WO2005050017A1 - Pompe cryostatique - Google Patents

Pompe cryostatique Download PDF

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Publication number
WO2005050017A1
WO2005050017A1 PCT/JP2004/017016 JP2004017016W WO2005050017A1 WO 2005050017 A1 WO2005050017 A1 WO 2005050017A1 JP 2004017016 W JP2004017016 W JP 2004017016W WO 2005050017 A1 WO2005050017 A1 WO 2005050017A1
Authority
WO
WIPO (PCT)
Prior art keywords
cryopanel
cryopump
condensed gas
gas
pump
Prior art date
Application number
PCT/JP2004/017016
Other languages
English (en)
Japanese (ja)
Inventor
Hidekazu Tanaka
Original Assignee
Sumitomo Heavy Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries, Ltd. filed Critical Sumitomo Heavy Industries, Ltd.
Priority to JP2005515611A priority Critical patent/JPWO2005050017A1/ja
Publication of WO2005050017A1 publication Critical patent/WO2005050017A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
    • F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps

Definitions

  • the present invention is used in, for example, a sputtering apparatus, an ion plating apparatus, and a semiconductor manufacturing apparatus, and is a refrigerator-cooled cryopump that obtains a high vacuum by condensing gas molecules into a cryogenic panel and evacuating the panel.
  • a refrigerator-cooled cryopump that obtains a high vacuum by condensing gas molecules into a cryogenic panel and evacuating the panel.
  • FIG. 1 shows an example of a configuration of a conventional cryopump.
  • reference numeral 10 denotes a cryopump main body, which is connected to a vacuum chamber 8 by a flange 12.
  • the purpose of the cryopump 10 is to increase the degree of vacuum in the vacuum chamber 8.
  • the cryopump 10 includes, for example, a heat shield plate 30, a louver 32, and a cryopanel (also referred to as a two-stage panel) 34, which are cooled by a cryogenic refrigerator 20 connected to the bottom surface thereof.
  • the heat shield plate 30 and the louver 32 are cooled by the one-stage cooling stage (hereinafter, also simply referred to as the one-stage stage) 21 of the cryogenic refrigerator 20, and the louver 32 is cooled through the heat shield plate 30.
  • the cryopanel 34 is cooled by the second (cooling) stage 22.
  • the cryopanel 34 has a shape in which the top of an umbrella is formed in a plane as shown in FIG. 2, is connected to a central cylinder, and has a shape in which several stages are combined.
  • the condensed gas 9 exhausted and condensed from the vacuum chamber 8 falls on the cryopanel 34 like snow and has a limited amount of occlusion. . Even if the number of stages of the cryopanel was increased, the lower stage could only store gas at the slope of the umbrella, which had little effect on the size of the equipment.
  • Japanese Patent Application Laid-Open No. 7-42671 describes that the difference between the pumping speed and the amount of occlusion is to increase the pumping speed by surrounding a certain cryo-panel with a looper-type baffle.
  • Japanese Patent Application Laid-Open No. H8-219019 describes that the length of the cryopanel in the gas inflow direction is increased to increase the occlusion amount.
  • Japanese Patent Publication No. 7-507855 (US Pat. No. 5,301,511) also describes a configuration similar to that of FIG.
  • Japanese Patent Publication No. 7-507855 discloses that frost generated by condensed gas prevents narrowing of the gap between the radiation shield and the cryopanel. The object is different from that of the present invention.
  • the present invention has been made to solve the above-described conventional problems, and has as its object to increase the amount of occluded gas without increasing the size of the cryopump.
  • the present invention relates to a cryopump having a cryopanel connected to a vacuum chamber for increasing the degree of vacuum, and the gas is supplied to an inflow portion of a gas flowing from the vacuum chamber into the cryopanel.
  • This problem has been solved by providing a condensed gas adsorption member having a surface parallel to the inflow direction.
  • the condensed gas adsorbing member is opened on the cryopanel side to improve gas escape.
  • the outer condensed gas adsorbing member is disposed outside the extension of the cryopanel.
  • the interval between the plurality of condensed gas adsorbing members is set to 25 mm or more.
  • the condensed gas adsorbing member has a cylindrical shape.
  • an inner condensed gas adsorbing member is provided with an L-shaped support portion mounted on the cryopanel.
  • the outer condensed gas adsorbing member has an I-shaped support portion mounted on the cryopanel, It has an opening provided therebetween.
  • the condensed gas adsorption member is connected to a cooling stage of a refrigerator.
  • the present invention also provides a sputtering apparatus and a semiconductor manufacturing apparatus including the cryopump.
  • the condensed gas adsorbing member independent of the cryopanel is provided at the gas inflow portion, so that the amount of condensed gas occluded without affecting the amount of occlusion of the conventional cryopanel can be increased. Therefore, it is possible to dramatically increase the amount of condensed gas stored without increasing the size of the apparatus.
  • FIG. 1 is a cross-sectional view showing an example of a configuration of a conventional cryopump.
  • FIG. 2 A perspective view of an example of the same cryopanel.
  • FIG. 3 is a cross-sectional view showing a main configuration of a cryopump according to a first embodiment of the present invention.
  • FIG. 4 is a perspective view showing a configuration of a first cylindrical panel used in the first embodiment.
  • FIG. 5 is a perspective view showing the configuration of the second cylindrical panel.
  • FIG. 7 is a cross-sectional view showing a state where the first and second cylindrical panels are mounted on a two-stage stage.
  • FIG. 8 is a sectional view showing a configuration of a main part of a second embodiment of the present invention.
  • the embodiment of the present invention relates to a cryopump similar to the conventional example shown in FIG. 1 and FIG. 2 as shown in FIG.
  • the two cylindrical panels 41 and 42 having a surface parallel to are arranged on the refrigerator two-stage stage 22 such that the side surfaces thereof are parallel to the gas inflow direction.
  • the first cylindrical panel 41 having a cylindrical shape made of copper similarly to the cryopanel 34 includes: As shown in FIG. 4, a notch is provided in the lower portion to provide an opening 41A for gas passage, and for example, an L-shaped support portion 41B is attached to the two-stage stage 22 so as to have good heat conduction.
  • the cylindrical second cylindrical panel 42 formed of copper has an outer diameter larger than that of the first cylindrical panel 41, and is shown in Figs. 5 (perspective view) and 6 (bottom view). As shown in (1), a lower portion is folded to provide an I-shaped support portion 42B having an opening 41A for gas passage, for example, and is attached to the second stage 22 with good heat conduction.
  • FIG. 7 shows the joined state.
  • the distance L between the cylinders is at least 25 mm so that the sediment does not hinder the gas flow.
  • the joining method is not limited to the bonding, and a screw may be used with a metal such as indium sandwiched therebetween in order to enhance heat conduction.
  • the first cylindrical panel 41 and the second cylindrical panel 42 are cooled by the two-stage stage 22 of the cryogenic refrigerator 20 similarly to the conventional cryopanel 34, and separately from the gas storage amount of the cryopanel 34.
  • the condensed gas 9 can be adsorbed on both sides. Therefore, the amount of occluded gas can be increased.
  • the force gas in which the cylindrical panel is placed vertically is piled up perpendicular to the direction in which the gas flowing in the direction of gravity flows like snow, so that the gas inflow direction is In the case of the horizontal orientation, as in the second embodiment shown in FIG. 8, even when the cylindrical panels 41 and 42 are placed horizontally, the adsorbed gas is similarly deposited.
  • two cylindrical panels 41 and 42 are added, but one or three or more panels may be used.
  • the shape of the panel is not limited to a cylindrical shape, but may be a rectangular tube shape or a discontinuous plate shape.
  • the number of stages of the cryogenic refrigerator is not limited to two, but may be one or three or more.
  • the direction of the cryogenic refrigerator is not limited to the horizontal type, and may be a vertical type.
  • the present invention can be used for, for example, a sputtering apparatus, an ion plating apparatus, and a semiconductor manufacturing apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Abstract

L'invention porte sur une pompe cryostatique dans laquelle le volume de gaz absorbé s'accroît sans que la taille de la pompe augmente. Pour obtenir cette pompe, on forme des panneaux tubulaires (41, 42) ayant une surface parallèle au sens de l'écoulement entrant du gaz au niveau de la section d'écoulement entrant par laquelle le gaz passe d'une chambre sous vide (8) à un panneau cryostatique (34).
PCT/JP2004/017016 2003-11-19 2004-11-16 Pompe cryostatique WO2005050017A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005515611A JPWO2005050017A1 (ja) 2003-11-19 2004-11-16 クライオポンプ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003389580 2003-11-19
JP2003-389580 2003-11-19

Publications (1)

Publication Number Publication Date
WO2005050017A1 true WO2005050017A1 (fr) 2005-06-02

Family

ID=34616254

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/017016 WO2005050017A1 (fr) 2003-11-19 2004-11-16 Pompe cryostatique

Country Status (2)

Country Link
JP (1) JPWO2005050017A1 (fr)
WO (1) WO2005050017A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009062890A (ja) * 2007-09-06 2009-03-26 Sumitomo Heavy Ind Ltd クライオパネル
CN110608149A (zh) * 2018-06-14 2019-12-24 上海优拓低温技术有限公司 一种低温泵

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4643740B1 (fr) * 1968-08-01 1971-12-25
JPS62113876A (ja) * 1985-11-13 1987-05-25 Hitachi Ltd クライオポンプ
JPH02294573A (ja) * 1989-05-09 1990-12-05 Toshiba Corp 真空排気装置および真空排気方法
JPH07507855A (ja) * 1992-06-12 1995-08-31 ヘリツクス・テクノロジー・コーポレーシヨン フロスト濃縮装置を有する低温ポンプおよび低温パネル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4643740B1 (fr) * 1968-08-01 1971-12-25
JPS62113876A (ja) * 1985-11-13 1987-05-25 Hitachi Ltd クライオポンプ
JPH02294573A (ja) * 1989-05-09 1990-12-05 Toshiba Corp 真空排気装置および真空排気方法
JPH07507855A (ja) * 1992-06-12 1995-08-31 ヘリツクス・テクノロジー・コーポレーシヨン フロスト濃縮装置を有する低温ポンプおよび低温パネル

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009062890A (ja) * 2007-09-06 2009-03-26 Sumitomo Heavy Ind Ltd クライオパネル
CN110608149A (zh) * 2018-06-14 2019-12-24 上海优拓低温技术有限公司 一种低温泵
CN110608149B (zh) * 2018-06-14 2022-02-25 上海优拓低温技术有限公司 一种低温泵

Also Published As

Publication number Publication date
JPWO2005050017A1 (ja) 2007-11-29

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