005-01-25 | ||
JP2005085440 | 2005-03-24 | ||
JP2005-085440 | 2005-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006080335A1 true WO2006080335A1 (ja) | 2006-08-03 |
Family
ID=36740365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/301113 WO2006080335A1 (ja) | 2005-01-25 | 2006-01-25 | 表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7705536B2 (ja) |
JP (1) | JPWO2006080335A1 (ja) |
WO (1) | WO2006080335A1 (ja) |
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JP2008145795A (ja) * | 2006-12-12 | 2008-06-26 | Hitachi Ltd | 画像表示装置 |
WO2008111157A1 (ja) * | 2007-03-12 | 2008-09-18 | Hitachi, Ltd. | 平面表示装置 |
JP2008292824A (ja) * | 2007-05-25 | 2008-12-04 | Hitachi Ltd | 平面型表示機器及びその製造方法 |
JP2009145545A (ja) * | 2007-12-13 | 2009-07-02 | Panasonic Corp | プラズマディスプレイ装置 |
JP2009157131A (ja) * | 2007-12-27 | 2009-07-16 | Hitachi Ltd | プラズマディスプレイ装置 |
JP2009163152A (ja) * | 2008-01-10 | 2009-07-23 | Panasonic Corp | ディスプレイ装置 |
JP2010002890A (ja) * | 2008-05-22 | 2010-01-07 | Jfe Steel Corp | ディスプレイ装置 |
JP2011007986A (ja) * | 2009-06-25 | 2011-01-13 | Seiko Epson Corp | 電気光学装置、および電子機器 |
JP2011520197A (ja) * | 2008-05-07 | 2011-07-14 | サムスン エレクトロニクス カンパニー リミテッド | ディスプレイユニット及びこれを備えた自動販売機 |
JP2014010226A (ja) * | 2012-06-28 | 2014-01-20 | Nippon Seiki Co Ltd | 表示装置 |
WO2018163694A1 (ja) * | 2017-03-07 | 2018-09-13 | シャープ株式会社 | 表示装置およびテレビジョン受信機 |
JP2021117288A (ja) * | 2020-01-23 | 2021-08-10 | シャープ株式会社 | 表示装置 |
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KR101307547B1 (ko) * | 2006-11-27 | 2013-09-12 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시장치 |
JP2009175230A (ja) * | 2008-01-22 | 2009-08-06 | Sharp Corp | 表示装置 |
JP5202220B2 (ja) * | 2008-09-30 | 2013-06-05 | 三洋電機株式会社 | 画像表示装置 |
JP5374166B2 (ja) * | 2009-01-09 | 2013-12-25 | キヤノン株式会社 | 薄型パネル表示装置 |
TWI587734B (zh) * | 2009-03-26 | 2017-06-11 | 精工愛普生股份有限公司 | 有機el裝置、有機el裝置之製造方法、及電子機器 |
JP2011039152A (ja) * | 2009-08-07 | 2011-02-24 | Sanyo Electric Co Ltd | 表示装置、及びカバー部材 |
JP5381729B2 (ja) * | 2010-01-12 | 2014-01-08 | セイコーエプソン株式会社 | 電気光学装置 |
CN103796486B (zh) * | 2012-10-31 | 2017-02-08 | 英业达科技有限公司 | 电子装置 |
JP6291690B2 (ja) | 2014-06-26 | 2018-03-14 | 株式会社Joled | 有機el表示装置 |
KR102433755B1 (ko) * | 2015-07-01 | 2022-08-19 | 삼성전자주식회사 | 감전 방지 기능을 가지는 방열 기판 및 이를 포함하는 전자 장치 |
CN105283040B (zh) * | 2015-10-23 | 2019-04-26 | 联想(北京)有限公司 | 一种散热单元和电子设备 |
US10429908B2 (en) * | 2016-03-28 | 2019-10-01 | Microsoft Technology Licensing, Llc | Black body radiation in a computing device |
KR20200094243A (ko) * | 2019-01-29 | 2020-08-07 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20230049704A (ko) * | 2020-08-13 | 2023-04-13 | 다이나스캔 테크놀로지 코포레이션 | 전자 디스플레이 조립체 및 양면 디스플레이 |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008145795A (ja) * | 2006-12-12 | 2008-06-26 | Hitachi Ltd | 画像表示装置 |
WO2008111157A1 (ja) * | 2007-03-12 | 2008-09-18 | Hitachi, Ltd. | 平面表示装置 |
JP2008292824A (ja) * | 2007-05-25 | 2008-12-04 | Hitachi Ltd | 平面型表示機器及びその製造方法 |
JP2009145545A (ja) * | 2007-12-13 | 2009-07-02 | Panasonic Corp | プラズマディスプレイ装置 |
JP2009157131A (ja) * | 2007-12-27 | 2009-07-16 | Hitachi Ltd | プラズマディスプレイ装置 |
JP2009163152A (ja) * | 2008-01-10 | 2009-07-23 | Panasonic Corp | ディスプレイ装置 |
JP2011520197A (ja) * | 2008-05-07 | 2011-07-14 | サムスン エレクトロニクス カンパニー リミテッド | ディスプレイユニット及びこれを備えた自動販売機 |
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JP2010002890A (ja) * | 2008-05-22 | 2010-01-07 | Jfe Steel Corp | ディスプレイ装置 |
JP2011007986A (ja) * | 2009-06-25 | 2011-01-13 | Seiko Epson Corp | 電気光学装置、および電子機器 |
JP2014010226A (ja) * | 2012-06-28 | 2014-01-20 | Nippon Seiki Co Ltd | 表示装置 |
WO2018163694A1 (ja) * | 2017-03-07 | 2018-09-13 | シャープ株式会社 | 表示装置およびテレビジョン受信機 |
JP2018146859A (ja) * | 2017-03-07 | 2018-09-20 | シャープ株式会社 | 表示装置およびテレビジョン受信機 |
JP2021117288A (ja) * | 2020-01-23 | 2021-08-10 | シャープ株式会社 | 表示装置 |
JP7397689B2 (ja) | 2020-01-23 | 2023-12-13 | シャープ株式会社 | 表示装置 |
Also Published As
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US7705536B2 (en) | 2010-04-27 |
US20070216273A1 (en) | 2007-09-20 |
JPWO2006080335A1 (ja) | 2008-06-19 |
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