WO2004100249A1 - 気化器及び半導体処理装置 - Google Patents
気化器及び半導体処理装置 Download PDFInfo
- Publication number
- WO2004100249A1 WO2004100249A1 PCT/JP2004/006609 JP2004006609W WO2004100249A1 WO 2004100249 A1 WO2004100249 A1 WO 2004100249A1 JP 2004006609 W JP2004006609 W JP 2004006609W WO 2004100249 A1 WO2004100249 A1 WO 2004100249A1
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- WO
- WIPO (PCT)
- Prior art keywords
- filter member
- raw material
- vaporizer
- shielding plate
- heat transfer
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Definitions
- the present invention relates to a vaporizer for generating a gaseous raw material by vaporizing a liquid raw material and a semiconductor processing apparatus using the same.
- the semiconductor treatment means a semiconductor layer and an insulating layer on a substrate to be processed such as a wafer, a glass substrate for a liquid crystal display (LCD), or a flat panel display (FPD).
- a conductive layer and the like By forming a conductive layer and the like in a predetermined pattern, it is possible to manufacture a structure including a semiconductor device, a wiring connected to the semiconductor device, an electrode, and the like on the substrate to be processed. Means the various processes performed. Background art
- a CVD (chemical vapor deposition) method is known as a thin film forming technique for semiconductor devices.
- a dielectric thin film having a high dielectric constant and a low leakage current in order to achieve high integration of a device. Therefore, when such a dielectric thin film is formed, a film forming technique using an organic metal material as a raw material is used.
- a raw material that is an organometallic material a material that is originally liquid or a material that is liquefied with an appropriate solvent is usually used.
- This raw material is atomized and vaporized in a vaporizer (raw material vaporizer) and supplied to a reaction chamber as a film forming apparatus.
- a vaporizer raw material vaporizer
- it is necessary to vaporize sufficiently at a temperature at which the organometallic material is not decomposed.
- residual mist that has not been vaporized is generated, or decomposition products of the organometallic material are generated as particles. Therefore, there is a problem that these mist particles degrade the quality of a thin film formed in the reaction chamber.
- a configuration has been known in which a filter is installed at the outlet of the vaporizer to remove mist particles (for example, Japanese Patent Application Laid-Open Nos. H07-94426 and H08-1996). No. 1,816,103, US Pat. No. 6,210,485).
- a vaporizing plate is provided perpendicular to the flow path of the vaporized material or at an angle so as to obstruct the flow path, and a heater is installed inside the vaporizing plate to promote vaporization. It is known (see, for example, JP-A-6-31044).
- a vaporizer in which a vaporizing surface is provided on an inner surface portion of the vaporizing chamber facing the spraying direction of the raw material so that the temperature can be controlled independently of the inner surface of another vaporizing chamber (for example, See Japanese Patent Application Laid-Open No. 2002-111506, especially the structure of FIG. 7 and FIG. 8.
- the temperature of the vaporized surface is set to be higher than the other inner surface temperatures.
- This vaporizer can reduce such unvaporized residues S and can increase the amount of vaporized.
- the temperature of an inner surface portion opposed to the spray direction of the raw material is controlled independently. This increases the vaporization efficiency of the raw materials in the vaporization chamber.
- the mist that does not contact the vaporized surface has little effect. For this reason, there is a problem that it is not possible to suppress the discharge of the non-vaporized residue / particles directly to the gas outlet, which is the outlet of the vaporizing chamber, without passing through the vaporizing surface.
- An object of the present invention is to provide a vaporizer that can reduce mist and particles in a gaseous raw material.
- a filter member is disposed in a passage (a second vaporization section) of a gaseous material generated and vaporized in a first vaporization section such as a vaporizer, and the filter member is substantially disposed in a first vaporization section.
- the captured residual mist is re-vaporized by the heated filter member, clogging of the filter member is reduced. For this reason, the vaporization efficiency of the vaporizer (2) is maintained for a long time, and an increase in the internal pressure of the vaporizer is suppressed. Therefore, the frequency of maintenance is reduced, and the operation rate of the device can be improved.
- a heating means is provided outside the filter member and the filter member is heated from the outside, and a heating means is provided inside the filter member. It is considered that heating is performed from the inside of the filter.
- the filter member is heated by radiant heat or conduction heat, but since the heating means cannot be arranged in the flow path of the gaseous raw material, the filter member is heated uniformly. Configuration is required. If the temperature of the filter member is not uniform, the heating temperature of the captured residual mist varies, which may cause local clogging of the filter member.
- the center of the filter contacts the gas mist. This cools and lowers the temperature. This Therefore, the mist cannot be vaporized, which causes clogging.
- a first aspect of the present invention is a supply structure of a vaporized raw material, comprising a first vaporizing section for vaporizing the raw material, and a first vaporizing section provided in a passage of the vaporized raw material vaporized in the first vaporizing section.
- a second vaporizing section wherein the second vaporizing section is in thermal contact with a portion of the filter member having a gas permeability disposed in the passage, and a portion other than an outer edge portion of the filter member.
- a heat transfer section for transmitting heat generated by the heating means.
- the residual mist in the gaseous raw material can be vaporized again by the second vaporizing section.
- the mist in the inside can be reduced.
- the heat generated by the heating means is transmitted to the portion other than the outer edge of the filter member by the heat transfer portion, the temperature of the filter member can be made uniform, and as a result, Thus, the mist can be vaporized more uniformly in the filter member or in a wider area.
- local concentration of the raw material hardly occurs, clogging of the filter member can be reduced.
- the filter member since the mist particles generated in the first vaporizing section can be captured by the filter member, high-quality processing using a gaseous raw material can be performed.
- the filter member include those having a porous structure, a plate-like structure having a large number of pores, a structure in which a fibrous substance is compressed, and a mesh structure. Can be mentioned.
- the heat transfer section includes a protrusion provided on the heating means or a member including the heating means, the protrusion protruding toward the filter member, and a member including the heating means or the heating means. It may be either a separate member interposed between the filter member and the filter member, or a projection provided to the heating member or a member including the heating unit and protruding toward the heating member.
- fixing means such as a heating means or a member having a built-in heating means, a heat transfer portion, and fixing screws for fixing at least two of the filter members to each other are provided. Is desirable.
- the temperature controllability of the filter member is improved. I can do it.
- a temperature detection point of a temperature sensor is arranged inside the heat transfer section or the filter member, and the heating means can be controlled by a temperature control circuit or the like based on the output of the temperature sensor.
- a heating means different from the chamber may be provided in the heat transfer section or the filter member. In this case, it is preferable that the temperature of the heat transfer section or the filter member by the heating means is controlled so as to be the same as that of the chamber.
- a second aspect of the present invention is a supply structure of a vaporized raw material, which includes a first vaporization section for vaporizing the raw material, and a second vapor passage provided in a passage of the vaporized raw material vaporized in the first vaporization section.
- a second vaporizer wherein the second vaporizer includes a gas-permeable filter member disposed in the passage, and heating means disposed inside the filter member.
- the filter member can be efficiently heated and the variation in the surface temperature thereof can be reduced. Can be done. For this reason, the mist and solids can be trapped by the filter member, and the attached residual mist can be uniformly vaporized. As a result, it is possible to prevent the residual mist from locally accumulating on the filter member to cause clogging and to prevent generation of particles.
- the first vaporizer can be configured, for example, as a conventionally known vaporizer.
- the vaporizer include a vaporizer having a heated inner surface, and a means for spraying raw materials into the vaporizer.
- the second vaporizer is connected to the downstream side of the vaporizer. It can be configured with a line filter or the like.
- both the first vaporizer and the second vaporizer may be provided in a single vaporizer.
- a reaction processing apparatus semiconductor processing apparatus
- a reaction processing apparatus comprising: a supply structure for a vaporized raw material according to any of the above; and a reaction chamber for reacting a gas raw material supplied by the supply structure.
- This reaction processing apparatus performs various processes by reacting a gaseous raw material in a reaction chamber using energy of a heat source or the like, for example, a semiconductor vapor deposition apparatus, a liquid crystal vapor deposition apparatus.
- CVD apparatus vapor deposition apparatus
- a vaporization chamber for vaporizing a raw material
- a spraying unit for atomizing the raw material into the vaporization chamber
- opening the vaporization chamber to send a gaseous raw material to a raw material supply line.
- a vaporizer having a delivery section for heating, and a heating member that is in thermal contact with a portion other than the outer edge of the filter member, which is installed in the delivery section, and has a gas permeability. And a heat transfer section that transmits the heat generated.
- the residual mist is re-evaporated or the solids are trapped in the delivery section of the vaporizer. For this reason, The amount of mist and solids in the supplied gaseous raw material can be reduced.
- the heat of the heating means is transmitted to a portion other than the outer edge portion of the filter member by the heat transfer portion, variation in the temperature of the filter member is reduced. For this reason, a more uniform re-evaporation action can be obtained, and local deposition (clogging) of the original substance on the filter member can be reduced.
- mist particles generated in the vaporization chamber can be captured, high-quality processing using a gaseous raw material can be performed.
- the temperature controllability of the filter member can be improved.
- a temperature detection point of a temperature sensor is arranged inside the heat transfer section or the filter member, and the heating means can be controlled by a temperature control circuit or the like based on the output of the temperature sensor. You. Further, a heating means may be provided on the heat transfer section or the filter member separately from the champer. In this case, it is preferable that the temperature of the heat transfer section or the filter member by the heating means be controlled to the same temperature as the chamber.
- the section of the filter member where the plurality of heat transfer sections are in thermal contact is perpendicular to the cross section of the delivery section (the direction from the vaporization chamber to the delivery section). That plane) have to desirable and this is substantially uniformly distributed on 0
- a vaporization chamber for vaporizing a raw material, a spraying unit for spraying the raw material into the vaporization chamber, and an opening in the vaporization chamber for discharging a gaseous raw material to a raw material supply line.
- a vaporizer having a discharge section and a filter section, comprising: a gas-permeable filter member provided at the discharge section; and a heating means disposed inside the filter member.
- a shielding plate is disposed between the inside of the vaporization chamber and the filter member.
- the shielding plate By disposing the shielding plate, the mist that has entered the delivery section from the vaporization chamber is less likely to directly contact the filter member. For this reason, the amount of residual mist that directly passes through the sending section without being vaporized in the vaporization chamber can be reduced. As a result, it is possible to avoid a situation in which mist adheres to the filter member and accumulates without being vaporized, or a situation in which a large amount of heat is removed from the filter member and the temperature is locally lowered.
- the filter member be detachably detached by removing only the sending portion, thereby being configured to be detachable. According to this, without disassembling other components of the vaporizer, for example, the spraying means and the entire vaporization chamber, the delivery section is removed, or the filter member is removed simply by disassembling. Can be attached. Therefore, maintenance work such as cleaning and replacement of the filter member can be easily performed.
- a sixth aspect of the present invention is a vaporization chamber for vaporizing a raw material, A position facing the vaporization chamber in a vaporizer having: a fog means for spraying a raw material into the vaporization chamber; and a delivery unit opened to the vaporization chamber and configured to deliver a gaseous raw material to a raw material supply line.
- a shielding plate arranged to cover the sending portion while securing a flow opening portion, and a heat transfer portion that is in thermal contact with the shielding plate and transmits heat generated by the heating means.
- the sixth viewpoint by disposing a shielding plate so as to cover the sending section at a position facing the vaporization chamber, residual mist particles that are not vaporized in the vaporization chamber directly reach the sending section. This can be prevented. Therefore, residual mist particles reaching the raw material supply line can be reduced.
- the heat of the heating means is transmitted to the shielding plate via the heat transfer section, the heated shielding plate itself can also perform the vaporizing action. For this reason, the vaporization efficiency can be improved by vaporizing the residual mist by the shielding plate.
- the gaseous material vaporized by the vaporization chamber or the shielding plate is introduced into the internal space of the delivery part through the above-mentioned flow opening, and is eventually delivered to the material supply line.
- the heat transfer portion that makes thermal contact with a portion other than the outer edge of the shielding plate.
- the temperature uniformity of the shielding plate can be improved.
- a vaporization chamber for vaporizing a raw material
- a spraying unit for spraying the raw material into the vaporization chamber
- an opening for opening the vaporization chamber for discharging a gaseous raw material to a raw material supply line.
- the vaporizer comprises: a shielding plate arranged so as to cover the delivery portion while securing a flow opening at a position facing the vaporization chamber; and a heating means arranged inside the shielding plate.
- the seventh viewpoint by disposing a shielding plate so as to cover the sending section at a position facing the vaporizing chamber, residual mist particles not vaporized in the vaporizing chamber directly reach the sending section. This can be prevented. Therefore, residual mist particles reaching the raw material supply line can be reduced. Further, since the heating means is disposed inside the shielding plate, the heated shielding plate itself can also perform the vaporizing action. For this reason, the vaporization efficiency can be improved by vaporizing the residual mist by the shielding plate.
- the gaseous material vaporized by the vaporization chamber and the shielding plate is introduced into the internal space of the delivery part through the above-mentioned flow opening, and is eventually delivered to the material supply line.
- a vaporizing chamber having a vaporizing surface for vaporizing a raw material, spraying means for spraying the raw material into the vaporizing chamber, and heating means for heating the vaporizing surface of the vaporizing chamber.
- a vaporizer that opens into the vaporization chamber and has a delivery section for delivering a gaseous raw material to a raw material supply line, wherein the vaporizer faces the vaporization chamber separately from the vaporization surface, and is connected to the vaporization chamber to the delivery section.
- a shielding plate is arranged to cover the sending portion while securing a flow opening, and the shielding plate is heated by the heating means or a heating means different from the heating means.
- the set temperature of the shielding plate is the same as the set temperature of the vaporized surface.
- the heating temperature of the shielding plate is the same as that of the vaporized surface.
- the mist can be vaporized in the shielding plate by being set at each time. For this reason, the vaporization efficiency can be improved while preventing the residual mist / solids from flowing into the delivery section by the shielding plate.
- a plurality of heat conducting columns that are in thermal contact with the inner surface of the sending unit and the shielding plate are dispersedly arranged in the sending unit.
- a plurality of heat conducting columns that are in thermal contact with the inner surface and the shielding plate are distributed and arranged at the sending section, so that residual mist that has passed through the flow opening and entered the sending section is captured. And it can be vaporized. Therefore, it is possible to further improve the vaporization efficiency and reduce the number of particles.
- the shielding plate is configured so as not to pass through the sending portion in a straight line from the vaporizing chamber through the flow opening.
- the shielding plate is configured so as not to pass through the sending portion in a straight line from the vaporizing chamber through the flow opening.
- a vaporization chamber for vaporizing a raw material
- a spraying unit for spraying the raw material into the vaporization chamber
- an opening to the vaporization chamber for discharging a gaseous raw material to a raw material supply line.
- a filter member installed in the discharge unit, and disposed so as to cover the filter member while securing a flow opening at a position facing the vaporization chamber.
- a heated shielding plate is provided.
- a filter member is installed in the delivery section, and a shielding plate is provided so as to cover the filter member at a position facing the vaporization chamber.
- a vaporizing chamber having a vaporizing surface for vaporizing a raw material, a fogging means for spraying the raw material into the vaporizing chamber, and a heating means for heating the vaporizing surface of the vaporizing chamber.
- a delivery unit that opens into the vaporization chamber and delivers a gaseous raw material to a raw material supply line, wherein a finolator member disposed in the delivery unit and the filter member are provided.
- a shielding plate that is disposed on the vaporization chamber side, faces the vaporization chamber separately from the vaporization surface, and shields the filter member so as to cover the filter member while securing a flow opening from the vaporization chamber to the delivery unit.
- the filter member and the shielding plate are heated by the heating unit or a heating unit different from the heating unit, and a set temperature of the filter member and the shielding plate is: Same as the set temperature of the vaporizing surface
- the mist is vaporized in the filter member and the shield plate by setting the heating temperature of the filter member and the shield plate to the same temperature as the vaporized surface. It can be done. For this reason, the filter member and the shield plate prevent the residual mist and solids from flowing into the delivery section, and the shield plate also prevents the filter from flowing. Evaporation efficiency can be improved while limiting the amount of residual mist reaching the filter member.
- the shielding plate is configured so that a virtual straight line introduced from the vaporization chamber to the flow opening does not reach the filter member. According to this, it is possible to reduce the possibility that the residual mist entering the delivery section from the vaporization chamber through the flow opening directly passes through the filter member. As a result, the clogging of the filter can be further reduced, and in particular, the concentration of sediment on a part of the filter can be suppressed.
- the distance between the filter member and the shielding plate is preferably in the range of 1 to 10 Omm, and more preferably in the range of 1 to 10 Omm. Most preferably, it is about 5 mm.
- the shielding plate is disposed so as to cover the entire surface of the filter member when viewed from the vaporization chamber side. This can prevent the mist or solids that have entered from the vaporization chamber from directly going to the filter member.
- the shielding plate is configured to protrude further around the entire periphery than the outer edge of the filter member. This is more desirable.
- an outer edge of the filter member is fixed to an inner surface of the sending section.
- the flow opening is provided so as to allow the vaporization chamber and the filter member to communicate with each other around the entire periphery of the shielding plate. According to this, the gaseous raw material can be smoothly circulated from the circulation opening to the filter member, and the mist and solid matter trapping location by the filter member can be uneven. Can be reduced.
- the gap is preferably in the range of 0.5 mm to 10 O mm, more preferably 1 O mm or less, and about 2 mm. That is most desirable.
- the flow opening is provided around the shielding plate.
- the shield plate can be configured in a simple structure, and maintenance such as cleaning of the shield plate and the vicinity of the circulation opening becomes easy.
- the opening width of the circulation opening (the distance between the shielding plate and the inner surface of the sending section on the outer peripheral side thereof) is preferably 0.5 mm or more and 10 mm or less, particularly 1 mm. More preferably, it is more preferably about 2 mm.
- the flow path of the gaseous raw material from the vaporization chamber to the delivery section includes a first flow path defined by the opening width of the communication opening, and a filter member that communicates with the first flow path. And a second flow path defined by the distance from the shielding plate.
- the mist which has entered from the first flow path, is prevented from proceeding linearly and reaching the second flow path.
- the flow path of the gaseous material includes a third flow path defined by a gap between the shielding plate and the outer edge of the filter member.
- the third flow path is provided so as to communicate the first flow path with the second flow path.
- the third flow path is formed so that the mist that has entered from the first flow path and the solid matter proceeds linearly and does not reach the second flow path. I prefer to be done.
- the filter member is preferably a plate-like material provided with a large number of pores penetrating in the flow direction of the gaseous raw material.
- the filter member is preferably a plate-like material provided with a large number of pores penetrating in the flow direction of the gaseous raw material.
- An eleventh aspect of the present invention is a reaction processing apparatus, comprising: the vaporizer according to any of the above; and a reaction chamber for reacting a gaseous raw material supplied from the vaporizer.
- the reaction processing apparatus performs various processes by reacting a gaseous raw material in a reaction chamber in some manner such as applying heat energy.
- the present invention widely covers semiconductor processing devices such as a body vapor deposition device, a liquid crystal vapor deposition device, a compound semiconductor vapor deposition device, and a vapor etching device. In particular, it is effective in the case of a vapor deposition system (CVD system).
- CVD system vapor deposition system
- FIG. 1 is a schematic sectional view showing a structure of a vaporizer according to a first embodiment of the present invention.
- FIG. 2A is a schematic internal side view showing the structure of a delivery unit of the vaporizer of the first embodiment
- FIGS. 2B, 2C, and 2D are internal side views showing a modification of the first embodiment.
- 3A and 3B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a second embodiment of the present invention.
- 4A and 4B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a third embodiment of the present invention.
- FIG. 5A and 5B are a schematic internal side view_ and a schematic longitudinal sectional view showing a main part of a vaporizer according to a fourth embodiment of the present invention
- FIG. 5C is a schematic sectional view showing a modification of a heating means.
- 6A and 6B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a fifth embodiment of the present invention.
- FIG. 7A and 7B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a sixth embodiment of the present invention.
- 8A and 8B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a seventh embodiment of the present invention.
- FIGS. 10A and 10B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to an eighth embodiment of the present invention.
- FIGS. 10A and 10B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a ninth embodiment of the present invention.
- 11A and 11B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a tenth embodiment of the present invention.
- 12A and 12B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a first embodiment of the present invention.
- FIGS. 13A and 13B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a 12th embodiment of the present invention.
- 14A and 14B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a thirteenth embodiment of the present invention.
- FIG. 15 is a schematic vertical sectional view showing a vaporizer according to a 14th embodiment of the present invention.
- FIG. 16 is a cross-sectional view showing the vaporizer of the fourteenth embodiment along the line AA in FIG.
- 17A and 17B are schematic longitudinal sectional views showing a vaporizer according to a fifteenth embodiment and a sixteenth embodiment of the present invention.
- FIGS. 18A and 18B are schematic longitudinal sectional views showing a vaporizer according to a 17th embodiment and an 18th embodiment of the present invention.
- FIG. 19 is a schematic longitudinal sectional view showing a vaporizer according to a nineteenth embodiment of the present invention.
- FIG. 20 AB is a schematic front view and a schematic side view showing a modification of the spraying means.
- FIG. 20 CD is a schematic front view and a schematic side view showing another modification of the spraying means.
- FIG. 21 shows a reaction processing apparatus (semiconductor) according to an embodiment of the present invention.
- FIG. 22 is a schematic configuration diagram showing the internal configuration of the raw material supply unit.
- FIG. 23 is a schematic configuration diagram showing a reaction processing apparatus (semiconductor processing apparatus) according to another embodiment of the present invention.
- FIG. 24 is a graph showing the change over time of the internal pressure of the vaporization chamber between the vaporizer of the second embodiment and a conventional vaporizer.
- FIG. 1 is a schematic sectional view showing the structure of the vaporizer according to the first embodiment of the present invention.
- the vaporizer 100 has a vaporizing surface 110B corresponding to a first vaporizing section and a vaporizing chamber 110 constituting a vaporizing space 11OA.
- a spraying means 120 is provided to spray the liquid raw material into the vaporizing space 110A.
- a delivery unit 130 corresponding to a second vaporization unit is detachably attached to the vaporization chamber 110.
- a detection pipe 13 9 for installing a pressure gauge (capacitance manometer: not shown) is provided in order to detect the internal pressure of the vaporization space 11 1 OA.
- a detection pipe 13 9 for installing a pressure gauge (capacitance manometer: not shown) is provided.
- a filter member 1339X is attached to the opening of the vaporization chamber 110 communicating with the pipe 139.
- Filter element 1339X prevents mist or solids from entering the pressure gauge.
- the filter member 1339X is tightly fixed to the opening edge by the mounting member 1339y.
- the vaporization chamber 110 has a housing wall 111 and heating means 112 such as a heater installed in the housing wall 111.
- the housing wall 1 1 1 1 has an opening 1 1 1 a for mounting the fog means 1 20 .
- the atomizing means 120 has a raw material supply pipe 121 'for supplying a liquid raw material such as an organic metal raw material or a raw material obtained by dissolving an organic metal raw material in a solvent.
- Spraying spray unit 1 2 0 may also, argon gas of which ⁇ gas (e.g.
- a r, N e, N 2 ) and atomizing gas supply pipe 1 2 2 supplies, the above raw material Mist-like The fog fog nozzles 1 2 3 and.
- the spray nozzles 123 emit a raw material (a liquid, for example, an organometallic material) and a spray gas from individual pores to form a mist.
- the delivery section 130 is a section for sending the gaseous material that has been vaporized in the vaporization space 110A to the supply line 141.
- the delivery section 130 has a side wall 131, and an internal space 130A is formed in a concave shape on the side of the side wall 131 on the side of the vaporizing space 110A.
- a column-shaped heat transfer section is provided to protrude into the internal space 13 O A in a convex shape.
- Heating means 13 2 such as a heater is arranged inside the side wall 13 1 (accommodation hole 13 1 a, see Fig. 2).
- the internal space 130 A of the delivery unit 130 communicates with the vaporizing space 110 A and the supply line 141.
- the sending unit 130 may be arranged on any side of the vaporization space 110A as long as it faces the vaporization space 111A.
- a filter member 13 33 is arranged so as to cover the outlet (gas outlet) 13 1 SO to the supply line 14 1.
- Filter members 1 3 3 are made of air-permeable filters. It is possible to use the one configured as a data plate. Examples of such a filter member include a porous material, a filter plate having a large number of fine particles, a material obtained by compacting fibers, and a mesh material. More specifically, a metal fiber (for example, about 180 ° C. to 350 ° C., which is appropriately set depending on the vaporization temperature and decomposition temperature of the raw material) (for example, about 180 ° C.
- a filter material obtained by solidifying stainless steel fiber into a nonwoven fabric or sintered shape.
- the diameter of the metal fiber is about 1.3 to 3.0 mm.
- a sintered material obtained by sintering spherical or other granular materials having high thermal conductivity examples include non-metal materials such as ceramics and quartz, and non-ferrous metals such as stainless steel, aluminum, titanium and nickel, and alloy materials thereof. I can do it. Note that the range of the above-described aspect regarding the structure and material of the filter member is common to all the embodiments described below. '
- FIG. 2A is an internal side view showing the appearance of the sending unit 130 viewed from the vaporizing space 110A side.
- the outer edge of the filter member 133 is in contact with and fixed to the surrounding side wall 13 1 so as to cover the entire flow section of the internal space 13 OA. More specifically, the outer edge of the filter member 133 is fixed to the side wall 13 1 with fixing screws 13 and the like. Except for the outer edge portion of the filter member 133, heat transfer portions 135 and 137 projecting inward from the side wall 1331 are provided. More specifically, the filter member 133 is in thermal contact with the side wall 131 via the heat transfer portions 135, 137. That is, the heat transfer portions 135 and 135 also function as support members for supporting the filter member 133.
- the heat transfer sections 135 and 135 are made of a metal having good heat conductivity (for example, stainless steel).
- the heat transfer section 135 has a columnar shape with an oval cross section, and the heat transfer section 135 has a columnar shape with a circular cross section.
- These heat transfer sections 135, 137 are heated by a heating means such as a heater arranged in the side wall 131, in the illustrated example.
- the heat transfer section may be constituted by the heating means itself, or the heating means may be embedded inside the heat transfer section.
- a shielding plate 134 is disposed on the vaporizing space 110A side of the filter member 133.
- the shield plate 1 34 is made of, for example, a heat conductive metal material such as stainless steel.
- the shielding plate 134 faces the vaporizing space 110A, and prevents the raw material mist sprayed from the spray nozzle 123 from directly adhering to the filter member 133. .
- the shielding plate 13 4 is basically arranged so as to cover the filter member 13 3 in a planar manner.
- the space portion 130D is heated by the heat of the shield plate 134 and the filter member 133 via the heat transfer portions 135, 137.
- a flow opening 1 3 4 b is provided around the shielding plate 1 3 4, Through the flow opening 13 4 b, the vaporized space 11 OA communicates with the internal space 13 OA, and the vaporized gaseous raw material is efficiently delivered.
- an opening 134a is formed on the side of the spray nozzle 123. Since the opening area of the above-mentioned gap increases due to the opening portion 134a, the gaseous raw material flowing from the vaporizing space 110A to the internal space 130A where the filter member 133 is disposed is discharged. It becomes easy to flow.
- the opening 1 34 a is formed because the spray angle range of the spray nozzle 123 is substantially limited, so that the spray nozzle 123 on the side of the spray nozzle 123 is formed. This is because the mist sprayed from 3 is difficult to reach the sending section 130 directly.
- FIG. 2B, 2C, and 2D are internal side views showing modified examples of the shield plate.
- an opening 13 4 a ′ is formed continuously or along the entire outer periphery at a position overlapping the filter member 13 3.
- the shielding plate 1334 ⁇ shown in FIG. 2C a plurality of openings 134a ⁇ are discretely formed along the outer periphery so as to correspond to the outer periphery of the filter member 133.
- the opening formed in the shielding plate may have a slit shape (including a concentric shape).
- the shielding plate 134X covers the entire filter member 133.
- the communication opening between the vaporizing space 11 OA and the internal space 13 0 A can be sufficiently obtained by the flow opening 13 4 b (see FIGS. 1 and 2A) around the shielding plate.
- the shielding plate 13 4 X covers the entire filter member 13 3
- the residual mist of the raw material directly passes through the filter member 13. 3 has the advantage of being less likely to adhere.
- the shielding plate 13 4 is fixed to the heat transfer section 135 through a spacer 13 36 together with the filter member 13 33.
- the spacer 136 is made of a material having good heat conductivity, for example, metal such as A1 or stainless steel, ceramics, or the like.
- the fixing screw 1336a is a fixing means for fixing the shielding plate 1334 and the spacer 1336 to the heat transfer section 135.
- a similar fixing means is used to fix the filter member 133 to the heat transfer section 133.
- the filter member 133 and the shielding plate 134 receive the heat released from the heating means 132, which makes thermal contact via the heat transfer portion 135 and the spacer 132, and the vaporizing space. It is heated by receiving radiant heat from the inner surface of the casing wall 1 11 of the vaporization chamber 1 1. 1 facing the 110 A.
- the raw material supplied from the raw material supply pipe 122 is atomized into the vaporization space 110A at the spray nozzle 123. A part of the mist of the sprayed material evaporates during flight, and another part is heated by heating means 1 1 2
- the vaporization chamber 110 is heated by the heating means 112 to a temperature range lower than the decomposition temperature of the raw material and higher than the vaporization temperature of the raw material. Is performed. This temperature is, for example, about 100 to 350 ° C.
- the gaseous raw material thus generated in the vaporizing space 110A passes through the filter member 133 from around the shielding plate 134 and is introduced into the internal space 13OA. Internal space introduced into 13 OA The gaseous raw material contains minute residual mist that is not vaporized in the vaporization space 110A. The residual mist reaches the filter member 133 and is captured, where it is transmitted from the heating means 132 to the filter member 133 via the heat transfer portions 135 and 137. It is heated by the obtained heat and re-vaporized. It is preferable that the filter member 13 3 is also heated so as to have substantially the same temperature range as that of the vaporization chamber.
- the above-mentioned heat transfer sections .135 and 137 are distributed almost uniformly over the entirety of the filter section Neo133 on the cross section of the flow path of the gaseous raw material. . This makes it possible to heat the filter member 133 more uniformly, improve the vaporization efficiency of the residual mist, and clog the filter member. Can be further reduced.
- the outer edge of the filter member contacts (connects and fixes) the inner surface of the sending portion, so that the outer edge also receives heat from the inner surface and is heated.
- the filter member may be heated by providing a heating means in the heat transfer section.
- the shielding plate 13 4 prevents the mist sprayed by the spray nozzle 123 from directly reaching the filter member 133. This prevents the filter member 133 from being deprived of heat by a large amount of mist, and as a result, the ability to vaporize the attached mist is partially reduced at a predetermined location. You. Therefore, by clogging at the location, it is possible to prevent a decrease in the amount of the gaseous raw material to be delivered and an increase in the pressure in the vaporization chamber.
- the sending section 130 can remove the filter member 133 easily by removing the side wall 131 from the casing wall 111. Be composed.
- the filter member 133 can be removed and cleaned very easily and quickly, or a new filter member can be used. It can be replaced with a member. As a result, maintenance time is shortened, the operation rate of the equipment is improved, and the yield is improved.
- the shield plate 134 is also heated. For this reason, when the raw material mist in the vaporizing chamber 11 OA directly hits the shielding plate 13 4, the mist is vaporized also on the surface of the shielding plate 13 4. However, when the mist hits the shield plate 134 and evaporates, the temperature of the shield plate 134 decreases due to the loss of heat of vaporization. The amount of decrease in the temperature of the shield plate 134 also changes due to the fact that the amount of mist that hits the shield plate 134 changes in accordance with the amount of the liquid material to be sprayed. Normally, the temperature of the shielding plate 134 is about 5 to 15 ° C lower than the set temperature of the vaporization chamber 110.
- the filter member 133 may be arranged at a position close to the delivery path side with respect to the shielding plate 134.
- the distance 13 OD between the filter member 13 3 and the shielding plate 13 4 is in the range of 1 to 10 O mm, particularly, in the range of 1 to 5 O mm. And more preferably in the range of 2 to 1 O mm. Typically, it is most desirable that the distance be about 5 mm. If the above distance becomes smaller than the above range, The conductance of the gaseous raw material decreases, and the substantial adhesion range of the residual mist to the filter member 133 also decreases. In this case, there is a possibility that solid matter will be intensively deposited on a part of the filter member 133. In addition, when the above distance is increased, the conductance of the gaseous raw material is improved, and the local solid adhesion of the filter member 133 is reduced, but instead the vaporizer becomes larger. Invite.
- the opening width of the above-mentioned flow opening portion 134b which is the distance between the outer edge of the shielding plate 134 and the side wall 131 disposed on the outer peripheral side thereof, is required to secure the conductance of the gaseous raw material. It is preferably 0.5 mm or more and 1 Omm or less, more preferably 1 mm or more. However, as the opening width increases, the risk that the mist directly reaches the filter member 133 increases, so it is most preferable that the opening width is about 2 mm.
- the gap between the outer edge of the shielding plate 13 4 and the filter member 13 3 disposed on the side of the inner space 130 A is 0.5 mm or more: L is preferably within the range of 0 mm, and 0.5 mm or more: more preferably within the range of LO mm. Further, it is most desirable that this interval be about 2 mm. When this interval is reduced, the conductance of the gaseous raw material decreases. Conversely, when the distance is increased, the mist that has entered from the flow opening 130B easily reaches the filter member 133 directly.
- the flow path of the gaseous raw material from the vaporization chamber 11 OA to the delivery section 130 is the first flow path defined by the opening width of the communication opening section 134 b described above. And a second flow path defined by the distance between the filter member 133 and the shielding plate 134 communicating with the first flow path.
- the mist and solid matter that has entered from the first flow path are linearly advanced so as not to reach the second flow path.
- the flow path of the gaseous raw material is the third flow path defined by the gap between the shielding plate 134 and the filter member 133.
- the third channel portion is disposed so as to communicate the first channel portion and the second channel portion.
- the third flow path is formed so that the mist that has entered from the first flow path and the solid matter advances linearly and does not reach the second flow path. It is preferred that it be composed.
- FIGS. 3A and 3B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a second embodiment of the present invention.
- FIGS. 3A and 3B show a delivery unit 150 which can be used in place of the delivery unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as in the first embodiment. It is.
- the delivery portion 150 has a side wall 151, and an inner space 150A is formed in a concave shape on the side of the side wall 151 on the vaporization space side.
- Inside the space 150A there are provided heat transfer portions 1505 and 157 which protrude from the side wall 1501 in a convex shape.
- Inside the side wall (accommodation hole 15 la) the same heating means 15 2 as described above is arranged.
- the internal space 15 OA communicates with the transmission path 15 OS.
- the same filter member 15 3 as described above is arranged in the internal space 15 OA.
- the filter member 15 3 is provided on the inner surface of the side wall 15 1. Thermal contact is made with the protruding heat transfer portions 15 5 and 15 7 as in the embodiment.
- the heat transfer portion 155 is a columnar portion having an elongated cross-sectional shape such as an oval shape.
- the heat transfer section 157 is a columnar section having a circular cross-sectional shape.
- the columnar portion may have any shape as long as the columnar portion is in surface contact with the filter member 153 or the shielding plate 154 and easily conducts heat.
- the shape of the column can be rhombus, triangle, star, rectangle, or round.
- the outer edge of the filter member 15 3 is fixed to the side wall 15 1 by a fixing screw 15 58 or the like.
- the number and arrangement of the heat transfer sections 155 and 157 are set so that heat can be uniformly transmitted to the filter member 153.
- a shield plate 154 is attached and fixed to the heat transfer portions 155, 157 via spacers 156 with fixing screws 156a. Shield
- a space 150D is formed between the filter member 153 and the filter member 153 over the entire surface of the filter member 153.
- the shielding plate 154 is disposed at a position facing the vaporization chamber of the delivery unit 150. Shield plate 1
- the shielding plate 154 is configured so as to cover the entire filter member 153 in a plane, and a circle provided between the outer edge of the shielding plate 154 and the surrounding side wall 155.
- the circumferential gap is the opening 150B.
- the filter member 15 3 receives not only the heat of the heating means 15 2 directly from the side wall 15 1 at the outer edge thereof, but also the heat transfer portion 1 which is in thermal contact with a portion other than the outer edge. It is configured to receive the heat of the heating means 152 through 55,157.
- the shield plate 154 is heated by the filter member 153 and the heat transfer portions 155, 157 through the spacer 156 for a period of time.
- the gaseous material vaporized in the vaporization chamber is introduced into the internal space 15 OA of the delivery section 150 through the flow opening section 15 OB and the filter member 15 3 After passing, it is configured to be sent out from the delivery line 1.50S to the supply line.
- any virtual straight line reaches the filter member 1553. It is configured not to. In other words, no matter what linear flight path the residual mist in the vaporization chamber enters the delivery section 150, it remains.
- the mist does not directly adhere to the filter member 153. Further, it is configured such that the mist-like raw material does not directly reach the filter member 153.
- the radial direction of the flow opening 150B is set so that the linear flight path passing through the flow opening 150B does not reach the filter portion of the filter member 1503.
- the opening width is set.
- each section of the sending section 150 are the same as in the first embodiment.
- a radial opening of 15 OB with a flow opening The width is 2 mm
- the axial distance between the outer edges of the shielding plate 15 54 and the filter member 15 3 is 2 mm
- the axial distance between the shielding plate 15 4 and the filter part of the filter member 15 3 is 5 mm
- the radial width of the outer edge of the filter member 153 is 4 mm
- a temperature sensor for example, a thermocouple 15 9 introduced into a hole 15 1 b provided in a side wall 15 1 is provided inside a heat transfer section 1.55 having an extended planar shape.
- the output of the temperature sensor 159 is connected to a temperature control circuit CONT or the like, and the temperature control circuit CONT controls the heating means 152 based on the output of the temperature sensor 159. It is composed of This temperature control is preferably controlled to the same temperature as the other heating means (means for heating the vaporization chamber) based on the output of the temperature sensor 159.
- the temperature of the heat transfer section 15 5, the filter member 15 3, and the housing wall 1 1 1 are controlled independently of the other heating means 1 1 2 so that the temperatures of the vaporization chamber are the same. It may be configured so that With this configuration, it is possible to precisely control the temperature of the filter member 153 and the shielding plate 154. it can. For this reason, clogging of the filter member 153 can be reduced, and a pressure increase in the vaporization chamber is suppressed. In addition, residual mist and particles can be reduced.
- the temperature of the heat transfer section 1555 that is, the filter member 1553 and the shielding plate 1554 are detected to control the heating means 152.
- the controllability of the temperature of the metal shield plate 154 is improved. Therefore, the temperature drop of the shielding plate 154 can be reduced more than in the first embodiment.
- the set temperature of the heating means 15 2 be the same as the set temperature for the vaporization chamber.
- the filter member 1553 may be disposed at a position near the delivery path 15.0S side of the shielding plate 1554.
- the distance between the filter member 153 and the shielding plate 1554 is in the range of 1 to 10 Omm, and particularly preferably in the range of 1 to 5 Omm. And more preferably in the range of 2 to 1 Omm. Typically, it is most desirable that the distance be about 5 mm. If the above distance is smaller than the above range, the conductance of the gaseous raw material will decrease, and the substantial adhesion range of the residual mist to the filter member 153 will also narrow. In this case, there is a possibility that solid matter is concentrated on a part of the filter member 153.
- the opening width of the flow opening portion 150B which is the distance between the outer edge of the shielding plate 154 and the side wall 151 arranged on the outer peripheral side thereof, is required to secure the conductance of the gaseous raw material. It is preferably 0.5 mm or more and 10 mm or less, more preferably 1 mm or more. However, as the opening width increases, the risk that the mist directly reaches the filter member 1553 increases. Therefore, it is most preferable that the opening width is about 2 mm. This point is the same in the embodiments described below.
- the flow path width within 15 O A) is 0.5 mn! It is preferably in the range of ⁇ 10 Omm, and more preferably in the range of 0.5 mm ⁇ : LOmm. Furthermore, it is most desirable that this interval be about 2 mm. When this interval is reduced, the conductance of the gaseous raw material is reduced. Conversely, when the interval is increased, the mist that has entered from the flow opening 150B directly enters the filter member 1553. It will be easier to reach. This point is the same in the embodiments described below.
- the flow path of the gaseous raw material from the vaporization chamber to the delivery section 150 communicates with the first flow path section defined by the opening width of the communication opening section 150 B and the first flow path section. And a second channel portion (space portion 150D) defined by an interval between the filter member 153 and the shielding plate 1554.
- the mist or the solid material entering from the first flow path is configured so as not to travel straight and reach the second flow path.
- the flow path of the gaseous raw material includes a third flow path defined by a gap between the shielding plate 154 and the outer edge of the filter member 153, and the third flow path is formed by a third flow path.
- the first flow path and the second flow path are provided so as to communicate with each other.
- the provision of the third flow path portion prevents the mist and solids entering from the first flow path portion from proceeding linearly and reaching the second flow path portion. It is preferred that it be composed. This is the same in the embodiments described below.
- 4A and 4B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a third embodiment of the present invention.
- 4A and 4B are used in place of the delivery unit 130 of the vaporizer shown in FIG. 1 and show a delivery unit 150 'that can be used, and the other parts are the same as those of the first embodiment. Is the same as In the transmitting section 150, the same portions as those in the second embodiment are denoted by the same reference numerals.
- the inner space 150A is connected to the outside '(aside from the delivery path 150S connecting the inner space 150A to the supply line to the reaction processing device on the side wall 151'.
- a discharge path 150 C communicating with the exhaust line of the reaction processing device) is formed.
- the discharge path 150C is formed at a position furthest away from the spray nozzle, that is, at the lower end in the drawing.
- the discharge path 150 C is connected to a discharge line such as a pipe line (evacuation line) that is exhausted without passing through a reaction processing section of a reaction processing apparatus described later. You.
- the discharge path 150 C is used to exhaust the gaseous raw material without introducing it into the reaction processing section until the supply state of the gaseous raw material is stabilized.
- an opening 153a ' is formed in the filter member 153' at a plane position corresponding to the discharge path 15OC.
- the opening edge of the opening portion 15 3 ′ is provided as a part of the outer edge portion of the filter member 15 3 ′, and a fixing screw 15 8 ′ for fixing the filter member 15 3 ′. Discharge without any gaps by connecting to ⁇ 150C.
- the gaseous raw material that has entered the internal space 150A through the flow opening 150B while avoiding the shielding plate 154 is discharged from the discharge line connected to the discharge path 150C.
- the valve V2 provided in the opening is opened, the gas is directly discharged through the opening 153a 'and the discharge path 150C.
- the supply line valve VI connected to the delivery path 15 OS is closed. Therefore, the gaseous material that is not sent to the reaction processing section does not pass through the filter member 15'3 ', so that the life of the filter member 153' can be extended.
- valve V2 of the discharge line connected to the discharge path 150C When flowing the gaseous raw material to the supply line, the valve V2 of the discharge line connected to the discharge path 150C is closed, and the valve VI of the supply line is opened. As a result, the gaseous raw material that has been discharged from the discharge path 150 C until now passes through the filter 153 ′, and is led from the discharge path 150 S to the supply line.
- FIGS. 5A and 5B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a fourth embodiment of the present invention.
- FIGS. 5A and 5B show a delivery section 150 ⁇ which can be used in place of the delivery section 130 of the vaporizer shown in FIG. 1 and other parts. Is the same as in the first embodiment.
- the same parts as those in the second embodiment are denoted by the same reference numerals.
- the heating means 15 2 ′′ is inserted into the inside of the side wall 15 1 ((accommodation hole 15 1 a) with the heat transfer section 15 7 ′′ joined to the tip of the heating means 15 2 ′′.
- the heat transfer section 157 ⁇ projects into the inner space 150A and makes thermal contact with the filter member 153 and the shielding plate 154 in the same manner as in the above embodiments. Is, for example, a rod-shaped heater, and the heat transfer portion 157 ⁇ is directly joined to the filter member 153 and the shielding plate 1 via the heat transfer portion 15 ⁇ ”. It is configured so that the heating of 54 can be performed efficiently.
- a heat transfer portion 155 having a planar shape extended in the same manner as in the above embodiments is provided.
- One part of the heat transfer portion 157" is formed by a side wall. The heat transfer portion is inserted from the inside of the heat transfer portion and protrudes into the internal space 150 A. That is, the heat transfer portion 155 "is configured so as to include one of the heat transfer portions 157 ⁇ You.
- a screw hole is formed at the tip of the heat transfer section 157 ⁇ .
- the filter member 15 3, spacer 15 6 and shielding plate 15 4 are sequentially stacked on the end of the heat transfer section 15 7 ".
- the fixing screw 15 56 a The filter member 15 3 and the shielding plate 15 4 are fixed to the heat transfer section 15 7 ′′ by screwing in.
- FIG. 5C shows a modification of the above heating means 152 and the components connected thereto.
- the heating means 15 2 S “shown in Fig. 5C has a bolt embedded at the tip of a rod-shaped heater. Things. Instead of the spacer 1556, prepare a nut 152 "to be screwed to the above bolt, and fix it to the nut 1552 /; ;. providing a heating means 1
- a filter member 15 3 is placed between the 5 2 S ”and the nut 15 2 T”, and a shielding plate 1 5 4 is placed between the nut 15 2 T and the fixing screw 15 2 U ⁇ . Place. In the second state, the heating means 15 2 S and the fixing screw 15 2 U ⁇ are fixed via the nut 15 2.
- the heat transfer section 157 can be constituted by a part of the heating means 152 ”.
- the filter member 153 and the shielding plate 155 can be formed. 4 can be more efficiently heated, so that the temperature drop of the shielding plate 15 4 can be further reduced, and in this case, the set temperature of the heating means 15 2 It is preferable to set the same as the set temperature.
- FIGS. 6A and 6B are a schematic internal j-law plan view and a schematic longitudinal sectional view showing a main part of an air carburetor according to a fifth embodiment of the present invention.
- FIGS. 6A and 6B show a delivery unit 160 that can be used in place of the delivery unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as in the first embodiment. It is.
- the delivery section 160 has a side wall 161, and heating means 162 arranged inside the side wall 161 (accommodation hole 1661a).
- a shielding plate 16 4 is fixedly attached to the side wall 16 1 from the inside (the vaporization chamber side).
- the inner space 160A is defined between the side wall 161 and the shielding plate 1664, and communicates with the delivery path 160S.
- Interior space 1 6 The outer edge of the filter member 163 is fixed to the OA by fixing screws 168 and the like.
- a plurality of heat transfer portions 165 and 167 protruding from the inner surface of the side wall 161 are in thermal contact with portions other than the outer edge of the filter member 163.
- a spacer 1666 is interposed between the filter member 163 and the shielding plate 1664, and the heat transfer sections 1665, 1666, and the filter are fixed by the fixing screw 1666a.
- the filter member 16 3 and the shielding plate 16 4 are fixed.
- a space 160D is formed between the filter member 163 and the shielding plate 1664 over the entire surface of the filter member 1663. Then, a space through which the vaporized gas passes is formed between the filter member 163 and the shielding plate 164. After the gas passing through this space passes through the filter 163, the delivery path 16 is formed. . Flows to 0 S.
- the heat transfer section 165 has an extended planar shape, and inside the heat transfer section 165, a temperature detection point of the temperature sensor 169 similar to that in each of the above embodiments is arranged.
- the shield plate 164 is formed with a flow opening 164A in which a plurality of planar shapes are formed in a slit shape. These flow openings 1664 A have a shape that is bent (refraction is extremely curved) in the thickness direction of the shield plate 164, and the residual mist that has entered from the vaporization chamber side is directly filtered. It is configured so that it does not reach 16 3. That is, the flow opening 164A is configured such that all virtual straight lines entering the flow opening 164A from the vaporization chamber side do not directly reach the filter member 1663. As a result, most of the residual mist contacts the shielding plate 164 at least once, and then enters the internal space 16 OA ⁇ .
- the plurality of flow openings 1664A may be formed in the plane of the shielding plate 1664 so as to be parallel to each other, or may be formed so as to be concentric. Good.
- the flow opening can be formed in the shielding plate.
- the above-mentioned flow opening may be configured so that there is no virtual straight line that directly reaches the filter member from the vaporization chamber side through the flow opening. Therefore, even if it does not have the bent hole shape as described above, it does not face the filter member at the flow opening. Then, the same effects as above can be obtained.
- 7A and 7B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a sixth embodiment of the present invention.
- 7A and 7B show a delivery section 160 'which can be used in place of the delivery section 130 of the vaporizer shown in FIG. 1, and the other portions are the same as those of the first embodiment. The same is true.
- the same parts as those in the fifth embodiment are denoted by the same reference numerals.
- the shield plate 16 4 ′ is formed with a flow opening 16 4 A ′.
- the flow opening portion 1664A ' is formed in a region outside the region overlapping with the filter member 163 when viewed in a plan view, that is, at a position shifted to the outer peripheral side from the filter member 1663. Thus, it is configured such that all virtual straight lines that enter the flow opening 164A 'from the vaporization chamber side do not reach the filter member 163.
- the flow opening 164A ' has an arc-shaped slit shape.
- the plurality of flow openings 164A ' may be formed concentrically at equal intervals.
- the heating means 16 2 is controlled based on the output of the temperature sensor 16 9, and the temperature of the shielding plate 16 4 ′ is controllable as in the previous embodiment.
- a heating means 164 H ′ composed of a wire-shaped heater or the like is passed through the inside of the shielding plate 164 to directly heat the shielding plate 164 ′. Heating means 1 6
- the heating means 164 H ' is introduced into the shielding plate 164' from outside, but the heating means 164 H 'may be embedded in the shielding plate 164'.
- the linear heating means 16 4 H ' may be arranged so as to form a lattice or a spiral. Further, a plurality of heating means 164 H 'may be introduced into the shielding plate 164'.
- a temperature detection point of the temperature sensor 164 TC ' is also arranged inside the shielding plate 164'.
- the heating means 164H ' is controlled by the temperature control circuit CONT based on the temperature detected by the temperature sensor 164TC', and the temperature of the shielding plate 164 'is directly and independently controlled.
- the temperature of the shielding plate 16 4 ′ can be set precisely to the optimum temperature, and the vaporization state of the mist by the shielding plate 16 4 ′ can be stabilized.
- the temperature controllability of the shielding plate is improved. For this reason, the raw material can be more efficiently vaporized, and residual mist and particles can be reduced.
- FIGS. 8A and 8B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a seventh embodiment of the present invention.
- FIGS. 8A and 8B show a delivery unit 15OX which can be used in place of the delivery unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as in the first embodiment. It is.
- the sending unit 15OX the same parts as those in the second embodiment are denoted by the same reference numerals.
- This embodiment has the same basic structure as that of the second embodiment, but has the same heat transfer sections 15 5 and 15 7, spacers 15 6 and fixing screws 15 56 a as those of the second embodiment. The difference is that more heat conducting columns are provided, and these are dispersed in the internal space 150A. These heat conducting columns are in thermal contact with the filter member 1553X and the shielding plate 1554X as in the second embodiment. The heat conduction column is in thermal contact with the inner surface of the side wall 15 1 X and the shielding plate 15 4 X.
- the residual mist that has entered with the gaseous raw material from the vaporization chamber through the flow opening section 15 OB is heated. Contact with conductive pillars.
- the residual mist is heated by Since it is converted into a gaseous raw material, the vaporization efficiency can be improved.
- FIGS. 9A and 9B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to an eighth embodiment of the present invention.
- FIGS. 9A and 9B show a sending unit 150Y which can be used in place of the sending unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as those of the first embodiment. The same is true.
- the same parts as those in the second embodiment are denoted by the same reference numerals.
- a plurality of columnar heat transfer portions 1557Y are formed on the side wall 151Y, and fixing screws 1556a are formed on the heat transfer portions 1557Y. Y is fixed.
- no filter member is provided, and instead, a heat conduction column composed of a large number of heat transfer portions 157 Y is formed by the inner surface of the side wall 151 Y and the shield plate 154 Y. Are distributed between and.
- the heat conduction column has the same function as the filter, and captures and regenerates residual mist and particles entering the internal space 15 OA from the flow opening ⁇ 15 OB. It is configured to evaporate.
- the shielding plate 1554Y is provided so as to cover the outlet (gas outlet) 15OSO to the delivery path 150S, and the shielding board 1554Y is connected to the delivery path 150S.
- a gas passage to further vaporize the raw material
- the heat transfer column of the heat transfer section 157Y functions as a fluid baffle, which replaces the function of the filter.
- a filter member is further provided. It can also be set up.
- the heat transfer sections 157Y are arranged in such a manner that the residual mist entering from the flow opening section 150B does not flow directly to the delivery path 150S.
- the heat transfer section 1557Y is arranged such that all imaginary straight lines entering the internal space 15OA reaching the flow opening section 15OB force reach the heat transfer section 1557Y. Be composed.
- a virtual straight line that does not pass through the heat transfer section 157Y from the outer circumference on the side of the flow opening 150B in the inner space 150A to the inner circumference on the side of the delivery path 150S is formed.
- a plurality of heat transfer sections 157Y are arranged substantially orthogonal to the flow direction of the raw material gas so that they cannot be pulled.
- the heat transfer sections 157 Y are arranged in a zigzag pattern.
- FIGS. 10A and 10B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a ninth embodiment of the present invention.
- FIGS. 10A and 10B show a sending unit 150Z which can be used in place of the sending unit 130 of the vaporizer shown in FIG. 1, and the other parts are the first embodiment. Same as.
- the same reference numerals as in the second embodiment denote the same parts in the transmission unit 15 OZ.
- a heat transfer frame 1557Z is attached and fixed to the side wall 151Z from the side ⁇ (vaporization chamber side).
- the heat transfer frame 1557Z has an outer frame portion that is in direct thermal contact with the side wall 151Z, and a plurality of beam portions 1557Za extending inward from the outer frame portion.
- the outer edge of the filter member 15 3 Z is fixed to the outer frame.
- the area other than the outer edge of the filter member 15 3 Z is in thermal contact with the multiple beam sections 1 57 Za.
- Filter member 15 3 Z is connected to spacer 15 6 through spacer 15 6.
- the shielding plate 1 5 4 Z is fixed with the fixing screw 1 5 6 a.
- the filter member 1553Z and the shielding plate 1554Z are connected to the outer edge by the beam portion 157Za, the spacer 156 and the fixing screw 156a.
- the parts are connected and fixed to each other at other parts.
- a gap is provided between the inner surface of the side wall 15 1 Z and the beam portion 15 57 Z a.
- Heating means 157 H is introduced into the heat transfer frame 157 Z, and the heating means 157 H passes through the beam 157 Z a.
- the wire-like heating means 157H is configured to sequentially pass through the plurality of beam portions 157Za in a meandering manner.
- a plurality of heating means 157 H may be configured to pass through each beam 157 Z a, and the heating means may be built in each beam 157 Z a, respectively. May be.
- a temperature detection point of the temperature sensor 157 TC is disposed inside the heat transfer frame 157 Z, particularly inside the beam portion 157 Za. Then, the temperature control circuit CONT controls the amount of heat generated by the above-mentioned heating means 157 H based on the temperature detected by the temperature sensor 157 TC. As a result, the temperature of the heat transfer frame 157Z can be controlled independently of the side wall 151Z. ' In this way, the temperature sensor 157 TC detects the temperature of the heat transfer section 157 Z a to control the heating means 157 H, and the shield plate 154 The controllability of the temperature of Z is improved. Therefore, the temperature drop of the shielding plate 1 5 4 Z It can be reduced.
- the set temperature of the heating means 157 H is preferably the same as the set temperature for the vaporization chamber.
- the beam portion 157Za itself may be constituted by a heating means such as a rectangular heater.
- the heating means may be arranged in the outer frame portion of the heat transfer frame 157.
- the heat transfer section may be formed in a beam shape, the heating means may be arranged inside the heat transfer section, and the heat transfer section itself may be provided with the heating means. It may be.
- FIGS. 11A and 11B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a tenth embodiment of the present invention.
- FIGS. 11A and 11B show a sending section 170 which can be used in place of the sending section 130 of the vaporizer shown in FIG. 1, and the other portions are the same as those of the first embodiment. Same as.
- the sending portion 170 has a structure in which a plate member 172 having a force tl heat function is fitted and fixed to the inside of the side wall 171 from the inside.
- the inner end face 172a of the plate member 172 faces the vaporization chamber and has the same function as the above-mentioned shielding plate.
- a gap provided between the inner end face 172a and the surrounding side wall 171 is a flow opening 170B.
- the plate member 172 is provided with a plurality of columnar heat transfer portions 172p at a portion opposite to the side wall 171 on the opposite side of the end surface 172a. These heat transfer portions 172 p come into thermal contact with the inner surface of the side wall 171.
- a heating section 17 2 H such as a heater is provided, Temperature sensor 17 2
- the TC temperature detector is arranged inside the plate member 17 1, where the power supply terminal 17 2 e connected to the heating section 17 2 H and the temperature sensor 17 2 TC are detected.
- Terminal 1 7 2 f is provided.
- the internal space 170A of the sending section 170 is an area surrounded by the side wall 171 and the plate member 172, and communicates with the sending path 17OS.
- the inner space 170A is formed in a ring shape (ring shape).
- a number of heat transfer sections 172p are distributed and arranged substantially orthogonal to the flow direction of the raw material gas. It is configured to have the same function as the filter, that is, the function of capturing residual mist particles that have entered from the vaporization chamber.
- These heat transfer portions 17 2 p are connected between the inner surface of the side wall 17 1 and the plate member 17 2 forming the inner end surface 17 2 a having the same function as the shielding plate.
- the pillars are in thermal contact.
- the residual mist contacts the heat transfer section 1772p and evaporates, improving the vaporization efficiency and suppressing the generation of particles.
- An annular filter member may be provided in the inner space 17OA, whereby solid matter such as residual mist and particles can be removed.
- the surface of the plate member 172 facing the vaporization chamber 110 functions as a vaporization surface for vaporizing the liquid raw material, like the other inner surface of the vaporization chamber 110.
- the plate member 172 is disposed so as to cover the outlet (gas outlet) 170SO to the delivery path 170S, and the plate member 1702 and the delivery path 170S are connected to each other.
- vaporization chamber 1 A gas passage connecting the 10 and the outlet 170 SO is formed.
- the heat transfer column of the heat transfer section 1772p functions as a fluid baffle, which replaces the function of the filter.
- all virtual straight lines that enter the flow opening 170b from the vaporization chamber side do not pass through the heat transfer section 1772p.
- the plurality of heat transfer sections 170p are arranged from the flow opening 170b side (outer peripheral side in the drawing) to the delivery path 170s side (inside) in the internal space 170A where these are arranged. Arranged in such a way that an imaginary straight line that does not pass through the heat transfer section 1 72 p toward the circumferential side> is formed, so that most of the residual mist is at least once.
- the temperature control of the plate member 172 is performed by a temperature control circuit C ONT on the basis of the temperature detected by the temperature sensor 172 TC, independently of the temperature control of the vaporization chamber. Therefore, it is possible to reduce the temperature drop of the inner end face 172a corresponding to the shielding plate.
- the set temperature of the plate member 17 2 be the same as the set temperature of the heating means for the vaporization chamber. Note that another heating means may be provided inside the side wall 17 1.
- FIGS. 12A and 12B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of the vaporizer according to the eleventh embodiment of the present invention.
- FIGS. 12A and B show a sending section 170 ′ which can be used in place of the sending section 130 of the vaporizer shown in FIG. 1, and the other parts are the same as those in the first embodiment. Same as the form.
- the same parts as those in the tenth embodiment of the sending unit 170 are denoted by the same reference numerals.
- a plate member 17 2 ′ is fitted and fixed to the side wall 17 1 ′ from inside.
- a flow opening 170B ' is formed between the inner end surface 172a of the plate member 172' and the surrounding side wall 171 '.
- annular ring-shaped (space-shaped) internal space 170 A ′ communicating with the flow opening portion 170 B ′. Also communicates with 1 7 0 S '.
- an annular filter member 173 is arranged in the internal space 170A.
- the outer edge of the filter member 173 is fixed to the inner surface of the side wall 171 '.
- the portions other than the outer edge of the filter member 17 3 are connected to the columnar heat transfer portion 17 1 projecting from the side wall 17 1 ′ and the columnar heat transfer portion 17 2 projecting from the plate member 17 2 ′. Make thermal contact. More specifically, the filter member 173 is sandwiched between the heat transfer sections 17 1 ⁇ ′ and 17 2 ⁇ ′.
- another heating means 172 ⁇ is arranged inside the side wall 171 ′ (accommodation hole 171 a ′). Accordingly, the filter member 17 3 is connected to the heat transfer sections 17 1 p ′ and 17 2 p ′ from both the heating section 17 2 H and the force tl heating means 17 2 ⁇ of the plate member 17 2 ′. To receive heat through each of them. Therefore, the filter member 173 can receive a larger amount of heat through these heat transfer sections. In this case, vaporization can be performed efficiently, and solid matter such as residual mist particles can be removed by the finoleta member.
- FIGS. 13A and 13B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a 12th embodiment of the present invention.
- FIGS. 13A and 13B show a delivery unit 180 that can be used in place of the delivery unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as those in the first embodiment. Same as the form.
- a plurality of heating means 18 2 are attached to the side wall 18 1 in a state inserted from the outside. At the tips of these heating means 18 2, columnar heat transfer portions 18 5 protruding from the inner surface of the side wall 18 1 are respectively joined.
- the interior space 180A which is configured to communicate with the delivery channel 180S and is defined inside the four side walls 181, has a container-like filter that opens inside (toward the vaporization chamber).
- the member 18 3 is placed.
- the outer edge of the filter member 183 is fixed to the inner surface of the side wall 181 by a fixing screw 188 or the like.
- the portion other than the outer edge of the filter member 183 is in thermal contact with the columnar support projections 181c provided on the side wall 181 and the heat transfer portion 185 described above.
- a shielding plate 184 is arranged at a position facing the vaporization chamber of the internal space 18 OA (further inside the filter member 183).
- the shielding plate 184 is connected to the filter member 183 via a spacer 186. It is in thermal contact, and is fixed to the heat transfer section 1885 by the fixing screw 1886a.
- a gap is provided between the shielding plate 184 and a portion of the side wall 181 surrounding the shielding plate 184, and this gap serves as a flow opening 180 B.
- the filter member 183 is formed in a container shape having the axial direction as the depth direction. For this reason, since the filter member 183 also has a side surface portion extending in the axial direction, the filter area can be increased. As a result, the life of the filter member 183 can be extended.
- the above-described heat transfer portion 185, spacer 186 and fixing screw 186a constituting the heat conduction column are in direct thermal contact with heating means 182. For this reason, the filter member 183 and the shielding plate 184 can be efficiently heated.
- FIGS. 14A and 14B are a schematic internal side view and a schematic longitudinal sectional view showing a main part of a vaporizer according to a thirteenth embodiment of the present invention.
- FIGS. 14A and 14B show a delivery unit 190 that can be used in place of the delivery unit 130 of the vaporizer shown in FIG. 1, and the other parts are the same as those in the first embodiment. Same as the form.
- a heating means 192 is disposed inside the side wall 191 (accommodation hole 1991a).
- an internal space 190A open to the inside (evaporation chamber side) is formed, which communicates with the delivery path 19OS.
- a filter member 1993 is arranged in the internal space 19OA, and an outer edge portion thereof is fixed to the side wall 1991 by a fixing screw 1998 or the like. The portion other than the outer edge of the filter member 1993 is in thermal contact with a plurality of columnar heat transfer portions 197 protruding from the inner surface of the side wall 191. Inside the filter member 1993, it is fixed to the heat transfer section 1997 by a fixing screw 1996a via a shielding plate 1994 facing the vaporization chamber. You. A gap is provided around the shielding plate 1994 between the shielding plate 1994 and the side wall 191, and this gap serves as a flow opening 190b. A space 19OD is formed between the shielding plate 1994 and the filter member 1993 over the entire surface of the filter member 1993.
- a hole 1991b is provided in the side wall 191, and a temperature sensor 1999 is arranged in the hole 1991b.
- the temperature detection point of the temperature sensor 199 is located near or inside the heat transfer section 197.
- the heating means 193H is arranged inside the filter member 193. More specifically, the heating means 1993H is a heater in the form of a wire, which passes through the inside of the filter member 1993 in a meandering manner. A temperature sensor 1993 TC is also located inside the filter member 1993. The heating control circuit CONT controls the heating value of the heating means 193 H based on the temperature detected by the temperature sensor 193 TC, and the filter member 193 directly and independently controls the temperature. It is configured to be controlled.
- the heating means 1993H is disposed inside the filter member 1993, the filter member 1993 is directly heated, and the filter member 1993 is independently provided. Temperature can be controlled. Therefore, the temperature of the filter member 193 can be precisely controlled, and the uniformity of the temperature can be improved. As a result, clogging of the filter member 1993 and local collection of sediment The inside can be suppressed, the pressure rise in the vaporization chamber can be suppressed, and the filter life can be prolonged.
- FIG. 15 is a schematic vertical sectional view showing a vaporizer according to a fourteenth embodiment of the present invention.
- FIG. 16 is a cross-sectional view showing the vaporizer of the fourteenth embodiment along the line AA in FIG.
- the vaporizer of this embodiment has a vaporizing surface 21 OB and a vaporizing chamber 210 forming a vaporizing space 21 OA similar to the first embodiment.
- Spraying means 120 is provided to spray the liquid raw material into the vaporization space 210A.
- a delivery unit 220 corresponding to a second vaporization unit is detachably attached to the vaporization chamber 210.
- the configuration of the above fog means 120 (raw material supply pipe 122, spray gas supply pipe 122 and spray nozzle 123), side wall 211 of vaporization chamber 210
- the heating means 2 1 and 2 are the same as those in the first embodiment.
- the side wall 221, the heating means 222, the filter member 222, the shielding plate 222, the heat transfer part 222, the spacer 222 and the fixing screw 222 are provided.
- 26a has a function similar to that of the first embodiment.
- the first embodiment is also applicable to the internal space 220A provided in the delivery section 220, the flow opening section 222B provided around the shielding plate 222, and the delivery path 220S. The same is true.
- the vaporization chamber 210 has an inner surface shape that is curved around the axis of the spray nozzle 123 as shown in FIG. Specifically, the vaporization chamber 210 is formed in a cylindrical shape.
- the shape of the vaporization chamber 210 is conical with the axis of the spray nozzle 123 as the center or the axis of the spray nozzle 123 as one of the diameters. It may be spherical.
- the filter member 222 and the shielding plate 222 have a curved shape along the inner surface curved around the axis of the mist nozzle 123 as described above.
- the outer edge of the filter member 223 is fixed to the side wall 221 by a fixing screw 228 or the like.
- a space 220D is formed between the filter member 222 and the shielding plate 222.
- the shielding plate 2 24 has a shape along the inner surface shape of the vaporization chamber 2 10. For this reason, a large filter area can be secured, and the carburetor can be made compact.
- the configuration is such that the flow of the mist gaseous raw material in the vaporization chamber 210 is hardly affected by the presence of the delivery section 220.
- the vaporization chamber 210 has a substantially uniform shape (rotator shape) around the entire axis of the spray nozzle 123. This makes it possible to stabilize the temperature distribution in the vaporization chamber 210 and the temperature distribution in the vaporization surface 210B and the inner surface of the shielding plate 222. For this reason, it is possible to prevent intensive accumulation of solid matter at specific positions. Filter material
- the distance between the filter member 22 3 and the shielding plate 22 4 can be made constant. For this reason, it is possible to effectively use the entire surface of the filter member 223 to efficiently capture residual mist and solid matter.
- the vaporization chamber 210 has a shape having a curved inner surface around the axis of the spray nozzle 123, but the shape of the vaporization chamber is not limited at all. Therefore,
- the shape of the conversion chamber may be a polyhedral shape such as a cube (hexahedron).
- the shielding plate and the Z or filter member have a shape along the inner surface of the vaporization chamber so as to constitute a part of the polyhedral shape, as described above.
- the shielding plate and / or the filter member may be formed so as to constitute at least two of the polyhedral shapes.
- the vaporization chamber may have an inner surface shape in which a curved surface and a flat surface are combined.
- an opening communicating with the detection pipe 219 to which a pressure gauge (not shown) is attached is formed so as to face the vaporization chamber 21OA.
- the filter member 2: (_3) and the shielding plate 2 14 arranged on the side of the vaporizing chamber 2 10 A of the filter member 2 13 are disposed in the opening.
- the filter member 2 13 comes into contact with a heat transfer section 2 15 protruding from the inner surface of the side wall 2 1 1.
- the heat transfer section 2 15 is fixed via a spacer 2 16 to a fixing screw 2 16 a.
- the thermal contact between the shield plate 2 13 and the side wall 2 1 1 is made to the fixed shield plate 2 14 via the spacer 2 16 and the fixing screw 2 16 a.
- An opening is provided between the openings, and the space in which the filter member 21 is disposed communicates with the vaporization chamber 21 OA through the opening. Pass through filter member 2 13 to the inside of detection pipe 2 19.
- the above-mentioned shield plate 214 prevents the remaining mist and solid matter entering from the vaporization chamber 21 OA from reaching the filter member 2 13. As a result, clogging of the filter member 2 13 is reduced.
- the life of the filter member 2 13 can be extended.
- the filter member 2 13 and the shielding plate 2 14 are in thermal contact with the side wall 2 1 1 at a portion other than the outer edge thereof via the heat transfer portion 2 15. For this reason, when the residual mist adheres, the residual mist can be vaporized when the residual mist adheres, because it is heated almost in the same manner as the inner surface of the vaporization chamber 210A.
- FIG. 17A is a schematic longitudinal sectional view showing a vaporizer according to a fifteenth embodiment of the present invention.
- the delivery section 230 is formed of a side wall 231, a honeycomb-shaped filter member 232 disposed between the side wall 231, and the vaporizing space 110A, and an inside of the filter member 232.
- heating means 2 3 3 such as a heater arranged at the bottom.
- a gas material delivery path 231a for delivering a gas material to the supply line is formed on the side wall 231, a gas material delivery path 231a for delivering a gas material to the supply line is formed.
- a heating means for heating the side wall 23 1 may be separately provided. This heating means can be provided inside the side wall 231, on the outer surface, or the like.
- the filter member 232 is made of a metal having good thermal conductivity (for example, stainless steel) or a plate-like material made of ceramics such as A1N and SiC. Inside the filter member 232, an accommodation hole (or accommodation hole, hereinafter the same) 233a is formed in a direction intersecting (orthogonal in the illustrated example) with the flow direction of the gaseous raw material (right direction in the figure). It is formed. Heating means 2 is provided in accommodation hole 2 3 2a. 3 3 are accommodated. Here, the heating means 233 may be arranged over the entire inside of the filter member 232. In this case, the thermal efficiency can be further improved.
- the filter member 2 32 has minute pores that penetrate almost parallel to the flow direction of the gaseous raw material.
- the fine pores 2332b may be formed substantially perpendicular to the flow direction of the raw material gas so that the residual mist / solids re-evaporate on the filter member.
- pores 2 32 b are configured such that the penetration distance (length) is larger than the diameter.
- the length of the pores 232b (which corresponds to the thickness of the filter member 232 in the illustrated example) is sufficient to capture small residual mist generated in the vaporization space 110A. Designed to be high. Specifically, pore 2
- the diameter of 32b is about 0.01 to 1.0 mm and the penetration distance is about 5 to 15 mm.
- a configuration may be such that the accommodation hole 232a for accommodating the heating means 233 and a part of the pores 2332b intersect.
- it may be configured such that the pores 2332b are not formed at positions intersecting with the accommodation holes 232a.
- FIG. 17B is a schematic longitudinal sectional view showing a vaporizer according to a sixteenth embodiment of the present invention.
- a filter member 234 is disposed between the side wall 231 and the honeycomb-shaped finoleta member 232.
- the filter member 234 is connected and fixed to the side wall 231 by a fixing member 235.
- These filters are located between the filter member 23 and the filter member 24.
- a space 230D is formed over the entire surface of the filter.
- the other points, that is, the filter member 232 and the heating means 233 are the same as in the fifteenth embodiment shown in FIG. 17A.
- the amount of mist particles introduced into the supply line is further reduced by disposing the filter member 234 downstream of the honeycomb-shaped filter member 232.
- the effect is that it can be done.
- the filter member 234 be configured so as to capture finer residual mist than the filter member 234.
- the same member as the filter member 133 shown in the first embodiment can be used.
- the filter member 234 is heated indirectly via the side wall 231 or by radiant heat from the filter member 232. The heat of the heating means is transmitted to the filter member 234 via a heat transfer portion 235 (a spacer), similarly to the filter member 133 of the embodiment shown in FIG. You.
- fixing means 235a for fixing the filter member 234 to the heat transfer portion 235 and the side wall 231 is used.
- a heating means may be disposed inside the filter member 232 similarly to the filter member 232 of the fifteenth embodiment.
- a heating means may be provided in the side wall 2 31. In any case, it is preferable that the heated finoleta member 234 is controlled to the same temperature as the vaporizing surface (inner surface) of the vaporizing chamber.
- a relatively large residual mist can be captured and vaporized by the filter member 232, and a relatively small residual mist can be captured by the filter member 234. It is configured to Therefore, mist removal efficiency can be improved. At the same time, clogging of each of the filter members 23, 23 can be reduced.
- FIG. 18A is a schematic longitudinal sectional view showing a vaporizer according to a seventeenth embodiment of the present invention. Also in the seventeenth embodiment, the structure other than the transmission unit 330 is the same as that in the first embodiment.
- the delivery section 3330 has an outer wall 331 and an inner wall 332 facing the vaporization space 110A inside the outer wall 331.
- a gas raw material delivery path 331a is formed on the outer wall 331.
- a communication hole 332a is formed on the inner wall 332, for communicating the evaporating space 110A with the inner space 33OA of the sending portion 330.
- Heating means 33 such as a heater is arranged inside the inner wall 3 32.
- the inner space 33OA is defined by the outer wall 3311 and the inner wall 3332.
- a filter member 334 is disposed in the internal space 33OA.
- the filter member 334 is in thermal contact with the heat transfer portion 335 at a portion other than the outer edge ⁇ .
- the heat transfer section 335 is configured to receive the heat generated by the heating member 333 from the inner wall 332 and transmit the heat to a portion other than the outer edge of the filter member 334.
- the filter members 334 are connected and fixed to the inner wall 332 via the heat transfer portions 335, respectively. More specifically, the filter member 334 is fixed to the heat transfer portion 335 and the inner wall 332 by fixing means 335a. That is, the heat transfer section 335 also functions as a support member for supporting the filter member 334.
- the gas source generated in the vaporization space 110 A The material is introduced into the internal space 33OA through the communication hole 3332a.
- the gaseous raw material introduced into the internal space 330A passes through the filter member 334, and is discharged from the gas raw material discharge passage 331a.
- the filter member 334 is heated by the heating means 333 via the heat transfer portion 335, fine residual mist existing in the gaseous raw material adheres. Can be reliably vaporized.
- a plurality of heat transfer portions 335 are in thermal contact with the filter member 334 at portions other than the outer edge portion, which are distributed. For this reason, since the entire filter member 3334 is more uniformly heated, temperature variations are reduced, and local clogging and the like can be prevented. Also in this case, it is preferable that the heated filter member 334 be controlled to the same temperature as the vaporizing surface (inner surface) of the vaporizing chamber.
- the inner wall 332 of the delivery unit 3330 is disposed so as to face the vaporization space 11OA of the vaporization chamber 110.
- the heating means 3 33 since the heating means 3 33 is disposed inside the inner wall 3 32, the heating means 3 33 also contributes to the vaporization of the raw material in the vaporization space 110 A.
- the communication hole 332a provided in the inner wall 332 is formed at a position deviated toward the spray means (spray nozzle: not shown). This reduces the possibility that the mist sprayed into the vaporizing space 11OA is directly captured by the filter member 334 through the communication hole 332a.
- FIG. 18B shows a vaporizer according to an eighteenth embodiment of the present invention. It is a schematic longitudinal cross-sectional view.
- the heating means 4 32 is housed and arranged inside the side wall 4 31.
- the filter member 433 is disposed inside the side wall 4331.
- the filter member 433 is in a state in which a portion other than the outer edge portion is in thermal contact with a heat transfer portion 434 (spacer) formed by projecting from the side wall 431.
- the heat transfer section 434 is connected and fixed to the filter member 433 and the side wall 431, respectively. More specifically, the filter member 433 is fixed to the heat transfer section 4334 and the side wall 431 by the fixing means 4334a. That is, the heat transfer section 434 also functions as a support member that supports the filter member 433. Even in this case, the heated filter member 4 3 4 is used for the vaporization of the vaporization chamber.
- FIG. 19 is a schematic vertical sectional view showing a carburetor according to a nineteenth embodiment of the present invention.
- the vaporizer 500 of this embodiment has a raw material vaporizing section 5110, a spraying section 5200, and a sending section 5300.
- the raw material vaporizing section 510 has a side wall 51, a vaporizing surface 5111A forming an inner surface of the side wall 510, and a heating means 512 such as a heater disposed inside the vaporizing surface 511A.
- the spraying means 520 is provided with a raw material supply pipe 521, a gas supply pipe 522 for atomization, and a spray nozzle 523.
- the spray nozzle 523 sprays the raw material at the pressure of the spray gas.
- the raw material and the gas for atomization are respectively introduced into the inside thereof, and the material is sprayed from a plurality (three in the example in the figure) of the atomizing gas by the gas for atomization. Let it be sprayed Is composed of More specifically, the introduced raw material is divided into a plurality of raw material supply paths 523 V through the raw material diffusion chamber 523 s. These raw material supply paths 52 3 V communicate with the above-mentioned spray ports 52 3 a.
- the atomizing gas was diverted to a path formed coaxially with the material supply path 52 3 V through the atomizing gas diffusion chamber 52 3 t, and was supplied through each material supply path 52 3 V.
- the raw material is sprayed at the spray port 5 2 3a.
- only one raw material supply pipe 521 for supplying the raw material to the spray nozzle 523 is illustrated, but a plurality of raw material supply pipes 521 may be provided as necessary. It can be.
- a plurality of kinds of raw materials supplied through a plurality of raw material supply pipes 52 1 are mixed immediately before spraying in a spray nozzle 52 3, and this mixture is sprayed together with a spray gas into a plurality of sprays.
- Spray (matrix spray) by sharing with mouth 5 2 3a.
- the vaporizing surface 5111A which is the inner surface of 5111, is formed in a substantially spherical (hemispherical) shape. As a result, the spray port 5 2 3 a
- the distance to 1 A is almost constant regardless of the spray direction of the mist. Due to the fact that the amount of mist sprayed on the vaporized surface 511 A is almost uniform on the spherical surface, the spray nozzle The mist sprayed from 5 2 3 can be efficiently vaporized.
- a side wall 531 and a honeycomb-shaped filter member 532 disposed inside the side wall 531 are provided on the side wall 531.
- a gas source delivery path 531a is formed on the side wall 531.
- the filter member 5332 is provided with a receiving hole (or a receiving hole, hereinafter the same) 5332a formed in a direction intersecting with the flow direction of the gaseous raw material.
- the storage hole 532a may be formed so as to be substantially perpendicular to the flow direction of the raw material gas so that the residual mist / solids re-evaporate on the filter member.
- a heating means 53.3 composed of a heater or the like is arranged on the outer peripheral side in the accommodation hole 532a.
- a large number of pores 532b penetrating in the direction of the flow path of the gaseous raw material are formed in the filter member 532. These pores 532b communicate between the vaporization space 5110A and the internal space 53OA of the delivery section 5330.
- the filter member 532 is provided on the side of the spray nozzle 523 with respect to the vaporization space 510A. More specifically, filter member 532 is arranged around spray nozzle 523 so as to surround spray nozzle 523 so as to face vaporizing surface 5111A. On the opposite side (behind) the spray nozzle 52 3 in the spray direction, an internal space 53 OA of the delivery section 53 0 is defined. Further, the gas raw material delivery path 531a is formed further behind it. With this configuration, the force S is prevented from the mist sprayed from the spray nozzles 52 23 directly adhering to the filter member 52 3. In this case, as in the first embodiment, the shielding plate 1 3 4 It is not necessary to provide.
- the filter member 532 is substantially uniformly heated by the heating means 533 disposed therein. Therefore, the fine residual mist flowing together with the gaseous raw material generated in the vaporizing space 5110 A by the vaporizing surface 511 A adheres to the filter member 532 and is re-vaporized here. .
- the gaseous raw material passes through the pores 5332b, is guided to the internal space 53OA, and is finally discharged through the gaseous raw material discharge passage 5311a.
- the dimensions of the pores 532b formed in the filter member 532 are designed in the same manner as in the second embodiment.
- a filter member 534 indicated by a broken line in the drawing may be provided in the internal space 53OA (between the filter member. 532 and the gaseous material delivery path 531a). I like it.
- the filter member 534 the same one as the filter member of the first embodiment or the fifteenth embodiment can be used.
- the heat transfer section is configured to transmit the heat to the filter member 532 and the heat to the filter member 534.
- the heating means may be incorporated in the side wall 531, a heat transfer section may be attached to the side wall 531, and this heat transfer section may be brought into thermal contact with the filter member 534. .
- the spraying means 620 includes a plurality of (three in the illustrated example) raw material supply pipes 621 and a spray gas supply pipe 622. And spray nozzles 6 2 and 3 are provided. Each of the raw materials supplied from the plurality of raw material supply pipes 6 21 is individually mixed in advance in the spray nozzle 6 23, and corresponds to each of the plurality of spray ports 6 2 3 a. It is configured to be sprayed together with the spray gas.
- This configuration is applied, for example, when PZT (lead zirconate titanate) is formed by supplying three kinds of gaseous materials (derivatives of Pb, Zr, and Ti (organometallic compounds)).
- PZT lead zirconate titanate
- Ti organometallic compounds
- the spraying means 620 has the same effect as the spraying means 520 of the nineteenth embodiment. Furthermore, by forming a dedicated spray port 623a for each raw material, the spray mode (raw material spray amount, mixed spray gas amount, water spray pressure, etc.) can be adjusted for each raw material. It has the advantage that it can be adjusted.
- 20C and 20D are a schematic front view and a schematic side view showing another modified example of the spraying means.
- a plurality of raw material supply pipes 7 21, a gas supply pipe 7 22 for spraying, and a spray nozzle 7 23 are arranged in the mist means 720.
- the spray nozzle 23 is provided with a gas raw material introduction port 72B-D that communicates with the plurality of raw material supply pipes 721, respectively.
- the raw materials supplied from the plurality of raw material supply pipes 72 1 are sequentially injected into the gas raw material introduction blocks 72 3 D, 72 3 C, and 72 B inside the spray nozzle 72 3. It is introduced into the conduit communicating with the mist port 7 2 3a and mixed.
- the plurality of raw materials are sprayed from the spray port 72 a together with the spray gas coaxially introduced through the spray gas diffusion chamber 72 A.
- the spraying means 720 a plurality of types of raw materials can be uniformly mixed. For this reason, since the mixed raw material is vaporized in the vaporization space and supplied to the film formation chamber, there is an effect that the reproducibility of the composition ratio of the film is improved.
- reaction processing apparatus semiconductor processing apparatus
- This reaction processing apparatus is, for example, a CVD apparatus for forming a thin film using a gaseous raw material.
- This reaction processing apparatus includes a raw material supply section 200, a vaporizer 100 (500) for vaporizing the raw material supplied from the raw material supply section 200, and a vaporizer. And a reaction processing section 300 for performing processing using the generated gaseous raw material.
- FIG. 22 is a schematic configuration diagram showing the internal configuration of the raw material supply unit 200.
- the raw material supply section 200 is provided with raw material containers 202 A to 202 C for storing the raw materials A to C, and the liquid supply line 204 from the raw material containers 202 A to 202 C is provided.
- Raw materials A to C are supplied to the vaporizer 100 (500) at a controlled flow rate through A to 204C.
- a ferroelectric thin film is formed as a material for a short conductor device, Pb, Zr, Ti (PZT) or Pb, Zr, Ti, Nb (PZTN ), Organic metal compounds such as B a, S r, T i for forming a high dielectric thin film, and B for forming a superconducting thin film. 1, Sr, Cu, etc. are used respectively.
- the number of raw materials and raw material containers is not limited to the illustrated example, and any number may be provided as necessary.
- a solvent container 202D is provided, and the solvent prepared in this container is supplied through a liquid sending line 204D. Further, a drain line 203 connected to each of the feed lines 204A to 204D of the raw material containers 202A to 202C and the solvent container 202D is provided.
- a drain container 202E connected to the drain line 203 is provided.
- Fluid flow control means on the way to each downstream
- a flow controller such as a mass flow meter
- the liquid sending lines 204 A to 204 D extend further downstream from the fluid flow rate control means and feed the respective raw materials to the vaporizer 100 (500).
- Each of 205 A to 205 D adjusts the flow rate in response to a controller (not shown) or a control signal.
- the raw material supply unit 200 has gas supply lines 206 A to 206 D branched from a gas introduction line 206 for introducing an inert gas or the like.
- the raw materials A to C and the solvent are sent to the respective liquid supply lines 204 A to 204 D by the pressure generated by the gas supply from the gas supply lines 206 A to 206 D. .
- Between the liquid supply line 204 D for supplying the solvent and each liquid supply line 202 A to 202 C for supplying the raw material and the gas supply line 206 A to 206 C Is connected to a solvent supply line 207.
- exhaust system (Not shown) Connected to vacuum line 208 cadrain vessel 202E connected to.
- a check valve CH is interposed between the gas supply lines 206 A to 206 D, and an on-off valve DV (diaphragm valve) is interposed in place as shown in all lines. Is done. Further, it is preferable that a separator (a deaerator: not shown) is interposed at a position upstream of the liquid flow rate adjusting means 205A to 205D of the raw material supply line.
- a separator a deaerator: not shown
- the raw material vaporized in the vaporization chamber 110 is sent to the delivery section 130 (150, 150).
- the delivery section 130 150, 150.
- 0 's 1 5 0 ⁇ , 1 6 0, 1 6 0' ⁇ 1 5 0 X s 1 5 0 Y, 1 5 0 ⁇ 1 7 0, 1 7 0 ', 1 8 0, 1 9 0, 2 3 0, 330, 430, 530 to the raw material supply line 140.
- the raw material supply line 144 is provided with a raw material supply path 141 and exhaust paths 144 and 144 connected to an exhaust system (for example, a vacuum pump).
- the raw material supply path 14 1 is provided with the above filter members (13 3, 15 3, 15 3 ′, 16 3, 15 3 ⁇ , 15 3 ⁇ , 17 3, 18 3,
- a gaseous raw material re-evaporation filter 142 provided with 193, 232, 334, 433, 532) is provided.
- These re-evaporation filters 14 2 are connected to the above-mentioned sending sections (130, 150, 150 ′, 150 °, 160, 160 ′, 150X, 150). 0 ⁇ , 150 0, 170 0, 170 0 ', 180, 190, 230, 330, 430, 530).
- the re-vaporization filter 142 differs in that it is disposed separately from the vaporizer, despite having the same configuration as the above-mentioned sending section.
- the supply structure of the vaporized raw material only one of the above-described delivery unit and the re-vaporization filter 142 may be provided.
- the processing section 300 has a reaction chamber 301 in which a susceptor 304 is disposed for placing a substrate to be processed such as a semiconductor wafer.
- a gas inlet (shower head) 303 is provided so as to face the susceptor 304.
- the shower head 3003 introduces the gaseous raw material (introduced together with the appropriate carrier gas) supplied from the vaporizer 100 (500) into the reaction chamber 301. Is done.
- the shower head 303 also has a reaction gas (for example, an oxidizing gas such as oxygen gas) supplied from a separate gas introduction pipe 303 introduced into the reaction chamber 301.
- An exhaust pipe 303 is connected to the reaction chamber 301 in order to exhaust the inside of the reaction chamber 301.
- the delivery section of the vaporizer (130, 150, 150 ', 150 ⁇ , 160, 160', 150X150Y, 150 ⁇ , 170, 170 ′, 180, 190, 230, 330, 430, 530) or re-evaporation filter 144 It is possible to greatly reduce the amount of mist particles introduced into 01. For this reason, it is possible to improve the quality of the processing (for example, film forming processing) performed in the reaction chamber 301.
- the filter member disposed therein is used. Be more evenly heated TJP2004 / 006609
- FIG. 23 is a schematic configuration diagram showing a reaction processing apparatus (semiconductor processing apparatus) according to another embodiment of the present invention.
- the raw material is supplied from the raw material supply unit 200 to the vaporizer 100 (500), and the raw material is supplied from the vaporizer 100 (500) to the raw material supply path 144. It is the same as described above in that it is supplied to the processing unit 300. However, the difference is that a purge line 144 for supplying an inert gas such as Ar gas is introduced into the raw material supply path 141. In this configuration example, the re-vaporization filter 142 and the exhaust gas path 144 are not provided.
- the distance from the vaporizer 100 (500) to the reaction chamber 301 (the length of the raw material supply path 141) is made as short as possible so that the inside of the raw material supply path is reduced. To reduce the amount of vaporized gas in the air. As a result, generation of particles in the raw material supply system can be suppressed, and the quality of the film formed in the reaction chamber 301 can be improved.
- Figure 24 shows the change in the internal pressure of the vaporization chamber over time (dependence of the internal pressure on the supply time of the raw material) with the vaporizer of the second embodiment and the conventional vaporizer (the filter member was simply installed in a conventional manner). This is a graph that is shown in comparison with the above.
- the upper limit pressure was exceeded before the raw material supply time reached 100 hours, as indicated by the line L2. For this reason, a purging process in which an inert gas such as N 2 is passed while heating is performed. Although the internal pressure was reduced occasionally, the upper limit pressure was exceeded again shortly thereafter (note that the purge process period is omitted in the figure). This is presumably because a large amount of solid matter adhered to the filter member and reduced the conductance.
- the vaporizer of the second embodiment as shown by the line L1, even if the raw material supply time exceeds 600 hours, the material does not reach the upper limit pressure much, and is compared with the conventional structure. As a result, it was found that the decrease in conductance was significantly suppressed. In the second embodiment, the decrease in the conductance hardly occurs as described above, but this does not mean that the filter member is not functioning. In the second embodiment, it has been experimentally confirmed that the amount of particles flowing into the reaction chamber is reduced to less than half compared to the conventional structure.
- the amount of particles flowing into the reaction chamber is greatly reduced by the in-line filter connected to the downstream side.
- the in-line filter is connected to the downstream side. Even if the in-line filter is removed, the particles that reach the reaction chamber
- the supply structure of the vaporized raw material, the vaporizer, and the reaction treatment device of the present invention are not limited to the above-described illustrated examples, and various changes can be made without departing from the gist of the present invention.
- the feature points of the side wall, the internal space, the heating means, the filter member, the shielding plate, the heat transfer portion (heat conduction column), and the flow opening portion shown in any of the above embodiments are independent.
- the present invention is also applicable to other embodiments, and is not limited to combinations with other configurations shown in the respective embodiments.
- a vaporizer capable of reducing mist and particles in a gas raw material.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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AT04732201T ATE516595T1 (de) | 2003-05-12 | 2004-05-11 | Verdampfer und halbleiter- verarbeitungsvorrichtung |
US10/556,355 US7666260B2 (en) | 2003-05-12 | 2004-05-11 | Vaporizer and semiconductor processing apparatus |
EP04732201A EP1630859B1 (en) | 2003-05-12 | 2004-05-11 | Vaporizer and semiconductor processing apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2003-132607 | 2003-05-12 | ||
JP2003132607 | 2003-05-12 | ||
JP2004121290A JP4185015B2 (ja) | 2003-05-12 | 2004-04-16 | 気化原料の供給構造、原料気化器及び反応処理装置 |
JP2004-121290 | 2004-04-16 |
Publications (1)
Publication Number | Publication Date |
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WO2004100249A1 true WO2004100249A1 (ja) | 2004-11-18 |
Family
ID=33436437
Family Applications (1)
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PCT/JP2004/006609 WO2004100249A1 (ja) | 2003-05-12 | 2004-05-11 | 気化器及び半導体処理装置 |
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Country | Link |
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US (1) | US7666260B2 (ja) |
EP (1) | EP1630859B1 (ja) |
JP (1) | JP4185015B2 (ja) |
KR (1) | KR100691038B1 (ja) |
AT (1) | ATE516595T1 (ja) |
WO (1) | WO2004100249A1 (ja) |
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US7927423B1 (en) * | 2005-05-25 | 2011-04-19 | Abbott Kenneth A | Vapor deposition of anti-stiction layer for micromechanical devices |
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JP2021031769A (ja) * | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
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CN114318300A (zh) * | 2021-12-30 | 2022-04-12 | 拓荆科技股份有限公司 | 一种半导体加工设备及其反应腔室、工艺管路穿腔模块 |
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- 2004-05-11 US US10/556,355 patent/US7666260B2/en not_active Expired - Fee Related
- 2004-05-11 KR KR1020057008778A patent/KR100691038B1/ko not_active IP Right Cessation
- 2004-05-11 EP EP04732201A patent/EP1630859B1/en not_active Not-in-force
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Also Published As
Publication number | Publication date |
---|---|
ATE516595T1 (de) | 2011-07-15 |
JP2004363562A (ja) | 2004-12-24 |
KR100691038B1 (ko) | 2007-03-12 |
EP1630859A1 (en) | 2006-03-01 |
US20070101940A1 (en) | 2007-05-10 |
JP4185015B2 (ja) | 2008-11-19 |
EP1630859B1 (en) | 2011-07-13 |
EP1630859A4 (en) | 2009-08-26 |
US7666260B2 (en) | 2010-02-23 |
KR20050075420A (ko) | 2005-07-20 |
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