WO2005081290A1 - Appareil d’exposition et procede de fabrication du dispositif - Google Patents

Appareil d’exposition et procede de fabrication du dispositif Download PDF

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Publication number
WO2005081290A1
WO2005081290A1 PCT/JP2005/002228 JP2005002228W WO2005081290A1 WO 2005081290 A1 WO2005081290 A1 WO 2005081290A1 JP 2005002228 W JP2005002228 W JP 2005002228W WO 2005081290 A1 WO2005081290 A1 WO 2005081290A1
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WO
WIPO (PCT)
Prior art keywords
substrate
liquid
exposure apparatus
base member
optical system
Prior art date
Application number
PCT/JP2005/002228
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English (en)
Japanese (ja)
Inventor
Takeyuki Mizutani
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2006510195A priority Critical patent/JP4797984B2/ja
Publication of WO2005081290A1 publication Critical patent/WO2005081290A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Definitions

  • the present invention relates to an exposure apparatus and a device manufacturing method for exposing a substrate by irradiating the substrate with exposure light via a liquid.
  • Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate.
  • An exposure apparatus used in the photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and sequentially moves the mask stage and the substrate stage to project a pattern of the mask through a projection optical system. Transfer to the substrate.
  • further improvement in the resolution of the projection optical system has been desired in order to cope with higher integration of device patterns.
  • the resolution of the projection optical system increases as the exposure wavelength used decreases and as the numerical aperture of the projection optical system increases. Therefore, the exposure wavelength used in the exposure apparatus is becoming shorter year by year, and the numerical aperture of the projection optical system is also increasing.
  • the mainstream exposure wavelength is 248 nm of KrF excimer laser, and 193 nm of short wavelength ArF excimer laser is being put to practical use.
  • the depth of focus (DOF) is as important as the resolution.
  • the resolution R and the depth of focus ⁇ are respectively represented by the following equations.
  • ⁇ is the exposure wavelength
  • ⁇ is the numerical aperture of the projection optical system
  • k is the process coefficient
  • Patent Document 1 International Publication No. 99Z49504 pamphlet
  • the exposure light Exposure failure may occur without being incident on the desired position on the substrate. Also, if the supplied liquid leaks onto the substrate or onto the substrate stage that holds the substrate, the liquid around the substrate stage and the electrical equipment may be damaged by the liquid, and inconveniences such as electric leakage or failure may occur. In addition, if the leaked liquid is diffused, the damage will increase, and the return operation will require a lot of time and labor, which will lower the operation rate of the exposure apparatus.
  • the present invention has been made in view of such circumstances, and uses an exposure apparatus that can prevent a decrease in the operation rate of an exposure apparatus, an exposure apparatus that can prevent exposure failure, and use of these exposure apparatuses. It is an object to provide a device manufacturing method.
  • the present invention employs the following configuration corresponding to Figs.
  • the reference numerals in parentheses attached to each element are merely examples of the element, and do not limit each element.
  • the exposure apparatus (EX) of the present invention is an exposure apparatus that exposes a substrate (P) by irradiating exposure light (EL) onto a substrate (P) via a liquid (LQ), wherein the first base member (BP1) And a substrate stage (PST) that movably holds the substrate (P), and a second base member (BP2) that supports the substrate stage (PST), and leaks onto the second base member (BP2).
  • First base of liquid (LQ) Diffusion to the member (BP1) is prevented.
  • the present invention even if a liquid leaks from a substrate or a substrate stage holding the substrate onto a second base member supporting the substrate stage, diffusion to the first base member is prevented. Because it is prevented, the spread of damage caused by the leaked liquid can be prevented. Further, since the damage caused by the leaked liquid is prevented from spreading, it is only necessary to perform a return operation to, for example, only the damaged device among the plurality of devices constituting the exposure apparatus. Therefore, the operation of returning the exposure apparatus can be performed smoothly, and the time until the return can be shortened. Therefore, exposure processing can be performed without lowering the operation rate of the exposure apparatus.
  • the exposure apparatus (EX) of the present invention is an exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the liquid (LQ).
  • First electrical system (120B) including 9, 47, 48, 100B, 400, 500, PST, PSTC, etc., and second device (6, 7, 82, 100A, CONT, IL, MST, PL, etc.)
  • second electrical system (12 OA) that is independent of the first electrical system (120B), even if the first electrical system (120B) stops due to leakage of the liquid (LQ),
  • the second electric system (120A) is operable.
  • the second electric system is operable, so that the driving of the second device can be continued.
  • the return work may be performed only on the first electrical system including the first device. Therefore, the return work time and the time until the exposure apparatus returns can be shortened, and a decrease in the operation rate of the exposure apparatus can be prevented.
  • the exposure apparatus (EX) of the present invention exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the projection optical system (PL) and the liquid (LQ).
  • the exposure apparatus has a supply port (12) for supplying a liquid (LQ) on a substrate (P) moving in a first direction (X), and the supply port (12) is provided in the first direction (X). With respect to (X), they are provided on both sides of the projection area (AR1) of the projection optical system (PL), respectively.
  • the movement distance of the substrate (P) in the first direction (X) is Ll, When the distance between them is L2,
  • a liquid supply port is provided so as to satisfy the above condition, By setting the moving distance of the liquid, the liquid immersion area can be satisfactorily formed on the optical path of the exposure light with the fresh liquid supplied from the liquid supply port, and the exposure processing can be performed.
  • the exposure apparatus (EX) of the present invention exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the projection optical system (PL) and the liquid (LQ).
  • the exposure apparatus has a supply port (12) that is connected to the supply pipe (13) and supplies the liquid (LQ) onto the substrate (P) moving in the first direction (X).
  • the liquid supply amount per unit time supplied to the supply port (12) is Q
  • the area of the supply port (12) is S
  • the width of the supply port (12) in the first direction (X) is H
  • the supply port is
  • the flow velocity of the liquid (LQ) supplied onto the substrate (P) from (12) is U
  • the moving speed of the substrate (P) is V
  • the distance between the projection optical system (PL) and the substrate (P) is WD.
  • the immersion area can be satisfactorily formed on the optical path of the exposure light with the liquid supplied from the liquid supply port. Exposure processing.
  • the exposure apparatus (EX) of the present invention is an exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the liquid (LQ). It has a substrate stage (PST) that can move while holding the substrate (P), and a liquid supply mechanism (10) that supplies liquid (LQ) .
  • the liquid supply mechanism (10) is connected to the substrate stage (PST). It is characterized by having a plate-like member (72) which is arranged to face each other and has a plurality of liquid supply holes (71).
  • the liquid can be uniformly supplied onto the substrate stage via the plurality of liquid supply holes. Therefore, it is possible to form the liquid immersion area well and perform the exposure processing.
  • a device manufacturing method uses the above-described exposure apparatus. According to the present invention, since the leakage of the liquid and the diffusion of the leaked liquid can be prevented, the exposure processing can be performed while preventing the inconvenience caused by the leaked liquid. Further, according to the present invention, the immersion area can be formed favorably, and the exposure processing can be performed without lowering the exposure accuracy. Therefore, a device having desired performance can be manufactured. The invention's effect
  • the present invention it is possible to prevent a decrease in the operation rate of an exposure apparatus, and to use this apparatus. This makes it possible to manufacture a device with reduced manufacturing costs. Further, according to the present invention, exposure processing of a substrate can be performed by favorably forming a liquid immersion region. By using this apparatus, device manufacturing can be performed while maintaining a high yield.
  • FIG. 1 is a schematic configuration diagram showing one embodiment of an exposure apparatus of the present invention.
  • FIG. 2 is a plan view of the substrate stage as viewed from above.
  • FIG. 3 is a diagram showing a liquid supply mechanism and a liquid recovery mechanism.
  • FIG. 4 is a plan view showing a positional relationship between a first base member and a second base member.
  • FIG. 5 is a perspective view showing a measuring device for measuring a relative position between a first base member and a second base member.
  • FIG. 6 is a schematic diagram for explaining how the leaked liquid flows.
  • FIG. 7 is a schematic view showing one embodiment of a liquid recovery mechanism for recovering a liquid flowing between a first base member and a second base member.
  • FIG. 8 is a diagram showing a positional relationship between a liquid supply port and a liquid recovery port.
  • FIG. 9 is a schematic diagram for explaining conditions of a liquid supply mechanism.
  • FIG. 10 is a sectional view showing another embodiment of the liquid supply mechanism and the liquid recovery mechanism.
  • FIG. 11 is a plan view showing another embodiment of the liquid supply mechanism and the liquid recovery mechanism.
  • FIG. 12 is a flowchart showing an example of a semiconductor device manufacturing process.
  • Liquid recovery mechanism liquid receiving member
  • 71 Liquid supply holes 72 Supply plate
  • 73 Liquid recovery holes 74 Recovery plate
  • 82 Laser interferometer 90... Measuring device (first measuring device), 100 ⁇ ⁇ Main power source (1st power source), 100 ⁇ ⁇ Power source for stage (2nd power source), 120A... Main electrical system (2nd electrical device) ), 120 ⁇ ⁇ Stage electrical system (first electrical system), 130... wireless device, 400... illuminance unevenness sensor (sensor system), 500... aerial image measurement sensor (sensor system), AR1... projection area, AR2 ” 'Immersion area, BP1... First base member, ⁇ 2 ⁇ Second Base member, CONT: Main controller, EL: Exposure light, EX: Exposure device, LQ: Liquid, M: Mask, MST: Mask stage (mask holding member), P: Substrate, PL: Projection optical system, PST: Substrate stage, PSTC ... Stage control device, S1-S24
  • FIG. 1 is a schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention.
  • an exposure apparatus EX includes a mask stage MST for supporting a mask M, a substrate stage PST for supporting a substrate P, and an illumination for illuminating the mask M supported by the mask stage MST with exposure light EL.
  • the exposing device EX has a main column 3 that supports the mask stage MST and the projection optical system PL.
  • the main column 3 is provided on a first base member BP1 placed horizontally on the floor FD.
  • the main column 3 has an upper step 3A and a lower step 3B protruding inward.
  • the exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which the immersion method is applied in order to substantially shorten the exposure wavelength and improve the resolution and to substantially widen the depth of focus.
  • pure water is used for the liquid LQ.
  • the exposure apparatus EX at least partially transfers the pattern image of the mask M onto the substrate P using the liquid LQ supplied from the liquid supply mechanism 10 on the substrate P including the projection area AR1 of the projection optical system PL. Then, an immersion area AR2 larger than the projection area AR1 and smaller than the substrate P is locally formed.
  • the exposure apparatus EX fills the liquid LQ between the optical element 2 at the image plane side tip of the projection optical system PL and the surface (exposure surface) of the substrate P, and the projection optical system PL and the substrate P
  • the substrate P is exposed by projecting a pattern image of the mask M onto the substrate P via the liquid LQ and the projection optical system PL.
  • the exposure apparatus EX the mask M and the substrate P are scanned in the scanning direction (predetermined direction).
  • a scanning type exposure apparatus a so-called scanning stepper
  • the synchronous movement direction (scanning direction, predetermined direction) between the mask M and the substrate P in the horizontal plane is the X-axis direction
  • the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction).
  • the direction perpendicular to the X-axis and Y-axis directions and coinciding with the optical axis AX of the projection optical system PL is defined as the Z-axis direction.
  • the rotation (tilt) directions around the X, Y, and Z axes are defined as 0X, 0Y, and 0Z directions, respectively.
  • the “substrate” includes a semiconductor wafer coated with a resist
  • the “mask” includes a reticle on which a device pattern to be reduced and projected onto the substrate is formed.
  • the illumination optical system (illumination system) IL is supported by a support column 5 fixed on the upper part of the main column 3. Therefore, the illumination optical system IL is configured to be supported on the first base member BP1 via the main column 3 and the support column 5.
  • the illumination optical system IL illuminates the mask M supported on the mask stage MST with the exposure light EL, and is used to make the illuminance of the exposure light source and the luminous flux emitted from the exposure light source uniform. It has an integrator, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, and a variable field stop that sets the illumination area on the mask M by the exposure light EL in a slit shape. A predetermined illumination area on the mask M is illuminated by the illumination optical system IL with exposure light EL having a uniform illuminance distribution.
  • Exposure light EL that is emitted is, for example, a bright line (g-line, h-line, i-line) that also emits a mercury lamp power, or a deep ultraviolet light (DUV light) such as a KrF excimer laser light (wavelength 248 nm). And vacuum ultraviolet light (VUV) such as ArF excimer laser light (wavelength 193 nm) and F laser light (wavelength 157 nm).
  • a bright line g-line, h-line, i-line
  • DUV light deep ultraviolet light
  • ArF excimer laser light wavelength 193 nm
  • F laser light wavelength 157 nm
  • ArF excimer laser light is used.
  • the liquid LQ in the present embodiment is pure water, and can be transmitted even when the exposure light EL is ArF excimer laser light. Pure water is also capable of transmitting bright ultraviolet rays (g-line, h-line, i-line) and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength: 248 nm).
  • the mask stage (mask holding member) MST movably holds the mask M, and has an opening 34A at the center thereof through which a pattern image of the mask M passes.
  • a mask surface plate 31 is supported on the upper step 3A of the main column 3 via an anti-vibration unit 6.
  • the anti-vibration unit 6 has a passive anti-vibration mechanism such as an air damper and an actuator (such as an electromagnetic actuator) driven by electric power, and actively transmits vibration between the mask surface plate 31 and the main column 3. Is curtailed.
  • the anti-vibration units 6 are provided in at least three places, and each can be driven based on a command from the main control unit CONT to adjust the position (posture) of the mask base 31.
  • An opening 34B through which the pattern image of the mask M passes is also formed in the center of the mask base 31.
  • a plurality of gas bearings (air bearings) 32 which are non-contact bearings, are provided on the lower surface of the mask stage MST.
  • the mask stage MST is supported in a non-contact manner with respect to the upper surface (guide surface) 31 A of the mask surface plate 31 by an air bearing 32, and is moved to the optical axis AX of the projection optical system PL by a mask stage drive system such as a linear motor. It can be moved two-dimensionally in a vertical plane, that is, in the XY plane, and can be slightly rotated in the Z direction.
  • the mask stage MST since the mask stage MST is supported on the mask base 31 supported by the upper step 3A of the main column 3, the mask stage MST passes through the main column 3 and the mask base 31. It is configured to be supported on the first base member BP1.
  • a movable mirror 35 is provided at a predetermined position on the + X side on the mask stage MST.
  • a laser interferometer 36 is provided at a position facing the movable mirror 35.
  • a movable mirror is also provided on the + Y side on the mask stage MST, and a laser interferometer is provided at a position facing the movable mirror.
  • the position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the ⁇ Z direction are measured in real time by the laser interferometer 36, and the measurement results are obtained. Is output to the main controller CONT.
  • the main controller CONT drives the mask stage driving system based on the measurement result of the laser interferometer 36 to position the mask M supported by the mask stage MST.
  • the projection optical system PL is for projecting and exposing the pattern of the mask M onto the substrate P at a predetermined projection magnification 13 and includes a plurality of optical elements (lenses) 2 provided at the front end on the substrate P side. These optical elements are supported by a lens barrel PK.
  • the projection optical system PL is a reduction system with a projection magnification j8 of, for example, 1Z4 or 1Z5. It is. Note that the projection optical system PL may be either a unity magnification system or an enlargement system.
  • the optical element 2 at the distal end of the projection optical system PL of the present embodiment is provided so as to be detachable (replaceable) from the lens barrel PK. Further, the optical element 2 at the tip is exposed from the lens barrel PK, and the liquid LQ in the liquid immersion area A R2 comes into contact with the optical element 2. This prevents corrosion of the lens barrel PK made of metal.
  • the optical element 2 is formed of fluorite. Since fluorite has a high affinity for pure water, the liquid LQ can be brought into close contact with almost the entire liquid contact surface 2A of the optical element 2. That is, in the present embodiment, since the affinity for the liquid contact surface 2A of the optical element 2 is high and the liquid (water) LQ is supplied, the liquid contact surface 2A of the optical element 2 and the liquid The optical element 2 having high adhesion to LQ may be quartz having high affinity for water. Further, the liquid contact surface 2A of the optical element 2 is subjected to a hydrophilic (lyophilic) treatment so as to further enhance the affinity with the liquid LQ.
  • a flange FLG is provided on the outer periphery of the lens barrel PK.
  • a lens barrel base 8 is supported on the lower step portion 3B of the main column 3 via a vibration isolation unit 7.
  • the anti-vibration unit 7 has a passive anti-vibration mechanism such as an air damper and an actuator (such as an electromagnetic actuator) driven by electric power, and transmits vibration between the lens barrel base 8 and the main column 3. Is actively suppressed.
  • the vibration isolating units 7 are provided in at least three places, and each can be driven based on a command from the main control unit CONT to adjust the position (posture) of the lens barrel base 8.
  • the lens barrel PK is supported by the lens barrel base 8 by the engagement of the flange portion FLG with the lens barrel base 8.
  • the barrel PK of the projection optical system PL is supported on the barrel base 8 supported by the lower step 3B of the main column 3. Therefore, the projection optical system PL is configured to be supported on the first base member BP1 via the main column 3 and the barrel base 8.
  • the substrate stage PST movably holds the substrate P via a substrate holder PH, and a plurality of gas bearings (air bearings) 42 as non-contact bearings are provided on the lower surface thereof. You.
  • the substrate stage PST is supported by an air bearing 42 in a non-contact manner with respect to an upper surface (guide surface) 41 A of a substrate surface plate 41. Non-contact supported on guide surface 41A
  • the substrate stage PST is movable along the guide surface 41A.
  • the substrate stage PST can be moved two-dimensionally in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane, and can be slightly rotated in the ⁇ Z direction by a substrate stage drive system such as a linear motor. Further, the substrate stage PST is provided so as to be movable also in the Z-axis direction, the ⁇ X direction, and the ⁇ Y direction.
  • the substrate surface plate 41 is supported on a second base member BP2 different from the first base member BP1 via the vibration isolation unit 9.
  • the vibration isolation unit 9 has a passive vibration isolation mechanism such as an air damper and an actuator (such as an electromagnetic actuator) driven by electric power.
  • the vibration isolation unit 9 is connected to the board surface plate 41 and the second base member BP2 (floor FD). The transmission of vibrations between them is actively suppressed.
  • the vibration isolating units 9 are provided in at least three places, and each of them is driven based on a command from the main control unit CONT (or a stage control unit PSTC described later), so that the position of the board surface plate 41 ( Attitude) can be adjusted.
  • the substrate stage PST is configured to be supported on a second base member BP2 via a substrate surface plate 41.
  • a gap (gap) 4 is formed between the first base member BP1 and the second base member BP2.
  • the second base member BP2 is mounted on the liquid receiving member 60, and the liquid receiving member 60 is provided on the floor FD. That is, the second base member BP2 is provided on the floor FD via the liquid receiving member 60.
  • the liquid receiving member 60 collects the liquid LQ flowing in the gap 4 between the first base member BP1 and the second base member BP2, and has a bottom plate 60A larger than the second base member BP2 and a bottom plate 60A. And a peripheral wall 60B surrounding the periphery of 60A.
  • the liquid receiving member 60 is preferably configured to be able to hold a larger amount of liquid by about 10 to 20% than the expected maximum amount of leaked liquid. Further, the liquid receiving member may be arranged on the second base member BP2, and the substrate surface plate 41 may be further arranged on the liquid receiving member via the vibration isolation unit 9. In this case, the liquid receiving member 60 below the second base member BP may be omitted or used together.
  • a gas supply system 150 for flowing gas toward the gap 4 is provided above the gap 4. The gas supply system 150 is provided at least above the substrate stage PST, and further above the liquid supply port 12.
  • the substrate stage drive system includes an X guide stage 44 that supports the substrate stage PST movably in the X-axis direction.
  • the substrate stage PST can be moved at a predetermined stroke in the X-axis direction by the X linear motor 47 while being guided by the X guide stage 44.
  • the X linear motor 47 includes a stator 47A provided on the X guide stage 44 so as to extend in the X-axis direction, and a mover 47B provided corresponding to the stator 47A and fixed to the substrate stage PST. ing. Then, when the mover 47B is driven relative to the stator 47A, the substrate stage PST moves in the X-axis direction.
  • the substrate stage PST is supported in a non-contact manner by a magnet and a magnetic guide, which maintains a predetermined gap in the Z-axis direction with respect to the X guide stage 44.
  • the substrate stage PST is moved in the X-axis direction by the X linear motor 47 in a state of being supported by the X guide stage 44 in a non-contact manner.
  • a pair of Y linear motors 48, 48 capable of moving the X guide stage 44 in the Y axis direction together with the substrate stage PST are provided.
  • Each of the ⁇ linear motors 48 includes a mover 48B provided at both ends in the longitudinal direction of the X guide stage 44, and a stator 48A provided corresponding to the mover 48B. Then, when the mover 48B is driven relative to the stator 48A, the X guide stage 44 moves in the Y-axis direction together with the substrate stage PST. Also, by adjusting the drive of each of the Y linear motors 48, 48, the X guide stage 44 can be rotated in the ⁇ Z direction. Therefore, the Y linear motors 48 enable the substrate stage PST to move in the Y-axis direction and the ⁇ Z direction almost integrally with the X guide stage 44.
  • Guide portions 49 for guiding the movement of the X guide stage 44 in the Y-axis direction are provided on both sides of the substrate surface plate 41 in the X-axis direction.
  • the guide part 49 is supported on the base plate 4.
  • a concave guided member 45 is provided at each of both longitudinal ends of the lower surface of the X guide stage 44.
  • the guide portion 49 is engaged with the guided member 45, and is provided such that the upper surface (guide surface) of the guide portion 49 and the inner surface of the guided member 45 face each other.
  • a gas bearing (air bearing) 46 which is a non-contact bearing is provided on the guide surface of the guide portion 49.
  • the X guide stage 44 is supported in a non-contact manner with respect to the guide surface of the guide portion 49.
  • a movable mirror 80 is provided at a predetermined position on the + X side on the substrate stage PST (substrate holder PH), and a reference mirror (fixed mirror) 81 is provided at a predetermined position on the + X side of the lens barrel PK. ing. Further, a laser interferometer 82 is provided at a position facing the movable mirror 80. The laser interferometer 82 irradiates the measuring beam (measuring light) to the movable mirror 80 and irradiates the reference mirror 81 with the reference beam (reference light) via the mirrors 83A and 83B.
  • the reflected light from each of the moving mirror 80 and the reference mirror 81 based on the irradiated measuring beam and the reference beam is received by the light receiving section of the laser interferometer 82, and the laser interferometer 82 interferes with these lights to form the reference beam.
  • the amount of change in the optical path length of the measurement beam based on the optical path length, and thus the position (coordinates) and displacement of the movable mirror 80 with respect to the reference mirror 81 are measured. Since the reference mirror 81 is supported by the barrel PK of the projection optical system PL and the movable mirror 80 is supported by the substrate stage PST, the laser interferometer 82 measures the position of the substrate stage PST based on the barrel PK. I do.
  • the laser interferometer 82 is mounted on the lens barrel base 8 supporting the projection optical system PL (the main column 3). Measure the positional relationship between the substrate stage and PST.
  • the reference mirror 81 may be provided on the barrel base 8 instead of the barrel PK.
  • a moving mirror and a reference mirror are also provided on the substrate stage PST and on the + Y side of the lens barrel PK, and a laser interferometer is provided at a position facing these.
  • the position and the rotation angle of the substrate P on the substrate stage PST in the two-dimensional direction are measured by the laser interferometer 82 in real time.
  • the substrate stage drive system is supported by the substrate stage PST by moving the substrate stage PST in a two-dimensional coordinate system defined by the laser interferometer 82 based on the measurement result of the laser interferometer 82.
  • the board P is positioned in the X-axis and Y-axis directions.
  • the exposure apparatus EX has a focus detection system (not shown) for detecting surface position information on the surface of the substrate P.
  • the focus detection system projects the detection light from the oblique direction to the surface (exposure surface) of the substrate P via the liquid LQ, and receives the reflected light from the substrate P via the liquid LQ. Detect surface position information.
  • Focus detection The output system detects a position (focus position) of the surface of the substrate P in the z-axis direction with respect to a predetermined reference plane (for example, an image plane). Further, the focus detection system can also obtain the attitude of the substrate P in the tilt direction by obtaining each focus position at each of a plurality of points on the surface of the substrate P.
  • the focus detection system for example, the configuration disclosed in Japanese Patent Application Laid-Open No. 8-37149 can be used. Further, the focus detection system may project the detection light onto the surface of the substrate P without passing through the liquid LQ and receive the reflected light.
  • the substrate stage drive system controls the position (focus position) in the Z-axis direction of the substrate P held by the substrate stage PST, and the position in the X and Y directions. That is, the substrate stage drive system drives the substrate stage PST based on the detection result of the focus detection system, controls the focus position (Z position) and the tilt angle of the substrate P, and controls the surface of the substrate P (the exposure surface). ) Is adjusted to the image plane formed via the projection optical system PL and the liquid LQ.
  • a recess 55 is provided on the substrate stage PST, and the substrate holder PH is disposed in the recess 55. Then, the upper surface 51 of the substrate stage PST other than the concave portion 55 has a flat surface (flat portion) that is almost the same height (flat) as the surface of the substrate P held in the substrate holder PH! /
  • the upper surface 51 of the substrate stage PST is liquid-repellent and has a liquid-repellent property.
  • the liquid-repellent treatment includes, for example, a liquid-repellent material such as a fluorine resin material or an acrylic resin material. Coating or affixing a thin film made of the liquid-repellent material.
  • a material that is insoluble in the liquid LQ is used as the liquid-repellent material for making the liquid-repellent. Since the upper surface 51, which is almost flush with the surface of the substrate P, is provided around the substrate P, the liquid LQ is applied to the image plane side of the projection optical system PL even when performing immersion exposure on the edge region of the surface of the substrate P.
  • the liquid immersion area AR2 can be formed favorably by holding. However, as long as the liquid immersion area AR2 can be held well, even if there is a step between the surface of the substrate P and the upper surface 51, no force is exerted. Also, there is a gap of about 0.1 to 2 mm between the edge of the substrate P and the flat surface 51 provided around the substrate P. The liquid LQ flows into the gap due to the surface tension of the liquid LQ. The liquid LQ can be held under the projection optical system PL even when exposing the edge region of the substrate P.
  • FIG. 2 shows a substrate stage PST, which is a movable body that can hold and move the substrate P, as viewed from above.
  • movable mirrors 80 are arranged on two mutually perpendicular edges of a substrate stage PST having a rectangular shape in a plan view.
  • a reference member 300 is arranged at a predetermined position outside the substrate P above the substrate stage PST.
  • the reference member 300 includes, for example, a reference mark PFM that is detected in a non-liquid immersion state without a liquid by a substrate alignment system (not shown) as disclosed in Japanese Patent Application Laid-Open No.
  • a reference mark MFM detected in a liquid immersion state via a liquid by a mask alignment system (not shown) as disclosed in JP-A-7-176468 is provided in a predetermined positional relationship.
  • the upper surface 301 A of the reference member 300 is substantially flat, and is provided at substantially the same height (level) as the surface of the substrate P held by the substrate stage PST and the upper surface 51 of the substrate stage PST. .
  • the substrate alignment system also detects an alignment mark 1 formed on the substrate P. As shown in FIG. 2, a plurality of shot areas S1 to S24 arranged in a matrix are provided on the substrate P, and the alignment mark 1 is provided on the substrate P corresponding to the plurality of shot areas S1 to S24. A plurality is provided on P.
  • an illuminance non-uniformity sensor 400 as disclosed in, for example, JP-A-57-117238 is arranged as a measurement sensor. Te ru.
  • the illuminance unevenness sensor 400 includes a rectangular upper plate 401 in a plan view.
  • the upper surface 401A of the upper plate 401 is substantially flat, and is provided at substantially the same height (level) as the surface of the substrate P held by the substrate stage PST and the upper surface 51 of the substrate stage PST.
  • the upper surface 401A of the upper plate 401 is provided with a pinhole 470 through which light can pass. Of the upper surface 401A, portions other than the pinhole portion 470 are covered with a light-shielding material such as chrome, and the illuminance distribution of the exposure light EL is measured via the projection optical system PL and the liquid LQ.
  • an aerial image measurement sensor 500 as disclosed in, for example, JP-A-2002-14005 is provided as a measurement sensor. Is provided.
  • the aerial image measurement sensor 500 includes a rectangular upper plate 501 in plan view.
  • the upper surface 501A of the upper plate 501 is substantially flat, and is provided at substantially the same height (level) as the surface of the substrate P held by the substrate stage PST and the upper surface 51 of the substrate stage PST.
  • a slit portion 570 through which light can pass is provided.
  • the upper surface 501A is covered with a light-shielding material such as chrome, except for the slit portion 570, receives the exposure light EL through the projection optical system PL, the liquid LQ, and the slit portion 570, and based on the received light result. Measuring various imaging characteristics.
  • an irradiation amount sensor as disclosed in, for example, Japanese Patent Application Laid-Open No. H11-16816 is also provided on the substrate stage PST.
  • the upper surface of the upper plate is provided at substantially the same height (level) as the surface of the substrate P held by the substrate stage PST and the upper surface 51 of the substrate stage PST.
  • the reference member 300 and the upper plates 401 and 501 are detachable (replaceable) from the substrate stage PST.
  • the upper surface of the movable mirror 80 is also arranged so as to be substantially the same height (level) as the upper surface 51 of the substrate stage PST.
  • a substrate stage drive system for moving substrate stage PST is controlled by a stage control device PSTC provided separately from main control device CONT.
  • the stage controller PSTC controls the movement of the substrate stage PST via the substrate stage drive system.
  • the stage controller PSTC can control the movement of the board stage PST under the command of the main controller CONT, or can independently move the board stage PST without the command of the main controller CONT. It can also be controlled.
  • exposure apparatus EX includes a wireless device 130 for wirelessly communicating between main controller CONT and stage controller PSTC.
  • the wireless device 130 allows the main controller CNT and the stage controller PSTC to communicate wirelessly.
  • the electric device supported on first base member BP1 is driven by electric power supplied from main power supply 100A.
  • the electric device supported on the second base member BP2 is driven by electric power that is also supplied with the power for the stage power supply 100B independently of the main power supply 100A.
  • the electric device on the first base member BP1 and the electric device on the second base member BP2 are electrically independent.
  • the electric device (second device) on the first base member BP1 a mask stage MST supported via the main column 3 and a mask stage drive for moving the mask stage MST are used.
  • the optical system includes an anti-vibration unit (anti-vibration system) 7 that supports a lens barrel base 8 that supports the PL, and a drive system that drives an optical member that constitutes the projection optical system PL.
  • the electric devices on the first base member BP1 include the main power supply 100A and the main control device CONT. Further, examples of the electric device include a linear motor, various cables, a control board, and the like that constitute the drive system.
  • a main electric system 120A is constituted by electric devices supported on the first base member BP1 and driven by electric power supplied from the main power supply 100A.
  • the electric equipment to be supplied with power from the main power supply 100A is not limited to those described above, and does not need to include all of the above.
  • the substrate stage PST and the substrate stage PST are moved in the X, ⁇ , ⁇ , ⁇ , 0 ⁇ , and 0 ⁇ directions.
  • Stage drive system including linear motors 47, 48, etc., vibration isolation unit (vibration isolation system) 9 that supports substrate stage PST via substrate surface plate 41, and uneven illuminance sensor placed on substrate stage PST Sensor systems including the 400 and the aerial image measurement sensor 500 are exemplified.
  • the electric devices on the second base member 2 also include a stage power supply 100B and a stage control device PSTC. Further, examples of the electric device include a linear motor constituting the drive system, a light receiving element constituting the sensor system, various cables, a control board, and the like.
  • the stage electric system 120B is constituted by electric equipment supported on the second base member 2 and driven by electric power supplied with the power for the stage power supply 100B.
  • the electric equipment to which the power for the stage power supply 100B is also supplied is not limited to those described above, and it is not necessary to include all of the above-mentioned ones.
  • Main controller CONT mainly controls main electric system 120A including electric devices on first base member BP1, and stage controller PSTC mainly controls second base member # 2. Controls the stage electrical system 120 mm including the electrical equipment of the above.
  • a linear motor constituting the stage drive system a stage power supply 100 °, a control board constituting the stage control device PSTC, and a cable connecting these (Not shown) are arranged below the substrate stage PST.
  • the sensor system and the like Located on the PST.
  • the main control unit CONT and the main power supply 100A that constitute the main electric system 120A are provided above the substrate stage PST, more specifically, above the liquid supply port 12 described later.
  • FIG. 3 is an enlarged view showing the vicinity of the liquid supply mechanism 10, the liquid recovery mechanism 20, and the tip of the projection optical system PL.
  • the liquid supply mechanism 10 is for supplying a predetermined liquid LQ to the image plane side of the projection optical system PL, and has a liquid supply unit 11 capable of sending out the liquid LQ, and one end of the liquid supply unit 11. And a supply pipe 13 for connection.
  • the liquid supply unit 11 includes a tank that stores the liquid LQ, a pressure pump, a liquid temperature controller that adjusts the temperature of the supplied liquid LQ, and the like.
  • the liquid supply operation of the liquid supply unit 11 is controlled by the main controller CONT.
  • the liquid supply mechanism 10 supplies the liquid LQ between the projection optical system PL and the substrate P on the substrate stage PST.
  • the liquid supply tank, pressurizing pump, temperature controller, etc. do not need to be fully equipped with the exposure equipment EX, and at least a part of the equipment should be installed at the factory where the exposure equipment EX is installed. Can be substituted.
  • the liquid recovery mechanism 20 is for recovering the liquid LQ on the image plane side of the projection optical system PL, and includes a liquid recovery unit 21 capable of recovering the liquid LQ and one end of the liquid recovery unit 21. And a collection pipe 23 for connecting the same.
  • the liquid recovery unit 21 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, a tank that stores the recovered liquid LQ, and the like.
  • a vacuum system a vacuum system of a factory where the exposure apparatus EX is arranged may be used without providing a vacuum pump in the exposure apparatus EX.
  • the gas-liquid separator and the recovery tank may be replaced by facilities such as a factory.
  • the liquid recovery operation of the liquid recovery unit 21 is controlled by the main controller CONT.
  • the liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ on the substrate P supplied from the liquid supply mechanism 10.
  • a flow path forming member 70 is disposed near the optical element 2 that is in contact with the liquid LQ.
  • the flow path forming member 70 is an annular member provided to surround the side surface of the optical element 2 above the substrate P (substrate stage PST).
  • a gap is provided between the flow path forming member 70 and the optical element 2, and the flow path forming section
  • the member 70 is supported by a predetermined support mechanism so as to be separated from the optical element 2 by vibration.
  • the flow path forming member 70 is provided above the substrate P (substrate stage PST), and has the liquid supply port 12 arranged so as to face the surface of the substrate P.
  • the liquid supply port 12 is provided on the lower surface 70A of the flow path forming member 70. Further, the flow path forming member 70 has a supply flow path corresponding to the liquid supply port 12 therein.
  • the flow path forming member 70 is provided above the substrate P (substrate stage PST), and has a liquid recovery port 22 arranged so as to face the surface of the substrate P.
  • the liquid recovery port 22 is provided on the lower surface 70A of the flow path forming member 70.
  • the flow path forming member 70 has a recovery flow path corresponding to the liquid recovery port 22 inside thereof.
  • the flow path forming member 70 constitutes a part of each of the liquid supply mechanism 10 and the liquid recovery mechanism 20.
  • the liquid supply ports 12 constituting the liquid supply mechanism 10 are provided at least at respective positions on both sides in the X-axis direction with the projection area AR1 of the projection optical system PL interposed therebetween.
  • the liquid recovery port 22 constituting the liquid recovery mechanism 20 is provided outside the liquid supply port 12 of the liquid supply mechanism 10 with respect to the projection area AR1 of the projection optical system PL.
  • the projection area AR1 of the projection optical system PL in the present embodiment is set to have a rectangular shape in plan view with the Y-axis direction as the long direction and the X-axis direction as the short direction.
  • the other end of the supply pipe 13 is connected to the liquid supply port 12 via the supply flow path of the flow path forming member 70.
  • the supply pipes 13 are provided corresponding to the plurality of liquid supply ports 12, respectively.
  • the other end of the recovery pipe 23 is connected to the liquid recovery port 22 via the recovery flow path of the flow path forming member 70.
  • a valve 15 for opening and closing the flow path of the supply pipe 13 is provided in the supply pipe 13.
  • valve 15 The opening and closing operation of the valve 15 is controlled by the main controller CONT.
  • the valve 15 in the present embodiment is a so-called normally closed system that mechanically closes the flow path of the supply pipe 13 when the drive source (power supply) of the exposure apparatus EX (main controller CONT) stops due to a power failure or the like. Become.
  • a flow rate control called a mass flow controller that controls the amount of liquid supplied per unit time from the liquid supply unit 11 to the liquid supply port 12.
  • a controller 16 is provided in the middle of the supply pipe 13. The control of the liquid supply amount by the flow controller 16 is performed under the command signal of the main controller CONT.
  • the main controller CONT When supplying the liquid LQ onto the substrate P, the main controller CONT sends out the liquid LQ from the liquid supply unit 11 and supplies the liquid LQ above the substrate P via the supply pipe 13 and the supply flow path of the flow path forming member 70.
  • the liquid LQ is supplied onto the substrate P from the liquid supply port 12 provided in the apparatus.
  • the liquid supply ports 12 are arranged at least on both sides of the projection area AR1 of the projection optical system PL, and the liquid LQ can be supplied from both sides of the projection area AR1 via the liquid supply ports 12. It is.
  • the amount of the liquid LQ supplied from the liquid supply port 12 onto the substrate P per unit time can be controlled by a flow controller 16 provided in the supply pipe 13.
  • the liquid recovery operation of liquid recovery unit 21 is controlled by main controller CONT.
  • the main control unit CONT can control the amount of liquid collected by the liquid recovery unit 21 per unit time.
  • the liquid LQ on the substrate P recovered from the liquid recovery port 22 provided above the substrate P is recovered by the liquid recovery unit 21 via the recovery flow path of the flow path forming member 70 and the recovery pipe 23.
  • the liquid contact surface 2A of the optical element 2 of the projection optical system PL and the lower surface (liquid contact surface) 70A of the flow path forming member 70 have lyophilicity (hydrophilicity).
  • the lyophilic treatment is performed on the liquid contact surfaces of the optical element 2 and the flow path forming member 70, and the lyophilic processing causes the liquid contact surfaces of the optical element 2 and the flow path forming member 70 to change.
  • at least the liquid contact surface of the member facing the exposed surface (surface) of the substrate P held by the substrate stage PST becomes lyophilic!
  • the lyophilic treatment is performed by forming a thin film with a substance having a large polarity and a molecular structure such as alcohol, for example. It imparts hydrophilicity to the liquid contact surface of the element 2 and the flow path forming member 70. That is, when water is used as the liquid LQ, it is desirable to provide a liquid having a large polar molecular structure such as an OH group on the liquid contact surface.
  • a lyophilic material such as MgF, Al 2 O 3, SiO
  • the lower surface (the surface facing the substrate P side) 70A of the flow path forming member 70 is a substantially flat surface, and the optical element 2
  • the lower surface (liquid contact surface) 2A is also a flat surface, and the lower surface 70A of the flow path forming member 70 and the lower surface 2A of the optical element 2 are substantially flush.
  • the liquid immersion area AR2 can be favorably formed in a wide range.
  • the liquid immersion mechanism disclosed in International Publication No. 2004Z053955 pamphlet and the liquid immersion mechanism disclosed in European Patent Publication No. 1420298 can also be applied to the exposure apparatus of the present embodiment.
  • FIG. 4 is a plan view showing the positional relationship between the first base member BP1 and the second base member BP2 that supports the substrate stage PST via the substrate surface plate 41.
  • the second base member BP2 is formed in a substantially rectangular shape in plan view
  • the first base member BP1 is formed in a frame shape surrounding the second base member BP2. ing.
  • the shape of the first and second base members BP1 and BP2 can be arbitrarily provided as long as the desired strength can be maintained, such as providing the first base member BP1 in a U-shape in plan view.
  • a measuring device 90 for measuring a relative position between the first base member BP1 and the second base member BP2 is provided.
  • the measuring device 90 is provided at each of two positions separated from each other on the second base member BP2.
  • FIG. 5 is a perspective view showing an example of the measuring device 90.
  • the measuring device 90 has a mark detection unit 91 having a microscope, and the mark detection unit 91 is supported on the second base member BP2 via the support unit 92.
  • a position detection mark 93 is provided on the first base member BP1.
  • the support section 92 supports the mark detection section 91 so that the mark detection section 91 and the position detection mark 93 face each other.
  • the position detection mark 93 has a plurality of lines 'and' space marks 93X arranged in the Y-axis direction and the X-axis direction, and a plurality of lines 'AND' arranged in the X-axis direction and the long direction. 'Has a space mark 93Y.
  • the measuring device 90 may be provided on the first base member BP1, and the position detection mark 93 may be provided on the second base member BP2.
  • the measuring device 90 detects the position detection mark 93 using the mark detection section 91, and based on the position detection result, moves the first base member BP1 and the second base member BP2 in the horizontal direction (XY direction). Find the relative position with respect to. Specifically, the measuring device 90 initializes the detected mark position based on the image information of the position detecting mark 93 detected by the mark detecting section 91. The amount of displacement with respect to the set position is determined, and the relative position (the amount of displacement) in the XY direction between the first base member BP1 and the second base member BP2 is determined based on the determined amount of displacement.
  • the measuring device 90 is provided at two locations. However, even if the measuring device 90 is provided at one location, it measures the relative position between the first base member B1 and the second base member BP2. be able to. On the other hand, the measuring devices 90 are provided at two or more positions, respectively, and the main control unit CONT operates the measurement results of the plurality of measuring devices 90 to calculate the relative position between the first base member BP1 and the second base member BP2. By obtaining position information (including relative rotation information), the relative position information can be obtained with higher accuracy.
  • the main controller CONT uses the measuring device 90 to obtain relative position information between the first base member BP1 and the second base member BP2.
  • the main controller CONT obtains a correction amount for adjusting the positional relationship between the pattern image of the mask M and the substrate P via the projection optical system PL, based on the obtained relative position information.
  • the main controller CONT drives the mask stage MST, the substrate stage PST, the image stabilizing units 6, 7, 9 and the like based on the obtained correction amount, and starts the exposure of the mask stage MST and the substrate stage PST at the start of the exposure. Adjust the initial position.
  • the first base member BP1 supporting the main column 3 and the second base member BP2 supporting the substrate stage PST are separated from each other. May fluctuate.
  • the relative positional relationship between the first base member BP1 and the second base member BP2 may greatly deviate from a desired relative positional relationship. If the relative positional relationship is largely deviated, there arises a problem that, for example, the movable mirror 80 on the substrate stage PST is not arranged in the measurable area of the laser interferometer 82 attached to the main column 3.
  • the board alignment system described above is mounted on the main column 3, the reference mark PFM on the board stage PST and the alignment mark 1 on the board P are detected by the board alignment system. Inconveniences such as inability to arrange in the exit area occur. Therefore, the relative positional relationship between the first base member BP1 and the second base member BP2 (and, consequently, the relative positional relationship between the main column 3 and the substrate stage PST) is roughly measured using the measuring device 90, and based on the measurement results. Therefore, for example, by correcting the position of the substrate stage PST, it is possible to prevent the above-mentioned inconvenience from occurring.
  • the main controller CONT uses the substrate interferometer 82 to arrange the movable mirror 80 within the measurable area of the laser interferometer 82. Move the substrate stage PST so that the fiducial mark is located within the detection area, and roughly align the substrate stage PST.
  • the relative position of the first base member BP1 and the second base member BP2 in the horizontal direction is measured using the measuring device 90, and the substrate stage PST is measured based on the measurement result.
  • the position of the substrate stage PST in the Z-axis direction is adjusted based on the measurement result by adjusting the position of the substrate stage PST in the XY direction. You may try to adjust.
  • the base line information (the positional relationship between the projection position of the pattern image formed by the projection optical system PL and the detection reference position of the substrate alignment system) in the coordinate system defined by the laser interferometer 82 is also used as the reference member 300. It is assumed that the measurement has already been performed using.
  • the main controller CONT detects (in a dry state) the alignment mark 1 formed in the shot area S1 to S24, which is the area to be exposed, on the substrate P without using the liquid LQ in the substrate alignment system.
  • the position of the substrate stage PST when the substrate alignment system detects alignment mark 1 is measured by the laser interferometer 82, and the measurement result is output to the main controller CONT.
  • the main controller CONT obtains positional information (deviation) of the shot area S1-S24 with respect to the detection reference position of the substrate alignment system, and obtains the alignment information (array information) of the shot area S1-S24 from the position of the substrate stage PST at that time. Ask for.
  • the main controller CO The NT drives the liquid supply mechanism 10 to supply the liquid LQ onto the substrate P and drives the liquid recovery mechanism 20 to perform a predetermined amount of liquid LQ on the substrate P in order to perform the liquid immersion exposure of the substrate P. to recover.
  • the liquid immersion area AR2 of the liquid LQ is formed between the optical element 2 at the tip of the projection optical system PL and the substrate P.
  • the main controller CONT is configured to carry out the liquid LQ on the substrate P by the liquid recovery mechanism 20 in parallel with the supply of the liquid LQ onto the substrate P by the liquid supply mechanism 10, and the substrate supporting the substrate P While moving the stage PST in the X-axis direction (scanning direction), an image of the pattern of the mask M is placed on the substrate P via the liquid LQ between the projection optical system PL and the substrate P and the projection optical system PL. Perform projection exposure. At this time, the alignment between the mask M and the substrate P is performed based on the previously obtained baseline information and the alignment information of the shot areas S1 to S24. Also, at the time of exposure of substrate P, main controller CONT (or stage controller PSTC) controls the movement of substrate stage PST based on the measurement result of laser interferometer 82.
  • the liquid LQ supplied from the liquid supply unit 11 of the liquid supply mechanism 10 to form the liquid immersion area AR2 flows through the supply pipe 13, and then is supplied to the supply channel formed inside the channel forming member 70.
  • the liquid is supplied onto the substrate P from the liquid supply port 12 via the.
  • the liquid LQ supplied onto the substrate P from the liquid supply port 12 is supplied so as to spread between the lower end surface of the front end portion (optical element 2) of the projection optical system PL and the substrate P, and includes the projection area AR1.
  • An immersion area AR2 smaller than the substrate P and larger than the projection area AR1 is locally formed on a part of the substrate P.
  • the exposure apparatus EX projects and exposes the pattern image of the mask M onto the substrate P while moving the mask M and the substrate P in the X-axis direction (scanning direction). Then, a part of the pattern image of the mask M is projected into the projection area AR1 via the liquid LQ in the immersion area AR2 and the projection optical system PL, and the mask M is moved in the ⁇ X direction (or + X direction) at a velocity V. In synchronization with the movement, the substrate P moves with respect to the projection area AR1 in the + X direction (or X direction) at a speed ⁇ ⁇ ⁇ ( ⁇ is a projection magnification). A plurality of shot areas S1 to S24 are set on the substrate ⁇ .
  • the next shot area is moved to the scanning start position by the stepping movement of the substrate ⁇ .
  • the scanning exposure process for each of the shot areas S1 to S24 is performed in order while moving the substrate in a step-and-scan manner. Next is done.
  • the liquid LQ supplied onto the substrate stage PST may leak out of the substrate stage PST.
  • Leakage of the liquid LQ may damage members such as metal parts around the substrate stage PST, control boards, cables, and electrical equipment such as power supplies, and cause inconveniences such as short circuit or failure.
  • damage to electrical equipment such as a sensor system provided on the substrate stage PST, and electrical equipment such as a substrate stage drive system and a vibration isolation unit disposed below the substrate stage PST become remarkable.
  • the leaked liquid LQ diffuses, for example, the damage to various electrical equipment supported by the main column 3 will also increase, and the return work will require much time and labor, and the exposure apparatus EL will operate. This leads to a lower rate.
  • the first base member BP1 and the second base member BP2 supporting the substrate stage PST are separated from each other, so that the substrate stage PST upward force second base member Even if the liquid LQ leaks to BP2, as shown in the schematic diagram of FIG. 6, the liquid LQ that leaks onto the second base member BP2 forms a gap between the first base member BP1 and the second base member BP2. 4 and does not diffuse to the first base member BP1.
  • the exposure processing can be performed without lowering the operation rate of the exposure apparatus EX.
  • the liquid LQ flowing into the gap 4 is recovered by the liquid receiving member 60 on which the second base member BP2 is placed, so that the diffusion of the liquid LQ is effective. Can be effectively prevented.
  • the liquid receiving member 60 is disposed separately from the first base member BP1 that supports the illumination system and the like, it is possible to prevent the damage caused by the leakage of the liquid LQ from spreading.
  • the gas supply system 150 supplies gas so as to guide the liquid LQ leaked from the substrate stage PST to the gap 4 between the first base member BP1 and the second base member BP2. Since the liquid LQ is flowing, the leaked liquid LQ can be prevented from diffusing, and the leaked liquid LQ can be smoothly collected by the liquid receiving member LQ.
  • the local liquid immersion method is used in which exposure is performed with the liquid LQ locally provided on the substrate P.
  • the liquid LQ can leak from the substrate P or the substrate stage PST. High. Therefore, by providing the second base member BP2 supporting the substrate stage PST separately from the first base member BP1 supporting devices other than the substrate stage PST among the plurality of devices constituting the exposure apparatus EX, It is possible to prevent the liquid LQ from diffusing into the first base member BP1, and prevent the liquid LQ from intruding (diffusion) into devices supported on the first base member BP1.
  • the power for the stage power supply 100B independent of the main power supply 100A is also supplied. Since the electrical equipment on the base member BP2 and the electrical equipment on the first base member BP1 are electrically independent, including the electrical equipment on the second base member BP2 and this electrical equipment due to the spilled liquid LQ Even when the stage electric system 120B stops due to a short circuit or a failure, the main electric system 120A including the electric device on the first base member BP1 can operate. Therefore, it is possible to prevent serious damage such as failure or stoppage of the electrical system of the entire exposure apparatus EX. Also, when performing the return operation, the return operation may be performed only on the stage electric system 120B including the electric device on the second base member BP2. Therefore, the return work time can be shortened, and a reduction in the operation rate of the exposure apparatus EX can be prevented.
  • the main electric system 120A is operable, so that it is possible to continue driving the electric device on the first base member BP1.
  • the main controller CONT is electrically independent of the stage controller PSTC, so the stage controller Even if the PSTC fails or stops, the main controller CONT can operate, and therefore, when the stage electric system 120B stops or restarts, the main electric controller CONT operates based on the command of the main controller CONT. System 120A can be driven.
  • the electrical equipment on the first base member BP1 including the main control device CONT and the electrical equipment on the second base member BP2 including the stage control device PSTC via a cable or the like transmit signal or power.
  • the leaked liquid LQ may be applied to the cable and cause inconvenience such as electric leakage.
  • the electric equipment on the second base member BP2 leaks due to the leaked liquid LQ, there is a possibility that the electric equipment on the first base member BP1 may also be electrically damaged through the cable. is there.
  • the electric device on the first base member BP1 including the main control device CONT and the electric device on the second base member BP2 including the stage control device PSTC are wirelessly communicated.
  • the device on the first base member BP1 and the device on the second base member BP2 can be physically and electrically separated from each other, and the above-mentioned inconvenience can be prevented.
  • FIG. 1 shows that stage control device PSTC on second base member BP2 and main control device CONT on first base member BP1 can be wirelessly communicated by wireless device 130.
  • electric devices other than the stage controller PSTC and the main controller CONT may be wirelessly communicated with each other.
  • a liquid sensor 160 is provided at a predetermined position such as a side surface of the substrate stage PST to detect the liquid LQ that has also leaked on the substrate stage PST.
  • the valve 15 of the liquid supply mechanism 10 may close the flow path of the supply pipe 13 when a liquid amount equal to or larger than the set allowable value is detected. Further, based on the detection result of the liquid sensor 160, after the valve 15 closes the flow path of the supply pipe 13, the amount of liquid substantially equal to the volume of the liquid flow path between the liquid supply port 12 and the valve 15 is obtained.
  • main controller CONT and main power supply 100A constituting main electric system 120A are located above substrate stage PST, and more specifically, liquid supply port 12A. Even if liquid LQ scatters from liquid immersion area AR2 or liquid LQ leaks from substrate stage PST, liquid LQ constitutes main control unit CONT, for example, control board And the inconvenience of the main power supply 100A is suppressed.
  • the substrate surface plate 41 and the lens barrel surface 8 are supported on different base members BP1 and BP2, respectively.
  • a substrate surface position sensor for measuring the position of the substrate surface 41 as disclosed in, for example, WO 00Z14779 pamphlet.
  • a column position sensor for measuring the position of the lens barrel base 8 with respect to the first base member BP1 may be provided.
  • the substrate surface position sensor measures at least the positions of the substrate surface 41 in the X, Y, and Z directions, and the X, ⁇ , and ⁇ directions with reference to the first base member BP1.
  • the column position sensor measures the positions of the lens barrel base 8 in the X, ⁇ , ⁇ , 0 ⁇ , 0 ⁇ , and 0 ⁇ directions with respect to the first base member BP1. Therefore, main controller CONT can determine the relative positions of first base member BP1 and substrate surface plate 41 in the directions of six degrees of freedom based on the measurement results of the substrate surface position sensor, and can also use the column position sensor. The relative positions of the first base member BP1 and the barrel base 8 in the directions of six degrees of freedom can be obtained based on the measurement results.
  • the main controller CONT obtains the relative position of the substrate base 41 in the direction of six degrees of freedom with respect to the first base member BP1 based on the measurement value of the substrate base position sensor, and uses the information of the relative position to prevent the position.
  • the vibration unit 9 the substrate surface plate 41 can be constantly maintained at a stable position with respect to the first base member BP1.
  • main controller CONT obtains a relative position of lens barrel base 8 in the direction of six degrees of freedom with respect to first base member BP1 based on the measurement value of the column position sensor, and uses the information of the relative position to perform vibration isolation.
  • the lens barrel base 8 can be constantly maintained at a stable position with respect to the first base member BP1.
  • the liquid for recovering the liquid LQ flowing in the gap 4 is used.
  • the recovery mechanism is constituted by the liquid receiving member 60, a gutter member 61 provided according to the shape and size of the gap 4 is disposed below the gap 4 as shown in FIG. You may.
  • a liquid recovery mechanism 64 for recovering the liquid LQ flowing between the first base member BP1 and the second base member BP2 includes a gutter member 61 arranged corresponding to the gap 4 and a vacuum system (suction). Device) 63, a gas-liquid separator 62 provided between the gutter member 61 and the vacuum system 63, and the like.
  • the gutter member 61 and the gas-liquid separator 62 are connected via a flow path 62A, and the gas-liquid separator 62 and the vacuum system 63 are connected via a flow path 63A.
  • the liquid LQ leaked onto the second base member BP2 flows to the gap 4.
  • the liquid LQ flowing into the gap 4 is collected by the gutter member 61.
  • the liquid LQ collected in the gutter member 61 is sent to the gas-liquid separator 62 via the flow path 62A by the suction operation of the vacuum system 63.
  • the gas-liquid separator 62 separates the liquid component and the gas component collected via the flow path 62A.
  • the gas component separated by the gas-liquid separator 62 is sucked into the vacuum system 63, and the liquid component is discharged through the discharge channel 62B.
  • FIG. 8 is a view of the lower surface 70A of the flow path forming member 70 as viewed from below.
  • a liquid supply port 12A for supplying the liquid LQ onto the substrate P is provided on both sides of the projection area AR1 of the projection optical system PL in the X-axis direction (scanning direction) in the lower surface 70A of the flow path forming member 70. , 12B are provided respectively.
  • the liquid supply ports 12A and 12B have a slit shape whose longitudinal direction is the Y-axis direction.
  • a liquid supply port 12C for supplying the liquid LQ onto the substrate P, 12D are provided respectively.
  • the liquid supply ports 12C and 12D have a slit shape whose longitudinal direction is the X-axis direction.
  • an annular liquid recovery port 22 formed so as to surround the projection area AR1 of the projection optical system PL and the liquid supply ports 12A to 12D is provided on the lower surface 70A of the flow path forming member 70.
  • the exposure light EL is supplied while supplying and collecting the liquid LQ while moving the substrate P in the X-axis direction. Irradiate on substrate P. Then, assuming that the moving distance in the X-axis direction required to scan and expose one shot area is Ll, and the distance between the liquid supply ports 12A and 12B is L2. L1 ⁇ L2 ... set to satisfy the condition of (h).
  • the moving distance L1 in the X-axis direction is a distance including a constant velocity section and an acceleration and deceleration section of the substrate P (substrate stage PST) during scanning exposure.
  • the step moving distance in the Y-axis direction for exposing the next shot area is L3
  • the distance between the liquid supply ports 12C and 12D is L4
  • the immersion area AR2 can be favorably formed on the substrate P, and the inconvenience that the temperature distribution (temperature unevenness) occurs in the liquid LQ in the immersion area AR2 is reduced. Can be prevented.
  • the temperature of the liquid LQ supplied on the substrate P is controlled by a temperature controller provided in the liquid supply unit 11, there is a possibility that a temperature distribution may occur after being supplied onto the substrate P. is there .
  • One of the factors that cause the temperature distribution in the liquid LQ in the liquid immersion area AR2 formed on the substrate P is heat generated by irradiation with the exposure light EL. Then, when the exposure light EL is applied to the immersion area AR2, the movement amount of the liquid LQ in the immersion area AR2 is small (if the liquid LQ is stagnant), the liquid LQ is locally heated. And the temperature distribution becomes significant.
  • the liquid LQ disposed on the optical path of the exposure light EL can be sufficiently moved (replaced) to suppress the stagnation of the liquid LQ, thereby preventing the occurrence of a temperature distribution. Then, by satisfying the condition of the above equation (1), the stagnation of the liquid LQ can be suppressed.
  • the liquid LQ supplied from the liquid supply port 12A on the X side is moved to the + X side as the substrate P moves, and the light of the exposure light EL is emitted. It is effective to place them on the road.
  • the liquid supply port 12B on the + X side moves the liquid LQ to which the force is also supplied to the X side along with the movement of the substrate P, and emits the light of the exposure light EL. It is effective to arrange it on the road.
  • the distance L2 between the liquid supply ports 12A and 12B is, of course, the distance L2 between the leading ends of the projection optical system PL.
  • the diameter (or the size in the X-axis direction) of the optical element 2 is set to be larger than ⁇ . Therefore,
  • the flow rate of the liquid LQ supplied onto the substrate P from the liquid supply port 12 is U
  • the moving speed of the substrate P is V
  • the distance between the tip of the projection optical system PL and the substrate P (working distance)
  • WD is defined as WD
  • it is preferable to satisfy the condition of HXU ⁇ WD XV (where U QZS) (5).
  • the space between the projection optical system PL and the substrate P can be favorably filled with the liquid LQ.
  • FIG. 10 is a sectional view showing a flow path forming member 70 'according to another embodiment of the present invention
  • FIG. 11 is a view of the flow path forming member 70' as viewed from below.
  • the flow path forming member 70 ′ is provided so as to face the substrate stage PST, and includes a supply plate-shaped member 72 in which a plurality of liquid supply holes 71 are formed.
  • the flow path forming member 70 ′ is disposed so as to face the substrate stage PST, and includes a collecting plate member 74 in which a plurality of liquid collecting holes 73 are formed.
  • the supply plate-like members 72 are substantially fan-shaped in plan view, and are provided in plural (four) so as to surround the projection area AR1 of the projection optical system PL.
  • the plurality of (four) recovery plate members 74 are provided so as to surround the outside of the supply plate member 72.
  • the flow path forming member 70 ′ has a frame member (supporting member) 75, and the plate members 72 and 74 are supported by the frame member 75.
  • the lower surface 70A of the flow path forming member 70 'facing the substrate stage PST is formed by a plurality of supply plate members 72 and a plurality of recovery plate members 74 by a plurality of liquid supply areas and a plurality of liquid collection areas. It is divided into two parts.
  • the liquid supply hole 71 is formed in a substantially circular shape, and the liquid recovery hole 73 is also formed in a substantially circular shape.
  • Each of the plurality of liquid supply holes 71 is formed in substantially the same size, and has a diameter of about 0.1 to 3 mm. However, the diameter of the liquid supply hole 71 can be appropriately changed according to the target value of the amount of liquid supplied onto the substrate P.
  • the liquid supply holes 71 are uniformly formed in the supply plate member 72 at substantially the same pitch as the diameter of the holes.
  • each of the plurality of liquid recovery holes 73 is formed to have substantially the same size, and has a diameter of about 0.1 to 3 mm. However, liquid recovery The diameter of the hole 73 can be appropriately changed according to the target value of the amount of liquid collected from the substrate P.
  • the liquid recovery holes 73 are uniformly formed in the recovery plate member 74 at substantially the same pitch as the diameter of the holes.
  • the flow path forming member 70 ′ has a supply space 76 connected to the supply pipe 13.
  • the supply space 76 is a space surrounded by the supply plate member 72 and the frame member 75, and is formed in a plurality (four) corresponding to the supply plate member 71.
  • Each of the plurality of supply spaces 76 is an independent space.
  • the flow path forming member 70 ′ has a collecting space 77 connected to the collecting pipe 23.
  • the collection space 77 is a space surrounded by the collection plate member 74 and the frame member 75, and is formed in a plurality (four) corresponding to the collection plate member 74!
  • the plurality of collection spaces 77 are also independent spaces.
  • the liquid LQ supplied from the supply pipe 13 is filled in the supply space 76, it is supplied onto the substrate P from each of the plurality of liquid supply holes 71.
  • the liquid LQ is uniformly supplied from the surface of the supply plate member 72 facing the substrate stage PST by being supplied through the liquid supply holes 71 formed uniformly in the supply plate member 72.
  • the liquid LQ on the substrate P is recovered through the liquid recovery holes 73 formed uniformly in the recovery plate member 74.
  • the liquid LQ recovered from the liquid recovery hole 73 is recovered to the recovery pipe 23 through the recovery space 77.
  • the liquid LQ on the substrate P is collected through a liquid collecting hole 73 uniformly formed in the collecting plate member 74.
  • the forces of the plurality of liquid supply holes 71 are almost the same, and the liquid LQ is uniformly supplied from the surface of the supply plate member 72. Can be supplied with liquid LQ.
  • the exposure processing can be performed in a state where the liquid immersion area AR2 is well formed.
  • the plurality of liquid supply holes 71 The pressure of the liquid LQ supplied from each of them can be made uniform uniformly.
  • a pressure detector that detects the pressure of the liquid LQ can be provided in the space 76.
  • the liquid supply mechanism 10 adjusts the amount of liquid supplied per unit time from the liquid supply unit 11 to the space 76 via the supply pipe 13 based on the detection result of the pressure detector. In this way, the amount of liquid supplied to the substrate P per unit time can be adjusted.
  • the liquid supply hole 71 has a substantially circular shape, but any shape such as a rectangular shape or a slit shape can be adopted.
  • the liquid recovery hole 73 can have any shape.
  • four supply plate members 71 are provided, the number is arbitrary. Further, the number of the supply plate-like members 71 may be one. Similarly, the number of the recovery plate members 73 can be arbitrarily set.
  • the liquid LQ in the present embodiment is composed of pure water.
  • Pure water has the advantage that it can be easily obtained in large quantities at a semiconductor manufacturing plant or the like, and that it has no adverse effect on the photoresist on the substrate P, optical elements (lenses), and the like.
  • pure water has no adverse effect on the environment and has an extremely low impurity content, so it is expected to have the effect of cleaning the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. it can.
  • the exposure apparatus may have an ultrapure water maker.
  • the refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44, and ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL. If used, the wavelength is shortened to lZn, that is, about 134 nm on the substrate P, and high resolution is obtained. Furthermore, since the depth of focus is expanded to about n times, that is, about 1.44 times as compared to that in the air, if it is sufficient to secure the same depth of focus as that used in the air, the projection optical system PL Can further increase the numerical aperture, and in this regard, the resolution is also improved.
  • the numerical aperture NA of the projection optical system may be 0.9-11.
  • the numerical aperture NA of the projection optical system is increased as described above, it has been conventionally used as the exposure light! /, Since the random polarization light may deteriorate the imaging performance due to the polarization effect, It is desirable to use polarized illumination.
  • linearly polarized illumination is performed according to the longitudinal direction of the line pattern of the line 'and' space pattern of the mask (reticle). From the pattern of the mask (reticle), the S-polarized component (TE-polarized component), It is preferable that a large amount of diffracted light of the polarization direction component along the longitudinal direction of the line pattern is emitted.
  • the projection optical system PL and the resist applied on the surface of the substrate P are not filled.
  • the transmittance of the diffracted light of the s-polarization component (TE polarization component), which contributes to the enhancement of contrast, on the resist surface increases, so that the projection optical system Even when the numerical aperture NA exceeds 1.0, high imaging performance can be obtained.
  • it is more effective to appropriately combine a phase shift mask such as an oblique incidence illumination method (particularly a dipole illumination method) adapted to the longitudinal direction of the line pattern as disclosed in Japanese Patent Application Laid-Open No. 6-188169.
  • a fine line 'and' space pattern for example, a line 'and' space of about 25-50 nm
  • a projection optical system PL with a reduction magnification of about 1Z4
  • the mask M acts as a polarizing plate due to the wave guide effect, and reduces the contrast.
  • the amount of diffracted light of the S-polarized component (TE polarized component) becomes larger than that of the diffracted light of the (TM polarized component) and is emitted by the mask M, it is desirable to use the linearly polarized illumination described above. Even when the mask M is illuminated, high resolution performance can be obtained even when the numerical aperture NA of the projection optical system PL is as large as 0.9-1.3. Also, when exposing a very fine line 'and' space pattern on the mask M on the substrate P, the P-polarized component (TM-polarized component) is larger than the S-polarized component (TE-polarized component) due to the Wire Grid effect.
  • the projection optical system PL when an ArF excimer laser is used as the exposure light and a line 'and' space pattern larger than 25 nm is exposed on the substrate P using the projection optical system PL with a reduction ratio of about 1Z4 Since the diffracted light of the S-polarized component (TE polarized component) is emitted from the mask M more than the diffracted light of the P-polarized component (TM polarized component), the numerical aperture NA of the projection optical system PL is 0.9. Even in the case of a large value such as 1.3, high resolution performance can be obtained.
  • the optical element 2 is attached to the tip of the projection optical system PL, and this lens is used to adjust the optical characteristics of the projection optical system PL, for example, aberrations (spherical aberration, coma, etc.). be able to.
  • the optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane-parallel plate that can transmit the exposed light EL.
  • the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ.
  • a cover glass having a plane-parallel plate force is attached to the surface of the substrate P. It may be configured to fill the liquid LQ in the closed state.
  • the substrate P is exposed by filling the optical path space on the light emission side of the optical element 2 of the projection optical system PL with liquid (pure water).
  • liquid pure water
  • the optical path space on the light incident side of the optical element 2 of the projection optical system PL may be filled with liquid (pure water).
  • the liquid LQ of the present embodiment may be a liquid other than water, which is water.
  • the light source of the exposure light EL is an F laser
  • the F laser light does not transmit water. So
  • liquid LQ for example, perfluoropolyether (PFPE) or
  • the part in contact with the liquid LQ has a small polarity, for example, containing fluorine! ⁇ ⁇ Lyophilization treatment is performed by forming a thin film using a substance with a molecular structure.
  • other liquid LQs that are transparent to the exposure optical system EL and have a refractive index as high as possible and are stable to the photo resist coated on the surface of the substrate P (for example, Cedar) Oil) can also be used.
  • the surface treatment is performed according to the polarity of the liquid LQ used.
  • the substrate P in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but may be a glass substrate for a display device or a ceramic for a thin film magnetic head. Wafers, masks or reticles used in exposure equipment (synthetic quartz, silicon wafers), etc. are applied.
  • the exposure apparatus EX is a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P.
  • a step-and-repeat projection exposure apparatus (a step-and-repeat type projection exposure apparatus in which the pattern of the mask M is exposed collectively while the M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.
  • the present invention can also be applied to an exposure apparatus of the step 'and' stitch type in which at least two patterns are partially overlapped and transferred on the substrate P
  • a reduced image of the first pattern is projected using a projection optical system (for example, a refraction projection optical system that does not include a reflective element at 1Z8 reduction magnification) while the first pattern and the substrate P are almost stationary.
  • a projection optical system for example, a refraction projection optical system that does not include a reflective element at 1Z8 reduction magnification
  • a batch exposure is performed on the plate P, and then, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is partially overlapped with the first pattern by using the projection optical system thereof.
  • the present invention can also be applied to a stitch type batch exposure apparatus that performs batch exposure on P.
  • a type of exposure apparatus having no projection optical system for example, a proximity type exposure apparatus or a two-beam interference type exposure apparatus that exposes a wafer by forming interference fringes on the wafer can be used. .
  • the present invention can also be applied to a twin-stage type exposure apparatus disclosed in JP-A-10-163099, JP-A-10-214783, JP-T-2000-505958, and the like.
  • the exposure apparatus may include a measurement stage mounted with a member for measurement and a sensor and moved on the image plane side of the projection optical system, separately from the stage holding the substrate P.
  • the measurement stage acquires the first movement information and the second movement information and moves the measurement stage based on the first movement information and the second movement information. May be controlled.
  • An exposure apparatus equipped with a measurement stage is disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-164504 (corresponding to U.S. Application No. 09Z593,800), and is designed for use in designated countries (or selected selected countries) specified in this international application. To the extent permitted by national law, the disclosures in this specification are incorporated by reference, using the disclosures in the above-mentioned publications and corresponding U.S. applications. Part of
  • the exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed.
  • Japanese Patent Application Laid-Open Nos. The present invention is also applicable to an immersion exposure apparatus in which the entire surface of a substrate to be exposed is covered with a liquid, as described in detail in, for example, US Pat. No. 3,303,114 and US Pat. No. 5,825,043. is there.
  • the type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element for exposing a semiconductor element pattern onto a substrate P, but may be an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, or the like. It can be widely applied to an image pickup device (CCD), an exposure apparatus for manufacturing a reticle or a mask, and the like.
  • CCD image pickup device
  • a linear motor (USP 5,623,853 or
  • each stage PST and MST may be of a type that moves along a guide or a guideless type that does not have a guide.
  • each stage PST, MST is such that a magnet cut in which a two-dimensional magnet is arranged and an armature unit in which a two-dimensional coil is arranged face each other, and each stage PST, MST is driven by electromagnetic force. May be used.
  • one of the magnet unit and the armature unit should be connected to the stages PST and MST, and the other of the magnet unit and the armature unit should be provided on the moving surface side of the stages PST and MST!
  • a reaction force generated by movement of the mask stage MST is mechanically controlled by using a frame member so as not to be transmitted to the projection optical system PL. You may escape to the floor (earth).
  • the exposure apparatus EX of the embodiment of the present application performs various types of subsystems including the components described in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to maintain accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical For, adjustments are made to achieve electrical accuracy.
  • Various subsystems The process of assembling into the exposure apparatus includes mechanical connection, electrical circuit wiring connection, and pneumatic circuit piping connection between the various subsystems. Needless to say, there is an assembling process for each subsystem before the assembling process into the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable to manufacture the exposure apparatus in a clean room in which the temperature, cleanliness, etc. are controlled.
  • a micro device such as a semiconductor device has a step 201 for designing the function and performance of the micro device, a step 202 for fabricating a mask (reticle) based on the design step, and a substrate for the device.
  • Step 203 of manufacturing a certain substrate substrate processing step 204 of exposing a mask pattern to the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing step, bonding step, package step) 205, inspection step Manufactured through 206 etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Appareil d’exposition capable de limiter l’expansion des dégâts même en cas de fuites de liquides pour empêcher la réduction de la vitesse d’exploitation et la précision d’exposition. L’appareil d’exposition (EX) expose un substrat (P) en irradiant la lumière d’exposition (LE) sur le substrat (P) à travers le liquide (LQ) et possède un premier élément de base (BP1), un étage substrat (PST) pour supporter de façon mobile le substrat (P), et un second élément de base (BP2) pour soutenir l’étage de substrat (PST). Le liquide (LQ) ayant fui sur le second élément de base (BP2) ne peut pas s’étaler sur le premier élément de base (BP1).
PCT/JP2005/002228 2004-02-19 2005-02-15 Appareil d’exposition et procede de fabrication du dispositif WO2005081290A1 (fr)

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JP2007012954A (ja) * 2005-07-01 2007-01-18 Canon Inc 露光装置
JP2008147652A (ja) * 2006-12-07 2008-06-26 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2009141355A (ja) * 2007-12-03 2009-06-25 Asml Netherlands Bv リソグラフィ装置、及びデバイス製造方法
JP2009272640A (ja) * 2008-05-08 2009-11-19 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
JP2011023749A (ja) * 2006-04-14 2011-02-03 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2012009853A (ja) * 2010-06-03 2012-01-12 Asml Netherlands Bv ステージ装置およびそのようなステージ装置を備えるリソグラフィ装置
US8345218B2 (en) 2008-05-08 2013-01-01 Asml Netherlands B.V. Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method
US8351018B2 (en) 2008-05-08 2013-01-08 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9013673B2 (en) 2009-12-02 2015-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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JP6493481B2 (ja) * 2017-10-18 2019-04-03 株式会社ニコン 露光装置及びデバイス製造方法

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JP2007012954A (ja) * 2005-07-01 2007-01-18 Canon Inc 露光装置
JP2011023749A (ja) * 2006-04-14 2011-02-03 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
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JP2008147652A (ja) * 2006-12-07 2008-06-26 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2011097107A (ja) * 2006-12-07 2011-05-12 Asml Netherlands Bv リソグラフィ投影装置
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JP2009141355A (ja) * 2007-12-03 2009-06-25 Asml Netherlands Bv リソグラフィ装置、及びデバイス製造方法
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JP2009272640A (ja) * 2008-05-08 2009-11-19 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
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US8345218B2 (en) 2008-05-08 2013-01-01 Asml Netherlands B.V. Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method
US9013673B2 (en) 2009-12-02 2015-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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JP2012009853A (ja) * 2010-06-03 2012-01-12 Asml Netherlands Bv ステージ装置およびそのようなステージ装置を備えるリソグラフィ装置

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JP5360088B2 (ja) 2013-12-04
JPWO2005081290A1 (ja) 2007-10-25

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