WO2005109448A1 - Dispositif conducteur isole de connexion electrique anisotropique et procede de preparation et produits comprenant celui-ci - Google Patents

Dispositif conducteur isole de connexion electrique anisotropique et procede de preparation et produits comprenant celui-ci Download PDF

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Publication number
WO2005109448A1
WO2005109448A1 PCT/KR2005/001367 KR2005001367W WO2005109448A1 WO 2005109448 A1 WO2005109448 A1 WO 2005109448A1 KR 2005001367 W KR2005001367 W KR 2005001367W WO 2005109448 A1 WO2005109448 A1 WO 2005109448A1
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WO
WIPO (PCT)
Prior art keywords
insulating resin
conductive
particle
insulation
insulated conductive
Prior art date
Application number
PCT/KR2005/001367
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English (en)
Inventor
Sang Hun Lee
Kee Ho Chang
Jeong Deok Seo
Original Assignee
Microglobe Corp Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microglobe Corp Co., Ltd. filed Critical Microglobe Corp Co., Ltd.
Priority to JP2007513062A priority Critical patent/JP2007537572A/ja
Publication of WO2005109448A1 publication Critical patent/WO2005109448A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
    • B62J6/06—Arrangement of lighting dynamos or drives therefor
    • B62J6/12—Dynamos arranged in the wheel hub
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
    • B62J6/02—Headlights
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
    • B62J6/04—Rear lights
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Definitions

  • the present invention relates to insulated conductive ball for anisotropic electric connection, and its method of preparation and products using the same.
  • the present invention relates to formation methods of insulation layer of a uniform and sufficient thickness avoiding aggregation of the particles, which is a major cause for connection failure, and the formation of insulation layer which is stable enough to resist undesirable stripping off from the surface of the particle and to minimize dissolution in solvents.
  • An anisotropic conductive connection method is widely used for electric connection between electronic parts, semiconductor devices and connection terminals of substrate.
  • An anisotropic connection method is generally applied to electrical connections between TCP(tape carrier package) terminals and transparent electric terminals of glass substrate, and between drive I/C and FPC(flexible printed circuit board) terminals or between drive I/C and transparent electric terminals.
  • the application of anisotropic connection materials is being extended to chip packaging by flip-chip manner as a next generation packaging process in which it can substitute for conventional solder ball packaging medium.
  • connection terminals have become even finer, and thus it become a major issue to prevent occurrence of a short circuit between the neighboring terminals in an anisotropic conductive connection process.
  • insulated conductive ball as a conductive medium in anisotropic conductive materials is being extended which is the conductive particle coated with a thin resin layer.
  • insulated conductive balls so far developed have diverse problems in terms of preparation procedure and product characteristics.
  • the type of presently developed insulated conductive balls could be sorted into three categories by the type of insulation resin; that is, thermoplastic resin.
  • thermoplastic resin when used as an insulating coating material, it is difficult to obtain a sufficiently thick and uniform coating layer.
  • the coating processes such as solution dipping and interfacial polymerization have been reported.
  • solution dipping process the insulation layer of a certain thickness may be obtained by repeating dipping of conductive particle into a resin solution of a certain concentration and drying.
  • interfacial polymerization process once conductive particles are treated with a coupling agent or a surface treatment agent having a particular functionality, then a desired monomer is added and polymerized.
  • these processes do not ensure a uniform quality and high yield because many steps of procedure are needed, and furthermore the aggregation of particles during the process can not be avoided intrinsically.
  • the problems of thermoplastic resin such as peeling-off and aggregation may be avoidable in some extent, but it is difficult to control the crosslink density of insulation resin layer. If the degree of crosslink is too low the same problem as in thermoplastic resin happens, and if the degree of crosslink is too high, the insulation layer would not get removed from the surface of the conductive particle in the anisotropic connection process so that the electric connection between the terminals would not be made satisfactorily, and when the too high pressure is applied to destroy and remove the insulation layer, it is likely to damage the terminals and even in case of that the pieces of the insulation layer still remains in the surface of the particles to block the reliable electric conduction between the terminals.
  • Sony Chemical Corp. has proposed the preparation of insulated conductive balls by coating crosslinked polymer with a predetermined degree of crosslink by physical and mechanical manner(KR 2001-0060234 A).
  • Sony Chemical Corp. claimed that the above problems was overcome by coating the conductive particle in the coating ratio of 50-99% using a resin particle whose gel portion is above 90%.
  • Sony's method can not give the uniform coat, and the resultant insulation layer is not entirely crosslinked it is easy to peel off the surface of the particle.
  • dry coating process such as hybridization method results inevitably in agglomeration of particles, which brings a problem of purification.
  • the present invention is to provide formation methods of insulation layer of uniform and sufficient thickness on a conductive particle avoiding aggregation of the particles, which is a major cause for connection failure, and the formation of insulation layer which is stable enough to minimize undesirable stripping off the surface of the particle and dissolution in solvents.
  • the object of the present invention is to solve the problems of insulated conductive balls so far in which thermoplastic or thermosetting resin, and to provide insulated conductive ball, which is much improved electric conduction and insulation characteristics, and its preparation methods.
  • Spray-dry and vacuum deposition processes can not avoid the aggregation either.
  • the solution dipping process proposed in JP 87-71255 is not a practical method of preparation of coated microparticles because even repeated dipping-drying can not form a several hundred thick coating layer and after each dipping-drying process it is necessary to break down and separate the aggregated particles to individual particles.
  • a Sony Chemical Corp. proposed a method in which conductive particles are covered with partially crosslinked polymer particles mechanically in gas phase. The method, as mentioned before, the formation of uniform coat is intrinsically impossible and the binding force between conductive particle and the insulation particle is weak, and as a result mechanical strength and solvent resistance of the insulation layer are not that strong.
  • the present invention is based on the results of the intensive research carried by the present inventors that when such polymer particles having hetero elements or functional units on the surfaces, which have attractive interaction with metal surfaces of the conductive particles, are used for coating the conductive particles, the above problems can be overcome and uniform and sufficient coating is possible.
  • the thickness of insulation layer can be controlled, and by adjusting the concentration of the insulation resin particles uniform coating on the surface of conductive particles, without aggregation is possible.
  • one aspect of the present invention provide a method of formation insulation layer of uniformity and controlled thickness, which solves the problems found in case that thermoplastic or thermosetting resin are used as insulation materials as well as the case that round microparticle is used for the insulation(KR 2001-060234 A)
  • Another aspect of the present invention is about the methods of preparation of insulation resin particles which is used as an insulation material for conductive ball.
  • a further aspect of the present invention is about anisotropic conductive connection materials and connection structures.
  • an insulated conductive ball comprising of a conductive particle and an insulation resin layer coated on the surface of the conductive particle for anisotropic conductive connection
  • an anisotropic insulated conductive particle whose insulation layer is formed by coating insulation resin microparticle containing hetero element or functional group.
  • the above hetero- element or functional group is a hetero element such as sulfur, phosphorous, nitrogen or oxygen, or a chemical group which contains such an element or elements more than one.
  • the above insulation resin microparticle can be a uncrosslinked olefin polymer whose molecular weight is a range of 100,000 ⁇ 1,000,000; a copolymer; condensation thermoplastic copolymer; or a crosslinked resin.
  • the desirable average thickness of the above insulation resin layer is 10 nm ⁇ 1 ⁇ m
  • the desirable average diameter of the insulation resin microparticle is 10 ⁇ 1,000 nm.
  • the glass transition temperature of the above insulation resin is -30 ⁇ 200°C, desirably.
  • the anisoptopic insulation conductive ball of the present invention can be prepared by coating conductive particle uniformly with insulation resin microparticle which contains hetero- element or functional group on the surface and thus has binding force with metal.
  • the coating of insulation resin microparticle can be simply carried out by putting the above conductive particle into an aqueous or an organic suspension (or solution) of the insulation resin particle and stirring the mixture. As a result the insulation resin microparticle attachs and fixes the surface of the conductive particle. Then the resultant product is obtained by filtration, isolation and drying.
  • the formation method of insulation layer is not limited by the above, rather so-called hybridization is possible, in which dried powder of insulation resin microparticle is bound to the surface of conductive particle by means of mechanical and thermal manner.
  • the thickness of insulation layer can be controlled by altering the size of the insulation resin microparticle, and the uniform coating can be achieved by adjusting concentration of the insulation resin microparticle in the suspension (or solution).
  • the surface of the insulation resin layer can be more smooth.
  • the above insulation resin microparticle is prepared by radical polymerization in which monomer or functional group containing hetero elements having interaction forces with metal, other monomers, radical initiator, and surface active agent are mixed, and the mixture is polymerized.
  • insulation resin microparticle which contains sulfur on the surface is prepared by polymerizing isothiuronium salt and the following hydrolysis of the salt to mercaptan.
  • anisotropic connection material and connection structure using it comprised of insulated adhesives and insulated conductive balls of the present invention uniformly dispersed in the adhesives.
  • hetero element or functional group having binding forces with metal means any hetero element or functional unit which can attach to metal surface either by covalent bond or by polar linkage or affinity for metal.
  • conductive particle means any metal microparticle such as nickel, copper, gold, silver, or metal-coated polymer or ceramic microparticle, either used at present or not, either spherical shape or irregular shape.
  • the present invention it is possible to form insulation resin layer of a uniform and sufficient thickness on the surface of conductive balls easily and simply.
  • the insulated conductive particle of the present inventin can be prepared without delicate devices with high yields.
  • the insulated conductive balls of the present invention avoid aggregation of the balls and have superior stability in solutions.
  • the insulated conductive balls of this invention exhibits excellent current feed and insulation characteristics improving the drawbacks of conventional conductive balls for anisotropic electric connection coated by thermoplastic or thermosetting resin.
  • the conductive connection material using the insulated conductive balls ensure production of uniform and excellent products in quality.
  • FIG. 1 is a schematic sectional view of an insulated conductive particle for anisotropic conductive connection, according to the present invention.
  • FIG. 2 is a schematic view of the structure of an insulation resin microparticle which composes the insulation resin layer.
  • an insulated conductive particle 10 for anisotropic conductive connection of the present invention is composed of conductive particle 11 and insulation resin layer 12 which coats the surface of the conductive particle.
  • a conductive particle 11 of this invention is not specially limited, generally a particle of 2 ⁇ 10D diameter can be used.
  • the thickness (average thickness) of insulation resin layer 12 is preferably lOnm ⁇ ID. When the thickness of insulation resin layer is too high current feed characteristics may become poor. In addition, because the fraction of insulation rein in an anisotropic conductive connection material using the insulated conductive particle becomes large, after connection the properties such as heat-resistance and adhesion become inferior. On the contrary, when the layer is too thin the insulation characteristics may not be satisfactory.
  • the appearance of surface of insulation layer can be smooth and of uniform thickness or rough and of irregular thickness according to composition of insulation resin microparticle and process condition of insulation coating.
  • Insulation resin layer according to characteristics of insulation resin microparticle (FIG. 2), is composed of usual thermoplastic resin or crosslinked polymer of suitable crosslink density.
  • the above insulation resin microparticle is comprised of one of such polymers whose molecular weights are 100,000-1,000,000 as un- crosslinked olefin polymer, copolymer, condensation thermoplastic resin, and crosslinked polymer.
  • Softening point of insulation resin layer is preferably higher than the heating temperature of anisotropic conductive connection process.
  • the softening point is lower than the heating temperature, insulation characteristics tends to deteriorate.
  • the insulation resin layer can not be easily removed from the surface of the conductive particle when the insulated conductive particle is pressed between bumps, and as a result, current feed characteristics may become poor.
  • resin particle (FIG 2) of the present invention by using various monomers and a appropriate amount of multifunctional monomers, many properties of insulation resin layer including heat resistance, mechanical strength, and rheological properties can be adjusted as desired.
  • insulation resin layer should be remained safe during preparation of anisotropic conductive connection materials against mechanical agitation and mixing with solvent, resin, curing agent, coupling agent and etc.
  • solvents in the preparation of anisotropic conductive connection materials are ketones such as acetone, methyl ethyl ketone (MEK) and methyl isobutyl ketone (MIBK),or hydrocarbon solvents such as toluene, benzene and xylene, as well as common industrial solvents including THF. Therefore, unless there is a special attractive or binding forces to metal surface of conductive particle as an insulation layer of the present invention, dissolution or peeling-off can not be avoidable.
  • the insulation resin microparticle 20 which is used as an insulation material in the present invention, has hetero- elements 22 on the surface such as sulfur, phosphorous, nitrogen and oxygen, or functional groups containing such elements (FIG 2). Because those heteroatoms show binding force with metal, they attach and fix firmly to the surface of conductive particle and the insulation resin layer formed in such manner does not only peel off by physical impact but also has excellent solvent resistance so that it does not deform and dissolve during the process of preparation.
  • Insulation resin layer should not flow even upon heating if no pressure is applied. Otherwise in an anisotropic conductive connection process a flow of insulation resin layer can bring phase separation in adhesive matrix and aggregation of conductive particle, and resultant occurrence of a short circuit.
  • softening point or glass transition temperature of insulation resin layer is preferably same as or slightly higher than the anisotropic conductive connection temperature.
  • anisotropic conductive connection materials which can be processed at lower temperature and pressure for better productivity and security of connection process on a flexible board or film.
  • the softening point of insulation resin layer is preferable to be lower than heating temperature.
  • insulated conductive particles developed to date in which softening point of insulation resin layer is lower than heating temperature do not satisfy low temperature-rapid cure connection process since phase separation occur.
  • the insulated conductive particle of the present invention is different from those developed so far since there is binding force between insulation resin particle and the surface of conductive particle, and thus even if the softening point of insulation resin layer is lower than the heating temperature phase separation does not occur and the connection process is accomplished.
  • glass transition temperature of insulation resin layer is preferably -30 ⁇ 200°C, and it may be generally higher than the heating temperature, but it may be lowered below the heating temperature for low temperature-rapid cure process.
  • insulation resin particle satisfying all the above required characteristics can be prepared by various methods.
  • polymerization techniques such as dispersion polymerization, suspension polymerization, micro-suspension polymerization, and emulsion polymerization, in which products are obtained as particles. This is because obtained particle suspension can be directly used in coating process, and furthermore the particle size can be controlled.
  • the preferable diameter of insulation resin microparticle is 10 ⁇ l,000nm since the desirable average thickness of insulation resin layer is 10 nm ⁇ l ⁇ m.
  • An example of preparation method of insulation resin microparticle for the present invention is as follows. After a monomer or a few monomers, which will be main components of the microparticle, are placed in dispersion medium like water and alcohol, a monomer containing hetero-atom such as sulfur, phosphorous, nitrogen and oxygen are added to the mixture along with an appropriate amount of radical initiator and surfactant. The mixture is heated and stirred to give resin microparticles which have hetero-atom on the surface. In this case the monomer containing a hetero-atom is placed on the surface of the resultant resin microparticle because the monomer is relatively hydrophilic.
  • dispersion polymerization according to hydrophilicity of monomer having hetero-atom, pure water or a mixture of water and alcohol can be used as a dispersion solvent. But, suspension polymerization is not suitable for highly hydrophilic monomers such as acrylamide and acylic acid. For an example, suspension copoly- merization of acrylamide, styrene and methyl methacrylate probably results in a heterogeneous product, which is a mixture of poly (strene-co-methyl methacrylate) resin particle containing almost no acrylamide in it and polyacrylamide that is dissolved in water phase.
  • the diameter, thermal and mechanical properties, as well as composition and characteristics of the surface can be controlled by adjusting type and amount of each reactant, temperature and agitation speed, etc.
  • the insulation resin layer is formed of the resin microparticle attached to surface of conductive particle via binding force between the two. Therefore, most of properties of the insulation resin layer are determined by the size and characteristics of the microparticle.
  • a resin particle containing hetero-atoms on the surface is prepared by multi-step reactions.
  • multi-step reaction is desirable in order to attach sulfur or phosphorous to surface of particle, which is different case from hydrophilic monomers such as acrylamide and acrylic acid.
  • hydrophilic monomers such as acrylamide and acrylic acid.
  • a sulfur-containing monomer like 4-methylmercaptostyrene is not such a hydrophilic monomer that it is not expectable to locate at the surface of particle in dispersion polymerization, and furthermore mercaptan or thiol compound participate chain transfer reaction in radical polymerization and hinder the polymerization itself.
  • a particle containing reactive group at the surface such as epoxy is synthesized first, then a desired element is added through the reaction of the surface of the particle and a suitable reactant.
  • a particle containing sulfur particularly a isothiuronium salt can be polymerized as a precursor, followed by hydrolysis of the salt on the surface of particle to mercaptan.
  • Composition of insulation resin particle is not necessarily a polymer which is made by addition of a olefin monomer. That is a condensation polymer microparticle such as polyester, polyamide and polyurethane. In this case particle itself shows adhesion force superior to olefin polymer particle, but by modification of the surface coating efficiency can be improved.
  • a olefin monomer such as polyester, polyamide and polyurethane.
  • particle itself shows adhesion force superior to olefin polymer particle, but by modification of the surface coating efficiency can be improved.
  • An irregular powder prepared by bulk or solution polymerization followed by pulverization can be used as an insulation material for the present invention as long as it contains some amount of hetero-atom such as sulfur or nitrogen.
  • insulation coating can be achieved simply by putting a conductive particle in an aqueous suspension of microparticle followed by mixing, filtration and drying.
  • Insulated conductive particle in the present invention can be prepared as follows. After putting conductive particle in an emulsion or suspension of insualtion resin microparticle, then stirring the mixture for a certain time to attach the resin particle to surface of the conductive particle, filtering and isolating followed by drying to give the final product. In the drying step of this case vacuum may be applied, but common air- circulation drying oven is enough. Insulation microparticle as an insulation material of the present invention contains hetero-atom or functional group. Therefore, simply agitating a mixture of aqueous dispersion of microparticle and conductive particle makes microparticle attach and fix to surface of conductive particle to form a insulation layer.
  • the uniform coating of insulation resin on the surface of conductive particle without aggregation of the particles can be achieved by adjusting the concentration of insulation resin in the dispersion.
  • the shape and surface roughness of insulation resin layer depends on work-up conditions. If insulated conductive particle is placed at a temperature higher than the softening point, an insulation layer of more uniform thickness and smooth surface could be obtained. In this case, if particles coagulate each other due to stickiness of the surface it is usable to put the insulated conductive particle in a non-solvent whose boiling point is higher than the softening point of insulation layer, and heat it.
  • An anisotropic conductive connection material can be obtained in the shape of film or paste by uniformly dispersing the anisotropic insulated conductive particle of this invention into an insulating adhesive using a conventional technique.
  • common adhesives can be used as an insulating adhesive.
  • connection structure which shows good conductive and insulating properties, can be obtained by an anisotropic conductive connection material of this invention as above is placed between the confronting two connection objectives (semiconductor, circuit board to package the semiconductor, flexible circuit board, transparent electrode array, etc.), and heat and press it.
  • the insulation resin microparticle was prepared by the same way except a mixture of butyl acrylate(59g) and hexamethylenediamine(lg) was used instead of butyl acrylate(60g).
  • Conductive particle which is a Ni/Au plated hexamethylenediacrylate polymer of 4D diameter, was coated with insulation resin particles dispered in water which were synthesized as above examples of preparation under the condition as Table 1 to give insulated conductive particles for anisotropic conductive connection.
  • the coating process is as follows.
  • Microparticle dispersed solution whose solid content was 5% was prepared by adding microparticle powder to water(or ethanol, or other organic solvent) and stirring with ultrasonication.
  • conductive particle 1.g, Sekisui Chemical Co., Micropearl AUL704
  • the resultant particle was isolated by ultracentrifuge and washed with ethanol several times and dried under reduced pressure. SEM pictures showed that the conductive particle was covered with microparticle with 200 ⁇ 300nm thickness.
  • the insulated conductive particle was placed in 50-mL beaker and the beaker was placed into a oven for 5 minutes at 100°C. From the SEM pictures it is found that the particle shape of the insulated conductive particle surface was almost disappeared and smooth insulation layer was formed.
  • the obtained insulated conductive particle by TGA analysis, was found that it had a insulation layer of 150nm thickness.
  • Coating fraction(%) and average thickness of insulation resin layer(nm) according to each example of practice is given in Table 1.
  • coating fraction was determined by calculation the area which was covered with microparticle upon 50 conductive balls which were chosen at random on the SEM picture.
  • Conductive particle which is a Ni/Au plated hexamethylenediacrylate polymer of 4D diameter, was coated with insulation resin particles(styrene/butyl acrylate copolymer, 180nm diameter) by the same way as above examples of practice under the condition of Table 2 (Examples of comparison 1-3)
  • Obtained insulated conductive balls were anylized by SEM and TGA after broken down by rubber bar. Analysis show that the aggregation formed and that the average thickness of insulation resin layer was about 12 nm.
  • insulation coating was accomplished by solution dipping method in which the solution was made by dissolving the above insulation resin particle in toluene(or THF)(Examples of comparison 1-4).
  • Example of practice 9 The insulated conductive particle obtained from the above example of practice 1-8 and example of comparison was added to a mixture of a Bisphenol-A liquid epoxy resin (60 weight parts, YDF-128, Gookdo Chemical Co.), a latent curing agent (40 weight parts, H-3842, Gookdo Chemical Co.) and methyl ethyl ketone(70 weight parts). The mixture was mixed throughly to make a 20 weight % solution. An anisotropic conductive connection film was prepared by coating a polyimide film treated with a silicone with the above mixture in order that the thickness of the coating layer is 25 D.
  • connection structure [111] The above anisotropic conductive connection film was placed between 50 micron pitch of a semiconductor device(bump size 35x80 D, bump interval 15 D, bump height 20 D) and a glass substrate provided with 50 D pitch of ITO(wire width 35 D, wire interval 15 D), and compressed at 180°C under 3kgf/cmfor 10 seconds, to obtain a connection structure.
  • connection structure was measured for current feed characteristics and insulation characteristics. The results are given in Table 3.
  • the insulated conductive particle coated with resin particle containing elements on the surface that exert binding force to metal has superior current feed an insulation characteristics to those coated with common resin particle or resin solution.
  • the insulated conductive particles is not damaged upon agitation in toluene or MEK for 3 hours at room temperature. Therefore, the insulated conductive particle of the present invention provide with excellent stability in preparation of anisotropic conductive connection materials, and the anisotropic conductive connection materials prepared by such manner provide outstanding anisotropic connection characteristics in anisotropic connection process.
  • the insulated conductive particle of the present invention exhibits excellent current feed characteristics and insulation characteristics. It can be widely used for anisotropic conductive connections in electronic device and semiconductor industries, for examples, between TCP terminals and transparent terminals of glass substrate in preparation of flat panel display, driver IC and FPC(flexible printed circuit) terminals, driver IC and transparent terminals. In particular, it can be used for electronic devices which recently become smaller and thinner.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention concerne des particules conductrices isolées permettant d'établir une connexion conductrice anisotropique, des procédés de préparation de celles-ci et des produits conducteurs anisotropiques comprenant celles-ci. La présente invention concerne, en particulier, des procédés de formation d'une couche isolante d'une épaisseur uniforme et suffisante permettant d'éviter l'agrégation des particules, une cause principale d'échec de connexion, et la formation d'une couche isolante suffisamment stable pour résister à la séparation indésirable de la surface de la particule, et pour minimiser la dissolution dans des solvants. La présente invention concerne une particule conductrice isolée comprenant une particule conductrice et une couche de résine isolante recouvrant la surface de la particule conductrice afin d'établir une connexion conductrice anisotropique. La couche isolante de la particule conductrice isolée anisotropique est formée de microparticules de résine isolante contenant un hétéro-élément ou un groupe fonctionnel. La particule conductrice isolée de la présente invention peut être préparée sans dispositifs à haut rendement, et le matériau de connexion conducteur à particules conductrices isolées garantit la production de produits uniformes d'excellente qualité.
PCT/KR2005/001367 2004-05-12 2005-05-10 Dispositif conducteur isole de connexion electrique anisotropique et procede de preparation et produits comprenant celui-ci WO2005109448A1 (fr)

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JP2007513062A JP2007537572A (ja) 2004-05-12 2005-05-10 異方性導電接続用の絶縁導電性粒子及びその製造方法並びにこれを用いた異方性導電接続材料

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KR1020040033306A KR100637763B1 (ko) 2004-05-12 2004-05-12 이방성 도전접속용 절연 도전성 입자와 그 제조방법 및이를 이용한 이방성 도전접속재료
KR10-2004-0033306 2004-05-12

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007113182A1 (fr) * 2006-03-31 2007-10-11 Siemens Aktiengesellschaft procédé pour appliquer des particules de brasure sur des surfaces de contact, particules de brasure convenant dans ce but et composants dotés de surfaces de contact
EP2079084A1 (fr) * 2006-10-17 2009-07-15 Hitachi Chemical Company, Ltd. Particule revetue et son procede de fabrication, composition adhesive conductrice anisotrope utilisant la particule revetue et film adhesif conducteur anisotrope
US7566494B2 (en) * 2005-09-02 2009-07-28 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film using the same
CN102549676A (zh) * 2009-09-08 2012-07-04 积水化学工业株式会社 附着绝缘粒子的导电性粒子、附着绝缘粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体
KR20200002864A (ko) 2017-05-08 2020-01-08 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그 제조 방법
KR20200004786A (ko) 2017-05-08 2020-01-14 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그 제조 방법

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JP5498907B2 (ja) * 2010-09-29 2014-05-21 株式会社日本触媒 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
JP6119130B2 (ja) * 2012-07-11 2017-04-26 日立化成株式会社 複合粒子及び異方導電性接着剤
JP7028641B2 (ja) * 2016-05-19 2022-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP6893399B2 (ja) * 2016-07-07 2021-06-23 デクセリアルズ株式会社 絶縁被覆粒子、絶縁被覆粒子の製造方法、粒子含有組成物、及び異方性導電接着剤

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Cited By (8)

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US7566494B2 (en) * 2005-09-02 2009-07-28 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film using the same
WO2007113182A1 (fr) * 2006-03-31 2007-10-11 Siemens Aktiengesellschaft procédé pour appliquer des particules de brasure sur des surfaces de contact, particules de brasure convenant dans ce but et composants dotés de surfaces de contact
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CN102549676A (zh) * 2009-09-08 2012-07-04 积水化学工业株式会社 附着绝缘粒子的导电性粒子、附着绝缘粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体
KR20200002864A (ko) 2017-05-08 2020-01-08 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그 제조 방법
KR20200004786A (ko) 2017-05-08 2020-01-14 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그 제조 방법
US11407863B2 (en) 2017-05-08 2022-08-09 Nippon Chemical Industrial Co., Ltd. Coated particles and production method therefor

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