Classifications

• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F30/00—Computer-aided design [CAD]
  • G06F30/30—Circuit design
  • G06F30/39—Circuit design at the physical level
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
  • G06F2119/18—Manufacturability analysis or optimisation for manufacturability
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
  • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

• the present invention relates generally to integrated circuit (IC) design, and more particularly, to IC design providing substantial matching functioning of circuit elements despite use of auto-generated dummy shapes.
• Auto-generated dummy shapes are typically located on a consistent grid across an IC design such that different instances of the circuit element may find themselves in substantially different local environments. That is, there is no guarantee that different instances of the same circuit element will see the same local environment, e.g., dummy fill and hole shapes, when placed within the IC design. Any resulting mismatch in electrical parameters (e.g., resistance, capacitance, etc.) is unknown to the designer, and acts to degrade the function of the precision circuits in question. In order to address this issue, many designers attempt to inhibit the automatic generation of dummy shapes in the vicinity of sensitive circuits, and place all required dummy shapes by hand. This approach, however, is more difficult for the designer, and is generally detrimental to the overall manufacturability and process window.
• electrical parameters e.g., resistance, capacitance, etc.
• the invention includes methods, systems and program products that control placement of dummy shapes about sensitive circuit elements such that the dummy shapes are at least substantially similar for each circuit element even though the dummy shapes are auto-generated.
• the invention includes providing a dummy shape pattern's pitch information to a designer, and allowing placement of circuit elements at integer multiples of one or more of the pitches such that the dummy shapes are at least substantially similar about each instance of the circuit element.
• Another embodiment includes allowing placement of a marker about a circuit element to indicate an area in which dummy shapes are to be substantially identical, and then using the marker to place the circuit element. Dummy shapes generated within the marker ensure substantially identical dummy shapes for each instance of the circuit element.
• the invention also includes the integrated circuits formed.
• a first aspect of the invention is directed to a method of forming part of an integrated circuit, the method comprising the steps of: providing a dummy shape pattern having an X pitch and a Y pitch between dummy shapes within the dummy shape pattern; allowing placement of a plurality of substantially identical circuit elements on a substrate, the circuit elements spaced apart an integer multiple of at least one of the X pitch and the Y pitch; and generating the circuit elements and the dummy shape pattern between the circuit elements to provide substantially similar dummy shapes adjacent to each of the circuit elements.
• a second aspect of the invention is directed to an integrated circuit comprising: a dummy shape pattern on a substrate, the dummy shape pattern having an X pitch and a Y pitch between dummy shapes within the dummy shape pattern; and a plurality of substantially identical circuit elements on the substrate, the circuit elements spaced apart an integer multiple of at least one of the X pitch and the Y pitch such that substantially similar dummy shapes are adjacent to each of the circuit elements.
• a third aspect of the invention is directed to a computer program product comprising a computer useable medium having computer readable program code embodied therein for designing an integrated circuit (IC) using a plurality of identical circuit elements, the program product comprising: program code configured to obtain an X pitch and a Y pitch of dummy shapes within a dummy shape pattern for an IC design; and program code configured to place the plurality of substantially identical circuit elements spaced apart an integer multiple of at least one of the X pitch and the Y pitch of dummy shapes to provide substantially similar dummy shapes adjacent to each of the circuit elements.
• a fourth aspect of the invention is directed to a computer program product comprising a computer useable medium having computer readable program code embodied therein for ensuring substantially identical dummy shapes for a circuit element during design of an integrated circuit (IC), the program product comprising: program code configured to obtain a circuit element to be used multiple times within an IC design; program code configured to selectively form a marker about the circuit element to indicate an area in which dummy shapes about the circuit element are to be substantially identical; and program code configured to use the marker to identify placement of copies of the circuit element in the IC design.
• a fifth aspect of the invention is directed to a method of ensuring substantially identical dummy shapes for a circuit element during design of an integrated circuit (IC), the method comprising the steps of: receiving an IC design including a marker indicating an area about the circuit element in which dummy shapes about the circuit element are to be substantially identical; forming the circuit element multiple times within the IC design; and generating dummy shapes including substantially identical dummy shapes about each circuit element within the area indicated by a respective marker.
• a sixth aspect of the invention relates to an integrated circuit comprising: a plurality of substantially identical circuit elements on a substrate, each circuit element having an area about the circuit element in which dummy shapes are substantially identical to dummy shapes about each other circuit element.
• FIG. 1 shows a block diagram of a design environment according to the invention.
• FIG. 2 shows a flow diagram of a method according to a first embodiment of the invention.
• FIG. 3 shows an example circuit element.
• FIG. 4 shows the example circuit element of FIG. 3 surrounded by auto-generated dummy shapes according to a dummy shape pattern.
• FIG. 5 shows details of the dummy shape pattern of FIG. 4.
• FIG. 6 shows placement of the example circuit element of FIG. 3 on a substrate as part of an integrated circuit (IC) design.
• FIG. 7 shows generation of dummy shapes about the IC design of FIG. 6.
• FIG. 8 shows a flow diagram of a method according to a second embodiment of the invention.
• FIG. 9 shows the example circuit element of FIG. 3 including a marker indicating an area in which dummy shapes are to be substantially identical for each instance of the circuit element.
• FIG. 10 shows the marker and circuit element of FIG. 9 used in an IC design and the dummy shapes generated thereabout.
• FIG. 28 BEST MODE FOR CARRYING OUT THE INVENTION
• FIG. 1 is a block diagram of a design environment 90 in accordance with the invention.
• Design environment 90 includes a customer design system 92 on which a designer designs an integrated circuit (IC), and a fabrication design system 100 that receives the design, modifies the design and generates the IC.
• IC integrated circuit
• fabrication design system 100 designs an integrated circuit on customer design system 92 and provides data thereabout for fabrication by system 100. It should be recognized, however, that this environment is illustrative only, and that the invention may be employed in other environments.
• System 100 is shown implemented on computer 102 as computer program code.
• computer 102 is shown including a memory 112, a processing unit (PU) 114, an input/output (I/O) interface 116, and a bus 118. Further, computer 102 is shown in communication with an external I/O device/resource 120 and a storage system 122.
• processor 114 executes computer program code, such as system 100, that is stored in memory 112 and/or storage system 122.
• processor 114 While executing computer program code, processor 114 can read and/or write data to/from memory 112, storage system 122, and/or I/O device 120.
• Bus 118 provides a communication link between each of the components in computer 102, and I/O device 120 can comprise any device that enables a user to interact with computer 102 (e.g., keyboard, pointing device, display, etc.).
• I/O device 116 can comprise any device that enables computer 102 to communicate with one or more other computing devices over a network (e.g., a network system, network adapter, I/O port, modem, etc.).
• the network can comprise any combination of various types of communications links.
• the network can comprise addressable connections that may utilize any combination of wireline and/or wireless transmission methods.
• the computing devices e.g., computer 102 may utilize conventional network connectivity, such as Token Ring, Ethernet, WiFi or other conventional communications standards.
• the network can comprise one or more of any type of network, including the Internet, a wide area network (WAN), a local area network (LAN), a virtual private network (VPN), etc.
• connectivity could be provided by conventional TCP/IP sockets-based protocol, and a computing device could utilize an Internet service provider to establish connectivity to the Internet.
• Computer 102 is only representative of various possible combinations of hardware and software.
• processor 114 may comprise a single processing unit, or be distributed across one or more processing units in one or more locations, e.g., on a client and server.
• memory 112 and/or storage system 122 may reside at one or more physical locations.
• Memory 112 and/or storage system 122 can comprise any combination of various types of computer-readable media and/or transmission media including magnetic media, optical media, random access memory (RAM), read only memory (ROM), a data object, etc.
• I/O interface 116 can comprise any system for exchanging information with one or more I/O devices 120. Further, it is understood that one or more additional components (e.g., system software, math co-processor, etc.
• computer 102 can be included in computer 102.
• computer 102 can comprise any type of computing device such as a network server, a desktop computer, a laptop, a handheld device, a mobile phone, a pager, a personal data assistant, etc.
• I/O devices 120 e.g., a display
• storage system 122 could be contained within computer 102, not externally as shown.
• fabrication design system 100 is shown including a communicator 130, a circuit (ckt.) element former 132, a dummy shape generator 134 including a marker-based shape generator 138 and general dummy shape generator 140, and other system components 150.
• Customer design system 92 may include a circuit (ckt.) element placer 160, a communicator 162 and a marker system 164. It should be recognized that while systems 92, 100 have each been illustrated as standalone systems, each may be included as part of larger IC design system(s) or peripheral(s) thereto. Accordingly, other conventional IC design systems (not shown) may also be provided in each system.
• FIG. 2 a flow diagram of operational methodology according to a first embodiment of the invention is shown. It should be recognized that although the invention will be described in a particular flow, the invention can be compartmentalized to include only various steps, as outlined in the attached claims.
• FIG. 3 illustrates an example circuit element 172 for use in describing the methodology.
• fabrication design system 100 provides a dummy shape pattern 171 (FIG. 1) via communicator 130, or customer design system 92 obtains dummy shape pattern 171 via communicator 162.
• a "dummy shape” may include any now known or later developed fill or hole shape.
• RG. 4 shows a circuit element 172 surrounded by dummy shapes 200 in the form of fill shapes.
• a dummy shape pattern 171 is illustrated by a box.
• Each "dummy shape pattern" 171 is a layout of a particular number of fill or hole shapes 200 to be repeated over a circuit design. As shown in FIG.
• each dummy shape pattern 171 has an X pitch (X) and a Y pitch (Y) between dummy shapes 200 within the dummy shape pattern 171. As illustrated, the X pitch and Y pitch appear as the same size, but this is not necessary.
• Each dummy shape pattern 171 also includes a pattern X pitch (XP), i.e., a height of the entire dummy shape pattern, and a pattern Y pitch (YP), i.e., a width of the entire dummy shape pattern.
• the X pitch is one half the pattern X pitch
• the Y pitch is one half the pattern Y pitch.
• a second step S2 includes allowing placement of a plurality of substantially identical circuit elements 172A-D on a substrate 176.
• this step is carried out by circuit element placer 160 located at customer design system 92, but this step could be carried out by fabrication design system 100.
• Circuit element placer 160 may include any now known or later developed interface (e.g., a graphical user interface) for a user to place circuit elements 172.
• circuit element placer 160 allows placement of circuit elements 172A-D spaced apart an integer multiple of: 1) the X pitch or the Y pitch of dummy shape pattern 171; 2) both the X pitch and the Y pitch; 3) the pattern X pitch or the pattern Y pitch; or 4) both the pattern X pitch and the pattern Y pitch.
• step S3 As shown in FIGS. 2 and 7, circuit elements
• circuit element former 132 (FIG. 1) and dummy shape pattern 171 is automatically generated between circuit elements 172 by dummy shape generator 134 in a conventional fashion, i.e., using general dummy shape generator 140 (FIG. 1).
• circuit elements 172A-D are placed at an integer multiple of at least one of the X pitch and the Y pitch, then the generating step provides "substantially similar" dummy shapes 200 adjacent each of the circuit elements 172A-D. For example, when an integer multiple of the X pitch is used, it ensures that a distance between a horizontal edge 190 of each instance of the circuit element 172 to the nearest row of dummy shapes 200 is going to be substantially identical.
• circuit elements 172A and 172B have substantially identical lower rows of dummy shapes 200, but not identical upper rows or identical columns. Accordingly, these circuit elements have "substantially similar" dummy shapes. Where both an integer of the X pitch and the Y pitch are used, each instance of circuit elements are even more substantially similarly surrounded by dummy shapes 200, i.e., the distance from a horizontal edge to the nearest row of dummy shapes and the distance from a vertical edge to the nearest column of dummy shapes will be substantially similar for each instance of circuit element 172.
• substantially similar means that the distance between a particular edge of a circuit element and the nearest row (if X pitch used) and/or column (if Y pitch used) of dummy shapes is the same for different instances of the circuit element. However, the exact placement of dummy shapes with respect to a particular point in the circuit element may not be identical.
• the circuit elements 172 are even more identically positioned relative to dummy shapes 200.
• use of the pattern pitch ensures that the nearest rows or columns of dummy shapes 200 are "substantially identical.”
• substantially identical means that the placement of adjacent dummy shapes relative to a particular point in the circuit element is identical (or very close to identical) for all instances and all placements of the circuit element for the direction used, i.e., X and/or Y.
• the distances in that direction between a particular point in the circuit element and every adjacent dummy shape is identical (or very close to identical), and the position of each dummy shape relative to a particular point of the circuit element in that direction is identical (or very close to identical) for each instance of the circuit element.
• the distances in both X and Y directions between a particular point in the circuit element and every adjacent dummy shape, and the position of each dummy shape relative to the particular point are identical (or very close to identical) for each instance of the circuit element.
• circuit elements 172A and 172C are placed using integer multiples of both the pattern X pitch and the pattern Y pitch, and accordingly, have substantially identical dummy shapes about them in the X and Y direction in terms of distances between edges and placement.
• An integrated circuit formed by the above method includes a dummy shape pattern 171 on a substrate 176 having an X pitch and a Y pitch between dummy shapes 200 within the dummy shape pattern 171, and a plurality of substantially identical circuit elements 172A-D on substrate 176. Circuit elements 172A-D are spaced apart an integer multiple of at least one of the X pitch and the Y pitch such that they have substantially similar dummy shapes adjacent each of the circuit elements.
• circuit elements 172 may be spaced apart an integer multiple of: l)the X pitch or the Y pitch of dummy shape pattern 171; 2) both the X pitch and the Y pitch; 3) the pattern X pitch or the pattern Y pitch; or 4) both the pattern X pitch and the pattern Y pitch.
• FIG. 8 a flow diagram of a second embodiment of the invention is shown. As shown in FIG. 9, this embodiment entails use of a marker 300 about a circuit element 372, which indicates an area 304 in which dummy shapes 306 about the circuit element are to be substantially identical. Dummy shapes 308 outside of marker 300 are generated in a conventional fashion. As shown in FIG. 10, markers 300 can then be used to place circuit elements 372 throughout a design so as to obtain substantially identical dummy shapes 306 about circuit elements 372. [Para 44] As shown in FIGS.
• an IC design 170 is received by communicator 130 of fabrication design system 100 including a marker 300 indicating an area 304 about circuit element 372 in which dummy shapes 306 about the circuit element are to be substantially identical.
• a circuit element 372 may be initially provided to a user either by fabrication design system 100 via communicator 130 or as a selectable circuit element at customer design system 92.
• a user of customer design system 92 can then use an interface such as a marker system 164 to selectively form a marker 300 about the circuit element to indicate to a dummy shape generator 134, i.e., marker-based dummy shape generator 138, an area 304 in which dummy shapes 306 about circuit element 372 are to be substantially identical.
• a user can then place circuit elements 372 throughout a design using circuit element placer 160 of customer design system 92. In this case, however, circuit element placer 160 prohibits placement of markers 300 such that they overlap, i.e., are on top of one another.
• step S102 circuit element 372 is formed multiple times within the IC design by circuit element former 132, i.e., after the design is forwarded back to fabrication design system 100.
• step S103 dummy shapes 306 are generated including substantially identical dummy shapes 306 about each circuit element 372 (i.e., by marker-based dummy shape generator 138) within area 304 as indicated by a respective marker 300. Dummy shapes 308 outside of marker 300 are also generated by general dummy shape generator 140 in a conventional fashion.
• an integrated circuit formed by the above-described alternative embodiment includes a plurality of substantially identical circuit elements 372 on a substrate 376, each circuit element 372 has an area 304 about the circuit element in which dummy shapes 306 are substantially identical to dummy shapes about each other circuit element 372. Circuit elements 372 do not overlap, i.e., are not on top of each other.
• the present invention also can be embedded in a computer program product or a propagated signal, which comprises all the respective features enabling the implementation of the methods described herein, and which - when loaded in a computer system - is able to carry out these methods.
• Computer program, propagated signal, software program, program, or software in the present context mean any expression, in any language, code or notation, of a set of instructions intended to cause a system having an information processing capability to perform a particular function either directly or after either or both of the following: (a) conversion to another language, code or notation; and/or (b) reproduction in a different material form.
• teachings of the present invention could be offered as a business method on a subscription or fee basis.
• system and/or computer could be created, maintained, supported and/or deployed by a service provider that offers the functions described herein for customers. That is, a service provider could offer the functionality described above.
• a service provider could offer the functionality described above.

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• 2005
  • 2005-01-06 US US10/905,474 patent/US7269818B2/en not_active Expired - Fee Related
  • 2005-12-16 WO PCT/US2005/045787 patent/WO2006073758A2/en not_active Ceased
  • 2005-12-16 CN CN2005800459863A patent/CN101099154B/zh not_active Expired - Fee Related
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