WO2004086430A1 - Film a aimant permanent - Google Patents

Film a aimant permanent Download PDF

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Publication number
WO2004086430A1
WO2004086430A1 PCT/JP2004/004229 JP2004004229W WO2004086430A1 WO 2004086430 A1 WO2004086430 A1 WO 2004086430A1 JP 2004004229 W JP2004004229 W JP 2004004229W WO 2004086430 A1 WO2004086430 A1 WO 2004086430A1
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Prior art keywords
permanent magnet
powder
film
magnetic
magnet film
Prior art date
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PCT/JP2004/004229
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English (en)
Japanese (ja)
Inventor
Satoshi Sugimoto
Koichiro Inomata
Jun Akedo
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National Institute Of Advanced Industrial Science And Technology
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Publication of WO2004086430A1 publication Critical patent/WO2004086430A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/18—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
    • H01F10/20—Ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
    • H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
    • H01F1/047—Alloys characterised by their composition
    • H01F1/053—Alloys characterised by their composition containing rare earth metals
    • H01F1/055—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5
    • H01F1/059—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and Va elements, e.g. Sm2Fe17N2
    • H01F1/0596—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and Va elements, e.g. Sm2Fe17N2 of rhombic or rhombohedral Th2Zn17 structure or hexagonal Th2Ni17 structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/126—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing rare earth metals

Definitions

  • the present invention relates to a magnetic film having permanent magnet capability and a method for producing the same. n.
  • Permanent magnets have been widely used in the fields of electronic communication equipment and automobiles because of their own magnetic field.
  • These permanent magnet materials include RFeB-based alloys containing rare earth metal elements (hereinafter abbreviated as R), boron (B) and iron (Fe) as main components, and R and cobalt (Co) as main components.
  • R rare earth metal elements
  • B boron
  • Fe iron
  • Co cobalt
  • ferrite magnets composed of a ferrite phase having a spinel-type or magnetoplumbite-type crystal structure
  • FeAINi Co-based alloy containing nickel, nickel (Ni) and Co as main components FeAINi Co-based alloy containing nickel, nickel (Ni) and Co as main components, CuNi Fe-based alloy containing copper (Cu), Ni and Fe as main components, CuNi Co-based alloy, Fe, chromium (Cr), and Co
  • alloy magnets such as FeCrCo based alloys whose main component is.
  • thin film magnets with a thickness of 1 ⁇ m or less can be manufactured using the sputtering method, and thick film magnets with a thickness of about 100 to 50 ⁇ zrn can be manufactured using the plasma laser deposition (PLD) method. See JP-A-9-50611 and JP-A-2000-212766.).
  • the present invention has been made in view of the above points, and provides a permanent magnet film which is efficiently and inexpensively obtained at a low cost, has a film thickness desired to be reduced in the future and has high magnetic properties, and a method for manufacturing the same.
  • the purpose is to do. Disclosure of the invention
  • the crystal lattice may be displaced or fractured along a projected surface such as an interface between crystallites.
  • a new surface is formed on the slip surface or fractured surface, where the atoms that originally existed and were bonded to other atoms are exposed.
  • the layer of one atom of this new surface is exposed to an unstable surface state by an external force from the originally stable atomic bond state, and the surface energy becomes high.
  • the application of a continuous mechanical impact from the outside where the active surface joins the surface of the adjacent brittle material, the newly formed surface of the adjacent brittle material or the substrate surface and transitions to a stable state continuously causes this phenomenon. As a result, the deformation and crushing of the fine particles are repeated, so that the bonding progresses and densifies, and a brittle material is formed.
  • the present invention further provides a mechanical impact force obtained by colliding a material with a base material using a carrier gas, and directly forming a polycrystalline structure of the material on the base material. is there.
  • a mechanical impact force obtained by colliding a material with a base material using a carrier gas, and directly forming a polycrystalline structure of the material on the base material.
  • an aerosol in which fine particles of a material such as a magnetic metal powder or a ferrite magnetic powder used as a raw material for forming a magnetic film are dispersed in a gas is conveyed, and the sol is jetted onto the surface of the base material at a high speed. And collide to break or deform the fine particles, form a layer of anchor at the interface with the substrate and join them together, and join the crushed or deformed fine particles together By doing so, it is possible to obtain a film structure having good adhesion to the substrate, high strength, and high strength.
  • a method for producing a permanent magnet film according to the present invention is a method for producing
  • the film thickness of 1 ⁇ m or more, which was difficult with the conventional sputter method, and 300, m or less, which was difficult with the conventional bonded magnet The film can be formed efficiently and at low cost.
  • the magnetic film formation by the AD method is a low-temperature process, there is little influence on a film-forming target.
  • the crystal grain size of the film obtained by molding at low temperature is from several ⁇ m to several hundred nm, or less than 10 O nm, and the exchange coupling between magnetic particles has a large effect and high magnetic characteristics.
  • a magnetic film exhibiting properties can be obtained.
  • the magnetic film formed by the AD method almost matches the composition of the powder charged before the formation, the degree of freedom in the composition of the magnetic film can be remarkably improved as compared with the conventional sputtering method. And a magnetic film having a stable composition can be easily formed.
  • the magnetic film obtained by the AD method has a large adhesion strength to a film-forming object.
  • an optical target is not required unlike a conventional spa, a magnetic film can be formed at low cost.
  • a soft magnetic phase such as Fe, Co, and FeCo, which exhibit high saturation magnetization, and a hard magnetic phase, both phases are prayed in nanometer order. It is also possible to manufacture the obtained nanocomposite magnet thick film.
  • the method for producing a permanent magnet film according to the present invention may further comprise the steps of: providing a permanent magnet material powder, a metal magnetic powder or a ferrite compound powder, or a mixture of a metal magnetic powder and a ferrite compound powder; a metal magnetic powder and a polymer It is characterized by comprising a mixture of material powders, a mixture of ferrite compound powders and polymer material powders, a mixture of metal magnetic powder, a fluoride compound powder and a polymer material powder.
  • the method for producing a permanent magnet film according to the present invention is characterized in that the permanent magnet film is formed at room temperature, and the film is formed at room temperature or higher while heating the object to be formed.
  • the structure of the magnet film can be changed, and the magnetic properties of the magnet film can be controlled according to the application.o
  • a permanent magnet film made of metal magnetic powder having permanent magnet capability It has a magnetic phase containing an amorphous layer of 20 nm or less, preferably 10 nm or less between crystal grains, and has a Vickers hardness of 200 to; L 000Hv, preferably 300 to 800 HV, and a coercive force of 0.2T. As described above, it is preferably 1.7 T or more.
  • the permanent magnet film of the present invention is a permanent magnet film made of a ferrite compound powder having a permanent magnet capability, and has a magnetic phase including an oxide layer of 10 to 20 nm or less between crystal grains of the ferrite compound powder. It has a Vickers hardness of 200 to; L000Hv, preferably 300 to 800 HV, and a coercive force of 0.2 T or more, preferably 1.7 T or more.
  • the permanent magnet film of the present invention is preferably a permanent magnet film comprising a mixture of a magnetic metal powder having a permanent magnet function and a ferrite compound powder, wherein the distance between crystal grains of the magnetic metal powder is 20 nm or less.
  • the permanent magnet film of the present invention is a permanent magnet film comprising a mixture of a magnetic metal powder having a permanent magnet function and a polymer material powder, wherein the permanent magnet film includes a polymer layer between crystal grains of the magnetic metal powder. It is characterized by having a phase.
  • the permanent magnet film of the present invention is characterized in that the metal magnetic powder is composed of one or more kinds of metal magnetic powder.
  • the permanent magnet film of the present invention is characterized in that the fluoride compound powder is composed of one or more ferrite compound powders.
  • the permanent magnet film of the present invention is characterized in that the thickness of the permanent magnet film is 2 ⁇ 111 to 500 ⁇ m.
  • the permanent magnet film of the present invention is characterized in that the thickness of the permanent magnet film is 2 m to 30 Om.
  • the permanent magnet film of the present invention is characterized in that the thickness of the permanent magnet film is 2 / m to 200 ⁇ m.
  • the permanent magnet film of the present invention is characterized in that it is formed without solder on a Si substrate, a metal substrate or a resin substrate having a thickness of 20 O ⁇ m or less. Further, the permanent magnet film of the present invention is formed on an Si substrate, a metal substrate or a resin substrate with an adhesion strength of 50 MPa or more.
  • FIG. 1 is a schematic diagram of a magnetic film manufacturing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a magnetic film obtained by the AD method according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing a demagnetization curve of the magnetic characteristics of the SmFeN powder (average powder particle size 3 Urn) used in the AD method according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing an appearance photograph of an SmFeN film produced by using the AD method according to the embodiment of the present invention.
  • FIG. 5 is a diagram showing an X-ray diffraction pattern of a thick SmFeN film produced by the AD method according to the embodiment of the present invention under the conditions of a gas flow rate of 4 to 10 lZmin and a deposition time of 4 minutes. is there.
  • FIG. 6 is a diagram showing the gas flow rate dependence of the film thickness of the SmFeN film produced by the AD method according to the embodiment of the present invention in the AD method.
  • FIG. 7 is a diagram showing the time dependence of the film thickness of the SmFeN film in the AD method according to the embodiment of the present invention.
  • FIG. 8 is a view showing an optical microscope structure of the SmFeN film obtained by the AD method according to the embodiment of the present invention under the condition of a gas flow rate of 61 Zmin and a deposition time of 4 minutes.
  • FIG. 9 is a diagram showing a scanning electron microscopic structure of the SmFeN film obtained by the AD method according to the embodiment of the present invention under the conditions of a gas flow rate of 61 min min and a deposition time of 4 minutes.
  • FIG. 10 shows the influence of the gas flow rate in the AD method on the micro Vickers hardness of the SmFeN thick film produced by the AD method according to the embodiment of the present invention under the condition that the film formation time is 4 minutes.
  • FIG. 11 is a diagram showing the results of magnetic measurement.
  • FIG. 12 is a diagram showing the gas flow rate dependence of the magnetic properties.
  • FIG. 13 is a diagram showing the dramatic time dependence of the magnetic properties of a thick SmFeN film formed at a gas flow rate of 41 Zmin and 81 / min.
  • FIG. 14 is a diagram showing a situation in which a thick film composed of crystal grains having large metal magnet compound powder particles as nuclei and small oxide powder disposed around the particles is obtained.
  • FIG. 15 is a diagram showing the gas flow rate dependence of the coercive force in an AD thick film using M-type ferrite powder.
  • FIG. 1 is a schematic diagram of a magnetic film manufacturing apparatus.
  • the magnetic film of the present invention is formed by aerosol-deposition method (hereinafter, referred to as “AD The law is used.)
  • AD aerosol-deposition method
  • a magnetic film having a desired composition and thickness can be efficiently manufactured by aerosolizing raw material powder having a composition equal to the composition of a target magnetic film and causing the material powder to collide with an object to be formed. .
  • the magnetic film forming apparatus 10 for performing the AD method includes a mixer 11, a channel 12, a mouth pump, and a mechanical booth pump 13.
  • the raw material powder 14 is charged into the mixer 11, and the raw material powder 14 charged therein is mixed by the vibration of the mixer 11. This eliminates bias in the particle size distribution in the mixer when the raw material powder 14 is a single type of powder, and uniformly mixes them when the raw material powder 14 is a plurality of types of powder. The deviation of the particle size distribution can be eliminated.
  • a nozzle 15 connected to the mixer 11 via a pipe is arranged in the channel 12, and the raw material powder 14 in the mixer 11 is supplied from the gas cylinder 17 from the tip of the nozzle 15. Is aerosolized by the above gas and ejected.
  • the substrate 20 is arranged on the tip end side of the nozzle 15 via a mask 16. When the raw material powder 14 is jetted, the particles 14 a collide with the surface of the substrate 20 not covered with the mask 15.
  • the inlet / outlet pump and the mechanical booth pump 13 are used for adjusting the pressure in the chamber 12.
  • the pressure in the chamber 12 is set to 10 2 Torr or less.
  • the formation of the magnetic film can be performed at normal temperature such as room temperature.
  • the optimum speed varies depending on the type of material, but is in the range of 200 to 800 m / sec for brittle materials and 400 to 80 Om / sec for fine metal particles.
  • a magnetic film having a desired film thickness can be manufactured at a high speed.
  • the thickness of the magnetic film is about the usual thickness in the conventional sputtering method, whereas the AD method can form a magnetic film with a thickness in the range of 2 / m to 500 zm. Wear.
  • the film thickness to be formed is preferably 2 im to 30 OAdm, and more preferably 2 m to 200 m.
  • the deposition rate of the magnetic film by the AD method is as fast as about 10 ⁇ m Zmin, which is an industrially superior method.
  • FIG. 2 is a schematic diagram of a magnetic film obtained by the AD method.
  • a magnetic film 30 is formed in which fine particles that have collided with the film-forming object 20 which is a substrate are laminated on the surface thereof.
  • the magnetic film 30 has a structure having an amorphous layer of 20 nm or less between crystal grains of the fine particles when the metal magnetic material powder is used as a raw material, and the fine particles when a ferrite compound powder is used as a raw material. It has a magnetic phase that contains an oxide layer (FeOx, SmOx, etc.) of 2 Onm or less between crystal grains.
  • the magnetic film formed by the AD method has a higher Beakers hardness than that formed by a conventional method such as a sintering method or a thermal spraying method. It has a hardness of 20 OHv to 100 OHv, preferably 300 Hv to 80 OHv, depending on the conditions at the time of production, for example, the injection speed and the like.
  • the magnetic film thus formed almost matches the composition of the powder charged before the formation.
  • the conventional sputtering method it is necessary to determine the composition ratio of the magnetic film to be formed based on the area of the target used, and to develop an optimal structure by heat treatment.
  • the AD method the degree of freedom of composition of a magnetic film that can be formed can be remarkably improved.
  • Gold magnetic powders used as raw materials for forming magnetic films by the AD method are Fe, Co ⁇ Ni, In addition to Mn simple metals, FeAlNi Co, CuNiFe, CuNiCo, FeCrCo, FePt, CoPt, RFeB, RCo, RFeN, MnAl, MnAlC alloys, etc. Can be. Further, nanocomposite powders of these metallic magnetic phases and Fe 3 B phase, Fe phase and the like can also be used.
  • spinel Blow wells compounds such as C o 0 ⁇ F e 2 ⁇ 3 as Fuwerai bets magnetic powder, BaFe 12 0, S r F e 0 19 M -type ferrite compounds such as, BaFe 18 0 27, S rFe 18 ⁇ 27 it is possible to use a W-type ferrite compounds such as.
  • the particle diameters of the metal magnetic powder and the ferrite compound powder are approximately several tens nm to several // m. Further, a mixed powder of the above-mentioned metal magnetic powder and ferrite magnetic powder can be used.
  • oxide powders of different sizes such as a mixture of oxide powders such as ferrite magnetic powders of several tens nm to sub / m size and metal petrochemical compound powders such as rare earth magnet compound powders of several ⁇ m size, and metal magnet compounds
  • a film is formed by the AD method using a powder mixed with a powder or a powder in which an oxide powder is supported on a metal magnet compound powder, particles of a large metal magnet compound powder as shown in FIG. 14 are nucleated. As a result, a thick film composed of crystal grains around which small iridescent powder is arranged is obtained.
  • metal magnetic substance powder and polymer material powder or mixed powder of metal magnetic substance powder, ferrite magnetic powder and polymer material powder, or ferrite magnetic powder and polymer material powder.
  • polymer material powder acryl-based, nylon-based, epoxy-based, polyamide-based, or polyimide-based resin is used.
  • Magnetic film obtained by using the AD method, very strongly attached to the film formation was a glass substrate, S i 0 2 substrate, Fe, Cu, metal such as Mg alloy, A 1 2 ⁇ 3 It can also be formed on ceramics such as ceramics, and polymer materials such as polycarbonate and ABS resin.
  • a micro motor or a micro actuator using a thin film magnet or a thick film magnet is formed, it is required to form a magnet film on such a thin substrate.
  • a thin magnet film is adhered on the above substrate having a thickness of ⁇ m to 200 zm with an adhesive, the application of the adhesive layer and the attachment of the magnet film are extremely difficult, and there is a major problem in productivity.
  • a specific portion table of a thin substrate material having a thickness of 200 zm or less can be easily formed by spraying magnet material fine particles.
  • the magnet film can be formed only on the surface.
  • the composition of the magnetic film formed of the AD film is determined by the composition of the raw material powder, and a magnetic film having a stable composition can be easily formed, and a magnetic film having high magnetic properties can be formed.
  • the magnetic film formation by the AD method is a low-temperature process, there is little effect on a film-formed object to be formed. Further, since a high-priced evening gate is not required unlike the conventional spa, it is possible to form a magnetic film at low cost.
  • the magnetic film obtained by the AD method has a very strong adhesion strength to the object to be formed, of 50 MPa or more even with a film thickness of 2 ⁇ m or more. Stability can be improved. Furthermore, it is possible to form a magnetic film having a film thickness of 1 JU.m or more, which was difficult to form by the conventional sputtering method, and a thickness of 300 ⁇ m or less, which was difficult with the conventional bond magnet. Therefore, a magnetic film can be arbitrarily formed on a variety of materials, parts, and the like according to their use or space.
  • VSM vibrating magnetometer
  • Fig. 3 shows the demagnetization curve.
  • the vertical axis is the magnetic polarization J (T)
  • the horizontal axis is the magnetic field /. ⁇ ( ⁇ ).
  • the host SmFeN powder has a remanent Br of about 0.7 T and a coercive force of about 1.2 T ⁇ . It can be seen that it has H.
  • Fig. 4 shows a photograph of the appearance of the SmFeN film produced by the AD method.
  • the gas flow rate in the AD method was varied from 2 lZmin to 101 / min, and the deposition time was kept constant at 4 minutes.
  • Figure 5 shows an X-ray diffraction pattern of a thick SmFeN film produced by the AD method under the conditions of a gas flow rate of 4 to 10 l / min and a deposition time of 4 minutes.
  • the vertical axis represents X-ray intensity
  • the horizontal axis represents 26 2.
  • Almost all the X-ray diffraction peaks can be indexed by the Tb 2 Fe 17 type structure, and the obtained thick film is considered to be composed of SmaFenN X-based compounds.
  • AD method Before and after AD method It is presumed that there is no change in the appearance phase, and this is a feature of the AD method in which the crystal structure does not change before and after film formation, and is a method different from other methods such as the sputtering method.
  • FIG. 6 shows the gas flow rate dependence of the thickness of the SmFeN film produced by the AD method in the AD method.
  • the horizontal axis of FIG. 6 represents the gas flow rate (lZmin) in the AD method, and the vertical axis represents the film thickness (1 m).
  • the film formation time was fixed at 4 minutes. From this, a film thickness of 45 / m or more was obtained by jetting at a flow rate of 81 / min for about 4 minutes, and the film formation rate calculated from this was 10 im / min or more.
  • O shows that the film was formed at high speed by the method.o
  • Figure 7 shows the dependence of the SmFeN film on the deposition time in the AD method.
  • the horizontal axis in FIG. 7 shows the film formation time (min) in the AD method, and the vertical axis shows the film thickness (jum). From this, it was found that the longer the film formation time, the thicker the film thickness, and the film thickness of 81Zmin was larger than the film thickness of 41Zmin. In addition, it is difficult to produce a thick film of this thickness by cutting a sintered magnet, and the superiority of this method, which can form a thick film in a short time of 4 minutes, can be seen.
  • FIGS. 8 and 9 show the optical microscopic structure and the scanning electron microscopic structure of the SmFeN film obtained by the AD method under the conditions of a gas flow rate of 61 / min and a film forming time of 4 minutes. It can be seen that the obtained thick film is formed by bonding particles of several tens nm to several // m. In view of the fact that high-temperature sintering causes crystal grain growth in the sintering method and crystal grains grow to 5 m or more, this method is a method that can produce a thick film composed of fine crystals. You can say that.
  • Fig. 10 shows the effect of the gas flow rate in the AD method on the micro Vickers hardness of the SmFeN thick film produced by the AD method under the conditions of the obtained film formation time of 4 minutes.
  • the vertical axis shows the picker hardness HV, and the horizontal axis shows the gas flow rate gfr (l / min).
  • the HV does not change much depending on the gas flow rate, indicating a high hardness of 600 to 800.
  • FIG. 11 is a diagram showing the results of magnetic measurement.
  • the horizontal axis represents the magnetic field intensity ⁇ .
  • H (T) and the vertical axis indicate the magnetic polarization J (T), respectively.
  • Magnetic properties of SmFeN film with a thickness of 18 ⁇ m formed by AD method were measured.
  • the obtained coercive force ⁇ . H is 1.7 T, and the formed SmFeN film shows a higher coercive force than the coercive force of the raw material powder shown in FIG.
  • Fig. 12 shows the gas flow rate dependence of the magnetic properties.
  • the horizontal axis is the gas flow in the AD method min)
  • the vertical axis is the saturation magnetic polarization J s (T)
  • the residual magnetic flux density B r (T) the coercive force //.
  • Hcj (T) is represented. This indicates that a coercive force of about 1.8 mm was obtained at all gas flow rates.
  • Fig. 13 shows the dependence of the magnetic properties of the SmFeM thick film deposited at a gas flow rate of 41 / min and 81 / min on the deposition time. From this, it can be seen that a coercive force of about 1.8 T was obtained at almost all times. Judging from Figs. 12 and 13, the SmFeN thick film prepared by this AD method can be said to have a higher coercive force than the magnetic powder of the host, as shown in Figs. 8 and 9. It is presumed to be related to the fact that the thick film formed in the above is composed of fine particles.
  • the flight speed of the SmFeN raw material particles injected from the nozzle (opening: 0.4 X 5 mm) used in the experiment increases in response to the increase in gas flow rate, but the flight speed described in the literature (JVSTA) is increased.
  • the gas flow rate is 20 OmZsec at 41 in 111 in. Therefore, it was clarified that the flying speed (injection speed) of the SmFeN material particles must be at least 20 Om / sec to obtain a good film.
  • M-type ferrite powder (average powder particle size 1.3 zm), which is a raw material for ferrite magnet powder, is used.
  • a coercive force of 0.14 to 0.25 T as shown in Fig. 15 was obtained.
  • this AD method can produce a thick-film magnet that generates coercive force with ferrite magnet powder in addition to rare-earth magnet powder. Therefore, this method can be said to be a method that can produce high coercivity thick film magnets even with various magnet materials.
  • this AD method is a method that can produce thinner magnets at a higher speed than conventional bonded magnets.
  • the AD method to form the permanent magnet film, it is possible to efficiently and efficiently form a magnetic film with a thickness of 300 mm or less, which was difficult with the conventional sputter method, and which was difficult with the conventional bonded magnet. It can be formed at low cost. In particular, it is possible to form a magnetic film having a film thickness in the range of 2 to 200 ⁇ m, which is expected to be thinner in the future.
  • the AD method Since the formation of the magnetic film by this is a low-temperature process, the influence on the film formation object is small.
  • the crystal grain size of the film obtained by molding at low temperature is from several ⁇ m to several hundred nm, or less than 10 O nm, and the exchange coupling between magnetic particles has a large effect and high magnetic characteristics.
  • a magnetic film exhibiting properties can be obtained.
  • the magnetic film formed by the AD method almost matches the composition of the powder to be charged before the formation, the degree of freedom in the composition of the magnetic film can be remarkably improved as compared with the conventional sputter method. And a magnetic film having a stable composition can be easily formed.
  • the magnetic film obtained by the AD method has a large adhesion strength to a film-forming object. Further, since an optical target is not required unlike the conventional sputtering, a magnetic film can be formed at low cost.
  • both phases are deposited on the order of nanometers to form a nanocomposite magnet thick film. Manufacturing is also possible.

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  • Thin Magnetic Films (AREA)

Abstract

L'invention concerne un procédé de production d'un film à aimant permanent présentant les capacités de rendement d'un aimant permanent, qui consiste à transformer une poudre d'un matériau magnétique permanent en aérosol et à pulvériser ledit aérosol sur un article devant recouvert du film à aimant permanent pour former le film à aimant permanent; ledit procédé, qui se caractérise en ce que la poudre d'un matériau à aimant permanent comprend une poudre métallique aimantée, une poudre de composé en ferrite, un mélange d'une poudre métallique aimantée et une poudre de composé en ferrite, un mélange d'une poudre métallique aimantée et une poudre de matériau polymère, un mélange d'une poudre de composé en ferrite et un poudre de matériau polymère, ou un mélange d'une poudre métallique aimantée, une poudre de composé en ferrite et une poudre de matériau polymère ; et un film à aimant permanent produit suivant ce procédé. Ledit procédé permet de produire un film à aimant permanent ayant une épaisseur escomptée pour un film magnétique mince dans le proche futur et présentant des caractéristiques magnétiques supérieures, avec un rendement élevé et à faible coût.
PCT/JP2004/004229 2003-03-26 2004-03-25 Film a aimant permanent WO2004086430A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003084710A JP4560619B2 (ja) 2003-03-26 2003-03-26 永久磁石膜
JP2003-084710 2003-03-26

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WO2004086430A1 true WO2004086430A1 (fr) 2004-10-07

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JP (1) JP4560619B2 (fr)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043079A1 (fr) * 2017-08-31 2019-03-07 Siemens Aktiengesellschaft Procédé de fabrication d'un aimant permanent, aimant permanent, machine électrique, appareil médical et véhicule électrique

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JP4868583B2 (ja) * 2006-09-04 2012-02-01 Ｎｅｃトーキン株式会社 インダクタ及びその製造方法
ITTO20080462A1 (it) * 2008-06-13 2009-12-14 Torino Politecnico Metodo per la produzione di magneti permanenti macroscopici nanostrutturati con elevata densita d energia magnetica e relativi magneti
JP5267665B2 (ja) * 2009-06-18 2013-08-21 トヨタ自動車株式会社 磁性粉末の製造方法及びその製造装置
JP2013135071A (ja) * 2011-12-26 2013-07-08 Nissan Motor Co Ltd 希土類磁石成形体および低温固化成形方法
DE102018212761A1 (de) * 2018-07-31 2020-02-06 Siemens Aktiengesellschaft Verfahren zur Fertigung eines Permanentmagneten, elektrische Maschine und Fahrzeug, insbesondere hybrid-elektrisches Luftfahrzeug
EP4280234A1 (fr) * 2021-01-14 2023-11-22 Powdertech Co., Ltd. Composite magnétique

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JPS5435900A (en) * 1977-08-15 1979-03-16 Philips Nv Method of forming magnetooptical polycrystalline cobalt ferrite layer on substrate
JP2002049318A (ja) * 2000-08-02 2002-02-15 Dainippon Ink & Chem Inc 可撓性磁石シート
WO2002036855A1 (fr) * 2000-10-23 2002-05-10 National Institute Of Advanced Industrial Science And Technology Structure composite et procede de fabrication
JP2002313615A (ja) * 2001-04-09 2002-10-25 Enplas Corp プラスチックマグネット用組成物
JP2003297629A (ja) * 2002-03-29 2003-10-17 Sony Corp 磁性膜
JP2003297628A (ja) * 2002-03-29 2003-10-17 Sony Corp 磁性膜およびその形成方法
JP2004124126A (ja) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 成膜装置及び成膜方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435900A (en) * 1977-08-15 1979-03-16 Philips Nv Method of forming magnetooptical polycrystalline cobalt ferrite layer on substrate
JP2002049318A (ja) * 2000-08-02 2002-02-15 Dainippon Ink & Chem Inc 可撓性磁石シート
WO2002036855A1 (fr) * 2000-10-23 2002-05-10 National Institute Of Advanced Industrial Science And Technology Structure composite et procede de fabrication
JP2002313615A (ja) * 2001-04-09 2002-10-25 Enplas Corp プラスチックマグネット用組成物
JP2003297629A (ja) * 2002-03-29 2003-10-17 Sony Corp 磁性膜
JP2003297628A (ja) * 2002-03-29 2003-10-17 Sony Corp 磁性膜およびその形成方法
JP2004124126A (ja) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 成膜装置及び成膜方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043079A1 (fr) * 2017-08-31 2019-03-07 Siemens Aktiengesellschaft Procédé de fabrication d'un aimant permanent, aimant permanent, machine électrique, appareil médical et véhicule électrique

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JP4560619B2 (ja) 2010-10-13

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