Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
  • B29C59/002—Component parts, details or accessories; Auxiliary operations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/30—Mounting, exchanging or centering
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/30—Mounting, exchanging or centering
  • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
  • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

Definitions

• the present invention relates to a stamper mounting device and a thermal transfer press machine provided with the stamper mounting device.
• a method of sucking the entire stamper can be considered.
• a stamper with fine irregularities may be placed in a mold to form irregularities on the surface of the injection molded product.
• through holes are formed at equal intervals in a region where a stamper is disposed in a mold, and the stamper is adsorbed to the mold by sucking air through these through hole forces (for example, patents). (Ref. 2).
• Patent Document 1 Japanese Patent Application Laid-Open No. 2003-1705 (Page 3, FIGS. 1 and 2)
• Patent Document 2 Japanese Patent Laid-Open No. 2004-130515 (FIGS. 1 and 2)
• the mold is used to heat or cool the mold.
• a fluid passage is formed inside. Therefore, the through hole for adsorbing the stamper must be formed avoiding the formation positions of these fluid passages.
• the fluid passage must be formed avoiding the formation position of the through hole, a sufficient number of fluid passages cannot be secured, and the heating and cooling efficiency of the mold deteriorates. is there. For this reason, it takes time to heat or cool the mold, and the molding cycle time becomes long. Therefore, even if this structure is applied to a thermal transfer press machine, it is very difficult to shorten the cycle time due to poor heating and cooling efficiency.
• a main object of the present invention is to provide a stamper mounting device that can satisfactorily prevent the stamper from being lifted up and improve heating and cooling efficiency, and a thermal transfer press machine equipped with the stamper mounting device.
• the stamper mounting device of the present invention is a stamper mounting device that mounts a stamper on a thermal transfer press machine that transfers the concave / convex pattern of the stamper to the base material, and is attached to the thermal transfer press machine and adjusts the stamper to a predetermined temperature.
• a stamper holder provided between the temperature control plate and the stamper.
• the stamper holder has a plurality of through holes for air suction over the entire region where the stamper abuts.
• a communication path communicating with the through hole is formed in at least one of the temperature control plate and the stamper holder.
• the through hole is formed in the stamper holder, and the communication path is formed in at least one of the temperature control plate and the stamper holder. Is sucked to the stamper holder side through the communication path and the through-hole, and is attracted to the stamper holder. At this time, since the through hole is formed over the entire region where the stamper abuts, the entire surface of the stamper is attracted to the stamper holder, and the stamper is prevented from being lifted. Furthermore, the stamper holder is adsorbed to the temperature control plate by sucking the air in the communication path. As a result, heat from the temperature control plate is also transmitted well to the central portion of the stamper, and when the pressing is performed by the thermal transfer press machine, the uneven pattern of the stamper is transferred to the substrate satisfactorily.
• the stamper holder has a through hole that extends over the entire stamper area.
• the temperature control plate for example, it is not necessary to provide a through hole at a position corresponding to the central portion of the stamper. Therefore, the temperature of the stamper can be adjusted using the entire surface of the temperature control plate, and the heating and cooling efficiency of the stamper is improved.
• the temperature of the temperature control plate when adjusting the temperature of the temperature control plate with a fluid and forming a fluid passage through which the fluid flows inside the temperature control plate, there is no need to form a through hole while avoiding the fluid passage. A large number of fluid passages can be provided, which also improves the heating and cooling efficiency.
• the communication path is a communication groove formed on a surface of the stamper holder facing the temperature control plate.
• the communication path is a communication groove, compared to the case where the communication path is formed by a hole by forming a groove on the stamper holder surface by an appropriate method such as etching.
• the formation of the communication path is simplified.
• the communication path is formed on the surface facing the temperature control plate of the stamper holder, the communication path is not exposed on the surface facing the stamper. Therefore, even when the stamper is pressed onto the substrate by the thermal transfer press machine, the transfer quality is improved without the possibility that the shape of the communication groove is transferred to the substrate.
• the through holes are arranged at substantially equal intervals, and the communication path is
• the through holes are arranged at substantially equal intervals, the holding performance of the stamper is stabilized and the stamper is reliably adsorbed.
• the communication path connects a plurality of through holes, the number of communication paths can be reduced relative to the number of through holes, the configuration of the stamper holder and z or temperature control plate is simplified, and manufacturing is simplified. It becomes.
• a fluid passage through which a temperature adjusting fluid flows is formed in the temperature adjustment plate, and the outside of the region where the fluid passage is formed communicates with the communication passage. It is desirable that a plate through hole is formed.
• the plate through hole is formed outside the region of the fluid passage, the area and dimensions of the fluid passage necessary for adjusting the temperature of the temperature control plate are secured. Even in this case, the entire surface of the stamper is adsorbed by the communication passage and the through hole, so that the stamper can be securely attached while ensuring the performance of the temperature control plate.
• a plate communication groove that communicates the plurality of communication paths and the plate through-holes is formed on the surface of the temperature control plate that faces the stamper holder.
• the plate communication groove is formed in the temperature control plate, the plurality of communication paths are communicated by the plate communication groove. Therefore, even when a large number of through holes are formed in a stamper holder with a large stamper size, for example, a plurality of communication paths are formed and the end of each communication path is extended to the plate communication groove for easy stamper suction. A passage can be secured. Further, if a plurality of plate through holes are communicated with each other by the plate communication groove, the air pressure in the plate through hole can be made uniform, and the suction force of the stamper can be made uniform.
• a thermal transfer press machine of the present invention includes the above-described stamper mounting device of the present invention.
• the thermal transfer press machine includes the stamper mounting device described above, the same effects as those of the stamper mounting device described above can be obtained, and the center of the stamper can be prevented from being lifted. It is securely attached to the thermal transfer press machine. Therefore, since heat is transferred to the stamper well, temperature control is ensured and the transfer performance of the uneven pattern is improved.
• FIG. 1 is a front view showing the whole of a thermal transfer press machine that works on one embodiment of the present invention.
• FIG. 2 is a front view showing the stamper mounting device according to the embodiment.
• FIG. 3 is a plan view showing a stamper holder according to the embodiment.
• FIG. 4 is an enlarged sectional view showing a part of the stamper holder according to the embodiment.
• FIG. 5 is another enlarged sectional view showing a part of the stamper holder according to the embodiment.
• FIG. 1 shows a front view of a thermal transfer press machine 1 that works according to an embodiment of the present invention.
• the thermal transfer press machine 1 manufactures a light guide plate used for a backlight of a liquid crystal display by thermally transferring a concavo-convex pattern onto a base material. 10 four uprights 11 (two of which are shown in FIG.
• a crown 12 installed on the upper surface of the upright 11, a slide 13 provided below the crown 12, and a slide 13 is a bolster 14 disposed on the bed 10, a stamper mounting device 20 (20A) provided below the slide 13 for attaching a stamper 24 (24A), and a stamper 24 (24B )
• a stamper mounting device 20 (20B) and a stamper 24 (24A, 24B) are provided.
• a slide drive device for moving the slide 13 up and down is built in.
• the stamper 24 (24A, 24B) is moved closer to and away from the stamper 24 (24A, 24A, A substrate (not shown) placed between 24B) is pressed.
• FIG. 2 shows a stamper mounting device 20 (20A, 20B) of the thermal transfer press machine 1! /.
• a pair of stamper mounting devices 20 (20A, 20B) are disposed on the lower surface of the slide 13 and the bolster 14, respectively.
• These stamper mounting devices 20 (20A, 20B) are composed of vacuum suction members 15, 16 provided on the lower surface of the slide 13 or the upper surface of the bolster 14, and the lower surface of the vacuum suction member 16 or the vacuum suction member 15.
• Heat insulating material 21 (21A, 21B) provided on the upper surface, temperature control plate 22 (22A, 22B) provided on the lower or upper surface of heat insulating material 21 (21A, 21B), and temperature control plate 22 (22A, 22B)
• a vacuum device (not shown) connected to the stamper holder 23 (23A, 23B) and the vacuum suction members 15, 16 ),
• a vacuum device for press 25 that evacuates the periphery of the stamper 24 (24A, 24B) when the thermal transfer press machine 1 presses the vacuum suction members 15 and 16.
• Air suction passages 151 and 161 are formed in the vacuum suction members 15 and 16, respectively.
• the passages 151 and 161 have openings 152 and 162 on the side surfaces of the vacuum suction members 15 and 16, and a vacuum apparatus is connected to these openings 152 and 162.
• the passages 151 and 161 are formed substantially in parallel to the surfaces of the vacuum suction members 15 and 16, and have a substantially rectangular shape at a position corresponding to the outer peripheral portion of the region where the heat insulating material 21 (21A, 21B) contacts. Is formed.
• a plurality of passages 153 and 163 are formed along the thickness direction of the vacuum suction members 15 and 16. These passages 153 and 163 communicate with the passages 151 and 161 and the outside of the vacuum suction members 15 and 16, and face the heat insulating material 21 (21 A and 21 B) at the vacuum suction members 15 and 16. Open on the side surface.
• the heat insulating material 21 (21A, 21B) has a predetermined thickness and is interposed between the vacuum suction members 15, 16 and the temperature control plate 22 (22A, 22B). These heat insulating materials 21 (21A, 21B) prevent the temperature control plates 22 (22A, 22B) from transmitting heat to the vacuum suction members 15, 16.
• a plurality of through holes 211 (211A, 211B) penetrating in the thickness direction are formed in the heat insulating material 21 (21A, 21B) at positions corresponding to the openings of the passages 153, 163 of the vacuum suction members 15, 16 Has been.
• the temperature control plate 22 is a flat plate member having a thickness of about 8 mm to 10 mm, and one surface (upper surface) thereof is closely attached to the heat insulating material 21 (21A, 21B). .
• a fluid passage 221 (221A, 221B) through which the temperature control fluid flows is formed substantially at the center in the thickness direction.
• the fluid passage 221 (221A, 221B) is formed in a circular cross section having a diameter of about 5 mm, is formed substantially parallel to the surface of the temperature control plate 22 (22A, 22B), and is approximately 7 mm substantially parallel to each other. Are arranged at a pitch of.
• the heat of the fluid is well transmitted to the temperature control plate 22 (22A, 22B), and the stamper 24 (24A, 24B) is quickly heated and Z or cooled.
• the inner peripheral area of the fluid passage 221 (221A, 221B) is set to be large as is done in the above. In other words, the diameter of the fluid passage 221 (221A, 22B) is as large as possible. It is desirable to set the threshold.
• the temperature control plate is pressurized between the slide 13 and the bolster 14, it is necessary to ensure a certain level of strength. Therefore, it is desirable that the materials and dimensions of the temperature control plate 22 (22A, 22B), the cross-sectional dimensions of the fluid passage 221 (221A, 221B), the pitch of the arrangement, etc. are set appropriately in consideration of these conditions. Yes.
• a fluorine-based inert liquid such as perfluoropolyether, water, steam or the like can be employed.
• the through hole 211 (211A, 21 IB) of the heat insulating material 21 (21A, 21B)
• Suction holes 222 as plate through-holes are respectively formed at positions corresponding to.
• the suction hole 222 (222A, 222B) has a diameter of about 5. Omm.
• the surface of the temperature control plate 22 (22A, 22B) facing the stamper holder 23 (23A, 23B) is connected to a plate communication groove 223 (223A, 223A, 22B) that communicates with the opening of the suction hole 222 (222A, 222B). 223B) is formed.
• These plate communication grooves 223 (223A, 223B) are arranged on both sides in the longitudinal direction outside the region where the stampers 24 (24A, 24B) are arranged, as shown by a two-dot chain line in FIG.
• a plurality (three in this embodiment) of suction holes 222 (222A, 222B) communicate with each other.
• the plurality of suction holes 222 (222A, 222B) communicate with each other at the position close to the stamper holder 23 (23A, 23B), when sucking air with the vacuum device, The suction force by the holes 222 (222A, 222B) is averaged by these plate communication grooves 223 (223A, 223B), and a uniform suction force is obtained.
• the width dimension of the plate communication groove 223 (223A, 223B) is set to about 1.5 mm in this embodiment.
• the depth dimension of the plate communication groove 223 (223A, 223B) is set to about 2 mm.
• the suction holes 222 are arranged outside the region where the fluid passages 221 (221A, 221B) are formed. That is, since the suction holes 222 (222A, 222B) are not provided in the region where the stampers 24 (24A, 24B) are attached, more fluid passages 221 (221A, 221B) can be arranged. Therefore, the heat of the fluid is controlled by the temperature control plate A, 22B) can be transmitted well, and the heat transfer efficiency of the temperature control plate 22 (22A, 22B) can be improved.
• FIG. 3 shows a plan view of the stamper holder 23 (23A, 23B).
• the stamper holder 23 (23A, 23B) is a thin plate member made of nickel, and the through hole 231 (231A, 231 B) extends over the entire region where the stamper 24 (24A, 24B) is disposed. ) Is formed.
• the through holes 231 (231A, 231B) are arranged at substantially equal intervals vertically and horizontally with a predetermined interval.
• the hole diameter of the through holes 231 (231A, 231B) is about 0.3 mm
• the plurality of through holes 231 (231A, 231B) are formed at a pitch (predetermined interval) of about 10 mm.
• the stamper holder 23 is configured as thin as possible in order to improve the heat transfer coefficient.
• the stamper holder 23 (23A, 23B) is set to a thickness of about 0.25 mm.
• the hole diameter of the through hole 231 (231A, 231B) is set to be equal to or smaller than the thickness dimension of the stamper 24 (24A, 24B). By setting such dimensions, it is possible to prevent the shape of the through holes 23 (23A, 23B) from being transferred to the base material when the stamper 24 (24A, 24B) is pressed onto the base material.
• the material of the stamper holder 23 in order to prevent displacement with respect to the stamper 24 (24A, 24B), a material having the same thermal expansion coefficient as that of the stamper 24 (24A, 24B) may be selected. More desirably, the same material may be used. In the present embodiment, the stamper holder 23 (23A, 23B) and the stamper 24 (24A, 24B) are both made of nickel, which is the same material.
• FIG. 4 is an enlarged cross-sectional view showing a part of the stamper holder 23 (23A, 23B).
• FIG. 5 is another enlarged sectional view showing a part of the stamper holder 23 (23A, 23B).
• FIG. 4 is a sectional view taken along the line IV-IV in FIG. 3
• FIG. 5 is a sectional view taken along the line VV in FIG.
• the stamper holder 23 (23A, 23B) has a plurality of penetrating ridges on the surface facing the temperature control plate 22 (22A, 22B).
• a communication groove (communication path) 232 (232 mm, 232 mm) that communicates with each other is formed.
• These communication grooves 232 are a plurality of linearly arranged along the short direction of the stamper 24 (24 mm, 24 mm).
• the through holes 231 (231A, 231B) communicate with each other, and a plurality of communication grooves 232 (232A, 232B) are arranged substantially parallel to each other. Both ends of these communication grooves 232 (232A, 232B) are arranged at positions corresponding to the plate communication grooves 223 (223A, 223B) of the temperature control plate 22 (22A, 22B), respectively.
• the communication groove 232 (232A, 232B) force is formed on the surface facing the temperature control plate 22 (22A, 22B9) on the opposite side of the surface facing the stamper 24 (24A, 24B). It is possible to prevent the shape of the communication groove 232 (232A, 232B) from being transferred to the substrate when the uneven pattern of 24A, 24B) is transferred to the substrate.
• the communication grooves 232 (232A , 232B) can be reduced, the manufacture of the stamper holder 23 (23A, 23B) can be simplified, the strength of the stamper holder 23 (23A, 23B) can be prevented from being reduced, and the substrate Transfer of the shape of the groove 232 (232A, 232B) can be more effectively suppressed.
• the dimensions of the communication groove 232 are such that the shape of the communication groove 232 (232A, 232B) is not transferred to the substrate when the stamper 24 (24A, 24B) is pressed onto the substrate.
• the depth dimension and width dimension of the communication groove 232 (232A, 232B) that are set to be preferably 1Z3 or less of the plate thickness of the stamper holder 23 (23A, 23B).
• the dimensions of the communication groove 232 (232A, 232B) are set to a width dimension of about 0.1 mm and a depth dimension of about 0.05 mm.
• Such communication grooves 232 (232A, 232B) are formed by an appropriate method such as etching.
• the stamper 24 (24A, 24B) has a fine uneven pattern formed on the surface (surface) opposite to the surface facing the stamper holder 23 (23A, 23B). .
• the stamper 24 (2 4A, 24B) is made of nickel in the same way as the stamper holder 23 (23A, 23B). The law is set at about 0.3 mm.
• the concavo-convex pattern is not limited to this, but can be arbitrarily adopted depending on the pattern to be transferred. Examples include dot patterns.
• the pressing vacuum apparatus 25 includes a pair of wall portions 25 1A and 251B attached to the vacuum suction members 15 and 16, vacuum knocks 252A and 252B provided on the wall rods 251A and 251B, and a wall rod 51A. , And an air suction device (not shown) for evacuating the area surrounded by 251B.
• Walls 251A and 251B are placed to surround the outer peripheries of stamper 24 (24A and 24B), stamper holder 23 (23A and 23B), temperature control plate 22 (22A and 22B), and insulation 21 (21A and 21B) And project in directions close to each other.
• the vacuum packings 252A and 252B are provided at the end portions where the wall portion 251A and the wall portion 251B face each other.
• stamper 24 (24A, 24B) when attaching the stamper 24 (24A, 24B) to the thermal transfer press machine 1, the stamper holder 23 (23A, 23B) is arranged on the upper or lower surface of the temperature control plate 22 (22A, 22B), and the upper or lower surface thereof Further, stamper 24 (24A, 24B) is arranged and positioned. At this time, before adsorbing the stamper 24 (24A, 24B), the outer periphery of the stamper 24 (24A, 24B) and the stamper holder 23 (23A, 23B) should be fixed with screws or tape so that they do not shift. It is preferable to temporarily fix the adjusting plate 22 (22A, 22B) by appropriate holding means such as providing a holding frame.
• stamper holder 23 (23A, 23B) and stamper 24 (24A, 24B) are attached by adsorbing them to the temperature control plate 22 (22A, 22B).
• the desorption is much easier.
• stamper removal If the double-sided tape is peeled off, the stamper will bend, so the peeled-off stamper can no longer be used, or once the stamper is pasted with the double-sided tape, the stamper must be pressed to the end of its life. There was a problem that the process could not be made flexible.
• the stamper 24 (24A, 24B) is attached by suction, so that the stamper 24 (24A, 24B) can be prevented from being damaged during removal.
• the stamper 24 (24A, 24B) can be easily replaced, it can be flexibly adapted to low-mix production.
• the through hole 231 (231A, 231B) of the stamper holder 23 (23A, 23B) is a stamper 24
• the stamper 24 (24A, 24B) Since it is formed in a region corresponding to the entire surface of (24A, 24B), the stamper 24 (24A, 24B) can be uniformly adsorbed over the entire surface. Therefore, since the stamper 24 (24A, 24B) is securely and satisfactorily adhered to the stamper holder 23 (23A, 23B), the heat transfer efficiency from the temperature control plate 22 (22A, 22B) force to the stamper 24 (24A, 24B) The stamper 24 (24 A, 24B) can be heated and cooled efficiently. Further, since the central portion of the stamper 24 (24A, 24B) can be prevented from being lifted, the transfer quality can be improved.
• a temperature control plate is conventionally provided with a through hole
• the stamper when using a stamper having a size smaller than the region where the through hole is formed, the stamper is not in contact with the outside of the stamper. A through hole is generated. In this case, it is necessary to take a measure such as closing the through hole, and the work becomes complicated.
• the through-hole when using a stamper with a size larger than the area where the through-hole is formed, the through-hole is not arranged in the outer peripheral portion of the stamper, so that the outer peripheral portion cannot be adsorbed, and the stamper is securely attached. Can not hold on.
• drilling or electrical discharge machining must be performed, which makes machining difficult and increases the machining cost depending on the number of through holes.
• the temperature control plate 2 2 (22A, 22B) is sucked into the outer fluid J of the fluid passage 221 (221A, 221B).
• the through hole 231 (231A, 231B) that adsorbs the Stanno 24 (24A, 24B) is formed by simply forming the plate 222 (222A, 222B) and the plate communication groove 223 (223A, 223B). It is formed on the stamper holder 23 (23A, 23B). Therefore, when using stampers having different dimensions, a stamper holder corresponding to the dimensions of the stamper may be prepared, and the through hole may be formed according to the dimensions of the stamper.
• the stamper can be easily replaced and the stamper Regardless of the dimensions, the entire stamper can be adsorbed and held well. Therefore, even when the concavo-convex pattern is transferred to a substrate having a relatively large size, it is possible to cope with it satisfactorily, so that the size of the transfer object can be increased.
• the through hole 231 (231A, 231B) and the communication groove 2 32 (232A, 232B) to the stamper holder 23 (23A, 23B) can be easily processed by etching, so the through hole 231 (231A, 2 31B)
• the machining cost does not depend on the number of communication grooves 232 (232A, 232B).
• Heating fluid is passed through the fluid passage 221 (221A, 221B) of the temperature control plate 22 (22A, 22B) to heat the temperature control plate 22 (22A, 22B) to a predetermined temperature.
• the predetermined temperature takes into consideration the heat softening temperature of the base material and the heat transfer efficiency of the temperature control plate 22 (22A, 22B), stamper holder 23 (23A, 23), and stamper 24 (24A, 24B).
• the base material is an acrylic resin
• the temperature of the thermal softening is about 95 ° C
• the predetermined temperature is set to about 120 ° C to 140 ° C.
• the stamper 24 (24A, 24B) is heated in a state where the slide 13 is in the raised position, the entire surface of the stamper 24 (24A, 24B) is adsorbed via the stamper holder 23 (23A, 23B).
• the close contact with the temperature control plate 22 (22A, 22B) is important for improving the heat transfer efficiency.
• the heat of the temperature control plate 22 (22A, 22B) is transmitted to the stamper holder 23 (23A, 23B) and the stamper 24 (24A, 24B), and the stamper 24 (24A, 24B) is heated to a predetermined temperature.
• the slide 13 is lowered by the slide driving device and approaches the bolster 14.
• the wall portions 251A and 251B are also brought close to each other, and the vacuum packings 252A and 252B come into contact with each other, and the region surrounded by the wall portions 251A and 251B is sealed.
• the periphery of the stamper 24 (24A, 24B) is evacuated by the press vacuum device 25, so that the stamper 24 (24A, 24B) is pressed when the stamper 24 (24A, 24B) is pressed onto the base material. ) And the base material can be prevented from being entrained. As a result, the concave / convex pattern of the stamper 24 (24A, 24B) can be satisfactorily transferred to the substrate, and defects such as transfer defects can occur. Can be prevented.
• the suction force of the stamper 24 (24A, 24B) is reduced by evacuating the walls 251A, 251B, the outer periphery of the stamper 24 (24A, 24B) is appropriately held.
• the stamper 24 (24A, 24B) is not likely to come off or move out of position.
• the slide 13 is further lowered, and the stamper 24 (24A, 24B) is subjected to caloric pressure (pressing) against the base material. Holding at a predetermined pressure for a predetermined time, only the surface of the substrate is softened, and the concavo-convex pattern of Stanno 24 (24A, 24B) is transferred to both surfaces of the substrate. Note that when the stamper 24 (24A, 24B) is in close contact with the substrate, the suction by the press vacuum device 25 may be stopped to open the inside of the wall portions 251A, 251B to the atmosphere.
• the fluid inside the fluid passage 221 (221A, 221B) of the temperature control plate 22 (22A, 22B) is switched to the cooling fluid, Cool preparation plate 22 (22A, 22B) to the specified temperature.
• the predetermined temperature is appropriately set in consideration of the material of the base material and the heat transfer efficiency of the temperature control plate 22 (22A, 22B), the stamper hono reda 23 (23A, 23B), and the stamper 24 (24A, 24B).
• the base material is acrylic resin, it is cooled to about 70 ° C to 50 ° C.
• the slide 13 is raised to release the pressure, and the base material with the concavo-convex pattern transferred is taken out from the thermal transfer press machine 1.
• the stamper is not limited to the force provided above both the bolster and below the slide, and may be provided only on either the bolster or below the slide. In this case, the thermal transfer press machine transfers the concavo-convex pattern only on one side of the substrate.
• the communication groove that communicates with the through hole formed in the stamper holder is a force that is formed on the surface of the stamper holder that faces the temperature control plate.
• the communication groove is formed on the temperature control plate. It is formed on the surface facing the stamper holder.
• the communication groove may be formed in both the temperature control plate and the stamper holder.
• the communication groove is at least one of the temperature control plate and the stamper holder. What is necessary is just to be formed.
• the communication path that communicates the through hole is not limited to the communication groove formed in at least one of the stamper holder and the temperature control plate, and may be, for example, a communication hole that communicates the through hole.
• the plate communication groove may be formed in the stamper holder.
• the present invention can be used as a thermal transfer press machine used for manufacturing a light guide plate for a knock light of a liquid crystal panel, as well as a thermal transfer press machine for manufacturing, for example, a separator of a fuel cell or a design plate. Can be used.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Shaping Of Tube Ends By Bending Or Straightening (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)

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• 2004
  • 2004-12-20 JP JP2004368552A patent/JP4469713B2/ja not_active Expired - Fee Related
• 2005
  • 2005-12-14 CN CN2005800436240A patent/CN101084102B/zh not_active Expired - Fee Related
  • 2005-12-14 KR KR1020077013743A patent/KR100861972B1/ko not_active IP Right Cessation
  • 2005-12-14 WO PCT/JP2005/022959 patent/WO2006068016A1/ja active Application Filing
  • 2005-12-16 TW TW094144646A patent/TW200621526A/zh not_active IP Right Cessation

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