Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/26—Cleaning or polishing of the conductive pattern
• • A—HUMAN NECESSITIES
  • A46—BRUSHWARE
  • A46B—BRUSHES
  • A46B3/00—Brushes characterised by the way in which the bristles are fixed or joined in or on the brush body or carrier
  • A46B3/005—Bristle carriers and bristles moulded as a unit
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
  • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
  • B24D13/04—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising a plurality of flaps or strips arranged around the axis
• • A—HUMAN NECESSITIES
  • A46—BRUSHWARE
  • A46B—BRUSHES
  • A46B13/00—Brushes with driven brush bodies or carriers
  • A46B13/001—Cylindrical or annular brush bodies
• • A—HUMAN NECESSITIES
  • A46—BRUSHWARE
  • A46B—BRUSHES
  • A46B2200/00—Brushes characterized by their functions, uses or applications
  • A46B2200/30—Brushes for cleaning or polishing
  • A46B2200/3093—Brush with abrasive properties, e.g. wire bristles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/025—Abrading, e.g. grinding or sand blasting
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/12—Using specific substances
  • H05K2203/127—Lubricants, e.g. during drilling of holes

Definitions

• FIG. 5 is a cross-sectional view of a preferred embodiment of a bristle, similar to FIGS. 4a-4d;
• FIG. 6 is a schematic depiction of a brush segment of the present invention illustrating the deflection of the bristles during modifying a printed circuit board surface;
• FIG. 7 is a graphical representation of cut results from the Cut and Finish Test, testing brushes according to the present invention and comparative brushes;
• FIG. 8 is a graphical representation of surface finish rests from the Cut and Finish Test, testing brushes according to the present invention and comparative brushes;
• FIG. 9 is a graphical representation of results from the Footprint Test, testing brushes according to the present invention and comparative brushes;
• FIG. 10 is a graphical representation of results from the Wear Test, testing brushes according to the present invention and comparative brushes.
• One preferred cross-sectional configuration for bristle 18 is a trapezoid, having a ⁇ vidth "w" of about 0.25 to 1.25 mm, a height “h” of about 0.25 to 1.25 mm, and an angle ⁇ of about 5 degrees.
• the side having the shorter width includes radiused comers, defined by a radius "r” of about 0.05 to 0.13 mm. See, FIG. 5. Such radiused outer comers are typically due to manufacturing tolerances.
• Thermoplastic Elastomers h some instances, it is preferred that moldable polymer 28 is a themioplastic elastomer or includes a themioplastic elastomer.
• Thermoplastic elastomers (or "TPEs") are defined and reviewed in "Thermoplastic Elastomers, A Comprehensive Review", edited by N.R. Legge, G. Holden and H. E. Schroeder, Hanser Publishers, New York,
• moldable polymer 28 include a silicone lubricant mixed therein.
• a lubricant in polymer 28 reduces the friction of the bristle contacting the circuit board surface. This reduces the heat generated when refining and reduces the presence of "smear". Excessive heat may cause the bmsh segment to leave residue or smear on the circuit board or to otherwise harm the circuit board.
• Lubricants preferably can be present in the moldable polymer 28 in amounts of at least 2 wt-% and up to about 20 wt-% (exclusive of abrasive particle content), and preferably in an amount about 5 to 15 %, although more or less may be used as desired.
• a grinding aid is defined herein as a material the addition of which has a significant effect on the chemical and physical processes of abrading which results in improved perfo ⁇ nance.
• the grinding aid will either (1) decrease the friction between the abrasive particles and the circuit board being abraded, (2) prevent the abrasive particle from "capping", i.e. prevent metal particles from becoming welded to the tops of the abrasive particles, (3) decrease the interface temperature between the abrasive particles the workpiece, or (4) decrease the grinding forces.
• Examples of chemical groups of grinding aids include waxes, organic halide compounds, halide salts and metals and their alloys.
• FIG. 6 is a schematic illustration of the footprint of the brash during use.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• Polishing Bodies And Polishing Tools (AREA)
• Manufacturing Of Printed Wiring (AREA)
• Brushes (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=34739933

Family Applications (1)

Country Status (7)

Families Citing this family (25)

Citations (5)

Family Cites Families (29)

• 2004
  • 2004-01-14 US US10/756,902 patent/US7081043B2/en not_active Expired - Fee Related
  • 2004-12-03 CN CN2004800404423A patent/CN1906982B/zh not_active Expired - Fee Related
  • 2004-12-03 JP JP2006549261A patent/JP4464973B2/ja not_active Expired - Fee Related
  • 2004-12-03 EP EP04812820A patent/EP1721500A1/en not_active Withdrawn
  • 2004-12-03 WO PCT/US2004/040382 patent/WO2005072036A1/en not_active Ceased
  • 2004-12-03 KR KR1020067016174A patent/KR20060135750A/ko not_active Ceased
  • 2004-12-23 TW TW093140283A patent/TW200534765A/zh unknown

Patent Citations (5)

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