WO2005098932A3 - Procede et dispositif pour alimenter une cavite de moule d'un materiau d'enrobage - Google Patents

Procede et dispositif pour alimenter une cavite de moule d'un materiau d'enrobage Download PDF

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Publication number
WO2005098932A3
WO2005098932A3 PCT/NL2005/000265 NL2005000265W WO2005098932A3 WO 2005098932 A3 WO2005098932 A3 WO 2005098932A3 NL 2005000265 W NL2005000265 W NL 2005000265W WO 2005098932 A3 WO2005098932 A3 WO 2005098932A3
Authority
WO
WIPO (PCT)
Prior art keywords
mould
encapsulating material
feed device
mould cavity
encapsulating
Prior art date
Application number
PCT/NL2005/000265
Other languages
English (en)
Other versions
WO2005098932A2 (fr
Inventor
Jong Willem Otto De
Johannes Lambertus Ge Venrooij
Original Assignee
Fico Bv
Jong Willem Otto De
Johannes Lambertus Ge Venrooij
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Jong Willem Otto De, Johannes Lambertus Ge Venrooij filed Critical Fico Bv
Priority to KR1020067022919A priority Critical patent/KR101199096B1/ko
Priority to JP2007507258A priority patent/JP4819796B2/ja
Publication of WO2005098932A2 publication Critical patent/WO2005098932A2/fr
Publication of WO2005098932A3 publication Critical patent/WO2005098932A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0077—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B29C45/0416—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement co-operating with fixed mould halves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/74—Heating or cooling of the injection unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé permettant d'alimenter une cavité de moule d'un matériau d'enrobage, le but étant d'enrober des composants électroniques. L'invention concerne également un dispositif destiné à alimenter une cavité de moule d'un matériau d'enrobage, le but étant d'enrober des composants électroniques, ainsi qu'un moule conçu pour enrober des composants électroniques que l'on peut appliquer en combinaison avec un tel dispositif d'alimentation.
PCT/NL2005/000265 2004-04-08 2005-04-07 Procede et dispositif pour alimenter une cavite de moule d'un materiau d'enrobage WO2005098932A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020067022919A KR101199096B1 (ko) 2004-04-08 2005-04-07 캡슐화 물질을 주형 공동에 공급하는 방법 및 장치
JP2007507258A JP4819796B2 (ja) 2004-04-08 2005-04-07 型空洞へ封入材料を供給するための方法およびデバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1025905A NL1025905C2 (nl) 2004-04-08 2004-04-08 Werkwijze en inrichting voor het aan een vormholte toevoeren van omhulmateriaal.
NLNL1025905 2004-04-08

Publications (2)

Publication Number Publication Date
WO2005098932A2 WO2005098932A2 (fr) 2005-10-20
WO2005098932A3 true WO2005098932A3 (fr) 2006-01-19

Family

ID=34964313

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2005/000265 WO2005098932A2 (fr) 2004-04-08 2005-04-07 Procede et dispositif pour alimenter une cavite de moule d'un materiau d'enrobage

Country Status (5)

Country Link
JP (1) JP4819796B2 (fr)
KR (1) KR101199096B1 (fr)
CN (1) CN100576479C (fr)
NL (1) NL1025905C2 (fr)
WO (1) WO2005098932A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107283782A (zh) * 2016-03-31 2017-10-24 宜品股份有限公司 热熔胶封装机
CN106608032A (zh) * 2016-12-09 2017-05-03 安徽优丽普科技股份有限公司 一种pvc板材连续挤塑设备
KR102477355B1 (ko) * 2018-10-23 2022-12-15 삼성전자주식회사 캐리어 기판 및 이를 이용한 기판 처리 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8302530A (nl) * 1983-07-14 1985-02-01 Jacob Van Noort Integrated circuit en werkwijze, spuitgietvorm en spuitgietmachine ter vervaardiging van voorwerpen.
JPH01317732A (ja) * 1988-06-20 1989-12-22 Japan Steel Works Ltd:The 射出成形機における射出能力向上方法及び装置
EP0787569A2 (fr) * 1996-01-31 1997-08-06 Sumitomo Bakelite Company Limited Procédé d'encapsulation d'un dispositif semi-conducteur par une résine époxy
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537474Y2 (fr) * 1987-03-25 1993-09-22
JPH08192438A (ja) * 1994-11-17 1996-07-30 Hitachi Ltd 半導体集積回路装置の製造方法およびそれに用いるモールド装置
JPH09141688A (ja) * 1995-11-20 1997-06-03 Towa Kk 電子部品の射出成形方法及び装置
JPH09286046A (ja) * 1996-04-23 1997-11-04 Matsushita Electric Works Ltd Ｌｉｍ成形装置
JP3992893B2 (ja) * 1999-12-02 2007-10-17 富士通株式会社 半導体装置のアンダーフィル方法
JP2001160129A (ja) * 2000-09-26 2001-06-12 Dainippon Printing Co Ltd Ｉｃカード用カード基材の製造方法
JP2003170465A (ja) * 2001-12-04 2003-06-17 Matsushita Electric Ind Co Ltd 半導体パッケージの製造方法およびそのための封止金型
JP4245417B2 (ja) * 2002-08-08 2009-03-25 アスリートＦａ株式会社 樹脂硬化システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8302530A (nl) * 1983-07-14 1985-02-01 Jacob Van Noort Integrated circuit en werkwijze, spuitgietvorm en spuitgietmachine ter vervaardiging van voorwerpen.
JPH01317732A (ja) * 1988-06-20 1989-12-22 Japan Steel Works Ltd:The 射出成形機における射出能力向上方法及び装置
EP0787569A2 (fr) * 1996-01-31 1997-08-06 Sumitomo Bakelite Company Limited Procédé d'encapsulation d'un dispositif semi-conducteur par une résine époxy
EP0985513A2 (fr) * 1996-01-31 2000-03-15 Sumitomo Bakelite Company Limited Procédé d'encapsulation d'un dispositif semi-conducteur par une résine époxy
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 121 (M - 0946) 7 March 1990 (1990-03-07) *

Also Published As

Publication number Publication date
JP2007533132A (ja) 2007-11-15
JP4819796B2 (ja) 2011-11-24
KR20070004079A (ko) 2007-01-05
KR101199096B1 (ko) 2012-11-08
WO2005098932A2 (fr) 2005-10-20
NL1025905C2 (nl) 2005-10-11
CN1957453A (zh) 2007-05-02
CN100576479C (zh) 2009-12-30

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