WO2005003001A1 - ボールトランスファユニットおよびボールテーブル - Google Patents
ボールトランスファユニットおよびボールテーブル Download PDFInfo
- Publication number
- WO2005003001A1 WO2005003001A1 PCT/JP2004/009672 JP2004009672W WO2005003001A1 WO 2005003001 A1 WO2005003001 A1 WO 2005003001A1 JP 2004009672 W JP2004009672 W JP 2004009672W WO 2005003001 A1 WO2005003001 A1 WO 2005003001A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pole
- main body
- ball
- small
- transfer unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors
- B65G39/02—Adaptations of individual rollers and supports therefor
- B65G39/025—Adaptations of individual rollers and supports therefor having spherical roller elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C29/00—Bearings for parts moving only linearly
- F16C29/04—Ball or roller bearings
- F16C29/045—Ball or roller bearings having rolling elements journaled in one of the moving parts
- F16C29/046—Ball or roller bearings having rolling elements journaled in one of the moving parts with balls journaled in pockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C2326/00—Articles relating to transporting
- F16C2326/58—Conveyor systems, e.g. rollers or bearings therefor
Definitions
- the present invention relates to a pole table for supporting an object to be displaced in an arbitrary direction along a transfer surface thereof and a pole transfer unit used for the pole table.
- Background technology In order to correct the transport position of an object to be transported in the middle of its transport path, or to change the transport direction to an orthogonal direction, a ball transit with multiple pole transformers arranged on a support member such as a surface plate Bull is used.
- the pole trans-fan phantom incorporated in the port table includes a main body having a hemispherically concave seating surface, and a plurality of small pawls each of which comes into rolling contact with the seating surface ′ of the main body.
- the large ball rolls and the small pole that comes into contact with the large pole and the seating surface of the main body is moved by the movement of the load placed on the large ball. By rolling between them, the static friction resistance between the transferred object and the large pole can be extremely reduced.
- the transported object can be easily displaced by an external force in any direction on the transport surface of the transported object, and the transporting posture of the transported object in the middle of transport is possible. Can be modified very easily.
- Japanese Patent No. 26411187 discloses that a side edge, which serves as a positioning reference for an object to be conveyed, such as a heavy windowpane for an automobile, conveyed on a pole table, is positioned with respect to the ball table. Achievement of fixed positioning reference block A technique has been disclosed in which the transfer posture of a transferred object is corrected by pressing the transfer object.
- An object of the present invention is to remove foreign matter that does not damage the surface of a transferred object, does not cause a defect in the transferred object itself, or cannot be removed by a cleaning operation in a later process.
- An object of the present invention is to provide a ball transfer unit and a ball table using the same.
- a main body having a hemispherically concave seating surface, a plurality of small pawls each of which rollably abuts the seating surface of the main body,
- At least the main body and the large pole are made of PAI, PBI, PCTFE, PEEK, PEI, PI, PPS, melamine resin, aromatic polyamide resin, aluminum oxide, zirconium oxide, nitrided. Since it is formed of any of the elements, the frictional resistance against the movement of the load mounted on the large pole can be minimized, and the load can be displaced by a small external force. In this case, the rotation of a large pole or a small pole As a result, these abrasion dusts are less likely to be generated, and even if they are generated and adhere as traces to the transported object, they can be easily cleaned, so that adverse effects particularly in semiconductor wafer processing and flat panel display manufacturing are reduced. It is possible to prevent this before it happens. In addition, excellent characteristics can be obtained with respect to resistance to ultraviolet rays or chemicals.
- the heat distortion temperature of the main body, small pole, and large pole in the ASTM D648 test is 120 ° C or more, respectively. If these heat deformation temperatures are less than 12, the large poles and the seating surface of the main body will be deformed when used in a relatively hot environment or in an environment with a high environmental temperature. The frictional resistance when moving the transported object from the stationary state increases, and the smooth movement of the transported object is hindered.
- the small pole may be formed of the same material as the main body or large ball, or the small pole may be made of SUS304, SUS316, SUS420j2, SUS440C or wet surface treatment (chemical It can also be formed of stainless steel such as SUS304 and SUS316 which has been polished and cleaned.
- the main body and large ball are made of PA I, PBI, PCTFE, PEEK, PE I, PI, P PS, melamine resin, and aromatic polyamide resin. Is preferred.
- the small balls are formed of the same material as the main body or the large balls as described above, no metal powder is generated from the pole transfer unit due to abrasion, so it is particularly useful in processing semiconductor wafers and manufacturing flat panel displays. An adverse effect can be prevented beforehand.
- the pole transfer unit may be formed of a single material, which can further simplify the treatment of foreign matter.
- a pretreatment device for the substrate glass for liquid crystal panels for example, in a vacuum chamber or heating furnace in an exposure device, a plasma dry etcher, a sputtering device, or the like. Particularly good results are obtained when using the ball transfer unit in or at sites exposed to chemicals, glass cutting or inspection equipment and laser repair for post-inspection corrections.
- the main body further has an annular groove formed on the outer peripheral surface thereof, and the cover has a cylindrical portion fitted around the outer peripheral surface of the main body, and is formed on the inner periphery of the lower end portion of the cylindrical portion to be formed in the annular groove.
- An annular locking portion capable of being elastically deformed in the radial direction that can be locked, wherein the inner diameter of the locking portion is set smaller than the outer diameter of the main body.
- the cover is made of PAI, PBI, PCTFE, PEEK, PEI, PI, PPS, melamine resin, or aromatic polyamide resin.
- An annular groove is formed on the outer peripheral surface of the main body, and a cylindrical portion is fitted around the outer peripheral surface of the main body, and is elastically deformed in a radial direction formed on the inner periphery of a lower end portion of the cylindrical portion so as to be locked in the annular groove. If the cover is provided with a possible annular locking portion and the inner diameter of this locking portion is set smaller than the outer diameter of the main body, the cover can be snapped to the main body, When fixing the cover, the generation of foreign matter can be prevented beforehand, and the reliability particularly for use in a clean room can be ensured. From this point of view, it is effective to wash and clean-pack the pole trans unit immediately after production and use it in a clean room.
- the pole transfer unit immediately after production was preliminarily washed with IPA (isopropyl alcohol) or a surfactant, the surfaces were degreased and foreign substances were removed, and then the surfactant was added.
- IPA isopropyl alcohol
- the pre-cleaned ball transfer unit is placed in the ultrasonic cleaning tank in which pure water is stored, ultrasonic cleaning is performed while heating these to an appropriate temperature, and then rinsing with pure water is performed in multiple stages. And drain with clean air. After that, the cleaned pole transfer unit is heated and dried in the drying room, and clean-packed with the specified packing material. This makes it possible to guarantee the cleanliness of the pole transfer unit to, for example, class 10 or so.
- a communication hole which penetrates the main body and has one end opened to the seating surface can be further provided. This communication hole does not hinder the rolling operation of the small pole along the seat surface, It is preferable that the inner diameter of the opening is set smaller than the radius of the small ball.
- a communication hole that penetrates the main body and one end opens to the seating surface, especially when a pole transfer unit is used in a vacuum chamber, degassing in the pole transfer unit is caused by the presence of the communication hole. Can be performed easily and quickly. Further, the cleaning liquid that flows into the pole transfer unit as the conveyed object is cleaned can be easily discharged to the outside through the communication hole.
- a fastening portion such as a female screw cylinder or a male screw portion or a mounting flange for fixing the main body can be formed integrally with the main body.
- a portable table for supporting an object to be transported, wherein a plurality of the pole transfer units according to the first aspect of the present invention and these pole transfer units are arranged at predetermined intervals.
- a pole table comprising a fixed support member.
- each ball transfer unit when an external force parallel to the surface of the support member is applied to the load placed on the support member via the pole transfer unit, each ball transfer unit is displaced with the displacement of the load.
- Each of the large balls rolls, and the small poles supporting these large poles also roll with respect to the bearing surface of each main body, so that the frictional resistance against the movement of the load is minimized.
- the pole transfer units since it includes the plurality of pole transfer units according to the present invention and the support members in which the pole transfer units are fixed at predetermined intervals, the pole transfer units extend over the individual pole transfer units. Accordingly, the frictional resistance to the movement of the object mounted on the support member can be minimized, and the object can be displaced on the support member with a small external force. In this case, it is difficult to generate these abrasion dusts with the rotation of the large pole or the small ball, and it is generated and adheres to the conveyed object as a trace. Since it can be easily cleaned, it is possible to prevent the adverse effects of using a pole table especially when processing semiconductor wafers and glass substrates for flat panel displays.
- the transferred object may be a semiconductor wafer or a glass substrate for a flat panel display.
- FIG. 1 is a projection view showing the appearance of an embodiment of a pole table according to the present invention in a broken state.
- FIG. 2 is a partially cutaway sectional view showing the internal structure of an embodiment of the ball transfer unit according to the present invention incorporated in the pole table shown in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 2 The internal structure of the present invention will be described in detail with reference to FIG. 2 showing the internal structure in a broken state, but the present invention is not limited to only such an embodiment, All changes and modifications encompassed in mind are possible and, of course, applicable to any other technique belonging to the spirit of the invention.
- FIG. 1 shows an external view of a main part of the ball table in the present embodiment
- FIG. 2 shows a cross-sectional structure of a pole transformer in the ball table. That is, female screw holes (not shown) are formed at predetermined intervals on the surface of the platen 11 as a support member in the present invention, which is formed of SUS304 or the like whose surface is subjected to electroless nickel plating. Each female screw hole protrudes downward from the center of the body 13 of the ball transfusant 12
- the male screw part 13a is screwed in as a fastening part.
- a positioning block (not shown) is fixed to the surface plate 11, and the side end of the glass substrate W conveyed onto the surface plate 11 is moved over the surface plate 11 by an unillustrated actuator. The posture of the glass substrate W is corrected by sliding it against the positioning block.
- the pole transfer unit 12 in the present embodiment has a cylindrical body 13 having a hemispherically concave seating surface 13 b formed at the center of the upper end, and a seating surface 13 of the body 13.
- Both the small pole 14 and the large ball 15 are mechanically polished to obtain a predetermined sphericity, and similarly, the bearing surface 13b of the main body 13 is also mechanically polished so as to have a predetermined radius of curvature.
- most of the small pockets 14 are simultaneously brought into point contact with the bearing surface 13 b of the main body 13 and the outer peripheral surface of the large ball 15. With this arrangement, the frictional resistance when the glass substrate W is moved from the state where the glass substrate W is placed on the large ball 15 is minimized.
- One end of the communication hole 13 c that passes through the main body 13 through the center of the male screw part 13 a is open to the seat 13 b of the main body 13, and the other end is the end face of the male screw part 13 a It is open to.
- the open end of the communication hole 13c on the side of the seat 13b should have an inside diameter smaller than the radius of the small pole 14 so as not to hinder the smooth rolling of the small pole 14 along the seat 13b. Is also a small diameter portion 13d set to be small, and a chamfered portion 13e is formed at an open end facing the seating surface 13b. Due to the presence of the communication hole 13c, for example, the pole transfer unit 12 is used in a vacuum chamber. When used, the exhaust operation in the pole transfer unit 12 can be performed quickly and reliably. In addition, when cleaning the glass substrate W, the cleaning liquid flowing into the pole transfer unit 12 can be easily discharged to the outside through the communication hole 13c. As long as one end of the communication hole 13 c is open to the seat 13 b so as to penetrate the body 13, the other end of the communication hole 13 c is formed on the outer peripheral surface of the body 13. You may make it open.
- the above-mentioned male thread part 13a is also formed integrally with the main body 13 by PI, and is finished by machining.However, it is also possible to use a female thread cylinder instead of the male thread part 13a. In this case, fine adjustment of the protrusion height of the pole transformer unit 12 from the surface plate 11 can be performed more easily.
- the lower end of the cylindrical portion 16 a of the cover 16 with a cup-shaped cross section 16 (the lower side in FIG.
- a tool such as a wrench to fix the body 13 to the surface plate 11 by screwing the male thread 13 a into the female screw hole of the surface plate 11
- a pair of flat portions 13 g having a so-called two-sided width sandwiched between them is formed.
- the annular groove 13 in the present embodiment is formed on the upper end side (upper in FIG. 2) of the main body 13 with respect to the pair of flat portions 13 g.
- An opening 16c is formed at the center of the cover 16 so that the upper end of the large pole 15 protrudes, and the inside diameter of the opening 16c is smaller than the outside diameter of the large pole 15.
- the large pole 15 is not in contact with the large pole 15 in the state shown in Fig. 2 where the large pole 15 is held on the seat 13b of the main body 13 via the small pole 14. It is set to such dimensions.
- the inner diameter of the cylindrical portion 16a of the cover 16 is set so that the inner diameter of the cylindrical portion 16a fits into the outer diameter of the main body 13, but the inner diameter of the locking portion 16b. It is set smaller than the outer diameter of 3.
- the locking portion 16b is elastically deformed and swells radially outward, so that the annular groove 13f is formed. When it reaches, it returns to its original state, and the locking part 16 b The cover 16 fits inside the 3 f so that the cover 16 does not come off the body 13.
- the outer diameter of the outer diameter of the main body 13 is set at the upper end of the outer circumference of the main body 13 so that the locking portion 16 b having a smaller diameter than the outer diameter of A tapered portion 13 h is formed, which is smaller than the inner diameter of the locking portion 16 b, and a taper portion 13 h is formed.
- Notch 13 i is formed in a part of the upper end surface of main body 13.
- each pole transfer unit 12 By properly interposing a shim (not shown) having an appropriate thickness between the surface plate 11 and the main body 13, the adjustment can be made appropriately.
- the entire pole transfer unit 12 was formed of PI, but PA I, PBI, PCTFE, PEEK, PEI, PI, PPS, melamine resin, aromatic polyamide resin, aluminum oxide, oxide oxide It can be formed of either zirconia or silicon nitride.
- Pre-processing equipment for liquid crystal panel substrate glass for example, in vacuum chambers and heating furnaces in exposure equipment, plasma dryers, sputtering equipment, etc., or in places exposed to chemicals, glass cutting or inspection equipment, and after inspection
- comprehensive judgment should be made taking into account these physical properties, the attachment characteristics of foreign matter to the transferred object, and manufacturing costs.
- the entire Poltransunit 12 it is presently most preferred to form the entire Poltransunit 12 with PI, PEEK or PBI. If the body 13, small pole 14, large pole 15, and cover 16 of the pole transfer unit 12 are all made of the same material, the cleaning process for foreign substances can be simplified. There are advantages. In addition, it is more likely that the static frictional resistance can be minimized by unifying the body 13, the small ball 14, and the large pole 15 that are in contact with each other with the same material.
- the present invention supports a plate-shaped object to be conveyed in a clean room or the like where metal powder or foreign matter that is difficult to clean in a post-process is not adhered, and adjusts its position easily. It can be used as a possible ball table.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Rolling Contact Bearings (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Float Valves (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800250887A CN1845863B (zh) | 2003-07-01 | 2004-07-01 | 滚珠传送单元及滚珠台 |
JP2005511400A JPWO2005003001A1 (ja) | 2003-07-01 | 2004-07-01 | ボールトランスファユニットおよびボールテーブル |
AT04747141T ATE464255T1 (de) | 2003-07-01 | 2004-07-01 | Kugelübertragungseinheit und kugeltisch |
EP04747141A EP1640295B1 (en) | 2003-07-01 | 2004-07-01 | Ball transfer unit and ball table |
DE602004026581T DE602004026581D1 (ja) | 2003-07-01 | 2004-07-01 | |
US10/561,568 US7370746B2 (en) | 2003-07-01 | 2004-07-01 | Ball transfer unit and ball table |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003270186 | 2003-07-01 | ||
JP2003-270186 | 2003-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005003001A1 true WO2005003001A1 (ja) | 2005-01-13 |
Family
ID=33562605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/009672 WO2005003001A1 (ja) | 2003-07-01 | 2004-07-01 | ボールトランスファユニットおよびボールテーブル |
Country Status (10)
Country | Link |
---|---|
US (1) | US7370746B2 (ja) |
EP (1) | EP1640295B1 (ja) |
JP (1) | JPWO2005003001A1 (ja) |
KR (1) | KR100702081B1 (ja) |
CN (1) | CN1845863B (ja) |
AT (1) | ATE464255T1 (ja) |
DE (1) | DE602004026581D1 (ja) |
ES (1) | ES2344646T3 (ja) |
TW (1) | TW200524799A (ja) |
WO (1) | WO2005003001A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020189725A (ja) * | 2019-05-22 | 2020-11-26 | 島田テクノロジー株式会社 | ボールコンベア |
JP2021190673A (ja) * | 2020-06-03 | 2021-12-13 | コヨ サーモ システム コリア カンパニー リミテッド | 熱処理装置の基板搬送ユニット |
Families Citing this family (25)
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JP5551888B2 (ja) * | 2009-04-14 | 2014-07-16 | 株式会社井口機工製作所 | フリーボールベアリング、ベアリング装置、支持テーブル、搬送設備、ターンテーブル |
JP2010265095A (ja) * | 2009-05-15 | 2010-11-25 | Iguchi Kiko Seisakusho:Kk | ベアリングユニット、フリーボールベアリング、支持テーブル、搬送設備、ターンテーブル |
KR101002615B1 (ko) * | 2010-03-23 | 2010-12-20 | 주식회사 코리아이엔지 | 볼트랜스퍼를 이용한 운반장치 |
CN102147194B (zh) * | 2011-04-29 | 2012-08-08 | 湖州松华橡塑有限公司 | 一种烘房箱的工件推车 |
US8529131B2 (en) * | 2011-12-06 | 2013-09-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Ball transfer unit |
US8864436B2 (en) * | 2011-12-06 | 2014-10-21 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Alignment device of cutting machine |
GB2531472B (en) * | 2013-02-20 | 2016-07-27 | Conveyor Units Ltd | Ball assembly and a method for manufacturing the same |
CN104165720B (zh) * | 2013-05-17 | 2016-10-05 | 臻越自动化技术(上海)有限公司 | 支撑单元以及拉压力检测装置 |
CN105682846B (zh) | 2013-10-29 | 2018-04-17 | 本田技研工业株式会社 | 焊枪 |
CN103991667B (zh) * | 2014-06-04 | 2016-07-06 | 昆山宝锦激光拼焊有限公司 | 一种板材传送装置 |
JP2016137733A (ja) * | 2015-01-26 | 2016-08-04 | 三菱航空機株式会社 | フロアパネル装置 |
CN104912921B (zh) * | 2015-05-30 | 2017-05-31 | 德清恒富机械有限公司 | 滚子轴承 |
US9863839B2 (en) * | 2015-11-18 | 2018-01-09 | The Boeing Company | Positioner for electrodynamic shaker |
TWM527411U (zh) * | 2016-05-06 | 2016-08-21 | Fivetech Technology Inc | 滾動裝置、滾動裝置包裝體及滾動模組 |
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CN107555174A (zh) * | 2017-09-27 | 2018-01-09 | 浙江云峰莫干山家居用品有限公司 | 气浮平台 |
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- 2004-07-01 DE DE602004026581T patent/DE602004026581D1/de active Active
- 2004-07-01 US US10/561,568 patent/US7370746B2/en not_active Expired - Fee Related
- 2004-07-01 TW TW093119948A patent/TW200524799A/zh not_active IP Right Cessation
- 2004-07-01 JP JP2005511400A patent/JPWO2005003001A1/ja active Pending
- 2004-07-01 AT AT04747141T patent/ATE464255T1/de not_active IP Right Cessation
- 2004-07-01 KR KR1020057025212A patent/KR100702081B1/ko active IP Right Grant
- 2004-07-01 WO PCT/JP2004/009672 patent/WO2005003001A1/ja active Application Filing
- 2004-07-01 ES ES04747141T patent/ES2344646T3/es active Active
- 2004-07-01 CN CN2004800250887A patent/CN1845863B/zh not_active Expired - Fee Related
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JP2020189725A (ja) * | 2019-05-22 | 2020-11-26 | 島田テクノロジー株式会社 | ボールコンベア |
JP2021190673A (ja) * | 2020-06-03 | 2021-12-13 | コヨ サーモ システム コリア カンパニー リミテッド | 熱処理装置の基板搬送ユニット |
JP7155200B2 (ja) | 2020-06-03 | 2022-10-18 | コヨ サーモ システム コリア カンパニー リミテッド | 熱処理装置の基板搬送ユニット |
Also Published As
Publication number | Publication date |
---|---|
TWI339182B (ja) | 2011-03-21 |
JPWO2005003001A1 (ja) | 2006-08-10 |
EP1640295A1 (en) | 2006-03-29 |
TW200524799A (en) | 2005-08-01 |
KR100702081B1 (ko) | 2007-04-02 |
ATE464255T1 (de) | 2010-04-15 |
US7370746B2 (en) | 2008-05-13 |
KR20060038404A (ko) | 2006-05-03 |
US20070029158A1 (en) | 2007-02-08 |
CN1845863A (zh) | 2006-10-11 |
CN1845863B (zh) | 2011-03-09 |
EP1640295B1 (en) | 2010-04-14 |
EP1640295A4 (en) | 2008-10-01 |
DE602004026581D1 (ja) | 2010-05-27 |
ES2344646T3 (es) | 2010-09-02 |
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