WO2006016435A1 - Système de traitement,méthode de traitement, moyen d'enregistrement pour ordinateur et programmation - Google Patents

Système de traitement,méthode de traitement, moyen d'enregistrement pour ordinateur et programmation Download PDF

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Publication number
WO2006016435A1
WO2006016435A1 PCT/JP2005/005797 JP2005005797W WO2006016435A1 WO 2006016435 A1 WO2006016435 A1 WO 2006016435A1 JP 2005005797 W JP2005005797 W JP 2005005797W WO 2006016435 A1 WO2006016435 A1 WO 2006016435A1
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WIPO (PCT)
Prior art keywords
information
alarm
processing
unit
storage unit
Prior art date
Application number
PCT/JP2005/005797
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English (en)
Japanese (ja)
Inventor
Osamu Tanaka
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US10/541,379 priority Critical patent/US20060235558A1/en
Publication of WO2006016435A1 publication Critical patent/WO2006016435A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q90/00—Systems or methods specially adapted for administrative, commercial, financial, managerial or supervisory purposes, not involving significant data processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0264—Control of logging system, e.g. decision on which data to store; time-stamping measurements

Definitions

  • the present invention relates to a processing system and a processing method including a processing device that performs a predetermined process on an object to be processed when manufacturing a semiconductor device, for example, a computer-readable storage medium, and a computer program.
  • a semiconductor wafer (hereinafter simply referred to as a wafer), and various processing apparatuses are used for that purpose.
  • a processing apparatus include a cleaning processing apparatus that performs a drying process after immersing a wafer in one or a plurality of processing tanks in which a processing liquid is stored.
  • Such a cleaning processing apparatus includes a temperature sensor that detects the temperature of the processing liquid supplied to the substrate, a concentration sensor that detects the concentration of the processing liquid, a position sensor that detects the position of the processing liquid in the tank, and the like.
  • a control system is provided for detecting the state of the processing device and controlling the processing device based on the various detection data. This control system also issues an alarm that the processing device may fail if the detected value of the sensor exceeds a preset allowable value during operation of the processing device.
  • a control unit is provided in each processing device, and these control units are connected to a host computer.
  • the host computer performs tracking processing of each processing device through exchange of various data with the control unit of each processing device.
  • the processing power received by each processing device is accumulated as a history, and the contents are displayed on a display device, and various parameters of the processing device are corrected and an abnormality is detected based on the process data.
  • Patent Document 1 in such a unified management method using a host computer, accumulated process data is limited, and abnormality or characteristic deterioration of a processing apparatus can be detected at an early stage.
  • a controller that collects all process data generated by the control unit of each processing device, analyzes the collected process data, and outputs the analysis results is disclosed as being difficult. Yes. As a result, the process data to be grasped can be increased, and the change with time of each processing apparatus can be detected early.
  • Patent Document 1 Japanese Patent Laid-Open No. 11-16797
  • An object of the present invention is to provide a processing system and a processing method capable of easily identifying the cause of occurrence of an alarm when an alarm is generated, and a computer-readable storage medium for performing such control. And providing a computer program.
  • a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units
  • An abnormality detection unit that detects an abnormality in detection information
  • an alarm generation unit that generates an alarm when the abnormality detection unit detects an abnormality
  • detection information of the detection means and alarm information are processed by the processing device.
  • An information storage unit that accumulates as a history, an alarm related information acquisition unit that acquires information related to an alarm selected from the alarms that have occurred, and an alarm that is acquired by the alarm related information acquisition unit.
  • a processing system including a display unit for displaying related information is provided.
  • a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units
  • An anomaly detector that detects anomalies in detected information and an alarm when the anomaly detector detects an anomaly Alarm generation unit that generates the alarm, the detection information of the detection means, and alarm information are stored as the processing history of the processing device, and outline information corresponding to each alarm is described, and an alarm that can be linked to the processing history
  • An information storage unit that pre-stores a table, and alarm information selected from the alarms that have been selected from the alarms that have been generated, and the information power stored as the processing history in the information storage unit.
  • a process comprising: an alarm related information acquisition unit that acquires sequential information that leads to the occurrence of the selected alarm as link information; and a display unit that displays the alarm related information acquired by the alarm related information acquisition unit
  • a system is provided.
  • a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each of the processing devices.
  • a device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information.
  • the control device receives from each device control unit.
  • An information storage unit that stores process information and alarm information as the processing history of each processing device, and an alarm storage unit that selectively acquires information related to an alarm selected from the generated alarms.
  • a distribution obtaining unit, the processing system comprising a display unit for displaying the alarm-related information acquiring unit is related to the acquired alarm information is provided.
  • a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each processing device.
  • a device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information. The control device receives from each device control unit.
  • An information storage unit that stores process information and alarm information as a processing history of each of the processing devices, describes summary information corresponding to each alarm, and stores in advance an alarm table that can be linked to the processing history; Occur The alarm information of the selected information is selected from the alarm table of the information storage unit, and the sequential information from the information stored as the processing history in the information storage unit to the occurrence of the selected alarm is selected.
  • a processing system includes an alarm-related information acquisition unit that acquires information as link information, and a display unit that displays information related to an alarm acquired by the alarm-related information acquisition unit.
  • the detection information of the plurality of detection means and the detection information of the plurality of detection means power provided in the processing apparatus that performs a predetermined process on the object to be detected are detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, and information related to the alarm selected from the generated alarms is acquired and related to the acquired alarm.
  • a processing method for displaying information to be provided is provided.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information stored in the information storage unit as a processing history, and outline information corresponding to each alarm is recorded, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance,
  • Information about the selected alarm is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit is selected to generate the selected alarm.
  • Acquires sequential information as link information, and displays the alarm table power selected information and the acquired sequential information leading to the alarm occurrence Management how is provided.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained.
  • a computer-readable recording medium is provided that includes software that causes a computer to control information to be displayed.
  • an abnormality is detected in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed.
  • the information of the alarm that occurs when the alarm is issued is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance.
  • the selected information from the alarm table of the information storage unit is selected from the alarm table selected from the generated alarms, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm.
  • a computer-readable recording medium including software for acquiring sequential information as link information, and controlling the alarm table power to display the selected information and the acquired sequential information leading to the occurrence of an alarm. Is done.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained.
  • a computer program is provided that includes software that causes a computer to display information to be displayed.
  • abnormalities in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed are detected.
  • Information on alarms generated upon detection is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance.
  • the alarm information selected from the generated alarms is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm.
  • Sequential information is acquired as link information, and the information selected from the alarm table and the sequential information leading to the alarm occurrence are displayed.
  • the process information from the processing device including the detection information of the detection means and the alarm information are stored in the information storage unit as the processing history of the processing device, and the generated alarm Information related to the alarm selected from the system is selectively acquired and displayed, so that the information that caused the alarm can be grasped from the processing history.
  • the cause of the alarm can be easily grasped.
  • by grasping the detailed information from the processing history accumulated in the information accumulation unit to the level of iZo data until the occurrence of the alarm of a predetermined alarm the detailed cause of the occurrence of the alarm can be grasped. It is possible to identify the cause of the alarm more easily and reliably. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm, so that if the abnormality occurs in the processing device, the processing device can be returned in a short time, and the downtime of the processing device can be shortened. Can do.
  • FIG. 1 is a block diagram showing the overall configuration of a processing system according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an example of a processing apparatus used in a processing system according to an embodiment of the present invention.
  • FIG. 3 is a plan view showing an example of a processing apparatus used in the processing system according to the embodiment of the present invention.
  • FIG. 4 is a schematic view showing a first chemical tank and a piping system of a processing apparatus used in a processing system according to an embodiment of the present invention.
  • FIG. 5 is a block diagram showing main detection means connected to a block controller (BC).
  • BC block controller
  • FIG. 6 is a diagram showing an example of description in the alarm table.
  • FIG. 7 is a diagram showing an example of a monitor screen displaying an alarm.
  • FIG. 8 A diagram showing an example of a monitor screen showing sequential detailed information up to the occurrence of an alarm.
  • FIG. 9 A diagram showing an example of a monitor screen on which related ⁇ address data is displayed before and after an alarm occurs.
  • FIG. 10 is a block diagram showing the overall configuration of a processing system according to another embodiment of the present invention.
  • FIG. 11 is a block diagram showing a schematic configuration of a main controller (MC) of the processing apparatus used in the processing system of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a block diagram showing the overall configuration of the processing system according to this embodiment.
  • This processing system 1 includes a processing apparatus 10 that performs liquid processing on a wafer and cleans it, a block controller (BC) 11 that is a lower control system of the processing apparatus 10, and a main controller (MC) that is an upper control system. ) 12
  • each processing apparatus 10 includes a plurality of detection means for detecting various processing states, and process information including detection information of the detection means force is input to the block controller (BC) 11.
  • the main controller (MC) 12 is connected to a monitor 21 and an operation unit 22 capable of displaying various screens.
  • the main controller (MC) 12 receives process information from the block controller (BC), sends a control signal to the block controller (BC), and processes the received process information.
  • a control unit 13 that performs processing, an error detection unit 15 that analyzes process information received from the control unit 13 and detects an abnormality, an alarm generation unit 16 that generates an alarm based on the abnormality detection information of the abnormality detection unit 15, and a control Section 13 receives the process information received from the block controller (BC) 11, the information storage section 17 that stores the occurrence of an alarm and other alarm information, and information related to each alarm from the information storage section 17.
  • a control unit 19 is a control unit 19.
  • the control unit 13 also has general-purpose computer power, and performs predetermined control using a program for executing predetermined processing, that is, a recipe.
  • the recipe may be stored in a hard disk or semiconductor memory, or may be set at a predetermined position in a state of being stored in a portable storage medium such as a CDROM or DVD.
  • recipes may be appropriately transmitted from other devices via, for example, a dedicated line.
  • the control of the processing device 10 in the control unit 13 is sent via the block controller (BC) 11.
  • Process information input to the control unit 13 via the block controller (BC) 11 by outputting a control signal to each component of the processing device 10 based on the received signal of each detection means.
  • the signal is processed by the control unit 13 and then stored in the information storage unit 17.
  • the control unit 13 transmits an alarm generation signal to the alarm generation unit 16 based on the abnormality detection signal from the abnormality detection unit 15 and stores the alarm generation signal in the information storage unit 17.
  • the information accumulating unit 17 stores an alarm table that explains the contents of the alarm in advance for each alarm. Each alarm is given an ID, and the alarm table is filled with the ID! Each alarm is called with that ID.
  • the contents of the alarm table include information on what each alarm is alerting (alarm description), the reason for one or more possible occurrences of the alarm, Furthermore, there are rough actions that can be taken for each reason.
  • the alarm table is linked to the accumulated processing history, so that sequential information related to the alarm occurrence can be called up.
  • the alarm related information acquisition unit 18 selectively acquires information related to the alarm among the information stored in the information storage unit 17. Specifically, an alarm with a predetermined ID stored in the information storage unit 17 is selected, and the selected alarm that is linked to the alarm table is also stored in the processing history. It is possible to selectively acquire information related to, specifically sequential details leading to the occurrence of an alarm, and related IZO address information before and after the occurrence of the alarm (IZO name, ⁇ information, ⁇ address). And timer information can be selectively acquired. In this case, it is possible to set a predetermined time before and after the occurrence of the alarm and select information during that time. Thus, the alarm information selected by the alarm related information acquisition unit 18 can be displayed on the monitor 21.
  • a predetermined alarm is selected.
  • a screen showing a description of the alarm, one or more possible causes of the alarm, and the actions that can be taken for each reason.
  • a screen that details the sequential information until an alarm is displayed for each occurrence reason pattern screen 2
  • a screen that displays related IZO address data before and after the alarm occurs.
  • screen 2 can be displayed by touching (clicking) a predetermined position provided on screen 1
  • screen 3 can be displayed by touching (clicking) a predetermined position on screen 2.
  • FIG. 2 is a perspective view of the processing apparatus 10
  • FIG. 3 is a plan view thereof.
  • the processing apparatus 10 carries in and out the carrier C in which the wafer W is stored in a horizontal state, carries out and stores the carrier C, and performs a cleaning process using a predetermined chemical solution for the wafer and W, and also performs drying.
  • the processing unit 32 mainly performs processing, and an interface unit 33 that transfers the wafer W between the loading / unloading unit 31 and the processing unit 32.
  • the loading / unloading section 31 can store a plurality of carriers C, and a carrier loading / unloading section 34 on which a stage 41 for mounting a carrier C capable of accommodating a predetermined number, for example, 25 wafers W, is formed. It consists of a career stock section 35.
  • the carrier C has a structure in which the wafer W is accommodated substantially horizontally at a predetermined interval, and one side surface thereof serves as a loading / unloading port for the wafer W, and the loading / unloading port can be opened and closed by a lid.
  • the carrier stock portion 35 is provided with a plurality of carrier holding members 43, and the carrier C is held by these carrier holding members 43.
  • the carrier C storing the unprocessed wafer W placed on the stage 41 is carried into the carrier stock unit 35 by the carrier transfer device 42, while the carrier C storing the processed wafer W and W is The carrier is transferred from the carrier stock unit 35 to the stage 41 using the carrier transfer device 42.
  • a shutter 44 is provided between the carrier loading / unloading section 34 and the carrier stock section 35, and the shutter C is transferred when the carrier C is transferred between the carrier loading / unloading section 34 and the carrier stock section 35. 44 is opened, otherwise, the veg shutter 44 that performs atmosphere separation between the carrier loading / unloading section 34 and the carrier stock section 35 is closed.
  • the carrier transport device 42 can, for example, move at least the carrier C in the X direction.
  • the arm 42a such as a multi-joint arm or a telescopic arm that is driven so as to be able to function is held, and the arm 42a grips the carrier C and transports the carrier C.
  • the carrier transporting device 42 can be driven in the Y direction and the Z direction (height direction) by a Y-axis driving mechanism and a Z-axis driving mechanism (not shown), and is thereby arranged at a predetermined position.
  • Carrier C can be placed on carrier holding member 43.
  • the carrier holding member 43 is provided in the vicinity of the wall surface forming the carrier stock portion 35, and is provided in a plurality of stages, for example, four stages in the height direction at each location.
  • the carrier stock section 35 temporarily stores the carrier C in which the wafer W before processing is stored, and also stores the carrier C in which the inside from which the wafer W is taken out is empty.
  • a window portion 46 is formed at the boundary between the carrier stock portion 35 and the interface portion 33, and the lid of the carrier C faces the window portion 46 on the carrier stock portion 35 side of the window portion 46.
  • an inspection Z loading / unloading stage 45 having the same structure as the carrier holding member 43 is provided so that the carrier C can be placed as described above.
  • the carrier transport device 42 may hold the carrier C for a predetermined time in a predetermined space facing the window 46 where the inspection Z loading / unloading stage 45 is not provided.
  • a lid opening / closing mechanism 47 for opening / closing the lid of the carrier C placed on the inspection Z loading / unloading stage 45 is provided on the carrier stock 35 side of the window 46.
  • the Ueno and W in the carrier C can be carried out to the interface unit 33 side. Conversely, the force on the interface unit 33 side also enters the empty carrier C. It is also possible to carry in wafer W.
  • the lid opening / closing mechanism 47 may be provided on the interface part 33 side of the window part 46.
  • a wafer inspection device 48 for measuring the number of wafers W in the carrier C is provided on the interface section 33 side of the window section 46.
  • the wafer inspection apparatus 48 for example, scans an infrared sensor head having a transmission unit and a reception unit in the Z direction in the vicinity of the X direction end of the wafer W accommodated in the carrier C, and between the transmission unit and the reception unit. Inspect the number of wafers W by detecting infrared transmitted or reflected light signal.
  • the storage state of the wafers W for example, whether the wafers W are arranged in parallel at a predetermined pitch in the carrier C, are checked.
  • the wafer inspection apparatus 48 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected number of stored sheets and the stored state to the block controller (BC) 11 as an output signal.
  • the operations of the carrier transfer device 42 and the wafer inspection device 48 are controlled by the host computer 15 via the block controller (BC) 11 and the main controller (MC) 12.
  • the carrier transfer device 42 is controlled so that the carrier C is stored in the carrier stock unit 35.
  • the opening / closing of the shutter 44, the opening / closing of the window 46, and the operation of the lid opening / closing mechanism 47 are controlled in conjunction with the movement of the carrier transport device 42.
  • the interface unit 33 is provided with a wafer carry-in / out device 49, a wafer transfer device 51, and a wafer transfer device 52.
  • the wafer transfer device 51 transfers the wafer W to and from the wafer carry-in / out device 49 and converts the posture of the wafer W, and between the posture changing mechanism 51a and the wafer transfer device 52.
  • a wafer vertical holding mechanism 51b for transferring the wafer W.
  • the wafer loading / unloading device 49 unloads the wafers W and W in the carrier C through the window 46 and delivers them to the attitude changing mechanism 51a, and receives the wafer W after the liquid processing from the attitude changing mechanism 51a.
  • the wafer carry-in / out device 49 has two arms, an arm 49a for carrying an unprocessed wafer W and an arm 49b for carrying a processed wafer W.
  • the arms 49a and 49b are adapted to the alignment pitch of the wafer W in the carrier C so that a plurality of wafers W stored in the carrier C can be held together, and a predetermined number of Z directions Are arranged at predetermined intervals.
  • the arms 49a and 49b move (slide) or extend and retract in the direction of arrow A, and can move up and down by a predetermined distance in the Z direction.
  • the entire wafer carry-in / out device 49 is configured to be rotatable in the ⁇ direction, so that the arms 49a and 49b can be connected to either the carrier C placed on the inspection Z carry-in / out stage 45 or the posture changing mechanism 51a. This is also accessible. [0040] In the wafer carry-in / out device 49, for example, in a state where the arm 49a is on the wafer transfer device 51 side, the arm 49a is inserted below the wafer W, and the arm 49a is moved up by a predetermined distance to remove the wafer W.
  • the arm 49a is held, and then the arm 49a is moved in the opposite direction to carry out the wafer W in the carrier C.
  • the arm 49a is moved to deliver the wafer W held on the arm 49a to the posture changing mechanism 51a.
  • the arm 49b is moved to take out the liquid-treated weno and W from the posture change structure 5 la, and then the wafer carry-in / out device 49 is moved to 90 °.
  • the arm 49b is placed on the wafer transfer device 51 side, and the arm 49b is moved to carry the wafer W held by the arm 49b into the empty carrier C.
  • the posture changing mechanism 51a of the wafer transfer device 51 a plurality of horizontal wafers W are received from the wafer loading / unloading device 49 by the guide member, and the guide member is rotated in this state to vertically change the wafer posture. Convert to state.
  • the wafer vertical holding mechanism 51b can store 50 wafers W for two carriers whose posture has been changed to the vertical state by the posture changing mechanism 51a at an arrangement pitch that is half the wafer arrangement pitch in the carrier C.
  • the Ueno and W for the two carriers are transferred to the wafer transfer device 52.
  • the wafer transfer device 52 delivers the wafer W in a vertical state with the wafer vertical holding mechanism 5 lb, carries the unprocessed wafer W into the processing unit 32, and conversely ends the liquid processing or the like.
  • the transferred wafer W is unloaded from the processing unit 32 and transferred to the wafer vertical holding mechanism 5 lb.
  • the wafer W is held by three chucks 58a to 58c.
  • the wafer transfer device 52 is provided with a guide rail 53 so that the wafer transfer device 52 can transfer the wafer W to and from the wafer vertical holding mechanism 51b and transfer the wafer W to the processing unit 32. It moves in the X direction along, and can enter the processing section 32 and exit the Z.
  • the wafer W is transferred between the wafer vertical holding mechanism 5 lb and the wafer transfer device 52.
  • the wafer detection sensor 57 that inspects the alignment state of the wafer W is provided at ing. Note that the wafer detection sensor 57 is not limited to such a position, and may be at a position where inspection can be performed until the processed wafer W is transferred to the wafer carry-in / out device 49.
  • the wafer detection sensor 57 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected value to the block controller (BC) 11 as an output signal.
  • the interface unit 33 is provided with a parking area 40a on the side of the position where the wafer W is transferred between the wafer vertical holding mechanism 51b and the wafer transfer device 52.
  • the parking area 40a For example, an unprocessed wafer W can be put on standby. For example, when liquid processing or drying processing is performed on a lot of wafers W, the wafer W to be started next is parked using the time when it is not necessary to operate the wafer transfer device 52. Transport to area 40a. As a result, for example, compared to the case where the wafer W is transferred from the carrier stock unit 35, it is possible to shorten the movement time of the wafer W to the processing unit 32 and improve the throughput. It is out.
  • the processing unit 32 includes a liquid processing unit 38, a drying unit 39, and a knocking area 40b. From the interface unit 33 side, the drying unit 39, the liquid processing unit 38, and the parking area 40b are arranged in this order. Is arranged in.
  • the wafer transfer device 52 can move in the processing unit 32 along a guide rail 53 extending in the X direction.
  • the parking area 40b is a place for waiting for an unprocessed wafer W.
  • the wafer W in the lot where liquid processing or drying processing is performed is performed, and the wafer W which should start liquid processing next using the time when it is not necessary to operate the wafer transfer device 52 is in the parking area 40b. It is conveyed to. Since the parking area 40b is adjacent to the liquid processing unit 38, the moving time of the wafer W can be shortened at the start of the liquid processing, and the throughput can be improved.
  • the liquid treatment unit 38 includes a first chemical tank 61, a second chemical tank 63, a third chemical tank 65, a first water tank 62, a second water tank 64, and a third water tank 66.
  • first chemical bath 61, the first flush bath 62, the second chemical bath 63, the second flush bath 64, the third The chemical tank 65 and the third washing tank 66 are arranged in this order.
  • the first For transporting wafers W between the chemical bath 61 and the first washing bath 62, and for transporting wafers W between the second chemical bath 63 and the second washing bath 64.
  • a chemical liquid for removing organic dirt and removing surface metal impurities is stored in the first chemical tank 61.
  • SPM liquid mixed sulfuric acid / peroxy-hydrogen water mixed solution
  • the second chemical tank 63 stores a chemical solution for removing deposits such as particles, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, hydrogen, and water).
  • the chemical solution tank 65 stores an etching solution for etching the acid film formed on the surface of the wafer W, for example, dilute hydrofluoric acid (DHF).
  • DHF dilute hydrofluoric acid
  • a mixture of hydrofluoric acid (HF) and ammonium fluoride (buffered hydrofluoric acid (BHF)) can be used in addition to dilute hydrofluoric acid.
  • phosphoric acid can be used as an etchant.
  • the first to third rinsing tanks 62, 64 and 66 are for removing the chemical solution adhering to the wafer W by the liquid treatments in the first to third chemical solution tanks 61, 63 and 65, respectively.
  • Various washing methods such as water and quick dampening are used.
  • the transfer device 67 has a drive mechanism that can be moved up and down in the Z direction.
  • the wafer W delivered from the wafer transfer device 52 is lowered and immersed in the first chemical tank 61, and a predetermined time has elapsed.
  • the wafer W is pulled up later, and then the wafer W is moved in parallel in the X direction so that the wafer W is immersed in the first rinsing tank 62, held for a predetermined time, and then lifted.
  • the wafer W that has been processed in the first washing tank 62 is once returned to the chucks 58a to 58c of the wafer transfer device 52, and then transferred from the wafer transfer device 52 to the transfer device 68.
  • the transport devices 68 and 69 have the same configuration as the transport device 67 and operate in the same manner.
  • the liquid processing unit 38 is provided with a liquid processing unit thermometer 59 for detecting the temperature of the atmosphere in the liquid processing unit 38 and a liquid processing unit pressure gauge 60 for detecting the pressure.
  • the liquid processing unit thermometer 59 and liquid processing unit pressure gauge 60 are wired to the block controller (BC) 11 as signal input devices. Force is transmitted to the block controller (BC) 11 as an output signal.
  • the drying unit 39 is provided with a rinsing tank 54 and a chuck cleaning mechanism 56 that cleans the chucks 58a to 58c of the wafer transfer device 52.
  • An isopropyl alcohol (IPA) is disposed above the rinsing tank 54, for example.
  • a drying chamber (not shown) is provided for drying the wafer W by supplying the steam.
  • a transfer device 55 for transferring the wafer W between the washing tank 54 and the drying chamber is provided, and the wafer W washed with water in the washing bath 54 is pulled up by the transfer device 55 and IPA-dried in the drying chamber. It has become so.
  • the transfer device 55 is configured in the same manner as the transfer device 67 and the like described above except that it cannot move in the X direction, and the wafer W can be transferred to and from the wafer transfer device 52.
  • the first chemical tank 61 is composed of a box-shaped inner tank 80 and an outer tank 81 that are large enough to accommodate the wafer W.
  • the upper surface of the inner tank 80 is open, and the wafer W is inserted into and removed from the inner tank 80 through the opening on the upper surface.
  • the outer tub 81 is mounted so as to surround the opening of the inner tub 80 so as to receive the chemical liquid in which the upper end force of the inner tub 80 also overflows.
  • liquid level sensors 82a and 82b for measuring the position of the liquid level are provided on the liquid level of the chemical solution stored in the inner tank 80 and the outer tank 81, respectively. These liquid level sensors 82a and 82b are wired to the block controller (BC) 11 as signal input devices, and transmit the detected liquid level positions to the block controller (BC) 11 as output signals.
  • a circulation supply circuit 84 is connected between the inner tank 80 and the outer tank 81 to supply a chemical solution in a circulating manner during the etching process of the wafer W.
  • One of the circulation supply circuit 84 is connected to the bottom surface of the outer tub 81, and in the middle of the circulation supply circuit 84, a pump 86, a temperature control unit 88, and a filter 90 are arranged in this order, and the other of the circulation supply circuit 84 is It is connected to the nozzle in the inner tank 80.
  • the chemical liquid overflowed from the inner tank 80 to the outer tank 81 flows into the circulation supply circuit 84, and is passed through the temperature control unit 88 and the filter 90 in this order by the operation of the pump 86, and after temperature adjustment and cleaning, the nozzle After that, it is again supplied into the inner tank 80.
  • the nozzle is disposed below the outer tank 81 and is configured to supply a chemical toward the surface of the wafer W.
  • the temperature control unit 88 requires that the chemical solution in the inner tank 80 be lower or higher than a predetermined processing temperature. As described above, the chemical solution supplied from the circulation supply circuit 84 into the inner tank 80 has a function of cooling or heating in advance before the wafer W is immersed. In this way, by supplying the chemical solution that has been cooled or heated in advance into the inner tank 80, the temperature of the chemical liquid in the inner tank 80 can be maintained.
  • the temperature controller 88 is wired to the block controller (BC) 11 as a signal output device, and receives the control signal output from the block controller (BC) 11.
  • the temperature control unit 88 is composed of a heater, a heat exchanger, and a cooling water supply means, and a valve and a heater power block arranged in the middle of the cooling water supply path for introducing the cooling water into the heat exchanger. Connected to controller (BC) 11. Then, a predetermined control signal is transmitted to either the heater or the valve via the block controller (BC) 11 as necessary.
  • a branch pipe 92 for connecting the chemical solution in the circulation supply circuit 84 to the outer tank 81 is connected. Further, the branch pipe 92 detects the temperature and concentration of the chemical solution.
  • a concentration / temperature detector 95 is provided.
  • the concentration / temperature detector 95 is wired to the block controller (BC) 11 as a signal input device.
  • the concentration'temperature detector 95 is provided with a thermometer 95a for detecting the temperature of the chemical solution and a concentration meter 95b for detecting the concentration of the chemical solution, and the detected temperature and concentration are respectively output to the block controller.
  • BC Send to 11.
  • the branch pipe 92 is narrower than the pipe of the circulation supply circuit 84.
  • the diameter of the branch pipe 92 is 1Z3 which is the diameter of the circulation supply circuit 84.
  • the first chemical solution tank 61 is provided with a chemical solution supply circuit 100 for filling the chemical solution into the tank.
  • the chemical solution supply circuit 100 includes a chemical solution supply source 101, a pure water supply source 102, and a mixing supply unit 103 that mixes the chemical solution and pure water.
  • the mixed supply unit 103 is wired to the block controller (BC) 11 as a signal output device.
  • the chemical solution supply circuit 100 has a function as a chemical solution replenishment means, and when the concentration of the chemical solution in the chemical solution tank 61 decreases, Control is performed to replenish the chemical solution from the liquid supply source 101 and the pure water supply source 102.
  • the other end of the chemical solution supply circuit 100 is connected to the outer tank 81, and the adjusted chemical solution flows through the circulation supply circuit 84, and after the temperature is adjusted, the downward force of the inner tank 80 Wafer Supplied to W.
  • the force which is the configuration of the first chemical tank 61 and the piping system as described above.
  • the first and second chemical tanks 63 and 65 also have substantially the same configuration and function, and thus the description thereof is omitted.
  • the first to third rinsing tanks 62, 64, 66 also basically have the same configuration and function. That is, it has a water washing tank composed of an inner tank and an outer tank and a circulation supply circuit, and pure water is supplied to the water washing tank from the pure water supply circuit.
  • the processing apparatus 10 includes various detection means for detecting the state of each component. That is, as described above, the liquid processing unit thermometer 59 and the liquid processing unit pressure gauge 60 are installed as detection means for detecting the state of the atmosphere in the liquid processing unit 38. As the detection means for detecting the state of the first chemical tank 61 and each part of its piping system, the liquid level sensors 82a and 82b, the thermometer 95a of the temperature 'concentration detector 95 and the concentration meter 95b are installed. . Similar liquid level sensors, temperature / concentration detector thermometers and concentration meters are installed in the second and third chemical tanks 63 and 65 and the piping system.
  • a wafer inspection device 48 is installed in the interface unit 33 as a detection means for detecting the storage state of the wafer and W, and a wafer detection sensor 57 is installed as a detection means for detecting the arrangement state of the wafers W. .
  • various detection means are provided. These perform predetermined detection as described above, and transmit the detection value as an output signal to the block controller (BC) 11 as shown in FIG.
  • the output signals of a, the densitometer 95b, and many other detection means are transmitted to the block controller (BC) 11 at a predetermined time interval and to the main controller (MC) 12.
  • the process information such as detection information transmitted to the main controller (MC) 12 in this way reaches the control unit 13 and is used for controlling the processing apparatus as described above.
  • the alarm generation unit Based on the process information and the abnormality detected by the abnormality detection unit 15, the alarm generation unit The alarm information generated in 16 is stored in the information storage unit 17, and information related to a predetermined alarm is selected from the information storage unit 17 by the alarm related information acquisition unit 18, so that detailed information on the alarm is grasped. It is possible to accurately determine the cause of the abnormality.
  • the carrier C constituting one lot is placed on the inspection Z loading / unloading stage 45 from the loading / unloading section 31 or the carrier stock section 35 using the carrier conveying apparatus 42, and the carrier opening / closing mechanism 47 performs carrier loading. Open the lid of C, and then open the window 46, and inspect the number of wafers W stored in the carrier and the storage state by the wafer inspection device 48.
  • the carrier C which has been detected as having no abnormality by inspection, is delivered to the posture changing structure 51a by the arm 49a, and the posture is changed in the posture changing 51a and then transferred to the wafer vertical holding mechanism 51b.
  • the posture change mechanism 51a converts the posture of the wafer W, and the wafer W is delivered to the arm 49a wafer vertical holding mechanism 5 lb.
  • 50 wafers W are arranged in the wafer vertical holding mechanism 5 lb.
  • the wafer vertical holding mechanism 5 lb is slid to the wafer transfer device 52 side, and the wafer W is transferred to the chucks 58a to 58c.
  • the wafer transfer device 52 holding the wafer W is moved along the guide rail 53 to the position of the first chemical bath 61 or the first washing bath 62 of the liquid processing unit 38, and the wafer W is moved to the first transfer device 67.
  • liquid processing of wafer W is started.
  • the liquid treatment of the wafer W includes, for example, immersion in the first chemical bath 61 and cleaning by the first water washing bath 62, immersion in the second chemical bath 63 and cleaning by the second water washing bath 64, and third cleaning. It is carried out in the order of immersion in the chemical tank 65 and cleaning by the third water washing tank 66.
  • the wafer W that has been processed in the liquid processing unit 38 is once transferred to the wafer transfer device 52 and then transferred to the transfer device 55 of the drying unit 39 to be subjected to a drying process.
  • the wafer W that has been dried is transferred to the wafer transfer device 52, returned to the interface unit 33, and the state of the wafer W is inspected by the detection sensor 57.
  • the liquid processing apparatus 1 is stopped and maintenance is performed.
  • the wafer W returned to the interface unit 33 after the liquid processing is completed transports the unprocessed wafer W from the carrier stock unit 35 to the wafer transfer device 52.
  • the procedure can be reversed and stored in the empty carrier C placed on the inspection Z loading / unloading stage 45.
  • the carrier C containing the wafer W after the liquid processing is transferred to the carrier loading / unloading section 34 and sent to the next process.
  • wafer inspection device 48 wafer detection sensor 57
  • liquid processing unit thermometer 59 liquid processing unit pressure gauge 60
  • liquid level sensor 82 liquid level sensor 82
  • temperature / concentration detection This is executed while being controlled by the block controller (BC) 11 and the main controller (MC) 12 based on detection signals from the thermometer 95a and the densitometer 95b installed in the unit 95 and many other detection means.
  • the detection signals of these detection means reach the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and the control unit 13 is based on these signals. Then, a predetermined control signal is transmitted to the processing device 10, and a series of cleaning processes are performed based on these control signals.
  • the process information including these detection signals from the processing device 10 is transmitted to the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and after signal processing, It is stored in the information storage unit 17.
  • the process information is also transmitted to the abnormality detection unit 15, and when the process information deviates from a predetermined set value force, it is determined as abnormal, and an abnormality detection signal is transmitted to the control unit 13.
  • the control unit 13 is based on the abnormality detection signal.
  • Send an alarm signal to the alarm generator 16 and the alarm generator 16 generates an alarm.
  • the alarm is generated by displaying information on the monitor 21 in addition to emitting sound and light information.
  • the alarm generation signal is also transmitted to the information storage unit 17 and stored as a processing history.
  • the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table is selected. Linked to it, the sequential detailed information related to the alarm in the processing history, and also the IZO address information and timer information related to the selected alarm are selectively acquired, and the acquired alarm information Can be displayed on the monitor 21.
  • the alarm generated when the liquid level sensors 82a and 82b detect the liquid level lower limit is shown in FIG.
  • 3071 is assigned as the alarm ID
  • the alarm content is that the alarm is the detection of the lower limit of the chemical tank, a detailed explanation thereof, and a summary of possible alarm occurrence reasons.
  • the reason why the circulation was executed without liquid (reason 1), sensor misalignment or malfunction (reason 2), drain valve malfunction or chemical tank damage (reason 3), An outline of these measures (actions) is given for each reason.
  • the alarm table includes link information described later.
  • the monitor 21 becomes a screen on which the above contents are displayed as shown in FIG. 7 (screen 1).
  • Sequential detailed information up to the occurrence of an alarm in the processing history linked to the alarm information in the alarm table can be selected for each of the above reasons, and the screen of the monitor 21 at that time is As shown in Figure 8 (Screen 2).
  • the screen corresponding to Reason 1 in FIG. 8 (“Pattern 1”) is displayed by touching (clicking) the “Detail” portion in FIG.
  • the circulation pump is turned on, circulation starts, and the level sensor is switched off.
  • touching (clicking) on the “Pattern2” and “Pattern3” sections it is possible to selectively obtain sequential detailed information until the alarm corresponding to Reason 2 and Reason 3 occurs.
  • the screen By touching (clicking) the “Currently View” portion of the screen in FIG. 8, the screen displays the related IZO name and information before and after the alarm shown in FIG. 9 (screen 3).
  • the IZO names CIRC_PUMP_START, OUTER_BATH ⁇ OWER ⁇ IMIT (outer tank lower limit), INNER_BATH ⁇ OWER ⁇ IMIT (inner tank lower limit) corresponding to the circulation pump start are displayed, and these IZO information (ONZOFF information) is also displayed.
  • I ⁇ information shows that the painted partial force is ON, and the horizontal axis is the time axis.
  • the circulation pump is in the ON state both before and after the alarm is generated.
  • the lower limit of the outer tank and the lower limit of the inner tank are turned OFF when the alarm is generated, and are in the OFF state thereafter.
  • the cause of the alarm is the one corresponding to the level sensor.
  • the IZO address on this display screen, it is possible to specify the ⁇ address on the screen.
  • Power with Parameter column This is the parameter (process information) linked to the alarm. In this example, there is no information to be displayed in the Parameter column.
  • the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table power also selects the alarm and is linked to it in the processing history! Sequential detailed information related to other alarms, IZO address data and timer information related to the selected alarm can be selectively acquired, and the acquired alarm information can be displayed on the monitor 21.
  • the alarm tape alarm alerts what each alarm is, information about the alarm (description of the alarm), and the reason for the occurrence of one or more possible alarms
  • information such as rough actions that can be taken for each cause is included, and this information is displayed, and sequential information up to the occurrence of the linked alarm is displayed in detail. Even if the skill level of the operator is low, it is possible to reliably grasp the alarm information and take appropriate measures.
  • the processing history stored in the information storage unit 17 includes abnormality detection data and alarm information as described above, and therefore information related to troubles occurring in the processing device 10 is also stored. Therefore, the next time a problem occurs, the cause of the abnormality can be efficiently estimated by extracting the data force related information stored in the information storage unit 17. wear. In this case, it is preferable that related information can be searched with an arbitrary keyword.
  • FIG. 10 is a block diagram showing a processing system according to this embodiment.
  • This processing system 1 ′ has a plurality of the above processing devices 10, and each processing device 10 has a block controller (BC) 11 / as a lower control system and a main controller (MC) 12 ′ as a higher control system. It is controlled by.
  • the processing system! / Is an advanced 'group' controller (hereinafter referred to as AGC) that analyzes process data generated by the host computer 115 that controls the entire system and the control system of each processing device and outputs the results. 11 7).
  • AGC advanced 'group' controller
  • Each processing device 10 is provided with a plurality of detection means for detecting various processing states, as in the previous embodiment, and this detection information is input to the block controller (BC) 11 ′ and the main controller (MC) 12 'is transmitted to the host computer 115 and the A GC 117.
  • BC block controller
  • MC main controller
  • the main controller (MC) 12 'receives the detection signal via the block controller (BC) 11' and controls each component of the processing device 10 based on the detection signal.
  • a control unit 110 that transmits a signal
  • an abnormality detection unit 111 that analyzes process information received from the control unit 110 and detects an abnormality
  • an alarm generation unit 112 that generates an alarm based on the abnormality detection information of the abnormality detection unit 111
  • Memory 118 in which all process information and alarm information received from the processing device 10 via the block controller (BC) 1 ⁇ 'and processed by the control unit 110 are temporarily stored, and preset from the memory 118.
  • HCI Host Communi
  • HCI send buffer 1 19 which is a logical interface means between the HCI send buffer 1 19 and the host computer 115, which writes out some types of process data (data 1, 3) and writes information.
  • cation interface) 113 and a RAP (Remote Agent Process) 116 which is a logical interface means with the AGC 117.
  • the HCI 113 exchanges various data with the host computer 115 through the data transmission system 114 such as TC PZIP.
  • RAP116 various data are exchanged with AGC117. Retrieval is performed through the data transmission system 114.
  • the HCI 113 selects only some of the preset types of process data from all the process data obtained from the processing device 10 by the main controller 12 'and transmits the data to the host computer 115. . That is, the HCI 113 takes out some preset types of process data (data 1 and 3) from the memory 118 in which all the process data generated by the main controller (MC) 12 ′ is temporarily stored. Are written in the HCI transmission buffer 119, and the contents of the HCI transmission buffer 119 are collectively transmitted to the host computer 115. The status data generated by the main controller (MC) 12 'is also sent.
  • the RAP 116 unconditionally transmits all the process data obtained from the processing apparatus 10 to the AGC 117 by the main controller (MC) 12 '. That is, the RAP 116 sequentially reads out the process data stored in the process data storage memory 118 in the main controller (MC) ⁇ 2 ′, and transfers it to the AGC 117 without changing the data structure. However, operations that rearrange the data order or exclude only a small part of the data may be performed here.
  • the host computer 115 controls the overall operation of each processing device 10, such as performing tracking processing of each processing device 10 by exchanging various data with the main controller (MC) 12 'of each processing device 10. I do.
  • AGC117 targets all process data obtained from each processing device 10, including centralized management of recipes (process condition values) for each processing device and process control of each processing device 10 based on the recipe.
  • analysis processing, statistical processing, centralized monitoring processing of process data and analysis Z statistical results, and processing to reflect the analysis Z statistical results in the recipe are performed.
  • the AGC 117 is composed of an AGC server 117a and an AGC client 117b!
  • the AGC server 117 a includes a communication iZF (interface unit) 121, an EQM control unit 122, and an information storage unit 123.
  • the communication IZF (interface unit) 121 transmits / receives various data to / from the main controller (MC) 12 ′ of each processing apparatus 10 and the AGC client 117b through the data transmission system 114.
  • the EQM control unit 122 performs a process for each processing device based on the process conditions defined in advance and the process information obtained from each processing device 10. Processing to correct received parameters, store received process information and alarm information, and store received parameters in the information storage unit 123, and search the information storage unit 123 for process data to be transferred to the AGC client 117b Etc. mainly.
  • the AGC client 117b can use and process the process data and the analysis result of the process data transferred from the AGC server 117a, and the captured user process data and the analysis results.
  • Data conversion unit 126 that converts data into a format data
  • display control unit 127 that controls the display of converted data on a monitor (not shown)
  • process data including measurement data such as film thickness on the object to be processed
  • the recipe correction unit 128 that updates the recipe (process conditions) to be optimized and the information related to each alarm acquired from each processing device 10 from the information storage unit 123 are selectively acquired.
  • an alarm related information acquisition unit 129 an alarm related information acquisition unit 129.
  • each processing apparatus 10 performs processing on the wafer W that is an object to be processed by the processing operation exactly the same as in the previous embodiment.
  • the processing operation of each processing apparatus 10 is executed while being controlled by the corresponding block controller (BC) 11 / and main controller ( ⁇ 12 ′) under process control by the host computer 115 and AGC 117.
  • BC block controller
  • ⁇ 12 ′ main controller
  • each main controller (MC) 12 ' process data obtained by 10 processing devices via the block controller (BC) 11 / is written to the process data storage memory 118 via the control unit 110. .
  • the process data written in the process data storage memory 118 is transferred to the host computer 115 via an independent channel of the data transmission system 114 such as TCPZIP by the HCI 113 and RAP1 16 which are logical interface means for the external transfer. Forwarded to AGC 117.
  • the AGC server 117a of the AGC 117 receives the process information and the alarm information transmitted by the RAP 116 of the main controller (MC) 12 'of each processing device 10, stores the information in the information storage unit 123, and The process information and recipe data power also generate parameter correction values for each processing device 10 and send them to the main controller (MC) 12 '. From the control unit 110 of the main controller (MC) 12', the block controller (BC) Process control by sending control signals to each component of each processing device 10 via 11 / I do.
  • the 80-day server 117 & reads out the corresponding process data from the information storage unit 123 and transmits it to the AGC client 117b through the communication IZF 121.
  • the process data transferred to the AGC client 117b is converted into data that can be processed by the client user at the data converter 126, and the information displayed on the monitor is controlled by the display controller 127.
  • the process data transferred to the AGC client 117b is analyzed and statistically processed by the data analysis unit 125, and the analysis result is converted to data in a user-usable format in the same way as the process data by the data conversion unit 126. Converted and displayed on the monitor. This realizes unified management of the entire substrate processing system on the AGC client 117b.
  • the data analysis unit 125 of the AGC client 117b performs process data analysis result capability detection of abnormalities in the processing data separately from the detection of abnormalities in each processing device and the occurrence of an alarm, and performs abnormal prediction.
  • the fact is output to the monitor and notified to the AGC server 117a.
  • the AGC server 117a performs control such as instructing the main controller (MC) 12 'that controls the processing apparatus 10 detected or predicted to be abnormal to stop the processing apparatus. .
  • the recipe correction unit 128 of the AGC client 117b performs an update process for optimizing the recipe (process condition) from the analysis result for the process data including the measurement data such as the film thickness measurement result on the substrate.
  • the alarm related information acquisition unit 129 stores the selected alarm in the information storage unit 123 in the same manner as in the previous embodiment.
  • the stored alarm table power also selects that alarm, selects sequential details related to the alarm in the processing history linked to it, and also selects IZO address data and timer information related to the selected alarm.
  • the acquired alarm information can be displayed on the monitor.
  • the sequential information from the processing history accumulated in the information accumulation unit 123 to the occurrence of the alarm of a predetermined alarm is detailed to the level of I / O address data. Because it can be grasped, the cause of the alarm can be easily identified. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm. Therefore, when an abnormality occurs in any of the processing apparatuses 10, the processing apparatus can be restored in a short time, and the downtime of the processing apparatus 10 can be shortened.
  • the host computer 115 when the host computer 115 is down, the process data spooling processing by the AGC 117 is performed. That is, the host computer 115 can take in the process data of the down period from the AGC 117 immediately after the recovery. As a result, the tracking processing of each processing apparatus 10 by the host computer 115 can be resumed immediately after recovery.
  • the wafer inspection device 48, wafer detection sensor 57, liquid processing unit thermometer 59, liquid processing unit pressure gauge 60, liquid level sensor 82a, 82b, temperature / concentration detector 95 All or almost all detailed process data represented by detection signals from thermometers and densitometers installed in 95 can be imported into AGC117 for centralized monitoring. Apart from detecting an abnormality in each processing device 10 and generating an alarm, it is possible to detect changes in the state of each processing device over time at an early stage. Thereby, it becomes possible to improve the maintenance reliability of the processing system including a large number of processing devices 10.
  • each processing apparatus 10 is updated by updating the analysis results for the detailed process data including the measurement data such as the film thickness measurement results on the substrate and the data in the statistical result power recipe to more preferable values.
  • the analysis results for the detailed process data including the measurement data such as the film thickness measurement results on the substrate and the data in the statistical result power recipe to more preferable values.
  • the process data obtained from each processing device 10 is taken into the AGC 117 and centrally monitored, thereby expanding the range of information that can be grasped as the status of each processing device, and processing device abnormalities and deterioration states. Therefore, it is possible to find out the life in more detail and earlier than when the AGC117 is not provided.
  • the present invention is not limited to the above-described embodiment, and can be variously modified.
  • the apparatus for cleaning the wafer by performing liquid processing has been described as an example of the processing apparatus.
  • the present invention is not limited to this and can be applied to other processing apparatuses.
  • the object to be processed is not limited to a wafer.
  • the present invention is particularly effective because there are many types of information to be detected and the number of types of alarms is enormous.

Abstract

Ce système de traitement (1) est équipé d'un processeur (10) pour effectuer une tâche prédéfinie vers un wafer (W); une pluralité de moyens de détection pour détecter le statut dans le processeur (10); une zone de détection d'anomalies (15) qui détecte les anomalies provenant d'information de détection de la pluralité de moyens de détections; une zone génératrice d'alarmes (16) pour générer une alarme lorsque la partie de détection d'anomalies détecte une anomalie; une zone de stockage d'informations qui accumule les informations de détection depuis les moyens de détection du processeur (10) et l'information des alarmes en tant qu'historique du traitement du processeur (10);une zone d'alarme-connexe d'information (18)pour acquérir sélectivement une information relative à une alarme choisie de la zone de stockage d'informations (17); et une zone d'affichage (21) pour afficher les informations de l'alarme-connexe acquise par la partie d'alarme-connexe d'informations (18).
PCT/JP2005/005797 2002-08-28 2005-03-29 Système de traitement,méthode de traitement, moyen d'enregistrement pour ordinateur et programmation WO2006016435A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007293683A (ja) * 2006-04-26 2007-11-08 Tokyo Electron Ltd 群管理システム、プロセス情報管理装置、およびプログラム
CN111966054A (zh) * 2020-07-15 2020-11-20 国家能源集团宁夏煤业有限责任公司 化工装置全厂大联锁保护方法及装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6763910B2 (ja) * 2018-05-30 2020-09-30 横河電機株式会社 異常検出装置、異常検出方法、異常検出プログラム及び記録媒体
JP2021173914A (ja) * 2020-04-28 2021-11-01 キヤノン株式会社 情報処理装置、及び情報処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030023340A1 (en) * 2001-07-05 2003-01-30 Toru Kitamoto Substrate processing system managing apparatus information of substrate processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030023340A1 (en) * 2001-07-05 2003-01-30 Toru Kitamoto Substrate processing system managing apparatus information of substrate processing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007293683A (ja) * 2006-04-26 2007-11-08 Tokyo Electron Ltd 群管理システム、プロセス情報管理装置、およびプログラム
WO2007125884A1 (fr) * 2006-04-26 2007-11-08 Tokyo Electron Limited Système de gestion de groupe, dispositif de gestion d'informations de traitement et programme
CN111966054A (zh) * 2020-07-15 2020-11-20 国家能源集团宁夏煤业有限责任公司 化工装置全厂大联锁保护方法及装置
CN111966054B (zh) * 2020-07-15 2023-10-13 国家能源集团宁夏煤业有限责任公司 化工装置全厂大联锁保护方法及装置

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