WO2006009144A1 - Connecteur conducteur anisotropique et procédé pour la fabrication de celui-ci, dispositif adaptateur et dispositif d’inspection électrique pour dispositif à circuit - Google Patents

Connecteur conducteur anisotropique et procédé pour la fabrication de celui-ci, dispositif adaptateur et dispositif d’inspection électrique pour dispositif à circuit Download PDF

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Publication number
WO2006009144A1
WO2006009144A1 PCT/JP2005/013252 JP2005013252W WO2006009144A1 WO 2006009144 A1 WO2006009144 A1 WO 2006009144A1 JP 2005013252 W JP2005013252 W JP 2005013252W WO 2006009144 A1 WO2006009144 A1 WO 2006009144A1
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WO
WIPO (PCT)
Prior art keywords
conductive
anisotropic conductive
path forming
layer
conductive path
Prior art date
Application number
PCT/JP2005/013252
Other languages
English (en)
Japanese (ja)
Inventor
Kiyoshi Kimura
Fujio Hara
Original Assignee
Jsr Corporation
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Filing date
Publication date
Application filed by Jsr Corporation filed Critical Jsr Corporation
Publication of WO2006009144A1 publication Critical patent/WO2006009144A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the present invention relates to an anisotropic conductive connector that can be suitably used for electrical inspection of a circuit device such as a printed circuit board, a method for manufacturing the same, an adapter device including the anisotropic conductive connector, and an The present invention relates to an electrical inspection device for a circuit device including an adapter device.
  • a circuit board for constituting or mounting an integrated circuit device or other electronic components is not suitable before assembling the electronic components or before mounting the electronic components.
  • an inspection electrode device in which a plurality of inspection electrodes are arranged according to the grid point positions arranged in the vertical and horizontal directions, and the inspection electrode of this inspection electrode device are inspection targets.
  • a method of using a combination with an adapter for electrically connecting an electrode to be inspected on a circuit board is known.
  • the adapter used is a printed wiring board called a pitch conversion board.
  • This adapter has a plurality of connection electrodes arranged on one side according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected, and has the same pitch as the inspection electrodes of the inspection electrode device on the other side. Having a plurality of terminal electrodes arranged at the grid point positions of the current supply connection electrodes and voltage measurement connection electrodes arranged according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected on one side
  • the former has a plurality of connection electrode pairs made of electrodes, and has a plurality of terminal electrodes arranged on the other surface at lattice point positions having the same pitch as the inspection electrodes of the inspection electrode device.
  • This adapter is used for, for example, an open / short test of each circuit on a circuit board, and the latter adapter is used for an electric resistance measurement test of each circuit on the circuit board. Therefore, in the electrical inspection of the circuit board, in general, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, the circuit board to be inspected and the adapter are An anisotropic conductive elastomer sheet is interposed.
  • This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or there are a number of pressure-conducting conductive portions that exhibit conductivity only in the thickness direction when pressed. It has something.
  • Such anisotropically conductive elastomer sheets are conventionally known in various structures, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer ( For example, refer to Patent Document 1.) By disperse the conductive magnetic metal particles unevenly in the elastomer, many conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other are formed. (For example, see Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, see Patent Document 3).
  • the arrangement pitch of the electrodes to be inspected in the circuit board to be inspected that is, adjacent to each other.
  • the distance between the centers of the electrodes to be inspected becomes smaller, it becomes difficult to align and hold and fix the anisotropic conductive elastomer sheet.
  • Such an anisotropic conductive connector 1 is manufactured as follows, for example.
  • a mold having a configuration as shown in FIG. 24 is prepared.
  • a ferromagnetic part 82 is arranged on a substrate 81 in accordance with the same pattern as, for example, an electrode to be inspected on a circuit board to be inspected, and a non-magnetic part is formed on a part other than the ferromagnetic part 82.
  • Ferromagnetic material is formed on one template 80 (hereinafter referred to as “upper die”) in which the body part 83 is disposed, and on the substrate 86 according to the pattern of the electrode to be inspected and the palm of the circuit board to be inspected.
  • the other mold plate hereinafter referred to as “lower mold”) 85 in which the non-magnetic part 88 is arranged in a part other than the ferromagnetic part 87. .
  • a frame plate 90 having an opening 91 is disposed in the mold, and an anisotropic conductive elastomer material layer 95A is formed so as to close the opening 91 of the frame plate 90.
  • the anisotropic conductive elastomer material layer 95A is formed by containing conductive particles P exhibiting magnetism in a liquid polymer material forming material that is cured to become an elastic high molecular material.
  • a pair of electromagnets (not shown) are arranged on the upper surface of the upper die 80 and the lower surface of the lower die 85, and by operating the electromagnet, the lower die 85 corresponding to the lower die 85 from the ferromagnetic portion 82 of the upper die 80 is operated.
  • a parallel magnetic field is applied to the ferromagnet part 87 in the direction of the force.
  • the ferromagnetic part 82 of the upper mold 80 and the ferromagnetic part 87 of the lower mold 85 acts as a magnetic pole, the ferromagnetic part 82 of the upper mold 80 and the ferromagnetic part 87 of the lower mold 85 are used.
  • a magnetic field with a greater strength than the other areas acts on the area between the two.
  • the conductive particles P dispersed in the anisotropic conductive elastomer material layer 95A are dispersed in the upper 80 ferromagnetic material.
  • the portion located between the body portion 82 and the ferromagnetic portion 87 of the lower mold 85 is moved by force to gather in the portion, and further oriented in the thickness direction.
  • the anisotropic conductive elastomer material layer 95A is hardened by heating, for example, so that a large number of layers extending in the thickness direction containing the conductive particles P as shown in FIG.
  • An anisotropic conductive connector is manufactured in which an anisotropic conductive elastomer sheet 95 composed of the conductive path forming portion 96 and an insulating portion 97 that insulates the conductive path forming portion 96 from each other is supported by the frame plate 90.
  • the anisotropic conductive connector has the following problems.
  • circuit board for configuring or mounting an electronic component one in which electrodes are arranged in a frame shape along, for example, four sides of a rectangle is known.
  • the anisotropic path having the anisotropic conductive elastomer sheet 95 in which the conductive path forming portion 96 is arranged in a frame shape along the four sides of the rectangle It is necessary to use conductive connectors.
  • the anisotropic conductive elastomer sheet 95 since the central portion surrounded by the conductive path forming portion 96 is all the insulating portion 97, the anisotropic conductive elastomer sheet 95 is different in forming the anisotropic conductive elastomer sheet 95.
  • the conductive particles present in the central part of the material layer 95A for the conductive elastomer the moving distance is extremely long. It is difficult. Therefore, the obtained conductive path forming part 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remain in the insulating part 97. A conductive elastomer sheet cannot be reliably formed.
  • the number of electrodes increases with the increase in functionality and capacity, and the arrangement pitch of electrodes, that is, the distance force between the centers of adjacent electrodes, increases the density. Tend to be further promoted. Therefore, when an electrical inspection is performed on a circuit board for configuring or mounting such an integrated circuit device, the pitch of the conductive path forming portion is determined. It is necessary to use anisotropically conductive connectors with small ridges and high density. Thus, in manufacturing such an anisotropic conductive connector, it is natural that it is necessary to use the upper die 80 and the lower die 85 in which the ferromagnetic parts 82 and 87 are arranged at an extremely small pitch. It is.
  • the magnetic field also acts in the direction toward the ferromagnetic part 87 b adjacent to 87a (indicated by the arrow Y). Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive particles P are located between the ferromagnetic portion 82a of the upper die 80 and the corresponding ferromagnetic portion 87a of the lower die 85.
  • the conductive particles P also gather in the portion located between the ferromagnetic portion 82a of the upper die 80 and the ferromagnetic portion 87b of the lower die 85, and the conductive property P It becomes difficult to sufficiently orient the particles P in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, an anisotropic conductive connector having the desired conductive path forming portion and insulating portion cannot be obtained. .
  • Patent Document 1 Japanese Patent Application Laid-Open No. 51-93393
  • Patent Document 2 Japanese Patent Laid-Open No. 53-147772
  • Patent Document 3 Japanese Patent Application Laid-Open No. 61-250906
  • Patent Document 4 JP-A-11-40224
  • the present invention has been made based on the above circumstances, and its first object is to Regardless of the arrangement pattern of the electrodes to be connected, the required electrical connection can be reliably achieved for each of the electrodes, and the electrodes to be connected are arranged with a small pitch and a high density.
  • An anisotropic conductive connector that can reliably achieve a required electrical connection to each of the electrodes even when the electrode is manufactured, and can be manufactured at low cost, and a method for manufacturing the same are provided. There is.
  • the second object of the present invention is to reliably achieve the required electrical connection for the circuit device regardless of the arrangement pattern of the electrode to be inspected of the circuit device to be inspected. Even when the pitch is very small and densely arranged, the adapter device can reliably achieve the required electrical connection for the circuit device and can be manufactured at low cost. Is to provide.
  • the third object of the present invention is to ensure that the required electrical inspection can be performed on the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, and the circuit to be inspected. Even when the electrodes to be inspected of the device are arranged with a small pitch and a high density, the electrical inspection of the circuit device can reliably perform the required electrical inspection of the circuit device. To provide an apparatus.
  • the method for manufacturing an anisotropically conductive connector according to the present invention includes a frame plate having one or more openings formed therein, and one or two or more frame plates arranged so as to close the openings of the frame plates and supported by the frame plates.
  • the elastic anisotropic conductive film has a thickness that is contained in a state where the conductive particles exhibiting magnetism arranged in the opening of the frame plate are aligned in the thickness direction.
  • a method of manufacturing an anisotropic conductive connector comprising a plurality of conductive path forming portions extending in the direction and an insulating portion formed around the conductive path forming portion, the elastic support supported on a releasable support plate
  • a plurality of conductive paths are formed on the releasable support plate by laser processing a conductive elastomer layer in which magnetic conductive particles dispersed in a polymer material are aligned in the thickness direction.
  • Forming part Insulating portion material made of a liquid polymer material forming material that is cured to become an elastic polymer material, which is formed so as to block the opening of the frame plate in each of the conductive path forming portions formed on the releasable support plate It is characterized by having a step of forming an insulating part by infiltrating into the layer and curing the insulating part material layer in this state.
  • the laser processing is preferably performed by a carbon dioxide laser.
  • a metal mask is formed on the surface of the conductive elastomer layer according to the pattern of the conductive path forming portion to be formed, and then the conductive conductive layer is formed. It is preferable to form a plurality of conductive path forming parts by laser processing one layer of the elastomer.
  • a metal mask by subjecting the surface of one layer of conductive elastomer to a plating treatment.
  • a thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and the resist layer in the thin metal layer is formed. Opening force It is preferable to form a metal mask by subjecting the surface of the exposed part to a plating treatment.
  • a conductive elastomer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic high molecular weight material. It is preferable to form a single conductive elastomer layer by applying a magnetic field to the single material layer in the thickness direction and curing the conductive elastomer single material layer.
  • An anisotropic conductive connector according to the present invention is obtained by the manufacturing method described above.
  • the adapter device of the present invention includes an adapter main body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;
  • the anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter body and formed according to a pattern corresponding to the connection electrode in the adapter body.
  • the adapter device of the present invention has two connections for current supply and voltage measurement, respectively, according to the pattern corresponding to the electrode to be inspected in the circuit device to be inspected on the surface.
  • An adapter body having a connection electrode region in which a plurality of connection electrode pairs made of connection electrodes are formed;
  • the anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter body and formed according to a pattern corresponding to the connection electrode in the adapter body.
  • An electrical inspection device for a circuit device according to the present invention comprises the adapter device described above.
  • a conductive path forming portion is formed by laser processing one layer of conductive elastomer, so that a conductive path having the desired conductivity is formed.
  • the part can be obtained reliably.
  • the conductive path forming portion is infiltrated into the elastomer material layer, and the elastomer material layer is cured to insulate. Since the portion is formed, an insulating portion having no conductive particles can be obtained with certainty.
  • the required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected.
  • the required electrical connection can be reliably achieved for each of the electrodes, and the force can be reduced at a low cost. Can be manufactured.
  • the adapter device of the present invention since the anisotropic conductive connector is provided, regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, the circuit device is connected.
  • the required electrical connection can be reliably achieved, and the required electrical connection can be achieved for the circuit device even when the electrodes to be inspected are arranged with a small pitch and a high density. It can be reliably achieved, and the force can be manufactured at a low cost.
  • the above-described adapter device is provided. Therefore, regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, the required electrical inspection can be reliably performed on the circuit device, and the electrodes to be inspected of the circuit device can be Even if they are small and densely arranged, the required electrical inspection can be reliably performed on the circuit device.
  • FIG. 1 is an explanatory cross-sectional view showing the configuration of an example of an anisotropic conductive connector according to the present invention.
  • FIG. 2 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the anisotropic conductive connector shown in FIG.
  • FIG. 3 is an explanatory cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.
  • FIG. 4 is an explanatory sectional view showing an enlarged conductive elastomer material layer.
  • FIG. 5 is an explanatory sectional view showing a state in which a magnetic field is applied to the material layer for conductive elastomer in the thickness direction.
  • FIG. 6 is an explanatory cross-sectional view showing a state in which a conductive elastomer layer is formed on a releasable support plate.
  • FIG. 7 is an explanatory cross-sectional view showing a state in which a thin metal layer is formed on one conductive elastomer layer.
  • FIG. 8 is an explanatory sectional view showing a state in which a resist layer having an opening is formed on a thin metal layer.
  • FIG. 9 is an explanatory sectional view showing a state in which a metal mask is formed in the opening of the resist layer.
  • FIG. 10 is an explanatory cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on a releasable support.
  • FIG. 11 is an explanatory cross-sectional view showing a state in which a frame plate is disposed on a releasable support and an insulating material layer is formed.
  • FIG. 12 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a releasable support plate on which an insulating material layer is formed. 13] A sectional view for explanation showing a state in which an integral insulating portion is formed around the conductive path forming portion.
  • FIG. 14 is a cross-sectional view illustrating the configuration of the adapter device according to the first example of the present invention.
  • FIG. 15 is an explanatory sectional view showing the configuration of the adapter main body in the adapter device shown in FIG.
  • FIG. 16 is a cross-sectional view illustrating the configuration of the adapter device according to the second example of the present invention.
  • FIG. 17 is a cross-sectional view illustrating the configuration of the adapter body in the adapter device shown in FIG.
  • FIG. 18 is an explanatory diagram showing a configuration of the first example of the electrical inspection device for a circuit device according to the present invention.
  • FIG. 19 is an explanatory diagram showing a configuration in a second example of the electrical inspection device for a circuit device according to the present invention.
  • FIG. 20 is an explanatory view showing a state in which a conductive path forming portion is formed by removing only a peripheral portion of a conductive elastomer forming layer in the conductive elastomer layer.
  • FIG. 21 is an explanatory cross-sectional view showing a state in which a conductive path forming portion is formed by removing only a peripheral portion of a conductive elastomer forming layer in the conductive elastomer layer.
  • FIG. 22 is an explanatory view showing a configuration in another example of the anisotropic conductive connector according to the present invention.
  • FIG. 23 is an explanatory view showing a configuration of still another example of the anisotropically conductive connector according to the present invention.
  • FIG. 24 is a cross-sectional view for explaining the structure of a mold for forming an anisotropic conductive steel laster sheet in a conventional method for manufacturing an anisotropic conductive connector.
  • FIG. 25 is an explanatory cross-sectional view showing a state in which a frame plate is arranged in the mold shown in FIG. 22 and an anisotropic conductive elastomer material layer is formed.
  • FIG. 26 is an explanatory sectional view showing a state in which a conventional anisotropic conductive connector is manufactured.
  • the conventional anisotropic conductive connector manufacturing method is It is sectional drawing for description which shows the direction of the magnetic field which acts on the material layer for explanation, explanation of numerals
  • FIG. 1 is a diagram for explaining the structure of an example of the anisotropic conductive connector according to the present invention.
  • FIG. 2 is an explanatory cross-sectional view showing an enlarged main part of the anisotropic conductive connector shown in FIG.
  • This anisotropic conductive connector 10 is arranged so as to close each of the opening 11 of the frame plate 11 and the frame plate 11 formed with a plurality of openings 12, and is supported by the frame plate 11 And an elastic anisotropic conductive film 15.
  • a plurality of conductive path forming portions 16 extending in the thickness direction are arranged so as to be located in the openings 12 of the frame plate 11 according to a specific pattern, and each of the conductive path forming portions 16 is surrounded by In this case, a single insulating portion 17 that insulates the adjacent conductive path forming portions 16 from each other is formed in a state of being integrally bonded to the conductive path forming portion 16! Speak.
  • the specific pattern of the conductive path forming portion 16 is a pattern corresponding to the pattern of the electrode to be connected, for example, the electrode to be inspected of the circuit device to be inspected.
  • the conductive path forming portion 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction.
  • the insulating portion 17 does not contain any conductive particles P and is made of an elastic polymer material.
  • a protruding portion is formed in which the conductive path forming portion 16 protrudes the surface force of the insulating portion 17.
  • the degree of compression by pressurization is much larger than that of the insulating portion 17 to the conductive path forming portion 16, and thus the resistance value is sufficiently low! ⁇
  • the conductive path is reliably formed in the conductive path forming portion 16, whereby the change in the resistance value can be reduced with respect to the change or fluctuation of the applied pressure.
  • the conductive path is acted on the elastic anisotropic conductive film 15. Even if the applied pressure is not uniform, it is possible to prevent variation in conductivity between the conductive path forming portions 16.
  • the frame plate 11 As a material constituting the frame plate 11, various non-metallic materials and metallic materials having high mechanical strength can be used.
  • non-metallic materials include liquid crystal polymers, polyimide resins, polyester resins, polyaramide resins, polyamide resins, and other resin materials, glass fiber reinforced epoxy resins, glass fiber reinforced polyester resins, Examples thereof include a fiber reinforced resin material such as a glass fiber reinforced polyimide resin, and a composite resin material containing an inorganic material such as alumina or boron nitride as a filler in an epoxy resin.
  • Metal materials include gold, silver, copper, iron, nickel, cobalt, or alloys thereof Alloy steel.
  • the anisotropic conductive connector 10 in a high temperature environment, as a frame plate 11, more preferably it is preferred instrument linear thermal expansion coefficient used the following 3 X 10- 5 ⁇ 1 X 10- 6 ⁇ 2 ⁇ 10- 5 ⁇ , particularly preferably 1 X 10- 6 ⁇ 6 ⁇ 10- 6 ⁇ .
  • a frame plate 11 By using such a frame plate 11, it is possible to suppress misalignment due to thermal expansion of the elastic anisotropic conductive film 15.
  • the thickness of the frame plate 11 is preferably 10 to 200 m, more preferably 15 to L00 m. If this thickness is too small, the frame plate 11 may not have the required strength. On the other hand, if this thickness is excessive, the thickness of the anisotropic anisotropic conductive film 15 is inevitably increased, and therefore, good conductivity may not be obtained.
  • the elastic polymer material constituting the conductive path forming portion 16 and the elastic polymer material constituting the insulating portion 17 are the same type even if they are different types. It may be.
  • a polymer material having a crosslinked structure is preferable.
  • Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene. Conjugated rubbers such as rubber, styrene-butadiene copolymer rubber, acrylonitrile butadiene copolymer rubber and their hydrogenated products, block copolymers such as styrene butadiene gen block copolymer rubber, styrene isoprene block copolymer, etc.
  • the silicone rubber is preferably one obtained by crosslinking or condensing liquid silicone rubber.
  • the liquid silicone rubber preferably has a viscosity of 10 5 ec or less at a strain rate of 10-ec, and may be any of a condensation type, an addition type, a bur group or a hydroxyl group-containing one. Also good.
  • dimethyl silicone raw rubber, methyl beer silicone raw Mention may be made of rubber and methyl rubber silicone raw rubber.
  • the silicone rubber preferably has a molecular weight Mw (standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000.
  • Mw standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter
  • Mn standard polystyrene equivalent weight average molecular weight
  • the molecular weight distribution index is preferably 2 or less.
  • conductive particles exhibiting magnetism are used because the particles can be easily aligned in the thickness direction by a method described later.
  • conductive particles include particles of magnetic metals such as iron, cobalt and nickel, particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles.
  • the core particles are made of metal particles with good conductivity such as gold, silver, palladium, rhodium, etc., or inorganic particles such as non-magnetic metal particles or glass beads, or polymer particles.
  • the surface of the core particles may be plated with a conductive magnetic metal such as nickel or cobalt.
  • a nickel particle as a core particle and a surface with a gold mesh having good conductivity.
  • the means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, an electrochemical plating method, an electrolytic plating method, a sputtering method, a vapor deposition method or the like is used.
  • the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained.
  • the ratio of the covering area of the conductive metal to the surface area of the core particles is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
  • the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4%. ⁇ 20% by mass.
  • the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and still more preferably 3-15% by mass.
  • the particle size of the conductive particles P is preferably 1 to: LOO / zm, more preferably 2 to 50 ⁇ m, still more preferably 3 to 30 ⁇ m, and particularly preferably 4-20 ⁇ m.
  • the particle size distribution (DwZDn) of the conductive particles P is preferably 1 to: LO, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ⁇ 4.
  • the obtained conductive path forming part 16 can be easily deformed under pressure, and the conductive path forming part 16 has sufficient space between the conductive particles. Electrical contact can be obtained.
  • the shape of the conductive particles P is not particularly limited, but is spherical, star-shaped or aggregated in that they can be easily dispersed in the polymer material-forming material. Preferred to be secondary particles.
  • the conductive particles P those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used.
  • a coupling agent such as a silane coupling agent or a lubricant
  • the durability of the anisotropically conductive connector is improved.
  • such conductive particles P are contained in the conductive path forming part 16 at a volume fraction of 15 to 45%, preferably 20 to 40%. If this ratio is too small, the conductive path forming portion 16 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming portion 16 becomes fragile and the necessary elasticity as the conductive path forming portion 16 may not be obtained immediately.
  • the thickness of the conductive path forming portion 16 is preferably 20 to 250 ⁇ m, more preferably 30 to 200 / ⁇ ⁇ . If this thickness is too small, sufficient unevenness absorbing ability may not be obtained. On the other hand, if this thickness is excessive, good conductivity may not be obtained.
  • the protrusion height of the protrusion of the conductive path forming portion 16 is preferably 5 to 70% of the thickness of the conductive path forming portion 16, more preferably 10 to 60%.
  • the anisotropic conductive connector 10 is dispersed in a state where conductive particles exhibiting magnetism are aligned in the thickness direction in an elastic polymer material supported on a releasable support plate.
  • a plurality of conductive path forming portions 16 are formed on the support plate, and each of the conductive path forming portions 16 formed on the releasable support plate is cured and formed so as to close the opening 12 of the frame plate 11.
  • Insulating part 17 is formed by infiltrating into an insulating part material layer made of a liquid polymer substance forming material that becomes a conductive polymer substance, and in this state, the insulating part material layer is cured. Thus, it is obtained.
  • the above-mentioned conductive elastomer layer is formed by containing conductive particles exhibiting magnetism in a liquid elastomer material which is cured to become an elastic polymer substance on a releasable support plate. It is obtained by forming a material layer for the material, applying a magnetic field to the material layer for the conductive elastomer in the thickness direction, and curing the material layer for the conductive elastomer.
  • a conductive elastomer material is prepared in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance.
  • a conductive elastomer material layer 16A is formed on the releasable support plate 13 for forming the forming portion by applying a conductive elastomer material.
  • the conductive particles P exhibiting magnetism are contained in a dispersed state.
  • the particles P are aligned in the thickness direction of the conductive elastomer material layer 16A.
  • the conductive elastomer material layer 16A is cured to perform the process shown in FIG.
  • the conductive elastomer layer 16B which is contained in the elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction, is formed in a state of being supported on the releasable support plate 13. Is done.
  • a material constituting the releasable support plate 13 metals, ceramics, resins, composite materials thereof, and the like can be used.
  • a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
  • the thickness of the conductive elastomer material layer 16A is set according to the thickness of the conductive path forming portion 16 to be formed.
  • an electromagnet As means for applying a magnetic field to the conductive elastomer material layer 16A, an electromagnet, a permanent magnet, or the like can be used.
  • the strength of the magnetic field applied to the conductive elastomer material layer 16A is preferably 0.2 to 2.5 Tesla.
  • the curing process of the conductive elastomer material layer 16A is usually performed by a heating process.
  • the specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 16A, the time required to move the conductive particles, and the like.
  • a thin metal layer 14 for a plating electrode is formed on the surface of the conductive elastomer layer 16B supported on the releasable support plate 13.
  • a pattern of the conductive path forming portion 16 to be formed that is, a specific pattern corresponding to the pattern of the electrode to be connected is formed on the metal thin layer 14 by a photolithography technique.
  • a resist layer 18 having a plurality of openings 18a is formed.
  • the resist layer 18 is subjected to electrolytic plating treatment on the exposed portion of the thin metal layer 14 through the opening 18a of the resist layer 18 to thereby form the resist layer.
  • a metal mask 19 is formed in the 18 openings 18a.
  • laser processing is applied to the conductive elastomer layer 16B, the metal thin layer 14 and the resist layer 18 to remove a part of the resist layer 18, the metal thin layer 14 and the conductive elastomer layer 16B.
  • a plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on the releasable support plate 13. Thereafter, the remaining thin metal layer 14 and metal mask 19 are peeled off from the surface of the conductive path forming portion 16.
  • an electroless plating method, a sputtering method, or the like can be used as a method of forming the thin metal layer 14 on the surface of the conductive elastomer layer 16B.
  • an electroless plating method, a sputtering method, or the like can be used as a material constituting the thin metal layer 14.
  • copper, gold, aluminum, rhodium, or the like can be used as a material constituting the thin metal layer 14.
  • the thickness of the thin metal layer 14 is preferably 0.05-2111, and more preferably 0.1-1 / z m. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.
  • the thickness of the resist layer 18 is set according to the thickness of the metal mask 19 to be formed.
  • a material constituting the metal mask 19 copper, iron, aluminum, gold, rhodium, or the like can be used.
  • the thickness of the metal mask 19 is preferably 2 ⁇ m or more, more preferably 5 to 20 ⁇ m. If this thickness is too small, it may be unsuitable as a mask for the laser.
  • Laser processing is preferably performed using a carbon dioxide gas laser, whereby the conductive path forming portion 16 having a desired form can be reliably formed.
  • a releasable support plate 13A for forming an insulating portion is prepared, and a frame plate 11 is disposed on the surface of the releasable support plate 13A and cured to be an insulating elastic polymer.
  • the insulating material layer 17A is formed by applying a liquid elastomer material that is a substance.
  • the releasable support plate 13 on which the plurality of conductive path forming portions 16 are formed is superposed on the releasable support plate 13A on which the insulating material layer 17A is formed.
  • each of the conductive path forming portions 16 enters the insulating portion material layer 17A and is brought into contact with the releasable support plate 13A.
  • the insulating material layer 17A is formed between the adjacent conductive path forming portions 16.
  • the insulating portion material layer 17A is cured, so that the insulating portion 17 that insulates each other from each other around the conductive path forming portion 16 is electrically conductive as shown in FIG.
  • the elastic anisotropic conductive film 15 is formed integrally with the path forming portion 16.
  • the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is obtained.
  • the material constituting the releasable support plate 13A the same material as the releasable support plate 13 for forming the conductive path forming portion can be used.
  • a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
  • the thickness of the insulating part material layer 17A is set according to the thickness of the insulating part 17 to be formed.
  • the curing process of the insulating part material layer 17A is usually performed by heat treatment.
  • the specific heating temperature and heating time are appropriately set in consideration of the type of material for the elastomer constituting the insulating material layer 17A.
  • the conductive elastomer layer 16B in which the conductive particles P are dispersed so as to be aligned in the thickness direction is subjected to laser processing to remove a part thereof, thereby removing the object. Therefore, it is possible to reliably obtain the conductive path forming portion 16 having the desired conductivity filled with a required amount of the conductive particles P. Further, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern on the releasable support plate 13, an insulating material layer 17A is formed between the conductive path forming portions 16. Since the insulating portion 17 is formed by performing the curing process, the insulating portion 17 can be reliably obtained without the presence of the conductive particles P.
  • the anisotropic conductive connector 10 obtained by such a method, it is possible to reliably achieve the required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected.
  • the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, The manufacturing cost can be reduced.
  • FIG. 14 is an explanatory cross-sectional view showing a configuration of the adapter device according to the first example of the present invention
  • FIG. 15 is an explanatory cross-sectional view showing an adapter main body in the adapter device shown in FIG.
  • This adapter device is suitable for circuit devices such as printed circuit boards.
  • it has an adapter body 20 made of a multilayer wiring board.
  • connection electrode region in which a plurality of connection electrodes 21 are arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. 25 is formed.
  • a plurality of terminal electrodes 22 are arranged on the back surface of the adapter body 20 according to the grid point positions of pitches of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, and 2.54 mm, for example. Are electrically connected to the connection electrode 21 by the internal wiring portion 23.
  • the anisotropic conductive connector 10 having the structure shown in FIG. 1 is basically disposed on the connection electrode region 25.
  • the adapter body 20 is provided with appropriate means (not shown). It is fixed.
  • a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20, and the anisotropic conductive connector 10 Each of the conductive path forming portions 16 is arranged so as to be positioned on the connection electrode 21 of the adapter main body 20.
  • each of the electrodes to be inspected is independent of the arrangement pattern of the inspection electrodes of the circuit device to be inspected.
  • the required electrical connection can be reliably achieved with respect to each of the electrodes to be inspected even when the electrodes to be inspected are arranged with a small pitch and a high density.
  • the required electrical connection can be reliably achieved, and the manufacturing cost can be reduced.
  • FIG. 16 is an explanatory cross-sectional view showing the configuration of the adapter device according to the second example of the present invention
  • FIG. 17 is an explanatory cross-sectional view showing the adapter main body in the adapter device shown in FIG. .
  • This adapter device is for testing a circuit device used for conducting an electrical resistance measurement test of each wiring pattern by a circuit device such as a printed circuit board, for example.
  • each is connected to the same electrode to be inspected and electrically connected to each other for current supply.
  • Electrode (hereinafter also referred to as “current supply electrode”) 21b and connection electrode for voltage measurement (hereinafter also referred to as “voltage measurement electrode”) 21c are provided with a plurality of connection electrode pairs 21a.
  • a connecting electrode region 25 is formed.
  • connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected.
  • the pitch of the adapter body 20 on the back surface is 0.8 mm, 0.75 mm, 1
  • a plurality of terminal electrodes 22 are arranged according to the grid point positions of 5 mm, 1.8 mm, and 2.54 mm.
  • Each of the current supply electrode 21b and the voltage measurement electrode 21c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.
  • the anisotropic conductive connector 10 having the structure shown in FIG. 1 is basically disposed on the connection electrode region 25.
  • the adapter body 20 is provided with appropriate means (not shown). It is fixed.
  • connection electrode in the adapter body 20 is the connection electrode in the adapter body 20
  • a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to 21b and 21c, and each of the anisotropic conductive connectors 10 is connected to the adapter main body 20. It arrange
  • each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected.
  • the required electrical connection can be reliably achieved with respect to each of the electrodes to be inspected even when the electrodes to be inspected are arranged with a small pitch and a high density.
  • the required electrical connection can be reliably achieved, and the manufacturing cost can be reduced.
  • FIG. 18 is an explanatory diagram showing the configuration of the first example of the circuit board electrical inspection apparatus according to the present invention.
  • This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board on which electrodes 6 and 7 to be inspected are formed on both sides.
  • the holder 2 has a position for placing the circuit device 5 at an appropriate position in the inspection execution area E. Placement pin 3 is provided.
  • the upper side adapter device la and the upper side inspection head 50a configured as shown in FIG. 14 are arranged in this order, and further above the upper side inspection head 50a, A side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a.
  • the lower side adapter device lb and the lower side inspection head 50b configured as shown in FIG. 14 are arranged in this order, and further below the lower side inspection head 50b.
  • the lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the lower side support plate 56b by a support 54b.
  • the upper inspection head 50a is composed of a plate-shaped inspection electrode device 5la and an anisotropically conductive sheet 55a having elasticity arranged and fixed to the lower surface of the inspection electrode device 5la.
  • the inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged at lattice point positions at the same pitch as the terminal electrodes 22 of the upper-side adapter device la on the lower surface thereof, and each of these inspection electrodes 52a.
  • the electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
  • the lower inspection head 50b is composed of a plate-shaped inspection electrode device 5 lb and an anisotropically conductive sheet 55b having elasticity arranged and fixed to the upper surface of the inspection electrode device 51b.
  • the inspection electrode device 5 lb has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device lb.
  • Each is electrically connected to a connector 57b provided on the lower support plate 56b by an electric wire 53b, and further electrically connected to an inspection circuit (not shown) of the tester via this connector 57b.
  • the anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction.
  • each of the conductive path forming portions is formed so as to protrude in the thickness direction at least on one surface, and exhibits high electrical contact stability. It is preferable in point to do.
  • the circuit apparatus 5 to be inspected has The holder 2 holds the test execution area E.
  • the upper support plate 56a and the lower support plate 56b move in a direction approaching the circuit device 5 to cause the circuit device 5 to move. It is clamped by the upper adapter device la and the lower adapter device lb.
  • the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper-side adapter device la through the conductive path forming portion 16 of the anisotropic conductive connector 10.
  • the terminal electrode 22 of the upper adapter device la is electrically connected to the test electrode 52a of the test electrode device 5la via an anisotropic conductive sheet 55a.
  • the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device lb through the conductive path forming portion 16 of the anisotropic conductive connector 10.
  • the terminal electrode 22 of the side adapter device lb is electrically connected to the test electrode 52b of the test electrode device 5 lb through the anisotropic conductive sheet 55b.
  • each of the test electrodes 6 and 7 on both the upper surface and the lower surface of the circuit device 5 is connected to the test electrode 52a and the lower test head 50b of the test electrode device 51a in the upper test head 50a.
  • a state of being electrically connected to the inspection circuit of the tester is achieved, and a required electrical inspection is performed in this state.
  • circuit board electrical inspection apparatus since it has the upper side adapter apparatus la and the lower side adapter apparatus lb configured as shown in FIG. Regardless of the arrangement pattern of 7, the required electrical inspection can be reliably performed on the circuit device 5, and the electrodes 6 and 7 to be inspected of the circuit device 5 have minute pitches and high density. Even if it is arranged, the required electrical inspection can be reliably performed on the circuit device 5.
  • FIG. 19 is an explanatory view showing the configuration of the second example of the electrical inspection apparatus for circuit boards according to the present invention.
  • This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 are formed on both sides.
  • 5 has a holder 2 for holding 5 in the inspection execution area E.
  • the circuit device 5 is arranged at an appropriate position in the inspection execution area E. Positioning pins 3 are provided for this purpose.
  • the upper side adapter device la and the upper side inspection head 50a configured as shown in FIG. 16 are arranged in this order, and further above the upper side inspection head 5 Oa,
  • the upper side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a support column 54a.
  • the lower side adapter device lb and the lower side inspection head 50b configured as shown in FIG. 16 are arranged in this order, and further below the lower side inspection head 50b.
  • the lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the support plate 56b by a support 54b.
  • the upper inspection head 50a is composed of a plate-shaped inspection electrode device 5la and an anisotropically conductive sheet 55a having elasticity arranged and fixed to the lower surface of the inspection electrode device 5la.
  • the inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged at lattice point positions at the same pitch as the terminal electrodes 22 of the upper-side adapter device la on the lower surface thereof, and each of these inspection electrodes 52a.
  • the electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
  • the lower inspection head 50b is composed of a plate-shaped inspection electrode device 5 lb and an anisotropically conductive sheet 55b having elasticity arranged and fixed to the upper surface of the inspection electrode device 51b.
  • the inspection electrode device 5 lb has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device lb.
  • Each is electrically connected to a connector 57b provided on the lower support plate 56b by an electric wire 53b, and further electrically connected to an inspection circuit (not shown) of the tester via this connector 57b.
  • the anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.
  • the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, the upper support plate 56a and the lower support plate 56b As each moves in the direction approaching circuit device 5, The circuit device 5 is clamped by the upper adapter device la and the lower adapter device lb.
  • the electrode 6 to be inspected on the upper surface of the circuit device 5 is anisotropically conductive to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper-side adapter device la.
  • the terminal electrode 22 of the upper adapter device la is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a.
  • the electrode 7 to be inspected on the lower surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the lower adapter device lb.
  • the terminal electrode 22 of this lower side adapter device lb is electrically connected to the inspection electrode device 5 lb of the inspection electrode 52b via the anisotropic conductive sheet 55b. Electrically connected.
  • each of the test electrodes 6 and 7 on both the upper surface and the lower surface of the circuit device 5 is connected to the test electrode 52a and the lower test head 50b of the test electrode device 51a in the upper test head 50a.
  • a state of being electrically connected to the inspection circuit of the tester is achieved, and a required electrical inspection is performed in this state.
  • a constant current is supplied between the current supply electrode 21b in the upper adapter device la and the current supply electrode 21b in the lower adapter device lb, and the upper adapter device la.
  • the upper side key configured as shown in FIG. Since it has the doveter device la and the lower-side adapter device lb, the required electrical inspection can be reliably performed on the circuit device 5 regardless of the arrangement pattern of the test electrodes 6 and 7 of the circuit device 5. At the same time, even if the electrodes 6 and 7 to be inspected of the circuit device 5 are arranged with a small pitch and a high density, the required electrical inspection can be reliably performed on the circuit device 5. it can.
  • the conductive path forming portion 16 is formed with a protruding portion, and the entire surface of the elastic anisotropic conductive film 15 may be flat.
  • the conductive path forming portion 16 may have protrusions formed on both sides thereof.
  • the elastic anisotropic conductive film 15 having such a conductive path forming portion 16 can be obtained as follows. That is, in forming the insulating portion 17, the conductive path forming portion 16 is pressed and compressed in the thickness direction by the releasable support plates 13 and 13A, and the insulating material layer 17A is cured in this state. Then, the insulating portion 17 is formed. After that, by releasing the pressure applied to the conductive path forming part 16 by the releasable support plates 13 and 13A, the compressed conductive path forming part 16 is restored to the original form, and thereby the double-sided force of the insulating part 17 is restored. A conductive path forming portion 16 having a protruding portion that protrudes is obtained.
  • the circuit device to be inspected is not limited to a printed circuit board, and may be a semiconductor integrated circuit device such as a cage IC or MCM.
  • a conductive particle exhibiting magnetism in an insulating elastic polymer material which has been manufactured in advance, is formed.
  • the conductive elastomer sheet dispersed in a state of being aligned in the direction is adhered on the releasable support plate 13 by the adhesive property of the conductive elastomer sheet or by an appropriate adhesive. It is also possible to use a method of supporting them.
  • a conductive elastomer material layer is formed between two resin sheets, and a magnetic field is applied in the thickness direction to the conductive elastomer material layer.
  • a magnetic field is applied in the thickness direction to the conductive elastomer material layer.
  • the conductive particles in the conductive elastomer material layer are aligned in the thickness direction. It is possible to manufacture by conducting the curing treatment of the conductive elastomer material layer while orienting and continuing the action of the magnetic field or after stopping the action of the magnetic field.
  • the conductive path forming portion 16 all of the conductive elastomer layer 16B other than the portion serving as the conductive path forming portion is removed by laser processing, whereby the conductive path forming portion 16 is formed. However, as shown in FIGS. 20 and 21, only the peripheral portion of the conductive elastomer forming layer 16B that is the conductive path forming portion is removed. It can also be formed. In this case, the remaining portion of the conductive elastomer layer 16B can be removed by mechanically peeling from the releasable support plate 13.
  • the anisotropically conductive connector 10 includes a frame plate 11 in which a single opening 12 is formed, and a single unit disposed so as to close the opening 12 of the frame plate 11.
  • a structure comprising the anisotropic anisotropic conductive film 15 may be used.
  • the anisotropic conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a plurality of elastic different plates arranged so as to close one opening 12 of the frame plate 11, respectively.
  • a structure composed of the directionally conductive film 15 may be used.
  • the anisotropic conductive connector 10 includes a frame plate 11 formed with a plurality of openings, one or more anisotropic anisotropic conductive films 15 arranged so as to close one opening 12 of the frame plate 11,
  • the frame plate 11 may be composed of one or more anisotropic anisotropic conductive films 15 arranged so as to close the plurality of openings 12.
  • Additive liquid silicone rubber 100 parts by weight of conductive particles in which core particles made of nickel are coated with gold (number average particle diameter is 12 m, ratio of gold to core particles is 2% by weight) 400 parts by weight was dispersed to prepare a conductive elastomer material.
  • This material for conductive elastomer is used as a releasable support plate (13) made of stainless steel with a thickness of 5 mm.
  • the material layer (16A) having a thickness of 100 m was formed on the releasable support plate (13) by applying it to the surface of the substrate by screen printing (see FIGS. 3 and 4). ).
  • the conductive elastomer material layer (16A) is subjected to a curing treatment at 120 ° C for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet, thereby supporting the releasability.
  • a conductive elastomer layer (16B) having a thickness of 100 m supported on the plate 13 was formed (see FIGS. 5 and 6).
  • the content ratio of conductive particles in this conductive elastomer layer was 30% in terms of volume fraction.
  • 4800 apertures (18a) with rectangular dimensions of 120 / zm x 60 m each are applied by a photolithography technique.
  • the minimum separation distance is 30 m (minimum)
  • a resist layer (18) having a thickness of 25 ⁇ m and a center-to-center distance of 90 ⁇ m was formed (see FIGS. 7 and 8).
  • an electrolytic plating treatment was applied to the surface of the thin metal layer (14) to form a metal mask (19) made of copper having a thickness of about 20 ⁇ m in the opening (18a) of the resist layer (18).
  • the conductive elastomer layer (16B), the metal thin layer (14), and the resist layer (18) are subjected to laser treatment with a carbon dioxide gas laser device, so that the releasable support plates ( 13) Form 4800 conductive path forming parts (16) supported on the top (see FIG. 10), and then a thin metal layer (14) and a metal mask remaining from the surface of the conductive path forming part (16) (19) was peeled off.
  • the laser processing conditions by the carbon dioxide laser device are as follows.
  • the carbon dioxide laser processing machine “ML-605GTX” manufactured by Mitsubishi Electric Corporation
  • the laser beam diameter was 60 m
  • the laser output was 0.8 mJ.
  • Laser processing was performed by irradiating the laser beam with 10 shots.
  • a frame plate (11) was produced as follows. A product in which copper foil is laminated on both sides of a resin sheet made of a liquid crystal polymer with a thickness of 50 ⁇ m. A layer sheet (“Espanex LB18-50-18NEP” manufactured by Nippon Steel Chemical Co., Ltd.) was prepared, and a dry film resist was laminated on the copper foil on one side of the laminated sheet to form a resist film. Next, by performing exposure processing and development processing on the formed resist film, pattern holes corresponding to the opening of the target frame plate are formed in the resist film, and further, etching processing is performed. An opening having a pattern corresponding to the opening of the target frame plate was formed in the copper foil, and then the resist film was removed.
  • a layer sheet (“Espanex LB18-50-18NEP” manufactured by Nippon Steel Chemical Co., Ltd.) was prepared, and a dry film resist was laminated on the copper foil on one side of the laminated sheet to form a resist film.
  • the resin sheet in the laminated sheet is subjected to laser processing through the opening formed in the copper foil to form an opening, and thereafter, the copper foil on both sides of the laminated sheet is subjected to etching treatment. By removing, a frame plate (11) was created.
  • This frame plate (11) is made of liquid crystal polymer and has dimensions of 190mm XI 30mm X 50 / zm, the opening (12) is a circle with a diameter force of OO / zm, and the total number of openings (12) is 2400 It is.
  • a coating film having a thickness of 10 m is formed, and a frame plate (11) is disposed on the coating film.
  • an insulating material layer (17A) having a total thickness of 70 m which is arranged so as to close the opening (12) of the frame plate (11), is formed.
  • the releasable support plate (13) on which 4800 conductive path forming portions (16) are formed is aligned and overlapped to thereby form the conductive path forming portion (16).
  • the elastic anisotropic conductive film (15) in this anisotropic conductive connector (10) has a thickness of ⁇ 00 / ⁇ ⁇ at the conductive path forming part (16), a thickness of 70 m at the insulating part (17), and a conductive path.
  • Minimum separation distance of forming part (16) The force is S30 m (minimum center distance is 90 ⁇ m), and the two conductive path forming parts (16) are arranged so as to be located in the opening (12) of the frame plate (11).
  • the conductive path forming portion (16) protrudes from both surfaces of the insulating portion (17), and the total protruding height of the conductive path forming portion (16) is 30 ⁇ m.
  • an adapter body (20) having the following specifications was manufactured according to the configuration shown in FIG. That is, the adapter body (20) has a vertical and horizontal dimension of 160 mm X 120 mm, and the substrate material is a glass fiber reinforced epoxy resin.
  • the connection electrode region on the surface of the adapter body (20) includes A rectangular connecting electrode with dimensions of 120 m x 60 m (21) force The minimum separation distance is 30 m (minimum center-to-center distance is 90 m).
  • a total of 4800 terminals are arranged at a pitch of a circular terminal electrode (22) force of 750 ⁇ m with a diameter of 400 m.
  • the anisotropic conductive connector (10) is placed on the connection electrode region on the surface of the adapter body (20), and each of the conductive path forming portions (16) is positioned on the connection electrode (21).
  • the adapter device of the present invention was manufactured by arranging and fixing as described above.
  • an electrical resistance measuring instrument is used to electrically connect each of the conductive path forming portions to the surface of the conductive path forming portion and the conductive path forming portion in a state where each of the conductive path forming portions is compressed 5% in the thickness direction.
  • the electrical resistance hereinafter referred to as “conducting resistance”
  • the ratio of the conductive path forming part having this conducting resistance of 0.1 ⁇ or less was found to be 100%.
  • conductive path forming part pair two conductive path forming parts adjacent to each other (hereinafter referred to as “conductive path forming part pair”) in a state where each of the conductive path forming parts is compressed 5% in the thickness direction using an electric resistance measuring instrument.
  • the electrical resistance (hereinafter referred to as “insulation resistance”) was measured, and the ratio of the pair of conductive path forming portions having an insulation resistance of 100 ⁇ or more was determined to be 100%.
  • the substrate (81, 86) in each of the upper mold (80) and the lower mold (85) is made of iron and has a thickness of omm.
  • the ferromagnetic part (82, 87) is made of nickel, is rectangular with dimensions of 120 m x 60 m in length and width, is 100 m in thickness, and is the smallest of the plate-like ferromagnetic parts (82, 87).
  • the total number of ferromagnetic layers is 4800 with a separation distance of 30 ⁇ m (minimum center-to-center distance is 90 ⁇ m).
  • the nonmagnetic parts (83, 88) are made of a hardened dry film resist and have a thickness of 0.115 mm.
  • a frame plate (90) was produced in the same manner as in Example 1.
  • conductive particles By adding 60 parts by weight of conductive particles with an average particle diameter of 12 m to 100 parts by weight of addition-type liquid silicone rubber, mixing, and then subjecting to degassing treatment under reduced pressure, a material for anisotropic conductive elastomers was prepared.
  • the conductive particles those obtained by subjecting core particles made of nickel to gold plating (average coating amount: 2% by weight of the weight of the core particles) were used.
  • a spacer with a thickness of 10 ⁇ m with an opening of 160 mm x 120 mm formed on the molding surface of the lower mold (85) of the above mold is aligned and placed in the opening of this spacer.
  • the prepared anisotropic conductive elastomer material was applied by screen printing to form an anisotropic conductive elastomer material layer having a thickness of 10 m.
  • the anisotropic conductive elastomer for the form corresponding to the desired elastic anisotropic conductive film A material layer (95A) was formed.
  • the upper mold (80) is positioned and arranged on the anisotropic conductive elastomer material layer (95A), and the ferromagnetic part (82A) is placed against the anisotropic conductive elastomer material layer (95A).
  • 87) by applying a 2T magnetic field in the thickness direction with an electromagnet to the part located between 120 ° C and 1 hour for the thickness between the conductive particles.
  • An anisotropic anisotropic conductive film composed of 4800 conductive path forming portions extending in the direction and insulating portions formed around the conductive path forming portions was formed.
  • an anisotropic conductive connector for comparison was manufactured.
  • the anisotropic conductive film in this anisotropically conductive connector has a conductive path forming part thickness of 1 m, an insulating part thickness of 70 m, and a minimum distance between the conductive path forming parts of 30 m (minimum center-to-center distance). 90 m), and the two conductive path forming portions are arranged so as to be located in the opening of the frame plate.
  • the conductive path forming part protrudes from both sides of the insulating part, and the total protruding height of the conductive path forming part is 30 m.
  • the content ratio of the conductive particles in the conductive path forming portion is about 30% in terms of volume fraction.
  • An adapter body having the same specifications as in Example 1 was prepared, and the anisotropic conductive connector was placed on the connection electrode area on the surface of the adapter body, and each of the conductive path forming portions was a connection electrode.
  • An adapter device for comparison was manufactured by placing and fixing it so as to be positioned above.
  • the conduction resistance was measured in the same manner as in Example 1, and the ratio of the conductive path forming portion having the conduction resistance of 0.1 ⁇ or less was determined to be 100%. Further, the insulation resistance was measured in the same manner as in Example 1, and the ratio of the pair of conductive path forming portions having this insulation resistance of 100 ⁇ or more was determined to be 95%.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L’invention concerne un connecteur conducteur anisotropique qui assure positivement une connexion électrique requise pour chacune des électrodes quel que soit le motif des électrodes, assure positivement une connexion électrique requise pour chacune des électrodes même si les électrodes sont disposées selon un faible écartement et une forte densité, et peut être fabriqué à moindres coûts, et un procédé de fabrication de celui-ci ; et un dispositif adaptateur et un dispositif d’inspection électrique pour un dispositif à circuit fourni avec ce connecteur. On obtient le connecteur conducteur anisotropique en traitant au laser une couche d’élastomère conducteur dans laquelle sont dispersées des particules conductrices, tout en étant orientées dans la direction de l’épaisseur, dans un matériau polymère élastique supporté sur une plaque support de type à libération pour former une pluralité d’unités formant des lignes conductrices, en permettant à chacune des unités formant des lignes conductrices formées sur la plaque support de type à libération d’imprégner et former une couche de matériau pour unité isolante comprenant un matériau formant une substance polymère liquide formé de sorte à fermer une ouverture d’une plaque cadre et devient une substance polymère élastique après polymérisation de la couche de matériau pour unité isolante pour former une unité isolante.
PCT/JP2005/013252 2004-07-23 2005-07-19 Connecteur conducteur anisotropique et procédé pour la fabrication de celui-ci, dispositif adaptateur et dispositif d’inspection électrique pour dispositif à circuit WO2006009144A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004216041A JP2006040632A (ja) 2004-07-23 2004-07-23 異方導電性コネクターおよびその製造方法、アダプター装置並びに回路装置の電気的検査装置
JP2004-216041 2004-07-23

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WO2006009144A1 true WO2006009144A1 (fr) 2006-01-26

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JP (1) JP2006040632A (fr)
KR (1) KR20070029205A (fr)
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TWI570414B (zh) * 2014-04-11 2017-02-11 Isc股份有限公司 測試片的製造方法以及測試片
US20210359434A1 (en) * 2018-10-11 2021-11-18 Sekisui Polymatech Co., Ltd. Electrical connection sheet and terminal-equipped glass plate structure

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JP4919093B2 (ja) * 2008-03-31 2012-04-18 Ｊｓｒ株式会社 異方導電性シート
KR100988304B1 (ko) * 2008-07-23 2010-10-18 주식회사 아이에스시테크놀러지 탄성 도전시트 및 그 탄성도전시트의 제조방법
CN107267076B (zh) * 2012-08-24 2021-06-29 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
US20170271299A1 (en) * 2015-10-29 2017-09-21 Boe Technology Group Co., Ltd Anisotropic conductive film (acf), bonding structure, and display panel, and their fabrication methods
KR102282081B1 (ko) * 2016-11-30 2021-07-27 데쿠세리아루즈 가부시키가이샤 도전 입자 배치 필름, 그 제조 방법, 검사 프로브 유닛, 도통 검사 방법
CN107479274A (zh) * 2017-07-11 2017-12-15 武汉华星光电半导体显示技术有限公司 显示面板与外接电路的邦定方法及显示装置
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102110150B1 (ko) * 2019-01-08 2020-06-08 (주)티에스이 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법
WO2024048439A1 (fr) * 2022-08-31 2024-03-07 三井化学株式会社 Feuille conductrice anisotrope encadrée, procédé de fabrication de feuille conductrice anisotrope encadrée, et dispositif d'inspection électrique

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JPH11154550A (ja) * 1997-11-19 1999-06-08 Jsr Corp コネクター
JP2002289277A (ja) * 2001-03-27 2002-10-04 Jsr Corp 異方導電性コネクターおよびその応用製品
JP2003163047A (ja) * 2001-11-28 2003-06-06 Jsr Corp 異方導電性シートおよび異方導電性シートの製造方法、ならびに電気回路部品の検査治具および電気回路部品の検査方法

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JPH11154550A (ja) * 1997-11-19 1999-06-08 Jsr Corp コネクター
JP2002289277A (ja) * 2001-03-27 2002-10-04 Jsr Corp 異方導電性コネクターおよびその応用製品
JP2003163047A (ja) * 2001-11-28 2003-06-06 Jsr Corp 異方導電性シートおよび異方導電性シートの製造方法、ならびに電気回路部品の検査治具および電気回路部品の検査方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570414B (zh) * 2014-04-11 2017-02-11 Isc股份有限公司 測試片的製造方法以及測試片
US20210359434A1 (en) * 2018-10-11 2021-11-18 Sekisui Polymatech Co., Ltd. Electrical connection sheet and terminal-equipped glass plate structure
US12021322B2 (en) * 2018-10-11 2024-06-25 Sekisui Polymatech Co., Ltd. Electrical connection sheet and terminal-equipped glass plate structure

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CN1989664A (zh) 2007-06-27
KR20070029205A (ko) 2007-03-13
TW200618424A (en) 2006-06-01

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