WO2004113065A1 - 表裏両面の導電層がスルホ−ルを介して互いに電気的に接続されている導電性シート - Google Patents
表裏両面の導電層がスルホ−ルを介して互いに電気的に接続されている導電性シート Download PDFInfo
- Publication number
- WO2004113065A1 WO2004113065A1 PCT/JP2004/008715 JP2004008715W WO2004113065A1 WO 2004113065 A1 WO2004113065 A1 WO 2004113065A1 JP 2004008715 W JP2004008715 W JP 2004008715W WO 2004113065 A1 WO2004113065 A1 WO 2004113065A1
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- WO
- WIPO (PCT)
- Prior art keywords
- conductive layer
- insulating substrate
- hole
- conductive
- back surfaces
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Definitions
- the present invention relates to a conductive sheet. More specifically, the present invention relates to a conductive sheet that can be suitably used for a substrate for a semiconductor, a circuit board for electric and electronic components, various packaging, an automobile component, a solar cell, an antenna circuit board, and the like.
- a conductive layer is formed by bonding a copper foil or the like to both the front and back surfaces of the insulating substrate, and thereafter, holes are formed by a known drilling process such as punching, drilling, pressing, and laser. A through hole is formed so as to penetrate both the insulating base and the conductive layer. After that, a method of forming a conductive layer on the wall surface of the through hole by an electroless plating method or an electroplating method after performing a catalytic treatment or a carbon black treatment has been attempted.
- the conductive layer (copper foil, etc.) on both the front and back surfaces of the insulating substrate may be contacted.
- the structure of the conductive layer (plating layer, etc.) in the hole was completely different and lacked in unity, so that highly reliable electrical connection could not be guaranteed. Further, since both of these conductive layers are manufactured through completely independent manufacturing steps, the production cost is high.
- the conductive layer 504 formed on the wall surface of the through hole 502 by the electroless plating method or the electroplating method by this method should be selectively formed only on the wall surface. Is difficult and is inevitably formed also on the conductive layer 503 formed in advance on the insulating substrate 501. As a result, the conductive layer 505 on the insulating substrate is formed extremely thick. Had to be done. When the conductive layer on the insulating substrate is formed thick as described above, it becomes difficult to perform fine processing when forming a circuit by etching or the like, which requires a long processing time and increases the production cost. At the same time, the dimensional accuracy itself deteriorated.
- Patent Document 213 Japanese Patent Application Laid-Open No. 4-286394
- Patent Document 2 JP-A-11-307933
- Patent Document 3 JP-A-11-298104
- Patent Document 4 JP-A-5-327229
- Patent Document 5 JP-A-5-267806
- Patent Document 6 JP-A-4-314395
- Patent Document 7 JP-A-2-142198
- Patent Document 8 JP-A-2-21507
- Patent Document 9 JP-A-63-177586
- Patent Document 10 JP-A-62-226689
- Patent Document 11 JP-A-53-140570
- Patent Document 12 JP-A-59-228789
- Patent Document 13 JP-A-51-60997
- the present invention has been made in view of the above situation, and has as its object to provide highly reliable electrical connectivity, reduce production costs and improve dimensional accuracy.
- An object of the present invention is to provide a conductive sheet that achieves both.
- a conductive layer is formed on both the front and back surfaces of an insulating substrate, and the conductive layers on both the front and back surfaces are formed through through holes formed so as to penetrate the insulating substrate.
- the conductive layer can include a first conductive layer formed by a sputtering method or a vapor deposition method, and a second conductive layer formed by an electroless plating method or an electroplating method.
- the conductive layer can be formed on the front and back surfaces of the insulating substrate and the wall surface of the through hole in the same step.
- the integration of the conductive layers formed on both the front and back surfaces of the insulating substrate and the wall surfaces of the through holes can be promoted, and the reliability of the electrical connection can be further increased, and the production cost can be reduced. be able to.
- the thickness of the conductive layer can be reduced as much as possible, and the dimensional accuracy can be further improved.
- the conductive sheet of the present invention has a highly reliable electrical connection, and at the same time reduces production costs and improves dimensional accuracy.
- the conductive sheet of the present invention can be applied to a wide range of applications such as a substrate for semiconductors, a circuit board for electric and electronic parts, various packaging, an automobile part, a solar cell, and an antenna circuit board. . That is, the conductive sheet can form a plurality of circuit patterns in a continuous form without cutting, or a force for cutting into a certain size, It can be used for the above various applications.
- FIG. 1 is a schematic cross-sectional view of a hole portion of an insulating substrate having a through hole and an alignment hole.
- FIG. 2 is a schematic sectional view of an opening in a state where a first conductive layer is formed on an insulating substrate.
- FIG. 3 is a schematic cross-sectional view of a hole in a conductive sheet in which a conductive layer including a first conductive layer and a second conductive layer is formed on an insulating substrate.
- FIG. 4 is a schematic plan view of a conductive sheet of the present invention.
- FIG. 5 is a schematic sectional view of an opening of a conventional conductive sheet.
- a conductive layer is formed on both front and back surfaces of an insulating substrate, and the conductive layers on both front and back surfaces are electrically connected to each other through through holes that are opened so as to penetrate the insulating substrate. It has a configuration that is connected to each other.
- the conductive sheet of the present invention having such a configuration can be suitably used for a substrate for a semiconductor, a circuit board for electric and electronic parts, various packaging, an automobile part, a solar cell, an antenna circuit board, and the like. it can.
- each configuration of the conductive sheet of the present invention will be described.
- FIG. 3 schematic cross-sectional view of the opening portion of the conductive sheet
- the conductive sheet 7 of the present invention is different from the insulating substrate 1 in which the Snorrehorn 2 (and the alignment hole 3) are opened.
- a conductive layer 6 (including the first conductive layer 4 and the second conductive layer 5) is formed.
- any conventionally known substrate that can be used for this kind of application can be used without any particular limitation.
- a film having a small thickness is preferable. It is suitable for forming the conductive layer described later, and can be processed as a long continuous material such as a roll. This makes it possible to improve production efficiency.
- Examples of such an insulating substrate include, for example, polyimides, aramides, polyesters such as PET, polysulfone, polyethenoleimide, polyphenylene oxide, PEN, liquid crystal polymers, glass fiber reinforced epoxy resins, The ability to name films such as phenolic resins and acrylic resins. Among these, it is particularly preferable to use a film made of a polyimide glass fiber reinforced epoxy resin having excellent flexibility and high performance.
- the film referred to here is preferably a film having a thickness of 4-1150 ⁇ m, preferably about 1275 ⁇ m. If it is less than 150 m, the strength may be weak and it may not be able to withstand processing.If it exceeds 150 zm, it may not be flexible and may not be handled in a roll shape, and the conductive layer may be applied to the wall surface of the through hole as described later. This is because it may hinder the formation.
- the shape of the insulating substrate is preferably a film-like force. If it is a film-like force, it may be a long sheet-like shape such as a roll. It may be in a continuous form. In the present invention, it is preferable to use a long continuous material such as a roll from the viewpoint of the processing efficiency in the production.
- the through hole in the present invention is a small hole provided so as to physically penetrate the front and back of the insulating substrate, and is formed on both the front and back surfaces of the insulating substrate through this through hole. Are electrically connected to each other.
- a conductive layer described later after forming the through hole in the insulating substrate. This makes it possible to integrally form the conductive layers on both the front and back surfaces of the insulating substrate and the conductive layers in the through holes, thereby contributing to a reduction in production costs and a highly reliable electrical connection. Can be guaranteed.
- the shape of such a through hole is not particularly limited as long as it penetrates the front and back of the insulating substrate.
- the through hole may have a circular or polygonal cross section.
- the inner diameter is preferably 3 mm, preferably 25-200 ⁇ m. If the inner diameter is less than 5 xm, drilling becomes difficult and the processing cost increases.If the inner diameter exceeds 3 mm, the through hole occupies the entire surface of the insulating substrate. becomes too large to secure an effective circuit space.
- the opening density (number) of such through holes is not particularly limited, but is usually 10 to 10 million per 100 cm 2 , more generally 100 to 1 50. Ten thousand, more commonly one hundred and one hundred thousand. If the number is less than 10, the substantial function of electrically connecting the conductive layers on the front and back of the conductive sheet via the through hole will not be exhibited. It is not preferable because it cannot be maintained and the accuracy is poor.
- Such a through hole can be formed by any method without particular limitation as long as it is a conventionally known hole forming method (hole forming method).
- holes are formed so as to penetrate the insulating substrate by means of holes such as various lasers, drills, punches, and presses.
- holes such as various lasers, drills, punches, and presses.
- the inner diameter of the through hole is smaller than 80 x m, it is preferable to open the hole with various lasers.
- the conductive layer of the present invention is formed on both the front and back surfaces of the insulating substrate and the wall surface of the through hole, and has the same configuration on both the front and back surfaces of the insulating substrate and the wall surface of the through hole. Formed.
- the conductive layers on both the front and back surfaces of the insulating substrate are electrically connected via through holes.
- the term “electrically connected through through holes” specifically refers to the insulating properties as described above. This means that the conductive layers formed on both the front and back surfaces of the base are electrically connected by the conductive layers of the same configuration formed on the wall surfaces of the through holes.
- highly reliable electrical connection can be achieved.
- Such a conductive layer is not particularly limited in its composition as long as it has an electric conductivity function, and is made of Cu, Ni, Cr, Ag, Au, Zn, Pd, Sn and Co.
- Group strength It can be formed as a single layer, which is preferably made of at least one selected metal or an alloy containing at least one metal, and a plurality of layers of the same composition or different compositions are laminated. It can also be formed.
- the conductive layer has the same configuration on both the front and back surfaces of the insulating substrate and the wall surface of the through hole means that It means that the laminated state is the same, and does not necessarily mean that the thickness of the layer is the same.
- Such a conductive layer can include a first conductive layer formed by a sputtering method or an evaporation method, and a second conductive layer formed by an electroless plating method or an electroplating method.
- the first conductive layer and the second conductive layer may be formed as a single layer or a plurality of layers, respectively, to form a conductive layer.
- the first conductive layer of the present invention is formed directly on the insulating substrate, and can form a metal S or an alloy containing at least one of the above metals by a sputtering method or a vapor deposition method.
- the first conductive layer has a function as a so-called base layer for forming a second conductive layer described later, and has a function of improving the adhesion of the second conductive layer to the insulating substrate. .
- Such a first conductive layer is preferably formed with a thickness of 300 to 5000A, preferably 1000 to 3000A. If it is less than 300 A, the effect of improving the adhesion of the second conductive layer described later cannot be sufficiently exhibited, and even if it exceeds 5000 A, the adhesion of the second conductive layer will not be substantially different and disadvantageous in terms of cost. .
- Such a first conductive layer can be formed as described above in a single layer (single layer) or in a laminate of two or more layers (multiple layers). The ability to have
- Ni and Cr have the function of preventing the adhesive strength from deteriorating over time, and by laminating a metal such as Cu or an alloy containing the same on it, the adhesion to the second conductive layer is improved. Because you can do it.
- the second conductive layer of the present invention is formed on the first conductive layer, and the above-mentioned metal or an alloy containing at least one metal is applied by an electroless plating method or an electroplating method. It is formed by this.
- This second conductive layer is different from the first conductive layer. The effect of imparting mainly electric conductivity is exerted by forming it thicker.
- such a second conductive layer is formed to have a thickness of 0.5 to 100 ⁇ 1 ⁇ , and preferably 125 / im. If it is less than 0.5 ⁇ , there is a problem that the electric resistance becomes too large, and even if it exceeds 100 ⁇ m, there is no significant difference in electric conductivity, which is disadvantageous in terms of cost.
- such a second conductive layer can be formed as a single layer (single layer) or a laminate of two or more layers (a plurality of layers). The ability to have
- the second conductive layer is preferably formed by using an electroplating method when it is formed relatively thick, and is formed by an electroless plating method when formed relatively thin. It is preferable to adopt and form.
- the conductive layer of the present invention is formed on the front and back surfaces of the insulating substrate and the wall surface of the through hole in the same step after the through hole is formed in the insulating substrate. ,.
- This makes it possible to integrally form the conductive layer on both the front and back surfaces of the insulating substrate and the conductive layer on the wall surface in the through hole, thereby contributing to a reduction in production cost and a highly reliable electrical connection. Connection can be guaranteed. It also contributes to the improvement of dimensional accuracy.
- the conductive layer is formed in the same step means that the conductive layer is formed simultaneously and integrally on both the front and back surfaces of the insulating substrate and the wall surface of the sulfol. are doing.
- the conductive layer includes a first conductive layer and a second conductive layer
- first the first conductive layer is formed on the front and back surfaces of the insulating substrate and the wall surfaces of the through holes by a sputtering method or
- the second conductive layer is formed simultaneously and integrally by a vapor deposition method, and then the second conductive layer is formed simultaneously and integrally on the first conductive layer by an electroless plating method or an electroplating method. Cases are included.
- the conductive layer includes the first conductive layer and the second conductive layer, or when the respective layers are stacked in a plurality of layers, each layer is formed simultaneously and integrally as described above. As long as the conductive layers are formed in the same step.
- the conductive layer is formed by a sputtering method or an evaporation method.
- the conductive layers on both the front and back sides and the conductive layer on the wall surface of the through hole are It is assumed that they are formed in the same process.
- the conductive layer on the wall surface of the snow hole is considered to be formed to the middle height (depth) of the hole by each of these two operations. It is considered that a conductive layer is formed on the entire wall surface. Even if the conductive layer is weighted and stacked at the middle height (depth) portion of the hole, the configuration of that portion is the same as the configuration of the conductive layer on the surface of the insulating substrate. Shall be considered.
- the conductive layer is first formed on both the front and back surfaces of the insulating substrate, then the through hole is opened, and then the wall surface of the through hole is formed again. Since the number of steps for forming the conductive layer can be halved compared to the method in which the conductive layer is formed by using the method, the production cost can be significantly reduced. In addition, since they are integrally formed in the same process, a highly reliable connection effect can be obtained.
- the conductive layer is formed in such a manner as to extend upward.
- the thickness of the conductive layer is weighted and formed.
- the thickness of the conductive layer on the insulating substrate is increased in this manner, processing for forming a circuit is difficult and dimensional accuracy itself is deteriorated.
- the thickness of the conductive layer can be reduced as much as possible without increasing the thickness of the conductive layer, and the circuit can be easily formed. And the dimensional accuracy does not deteriorate.
- An alignment mark can be formed on the insulating substrate of the present invention.
- the alignment mark serves as a reference for determining a predetermined position of the through hole, and is preferably formed at both ends (positions where no through hole is provided) of the insulating substrate.
- Such an alignment mark may be any mark as long as the predetermined position of the through hole can be determined optically, electronically, magnetically, visually, or by other reading means.
- the method for forming the same is not particularly limited.
- This hole (referred to as an alignment hole) is more preferably continuously opened at a constant interval.
- the size of such an alignment hole is usually preferably about 5 ⁇ m 3 mm, and can be formed by various lasers, drills, punches, presses, or the like. When such an alignment hole is smaller than 80 x m, it is preferable to use various lasers.
- such an alignment hole may have a conductive layer formed on the inner wall surface thereof.
- a polyimide film (trade name: manufactured by Abbical, manufactured by Kanebo) having a thickness of 50 ⁇ m, a width of 250 mm, and a length of 100 m was set on a CO laser processing machine (manufactured by Mitsubishi Electric).
- a through hole 2 having an inner diameter of 70 ⁇ m and an alignment hole 3 having an inner diameter of 200 ⁇ m were formed by this processing machine so as to penetrate both sides of the polyimide film. .
- the following treatment was carried out in order to remove the carbide formed in the hole and its periphery during the treatment. That is, the conductive substrate 1 was set in a dismirror apparatus, immersed in an immersion bath of a 50 g / 1 aqueous solution of potassium permanganate at a liquid temperature of 60 ° C. for 70 seconds, and washed with pure water five times. .
- a neutralization treatment was further performed by immersion in an immersion bath of 5% sulfuric acid at a liquid temperature of 40 ° C for 2 minutes, and washing with pure water was repeated five times again.
- the high-performance filter Draining was performed with dry air at 105 ° C passed through (the size of the opening of the filter was 0.5 ⁇ m or less), and the carbides generated above were removed by sufficient drying.
- one end of the insulating substrate 1 from which the carbide was removed in this way was set on a sending shaft of a sputtering device, and the other end was set on a winding shaft.
- Ni was attached as target No. 1
- Cu was attached as target No. 24, respectively.
- the insulating substrate is turned upside down so that the same first conductive layer as described above can be formed on the surface of the insulating substrate on which the first conductive layer is not formed. , And set again in the sputtering apparatus. Then, the same first conductive layer as described above was formed on the other surface of the insulating substrate by performing sputtering under the same conditions as described above.
- FIG. 2 shows the insulating substrate in this state, in which the first conductive layer 4 is formed on both the front and back surfaces of the insulating substrate 1 and the wall surface of the sulfone hole 2 (and the wall surface of the alignment hole 3). It has been done.
- the first conductive layer 4 has a configuration in which a Ni layer is first laminated on the insulating substrate 1 and a Cu layer is laminated thereon. This configuration is the same on both the front and back surfaces of the insulating substrate and the wall surface of the through hole.
- the insulating substrate having the first conductive layer formed on both the front and back surfaces as described above is set in a continuous plating apparatus, and under the following conditions. Electric plating was performed. In other words, first place the insulating material in an acid activation tank filled with 8% sulfuric acid. By immersing the substrate continuously for 20 seconds, the first conductive layer was subjected to an acid activation treatment.
- the plating bath 110 g / l of copper sulfate, 160 g / l of sulfuric acid, 60 ppm of chlorine, and 60 ppm of chlorine and Tutopulina 380H (manufactured by Okuno Pharmaceutical Co., Ltd.)
- the plating bath 110 g / l of copper sulfate, 160 g / l of sulfuric acid, 60 ppm of chlorine, and 60 ppm of chlorine and Tutopulina 380H (manufactured by Okuno Pharmaceutical Co., Ltd.)
- the plating bath 110 g / l of copper sulfate, 160 g / l of sulfuric acid, 60 ppm of chlorine, and 60 ppm of chlorine and Tutopulina 380H (manufactured by Okuno Pharmaceutical Co., Ltd.)
- the plating bath 110 g / l of copper sulfate, 160 g / l of sulfuric acid, 60 ppm
- FIG. 3 shows the insulating substrate in this state, in which the first conductive layer 4 is formed on both the front and back surfaces of the insulating substrate 1 and the wall surface of the sulfone hole 2 (and the wall surface of the alignment hole 3).
- the second conductive layer 5 is formed on the first conductive layer 4.
- the configuration of the second conductive layer 5 is the same on both the front and back surfaces of the insulating substrate and the wall surface of the through hole. Therefore, the conductive layer 6 includes a first conductive layer and a second conductive layer, and a conductive layer having the same configuration is formed on both the front and back surfaces of the insulating substrate and the wall surfaces of the through holes.
- FIG. 4 is a schematic plan view of the conductive sheet 7 in the above state.
- the conductive layer 6 (including the first conductive layer 4 and the second conductive layer 5) on the insulating substrate 1 is omitted.
- the insulating substrate on which the second conductive layer was formed was repeatedly washed with pure water five times.
- the conductive sheet 7 of the present invention shown in FIGS. 3 and 4 was obtained by draining with 105 ° C. dry air passed through a high-performance filter and sufficiently drying.
- the conductive sheet obtained as described above was cut into a sheet having a size of 250 mm in width and 300 mm in length. Then, the conductive sheet cut in this manner was subjected to resist processing for exposure to light, and a negative mask for forming a circuit pattern was set on the basis of the alignment hole. After that, exposure, development, etching and resist peeling are performed respectively. Thus, a circuit pattern was formed on the conductive layer.
- the circuit pattern thus formed was extremely accurate on both the front and back sides of the conductive sheet, and the dimensions of the formed circuit were all within ⁇ 5% of the design dimensions. In addition, both sides showed an extremely reliable electrical connection effect with no problem in electrical conductivity.
- the insulating substrate thus obtained was immersed in an immersion bath of lOOcc / 1 palladium catalyst (trade name: Axeleta, manufactured by Okuno Pharmaceutical Co., Ltd.) for 1 minute at room temperature. Catalyst treatment was performed on the first conductive layer.
- the electroless copper plating solution for through-holes (trade name: OPC-750 electroless copper M (product name) was applied to the catalyst-treated first conductive layer. 2), and electroless plating was performed at room temperature and pH 12.9 to form a 1 ⁇ m thick second conductive layer made of copper.
- the insulating substrate on which the second conductive layer was formed was repeatedly washed with pure water five times. After that, water is removed by dry air at 105 ° C through a high-performance filter (the size of the opening of the filter is 0.5 zm or less), and the insulating substrate is dried sufficiently. Then, a conductive sheet of the present invention in which a conductive layer including a first conductive layer and a second conductive layer was formed was obtained.
- the conductive layer of the conductive sheet had the same configuration on both the front and back surfaces of the insulating substrate and the wall surface of the through hole. It also has excellent dimensional accuracy and a highly reliable electrical connection effect.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-179343 | 2003-06-24 | ||
JP2003179343A JP2005019513A (ja) | 2003-06-24 | 2003-06-24 | 導電性シート |
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WO2004113065A1 true WO2004113065A1 (ja) | 2004-12-29 |
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PCT/JP2004/008715 WO2004113065A1 (ja) | 2003-06-24 | 2004-06-21 | 表裏両面の導電層がスルホ−ルを介して互いに電気的に接続されている導電性シート |
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JP (1) | JP2005019513A (ja) |
TW (1) | TWI277379B (ja) |
WO (1) | WO2004113065A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2129199A1 (en) * | 2008-05-28 | 2009-12-02 | LG Electronics Inc. | Method of manufactoring flexible film |
EP2146561A1 (en) * | 2008-05-28 | 2010-01-20 | LG Electronics Inc. | Flexible film and display device including the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49121174A (ja) * | 1973-03-28 | 1974-11-19 | ||
JPS6295894A (ja) * | 1985-10-23 | 1987-05-02 | 株式会社エイト工業 | スル−ホ−ル基板の製造方法 |
JPH02301187A (ja) * | 1989-05-16 | 1990-12-13 | Casio Comput Co Ltd | 両面配線基板の製造方法 |
-
2003
- 2003-06-24 JP JP2003179343A patent/JP2005019513A/ja active Pending
-
2004
- 2004-06-21 WO PCT/JP2004/008715 patent/WO2004113065A1/ja active Application Filing
- 2004-06-24 TW TW93118373A patent/TWI277379B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49121174A (ja) * | 1973-03-28 | 1974-11-19 | ||
JPS6295894A (ja) * | 1985-10-23 | 1987-05-02 | 株式会社エイト工業 | スル−ホ−ル基板の製造方法 |
JPH02301187A (ja) * | 1989-05-16 | 1990-12-13 | Casio Comput Co Ltd | 両面配線基板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2129199A1 (en) * | 2008-05-28 | 2009-12-02 | LG Electronics Inc. | Method of manufactoring flexible film |
EP2146561A1 (en) * | 2008-05-28 | 2010-01-20 | LG Electronics Inc. | Flexible film and display device including the same |
Also Published As
Publication number | Publication date |
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JP2005019513A (ja) | 2005-01-20 |
TW200507719A (en) | 2005-02-16 |
TWI277379B (en) | 2007-03-21 |
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