WO2006030718A1 - AlN単結晶の製造方法およびAlN単結晶 - Google Patents
AlN単結晶の製造方法およびAlN単結晶 Download PDFInfo
- Publication number
- WO2006030718A1 WO2006030718A1 PCT/JP2005/016672 JP2005016672W WO2006030718A1 WO 2006030718 A1 WO2006030718 A1 WO 2006030718A1 JP 2005016672 W JP2005016672 W JP 2005016672W WO 2006030718 A1 WO2006030718 A1 WO 2006030718A1
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- WO
- WIPO (PCT)
- Prior art keywords
- single crystal
- nitrogen
- aln single
- grown
- gallium
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B9/00—Single-crystal growth from melt solutions using molten solvents
- C30B9/04—Single-crystal growth from melt solutions using molten solvents by cooling of the solution
- C30B9/08—Single-crystal growth from melt solutions using molten solvents by cooling of the solution using other solvents
- C30B9/10—Metal solvents
Definitions
- the present invention relates to a method for producing an A 1 N single crystal by a flux method and an A 1 N single crystal.
- Aluminum nitride has a large band gap of 6.2 eV and high thermal conductivity, making it an excellent substrate material for light emitting devices (LEDs, LDs) and electronic devices in the ultraviolet region. Development is desired. So far, the production technology of A 1 N single crystal by sublimation method and HVPE method has been proposed. Also, the manufacturing technology of A 1 N by the flux method (solution method) is disclosed in Japanese Patent Application Laid-Open No. 2003- 1 1 90 9 9 “Mat. Res. Bull.j Vol. 9 (1974) 331-336. In Japanese Patent Application Laid-Open No. 2 0 0 3— 1 1 9 0 9 9, transition metal is used as a flux. “Mat. Res. Bull. JVol. 9 (1974) pp.
- C A 1 N single crystal is obtained from a 3 N 2 and A 1 N powder
- high quality bulk gallium nitride single crystals can be synthesized at relatively low temperature and low pressure by using Na as a catalyst. (Special 200 0 0—3 2749 5) This raw material is gallium and sodium azide.
- a 1 G a N solid solution single crystal (size: 300-500 Mi click b down, composition Al 0 22 Ga 0 78 N. .) Have been successfully cultivate. Disclosure of the invention
- An object of the present invention is to provide a new method for growing A 1 N single crystals.
- Another object of the present invention is to provide a high-quality A 1 N single crystal.
- the present invention is characterized by growing an A 1 N single crystal by pressurizing a melt containing a flux containing at least gallium, aluminum, and sodium in a nitrogen-containing atmosphere. This relates to the manufacturing method.
- the present invention relates to an A 1 N single crystal characterized by being grown by this method.
- an AIN single crystal is grown by pressurizing a melt containing gallium, aluminum, and sodium in a nitrogen-containing atmosphere.
- the This is not limited to gallium alone, and we have found that, for example, indium (I n), lithium (L i), zinc (Z n), bismuth (B i) have similar effects. It was.
- a substrate made of A 1 N single crystal or an A 1 N template in which an A 1 N single crystal thin film is formed on a base substrate is preferable.
- the base substrate various substrates such as a sapphire substrate, a GaAs substrate, a GaAlAs substrate, a GaP substrate, an InP substrate, a silicon substrate, and an SiC substrate can be used.
- the thickness of the A 1 N thin film There is no particular limitation on the thickness of the A 1 N thin film. However, since this thin film plays a role of selectively generating nuclei for bulk single crystal growth, its thickness may be basically thin as long as it plays such a role.
- a 1 N thin film is deposited by MOCVD, HVPE, laser CVD, laser ablation, reactive sputtering, reactive ion plating, gas phase methods such as cluster ion deposition, or other methods. It may be.
- nitrogen raw material in addition to nitrogen gas and ammonia, compounds containing sodium and nitrogen such as Na azide, Na azazine, Na hydrazide and the like can be used.
- aluminum raw material aluminum metal is preferable, but aluminum nitride powder can also be used.
- gallium raw material gallium metal is preferable, but gallium nitride powder can also be used.
- the A 1 N single crystal is grown at a nitrogen partial pressure of 50 atm or less. The inventors have found that under such low pressure conditions, nitrides of elements other than aluminum, such as G a N, are difficult to precipitate, and only A 1 N single crystals precipitate.
- the nitrogen partial pressure is preferably 40 atm or less, and more preferably 30 atm or less. Further, from the viewpoint of promoting the dissolution of nitrogen into the raw material, the nitrogen partial pressure is preferably 1 atm or more.
- the nitrogen-containing atmosphere may consist only of nitrogen or may contain a gas other than nitrogen. Argon can be illustrated as gas other than nitrogen.
- the total pressure of the atmosphere is preferably 50 atm or more, and more preferably 100 atm or more, from the viewpoint of suppressing the evaporation of the flux. Also, if the total pressure of the atmosphere exceeds 2000 atmospheres, the density of the high-pressure gas and the density of the growth solution approach each other, making it difficult to hold the growth solution in the crucible. Is preferably 2000 atm or less.
- the temperature at the time of growth can be selected as appropriate, but A 1 N is more likely to selectively precipitate at a relatively high temperature, for example, preferably 850 ° C. or higher, more preferably 900 ° C. or higher. There is no particular upper limit on the temperature at the time of growth. However, since the vapor pressure of Na is increased, a temperature of 1 200 ° C or lower is desirable, and 1 100 ° C or lower is more preferable.
- the molar ratio of Ga, Al, and Na is not particularly limited as long as it does not phase separate.
- a 1 is preferably in a ratio of 100 to 10 mol
- Na is preferably in a ratio of 10 to 300 mol.
- the amount of gallium may be reduced (internal distribution). It may be added to the whole as it is (outside distribution). Two or more of these elements may be added simultaneously.
- a 1N template a 1 m thick aluminum nitride thin film epitaxially grown on a sapphire single crystal wafer
- the aluminum crucible and A 1 N template are housed in a stainless steel pressure-resistant container, and the atmosphere is nitrogen-argon mixed gas (nitrogen 10%) at 1200 ° C and 500 atmospheres (nitrogen partial pressure 50 atmospheres).
- the temperature was raised and the pressure was increased and maintained at 1 200 ° C and 500 atmospheres for 100 hours.
- an aluminum nitride single crystal with a thickness of about 1 mm was grown on the A 1 N template.
- gallium nitride did not precipitate.
- the presence or absence of gallium nitride precipitation was confirmed as follows. After the experiment, the solid component remaining in the crucible was taken out, pulverized, and subjected to powder X-ray diffraction analysis. As a result, a diffraction peak characteristic of GaN was not confirmed.
- Example 2 Experiments were performed in the same manner as in Example 1 except that nitrogen gas was used as the atmosphere gas, the pressure during growth was 10 atm, and the temperature was 850 ° C. As a result, it was confirmed that an aluminum nitride single crystal having a thickness of about 200 mm grew to an A IN template ⁇ . Gallium nitride did not precipitate.
- Example 2 Experiments were performed in the same manner as in Example 1 except that indium with a purity of 99.999% was internally arranged as 50% of Ga and the temperature was set to 10 ° to 0 ° C.
- Example 2 The experiment was performed in the same manner as in Example 2 except that the pressure at the time of growth was 100 atm. However, on the A 1 N template, A 1 G a N crystals containing a small amount of A 1 were grown, and no A 1 N single crystal was obtained.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077001732A KR101357460B1 (ko) | 2004-09-16 | 2005-09-05 | Ain 단결정의 제조 방법 및 ain 단결정 |
JP2006535854A JP4780720B2 (ja) | 2004-09-16 | 2005-09-05 | AlN単結晶の製造方法およびAlN単結晶 |
EP05778521A EP1806439A4 (en) | 2004-09-16 | 2005-09-05 | METHOD OF MANUFACTURING MONOCRYSTALS OF AlN AND MONOCRYSTAL OF AlN |
US11/682,385 US7449064B2 (en) | 2004-09-16 | 2007-03-06 | Method for producing AlN single crystal and AlN single crystal |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-269319 | 2004-09-16 | ||
JP2004269319 | 2004-09-16 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/682,385 Continuation US7449064B2 (en) | 2004-09-16 | 2007-03-06 | Method for producing AlN single crystal and AlN single crystal |
Publications (1)
Publication Number | Publication Date |
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WO2006030718A1 true WO2006030718A1 (ja) | 2006-03-23 |
Family
ID=36059971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/016672 WO2006030718A1 (ja) | 2004-09-16 | 2005-09-05 | AlN単結晶の製造方法およびAlN単結晶 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7449064B2 (ja) |
EP (1) | EP1806439A4 (ja) |
JP (1) | JP4780720B2 (ja) |
KR (1) | KR101357460B1 (ja) |
CN (1) | CN100582324C (ja) |
WO (1) | WO2006030718A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008117564A1 (ja) | 2007-03-27 | 2008-10-02 | Ngk Insulators, Ltd. | 窒化物単結晶の製造方法 |
JP2008266067A (ja) * | 2007-04-19 | 2008-11-06 | Ngk Insulators Ltd | 窒化アルミニウム単結晶の製造方法 |
JP2010118391A (ja) * | 2008-11-11 | 2010-05-27 | Sumitomo Electric Ind Ltd | AlxGa1−xN結晶の成長方法 |
WO2012008545A1 (ja) * | 2010-07-14 | 2012-01-19 | 住友金属鉱山株式会社 | 窒化アルミニウム結晶の製造方法 |
US10280518B2 (en) | 2015-10-23 | 2019-05-07 | Adeka Corporation | Etching liquid composition and etching method |
WO2020161860A1 (ja) * | 2019-02-07 | 2020-08-13 | 日本碍子株式会社 | 窒化アルミニウムガリウム単結晶の育成方法および融液組成物 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4753869B2 (ja) * | 2004-03-31 | 2011-08-24 | 日本碍子株式会社 | 窒化ガリウム単結晶の育成方法 |
JP5651481B2 (ja) * | 2009-01-23 | 2015-01-14 | 日本碍子株式会社 | 3b族窒化物結晶 |
JP2017122028A (ja) * | 2016-01-07 | 2017-07-13 | Jfeミネラル株式会社 | 窒化アルミニウム単結晶 |
CN105780124B (zh) * | 2016-03-12 | 2018-05-22 | 东莞市中镓半导体科技有限公司 | 一种激光辅助iii-v族晶体生长装置及方法 |
Citations (2)
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JP2003119099A (ja) | 2001-10-11 | 2003-04-23 | Sumitomo Metal Ind Ltd | 窒化アルミニウム単結晶の製造方法 |
JP2003335600A (ja) * | 2002-03-14 | 2003-11-25 | Sumitomo Metal Ind Ltd | AlN単結晶の製造方法 |
Family Cites Families (6)
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JP3957918B2 (ja) | 1999-05-17 | 2007-08-15 | 独立行政法人科学技術振興機構 | 窒化ガリウム単結晶の育成方法 |
JP2002293696A (ja) * | 2001-03-29 | 2002-10-09 | Japan Science & Technology Corp | GaN単結晶の製造方法 |
JP4278330B2 (ja) * | 2002-01-10 | 2009-06-10 | 株式会社リコー | Iii族窒化物結晶製造方法およびiii族窒化物結晶製造装置 |
US7524691B2 (en) * | 2003-01-20 | 2009-04-28 | Panasonic Corporation | Method of manufacturing group III nitride substrate |
JP4397695B2 (ja) * | 2003-01-20 | 2010-01-13 | パナソニック株式会社 | Iii族窒化物基板の製造方法 |
US7221037B2 (en) * | 2003-01-20 | 2007-05-22 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing group III nitride substrate and semiconductor device |
-
2005
- 2005-09-05 JP JP2006535854A patent/JP4780720B2/ja active Active
- 2005-09-05 WO PCT/JP2005/016672 patent/WO2006030718A1/ja active Application Filing
- 2005-09-05 CN CN200580027729A patent/CN100582324C/zh not_active Expired - Fee Related
- 2005-09-05 KR KR1020077001732A patent/KR101357460B1/ko active IP Right Grant
- 2005-09-05 EP EP05778521A patent/EP1806439A4/en not_active Withdrawn
-
2007
- 2007-03-06 US US11/682,385 patent/US7449064B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003119099A (ja) | 2001-10-11 | 2003-04-23 | Sumitomo Metal Ind Ltd | 窒化アルミニウム単結晶の製造方法 |
JP2003335600A (ja) * | 2002-03-14 | 2003-11-25 | Sumitomo Metal Ind Ltd | AlN単結晶の製造方法 |
Non-Patent Citations (6)
Title |
---|
MAT. RES. BULL., vol. 9, 1974, pages 331 - 336 |
PHYS. STAT. SOL., vol. 188, 2001, pages 415 - 419 |
See also references of EP1806439A4 |
YAMANE HISANORI ET AL: "Natrium o Mochiita AIN no Teion Gosei.", THE CERAMIC SOCIETY OF JAPAN SHUNKI SYMPOSIUM KOEN YOKOSHU., vol. 11, 1998, pages 157, XP008118378 * |
YANO M ET AL: "Growth of nitride crystals, BN, AIN and GaN by using a Na flux.", DIAMOND AD RELATED MATERIALS., vol. 9, 2000, pages 512 - 515, XP004199807 * |
YASUI K ET AL: "Growth of Al x Ga 1-x N and In y Ga 1-y N Single Crystals Using the Na Flux Method.", PHYS STAT SOL., vol. 188, no. 1, 2001, pages 415 - 419, XP002999861 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008117564A1 (ja) | 2007-03-27 | 2008-10-02 | Ngk Insulators, Ltd. | 窒化物単結晶の製造方法 |
US8506705B2 (en) | 2007-03-27 | 2013-08-13 | Ngk Insulators, Ltd. | Method for manufacturing nitride single crystal |
JP2008266067A (ja) * | 2007-04-19 | 2008-11-06 | Ngk Insulators Ltd | 窒化アルミニウム単結晶の製造方法 |
JP2010118391A (ja) * | 2008-11-11 | 2010-05-27 | Sumitomo Electric Ind Ltd | AlxGa1−xN結晶の成長方法 |
WO2012008545A1 (ja) * | 2010-07-14 | 2012-01-19 | 住友金属鉱山株式会社 | 窒化アルミニウム結晶の製造方法 |
JP2012167001A (ja) * | 2010-07-14 | 2012-09-06 | Sumitomo Metal Mining Co Ltd | 窒化アルミニウム結晶の製造方法 |
US8735905B2 (en) | 2010-07-14 | 2014-05-27 | Sumitomo Metal Mining Co., Ltd. | Method for producing aluminum nitride crystals |
US10280518B2 (en) | 2015-10-23 | 2019-05-07 | Adeka Corporation | Etching liquid composition and etching method |
WO2020161860A1 (ja) * | 2019-02-07 | 2020-08-13 | 日本碍子株式会社 | 窒化アルミニウムガリウム単結晶の育成方法および融液組成物 |
JPWO2020161860A1 (ja) * | 2019-02-07 | 2021-09-30 | 日本碍子株式会社 | 窒化アルミニウムガリウム単結晶の育成方法および融液組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN101006207A (zh) | 2007-07-25 |
CN100582324C (zh) | 2010-01-20 |
US7449064B2 (en) | 2008-11-11 |
JPWO2006030718A1 (ja) | 2008-05-15 |
KR101357460B1 (ko) | 2014-02-03 |
EP1806439A4 (en) | 2010-03-24 |
JP4780720B2 (ja) | 2011-09-28 |
EP1806439A1 (en) | 2007-07-11 |
US20070144427A1 (en) | 2007-06-28 |
KR20070052268A (ko) | 2007-05-21 |
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