WO2006013772A1 - フレキシブルプリント基板 - Google Patents
フレキシブルプリント基板 Download PDFInfo
- Publication number
- WO2006013772A1 WO2006013772A1 PCT/JP2005/013824 JP2005013824W WO2006013772A1 WO 2006013772 A1 WO2006013772 A1 WO 2006013772A1 JP 2005013824 W JP2005013824 W JP 2005013824W WO 2006013772 A1 WO2006013772 A1 WO 2006013772A1
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- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- signal
- flexible printed
- circuit board
- pad
- Prior art date
Links
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 23
- 230000005540 biological transmission Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Definitions
- the present invention relates to a flexible printed circuit board used for signal transmission in electronic equipment such as computer terminals and AV equipment.
- USB Universal benal Bus
- IEEE Institute of Electrical and Electric Engineers 1394
- PC Personal Computer
- a substrate in which wiring is arranged on both sides is usually used.
- a double-sided board has a signal wiring pattern on the front and a ground wiring pattern on the back.
- the design of transmission lines including signal wiring and ground wiring is performed in consideration of signal reflection and crosstalk noise.
- a double-sided board has the advantage of being easy to realize low impedance and good high-frequency characteristics.
- double-sided substrates have the problem of high cost.
- Patent Document 1 proposes a technique for adjusting the characteristic impedance of a transmission line using an inexpensive single-sided substrate.
- Patent Document 1 proposes a technique for suppressing signal reflection and crosstalk noise that occurs when a plurality of connectors are mounted on a flexible substrate. If multiple connectors are simply mounted on one side, the mounting area increases by the number of connectors as shown in Fig. 8, which increases costs. Also, As shown in Fig. 9, if the mounting area is simply reduced without considering the terminal arrangement and multiple connectors are mounted on the double-sided board, problems such as signal reflection and crosstalk occur, resulting in high-speed signal transmission. It becomes difficult.
- the present invention solves the above-described conventional problems, and allows a plurality of connectors to be mounted using an inexpensive single-sided board and suppresses signal reflection and crosstalk.
- An object of the present invention is to provide a flexible printed board having
- Patent Document 1 Japanese Unexamined Patent Publication No. 2000-357846
- the present invention 1 provides a flexible printed board having the following characteristics.
- a main body of a flexible printed circuit board having a first surface and a second surface facing each other, and an overlapping portion that is overlapped so that the first surface becomes an outer surface by folding at least a part thereof;
- a plurality of wires arranged substantially parallel to each other on the first surface of the body
- Each wiring to which the first pad is connected and each wiring to which the second pad is connected are alternately arranged on the first surface.
- the wiring is formed only on the first surface, the area of the substrate can be reduced, and the cost of the substrate can be reduced.
- the knots for connecting the connectors are formed on the front and back of the overlapping portion, that is, on both sides, a plurality of connectors can be connected.
- the overlapping portion for forming the pad can be formed not only at the end of the flexible printed circuit board but also in the middle, and may be formed at a plurality of locations.
- Invention 2 of the present application is the invention 1, wherein the wiring includes a signal wiring and a ground wiring.
- a flexible printed circuit board is provided in which two signal wirings and two ground wirings are alternately arranged.
- Invention 3 of the present application provides the flexible printed board according to Invention 2, wherein the distance between the adjacent signal wirings is longer than the distance between the adjacent signal wirings and the ground wiring.
- Invention 4 of the present application provides the flexible printed circuit board according to Invention 1, wherein a wiring pattern constituted by repeating the wiring pattern unit having three wiring forces is formed on the first surface. To do.
- each wiring pattern unit is formed by a ground wiring and two signal wirings arranged so as to sandwich the ground wiring.
- ground terminal on the other surface is located between the signal terminal and the signal terminal in the overlapping portion of the substrate body, crosstalk of the signal terminal can be reduced.
- the invention 5 of the present application is the first signal wiring and the second signal wiring in which the two signal wirings included in the wiring pattern unit in the invention 4 are inverted in phase of each other.
- the first signal wiring and the second signal wiring are arranged symmetrically with respect to the ground wiring.
- ground wiring is arranged between the positive phase and the negative phase of the differential wiring, the influence of crosstalk between the positive phase and the negative phase signals of the differential signal can be reduced.
- the present invention 6 is the invention 4, wherein the distance between each wiring pattern unit constituting the wiring pattern is longer than the distance between the signal wiring and the ground wiring in each wiring pattern unit.
- V Provide flexible printed circuit boards.
- a flexible printed circuit board on which a plurality of connectors can be mounted is inexpensive. Can be provided.
- FIG. 1 is a configuration diagram of a flexible printed circuit board according to a first embodiment of the present invention (a) a plan view (b) a developed plan view (c) a side view as viewed from the direction A in FIG. ) Side view as seen from direction B in Fig. (A) (e) Cross section of the overlapping part of Fig. (A)
- FIG. 2 is a configuration diagram of a flexible printed circuit board according to a second embodiment of the present invention (a) a plan view (b) a developed plan view (c) a sectional view of an overlapping portion of FIG.
- FIG. 3 is a configuration diagram of a flexible printed circuit board according to a third embodiment of the present invention (a) a plan view (b) a developed plan view (c) a sectional view of an overlapping portion of FIG.
- FIG. 4 Configuration of flexible printed circuit board in another form (a) Plan view (b) Expanded plan view (c) Cross-sectional view of overlapping part of Fig. (A)
- FIG. 5 Configuration of flexible printed circuit board in another form (a) Plan view (b) Exploded plan view (c) Cross-sectional view of overlapping part of Fig. (A)
- FIG. 6 Configuration of flexible printed circuit board according to another embodiment
- b) Flexible print as seen from side A in (a) Side view of the board
- FIG. 7 is an explanatory diagram showing an application example of the configuration shown in FIG.
- FIG. 1 is a configuration diagram of a flexible printed circuit board according to a first embodiment of the present invention.
- FIG. 1 (a) is a plan view of the flexible printed circuit board according to the present embodiment.
- the flexible printed circuit board has a main body 100, a wiring 101 and a surface pad 103.
- This frame The kibble substrate has two overlapping substrates at the overlapping portion 105, and has a back surface pad 104 (see FIGS. 1C and 1D) on the opposite side of the overlapping portion 105 in the drawing.
- FIG. 1 (b) is a plan view of the flexible printed circuit board when the overlapping portion 105 is developed.
- the overlapping portion 105 is developed on the front surface side 105a and the back surface side 105b.
- the back surface pad 104 is formed on the back surface side of the overlapping portion 105.
- Fig. 1 (c) is a side view of the flexible printed circuit board, which also shows the A-direction force in Fig. 1 (a).
- Fig. 1 (d) is a side view of the flexible printed circuit board, which also shows the B direction force in Fig. 1 (a).
- FIG. 1 (e) is a cross-sectional view of the overlapping portion 105 in FIG. 1 (a).
- the sheet-like main body 100 has a front surface 100a and a back surface 100b facing each other, and can be bent. One end of the main body 100 is bent at a fold line 102 in FIG. 1 (b) so that the surface 100a is outside.
- the back surfaces 100b of the folded main body 100 are joined with a heat-resistant adhesive or the like.
- the folded portion forms an overlapping portion 105 in which the main body 100 overlaps twice.
- the plurality of wirings 101 are arranged substantially parallel to each other on the surface of the main body 100.
- the wiring 101 is a conductor wiring for transmitting a signal.
- the number of wirings 101 is not limited to the 12 shown in the figure.
- the wiring 101 is roughly divided into a wiring 101a connected to the front surface pad 103 and a wiring 101b connected to the back surface pad 104.
- the wiring 101a and the wiring 101b are alternately arranged on the surface 100a of the main body 100. This is because the pads on the other surface are arranged behind the pads on one surface of the overlapping portion 105, as will be described later.
- the width of the wiring 101b is formed narrower than other portions. This is to maintain the distance between the wiring 101b and the surface pad 103 in the overlapping portion 105 and to moderate crosstalk.
- the impedance of each wiring is stabilized.
- the main body 100 is formed with a front surface pad 103 and a back surface pad 104 for connector connection.
- the front surface pad 103 and the back surface pad 104 are connected to one end of the wiring 101 and are formed wider than the wiring 101.
- the surface pad 103 is formed on the surface side 105a of the overlapping portion.
- the surface pad 103 is connected to the wiring 101a on the surface 100a of the main body 100.
- the back surface pad 104 is formed on the back surface side 105b of the overlapping portion.
- the back surface pad 104 is connected to the wiring 101b that also has the surface side force of the overlap portion 105 around the back surface side by the back surface side 105b of the overlap portion.
- the node on the other surface is located behind the pad between the one surface of the overlapping portion 105. Therefore, the distance between the nodes can be secured on each of the front surface side 105a and the back surface side 105b of the overlapping portion. Further, it is possible to secure a distance between the pad on the front surface side 105a and the pad on the back surface side 105b of the overlapping portion. For this reason, it is easy to reduce crosstalk between pads. In addition, the spacing between the pads is set to be the same on both the front and back sides, which is suitable for mounting the connector immediately.
- one overlapping portion 105 is formed and two connectors are mounted on both surfaces thereof, but a plurality of overlapping portions 105 may be formed. Three or more connectors can be mounted.
- the connector mounted on this flexible printed circuit board may be a separate connector for the front and back, or a connector integrated for use on the front and back.
- the wiring 101 is formed only on one side of the main body 100, the area of the flexible printed board can be reduced, and the cost can be reduced.
- the pads 103 and 104 for connecting the connectors are formed on the front and back of the overlapping portion 105, that is, on both surfaces of the substrate, a plurality of connectors can be connected to the substrate. In other words, it is possible to realize a flexible printed circuit board that is compatible with a plurality of connectors and that can easily control impedance and is low in cost.
- FIG. 2 shows a configuration diagram of the flexible printed circuit board according to the second embodiment of the present invention.
- FIG. 2 (a) is a plan view of the flexible printed circuit board according to the present embodiment.
- the flexible printed circuit board has a main body 100, a wiring 101 and a surface pad 103.
- the substrate is doubled at the overlap portion 105, and the back surface pad 104 (see FIGS. 2 (b) and (c)) is provided on the opposite side of the overlap portion 105 in the drawing.
- FIG. 2 (b) is a plan view of the flexible printed circuit board when the overlapping portion 105 is expanded.
- the overlapping portion 105 is developed on the front surface side 105a and the back surface side 105b.
- FIG. 10C is a cross-sectional view at the overlapping portion 105 in FIG.
- the sheet-like main body 100 has a front surface 100a and a back surface 100b facing each other, and can be bent. One end of the main body 100 is bent at a fold line 102 in FIG. 2 (b) so that the surface 100a is on the outer side.
- the back surfaces 100b of the folded main body 100 are joined with a heat-resistant adhesive or the like.
- the folded portion forms an overlapping portion 105 in which the main body 100 overlaps twice.
- the plurality of wirings 101 are arranged substantially parallel to each other on the surface of the main body 100.
- the wiring 101 is a conductor wiring for transmitting a signal.
- the number of wirings 101 is not limited to the 12 shown in the figure.
- the wiring 101 is roughly divided into a wiring 101a connected to the front surface pad 103 and a wiring 101b connected to the back surface pad 104.
- the wiring 101a and the wiring 101b are alternately arranged on the surface 100a of the main body 100. This is because the pads on the other surface are arranged behind the pads on one surface of the overlapping portion 105, as will be described later.
- the width of the wiring 101b is formed narrower than other portions. This is because the distance between the wiring 101b and the surface pad 103 in the overlapping portion 105 is kept as large as possible, and signal reflection and crosstalk are alleviated.
- the wiring 101 can also be divided into a signal wiring S and a ground wiring G. Two signal lines S and two line lines G are alternately arranged. In this way, the signal pads and the ground pads are alternately arranged on the front side 105a and the back side 105b of the overlapping portion. Thus, the influence of crosstalk between signal pads can be reduced.
- the impedance of the line and node can be determined, and the desired impedance can be designed by adjusting the material, line width, and line thickness.
- the pad connected to the signal wiring S is called a signal pad
- the pad connected to the ground wiring G is called a ground pad.
- the distance between adjacent signal lines S be as large as possible. This is to prevent crosstalk between signal wires and signal reflection. Since the area of the main body 100 is limited, it is actually preferable to set the distance between the adjacent signal wirings S to be larger than the distance between the adjacent signal wirings S and the ground wiring G.
- the main body 100 is formed with a front surface pad 103 and a back surface pad 104 for connector connection.
- the front surface pad 103 and the back surface pad 104 are connected to one end of the wiring 101 and are formed wider than the wiring 101.
- the surface pad 103 is formed on the surface side 105a of the overlapping portion.
- the surface pad 103 is connected to the wiring 101a on the surface 100a of the main body 100.
- the back surface pad 104 is formed on the back surface side 105b of the overlapping portion.
- the back surface pad 104 is connected to the wiring 101b that also has the surface side force of the overlap portion 105 around the back surface side by the back surface side 105b of the overlap portion.
- the knobs on the other surface are arranged behind the pads on one surface of the overlapping portion 105. Therefore, it is easy to secure the distance between the pads on each of the front surface side 105a and the back surface side 105b of the overlapping portion. Further, it is easy to secure a distance between the pad on the front surface side 105a and the pad on the back surface side 105b. Therefore, it is easy to reduce crosstalk between pads. In addition, if the spacing between the pads is set to be the same on both the front and back surfaces, it is preferable for mounting the connector.
- the front surface pad 103 and the back surface pad 104 can be divided into a signal pad and a ground pad. As shown in FIG. 2 (c), signal pads and ground pads are alternately arranged on each of the front surface side 105a and the back surface side 105b of the overlapping portion. For this reason, reflection and crosstalk between signal pads can be reduced.
- the impedance of the track and pad is fixed, and the desired impedance can be designed by adjusting the material, line width, and line thickness. It is to be noted that, as in the first embodiment, a plurality of overlapping portions 105 can be formed and three or more connectors can be mounted. Further, the connectors mounted on the flexible printed circuit board may be separate on the front and back sides, or may be partially or integrally formed, as in the first embodiment.
- the wiring 101 is formed only on one side of the main body 100, the area of the flexible printed board can be reduced, and the cost can be reduced.
- the pads 103 and 104 for connecting the connectors are formed on the front and back of the overlapping portion 105, that is, on both surfaces of the substrate, a plurality of connectors can be connected to the substrate. Further, by alternately arranging two signal wirings S and two ground wirings G, signal pads and ground pads are alternately arranged on each of the front surface side 105a and the back surface side 105b of the overlapping portion. It is possible to reduce reflection and crosstalk between signal pads.
- the impedance of the line and pad is determined, and the desired impedance can be designed by adjusting the material, line width, and line thickness. Further, by making the distance between the signal lines S larger than the distance between the signal lines S and the ground lines G, reflection and crosstalk between the signal lines S can be reduced. That is, it is possible to realize a low-cost flexible printed circuit board that supports a plurality of connectors and is suitable for high-speed transmission.
- FIG. 3 shows a configuration diagram of a flexible printed circuit board according to the third embodiment of the present invention.
- FIG. 3A is a plan view of the flexible printed circuit board according to the present embodiment.
- the flexible printed circuit board has a main body 100, a wiring 101 and a surface pad 103.
- the overlapped portion 105 has a double overlapped substrate, and the backside pad 104 (see FIGS. 3B and 3C) is provided on the opposite side of the overlapped portion 105 in the drawing.
- FIG. 3B is a plan view of the flexible printed circuit board when the overlapping portion 105 is developed.
- the overlapping part 105 is developed on the front side 105a and the back side 105b.
- FIG. 3 (c) is a cross-sectional view at the overlapping portion 105 in FIG. 3 (a).
- the sheet-like main body 100 has a front surface 100a and a back surface 100b facing each other, and can be bent. One end of the main body 100 is bent at a fold line 102 in FIG. 3 (b) so that the surface 100a faces outward.
- the back surfaces 100b of the folded main body 100 are joined with a heat-resistant adhesive or the like.
- the folded portion forms an overlapping portion 105 in which the main body 100 overlaps twice.
- the plurality of wirings 101 are arranged substantially parallel to each other on the surface of the main body 100.
- the wiring 101 is a conductor wiring for transmitting a signal.
- the number of wirings 101 is not limited to the 12 shown in the figure.
- the wiring 101 is roughly divided into a wiring 101a connected to the front surface pad 103 and a wiring 101b connected to the back surface pad 104.
- the wiring 101a and the wiring 101b are alternately arranged on the surface 100a of the main body 100. As will be described later, this is because the pads on the other surface are positioned behind the pads on one surface of the overlapping portion 105.
- the width of the wiring 101b is formed narrower than other portions. This is because the distance between the wiring 101b and the surface pad 103 in the overlapping portion 105 is kept as large as possible and crosstalk is alleviated.
- the wiring 101 can also be divided into a signal wiring S and a ground wiring G.
- a wiring pattern constituted by repeating wiring pattern units such as three wiring patterns is formed on the surface 100 a of the main body 100.
- Each wiring pattern unit is formed by ground wiring G and two signal wirings arranged so as to sandwich the ground wiring! Speak.
- the impedance of the line and node is determined, and the desired impedance can be designed by adjusting the material, line width, and line thickness.
- the two signal wirings included in the wiring pattern unit are the signal wiring + S and the signal wiring S in which the phases of the signals are inverted.
- the ground wiring G between the positive and negative phases of the differential wiring + S and 1 S, the effects of crosstalk between the positive and negative signals of the differential signal can be effectively mitigated. Therefore, pseudo differential transmission such as HDMI and DVI Thus, the signal waveform is less deteriorated.
- signal wiring + S and the signal wiring S in which the phases of the signals are inverted.
- the + S and the signal wiring S are arranged symmetrically with respect to the ground wiring G, it is more suitable for alleviating the crosstalk of the differential signal and controlling the impedance.
- the signal wirings + S and -S are adjacent to each other. It is preferable that the distance between adjacent signal lines + S, —S be as large as possible. Since the area of the main body 100 is limited, the distance between the adjacent signal lines + S, — S is actually larger than the distance between the adjacent signal lines + S, — S and the ground line G. It is good to make it. In other words, the distance between each wiring pattern unit is preferably larger than the distance between the signal wiring + S, — S and the ground wiring G in each wiring pattern unit. It is possible to reduce reflection and crosstalk in the normal-phase and reverse-phase signal wirings of adjacent differential signals.
- the main body 100 is formed with a front surface pad 103 and a back surface pad 104 for connector connection.
- the front surface pad 103 and the back surface pad 104 are connected to one end of the wiring 101 and are formed wider than the wiring 101.
- the surface pad 103 is formed on the surface side 105a of the overlapping portion.
- the surface pad 103 is connected to the wiring 101a on the surface 100a of the main body 100.
- the back surface pad 104 is formed on the back surface side 105b of the overlapping portion.
- the back surface pad 104 is connected to the wiring 101b that also has the surface side force of the overlap portion 105 around the back surface side by the back surface side 105b of the overlap portion.
- the knobs on the other surface are arranged behind the pads on one surface of the overlapping portion 105. Therefore, the distance between the front surface pads, the distance between the back surface pads, and the distance between the front surface pad and the back surface pad are secured, and crosstalk between the pads is easily reduced. In addition, if the pad spacing is set to be the same on both the front and back surfaces, it is preferable for mounting the connector.
- the front surface pad 103 and the back surface pad 104 can be divided into a signal pad and a ground pad. As shown in FIG. 3 (c), the ground pad on the other side is arranged behind the signal pad on one side of the overlapping portion 105. Therefore, crosstalk between signal pads that transmit differential signals can be reduced.
- a plurality of overlapping portions 105 can be formed to mount three or more connectors. This is the same as in the first embodiment. Further, the connectors mounted on the flexible printed circuit board may be separate on the front and back sides, or may be partially or integrally formed, as in the first embodiment.
- the wiring 101 is formed only on one side of the main body 100, the area of the flexible printed board can be reduced, and the cost can be reduced.
- the pads 103 and 104 for connecting the connectors are formed on the front and back of the overlapping portion 105, that is, on both surfaces of the substrate, a plurality of connectors can be connected to the substrate.
- crosstalk between the signal wires + S, —S can be reduced. If the distance between the signal lines + S, —S is larger than the distance between the signal lines + S, —S and the ground line G, the crosstalk between the signal lines S can be further reduced.
- the ground pad on the other surface side is positioned behind the adjacent signal pads on one surface, so that crosstalk between the signal pads can be reduced.
- the impedance of the line and the pad is determined, and the impedance can be designed to a desired value by adjusting the material, the line width, and the line thickness.
- a low-cost flexible printed circuit board that supports a plurality of connectors and is suitable for high-speed transmission can be realized.
- FIG. 4 shows another configuration example of a low-cost flexible printed circuit board that can mount multiple connectors and alleviate crosstalk.
- FIG. 4 (a) is a plan view of the flexible printed circuit board according to the present embodiment.
- the flexible printed circuit board has a main body 100, a wiring 101 and a surface pad 103.
- This flexible printed circuit board has two overlapping layers at the overlapping portion 105, and has a back surface pad 104 (see FIGS. 4 (b) and (c)) on the opposite side of the overlapping portion 105 in the drawing.
- FIG. 4 (b) is a plan view of the flexible printed circuit board when the overlapping portion 105 is developed.
- the overlapping part 105 is developed on the front side 105a and the back side 105b.
- FIG. 4C is a cross-sectional view of the overlapping portion 105 in FIG.
- the wiring 101 is connected to the wiring 101 a connected to the front surface pad 103 and the wiring connected to the back surface pad 104. Two lines 101b are alternately arranged.
- the wiring 101 can also be divided into a signal wiring S and a ground wiring G.
- the signal wiring S and the ground wiring G are arranged alternately.
- the signal wiring S and the ground wiring G form a pair, and a wiring pattern is formed by repeating the pair.
- the signal wiring S and the ground wiring G that make a pair are both connected to the front surface pad 103 or are both connected to the rear surface pad 104.
- the distance between paired signal wiring S and ground wiring G is set to be shorter than the distance between different pairs.
- the signal pads and the ground pads are alternately arranged on both the front surface side 105a and the back surface side 105b of the overlapping portion. Further, the signal pad and the ground pad on the other surface are located on the back side between the pair of the signal pad and the ground pad on one surface. Thereby, the influence of the cross stroke between signal pads can be suppressed.
- the impedance of the line and node is determined, and the desired impedance can be designed by adjusting the material, line width, and line thickness.
- FIG. 5 shows another configuration example of a low-cost flexible printed circuit board on which a plurality of connectors can be mounted and crosstalk is reduced.
- FIG. 5A is a plan view of the flexible printed circuit board according to the present embodiment.
- the flexible printed circuit board has a main body 100, a wiring 101 and a surface pad 103.
- This flexible printed circuit board has two overlapping substrates at the overlapping portion 105, and has a back surface pad 104 (see FIGS. 5 (b) and 5 (c)) on the opposite side of the overlapping portion 105 in the drawing.
- FIG. 5B is a plan view of the flexible printed circuit board when the overlapping portion 105 is expanded.
- the overlapping portion 105 is developed on the front surface side 105a and the back surface side 105b.
- FIG. 4C is a cross-sectional view of the overlapping portion 105 in FIG.
- the wiring 101 is alternately arranged with three wirings 101a connected to the front surface pad 103 and three wirings 101b connected to the back surface pad 104. These three wirings 101 are a wiring pattern unit.
- the wiring 101 can be divided into a signal wiring S and a ground wiring G.
- One wiring pattern unit is formed by arranging the signal wirings + S, —S and the ground wiring G having the phases opposite to each other in the order of + S, ⁇ S, G.
- the signal wiring S and the ground wiring G constitute a pair, and a wiring pattern is formed by repeating the pair.
- Differential signal wiring + S, — Connection between S It is preferable to place the differential signal wiring + S, — S wiring close to each other in order to increase the accuracy.
- either the positive or negative phase of the differential signal may be arranged in the order of -S, + S, and G.
- the impedance of the line and pad is determined, and the desired impedance can be designed by adjusting the material, line width, and line thickness.
- the differential signal pads and the ground pads are alternately arranged on both the front surface side 105a and the back surface side 105b of the overlapping portion.
- the group of differential signal pads and ground pads on the other surface is located on the back side between the groups of differential signal pads and ground pads on one surface. This makes it possible to eliminate the effects of crosstalk between differential signals, and reduces signal waveform degradation for differential transmission such as USB and IEEE1394.
- FIG. 6 shows a configuration example of a flexible printed board in which pads are formed in the middle of the wiring 101.
- FIG. 6 (a) is a plan view when the flexible printed circuit board according to the present embodiment is developed.
- Fig. 6 (b) is a side view of the flexible printed circuit board as seen from the A side force in Fig. 6 (a).
- Fig. 6 (c) is a side view of the flexible printed circuit board as seen from the B side in Fig. 6 (a).
- FIG. 6 (d) is a perspective view of the flexible printed circuit board in which one force is also seen.
- FIG. 6 (e) is a perspective view of the flexible printed circuit board seen from another direction.
- an overlapping portion 105 is formed in the middle of the wiring 101.
- a surface pad 103 is inserted in the middle of the wiring 101a and connected in series with the wiring 101a.
- the surface pad 103 is formed on one surface of the overlapping portion 105, that is, on the surface 10 Oa of the main body 100.
- a back surface pad 104 is inserted and connected in series with the wiring 101b.
- the back pad 104 is formed on one surface of the overlapping portion 105, that is, on the surface 100 a of the main body 100.
- the front surface pad 103 and the rear surface pad 104 are formed on the surfaces opposite to each other in the overlapping portion 105.
- FIG. 7 shows a configuration in which a plurality of the nodes 103, 104 and the overlapping portion 105 are formed in the middle of the long substrate body 100.
- the flexible printed circuit board according to the present invention can be applied as a transmission medium for an interface having a plurality of ports in a high-speed interface in which signal reflection and crosstalk are problematic.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006531423A JPWO2006013772A1 (ja) | 2004-08-02 | 2005-07-28 | フレキシブルプリント基板 |
US11/659,131 US20090008131A1 (en) | 2004-08-02 | 2005-07-28 | Flexible printed-circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004225067 | 2004-08-02 | ||
JP2004-225067 | 2004-08-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006013772A1 true WO2006013772A1 (ja) | 2006-02-09 |
Family
ID=35787060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/013824 WO2006013772A1 (ja) | 2004-08-02 | 2005-07-28 | フレキシブルプリント基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090008131A1 (ja) |
JP (1) | JPWO2006013772A1 (ja) |
CN (1) | CN100574556C (ja) |
WO (1) | WO2006013772A1 (ja) |
Cited By (5)
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JP2008067062A (ja) * | 2006-09-07 | 2008-03-21 | Canon Inc | 固体撮像装置及び撮像システム |
CN100416581C (zh) * | 2006-04-13 | 2008-09-03 | 华为技术有限公司 | Fanout设计中自动调整线宽的方法及装置 |
JP2008300681A (ja) * | 2007-05-31 | 2008-12-11 | Nitto Denko Corp | プリント配線基板 |
JP2009063691A (ja) * | 2007-09-05 | 2009-03-26 | Seiko Epson Corp | 配線基板及び該配線基板を備える電気光学装置、並びに電子機器 |
CN113840455A (zh) * | 2021-11-29 | 2021-12-24 | 鹏元晟高科技股份有限公司 | 印刷电路板和qsfp-dd高速线缆组件 |
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TWI272598B (en) * | 2005-08-19 | 2007-02-01 | Lite On It Corp | Optical reading apparatus |
JP5284308B2 (ja) * | 2010-04-19 | 2013-09-11 | 日本メクトロン株式会社 | フレキシブル回路基板及びその製造方法 |
JP5966875B2 (ja) * | 2012-11-16 | 2016-08-10 | 富士通株式会社 | コネクタ及びフレキシブルプリント基板 |
KR101416159B1 (ko) * | 2013-09-06 | 2014-07-14 | 주식회사 기가레인 | 접촉 패드를 구비하는 인쇄회로기판 |
KR102263056B1 (ko) * | 2014-11-19 | 2021-06-09 | 삼성디스플레이 주식회사 | 인쇄 회로 기판 및 이를 포함하는 표시 장치 |
KR102367317B1 (ko) * | 2015-03-23 | 2022-02-25 | 삼성디스플레이 주식회사 | 인쇄회로기판 어셈블리 |
US10687422B2 (en) | 2016-12-16 | 2020-06-16 | Google Llc | Dual-sided FPC assembly and related systems and methods for hotbar soldering FPC assemblies |
KR102147336B1 (ko) * | 2018-01-23 | 2020-08-24 | 동우 화인켐 주식회사 | 필름 안테나-회로 연결 구조체 및 이를 포함하는 디스플레이 장치 |
WO2023108284A1 (en) * | 2021-12-17 | 2023-06-22 | Exro Technologies Inc. | Article for power inverter and power inverter |
CN114615797B (zh) * | 2022-05-11 | 2022-07-29 | 成都英思嘉半导体技术有限公司 | 一种多通道高速柔板 |
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US6994563B2 (en) * | 2003-12-19 | 2006-02-07 | Lenovo (Singapore) Pte. Ltd. | Signal channel configuration providing increased capacitance at a card edge connection |
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- 2005-07-28 US US11/659,131 patent/US20090008131A1/en not_active Abandoned
- 2005-07-28 WO PCT/JP2005/013824 patent/WO2006013772A1/ja active Application Filing
- 2005-07-28 JP JP2006531423A patent/JPWO2006013772A1/ja not_active Withdrawn
- 2005-07-28 CN CNB2005800216486A patent/CN100574556C/zh not_active Expired - Fee Related
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JPH0231492A (ja) * | 1988-07-21 | 1990-02-01 | Mitsubishi Electric Corp | フレキシブルプリント基板 |
JPH0715106A (ja) * | 1993-06-29 | 1995-01-17 | Toshiba Corp | プリント基板 |
JPH0837351A (ja) * | 1994-07-21 | 1996-02-06 | Amp Japan Ltd | フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板 |
JP2001007458A (ja) * | 1999-06-18 | 2001-01-12 | Matsushita Electric Ind Co Ltd | 差動平衡信号伝送基板 |
JP2005123520A (ja) * | 2003-10-20 | 2005-05-12 | Nec Corp | プリント配線板 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100416581C (zh) * | 2006-04-13 | 2008-09-03 | 华为技术有限公司 | Fanout设计中自动调整线宽的方法及装置 |
JP2008067062A (ja) * | 2006-09-07 | 2008-03-21 | Canon Inc | 固体撮像装置及び撮像システム |
JP2008300681A (ja) * | 2007-05-31 | 2008-12-11 | Nitto Denko Corp | プリント配線基板 |
JP2009063691A (ja) * | 2007-09-05 | 2009-03-26 | Seiko Epson Corp | 配線基板及び該配線基板を備える電気光学装置、並びに電子機器 |
CN113840455A (zh) * | 2021-11-29 | 2021-12-24 | 鹏元晟高科技股份有限公司 | 印刷电路板和qsfp-dd高速线缆组件 |
Also Published As
Publication number | Publication date |
---|---|
CN1977573A (zh) | 2007-06-06 |
JPWO2006013772A1 (ja) | 2008-05-01 |
CN100574556C (zh) | 2009-12-23 |
US20090008131A1 (en) | 2009-01-08 |
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