WO2005002832A1 - チューブ接合装置 - Google Patents
チューブ接合装置 Download PDFInfo
- Publication number
- WO2005002832A1 WO2005002832A1 PCT/JP2004/009338 JP2004009338W WO2005002832A1 WO 2005002832 A1 WO2005002832 A1 WO 2005002832A1 JP 2004009338 W JP2004009338 W JP 2004009338W WO 2005002832 A1 WO2005002832 A1 WO 2005002832A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- unit
- cutting
- tube
- joining
- wafer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/20—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
- B29C65/2007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by the type of welding mirror
- B29C65/203—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by the type of welding mirror being several single mirrors, e.g. not mounted on the same tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/20—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M39/00—Tubes, tube connectors, tube couplings, valves, access sites or the like, specially adapted for medical use
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M39/00—Tubes, tube connectors, tube couplings, valves, access sites or the like, specially adapted for medical use
- A61M39/10—Tube connectors; Tube couplings
- A61M39/14—Tube connectors; Tube couplings for connecting tubes having sealed ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/20—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
- B29C65/2046—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" using a welding mirror which also cuts the parts to be joined, e.g. for sterile welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/20—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
- B29C65/2053—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by special ways of bringing the welding mirrors into position
- B29C65/2061—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by special ways of bringing the welding mirrors into position by sliding
- B29C65/2069—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by special ways of bringing the welding mirrors into position by sliding with an angle with respect to the plane comprising the parts to be joined
- B29C65/2076—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror" characterised by special ways of bringing the welding mirrors into position by sliding with an angle with respect to the plane comprising the parts to be joined perpendicularly to the plane comprising the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
- B29C65/30—Electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/001—Joining in special atmospheres
- B29C66/0012—Joining in special atmospheres characterised by the type of environment
- B29C66/0018—Joining in special atmospheres characterised by the type of environment being sterile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/52—Joining tubular articles, bars or profiled elements
- B29C66/522—Joining tubular articles
- B29C66/5221—Joining tubular articles for forming coaxial connections, i.e. the tubular articles to be joined forming a zero angle relative to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
- B29C66/7373—Joining soiled or oxidised materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8167—Quick change joining tools or surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/818—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/84—Specific machine types or machines suitable for specific applications
- B29C66/857—Medical tube welding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/87—Auxiliary operations or devices
- B29C66/872—Starting or stopping procedures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/87—Auxiliary operations or devices
- B29C66/874—Safety measures or devices
- B29C66/8748—Safety measures or devices involving the use of warnings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/87—Auxiliary operations or devices
- B29C66/876—Maintenance or cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
- B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
- B29C66/91231—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature of the joining tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91431—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being kept constant over time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
- B29C66/91651—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux by controlling or regulating the heat generated by Joule heating or induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/942—Measuring or controlling the joining process by measuring or controlling the time by measuring the time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
- B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M39/00—Tubes, tube connectors, tube couplings, valves, access sites or the like, specially adapted for medical use
- A61M39/10—Tube connectors; Tube couplings
- A61M39/14—Tube connectors; Tube couplings for connecting tubes having sealed ends
- A61M39/146—Tube connectors; Tube couplings for connecting tubes having sealed ends by cutting and welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
- B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
- B29C66/91211—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods
- B29C66/91212—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws
- B29C66/91213—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws and measuring the electrical resistance of a resistive element belonging to said welding jaws, said element being, e.g. a thermistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/712—Containers; Packaging elements or accessories, Packages
- B29L2031/7148—Blood bags, medical bags
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1313—Cutting element simultaneously bonds [e.g., cut seaming]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
- Y10T156/1326—Severing means or member secured thereto also bonds
Definitions
- the present invention relates to a tube joining apparatus that cuts and joins a flexible tube, and in particular, has an automatic return function when the power supply is cut off during the tube joining operation and the apparatus stops operating.
- the present invention relates to a tube joining apparatus provided.
- Japanese Patent Publication No. Sho 61-30582 discloses a pair of holders (procks) that can hold two tubes to be connected in parallel, and a pair of holders (procks) that are placed between both holders and move across the tubes.
- a tube joining apparatus having a cutting plate (plate-like heating element, wafer) that can be used is disclosed.
- the cutting plate is heated and moved while the two tubes are held in parallel and in opposite directions in the grooves formed in both holders to melt the tubes, and then one of the holders is cut.
- the tubes are moved in the radial direction (the direction in which they are arranged) so that the cut ends of the tubes to be joined are aligned with each other, and the cutting plate is moved to the retracted position and pulled out to fuse both tubes.
- Japanese Patent Application Laid-Open No. 6-91010 discloses that two tubes are used in order to increase the reliability of tube joining using the same tube joining method as the above tube joining device.
- a tube joining device having a first clamp and a second clamp that are held in a parallel state and moving the first clamp in parallel with the second clamp is disclosed.
- a first clamp moving mechanism that moves only before and after the retraction and forward movement
- a second clamp moving mechanism that moves the second clamp only in a direction approaching / separating from the first clamp. It has.
- Japanese Patent Application Laid-Open No. 4-308731 discloses that although the basic principle of heating and melting tubes and aseptically joining the tubes using a cutting plate is the same, If liquid remains in the tube beforehand, the liquid in the tube should not leak while being sealed.
- a tube joining apparatus for joining tubes is disclosed.
- two tubes first tube and second tube
- both tubes are heated by a cut plate.
- rotate the tube holder After cutting the tube between the holders, rotate the tube holder to align the cut end face on one side of the first tube with the cut end face on the other side of the second tube, retract the cutting plate, and melt both tubes. To wear.
- Japanese Patent Application Laid-Open No. 9-154920 discloses that, in addition to the purpose of joining tubes without leaking while keeping the liquid in the tube sealed, the amount of movement of the tubes when connecting the tubes is limited.
- a tube joining device capable of reducing the number of devices and the components of the device is disclosed.
- two tubes to be connected to two tube holders having a U-shaped groove first and second tube holders
- two tube holders having a U-shaped groove are housed and held in a state of contacting (overlapping) two tubes.
- After cutting both tubes with the heated cutting plate rotate the second tube holder by 180 ° relative to the first tube holder, so that the cut end faces of both tubes are exchanged and aligned. Then, the cutting plate is retracted, and the tubes are fused.
- an object of the present invention is to provide a tube joining apparatus that can return to its own state without damaging the apparatus even when the operation of the apparatus is stopped, and that also considers the safety of the operator. I do.
- a first aspect of the present invention provides a holding unit that holds at least two flexible tubes and presses the tubes in a flat shape, and a holding unit that holds the flexible tubes.
- a cutting section for cutting the flat tube an electrode section for supplying heating power to the cutting section, and moving the cutting section between a tube cutting position and a tube non-cutting position.
- a holding unit moving unit that moves the holding unit; and a control unit that controls operations of the power supply to the electrode unit and the cutting unit movement unit and the holding unit movement unit. Department stops and then re- When operating, the necessity of the return operation is determined in accordance with the detection information of the cut portion by the cut portion detection sensor.
- the first mode at least two flexible tubes are held by the holding portion and pressed flat.
- Heating power is supplied to the cutting section that cuts the flat tube held by the holding section via the electrode section, and the cutting section moving unit moves the cutting section to the tube non-cutting position and the tube cutting position.
- the flat tube held by the holding section is cut.
- the position of at least two tubes cut by the cutting unit is relatively changed by the holding unit moving unit, and the holding unit is moved so that the ends to be joined are in close contact with each other, so that the tubes are joined together.
- the power supply to the electrode unit and the operation of the cutting unit moving unit and the holding unit moving unit are controlled by the control unit.
- the control unit controls the cutting unit moving unit by the cutting unit detection sensor. Then, the necessity of the return operation is determined in accordance with the detection information of the moving cutting section. According to the first mode, when the apparatus is restarted after the apparatus is stopped, the control unit determines the necessity of the return operation according to the detection information of the cutting section detection sensor.
- the control unit has a non-volatile memory that stores bonding processing information indicating a bonding processing state of the tube, the bonding processing information stored in the non-volatile memory is information indicating that a bonding operation is being performed, and
- the cut section detection sensor detects the cut section that has moved to the tube cutting position, it may be determined that a return operation is necessary, and control may be performed to perform the return operation.
- a locking portion that locks to at least a part of the holding portion to prohibit an opening operation of the tube from the pressed state by the holding portion; and a holding portion lock sensor that detects a locking state of the holding portion by the locking portion.
- the control unit detects the cutting portion moved to the tube cutting position by the cutting portion detection sensor, wherein the joining process information stored in the non-volatile memory is information indicating that the joining operation is being performed;
- the unit lock sensor detects the holding portion locked by the locking portion, it may be determined that the returning operation is necessary, and control may be performed so as to perform the returning operation.
- the control unit further includes a locking unit that is locked to at least a part of the holding unit and prohibits the holding unit from releasing the pressing force of the tube, and a display unit for displaying information. If it is determined that the resetting is necessary, the control unit controls the return power supply to the electrode unit and the return operation of the cutting unit moving unit, the holding unit moving unit, and the locking unit, and displays an error on the display unit. You may control it.
- control unit causes the non-volatile memory to store information indicating that the bonding operation is being performed as the bonding process information when a predetermined time has passed since the heating start force of the electrode unit on the cutting unit. Is also good.
- the control unit further includes a position detection sensor for detecting that the holding unit moved by the holding unit moving unit has reached a joining completion position for bringing the cut ends of the cut tubes into close contact with each other. May detect that the non-bonding operation is being performed as the bonding processing information in the non-volatile memory when detecting that the holding unit has reached the bonding completion position.
- the non-volatile memory is capable of storing the exchange information of the cutting plate, and includes a cutting plate transporting unit that exchangeably transports the cutting plate to the cutting unit, and the control unit is stored in the nonvolatile memory.
- the joining processing information is information indicating that a non-joining operation is being performed
- the exchange information of the cutting plate stored in the non-volatile memory is information indicating that the cutting plate has not been exchanged
- the cutting plate is cut to be transported to the cutting unit. You may make it control a board conveyance part.
- the apparatus further includes a cutting plate transport unit detection sensor for detecting the cutting plate transport unit, the cutting plate transport unit is movable to transport the cutting plate to the cutting unit, and the control unit detects the cutting plate transport unit.
- the sensor detects the moved cutting plate transport unit, information indicating that the cutting plate has been replaced may be stored in the nonvolatile memory as replacement information of the cutting plate.
- a locking portion that locks to at least a part of the holding portion to prohibit the release of the pressing force of the tube by the holding portion, and a holding portion lock that detects a locking state of the holding portion by the locking portion.
- a cutting unit for cutting the tube, the non-volatile memory is capable of storing exchange information of the cutting plate, and the control unit is configured to perform a joining process stored in the non-volatile memory.
- the information is information indicating that a non-joining operation is being performed, and when the holding part lock sensor detects the holding part locked by the locking part, the information indicating non-replacement as the replacement information of the cutting plate is nonvolatile. Write it down in memory.
- the locking portion is self-holding even if power supply is cut off during the joining operation of the tubes. As a result, the holding state of the opening operation of the tube pressing force by the holding section is continued, and the operator is prevented from touching the cutting section, so that safety can be ensured.
- a second aspect of the present invention provides a holding unit that holds at least two flexible tubes and presses them flat, and is held by the holding unit.
- a cutting section for cutting the flat tube an electrode section for supplying electric power for heating to the cutting section, and a cutting section movement for moving the cutting section between a tube cutting position and a tube non-cutting position.
- a unit a holding unit moving unit that relatively changes the position of the cut tube, and moves the holding unit so that the ends to be joined are in close contact with each other, power supply to the electrode unit, and
- the cutting unit moving unit and the holding unit moving unit A control unit for controlling the operation of the tube, and a display unit for displaying information, wherein the control unit has a non-volatile memory for storing joining process information indicating a joining process state of the tube.
- the control unit determines the necessity of the return operation according to the connection processing information stored in the nonvolatile memory.
- the power supply to the electrode unit and the operation of the cutting unit moving unit and the holding unit moving unit can be controlled to allow self-return without damaging the tube joining device, and an error display is displayed on the display unit.
- the control is performed so that the operator can be warned about the tube to be joined.
- the apparatus further comprises a locking portion which is locked to at least a part of the holding portion and prohibits the pressing operation of the tube by the holding portion from opening even when the holding portion is pressed, wherein the control portion is stored in the nonvolatile memory.
- the joining process information indicates that the joining operation is being performed, it is determined that the returning operation is necessary, the returning power is supplied to the electrode unit, and the cutting unit moving unit, the holding unit moving unit, and the locking unit are operated.
- the return operation may be controlled.
- FIG. 1 is an external perspective view of a tube joining apparatus according to an embodiment to which the present invention can be applied.
- FIG. 2 is a perspective view showing a clamp of the tube joining device.
- FIG. 3 is a partially broken plan view of the tube joining apparatus.
- FIG. 4 is an enlarged side view of a wafer holder.
- FIG. 5 is an enlarged plan view of a drive transmission mechanism.
- FIG. 6 is a side view showing a rotating disk and a transmission sensor fixed to a drive shaft.
- FIG. 7 is a right side view showing a state where a second clamp is opened.
- FIG. 8 is a right side view showing a state where a second clamp is closed and a wafer is positioned at a non-cutting position.
- FIG. 9 is a right side view showing a state where a second clamp is closed and a wafer is positioned at a cutting position.
- FIG. 10 is a left side view showing a state where a first clamp is opened.
- FIG. 11 is a left side view showing a state where a first clamp is closed and a wafer is positioned at a non-cutting position.
- FIG. 12 is a left side view showing a state where the first clamp is closed and a wafer is positioned at a cutting position.
- FIG. 13 is a schematic block diagram of a control unit and each unit of a control system.
- FIG. 14 is a flowchart of a tube joining routine executed by a CPU of a control unit.
- FIG. 15 is a flowchart of a power-on subroutine showing details of step 600 of the tube joining routine.
- FIG. 16 is a flowchart of a return processing subroutine showing details of step 610 of the power-on subroutine.
- FIG. 17 is a flowchart of an initial setting process subroutine showing details of step 650 of a power-on subroutine.
- FIG. 18 is a flowchart of a wafer exchange subroutine showing details of step 700 of the tube joining routine.
- FIG. 19 is a flowchart of a tube joining process subroutine showing details of step 800 of the tube joining routine.
- FIG. 20 is an explanatory diagram showing an operation 1 of a main part of the tube joining device, and is a front view schematically showing a state where the lids of the first clamp and the second clamp have begun to close.
- FIG. 21 is a front view schematically showing the operation of the main part of the tube joining apparatus, where FIG. 21 (A) shows operation 2 and FIG. 21 (B) shows operation 3.
- FIG. 22 is a front view schematically showing the operation of the main part of the tube joining apparatus, where FIG. 22 (A) is operation 4, FIG. 22 (B) is operation 5, and FIG. 22 (C) is operation Shows 6.
- FIG. 23 is a side view showing the retracting operation of the tube pushing member
- FIG. FIG. 23 (B) shows a state immediately before the distal end portion of the pushing member presses the tube to the flat state
- FIG. 23 (B) shows a state where the distal end portion of the tube pushing member presses the tube to the flat state
- FIG. 7 shows a state in which a tube that holds a wafer in a flat state is cut.
- FIG. 24 is a side view showing a state where the holding member holding the wafer is lowered and the wafer is retracted from the cutting position.
- FIG. 25 is an enlarged plan view of the vicinity of a cam that regulates the movement of the second clamp.
- FIG. 25 (A) is an initial state
- FIG. 25 (B) is a joining operation completed state
- FIG. 25 (C) is a cutout. Is facing the bearing
- FIG. 25 (D) shows a state in which the second clamp has been moved to the retracted position.
- FIG. 26 is a side view of a cam that regulates movement of the first clamp and a cam that regulates movement of the wafer holder.
- FIG. 26 (A) is an initial state
- FIG. 26 (B) is a cutting operation state
- FIG. 26 (C). ) Indicates the end of cutting or the start of joining.
- FIG. 27 is a perspective view showing the operation of the main part of the tube joining device in the tube joining process.
- the tube joining apparatus 1 of the present embodiment includes a first clamp 6 and a second clamp 7 as holding portions for holding two flexible tubes 8 and 9 substantially in parallel. And a tube pushing member 10 disposed between the first clamp 6 and the second clamp 7 adjacent to the first clamp 6 and pressing the tubes 8 and 9 in a flat shape.
- the tube joining device 1 is housed in a casing so that the protruding member shown in FIG. 1 is hidden (see FIG. 3).
- the first clamp 6 serves as an upper jaw and supports the first upper jaw 50 which presses the tubes 8 and 9 in a flat shape, and the lower jaw which supports the tubes 8 and 9 which are pressed flat by the first upper jaw 50. And a first lower jaw 70.
- the second clamp 7 serves as an upper jaw and a second upper jaw 60 which presses the tubes 8 and 9 in a flat shape, and a lower jaw which serves as a tube 8 which is pressed flat by the second upper jaw 60. , 9 supporting a second lower jaw 80.
- the tubes 8 and 9 are made of a soft thermoplastic resin such as a soft polychlorinated bur, for example, and have flexibility (flexibility). Blood is sealed in the tubes. These tubes 8 and 9 have substantially the same shape in terms of inner diameter, outer diameter and length before blood is sealed.
- the first clamp 6 has a holder 21 that holds the tubes 8 and 9 and a lid 24 that is rotatably attached to the rear end of the holder 21 from a hinge 25 and that can be opened and closed.
- the holder 21 is formed with a pair of grooves 22 and 23 in which two tubes 8 and 9 are respectively loaded and whose cross sections are U-shaped in parallel with each other.
- the width of the grooves 22, 23 is preferably equal to or less than the natural outer diameter of the tubes 8, 9 so that the operator can adjust the width of the tubes 8, 9 to the grooves 22, 9.
- the lid 24 has a function of covering the grooves 22 and 23 when closed, and fixing the tubes 8 and 9 loaded in the grooves 22 and 23 so as not to come off.
- the first clamp 6 has a locking mechanism 26 for keeping the lid 24 closed.
- the locking mechanism 26 includes a plate piece 28 rotatably mounted on the tip of the lid 24 via a hinge 27 with respect to the lid 24, a claw member 29 projecting from the inner surface of the plate piece 28, It consists of a locking roller 20 rotatably arranged at the tip of the holder 21.With the lid 24 closed, the plate piece 28 is rotated in the direction of arrow F in FIG. It is possible to lock with the locking roller 20.
- the plate piece 28 is fixedly provided with a shaft 19 having an end face force protruding toward the second clamp 7.
- the first clamp 6 includes a saw blade-shaped closing member 61 fixed to the side surface of the holder 21 and a saw blade-shaped closing member 62 fixed to the side surface of the lid 24 and mating with the closing member 61.
- the closing member 61 has inclined surfaces 63 and 64 at positions corresponding to the grooves 22 and 23, respectively.
- the closing member 62 is located at a position parallel to the inclined surfaces 63 and 64 and separated by a predetermined distance.
- the inclined surfaces 65 and 66 are formed (see FIG. 24).
- the second clamp 7 is arranged adjacent to the side of the first clamp 6 via the tube pushing member 10.
- the second clamp 7 includes a holder 31 having a pair of grooves 32, 33 formed therein to hold the tubes 8, 9, and a lid 34 that rotates and opens and closes with respect to the holder 31.
- a locking mechanism 36 These structures are similar to those of the first clamp 6.
- the locking mechanism 36 has a hinge 37, a plate 38, and a claw member 39 having a tip 39 A, the holder 31 has a hinge 35, and a locking roller.
- Has 30 An elongated hole 40 into which the shaft 19 can be inserted is formed on the end face of the plate piece 38 on the first clamp 6 side. The elongated hole 40 is used for the shaft associated with the movement of the first clamp 6 in the tube joining operation described later. It has a function to allow 19 movements.
- the second clamp 7 includes a saw blade-shaped closing member 7 1 (not shown) fixed to a side surface of the holder 31 on the holder 21 side, and a pressure clamp fixed to a side surface of the lid 34 on the lid 24 side. It is composed of a closing member 71 and a saw blade-shaped pressure closing member 72 that engages.
- the closing member 71 has inclined surfaces 73 and 74 at positions corresponding to the grooves 32 and 33, respectively (see FIG. 24), and the closing member 72 is parallel to the inclined surfaces 73 and 74, respectively.
- inclined surfaces 75 and 76 are formed at positions separated by a predetermined distance.
- the first clamp 6 and the second clamp 7 are usually arranged such that the grooves 22, 32 and the grooves 23, 33 are aligned (aligned on a straight line).
- the tube pushing member 10 is provided integrally and movably with the first clamp 6. Like the first clamp 6 and the second clamp 7, the tube pushing member 10 has a tip portion 12 (corresponding to the closing members 62 and 72) having a saw-toothed inclined surface 15, 16; The first and second clamps 6 and 7 are different from the first and second clamps 6 and 7 in that they do not have the closing members 61 and 71 that interlock with each other across the first and second clamps 9 and 9.
- the distal end portion 12 of the tube pushing member 10 has a sawtooth-like force corresponding to the pressure closing member 62 of the first clamp 6 and the pressure closing member 72 of the second clamp 7. It is positioned at a position slightly protruding from the closing member 62.
- a support member 11 having an L-shaped cross section is fixed to the tube pushing member 10 by screwing.
- the support member 11 has a support member protrusion 14 protruding downward.
- the holding member 11 is provided with a U-shaped slider (not shown), and the slider is configured to be slidable along a rail (not shown).
- the rail (not shown) is fixed to a rail support member (not shown), and the rail support member is screwed to the lid 24.
- the tube pushing member 10 is integrated with the first clamp 6 and can be moved relative to the first clamp 6. Since the distal end portion 12 of the tube pushing member 10 protrudes from the closing member 62 of the first clamp 6, the tubes 8, 9 are pushed in before the first clamp 6 when the lid 24 is closed. It will be.
- the tube bonding apparatus 1 includes a wafer feeding mechanism 100 (cutting plate transfer unit) for feeding out a wafer as a cutting plate.
- a wafer feeding mechanism 100 cutting plate transfer unit
- a fixing member 94 is provided upright on the casing of the tube joining apparatus 1, and a wafer feed motor 110 having a pulse motor force capable of normal and reverse rotation is screwed to the fixing member 94.
- a gear 112 is fixed to an output shaft 111 of the wafer feed motor 110, and a timing belt 113 is stretched between the output shaft 111 and the gear 114.
- the gear 114 is arranged on the axis of a ball screw 116 on which the wafer feeding member 115 called a shuttle for feeding the wafers 41 capable of cutting the tubes 8 and 9 one by one is arranged.
- a nut (not shown) that engages with the ball screw 116 is provided inside the wafer feeding member 115, and the rotation of the ball screw 116 is caused by the rotation of the gear 114 driven by the wafer feed motor 110. Accordingly, the wafer feeding member 115 moves along the ball screw 116.
- One side of the wafer feeding member 115 is supported by a rod-shaped shaft 117, and stabilizes the attitude (operation) of the wafer feeding member 115 when the wafer is fed.
- the wafer 41 in the wafer cassette 120 is moved along with the movement of the wafer feeding member 115 from the wafer cassette 120 storing a plurality of wafers (70 in this example).
- An extruding piece 118 is provided to feed out one by one.
- a wafer cassette detection sensor 121 for detecting that the wafer force set 120 is mounted is fixed.
- a compression panel (not shown) is disposed inside the wafer cassette 120 so as to urge the wafer 41.
- the wafer 41 is fed by the pushing piece 118 of the wafer feeding member 115, the adjacent wafer is moved. Extruded by successively facing the feeding member 115 side The continuous feeding operation of the wafer 41 by the piece 118 is allowed. Note that the wafer feeding member 115 can move in a direction opposite to the direction in which the wafer 41 is fed by the reverse rotation of the wafer feed motor 110.
- the wafer 41 is a self-heating type heat-cutting plate.
- a metal plate such as a copper plate is folded in two, and a heating element having a desired pattern is formed on the inner surface thereof via an insulating layer.
- the terminals 44, 45 at both ends of the resistor have a structure in which the opening force formed at one end of the metal plate is exposed.
- a rotating disk 130 having a plurality of slits adjacent to the gear 112 and rotating with the rotation of the wafer feed motor 110 is fixedly provided.
- the turntable 130 is for detecting the amount of movement of the wafer feeding member 115.
- a transmission type sensor 131 for detecting the rotation amount of the turntable 130 is screwed to the fixing member 94 so as to straddle the turntable 130 on the opposite side of the gear 114.
- a transmission type sensor 132 as a cutting plate transport unit detection sensor for detecting the wafer feeding member 115 positioned at the feeding start position of the wafer 41
- a transmission type sensor 133 serving as a cut-plate transfer unit detection sensor for detecting a wafer feeding member 115 positioned at the feeding end position of the wafer 41
- a substantially L-shaped test piece 119 is attached to the opposite side of the push piece 118. The detection of the amount of movement of the wafer feeding member 115 by the turntable 130 and the transmission sensor 131 is performed between the positions of the transmission sensors 132 and 133.
- the wafer 41 fed by the wafer feeding member 115 is located on the downstream side of the wafer transfer path from the wafer cassette 120 and is positioned in the wafer holder 140 holding the wafer 41.
- a configuration is adopted in which the two wafers 41 are held in a wafer holder 140 such that the end faces of the wafers 41 are in contact with each other.
- the wafer 41 is supplied by being pushed on the transfer path 105 in the wafer holder 140 by the newly fed wafer 41b. In other words, the wafer 41b pushes the wafer 41a forward, and the wafer 41a is positioned in the wafer holder 140 at a position where the tubes 8 and 9 are cut.
- the terminals 44 and 45 of the wafer 41a positioned on the front side of the wafer holder 140 are heated by a protruding electrode portions 145 and 146 from a power supply unit (not shown) to the wafers and 41a via a not-shown nose. Power is supplied.
- the electrode portions 145 and 146 are integrally attached to the wafer holder 140, and are disposed so as to face the wall end on one side of the wafer holder 140 (the back side in FIG. 4) via the wafer 41. .
- the electrode portions 145 and 146 integrally attached to the wafer holder 140 can also supply power to the wafer 41 for heating. It has a functional structure.
- the resistor inside the wafer 41 generates heat by the power supply by the electrode portions 145 and 146, and the wafer 41 heats the tubes 8 and 9 to a temperature at which the tubes 8 and 9 can be melted and cut (for example, about 260 to 320 ° C.). Is done.
- the wafer feeding mechanism 100 which is preferably a disposable type (sindal use) for each one time of joining (connection) of the tube, is provided with the wafer 41 loaded in the wafer holder 140 and the tube 8. , 9 can be replaced each time it is joined.
- the wafer holder 140 is heated by a heater 144 attached to a rotation support plate 184 described later (see FIG. 3). Although power is supplied to the heater 144 from a power supply unit (not shown), the wafer holder 140 is always kept in a heated state while the tube bonding apparatus 1 is powered on.
- a wafer temperature sensor 508 (see FIG. 13) such as a thermistor for detecting the temperature of the wafer holder 140 is fixed to the wafer holder 140, and the wafer holder 140 maintains a predetermined temperature (in this example, 70 ° C.). Is controlled as follows.
- the material (copper) characteristic force of the wafer 41 is also reduced when the wafer holder 140 is inserted into the wafer holder 140. The temperature is reached immediately after insertion due to the effect of the retained temperature.
- the control unit 190 determines the temperature of the wafer 41 itself, which is energized by the electrode units 145 and 146, at a predetermined temperature after a predetermined time from the time when the wafer 41 is inserted into the wafer holder 140 (for example, — Predicts that the temperature has reached about 320 ° C.) and shifts to the tube cutting operation by wafer 41 (wafer holder 140 ascending operation).
- the tube bonding apparatus 1 functions as a holding unit moving unit that moves the first clamp 6 and the second clamp 7, and moves the wafer holder 140 (up and down). And a drive transmission mechanism 200 functioning as a cutting unit moving unit.
- a motor fixing member (not shown) fixed to the casing of the tube joining device 1 can rotate forward and reverse as a drive source of the drive transmission mechanism 200.
- the cam motor 150 that also generates pulse motor power is screwed.
- a gear 152 is fixed to the output shaft 151 of the cam motor 150, and a gear 153 is engaged with the gear 152.
- a gear 154 is fixed coaxially with the gear 153, and the gear 155 meshes with the gear 154.
- a drive shaft 156 that rotates together with the gear 155 by the driving force transmitted to the gear 155 is provided.
- a cam 157 for regulating the movement of the first clamp 6, a cam 158 for regulating the movement of the second clamp, and a cam 159 for regulating the movement of the wafer holder 140 are fixedly provided on the axis of the drive shaft 156. . Accordingly, the driving force from the cam motor 150 is transmitted to the driving shaft 156, and the cams 157, 158, 159 are respectively driven to rotate.
- a groove 161 is formed inside the cam 157, and a bearing 162 that engages with an edge of the groove 161 supports the first clamp 6 via the mounting member 163 in a fixed state. (See also Figure 1). Therefore, the rotation of the cam 157 causes the bearing 162 to slide along the edge surface of the groove 161 inside the cam 157, and the first clamp 6 can move in a predetermined direction (the direction of arrow A in FIG. 3). Become. Note that a linear guide 165 that guides the support base 164 (the first clamp 6) so as to move stably is disposed below the support base 164 in a contact state with the bottom of the support base 164. Further, a compression panel 166 is hung on one end of the support base 164 so as to urge the support base 164 in a predetermined direction.
- a bearing 172 that engages with this surface is connected via a mounting member 173 to a support base 174 that supports the second clamp 7 in a fixed state. Therefore, the rotation of the force 158 causes the bearing 172 to slide along the surface of the cam 158, and the second clamp 7 can move in a predetermined direction (the direction of arrow B in FIG. 3).
- the bearing 172 is configured to engage with the side surface of the cam 158 and also to engage with the surface of a flange 177 formed integrally with the cam 159 that regulates the movement of the wafer holder 140. ing.
- the bearing 172 is located between the side surface of the cam 158 and the flange 177, and has a configuration capable of engaging with both members, and thus, slidable. This is included in a part of the function of the cam 158 that regulates the movement of the ramp. As described later, a notch 178 (see FIGS. 25C and 25D) is formed in a part of the cam 158.
- a linear guide 175, which is designed to move the support 174 (second clamp 7) stably, is disposed in contact with the bottom of the support 174.
- a compression panel 176 is hung on one end of the support 174 so as to urge the support 174 in a predetermined direction.
- a bearing 182 (see also FIG. 4) is mounted on the bottom of the wafer holder 140 via a mounting member 183.
- the bearing 182 follows the surface shape of the cam 159 as the cam 159 rotates.
- the wafer holder 140 is configured to be movable in a predetermined direction (up and down direction) by sliding. That is, the wafer holder 140 is rotated integrally with the shaft 187 around the shaft 187 penetrating the hole 186 formed in the projection 185 of the rotation support plate 184 attached to the wafer holder 140. It is configured to be able to swing up and down.
- the upper side of the wafer holder 140 has a metal roller 147 at its tip and a slanted projection 148 is formed on the body (see FIG.
- a rotating disk 197 having a notch 198 formed between the cam 157 and the gear 155 is fixed to the drive shaft 156 (see also FIG. 6).
- Transmission sensors 195 and 196 as position detection sensors are provided near the turntable 197 so as to straddle the turntable 197. Utilizing the notch 198 formed in the turntable 197, the positions of the first clamp 6 and the second clamp 7 are detected by the transmission sensors 195 and 196. That is, when the light from the force transmitting sensor 195 is transmitted through the notch 198 (see FIG. 6 (A)), the first clamping is performed when the rotating disk 197 rotates in a predetermined direction as the drive shaft 156 rotates. 6 and the initial position of the second clamp 7.
- the transmission sensor 195 is used as an initial position detection sensor for the first clamp 6 and the second clamp 7.
- the transmission type sensor 196 is used as a sensor for detecting that the joining operation of the tubes 8 and 9 has been completed.
- the notch 198 is positioned at a position facing the transmission sensor 196 (see FIG. 6B).
- the used wafer 41 is guided downstream of the wafer holder 140.
- a guide 141 (constituting a transfer path) and a disposal box 142 for accommodating the used wafer 41 are provided.
- the wafer 41 positioned at the tube cutting operable position is discarded (accommodated) in the disposal box 142 after the cutting and joining operations of the tubes 8 and 9, and the discarding operation is also performed as described above.
- the pushing is performed, and the used wafer 41 is guided along the guide 141 and is dropped and stored in the disposal box 142.
- a light-receiving element and a light-emitting element are spaced apart from the waste box 142, and a transmission-type wafer full sensor 143 for detecting the full state of the used and stored wafer 41 is provided at the bottom of the waste box 142. From a predetermined height.
- the shaft 19 of the first clamp 6 is inserted into the elongated hole 40 of the second clamp 7, and the first clamp 6 and the second clamp 7 are connected to move integrally. Therefore, the lock function of the clamp lock solenoid 400 acts not only on the second clamp 7 but also on the first clamp 6.
- the clamp lock solenoid 400 As the clamp lock solenoid 400, a general self-holding type solenoid is used. That is, the clamp lock solenoid 400 includes an electromagnet 402 having a coil (not shown) and a permanent magnet 403 in a fixed frame 401, and the claw member 39 is engaged in a locked state inside them. 8 and 9 and the locking state of the claw member 39 so that the force is released to allow the lid 34 to open. A plunger 404 that can move in a direction to return to the side (downwardly retracted state shown in FIG. 7) is inserted. An enlarged diameter portion 405, which is slightly larger in diameter, is formed on the distal end side of the plunger 404 (the upper side shown in FIGS. 7 to 9).
- the permanent magnet 403 holds the plunger 404 even when the energization of a coil (not shown) is stopped (the solenoid is demagnetized).
- the enlarged diameter portion 405 is continuously positioned at the protruding position.
- another coil (not shown) is mounted on the electromagnet 402 other than the above-not shown coil, and by energizing the other coil (exciting the solenoid), the plunger is energized. 404 moves in a direction to return to the frame 401. Immediately after the movement, the energization of another coil is stopped (the same applies to the movement in the protruding direction from the frame 401), but covers the other end of the plunger 404 (the lower side shown in FIGS. 7 to 9). By the urging force of the compression panel 407 wound on the cover 406, the enlarged diameter portion 405 of the plunger 404 maintains the retracted state close to the frame 401.
- a lever member 408 is fixed to the cover 406, and moves integrally with the plunger 404.
- the end portion 409 of the lever member 408 has a function as a light-shielding plate that shields the optical path of the fixed transmission-type clamp lock detection sensor 410 (holding portion lock sensor). That is, as shown in FIG. 7, when the enlarged diameter portion 405 of the plunger 404 is retracted close to the frame 401 so as to allow the pawl member 39 to be released from the locked state and opened, the clamp is locked. Since the optical path of the detection sensor 410 is blocked by the end portion 409 of the lever member 408, the clamp lock is released (the claw member 39 can be released from the locked state from the locking roller 30). Is detected. On the other hand, as shown in FIGS.
- the clamp lock detection sensor 410 uses the lever member 408. Since the sensor light is transmitted without blocking the optical path at the end 409 of the sensor, it is detected that the locked state (the state in which the claw member 39 is locked in the locked state with the locking roller 30 and the opening is prohibited). . Further, on the lower side of the second lower jaw 80 and beside the clamp lock solenoid 400, the open / close state of the second clamp 7 (and the first clamp 6), that is, the second clamp 7 is locked.
- a clamp open / close detecting unit 300 is provided for detecting a force in a state or a force in an open state, which also deviates from a lock state force.
- the distal end portion 39A of the claw member 39 and the one end side 302 of the lever member 301 of the force clamp open / close detection unit 300 Push in (as shown in Figures 8 and 9).
- the reno member 301 is provided with a torsion coil panel 304 at the center of rotation 303 thereof.
- a torsion coil panel 304 By the action of the panel 304, one end 302 of the lever member 301 pushes the tip 39 A of the claw member 39. It is biased to move in the opposite direction.
- the other end 305 of the lever member 301 has a function as a light-shielding plate that shields the optical path of the fixed transmission-type clamp opening / closing sensor 306.
- the other end 305 of the lever member 301 blocks the optical path of the clamp opening / closing sensor 306, so that the clamp opening / closing sensor 306 is in a state where the clamp is released (the claw member 39 is engaged with the locking roller 30).
- a wafer position as a transmission-type cut portion detection sensor for detecting the wafer 41 is provided below the first clamp 6 on the left side of the tube joining apparatus 1.
- a position detection sensor 421 is disposed, and a light shielding plate 420 provided integrally with the wafer holder 140 is disposed on the side of the first clamp 6 of the wafer holder 140 (below the first clamp 6). .
- the light shielding plate 420 moves the optical path of the wafer position detection sensor 421. By blocking the light, the wafer position detection sensor 421 detects that the wafer 41 (wafer holder 140) is at the cutting position (the state shown in FIG. 12).
- the wafer 41 is moved to the initial position where the tubes 8 and 9 cannot be cut ( Non-cutting position) This is positioned.
- the light blocking plate 420 Since the sensor light is transmitted without blocking the optical path of the wafer position detection sensor 421, the wafer position detection sensor 421 cannot detect the wafer 41 (wafer holder 140), and the control unit 190 described later controls the wafer 41.
- the tube joining apparatus 1 includes a control section 190 for controlling the operation of the entire apparatus, an LCD display section 192 as a display section for displaying the state of the apparatus to an operator, and an actuator and control section such as a pulse motor for the commercial AC power supply. Equipped with a constant voltage power supply that converts the 190 into a operable DC power supply.
- the control unit 190 includes a CPU 191 (see also FIG. 3) that operates as a central processing unit with a high-speed clock, a ROM in which a control program and control data of the tube joining device 1 are stored, It consists of a RAM that works as a work area for the CPU 191 and an internal bus that connects them.
- the control unit 190 is connected to an external bus.
- the external bus has an information storage unit for storing the joining processing state of the tubes, a clamp unit that detects the open / closed state and lock state of the first and second clamps 6 and 7, and locks these clamps.
- a switch input section including a joining switch 193 (see also FIG. 3) for instructing the tube joining apparatus 1 to perform cutting and joining operations, a holder temperature control section for maintaining the wafer holder 140 at a constant temperature, not shown!
- Wafer cassette Z discard control unit that has a fan motor control unit that controls the smoke exhaust fan motor and cooling fan motor, a sensor that detects the presence or absence of the wear 41 in the wafer cassette 120, and the full state of the used wear in the waste box 142
- Operating environment monitoring unit that monitors the environmental temperature (room temperature) where the tube joining device 1 is placed, and a way that controls the current flowing between the electrode units 145 and 146.
- a cam connection having a wear constant power control unit including a current control unit, a wafer feed control unit for controlling the feed operation of the wafer 41, and a motor driver for rotating a cam motor for rotating the wafer position detection sensor 421 and the drive shaft 156.
- the message output unit includes an LCD display unit 192, a backlight of the LCD display unit 192, an LCD driver 507 for controlling an input operation unit (not shown), and a red warning LED 503 for notifying the maintenance time of the tube joining apparatus 1. And a buzzer control unit 504 for operating a buzzer 505 so as to emit a warning sound when a maintenance date has passed.
- the information storage unit has an EEPROM 500 as a nonvolatile memory and a real-time clock 501 operated by a 3V power supply.
- the EEPROM 500 stores information on the bonding process status of the tubes 8 and 9 (information indicating that bonding operation is being performed or information indicating that non-bonding operation is being performed), exchange information of the wafer 41 (information indicating that the wafer 41 has been replaced or information indicating that the wafer 41 has not been replaced).
- the accumulated number of joining operations (the cumulative number of joining operations performed by the tube joining apparatus 1) and the like are stored.
- the clamp unit includes the above-described clamp open / close sensor 306 and clamp lock detection sensor 410, and a clamp lock solenoid control unit 506 that controls the driving of the clamp lock solenoid 400. Further, in addition to the above-described joining switch 193, the switch input section is used to reset the operation of the tube joining apparatus 1 when the power supply is cut off during the joining operation of the tubes 8 and 9 and then the power is turned on again. And a switch switch 0-7 for setting a switch to a test mode or the like for adjusting at the time of assembling the tube joining device 1!
- the operation of the tube joining device 1 of the present embodiment will be described mainly with respect to the CPU 191 of the control unit 190.
- the CPU 191 reads out the control program and control data from the ROM, expands the data in the RAM, and cuts and joins the tubes 8 and 9 as shown in FIG. Perform the tube splicing routine.
- a power-on processing subroutine is executed in step 600.
- the information on the joining process state (either information indicating that the tube joining operation or the non-joining operation is being performed) stored in the EEPROM 500 is read, and whether or not the information regarding the joining process state is the information indicating that the joining operation is being performed. If the determination is affirmative, it is determined whether or not the clamp lock detection sensor 410 has detected the locked state in the next step 604, and if the determination in step 604 is affirmative, the wafer is determined in step 606. It is determined whether or not the position detection sensor 421 detects the force of detecting the wafer 41 at the cutting position.
- the CPU 191 supplies power to the tube joining apparatus 1 during the previous (before power-on) joining operation of the tubes 8 and 9 according to the determination result in step 602—step 606. It accurately determines whether or not the interrupted force is present.
- the CPU 191 stores the latest processing state of the tube joining operation in the EEPROM 500 as described later (see FIG. 19, steps 814 and 826). In step 602, if the information on the latest joining process status read from the EEPROM 500 is during the tube joining operation, the power supply is cut off during the previous tube joining operation and the joining process is completed.
- the clamp lock detection sensor 410 is in the locked state. Is detected, the enlarged portion 405 of the clamp lock solenoid 400 of the self-holding solenoid inhibits the opening operation of the claw member 39 as described above, and power is supplied during the previous tube joining operation. (If the joining process is completed, the clamp lock detection sensor 410 should not detect the locked state.) O Further, at step 606, c.
- the position detection sensor 421 detects the wafer 41 at the cutting position when the wafer 41 has moved to the position where the tubes 8 and 9 can be cut as described above.
- Step 606 is to make an accurate determination from a plurality of determinations as to whether the power supply was interrupted during the previous tube joining operation.
- step 610 If an affirmative determination is made in step 606, since the power supply has been cut off during the previous tube joining operation, in step 610, the tube joining by the tube joining apparatus 1 is performed. Execute the return processing subroutine to return to the normal state so that the wire joining operation can be performed.
- step 612 the process waits until the operator presses the reset switch 194 (turns on).
- the wear current control unit is caused to supply power to the wafer 41 via the electrode units 145 and 146 to start heating the wafer 41, and in step 616, the predetermined heating is performed.
- the EEPROM 500 stores information (for example, “1”) indicating that the tube joining operation is being performed as information relating to the joining process state.
- step 620 the cam motor 150 is driven.
- step 622 it is determined whether the transmission type sensor 196 has detected the notch 198. If the determination is negative, the driving of the cam motor 150 is continued. If it is determined, the driving of the cam motor 150 is stopped in step 624.
- step 626 the information on the joining processing state is updated and stored in the EEPROM 500 as information indicating the tube non-joining operation (eg, “0”) during the tube non-joining operation, and then at step 628
- the heating of the wafer 41 is stopped by stopping the power supply to the wafer 41 by the wear current control unit.
- step 630 the process waits until a predetermined time (cooling time) until the wafer 41 cools, and when the cooling time has elapsed, the locked state of the clamp lock solenoid 400 is released in step 632 (the plunger 404 is turned off). the retracted state.) as the 0 above, in step 614-612 described above, a force for melting the tubes 8, 9 fixed to the wafer 41 by Saika ⁇ the wafer 41 to complete the joining of the tubes 8, 9 Since the joining strength and aseptic joining of the tubes 8 and 9 cannot be guaranteed, in the next step 634, an error is displayed on the LCD display unit 192 via the LCD driver 507, and the buzzer control unit 504 is activated to sound the buzzer 505. This alerts the operator.
- step 636 various other initial settings are made, the return processing subroutine and the power-on processing subroutine are completed, and the flow advances to step 700 in FIG.
- step 650 an initialization processing subroutine for performing initialization in normal time is executed.
- the preset number of times of joining requiring maintenance is read from the EEPROM 500, and at step 654, the accumulated number of joining times previously stored in the EEPROM 500 (see step 834).
- the number of times of joining requiring maintenance and the cumulative number of times of joining are compared to determine whether or not the cumulative number of times of joining s exceeds the number of times of joining until maintenance. If the determination is negative, the process proceeds to step 668. If the determination is affirmative, the remaining number of bonding operations up to the maintenance is displayed on the LCD display unit 192 in the next step 658.
- step 660 the maintenance date stored in the EEPROM 500 is read in advance.
- step 662 the current date is read from the real-time clock 501.
- step 664 the date of the maintenance that has passed the current date maintenance date is determined. Judge. When the determination is affirmative, the process proceeds to step 668. When the determination is negative, the maintenance date is displayed on the LCD display unit 192 in the next step 666, and the process proceeds to step 670.
- step 668 a warning that maintenance is required is displayed on the LCD display section 192 because the cumulative number of times of joining S exceeds the number of times of joining requiring maintenance or the maintenance date has passed, and The control unit 502 is controlled so as to light or flash the red warning LED 503.
- step 670 other messages such as a reference time until the operation of the tube joining device 1 can be started are displayed, and in the next step 672, the clamp lock detection sensor 410 detects the locked state of the clamp lock solenoid 400 and It is determined whether or not there is. If the determination is negative, the process proceeds to step 676. If the determination is affirmative, the locked state of the clamp lock solenoid 400 is released in step 674. In step 676, various other initial settings are performed, the initial setting processing subroutine and the power-on processing subroutine are completed, and the flow advances to step 700 in FIG.
- a wafer exchange processing subroutine for exchanging wafer 41 is executed. As shown in FIG. 18, in the wafer exchange processing subroutine, it is determined whether or not the wafer cassette detection sensor 121 detects the force of detecting the wafer cassette 120. If a negative determination is made, the process waits until the wafer cassette 120 is mounted. If the determination is affirmative, in the next step 704, the transmission of the wafer full sensor 143 on the light receiving side is blocked (the It is determined whether or not the discarded (accommodated) wafer 41 is full. If the determination is affirmative, the process returns to step 702. If the determination is negative, the reset switch 194 is determined in the next step 706. Wait until is pressed.
- step 702-706 which is not shown in FIG. 18, the wafer cassette 120 is not mounted, the waste box 142 is full, and the reset switch 194 is pressed. What should be done is displayed on the LCD display unit 192, and the operation waits.
- step 706 When it is determined in step 706 that the reset switch 194 has been pressed, in the next step 708, the force at which the transmission sensor 195 detects the notch 198, that is, the force at which the cam 157 or the like is at the initial position. If the judgment is affirmative, the process proceeds to step 716; if the judgment is negative, the cam motor 150 is started to rotate at step 710, and the cam motor 150 is rotated until the transparent sensor 195 detects the notch 198 at step 712. When the notch 198 is detected, the rotation of the cam motor 150 is stopped in step 714.
- step 716 the exchange information of the wafer 41 in the EEPROM 500 is read, and it is determined whether or not the exchange information of the wafer 41 is information indicating that the exchange has been completed (for example, “1”).
- the exchange processing subroutine is completed, and the process proceeds to step 800 in FIG. 14. If a negative judgment is made, the wafer feed motor 110 is driven in step 718 to exchange the wafer 41.
- the wafer feeding member 115 moved by the rotational drive of the wafer feed motor 110 includes the wafer feeding start position and the wafer feeding position. It reciprocates between the end position and the forward / reverse drive of the wafer feed motor 110.
- the CPU 191 directly couples the rotation of the wafer feed motor 110 between the wafer feeding start position of the wafer feeding member 115 and the wafer feeding end position when the wafer feed motor 110 is driven to rotate forward.
- the rotation amount force of the turntable 130 is also detected for each pulse by the transmission sensor 131.
- the CPU 191 detects the test piece 119 of the wafer feeding member 115 positioned at the wafer feeding start position by the transmission sensor 132 and uses the transmission sensor 132 as a base point to determine the amount of movement of the wafer feeding member 115 by the rotation amount of the turntable 130. By detecting the force with the transmission sensor 131, the position of the wafer feeding member 115 is grasped. In the CPU 191, the wafer feeding member 115 has moved by a predetermined amount (30 mm in this example, see the wafer feeding member 15 shown by a two-dot chain line in FIG. 25) in the direction of the wafer feeding end position of the wafer feeding start position. It is determined whether or not the force is exerted. If the determination is negative, the position of the wafer feeding member 115 is grasped. In this example, the moving amount of the wafer feeding member 115 for feeding the wafer 41 is set to about 55 mm.
- a force / no-force in which a difference of a predetermined number of pulses (for example, 20 pulses) or more occurs between the preset number of pulses and the actually detected number of pulses, that is, the predetermined number of pulses It is determined whether the number of pulses actually detected is smaller than the number of pulses by 20 or more. If the determination is affirmative, it is determined that the wafer 41 is not properly fed, and the process waits until the reset switch 194 is pressed. When the determination is negative, it is determined that the feeding is normal.
- a predetermined number of pulses for example, 20 pulses
- the drive of the wafer feed motor 110 is stopped, a display is displayed on the LCD display unit 192 to prompt the wafer to be removed and the wafer is removed, and the cam motor 150 is connected to a series of tubes.
- the notch 178 formed in the cam 158 faces the bearing 172 (FIG. 25 ( C)).
- the bearing 172 can enter the notch 178, that is, the second clamp 7 is moved rightward as indicated by the arrow B in FIG. 3 (moving in the direction opposite to the moving direction of the second clamp 7 when joining the tube).
- the operator By moving the second clamp 7 to the retracted position, the operator accesses the space created between the second clamp 7 and the first clamp 6, and causes a wafer feeding failure due to double feeding of the wafer 41 or the like. Can be removed (see Fig. 25 (D)).
- the reset switch 194 When the reset switch 194 is depressed after the error release operation is completed, the CPU 191 captures the signal, drives the motors 110 and 150, and returns various mechanisms to the initial state.
- step 720 the exchange information of the wafer 41 in the EEPROM 500 is updated from the information indicating the exchange to the information indicating the non-exchange (for example, "0"), and the wafer exchange subroutine is terminated.
- step 800 a tube joining process subroutine for cutting and joining tubes 8 and 9 is executed.
- the clamp open / close sensor 306 closes the second clamp 7 (and the first clamp 6 connected by the elongated hole 40 and the shaft 19).
- the force is detected to be in the state of being locked. That is, it is determined whether or not the force is attained by the pawl member 39 being engaged with the engaging roller 30. , 23 are loaded with tubes 8, 9 and a message prompting the user to close the first clamp 6 and the second clamp 7 is displayed (not shown in FIG. 19), and the standby state is continued.
- the operator loads the tubes 8 and 9 into the grooves 22 and 23 and closes the lid 24 of the first clamp 6 and the lid 34 of the second clamp 7 (see FIG. 20).
- the lid 24 of the first clamp 6 or the lid 34 of the second clamp 7 is closed, since the shaft 19 is inserted into the elongated hole 40, the lid 24 of the first clamp 6 or the second clamp The lid 34 of 7 is also closed almost simultaneously at the same time.
- the distal end portion 12 of the tube pushing member 10 first contacts the tubes 8 and 9 and is parallel at the first contact position P1 (
- the tubes 8 and 9 placed in the (parallel) state are deformed to a flat state (see FIG. 21 (A)).
- the blood inside the portion pushed by the tube pushing member 10 of the tubes 8 and 9 is pushed out so as to be removed in the directions of arrows c to d in FIG. 21 (A). It is.
- the clamp 6 presses and holds the tubes 8 and 9 in a flat state with a predetermined pressing force at a second position P2 adjacent to the first position P1.
- the tube pushing member 10 arranged in contact with the first clamp 6 is in a state where the tubes 8 and 9 are almost crushed similarly to the first clamp 6 (almost no blood is present inside the tube). And press! (See FIG. 21 (B)).
- FIG. 23 (A) shows that the lid 24 of the first clamp 6 is closed with respect to the tubes 8 and 9 loaded in the grooves 22 and 23, and the distal end portion 12 of the tube pushing member 10 is 9 shows a state immediately before pressing 9 into a flat state.
- FIG. 23 (B) when the closing operation of the lid 24 is continued by the operator, the distal end portion 12 of the tube pushing member 10 is Press 8 and 9 flat. At this time, the pressing operations of the tubes 8 and 9 by the first clamp 6 and the second clamp 7 are interlocked and continuously performed.
- the operation of closing the cover 34 of the second clamp 7 is performed almost simultaneously with the operation of closing the cover 24 of the first clamp 6.
- the distal end portion 39A of the claw member 39 is locked by the locking roller 30 by the locking mechanism 36 of the second clamp 7, it is disposed in contact with the tube pushing member 10 like the first clamp 6.
- the second clamp 7 force A predetermined pressing force is applied to the tubes 8 and 9 at a third position P3 adjacent to the first position P1 and opposed to the second position P2 across the first position P1. Press and hold the tubes 8 and 9 in a flat state with the tubes 8 and 9 almost crushed (most of the tubes have no blood inside!).
- the first clamp 6 presses the inside of the tubes 8 and 9 from the second position P2 to the third position P3 across the first position P1, in other words, the tube pressing member 10. Partial force The blood in the tubes 8 and 9 corresponding to the part pressed by the second clamp 7 is almost eliminated (see FIG. 21 (B)).
- step 804 If an affirmative determination is made in step 802, it is determined in next step 804 whether or not the joining switch 193 has been turned on. If a negative determination is made, the joining switch 193 is displayed on the LCD display unit 192. A display urging the user to press the switch 193 is displayed (not shown in FIG. 19), and the standby state is continued. If an affirmative determination is made in step 804, the clamp lock solenoid control unit 506 excites the clamp lock solenoid 400 in step 804. As a result, the plunger 404 protrudes upward, the enlarged diameter portion 405 is locked so as to prohibit the opening operation of the claw member 39, and the second clamp 7 enters a locked state in which the opening operation is prohibited.
- FIGS. 8 and 11 show the state of the second clamp 7 and the first clamp 6 in this state, respectively.
- FIGS. 25 (A) and 26 (A) show the cam 158 and the cams 157 and 159, respectively. Shows the state of
- step 808 the information relating to the exchange information of the EEPROM 500 wafer 41 is updated from the information representing the exchange to the information representing the non-exchange.
- the heating of the wafer 41 is started by supplying power to the wafer 41 via the electrode units 145 and 146, and in step 812, the process waits until a predetermined heating time has elapsed, and the predetermined time has elapsed. Then in step 814, the information on the bonding processing state of the EEPROM 500 is updated to information indicating that the non-bonding operation is being performed.
- step 816 the cam motor 150 is driven, and in step 818, the process waits until the wafer detection sensor 421 detects the wafer 41 (wafer holder 140).
- the wafer 41 is detected in the next step 820.
- step 822 it is determined in step 822 whether the transmission type sensor 196 has detected the notch 198, and in the case of a negative determination, the driving of the cam motor 150 is performed. If the determination is affirmative, the driving of the cam motor 150 is stopped in the next step 824.
- the tubes 8 and 9 are cut and joined by the tube joining apparatus 1, and the details are as follows.
- the cam motor 150 By driving the cam motor 150, the cam 158 and the force at which the cams 157, 159 start rotating in a predetermined direction
- the cam 158 maintains the state shown in FIG. 25A for a predetermined time.
- the wafer holder 140 swings due to the rotation of the cam 159 and rises a predetermined distance between the first clamp 6 and the second clamp 7 (see FIG. 26 (B)).
- This raising operation also raises the roller 147, and the supporting member projecting portion 14 that contacts the roller 147 also moves up.
- a part of the pushing member 10 is pushed up, and the wafer 41 advances between the first position P1 and the second position P2 (between the first clamp 6 and the second clamp 7), and the wafer holder 140 The heated wafer 41 is blown off the two tubes 8 and 9.
- the tube pushing member 10 is positioned at the retracted position with respect to the wafer 41 (see also FIG. 23 (C)).
- FIG. 9 and 12 show a state in which the wafer holder 140 is lifted (oscillated) to cut the tubes 8 and 9 in which the wafer 41 is set at a predetermined position.
- the cam 157 also rotates the state force shown in FIG. 26 (A) (see FIG. 26 (B)), but the first clamp 6 (the support base 164) uses the second clamp 7 (FIG. 25A).
- the support 174) is also immobile.
- the CPU 191 continues to drive the cam motor 150.
- the wafer holder 140 maintains the state shown in FIG. 26 (B), while the first clamp 6 (support base 164) rotates by rotating the cam 157.
- Arrow (a) in the figure on the left side of (C) (the upward direction of arrow A in FIG. Move a predetermined distance (8 mm) in the direction of arrow X).
- the relative positions of the cut tubes change, and the joined ends face each other.
- the wafer 41 from which the tubes 8 and 9 have been cut is held at the cutting position and is immobile.
- the shaft 19 of the first clamp 6 moves in the elongated hole 40 while being inserted into the elongated hole 40 of the second clamp 7.
- the CPU 191 has the notch 198 positioned at the position facing the transmission sensor 196, and the expected state (the first clamp 6 and the second clamp 7 are shifted). After confirming the state (the state positioned in the state), the driving of the cam motor 150 is stopped (steps 822 and 824).
- next step 826 since the joining operation of the tubes 8 and 9 has been completed, the information on the joining processing state of the EEPROM 500 is updated from the information indicating the joining operation to the latest information indicating the non-joining operation,
- the heating of the wafer 41 is stopped by causing the wear current control unit to stop supplying power to the wafer 41, and in the next step 830, the process waits until the cooling time of the wafer 41 elapses.
- the clamp lock solenoid control unit 506 demagnetizes the clamp lock solenoid 400 to release the locked state.
- step 834 the cumulative bonding operation count stored in the EEPROM 500 is read out and incremented by one.
- the joining processing subroutine ends, and the process returns to step 700 in FIG. This completes one tube connection routine.
- the operator lifts the plate piece 28 located on the tip side of the lid 24 in order to take out the tube having undergone the bonding process from the main body of the apparatus, and releases the claw member 39 by the locking mechanism 36 (or 26).
- the lid is closed as shown in FIGS. 2, 7, and 10.
- Body 34 (or 24) is open.
- the lid 24 and the lid 34 are inserted into the slot 40 with the force shaft 19 in a state where the relative positions are changed, when the lid 34 (or 24) is lifted, the lid 24 (or 24) is lifted. Or 34) can also be lifted at about the same time.
- the locked state of the tube pushing member 10 is also released.
- a tube pushing member 10 whose tip portion 12 slightly protrudes from the press-closing member 62 of the first clamp 6 is disposed between the first clamp 6 and the second clamp 7.
- the tubes 8 and 9 Prior to the pressing by the first clamp 6 and the second clamp 7, the tubes 8 and 9 are pressed to push out and remove the residual blood in the tubes at the pressed portions.
- the tubes can be joined together without being affected by the blood enclosed in the tubes.
- the tube joining device 1 simply loads the tubes 8, 9 in which blood is sealed into the grooves 22, 23, 32, 33, closes the lids 24, 34 and locks them with the locking mechanisms 26, 36, Aseptic wet-to-wet joining of tubes can be performed automatically, easily, uniformly and quickly.
- Such a tube joining device is required to be realized socially, especially in the medical field, and its industrial value is considered to be extremely high.
- the tube joining apparatus 1 of the present embodiment updates the information on the latest joining processing state of the tubes 8 and 9 and stores the updated information in the joining EEPROM 500 (steps 618, 626, 814, and 826).
- the power is turned on in the power-on processing subroutine, information on the previous bonding processing state stored in the EEPROM 500, the detection result of the clamp lock detection sensor 410, the detection result of the wafer 41 of the wafer position detection sensor 421, and a plurality of From the information, it is determined whether the power supply was interrupted during the previous (before power-on) tube joining operation (Step 602—Step 606), and it is determined that the power supply was interrupted during the tube joining operation Then, a return process is executed (step 610).
- the tube joining device 1 determines the cutoff of power supply from multiple pieces of information! /, So it satisfies the accuracy requirements required in the medical field and automatically executes self-return, Urgent demands in the field can be met. That is, in the tube bonding apparatus 1 of the present embodiment, the information on the bonding processing state read from the EEPROM 500 is information indicating that the non-bonding operation is being performed (bonding is completed), or the wafer position detection sensor 421 has the wafer 41 If is not detected (when a negative determination is made in steps 602 and 606), the locked state is released even if the locked state is maintained by the self-holding function of the clamp lock solenoid 400 (step 674). This allows the operator to remove tubes 8 and 9.
- the wafer / position detecting sensor 421 detects the wafer 41 (when the affirmative determination is made in steps 602 and 606), the wafer 41 is reheated to melt the tubes 8 and 9 fixed to the wafer 41, and the operation is resumed to complete the bonding operation (steps 612-632).
- the operator displays a force joining error that allows the tubes 8 and 9 to be removed (step 632), and alerts the operator to secure the joining strength or aseptic joining.
- the device does not need to be returned to the factory or the like to return to the initial state, and the operator can forcibly remove the tube during the joining operation. It is possible to prevent the device from being damaged when trying to remove it.
- the clamp lock solenoid 400 is a self-holding type, even if the power supply is cut off during the tube joining operation, the extension of the clamp lock solenoid 400 is performed.
- the diameter portion 405 is engaged with the claw member 39 and is not released from the locked state.
- the lock state by the clamp lock solenoid 400 is released after the cooling time of the wafer 41 has elapsed (steps 630 and 830). Therefore, since the operator cannot open the lids 24 and 34 until the heat of the wafer 41 has cooled down, the operator does not touch the heated wafer 41! /.
- the wafer 41 since the wafer 41 is replaced each time by the wafer feeding mechanism 100 (step 718), it is possible to secure the bonding strength or aseptic bonding of the tubes 8 and 9. it can.
- the latest exchange information of the wafer 41 is stored in the EEPROM 500, and even if the power supply is cut off during the tube joining operation, the wafer is not heated due to heat. Since the bonding strength or aseptic bonding of 8 and 9 can be secured, the wafer 41 is used. It remains updated after the wafer has been replaced, and is not judged in steps 602 to 606. This reduces the running cost during the return operation.
- the accumulated number of joining operations and the maintenance date are stored in the EEPROM 500, and the accumulated number of joining times and the maintenance date are determined and displayed on the LCD display section 192. (Steps 656 and 664), it is possible to secure in advance the certainty required for the tube joining apparatus 1 such as the joining strength of the tubes 8 and 9.
- the test piece 119 of the wafer feeding member 115 positioned at the wafer feeding start position is detected by the transmission sensor 132, and the wafer feeding member 115 is detected from the base point.
- the amount of movement of the wafer 41 is detected by the turntable 130 and the transmission type sensor 131, so that the feed amount of the wafer 41 can be accurately detected.
- the number of pulses actually detected with respect to the preset number of pulses is equal to or more than a predetermined number of pulses, it is determined that the feeding is defective, and thus the detection accuracy of the transport failure of the wafer 41 can be improved.
- the tube bonding apparatus 1 of the present embodiment when a transfer (extending) failure of the wafer 41 occurs, the structure in which the bearing 172 can enter the notch 178 is adopted. By moving 7 to the retreat position, it is possible to cancel the transfer failure of the wafer 41. Conventionally, when this kind of error occurred, the device was returned to the factory as a device failure and disassembly work was performed to remove the wafer that caused the feeding failure. Since the error can be easily canceled based on the wafer feeding failure, the operability and reliability of the apparatus can be improved.
- the transmission sensor 143 detects the full state of the waste box 142 and stops the wafer feeding mechanism 100, an automatic wafer push-in structure is adopted. In addition, it is possible to prevent the wafer from being jammed on the transfer path by the subsequent wafer. Further, in the tube joining apparatus 1, the transmission type sensor 195 determines whether the first clamp 6 and the second clamp 7 can hold the tubes 8 and 9 in parallel with each other. Since the device does not operate as it is and operates after the first clamp 6 and the second clamp 7 are returned to the proper initial positions by pressing the reset switch 194, the normal cutting and joining operation should always be ensured. Can be.
- the shaft 19 of the first clamp 6 is Since the first clamp 6 and the second clamp 7 are in the initial position (when the tube is loaded) as well as their relative positions have changed since the At the end), when either the lid 24 of the first clamp 6 or the lid 34 of the second clamp 7 is opened or closed, the lid 24 of the first clamp 6 or the lid of the second clamp 7 is opened. 34 also opens and closes almost simultaneously in conjunction with each other, so that work efficiency can be improved.
- the tube joining apparatus 1 employs a cam structure instead of the conventional moving mechanism such as the X and Y tables for directly moving the first and second clamps 6 and 7 in the X and Y directions. Can be reduced in size.
- clamp lock solenoid 400 is arranged on the second clamp 7 side, and the wafer position detection sensor 421 is arranged on the first clamp 6 side.
- the clamp lock solenoid 400 which is not limited to such an arrangement is arranged on the first clamp 7 side, and the wafer position detection sensor 421 is arranged on the second clamp 6 side.
- a configuration in which two types of coils are mounted on the clamp lock solenoid 400 and the plunger 404 is moved in different directions to switch to a different coil and energize is exemplified. It is also possible to use a clamp lock solenoid having a configuration in which the direction of the current is changed by reversing the connection of the coil by plus / minus reversing.
- the EEPROM 500 has been exemplified as an example of the nonvolatile memory.
- the present invention is not limited to this, and magnetic memories such as an EPROM, a flash memory, and a core memory are used. Is also good.
- an example in which the EEPROM 500 is connected to the internal bus of the control unit 190 via an external bus has been described.
- the present invention is not limited to this, and the nonvolatile memory can be connected by an internal node. It should be installed together with CPU, ROM and RAM.
- the light shielding plate 420 shields the optical path of the wafer position detection sensor 421 to detect the wafer holder 140.
- the light path of the wafer position detection sensor 421 is shielded by the light shielding plate 420, and the wafer holder 140 is detected (the wafer holder 140 is raised and positioned at the cutting position where the wafer 41 cuts the tubes 8 and 9).
- the light-shielding plate 420 does not detect the wafer holder 140 by transmitting the light path of the position detection sensor 421 without blocking the light, so that the related determination or operation control is changed as appropriate. Is also good.
- the joining of the tubes filled with blood has been exemplified.
- the present invention is not limited to this, and the tubes filled with blood and the empty tubes performed in the conventional technique are used.
- the method may be used for any purpose, such as when bonding is performed, when blood is enclosed, and when empty tubes are bonded to each other.
- an example in which the elongated hole 40 is formed in the second clamp 7 is shown, but the present invention is not limited to this, and a concave portion may be formed below the plate piece 38 of the second clamp.
- the shaft 19 and the elongated hole 40 provided in the first clamp 6 and the second clamp 7 may be provided in reverse.
- a tube joining device that joins two tubes in which blood is sealed is exemplified.
- the present invention is not limited to this, and a tube joining device that joins three or more tubes may be used. Even a tube in which a liquid other than blood is sealed can be applied to a tube joining device for suitably joining tubes.
- the present invention is not limited to this, and holds one wafer or three or more wafers. You may do so.
- the blood in the force tubes 8 and 9 can be extruded and removed by exemplifying a saw-toothed closing member 61, 62, 71 or 72 and a tube pushing member 10.
- the tubes 8 and 9 may be closed in a horizontal plane.
- the laser 41 is not limited to the self-heating type, and may have a configuration in which the cutting plate is heated by a heat source such as an electric heater.
- the present invention in the power-on processing subroutine (see FIG. 15), when the power is turned on, the information on the bonding processing state stored in the EEPROM 500, the detection result of the clamp lock detection sensor 410, the wafer The result of detection of the wafer 41 by the position detection sensor 421 is used to determine whether or not the power supply was interrupted during the previous tube joining operation (step Step 602-Step 606)
- Example Force The present invention is not limited to this, and may be a subroutine lacking one or both of Steps 602 and 604, or one or both of Steps 604 and 606.
- step 602 when step 602 is omitted, the EEPROM 500 becomes unnecessary, and it is possible to determine whether the power supply has been cut off based only on the detection information of the wafer position detection sensor 421. Further, in the present embodiment, a typical example in which the power supply is cut off has been described, but the present invention is not limited to this, and even if the power supply is not cut off, the tube joining apparatus 1 may be stopped or restarted. It is also applicable to a configuration that can be operated.
- the information on the bonding processing state of the tubes 8 and 9 and the exchange information of the wafer 41 are set to 1 bit and the latest bonding processing state is set.
- the present invention is not limited to this.
- a storage area for the information on the joining process status and the exchange information is defined, and the information on the latest joining process status and the identifiable information are not deleted without deleting the information on the previous joining process status and the exchange information.
- the information on the latest joining processing state or the exchange information may be read out based on the identifiable information by additionally storing the information sequentially. In this case, since the storage area for the information on the joining processing state and the exchange information is determined, the data overflows in chronological order.
- Cam motor part of holding unit moving unit, part of cutting unit moving unit
- Drive shaft part of holding unit moving unit, part of cutting unit moving unit
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Anesthesiology (AREA)
- Pulmonology (AREA)
- Biomedical Technology (AREA)
- Hematology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- External Artificial Organs (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002531408A CA2531408C (en) | 2003-07-04 | 2004-07-01 | Tube joining device |
EP04746807A EP1652653B1 (en) | 2003-07-04 | 2004-07-01 | Tube joining device |
AT04746807T ATE512785T1 (de) | 2003-07-04 | 2004-07-01 | Röhrenverbindungsvorrichtung |
US10/562,811 US7779880B2 (en) | 2003-07-04 | 2004-07-01 | Tube connecting apparatus |
HK06112306.8A HK1090607A1 (en) | 2003-07-04 | 2006-11-09 | Tube joining device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-192370 | 2003-07-04 | ||
JP2003192370A JP4046655B2 (ja) | 2003-07-04 | 2003-07-04 | チューブ接合装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005002832A1 true WO2005002832A1 (ja) | 2005-01-13 |
Family
ID=33562399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/009338 WO2005002832A1 (ja) | 2003-07-04 | 2004-07-01 | チューブ接合装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7779880B2 (ja) |
EP (1) | EP1652653B1 (ja) |
JP (1) | JP4046655B2 (ja) |
KR (1) | KR101065934B1 (ja) |
CN (1) | CN100434260C (ja) |
AT (1) | ATE512785T1 (ja) |
CA (1) | CA2531408C (ja) |
HK (1) | HK1090607A1 (ja) |
WO (1) | WO2005002832A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013146354A (ja) * | 2012-01-18 | 2013-08-01 | Terumo Corp | 無菌接合装置 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7398813B2 (en) * | 2006-07-31 | 2008-07-15 | Denco Inc. | Device for welding plastic tubes |
US8448992B2 (en) | 2011-02-16 | 2013-05-28 | Fenwal, Inc. | Sterile docking device, medical fluid flow system with sterile docking device and method of using same |
US9199070B2 (en) | 2011-12-21 | 2015-12-01 | Fenwal, Inc. | Fluid flow conduits and apparatus and methods for making and joining fluid conduits |
JP5868711B2 (ja) * | 2012-01-18 | 2016-02-24 | テルモ株式会社 | 無菌接合装置 |
JP2013146355A (ja) * | 2012-01-18 | 2013-08-01 | Terumo Corp | 無菌接合装置 |
JP5868715B2 (ja) * | 2012-01-24 | 2016-02-24 | テルモ株式会社 | 無菌接合装置 |
JP5851258B2 (ja) * | 2012-01-25 | 2016-02-03 | テルモ株式会社 | 無菌接合装置 |
JP5955570B2 (ja) * | 2012-01-25 | 2016-07-20 | テルモ株式会社 | 無菌接合装置 |
JP2013154538A (ja) * | 2012-01-30 | 2013-08-15 | Terumo Corp | 無菌接合装置 |
US9308709B2 (en) | 2013-06-06 | 2016-04-12 | Fenwal, Inc. | Bonding apparatus and method |
CN106457674B (zh) * | 2014-04-02 | 2019-12-10 | 通用电气健康护理生物科学股份公司 | 合并器和密封器集成系统 |
US9440396B2 (en) | 2014-06-19 | 2016-09-13 | Fenwal, Inc. | Sterile connection device for making multiple connections |
US9839582B2 (en) | 2014-12-02 | 2017-12-12 | Fenwal, Inc. | Sterile connection syringe assemblies |
DE102015117095A1 (de) | 2015-10-07 | 2017-04-13 | B. Braun Avitum Ag | Verriegelungszustand-Erfassungsvorrichtung |
CH711822A1 (de) * | 2015-11-30 | 2017-05-31 | Reed Electronics Ag | Vorrichtung zum Verschweissen von thermoplastischen Schläuchen. |
US10401836B2 (en) * | 2016-03-21 | 2019-09-03 | Fisher-Rosemount Systems, Inc. | Methods and apparatus to setup single-use equipment/processes |
CN107031053A (zh) * | 2017-05-26 | 2017-08-11 | 武汉佰美斯医疗科技有限公司 | 一种无菌管接驳装置 |
US10919235B2 (en) | 2017-06-07 | 2021-02-16 | Fenwal, Inc. | Apparatus and method for mechanically opening a connection site |
FR3097467B1 (fr) * | 2019-06-19 | 2022-09-23 | Mga Tech | Procédé de compression d’un tube déformable |
JPWO2020262243A1 (ja) * | 2019-06-24 | 2020-12-30 | ||
JPWO2020262194A1 (ja) * | 2019-06-25 | 2020-12-30 | ||
JPWO2020262192A1 (ja) * | 2019-06-25 | 2020-12-30 | ||
CN110641026B (zh) * | 2019-10-21 | 2022-07-19 | 东台市高科技术创业园有限公司 | 一种供水管走顶布局用ppr管熔接设备 |
CN114789561A (zh) | 2021-01-25 | 2022-07-26 | 汾沃有限公司 | 管的无菌连接 |
CA3225951A1 (en) * | 2021-07-06 | 2023-01-12 | Cellular Origins Limited | Automated apparatus |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4521263A (en) | 1982-08-16 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Automatic splicing device and process |
JPH0691010A (ja) * | 1992-09-10 | 1994-04-05 | Terumo Corp | 可撓性チューブ無菌的接合装置 |
JPH09154920A (ja) * | 1995-12-08 | 1997-06-17 | Terumo Corp | チューブ接続装置 |
JP2000202034A (ja) * | 1999-01-19 | 2000-07-25 | Terumo Corp | チュ―ブ接続装置およびチュ―ブ接続装置の管理システム |
EP1048316A2 (en) | 1999-04-27 | 2000-11-02 | Terumo Kabushiki Kaisha | Tube connecting apparatus |
JP2000308688A (ja) * | 1999-04-28 | 2000-11-07 | Terumo Corp | チューブ接続装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ZA814659B (en) | 1980-07-11 | 1983-02-23 | Du Pont | Sterile docking process, apparatus and system |
IL69496A0 (en) | 1982-08-16 | 1983-11-30 | Du Pont | Automatic apparatus,system and process for making a connection between two thermoplastic resin tubes |
DD237634A5 (de) | 1983-06-13 | 1986-07-23 | E. I. Du Pont De Nemours U. Co,Us | Steriles verbindungsverfahren- vorrichtung und -system |
US4647756A (en) * | 1983-07-05 | 1987-03-03 | E. I. Du Pont De Nemours And Company | Electrical resistance heating element with signal means to indicate first use |
US5279685A (en) | 1990-08-20 | 1994-01-18 | Denco, Inc. | Total containment device for connect/disconnect of plastic tubes |
JP3096086B2 (ja) | 1991-04-05 | 2000-10-10 | テルモ株式会社 | チューブの接合方法及び装置 |
JP2574078Y2 (ja) | 1992-09-03 | 1998-06-11 | テルモ株式会社 | 可撓性チューブ無菌的接合装置 |
JP3354602B2 (ja) | 1992-09-03 | 2002-12-09 | テルモ株式会社 | 可撓性チューブ無菌的接合装置 |
JP4344420B2 (ja) | 1999-04-23 | 2009-10-14 | 本田技研工業株式会社 | 金属部品の高強度化装置および高強度化方法 |
US6485593B1 (en) * | 1998-10-26 | 2002-11-26 | Kurt J. Christoffersen | Sterile docking apparatus and method of use |
-
2003
- 2003-07-04 JP JP2003192370A patent/JP4046655B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-01 KR KR20057025205A patent/KR101065934B1/ko not_active IP Right Cessation
- 2004-07-01 US US10/562,811 patent/US7779880B2/en active Active
- 2004-07-01 WO PCT/JP2004/009338 patent/WO2005002832A1/ja active Application Filing
- 2004-07-01 AT AT04746807T patent/ATE512785T1/de not_active IP Right Cessation
- 2004-07-01 CA CA002531408A patent/CA2531408C/en active Active
- 2004-07-01 CN CNB2004800187173A patent/CN100434260C/zh active Active
- 2004-07-01 EP EP04746807A patent/EP1652653B1/en active Active
-
2006
- 2006-11-09 HK HK06112306.8A patent/HK1090607A1/xx not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4521263A (en) | 1982-08-16 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Automatic splicing device and process |
JPH0691010A (ja) * | 1992-09-10 | 1994-04-05 | Terumo Corp | 可撓性チューブ無菌的接合装置 |
JPH09154920A (ja) * | 1995-12-08 | 1997-06-17 | Terumo Corp | チューブ接続装置 |
JP2000202034A (ja) * | 1999-01-19 | 2000-07-25 | Terumo Corp | チュ―ブ接続装置およびチュ―ブ接続装置の管理システム |
EP1048316A2 (en) | 1999-04-27 | 2000-11-02 | Terumo Kabushiki Kaisha | Tube connecting apparatus |
JP2000308670A (ja) | 1999-04-27 | 2000-11-07 | Terumo Corp | チューブ接続装置 |
JP2000308688A (ja) * | 1999-04-28 | 2000-11-07 | Terumo Corp | チューブ接続装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013146354A (ja) * | 2012-01-18 | 2013-08-01 | Terumo Corp | 無菌接合装置 |
Also Published As
Publication number | Publication date |
---|---|
ATE512785T1 (de) | 2011-07-15 |
EP1652653A1 (en) | 2006-05-03 |
CA2531408C (en) | 2009-09-08 |
JP4046655B2 (ja) | 2008-02-13 |
CA2531408A1 (en) | 2005-01-13 |
KR20060026450A (ko) | 2006-03-23 |
US7779880B2 (en) | 2010-08-24 |
EP1652653A4 (en) | 2009-03-11 |
KR101065934B1 (ko) | 2011-09-19 |
CN1816438A (zh) | 2006-08-09 |
US20060144525A1 (en) | 2006-07-06 |
CN100434260C (zh) | 2008-11-19 |
HK1090607A1 (en) | 2006-12-29 |
JP2005022341A (ja) | 2005-01-27 |
EP1652653B1 (en) | 2011-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005002832A1 (ja) | チューブ接合装置 | |
WO2004020179A1 (ja) | チューブ接合装置及びチューブ接合方法 | |
JP4073371B2 (ja) | チューブクランプ装置及びチューブ接合装置 | |
US5279685A (en) | Total containment device for connect/disconnect of plastic tubes | |
JP4162973B2 (ja) | チューブ接合装置 | |
JP2005539370A (ja) | 自動装填式コンポーネントテープフィーダ | |
WO2018173957A1 (ja) | チューブ接合装置 | |
JP4115263B2 (ja) | チューブ接合装置 | |
JP3093887B2 (ja) | 可撓性チューブ無菌的接合装置 | |
JP4139202B2 (ja) | チューブ接合装置 | |
JP5557679B2 (ja) | フラックス供給装置 | |
JP4115262B2 (ja) | チューブ接合装置 | |
JP4115353B2 (ja) | チューブ接合装置 | |
JP3354602B2 (ja) | 可撓性チューブ無菌的接合装置 | |
JP3011982U (ja) | 溶着装置 | |
JP5736793B2 (ja) | チューブ接合装置 | |
JP2002239840A (ja) | ワイヤ放電加工装置およびワイヤ放電加工装置における自動結線方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
ENP | Entry into the national phase |
Ref document number: 2006144525 Country of ref document: US Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020057025205 Country of ref document: KR Ref document number: 10562811 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20048187173 Country of ref document: CN |
|
ENP | Entry into the national phase |
Ref document number: 2531408 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004746807 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057025205 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2004746807 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 10562811 Country of ref document: US |