WO2005119309A1 - 反射ミラー製作方法および反射ミラー - Google Patents
反射ミラー製作方法および反射ミラー Download PDFInfo
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- WO2005119309A1 WO2005119309A1 PCT/JP2005/010027 JP2005010027W WO2005119309A1 WO 2005119309 A1 WO2005119309 A1 WO 2005119309A1 JP 2005010027 W JP2005010027 W JP 2005010027W WO 2005119309 A1 WO2005119309 A1 WO 2005119309A1
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- Prior art keywords
- etching
- etched
- reflection mirror
- manufacturing
- vibrating body
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0109—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0133—Wet etching
Definitions
- the present invention relates to a technology for manufacturing a plate-like reflection mirror having a reflection surface on which light enters by etching, and more particularly to a technology for manufacturing the reflection mirror by wet etching.
- a plate-shaped reflecting mirror having a reflecting surface on which light is incident may be used.
- This type of reflecting mirror is used for various purposes.
- one type of this type of reflecting mirror is to oscillate around an oscillating axis parallel to the reflecting surface to change the reflecting direction of light incident on the reflecting surface and scan the light. used.
- It is used for changing the reflection direction of the light incident on the reflection surface and scanning the light.
- this conventional reflecting mirror has a quadrangular planar shape having a center axis of symmetry about the oscillation axis of the reflecting mirror. Had been produced. Further, this conventional reflecting mirror has been manufactured by etching. Types of etching include dry etching and wet etching. Disclosure of the invention
- the conventional reflecting mirror manufactured by wet etching while being pressed has been manufactured to have a quadrangular planar shape having the oscillating axis of the reflecting mirror as the center of symmetry as described above. . Therefore, when it is necessary to use the conventional reflecting mirror, the reflecting mirror is compared with a circular reflecting mirror having the same lateral dimension as that of the conventional reflecting mirror in order to secure the same reflection area as the conventional reflecting mirror. It was difficult to reduce the moment of inertia.
- a reflecting mirror is manufactured by dry etching, it is easier to make a mask pattern finer than when it is manufactured by wet etching, and it is easier to manufacture a reflecting mirror into an arbitrary shape with high precision. It is.
- the production of a reflection mirror by dry etching is not sufficiently suitable for batch processing in which a large number of materials to be etched used for producing a large number of reflection mirrors are etched at once. Therefore, the production of a reflection mirror by dry etching is well suited for increasing the production efficiency of the reflection mirror and reducing the production cost.
- the present invention relates to a technique for manufacturing a plate-like reflecting mirror having a reflecting surface on which light is incident by etching, and a technique for manufacturing the reflecting mirror by wet etching. It was made to provide.
- a reflection mirror manufacturing method for manufacturing a plate-like reflection mirror having a reflection surface on which light enters by etching (1) A reflection mirror manufacturing method for manufacturing a plate-like reflection mirror having a reflection surface on which light enters by etching.
- the reflection mirror is manufactured such that the projection figure obtained by projecting the reflection mirror in the normal direction thereof has a planar shape that is closer to a circle than a rectangle. Therefore, according to this method, in a reflecting mirror that requires a minimum of a circular reflecting area having a necessary reflecting area, a useless reflecting area can be omitted more easily than a reflecting mirror that uses a square as a projected figure. Therefore, the weight and inertia moment of the mirror are smaller than those of the reflection mirror that uses a square as a projected figure, and the reflection mirror can be easily manufactured.
- the reflection mirror is manufactured not by dry etching but by wet etching. Therefore, according to this method, it is easier to manufacture the reflection mirror at a higher production efficiency and at a lower cost than when the reflection mirror is manufactured by dry etching.
- the reflection mirror is manufactured by dry etching
- the same shape as a mask pattern formed on an etching mask material coated on the surface of a material to be etched is used.
- the reflection mirror is manufactured to have a shape.
- the reflection mirror is manufactured by wet etching, the reflection mirror is manufactured so as to have a shape different from the mask pattern. The reason for this is a difference in etching speed between the plurality of crystal planes of the material to be etched.
- a mask pattern is formed based on the target shape of the reflection mirror in consideration of the etching rate difference existing between a plurality of crystal planes of the material to be etched.
- the mask pattern since the reflecting mirror is finally manufactured so that its projected figure has a plane shape closer to a circle than a square, the mask pattern also has a plane shape closer to a circle than a square, and the reflection pattern It is formed to have a shape that does not match the target shape of the mirror.
- the reflecting mirror is manufactured by wet etching, if the mask pattern is determined in consideration of the etching rate difference existing between a plurality of crystal planes, the reflecting mirror has a target shape. It is possible to manufacture.
- the method according to this item can be carried out in a mode in which an etching mask is coated on both surfaces of the material to be etched, or in a mode in which only one surface is coated.
- the mask pattern forming step includes forming a mask pattern on each of the two etching masks coated on both surfaces of the material to be etched, or forming a mask pattern on the two etching masks. It is possible to form a mask pattern on only one of them. In short, it suffices that the method according to this section is performed so that a mask pattern is formed on at least one of both surfaces of the material to be etched.
- the reflection mirror is used to scan the light by changing the reflection direction of the light incident on the reflection surface by being oscillated about an oscillation axis parallel to the reflection surface.
- the reflection mirror extends from the reflection mirror along the oscillation axis, and A vibrating body is formed together with a plate-like spring in which torsional vibration is generated around the oscillation axis, and at least a part of the vibrating body is vibrated to reflect light incident on the reflection surface.
- the planar shape of the mask pattern is a generally convex octagon (1) to (3).
- the erosion force of the portion of the material to be etched facing the corner of the mask pattern is greater than when the corner has no protrusion. Be delayed.
- the reflection mirror is manufactured so that this delay is reflected.
- the "projecting portion" in this section may have, for example, a shape extending from each corner of a regular octagon to a region corresponding to an outer corner of each corner.
- the mask pattern has a first side parallel to one reference line and a second side orthogonal to the reference line, and the first side is located on a (100) crystal plane of the material to be etched.
- the side and the second side are positioned relative to the material to be etched such that the ⁇ 110> crystal direction is orthogonal to the ⁇ 110> crystal direction, and the outline of the mask pattern has two symmetric center lines orthogonal to each other at the center point of the mask pattern.
- the first part corresponding to the (100) crystal plane and the second part corresponding to the (111) crystal plane of the material to be etched are divided into four regions by dividing the material to be etched into four regions by the above method. Reflection mirror manufacturing method according to (4) or (5)
- a crystal plane is expressed by a force expressed as (abc).
- a crystal plane represented by this notation has a narrow sense in consideration of the signs of the numbers a, b, and c in the notation. It includes not only crystal planes but also equivalent crystal planes. That is, the (abc) crystal plane It should be interpreted according to a comprehensive definition that includes multiple crystal planes. The same is true for abc> t, where the crystal direction is written as
- the m-sided polygon (m: an integer equal to or greater than 3 multiplied by 4) in which the (100) crystal plane and the (111) crystal plane are exposed is defined as a projected figure. It is possible to manufacture a reflective mirror that can be used.
- the outline of the mask pattern further includes, for each of the regions, a third portion corresponding to a (nil) crystal plane (n: an integer of 2 or more) of the material to be etched.
- n an integer of 2 or more
- the octagon indicated by the projected figure is assigned to the octagon.
- Reflection mirror with m-gon (m: multiple of 8 larger than 8) obtained by partially shaving each of the eight corners so that at least one other crystal plane is exposed Can be manufactured.
- this method it is possible to manufacture a reflecting mirror in which a planar shape closer to a circle than an octagon is a projected figure. Furthermore, according to this method, the projected figure of the reflecting mirror can be more easily approximated to a circle than a square, so that a reflecting mirror that requires a necessary reflecting area (securing a necessary lateral dimension) is required. In the case of, the useless reflection area is omitted as compared with the case where the reflection mirror is square, and as a result, the weight of the reflection mirror and the reduction of the moment of inertia are facilitated.
- the circularity of the reflecting mirror is improved when a plurality of types of crystal planes are exposed at each corner of the octagon, which is the virtual shape, as compared with a case where only one type is present. For example, if there is only one type of exposed crystal plane, the projected shape of the reflecting mirror is a hexagon, but if there are two types of exposed crystal surface, the projected shape of the reflecting mirror is Becomes a 24-gon.
- the tendency that the circularity of the reflecting mirror increases as the number of types of exposed crystal planes increases is emphasized as the number of types of exposed crystal planes increases, and the method according to this section increases the number of types of exposed crystal planes. Suitable for letting
- the outline of the mask pattern further includes, for each of the regions, a fourth portion corresponding to the (520) crystal plane of the material to be etched, between the first portion and the second portion. Have in between ( The method for manufacturing a reflection mirror according to the item 6).
- the octagon indicated by the projected figure belongs to it.
- a reflection mirror having a shape partially projected so as to mainly expose the (520) crystal plane as a projected figure.
- the projected figure of the reflecting mirror that can be manufactured by this method has a shape close to a hexagon.
- this method it is possible to manufacture a reflecting mirror in which a planar shape closer to a circle than an octagon is a projected figure. Furthermore, according to this method, when the octagon is cut off at each corner thereof, only one type of crystal plane is mainly exposed, and the number of types of the crystal plane does not change. The final shape of the reflecting mirror is stabilized.
- the mask pattern forming step includes a step of forming the mask pattern on each of two etching mask materials coated on both surfaces of the material to be etched (1) to (11).
- the side surface has an inclined surface in a longitudinal sectional view.
- a reflection mirror is manufactured.
- a continuous inclined surface is formed on the side surface of the material to be etched 400 ′. It is formed.
- the inclined surface is formed asymmetrically with respect to the center line in the thickness direction of the material to be etched 400 ′.
- FIG. As shown in the vertical sectional view in b), a discontinuous inclined surface is formed on the side surface of the material 400 to be etched.
- the inclined surface is formed symmetrically with respect to the center line in the thickness direction of the material 400 to be etched.
- the former one-sided wet etching is more effective in the case of performing the latter two-sided wet etching.
- Lightening of the reflection mirror becomes easier than in the case of performing etching. If the weight of the reflecting mirror can be easily reduced, the moment of inertia of the reflecting mirror can be easily reduced.
- a mask pattern is formed on each of two etching mask materials coated on both surfaces of the material to be etched.
- a mask pattern is formed on both surfaces of the material to be etched, and as a result, wet etching is performed from both surfaces of the material to be etched.
- the material to be etched also includes a peeling step of peeling the etching mask material (1). How to make a reflective mirror.
- the etching target material includes a reflection film forming step of forming a reflection film on at least one of both surfaces of the etching target material (13).
- a plate-like reflecting mirror having a reflecting surface on which light is incident
- a projected figure obtained by projecting the reflecting mirror in the normal direction has a planar shape that is closer to a circle than a square. Therefore, according to this reflecting mirror, under a use condition in which a circular reflecting area having a necessary reflecting area is required at a minimum, an unnecessary reflecting area can be more easily formed than a reflecting mirror having a square as a projected figure. It can be omitted. Therefore, according to this reflecting mirror, it is easier to reduce the weight and to reduce the moment of inertia than the reflection mirror using a square as a projected figure.
- the reflecting mirror is used to scan the light by changing the reflecting direction of the light incident on the reflecting surface by being oscillated about an oscillation axis parallel to the reflecting surface.
- the reflecting mirror extends from the reflecting mirror along the oscillation axis, and constitutes a vibrating body together with a plate-shaped spring that generates at least torsional vibration about the oscillation axis.
- the step portion includes: (a) a high portion having the same height as a basic surface of the beam structure; and (b) a lower portion and a lower portion than the basic surface, in a thickness direction of the beam structure. (C) the beam structure is located at the boundary between the high portion and the low portion; With a shoulder to cut off,
- the material to be etched includes: (d) a scheduled penetration portion that is eroded until it penetrates in the thickness direction when the wet etching is performed in order to remove the beam structure from the plate-like material to be etched; (E) the remaining portion which is not eroded when the wet etching is performed to form the high portion, and (f) the wet etching is performed when the wet etching is performed to form the low portion.
- a scheduled semi-eroded portion that is eroded halfway in the thickness direction
- the mask pattern includes: (g) a basic pattern covering the surface of the planned remaining portion; and (h) both side portions of the planned penetrating portion that sandwich the planned semi-eroded portion from both sides in the width direction of the beam structure.
- a method of manufacturing a beam structure comprising: a semi-eroded portion; and a compensation pattern covering at least a surface of both side portions.
- the method according to this section relates to a technique for manufacturing a one-dimensionally extending beam structure by etching.
- the beam structure having a step portion in a part in the length direction is integrated by etching. It is related to the technology to make it.
- the traveling direction or wavefront curvature of light is changed with high accuracy for the purpose of scanning light or controlling the depth of a virtual image perceived by an observer through eyes.
- a beam structure may be used for this purpose.
- the beam structure is, for example, torsionally oscillated about a straight line parallel to the beam structure for scanning light, and a beam perpendicular to the surface of the beam structure for modulation of wavefront curvature. It is longitudinally vibrated in a straight line.
- this type of beam structure is used for the purpose of scanning light or controlling the depth of a virtual image, for example, a plate-like reflecting mirror portion having a reflecting surface on which light enters, The mirror unit and the elastic deformation unit extending along the same plane are integrally formed.
- a conventional example of this type of beam structure is disclosed in Japanese Patent No. 2981600.
- the present inventors have conducted research on a technology for integrally fabricating a beam structure having a step portion in a part in the length direction by jet etching.
- the step portion comprises: (a) a high portion having the same height as the basic surface of the beam structure; A low lower part, separated from the higher part in the thickness direction of the beam structure, and (C) a shoulder located at the boundary between the higher part and the lower part and crossing the beam structure.
- the present inventors have found that when dry etching is performed on a wafer, the length of the beam structure at the shoulder portion of the step portion in the manufactured beam structure.
- wet etching is performed on the wafer by the conventional method while the position in the direction is easily stabilized, the length of the shoulder portion of the step portion of the manufactured beam structure is reduced. I noticed that the position in the vertical direction was difficult to stabilize.
- the present inventors have also noticed that it is difficult to reduce the variation between individuals in the accuracy of the position of the shoulder in the longitudinal direction of the beam structure by conventional wet etching.
- the method according to this section relates to a technique for integrally fabricating a beam structure having a step portion in a part in the length direction by etching, wherein the shoulder portion of the step portion is used.
- the object of the present invention is to control the position of the section in the longitudinal direction of the beam structure.
- a beam structure having a step portion is manufactured by performing a wet etching on the material to be etched on which the mask pattern is formed.
- the step portion has a high portion, a low portion, and a shoulder portion, as described above.
- the material to be etched includes a planned penetrating portion for taking out the beam structure from the plate-like material to be etched, a planned remaining portion for forming a high portion of the step portion, and a step.
- a predetermined semi-eroded portion for forming a lower portion of the portion.
- the mask pattern includes a basic pattern that covers the surface of the expected remaining portion.
- the mask pattern further includes: (i) both sides sandwiching the planned semi-eroded portion of the planned penetrating portion from both sides in the width direction of the beam structure; and ( ⁇ ) the surfaces of at least both sides of the planned semi-eroded portion. Includes a compensation pattern to cover.
- the shoulder portion of the step portion is formed by etching a flat portion of the material to be etched. During the etching process, a portion having a shape similar to the final shoulder is generated in the material to be etched in the middle.
- the intermediate portion extends in a direction intersecting the basic surface of the material to be etched. Yes. Therefore, in the intermediate portion, the etching proceeds not only in the direction of decreasing the thickness of the material to be etched, but also in the direction of decreasing the width dimension and the direction of retracting the longitudinal position. Therefore, in the intermediate portion, the etching proceeds at a higher speed than the basic surface of the same material to be etched, and the structure of the crystal plane that appears tends to be complicated.
- the mask pattern which is previously attached to the material to be etched to form a three-dimensional step portion from the flat portion of the material to be etched, is reflected only by the shape of the aforementioned planned remaining portion.
- the shoulder of the step portion of the finally formed beam structure is stable with respect to the position in the longitudinal direction of the beam structure.
- the position of the shoulder is considerably sensitive to variations in actual etching conditions (for example, etching time).
- the shoulder between the plurality of beam structures formed by etching is formed.
- Position is easy to vary.
- the mask pattern further includes (a) the planned semi-eroded portion A and (b) the planned semi-eroded portion of the planned penetrating portion, and It includes a compensation pattern that covers at least the surface of both sides B of both sides B sandwiched from both sides in the width direction.
- the compensation pattern functions to suppress the progress of etching in a portion of the material to be etched that is covered by the basic pattern. Furthermore, depending on the shape of the compensation pattern, it is easy to control the surface composition of the finally formed shoulder so that a crystal plane that is difficult to etch appears at an appropriate position. The appearance of a hardly etched crystal plane on the shoulder surface leads to a stable position of the shoulder regardless of the actual etching conditions.
- the mask pattern since the mask pattern includes the compensation pattern in addition to the basic pattern, the mask pattern has a three-dimensional step portion from the material to be etched.
- the beam structure is integrally manufactured by wet etching, it becomes easy to improve the positional accuracy of the shoulder portion of the step portion.
- the mask pattern can be manufactured more easily and stably than when the thickness of the mask pattern is not uniform.
- the compensation pattern covers the surfaces of the both side portions, thereby reducing the speed at which the wet etching progresses in the planned semi-eroded portion, so that the wet etching does not reach the planned remaining portion.
- the first etching compensating portion which is a part of the mask pattern, covers the surfaces of both side portions sandwiching the predetermined semi-eroded portion of the etching target material from both sides in the width direction, The speed at which wet etching proceeds in the planned semi-eroded portion is reduced.
- the first etching compensating portion is a pair of projecting portions extending in the length direction with the projecting semi-eroded portions projecting to both sides in the width direction, respectively. While being closed at one end of the portion to the basic pattern and being open at the other end, it is generally U-shaped in cooperation with the portion of the basic pattern connected to the pair of overhangs.
- the first etching compensator has a linear portion parallel to the width direction of the beam structure and orthogonal to the ⁇ 110> crystal direction of the material to be etched (21) or (21). 2 The method for manufacturing a beam structure according to the item 2).
- a portion of the material to be etched that is perpendicular to the 110> crystal direction is a portion that is difficult to be etched. Therefore, if the shoulder is formed by wet etching so that this part appears, the position of the shoulder is stabilized.
- the first etching compensating portion force in the above item (21) or (22) is parallel to the width direction of the beam structure and is etched. It has a straight portion perpendicular to the crystal direction.
- the compensation pattern covers the surface of the planned semi-eroded portion, thereby reducing the speed at which the wet etching proceeds in the planned semi-eroded portion, and causing the wet etching to be performed on the planned remaining portion.
- the surface of the planned semi-eroded portion of the material to be etched is covered with the second etching compensating portion which is a part of the mask pattern, so that the wet-etched portion at the planned semi-eroded portion is obtained.
- the speed at which the etching proceeds is reduced.
- the compensation pattern includes the first etching compensator and the second etching compensator according to any one of (21) to (23).
- the compensation pattern forms a rhombus having four corners and four sides in cooperation with a part of the basic pattern that is coupled to the compensation pattern, and each side has a square shape.
- the material to be etched is immersed only once in the etching solution, whereby the beam structure is manufactured at a time.
- the material to be etched is immersed only once in the etching solution in the wet etching step, so that the beam structure is collectively formed. It is manufactured. Therefore, according to this method, the manufacturing time of the beam structure is reduced, and the manufacturing efficiency is improved.
- a beam structure having a step in at least a portion in the length direction wherein the step includes: (a) a high portion having the same height as a basic surface of the beam structure; b) lower and lower than the basic surface, in the thickness direction of the beam structure, and separated from the high portion; and (c) at the boundary between the high and low portions.
- this beam structure there is provided a beam structure having a step portion in at least a portion in the length direction, which is integrally manufactured by wet etching.
- This beam structure can be suitably manufactured by implementing the method according to any of the above (18) to (26).
- the beam structure is a beam structure manufactured by the method for manufacturing a beam structure according to any one of (18) to (26).
- the beam structure includes a plate-like reflection mirror having a reflection surface on which light is incident, and an elastic deformation portion extending along the same plane as the reflection mirror, and the step portion is formed. (27) or the beam structure according to the above mode (28), wherein the beam structure is integrally formed with the beam structure.
- vibration may be realized, for example, as a swing about a vertical axis parallel to the reflection surface, or in a linear direction perpendicular to the reflection surface. It can be realized as a reciprocating movement in.
- optical characteristics refers to, for example, the incidence on a reflective surface. It can be interpreted to mean the angle at which light is deflected by the reflecting surface, or to mean the wavefront curvature of the light emitted from the reflecting surface.
- the laminated portion (for example, a vibration source or a driving source) can be formed on the beam structure without protruding in the thickness direction of the basic surface force of the beam structure. It is possible. Therefore, according to this beam structure, for example, in an environment where a thin plate of the beam structure is desired, it is possible to form a laminated portion in the beam structure while satisfying the demand.
- the reflection mirror is oscillated about an oscillating axis parallel to the reflection surface, thereby changing a reflection direction of light incident on the reflection surface and scanning the light.
- Is configured as a beam structure extending from the reflection mirror along the oscillation axis and having a step in a part in the length direction, and at least torsional vibration is caused by vibration of at least a part of the vibrating body.
- a spring is generated around the swing axis, and the reflecting mirror is swung about the swing axis by at least torsional vibration.
- the vibrating body manufacturing method includes the reflecting mirror manufacturing method according to any one of (1) to (14) for manufacturing the reflecting mirror,
- the etching mask material is further coated on both surfaces of a portion of the material to be etched where the beam structure is to be formed,
- a set of the mask patterns is formed on each of the two etching mask materials coated on both surfaces of the predetermined forming portion, respectively.
- the set of mask patterns is further coated in the mask pattern forming step in order to manufacture the beam structure.
- the step portion includes: (a) a high portion having the same height as a basic surface of the beam structure; Lower than the surface, lower than in the thickness direction of the beam structure, and separated from the higher portion; and (c) positioned at the boundary between the higher portion and the lower portion. A shoulder crossing the beam structure,
- the material to be etched includes: (d) a scheduled penetration portion that is eroded until it penetrates in the thickness direction when the wet etching is performed in order to remove the beam structure from the plate-like material to be etched; (E) the remaining portion which is not eroded when the wet etching is performed to form the high portion, and (f) the wet etching is performed when the wet etching is performed to form the low portion.
- a scheduled semi-eroded portion that is eroded halfway in the thickness direction
- the mask pattern includes: (g) a basic pattern covering the surface of the planned remaining portion; and (h) both side portions of the planned penetrating portion that sandwich the planned semi-eroded portion from both sides in the width direction of the beam structure.
- a method of manufacturing a vibrating body comprising: a semi-eroded portion; and a compensation pattern that covers at least the surfaces of both side portions.
- the compensation pattern covers the surfaces of the both side portions, thereby reducing the speed at which the wet etching proceeds in the planned semi-eroded portion and preventing the wet etching from reaching the planned remaining portion.
- the first etching compensating portion is a pair of projecting portions extending in the length direction with the projecting semi-eroded portions projecting on both sides in the width direction, respectively. While being closed at one end of the portion to the basic pattern and being open at the other end, it is generally U-shaped in cooperation with the portion of the basic pattern connected to the pair of overhangs. (35) The method for manufacturing a vibrating body according to (35), including:
- the first etching compensating portion has a straight portion parallel to the width direction of the beam structure and orthogonal to the crystal direction of the material to be etched (35) or (35). 3 6) The method for manufacturing a vibrating body described in 6).
- the compensation pattern covers the surface of the planned semi-eroded portion, thereby reducing the speed at which the wet etching proceeds in the planned semi-eroded portion, and causing the wet etching to reach the planned remaining portion.
- the compensation pattern includes the first etching compensator and the second etching compensator according to any one of (35) to (37),
- the compensation pattern forms a diamond shape having four corners and four sides in cooperation with a part of the basic pattern that is coupled to the compensation pattern, and each side has a square shape. > One of two opposing corners that are orthogonal to the crystal direction and oppose each other among the four corners, are coupled to the basic pattern, while ⁇ , The vibrating body manufacturing method according to the above mode (38), wherein the vibrating body is cut out to form a shape.
- the vibrating body is manufactured collectively by immersing the material to be etched only once in the etching solution (32) to (39).
- the reflection mirror is oscillated about an oscillating axis parallel to the reflection surface, thereby changing a reflection direction of light incident on the reflection surface and scanning the light.
- Is configured as a beam structure extending from the reflection mirror along the oscillation axis and having a step in a part in the length direction, and at least torsional vibration is caused by vibration of at least a part of the vibrating body.
- a spring is generated around the swing axis, and the reflecting mirror is swung about the swing axis by at least torsional vibration.
- the step portion includes: (a) a high portion having the same height as a basic surface of the beam structure; and (b) a lower portion and a lower portion than the basic surface, in a thickness direction of the beam structure.
- the material to be etched so as to have a part separated from the high part and (c) a shoulder located at a boundary between the high part and the low part and crossing the beam structure.
- the vibrating body integrally includes the reflecting mirror and an elastically deformable portion extending along the same plane as the reflecting mirror and having the step portion formed thereon (41) Or the vibrating body according to the paragraph (42).
- the vibrating body is used to change the optical characteristics of light incident on the reflecting surface by being vibrated (41). Vibrating body described in
- the laminated portion force at the lower portion is formed so that the upper surface of the laminated portion does not exceed the upper surface of the higher portion. (41) body.
- FIG. 1 is a system diagram showing a retinal scanning display provided with a part of a reflection mirror for optical scanning manufactured by a reflection mirror manufacturing method according to a first embodiment of the present invention.
- FIG. 2 is an exploded perspective view showing the optical scanner 104 in FIG. 1.
- FIG. 3 is a side sectional view and a perspective view showing a driving source 154 and its periphery in FIG. 2.
- FIG. 4 is a perspective view showing a vibrating body 124 in FIG. 2.
- FIG. 5 is a block diagram showing a horizontal scanning drive circuit 180 in FIG. 1.
- FIG. 6 is a perspective view showing a specific shape of a vibrating body 124 in FIG. 2.
- FIG. 7 is a perspective view for explaining a state in which light is incident on a circular reflecting mirror portion 122 of the vibrating body 124 in FIG. 2.
- FIG. 8 is a perspective view for explaining a state in which light is incident on a square-shaped reflecting mirror portion 302 in a comparative example of the vibrating body 124 in FIG. 2.
- FIG. 9 is a process diagram showing a method for manufacturing the reflection mirror.
- FIG. 10 is a plan view showing a mask pattern formed in step S3 in FIG. 9.
- FIG. 11 is a perspective view for explaining stepwise how wet etching is performed in step S4 in FIG. 9.
- FIG. 12 is another perspective view for explaining step-by-step how the wet etching performed in step S4 in FIG. 9 proceeds.
- FIG. 13 is an enlarged perspective view showing a material to be etched 400 shown in FIG. 12 (b).
- FIG. 14 is a longitudinal sectional view showing a reflecting mirror section 122 finally manufactured by the reflecting mirror manufacturing method shown in FIG. 9, and a longitudinal sectional view showing a comparative example of the reflecting mirror section 122;
- FIG. 15 is a plan view showing a modification of the mask pattern shown in FIG.
- FIG. 16 is a plan view showing a mask pattern formed for manufacturing a reflection mirror unit 122 by a reflection mirror manufacturing method according to the second embodiment of the present invention.
- FIG. 17 is a perspective view for explaining stepwise progress of wet etching in the second embodiment.
- FIG. 18 is another perspective view for explaining stepwise the progress of wet etching in the second embodiment.
- FIG. 19 is an enlarged perspective view showing a material to be etched 480 shown in FIG. 18 (b).
- FIG. 20 is a perspective view and a plan view showing a reflection mirror unit 122 finally manufactured according to the second embodiment.
- FIG. 21 is a plan view showing a modification of the mask pattern shown in FIG.
- FIG. 22 is a process chart showing a vibrating body manufacturing method according to the third embodiment of the present invention.
- FIG. 23 is a sectional view taken along the line AA and a sectional view taken along the line BB in FIG. 2 for explaining steps S12 and S13 in FIG. 22.
- FIG. 24 is a plan view showing an upper mask pattern 630 and a lower mask pattern 632 formed in step S13 of FIG. 22.
- FIG. 25 A perspective view showing a basic target shape of one representative frame-side leaf spring portion 144 representing the plurality of frame-side leaf spring portions 144 in FIG. 2, and a material 600 to be etched and an upper mask pattern 630, respectively.
- FIG. 25 A perspective view showing a basic target shape of one representative frame-side leaf spring portion 144 representing the plurality of frame-side leaf spring portions 144 in FIG. 2, and a material 600 to be etched and an upper mask pattern 630, respectively.
- FIG. 26 is a plan view showing a basic target shape of a step portion 160 of the representative frame-side leaf spring portion 144 in FIG. 25 and a mask pattern 650 corresponding to the step portion.
- FIG. 27 is a perspective view for explaining stepwise how the wet etching performed in step S14 in FIG. 22 proceeds.
- FIG. 28 is another perspective view for explaining stepwise how the wet etching performed in step S14 in FIG. 22 proceeds.
- FIG. 29 is a plan view and a perspective view showing, on an enlarged scale, a step portion 160 of the material to be etched 600 shown in FIG. 28 (b).
- Fig. 30 is a perspective view for explaining stepwise progress of wet etching in a comparative example with the third embodiment.
- FIG. 31 is another perspective view for stepwise explaining how wet etching proceeds in a comparative example with the third embodiment.
- FIG. 32 is a plan view showing an upper mask pattern 740 and a lower mask pattern 742 formed to manufacture the step portion 160 by the vibrator manufacturing method according to the fourth embodiment of the present invention.
- FIG. 33 The mask pattern 760 corresponding to the step portion in FIG. 32 and the mask corresponding to the step portion.
- FIG. 7 is a plan view showing a basic target shape of a step portion 160 to be formed by a lock pattern 760, respectively.
- FIG. 34 is a perspective view for explaining stepwise progress of wet etching when the vibrating body manufacturing method according to the fourth embodiment is performed.
- FIG. 35 is another perspective view for explaining stepwise how wet etching progresses when the method of manufacturing a vibrating body according to the fourth embodiment is performed.
- FIG. 1 systematically shows a retinal scanning display provided with a reflecting mirror section for optical scanning manufactured by the reflecting mirror manufacturing method according to the first embodiment of the present invention.
- This retinal scanning display (hereinafter abbreviated as “RSD”) allows a laser beam to enter a retina 14 via a pupil 12 of an observer's eye 10 while appropriately modulating its wavefront and intensity.
- This is a device that directly projects an image on the retina 14 by two-dimensionally scanning a laser beam on the retina 14.
- the RSD includes a light source unit 20, and a wavefront modulation optical system 22 and a scanning device 24 between the light source unit 20 and the observer's eye 10 in that order.
- the light source unit 20 includes an R laser 30 that emits red laser light in order to combine three laser lights having three primary colors (RGB) into one laser light to generate an arbitrary color laser light, A G laser 32 that emits green laser light and a B laser 34 that emits blue laser light are provided.
- Each of the lasers 30, 32, 34 can be configured as, for example, a semiconductor laser.
- each of the lasers 30, 32, and 34 is collimated by the respective collimating optical systems 40, 42, and 44 so as to be combined, and then, each of the dikes having wavelength dependence is coupled.
- the laser beams are made incident on the mouth mirrors 50, 52, and 54, whereby each laser beam is selectively reflected and transmitted with respect to the wavelength.
- the red laser light emitted from the R laser 30 is collimated by the collimating optical system 40 before being incident on the dichroic mirror 50.
- Exit from G Laser 32 The emitted green laser light is made incident on a dichroic mirror 52 via a collimating optical system 42.
- the blue laser light emitted from the B laser 34 is made incident on the dike opening mirror 54 via the collimating optical system 44.
- the light source unit 20 includes a signal processing circuit 60 mainly composed of a computer.
- the signal processing circuit 60 is designed to perform signal processing for driving each of the lasers 30, 32, and 34 and signal processing for scanning a laser beam based on a video signal to which an external force is also supplied. ing.
- the signal processing circuit 60 In order to drive each of the lasers 30, 32, and 34, the signal processing circuit 60 generates a laser beam for each pixel on an image to be projected on the retina 14 based on an image signal supplied from the outside. Driving signals necessary for realizing necessary colors and intensities are supplied to the respective lasers 30, 32, 34 via the respective laser drivers 70, 72, 74. Signal processing for laser beam scanning will be described later.
- the light source unit 20 described above condenses the laser beam in the coupling optical system 56 and makes it incident on the optical fiber 82.
- the laser beam incident on the optical fiber 82 is transmitted through the optical fiber 82 as an optical transmission medium, and the rear end force of the optical fiber 82 passes through a collimating optical system 84 that collimates the emitted laser beam to produce a wavefront.
- the light enters the modulation optical system 22.
- This wavefront modulation optical system 22 is an optical system that modulates the wavefront curvature of the laser beam emitted from the light source unit 20.
- the wavefront modulating optical system 22 can modulate the wavefront curvature for each pixel of an image to be projected on the retina 14, which is indispensable for implementing the present invention. In other words, it is possible to use a format that is performed for each frame of the image. Modulating the wavefront curvature means changing the perspective of the display image and changing the focus position of the display image.
- the signal input from the signal processing circuit 60 is input.
- the wavefront of the laser beam incident on the wavefront modulation optical system 22 is modulated based on the obtained depth signal.
- a laser beam incident as collimated light from the collimating optical system 84 is converted into convergent light by a converging lens 90, and the converted converged light is reflected by a movable mirror 92 to be diffused light. Is converted to The converted diffused light passes through the converging lens 90 and exits from the wavefront modulation optical system 22 as a laser beam having a target wavefront curvature.
- the wavefront modulating optical system 22 includes a beam splitter 94 for reflecting or transmitting a laser beam incident from the outside, and a convergence for converging a laser beam incident via the beam splitter 94. It has a lens 90 and a movable mirror 92 that reflects the laser beam converged by the converging lens 90.
- the wavefront modulation optical system 22 further includes an actuator 96 for displacing the movable mirror 92 toward or away from the converging lens 90.
- the actuator 96 is a piezoelectric element.
- Actuator 96 modulates the wavefront curvature of the laser beam emitted from wavefront modulating optical system 22 by moving the position of movable mirror 92 in accordance with the depth signal input from signal processing circuit 60.
- the laser beam input from the collimating optical system 84 is reflected by the beam splitter 94, passes through the converging lens 90, and is reflected by the movable mirror 92. I do. Then, the light passes through the converging lens 90 again, and thereafter, passes through the beam splitter 94 and travels to the scanning device 24.
- the scanning device 24 includes a horizontal scanning system 100 and a vertical scanning system 102.
- the horizontal scanning system 100 is an optical system that performs horizontal scanning in which a laser beam runs horizontally for each frame of an image to be displayed.
- the vertical scanning system 102 is an optical system that performs vertical scanning for vertically scanning a laser beam for each frame of an image to be displayed.
- the horizontal scanning system 100 is designed to scan the laser beam faster than the vertical scanning system 102, that is, at a higher frequency.
- the horizontal scanning system 100 includes an optical scanner 104 that oscillates a mirror by vibrating an elastic body having a mirror that performs mechanical deflection.
- the optical scanner 104 is based on the horizontal synchronization signal supplied from the signal processing circuit 60. Controlled.
- FIG. 2 shows the optical scanner 104 in an exploded perspective view. As shown in FIG. 2, the optical scanner 104 has a main body 110 mounted on a base 112.
- the main body 110 is formed using an elastic material such as silicon. As shown in the upper part of FIG. 2, the main body 110 has a thin rectangular shape having a through hole 114 through which light can pass.
- the main body 110 has a fixed frame 116 on the outside, and a vibrating body 124 having a reflection mirror 122 on which a reflection surface 120 is formed on the inside.
- the base 112 includes, as shown in the lower part of FIG. It is configured to have a vibrating body 124 and a concave portion 132 opposed thereto.
- the concave portion 132 is formed to have a shape that does not interfere with the base 112 even when the vibrating body 124 is displaced by vibration when the main body 110 is mounted on the base 112.
- the reflection surface 120 of the reflection mirror section 122 is swung about a swing axis 134 which is also a center line of symmetry thereof.
- the vibrating body 124 further includes a beam portion 140 extending from the reflection mirror portion 122 on the same plane as the reflection mirror portion 122 and joining the reflection mirror portion 122 to the fixed frame 116.
- a pair of beam sections 140 extend from opposite sides of the reflection mirror section 122 in opposite directions.
- Each beam portion 140 includes one mirror-side leaf spring portion 142, a pair of frame-side leaf spring portions 144, and a connection that connects the mirror-side leaf spring portion 142 and the pair of frame-side leaf spring portions 144 to each other.
- Part 146 is configured.
- the mirror-side leaf spring portion 142 is formed on the oscillation axis 134 on the oscillation axis 134 from the pair of edges facing each other in the direction of the oscillation axis 134 of the reflection mirror portion 122 to the corresponding connection portion 146. Extends along.
- the pair of frame-side leaf spring portions 144 extend along the swing axis 134 from the corresponding connection portions 146 in positions that are offset in opposite directions with respect to the swing axis 134.
- each of the pairs of frame-side leaf springs 144, 144 has a power source of 150, 152, 154, 156, respectively. It is mounted in a position that extends over the fixed frame 116.
- each frame-side leaf spring portion 144 has a local portion on the side close to the fixed frame 116.
- the recess 158 is thereby formed.
- a recess 159 that is continuous with the recess 158 is formed in the fixed frame 116.
- Each of the driving sources 150, 152, 154, and 156 has a driving source 154 force as shown in FIG. 3.
- the piezoelectric body 170 (also referred to as a “piezoelectric vibrator” or a “piezoelectric element”!). ⁇ )).
- the piezoelectric body 170 has a thin plate shape and is attached to one surface of the vibrating body 124, and is sandwiched between the upper electrode 172 and the lower electrode 174 in a direction perpendicular to the attachment surface.
- the upper electrode 172 and the lower electrode 174 are respectively connected to a pair of input terminals 178, 178 provided on the fixed frame 116 by respective lead wires (not shown).
- the present invention can be implemented in such a manner that the upper electrode 172 and the lower electrode 174 are respectively connected to external terminals (not shown) by respective lead wires (not shown).
- the drive sources 150, 152, 154, and 156 attached to the four frame-side leaf springs 144, respectively are located on one side with respect to the swing axis 134.
- a pair of drive sources 150 and 152 sandwiching a part of the reflection mirror 122 and a pair of drive sources 154 and 156 located on the other side and sandwiching the reflection mirror unit 122 are respectively two piezoelectric members 170 belonging to each pair. Are bent so that their free ends are displaced in the same direction as each other.
- a pair of drive sources 150 and 154 located on one side of the reflection mirror section 122 and sandwiching the oscillation axis 134, and a pair of drive sources 15 2 located on the other side and sandwiching the oscillation axis 134 And 156 are bent so that the free ends of the two piezoelectric members 170 belonging to each pair are displaced in opposite directions.
- the displacement to be rotated in the direction is the difference between the displacement in one direction of the pair of drive sources 150 and 152 located on one side with respect to the swing axis 134 and the displacement in the opposite direction of the pair of drive sources 154 and 156 located on the opposite side. Generated by both.
- each frame-side leaf spring portion 144 has a function of converting a linear displacement (lateral displacement) of the piezoelectric body 170 attached thereto into a bending motion (longitudinal displacement). This has the function of converting the bending motion of the frame-side leaf spring portion 144 into the rotation motion of the mirror-side leaf spring portion 142.
- the reflecting mirror section 122 is rotated by the rotational movement of the mirror side leaf spring section 142.
- the two driving sources 150 and 152 forming the first pair and the two driving sources 154 and 156 forming the second pair are displaced in opposite directions to each other to form the reflection mirror unit.
- An alternating voltage is applied to the two driving sources 150 and 152 forming the first pair in the same phase in order to generate a reciprocating rotational movement or oscillating movement of the driving source 122 around its driving axis 134.
- the alternating voltage force having the opposite phase is applied to the two driving sources 154 and 156 forming the second pair in the same phase.
- the horizontal scanning system 100 includes the horizontal scanning drive circuit 180 shown in FIG.
- the oscillator 182 generates an alternating voltage signal based on the horizontal synchronization signal input from the signal processing circuit 60.
- the oscillator 182 is connected to a first pair of two driving sources 150 and 152 via a first path via a phase shifter 184 and an amplifier 186, while passing through a phase inverting circuit 188, a phase shifter 190 and an amplifier 192. Via a second path, it is connected to a second pair of two driving sources 154, 156.
- the phase inversion circuit 188 inverts the phase of the alternating voltage signal input from the oscillator 182 and supplies it to the phase shifter 190. Since this phase inverting circuit 188 is provided only in the second path, two driving sources 150 and 152 forming the first pair and two driving sources 154 and 156 forming the second pair have corresponding amplifiers. The phases of the alternating voltage signals supplied from 186 and 192 are opposite to each other.
- phase shifters 184 and 190 are provided with alternating voltages to be supplied to the driving sources 150, 152, 154 and 156 so that the video signal and the vibration of the reflection mirror unit 122 are synchronized with each other. It is provided to change the phase of the signal.
- FIG. 6 is a perspective view showing a specific shape of the vibrating body 124.
- the reflection mirror unit 122 is manufactured so that the projection graphic force obtained by projecting the reflection mirror unit 122 in the normal direction of the reflection surface 120 is generally circular.
- the reflection mirror section 122 is an example of the “reflection mirror” in the above item (18).
- the diameter of the reflection mirror section 122 is 1 mm, the thickness thereof is 100 m, and the length of each beam section 140 is 2 mm. The method of manufacturing the reflection mirror section 122 will be described later in detail.
- FIG. 7 is a perspective view showing how light emitted from the optical fiber 82 enters the optical scanner 104 via the collimating optical system 84.
- the light emitted from the collimating optical system 84 is incident on the reflecting surface 120 of a generally circular reflecting mirror unit 122, and the reflecting mirror unit 122 is caused to swing around the swing axis 134, so that the light is reflected from the reflecting surface 120. Is scanned in the horizontal direction.
- FIG. 8 is a perspective view showing how light emitted from the optical fiber 82 enters the conventional optical scanner 300 via the collimating optical system 84.
- the reflection mirror section 302 has a rectangular shape.
- the reflection mirror section 302 and the reflection mirror section 122 in the present embodiment are common to each other with respect to the specific gravity, thickness, and maximum width dimension of the material, and compared with each other in terms of weight, the present embodiment Since the reflection mirror portion 122 of the present embodiment is lighter, the reflection mirror portion 122 of the present embodiment is smaller when compared with each other with respect to the moments of inertia around the oscillation axes 134 and 304.
- both the reflecting mirror unit 122 of the present embodiment and the conventional reflecting mirror unit 302 are When light is scanned using its own resonance, the reflection mirror unit 122 in the present embodiment is higher than the conventional reflection mirror unit 302 in increasing the resonance frequency and increasing the light scanning frequency. Suitable.
- the laser beam horizontally scanned by the optical scanner 104 described above is transmitted to the vertical scanning system 102 by the relay optical system 194, as shown in FIG.
- This RSD has a beam detector 200 at a fixed position.
- the beam detector 200 is provided to detect the position of the laser beam in the main scanning direction (horizontal scanning direction) by detecting the laser beam deflected by the optical scanner 104.
- One example of a beam detector 200 is a photodiode.
- the beam detector 200 outputs a signal indicating that the laser beam has reached a predetermined position as a BD signal, and the output BD signal is supplied to the signal processing circuit 60.
- the signal processing circuit 60 waits for a set time from the time when the beam detector 200 detects the laser beam, and outputs a necessary drive signal to each laser driver 70. , 72, 74.
- the image display start timing is determined for each scanning line, and the image display is started at the determined image display start timing. Therefore, synchronization between the image signal and the laser beam scanning position is ensured.
- the vertical scanning system 102 includes the galvano mirror 210 as an oscillating mirror that performs mechanical deflection.
- the laser beam emitted from the horizontal scanning system 100 is condensed by the relay optical system 194 and enters the galvanometer mirror 210.
- the galvanomirror 210 is swung around a rotation axis that intersects the optical axis of the laser beam incident on the galvanomirror.
- the starting timing and the rotation speed of the galvanometer mirror 210 are controlled based on a vertical synchronization signal supplied from the signal processing circuit 60.
- the vertical scanning system 102 is mainly configured with the galvanometer mirror 210, but can be configured in another format.
- the laser beam is two-dimensionally scanned, and the image power relay represented by the scanned laser beam is relayed.
- the light is emitted to the observer's eye 10 via the optical system 214.
- step S1 a plate-like material (silicon wafer) made of silicon single crystal is so etched as to have a thickness of 100 m. Prepared for use as (11).
- step S2 both surfaces of the material 400 to be etched are coated with an etching mask material 410 (see FIG. 11).
- the etching mask material 410 is, for example, a silicon oxide film formed on both surfaces of the material to be etched 400 by heating the material to be etched 400. That is, step S2 is a coating process.
- step S3 a predetermined mask pattern is formed by lithography on etching mask material 410 coated on both surfaces of material 400 to be etched.
- the shape of the mask pattern formed on each etching mask material 410 is such that when the material to be etched 400 is immersed in an etching bath (not shown), the etching solution is firstly brought into contact with the etching bath and then etched. Determine the shape of the part to be cut. That is, this step S3 is a mask pattern forming step.
- FIG. 10 is a plan view showing an example of the mask pattern.
- FIG. 13 shows one of the four regions as a representative.
- the mask pattern is parallel to the swing axis 134 (this is an example of “one reference line” in the above item (23)). It has a side and a second side orthogonal to the swing axis 134.
- This mask pattern is positioned with respect to the material to be etched 400 such that the first side and the second side are orthogonal to the crystal direction in the (100) crystal plane of the material to be etched 400 shown in FIG.
- the first side has a second portion 422 (extending horizontally in FIG. 10) parallel to the swing axis 134 among a plurality of second portions 422 described later. 2nd part 4 22), while the second side corresponds to a second portion 422 (the second portion 422 extending vertically in FIG. 10) of the plurality of second portions 422 that is orthogonal to the swing axis 134.
- the material 400 to be etched is placed on two center lines of symmetry orthogonal to each other at the center point PC of the mask pattern (the swing axis 134 and the center point PC). It is divided into four regions I, II, III and IV by a straight line perpendicular to the oscillation axis 134).
- the mask patterns are opposed to each other on both sides of the mask pattern in the direction of the swing axis 134, and respectively, as shown in FIG. It has an extension 431 that extends outward along the dynamic axis 134.
- the extension portion 431 is provided in a mask pattern for manufacturing the beam portion 140 shown in FIG. 4 together with the reflection mirror portion 122 by wet etching.
- the orientation of each region and the X yz coordinates assigned to the material 400 to be etched to define a plurality of crystal planes of the material 400 to be etched composed of a single crystal Explaining the relationship with the orientation of the system, the central angle of each region (in the example of FIG. 13, the four corners of the square indicated by the region and located at the top in FIG. 13)
- the direction of each region and the direction of the xyz coordinate system are determined so that the bisector and the X axis coincide with each other.
- the material 400 to be etched is divided into four equal parts so that the normal force to the (100) plane in each area coincides with the bisector of the central angle of each area.
- FIG. 10 shows an etching mask material 410 separated from the xyz coordinate system force-etched material 400 described above.
- the mask pattern is divided into four equal parts along its surface around one center point PC of the surface, thereby forming four regions I, II, III and IV. Forces where xyz coordinate system is assigned to each region In FIG. 10, this is typically shown only for region I! /.
- the mask pattern has a convex octagon.
- the outline of the mask pattern includes, for each region, a first portion 420 corresponding to the (100) crystal plane of the material 400 to be etched, and a (111) crystal plane (a narrowly defined (111) crystal plane). And a second portion 422 corresponding to the same.
- the second part 422 is present on each side of the first part 420.
- the mask pattern having the shape described above is formed on both surfaces of the material 400 to be etched so as not to be shifted from each other.
- step S4 the laminate of the material to be etched 400 and the etching mask material 410 is immersed in an etching bath containing an etching solution.
- the kind of the etching solution is selected as potassium hydroxide solution (KOH), the concentration is selected as 40 wt%, and the temperature is selected as 70 ° C.
- KOH potassium hydroxide solution
- the concentration is selected as 40 wt%
- the temperature is selected as 70 ° C.
- wet etching is performed on the material 400 to be etched. That is, step S4 is a wet etching process.
- TMAH hydroxyl-tetramethylammonium solution
- FIGS. 11 (a) and (b) and FIGS. 12 (a) and (b) show steps in which the material 400 to be etched is wet-etched. However, in these figures, attention is paid to the 400 materials to be etched and their symmetry, and only one of the four regions I, II, III and IV is representatively shown.
- the wet etching force of the material to be etched 400 is started from a portion that is not coated with the etching mask material 410. At this stage, only the (100) crystal plane and the (111) crystal plane appear in the material 400 to be etched.
- each of the corners belonging to the octagon shown by the etching mask material 410 at the stage shown in FIG. 11A (hereinafter, referred to as “original corners”) has a plurality of separate portions.
- the crystal plane of the crystal begins to be exposed, thereby rounding off the original corners.
- FIG. 12 (a) when the stepping force slightly progresses as shown in FIG. 11 (b), as shown in FIG. A plurality of crystal planes exposed at the stage shown in FIG. 11 (b) grow in the area shown in FIG. 11B, and further another crystal plane starts to be exposed, whereby each original corner is further rounded.
- FIG. 12 (b) when the stepping force slightly progresses as shown in FIG. 12 (a), as shown in FIG. Part of At the stage shown in FIG. 12 (a), a plurality of exposed crystal faces grow, and further another crystal face starts to be exposed, whereby each original corner is further rounded.
- the stage shown in FIG. 12B is the end stage of the wet etching, and the material 400 to be etched is penetrated in the thickness direction by the etching solution.
- FIG. 12B shows the final shape of the material 400 to be etched, together with the matas pattern.
- FIG. 13 shows an enlarged view of the material to be etched 400 shown in FIG. 12 (b).
- the (211) crystal plane, the (311) crystal plane, the (411) crystal plane, and the (511) crystal plane are interposed between the (100) crystal plane and the (111) crystal plane.
- a plurality of other crystal planes including a plane are exposed.
- the (211) crystal plane, the (311) crystal plane, the (411) crystal plane, and the (511) crystal plane are the same as the (111) crystal plane, respectively. It is defined to include the plane and its equivalent crystal plane.
- the etching mask material 410 has a (nil) crystal plane (n: 2 or more) between the first portion 420 and the second portion 422. (Integer).
- the reflection mirror section 122 completed by the wet etching described above has a generally convex octagon when projected in the normal direction, and is more precisely an m-sided polygon (m: larger than 16). Integer).
- FIG. 14A is a longitudinal sectional view of the completed reflection mirror section 122, which is cut along a plane passing through the (100) crystal plane.
- FIG. 7B is a longitudinal sectional view of the completed reflection mirror unit 122 when cut along a plane passing through the (111) crystal plane.
- FIG. 14 (c) shows, as a comparative example of the material 400 to be etched, a reflection mirror portion 122 'obtained when only one surface of the material 400' to be etched is wet-etched, and the (111) crystal surface Is shown in a vertical cross-sectional view cut by a plane passing through.
- the side surface thereof is symmetrical with respect to the center line in the thickness direction of the material 400 to be etched. A discontinuous slope is formed. Therefore, according to the present embodiment, it is easier to manufacture the reflecting mirror portion 122 which is lighter and has a smaller moment of inertia than the comparative example described above.
- the shape of the reflection mirror unit 122 is made circular rather than the hexagonal shape that is the shape of the reflection mirror unit 122 when the number of types of the intervening crystal plane is one.
- both the (100) crystal plane and the (111) crystal plane are eroded by wet etching, and the respective length dimensions are reduced from the initial values.
- the decrease is replaced by another crystal plane having an oblique direction with respect to both the (100) crystal plane and the (111) crystal plane.
- the length of each of the plurality of crystal planes constituting the outer peripheral surface of the reflection mirror unit 122 is reduced and equalized, which also allows the reflection mirror
- the shape of the part 122 is circularized. Assuming that the number of straight line segments (corresponding to each crystal plane) constituting the outline of the projected figure of the reflecting mirror unit 122 is constant, the length of the longest straight line segment among the straight line segments The shorter the is, the more the outline tends to approach the circle.
- FIG. 15 shows another example of the mask pattern.
- the first portion 430 corresponding to the (100) crystal plane
- the second portion 432 corresponding to the (111) crystal plane
- (ni l) It has a third portion 434 corresponding to the crystal plane (n: an integer of 2 or more).
- step S5 the material to be etched 400 having both surfaces coated with the etching mask material 410 is taken out of the etching bath.
- step S6 the etching mask material 410 is peeled off from both surfaces of the material 400 to be etched.
- step S7 a reflection film is formed on at least one of both surfaces of the material 400 to be etched, using aluminum or silver as a material.
- the mask pattern is formed by the swing axis 134 (this is an example of the “one reference line” in the above item (23)). ) And a second side orthogonal to the swing axis 134.
- This mask pattern is positioned with respect to the material to be etched 480 such that the first side and the second side are orthogonal to the ⁇ 110> crystal direction on the (100) crystal plane of the material to be etched 480 shown in FIG. You.
- the first side is a second portion 472 (a second portion 472 extending horizontally in FIG. 16) parallel to the swing axis 134 among a plurality of second portions 472 described later.
- the second side corresponds to a second portion 472 (a second portion 472 extending vertically in FIG. 16) of the plurality of second portions 472 that is orthogonal to the swing axis 134.
- the material to be etched 480 is placed at two center lines (a swing axis 134 and a center point PC) orthogonal to each other at the center point PC of the mask pattern.
- the region is divided into four regions I, II, III and IV by a straight line perpendicular to the oscillation axis 134).
- the mask patterns are opposed to each other on both sides thereof in the direction of the swing axis 134, as shown in FIG.
- Each has an extension 431 that extends outward along the swing axis 134.
- the mask pattern has a generally convex octagon, and the outline of the mask pattern corresponds to the first portion 470 corresponding to the (100) crystal plane. And a second portion 472 corresponding to the (111) crystal plane. Further, in the present embodiment, similarly to the second portion 472, the fourth portion 474 is symmetrically disposed on both sides of the first portion 470.
- the plane shape of the mask pattern is based on a convex octagon as a basic shape, and protrudes at eight corners of the octagon.
- the shape has a fourth portion 474 as a portion.
- the fourth portion 474 has a shape extending from each corner of the regular octagon to a region corresponding to the outer corner of each corner.
- the fourth portion 474 is determined by the timing at which a corner that should be formed by the first portion 470 and the second portion 472 is eroded by wet etching due to the absence of the fourth portion 474. Performs the function of delaying. With this function, the surface configuration of the outer peripheral surface of the reflection mirror unit 122 can be simpler than that of the first embodiment.
- the etching mask material 490 is coated on both surfaces of the material to be etched 480, and the two coated etching mask materials 490 are respectively coated with the above-described etching mask material 490.
- a mask pattern having a shape is formed.
- wet etching is performed on the material to be etched 480 to which the mask pattern is assigned.
- FIGS. 17 (a) and (b) and FIGS. 18 (a) and (b) show steps in which the material to be etched 480 is subjected to wet etching.
- FIG. 17A the wet etching of the material to be etched 480 is started from a portion not coated with the etching mask material 490.
- the (100) crystal plane and the (111) crystal plane mainly appear in the material to be etched 480. Further, in the material to be etched 480, another crystal plane appears between the (100) crystal plane and the (111) crystal plane.
- the portion of the material to be etched 480 where the other crystal plane appears forms a projection 492 projecting from the (100) crystal plane and the (111) crystal plane.
- the protruding portion 492 is a portion formed as a result of the erosion being delayed from the peripheral portion by the fourth portion 474 of the mask pattern.
- the material to be etched 480 has a gap between the (100) crystal plane and the (111) crystal plane.
- a (520) crystal plane grows, and the (100) crystal plane and the (111) crystal plane are connected to each other by a slope by the (520) crystal plane.
- the stage shown in FIG. 18B is the end stage of the wet etching, in which the material to be etched 480 is penetrated in the thickness direction by the etchant.
- FIG. 18B shows the final shape force of the material to be etched 480 together with the first portion 470 of the matas pattern.
- FIG. 19 shows an enlarged view of the material to be etched 480 shown in FIG. 18B.
- the wet etching of the material to be etched 480 is completed, only the (520) crystal plane is exposed between the (100) crystal plane and the (111) crystal plane.
- (100) The crystal plane and the (111) crystal plane are connected to each other by a simpler plane configuration than in the first embodiment.
- FIG. 20 (a) shows a perspective view of the completed reflection mirror section 122
- FIG. 20 (b) shows a plan view.
- the reflecting mirror portion 122 When the reflecting mirror portion 122 is projected in the normal direction, the reflecting mirror portion 122 generally has a convex octagon, more precisely, has a hexagonal shape, and more precisely, has a shape close to a hexagonal shape. Has formed.
- the (520) crystal plane is mainly interposed between the (100) crystal plane and the (111) crystal plane of the outer peripheral surface force of the reflection mirror unit 122.
- Wet etching is performed so that there is mainly one kind of intervening crystal plane, and the number of kinds of intervening crystal planes does not change. Therefore, according to the present embodiment, the shape of the outer peripheral surface of the reflection mirror unit 122 is stabilized, and as a result, the moment of inertia of the reflection mirror unit 122 is also stabilized.
- FIG. 21 shows another example of the mask pattern.
- the first part 500 corresponding to the (100) crystal plane
- the second part 502 corresponding to the (111) crystal plane
- the fourth part With part 504 and Yes is another example of the mask pattern.
- the present embodiment is different from the first or second embodiment only in the part of the method of manufacturing the main body 110 where the spring 140 having the step is manufactured by wet etching. About is common. Therefore, among the plurality of elements in the present embodiment, elements common to the first or second embodiment will be referred to using the same reference numerals or names, and duplicate descriptions will be omitted. Only will be described in detail.
- the RSD according to the present embodiment is structurally the same as the RSD according to the first embodiment shown in Fig. 1. However, the present embodiment can be changed so that the wavefront modulation optical system 22 is omitted, and the same is true for the first embodiment.
- the main body 110 of the RSD according to the present embodiment is the same as the main body 110 of the RSD according to the first embodiment shown in FIGS. 2 to 4, and includes a vibrating body 124 and a fixed frame 116. Are integrally formed. As shown in FIG. 2, the vibrating body 124 has a reflecting mirror portion 122 having a reflecting surface 120 and a pair of beam portions 140, 140 facing each other with the reflecting mirror portion 122 interposed therebetween. It is configured.
- each beam portion 140 of the vibrating body 124 includes one mirror-side leaf spring portion 142, a pair of frame-side leaf spring portions 144, 144, as in the first embodiment.
- the mirror side plate spring 142 and a pair of frame side plate springs 144, 144 are configured to include a connecting portion 146 for connecting the mirror side plate springs 144 to each other. That is, in the present embodiment, each beam portion 140 constitutes an example of the “beam structure” in the above item (18), and the “beam structure” according to the above items (27) and (28). It constitutes an example of the "body”.
- each of the pairs 140 /! Has a horsepower 150, 152, 154, and 156 forces. It is mounted in a position that extends over the fixed frame 116.
- each frame-side leaf spring portion 144 is locally thin-plated on the side near the fixed frame 116, thereby forming a concave portion 158.
- a recess 159 that is continuous with the recess 158 is formed in the fixed frame 116.
- concave portions 158 are formed in one side portion, that is, the upper surface portion of each frame side leaf spring portion 144 of beam portion 140.
- each frame-side leaf spring portion 144 has a step portion 160.
- the step portion 160 includes (a) a high portion 162 having the same height as the basic surface of the beam portion 140, that is, the original upper surface, and (b) a higher portion than the original upper surface.
- Each frame-side leaf spring portion 144 is formed so as to have a lower portion 164 and (a) a shoulder portion 166 traversing the beam portion 140 at the boundary between the higher portion 162 and the lower portion 164.
- the concave portion 158 is formed by the lower portion 164 and the shoulder portion 166.
- each of the drive sources 150, 152, 154, and 156 is in a state where it does not exceed a plane having the same height as the basic surface of the frame-side leaf spring portion 144 corresponding to the upper surface force.
- the corresponding concave portion 158 that is, in the corresponding step portion 160.
- each of the horse-power sources 150, 152, 154, and 156 is formed as a laminated body sandwiched by a thin plate-shaped piezoelectric member 170, an upper electrode 172, and a lower electrode 174. ing.
- Each drive source 150, 152, 154, 156 is mounted on the surface of the recess 158, 159 on the lower surface, while the height of the surface of the high portion 162 on the upper surface, as shown in a side view in FIG. It has a thickness dimension not exceeding. That is, in the present embodiment, each of the driving sources 150, 152, 154, and 156 constitutes an example of the “laminated portion” in the above item (31).
- the horizontal scanning drive circuit 180 in the RSD according to the present embodiment has the same configuration and operation as the horizontal scanning drive circuit 180 in the RSD according to the first embodiment, which is shown in FIG.
- Each frame-side leaf spring portion 144 of the vibrating body 124 is formed integrally with the reflection mirror portion 122 so as to have a step portion 160 for forming the concave portion 158.
- the height of the step portion 160 that is, the distance between the high portion 162 and the low portion 164 in the thickness direction of each frame-side leaf spring portion 144 is 50 m, and The dimensions of the recess 158 are lmm.
- FIG. 22 is a process chart showing a vibrating body manufacturing method for integrally and collectively manufacturing the main body 110 including the fixed frame 116 and the vibrating body 124 by wet etching.
- step S11 a plate-shaped material made of silicon single crystal is prepared as a material to be etched.
- the material to be etched is denoted by reference numeral 600.
- the material 600 to be etched has a thickness of 100 / zm and is made of silicon wafer.
- a (100) crystal plane is exposed from the beginning.
- FIG. 23 is a diagram illustrating a method of manufacturing the main body 110.
- lines A--A and B-- in FIG. It is shown in a sectional view with respect to line B.
- the line A-A is a cutting line passing through the center of the reflecting mirror section 122 and crossing the main body 110, while the line B-B passes through the center in the longitudinal direction of the concave portion 158 and the main body 110 Is a cutting line that crosses
- step S12 as shown in FIG. 23 (a), two etching mask materials 610 and 612 are coated on both surfaces of the material 600 to be etched.
- These etching mask materials 610 and 612 are silicon thermal oxide films formed on both surfaces of the material 600 to be etched by heating both surfaces of the material 600 to be etched. That is, this step S12 constitutes an example of the “coating step” in the above item (18).
- step S13 lithography is performed on the two etching mask materials 610 and 612 respectively coated on both surfaces of the material 600 to be etched.
- a resist is applied to the surface of each of the etching mask materials 610 and 612, and then the applied resist is exposed with respective pattern lights.
- each resist is selectively removed in a position-selective manner using a necessary chemical under each exposure pattern.
- the resist 620 having the upper mask pattern adheres to the surface of the upper etching mask material 610, while the lower etching mask material 612 is attached.
- a resist 622 having a lower mask pattern adheres to the surface of the substrate.
- a necessary chemical solution for example, hydrofluoric acid
- the upper etching mask material 610 has an upper mask pattern 630 shown in a plan view in FIG. 24A
- the lower etching mask material 612 has a lower mask pattern 632 shown in a plan view in FIG. Are respectively formed.
- each of the upper mask pattern 630 and the lower mask pattern 632 is shown only for a portion related to the manufacture of the vibrating body 124, and is related to the manufacture of the fixed frame 116. Parts have been omitted because they are not essential for understanding the present invention.
- a portion surrounded by a dashed circle is a portion 650 of the upper surface portion of each frame side leaf spring portion 144 related to the production of the step portion 160. is there.
- the portion surrounded by a broken line circle is located on the opposite side of the lower surface portion of each frame side leaf spring portion 144 from the step portion 160. This is the part 652 related to the production of the part to be performed.
- each of the mask patterns 630 and 632 is such that when the material to be etched 600 is immersed in an etching bath (not shown), the etching solution contained in the etching bath comes into contact first and is etched. Determine the shape of the part to be cut. That is, this step S13 constitutes an example of the “mask pattern forming step” in the above item (18).
- the portion 652 forms a simple belt shape substantially the same as the basic target shape (final production shape) of the frame-side leaf spring portion 144, and the portion 652 and the lower mask pattern are formed.
- the portion 650 of the 632 extends straight between the portion 654 corresponding to the fixed frame 116, while the portion 650 has a complicated shape.
- FIG. 25 shows the material to be etched 600 and the frame-side leaf spring portion 144 in a simplified manner for the purpose of easily describing their shapes. More realistic shapes of the material 600 to be etched and the frame-side leaf spring portion 144 are shown in FIGS. 27 to 29.
- FIG. 25 (a) shows one frame-side leaf spring portion 144 (hereinafter referred to as “representative frame-side leaf spring portion”) of the upper mask pattern 630, which represents a plurality of frame-side leaf spring portions 144 for convenience of explanation. )) Are shown in perspective view.
- FIG. 25 (b) shows a perspective view of a portion of the material to be etched 600 where the representative frame-side leaf spring portion 144 is formed and its peripheral portion.
- FIG. 25 (c) shows a perspective view of a basic target shape (final production shape) of the representative frame side leaf spring portion 144.
- the material to be etched 600 will be described in more detail with reference to FIG. 25 (b).
- the material to be etched 600 is immersed in the etching solution among the material to be etched 600. It is provided with a planned remaining portion 700 that remains without being eroded despite performing wet etching.
- the expected remaining portion 700 has the same shape as the high portion 162 of the basic target shape shown in FIG. 25 (c). The expected remaining portion 700 is indicated by a broken line in FIG. 25 (b).
- the material to be etched 600 further includes a penetrating portion 702 that is eroded by wet etching until it penetrates in the thickness direction of the material to be etched 600.
- the planned penetrating portion 702 includes the material to be etched 600 and the same shaped portion of the material to be etched 600 having the same shape as the basic target shape of the representative frame-side leaf spring portion 144. When the projection is performed in the thickness direction, this is a portion excluding the projection of the same shape portion in the projection of the material 600 to be etched.
- the material to be etched 600 further has a semi-eroded portion 704 to be eroded halfway in the thickness direction of the material to be etched 600 by wet etching.
- the planned semi-eroded portion 704 has the same shape as the recess 158 shown in FIG. This planned semi-eroded portion 704 is shown by a two-dot chain line in FIG. 25 (b).
- the portion 650 of the upper mask pattern 630 (hereinafter, referred to as “step portion corresponding mask pattern 650”) is the surface of the scheduled remaining portion 700 before the start of wet etching. Includes basic pattern 710 covering (top).
- the step portion corresponding mask pattern 650 further includes a compensation pattern 712 covering the surface (upper surface) of both side portions 706 before the start of wet etching.
- the compensation pattern 712 is configured as a pair of overhanging portions 714, 714 that extend in the length direction of the semi-eroded portion 704 so as to overhang both sides in the width direction thereof.
- Fig. 26 shows the basic target shape of the high portion 162 of the step portion 160 of the representative frame-side leaf spring portion 144 and the shape and force of the mask pattern 650 corresponding to the step portion, for comparison. Are shown side by side in a plan view.
- the step portion corresponding mask pattern 650 includes a basic pattern 710 having the same shape as the surface shape of the high portion 162.
- the step portion corresponding mask pattern 650 further includes, as a compensation pattern 712, a pair of projecting portions 714, 714 projecting from the basic pattern 710 on both sides in the width direction. As shown in FIG.
- the mask pattern 650 corresponding to the step portion is connected to the basic pattern 710 at one end of the pair of overhang portions 714 and 714 and is closed, while being opened at the other end to form a basic pattern. Together with the portion of the pattern 710 that is coupled to the compensation pattern 712, it forms a generally U-shape.
- step S14 the laminate of the material to be etched 600 and the etching mask materials 610 and 612 is immersed in an etching tank containing a liquid etching solution.
- the type of the etching solution is selected as potassium hydroxide solution (KOH)
- the concentration is selected as 40 wt%
- the temperature is selected as 70 ° C.
- wet etching is performed on the material 600 to be etched. That is, step S14 constitutes an example of the “wet etching step” in the above item (18).
- step S14 when the material 600 to be etched has penetrated in the planned penetrating portion 702, one wet etching is completed.
- the material 600 to be etched is immersed in the etching solution only once for one wet etching. That is, in the present embodiment, the material 600 to be etched is immersed only once instead of being immersed in the etching solution in a plurality of times for one wet etching. This is because the main body 110 is manufactured together (at one time) by wet etching of the material 600 to be etched!
- FIGS. 27 (a) and (b) and FIGS. 28 (a) and (b) show, in a stepwise manner, how wet etching proceeds in the material 600 to be etched.
- FIGS. 27 (a) and (b) and FIGS. 28 (a) and (b) show, in a stepwise manner, how wet etching proceeds in the material 600 to be etched.
- FIGS. 27 (a) and (b) and FIGS. 28 (a) and (b) show, in a stepwise manner, how wet etching proceeds in the material 600 to be etched.
- the representative frame side leaf spring portion 144 typically shows a state in which the erosion of the material to be etched 600 progresses from the upper surface to the lower surface.
- the process is started from a portion of the material to be etched 600 that is not covered by the wet etching force etching mask material 610.
- the (100) crystal plane and the (111) crystal plane begin to appear on the material to be etched 600 by the mask pattern 650 corresponding to the step portion.
- FIG. 29 (a) shows a plan view of step portion 160 formed by the wet etching
- FIG. 29 (b) shows a perspective view.
- a (111) crystal plane appears at the shoulder 166.
- the (111) crystal plane is a crystal plane that is eroded more slowly than other crystal planes during wet etching.
- the compensation pattern 712 is a pair of overhang portions 714, 714 as shown in FIG.
- the distal end has a rectangular portion extending at right angles to the length direction of each overhang portion 714, and each corner of the rectangular portion has a shape as close as possible to a right angle.
- straight portions 720, 720 orthogonal to the length direction of the overhang portions 714, 714 are formed at the respective tips of the pair of overhang portions 714, 714.
- Each straight portion 720, 720 is an example of a straight portion orthogonal to the crystal direction of the material to be etched 600, and the presence of each straight portion 720, 720 causes the (111) crystal face to be formed on the shoulder portion 166 by wet etching. Appears. That is, in the present embodiment, the linear portions 720, 720 located at the tips of the overhang portions 714, 714 constitute an example of the “linear portion” in the above item (23).
- the shape of the compensation pattern 712 has a pair of overhanging portions 714, 714 such that a (111) crystal plane appears at the shoulder 166 when the wet etching is completed. Is set in advance!
- step S15 the material to be etched 600 having both surfaces coated with the etching mask material 610 is removed from the etching bath.
- step S16 the etching mask material 610 is peeled off from both surfaces of the material 600 to be etched.
- FIGS. 30 and 31 show steps in which the step portion 160 is manufactured by the manufacturing method as a comparative example of the present embodiment in a stepwise perspective view, similarly to FIGS. 27 and 28. It has been.
- the mask pattern strength corresponding to the step portion is used as having the same shape as the basic pattern 710.
- a pair of overhanging portions 714, 714 cooperate with each other to form an example of the "first etching compensator" in the above items (21) and (22). That is,
- both surfaces of the etching mask material 610 are coated with the upper etching mask material 730 and the lower etching mask material 732. You.
- FIG. 32A shows the upper mask pattern 740 formed on the upper etching mask material 730. Only those parts relevant to the production of the force oscillator 124 are shown in plan view.
- FIG. 32 (b) shows that the lower mask pattern 742 formed on the lower etching mask material 732 includes a portion related to the production of the vibrator 124 and a portion of the fixed frame 116 connected to the vibrator 124. Only parts related to the work are shown in plan view.
- a portion surrounded by a broken line circle is a portion 760 of the upper surface portion of each frame side leaf spring portion 144 related to the production of the step portion 160. is there.
- the portion surrounded by a broken line circle is located on the opposite side of the lower surface of each frame side leaf spring portion 144 from the step portion 160. This is the part 762 related to the production of the part to be performed.
- the shape of the lower mask pattern 742 is the same as the shape of the lower mask pattern 632 in the third embodiment, while the shape of the upper mask pattern 740 is the shape in the third embodiment. This is different from the upper mask pattern 630. Accordingly, hereinafter, only the shape of the upper mask pattern 740 will be described in detail, and the description of the shape of the lower mask pattern 742 will be omitted.
- FIG. 33 shows the basic target shape of the high portion 162 of the step portion 160 of one frame side leaf spring portion 144 representing the plurality of frame side leaf spring portions 144, and the upper mask pattern 740.
- the portion 760 corresponding to the step portion 160 (hereinafter, referred to as “step portion corresponding mask pattern 760”) is shown in a plan view together for shape and force comparison.
- the step portion corresponding mask pattern 760 includes a basic pattern 770 having the same shape as the surface shape of the high portion 162.
- the mask pattern 760 corresponding to the step portion further covers the surface of the planned semi-eroded portion 704 (see FIG. 25) and the surfaces of both side portions 706, 706 (see FIG. 25), and in particular, the planned semi-eroded portion 704.
- the compensation pattern 772 has a rhombic shape having four corners and four sides in cooperation with a portion of the basic pattern 770 coupled to the compensation pattern 772. ing. Each side of the compensating pattern 772 is perpendicular to the crystal direction, and at least one of two opposing corners of the four corners of the compensating pattern 772 corresponds to the basic pattern 770. While being joined, it is cut away at the other opposing corner.
- the compensation pattern 772 includes a pair of first etching compensation portions 780 and 780 covering the surfaces of both side portions 706 and 706 (see FIG. 25), and a predetermined semi-eroded portion 704 (see FIG.
- the first etching compensator 780, 780 and the second etching compensator 782 cooperate to reduce the speed at which the wet etching progresses in the planned semi-eroded portion 704, and as a result, the wet etching becomes the planned remaining portion. Do not reach 700.
- FIGS. 34 (a) and (b) and FIGS. 35 (a) and (b) show a stepwise progress of wet etching in the material 600 to be etched.
- FIGS. 34 (a) and (b) and FIGS. 35 (a) and (b) show a stepwise progress of wet etching in the material 600 to be etched.
- FIGS. 34 (a) and (b) and FIGS. 35 (a) and (b) show a stepwise progress of wet etching in the material 600 to be etched.
- the representative frame side leaf spring portion 144 typically shows a state in which the erosion of the material to be etched 600 progresses from the upper surface to the lower surface.
- the process is started from a portion of the material to be etched 600 that is not covered with the wet etching force etching mask material 610.
- a (100) crystal plane starts to appear on the material to be etched 600 by the mask pattern 760 corresponding to the step portion.
- step force shown in FIG. 34 (b) also slightly progresses in the wet etching, as shown in FIG. 35 (a), the partial force covered by the compensation pattern 772 in the material 600 to be etched and the compensation pattern 772 Is removed leaving only the rear end. At this stage, the (100) crystal plane still exists.
- the position of shoulder 166 in the length direction of representative frame side leaf spring 144 does not need to change so sensitively.
- the position and the wet etching conditions of the shoulder 166 in the length direction are stabilized and the accuracy is improved despite the fluctuation.
- the compensation pattern 772 is
- An example of the “compensation pattern” in the item (25) is constituted, and a pair of the first etching compensating portions 780 and 780 in the compensation pattern 772 are the same as the items (21), (23) and (25).
- the second etching compensator 782 constitutes an example of the “second etching compensator” in the above items (24) and (25). It is an example.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/605,961 US7582219B1 (en) | 2004-06-04 | 2006-11-30 | Method of fabricating reflective mirror by wet-etch using improved mask pattern and reflective mirror fabricated using the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2004-166511 | 2004-06-04 | ||
JP2004166511A JP4645067B2 (ja) | 2004-06-04 | 2004-06-04 | 反射ミラー製作方法 |
JP2004-321632 | 2004-11-05 | ||
JP2004321632A JP2006130598A (ja) | 2004-11-05 | 2004-11-05 | はり構造体製作方法およびはり構造体 |
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US11/605,961 Continuation US7582219B1 (en) | 2004-06-04 | 2006-11-30 | Method of fabricating reflective mirror by wet-etch using improved mask pattern and reflective mirror fabricated using the same |
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WO2005119309A1 true WO2005119309A1 (ja) | 2005-12-15 |
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PCT/JP2005/010027 WO2005119309A1 (ja) | 2004-06-04 | 2005-06-01 | 反射ミラー製作方法および反射ミラー |
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WO (1) | WO2005119309A1 (ja) |
Cited By (1)
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JP2010102147A (ja) * | 2008-10-24 | 2010-05-06 | Seiko Epson Corp | 光学デバイス、光スキャナ及び画像形成装置 |
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JP5842356B2 (ja) | 2011-03-24 | 2016-01-13 | セイコーエプソン株式会社 | アクチュエーター、光スキャナーおよび画像形成装置 |
JP5842369B2 (ja) | 2011-04-11 | 2016-01-13 | セイコーエプソン株式会社 | アクチュエーターの製造方法、光スキャナーの製造方法および画像形成装置の製造方法、アクチュエーター、光スキャナーおよび画像形成装置 |
EP2737357A4 (en) * | 2011-07-29 | 2015-04-22 | Cambridge Technology Inc | SYSTEMS AND METHODS FOR PROVIDING MIRRORS WITH HIGH RIGIDITY AND LOW INERTIA INVOLVING CHEMICAL ENGRAVING |
US9689795B2 (en) * | 2015-03-25 | 2017-06-27 | General Electric Company | Methods and systems to analyze a gas-mixture |
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US20090223924A1 (en) | 2009-09-10 |
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