WO2006016435A1 - Processing system, processing method, computer readable recording medium and computer program - Google Patents

Processing system, processing method, computer readable recording medium and computer program Download PDF

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Publication number
WO2006016435A1
WO2006016435A1 PCT/JP2005/005797 JP2005005797W WO2006016435A1 WO 2006016435 A1 WO2006016435 A1 WO 2006016435A1 JP 2005005797 W JP2005005797 W JP 2005005797W WO 2006016435 A1 WO2006016435 A1 WO 2006016435A1
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WO
WIPO (PCT)
Prior art keywords
information
alarm
processing
unit
storage unit
Prior art date
Application number
PCT/JP2005/005797
Other languages
French (fr)
Japanese (ja)
Inventor
Osamu Tanaka
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US10/541,379 priority Critical patent/US20060235558A1/en
Publication of WO2006016435A1 publication Critical patent/WO2006016435A1/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q90/00Systems or methods specially adapted for administrative, commercial, financial, managerial or supervisory purposes, not involving significant data processing
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0264Control of logging system, e.g. decision on which data to store; time-stamping measurements

Definitions

  • the present invention relates to a processing system and a processing method including a processing device that performs a predetermined process on an object to be processed when manufacturing a semiconductor device, for example, a computer-readable storage medium, and a computer program.
  • a semiconductor wafer (hereinafter simply referred to as a wafer), and various processing apparatuses are used for that purpose.
  • a processing apparatus include a cleaning processing apparatus that performs a drying process after immersing a wafer in one or a plurality of processing tanks in which a processing liquid is stored.
  • Such a cleaning processing apparatus includes a temperature sensor that detects the temperature of the processing liquid supplied to the substrate, a concentration sensor that detects the concentration of the processing liquid, a position sensor that detects the position of the processing liquid in the tank, and the like.
  • a control system is provided for detecting the state of the processing device and controlling the processing device based on the various detection data. This control system also issues an alarm that the processing device may fail if the detected value of the sensor exceeds a preset allowable value during operation of the processing device.
  • a control unit is provided in each processing device, and these control units are connected to a host computer.
  • the host computer performs tracking processing of each processing device through exchange of various data with the control unit of each processing device.
  • the processing power received by each processing device is accumulated as a history, and the contents are displayed on a display device, and various parameters of the processing device are corrected and an abnormality is detected based on the process data.
  • Patent Document 1 in such a unified management method using a host computer, accumulated process data is limited, and abnormality or characteristic deterioration of a processing apparatus can be detected at an early stage.
  • a controller that collects all process data generated by the control unit of each processing device, analyzes the collected process data, and outputs the analysis results is disclosed as being difficult. Yes. As a result, the process data to be grasped can be increased, and the change with time of each processing apparatus can be detected early.
  • Patent Document 1 Japanese Patent Laid-Open No. 11-16797
  • An object of the present invention is to provide a processing system and a processing method capable of easily identifying the cause of occurrence of an alarm when an alarm is generated, and a computer-readable storage medium for performing such control. And providing a computer program.
  • a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units
  • An abnormality detection unit that detects an abnormality in detection information
  • an alarm generation unit that generates an alarm when the abnormality detection unit detects an abnormality
  • detection information of the detection means and alarm information are processed by the processing device.
  • An information storage unit that accumulates as a history, an alarm related information acquisition unit that acquires information related to an alarm selected from the alarms that have occurred, and an alarm that is acquired by the alarm related information acquisition unit.
  • a processing system including a display unit for displaying related information is provided.
  • a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units
  • An anomaly detector that detects anomalies in detected information and an alarm when the anomaly detector detects an anomaly Alarm generation unit that generates the alarm, the detection information of the detection means, and alarm information are stored as the processing history of the processing device, and outline information corresponding to each alarm is described, and an alarm that can be linked to the processing history
  • An information storage unit that pre-stores a table, and alarm information selected from the alarms that have been selected from the alarms that have been generated, and the information power stored as the processing history in the information storage unit.
  • a process comprising: an alarm related information acquisition unit that acquires sequential information that leads to the occurrence of the selected alarm as link information; and a display unit that displays the alarm related information acquired by the alarm related information acquisition unit
  • a system is provided.
  • a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each of the processing devices.
  • a device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information.
  • the control device receives from each device control unit.
  • An information storage unit that stores process information and alarm information as the processing history of each processing device, and an alarm storage unit that selectively acquires information related to an alarm selected from the generated alarms.
  • a distribution obtaining unit, the processing system comprising a display unit for displaying the alarm-related information acquiring unit is related to the acquired alarm information is provided.
  • a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each processing device.
  • a device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information. The control device receives from each device control unit.
  • An information storage unit that stores process information and alarm information as a processing history of each of the processing devices, describes summary information corresponding to each alarm, and stores in advance an alarm table that can be linked to the processing history; Occur The alarm information of the selected information is selected from the alarm table of the information storage unit, and the sequential information from the information stored as the processing history in the information storage unit to the occurrence of the selected alarm is selected.
  • a processing system includes an alarm-related information acquisition unit that acquires information as link information, and a display unit that displays information related to an alarm acquired by the alarm-related information acquisition unit.
  • the detection information of the plurality of detection means and the detection information of the plurality of detection means power provided in the processing apparatus that performs a predetermined process on the object to be detected are detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, and information related to the alarm selected from the generated alarms is acquired and related to the acquired alarm.
  • a processing method for displaying information to be provided is provided.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information stored in the information storage unit as a processing history, and outline information corresponding to each alarm is recorded, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance,
  • Information about the selected alarm is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit is selected to generate the selected alarm.
  • Acquires sequential information as link information, and displays the alarm table power selected information and the acquired sequential information leading to the alarm occurrence Management how is provided.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained.
  • a computer-readable recording medium is provided that includes software that causes a computer to control information to be displayed.
  • an abnormality is detected in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed.
  • the information of the alarm that occurs when the alarm is issued is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance.
  • the selected information from the alarm table of the information storage unit is selected from the alarm table selected from the generated alarms, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm.
  • a computer-readable recording medium including software for acquiring sequential information as link information, and controlling the alarm table power to display the selected information and the acquired sequential information leading to the occurrence of an alarm. Is done.
  • an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected.
  • Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained.
  • a computer program is provided that includes software that causes a computer to display information to be displayed.
  • abnormalities in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed are detected.
  • Information on alarms generated upon detection is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance.
  • the alarm information selected from the generated alarms is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm.
  • Sequential information is acquired as link information, and the information selected from the alarm table and the sequential information leading to the alarm occurrence are displayed.
  • the process information from the processing device including the detection information of the detection means and the alarm information are stored in the information storage unit as the processing history of the processing device, and the generated alarm Information related to the alarm selected from the system is selectively acquired and displayed, so that the information that caused the alarm can be grasped from the processing history.
  • the cause of the alarm can be easily grasped.
  • by grasping the detailed information from the processing history accumulated in the information accumulation unit to the level of iZo data until the occurrence of the alarm of a predetermined alarm the detailed cause of the occurrence of the alarm can be grasped. It is possible to identify the cause of the alarm more easily and reliably. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm, so that if the abnormality occurs in the processing device, the processing device can be returned in a short time, and the downtime of the processing device can be shortened. Can do.
  • FIG. 1 is a block diagram showing the overall configuration of a processing system according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an example of a processing apparatus used in a processing system according to an embodiment of the present invention.
  • FIG. 3 is a plan view showing an example of a processing apparatus used in the processing system according to the embodiment of the present invention.
  • FIG. 4 is a schematic view showing a first chemical tank and a piping system of a processing apparatus used in a processing system according to an embodiment of the present invention.
  • FIG. 5 is a block diagram showing main detection means connected to a block controller (BC).
  • BC block controller
  • FIG. 6 is a diagram showing an example of description in the alarm table.
  • FIG. 7 is a diagram showing an example of a monitor screen displaying an alarm.
  • FIG. 8 A diagram showing an example of a monitor screen showing sequential detailed information up to the occurrence of an alarm.
  • FIG. 9 A diagram showing an example of a monitor screen on which related ⁇ address data is displayed before and after an alarm occurs.
  • FIG. 10 is a block diagram showing the overall configuration of a processing system according to another embodiment of the present invention.
  • FIG. 11 is a block diagram showing a schematic configuration of a main controller (MC) of the processing apparatus used in the processing system of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a block diagram showing the overall configuration of the processing system according to this embodiment.
  • This processing system 1 includes a processing apparatus 10 that performs liquid processing on a wafer and cleans it, a block controller (BC) 11 that is a lower control system of the processing apparatus 10, and a main controller (MC) that is an upper control system. ) 12
  • each processing apparatus 10 includes a plurality of detection means for detecting various processing states, and process information including detection information of the detection means force is input to the block controller (BC) 11.
  • the main controller (MC) 12 is connected to a monitor 21 and an operation unit 22 capable of displaying various screens.
  • the main controller (MC) 12 receives process information from the block controller (BC), sends a control signal to the block controller (BC), and processes the received process information.
  • a control unit 13 that performs processing, an error detection unit 15 that analyzes process information received from the control unit 13 and detects an abnormality, an alarm generation unit 16 that generates an alarm based on the abnormality detection information of the abnormality detection unit 15, and a control Section 13 receives the process information received from the block controller (BC) 11, the information storage section 17 that stores the occurrence of an alarm and other alarm information, and information related to each alarm from the information storage section 17.
  • a control unit 19 is a control unit 19.
  • the control unit 13 also has general-purpose computer power, and performs predetermined control using a program for executing predetermined processing, that is, a recipe.
  • the recipe may be stored in a hard disk or semiconductor memory, or may be set at a predetermined position in a state of being stored in a portable storage medium such as a CDROM or DVD.
  • recipes may be appropriately transmitted from other devices via, for example, a dedicated line.
  • the control of the processing device 10 in the control unit 13 is sent via the block controller (BC) 11.
  • Process information input to the control unit 13 via the block controller (BC) 11 by outputting a control signal to each component of the processing device 10 based on the received signal of each detection means.
  • the signal is processed by the control unit 13 and then stored in the information storage unit 17.
  • the control unit 13 transmits an alarm generation signal to the alarm generation unit 16 based on the abnormality detection signal from the abnormality detection unit 15 and stores the alarm generation signal in the information storage unit 17.
  • the information accumulating unit 17 stores an alarm table that explains the contents of the alarm in advance for each alarm. Each alarm is given an ID, and the alarm table is filled with the ID! Each alarm is called with that ID.
  • the contents of the alarm table include information on what each alarm is alerting (alarm description), the reason for one or more possible occurrences of the alarm, Furthermore, there are rough actions that can be taken for each reason.
  • the alarm table is linked to the accumulated processing history, so that sequential information related to the alarm occurrence can be called up.
  • the alarm related information acquisition unit 18 selectively acquires information related to the alarm among the information stored in the information storage unit 17. Specifically, an alarm with a predetermined ID stored in the information storage unit 17 is selected, and the selected alarm that is linked to the alarm table is also stored in the processing history. It is possible to selectively acquire information related to, specifically sequential details leading to the occurrence of an alarm, and related IZO address information before and after the occurrence of the alarm (IZO name, ⁇ information, ⁇ address). And timer information can be selectively acquired. In this case, it is possible to set a predetermined time before and after the occurrence of the alarm and select information during that time. Thus, the alarm information selected by the alarm related information acquisition unit 18 can be displayed on the monitor 21.
  • a predetermined alarm is selected.
  • a screen showing a description of the alarm, one or more possible causes of the alarm, and the actions that can be taken for each reason.
  • a screen that details the sequential information until an alarm is displayed for each occurrence reason pattern screen 2
  • a screen that displays related IZO address data before and after the alarm occurs.
  • screen 2 can be displayed by touching (clicking) a predetermined position provided on screen 1
  • screen 3 can be displayed by touching (clicking) a predetermined position on screen 2.
  • FIG. 2 is a perspective view of the processing apparatus 10
  • FIG. 3 is a plan view thereof.
  • the processing apparatus 10 carries in and out the carrier C in which the wafer W is stored in a horizontal state, carries out and stores the carrier C, and performs a cleaning process using a predetermined chemical solution for the wafer and W, and also performs drying.
  • the processing unit 32 mainly performs processing, and an interface unit 33 that transfers the wafer W between the loading / unloading unit 31 and the processing unit 32.
  • the loading / unloading section 31 can store a plurality of carriers C, and a carrier loading / unloading section 34 on which a stage 41 for mounting a carrier C capable of accommodating a predetermined number, for example, 25 wafers W, is formed. It consists of a career stock section 35.
  • the carrier C has a structure in which the wafer W is accommodated substantially horizontally at a predetermined interval, and one side surface thereof serves as a loading / unloading port for the wafer W, and the loading / unloading port can be opened and closed by a lid.
  • the carrier stock portion 35 is provided with a plurality of carrier holding members 43, and the carrier C is held by these carrier holding members 43.
  • the carrier C storing the unprocessed wafer W placed on the stage 41 is carried into the carrier stock unit 35 by the carrier transfer device 42, while the carrier C storing the processed wafer W and W is The carrier is transferred from the carrier stock unit 35 to the stage 41 using the carrier transfer device 42.
  • a shutter 44 is provided between the carrier loading / unloading section 34 and the carrier stock section 35, and the shutter C is transferred when the carrier C is transferred between the carrier loading / unloading section 34 and the carrier stock section 35. 44 is opened, otherwise, the veg shutter 44 that performs atmosphere separation between the carrier loading / unloading section 34 and the carrier stock section 35 is closed.
  • the carrier transport device 42 can, for example, move at least the carrier C in the X direction.
  • the arm 42a such as a multi-joint arm or a telescopic arm that is driven so as to be able to function is held, and the arm 42a grips the carrier C and transports the carrier C.
  • the carrier transporting device 42 can be driven in the Y direction and the Z direction (height direction) by a Y-axis driving mechanism and a Z-axis driving mechanism (not shown), and is thereby arranged at a predetermined position.
  • Carrier C can be placed on carrier holding member 43.
  • the carrier holding member 43 is provided in the vicinity of the wall surface forming the carrier stock portion 35, and is provided in a plurality of stages, for example, four stages in the height direction at each location.
  • the carrier stock section 35 temporarily stores the carrier C in which the wafer W before processing is stored, and also stores the carrier C in which the inside from which the wafer W is taken out is empty.
  • a window portion 46 is formed at the boundary between the carrier stock portion 35 and the interface portion 33, and the lid of the carrier C faces the window portion 46 on the carrier stock portion 35 side of the window portion 46.
  • an inspection Z loading / unloading stage 45 having the same structure as the carrier holding member 43 is provided so that the carrier C can be placed as described above.
  • the carrier transport device 42 may hold the carrier C for a predetermined time in a predetermined space facing the window 46 where the inspection Z loading / unloading stage 45 is not provided.
  • a lid opening / closing mechanism 47 for opening / closing the lid of the carrier C placed on the inspection Z loading / unloading stage 45 is provided on the carrier stock 35 side of the window 46.
  • the Ueno and W in the carrier C can be carried out to the interface unit 33 side. Conversely, the force on the interface unit 33 side also enters the empty carrier C. It is also possible to carry in wafer W.
  • the lid opening / closing mechanism 47 may be provided on the interface part 33 side of the window part 46.
  • a wafer inspection device 48 for measuring the number of wafers W in the carrier C is provided on the interface section 33 side of the window section 46.
  • the wafer inspection apparatus 48 for example, scans an infrared sensor head having a transmission unit and a reception unit in the Z direction in the vicinity of the X direction end of the wafer W accommodated in the carrier C, and between the transmission unit and the reception unit. Inspect the number of wafers W by detecting infrared transmitted or reflected light signal.
  • the storage state of the wafers W for example, whether the wafers W are arranged in parallel at a predetermined pitch in the carrier C, are checked.
  • the wafer inspection apparatus 48 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected number of stored sheets and the stored state to the block controller (BC) 11 as an output signal.
  • the operations of the carrier transfer device 42 and the wafer inspection device 48 are controlled by the host computer 15 via the block controller (BC) 11 and the main controller (MC) 12.
  • the carrier transfer device 42 is controlled so that the carrier C is stored in the carrier stock unit 35.
  • the opening / closing of the shutter 44, the opening / closing of the window 46, and the operation of the lid opening / closing mechanism 47 are controlled in conjunction with the movement of the carrier transport device 42.
  • the interface unit 33 is provided with a wafer carry-in / out device 49, a wafer transfer device 51, and a wafer transfer device 52.
  • the wafer transfer device 51 transfers the wafer W to and from the wafer carry-in / out device 49 and converts the posture of the wafer W, and between the posture changing mechanism 51a and the wafer transfer device 52.
  • a wafer vertical holding mechanism 51b for transferring the wafer W.
  • the wafer loading / unloading device 49 unloads the wafers W and W in the carrier C through the window 46 and delivers them to the attitude changing mechanism 51a, and receives the wafer W after the liquid processing from the attitude changing mechanism 51a.
  • the wafer carry-in / out device 49 has two arms, an arm 49a for carrying an unprocessed wafer W and an arm 49b for carrying a processed wafer W.
  • the arms 49a and 49b are adapted to the alignment pitch of the wafer W in the carrier C so that a plurality of wafers W stored in the carrier C can be held together, and a predetermined number of Z directions Are arranged at predetermined intervals.
  • the arms 49a and 49b move (slide) or extend and retract in the direction of arrow A, and can move up and down by a predetermined distance in the Z direction.
  • the entire wafer carry-in / out device 49 is configured to be rotatable in the ⁇ direction, so that the arms 49a and 49b can be connected to either the carrier C placed on the inspection Z carry-in / out stage 45 or the posture changing mechanism 51a. This is also accessible. [0040] In the wafer carry-in / out device 49, for example, in a state where the arm 49a is on the wafer transfer device 51 side, the arm 49a is inserted below the wafer W, and the arm 49a is moved up by a predetermined distance to remove the wafer W.
  • the arm 49a is held, and then the arm 49a is moved in the opposite direction to carry out the wafer W in the carrier C.
  • the arm 49a is moved to deliver the wafer W held on the arm 49a to the posture changing mechanism 51a.
  • the arm 49b is moved to take out the liquid-treated weno and W from the posture change structure 5 la, and then the wafer carry-in / out device 49 is moved to 90 °.
  • the arm 49b is placed on the wafer transfer device 51 side, and the arm 49b is moved to carry the wafer W held by the arm 49b into the empty carrier C.
  • the posture changing mechanism 51a of the wafer transfer device 51 a plurality of horizontal wafers W are received from the wafer loading / unloading device 49 by the guide member, and the guide member is rotated in this state to vertically change the wafer posture. Convert to state.
  • the wafer vertical holding mechanism 51b can store 50 wafers W for two carriers whose posture has been changed to the vertical state by the posture changing mechanism 51a at an arrangement pitch that is half the wafer arrangement pitch in the carrier C.
  • the Ueno and W for the two carriers are transferred to the wafer transfer device 52.
  • the wafer transfer device 52 delivers the wafer W in a vertical state with the wafer vertical holding mechanism 5 lb, carries the unprocessed wafer W into the processing unit 32, and conversely ends the liquid processing or the like.
  • the transferred wafer W is unloaded from the processing unit 32 and transferred to the wafer vertical holding mechanism 5 lb.
  • the wafer W is held by three chucks 58a to 58c.
  • the wafer transfer device 52 is provided with a guide rail 53 so that the wafer transfer device 52 can transfer the wafer W to and from the wafer vertical holding mechanism 51b and transfer the wafer W to the processing unit 32. It moves in the X direction along, and can enter the processing section 32 and exit the Z.
  • the wafer W is transferred between the wafer vertical holding mechanism 5 lb and the wafer transfer device 52.
  • the wafer detection sensor 57 that inspects the alignment state of the wafer W is provided at ing. Note that the wafer detection sensor 57 is not limited to such a position, and may be at a position where inspection can be performed until the processed wafer W is transferred to the wafer carry-in / out device 49.
  • the wafer detection sensor 57 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected value to the block controller (BC) 11 as an output signal.
  • the interface unit 33 is provided with a parking area 40a on the side of the position where the wafer W is transferred between the wafer vertical holding mechanism 51b and the wafer transfer device 52.
  • the parking area 40a For example, an unprocessed wafer W can be put on standby. For example, when liquid processing or drying processing is performed on a lot of wafers W, the wafer W to be started next is parked using the time when it is not necessary to operate the wafer transfer device 52. Transport to area 40a. As a result, for example, compared to the case where the wafer W is transferred from the carrier stock unit 35, it is possible to shorten the movement time of the wafer W to the processing unit 32 and improve the throughput. It is out.
  • the processing unit 32 includes a liquid processing unit 38, a drying unit 39, and a knocking area 40b. From the interface unit 33 side, the drying unit 39, the liquid processing unit 38, and the parking area 40b are arranged in this order. Is arranged in.
  • the wafer transfer device 52 can move in the processing unit 32 along a guide rail 53 extending in the X direction.
  • the parking area 40b is a place for waiting for an unprocessed wafer W.
  • the wafer W in the lot where liquid processing or drying processing is performed is performed, and the wafer W which should start liquid processing next using the time when it is not necessary to operate the wafer transfer device 52 is in the parking area 40b. It is conveyed to. Since the parking area 40b is adjacent to the liquid processing unit 38, the moving time of the wafer W can be shortened at the start of the liquid processing, and the throughput can be improved.
  • the liquid treatment unit 38 includes a first chemical tank 61, a second chemical tank 63, a third chemical tank 65, a first water tank 62, a second water tank 64, and a third water tank 66.
  • first chemical bath 61, the first flush bath 62, the second chemical bath 63, the second flush bath 64, the third The chemical tank 65 and the third washing tank 66 are arranged in this order.
  • the first For transporting wafers W between the chemical bath 61 and the first washing bath 62, and for transporting wafers W between the second chemical bath 63 and the second washing bath 64.
  • a chemical liquid for removing organic dirt and removing surface metal impurities is stored in the first chemical tank 61.
  • SPM liquid mixed sulfuric acid / peroxy-hydrogen water mixed solution
  • the second chemical tank 63 stores a chemical solution for removing deposits such as particles, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, hydrogen, and water).
  • the chemical solution tank 65 stores an etching solution for etching the acid film formed on the surface of the wafer W, for example, dilute hydrofluoric acid (DHF).
  • DHF dilute hydrofluoric acid
  • a mixture of hydrofluoric acid (HF) and ammonium fluoride (buffered hydrofluoric acid (BHF)) can be used in addition to dilute hydrofluoric acid.
  • phosphoric acid can be used as an etchant.
  • the first to third rinsing tanks 62, 64 and 66 are for removing the chemical solution adhering to the wafer W by the liquid treatments in the first to third chemical solution tanks 61, 63 and 65, respectively.
  • Various washing methods such as water and quick dampening are used.
  • the transfer device 67 has a drive mechanism that can be moved up and down in the Z direction.
  • the wafer W delivered from the wafer transfer device 52 is lowered and immersed in the first chemical tank 61, and a predetermined time has elapsed.
  • the wafer W is pulled up later, and then the wafer W is moved in parallel in the X direction so that the wafer W is immersed in the first rinsing tank 62, held for a predetermined time, and then lifted.
  • the wafer W that has been processed in the first washing tank 62 is once returned to the chucks 58a to 58c of the wafer transfer device 52, and then transferred from the wafer transfer device 52 to the transfer device 68.
  • the transport devices 68 and 69 have the same configuration as the transport device 67 and operate in the same manner.
  • the liquid processing unit 38 is provided with a liquid processing unit thermometer 59 for detecting the temperature of the atmosphere in the liquid processing unit 38 and a liquid processing unit pressure gauge 60 for detecting the pressure.
  • the liquid processing unit thermometer 59 and liquid processing unit pressure gauge 60 are wired to the block controller (BC) 11 as signal input devices. Force is transmitted to the block controller (BC) 11 as an output signal.
  • the drying unit 39 is provided with a rinsing tank 54 and a chuck cleaning mechanism 56 that cleans the chucks 58a to 58c of the wafer transfer device 52.
  • An isopropyl alcohol (IPA) is disposed above the rinsing tank 54, for example.
  • a drying chamber (not shown) is provided for drying the wafer W by supplying the steam.
  • a transfer device 55 for transferring the wafer W between the washing tank 54 and the drying chamber is provided, and the wafer W washed with water in the washing bath 54 is pulled up by the transfer device 55 and IPA-dried in the drying chamber. It has become so.
  • the transfer device 55 is configured in the same manner as the transfer device 67 and the like described above except that it cannot move in the X direction, and the wafer W can be transferred to and from the wafer transfer device 52.
  • the first chemical tank 61 is composed of a box-shaped inner tank 80 and an outer tank 81 that are large enough to accommodate the wafer W.
  • the upper surface of the inner tank 80 is open, and the wafer W is inserted into and removed from the inner tank 80 through the opening on the upper surface.
  • the outer tub 81 is mounted so as to surround the opening of the inner tub 80 so as to receive the chemical liquid in which the upper end force of the inner tub 80 also overflows.
  • liquid level sensors 82a and 82b for measuring the position of the liquid level are provided on the liquid level of the chemical solution stored in the inner tank 80 and the outer tank 81, respectively. These liquid level sensors 82a and 82b are wired to the block controller (BC) 11 as signal input devices, and transmit the detected liquid level positions to the block controller (BC) 11 as output signals.
  • a circulation supply circuit 84 is connected between the inner tank 80 and the outer tank 81 to supply a chemical solution in a circulating manner during the etching process of the wafer W.
  • One of the circulation supply circuit 84 is connected to the bottom surface of the outer tub 81, and in the middle of the circulation supply circuit 84, a pump 86, a temperature control unit 88, and a filter 90 are arranged in this order, and the other of the circulation supply circuit 84 is It is connected to the nozzle in the inner tank 80.
  • the chemical liquid overflowed from the inner tank 80 to the outer tank 81 flows into the circulation supply circuit 84, and is passed through the temperature control unit 88 and the filter 90 in this order by the operation of the pump 86, and after temperature adjustment and cleaning, the nozzle After that, it is again supplied into the inner tank 80.
  • the nozzle is disposed below the outer tank 81 and is configured to supply a chemical toward the surface of the wafer W.
  • the temperature control unit 88 requires that the chemical solution in the inner tank 80 be lower or higher than a predetermined processing temperature. As described above, the chemical solution supplied from the circulation supply circuit 84 into the inner tank 80 has a function of cooling or heating in advance before the wafer W is immersed. In this way, by supplying the chemical solution that has been cooled or heated in advance into the inner tank 80, the temperature of the chemical liquid in the inner tank 80 can be maintained.
  • the temperature controller 88 is wired to the block controller (BC) 11 as a signal output device, and receives the control signal output from the block controller (BC) 11.
  • the temperature control unit 88 is composed of a heater, a heat exchanger, and a cooling water supply means, and a valve and a heater power block arranged in the middle of the cooling water supply path for introducing the cooling water into the heat exchanger. Connected to controller (BC) 11. Then, a predetermined control signal is transmitted to either the heater or the valve via the block controller (BC) 11 as necessary.
  • a branch pipe 92 for connecting the chemical solution in the circulation supply circuit 84 to the outer tank 81 is connected. Further, the branch pipe 92 detects the temperature and concentration of the chemical solution.
  • a concentration / temperature detector 95 is provided.
  • the concentration / temperature detector 95 is wired to the block controller (BC) 11 as a signal input device.
  • the concentration'temperature detector 95 is provided with a thermometer 95a for detecting the temperature of the chemical solution and a concentration meter 95b for detecting the concentration of the chemical solution, and the detected temperature and concentration are respectively output to the block controller.
  • BC Send to 11.
  • the branch pipe 92 is narrower than the pipe of the circulation supply circuit 84.
  • the diameter of the branch pipe 92 is 1Z3 which is the diameter of the circulation supply circuit 84.
  • the first chemical solution tank 61 is provided with a chemical solution supply circuit 100 for filling the chemical solution into the tank.
  • the chemical solution supply circuit 100 includes a chemical solution supply source 101, a pure water supply source 102, and a mixing supply unit 103 that mixes the chemical solution and pure water.
  • the mixed supply unit 103 is wired to the block controller (BC) 11 as a signal output device.
  • the chemical solution supply circuit 100 has a function as a chemical solution replenishment means, and when the concentration of the chemical solution in the chemical solution tank 61 decreases, Control is performed to replenish the chemical solution from the liquid supply source 101 and the pure water supply source 102.
  • the other end of the chemical solution supply circuit 100 is connected to the outer tank 81, and the adjusted chemical solution flows through the circulation supply circuit 84, and after the temperature is adjusted, the downward force of the inner tank 80 Wafer Supplied to W.
  • the force which is the configuration of the first chemical tank 61 and the piping system as described above.
  • the first and second chemical tanks 63 and 65 also have substantially the same configuration and function, and thus the description thereof is omitted.
  • the first to third rinsing tanks 62, 64, 66 also basically have the same configuration and function. That is, it has a water washing tank composed of an inner tank and an outer tank and a circulation supply circuit, and pure water is supplied to the water washing tank from the pure water supply circuit.
  • the processing apparatus 10 includes various detection means for detecting the state of each component. That is, as described above, the liquid processing unit thermometer 59 and the liquid processing unit pressure gauge 60 are installed as detection means for detecting the state of the atmosphere in the liquid processing unit 38. As the detection means for detecting the state of the first chemical tank 61 and each part of its piping system, the liquid level sensors 82a and 82b, the thermometer 95a of the temperature 'concentration detector 95 and the concentration meter 95b are installed. . Similar liquid level sensors, temperature / concentration detector thermometers and concentration meters are installed in the second and third chemical tanks 63 and 65 and the piping system.
  • a wafer inspection device 48 is installed in the interface unit 33 as a detection means for detecting the storage state of the wafer and W, and a wafer detection sensor 57 is installed as a detection means for detecting the arrangement state of the wafers W. .
  • various detection means are provided. These perform predetermined detection as described above, and transmit the detection value as an output signal to the block controller (BC) 11 as shown in FIG.
  • the output signals of a, the densitometer 95b, and many other detection means are transmitted to the block controller (BC) 11 at a predetermined time interval and to the main controller (MC) 12.
  • the process information such as detection information transmitted to the main controller (MC) 12 in this way reaches the control unit 13 and is used for controlling the processing apparatus as described above.
  • the alarm generation unit Based on the process information and the abnormality detected by the abnormality detection unit 15, the alarm generation unit The alarm information generated in 16 is stored in the information storage unit 17, and information related to a predetermined alarm is selected from the information storage unit 17 by the alarm related information acquisition unit 18, so that detailed information on the alarm is grasped. It is possible to accurately determine the cause of the abnormality.
  • the carrier C constituting one lot is placed on the inspection Z loading / unloading stage 45 from the loading / unloading section 31 or the carrier stock section 35 using the carrier conveying apparatus 42, and the carrier opening / closing mechanism 47 performs carrier loading. Open the lid of C, and then open the window 46, and inspect the number of wafers W stored in the carrier and the storage state by the wafer inspection device 48.
  • the carrier C which has been detected as having no abnormality by inspection, is delivered to the posture changing structure 51a by the arm 49a, and the posture is changed in the posture changing 51a and then transferred to the wafer vertical holding mechanism 51b.
  • the posture change mechanism 51a converts the posture of the wafer W, and the wafer W is delivered to the arm 49a wafer vertical holding mechanism 5 lb.
  • 50 wafers W are arranged in the wafer vertical holding mechanism 5 lb.
  • the wafer vertical holding mechanism 5 lb is slid to the wafer transfer device 52 side, and the wafer W is transferred to the chucks 58a to 58c.
  • the wafer transfer device 52 holding the wafer W is moved along the guide rail 53 to the position of the first chemical bath 61 or the first washing bath 62 of the liquid processing unit 38, and the wafer W is moved to the first transfer device 67.
  • liquid processing of wafer W is started.
  • the liquid treatment of the wafer W includes, for example, immersion in the first chemical bath 61 and cleaning by the first water washing bath 62, immersion in the second chemical bath 63 and cleaning by the second water washing bath 64, and third cleaning. It is carried out in the order of immersion in the chemical tank 65 and cleaning by the third water washing tank 66.
  • the wafer W that has been processed in the liquid processing unit 38 is once transferred to the wafer transfer device 52 and then transferred to the transfer device 55 of the drying unit 39 to be subjected to a drying process.
  • the wafer W that has been dried is transferred to the wafer transfer device 52, returned to the interface unit 33, and the state of the wafer W is inspected by the detection sensor 57.
  • the liquid processing apparatus 1 is stopped and maintenance is performed.
  • the wafer W returned to the interface unit 33 after the liquid processing is completed transports the unprocessed wafer W from the carrier stock unit 35 to the wafer transfer device 52.
  • the procedure can be reversed and stored in the empty carrier C placed on the inspection Z loading / unloading stage 45.
  • the carrier C containing the wafer W after the liquid processing is transferred to the carrier loading / unloading section 34 and sent to the next process.
  • wafer inspection device 48 wafer detection sensor 57
  • liquid processing unit thermometer 59 liquid processing unit pressure gauge 60
  • liquid level sensor 82 liquid level sensor 82
  • temperature / concentration detection This is executed while being controlled by the block controller (BC) 11 and the main controller (MC) 12 based on detection signals from the thermometer 95a and the densitometer 95b installed in the unit 95 and many other detection means.
  • the detection signals of these detection means reach the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and the control unit 13 is based on these signals. Then, a predetermined control signal is transmitted to the processing device 10, and a series of cleaning processes are performed based on these control signals.
  • the process information including these detection signals from the processing device 10 is transmitted to the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and after signal processing, It is stored in the information storage unit 17.
  • the process information is also transmitted to the abnormality detection unit 15, and when the process information deviates from a predetermined set value force, it is determined as abnormal, and an abnormality detection signal is transmitted to the control unit 13.
  • the control unit 13 is based on the abnormality detection signal.
  • Send an alarm signal to the alarm generator 16 and the alarm generator 16 generates an alarm.
  • the alarm is generated by displaying information on the monitor 21 in addition to emitting sound and light information.
  • the alarm generation signal is also transmitted to the information storage unit 17 and stored as a processing history.
  • the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table is selected. Linked to it, the sequential detailed information related to the alarm in the processing history, and also the IZO address information and timer information related to the selected alarm are selectively acquired, and the acquired alarm information Can be displayed on the monitor 21.
  • the alarm generated when the liquid level sensors 82a and 82b detect the liquid level lower limit is shown in FIG.
  • 3071 is assigned as the alarm ID
  • the alarm content is that the alarm is the detection of the lower limit of the chemical tank, a detailed explanation thereof, and a summary of possible alarm occurrence reasons.
  • the reason why the circulation was executed without liquid (reason 1), sensor misalignment or malfunction (reason 2), drain valve malfunction or chemical tank damage (reason 3), An outline of these measures (actions) is given for each reason.
  • the alarm table includes link information described later.
  • the monitor 21 becomes a screen on which the above contents are displayed as shown in FIG. 7 (screen 1).
  • Sequential detailed information up to the occurrence of an alarm in the processing history linked to the alarm information in the alarm table can be selected for each of the above reasons, and the screen of the monitor 21 at that time is As shown in Figure 8 (Screen 2).
  • the screen corresponding to Reason 1 in FIG. 8 (“Pattern 1”) is displayed by touching (clicking) the “Detail” portion in FIG.
  • the circulation pump is turned on, circulation starts, and the level sensor is switched off.
  • touching (clicking) on the “Pattern2” and “Pattern3” sections it is possible to selectively obtain sequential detailed information until the alarm corresponding to Reason 2 and Reason 3 occurs.
  • the screen By touching (clicking) the “Currently View” portion of the screen in FIG. 8, the screen displays the related IZO name and information before and after the alarm shown in FIG. 9 (screen 3).
  • the IZO names CIRC_PUMP_START, OUTER_BATH ⁇ OWER ⁇ IMIT (outer tank lower limit), INNER_BATH ⁇ OWER ⁇ IMIT (inner tank lower limit) corresponding to the circulation pump start are displayed, and these IZO information (ONZOFF information) is also displayed.
  • I ⁇ information shows that the painted partial force is ON, and the horizontal axis is the time axis.
  • the circulation pump is in the ON state both before and after the alarm is generated.
  • the lower limit of the outer tank and the lower limit of the inner tank are turned OFF when the alarm is generated, and are in the OFF state thereafter.
  • the cause of the alarm is the one corresponding to the level sensor.
  • the IZO address on this display screen, it is possible to specify the ⁇ address on the screen.
  • Power with Parameter column This is the parameter (process information) linked to the alarm. In this example, there is no information to be displayed in the Parameter column.
  • the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table power also selects the alarm and is linked to it in the processing history! Sequential detailed information related to other alarms, IZO address data and timer information related to the selected alarm can be selectively acquired, and the acquired alarm information can be displayed on the monitor 21.
  • the alarm tape alarm alerts what each alarm is, information about the alarm (description of the alarm), and the reason for the occurrence of one or more possible alarms
  • information such as rough actions that can be taken for each cause is included, and this information is displayed, and sequential information up to the occurrence of the linked alarm is displayed in detail. Even if the skill level of the operator is low, it is possible to reliably grasp the alarm information and take appropriate measures.
  • the processing history stored in the information storage unit 17 includes abnormality detection data and alarm information as described above, and therefore information related to troubles occurring in the processing device 10 is also stored. Therefore, the next time a problem occurs, the cause of the abnormality can be efficiently estimated by extracting the data force related information stored in the information storage unit 17. wear. In this case, it is preferable that related information can be searched with an arbitrary keyword.
  • FIG. 10 is a block diagram showing a processing system according to this embodiment.
  • This processing system 1 ′ has a plurality of the above processing devices 10, and each processing device 10 has a block controller (BC) 11 / as a lower control system and a main controller (MC) 12 ′ as a higher control system. It is controlled by.
  • the processing system! / Is an advanced 'group' controller (hereinafter referred to as AGC) that analyzes process data generated by the host computer 115 that controls the entire system and the control system of each processing device and outputs the results. 11 7).
  • AGC advanced 'group' controller
  • Each processing device 10 is provided with a plurality of detection means for detecting various processing states, as in the previous embodiment, and this detection information is input to the block controller (BC) 11 ′ and the main controller (MC) 12 'is transmitted to the host computer 115 and the A GC 117.
  • BC block controller
  • MC main controller
  • the main controller (MC) 12 'receives the detection signal via the block controller (BC) 11' and controls each component of the processing device 10 based on the detection signal.
  • a control unit 110 that transmits a signal
  • an abnormality detection unit 111 that analyzes process information received from the control unit 110 and detects an abnormality
  • an alarm generation unit 112 that generates an alarm based on the abnormality detection information of the abnormality detection unit 111
  • Memory 118 in which all process information and alarm information received from the processing device 10 via the block controller (BC) 1 ⁇ 'and processed by the control unit 110 are temporarily stored, and preset from the memory 118.
  • HCI Host Communi
  • HCI send buffer 1 19 which is a logical interface means between the HCI send buffer 1 19 and the host computer 115, which writes out some types of process data (data 1, 3) and writes information.
  • cation interface) 113 and a RAP (Remote Agent Process) 116 which is a logical interface means with the AGC 117.
  • the HCI 113 exchanges various data with the host computer 115 through the data transmission system 114 such as TC PZIP.
  • RAP116 various data are exchanged with AGC117. Retrieval is performed through the data transmission system 114.
  • the HCI 113 selects only some of the preset types of process data from all the process data obtained from the processing device 10 by the main controller 12 'and transmits the data to the host computer 115. . That is, the HCI 113 takes out some preset types of process data (data 1 and 3) from the memory 118 in which all the process data generated by the main controller (MC) 12 ′ is temporarily stored. Are written in the HCI transmission buffer 119, and the contents of the HCI transmission buffer 119 are collectively transmitted to the host computer 115. The status data generated by the main controller (MC) 12 'is also sent.
  • the RAP 116 unconditionally transmits all the process data obtained from the processing apparatus 10 to the AGC 117 by the main controller (MC) 12 '. That is, the RAP 116 sequentially reads out the process data stored in the process data storage memory 118 in the main controller (MC) ⁇ 2 ′, and transfers it to the AGC 117 without changing the data structure. However, operations that rearrange the data order or exclude only a small part of the data may be performed here.
  • the host computer 115 controls the overall operation of each processing device 10, such as performing tracking processing of each processing device 10 by exchanging various data with the main controller (MC) 12 'of each processing device 10. I do.
  • AGC117 targets all process data obtained from each processing device 10, including centralized management of recipes (process condition values) for each processing device and process control of each processing device 10 based on the recipe.
  • analysis processing, statistical processing, centralized monitoring processing of process data and analysis Z statistical results, and processing to reflect the analysis Z statistical results in the recipe are performed.
  • the AGC 117 is composed of an AGC server 117a and an AGC client 117b!
  • the AGC server 117 a includes a communication iZF (interface unit) 121, an EQM control unit 122, and an information storage unit 123.
  • the communication IZF (interface unit) 121 transmits / receives various data to / from the main controller (MC) 12 ′ of each processing apparatus 10 and the AGC client 117b through the data transmission system 114.
  • the EQM control unit 122 performs a process for each processing device based on the process conditions defined in advance and the process information obtained from each processing device 10. Processing to correct received parameters, store received process information and alarm information, and store received parameters in the information storage unit 123, and search the information storage unit 123 for process data to be transferred to the AGC client 117b Etc. mainly.
  • the AGC client 117b can use and process the process data and the analysis result of the process data transferred from the AGC server 117a, and the captured user process data and the analysis results.
  • Data conversion unit 126 that converts data into a format data
  • display control unit 127 that controls the display of converted data on a monitor (not shown)
  • process data including measurement data such as film thickness on the object to be processed
  • the recipe correction unit 128 that updates the recipe (process conditions) to be optimized and the information related to each alarm acquired from each processing device 10 from the information storage unit 123 are selectively acquired.
  • an alarm related information acquisition unit 129 an alarm related information acquisition unit 129.
  • each processing apparatus 10 performs processing on the wafer W that is an object to be processed by the processing operation exactly the same as in the previous embodiment.
  • the processing operation of each processing apparatus 10 is executed while being controlled by the corresponding block controller (BC) 11 / and main controller ( ⁇ 12 ′) under process control by the host computer 115 and AGC 117.
  • BC block controller
  • ⁇ 12 ′ main controller
  • each main controller (MC) 12 ' process data obtained by 10 processing devices via the block controller (BC) 11 / is written to the process data storage memory 118 via the control unit 110. .
  • the process data written in the process data storage memory 118 is transferred to the host computer 115 via an independent channel of the data transmission system 114 such as TCPZIP by the HCI 113 and RAP1 16 which are logical interface means for the external transfer. Forwarded to AGC 117.
  • the AGC server 117a of the AGC 117 receives the process information and the alarm information transmitted by the RAP 116 of the main controller (MC) 12 'of each processing device 10, stores the information in the information storage unit 123, and The process information and recipe data power also generate parameter correction values for each processing device 10 and send them to the main controller (MC) 12 '. From the control unit 110 of the main controller (MC) 12', the block controller (BC) Process control by sending control signals to each component of each processing device 10 via 11 / I do.
  • the 80-day server 117 & reads out the corresponding process data from the information storage unit 123 and transmits it to the AGC client 117b through the communication IZF 121.
  • the process data transferred to the AGC client 117b is converted into data that can be processed by the client user at the data converter 126, and the information displayed on the monitor is controlled by the display controller 127.
  • the process data transferred to the AGC client 117b is analyzed and statistically processed by the data analysis unit 125, and the analysis result is converted to data in a user-usable format in the same way as the process data by the data conversion unit 126. Converted and displayed on the monitor. This realizes unified management of the entire substrate processing system on the AGC client 117b.
  • the data analysis unit 125 of the AGC client 117b performs process data analysis result capability detection of abnormalities in the processing data separately from the detection of abnormalities in each processing device and the occurrence of an alarm, and performs abnormal prediction.
  • the fact is output to the monitor and notified to the AGC server 117a.
  • the AGC server 117a performs control such as instructing the main controller (MC) 12 'that controls the processing apparatus 10 detected or predicted to be abnormal to stop the processing apparatus. .
  • the recipe correction unit 128 of the AGC client 117b performs an update process for optimizing the recipe (process condition) from the analysis result for the process data including the measurement data such as the film thickness measurement result on the substrate.
  • the alarm related information acquisition unit 129 stores the selected alarm in the information storage unit 123 in the same manner as in the previous embodiment.
  • the stored alarm table power also selects that alarm, selects sequential details related to the alarm in the processing history linked to it, and also selects IZO address data and timer information related to the selected alarm.
  • the acquired alarm information can be displayed on the monitor.
  • the sequential information from the processing history accumulated in the information accumulation unit 123 to the occurrence of the alarm of a predetermined alarm is detailed to the level of I / O address data. Because it can be grasped, the cause of the alarm can be easily identified. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm. Therefore, when an abnormality occurs in any of the processing apparatuses 10, the processing apparatus can be restored in a short time, and the downtime of the processing apparatus 10 can be shortened.
  • the host computer 115 when the host computer 115 is down, the process data spooling processing by the AGC 117 is performed. That is, the host computer 115 can take in the process data of the down period from the AGC 117 immediately after the recovery. As a result, the tracking processing of each processing apparatus 10 by the host computer 115 can be resumed immediately after recovery.
  • the wafer inspection device 48, wafer detection sensor 57, liquid processing unit thermometer 59, liquid processing unit pressure gauge 60, liquid level sensor 82a, 82b, temperature / concentration detector 95 All or almost all detailed process data represented by detection signals from thermometers and densitometers installed in 95 can be imported into AGC117 for centralized monitoring. Apart from detecting an abnormality in each processing device 10 and generating an alarm, it is possible to detect changes in the state of each processing device over time at an early stage. Thereby, it becomes possible to improve the maintenance reliability of the processing system including a large number of processing devices 10.
  • each processing apparatus 10 is updated by updating the analysis results for the detailed process data including the measurement data such as the film thickness measurement results on the substrate and the data in the statistical result power recipe to more preferable values.
  • the analysis results for the detailed process data including the measurement data such as the film thickness measurement results on the substrate and the data in the statistical result power recipe to more preferable values.
  • the process data obtained from each processing device 10 is taken into the AGC 117 and centrally monitored, thereby expanding the range of information that can be grasped as the status of each processing device, and processing device abnormalities and deterioration states. Therefore, it is possible to find out the life in more detail and earlier than when the AGC117 is not provided.
  • the present invention is not limited to the above-described embodiment, and can be variously modified.
  • the apparatus for cleaning the wafer by performing liquid processing has been described as an example of the processing apparatus.
  • the present invention is not limited to this and can be applied to other processing apparatuses.
  • the object to be processed is not limited to a wafer.
  • the present invention is particularly effective because there are many types of information to be detected and the number of types of alarms is enormous.

Abstract

A processing system (1) is provided with a processor (10) for performing a prescribed process to a wafer (W); a plurality of detecting means for detecting the status inside the processor (10); an abnormality detecting part (15) for detecting abnormalities of detection information from the plurality of detecting means; an alarm generating part (16) for generating an alarm when the abnormality detecting part (15) detects an abnormality; an information accumulating part (17) for accumulating the detection information from the detecting means of the processor (10) and alarm information as processing history of the processor (10); an alarm-related information acquiring part (18) for selectively acquiring information relating to a selected alarm from the information accumulating part (17); and a display part (21) for displaying the alarm-related information acquired by the alarm-related information acquiring part (18).

Description

明 細 書  Specification
処理システムおよび処理方法、ならびにコンピュータ読取可能な記憶媒 体およびコンピュータプログラム  PROCESSING SYSTEM AND PROCESSING METHOD, COMPUTER-READABLE STORAGE MEDIUM, AND COMPUTER PROGRAM
技術分野  Technical field
[0001] 本発明は、例えば半導体デバイスの製造の際に被処理体に所定の処理を行う処 理装置を含む処理システムおよび処理方法ならびにコンピュータ読取可能な記憶媒 体およびコンピュータプログラムに関する。  The present invention relates to a processing system and a processing method including a processing device that performs a predetermined process on an object to be processed when manufacturing a semiconductor device, for example, a computer-readable storage medium, and a computer program.
背景技術  Background art
[0002] 例えば半導体デバイスの製造工程においては、半導体ウェハ(以下、単にウェハと 記す)に種々の処理が施され、そのために種々の処理装置が用いられている。このよ うな処理装置としては、例えば、処理液を貯留した 1または複数の処理槽にウェハを 浸漬させて処理を行った後、乾燥処理を行う洗浄処理装置が挙げられる。  For example, in a semiconductor device manufacturing process, various processes are performed on a semiconductor wafer (hereinafter simply referred to as a wafer), and various processing apparatuses are used for that purpose. Examples of such a processing apparatus include a cleaning processing apparatus that performs a drying process after immersing a wafer in one or a plurality of processing tanks in which a processing liquid is stored.
[0003] このような洗浄処理装置は、基板に供給する処理液の温度を検出する温度センサ や、処理液の濃度を検出する濃度センサ、槽内の処理液の位置を検出する位置セ ンサ等の種々の検出データを入力し、処理装置の状態を検知するとともに、種々の 検出データに基づ!/、て処理装置を制御する制御システムが設けられて!/、る。この制 御システムは、また、処理装置の稼働中にセンサの検出値が予め設定された許容値 を超えた場合には、処理装置に障害が発生するおそれがあるとしてアラームを発す る。  Such a cleaning processing apparatus includes a temperature sensor that detects the temperature of the processing liquid supplied to the substrate, a concentration sensor that detects the concentration of the processing liquid, a position sensor that detects the position of the processing liquid in the tank, and the like. A control system is provided for detecting the state of the processing device and controlling the processing device based on the various detection data. This control system also issues an alarm that the processing device may fail if the detected value of the sensor exceeds a preset allowable value during operation of the processing device.
[0004] 一方、ウェハの処理にお 、ては、複数の処理装置を配置して処理システムを構築 するが、近年このような処理システムは大規模ィ匕しており、そのため多数の処理装置 を一元管理する要求が益々高まって!/、る。  [0004] On the other hand, for processing wafers, a processing system is constructed by arranging a plurality of processing apparatuses. However, in recent years, such processing systems have become large-scale, and therefore, a large number of processing apparatuses are installed. The demand for centralized management is increasing!
[0005] このため、各処理装置に制御部を設け、これら制御部をホストコンピュータに接続し 、ホストコンピュータは各処理装置の制御部との間での各種データのやりとりを通じて 各処理装置のトラッキング処理や、各処理装置力 受信したプロセスデータを履歴と して蓄積し、その内容を表示装置に表示したり、そのプロセスデータに基づいて処理 装置の各種パラメータ補正や異常検出等を行うようにして ヽる。 [0006] また、特許文献 1では、このようなホストコンピュータを用いた一元管理方式では、蓄 積されるプロセスデータが限定的であり、また処理装置の異常や特性劣化を早期に 発見することが困難であるとして、ホストコンピュータの他に、各処理装置の制御部で 生成された全てのプロセスデータを収集し、収集したプロセスデータを解析し、解析 結果を出力するコントローラを設けることが開示されている。これにより、把握するプロ セスデータを増加させることができ、各処理装置の状態の経時的な変化も早期に発 見することができるとして 、る。 For this reason, a control unit is provided in each processing device, and these control units are connected to a host computer. The host computer performs tracking processing of each processing device through exchange of various data with the control unit of each processing device. In addition, the processing power received by each processing device is accumulated as a history, and the contents are displayed on a display device, and various parameters of the processing device are corrected and an abnormality is detected based on the process data. The [0006] Further, in Patent Document 1, in such a unified management method using a host computer, accumulated process data is limited, and abnormality or characteristic deterioration of a processing apparatus can be detected at an early stage. In addition to the host computer, it is disclosed that a controller that collects all process data generated by the control unit of each processing device, analyzes the collected process data, and outputs the analysis results is disclosed as being difficult. Yes. As a result, the process data to be grasped can be increased, and the change with time of each processing apparatus can be detected early.
[0007] し力しながら、このようなシステムにおいてアラームが発生すると、どの部分のアラー ムが発生したかの概略情報は得られるものの、アラーム発生に至った装置側の詳細 な情報等までは得られず、アラーム発生の原因箇所を詳細に特定することが困難で ある。したがって、オペレータがアラーム発生の原因箇所を発見して処理装置を復帰 させるために長時間を要してしまう。  [0007] However, when an alarm occurs in such a system, although it is possible to obtain general information on which part of the alarm has occurred, it is possible to obtain detailed information on the device side that caused the alarm. It is difficult to pinpoint the cause of the alarm. Therefore, it takes a long time for the operator to discover the cause of the alarm and restore the processing device.
特許文献 1:特開平 11― 16797号公報  Patent Document 1: Japanese Patent Laid-Open No. 11-16797
発明の開示  Disclosure of the invention
[0008] 本発明の目的は、アラームが発生した場合に、容易にアラーム発生の原因箇所を 特定することができる処理システムおよび処理方法、さらにはそのような制御を行うコ ンピュータ読取可能な記憶媒体およびコンピュータプログラムを提供することにある。  [0008] An object of the present invention is to provide a processing system and a processing method capable of easily identifying the cause of occurrence of an alarm when an alarm is generated, and a computer-readable storage medium for performing such control. And providing a computer program.
[0009] 本発明の第 1の観点によれば、被処理体に所定の処理を施す処理装置と、前記処 理装置内の状態を検出する複数の検出手段と、前記複数の検出手段からの検出情 報の異常を検出する異常検出部と、前記異常検出部が異常を検出した際にアラーム を発生するアラーム発生部と、前記検出手段の検出情報、およびアラーム情報を前 記処理装置の処理履歴として蓄積する情報蓄積部と、発生したアラームの中から選 択されたアラームに関連する情報を前記情報蓄積部力 取得するアラーム関連情報 取得部と、前記アラーム関連情報取得部が取得したアラームに関連する情報を表示 する表示部とを具備する処理システムが提供される。  [0009] According to a first aspect of the present invention, a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units An abnormality detection unit that detects an abnormality in detection information, an alarm generation unit that generates an alarm when the abnormality detection unit detects an abnormality, detection information of the detection means, and alarm information are processed by the processing device. An information storage unit that accumulates as a history, an alarm related information acquisition unit that acquires information related to an alarm selected from the alarms that have occurred, and an alarm that is acquired by the alarm related information acquisition unit. A processing system including a display unit for displaying related information is provided.
[0010] 本発明の第 2の観点によれば、被処理体に所定の処理を施す処理装置と、前記処 理装置内の状態を検出する複数の検出手段と、前記複数の検出手段からの検出情 報の異常を検出する異常検出部と、前記異常検出部が異常を検出した際にアラーム を発生するアラーム発生部と、前記検出手段の検出情報、およびアラーム情報を前 記処理装置の処理履歴として蓄積し、かつ各アラームに応じた概略情報を記載する とともに前記処理履歴とリンク可能なアラームテーブルを予め記憶する情報蓄積部と 、発生したアラームの中から選択されたアラームの概略情報を前記情報蓄積部のァ ラームテーブル力 選択し、前記情報蓄積部に前記処理履歴として蓄積された情報 力 その選択されたアラームの発生に至るシーケンシャルな情報をリンク情報として 取得するアラーム関連情報取得部と、前記アラーム関連情報取得部が取得したァラ ーム関連情報を表示する表示部とを具備する処理システムが提供される。 [0010] According to a second aspect of the present invention, a processing device that performs a predetermined process on an object to be processed, a plurality of detection units that detect a state in the processing unit, and a plurality of detection units An anomaly detector that detects anomalies in detected information and an alarm when the anomaly detector detects an anomaly Alarm generation unit that generates the alarm, the detection information of the detection means, and alarm information are stored as the processing history of the processing device, and outline information corresponding to each alarm is described, and an alarm that can be linked to the processing history An information storage unit that pre-stores a table, and alarm information selected from the alarms that have been selected from the alarms that have been generated, and the information power stored as the processing history in the information storage unit. A process comprising: an alarm related information acquisition unit that acquires sequential information that leads to the occurrence of the selected alarm as link information; and a display unit that displays the alarm related information acquired by the alarm related information acquisition unit A system is provided.
[0011] 本発明の第 3の観点によれば、被処理体に所定の処理を施す複数の処理装置と、 前記各処理装置において検出される情報に基づいて前記複数の処理装置を制御し 、前記各処理装置において前記検出される情報が所定の範囲から外れた場合に異 常を検出し、前記異常検出部が異常を検出した際にアラームを発生する装置制御部 と、前記各装置制御部力 全てのまたはほぼ全てのプロセス情報を受信し、そのプロ セス情報に基づ!、て前記各処理装置を制御する制御装置とを有し、前記制御装置 は、前記各装置制御部から受信したプロセス情報およびアラーム情報を前記各処理 装置の処理履歴として蓄積する情報蓄積部と、発生したアラームの中から選択され たアラームに関連する情報を前記情報蓄積部力 選択的に取得するアラーム関連 情報取得部と、前記アラーム関連情報取得部が取得したアラームに関連する情報を 表示する表示部とを具備する処理システムが提供される。  [0011] According to a third aspect of the present invention, a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each of the processing devices. A device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information. The control device receives from each device control unit. An information storage unit that stores process information and alarm information as the processing history of each processing device, and an alarm storage unit that selectively acquires information related to an alarm selected from the generated alarms. A distribution obtaining unit, the processing system comprising a display unit for displaying the alarm-related information acquiring unit is related to the acquired alarm information is provided.
[0012] 本発明の第 4の観点によれば、被処理体に所定の処理を施す複数の処理装置と、 前記各処理装置において検出される情報に基づいて前記複数の処理装置を制御し 、前記各処理装置において前記検出される情報が所定の範囲から外れた場合に異 常を検出し、前記異常検出部が異常を検出した際にアラームを発生する装置制御部 と、前記各装置制御部力 全てのまたはほぼ全てのプロセス情報を受信し、そのプロ セス情報に基づ!、て前記各処理装置を制御する制御装置とを有し、前記制御装置 は、前記各装置制御部から受信したプロセス情報およびアラーム情報を前記各処理 装置の処理履歴として蓄積し、かつ各アラームに応じた概略情報を記載するとともに 前記処理履歴とリンク可能なアラームテーブルを予め記憶する情報蓄積部と、発生し たアラームの中から選択されたアラームの概略情報を前記情報蓄積部のアラームテ 一ブル力 選択し、前記情報蓄積部に前記処理履歴として蓄積された情報からその 選択されたアラームの発生に至るシーケンシャルな情報をリンク情報として取得する アラーム関連情報取得部と、前記アラーム関連情報取得部が取得したアラームに関 連する情報を表示する表示部とを具備する処理システムが提供される。 [0012] According to a fourth aspect of the present invention, a plurality of processing devices that perform a predetermined process on an object to be processed, and the plurality of processing devices are controlled based on information detected in each processing device. A device control unit that detects an abnormality when the detected information is out of a predetermined range in each processing device, and that generates an alarm when the abnormality detection unit detects an abnormality; and each device control unit A control device that receives all or almost all process information and controls each of the processing devices based on the process information. The control device receives from each device control unit. An information storage unit that stores process information and alarm information as a processing history of each of the processing devices, describes summary information corresponding to each alarm, and stores in advance an alarm table that can be linked to the processing history; Occur The alarm information of the selected information is selected from the alarm table of the information storage unit, and the sequential information from the information stored as the processing history in the information storage unit to the occurrence of the selected alarm is selected. A processing system is provided that includes an alarm-related information acquisition unit that acquires information as link information, and a display unit that displays information related to an alarm acquired by the alarm-related information acquisition unit.
[0013] 本発明の第 5の観点によれば、被処理体に所定の処理を施す処理装置に設けられ た複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を検 出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積し、発生し たアラームの中から選択されたアラームに関連する情報を前記情報蓄積部力 取得 し、取得されたアラームに関連する情報を表示する処理方法が提供される。  [0013] According to the fifth aspect of the present invention, the detection information of the plurality of detection means and the detection information of the plurality of detection means power provided in the processing apparatus that performs a predetermined process on the object to be detected are detected. Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, and information related to the alarm selected from the generated alarms is acquired and related to the acquired alarm. A processing method for displaying information to be provided is provided.
[0014] 本発明の第 6の観点によれば、被処理体に所定の処理を施す処理装置に設けられ た複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を検 出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積し、かつ各 アラームに応じた概略情報を記載するとともに前記処理履歴とリンク可能なアラーム テーブルを情報蓄積部に予め記憶し、発生したアラームの中から選択されたアラー ムの概略情報を前記情報蓄積部のアラームテーブルから選択し、前記情報蓄積部 に前記処理履歴として蓄積された情報力 その選択されたアラームの発生に至るシ 一ケンシャルな情報をリンク情報として取得し、前記アラームテーブル力 選択された 情報および取得されたアラーム発生に至るシーケンシャルな情報を表示する処理方 法が提供される。  [0014] According to the sixth aspect of the present invention, an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected. Information stored in the information storage unit as a processing history, and outline information corresponding to each alarm is recorded, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance, Information about the selected alarm is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit is selected to generate the selected alarm. Acquires sequential information as link information, and displays the alarm table power selected information and the acquired sequential information leading to the alarm occurrence Management how is provided.
[0015] 本発明の第 7の観点によれば、被処理体に所定の処理を施す処理装置に設けられ た複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を検 出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積させ、発生 したアラームの中から選択されたアラームに関連する情報を前記情報蓄積部力 取 得し、取得されたアラームに関連する情報を表示するようにコンピュータに制御させる ソフトウェアを含むコンピュータ読取可能な記録媒体が提供される。  [0015] According to the seventh aspect of the present invention, an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected. Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained. A computer-readable recording medium is provided that includes software that causes a computer to control information to be displayed.
[0016] 本発明の第 8の観点によれば、被処理体に所定の処理を施す処理装置に設けられ た複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を検 出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積させ、かつ 各アラームに応じた概略情報を記載するとともに前記処理履歴とリンク可能なアラー ムテーブルを情報蓄積部に予め記憶させ、発生したアラームの中から選択されたァ ラームの概略情報を前記情報蓄積部のアラームテーブルから選択し、前記情報蓄積 部に前記処理履歴として蓄積された情報力 その選択されたアラームの発生に至る シーケンシャルな情報をリンク情報として取得し、前記アラームテーブル力 選択され た情報および取得されたアラーム発生に至るシーケンシャルな情報を表示するように コンピュータに制御させるソフトウェアを含むコンピュータ読取可能な記録媒体が提 供される。 [0016] According to the eighth aspect of the present invention, an abnormality is detected in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed. The information of the alarm that occurs when the alarm is issued is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance. The selected information from the alarm table of the information storage unit is selected from the alarm table selected from the generated alarms, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm. Provided is a computer-readable recording medium including software for acquiring sequential information as link information, and controlling the alarm table power to display the selected information and the acquired sequential information leading to the occurrence of an alarm. Is done.
[0017] 本発明の第 9の観点によれば、被処理体に所定の処理を施す処理装置に設けられ た複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を検 出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積させ、発生 したアラームの中から選択されたアラームに関連する情報を前記情報蓄積部力 取 得し、取得されたアラームに関連する情報を表示するようにコンピュータに制御させる ソフトウェアを含むコンピュータプログラムが提供される。  [0017] According to the ninth aspect of the present invention, an abnormality in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed is detected. Information on alarms that occur when the alarm is issued is stored in the information storage unit as a processing history, information related to the alarm selected from the generated alarms is acquired, and information related to the acquired alarm is obtained. A computer program is provided that includes software that causes a computer to display information to be displayed.
[0018] 本発明の第 10の観点によれば、被処理体に所定の処理を施す処理装置に設けら れた複数の検出手段の検出情報、および複数の検出手段力 の検出情報の異常を 検出した際に発生するアラームの情報を処理履歴として情報蓄積部に蓄積させ、か つ各アラームに応じた概略情報を記載するとともに前記処理履歴とリンク可能なァラ ームテーブルを情報蓄積部に予め記憶させ、発生したアラームの中から選択された アラームの概略情報を前記情報蓄積部のアラームテーブルから選択し、前記情報蓄 積部に前記処理履歴として蓄積された情報力 その選択されたアラームの発生に至 るシーケンシャルな情報をリンク情報として取得し、前記アラームテーブルから選択さ れた情報および取得されたアラーム発生に至るシーケンシャルな情報を表示するよう に、コンピュータに制御させるソフトウェアを含むコンピュータプログラムが提供される  [0018] According to the tenth aspect of the present invention, abnormalities in detection information of a plurality of detection means and detection information of a plurality of detection means forces provided in a processing apparatus that performs a predetermined process on an object to be processed are detected. Information on alarms generated upon detection is stored in the information storage unit as a processing history, and summary information corresponding to each alarm is described, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance. The alarm information selected from the generated alarms is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit leads to the occurrence of the selected alarm. Sequential information is acquired as link information, and the information selected from the alarm table and the sequential information leading to the alarm occurrence are displayed. As to the form of a computer program containing software for controlling the computer is provided
[0019] 本発明によれば、検出手段の検出情報を含む処理装置からのプロセス情報、およ びアラーム情報を処理装置の処理履歴として情報蓄積部に蓄積し、発生したアラー ムの中から選択されたアラームに関連する情報を前記情報蓄積部力 選択的に取得 し、その情報を表示するので、アラームが発生するに至った情報を処理履歴から把 握することができ、アラーム発生原因箇所を容易に把握することができる。特に、情報 蓄積部に蓄積した処理履歴から、所定のアラームのアラーム発生に至るまでのシー ケンシャルな情報を iZoデータのレベルまで詳細に把握することにより、アラーム発 生に至ったより詳細な原因を把握することができ、アラーム発生原因箇所を一層容易 にかつ確実に特定することができる。したがって、アラーム発生原因箇所の異常を迅 速に取り除くことができるので、処理装置に異常が発生した場合に、処理装置を短時 間で復帰させることができ、処理装置のダウンタイムを短くすることができる。 According to the present invention, the process information from the processing device including the detection information of the detection means and the alarm information are stored in the information storage unit as the processing history of the processing device, and the generated alarm Information related to the alarm selected from the system is selectively acquired and displayed, so that the information that caused the alarm can be grasped from the processing history. The cause of the alarm can be easily grasped. In particular, by grasping the detailed information from the processing history accumulated in the information accumulation unit to the level of iZo data until the occurrence of the alarm of a predetermined alarm, the detailed cause of the occurrence of the alarm can be grasped. It is possible to identify the cause of the alarm more easily and reliably. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm, so that if the abnormality occurs in the processing device, the processing device can be returned in a short time, and the downtime of the processing device can be shortened. Can do.
図面の簡単な説明 Brief Description of Drawings
[図 1]本発明の一実施形態に係る処理システムの全体的な構成を示すブロック図。 FIG. 1 is a block diagram showing the overall configuration of a processing system according to an embodiment of the present invention.
[図 2]本発明の一実施形態に係る処理システムに用いられる処理装置の一例を示す 斜視図。  FIG. 2 is a perspective view showing an example of a processing apparatus used in a processing system according to an embodiment of the present invention.
[図 3]本発明の一実施形態に係る処理システムに用いられる処理装置の一例を示す 平面図。  FIG. 3 is a plan view showing an example of a processing apparatus used in the processing system according to the embodiment of the present invention.
[図 4]本発明の一実施形態に係る処理システムに用いられる処理装置の第 1の薬液 槽およびその配管系を示す概略図。  FIG. 4 is a schematic view showing a first chemical tank and a piping system of a processing apparatus used in a processing system according to an embodiment of the present invention.
[図 5]ブロックコントローラ (BC)に接続している主な検出手段を示すブロック図。  FIG. 5 is a block diagram showing main detection means connected to a block controller (BC).
[図 6]アラームテーブルへの記載例を示す図。  FIG. 6 is a diagram showing an example of description in the alarm table.
[図 7]アラームを表示したモニター画面の一例を示す図。  FIG. 7 is a diagram showing an example of a monitor screen displaying an alarm.
[図 8]アラーム発生に至るまでのシーケンシャルな詳細情報を示したモニター画面の 一例を示す図。  [Figure 8] A diagram showing an example of a monitor screen showing sequential detailed information up to the occurrence of an alarm.
[図 9]アラーム発生前後の関連する ΙΖΟアドレスデータが表示されたモニター画面の 一例を示す図。  [Fig. 9] A diagram showing an example of a monitor screen on which related ΙΖΟ address data is displayed before and after an alarm occurs.
[図 10]本発明の他の実施形態に係る処理システムの全体的な構成を示すブロック図  FIG. 10 is a block diagram showing the overall configuration of a processing system according to another embodiment of the present invention.
[図 11]図 10の処理システムに用いられる処理装置のメインコントローラ(MC)の概略 構成を示すブロック図。 発明を実施するための最良の形態 FIG. 11 is a block diagram showing a schematic configuration of a main controller (MC) of the processing apparatus used in the processing system of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
[0021] 以下、添付図面を参照して、本発明の実施形態について説明する。  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
ここでは、基板としてのウェハに液処理を施して洗浄する処理装置を備えた処理シ ステムについて説明する。図 1は本実施形態に係る処理システムの全体的な構成を 示すブロック図である。  Here, a description will be given of a processing system including a processing apparatus that performs cleaning by performing liquid processing on a wafer as a substrate. FIG. 1 is a block diagram showing the overall configuration of the processing system according to this embodiment.
[0022] この処理システム 1は、ウェハに液処理を施して洗浄する処理装置 10と、処理装置 10の下位制御系であるブロックコントローラ(BC) 11と、上位制御系であるメインコン トローラ (MC) 12とを備えている。各処理装置 10は、後述するように、種々の処理状 態を検出する複数の検出手段を備えており、この検出手段力 の検出情報を含むプ ロセス情報がブロックコントローラ(BC) 11に入力され、メインコントローラ(MC) 12に 送信されるようになっている。また、メインコントローラ(MC) 12には種々の画面が表 示可能なモニター 21および操作部 22が接続されている。  [0022] This processing system 1 includes a processing apparatus 10 that performs liquid processing on a wafer and cleans it, a block controller (BC) 11 that is a lower control system of the processing apparatus 10, and a main controller (MC) that is an upper control system. ) 12 As will be described later, each processing apparatus 10 includes a plurality of detection means for detecting various processing states, and process information including detection information of the detection means force is input to the block controller (BC) 11. To the main controller (MC) 12. The main controller (MC) 12 is connected to a monitor 21 and an operation unit 22 capable of displaying various screens.
[0023] 図 1に示すように、メインコントローラ(MC) 12は、ブロックコントローラ(BC)力らの プロセス情報を受け取り、ブロックコントローラ(BC)に制御信号を送信するとともに、 受け取ったプロセス情報を処理する制御部 13と、制御部 13から受け取ったプロセス 情報を解析して異常を検出する異常検出部 15と、異常検出部 15の異常検出情報に 基づいてアラームを発生させるアラーム発生部 16と、制御部 13がブロックコントロー ラ(BC) 11から受け取ったプロセス情報、ならびにアラームが発生したことおよびその 他のアラーム情報を蓄積する情報蓄積部 17と、情報蓄積部 17から各アラームに関 連する情報を選択するアラーム関連情報取得部 18と、プロセス情報およびアラーム 情報の中から選択された情報をモニター 21に表示させるための表示制御部 19とを 有している。  [0023] As shown in FIG. 1, the main controller (MC) 12 receives process information from the block controller (BC), sends a control signal to the block controller (BC), and processes the received process information. A control unit 13 that performs processing, an error detection unit 15 that analyzes process information received from the control unit 13 and detects an abnormality, an alarm generation unit 16 that generates an alarm based on the abnormality detection information of the abnormality detection unit 15, and a control Section 13 receives the process information received from the block controller (BC) 11, the information storage section 17 that stores the occurrence of an alarm and other alarm information, and information related to each alarm from the information storage section 17. A table for displaying the alarm-related information acquisition unit 18 to be selected and information selected from the process information and alarm information on the monitor 21. And a control unit 19.
[0024] 制御部 13は汎用コンピュータ力もなり、所定の処理を実行させるためのプログラム すなわちレシピにより所定の制御を行う。レシピはハードディスクや半導体メモリーに 記憶されていてもよいし、 CDROM、 DVD等の可搬性の記憶媒体に収容された状 態で所定位置にセットするようになっていてもよい。さらに、他の装置から、例えば専 用回線を介してレシピを適宜伝送させるようにしてもょ 、。  The control unit 13 also has general-purpose computer power, and performs predetermined control using a program for executing predetermined processing, that is, a recipe. The recipe may be stored in a hard disk or semiconductor memory, or may be set at a predetermined position in a state of being stored in a portable storage medium such as a CDROM or DVD. In addition, recipes may be appropriately transmitted from other devices via, for example, a dedicated line.
[0025] 制御部 13における処理装置 10の制御は、ブロックコントローラ(BC) 11を介して送 信された各検出手段力もの信号等に基づいて処理装置 10の各構成部に制御信号 を出力することによりなされ、また、制御部 13にブロックコントローラ (BC) 11を介して 入力されたプロセス情報は制御部 13で信号処理された後、情報蓄積部 17に蓄積さ れる。また、制御部 13は、異常検出部 15からの異常検出信号に基づいてアラーム発 生部 16にアラーム発生信号を送信するとともに、アラーム発生信号を情報蓄積部 17 に蓄積させる。 The control of the processing device 10 in the control unit 13 is sent via the block controller (BC) 11. Process information input to the control unit 13 via the block controller (BC) 11 by outputting a control signal to each component of the processing device 10 based on the received signal of each detection means. The signal is processed by the control unit 13 and then stored in the information storage unit 17. In addition, the control unit 13 transmits an alarm generation signal to the alarm generation unit 16 based on the abnormality detection signal from the abnormality detection unit 15 and stores the alarm generation signal in the information storage unit 17.
[0026] 情報蓄積部 17は、実プロセスにおいて、プロセス情報およびアラーム情報を処理 履歴として時系列的に蓄積する他、各アラーム毎に予めそのアラームの内容を説明 したアラームテーブルを記憶している。アラームには IDが付されており、アラームテー ブルにぉ 、てもその IDが記入されて!、て、各アラームはその IDで呼び出されるよう になっている。アラームテーブルに記載される内容としては、各アラームがどのような ことを警告しているアラームかの情報 (アラームの説明)、そのアラームの可能性のあ る 1または 2以上の概略の発生理由、さらには各発生理由毎の概略的な取り得るァク シヨン等が挙げられる。また、アラームテーブルは、蓄積されている処理履歴とリンクし ており、アラーム発生に関連するシーケンシャルな情報を呼び出せるようになつてい る。  [0026] In addition to accumulating process information and alarm information in a time series as a processing history in an actual process, the information accumulating unit 17 stores an alarm table that explains the contents of the alarm in advance for each alarm. Each alarm is given an ID, and the alarm table is filled with the ID! Each alarm is called with that ID. The contents of the alarm table include information on what each alarm is alerting (alarm description), the reason for one or more possible occurrences of the alarm, Furthermore, there are rough actions that can be taken for each reason. In addition, the alarm table is linked to the accumulated processing history, so that sequential information related to the alarm occurrence can be called up.
[0027] アラーム関連情報取得部 18は、操作部 22により所定のアラームが選択されると、 情報蓄積部 17に蓄積されている情報のうち、そのアラームに関連する情報を選択的 に取得する。具体的には、情報蓄積部 17に記憶されているアラームテーブル力 所 定の IDのアラームを選択し、さらに蓄積されている処理履歴の中力もそのアラームテ 一ブルにリンクされている選択されたアラームに関連する情報、具体的にはアラーム 発生に至るシーケンシャルな詳細情報を選択的に取得することができ、さらにはその アラーム発生前後の関連する IZOアドレス情報 (IZOネーム、 ΙΖΟ情報、 ΙΖΟアド レス)やタイマー情報を選択的に取得することができる。この場合に、アラーム発生の 前後の所定時間を設定し、その間の情報が選択されるようにすることができる。このよ うにアラーム関連情報取得部 18により選択されたアラームの情報はモニター 21に表 示可能である。  [0027] When a predetermined alarm is selected by the operation unit 22, the alarm related information acquisition unit 18 selectively acquires information related to the alarm among the information stored in the information storage unit 17. Specifically, an alarm with a predetermined ID stored in the information storage unit 17 is selected, and the selected alarm that is linked to the alarm table is also stored in the processing history. It is possible to selectively acquire information related to, specifically sequential details leading to the occurrence of an alarm, and related IZO address information before and after the occurrence of the alarm (IZO name, ΙΖΟ information, ΙΖΟ address). And timer information can be selectively acquired. In this case, it is possible to set a predetermined time before and after the occurrence of the alarm and select information during that time. Thus, the alarm information selected by the alarm related information acquisition unit 18 can be displayed on the monitor 21.
[0028] アラームに関連するモニター 21の具体的な表示例としては、所定のアラームが選 択された際に、そのアラームの内容説明と、そのアラームの可能性のある 1または 2以 上の発生理由、さらには各発生理由毎の概略的な取り得るアクションが表示された画 面 (画面 1)、発生理由のパターン毎に表示されるアラームが発生するまでのシーケン シャルな情報が詳細に記述された画面 (画面 2)、さらにアラーム発生前後の関連す る IZOアドレスデータが表示された画面(画面 3)が挙げられる。そして、画面 1に設 けられた所定位置をタツチ (クリック)することで画面 2が表示され、画面 2の所定位置 をタツチ (クリック)することで画面 3が表示されるようにすることができる。 [0028] As a specific display example of the monitor 21 related to the alarm, a predetermined alarm is selected. When selected, a screen (screen) showing a description of the alarm, one or more possible causes of the alarm, and the actions that can be taken for each reason. 1) A screen that details the sequential information until an alarm is displayed for each occurrence reason pattern (screen 2), and a screen that displays related IZO address data before and after the alarm occurs. (Screen 3). Then, screen 2 can be displayed by touching (clicking) a predetermined position provided on screen 1, and screen 3 can be displayed by touching (clicking) a predetermined position on screen 2. .
[0029] 次に、処理装置 10の一例について説明する。図 2は処理装置 10の斜視図であり、 図 3はその平面図である。  [0029] Next, an example of the processing apparatus 10 will be described. FIG. 2 is a perspective view of the processing apparatus 10, and FIG. 3 is a plan view thereof.
[0030] 処理装置 10は、ウェハ Wが水平状態で収納されたキャリア Cを搬入出し、また保管 等する搬入出部 31と、ウエノ、 Wに所定の薬液を用いた洗浄処理を行い、また乾燥処 理等を行う処理部 32と、搬入出部 31と処理部 32との間でウェハ Wを搬送するインタ 一フェイス部 33とで主に構成されて 、る。  [0030] The processing apparatus 10 carries in and out the carrier C in which the wafer W is stored in a horizontal state, carries out and stores the carrier C, and performs a cleaning process using a predetermined chemical solution for the wafer and W, and also performs drying. The processing unit 32 mainly performs processing, and an interface unit 33 that transfers the wafer W between the loading / unloading unit 31 and the processing unit 32.
[0031] 搬入出部 31は、所定枚数、例えば 25枚のウェハ Wを収容可能なキャリア Cを載置 するためのステージ 41が形成されたキャリア搬入出部 34と、複数のキャリア Cが保管 可能となっているキャリアストック部 35とで構成されている。キャリア Cは、ウェハ Wを 略水平に所定間隔で収容し、その一側面がウェハ Wの搬入出口となっており、この 搬入出口が蓋体により開閉可能となっている構造を有する。また、キャリアストック部 3 5は、複数のキャリア保持部材 43が設けられており、これらキャリア保持部材 43により キャリア Cが保持されるようになっている。ステージ 41に載置された処理前のウェハ W が収納されたキャリア Cは、キャリア搬送装置 42によりキャリアストック部 35へ搬入さ れ、一方、処理後のウエノ、 Wが収納されたキャリア Cは、キャリアストック部 35からキヤ リア搬送装置 42を用いて、ステージ 41へと搬出される。  [0031] The loading / unloading section 31 can store a plurality of carriers C, and a carrier loading / unloading section 34 on which a stage 41 for mounting a carrier C capable of accommodating a predetermined number, for example, 25 wafers W, is formed. It consists of a career stock section 35. The carrier C has a structure in which the wafer W is accommodated substantially horizontally at a predetermined interval, and one side surface thereof serves as a loading / unloading port for the wafer W, and the loading / unloading port can be opened and closed by a lid. The carrier stock portion 35 is provided with a plurality of carrier holding members 43, and the carrier C is held by these carrier holding members 43. The carrier C storing the unprocessed wafer W placed on the stage 41 is carried into the carrier stock unit 35 by the carrier transfer device 42, while the carrier C storing the processed wafer W and W is The carrier is transferred from the carrier stock unit 35 to the stage 41 using the carrier transfer device 42.
[0032] キャリア搬入出部 34とキャリアストック部 35との間にはシャッター 44が設けられてお り、キャリア搬入出部 34とキャリアストック部 35との間でのキャリア C受け渡しの際にシ ャッター 44が開かれ、それ以外のときにはキャリア搬入出部 34とキャリアストック部 35 との間の雰囲気分離を行うベぐシャッター 44は閉じた状態とされる。  [0032] A shutter 44 is provided between the carrier loading / unloading section 34 and the carrier stock section 35, and the shutter C is transferred when the carrier C is transferred between the carrier loading / unloading section 34 and the carrier stock section 35. 44 is opened, otherwise, the veg shutter 44 that performs atmosphere separation between the carrier loading / unloading section 34 and the carrier stock section 35 is closed.
[0033] キャリア搬送装置 42は、例えば、少なくともキャリア Cを X方向に移動させることが可 能なように駆動される多関節アームまたは伸縮アーム等のアーム 42aを有しており、 このようなアーム 42aがキャリア Cを把持してキャリア Cの搬送を行う。また、キャリア搬 送装置 42は、図示しない Y軸駆動機構と Z軸駆動機構により、 Y方向及び Z方向(高 さ方向)へも駆動可能となっており、これにより所定位置に配設されたキャリア保持部 材 43にキャリア Cを載置することが可能となって 、る。 [0033] The carrier transport device 42 can, for example, move at least the carrier C in the X direction. The arm 42a such as a multi-joint arm or a telescopic arm that is driven so as to be able to function is held, and the arm 42a grips the carrier C and transports the carrier C. Further, the carrier transporting device 42 can be driven in the Y direction and the Z direction (height direction) by a Y-axis driving mechanism and a Z-axis driving mechanism (not shown), and is thereby arranged at a predetermined position. Carrier C can be placed on carrier holding member 43.
[0034] キャリア保持部材 43は、図 3では、キャリアストック部 35を形成する壁面近傍に設け られており、各箇所において高さ方向に複数段に,例えば 4段設けられている。キヤリ ァストック部 35は、処理前のウェハ Wが収納されたキャリア Cを一時的に保管し、また ,ウェハ Wが取り出された内部が空となったキャリア Cを保管する役割を果たす。  In FIG. 3, the carrier holding member 43 is provided in the vicinity of the wall surface forming the carrier stock portion 35, and is provided in a plurality of stages, for example, four stages in the height direction at each location. The carrier stock section 35 temporarily stores the carrier C in which the wafer W before processing is stored, and also stores the carrier C in which the inside from which the wafer W is taken out is empty.
[0035] キャリアストック部 35とインターフェイス部 33との境界には窓部 46が形成されており 、この窓部 46のキャリアストック部 35側には、キャリア Cの蓋体が窓部 46に対面する ようにキャリア Cを載置することができるように、キャリア保持部材 43と同様の構造を有 する検査 Z搬入出ステージ 45が設けられている。なお、検査 Z搬入出ステージ 45を 配設することなぐ窓部 46に対面した所定のスペースにおいてキャリア搬送装置 42 がキャリア Cを所定時間保持するようにしてもょ 、。窓部 46のキャリアストック部 35側 には、検査 Z搬入出ステージ 45に載置されたキャリア Cの蓋体の開閉を行うための 蓋体開閉機構 47が設けられており、窓部 46およびキャリア Cの蓋体を開けた状態と することで、キャリア C内のウエノ、 Wをインターフェイス部 33側へ搬出することが可能 となっており、逆に、インターフェイス部 33側力も空のキャリア C内へウェハ Wを搬入 することも可能である。なお、蓋体開閉機構 47は窓部 46のインターフェイス部 33側 に設けてもよい。  A window portion 46 is formed at the boundary between the carrier stock portion 35 and the interface portion 33, and the lid of the carrier C faces the window portion 46 on the carrier stock portion 35 side of the window portion 46. Thus, an inspection Z loading / unloading stage 45 having the same structure as the carrier holding member 43 is provided so that the carrier C can be placed as described above. The carrier transport device 42 may hold the carrier C for a predetermined time in a predetermined space facing the window 46 where the inspection Z loading / unloading stage 45 is not provided. A lid opening / closing mechanism 47 for opening / closing the lid of the carrier C placed on the inspection Z loading / unloading stage 45 is provided on the carrier stock 35 side of the window 46. By opening the cover of C, the Ueno and W in the carrier C can be carried out to the interface unit 33 side. Conversely, the force on the interface unit 33 side also enters the empty carrier C. It is also possible to carry in wafer W. The lid opening / closing mechanism 47 may be provided on the interface part 33 side of the window part 46.
[0036] 窓部 46のインターフェイス部 33側には、キャリア C内のウェハ Wの枚数を計測する ためのウェハ検査装置 48が設けられている。ウェハ検査装置 48は、例えば、送信部 と受信部を有する赤外線センサヘッドを、キャリア C内に収納されたウェハ Wの X方向 端近傍において Z方向にスキャンさせながら、送信部と受信部との間で赤外線の透 過光または反射光の信号を検知して、ウェハ Wの枚数を検査する。ウェハ検査装置 48としては、ウェハ Wの枚数の検査と並行して、ウェハ Wの収納状態、例えば、キヤ リア C内にウェハ Wが所定のピッチで平行に 1枚ずつ配置されているかどうか、ゥェ ハ wが段差ずれして斜めに収納されていないかどうか等を検出する機能を具備した ものを用いることが好ましい。また、ウェハ wの収納状態を確認した後に、同センサを 用いてウェハ Wの枚数を検出するようにしてもよい。このウェハ検査装置 48は、ブロ ックコントローラ (BC) 11に信号入力機器として配線接続されており、検出した収納枚 数および収納状態を出力信号としブロックコントローラ (BC) 11に送信する。 A wafer inspection device 48 for measuring the number of wafers W in the carrier C is provided on the interface section 33 side of the window section 46. The wafer inspection apparatus 48, for example, scans an infrared sensor head having a transmission unit and a reception unit in the Z direction in the vicinity of the X direction end of the wafer W accommodated in the carrier C, and between the transmission unit and the reception unit. Inspect the number of wafers W by detecting infrared transmitted or reflected light signal. As the wafer inspection apparatus 48, in parallel with the inspection of the number of wafers W, the storage state of the wafers W, for example, whether the wafers W are arranged in parallel at a predetermined pitch in the carrier C, are checked. Ye It is preferable to use a device having a function of detecting whether or not the w is shifted in steps and stored obliquely. Further, after confirming the storage state of the wafer w, the number of wafers W may be detected using the sensor. The wafer inspection apparatus 48 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected number of stored sheets and the stored state to the block controller (BC) 11 as an output signal.
[0037] キャリア搬送装置 42とウェハ検査装置 48とは、ブロックコントローラ(BC) 11および メインコントローラ(MC) 12を介してホストコンピュータ 15によりその動作が制御され る。例えば、キャリア C内のウェハ Wの枚数をウェハ検査装置 48により検査した後に 、そのキャリア Cをキャリアストック部 35に保管するように、キャリア搬送装置 42を制御 する。なお、シャッター 44の開閉や窓部 46の開閉、蓋体開閉機構 47の動作がキヤリ ァ搬送装置 42の動きに連動して制御される。  The operations of the carrier transfer device 42 and the wafer inspection device 48 are controlled by the host computer 15 via the block controller (BC) 11 and the main controller (MC) 12. For example, after the number of wafers W in the carrier C is inspected by the wafer inspection device 48, the carrier transfer device 42 is controlled so that the carrier C is stored in the carrier stock unit 35. The opening / closing of the shutter 44, the opening / closing of the window 46, and the operation of the lid opening / closing mechanism 47 are controlled in conjunction with the movement of the carrier transport device 42.
[0038] インターフェイス部 33には、ウェハ搬入出装置 49と、ウェハ移し替え装置 51と、ゥ ェハ搬送装置 52とが設けられている。ウェハ移し替え装置 51は、ウェハ搬入出装置 49との間でウェハ Wの受け渡しを行い、かつ、ウェハ Wの姿勢を変換する姿勢変換 機構 51aと、姿勢変換機構 51aとウェハ搬送装置 52との間でウェハ Wの受け渡しを 行うウェハ垂直保持機構 51bとから構成されている。  The interface unit 33 is provided with a wafer carry-in / out device 49, a wafer transfer device 51, and a wafer transfer device 52. The wafer transfer device 51 transfers the wafer W to and from the wafer carry-in / out device 49 and converts the posture of the wafer W, and between the posture changing mechanism 51a and the wafer transfer device 52. And a wafer vertical holding mechanism 51b for transferring the wafer W.
[0039] ウェハ搬入出装置 49は、窓部 46を通してキャリア C内のウエノ、 Wを搬出して姿勢 変換機構 51aへ受け渡し、また、液処理が終了したウェハ Wを姿勢変換機構 51aか ら受け取ってキャリア Cへ搬入する。このウェハ搬入出装置 49は、未処理のウェハ W の搬送を行うアーム 49aと、処理済みのウェハ Wの搬送を行うアーム 49bの 2系統の アームを有している。アーム 49aおよび 49bは、キャリア C内に収納された複数のゥェ ハ Wを一括して保持することができるように、キャリア C内におけるウェハ Wの配列ピ ツチに適合させて、所定数 Z方向に所定間隔で並べられている。また、図 3に示した 状態において、アーム 49aおよび 49bは矢印 A方向に移動 (スライド)または伸縮自 在であり、かつ、 Z方向に所定距離昇降可能となっている。さらに、ウェハ搬入出装置 49全体は Θ方向に回転可能に構成されており,これにより、アーム 49aおよび 49bは 、検査 Z搬入出ステージ 45に載置されたキャリア Cおよび姿勢変換機構 51aのいず れにもアクセス可能となって 、る。 [0040] ウェハ搬入出装置 49においては、例えば、アーム 49aがウェハ移し替え装置 51側 にある状態において、アーム 49aをウェハ Wの下側に挿入し、アーム 49aを所定距離 上昇させてウェハ Wをアーム 49aに保持させ、その後アーム 49aを逆方向に移動さ せてキャリア C内のウェハ Wを搬出する。次いで、ウェハ搬入出装置 49全体を 90° 回転させた後、アーム 49aを移動させることにより、アーム 49aに保持したウェハ Wを 姿勢変換機構 51aへ受け渡す。一方、アーム 49bが処理部 32側にある状態におい て、アーム 49bを移動させて姿勢変 «構 5 laから液処理済みのウエノ、 Wを取り出 した後、ウェハ搬入出装置 49全体を 90° 回転させた後、アーム 49bをウェハ移し替 え装置 51側にある状態とし、アーム 49bを移動させることにより、アーム 49bに保持さ れたウェハ Wを空のキャリア Cへ搬入する。 The wafer loading / unloading device 49 unloads the wafers W and W in the carrier C through the window 46 and delivers them to the attitude changing mechanism 51a, and receives the wafer W after the liquid processing from the attitude changing mechanism 51a. Carry into Carrier C. The wafer carry-in / out device 49 has two arms, an arm 49a for carrying an unprocessed wafer W and an arm 49b for carrying a processed wafer W. The arms 49a and 49b are adapted to the alignment pitch of the wafer W in the carrier C so that a plurality of wafers W stored in the carrier C can be held together, and a predetermined number of Z directions Are arranged at predetermined intervals. In the state shown in FIG. 3, the arms 49a and 49b move (slide) or extend and retract in the direction of arrow A, and can move up and down by a predetermined distance in the Z direction. Further, the entire wafer carry-in / out device 49 is configured to be rotatable in the Θ direction, so that the arms 49a and 49b can be connected to either the carrier C placed on the inspection Z carry-in / out stage 45 or the posture changing mechanism 51a. This is also accessible. [0040] In the wafer carry-in / out device 49, for example, in a state where the arm 49a is on the wafer transfer device 51 side, the arm 49a is inserted below the wafer W, and the arm 49a is moved up by a predetermined distance to remove the wafer W. The arm 49a is held, and then the arm 49a is moved in the opposite direction to carry out the wafer W in the carrier C. Next, after the entire wafer carry-in / out device 49 is rotated by 90 °, the arm 49a is moved to deliver the wafer W held on the arm 49a to the posture changing mechanism 51a. On the other hand, in a state where the arm 49b is on the processing unit 32 side, the arm 49b is moved to take out the liquid-treated weno and W from the posture change structure 5 la, and then the wafer carry-in / out device 49 is moved to 90 °. After the rotation, the arm 49b is placed on the wafer transfer device 51 side, and the arm 49b is moved to carry the wafer W held by the arm 49b into the empty carrier C.
[0041] ウェハ移し替え装置 51の姿勢変換機構 51aにおいては、ガイド部材によりウェハ搬 入出装置 49から水平方向の複数のウェハ Wを受け取り、その状態でガイド部材を回 転させてウェハの姿勢を垂直状態へ変換する。  [0041] In the posture changing mechanism 51a of the wafer transfer device 51, a plurality of horizontal wafers W are received from the wafer loading / unloading device 49 by the guide member, and the guide member is rotated in this state to vertically change the wafer posture. Convert to state.
[0042] ウェハ垂直保持機構 51bは、姿勢変換機構 51aで垂直状態に姿勢変換されたキヤ リア 2個分の 50枚のウェハ Wをキャリア C内におけるウェハ配列ピッチの半分の配列 ピッチで収納可能となっており、このキャリア 2個分のウエノ、 Wをウェハ搬送装置 52 へ受け渡す。  [0042] The wafer vertical holding mechanism 51b can store 50 wafers W for two carriers whose posture has been changed to the vertical state by the posture changing mechanism 51a at an arrangement pitch that is half the wafer arrangement pitch in the carrier C. The Ueno and W for the two carriers are transferred to the wafer transfer device 52.
[0043] ウェハ搬送装置 52は、ウェハ垂直保持機構 5 lbとの間で垂直状態のウェハ Wの 受け渡しを行い、未処理のウェハ Wを処理部 32へ搬入し、逆に、液処理等の終了し たウェハ Wを処理部 32から搬出して、ウェハ垂直保持機構 5 lbに受け渡す。ウェハ 搬送装置 52においては、ウェハ Wは 3本のチャック 58a〜58cにより保持される。ゥ ェハ搬送装置 52がウェハ垂直保持機構 51bとの間でウェハ Wの受け渡しを行い、ま た,処理部 32へウェハ Wを搬送することができるように,ウェハ搬送装置 52は、ガイ ドレール 53に沿って X方向に移動し、処理部 32へ進入 Z退出することができるように なっている。  [0043] The wafer transfer device 52 delivers the wafer W in a vertical state with the wafer vertical holding mechanism 5 lb, carries the unprocessed wafer W into the processing unit 32, and conversely ends the liquid processing or the like. The transferred wafer W is unloaded from the processing unit 32 and transferred to the wafer vertical holding mechanism 5 lb. In the wafer transfer device 52, the wafer W is held by three chucks 58a to 58c. The wafer transfer device 52 is provided with a guide rail 53 so that the wafer transfer device 52 can transfer the wafer W to and from the wafer vertical holding mechanism 51b and transfer the wafer W to the processing unit 32. It moves in the X direction along, and can enter the processing section 32 and exit the Z.
[0044] また、液処理後のウェハ Wに損傷や位置ずれ等の発生がないかどうかを確認する ために、ウェハ垂直保持機構 5 lbとウェハ搬送装置 52との間でウェハ Wの受け渡し が行われる位置に、ウェハ Wの配列状態を検査するウェハ検出センサ 57が設けられ ている。なお、ウェハ検出センサ 57は、このような位置に限定されず、処理後のゥェ ハ Wがウェハ搬入出装置 49へ搬送されるまでの間で検査を行うことができる位置に あればよい。ウェハ検出センサ 57は、ブロックコントローラ (BC) 11に信号入力機器 として配線接続されており、検出値を出力信号としてブロックコントローラ (BC) 11に 送信する。 [0044] Further, in order to confirm whether or not the wafer W after the liquid processing is damaged or displaced, the wafer W is transferred between the wafer vertical holding mechanism 5 lb and the wafer transfer device 52. The wafer detection sensor 57 that inspects the alignment state of the wafer W is provided at ing. Note that the wafer detection sensor 57 is not limited to such a position, and may be at a position where inspection can be performed until the processed wafer W is transferred to the wafer carry-in / out device 49. The wafer detection sensor 57 is wired to the block controller (BC) 11 as a signal input device, and transmits the detected value to the block controller (BC) 11 as an output signal.
[0045] インターフェイス部 33には、ウェハ垂直保持機構 51bとウェハ搬送装置 52との間で ウェハ Wの受け渡しが行われる位置の側方に、パーキングエリア 40aが設けられてお り、このパーキングエリア 40aには、例えば、未処理のウェハ Wを待機させることが可 能となっている。例えば、あるロットのウェハ Wについて液処理または乾燥処理が行 われている際に、ウェハ搬送装置 52を運転させることが必要でない時間を利用して、 次に液処理を開始すべきウェハ Wをパーキングエリア 40aに搬送しておく。これによ り、例えば、キャリアストック部 35からウェハ Wを搬送してくる場合と比較すると、ゥェ ハ Wの処理部 32への移動時間を短縮することが可能となり、スループットを向上させ ることがでさる。  [0045] The interface unit 33 is provided with a parking area 40a on the side of the position where the wafer W is transferred between the wafer vertical holding mechanism 51b and the wafer transfer device 52. The parking area 40a For example, an unprocessed wafer W can be put on standby. For example, when liquid processing or drying processing is performed on a lot of wafers W, the wafer W to be started next is parked using the time when it is not necessary to operate the wafer transfer device 52. Transport to area 40a. As a result, for example, compared to the case where the wafer W is transferred from the carrier stock unit 35, it is possible to shorten the movement time of the wafer W to the processing unit 32 and improve the throughput. It is out.
[0046] 処理部 32は、液処理ユニット 38と、乾燥ユニット 39と、ノ ーキングエリア 40bと力ら 構成されており、インターフェイス部 33側から、乾燥ユニット 39、液処理ユニット 38、 パーキングエリア 40bの順で配置されている。ウェハ搬送装置 52は、 X方向に延在 するガイドレール 53に沿って処理部 32内を移動することができるようになつている。  [0046] The processing unit 32 includes a liquid processing unit 38, a drying unit 39, and a knocking area 40b. From the interface unit 33 side, the drying unit 39, the liquid processing unit 38, and the parking area 40b are arranged in this order. Is arranged in. The wafer transfer device 52 can move in the processing unit 32 along a guide rail 53 extending in the X direction.
[0047] パーキングエリア 40bは、パーキングエリア 40aと同様に、未処理のウェハ Wを待機 させる場所である。液処理または乾燥処理があるロットのウェハ Wにつ 、て行われて おり、ウェハ搬送装置 52を運転させることが必要でない時間を利用して次に液処理 を開始すべきウェハ Wがパーキングエリア 40bへ搬送される。パーキングエリア 40b は液処理ユニット 38に隣接していることから、液処理開始にあたってウェハ Wの移動 時間を短縮することが可能となり、スループットを向上させることができる。  [0047] Similar to the parking area 40a, the parking area 40b is a place for waiting for an unprocessed wafer W. The wafer W in the lot where liquid processing or drying processing is performed is performed, and the wafer W which should start liquid processing next using the time when it is not necessary to operate the wafer transfer device 52 is in the parking area 40b. It is conveyed to. Since the parking area 40b is adjacent to the liquid processing unit 38, the moving time of the wafer W can be shortened at the start of the liquid processing, and the throughput can be improved.
[0048] 液処理ユニット 38は、第 1の薬液槽 61、第 2の薬液槽 63、第 3の薬液槽 65、第 1の 水洗槽 62、第 2の水洗槽 64、第 3の水洗槽 66を有しており、図 3に示すように、パー キングエリア 40b側から、第 1の薬液槽 61、第 1の水洗槽 62、第 2の薬液槽 63、第 2 の水洗槽 64、第 3の薬液槽 65、第 3の水洗槽 66の順に配置されている。また、第 1 の薬液槽 61と第 1の水洗槽 62との間でウェハ Wを搬送するための搬送装置 67、第 2の薬液槽 63と第 2の水洗槽 64との間でウエノ、 Wを搬送するための搬送装置 68、 第 3の薬液槽 65と第 3の水洗槽 66との間でウエノ、 Wを搬送するための搬送装置 69 とを備えている。 [0048] The liquid treatment unit 38 includes a first chemical tank 61, a second chemical tank 63, a third chemical tank 65, a first water tank 62, a second water tank 64, and a third water tank 66. As shown in FIG. 3, from the parking area 40b side, the first chemical bath 61, the first flush bath 62, the second chemical bath 63, the second flush bath 64, the third The chemical tank 65 and the third washing tank 66 are arranged in this order. The first For transporting wafers W between the chemical bath 61 and the first washing bath 62, and for transporting wafers W between the second chemical bath 63 and the second washing bath 64. A transfer device 68, and a transfer device 69 for transferring Ueno and W between the third chemical solution tank 65 and the third rinsing tank 66.
[0049] 第 1の薬液槽 61には、有機性汚れ除去や表面金属不純物除去を行うための薬液 が貯留されて 、る。有機性汚れ除去や表面金属不純物除去を行うための薬液として は,例えば 130°C前後に加熱された SPM液 (濃硫酸と過酸ィ匕水素水の混合溶液)が 貯留される。また、第 2の薬液槽 63には、パーティクル等の付着物を除去するための 薬液、例えば SC— 1液 (アンモニアと過酸ィ匕水素と水の混合溶液)が貯留されており 、第 3の薬液槽 65には、ウェハ Wの表面に形成された酸ィ匕膜をエッチングするため のエッチング液、例えば希フッ酸 (DHF)が貯留されている。エッチング液としては、 希フッ酸の他、フッ酸(HF)とフッ化アンモ-ゥムとの混合物(バッファドフッ酸 (BHF) )を用いることもできる。また、ウエノ、 Wの表面に形成された窒化膜をエッチングする 場合は、エッチング液としてリン酸を用いることができる。第 1〜第 3の水洗槽 62, 64 , 66は、それぞれ第 1〜第 3の薬液槽 61, 63, 65による液処理によってウェハ Wに 付着した薬液を除去するものであり、例えば、オーバーフローリンスやクイックダンプリ ンス等の各種の水洗手法が用いられる。  [0049] In the first chemical tank 61, a chemical liquid for removing organic dirt and removing surface metal impurities is stored. For example, SPM liquid (mixed sulfuric acid / peroxy-hydrogen water mixed solution) heated to around 130 ° C is stored as a chemical solution for organic soil removal and surface metal impurity removal. The second chemical tank 63 stores a chemical solution for removing deposits such as particles, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, hydrogen, and water). The chemical solution tank 65 stores an etching solution for etching the acid film formed on the surface of the wafer W, for example, dilute hydrofluoric acid (DHF). As an etchant, a mixture of hydrofluoric acid (HF) and ammonium fluoride (buffered hydrofluoric acid (BHF)) can be used in addition to dilute hydrofluoric acid. Further, when etching a nitride film formed on the surface of Ueno or W, phosphoric acid can be used as an etchant. The first to third rinsing tanks 62, 64 and 66 are for removing the chemical solution adhering to the wafer W by the liquid treatments in the first to third chemical solution tanks 61, 63 and 65, respectively. Various washing methods such as water and quick dampening are used.
[0050] 搬送装置 67は、 Z方向に昇降可能な駆動機構を有しており、ウェハ搬送装置 52か ら受け渡されたウェハ Wを下降させて第 1の薬液槽 61に浸して所定時間経過後に引 き上げ、次いで、ウェハ Wを X方向に平行移動させてウェハ Wを第 1の水洗槽 62に 浸して所定時間保持し、引き上げるように動作する。第 1の水洗槽 62での処理を終え たウェハ Wは、一度、ウェハ搬送装置 52のチャック 58a〜58cに戻された後、ウェハ 搬送装置 52から搬送装置 68へ搬送される。搬送装置 68, 69は、搬送装置 67と同 様の構成を有し、また、同様に動作する。  [0050] The transfer device 67 has a drive mechanism that can be moved up and down in the Z direction. The wafer W delivered from the wafer transfer device 52 is lowered and immersed in the first chemical tank 61, and a predetermined time has elapsed. The wafer W is pulled up later, and then the wafer W is moved in parallel in the X direction so that the wafer W is immersed in the first rinsing tank 62, held for a predetermined time, and then lifted. The wafer W that has been processed in the first washing tank 62 is once returned to the chucks 58a to 58c of the wafer transfer device 52, and then transferred from the wafer transfer device 52 to the transfer device 68. The transport devices 68 and 69 have the same configuration as the transport device 67 and operate in the same manner.
[0051] 液処理ユニット 38には、液処理ユニット 38内の雰囲気の温度を検出する液処理ュ ニット温度計 59および圧力を検出する液処理ユニット圧力計 60が設置されている。 液処理ユニット温度計 59および液処理ユニット圧力計 60は、ブロックコントローラ(B C) 11に信号入力機器として配線接続されており、それぞれ検出した温度および圧 力を出力信号としてブロックコントローラ(BC) 11に送信する。 [0051] The liquid processing unit 38 is provided with a liquid processing unit thermometer 59 for detecting the temperature of the atmosphere in the liquid processing unit 38 and a liquid processing unit pressure gauge 60 for detecting the pressure. The liquid processing unit thermometer 59 and liquid processing unit pressure gauge 60 are wired to the block controller (BC) 11 as signal input devices. Force is transmitted to the block controller (BC) 11 as an output signal.
[0052] 乾燥ユニット 39は、水洗槽 54とウェハ搬送装置 52のチャック 58a〜58cを洗浄す るチャック洗浄機構 56が配設されており、水洗槽 54の上部には、例えばイソプロピル アルコール (IPA)の蒸気が供給されてウェハ Wを乾燥する乾燥室(図示せず)が設 けられている。また、水洗槽 54と乾燥室との間でウェハ Wを搬送する搬送装置 55が 設けられており、水洗槽 54で水洗されたウェハ Wが搬送装置 55で引き上げられ、乾 燥室において IPA乾燥されるようになっている。搬送装置 55は X方向の移動ができ ない他は前述した搬送装置 67等と同様に構成されており、ウェハ搬送装置 52との間 でウェハ Wの受け渡しが可能となって!/、る。  [0052] The drying unit 39 is provided with a rinsing tank 54 and a chuck cleaning mechanism 56 that cleans the chucks 58a to 58c of the wafer transfer device 52. An isopropyl alcohol (IPA) is disposed above the rinsing tank 54, for example. A drying chamber (not shown) is provided for drying the wafer W by supplying the steam. In addition, a transfer device 55 for transferring the wafer W between the washing tank 54 and the drying chamber is provided, and the wafer W washed with water in the washing bath 54 is pulled up by the transfer device 55 and IPA-dried in the drying chamber. It has become so. The transfer device 55 is configured in the same manner as the transfer device 67 and the like described above except that it cannot move in the X direction, and the wafer W can be transferred to and from the wafer transfer device 52.
[0053] 第 1の薬液槽 61は、図 4に示すように、ウェハ Wを収納するのに充分な大きさを有 する箱形の内槽 80と外槽 81から構成されている。内槽 80の上面は開口しており,こ の上面の開口部を介して内槽 80に対するウェハ Wの出し入れが行われる。外槽 81 は、内槽 80の上端力もオーバーフローした薬液を受けとめるように、内槽 80の開口 部を取り囲んで装着されている。さらに、内槽 80および外槽 81に貯留される薬液の 液面には、それぞれ液面の位置を計測するための液面センサ 82a, 82bが設けられ ている。これら液面センサ 82a, 82bは、ブロックコントローラ(BC) 11に信号入力機 器として配線接続されており、検出した液面の位置を出力信号としてブロックコント口 ーラ(BC) 11に送信する。  As shown in FIG. 4, the first chemical tank 61 is composed of a box-shaped inner tank 80 and an outer tank 81 that are large enough to accommodate the wafer W. The upper surface of the inner tank 80 is open, and the wafer W is inserted into and removed from the inner tank 80 through the opening on the upper surface. The outer tub 81 is mounted so as to surround the opening of the inner tub 80 so as to receive the chemical liquid in which the upper end force of the inner tub 80 also overflows. Furthermore, liquid level sensors 82a and 82b for measuring the position of the liquid level are provided on the liquid level of the chemical solution stored in the inner tank 80 and the outer tank 81, respectively. These liquid level sensors 82a and 82b are wired to the block controller (BC) 11 as signal input devices, and transmit the detected liquid level positions to the block controller (BC) 11 as output signals.
[0054] 内槽 80と外槽 81との間には、ウェハ Wのエッチング処理中に薬液を循環流通させ て供給する循環供給回路 84が接続されて 、る。この循環供給回路 84の一方は外槽 81の底面に接続されており、循環供給回路 84の途中には、ポンプ 86、温度制御部 88、フィルタ 90が順に配列され、循環供給回路 84の他方は内槽 80内のノズルに接 続されている。したがって、内槽 80から外槽 81にオーバーフローした薬液は循環供 給回路 84に流入し、ポンプ 86の稼働によって温度制御部 88、フィルタ 90の順に通 過し温調および清浄化された後、ノズルを経て再び内槽 80内に供給されるようにな つている。ノズルは外槽 81の下方に配置されており、ウェハ Wの表面に向かって薬 液を供給するように構成されて 、る。  A circulation supply circuit 84 is connected between the inner tank 80 and the outer tank 81 to supply a chemical solution in a circulating manner during the etching process of the wafer W. One of the circulation supply circuit 84 is connected to the bottom surface of the outer tub 81, and in the middle of the circulation supply circuit 84, a pump 86, a temperature control unit 88, and a filter 90 are arranged in this order, and the other of the circulation supply circuit 84 is It is connected to the nozzle in the inner tank 80. Therefore, the chemical liquid overflowed from the inner tank 80 to the outer tank 81 flows into the circulation supply circuit 84, and is passed through the temperature control unit 88 and the filter 90 in this order by the operation of the pump 86, and after temperature adjustment and cleaning, the nozzle After that, it is again supplied into the inner tank 80. The nozzle is disposed below the outer tank 81 and is configured to supply a chemical toward the surface of the wafer W.
[0055] 温度制御部 88は、内槽 80内の薬液が所定の処理温度よりも低くまたは高くならな いように、循環供給回路 84から内槽 80内に供給される薬液をウェハ Wの浸漬前に 予め冷却または加熱しておく機能を有している。このように、予め冷却または加熱さ れた薬液を内槽 80内に供給することにより、内槽 80内の薬液の温度を維持すること が可能となる。また,温度制御部 88はブロックコントローラ(BC) 11に信号出力機器 として配線接続されており、ブロックコントローラ (BC) 11から出力された制御信号を 受信する。例えば、温度制御部 88はヒータと熱交換器および冷却水供給手段とから 構成されており、熱交換器内部に冷却水を導入する冷却水供給路の途中に配置さ れた弁とヒータ力 ブロックコントローラ(BC) 11に接続されている。そして、ヒータまた は弁の何れかに、必要に応じてブロックコントローラ (BC) 11を介して所定の制御信 号が送信される。 [0055] The temperature control unit 88 requires that the chemical solution in the inner tank 80 be lower or higher than a predetermined processing temperature. As described above, the chemical solution supplied from the circulation supply circuit 84 into the inner tank 80 has a function of cooling or heating in advance before the wafer W is immersed. In this way, by supplying the chemical solution that has been cooled or heated in advance into the inner tank 80, the temperature of the chemical liquid in the inner tank 80 can be maintained. The temperature controller 88 is wired to the block controller (BC) 11 as a signal output device, and receives the control signal output from the block controller (BC) 11. For example, the temperature control unit 88 is composed of a heater, a heat exchanger, and a cooling water supply means, and a valve and a heater power block arranged in the middle of the cooling water supply path for introducing the cooling water into the heat exchanger. Connected to controller (BC) 11. Then, a predetermined control signal is transmitted to either the heater or the valve via the block controller (BC) 11 as necessary.
[0056] 循環供給回路 84の途中には、循環供給回路 84内の薬液を外槽 81に流入させる 分岐管 92が接続されており、さらに分岐管 92には、薬液の温度および濃度を検出 するための濃度 ·温度検出部 95が設けられている。濃度 ·温度検出部 95はブロック コントローラ (BC) 11に信号入力機器として配線接続されている。濃度'温度検出部 95には、薬液の温度を検出する温度計 95aと、薬液の濃度を検出する濃度計 95bが 設けられており、それぞれ検出した温度および濃度を出力信号としてブロックコント口 ーラ(BC) 11に送信する。  In the middle of the circulation supply circuit 84, a branch pipe 92 for connecting the chemical solution in the circulation supply circuit 84 to the outer tank 81 is connected. Further, the branch pipe 92 detects the temperature and concentration of the chemical solution. A concentration / temperature detector 95 is provided. The concentration / temperature detector 95 is wired to the block controller (BC) 11 as a signal input device. The concentration'temperature detector 95 is provided with a thermometer 95a for detecting the temperature of the chemical solution and a concentration meter 95b for detecting the concentration of the chemical solution, and the detected temperature and concentration are respectively output to the block controller. (BC) Send to 11.
[0057] 分岐管 92は循環供給回路 84の管より細ぐ例えば分岐管 92の直径が循環供給回 路 84の直径の 1Z3となっている。この場合、乱流の発生を防止できるので、濃度'温 度検出部 95において超音波濃度計を使用した場合であっても、濃度の計測に用い る超音波は乱流渦の影響を受けない。また、ポンプ 86の駆動によって生じる薬液の 圧力変動が濃度の計測に与える影響を抑制する。したがって、高精度な濃度測定が 可能となる。  The branch pipe 92 is narrower than the pipe of the circulation supply circuit 84. For example, the diameter of the branch pipe 92 is 1Z3 which is the diameter of the circulation supply circuit 84. In this case, since the generation of turbulent flow can be prevented, even if an ultrasonic densitometer is used in the concentration / temperature detector 95, the ultrasonic wave used for concentration measurement is not affected by the turbulent vortex. . It also suppresses the effect of pressure fluctuations in the chemical solution caused by driving the pump 86 on concentration measurement. Therefore, highly accurate concentration measurement is possible.
[0058] 第 1の薬液槽 61には薬液を槽内に充填するための薬液供給回路 100が設けられ ている。薬液供給回路 100は、薬液供給源 101、純水供給源 102および薬液と純水 を混合する混合供給部 103とを備えている。混合供給部 103はブロックコントローラ( BC) 11に信号出力機器として配線接続されている。なお、薬液供給回路 100は薬 液の補充手段としての機能を有し、薬液槽 61内の薬液の濃度が低下した際に、薬 液供給源 101、純水供給源 102から薬液を補充するように制御される。 [0058] The first chemical solution tank 61 is provided with a chemical solution supply circuit 100 for filling the chemical solution into the tank. The chemical solution supply circuit 100 includes a chemical solution supply source 101, a pure water supply source 102, and a mixing supply unit 103 that mixes the chemical solution and pure water. The mixed supply unit 103 is wired to the block controller (BC) 11 as a signal output device. The chemical solution supply circuit 100 has a function as a chemical solution replenishment means, and when the concentration of the chemical solution in the chemical solution tank 61 decreases, Control is performed to replenish the chemical solution from the liquid supply source 101 and the pure water supply source 102.
[0059] 薬液供給回路 100の他端は外槽 81へ接続されており、調整された薬液はー且循 環供給回路 84を流れて、温度を調整された後、内槽 80の下方力 ウェハ Wに対し て供給されるようになって 、る。  [0059] The other end of the chemical solution supply circuit 100 is connected to the outer tank 81, and the adjusted chemical solution flows through the circulation supply circuit 84, and after the temperature is adjusted, the downward force of the inner tank 80 Wafer Supplied to W.
[0060] 以上が第 1の薬液槽 61および配管系の構成である力 第 1および第 2の薬液槽 63 , 65もほぼ同様の構成と機能を有しているので説明は省略する。また、第 1〜第 3の 水洗槽 62, 64, 66も、基本的には同様の構成と機能を有している。すなわち、内槽 および外槽からなる水洗槽と、循環供給回路とを有し、水洗槽に対して純水供給回 路から純水が供給されるようになって!/ヽる。  [0060] The force which is the configuration of the first chemical tank 61 and the piping system as described above. The first and second chemical tanks 63 and 65 also have substantially the same configuration and function, and thus the description thereof is omitted. The first to third rinsing tanks 62, 64, 66 also basically have the same configuration and function. That is, it has a water washing tank composed of an inner tank and an outer tank and a circulation supply circuit, and pure water is supplied to the water washing tank from the pure water supply circuit.
[0061] 以上のように、処理装置 10は各構成部の状態を検知する種々の検出手段を備え ている。すなわち、上述したように、液処理ユニット 38内の雰囲気の状態を検出する 検出手段としては、液処理ユニット温度計 59および液処理ユニット圧力計 60が設置 されている。また、第 1の薬液槽 61およびその配管系の各部の状態を検出する検出 手段としては、液面センサ 82a, 82b、温度'濃度検出部 95の温度計 95aおよび濃度 計 95bが設置されている。第 2および第 3の薬液槽 63, 65および配管系にも同様の 液面センサ、温度 ·濃度検出部の温度計および濃度計が設置されている。さらに、ゥ エノ、 Wの収納状態を検出する検出手段として、インターフェイス部 33にウェハ検査 装置 48が設置され、ウェハ Wの配列状態を検出する検出手段として、ウェハ検出セ ンサ 57が設置されている。その他にも種々の検出手段が設けられている。これらは、 上述したように所定の検出を行い、図 5に示すように、検出値を出力信号としてブロッ クコントローラ(BC) 11に送信するようになって!/、る。  [0061] As described above, the processing apparatus 10 includes various detection means for detecting the state of each component. That is, as described above, the liquid processing unit thermometer 59 and the liquid processing unit pressure gauge 60 are installed as detection means for detecting the state of the atmosphere in the liquid processing unit 38. As the detection means for detecting the state of the first chemical tank 61 and each part of its piping system, the liquid level sensors 82a and 82b, the thermometer 95a of the temperature 'concentration detector 95 and the concentration meter 95b are installed. . Similar liquid level sensors, temperature / concentration detector thermometers and concentration meters are installed in the second and third chemical tanks 63 and 65 and the piping system. Further, a wafer inspection device 48 is installed in the interface unit 33 as a detection means for detecting the storage state of the wafer and W, and a wafer detection sensor 57 is installed as a detection means for detecting the arrangement state of the wafers W. . In addition, various detection means are provided. These perform predetermined detection as described above, and transmit the detection value as an output signal to the block controller (BC) 11 as shown in FIG.
[0062] ウェハ検査装置 48、ウェハ検出センサ 57、液処理ユニット温度計 59、液処理ュ- ット圧力計 60、液面センサ 82a, 82b、温度'濃度検出部 95に設置された温度計 95 aおよび濃度計 95b、およびその他多数の検出手段の出力信号は所定の時間間隔 でブロックコントローラ(BC) 11に送信され、メインコントローラ(MC) 12に送信される 。このようにしてメインコントローラ (MC) 12に送信された検出情報等のプロセス情報 は、制御部 13に至り、上述したように処理装置の制御に用いられる。そしてこのような プロセス情報および異常検出部 15により検出された異常に基づいてアラーム発生部 16で発生されたアラーム情報は情報蓄積部 17に蓄積され、情報蓄積部 17から所定 のアラームに関連する情報がアラーム関連情報取得部 18により選択されることにより 、そのアラームの詳細情報を把握することができ、異常発生の原因箇所を的確に判 断することができる。 [0062] Wafer inspection device 48, wafer detection sensor 57, liquid processing unit thermometer 59, liquid processing unit pressure gauge 60, liquid level sensors 82a and 82b, thermometer 95 installed in temperature 'concentration detector 95 The output signals of a, the densitometer 95b, and many other detection means are transmitted to the block controller (BC) 11 at a predetermined time interval and to the main controller (MC) 12. The process information such as detection information transmitted to the main controller (MC) 12 in this way reaches the control unit 13 and is used for controlling the processing apparatus as described above. Based on the process information and the abnormality detected by the abnormality detection unit 15, the alarm generation unit The alarm information generated in 16 is stored in the information storage unit 17, and information related to a predetermined alarm is selected from the information storage unit 17 by the alarm related information acquisition unit 18, so that detailed information on the alarm is grasped. It is possible to accurately determine the cause of the abnormality.
[0063] 次に、このような処理システムの処理動作について説明する。  Next, the processing operation of such a processing system will be described.
処理装置 10では、まず、 1ロットを構成するキャリア Cを搬入出部 31またはキャリア ストック部 35からキャリア搬送装置 42を用いて検査 Z搬入出ステージ 45に載置し、 蓋体開閉機構 47によりキャリア Cの蓋体を開き、さらに窓部 46を開いて、キャリアじに 収納されたウェハ Wの枚数と収納状態をウェハ検査装置 48によって検査する。検査 により異常が検出されな力つたキャリア Cはアーム 49aにより姿勢変 «構 51aへ受 け渡され、姿勢変 構 51aにおいて姿勢変換されてウェハ垂直保持機構 51bに 受け渡される。もう一つのキャリア Cについても姿勢変換機構 51aにてウェハ Wの姿 勢変換が行われ、ウェハ Wはアーム 49aウェハ垂直保持機構 5 lbに受け渡される。 こうして、ウェハ垂直保持機構 5 lbには、 50枚のウェハ Wが配列される。  In the processing apparatus 10, first, the carrier C constituting one lot is placed on the inspection Z loading / unloading stage 45 from the loading / unloading section 31 or the carrier stock section 35 using the carrier conveying apparatus 42, and the carrier opening / closing mechanism 47 performs carrier loading. Open the lid of C, and then open the window 46, and inspect the number of wafers W stored in the carrier and the storage state by the wafer inspection device 48. The carrier C, which has been detected as having no abnormality by inspection, is delivered to the posture changing structure 51a by the arm 49a, and the posture is changed in the posture changing 51a and then transferred to the wafer vertical holding mechanism 51b. For the other carrier C, the posture change mechanism 51a converts the posture of the wafer W, and the wafer W is delivered to the arm 49a wafer vertical holding mechanism 5 lb. Thus, 50 wafers W are arranged in the wafer vertical holding mechanism 5 lb.
[0064] ウェハ垂直保持機構 5 lbはウェハ搬送装置 52側へスライド移動され、ウェハ Wが チャック 58a〜58cへ移し替えられる。ウェハ Wを保持したウェハ搬送装置 52を、ガ イドレール 53に沿って液処理ユニット 38の第 1の薬液槽 61または第 1の水洗槽 62の 位置へ移動させ、ウェハ Wを第 1の搬送装置 67へ移し替え、ウェハ Wの液処理を開 始する。ウェハ Wの液処理は、例えば、第 1の薬液槽 61への浸漬と第 1の水洗槽 62 による洗浄、第 2の薬液槽 63への浸漬と第 2の水洗槽 64による洗浄、第 3の薬液槽 6 5への浸漬と第 3の水洗槽 66による洗浄の順で行われる。  [0064] The wafer vertical holding mechanism 5 lb is slid to the wafer transfer device 52 side, and the wafer W is transferred to the chucks 58a to 58c. The wafer transfer device 52 holding the wafer W is moved along the guide rail 53 to the position of the first chemical bath 61 or the first washing bath 62 of the liquid processing unit 38, and the wafer W is moved to the first transfer device 67. And liquid processing of wafer W is started. The liquid treatment of the wafer W includes, for example, immersion in the first chemical bath 61 and cleaning by the first water washing bath 62, immersion in the second chemical bath 63 and cleaning by the second water washing bath 64, and third cleaning. It is carried out in the order of immersion in the chemical tank 65 and cleaning by the third water washing tank 66.
[0065] 液処理ユニット 38での処理が終了したウェハ Wは、一度、ウェハ搬送装置 52に移 し替えられた後、乾燥ユニット 39の搬送装置 55へ移し替えられ、乾燥処理が施され る。乾燥処理が終了したウェハ Wは、ウェハ搬送装置 52に移し替えられて、インター フェイス部 33に戻され、検出センサ 57によりウェハ Wの状態を検査する。ここで、ゥ ェハ Wの状態に異常が検出されれば、例えば、液処理装置 1を停止してメンテナンス を行う等の処置をとる。液処理が終了してインターフェイス部 33へ戻されたウェハ W は、先に未処理のウェハ Wをキャリアストック部 35からウェハ搬送装置 52まで搬送し た手順と逆の手順により、検査 Z搬入出ステージ 45に載置された空のキャリア Cへ収 納することができる。液処理が終了したウェハ Wが収納されたキャリア Cは、キャリア 搬入出部 34へ搬送されて、次工程へと送られる。 The wafer W that has been processed in the liquid processing unit 38 is once transferred to the wafer transfer device 52 and then transferred to the transfer device 55 of the drying unit 39 to be subjected to a drying process. The wafer W that has been dried is transferred to the wafer transfer device 52, returned to the interface unit 33, and the state of the wafer W is inspected by the detection sensor 57. Here, if an abnormality is detected in the state of wafer W, for example, the liquid processing apparatus 1 is stopped and maintenance is performed. The wafer W returned to the interface unit 33 after the liquid processing is completed, transports the unprocessed wafer W from the carrier stock unit 35 to the wafer transfer device 52. The procedure can be reversed and stored in the empty carrier C placed on the inspection Z loading / unloading stage 45. The carrier C containing the wafer W after the liquid processing is transferred to the carrier loading / unloading section 34 and sent to the next process.
[0066] 以上の被処理体であるウェハ Wに対する処理動作は、ウェハ検査装置 48、ウェハ 検出センサ 57、液処理ユニット温度計 59、液処理ユニット圧力計 60、液面センサ 82 、温度 ·濃度検出部 95に設置された温度計 95aおよび濃度計 95b、およびその他多 数の検出手段の検出信号に基づいてブロックコントローラ (BC) 11およびメインコント ローラ (MC) 12により制御されつつ実行される。  The processing operations for wafer W, which is the object to be processed, are as follows: wafer inspection device 48, wafer detection sensor 57, liquid processing unit thermometer 59, liquid processing unit pressure gauge 60, liquid level sensor 82, temperature / concentration detection This is executed while being controlled by the block controller (BC) 11 and the main controller (MC) 12 based on detection signals from the thermometer 95a and the densitometer 95b installed in the unit 95 and many other detection means.
[0067] 具体的には、これらの検出手段の検出信号は、ブロックコントローラ (BC) 11を介し てメインコントローラ(MC) 12の制御部 13に至り、制御部 13は、これらの信号に基づ いて処理装置 10に所定の制御信号を送信し、これら制御信号に基づいて一連の洗 浄処理が行われる。  Specifically, the detection signals of these detection means reach the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and the control unit 13 is based on these signals. Then, a predetermined control signal is transmitted to the processing device 10, and a series of cleaning processes are performed based on these control signals.
[0068] また、処理装置 10からのこれら検出信号を含むプロセス情報は、ブロックコントロー ラ(BC) 11を介してメインコントローラ (MC) 12の制御部 13に送信され、信号処理さ れた後、情報蓄積部 17に蓄積される。プロセス情報は異常検出部 15にも送信され、 プロセス情報が所定の設定値力 外れた場合に異常と判断し、異常検出信号を制御 部 13に送信し、制御部 13はその異常検出信号に基づ!/、てアラーム発生部 16にァラ ーム発生信号を送信し、アラーム発生部 16はアラームを発生させる。アラーム発生は 、音や光の情報を発する他、モニター 21に表示することにより行われる。アラーム発 生信号は、情報蓄積部 17にも送信され処理履歴として蓄積される。  [0068] Further, the process information including these detection signals from the processing device 10 is transmitted to the control unit 13 of the main controller (MC) 12 via the block controller (BC) 11, and after signal processing, It is stored in the information storage unit 17. The process information is also transmitted to the abnormality detection unit 15, and when the process information deviates from a predetermined set value force, it is determined as abnormal, and an abnormality detection signal is transmitted to the control unit 13. The control unit 13 is based on the abnormality detection signal. Send an alarm signal to the alarm generator 16 and the alarm generator 16 generates an alarm. The alarm is generated by displaying information on the monitor 21 in addition to emitting sound and light information. The alarm generation signal is also transmitted to the information storage unit 17 and stored as a processing history.
[0069] アラームの情報を得ようとする場合には、操作部 22で所定のアラームを選択すると 、アラーム関連情報取得部 18が情報蓄積部 17に記憶されて 、るアラームテーブル 力 そのアラームを選択し、それにリンクされて 、る処理履歴の中のアラームに関連 するシーケンシャルな詳細情報、さらには選択されたアラームに関連した IZOァドレ ス情報やタイマー情報を選択的に取得し、取得されたアラーム情報をモニター 21に 表示することができる。  [0069] When trying to obtain alarm information, when a predetermined alarm is selected on the operation unit 22, the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table is selected. Linked to it, the sequential detailed information related to the alarm in the processing history, and also the IZO address information and timer information related to the selected alarm are selectively acquired, and the acquired alarm information Can be displayed on the monitor 21.
[0070] 例えば、第 1の薬液槽 61 (内槽 80および外槽 81)において、液面センサー 82a, 8 2bが液面レベル下限を検出した場合に発生するアラームは、その内容がアラームテ 一ブルに図 6に示すように記載されている。すなわち、アラーム IDとして 3071が割り 当てられ、アラームの内容として、アラームが薬液槽の下限を検出したものであること 、およびその詳細説明が記載され、さらに、可能性のあるアラーム発生理由の概略と して、液無しの状態で循環が実行されたこと (理由 1)、センサーの位置調整不良また は故障 (理由 2)、排液バルブの故障または薬液槽の破損 (理由 3)が記載され、これ らの対策(アクション)の概略が各理由毎に記載されている。また、このアラームテー ブルには、後述するリンク情報が記載される。そして、アラーム関連情報取得部 18が このアラームを選択すると、図 7のようにモニター 21が上記内容が表示された画面と なる(画面 1)。 [0070] For example, in the first chemical tank 61 (the inner tank 80 and the outer tank 81), the alarm generated when the liquid level sensors 82a and 82b detect the liquid level lower limit, One table is shown in FIG. In other words, 3071 is assigned as the alarm ID, the alarm content is that the alarm is the detection of the lower limit of the chemical tank, a detailed explanation thereof, and a summary of possible alarm occurrence reasons. The reason why the circulation was executed without liquid (reason 1), sensor misalignment or malfunction (reason 2), drain valve malfunction or chemical tank damage (reason 3), An outline of these measures (actions) is given for each reason. The alarm table includes link information described later. When the alarm related information acquisition unit 18 selects this alarm, the monitor 21 becomes a screen on which the above contents are displayed as shown in FIG. 7 (screen 1).
[0071] また、アラームテーブルのアラーム情報にリンクされている処理履歴の中のアラーム 発生に至るまでのシーケンシャルな詳細情報を、上記理由毎に選択することができ、 そのときのモニター 21の画面は図 8に示すようになる(画面 2)。具体的には、図 7の「 Detail]の部分をタツチ(クリック)することにより図 8の理由 1に対応する画面(「Pattern 1」)が表示される。本例では、循環ポンプがオンされて循環がスタートし、レベルセン サ一がオフに切り替わったことが表示されている。このとき「Pattern2」「Pattern3」の部 分をタツチ (クリック)することにより理由 2、理由 3に対応するアラーム発生に至るまで のシーケンシャルな詳細情報を選択的に取得することができる。  [0071] Sequential detailed information up to the occurrence of an alarm in the processing history linked to the alarm information in the alarm table can be selected for each of the above reasons, and the screen of the monitor 21 at that time is As shown in Figure 8 (Screen 2). Specifically, the screen corresponding to Reason 1 in FIG. 8 (“Pattern 1”) is displayed by touching (clicking) the “Detail” portion in FIG. In this example, it is displayed that the circulation pump is turned on, circulation starts, and the level sensor is switched off. At this time, by touching (clicking) on the “Pattern2” and “Pattern3” sections, it is possible to selectively obtain sequential detailed information until the alarm corresponding to Reason 2 and Reason 3 occurs.
[0072] さらに図 8の画面の「Currently View」の部分をタツチ(クリック)することにより、図 9に 示すアラーム発生前後の関連する IZOネーム、 ΙΖΟ情報が表示された画面となる( 画面 3)。ここでは、循環ポンプスタートに対応する IZOネーム CIRC_PUMP_START 、 OUTER_BATH丄 OWER丄 IMIT (外槽下限)、 INNER_BATH丄 OWER丄 IMIT (内槽 下限)が表示され、さらにこれらの IZO情報 (ONZOFF情報)が表示されている。 I ΖΟ情報は、塗りつぶされた部分力 ON状態であり、横軸が時間軸である。具体的に は、この画面から、循環ポンプはアラーム発生前後でいずれも ON状態となっている 力 外槽下限と内槽下限はアラーム発生時に ON力も OFFになり、その後も OFF状 態であることがわかる。このことから、アラーム発生原因がレベルセンサーに対応する ものであるということが特定される。さらに、この表示画面に IZOアドレスを表示するこ とにより画面上で ΙΖΟアドレスも特定することが可能である。なお、この画面には Parameterの欄がある力 ここにはアラームにリンクしたパラメータ(プロセス情報)が表 示される。この例の場合には、 Parameterの欄に表示されるべき情報がないことを示し ている。 [0072] By touching (clicking) the “Currently View” portion of the screen in FIG. 8, the screen displays the related IZO name and information before and after the alarm shown in FIG. 9 (screen 3). . Here, the IZO names CIRC_PUMP_START, OUTER_BATH 丄 OWER 丄 IMIT (outer tank lower limit), INNER_BATH 丄 OWER 丄 IMIT (inner tank lower limit) corresponding to the circulation pump start are displayed, and these IZO information (ONZOFF information) is also displayed. ing. I ΖΟ information shows that the painted partial force is ON, and the horizontal axis is the time axis. Specifically, from this screen, the circulation pump is in the ON state both before and after the alarm is generated.The lower limit of the outer tank and the lower limit of the inner tank are turned OFF when the alarm is generated, and are in the OFF state thereafter. I understand. From this, it is specified that the cause of the alarm is the one corresponding to the level sensor. Furthermore, by displaying the IZO address on this display screen, it is possible to specify the ΙΖΟ address on the screen. In this screen, Power with Parameter column This is the parameter (process information) linked to the alarm. In this example, there is no information to be displayed in the Parameter column.
[0073] 他のアラームについても全く同様に、アラーム関連情報取得部 18が情報蓄積部 17 に記憶されて 、るアラームテーブル力もそのアラームを選択し、それにリンクされて!/ヽ る処理履歴の中のアラームに関連するシーケンシャルな詳細情報、さらには選択さ れたアラームに関連した IZOアドレスデータやタイマー情報を選択的に取得し、取 得されたアラーム情報をモニター 21に表示することができる。  [0073] Exactly the same as for other alarms, the alarm related information acquisition unit 18 is stored in the information storage unit 17, and the alarm table power also selects the alarm and is linked to it in the processing history! Sequential detailed information related to other alarms, IZO address data and timer information related to the selected alarm can be selectively acquired, and the acquired alarm information can be displayed on the monitor 21.
[0074] 従来はアラームが発生すると、どの部分のアラームが発生したかの概略情報は得ら れるものの、アラーム発生に至った装置側の詳細な情報等までは得られず、アラーム 発生の原因箇所を特定することが困難であり、したがって、オペレータがアラーム発 生の原因箇所を発見して処理装置を復帰させるために長時間を要して 、た。これに 対して、本実施形態では、情報蓄積部 17に蓄積した処理履歴から、所定のアラーム のアラーム発生に至るまでのシーケンシャルな情報を I/Oアドレスデータのレベルま で詳細に把握することができるので、アラーム発生原因箇所を容易に特定することが できる。したがって、アラーム発生原因箇所の異常を迅速に取り除くことができるので 、処理装置 10に異常が発生した場合に、処理装置を短時間で復帰させることができ 、処理装置 10のダウンタイムを短くすることができる。  [0074] Conventionally, when an alarm is generated, it is possible to obtain general information about which part of the alarm has occurred, but it is not possible to obtain detailed information on the device side that caused the alarm, and the cause of the occurrence of the alarm. Therefore, it took a long time for the operator to find the cause of the alarm and return the processing device. On the other hand, in this embodiment, it is possible to grasp in detail the sequential information from the processing history accumulated in the information accumulation unit 17 to the occurrence of a predetermined alarm up to the level of the I / O address data. As a result, the location where the alarm occurred can be easily identified. Therefore, since the abnormality at the location causing the alarm can be quickly removed, when the abnormality occurs in the processing device 10, the processing device can be returned in a short time, and the downtime of the processing device 10 can be shortened. Can do.
[0075] また、アラームテープノレに、各アラームがどのようなことを警告して 、るアラームかの 情報 (アラームの説明)、そのアラームの可能性のある 1または 2以上の概略の発生理 由、さらには各発生理由毎の概略的な取り得るアクションといった情報が搭載されて おり、この情報が表示されるとともに、リンクされているアラーム発生までのシーケンシ ャルな情報が詳細に表示されるので、オペレータの熟練度が低くても、確実にアラー ム情報を把握して、適切な処置をとることが可能となる。  [0075] Also, the alarm tape alarm alerts what each alarm is, information about the alarm (description of the alarm), and the reason for the occurrence of one or more possible alarms In addition, information such as rough actions that can be taken for each cause is included, and this information is displayed, and sequential information up to the occurrence of the linked alarm is displayed in detail. Even if the skill level of the operator is low, it is possible to reliably grasp the alarm information and take appropriate measures.
[0076] なお、情報蓄積部 17に蓄積される処理履歴には、以上のように異常検出データや アラーム情報が含まれるため、処理装置 10で発生したトラブルに関する情報も蓄積 されることとなる。このため、次にトラブルが発生した際に、情報蓄積部 17に蓄積され たデータ力 関連情報を抽出することにより、効率良く異常原因を推測することがで きる。この場合に関連情報は任意のキーワードで検索することができるようにしておく ことが好ましい。 It should be noted that the processing history stored in the information storage unit 17 includes abnormality detection data and alarm information as described above, and therefore information related to troubles occurring in the processing device 10 is also stored. Therefore, the next time a problem occurs, the cause of the abnormality can be efficiently estimated by extracting the data force related information stored in the information storage unit 17. wear. In this case, it is preferable that related information can be searched with an arbitrary keyword.
[0077] 次に、本発明の他の実施形態に係る処理システムについて説明する。上記実施形 態では、処理装置 10が 1台の場合の処理システムについて説明した力 ここでは、複 数台の処理装置 10を一括して制御する処理システムについて説明する。  Next, a processing system according to another embodiment of the present invention will be described. In the above embodiment, the power described for the processing system when there is one processing device 10 Here, a processing system that collectively controls a plurality of processing devices 10 will be described.
[0078] 図 10は本実施形態に係る処理システムを示すブロック図である。この処理システム 1' は上記処理装置 10を複数台有しており、各処理装置 10は、下位制御系である ブロックコントローラ(BC) 11/ と、上位制御系であるメインコントローラ(MC) 12' に より制御されるようになっている。また、処理システム!/ は、システム全体の制御を行 うホストコンピュータ 115と、各処理装置の制御系で生成されたプロセスデータを解析 してその結果を出力するアドバンスド 'グループ 'コントローラ(以下、 AGCと記す) 11 7とを有している。各処理装置 10は、従前の実施形態と同様、種々の処理状態を検 出する複数の検出手段を備えており、この検出情報がブロックコントローラ(BC) 11 ' に入力され、メインコントローラ(MC) 12' を介してホストコンピュータ 115および A GC 117に送信されるようになっている。  FIG. 10 is a block diagram showing a processing system according to this embodiment. This processing system 1 ′ has a plurality of the above processing devices 10, and each processing device 10 has a block controller (BC) 11 / as a lower control system and a main controller (MC) 12 ′ as a higher control system. It is controlled by. The processing system! / Is an advanced 'group' controller (hereinafter referred to as AGC) that analyzes process data generated by the host computer 115 that controls the entire system and the control system of each processing device and outputs the results. 11 7). Each processing device 10 is provided with a plurality of detection means for detecting various processing states, as in the previous embodiment, and this detection information is input to the block controller (BC) 11 ′ and the main controller (MC) 12 'is transmitted to the host computer 115 and the A GC 117.
[0079] 図 11に示すように、メインコントローラ(MC) 12' は、ブロックコントローラ(BC) 11 ' を介して検出信号を受信し、その検出信号に基づいて処理装置 10の各構成部に 制御信号を送信する制御部 110と、制御部 110から受け取ったプロセス情報を解析 して異常を検出する異常検出部 111と、異常検出部 111の異常検出情報に基づい てアラームを発生させるアラーム発生部 112と、処理装置 10からブロックコントローラ (BC) 1 \' を介して受信され制御部 110で信号処理された全プロセス情報およびァ ラーム情報が一時的に蓄積されるメモリ 118と、メモリ 118から予め設定された一部の 種類のプロセスデータ(データ 1, 3)を取り出して情報を書き込む HCI送信バッファ 1 19と、ホストコンピュータ 115との論理的なインターフェイス手段である HCI (Host Communication Interface) 113と、 AGC 117との論理的なインターフェイス手段であ る RAP (Remote Agent Process) 116とを有している。そして、 HCI113によって、 TC PZIP等のデータ伝送系 114を通じたホストコンピュータ 115との間での各種データ のやりとりが行われる。また、 RAP116によって AGC117との間での各種データのや りとりがデータ伝送系 114を通じて行われる。 [0079] As shown in FIG. 11, the main controller (MC) 12 'receives the detection signal via the block controller (BC) 11' and controls each component of the processing device 10 based on the detection signal. A control unit 110 that transmits a signal, an abnormality detection unit 111 that analyzes process information received from the control unit 110 and detects an abnormality, and an alarm generation unit 112 that generates an alarm based on the abnormality detection information of the abnormality detection unit 111 Memory 118 in which all process information and alarm information received from the processing device 10 via the block controller (BC) 1 \ 'and processed by the control unit 110 are temporarily stored, and preset from the memory 118. HCI (Host Communi), which is a logical interface means between the HCI send buffer 1 19 and the host computer 115, which writes out some types of process data (data 1, 3) and writes information. cation interface) 113 and a RAP (Remote Agent Process) 116 which is a logical interface means with the AGC 117. The HCI 113 exchanges various data with the host computer 115 through the data transmission system 114 such as TC PZIP. In addition, with RAP116, various data are exchanged with AGC117. Retrieval is performed through the data transmission system 114.
[0080] HCI113は、メインコントローラ 12' にて処理装置 10から得た全てのプロセスデー タの中から予め設定された一部の種類のプロセスデータだけを選択してホストコンビ ユータ 115〖こ送信する。すなわち、 HCI113は、メインコントローラ(MC) 12' にて生 成された全プロセスデータが一時的に蓄積されるメモリ 118から予め設定された一部 の種類のプロセスデータ(データ 1 , 3)を取り出して HCI送信バッファ 119に書き込み 、 HCI送信バッファ 119の内容をまとめてホストコンピュータ 115に送信する。また、メ インコントローラ (MC) 12' で生成されたステータスデータ等も送信される。  [0080] The HCI 113 selects only some of the preset types of process data from all the process data obtained from the processing device 10 by the main controller 12 'and transmits the data to the host computer 115. . That is, the HCI 113 takes out some preset types of process data (data 1 and 3) from the memory 118 in which all the process data generated by the main controller (MC) 12 ′ is temporarily stored. Are written in the HCI transmission buffer 119, and the contents of the HCI transmission buffer 119 are collectively transmitted to the host computer 115. The status data generated by the main controller (MC) 12 'is also sent.
[0081] RAP116は、メインコントローラ(MC) 12' にて処理装置 10から得た全てのプロセ スデータを無条件に AGC117に送信する。すなわち、 RAP116は、メインコントロー ラ(MC) \2' 内のプロセスデータ蓄積用メモリ 118に蓄積されたプロセスデータを先 頭力 順次読み出し、そのデータ構造のまま AGC117に転送する。ただし、データ の順番を並び換えたり、ごく一部のデータを排除する程度の操作をここで行ってもよ い。  [0081] The RAP 116 unconditionally transmits all the process data obtained from the processing apparatus 10 to the AGC 117 by the main controller (MC) 12 '. That is, the RAP 116 sequentially reads out the process data stored in the process data storage memory 118 in the main controller (MC) \ 2 ′, and transfers it to the AGC 117 without changing the data structure. However, operations that rearrange the data order or exclude only a small part of the data may be performed here.
[0082] ホストコンピュータ 115は、各処理装置 10のメインコントローラ(MC) 12' との間で の各種データをやりとりを通じて各処理装置 10のトラッキング処理を行うなど各処理 装置 10の全体的な動作制御を行う。  [0082] The host computer 115 controls the overall operation of each processing device 10, such as performing tracking processing of each processing device 10 by exchanging various data with the main controller (MC) 12 'of each processing device 10. I do.
[0083] AGC117は、各処理装置毎のレシピ (プロセス条件値)の集中管理やレシピに基 づく各処理装置 10のプロセスコントロールをはじめとして、各処理装置 10から得られ る全てのプロセスデータを対象に、その解析処理、統計処理、プロセスデータやその 解析 Z統計結果の集中モニタリング処理、さらには解析 Z統計結果をレシピに反映 させる処理等を行う。  [0083] AGC117 targets all process data obtained from each processing device 10, including centralized management of recipes (process condition values) for each processing device and process control of each processing device 10 based on the recipe. In addition, analysis processing, statistical processing, centralized monitoring processing of process data and analysis Z statistical results, and processing to reflect the analysis Z statistical results in the recipe are performed.
[0084] AGC117は AGCサーバ 117aと AGCクライアント 117bから構成されて!、る。  [0084] The AGC 117 is composed of an AGC server 117a and an AGC client 117b!
[0085] AGCサーバ 117aは、通信 iZF (インターフェース部) 121と、 EQM制御部 122と、 情報蓄積部 123とを有している。通信 IZF (インターフェース部) 121は、各処理装置 10のメインコントローラ(MC) 12' および AGCクライアント 117bとの間でデータ伝送 系 114を通じて各種テータを送受信する。 EQM制御部 122は、予め定義されたプロ セス条件と各処理装置 10から得られるプロセス情報に基づいて処理装置毎のプロセ スの各種パラメータ補正を行うとともに、受信したプロセス情報およびアラーム情報、 ならびに受信したパラメータの情報蓄積部 123への格納、および AGCクライアント 11 7bに転送すべきプロセスデータを情報蓄積部 123から検索する処理等を主に行う。 The AGC server 117 a includes a communication iZF (interface unit) 121, an EQM control unit 122, and an information storage unit 123. The communication IZF (interface unit) 121 transmits / receives various data to / from the main controller (MC) 12 ′ of each processing apparatus 10 and the AGC client 117b through the data transmission system 114. The EQM control unit 122 performs a process for each processing device based on the process conditions defined in advance and the process information obtained from each processing device 10. Processing to correct received parameters, store received process information and alarm information, and store received parameters in the information storage unit 123, and search the information storage unit 123 for process data to be transferred to the AGC client 117b Etc. mainly.
[0086] AGCクライアント 117bは、 AGCサーバ 117aより転送されてきたプロセスデータの 解析処理および統計処理を行うデータ解析部 125と、取り込んだプロセスデータや その解析結果等をクライアントユーザの利用 ·加工可能な形式のデータに変換する データ変換部 126と、変換データのモニタ(図示せず)への表示を制御する表示制 御部 127と、被処理体上の膜厚等の測定データを含むプロセスデータの解析結果に 基づ 、てレシピ (プロセス条件)を最適化するように更新するレシピ修正部 128と、情 報蓄積部 123から各処理装置 10から取得した各アラームに関連する情報を選択的 に取得するアラーム関連情報取得部 129とを有する。  [0086] The AGC client 117b can use and process the process data and the analysis result of the process data transferred from the AGC server 117a, and the captured user process data and the analysis results. Data conversion unit 126 that converts data into a format data, display control unit 127 that controls the display of converted data on a monitor (not shown), and process data including measurement data such as film thickness on the object to be processed Based on the analysis results, the recipe correction unit 128 that updates the recipe (process conditions) to be optimized and the information related to each alarm acquired from each processing device 10 from the information storage unit 123 are selectively acquired. And an alarm related information acquisition unit 129.
[0087] このような処理システム!/ において、各処理装置 10は、従前の実施形態と全く同 様の処理動作により被処理体であるウェハ Wに対する処理が行われる。この場合に 、各処理装置 10の処理動作が、ホストコンピュータ 115および AGC117よるプロセス コントロールの下、対応するブロックコントローラ(BC) 11/ およびメインコントローラ( Μθ 12' により制御されつつ実行される。  [0087] Such a processing system! In /, each processing apparatus 10 performs processing on the wafer W that is an object to be processed by the processing operation exactly the same as in the previous embodiment. In this case, the processing operation of each processing apparatus 10 is executed while being controlled by the corresponding block controller (BC) 11 / and main controller (Μθ 12 ′) under process control by the host computer 115 and AGC 117.
[0088] 個々のメインコントローラ(MC) 12' にて、ブロックコントローラ(BC) 11/ を介して 処理装置 10力も得たプロセスデータは、制御部 110を経てプロセスデータ蓄積用メ モリ 118に書き込まれる。プロセスデータ蓄積用メモリ 118に書き込まれたプロセスデ ータは、その外部転送に係る論理的なインターフェイス手段である HCI113と RAP1 16によって、 TCPZIP等のデータ伝送系 114の独立したチャンネルを通じてホストコ ンピュータ 115と AGC 117に転送される。  [0088] In each main controller (MC) 12 ', process data obtained by 10 processing devices via the block controller (BC) 11 / is written to the process data storage memory 118 via the control unit 110. . The process data written in the process data storage memory 118 is transferred to the host computer 115 via an independent channel of the data transmission system 114 such as TCPZIP by the HCI 113 and RAP1 16 which are logical interface means for the external transfer. Forwarded to AGC 117.
[0089] AGC117の AGCサーバ 117aは、各処理装置 10のメインコントローラ(MC) 12' の RAP116によって送信されたプロセス情報およびアラーム情報を受信し、これら情 報を情報蓄積部 123に蓄積するとともに、プロセス情報とレシピデータ力も各処理装 置 10のパラメータ補正値を生成してこれをメインコントローラ (MC) 12' に送信し、メ インコントローラ(MC) 12' の制御部 110からブロックコントローラ(BC) 11/ を経て 各処理装置 10の各構成部に制御信号を送信することによってプロセスコントロール を行う。 [0089] The AGC server 117a of the AGC 117 receives the process information and the alarm information transmitted by the RAP 116 of the main controller (MC) 12 'of each processing device 10, stores the information in the information storage unit 123, and The process information and recipe data power also generate parameter correction values for each processing device 10 and send them to the main controller (MC) 12 '. From the control unit 110 of the main controller (MC) 12', the block controller (BC) Process control by sending control signals to each component of each processing device 10 via 11 / I do.
[0090] また、八0じサーバ117&は、 AGCクライアント 117bからプロセステータ転送要求を 受けると、情報蓄積部 123から該当するプロセスデータを読み出し、通信 IZF121を 通じて AGCクライアント 117bに送信する。 AGCクライアント 117bに転送されたプロ セスデータは、データ変換部 126にてクライアントユーザの利用 '加工可能な形式の データに変換され、表示制御部 127によってモニタに表示される情報が制御され。さ らに、 AGCクライアント 117bに転送されたプロセスデータは、データ解析部 125にて 解析および統計処理され、その解析結果はデータ変換部 126にてプロセスデータと 同様にユーザ利用可能な形式のデータに変換され、モニタに表示される。これにより AGCクライアント 117b上での基板処理システム全体の一元管理が実現される。  Further, when receiving a process data transfer request from the AGC client 117b, the 80-day server 117 & reads out the corresponding process data from the information storage unit 123 and transmits it to the AGC client 117b through the communication IZF 121. The process data transferred to the AGC client 117b is converted into data that can be processed by the client user at the data converter 126, and the information displayed on the monitor is controlled by the display controller 127. In addition, the process data transferred to the AGC client 117b is analyzed and statistically processed by the data analysis unit 125, and the analysis result is converted to data in a user-usable format in the same way as the process data by the data conversion unit 126. Converted and displayed on the monitor. This realizes unified management of the entire substrate processing system on the AGC client 117b.
[0091] また、 AGCクライアント 117bのデータ解析部 125は、各処理装置の異常検出およ びアラーム発生とは別に、プロセスデータの解析結果力 処理装置の異常検出ゃ異 常予測を行い、異常を検出した場合および予測した場合は、その旨をモニタに出力 するとともに AGCサーバ 117aに通知する。この通知に従って AGCサーバ 117aは、 例えば、異常検出あるいは異常予測された処理装置 10を制御しているメインコント口 ーラ(MC) 12' に対して処理装置の停止を指示するなどの制御を行う。  [0091] In addition, the data analysis unit 125 of the AGC client 117b performs process data analysis result capability detection of abnormalities in the processing data separately from the detection of abnormalities in each processing device and the occurrence of an alarm, and performs abnormal prediction. When it is detected or predicted, the fact is output to the monitor and notified to the AGC server 117a. In accordance with this notification, the AGC server 117a performs control such as instructing the main controller (MC) 12 'that controls the processing apparatus 10 detected or predicted to be abnormal to stop the processing apparatus. .
[0092] さらに、 AGCクライアント 117bのレシピ修正部 128は、基板上の膜厚測定結果等 の測定データを含むプロセスデータに対する解析結果からレシピ (プロセス条件)を 最適化するための更新処理を行う。  Furthermore, the recipe correction unit 128 of the AGC client 117b performs an update process for optimizing the recipe (process condition) from the analysis result for the process data including the measurement data such as the film thickness measurement result on the substrate.
[0093] 各処理装置 10のアラームの情報を得ようとする場合には、選択されたアラームにつ いて、従前の実施形態と同様にして、アラーム関連情報取得部 129が情報蓄積部 1 23に記憶されているアラームテーブル力もそのアラームを選択し、それにリンクされ ている処理履歴の中のアラームに関連するシーケンシャルな詳細情報、さらには選 択されたアラームに関連した IZOアドレスデータやタイマー情報を選択的に取得し、 取得されたアラーム情報をモニターに表示することができる。  [0093] When the alarm information of each processing device 10 is to be obtained, the alarm related information acquisition unit 129 stores the selected alarm in the information storage unit 123 in the same manner as in the previous embodiment. The stored alarm table power also selects that alarm, selects sequential details related to the alarm in the processing history linked to it, and also selects IZO address data and timer information related to the selected alarm. The acquired alarm information can be displayed on the monitor.
[0094] このように、本実施形態においても、情報蓄積部 123に蓄積した処理履歴から、所 定のアラームのアラーム発生に至るまでのシーケンシャルな情報を I/Oアドレスデー タのレベルまで詳細に把握することができるので、アラーム発生原因箇所を容易に特 定することができ、アラーム発生原因箇所の異常を迅速に取り除くことができる。した がって、いずれかの処理装置 10に異常が発生した場合に、処理装置を短時間で復 帰させることができ、処理装置 10のダウンタイムを短くすることができる。 As described above, also in the present embodiment, the sequential information from the processing history accumulated in the information accumulation unit 123 to the occurrence of the alarm of a predetermined alarm is detailed to the level of I / O address data. Because it can be grasped, the cause of the alarm can be easily identified. Therefore, it is possible to quickly remove the abnormality at the location causing the alarm. Therefore, when an abnormality occurs in any of the processing apparatuses 10, the processing apparatus can be restored in a short time, and the downtime of the processing apparatus 10 can be shortened.
[0095] これに加えて、本実施形態では、ホストコンピュータ 115がダウンした場合に AGC1 17によるプロセスデータのスプーリング処理が行われる。すなわち、ホストコンビユー タ 115は、復旧後、ダウン期間のプロセスデータを AGC117から直ちに取り込むこと ができる。これにより、ホストコンピュータ 115による各処理装置 10のトラッキング処理 を復旧後直ちに再開することができる。  In addition to this, in the present embodiment, when the host computer 115 is down, the process data spooling processing by the AGC 117 is performed. That is, the host computer 115 can take in the process data of the down period from the AGC 117 immediately after the recovery. As a result, the tracking processing of each processing apparatus 10 by the host computer 115 can be resumed immediately after recovery.
[0096] また、本実施形態によれば、各処理装置 10から得られるウェハ検査装置 48、ゥェ ハ検出センサ 57、液処理ユニット温度計 59、液処理ユニット圧力計 60、液面センサ 82a, 82b、温度 ·濃度検出部 95に設置された温度計および濃度計等からの検出信 号に代表される全てあるいはほぼ全ての詳細なプロセスデータを AGC117に取り込 んで集中モニタリングすることができるので、各処理装置 10の異常検出およびアラー ム発生とは別に、各処理装置の状態の経時的な変化を早期に発見することができる 。これにより、多数の処理装置 10を含む処理システムの保守信頼性を高めることが可 能となる。また、本実施形態では、基板上の膜厚測定結果等の測定データを含む詳 細なプロセスデータに対する解析結果や統計結果力 レシピにおける各データをより 好ましい値に更新することによって、各処理装置 10の経時的な特性の変動をも考慮 した様々な観点力 最適なプロセス条件を自動的に得ることが可能となり、ウェハ W の液処理の信頼性の向上を図ることができる。  Further, according to the present embodiment, the wafer inspection device 48, wafer detection sensor 57, liquid processing unit thermometer 59, liquid processing unit pressure gauge 60, liquid level sensor 82a, 82b, temperature / concentration detector 95 All or almost all detailed process data represented by detection signals from thermometers and densitometers installed in 95 can be imported into AGC117 for centralized monitoring. Apart from detecting an abnormality in each processing device 10 and generating an alarm, it is possible to detect changes in the state of each processing device over time at an early stage. Thereby, it becomes possible to improve the maintenance reliability of the processing system including a large number of processing devices 10. Further, in this embodiment, each processing apparatus 10 is updated by updating the analysis results for the detailed process data including the measurement data such as the film thickness measurement results on the substrate and the data in the statistical result power recipe to more preferable values. Various viewpoints that take into account changes in characteristics over time It is possible to automatically obtain optimal process conditions, and to improve the reliability of liquid processing of wafers W.
[0097] また、このように各処理装置 10から得られるプロセスデータを AGC117に取り込ん で集中モニタリングすることにより、各処理装置の状態として掴むことのできる情報の 幅が広がり、処理装置異常や劣化状態、寿命を AGC117を設けない場合に比べて より詳細かつ早期に発見することが可能となる。  [0097] In addition, the process data obtained from each processing device 10 is taken into the AGC 117 and centrally monitored, thereby expanding the range of information that can be grasped as the status of each processing device, and processing device abnormalities and deterioration states. Therefore, it is possible to find out the life in more detail and earlier than when the AGC117 is not provided.
[0098] なお、本発明は上記実施形態に限定されることなく種々変形可能である。例えば、 上記実施形態では、処理装置としてウェハに対して液処理を施して洗浄する装置を 例にとって説明したが、これに限らず、他の処理装置に適用可能である。また、被処 理体もウェハに限るものではない。ただし、上記実施形態で示した処理装置のように 、被処理体に対して一連の複数の処理を施す装置の場合には、検出すべき情報の 種類が多ぐそれに応じてアラームの種類も膨大であるため、本発明が特に有効であ る。 Note that the present invention is not limited to the above-described embodiment, and can be variously modified. For example, in the above-described embodiment, the apparatus for cleaning the wafer by performing liquid processing has been described as an example of the processing apparatus. However, the present invention is not limited to this and can be applied to other processing apparatuses. Further, the object to be processed is not limited to a wafer. However, like the processing apparatus shown in the above embodiment, In the case of an apparatus that performs a series of processes on an object to be processed, the present invention is particularly effective because there are many types of information to be detected and the number of types of alarms is enormous.

Claims

請求の範囲 The scope of the claims
[1] 被処理体に所定の処理を施す処理装置と、  [1] a processing apparatus for performing a predetermined process on a workpiece;
前記処理装置内の状態を検出する複数の検出手段と、  A plurality of detection means for detecting a state in the processing apparatus;
前記複数の検出手段からの検出情報の異常を検出する異常検出部と、 前記異常検出部が異常を検出した際にアラームを発生するアラーム発生部と、 前記検出手段の検出情報、およびアラーム情報を前記処理装置の処理履歴として 蓄積する情報蓄積部と、  An abnormality detection unit that detects an abnormality in detection information from the plurality of detection units, an alarm generation unit that generates an alarm when the abnormality detection unit detects an abnormality, detection information of the detection unit, and alarm information An information storage unit that stores the processing history of the processing device;
発生したアラームの中から選択されたアラームに関連する情報を前記情報蓄積部 力 取得するアラーム関連情報取得部と、  An alarm-related information acquisition unit for acquiring information related to an alarm selected from among the generated alarms;
前記アラーム関連情報取得部が取得したアラームに関連する情報を表示する表示 部と  A display unit for displaying information related to the alarm acquired by the alarm related information acquisition unit;
を具備する処理システム。  A processing system comprising:
[2] 請求項 1に係る処理システムにおいて、前記アラーム関連情報は、前記アラームに 関連した iZoアドレス情報を含む、処理システム。  [2] The processing system according to claim 1, wherein the alarm related information includes iZo address information related to the alarm.
[3] 請求項 1に係る処理システムにお 、て、前記情報蓄積部は、アラームの種類に応じ てその概略情報を予め記憶しておき、前記アラーム関連情報取得部は、選択された アラームの概略情報を選択するとともに、その概略情報に対応して前記処理履歴とし て蓄積された情報力もそのアラームの発生に至るシーケンシャルな情報を選択する、 処理システム。  [3] In the processing system according to claim 1, the information storage unit stores in advance summary information according to the type of alarm, and the alarm related information acquisition unit stores the selected alarm. A processing system that selects summary information and also selects sequential information that corresponds to the summary information and the information power accumulated as the processing history leads to the occurrence of the alarm.
[4] 請求項 3に係る処理システムにお 、て、前記アラーム関連情報取得部は、前記情 報蓄積部の前記処理履歴として蓄積された情報から、前記アラームの発生に至るシ 一ケンシャルな情報に対応するアラーム発生前後の ΙΖΟ情報を選択する、処理シス テム。  [4] In the processing system according to claim 3, the alarm-related information acquisition unit includes sequential information from the information stored as the processing history of the information storage unit to the occurrence of the alarm. A processing system that selects information before and after the occurrence of an alarm corresponding to.
[5] 請求項 4に係る処理システムにお 、て、前記表示部は、前記選択されたアラームの 概略情報を表示する第 1の画面、アラームの発生に至るシーケンシャルな情報を表 示する第 2の画面、アラーム発生前後の ΙΖΟ情報を表示する第 3の画面を表示可能 である、処理システム。  [5] In the processing system according to claim 4, the display unit displays a first screen that displays summary information of the selected alarm, and a second screen that displays sequential information leading to the occurrence of the alarm. A processing system that can display a 3rd screen that displays 画面 information before and after the occurrence of an alarm.
[6] 請求項 3に係る処理システムにおいて、前記各アラームに応じて前記情報蓄積部 に記憶された概略情報は、アラームの ID、アラームの内容、可能性のある 1または 2 以上のアラームの発生理由、各発生理由に対応する対策を含む、処理システム。 [6] In the processing system according to claim 3, the information storage unit according to the alarms. The summary information stored in the processing system includes the ID of the alarm, the contents of the alarm, the reason for the occurrence of one or more possible alarms, and the countermeasures for each reason.
[7] 被処理体に所定の処理を施す処理装置と、 [7] a processing apparatus for performing a predetermined process on the workpiece;
前記処理装置内の状態を検出する複数の検出手段と、  A plurality of detection means for detecting a state in the processing apparatus;
前記複数の検出手段からの検出情報の異常を検出する異常検出部と、 前記異常検出部が異常を検出した際にアラームを発生するアラーム発生部と、 前記検出手段の検出情報、およびアラーム情報を前記処理装置の処理履歴として 蓄積し、かつ各アラームに応じた概略情報を記載するとともに前記処理履歴とリンク 可能なアラームテーブルを予め記憶する情報蓄積部と、  An abnormality detection unit that detects an abnormality in detection information from the plurality of detection units, an alarm generation unit that generates an alarm when the abnormality detection unit detects an abnormality, detection information of the detection unit, and alarm information An information storage unit that stores information as a processing history of the processing device and stores summary information corresponding to each alarm and stores an alarm table that can be linked to the processing history in advance;
発生したアラームの中から選択されたアラームの概略情報を前記情報蓄積部のァ ラームテーブル力 選択し、前記情報蓄積部に前記処理履歴として蓄積された情報 力 その選択されたアラームの発生に至るシーケンシャルな情報をリンク情報として 取得するアラーム関連情報取得部と、  Select the alarm table power of the information storage unit from the alarm information selected from the generated alarms, and the information power stored as the processing history in the information storage unit Sequential to the occurrence of the selected alarm Alarm-related information acquisition unit that acquires various information as link information,
前記アラーム関連情報取得部が取得したアラーム関連情報を表示する表示部と を具備する処理システム。  And a display unit for displaying the alarm related information acquired by the alarm related information acquiring unit.
[8] 請求項 7に係る処理システムにお 、て、前記アラーム関連情報取得部は、前記ァラ ームの発生に至るシーケンシャルな情報に対応するアラーム発生前後の IZO情報 を取得する、処理システム。 [8] The processing system according to claim 7, wherein the alarm related information acquisition unit acquires IZO information before and after the occurrence of an alarm corresponding to sequential information leading to the occurrence of the alarm. .
[9] 請求項 8に係る処理システムにお 、て、前記表示部は、前記選択されたアラームの 概略情報を表示する第 1の画面、アラームの発生に至るシーケンシャルな情報を表 示する第 2の画面、アラーム発生前後の ΙΖΟ情報を表示する第 3の画面を表示可能 である、処理システム。 [9] In the processing system according to claim 8, the display unit displays a first screen that displays summary information of the selected alarm, and a second screen that displays sequential information leading to the occurrence of the alarm. A processing system that can display a 3rd screen that displays 画面 information before and after the occurrence of an alarm.
[10] 請求項 7に係る処理システムにおいて、前記各アラームに応じて前記情報蓄積部 に記憶された概略情報は、アラームの ID、アラームの内容、可能性のある 1または 2 以上のアラームの発生理由、各発生理由に対応する対策を含む、処理システム。  [10] In the processing system according to claim 7, the summary information stored in the information storage unit in response to each alarm includes an alarm ID, an alarm content, and the occurrence of one or more possible alarms. A processing system that includes reasons and countermeasures for each occurrence.
[11] 被処理体に所定の処理を施す複数の処理装置と、  [11] a plurality of processing devices for performing predetermined processing on the workpiece;
前記各処理装置において検出される情報に基づいて前記複数の処理装置を制御 し、前記各処理装置において前記検出される情報が所定の範囲から外れた場合に 異常を検出し、前記異常検出部が異常を検出した際にアラームを発生する装置制御 部と、 When the plurality of processing devices are controlled based on information detected in each processing device, and the information detected in each processing device is out of a predetermined range A device control unit that detects an abnormality and generates an alarm when the abnormality detection unit detects the abnormality;
前記各装置制御部力も全てのまたはほぼ全てのプロセス情報を受信し、そのプロ セス情報に基づいて前記各処理装置を制御する制御装置と  Each device control unit also receives all or almost all process information, and controls each processing device based on the process information.
を有し、 Have
前記制御装置は、  The control device includes:
前記各装置制御部から受信したプロセス情報およびアラーム情報を前記各処理装 置の処理履歴として蓄積する情報蓄積部と、  An information storage unit for storing process information and alarm information received from each device control unit as a processing history of each processing device;
発生したアラームの中から選択されたアラームに関連する情報を前記情報蓄積部 から選択的に取得するアラーム関連情報取得部と、  An alarm-related information acquisition unit that selectively acquires information related to the alarm selected from the generated alarms from the information storage unit;
前記アラーム関連情報取得部が取得したアラームに関連する情報を表示する表示 部と  A display unit for displaying information related to the alarm acquired by the alarm related information acquisition unit;
を具備する処理システム。 A processing system comprising:
被処理体に所定の処理を施す複数の処理装置と、  A plurality of processing devices for performing predetermined processing on the object to be processed;
前記各処理装置において検出される情報に基づいて前記複数の処理装置を制御 し、前記各処理装置において前記検出される情報が所定の範囲から外れた場合に 異常を検出し、前記異常検出部が異常を検出した際にアラームを発生する装置制御 部と、  The plurality of processing devices are controlled based on information detected in each processing device, an abnormality is detected when the detected information is out of a predetermined range in each processing device, and the abnormality detecting unit A device controller that generates an alarm when an abnormality is detected;
前記各装置制御部力も全てのまたはほぼ全てのプロセス情報を受信し、そのプロ セス情報に基づいて前記各処理装置を制御する制御装置と  Each device control unit also receives all or almost all process information, and controls each processing device based on the process information.
を有し、 Have
前記制御装置は、  The control device includes:
前記各装置制御部から受信したプロセス情報およびアラーム情報を前記各処理装 置の処理履歴として蓄積し、かつ各アラームに応じた概略情報を記載するとともに前 記処理履歴とリンク可能なアラームテーブルを予め記憶する情報蓄積部と、 発生したアラームの中から選択されたアラームの概略情報を前記情報蓄積部のァ ラームテーブル力 選択し、前記情報蓄積部に前記処理履歴として蓄積された情報 からその選択されたアラームの発生に至るシーケンシャルな情報をリンク情報として 取得するアラーム関連情報取得部と、 The process information and alarm information received from each device control unit is accumulated as the processing history of each processing device, and outline information corresponding to each alarm is described and an alarm table that can be linked to the processing history is stored in advance. The information storage unit to be stored and the alarm table power of the information storage unit selected from the alarm information selected from the generated alarms are selected, and the selected information is selected from the information stored as the processing history in the information storage unit. Sequential information leading to the occurrence of an alarm as link information An alarm related information acquisition unit to be acquired;
前記アラーム関連情報取得部が取得したアラームに関連する情報を表示する表示 部と  A display unit for displaying information related to the alarm acquired by the alarm related information acquisition unit;
を具備する処理システム。  A processing system comprising:
[13] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積し、発生したアラームの中から選択された アラームに関連する情報を前記情報蓄積部から取得し、取得されたアラームに関連 する情報を表示する処理方法。  [13] Processing history of detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on an object to be processed, and information of an alarm that is generated when an abnormality of detection information from the plurality of detection means is detected The information storage unit stores the information related to the alarm selected from the generated alarms from the information storage unit, and displays the information related to the acquired alarm.
[14] 請求項 13に係る処理方法において、前記アラーム関連情報は、前記アラームに関 連した IZOアドレス情報を含む、処理方法。  14. The processing method according to claim 13, wherein the alarm related information includes IZO address information related to the alarm.
[15] 請求項 13に係る処理方法において、前記情報蓄積部は、アラームの種類に応じて その概略情報を予め記憶しておき、発生したアラームの中から選択されたアラームの 概略情報を選択するとともに、その概略情報に対応して前記処理履歴として蓄積さ れた情報力もそのアラームの発生に至るシーケンシャルな情報を選択する、処理方 法。  [15] In the processing method according to claim 13, the information storage unit stores in advance summary information in accordance with the type of alarm, and selects the summary information of the selected alarm from among the generated alarms. In addition, a processing method that selects sequential information that leads to the occurrence of the alarm for the information power accumulated as the processing history corresponding to the summary information.
[16] 請求項 15に係る処理方法において、前記アラーム関連情報の取得は、前記情報 蓄積部の前記処理履歴として蓄積された情報から、前記アラームの発生に至るシー ケンシャルな情報に対応するアラーム発生前後の ΙΖΟ情報を選択することにより行 われる、処理方法。  [16] In the processing method according to claim 15, the acquisition of the alarm related information may be performed by generating an alarm corresponding to sequential information from the information accumulated as the processing history of the information accumulation unit to the occurrence of the alarm. A processing method that is performed by selecting the previous and next trap information.
[17] 請求項 16に係る処理方法において、前記アラーム関連情報の表示は、前記選択 されたアラームの概略情報を表示する第 1の画面、アラームの発生に至るシーケンシ ャルな情報を表示する第 2の画面、アラーム発生前後の ΙΖΟ情報を表示する第 3の 画面のいずれかで行われる、処理方法。  [17] In the processing method according to claim 16, the alarm-related information is displayed on a first screen that displays the summary information of the selected alarm, and on the first screen that displays sequential information leading to the occurrence of the alarm. The processing method that is performed on either the second screen or the third screen that displays the information before and after the occurrence of the alarm.
[18] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積し、かつ各アラームに応じた概略情報を記 載するとともに前記処理履歴とリンク可能なアラームテーブルを情報蓄積部に予め記 憶し、発生したアラームの中から選択されたアラームの概略情報を前記情報蓄積部 のアラームテーブル力 選択し、前記情報蓄積部に前記処理履歴として蓄積された 情報力 その選択されたアラームの発生に至るシーケンシャルな情報をリンク情報と して取得し、前記アラームテーブル力 選択された情報および取得されたアラーム発 生に至るシーケンシャルな情報を表示する処理方法。 [18] Processing history of detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on an object to be processed and information of an alarm that is generated when abnormality of detection information from the plurality of detection means is detected In the information storage unit, an outline table corresponding to each alarm is recorded, and an alarm table that can be linked to the processing history is stored in the information storage unit in advance. Select the alarm table power of the information storage unit to select the summary information of the alarm selected from the alarms generated and the information power stored as the processing history in the information storage unit to generate the selected alarm A processing method for acquiring sequential information as link information, and displaying the information selected for the alarm table and the sequential information for the acquired alarm occurrence.
[19] 請求項 18に係る処理方法において、前記アラーム関連情報の取得は、前記アラー ムの発生に至るシーケンシャルな情報に対応するアラーム発生前後の IZO情報を 取得することにより行われる、処理方法。  [19] The processing method according to claim 18, wherein the acquisition of the alarm related information is performed by acquiring IZO information before and after the occurrence of an alarm corresponding to sequential information leading to the occurrence of the alarm.
[20] 請求項 19に係る処理方法において、前記表示は、前記選択されたアラームの概略 情報を表示する第 1の画面、アラームの発生に至るシーケンシャルな情報を表示する 第 2の画面、アラーム発生前後の ΙΖΟ情報を表示する第 3の画面の 、ずれかで行わ れる、処理方法。  [20] In the processing method according to claim 19, the display includes a first screen that displays summary information of the selected alarm, a second screen that displays sequential information leading to the occurrence of the alarm, and an alarm occurrence. A processing method that is performed at the offset of the third screen that displays the previous and next haze information.
[21] 請求項 15に係る処理方法において、前記各アラームに応じて前記情報蓄積部に 記憶された概略情報は、アラームの ID、アラームの内容、可能性のある 1または 2以 上のアラームの発生理由、各発生理由に対応する対策を含む、処理方法。  [21] In the processing method according to claim 15, the summary information stored in the information storage unit in response to each of the alarms includes an alarm ID, an alarm content, and one or more possible alarms. A processing method that includes the reasons for occurrence and countermeasures corresponding to each reason.
[22] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積させ、発生したアラームの中から選択され たアラームに関連する情報を前記情報蓄積部力 取得し、取得されたアラームに関 連する情報を表示するようにコンピュータに制御させるソフトウェアを含むコンビユー タ読取可能な記録媒体。  [22] Process information including detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on the object to be processed, and information of an alarm that is generated when an abnormality is detected in the detection information from the plurality of detection means Software that stores information in the information storage unit, acquires information related to the alarm selected from the alarms that occurred, and controls the computer to display the information related to the acquired alarm. Computer-readable recording media including
[23] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積させ、かつ各アラームに応じた概略情報を 記載するとともに前記処理履歴とリンク可能なアラームテーブルを情報蓄積部に予め 記憶させ、発生したアラームの中から選択されたアラームの概略情報を前記情報蓄 積部のアラームテーブルから選択し、前記情報蓄積部に前記処理履歴として蓄積さ れた情報力 その選択されたアラームの発生に至るシーケンシャルな情報をリンク情 報として取得し、前記アラームテーブル力 選択された情報および取得されたアラー ム発生に至るシーケンシャルな情報を表示するようにコンピュータに制御させるソフト ウェアを含むコンピュータ読取可能な記録媒体。 [23] Process information including detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on a target object, and information of an alarm that is generated when an abnormality in detection information from the plurality of detection means is detected The information storage unit stores the summary information corresponding to each alarm, and the alarm table that can be linked to the processing history is stored in advance in the information storage unit. Information is selected from the alarm table of the information storage unit, and the information power stored as the processing history in the information storage unit is linked to the sequential information that leads to the occurrence of the selected alarm. A computer-readable recording medium including software that is acquired as information and causes the computer to display the information selected as the alarm table power and the sequential information that results in the occurrence of the acquired alarm.
[24] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積させ、発生したアラームの中から選択され たアラームに関連する情報を前記情報蓄積部力 取得し、取得されたアラームに関 連する情報を表示するようにコンピュータに制御させるソフトウェアを含むコンビユー タプログラム。  [24] Processing history of detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on a target object, and information of an alarm that is generated when an abnormality of detection information from the plurality of detection means is detected Software that stores information in the information storage unit, acquires information related to the alarm selected from the alarms that occurred, and controls the computer to display the information related to the acquired alarm. Computer program including
[25] 被処理体に所定の処理を施す処理装置に設けられた複数の検出手段の検出情報 、および複数の検出手段からの検出情報の異常を検出した際に発生するアラームの 情報を処理履歴として情報蓄積部に蓄積させ、かつ各アラームに応じた概略情報を 記載するとともに前記処理履歴とリンク可能なアラームテーブルを情報蓄積部に予め 記憶させ、発生したアラームの中から選択されたアラームの概略情報を前記情報蓄 積部のアラームテーブルから選択し、前記情報蓄積部に前記処理履歴として蓄積さ れた情報力 その選択されたアラームの発生に至るシーケンシャルな情報をリンク情 報として取得し、前記アラームテーブル力 選択された情報および取得されたアラー ム発生に至るシーケンシャルな情報を表示するようにコンピュータに制御させるソフト ウェアを含むコンピュータプログラム。  [25] Process information including detection information of a plurality of detection means provided in a processing apparatus that performs a predetermined process on the object to be processed, and information of an alarm that is generated when an abnormality is detected in the detection information from the plurality of detection means The information storage unit stores the summary information corresponding to each alarm, and the alarm table that can be linked to the processing history is stored in advance in the information storage unit. Information is selected from the alarm table of the information storage unit, information power stored as the processing history in the information storage unit is acquired as sequential information that leads to the occurrence of the selected alarm, and the information Alarm table force Controls the computer to display the selected information and the sequential information leading to the acquired alarm occurrence A computer program that contains the software to.
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