WO2005098935A1 - Table de positionnement de plaque, équipement de positionnement de plaque et méthode de positionnement de plaque - Google Patents

Table de positionnement de plaque, équipement de positionnement de plaque et méthode de positionnement de plaque Download PDF

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Publication number
WO2005098935A1
WO2005098935A1 PCT/JP2005/006615 JP2005006615W WO2005098935A1 WO 2005098935 A1 WO2005098935 A1 WO 2005098935A1 JP 2005006615 W JP2005006615 W JP 2005006615W WO 2005098935 A1 WO2005098935 A1 WO 2005098935A1
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WO
WIPO (PCT)
Prior art keywords
substrate
positioning
ball
board
free
Prior art date
Application number
PCT/JP2005/006615
Other languages
English (en)
Japanese (ja)
Inventor
Kaoru Iguchi
Takurou Uchida
Hideki Nishinomiya
Original Assignee
Iguchi Kiko Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iguchi Kiko Co., Ltd. filed Critical Iguchi Kiko Co., Ltd.
Publication of WO2005098935A1 publication Critical patent/WO2005098935A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/04—Ball or roller bearings
    • F16C29/045—Ball or roller bearings having rolling elements journaled in one of the moving parts
    • F16C29/046—Ball or roller bearings having rolling elements journaled in one of the moving parts with balls journaled in pockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Definitions

  • the present invention relates to a substrate positioning table, a substrate positioning equipment, and a substrate positioning method for precisely positioning a substrate such as a mother glass for a display or a silicon substrate (Ueno).
  • Equipment for coating films on PDPs plasma display panels
  • liquid crystal displays liquid crystal displays
  • glass substrates mother-glass
  • Dedicated robots transport and unload substrates to and from multiple processing chambers (chamber 1) where the processing is performed.
  • processing chambers chamber 1
  • the glass substrate may be transferred into the processing chamber in a middle of a carrying path of the substrate (for example, in a chamber 1 (load lock chamber 1) provided separately from the processing chamber).
  • the robot After positioning on a positioning table installed near the entrance of the vacuum equipment (in the atmosphere, etc.) where the processing chamber and the like are provided, the robot was taken out from the positioning table In Rukoto to carry the glass substrate into the processing chamber, the position of the glass substrate in the processing chamber is to fit within the allowable error range
  • the positioning table has a configuration in which a glass substrate placed on the positioning table is pressed against a positioning gauge (eg, Patent Document 1), or a positioning gauge is moved by moving the positioning gauge. There is a method of pressing against the end face of the glass substrate to determine the position.
  • a positioning gauge eg, Patent Document 1
  • the loading of the glass substrate into the positioning table is performed by a loading table into which the glass substrate is loaded.
  • the positioning table 106 is provided with a traversing device (not shown) for laterally moving the glass substrate 102 placed by the transfer robot, and an end face of an outer peripheral portion of the glass substrate 102 traversed by the traversing device.
  • a positioning gauge 107 for positioning the glass substrate 102 by being applied thereto is provided, and the glass substrate 102 carried by the transfer robot is moved by a lateral feeder and brought into contact with the positioning gauge 107, thereby forming a glass.
  • the substrate 102 can be precisely positioned.
  • the glass substrate 102 is supported by a large number of free ball bearings 109 provided on the table body 108 so that the glass substrate 102 can be moved laterally, so that the lateral movement of the glass substrate 102 can be realized with a light force.
  • Patent Document 1 JP-A-06-183556
  • the present invention makes it easy to position a substrate such as a glass substrate in a short time.
  • the purpose of the present invention is to provide a low-cost substrate positioning table, substrate positioning equipment, and a method for positioning a substrate, which can be performed, and furthermore, the generation of particles that hardly cause distortion to the substrate can be extremely reduced. .
  • the present invention provides the following configurations.
  • the present invention relates to a mounting table on which a substrate is mounted; and an outer peripheral portion of the substrate which is arranged at a plurality of locations on the outer peripheral portion of the mounting table and which is placed on the mounting table by descending from above the mounting table.
  • the substrate is disposed at a position higher than the support surface within the range of the thickness of the substrate to be placed, and the substrate abutting on the protruding portion of the ball supporting member of the ball is rotated by rotation of the ball.
  • the present invention provides a substrate positioning table, which can be guided to the substrate positioning region on the inside surrounded by balls of a free ball bearing.
  • At least the surface of the ball of the free ball bearing is formed of a conductive material, and the ball support of the free ball bearing is provided with a ground current-carrying portion that is in contact with the ball. Configuration can also be adopted.
  • the mounting table may include a substrate supporting means for supporting the substrate mounted on the mounting table while allowing displacement in a direction along the supporting surface.
  • a substrate supporting means for supporting the substrate mounted on the mounting table while allowing displacement in a direction along the supporting surface.
  • the substrate supporting means for example, free ball bearing can be adopted.
  • the present invention also provides a loading table into which a substrate is loaded, the substrate positioning table according to the present invention, and a substrate transfer that removes a substrate from the loading table and places it on a mounting table of the substrate positioning table.
  • a substrate positioning apparatus characterized by comprising a device.
  • the present invention provides a free ball bearing in which a substrate to be mounted on the table above the positioning table for a substrate according to the present invention is arranged at a plurality of locations on the outer periphery of the table. Above a certain ball of the side free bearing, lower the ball from the substrate receiving area, which is an area secured by the amount of protrusion of the ball support force of each side free bearing ball above the board positioning area.
  • the present invention provides a method for positioning a substrate, wherein after the substrate is placed in a substrate receiving area, the substrate is moved down while being guided by balls of the respective side free bearings, and is disposed in the substrate positioning area.
  • the substrate is lower than the balls of the free ball bearings (hereinafter, also referred to as side free bearings) arranged on the outer peripheral portion of the mounting table, and is surrounded by the side free bearings.
  • the substrate can be positioned with a desired degree of accuracy simply by placing it in the substrate positioning area on the inner side (the inner side surrounded by the most protruding portion of the ball support force) and placing it on the support surface on the mounting table. Since the board that has entered the board positioning area is positioned by the balls of the respective side free bearings, the board positioning can be completed at the same time that the board enters the board positioning area. Therefore, positioning can be performed in a very short time.
  • the ball supporting member has a structure in which the substrate abutting on the protruding portion can be smoothly guided to the substrate positioning region by rotation of the ball, so that the substrate enters the substrate positioning region and completes the positioning of the substrate at the same time. it can.
  • the substrate is less likely to be distorted such as a partial radius.
  • An excellent effect is obtained in that the dimensional accuracy of the substrate can be stably maintained.
  • the number of sources of particles can be significantly reduced, and the cost can be reduced.
  • FIG. 1 is a plan view showing a substrate positioning table (hereinafter, also referred to as a positioning table) according to the present invention.
  • FIG. 2 is a view showing the positioning table of FIG. 1, and is a cross-sectional view taken along line AA of FIG. 1.
  • FIG. 3 is an enlarged view showing a mounting positional relationship between a side free bearing and a receiving free bearing provided on the positioning table of FIG. 1.
  • FIG. 4 is a schematic plan view showing a process facility provided with a substrate positioning facility according to the present invention.
  • FIG. 5 is a view showing a conventional transfer robot.
  • FIG. 6 is a view showing another example of the transfer robot of the conventional example.
  • FIGS. 1 and 2 are views showing a substrate positioning table 1 (hereinafter, also referred to as a positioning table) according to the present invention.
  • FIG. 1 is a plan view
  • FIG. 2 is a line AA of FIG.
  • FIG. 3 is an enlarged view showing a mounting positional relationship of free ball bearings (side free bearings and receiving free bearings described later) provided on the positioning table 1
  • FIG. 4 is a board according to the present invention.
  • 1 is a schematic plan view showing a process equipment 3 including a positioning equipment 2 (hereinafter, also referred to as a positioning equipment).
  • the substrate 4 applied to the present invention is glass.
  • a substrate for example, a silicon substrate, a ceramic substrate, a metal substrate, etc.
  • various substrates for precision processing can be employed.
  • the substrate 4 has a rectangular plate shape here, but is not limited thereto, and the shape of the substrate 4 may be, for example, a circle or an ellipse.
  • the positioning table 1 is installed in a load lock chamber 32 provided in a vacuum device 31 constituting the process equipment 3 shown in FIG.
  • the vacuum device 31 includes the load lock chamber 32, a transfer chamber 33, and first to third processing chambers 34a, 34b, and 34c (chamber 1).
  • Reference numeral 35a denotes an atmosphere gate provided in the load lock chamber 32, and when the substrate 4 is loaded into the load lock chamber 32 from outside the vacuum device 31, the load gate chamber 32 moves out of the vacuum device 31. It is opened and closed when the substrate 4 is carried out.
  • Reference numeral 35b denotes a gate that opens and closes between the load lock chamber 32 and the transfer chamber 33, and 35c, 35d, and 35e denote gates between the first to third processing chambers 34a, 34b, and 34c and the transfer channel 33. A gate that opens and closes.
  • a robot 36 (substrate transfer device; hereinafter, also referred to as a vacuum robot) for moving the substrate 4 is installed in the transfer chamber 33, and includes a positioning table 1 in the load chamber 32 and a processing chamber 34a. , 34b, 34c is transferred by the vacuum robot 36.
  • the substrate 4 taken out of the processing chamber is carried into another processing chamber (or carried in to the original processing chamber) in accordance with the processing steps such as film deposition, the substrate 4 taken out of the processing chamber is taken into account. -After the positioning on the positioning table 1, it should be put into another processing chamber.
  • the process equipment 3 includes a cassette 37 and a robot 38 (substrate transfer device; hereinafter, also referred to as atmospheric robot) installed outside the vacuum device 31, and the above-described vacuum device 31. I have.
  • the substrate 4 is loaded from the outside of the vacuum device 31 to the positioning table 1 in the load lock chamber 1 32 by the atmospheric robot 38 placing the substrate 4 taken out of the cassette 37 on the positioning table 1 via the atmospheric gate 35a. Done.
  • the atmospheric robot 38 also carries out the work of carrying the substrate 4 on the positioning table 1 out of the vacuum device 31.
  • the atmospheric robot 38 has a state in which the substrate 4 is placed on a movable arm 38a (see FIG. 2) that can move in the XYZ directions, similarly to the transfer robot 103 described with reference to FIG. Transport by
  • the present invention is not limited to this, and various configurations can be adopted.
  • the cassette 37 functions as a loading table into which the substrate 4 to be processed is loaded.
  • the cassette 37, the positioning table 1, and the atmospheric robot 38 constitute the substrate positioning equipment according to the present invention.
  • the positioning table 1 is provided on a mounting table 11 on which the substrate 4 is mounted, and at a plurality of locations on the outer periphery of the mounting table 11. It has a free ball bearing 12 (hereinafter, also referred to as a side free bearing) for positioning the substrate 4 at a desired position on the mounting table 11 by being in contact with the end surface 41 of the substrate 4 to be mounted. It is configured.
  • a free ball bearing 12 hereinafter, also referred to as a side free bearing
  • the table 11 described above includes a table body 13 and a plurality of free ball bearings 14 (hereinafter also referred to as receiving free bearings) mounted so as to protrude above the upper surface 13a of the table body 13.
  • the substrate 4 mounted on the mounting table 11 is supported on a horizontal or substantially horizontal support surface F (virtual surface) by the plurality of receiving free bearings 14.
  • a mounting base 15 for mounting the side free bearing 12 is provided on an outer peripheral portion of the table main body 13 so as to protrude above the table main body 13.
  • the receiving free bearing 14 is provided on the mounting base 15.
  • the rotatable ball 14b is mounted on the table main body 13 so as to protrude above the table main body upper surface 13a positioned inside surrounded by a circle.
  • the table body 13 of the mounting table 11 in the illustrated example has a rectangular shape in a plan view (see FIG. 1), the present invention is not limited to this. Can also be adopted.
  • the side free bearing 12 includes a ball support 12a (holder) and a ball 12b rotatably supported by the ball support 12a. It is fixedly attached to the mounting base 15.
  • the side free bearing 12 is mounted on the inner surface 15a side (the side facing the inner space S surrounded by the mounting base 15) of the mounting base 15 of the table body 13, and is provided from the ball support 12a of the ball 12b.
  • the protruding portion is located on the inner space S side with respect to the mounting table inner surface 15a.
  • Figure 3 As shown in FIG. 2, the side free bearing 12 is disposed at a position where the center 11 of the ball 12b is on an extension of the support surface F that supports the substrate 4. For this reason, the ball 12b of the side free bearing 12 is positioned such that the largest amount of protrusion of the ball 12b from the ball support 12a is coincident with the support surface F.
  • an inner area force surrounded by the ball 12b of each side free bearing 12 (specifically, the portion of the ball 12b protruding from the ball support 12a).
  • the substrate 4 placed on the mounting table 11 is a substrate positioning area M where the substrate 4 is placed.
  • the substrate 4 mounted on the mounting table 11 is arranged in the substrate positioning area M, so that each side free bearing 12 of the positioning table 1
  • the ball 12b is positioned with respect to the positioning table 1 with desired accuracy.
  • the dimension L of the substrate positioning area M (specifically, the XY dimension; the dimension L in FIG. 2 indicates the dimension in the Y direction) is the dimension t of the substrate 4 (specifically, The dimension t in Fig. 2 is slightly larger than the vertical (short side) dimension of the rectangular board 4)
  • the dimension L of the board positioning area M and the dimension of the board 4 The difference (L ⁇ t) from t determines the positioning accuracy of the substrate 4 placed in the substrate positioning area M with respect to the positioning table 1.
  • This positioning accuracy is determined by determining the position of the substrate 4 in the direction along the support surface F with respect to the target position (hereinafter, reference position; error 0) in the substrate positioning region M for the substrate 4 placed in the substrate positioning region M. It is set based on the allowable displacement range (dimensions cl and c2 shown in Fig. 2).
  • the dimensions cl and c2 shown in FIG. 2 are both the end face 41 of the substrate 4 arranged at the reference position and the ball 12b of the side free bearing 12 arranged at a position facing the end face 41. (The point (point) where the protrusion of the ball 12b from the ball support 12a (described later) is the largest).
  • the positioning accuracy of the substrate 4 with respect to the positioning table 1 is, for example, a force that can be set to about ⁇ 0.1 to 0.7 mm. It is also possible to set a finer level than this.
  • the side free bearing 12 has a function of guiding the substrate 4 abutting on a portion of the ball 12b protruding from the ball support 12a to a substrate positioning area M by rotation of the ball 12b. . Accordingly, when the substrate 4 is lowered from above the mounting table 11 so as to enter the substrate positioning region M, the end of the substrate 4 is side-free beared during the lowering. Even if the ball 12 abuts on the ball 12b, the substrate 4 is smoothly guided to the substrate positioning region M by the rotation of the ball 12b, and is disposed in the substrate positioning region M.
  • the operation of carrying the substrate 4 into the positioning table 1 and positioning the substrate 4 by the atmospheric robot 38 (see Fig. 4) (a method of positioning the substrate) is as follows: the substrate 4 is taken out from the cassette 37 and the movable substrate 4 on which the substrate 4 is placed is placed. The arm 38a is moved to place the substrate 4 above the substrate positioning area M of the positioning table 1 as shown in FIG. 2, and then the movable arm 38a is lowered to move the substrate 4 to the substrate positioning area M. Try to fit.
  • the movable arm 38a is lowered from above the positioning table 1! /, But the board 4 placed on the movable arm 38a is also lowered. The descent stops when the ball contacts the ball 14b of the receiving free bearing 14 (indicating that it has reached the support surface F).
  • the board 4 is positioned in the board positioning area M, and is positioned with desired accuracy by the side free bearings 12 (specifically, balls 12b) around the board positioning area M (in the direction along the support surface F). Positioning).
  • the movable arm 38a continues to descend even after the lowering of the substrate 4 is stopped, and stops descending when it enters the arm storage groove 13b formed on the table body 13. As a result, the movable arm 38a does not touch the substrate 4 supported on the receiving free bearing 14, and the movable arm 38a does not affect the positioning of the substrate 4 on the receiving free bearing 14.
  • the substrate 4 is positioned by the rotation of the ball 12b. Since the substrate 4 is guided to the region M, the arrangement of the substrate 4 in the substrate positioning region M can be performed smoothly.
  • the atmospheric robot 38 does not restrict the lateral movement of the substrate 4 on the movable arm 38a when performing an operation of placing the substrate 4 from above the mounting table 11 into the substrate positioning region M.
  • One that does not adversely affect the positioning of the substrate 4 due to the contact of the side free bearing 12 with the ball 12b is adopted.
  • As the atmospheric robot 38 a configuration in which the substrate 4 is transported by a transport member other than the movable arm 38a can also be used. A force that does not adversely affect the positioning of the substrate 4 due to the contact of the side free bearing 12 with the ball 12b. Is adopted.
  • the substrate 4 lowered from above the positioning table 1 is accommodated in the substrate positioning area M, and at the same time, the side free bearings 12 around the substrate positioning area M (in detail, Since the positioning of the substrate 4 is completed by the ball 12b), the time required for positioning the substrate 4 can be greatly reduced, and the positioning efficiency can be greatly improved.
  • a device such as a traversing device for laterally moving the substrate, which has been conventionally used, is not required, and the positioning of the substrate 4 can be realized with a very simple configuration, the positioning process in the positioning table 1 can be performed. Particle generation can be significantly reduced, and there is an advantage that high cleanliness can be stably maintained in one chamber (the load lock chamber 32) in which the positioning table 1 is installed.
  • a ball formed from a conductive resin material is used as the ball 12a, and the side free bearing 12 having a ground current-carrying portion in contact with the ball 12a is used as the ball support 12a.
  • the side free bearing 12 has a cylindrical case 12d, a lid 12e, and a ball support 12a, which is also strong, and accommodates about half of the ball 12b.
  • a large number of rolling small balls 12f in contact with the balls 12b are housed in the 12a.
  • a ball 12b formed of a conductive resin material and a small ball 12f formed of a conductive metal such as stainless steel are employed, and further, as a cylindrical case 12d, If it is made of a conductive metal such as stainless steel, or has a configuration in which an energizing circuit consisting of electric wires (including a contact portion that comes into contact with the small ball 12f to ensure electrical conduction) is used, the small ball It has a configuration having a ground conducting portion composed of 12f and cylindrical case 12d.
  • the use of the side free bearing 12 having the above configuration can prevent the damage to the substrate 4 due to sparks and improve the product yield, etc. it can.
  • a conductive metal is used for the base resin.
  • a material in which fillers are dispersed and mixed, a material in which an antistatic polymer is added to a base resin, and the like can be employed. Such a material is used to have loS X IC ⁇ Q / surface resistivity of the mouth.
  • Base resins include PAI (polyamide imide), PBI (polybenzimidazole), PC TFE (polycloth trifluoroethylene), polyetheretherketone, PEI (polyetherimide), PI (polyimide), PPS (polyimide) Polyphenylene sulfide), melamine resin, aromatic polyamide resin (aramide resin) and the like can be used.
  • LCP liquid crystal polymer
  • PBT polybutylene terephthalate
  • PES polyether sulfone
  • Vespel a registered trademark of DuPont, which is an aromatic polyamide resin
  • PBI are preferable from the viewpoint of characteristic stability to the environment in a vacuum device.
  • the substrate 4 when the substrate 4 is lowered from above the balls 12b of each side free bearing 12 by the movement of the movable arm 38a of the atmospheric robot 38, the substrate 4 If the outer peripheral portion is placed on the portion of the ball 12b of the side free bearing 12 protruding from the ball support 12a, the rotation of the ball 12b can guide the substrate 4 to the substrate positioning area M. It is not necessary that the position of the substrate 4 lowered to near the ball 12b be within the range of the substrate positioning area M.
  • the atmospheric robot 38 moves the board 4 descending from above the ball 12b of each side free bearing 12 by the amount of protrusion of the ball 12b of each side free bearing 12 from the ball support 12a beyond the board positioning area M.
  • the substrate receiving area U is a ball support 12a of each side free bearing 12 on the mounting table 11 (specifically, an end face of the ball support 12a on the side facing the substrate positioning area M). 12c, more specifically, the inner area surrounded by the end surface of the lid 12e of the ball support 12a, and located above the ball 12b of each side free bearing 12. .
  • this substrate receiving area U in other words, the force of the ball support 12a of the ball 12b of each side free bearing 12 (containing about half of the ball 12b!) Is protruded! This is the inner area surrounded by the top (dot) of the / part.
  • the positioning accuracy that ensures that the substrate 4 falls within the range of the substrate receiving area U is secured.
  • the substrate 4 can be lowered to the substrate positioning area M without bringing the substrate 4 into contact with the ball support 12 a of the side free bearing 12, and the substrate 4 can be positioned with desired positioning accuracy with respect to the positioning table 1. Substrate Positioned in the positioning area M.
  • the allowable error range of the horizontal position of the substrate 4 is ⁇ 3.0 mm.
  • the substrate 4 is lowered, and thus, the substrate 4 can be positioned with an accuracy of ⁇ 0.5 mm.
  • the size of the glass substrate 4 such as a mother glass for a display has been increasing.
  • the size of the mother glass which is frequently used, is for liquid crystal displays and has a size of 150 Omm x 1800 mm and a thickness of about 0.3 to 0.7 mm.
  • the atmospheric robot 38 of the present embodiment has a configuration in which the glass substrate 4 is placed on the movable arm 38a inserted below the glass substrate 4 and transported as illustrated in FIG. 2, but the transport accuracy of the robot itself is low. Even if it is sufficiently ensured, it is difficult to eliminate the occurrence of the positioning error caused by the radius of the glass substrate 4.
  • a positioning table configured to position the glass substrate by pressing against the positioning gauge has a The pressing force may cause a partial radius on the glass substrate, which may affect the flatness of the glass substrate.
  • the substrate 4 lowered from above the ball 12 b of each side free bearing 12 around the mounting table 11 is moved into the substrate receiving area U and the force of each side free bearing 12.
  • the substrate 4 is placed on the support table 11 (i.e., the positioning table 1) with a desired degree of accuracy simply by being inserted into the substrate positioning area M while being guided by the balls 12b, and mounted on the support surface F on the mounting table 11. Since the positioning can be performed with respect to the glass substrate, accuracy errors due to the radius of the glass substrate can be absorbed and high-precision positioning can be easily realized.
  • the substrate 4 to be lowered to the substrate positioning area M is positioned within the above-described substrate receiving area U, high-precision positioning can be easily realized by lowering, and the accuracy due to the radius of the glass substrate Even if there is an error, high-precision positioning can be realized easily and reliably.
  • the board 4 can be positioned simply by dropping it into the board positioning area M while being guided by the balls 12b of the respective side free bearings 12, the substrate 4 is partially pressed onto the glass board by the pressing force against the positioning gauge. This eliminates the inconvenience of generating a typical radius and stably maintains the flatness of the glass substrate.
  • the glass substrate 4 placed on the support surface F of the mounting table 11 is supported by the receiving free bearing 14, the glass substrate 4 on the movable arm 38a is bent. Even when the glass substrate 4 is lowered on the support surface F in a state, the glass substrate 4 is placed on the support surface F while rotating the ball 14b of the receiving free bearing 14 while eliminating the radius. Eventually, it will be placed on the support surface F with the radius almost eliminated. Thus, when the positioning in the positioning area M is completed, a high flatness is ensured on the glass substrate 4. Further, since no external force or the like for lateral feeding is applied to the glass substrate 4 placed on the support surface F, the flatness of the glass substrate can be stably maintained.
  • the receiving free bearing 14 functions as a substrate supporting means for supporting the substrate 4 mounted on the mounting table 11 while permitting displacement in a direction along the support surface F.
  • the substrate supporting means is not limited to the receiving free bearing ring 14, and for example, the load of the substrate 4 placed on a plurality of stays (including receiving free bearings) protruding on the mounting table.
  • a part is supported by the air layer (slightly higher than the atmospheric pressure) formed between the substrate 4 and the upper surface of the mounting table by the air blown by the air blower opening on the upper surface of the mounting table.
  • One that does not restrain the lateral movement of the supported substrate 4 (movement in the direction along the supporting surface F (virtual surface), which is the surface that supports the substrate 4 by a plurality of stages), etc. adopt.
  • the substrate 4 from which the processing chamber force has been taken out is placed on a positioning table installed in the load lock chamber 31 (see Fig. 4) and repositioned. Also, when the wafer is carried into the processing chamber where the next process is performed, the positioning table 1 according to the present invention can provide high positioning accuracy easily and in a short time, and can maintain the flatness of the substrate 4.
  • the substrate applied to the present invention is not limited to a glass substrate for a liquid crystal display (mother-glass), but may be, for example, a glass substrate for a PDP, a silicon substrate, a ceramic substrate, or a metal substrate. Is also good.
  • the installation position of the positioning table according to the present invention is not limited to the inside of the load lock chamber, and is not particularly limited as long as it is appropriately set according to the necessity of positioning the substrate.
  • a substrate loading / unloading path into or out of the processing chamber for example, outside the vacuum device 31 (in the atmosphere), near the entrance of the substrate into the vacuum device 31 (atmospheric gate)
  • the positioning table according to the present invention can be used for, for example, positioning of a substrate to be carried into a processing apparatus in the atmosphere, positioning of a substrate before being stored in a transport cassette, and the like.
  • a substrate such as a mother glass for a display, a silicon substrate (Ueno, etc.) can be precisely, in a short time. Positioning is easy.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Une table de positionnement de plaque est équipée d’une table de placement, sur laquelle une plaque doit être placée, et de roulements à billes libres, lesquels sont agencés sur plusieurs surfaces sur une partie de circonférence externe de la table de placement, guident une partie de circonférence externe de la plaque placée sur la table de placement en descendant d’une partie haute de la table de placement, et positionnent la plaque dans une zone de positionnement de plaque définie sur la table de placement. Le roulement à bille libre est pourvu d’une corps de support de bille et d’une bille soutenue, de manière à pouvoir pivoter, par le corps de support de bille. Le centre de la bille est disposé à une position sur un prolongement d’un plan d’appui de la table de placement pour soutenir la plaque ou bien à une position plus haute que le plan d’appui dans une plage d’épaisseur de la plaque à placer sur la table de placement.
PCT/JP2005/006615 2004-04-05 2005-04-04 Table de positionnement de plaque, équipement de positionnement de plaque et méthode de positionnement de plaque WO2005098935A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-110896 2004-04-05
JP2004110896 2004-04-05

Publications (1)

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WO2005098935A1 true WO2005098935A1 (fr) 2005-10-20

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KR (1) KR100847347B1 (fr)
CN (1) CN100479129C (fr)
TW (1) TWI278082B (fr)
WO (1) WO2005098935A1 (fr)

Cited By (2)

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US20120006237A1 (en) * 2009-04-14 2012-01-12 Kaoru Iguchi Free ball bearing, bearing unit, support table carrying equipment, and turntable
US20140077431A1 (en) * 2012-09-20 2014-03-20 Varian Semiconductor Equipment Associates, Inc. System and Method for 2D Workpiece Alignment

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KR100969283B1 (ko) * 2007-05-16 2010-07-09 아주하이텍(주) 광학 검사 장치
TWI405915B (zh) * 2008-07-09 2013-08-21 Au Optronics Corp 定位裝置
JP2010265095A (ja) 2009-05-15 2010-11-25 Iguchi Kiko Seisakusho:Kk ベアリングユニット、フリーボールベアリング、支持テーブル、搬送設備、ターンテーブル
CN101830351B (zh) * 2010-05-10 2012-07-04 友达光电股份有限公司 钳制组件、使用其的定位设备以及从定位设备移走物体的方法
CN102841505B (zh) * 2011-06-22 2015-06-17 上海微电子装备有限公司 一种可精确定位基板的工件台
CN106571329A (zh) * 2015-10-12 2017-04-19 沈阳拓荆科技有限公司 一种晶圆基板支架结构

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JPH10209250A (ja) * 1997-01-24 1998-08-07 Tabai Espec Corp 試料体位置決め装置
JPH11116048A (ja) * 1997-10-14 1999-04-27 Nikon Corp 基板搬送装置
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
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JPH07112802A (ja) * 1993-10-18 1995-05-02 Tokyo Electron Ltd 搬送装置
JPH07147311A (ja) * 1993-11-24 1995-06-06 Tokyo Electron Ltd 搬送アーム
JPH10209250A (ja) * 1997-01-24 1998-08-07 Tabai Espec Corp 試料体位置決め装置
JPH11116048A (ja) * 1997-10-14 1999-04-27 Nikon Corp 基板搬送装置
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120006237A1 (en) * 2009-04-14 2012-01-12 Kaoru Iguchi Free ball bearing, bearing unit, support table carrying equipment, and turntable
US8635960B2 (en) * 2009-04-14 2014-01-28 Iguchi Kiko Co., Ltd. Free ball bearing, bearing unit, support table carrying equipment, and turntable
US20140077431A1 (en) * 2012-09-20 2014-03-20 Varian Semiconductor Equipment Associates, Inc. System and Method for 2D Workpiece Alignment
US9082799B2 (en) * 2012-09-20 2015-07-14 Varian Semiconductor Equipment Associates, Inc. System and method for 2D workpiece alignment

Also Published As

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TW200534451A (en) 2005-10-16
CN1938843A (zh) 2007-03-28
TWI278082B (en) 2007-04-01
CN100479129C (zh) 2009-04-15
KR100847347B1 (ko) 2008-07-21
KR20060126597A (ko) 2006-12-07

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