WO2006041022A1 - 電子部品供給装置及び電子部品供給方法 - Google Patents
電子部品供給装置及び電子部品供給方法 Download PDFInfo
- Publication number
- WO2006041022A1 WO2006041022A1 PCT/JP2005/018611 JP2005018611W WO2006041022A1 WO 2006041022 A1 WO2006041022 A1 WO 2006041022A1 JP 2005018611 W JP2005018611 W JP 2005018611W WO 2006041022 A1 WO2006041022 A1 WO 2006041022A1
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- WIPO (PCT)
- Prior art keywords
- electronic component
- adhesive film
- electronic
- electronic components
- held
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Definitions
- the present invention relates to an electronic component supply apparatus, an electronic component supply method, and an electronic component mounting method, and in particular, an electronic component (semiconductor chip component) such as a flip chip component or a wafer level CSP.
- an electronic component semiconductor chip component
- semiconductor chip component such as a flip chip component or a wafer level CSP.
- the present invention also relates to an electronic component mounting technology capable of mounting electronic components by supplying a large amount of high-speed and low-cost electronic components) to an electronic component mounting portion.
- a semiconductor chip is a generic term for semiconductors formed on a semiconductor wafer, and includes the wafer level CSP described below.
- New mounting technologies include flip-chip bonding, which eliminates the wire bonding process and directly attaches the semiconductor chip with the circuit side down, and semiconductor chips in which bonding bumps are formed directly on the chip on a semiconductor wafer (such a semiconductor chip).
- wafer level CSP wafer level CSP
- a wafer level CSP chip scale package
- IC tags and RFIDs are produced by wafer level CSP and are widely used as tag systems capable of communication.
- RFID is used for production, logistics, inventory management, product anti-theft tag, facility entry / exit management, air baggage management, membership card, employee ID card, banknote printing, product history management, etc. Can be seen. In the future, a large amount of RFID will be implemented to build a ubiquitous society. In order to mount hundreds of billions to trillions of RFIDs per year, it is awaited to establish a high-speed RFID supply and high-speed mounting system.
- RFID with solder bumps is mounted at high speed with a high-speed chip mounter that mounts electronic components on the surface, and soldered in the same reflow process as normal surface-mounted components.
- This technology is attracting attention as the cheapest and fastest RFID mounting method. Theoretically, it is possible to mount a large amount of high-speed with a high-speed chip mounter and perform batch reflow soldering, but in practice, to supply RFID to a high-speed chip mounter at high speed, remove the RFID from the semiconductor wafer.
- the taped RFID is the same as the taping process, and when removing the RFID from the semiconductor wafer, it uses a process of reversing the front and back so that the RFID circuit surface faces down when the RFID is removed.
- the taping cost is high and this is the bottleneck.
- flip chip mounting of other semiconductor chips and wafer level CSP mounting it is mounted through a pin ejection process and a process of flipping the front and back one by one so that the RFID circuit surface is down. .
- the present invention provides an electronic component supply apparatus and an electronic component supply method that can supply electronic components such as flip chip components and wafer level CSPs to electronic component mounting portions at high speed and in large quantities at low cost. For the purpose of providing.
- Another object of the present invention is to provide an electronic component mounting method using this electronic component supply apparatus.
- the first invention of the present invention supplies a large number of electronic components held on a semiconductor wafer by a heat-peelable adhesive film to an electronic component mounting portion.
- An electronic component supply apparatus that heats the adhesive film while holding the electronic component on the semiconductor wafer with its surface facing upward to reduce the adhesive film's adhesiveness, thereby peeling the electronic component from the adhesive film force.
- the peeling means and the first adhesive film force are peeled off and the electronic components are held in a lump so that the surface of the electronic components is held upward from above and the back surface of the electronic components is faced upward while holding the electronic components.
- a component holding means for holding the electronic component so that the electronic component can be easily sucked after the front and back are reversed.
- the component holding means holds the electronic component so as to prevent the electronic component from slipping and to easily peel off the electronic component when the electronic component is attracted.
- a plate means provided with a coating having a surface friction coefficient to the extent possible. The surface of the plate means faces down, and the adhesive film force is peeled off, and a large number of electronic components whose surfaces are facing upward are coated.
- the front and back of the electronic component are reversed so that the back surface of the electronic component faces upward while holding a large number of electronic components.
- the component holding means is a second pressure-sensitive adhesive film having heat peelability, and is peeled off from the pressure-sensitive adhesive film and has a large number of electrons facing upward.
- a second adhesive film that flips the front and back in a batch so that the back of the electronic component is facing upward while holding the electronic components in an adhesive state and holding a large number of electronic components. The second adhesive is held so that is facing upward.
- a second peeling means for heating the film in that state to lower the adhesiveness of the second adhesive film and peeling the electronic component from the second adhesive film.
- a second invention of the present invention is an electronic component supply method for supplying a large number of electronic components held by a heat-peelable adhesive film on a semiconductor wafer to an electronic component mounting portion.
- a component holding step for holding the electronic component so that it can be easily adsorbed.
- the component holding step holds the electronic component such that the electronic component is prevented from skidding and is easily peeled off when the electronic component is attracted.
- a plate means having a coating having a surface friction coefficient as much as possible on its surface the surface of this plate means is faced downward to peel off the adhesive film force, and a large number of electronic components with their surfaces facing upward are While holding it with a film and holding a large number of electronic components, the front and back are reversed together so that the back side of the electronic components faces upward.
- the second pressure-sensitive adhesive film having heat peelability and adhesiveness causes a large number of the surfaces of the pressure-sensitive adhesive film peeled to face upward.
- a third invention of the present invention is an electronic component mounting method for mounting an electronic component by using the electronic component supply device of the first invention or the second invention, and the first invention or the second invention.
- a fourth invention of the present invention is an electronic component supply apparatus for supplying a large number of electronic components held by a heat-peelable adhesive film on a semiconductor wafer to an electronic component mounting portion.
- the adhesive film is heated to lower the adhesiveness of the adhesive film, and the electronic component is peeled off from the adhesive film to separate it.
- Vibrating feeder means that vibrate and supply aligned electronic parts in a row, front / back judgment means for judging the front and back of electronic parts aligned in a row, and the front and back of electronic parts that have been judged to be front / back
- a refilling square pipe means having a passage corresponding to the outer shape of the electronic component, and a filling hand for filling the refilling square pipe means with the electronic component with the front and back aligned.
- the fourth invention of the present invention further includes a fixing square pipe means having one end connected to one end of the replenishing square pipe means, from one end side of the fixing square pipe means.
- a fixing square pipe means having one end connected to one end of the replenishing square pipe means, from one end side of the fixing square pipe means.
- FIG. 1 is a plan view showing a semiconductor chip (electronic component or semiconductor chip component) held on a semiconductor wafer handled by the electronic component supply apparatus according to the first embodiment of the present invention.
- FIG. 2 is a front view showing the semiconductor wafer shown in FIG.
- the semiconductor chip 2 is a wafer level CSP (chip scale package) in which solder bumps 6 are directly formed on the semiconductor chip.
- the semiconductor chip 2 may be another type of electronic component such as a flip chip component that is directly attached to a printed wiring board with the circuit surface of the semiconductor chip facing down.
- the adhesive film 4 is a heat-peelable and adhesive film (for example, Nitto Denko Corporation's trade name "Riva Alpha"), and this film usually has a predetermined adhesiveness. When heat is applied, the adhesiveness is reduced or eliminated.
- dicing may be performed with several micron force that leaves several hundred microns without completely separating the individual semiconductor chips 2.
- the adhesive film 4 described later before heating the adhesive film 4 described later (in a state where the semiconductor chip 2 is held by the adhesive film 4), the semiconductor chip 2 is completely pulled by pulling the adhesive film 4 in four directions. Can be separated.
- each semiconductor chip 2 is pushed up with a pin digit. Then, it was made easy to peel off from the adhesive film 4, and then it was turned upside down to pick up the parts.
- a heater 8 is provided on the lower surface side of the adhesive film 2, and the heater 8 heats the adhesive film 2 to adhere the adhesive film. I try to decrease the sex.
- a weak adhesive plate 10 is placed on the semiconductor wafer 1 so as to overlap.
- the weak adhesive plate 10 is composed of a plate 12 and a weak adhesive film 14 formed on the surface (lower surface) of the plate 12.
- the weak adhesive film 14 prevents the semiconductor chip 2 from slipping and is sufficiently adhesive to hold the semiconductor chip 2 or the semiconductor chip 2 can be easily peeled off when the semiconductor chip 2 is attracted.
- a film having a surface friction coefficient. Silicon rubber is used as the weak adhesive film 14.
- adhesive with weak adhesive strength may be applied on the plate 12 instead of silicone rubber.
- the semiconductor chip 2 is turned upside down while the semiconductor wafer 1 and the weak adhesive plate 10 are overlapped, and then the adhesive film 4 is peeled off from the top. As a result, the semiconductor chip 2 is turned upside down on the weak adhesive plate 10 and remains at the same position as the position on the semiconductor wafer 1.
- FIG. 6 is a plan view showing the weak adhesive plate 10 and the semiconductor chip 2 after the adhesive film 4 is peeled off
- FIG. 7 is a front view of FIG.
- the weakly adhesive plate 10 on which a large number of semiconductor chips 2 are mounted as shown in FIGS. 6 and 7 is fixedly arranged within the pickup range of the electronic component mounting portion as shown in FIG.
- the semiconductor chip 2 can be picked up by the pick-up nozzle 16 and mounted on the printed circuit board at a high speed without being ejected or individually turned over.
- the strong adhesive film 18 is an adhesive film made of a material whose adhesiveness is lowered by applying heat.
- the above-mentioned adhesive film 4 and strong adhesive film 18 will be described as different ones, but an adhesive film having the same heat release property may be used.
- the strong adhesive film 18 is placed with its adhesive surface down. In this state, it is overlapped with semiconductor wafer 1 (semiconductor chip 2 and adhesive film 4), and then shown in FIG. In this manner, the semiconductor chip 2 is turned upside down while the strong adhesive film 18 stacked on the semiconductor wafer 1 is left stacked.
- the adhesive film 4 is peeled off.
- the semiconductor chip 2 is turned upside down on the strong adhesive film 18, and remains in the same position as the position on the semiconductor wafer 1.
- the strong adhesive film 18 is fixedly disposed on the electronic component mounting portion, and the strong adhesive film 18 is heated by the heater 20 provided in the electronic component mounting portion to By reducing the adhesive force that holds the semiconductor chip 2 by the adhesive film 18, the electronic component mounting part can be easily attached to the semiconductor chip 2 by the pickup nozzle 22 without performing pin ejection.
- the semiconductor chip 2 is held by the pick-up nozzle 22 so that it can be easily adsorbed after the front and back are reversed.
- the semiconductor chip 2 is similarly attached using a magnet or a suction mechanism. It can be reversed and held.
- the electronic component mounting method using the electronic component supply apparatus is configured such that a weak adhesive plate 10 on which a large number of semiconductor chips 2 are mounted is attached to a pickup range (pickup) of the electronic component mounting portion. If it is fixedly placed within the X—Y axis movement range of the nozzle, it does not need to pin-invert, and it does not need to be turned over individually.
- the pick-up nozzle 16 can pick up the semiconductor chip 2 at high speed and mount it on the printed circuit board.
- the electronic component mounting method using the electronic component supply apparatus is configured so that the strong adhesive film 18 can be picked up in the electronic component mounting portion (the XY axes of the pickup nozzle).
- the strong adhesive film 18 is heated by the heater 20 provided in the electronic component mounting part, and the adhesive force for holding the semiconductor chip 2 by the strong adhesive film 18 is reduced.
- the semiconductor chip 2 can be easily adsorbed at a higher speed than the strong adhesive film 18 by the pickup nozzle 22 of the high-speed chip mounter without pin ejecting and mounted on the printed circuit board. it can.
- the semiconductor chip 2 can be taken out of the semiconductor wafer 1 without pin ejection at a high speed and at a low cost as never before as a mounting method of the semiconductor chip 2.
- the electronic component supply device 30 once disassembles the semiconductor chips 2 from the semiconductor wafer 1 and then arranges them in a row by the vibration ball feeder 32 and the linear vibration feeder 34, and then the sensor 36 transmits the semiconductor chip 2.
- the front and back sides are discriminated. If the front side is facing down (the solder bump 6 is facing down), it is returned by the return passage 38 and lined up and down, and the semiconductor chip 2 that is lined up and down is packed in the refilling square pipe 40 and refilled.
- the adhesive film 4 is heated as described above.
- Adopt an adhesive film made of a material that loses its adhesiveness almost when heated, and disassemble it by heating (see Fig. 3).
- the semiconductor chips 2 are put into the vibration ball feeder 32, aligned in a line, and then sent to the linear vibration feeder 34. It is. In the middle of the linear vibration feeder 34, the sensor 36 determines the front and back of the semiconductor chip 2, and the semiconductor chip 2 with the front side facing downward (the solder bump 6 facing down) is returned to the vibrating ball feeder 32 through the return path 38.
- the outlet of the linear vibration feeder 34 is connected to the replenishing square pipe 40, and the semiconductor chip 2 is packed in the replenishing square pipe 40 with the solder bumps 6 facing up.
- FIG. 14 is a side view showing the semiconductor chip 2 packed in the replenishing square pipe 40, with the solder bumps 6 facing upward.
- FIG. 16 is a side view showing a state in which the bumps 6 of the semiconductor chip 2 inside are turned downward by turning the supplementary square pipe 40 upside down. In this state, it is connected to a square pipe 42 that is fixedly arranged in an electronic component supply device, which will be described later, and is supplied to the electronic component mounting device with the bump 6 of the semiconductor chip 2 facing downward.
- FIG. 16 is a side view showing a pipe-type electronic component supply device 46 according to the fourth embodiment.
- the replenishing square pipe 40 is connected to a fixedly arranged square pipe 42, and is conveyed to the outlet 44 by compressed air discharged from the conveying device 48.
- the inner diameter of the square pipe 42 is almost the same as that of the semiconductor chip 2 so that the semiconductor chip 2 can be positioned and held with high accuracy when the parts are taken out.
- the first magnet 50 is arranged near the lower side of the outlet 44 so that the semiconductor chip 2 can be held by magnetic force.
- the second magnet 52 is disposed in the vicinity of the second semiconductor chip 2, and the second and subsequent semiconductor chips 2 press the first semiconductor chip 2 from the rear, and the pressing force when the semiconductor chip 2 is taken out Is trying to prevent it from becoming an obstacle.
- the force pressing the first semiconductor chip 2 is released. Also, it is possible to move the first magnet 50 in the direction with less influence of magnetic force so that the magnetic force of the first magnet 50 does not affect the attractive force of the pickup nozzle 54.
- FIG. 1 is a plan view showing a semiconductor chip held on a semiconductor wafer handled by the electronic component supply apparatus according to the first embodiment of the present invention.
- FIG. 2 is a front view showing the semiconductor wafer shown in FIG. ⁇ 3] A diagram showing a process of heating the adhesive film with the heater according to the first embodiment of the present invention to reduce the adhesiveness of the adhesive film.
- FIG. 4 A diagram showing a process of arranging the weak adhesive plate so as to overlap the semiconductor wafer according to the first embodiment of the present invention.
- FIG. 5 is a diagram showing a process of turning the semiconductor chip upside down while the semiconductor wafer and the weak adhesive plate are overlaid according to the first embodiment of the present invention.
- FIG. 7 is a front view of FIG.
- FIG. 8 A front view showing an electronic component supply device and an electronic component mounting portion to which the electronic component mounting method according to the third embodiment of the present invention is applied.
- FIG. 9 is a diagram showing a process of superposing a strongly adhesive film according to the second embodiment of the present invention on a semiconductor wafer with its adhesive surface facing down.
- FIG. 10 is a diagram showing a process of turning the semiconductor chip upside down in a state where the strong adhesive film overlaid on the semiconductor wafer according to the second embodiment of the present invention is overlaid.
- FIG. 11 is a diagram showing a process of peeling off the adhesive film according to the second embodiment of the present invention. 12] A front view showing an electronic component supply apparatus and an electronic component mounting portion to which the electronic component mounting method according to the third embodiment of the present invention is applied.
- FIG. 13 A side view showing an electronic component supply device according to a fourth embodiment of the present invention.
- FIG. 15 is a side view showing a state where the refilling pipe shown in FIG. 14 is turned upside down.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-296489 | 2004-10-08 | ||
JP2004296489A JP2006108569A (ja) | 2004-10-08 | 2004-10-08 | 電子部品供給装置及び電子部品供給方法 |
Publications (1)
Publication Number | Publication Date |
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WO2006041022A1 true WO2006041022A1 (ja) | 2006-04-20 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/018611 WO2006041022A1 (ja) | 2004-10-08 | 2005-10-07 | 電子部品供給装置及び電子部品供給方法 |
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JP (1) | JP2006108569A (ja) |
WO (1) | WO2006041022A1 (ja) |
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KR102272610B1 (ko) * | 2020-11-27 | 2021-07-05 | (주)삼정오토메이션 | 전자부품 전사장치 및 전사공정 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4942424B1 (ja) * | 1970-10-08 | 1974-11-14 | ||
JPH0256946A (ja) * | 1988-08-22 | 1990-02-26 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JPH0918191A (ja) * | 1995-07-03 | 1997-01-17 | Fujitsu Ltd | 実装装置及び実装方法 |
JPH10284578A (ja) * | 1997-04-10 | 1998-10-23 | Fujitsu Ltd | 半導体装置の製造方法及び製造装置 |
JP2003119439A (ja) * | 2001-10-17 | 2003-04-23 | Kureha Elastomer Co Ltd | 加熱剥離型自己粘着シート |
-
2004
- 2004-10-08 JP JP2004296489A patent/JP2006108569A/ja not_active Withdrawn
-
2005
- 2005-10-07 WO PCT/JP2005/018611 patent/WO2006041022A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4942424B1 (ja) * | 1970-10-08 | 1974-11-14 | ||
JPH0256946A (ja) * | 1988-08-22 | 1990-02-26 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JPH0918191A (ja) * | 1995-07-03 | 1997-01-17 | Fujitsu Ltd | 実装装置及び実装方法 |
JPH10284578A (ja) * | 1997-04-10 | 1998-10-23 | Fujitsu Ltd | 半導体装置の製造方法及び製造装置 |
JP2003119439A (ja) * | 2001-10-17 | 2003-04-23 | Kureha Elastomer Co Ltd | 加熱剥離型自己粘着シート |
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