WO2005090211A1 - Dispositif de transfert avec fonction d’alignement - Google Patents

Dispositif de transfert avec fonction d’alignement Download PDF

Info

Publication number
WO2005090211A1
WO2005090211A1 PCT/JP2004/003611 JP2004003611W WO2005090211A1 WO 2005090211 A1 WO2005090211 A1 WO 2005090211A1 JP 2004003611 W JP2004003611 W JP 2004003611W WO 2005090211 A1 WO2005090211 A1 WO 2005090211A1
Authority
WO
WIPO (PCT)
Prior art keywords
flat panel
roller
contact support
wire
transfer
Prior art date
Application number
PCT/JP2004/003611
Other languages
English (en)
Japanese (ja)
Inventor
Ryoji Mori
Original Assignee
Daiichi Institution Industry Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiichi Institution Industry Co. Ltd. filed Critical Daiichi Institution Industry Co. Ltd.
Priority to PCT/JP2004/003611 priority Critical patent/WO2005090211A1/fr
Publication of WO2005090211A1 publication Critical patent/WO2005090211A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to a method for manufacturing a glass substrate or the like,
  • the present invention relates to a transfer device having a top panel alignment function and a flat panel alignment and transfer method.
  • a station may be provided in the middle of a glass substrate transfer line to adjust a transfer process.
  • a cassette that can accommodate a plurality of glass substrates is used as a buffer in front of the processing device, and the robot takes out one by one by a robot and transfers it to the processing device side.
  • the two are that a wire cassette is sometimes used to cope with an increase in the size of the glass substrate.
  • the storage positions of the glass substrates housed in this wire cassette vary, and it is desirable to perform alignment before placing them in the processing equipment. Good thing,
  • the present invention has been devised to solve the above-described problems.
  • a wire cassette is used to cope with an increase in the size of a glass substrate
  • non-contact alignment of a flat panel in a transfer device is required. It is an object of the present invention to provide an alignment, a transfer method, and a transfer device with an alignment function that can minimize the effects of contamination and static electricity on a flat panel. Disclosure of the invention
  • the present invention uses a conveyor device that transports a flat panel, and a transfer device that includes a wire cassette that moves up and down in a vertical direction so that the wires cross the transport surface of the conveyor device.
  • the flat panel which is accommodated in the wire cassette and descends, is received by the non-contact support portion of the conveyor device, and the flat panel floating on the non-contact support portion is moved by the roller device of the conveyor device. After guiding the flat panel to one roller device side with one of the roller devices, the roller device was raised to receive the end of the flat panel. Thereafter, the alignment and transfer method are characterized by driving the roller device.
  • the non-contact support portion of the conveyor device is lowered and the flat device is flattened by the roller device.
  • the alignment and transfer method may be characterized by driving the roller device after receiving the end of the panel.
  • the present invention includes a conveyor device that transports a flat panel, and a wire cassette that moves up and down in a vertical direction so that the wire crosses a transport surface of the conveyor device,
  • the conveyor device is disposed on both sides of the transport surface, and a non-contact support portion that supports the flat panel in a non-contact manner, and A roller device for guiding a flat panel supported by the non-contact support portion, an elevating device for elevating the roller device, and a horizontal moving device for moving at least one of the roller devices in the horizontal direction are provided.
  • a transfer device with an alignment function is provided.
  • a lifting device that raises and lowers the non-contact support portion may be used instead of the lifting device that raises and lowers the roller device according to the invention.
  • FIG. 1 is a perspective view of a transfer device with an alignment function
  • Fig. 2 is an exploded perspective view of the transfer device
  • Fig. 3 is a configuration example of a floating unit used in the transfer device
  • Fig. 4 Is a perspective view of the main part of the conveyor device of the transfer device
  • FIG. 5 is a schematic diagram of the operation of the transfer device
  • FIG. 6 is a graph showing static electricity data of a floating unit used in the transfer device.
  • FIG. 7 is a schematic diagram of the operation of a transfer device according to another example.
  • the transfer device with an alignment function according to the first embodiment (hereinafter simply referred to as transfer device) 1 has a transfer surface for transferring the flat panel G as shown in FIGS.
  • the conveyor device 2 includes a wire cassette 3 that moves up and down in the vertical direction so that the wire 31 intersects the transfer surface 20.
  • the conveyor device 2 moves a plurality of conveyor cutouts 2A at predetermined intervals corresponding to the mounting position and the elevating position of the wire 31 so that the wire 31 of the wire cassette 3 can be moved up and down. , And are arranged on both sides of the transfer surface 20.
  • Each conveyor unit 2A is a floating unit 21 serving as a non-contact support portion for supporting the flat panel G in a non-contact manner each time the flat panel G is put in and out of the wire cassette 3, and a flat unit floating by the floating unit 21.
  • a roller device 22 for guiding the panel G and a lifting device 23 for lifting and lowering the roller device 22 are provided.
  • the roller device 22 on either side of the transfer surface 20 is provided with a horizontal movement device 224 for moving the roller in the horizontal direction.
  • the floating unit 21 is attached to the chamber 210, a plate 21 fixed to the upper surface of the chamber 210, and the plate 21. It comprises a porous body 2 12 fixed to the hole 2 11 a provided and a hose means 2 13 for sending air into the chamber 210.
  • the plate-like body 211 is formed of, for example, an aluminum plate having a width of about 300 mm, a length of about 80 Omm and a thickness of about 4 mm, and the holes 211a are formed at predetermined intervals.
  • the chamber is formed so as to communicate with the inside of the chamber 210. In this hole 2 12a, a step 2b for attaching the porous body 2 12 is formed.
  • the flatness of the surface of the plate-like body 211 is desirably accurate.
  • the porous body 212 is finely dispersed and ejected from the surface 211c by the formed pores. Any material can be used as long as it has a predetermined porosity.
  • it is made of ceramic, glass, synthetic resin, or metal, and has a substantially disk shape.
  • the shape is not limited to this, and may be, for example, a square shape. Can be molded.
  • the porous body 2 1 2 is engaged with the step 2 2 b of the hole 2 1 2 a of the plate 2 1 1, and the surface 2 1 2 c is formed on the surface of the plate 2 2 1. Are fixed to form substantially the same plane.
  • a floating unit 21 for example, when compressed air is supplied as a fluid from a supply means (not shown), the air is released from the surface 211 c of the polysodium body 212. Is done.
  • a flat panel G such as a glass substrate is placed on the transfer surface 20, air stays between the flat panel G and the plate-like body 211 to form a gas film.
  • the flat panel G is levitated, and the flat panel G can be brought into a state in which it can be aligned without contact.
  • the surface 2 12 c of the porous body 2 12 may be arranged so as to be about 0.1 to 0.2 mm lower than the surface of the plate-shaped body 2 11.
  • the volume of the gas film is a product of the area of the back surface of the flat panel G, the flying height, and the area of the surface of the plate-like body 211 corresponding to the area of the back surface of the flat panel G.
  • the roller device 22 is disposed on a mounting frame 22 that is removably mounted on the upper mounting base 221, and the upper mounting base 22 is a lower mounting base 22.
  • the elevating device 23 can move up and down.
  • the roller device 22 includes a driving roller 22 3 driven by a driving source such as a motor housed in the mounting frame 22 2 and a free roller 22 4.
  • Each of the two rollers 22 3 and 22 4 is provided with a guide flange portion 22 5 and a transport portion 22 6 for transporting an end of the flat panel G placed thereon.
  • the guide flange portion 225 is formed concentrically with the transfer portion 226 and guides the outer edge of the end of the flat panel G.
  • the elevating device 23 raises and lowers the upper mounting base 22 1 using, for example, a hydraulic cylinder, an air cylinder, or a pawn wrench.
  • the horizontal moving device 224 moves the mounting frame 222 in the horizontal direction to perform the alignment of the flat panel G, and includes a hydraulic cylinder, an air cylinder, a pole screw, or the like.
  • the supply means supplies, for example, air (cleanliness class: about 10) supplied from a compressor, and is connected to the hose means 21.
  • the wire cassette 3 includes an outer frame 30, wires 31 stretched at predetermined intervals in the vertical direction of the outer frame 30, for example, at intervals of approximately 3 cm, and a lifting device 3 2. Consists of
  • Conveyor unit 2A is a wire cassette for this wire cassette 3.
  • the upper end of the transfer unit 226 of the roller unit 22 has a height of several millimeters with respect to the surface of the plate-shaped body 21. It is located at.
  • An operation example in the case where the flat panel G is transferred from the wire cassette 3 to the processing device from this state will be described.
  • the wire cassette 3 accommodates a flat panel G for each wire 31, and the wire cassette 3 descends every time the flat panel G is transferred to the processing device side.
  • the floating flat panel G is guided by the guide flanges 22 of the rollers 22 3 and 22 4 of the roller device ft 22, and the gap between the guides 2 25.
  • One of the roller devices 22 is moved toward the other roller device 22 by the horizontal movement device 224, and the flat panel G is positioned in the lateral direction ( (Fig. 5 (B)).
  • roller device 22 is raised by the elevating device 23 and returned to its initial position, and the end of the flat panel G is placed on the carry-out portion 226 of the roller device 22 and transported (see FIG. 5 (C)).
  • the elevating device 32 lowers the uppermost wire 31 of the wire cassette 3 to a position substantially equal to the carrying surface 20 and the uppermost wire
  • the flat panel O may be loaded into the lower wires 31 sequentially from 31 while raising the wire cassette 3.
  • the flat panel G When the flat panel G is loaded, the flat panel G can be loaded in a non-contact manner by using the floating unit 21.
  • the terminal of the flat panel G where the rollers 2 2 3 and 2 2 4 come into contact is Although cut off in the final product, the rollers 222, 224 do not come into contact with the flat panel G other than at the end, so that damage to the internal circuit due to static electricity can be avoided.
  • the graph in Fig. 6 plots the amount of charge between the contact area of the roller and the non-contact area at the center of the glass substrate so that it can be compared.
  • the value of the charge is substantially equal to zero in the non-contact area at the center of the glass substrate.
  • the robot receives the aligned flat panel G via a single-wafer conveyer approximately equal to the height of the processing unit. Therefore, when mounting the flat panel G on the processing unit, the robot moves up and down. The lifting stroke does not increase.
  • the roller device 22 is used, but a belt conveyor system may be used from the viewpoint of preventing generation of static electricity.
  • the flat panel G as the object to be levitated is assumed to be a flat panel for flat panel displays such as liquid crystal display (LCD), plasma display (PDP), field emission display (FED), and electroluminescent display (EL). are doing. These panels include glass substrates and synthetic resin substrates such as plastics.
  • This embodiment is characterized in that the levitation cut 21 of the transfer device of the first embodiment is raised and lowered.
  • the other configuration is the same as that of the first embodiment, and thus the detailed configuration is omitted.
  • the lifting unit 21 is provided with a descent unit 211, and when the wire cassette 3 is lowered, the lifting unit 21 is raised at that point. Air is supplied from the supply means, and the flat panel G is received by the floating unit 21 in a non-contact manner (FIG. 7 (A)).
  • the floating flat panel G is guided by guide flanges 225 of the rollers 223 and 224 of the roller device 22 and is located between the guides 225. Therefore, one of the roller devices 22 is moved toward the other roller device 22, and the flat panel G is exposed in the horizontal direction (FIG. 7 (B)).

Abstract

Il est prévu un dispositif d’alignement, un procédé de transfert, et un dispositif de transfert avec fonction d’alignement d’un panneau plat capable de réaliser l’alignement et de réduire les effets de la contamination et l’électricité statique sur le panneau plat, le dispositif de transfert comprenant un appareil à convoyeur pour transporter le panneau plat et une cassette de fil se soulevant à la verticale pour que le fil traverse la face de transport de l’appareil à convoyeur. Le panneau plat stocké dans la cassette à fil est reçu par une pièce support sans contact, et le panneau plat alors flottant est guidé par des dispositifs à galets avec les flasques de guidage de l’appareil à convoyeur. Une fois que le panneau plat est transféré vers l’un de ces dispositifs à galets par l’autre dispositif à galets, les dispositifs à galets des deux côtés sont relevés et entraînés.
PCT/JP2004/003611 2004-03-18 2004-03-18 Dispositif de transfert avec fonction d’alignement WO2005090211A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/003611 WO2005090211A1 (fr) 2004-03-18 2004-03-18 Dispositif de transfert avec fonction d’alignement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/003611 WO2005090211A1 (fr) 2004-03-18 2004-03-18 Dispositif de transfert avec fonction d’alignement

Publications (1)

Publication Number Publication Date
WO2005090211A1 true WO2005090211A1 (fr) 2005-09-29

Family

ID=34993574

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/003611 WO2005090211A1 (fr) 2004-03-18 2004-03-18 Dispositif de transfert avec fonction d’alignement

Country Status (1)

Country Link
WO (1) WO2005090211A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797513A (zh) * 2012-12-18 2015-07-22 日本电气硝子株式会社 工件输送装置和工件输送方法
CN111294476A (zh) * 2018-12-10 2020-06-16 捷普电子(广州)有限公司 扫描机及自动导正模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969549A (ja) * 1995-08-31 1997-03-11 Shibaura Eng Works Co Ltd ロ−デイング装置
JPH1029709A (ja) * 1996-07-12 1998-02-03 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH10218353A (ja) * 1997-02-07 1998-08-18 Orc Mfg Co Ltd 薄板状ワークの搬送方法
JP2004115137A (ja) * 2002-09-24 2004-04-15 Hitachi Kiden Kogyo Ltd 薄板搬送装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969549A (ja) * 1995-08-31 1997-03-11 Shibaura Eng Works Co Ltd ロ−デイング装置
JPH1029709A (ja) * 1996-07-12 1998-02-03 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH10218353A (ja) * 1997-02-07 1998-08-18 Orc Mfg Co Ltd 薄板状ワークの搬送方法
JP2004115137A (ja) * 2002-09-24 2004-04-15 Hitachi Kiden Kogyo Ltd 薄板搬送装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797513A (zh) * 2012-12-18 2015-07-22 日本电气硝子株式会社 工件输送装置和工件输送方法
CN104797513B (zh) * 2012-12-18 2016-10-05 日本电气硝子株式会社 工件输送装置和工件输送方法
CN111294476A (zh) * 2018-12-10 2020-06-16 捷普电子(广州)有限公司 扫描机及自动导正模块

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