WO2004068580A1 - High-frequency circuit package and mounting configuration thereof - Google Patents

High-frequency circuit package and mounting configuration thereof Download PDF

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Publication number
WO2004068580A1
WO2004068580A1 PCT/JP2003/016562 JP0316562W WO2004068580A1 WO 2004068580 A1 WO2004068580 A1 WO 2004068580A1 JP 0316562 W JP0316562 W JP 0316562W WO 2004068580 A1 WO2004068580 A1 WO 2004068580A1
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WO
WIPO (PCT)
Prior art keywords
package
substrate
frequency circuit
ground
dielectric substrate
Prior art date
Application number
PCT/JP2003/016562
Other languages
French (fr)
Japanese (ja)
Inventor
Tomoyoshi Yamashita
Original Assignee
Ai Electronics Ltd.
Koa Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ai Electronics Ltd., Koa Kabushiki Kaisha filed Critical Ai Electronics Ltd.
Publication of WO2004068580A1 publication Critical patent/WO2004068580A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present invention relates to a high-frequency circuit package and a mounting structure thereof, and more particularly, to a structure of a high-frequency circuit package for mounting an r3 ⁇ 4′-frequency MMIC (Microwave Monolithic Integrated Circuit) and the like and a printed circuit board thereof. It relates to a mounting structure on a board.
  • MMIC Microwave Monolithic Integrated Circuit
  • FIG. 7 is a diagram showing an example of mounting a conventional high-frequency circuit package.
  • 60 A is a high-frequency circuit package for mounting an MM IC, etc.
  • 61 is a package ground substrate made of metal
  • 6 2 is a package dielectric substrate
  • 6 3 is a cover for protecting high frequency circuit elements
  • 6 4 is an electrode terminal for connecting a signal line and a power line
  • 6 6 is a connection line (ribbon, bonding wire, etc.)
  • 70 is a printed circuit board made of a strip line
  • ⁇ 1 is a dielectric board made of alumina or the like
  • 72 is a signal conductor on the top of the dielectric board
  • 73 is a ground conductor on the back of the dielectric board
  • 74 Denotes an opening corresponding to the package ground substrate 61 provided on the printed circuit board 70
  • 50 denotes a housing of the electronic circuit device
  • 51 denotes a recessed portion thereof.
  • An opening 74 is provided in the printed circuit board 70 in conformity with the external shape of the high-frequency circuit package 60 A in plan view, and the package ground board 61
  • the ground conductors 73 on the back of the printed circuit board are respectively fixed by contacting the common housing 50, and necessary electrical connection to the package electrode terminals 64 is made on the upper surface side of the printed circuit board 70.
  • the housing 50 is provided with a recessed portion 51.
  • FIG. 8 is a diagram illustrating another example of mounting a conventional high-frequency circuit package, and illustrates a mounting example of a surface-mount type high-frequency circuit package.
  • Fig. 8 (A) is the bottom view of the high-shoulder circuit package
  • Fig. 8 (B) is the side view of an example of mounting on a printed circuit board
  • Fig. 8 (C) is the same bottom view (viewed from the back of the printed circuit board).
  • 60 B is a package for a surface-mount type high-frequency circuit
  • 63 is a lid at the top of the package
  • 64 a is provided on the bottom of the package for connection to an external circuit.
  • Signal terminals, 64b are also power terminals, 64c are also ground electrodes, 70 is a printed circuit board with strip lines, 71 is its dielectric substrate, and 72a is the top surface of the printed circuit board. 7b is the power supply conductor, 72c is the ground electrode, 73 is the ground conductor on the back of the printed circuit board, and 74c is the ground electrode on the top of the printed circuit board.
  • a plurality of via holes for connecting between the ground conductor 73 and 50 are the housing of the electronic circuit device. .
  • the high-frequency circuit package 60B is placed on the upper side of the printed board 70, and its signal terminal 64a is connected to the signal conductor wire 72a on the upper surface of the board.
  • the power supply terminal 64b is connected to the power supply conductor wire 72b, and the center ground electrode 64c is connected to the ground electrode 72c by soldering or the like.
  • a large number of via holes are provided between the ground electrode 72 c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface. Also called 7) 4c.
  • the surface mounting component (8) mounted on the surface mounting component mounting board (2) is inserted into the opening (4) provided in the printed circuit board (14).
  • a mounting structure of a surface mounting component in which a printed circuit board (14) and a surface mounting component mounting substrate (2) are joined and fixed Japanese Patent Application Laid-Open No. Hei 10-12632.
  • connection wire 66 In the connection part, the uniform relationship between the signal conductor wire 72 on the printed circuit board surface and the ground conductor 73 on the back surface (that is, the cross-sectional shape, dimensions, permittivity as a strip line) is obtained. ), The high-frequency characteristics (characteristic impedance, transmission line wavelength, attenuation, etc.) of the line deteriorate significantly.
  • the present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure have been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-menti
  • the high-frequency circuit package 10 A of the present invention (1) has an electrode terminal 14 a connected to the high-frequency circuit element 15 on an upper surface of a package ground substrate 11 for mounting the high-frequency circuit element 15. , 14b, and an upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12.
  • the package ground substrate 11 since the upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12, such a high-frequency circuit package 10 A can be mounted on a printed circuit board or a housing. Mounting is easy, and the top surface of the package ground substrate 11 can be directly joined to the ground conductor on the back surface of the printed substrate, so that good high-frequency characteristics can be obtained.
  • the mounting structure of the high-frequency circuit package of the present invention (2) is similar to that of the high-frequency circuit package 10 A of the present invention (1), except that the dielectric substrate 12 is replaced by a flexible print substrate 3. 0, and is fitted into an opening of substantially the same size as the dielectric substrate provided on the printed circuit board.
  • the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (solder Attachment, conductive bonding, etc.).
  • the structure in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the print substrate provides a uniform, stable and reliable ground therebetween. Good connection with good circumference Wave characteristics are obtained.
  • the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and a sufficient heat radiation effect of the high-frequency circuit element can be obtained.
  • the ground conductor 33 on the back of the flexible print substrate 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground substrate 11, so that the package ground substrate 11 Therefore, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50.
  • the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 32b on the upper surface of the printed circuit board can be made with a short distance and with little step. Therefore, it is possible to operate satisfactorily and stably even at high frequency without using unnecessary reactance (inductance).
  • the high-frequency circuit package 10 B of the present invention (3) is a dielectric substrate 12 installed on the upper surface of the package ground substrate 11 for mounting the high-frequency circuit element 15, It comprises a signal electrode 14 a for connection to the high-frequency circuit element 15, a power supply electrode 14 b, and a ground electrode 14 c provided so as to extend around these electrodes.
  • a ground electrode 14c is joined to the upper surface of the package ground substrate 11 via a plurality of via holes 17c, and has a lid protrusion for internal protection at the center of the dielectric substrate 12 Things.
  • the package ground electrode 14c is provided on the upper surface of the package dielectric substrate 12, the upper surface of the ground electrode 14c and the ground conductor on the rear surface of the print substrate are directly connected. Joining is possible, so that good high-frequency characteristics can be obtained.
  • the package ground substrate 11 that can directly support the high-frequency circuit element 15 can be brought into direct contact with the upper surface of the housing, so that a sufficient heat radiation effect can be obtained.
  • the package for a high-frequency circuit according to the present invention (1) or (3) is, for example, as shown in FIG. 4, the package ground substrate 11 is a metal substrate or a metallized layer 11 a on the upper surface. It consists of a provided dielectric substrate.
  • a metal plate is used as the package ground substrate 11 in order to secure the ground connection of the high-frequency circuit element 15 and obtain a sufficient heat radiation effect.
  • the high-frequency circuit package 10A A uniform and reliable ground connection is obtained between the substrate and the printed circuit board 30.
  • a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11.
  • the package ground substrate 11 can be configured at low cost. Also, in the case of FIG.
  • the plurality of ground electrodes 14 c directly connected to the ground conductor 33 on the back of the printed circuit board 30 are connected to the upper surface 1 of the package ground substrate 11 via the plurality of via holes 17 c. 1a, there is no problem in ground connection between the high-frequency circuit package 10B and the ground conductor 33 on the back of the printed circuit board. Therefore, this type of high-frequency circuit device is inexpensive in various modes. Can be configured.
  • the above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (5) is the same as that of the high-frequency circuit package 10 B of the present invention (3), and at least the lid joined to the center of the upper surface of the dielectric substrate.
  • the projecting portion (that is, for example, the portion of the lid 13 in FIG. 5) is fitted into an opening 35 provided on the flexible print substrate 30 and having substantially the same size as the lid projecting portion.
  • the ground electrode 14c on the upper surface and the ground conductor 33 on the back of the printed circuit board around the opening 35 are joined (solder, conductive bonding, etc.).
  • the ground electrode 14c on the top surface of the package dielectric substrate 12 and the back surface of the print substrate around the print substrate opening 35 are provided.
  • a uniform, stable, and reliable ground connection can be obtained between them, and thus good high-frequency characteristics can be obtained.
  • a package ground substrate (a metal substrate or an aluminum substrate having a metallized upper surface) 11 for supporting a high-frequency circuit element can be brought into direct contact with the housing 50 of the device, and a sufficient amount of the high-frequency circuit element can be obtained. A heat radiation effect is obtained.
  • the ground conductor 33 on the back side of the flexible printed board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is unlikely to occur between the printed circuit board 30 and the housing 50.
  • the mounting structure of the high-frequency circuit package according to the present invention (6) is different from the above-mentioned present invention (2) in that the electrode terminals 14a and 14b on the upper surface of the package dielectric substrate 12 as shown in FIG.
  • a flexible printed circuit board 30 is provided with a tongue-shaped portion 34a, 34b near the opening 35 on the upper surface of the conductor wire at the tip thereof. Via holes 38. Accordingly, since a separate connection line 36 and a connection step for the connection line are not required, the connection is stable and the production is easy.
  • the mounting structure of the high-frequency circuit package of the present invention (7) has, for example, as shown in FIG. 6, an electrode terminal connected to the high-frequency circuit element on the upper surface of a package ground substrate 11 for mounting the high-frequency circuit element.
  • a high-frequency circuit package 10 C having a dielectric substrate 12 is mounted, and the package ground substrate 11 is provided on a flexible printed circuit board 30 with an opening 35 having substantially the same size as the dielectric substrate. Then, the peripheral surface of the package 'ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (soldering, conductive bonding, etc.).
  • FIG. 1 is a diagram showing the structure of the high-frequency circuit package according to the first embodiment
  • FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment
  • FIG. FIG. 2 shows a mounting structure of the high-frequency circuit package according to the embodiment (2)
  • FIG. 4 shows a structure of the high-frequency circuit package according to the second embodiment
  • FIG. 5 shows a high-frequency circuit according to the second embodiment
  • FIG. 6 is a diagram showing a mounting structure of a package for a high frequency circuit according to a third embodiment
  • FIG. 6 is a diagram illustrating a conventional technology (1)
  • FIG. FIG. 2 is a diagram (2) explaining a conventional technique.
  • FIG. 1 is a diagram showing the structure of a high-frequency circuit package according to the first embodiment, in which the upper surface of a package ground substrate 11 is provided wider than the package dielectric substrate 12.
  • 1 (A) is a side view
  • FIG. 1 (B) is a top view
  • FIG. 1 (C) is a side sectional view, where 10A is a high-frequency circuit according to the first embodiment.
  • 11 is a ground substrate made of metal
  • 12 is a dielectric substrate made of alumina or the like
  • 13 is a cover for protecting internal high-frequency circuit elements
  • 14a is a dielectric to connect to external circuits.
  • Signal terminals provided on the upper surface of the board 12, 14b are the same
  • the power supply terminal, 15 is a high-frequency circuit element such as an MM IC
  • 16 is a connection wire (ribbon, bonding wire, etc.) connecting the high-frequency circuit element and the electrode terminals 14a and 14b.
  • the high-frequency circuit element 15 is adhered on the package ground substrate 11, and the element 15 is connected to the signal terminal 14 a and the power supply terminal 14 b by a connection line 16. Furthermore, they were adhered to the lid 1 3 _ on the side of the package the dielectric substrate 1 2 to protect, it is possible to form a high-frequency circuit package as a whole.
  • the upper surface of the package ground substrate 11 is exposed around the dielectric substrate 12.
  • the ground conductor on the back of the printed circuit board can be directly joined (soldered, etc.) to this exposed part.
  • a metal plate is used as the package ground substrate 11 in order to obtain a reliable ground connection of the high-frequency circuit 15 and a sufficient heat radiation effect.
  • the high-frequency circuit package 10 A uniform and reliable ground connection is obtained between A and the printed circuit board 30.
  • a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11.
  • the package ground substrate 11 can be configured at low cost.
  • FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment, showing a case where the high-frequency circuit package 10A of FIG. 1 is mounted on a flexible printed circuit board 30. ing.
  • Figure 2 (A) is a side view of the mounted state
  • Figure 2 (B) is a top view, where 10A is the high-frequency circuit package shown in Figure 1 above, and 14a is the package.
  • signal Terminal 14b is also a power supply terminal.
  • reference numeral 30 denotes a flexible printed circuit board made of, for example, a strip line
  • 31 denotes a dielectric substrate thereof (Teflon (registered trademark) or the like)
  • 32a denotes a signal conductor line on the upper surface of the dielectric substrate
  • 3 2b is the same power supply conductor wire
  • 33 is the ground conductor on the back of the dielectric substrate
  • 35 is the printed circuit board 30, and it is provided corresponding to the top view shape of the package dielectric substrate 12
  • An opening, 36 is a connection line (a repong, a bonding wire, etc.)
  • 37 is a ground contact surface between the upper surface of the package ground substrate 11 and the ground conductor 33 on the back of the printed substrate 30, and 40 is a ground contact surface.
  • the printed circuit board holder 50 is a housing of the electronic circuit device.
  • the back surface of the printed circuit board 30 is fitted into the opening 35, and the ground conductor 33 on the back of the printed circuit board is brought into contact with the exposed surface on the upper side of the package ground substrate 11 to form a ground contact surface 37, between them. Adhere and fix by soldering. Further, the signal terminals 14a and the power terminals 14b of the package and the signal conductors 32a and the power conductors 32 on the upper surface of the printed circuit board are connected by the connection wires 36, respectively. Form a printed circuit board assembly.
  • the respective portions of the ground conductors 33 on the rear surface of the package ground substrate 11 and the rear surface of the printed circuit board are brought into contact with the upper surface of the housing 50 and fixed.
  • the high-frequency circuit package 10 A must be mounted so that the ground conductor 33 on the back of the flexible printed circuit board 30 adheres to the housing 50 as close as possible to the package ground substrate 11.
  • the printed circuit board 30 is pressed against the housing 50 by the printed circuit board retainer 40 and fixed with screws or the like.
  • the first embodiment it is possible to provide a recessed portion for sinking a part of the high-frequency circuit package 10 A on the surface of the housing 50.
  • the amount of flexure of the flexible printed circuit board 30 is sufficiently small I can do it.
  • the printed circuit board 30 may be simply screwed to the housing 50 without using the printed circuit board retainer 40 as described above.
  • the configuration in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the printed circuit board is uniform, stable and reliable between them. Good high-frequency characteristics are obtained because a ground connection is obtained. It is also easy to handle this type of printed circuit board assembly when assembling this type of high-frequency circuit device.
  • the rear surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and the high-frequency circuit element 15 can have a sufficient heat radiation effect.
  • the ground conductor 33 on the back of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50.
  • the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 3.2b on the upper surface of the printed circuit board is made with a short distance and with little step. It is possible to operate satisfactorily and stably even at high frequencies without any unnecessary reactance (inductance).
  • FIG. 3 is a diagram (2) showing the mounting structure of the high-frequency circuit package according to the first embodiment.
  • the signal terminal 14a and the power supply terminal 14b of the high-frequency circuit package 1OA are connected to the printed circuit board 30.
  • the figure shows a case where the signal conductor line 32a and the power supply conductor line 32b can be directly connected without passing through a separate connection line 36.
  • FIG. 3 (A) is a side view of a mounted state
  • FIG. 3 (B) is a top view.
  • 34 a is a flexible dielectric substrate 3 near the opening 35 of the printed substrate 30.
  • FIG. 1 is a tongue for a signal conductor cut into a tongue for a signal conductor line 32a
  • 34b is a tongue for a power conductor also cut tongue for a power conductor wire 32b , 38 are the tip ends of the signal conductor wire 32a and the power conductor wire 32b on the upper surface of the signal conductor tongue 34a and the power conductor tongue 34b.
  • It is a fire hole (also called a through hole) provided in the section.
  • the ground conductor 33 is not provided on the back surface of the signal conductor tongue 34 a of the printed circuit board 30.
  • the signal conductor wire 32 a on the upper surface of the printed board 30 is connected to the package signal terminal 14 a via the via hole 38 at the tip of the board.
  • the mounting structure of the other parts may be the same as that described in FIG. According to this mounting structure, since it is a simple configuration that does not require a separate connection by the connection line 36, the reliability of the signal line connection and the power supply line connection is high, and the high-frequency characteristics are improved. Also, manufacturing costs can be reduced.
  • FIG. 4 is a diagram showing the structure of a high-frequency circuit package according to the second embodiment, in which a package ground electrode 14c is provided on the same surface around a package signal terminal 14a and a power supply terminal 14b. Is shown. 4 (A) is a side view, FIG. 4 (B) is a top view, and FIG. 4 (C) is a side sectional view.
  • 10 B is a high-frequency circuit package according to the second embodiment
  • 11 is a ground substrate
  • 11 a is a metallized layer on the top surface of the ground substrate
  • 12 is a package dielectric substrate
  • 13 is a lid
  • 14 a is a signal terminal provided on the upper surface of the dielectric substrate 12
  • 14b is also a power supply terminal
  • 14c is also a dull electrode
  • 17c is a via hole (through hole) penetrating from the ground electrode 14c to the back of the dielectric substrate 12
  • 15 is an MM IC etc.
  • And 16 are connection wires (ribbon, bonding wire, etc.).
  • a high-frequency circuit element 15 is bonded on the metallized layer 11a, and the periphery thereof is bonded to a package dielectric substrate 12 having an opening in the center of the package. Surround more.
  • the signal and power supply are connected to the high-frequency circuit element 15 via the signal terminal 14 a and the power supply terminal 14 b on the top surface of the package dielectric substrate 12, respectively, and are protected by connecting wires 16 respectively. It is possible to bond the lid 13 to the upper part as much as possible to form a high-frequency circuit package as a whole.
  • a signal terminal 14a, a power supply terminal 14b, and a ground electrode 14c are provided on the same surface so as to surround them.
  • the package ground substrate 11 may be made of a metal plate.
  • FIG. 5 is a diagram showing a mounting structure of a high-frequency circuit package according to the second embodiment, and shows a case where the high-frequency circuit package 10 B of FIG. 4 is mounted on a flexible printed circuit board 30.
  • FIG. 5 (A) is a side view of a mounted state
  • FIG. 5 (B) is a top view.
  • reference numeral 35 denotes a printed board 30 and a cover 13 in a top view shape] ⁇ 3a
  • the signal conductor extending to the end face of the opening 35, 32b is the power supply conductor
  • 38a is the signal conductor 32a extending to the end face of the opening.
  • a via hole provided at the tip, 38b is a via hole provided at the tip of the power supply conductor 32b.
  • the inner opening 35 c is joined to the entire opening surface of the package ground electrode 14 c when viewed from above, but the other package terminals 14 a And 14b so that they do not come into contact with it.
  • the signal conductor line 32a and the power supply conductor line 32b on the surface of the printed circuit board extend right above the package signal terminal 14a and the power supply terminal 14b, respectively.
  • High-frequency circuit package 10 B lid on opening 35 of printed circuit board 30
  • the part of the body 13 is inserted from the back, and the ground electrode 14c on the top of the package dielectric substrate 12 is bonded and fixed to the ground conductor 33 on the back of the printed board by soldering or the like.
  • the connection of the signal to the signal terminal 14a is made through a via hole 38a provided at the end of the signal conductor 32a, and to the power terminal 14b.
  • the power supply is connected through a via hole 38b provided at the end of the power supply conductor wire 32.
  • the printed circuit board retainer 40 is used for the same purpose as described above.
  • a connection line 36 may be separately used instead of the connection via the via holes 38a and 38b.
  • FIG. 6 is a diagram showing a mounting structure of a high-frequency circuit package according to the third embodiment, and shows a configuration having characteristics different from those of a conventional high-frequency circuit package.
  • 10 C denotes a high-frequency circuit package
  • the ground substrate 11 and the dielectric substrate 12 of the package 10 C usually have the same area.
  • Reference numeral 35 denotes an opening provided corresponding to the shape of the printed substrate 30 as viewed from above of the package dielectric substrate 1].
  • the entire high-frequency circuit package 10 C is inserted into the opening 35 from the back of the printed circuit board 30, and the ground conductor 33 on the back of the printed circuit board 30 is brought into contact with the peripheral side surface of the package ground board 11. Adhere and fix by soldering.
  • connection lines 36 connect between the signal terminals 14a and the power supply terminals 14b on the upper surface of the package dielectric substrate 12 and the signal conductor lines 32a and the power supply conductor lines 32b on the upper surface of the printed circuit board, respectively. Connections, thus forming a printed circuit board assembly.
  • each part of the package ground substrate 11 of this assembly and the ground conductor 33 on the back of the printed circuit board is brought into contact with the upper surface of the housing 50 and fixed.
  • the ground conductor 33 on the back of the flexible printed circuit board should be in close contact with the housing 50 as close as possible to the periphery of the package ground board 11.
  • the printed circuit board 30 surrounding the package ground board 11 is pressed against the housing 50 with the printed board presser 40 and fixed with screws or the like.
  • a thermal conductive agent 41 such as silicon dally is filled so as to fill the gap between the print substrate 30 and the housing 50 on the back and periphery of the high-frequency circuit package 10C. It is possible to do.
  • the heat conductive agent 41 is placed in the space between the package ground substrate 11 and the housing 50 and in the space between the printed circuit board 30 and the housing 50 near the high-frequency circuit package 10 C as described above. By filling, heat generated from the high-frequency circuit element can be efficiently dissipated.
  • the use of the heat conductive agent 41 can be applied to heat radiation of each part in the mounting structure according to the first and second embodiments.
  • the housing 50 is not provided with a recessed portion into which the portion of the package ground substrate 11 can be fitted.
  • the present invention is not limited to this. It is clear that bending the flexible printed circuit board 30 can be reduced by providing a recessed part in the housing 50 and submerging a part of the high-frequency circuit package 10 here. The high frequency characteristics can be improved.
  • various high-frequency circuit packages each including the high-frequency circuit element 15 have been described.
  • the present invention is not limited to this. Needless to say, the present invention can be realized (provided) as a high-frequency circuit package having no high-frequency circuit element.
  • printing of a package for a high-frequency circuit It is easy to mount on a board and a housing, and has good electrical characteristics even at an ultra-high frequency exceeding, for example, 20 GHz.

Abstract

A high-frequency circuit package and its mounting configuration capable of easily mounting on a printed circuit board and case and obtaining a preferable high-frequency characteristic. On the upper surface of a package gland substrate (11) having an installation space for mounting a high-frequency circuit element (15), a dielectric substrate (12) having electrode terminals (14a, 14b) to be connected to the high frequency circuit element (15) is arranged. The package gland substrate (11) has an upper surface wider than the dielectric substrate (12). Moreover, for such a high-frequency circuit package (10A), the part of the dielectric substrate (12) is inserted into an opening (35) of substantially the same size as the dielectric substrate provided on a flexible printed circuit board (30). The upper surface of the package gland substrate (11) is directly attached (by soldering) to a grounding conductor (33) at the back of the printed circuit board in the periphery of the opening (35).

Description

明 細 書 高周波回路用パッケージ及びその実装構造 技術分野  Description High-frequency circuit package and its mounting structure
本発明は高周波回路用パッケージ及びその実装構造に関し、 更に詳し <は、 r¾ '周波用 MM I C (Mi crowave Monori thi c Integrated Circui t) 等を実装するための高周波回路用パッケージの構造及びそのプリント基 板への実装構造に関する。  The present invention relates to a high-frequency circuit package and a mounting structure thereof, and more particularly, to a structure of a high-frequency circuit package for mounting an r¾′-frequency MMIC (Microwave Monolithic Integrated Circuit) and the like and a printed circuit board thereof. It relates to a mounting structure on a board.
高周波回路用パッケージの実装構造で重要な点は、 グランド線及び信 号線の接続であり、 特に高周波回路用パッケージのグランド電極はプリ ント基板裏面の接地導体及ぴ筐体アースと電気的にも熱的にも一体に近 い関係にあることが望ましい。 背景 S術  An important point in the mounting structure of the high-frequency circuit package is the connection of the ground line and the signal line.Especially, the ground electrode of the high-frequency circuit package is electrically heated with the ground conductor on the back of the printed circuit board and the housing ground. It is desirable that they are close to one another. Background S art
図 7は従来の高周波回路用パッケージの一実装例を示す図で、 図にお いて、 6 0 Aは MM I C等を実装するための高周波回路用パッケージ、 6 1は金属からなるパッケージグランド基板、 6 2はパッケージ誘電体 基板、 6 3は高周波回路素子を保護するための蓋体、 6 4は信号線ゃ電 源線を接続するための電極端子、 6 6は接続線 （リボン， ボンディング ワイヤ等）、 7 0はス トリ ップ線路によるプリ ンド基板、 Ί 1はアルミナ 等による誘電体基板、 7 2は誘電体基板上面の信号導体線、 7 3は誘電 体基板背面の接地導体、 7 4はプリント基板 7 0に設けたパッケージグ ランド基板 6 1に対応した開口部、 5 0は電子回路装置の筐体、 5 1は その窪み加工部である。  FIG. 7 is a diagram showing an example of mounting a conventional high-frequency circuit package. In the figure, 60 A is a high-frequency circuit package for mounting an MM IC, etc., 61 is a package ground substrate made of metal, 6 2 is a package dielectric substrate, 6 3 is a cover for protecting high frequency circuit elements, 6 4 is an electrode terminal for connecting a signal line and a power line, and 6 6 is a connection line (ribbon, bonding wire, etc.) ), 70 is a printed circuit board made of a strip line, Ί1 is a dielectric board made of alumina or the like, 72 is a signal conductor on the top of the dielectric board, 73 is a ground conductor on the back of the dielectric board, 74 Denotes an opening corresponding to the package ground substrate 61 provided on the printed circuit board 70, 50 denotes a housing of the electronic circuit device, and 51 denotes a recessed portion thereof.
高周波回路用パッケージ 6 0 Aの平面視外形に合わせてプリント基板 7 0に開口部 7 4を設けると共に、 パッケージグランド基板 6 1 とプリ ント基板背面の接地導体 7 3 とをそれぞれ共通の筐体 5 0に接触させ て固定し、 かつプリント基板 7 0の上面側でパッケージ電極端子 6 4に 必要な電気的接続を行っている。 その際には、 もしパッケージ電極端子 6 4 とプリント基板 7 0の上面との間の段差が大きいと、 接続線 6 6の 曲がりによりィンダクタンス成分が増加して竃気的特性を悪化させるた め、 この影響を軽減すべく、 筐体 5 0に窪み加工部 5 1を施している。 図 8は従来の高周波回路用パッケージの他の実装例を示す図で、 表面 実装型高周波回路用パッケージの実装例を示している。 図 8 (A) は高 肩波回路用パッケージの底面図、 図 8 (B) はプリント基板への実装例 の側面図、 図 8 (C) は同じく底面図 （プリ ン ト基板の背面から見た透 視図） であり、 図において、 6 0 Bは表面実装型の高周波回路用パッケ ージ、 6 3はパッケージ上部の蓋体、 6 4 aは外部回路と接続すべくパ ッケージ底面に設けられた信号端子、 6 4 bは同じく電源端子、 6 4 c は同じくグランド電極、 7 0はス トリ ップ線路によるプリント基板、 7 1はその誘電体基板、 7 2 aはプリ ン ト基板上面の信号導体線、 7 2 b は同じく電源導体線、 7 2 cは同じくグランド電極、 7 3はプリ ント基 板背面の接地導体、 7 4 cはプリ ント基板上面のグランド電極 7 2 c と 背面の接地導体 7 3 との間を接続するための複数のパイァホール （via hole), 5 0は電子回路装置の筐体である。 An opening 74 is provided in the printed circuit board 70 in conformity with the external shape of the high-frequency circuit package 60 A in plan view, and the package ground board 61 The ground conductors 73 on the back of the printed circuit board are respectively fixed by contacting the common housing 50, and necessary electrical connection to the package electrode terminals 64 is made on the upper surface side of the printed circuit board 70. In this case, if the step between the package electrode terminal 64 and the upper surface of the printed circuit board 70 is large, the inductance component increases due to the bending of the connection line 66, and the flammability is deteriorated. However, in order to reduce this effect, the housing 50 is provided with a recessed portion 51. FIG. 8 is a diagram illustrating another example of mounting a conventional high-frequency circuit package, and illustrates a mounting example of a surface-mount type high-frequency circuit package. Fig. 8 (A) is the bottom view of the high-shoulder circuit package, Fig. 8 (B) is the side view of an example of mounting on a printed circuit board, and Fig. 8 (C) is the same bottom view (viewed from the back of the printed circuit board). In the figure, 60 B is a package for a surface-mount type high-frequency circuit, 63 is a lid at the top of the package, and 64 a is provided on the bottom of the package for connection to an external circuit. Signal terminals, 64b are also power terminals, 64c are also ground electrodes, 70 is a printed circuit board with strip lines, 71 is its dielectric substrate, and 72a is the top surface of the printed circuit board. 7b is the power supply conductor, 72c is the ground electrode, 73 is the ground conductor on the back of the printed circuit board, and 74c is the ground electrode on the top of the printed circuit board. A plurality of via holes for connecting between the ground conductor 73 and 50 are the housing of the electronic circuit device. .
図 8 (B), (C) において、 高周波回路用パッケージ 6 0 Bは、 プリ ント基板 7 0の上側に置かれ、 その信号端子 6 4 aは基板上面の信号導 体線 7 2 aに、 電源端子 6 4 bは同じく電源導体線 7 2 bに、 そして中 央のグランド電極 6 4 cは同じくグランド電極 7 2 cに、 それぞれ半田 付け等により接続される。 その際には、 パッケージグランド電極 6 4 c をより確実にアース電位に近付けるために、 プリ ント基板上面のグラン ド電極 7 2 c と背面の接地導体 7 3 との間に多数のバイァホール （ビア ホールとも呼ばれる） 7 4 cを設けている。 また、 図示しないが、 従来は、 プリント基板 （ 1 4 ) に設けられた開 口部 （4 ) 内に、 表面実装部品搭载基板 （ 2 ) に搭載されている表面実 装部品 （ 8 ) を嵌入し、 プリント基板 （ 1 4 ) と表面実装部品搭載基板 ( 2 ) とを接合固定するところの表面実装部品の実装構造が知られてい る （特開平 1 0 _ 1 2 6 0 3 2号公報）。 8 (B) and 8 (C), the high-frequency circuit package 60B is placed on the upper side of the printed board 70, and its signal terminal 64a is connected to the signal conductor wire 72a on the upper surface of the board. The power supply terminal 64b is connected to the power supply conductor wire 72b, and the center ground electrode 64c is connected to the ground electrode 72c by soldering or the like. In this case, in order to bring the package ground electrode 64 c closer to the ground potential, a large number of via holes (via holes) are provided between the ground electrode 72 c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface. Also called 7) 4c. In addition, although not shown, conventionally, the surface mounting component (8) mounted on the surface mounting component mounting board (2) is inserted into the opening (4) provided in the printed circuit board (14). In addition, there is known a mounting structure of a surface mounting component in which a printed circuit board (14) and a surface mounting component mounting substrate (2) are joined and fixed (Japanese Patent Application Laid-Open No. Hei 10-12632). .
しかし、 上記図 7に示した如く、 一旦、 プリント基板開口部 7 4で切 断された信号導体線 7 2とパッケージ電極端子 6 4との間を接続線 6 6 により接続する方式であると、 その接続部分では、 プリント基板表面の 信号導体線 7 2 と、 背面の接地導体 7 3 との間の一様な関係 （即ち、 ス ト リ ップ線路と しての断面形状， 寸法， 誘電率等） が維持されなくなる ため、 線路の高周波特性 (特性インピーダンス, 伝送線波長， 減衰量等 ) が著しく劣化するという問題があった。  However, as shown in FIG. 7 above, once the signal conductor wire 72 cut at the printed board opening 74 and the package electrode terminal 64 are connected by the connection wire 66, In the connection part, the uniform relationship between the signal conductor wire 72 on the printed circuit board surface and the ground conductor 73 on the back surface (that is, the cross-sectional shape, dimensions, permittivity as a strip line) is obtained. ), The high-frequency characteristics (characteristic impedance, transmission line wavelength, attenuation, etc.) of the line deteriorate significantly.
また上記の如く、 パッケージグランド基板 6 1 とプリント基板背面の 接地導体 7 3 との間のグランド接続を、 これらに共通の筐体 5 0への接 触を介して行う方式であると、 筐体 5 0 とパッケージグランド基板 6 1 又はプリ ント基板接地導体 7 3 との間に存在するような僅かな隙間が回 路の高周波特性に大きく影響するばかり力 、 これを阻止するためには、 高周波回路用パッケージ 6 0 A及びプリント基板 7 0を共に筐体 5 0に ネジ止め又は導電接着する必要があり、 これがコス ト増加の一要因とな つていた。  Further, as described above, if the ground connection between the package ground substrate 61 and the ground conductor 73 on the back of the printed circuit board is made through contact with the common housing 50, A small gap, such as between 50 and the package ground substrate 61 or the printed circuit board ground conductor 73, greatly affects the high frequency characteristics of the circuit. It was necessary to screw the package 60 A and the printed circuit board 70 together to the housing 50 with screws or conductive bonding, and this was one factor in increasing the cost.
また上記図 8に示した如く、 パッケージグランド電極 6 4 c とプリン ト基板背面の接地導体 7 3 との間のグランド接続を、 複数のバイァホー ル 7 4 cを介して行う方式であると、 該パイァホール 7 4 cのィンダク タンスが高周波特性に大きく影響するという問題があった。 また、 一般 にプリント基板 7 0の熱伝導特性は良好ではないため、 図示の如く筐体 5 0 との間にバイァホール 7 4 cが介在していても、 高周波回路素子の 放熱の点で不利であった。 発明の開示 In addition, as shown in FIG. 8, when the ground connection between the package ground electrode 64 c and the ground conductor 73 on the back of the printed circuit board is made via a plurality of via holes 74 c, There was a problem that the inductance of the via hole 74c greatly affected the high frequency characteristics. Further, since the thermal conductivity of the printed circuit board 70 is generally not good, even if the via hole 74c is interposed between the printed circuit board 70 and the housing 50 as shown in the figure, it is disadvantageous in terms of heat radiation of the high-frequency circuit element. there were. Disclosure of the invention
本発明は上記従来技術の問題点に鑑みなされたもので、 その目的とす る所は、 プリ ント基板及び筐体への実装が容易であると共に、 良好な高 周波特性が得られる高周波回路用パッケージ及びその実装構造を提供す ることにある。  SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics. Package and its mounting structure.
上記の課題は例えば図 1の構成により解決される。 即ち、 本発明 （ 1 ) の高周波回路用パッケージ 1 0 Aは、 高周波回路素子 1 5を搭載する ためのパッケージグランド基板 1 1の上面に前記高周波回路素子 1 5に 接続される電極端子 1 4 a， 1 4 bを有する 電体基板 1 2を備え、 前 記パッケージグランド基板 1 1 の上面が前記誘電体基板 1 2より も幅広 に設けられているものである。  The above problem is solved, for example, by the configuration of FIG. That is, the high-frequency circuit package 10 A of the present invention (1) has an electrode terminal 14 a connected to the high-frequency circuit element 15 on an upper surface of a package ground substrate 11 for mounting the high-frequency circuit element 15. , 14b, and an upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12.
本発明 （ 1 ) によれば、 パッケージグランド基板 1 1 の上面が誘電体 基板 1 2より も幅広に設けられているため、 この様な高周波回路用パッ ケージ 1 0 Aはプリント基板や筐体への実装が容易であると共に、 パッ ケージグランド基板 1 1の上面とプリ ント基板背面の接地導体とを直接 に接合可能となり、 よって、 良好な高周波特性が得られる。  According to the present invention (1), since the upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12, such a high-frequency circuit package 10 A can be mounted on a printed circuit board or a housing. Mounting is easy, and the top surface of the package ground substrate 11 can be directly joined to the ground conductor on the back surface of the printed substrate, so that good high-frequency characteristics can be obtained.
また上記の課題は例えば図 2の構成により解決される。 即ち、 本発明 ( 2 ) の高周波回路用パッケージの実装構造は、 上記本発明 （ 1 ) の高 周波回路用パッケージ 1 0 Aにっき、 前記誘電体基板 1 2の部分を可撓 性プリ ント基板 3 0に設けた該誘電体基板と略同一サイズの開口部に嵌 入し、 前記パッケージグランド基板 1 1 の上面と前記開口部 3 5の周辺 におけるプリント基板背面の接地導体 3 3 とを接合 （半田付け， 導電接 着等） したものである。  The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (2) is similar to that of the high-frequency circuit package 10 A of the present invention (1), except that the dielectric substrate 12 is replaced by a flexible print substrate 3. 0, and is fitted into an opening of substantially the same size as the dielectric substrate provided on the printed circuit board. The upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (solder Attachment, conductive bonding, etc.).
本発明 （ 2 ) によれば、 パッケージグランド基板 1 1の上面とプリ ン ト基板背面の接地導体 3 3 とを直接に接合する構成により、 これらの間 には一様で、 安定かつ確実なグランド接続が得られるため、 良好な高周 波特性が得られる。 また、 この種の高周波回路装置組立時のプリ ント 基板回路アセンブリの取扱が容易である。 更にまた、 幅広のパッケージ グランド基板 1 1の背面を装置の筐体 5 0に直接接触させることが可能 となり、 高周波回路素子の十分な放熱効果が得られる。 また、 可撓性プ リント基板 3 0の背面の接地導体 3 3をパッケージグランド基板 1 1の 周辺のできるだけ近傍で共通の筐体 5 0に密着させることが可能となり、 よって、 パッケージグランド基板 1 1 , プリント基板 3 0及び筐体 5 0 の間には高周波電位差が生じ難い。 また、 このような各部品の実装配置 では、 パッケージ電極端子 1 4 a , 1 4 b とプリ ント基板上面の導体線 3 2 a , 3 2 b との間を短い距離で、 かつ段差少なく接続可能であり、 よって、 不要なリアクタンス (インダクタンス) 分を介することなく、 高周波でも良好 ·安定に動作可能となる。 According to the present invention (2), the structure in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the print substrate provides a uniform, stable and reliable ground therebetween. Good connection with good circumference Wave characteristics are obtained. In addition, it is easy to handle the printed circuit board circuit assembly when assembling this type of high-frequency circuit device. Furthermore, the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and a sufficient heat radiation effect of the high-frequency circuit element can be obtained. In addition, the ground conductor 33 on the back of the flexible print substrate 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground substrate 11, so that the package ground substrate 11 Therefore, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50. Also, in such a mounting arrangement of each component, the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 32b on the upper surface of the printed circuit board can be made with a short distance and with little step. Therefore, it is possible to operate satisfactorily and stably even at high frequency without using unnecessary reactance (inductance).
また上記の課題は例えば図 4の構成により解決される。 即ち、 本発明 ( 3 ) の高周波回路用パッケージ 1 0 Bは、 高周波回路素子 1 5を搭載 するためのパッケージグランド基板 1 1の上面に設置される誘電体基板 1 2であって、 その上面に高周波回路素子 1 5に接続するための信号用 電極 1 4 a と、 電源用電極 1 4 b と、 これらの電極の周囲に展開するよ うに設けられたグランド龠極 1 4 c とを備え、 該グランド電極 1 4 cが 複数のバイァホール 1 7 cを介して前記パッケージグランド基板 1 1の 上面に接合しており、 前記誘電体基板 1 2の中央部に内部保護のための 蓋体突起部を有するものである。  The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the high-frequency circuit package 10 B of the present invention (3) is a dielectric substrate 12 installed on the upper surface of the package ground substrate 11 for mounting the high-frequency circuit element 15, It comprises a signal electrode 14 a for connection to the high-frequency circuit element 15, a power supply electrode 14 b, and a ground electrode 14 c provided so as to extend around these electrodes. A ground electrode 14c is joined to the upper surface of the package ground substrate 11 via a plurality of via holes 17c, and has a lid protrusion for internal protection at the center of the dielectric substrate 12 Things.
本発明 （ 3 ) によれば、 パッケージ誘電体基板 1 2の上面にパッケ一 ジグランド電極 1 4 cを備えるため、 該グランド電極 1 4 cの上面とプ リ ント基板背面の接地導体とを直接に接合可能となり、 よって、 良好な 高周波特性が得られる。 また、 高周波回路素子 1 5を直接支持可能なパ ッケージグランド基板 1 1を筐体上面に直接接触させることが可能であ り， よって、 十分な放熱効果が得られる。 本発明 （4 ) の高周波回路用パッケージは、 上記本発明 （ 1 ) 又は ( 3 ) において、 例えば図 4に示す如く、 パッケージグランド基板 1 1 は、 金属基板、 もしくは上面にメタライズ層 1 1 aを設けた誘電体基板 からなるものである。 パッケージグランド基板 1 1 としては、 高周波回 路素子 1 5の確実なグランド接続と十分な放熱効果を得るために、 好ま しくは、 金属板を使用する。 但し、 例えば図 2に示す実装構造では、 パ ッケージグランド基板 1 1の上側露出面がプリ ント基板 3 0背面の接地 導体 3 3 と直接に接合することになるため、 高周波回路パッケージ 1 0 Aとプリ ント基板 3 0との間には一様かつ確実なグランド接続が得られ る。 このような場合には、 アルミナ基板等の上面を銅等によりメタライ ズした基板をパッケージグランド基板 1 1 としても良い。 こうすれば、 パッケージグランド基板 1 1を安価に構成できる。 また、 図 4の場合で も、 プリ ント基板 3 0背面の接地導体 3 3に直接接続する複数のグラン ド電極 1 4 cが複数のパイァホール 1 7 cを介してパッケージグランド 基板 1 1の上面 1 1 aに接合するため、高周波回路パッケージ 1 0 Bと、 プリント基板背面の接地導体 3 3 との間のグランド接続には支障が生じ ず、よって、この種の高周波回路装置を多様な態様で安価に構成できる。 また上記の課題は例えば図 5の構成により解決される。 即ち、 本発明 ( 5 ) の高周波回路用パッケージの実装構造は、 上記本発明 （ 3 ) の高 周波回路用パッケージ 1 0 Bにっき、 少なく とも前記誘電体基板上面中 央に接合されている蓋体突起部分 （即ち、 例えば図 5の蓋体 1 3の部分 ) を可撓性プリ ント基板 3 0に設けた該蓋体突起部分と略同一サイズの 開口部 3 5に嵌入し、前記誘電体基板 1 2上面のグランド電極 1 4 c と、 前記開口部 3 5周辺におけるプリ ント基板背面の接地導体 3 3 とを接合 (半田付け， 導電接着等） したものである。 According to the present invention (3), since the package ground electrode 14c is provided on the upper surface of the package dielectric substrate 12, the upper surface of the ground electrode 14c and the ground conductor on the rear surface of the print substrate are directly connected. Joining is possible, so that good high-frequency characteristics can be obtained. In addition, the package ground substrate 11 that can directly support the high-frequency circuit element 15 can be brought into direct contact with the upper surface of the housing, so that a sufficient heat radiation effect can be obtained. According to the present invention (4), the package for a high-frequency circuit according to the present invention (1) or (3) is, for example, as shown in FIG. 4, the package ground substrate 11 is a metal substrate or a metallized layer 11 a on the upper surface. It consists of a provided dielectric substrate. Preferably, a metal plate is used as the package ground substrate 11 in order to secure the ground connection of the high-frequency circuit element 15 and obtain a sufficient heat radiation effect. However, for example, in the mounting structure shown in FIG. 2, since the upper exposed surface of the package ground substrate 11 is directly bonded to the ground conductor 33 on the back of the printed substrate 30, the high-frequency circuit package 10A A uniform and reliable ground connection is obtained between the substrate and the printed circuit board 30. In such a case, a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11. In this case, the package ground substrate 11 can be configured at low cost. Also, in the case of FIG. 4 as well, the plurality of ground electrodes 14 c directly connected to the ground conductor 33 on the back of the printed circuit board 30 are connected to the upper surface 1 of the package ground substrate 11 via the plurality of via holes 17 c. 1a, there is no problem in ground connection between the high-frequency circuit package 10B and the ground conductor 33 on the back of the printed circuit board. Therefore, this type of high-frequency circuit device is inexpensive in various modes. Can be configured. The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (5) is the same as that of the high-frequency circuit package 10 B of the present invention (3), and at least the lid joined to the center of the upper surface of the dielectric substrate. The projecting portion (that is, for example, the portion of the lid 13 in FIG. 5) is fitted into an opening 35 provided on the flexible print substrate 30 and having substantially the same size as the lid projecting portion. The ground electrode 14c on the upper surface and the ground conductor 33 on the back of the printed circuit board around the opening 35 are joined (solder, conductive bonding, etc.).
本発明 （ 5 ) によれば、 パッケージ誘電体基板 1 2上面のグランド電 極 1 4 c と、 プリ ント基板開口部 3 5周辺におけるプリ ント基板背面の 接地導体 3 3 とを直接に接合する構成により、 これらの間には一様で、 安定かつ確実なグランド接続が得られ、 よって良好な高周波特性が得ら れる。 また、 この種の高周波回路装置組立時のプリ ント基板回路ァセン プリの取扱が容易である。 更にまた、 高周波回路素子を支持するための パッケージグランド基板 （金属基板あるいは上面をメタライズしたアル ミナ基板） 1 1を装置の筐体 5 0に直接接触させることが可能となり、 高周波回路素子の十分な放熱効果が得られる。 また、 可撓性プリ ント基 板 3 0の背面の接地導体 3 3をパッケージグランド基板 1 1の周辺ので きるだけ近傍で共通の筐体 5 0に密着させることが可能となり、よって、 パッケージグランド基板 1 1 , プリ ント基板 3 0及び筐体 5 0の間には 高周波電位差が生じ難い。 According to the present invention (5), the ground electrode 14c on the top surface of the package dielectric substrate 12 and the back surface of the print substrate around the print substrate opening 35 are provided. With a configuration in which the ground conductor 33 is directly joined, a uniform, stable, and reliable ground connection can be obtained between them, and thus good high-frequency characteristics can be obtained. In addition, it is easy to handle the printed circuit board circuit assembly when assembling this type of high-frequency circuit device. Furthermore, a package ground substrate (a metal substrate or an aluminum substrate having a metallized upper surface) 11 for supporting a high-frequency circuit element can be brought into direct contact with the housing 50 of the device, and a sufficient amount of the high-frequency circuit element can be obtained. A heat radiation effect is obtained. Further, the ground conductor 33 on the back side of the flexible printed board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is unlikely to occur between the printed circuit board 30 and the housing 50.
本発明 （ 6 ) の高周波回路用パッケージの実装構造は、 上記本発明 （ 2 ) において、 例えば図 3に示す如く、 パッケージ誘電体基板 1 2上面 の電極端子 1 4 a， 1 4 b と、 可撓性プリ ント基板 3 0上面の開口部 3 5付近で導体線用に舌状に切り込まれた部分 3 4 a , 3 4 b上の該導体 線の先端部とを、 該先端部に設けたバイァホール 3 8を介して接合した ものである。 従って、 別段の接続線 3 6やその接続工程を必要と しない ため、 接続安定であると共に、 製造容易である。  The mounting structure of the high-frequency circuit package according to the present invention (6) is different from the above-mentioned present invention (2) in that the electrode terminals 14a and 14b on the upper surface of the package dielectric substrate 12 as shown in FIG. A flexible printed circuit board 30 is provided with a tongue-shaped portion 34a, 34b near the opening 35 on the upper surface of the conductor wire at the tip thereof. Via holes 38. Accordingly, since a separate connection line 36 and a connection step for the connection line are not required, the connection is stable and the production is easy.
本発明 （ 7 ) の高周波回路用パッケージの実装構造は、 例えば図 6に 示す如く、 高周波回路素子を搭载するためのパッケージグランド基板 1 1の上面に前記高周波回路素子に接続される電極端子を有する誘電体基 板 1 2を備えた高周波回路用パッケージ 1 0 Cにっき、 そのパッケージ グランド基板 1 1の部分を可撓性プリント基板 3 0に設けた前記誘電体 基板と略同一サイズの開口部 3 5に嵌入し、 前記パッケージ'グランド基 板 1 1の周囲面と前記開口部 3 5周辺におけるプリ ント基板背面の接地 導体 3 3 とを接合 （半田付け， 導電接着等） したものである。  The mounting structure of the high-frequency circuit package of the present invention (7) has, for example, as shown in FIG. 6, an electrode terminal connected to the high-frequency circuit element on the upper surface of a package ground substrate 11 for mounting the high-frequency circuit element. A high-frequency circuit package 10 C having a dielectric substrate 12 is mounted, and the package ground substrate 11 is provided on a flexible printed circuit board 30 with an opening 35 having substantially the same size as the dielectric substrate. Then, the peripheral surface of the package 'ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (soldering, conductive bonding, etc.).
従って、 上記図 7に示した従来の高周波回路用パッケージ 6 0 Aと同 様の形状を有するよ うな通常の高周波回路用パッケージ 1 0 Cについ ても、 パッケージグランド基板 1 1の周囲面と、 開口部 3 5周辺におけ るプリ ント基板背面の接地導体 3 3 とを直接に接合する構成により、 こ れらの間には一様で、 安定かつ確実なグランド接続が得られるため、 良 好な高周波特性が得られる。 図面の簡単な説明 Therefore, it is the same as the conventional high-frequency circuit package 60 A shown in FIG. In the case of a normal high-frequency circuit package 10 C having a similar shape, the peripheral surface of the package ground substrate 11 is directly connected to the ground conductor 33 on the back of the print substrate around the opening 35. Since a uniform, stable, and reliable ground connection can be obtained between them by the configuration that is joined to the substrate, good high-frequency characteristics can be obtained. BRIEF DESCRIPTION OF THE FIGURES
図 1は第 1の実施の形態による高周波回路用パッケージの構造を示す 図、 図 2は第 1の実施の形態による高周波回路用パッケージの実装構造 を示す図 （ 1 )、 図 3は第 1の実施の形態による高周波回路用パッケージ の実装構造を示す図 （ 2 )、 図 4は第 2の実施の形態による高周波回路用 パッケージの構造を示す図、 図 5は第 2の実施の形態による高周波回路 用パッケージの実装構造を示す図、 図 6は第 3の実施の形態による高周 波回路用パッケージの実装構造を示す図、 図 7は従来技術を説明する図 ( 1 )、 そして、 図 8は従来技術を説明する図 （ 2 ) である。 発明を実施するための梟良の形態 FIG. 1 is a diagram showing the structure of the high-frequency circuit package according to the first embodiment, FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment, and FIG. FIG. 2 shows a mounting structure of the high-frequency circuit package according to the embodiment (2), FIG. 4 shows a structure of the high-frequency circuit package according to the second embodiment, and FIG. 5 shows a high-frequency circuit according to the second embodiment. FIG. 6 is a diagram showing a mounting structure of a package for a high frequency circuit according to a third embodiment, FIG. 6 is a diagram illustrating a conventional technology (1), and FIG. FIG. 2 is a diagram (2) explaining a conventional technique. The form of owls for carrying out the invention
以下、 添付図面に従って本発明に好適なる複数の実施の形態を詳細に 説明する。 なお 、 全図を通して同一符号は同一又は相当部分を示すもの とする。 図 1は第 1の実施の形態による高周波回路用パッケージの構造 を示す図で、 パッケージグランド基板 1 1の上面がパッケージ誘電体基 板 1 2より も幅広に設けられている場合を示している。 図 1 ( A ) はそ の側面図、 図 1 ( B ) は上面図、 図 1 ( C ) は側断面図であり、 図にお いて、 1 0 Aは第 1の実施の形態による高周波回路用パッケージ、 1 1 は金属からなるグランド基板、 1 2はアルミナ等による誘電体基板、 1 3は内部の高周波回路素子を保護するための蓋体、 1 4 aは外部回路と 接続すべく誘電体基板 1 2の上面に設けられた信号端子、 1 4 bは同じ く電源端子、 1 5は MM I C等による高周波回路素子、 1 6は高周波 回路素子と電極端子 1 4 a， 1 4 b間を接続する接続線 （リボン， ボンデ ングワイヤ等) である。 Hereinafter, a plurality of embodiments suitable for the present invention will be described in detail with reference to the accompanying drawings. It is to be noted that the same reference numerals indicate the same or corresponding parts throughout the drawings. FIG. 1 is a diagram showing the structure of a high-frequency circuit package according to the first embodiment, in which the upper surface of a package ground substrate 11 is provided wider than the package dielectric substrate 12. 1 (A) is a side view, FIG. 1 (B) is a top view, FIG. 1 (C) is a side sectional view, where 10A is a high-frequency circuit according to the first embodiment. Package, 11 is a ground substrate made of metal, 12 is a dielectric substrate made of alumina or the like, 13 is a cover for protecting internal high-frequency circuit elements, and 14a is a dielectric to connect to external circuits. Signal terminals provided on the upper surface of the board 12, 14b are the same The power supply terminal, 15 is a high-frequency circuit element such as an MM IC, and 16 is a connection wire (ribbon, bonding wire, etc.) connecting the high-frequency circuit element and the electrode terminals 14a and 14b.
パッケージグランド基板 1 1の上に高周波回路素子 1 5を接着し、 該 素子 1 5 と信号端子 1 4 a及び電源端子 1 4 b との間を接続線 1 6によ り接続する。 更に、 これらを保護すべくパッケージ誘電体基板 1 2の上 側に蓋体 1 3 _を接着し、 全体と して高周波回路パッケージとなすことが 可能である。 The high-frequency circuit element 15 is adhered on the package ground substrate 11, and the element 15 is connected to the signal terminal 14 a and the power supply terminal 14 b by a connection line 16. Furthermore, they were adhered to the lid 1 3 _ on the side of the package the dielectric substrate 1 2 to protect, it is possible to form a high-frequency circuit package as a whole.
本第 1の実施の形態では、 パッケージグランド基板 1 1の面積を誘電 体基板 1 2の面積よりも広くすることにより、 パッケージグランド基板 1 1の上面が誘電体基板 1 2の周囲に露出することとなり、 この露出部 分にプリント基板背面の接地導体を直接に接合 （半田付け等） 可能とな つている。 '  In the first embodiment, by making the area of the package ground substrate 11 larger than the area of the dielectric substrate 12, the upper surface of the package ground substrate 11 is exposed around the dielectric substrate 12. Thus, the ground conductor on the back of the printed circuit board can be directly joined (soldered, etc.) to this exposed part. '
パッケージグランド基板 1 1 と しては、 高周波回路 ^子 1 5の確実な グランド接続と十分な放熱効果を得るために、 好ましくは、 金属板を使 用する。 但し、 後述の本第 1の実施の形態による実装構造では、 パッケ ージグランド基板 1 1の上側露出面がプリント基板背面の接地導体 3 3 と直接に接合することになるため、 高周波回路用パッケージ 1 0 Aとプ リ ント基板 3 0との間には一様かつ確実なグランド接続が得られる。 こ のような場合には、 アルミナ基板等の上面を銅等によりメタライズした 基板をパッケージグラン 基板 1 1 としても良い。 こうすれば、 パッケ ージグランド基板 1 1を安価に構成できる。  Preferably, a metal plate is used as the package ground substrate 11 in order to obtain a reliable ground connection of the high-frequency circuit 15 and a sufficient heat radiation effect. However, in the mounting structure according to the first embodiment to be described later, since the upper exposed surface of the package ground substrate 11 is directly bonded to the ground conductor 33 on the back of the printed circuit board, the high-frequency circuit package 10 A uniform and reliable ground connection is obtained between A and the printed circuit board 30. In such a case, a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11. In this case, the package ground substrate 11 can be configured at low cost.
図 2は第 1の実施の形態による高周波回路用パッケージの実装構造を 示す図 （ 1 ) で、 上記図 1の高周波回路用パッケージ 1 0 Aをフレキシ ブルなプリント基板 3 0に実装する場合を示している。 図 2 ( A ) は実 装状態の側面図、 図 2 ( B ) は上面図であり、 図において、 1 0 Aは上 記図 1に示した高周波回路用パッケージ、 1 4 aは該パッケージの信号 端子、 1 4 bは同じく電源端子である。 更に、 3 0は例えばス トリ ツ プ線路による可撓性のプリント基板、 3 1はその誘電体基板 {テフロン (登録商標） 系等 }、 3 2 aは誘電体基板上面の信号導体線、 3 2 bは同 じく電源導体線、 3 3は誘電体基板背面の接地導体、 3 5はプリ ン ト基' 板 3 0にっきパッケ一ジ誘電体基板 1 2の上面視形状に対応して設けた 開口部、 3 6は接続線 （リポン， ボンディングワイヤ等）、 3 7はパッケ ージグランド基板 1 1の上面とプリ ント基板 3 0背面の接地導体 3 3 と の間のグランド接触面、 4 0はプリント基板押え、 5 0は電子回路装置 の筐体である。 FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment, showing a case where the high-frequency circuit package 10A of FIG. 1 is mounted on a flexible printed circuit board 30. ing. Figure 2 (A) is a side view of the mounted state, Figure 2 (B) is a top view, where 10A is the high-frequency circuit package shown in Figure 1 above, and 14a is the package. signal Terminal 14b is also a power supply terminal. Further, reference numeral 30 denotes a flexible printed circuit board made of, for example, a strip line, 31 denotes a dielectric substrate thereof (Teflon (registered trademark) or the like), 32a denotes a signal conductor line on the upper surface of the dielectric substrate, 3 2b is the same power supply conductor wire, 33 is the ground conductor on the back of the dielectric substrate, 35 is the printed circuit board 30, and it is provided corresponding to the top view shape of the package dielectric substrate 12 An opening, 36 is a connection line (a repong, a bonding wire, etc.), 37 is a ground contact surface between the upper surface of the package ground substrate 11 and the ground conductor 33 on the back of the printed substrate 30, and 40 is a ground contact surface. The printed circuit board holder 50 is a housing of the electronic circuit device.
高周波回路用パッケージ 1 0 Aの蓋体 1 3 とパッケージ誘電体基板 1 2の部分をフ。リント基板 3 0の背面より開口部 3 5に嵌入すると共に、 プリ ント基板背面の接地導体 3 3をパッケージグランド基板 1 1の上側 露出面に接触させてグランド接触面 3 7 となし、 これらの間を半田付け 等により接着 · 固定する。 更に、 パッケージの信号端子 1 4 a及び電源 端子 1 4 b とプリ ント基板上面の信号導体線 3 2 a及び電源導体線 3 2 との間をそれぞれ接続線 3 6により接続し、 こ う してプリ ント回路基 板ァセンプリを形成する。  Cover the high-frequency circuit package 10 A lid 13 and package dielectric substrate 12. The back surface of the printed circuit board 30 is fitted into the opening 35, and the ground conductor 33 on the back of the printed circuit board is brought into contact with the exposed surface on the upper side of the package ground substrate 11 to form a ground contact surface 37, between them. Adhere and fix by soldering. Further, the signal terminals 14a and the power terminals 14b of the package and the signal conductors 32a and the power conductors 32 on the upper surface of the printed circuit board are connected by the connection wires 36, respectively. Form a printed circuit board assembly.
更に、 このアセンブリにっき、 パッケージグランド基板 1 1の背面及 びプリント基板背面の接地導体 3 3の各部分をそれぞれ筐体 5 0の上面 に接触させて、 固定する。 その際には、 フレキシブルなプリント基板 3 0背面の接地導体 3 3がパッケージグランド基板 1 1の周囲のできるだ け近くで筐体 5 0に密着するように、 高周波回路用パッケージ 1 0 A周 囲のプリ ント基板 3 0の部分をプリント基板押え 4 0により筐体 5 0に 押し付け、 ネジ等により固定する。  Further, according to this assembly, the respective portions of the ground conductors 33 on the rear surface of the package ground substrate 11 and the rear surface of the printed circuit board are brought into contact with the upper surface of the housing 50 and fixed. In this case, the high-frequency circuit package 10 A must be mounted so that the ground conductor 33 on the back of the flexible printed circuit board 30 adheres to the housing 50 as close as possible to the package ground substrate 11. The printed circuit board 30 is pressed against the housing 50 by the printed circuit board retainer 40 and fixed with screws or the like.
なお、 本第 1の実施の形態においても、 高周波回路用パッケージ 1 0 Aの一部を沈めるための窪み加工部を筐体 5 0の表面に設けることが可 能であり、 こうすれば、 可撓性プリント基板 3 0の撓み量を十分に小さ くできる。 この場合には、 上記のようにプリント基板押え 4 0を用い ないで、 プリ ント基板 3 0を筐体 5 0にネジ止めするだけでも良い。 本第 1の実施の形態によれば、 パッケージグランド基板 1 1の上面と プリント基板背面の接地導体 3 3とを直接に接合する構成により、 これ らの間には一様で、 安定かつ確実なグランド接続が得られるため、 良好 な高周波特性が得られる。 また、 この種の高周波回路装置組立時のプリ ント墓板回路アセンブリ の取扱が容易である。 更にまた、 幅広のパッケ ージグランド基板 1 1の背面を装置の筐体 5 0に直接接触させることが 可能となり、 高周波回路素子 1 5に十分な放熱効果が得られる。 また、 可撓性プリ ント基板 3 0の背面の接地導体 3 3をパッケージグランド基 板 1 1の周辺のできるだけ近傍で共通の筐体 5 0に密着させることが可 能となり、 よって、 パッケージグランド基板 1 1、 プリント基板 3 0及 び筐体 5 0の間には高周波電位差が生じ難い。 また、 このような各部品 の実装配輋では、 パッケージ電極端子 1 4 a， 1 4 b とプリ ント基板上 面の導体線 3 2 a， 3.2 b との間を短い距離で、 かつ段差少なく接続可 能であり、 よって、 不要なリアクタンス (ィンダクタンス） 分を介する ことなく、 高周波でも良好 ·安定に動作可能となる。 In the first embodiment as well, it is possible to provide a recessed portion for sinking a part of the high-frequency circuit package 10 A on the surface of the housing 50. The amount of flexure of the flexible printed circuit board 30 is sufficiently small I can do it. In this case, the printed circuit board 30 may be simply screwed to the housing 50 without using the printed circuit board retainer 40 as described above. According to the first embodiment, the configuration in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the printed circuit board is uniform, stable and reliable between them. Good high-frequency characteristics are obtained because a ground connection is obtained. It is also easy to handle this type of printed circuit board assembly when assembling this type of high-frequency circuit device. Furthermore, the rear surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and the high-frequency circuit element 15 can have a sufficient heat radiation effect. In addition, the ground conductor 33 on the back of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50. In the mounting arrangement of such components, the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 3.2b on the upper surface of the printed circuit board is made with a short distance and with little step. It is possible to operate satisfactorily and stably even at high frequencies without any unnecessary reactance (inductance).
図 3は第 1の実施の形態による高周波回路用パッケージの実装構造を 示す図 （2 ) で、 高周波回路用パッケージ 1 O Aの信号端子 1 4 a及び 電源端子 1 4 b と、 プリント基板 3 0の信号導体線 3 2 a及び電源導体 線 3 2 b とを、 別段の接続線 3 6を介することなく、 直接的に接続可能 な場合を示している。 図 3 (A) は実装状態の側面図、 図 3 (B ) は上 面図であり、 図において、 3 4 aはプリ ント基板 3 0の開口部 3 5付近 で可撓性誘電体基板 3 1が信号導体線 3 2 a用に舌状に切り込まれた信 号導体用舌状部、 3 4 bは同じく電源導体線 3 2 b用に舌状に切り込ま れた電源導体用舌状部、 3 8は信号導体用舌状部 3 4 aや電源導体用舌 状部 3 4 bの上面にある信号導体線 3 2 aや電源導体線 3 2 bの各先端 部に設けられたパイァホール （スルホールとも呼ばれる） である。 図FIG. 3 is a diagram (2) showing the mounting structure of the high-frequency circuit package according to the first embodiment. The signal terminal 14a and the power supply terminal 14b of the high-frequency circuit package 1OA are connected to the printed circuit board 30. The figure shows a case where the signal conductor line 32a and the power supply conductor line 32b can be directly connected without passing through a separate connection line 36. FIG. 3 (A) is a side view of a mounted state, and FIG. 3 (B) is a top view. In the figure, 34 a is a flexible dielectric substrate 3 near the opening 35 of the printed substrate 30. 1 is a tongue for a signal conductor cut into a tongue for a signal conductor line 32a, and 34b is a tongue for a power conductor also cut tongue for a power conductor wire 32b , 38 are the tip ends of the signal conductor wire 32a and the power conductor wire 32b on the upper surface of the signal conductor tongue 34a and the power conductor tongue 34b. It is a fire hole (also called a through hole) provided in the section. Figure
3 (B) の挿入図 （ a )， ( b ) に信号導体用舌状部 3 4 a と電源導体用 舌状部 3 4 bの部分拡大図を示す。 3 (B) Insets (a) and (b) show partially enlarged views of the signal conductor tongue 34a and the power conductor tongue 34b.
プリント基板 3 0のうちの信号導体用舌状部 3 4 aの背面には接地導 体 3 3が設けられておらず、 よって、 この部分をパッケージ信号端子 1 The ground conductor 33 is not provided on the back surface of the signal conductor tongue 34 a of the printed circuit board 30.
4 aの上面に展開 （延展） させて半田付け等により直接的に接続可能で ある。 これにより、 プリ ント基板 3 0上面の信号導体線 3 2 a とパッケ ージ信号端子 1 4 a とが基板先端部のパイァホール 3 8を介して接続さ れる。 電源導体用舌状部 3 4 b とパッケージ電源端子 1 4 b との間の接 続についても同様である。 それ以外の部分の実装構造については上記図 2で述べたものと同様で良い。 本実装構造によれば、 別途に接続線 3 6 による接続を必要と しない簡単な構成であるため、 信号線接続及び電源 線接続の信頼性が高いと共に、 高周波特性が改善される。 また製造コス トを低減できる。 4 Can be directly connected by spreading (spreading) on the upper surface of a and soldering. As a result, the signal conductor wire 32 a on the upper surface of the printed board 30 is connected to the package signal terminal 14 a via the via hole 38 at the tip of the board. The same applies to the connection between the power supply conductor tongue 34b and the package power supply terminal 14b. The mounting structure of the other parts may be the same as that described in FIG. According to this mounting structure, since it is a simple configuration that does not require a separate connection by the connection line 36, the reliability of the signal line connection and the power supply line connection is high, and the high-frequency characteristics are improved. Also, manufacturing costs can be reduced.
図 4は第 2の実施の形態による高周波回路用パッケージの構造を示す 図で、 パッケージ信号端子 1 4 a及び電源端子 1 4 bの周囲の同一面上 にパッケージグランド電極 1 4 cを備える場合を示している。 図 4 (A ) はその側面図、 図 4 (B) は上面図、 図 4 (C) は側断面図であり、 図において、 1 0 Bは第 2の実施の形態による高周波回路用パッケージ、 1 1はそのグランド基板、 1 1 aは該グランド基板上面のメタラィズ層、 1 2はパッケージ誘電体基板、 1 3は蓋体、 1 4 aは誘電体基板 1 2の 上面に設けた信号端子、 1 4 bは同じく電源端子、 1 4 cは同じくダラ ンド電極、 1 7 cは該グランド電極 1 4 cから誘電体基板 1 2の背面に 貫通するバイァホール （スルーホール）、 1 5は MM I C等による高周波 回路素子、 1 6は接続線 （リポン， ボンディングワイヤ等） である。 メタライズ層 1 1 aの上に高周波回路素子 1 5を接着し、その周囲を、 パッケージ中央部に開口部を有するようなパッケージ誘電体基板 1 2に より囲む。 高周波回路素子 1 5への信号及び電源の接続はパッケージ 誘電体基板 1 2上面の信号端子 1 4 a及び電源端子 1 4 bを介してそれ ぞれに接続線 1 6により行う と共に、 これらを保護すべく上部に蓋体 1 3を接着し、全体として高周波回路パッケージとなすことが可能である。 パッケージ誘電体基板 1 2の上面には信号端子 1 4 a、 電源端子 1 4 b、 及びこれらを取り囲む形でグランド電極 1 4 cが同一面上に設けら れている。 更に、 このグランド電極 1 4 cには多数のパイァホール 1 Ί cが設けられており、 グランド電極 1 4 c と誘電体基板 1 2の背面に接 触（接合）するメタラィズ層 1 1 a との間が多数のバイァホール 1 7 cを 介して電気的に接続される。 なお、 パッケージグランド基板 1 1が金属 板で構成されていても良いことは言うまでもない。 FIG. 4 is a diagram showing the structure of a high-frequency circuit package according to the second embodiment, in which a package ground electrode 14c is provided on the same surface around a package signal terminal 14a and a power supply terminal 14b. Is shown. 4 (A) is a side view, FIG. 4 (B) is a top view, and FIG. 4 (C) is a side sectional view. In the drawing, 10 B is a high-frequency circuit package according to the second embodiment, 11 is a ground substrate, 11 a is a metallized layer on the top surface of the ground substrate, 12 is a package dielectric substrate, 13 is a lid, 14 a is a signal terminal provided on the upper surface of the dielectric substrate 12, 14b is also a power supply terminal, 14c is also a dull electrode, 17c is a via hole (through hole) penetrating from the ground electrode 14c to the back of the dielectric substrate 12, and 15 is an MM IC etc. , And 16 are connection wires (ribbon, bonding wire, etc.). A high-frequency circuit element 15 is bonded on the metallized layer 11a, and the periphery thereof is bonded to a package dielectric substrate 12 having an opening in the center of the package. Surround more. The signal and power supply are connected to the high-frequency circuit element 15 via the signal terminal 14 a and the power supply terminal 14 b on the top surface of the package dielectric substrate 12, respectively, and are protected by connecting wires 16 respectively. It is possible to bond the lid 13 to the upper part as much as possible to form a high-frequency circuit package as a whole. On the upper surface of the package dielectric substrate 12, a signal terminal 14a, a power supply terminal 14b, and a ground electrode 14c are provided on the same surface so as to surround them. Furthermore, a large number of via holes 1Ίc are provided in the ground electrode 14c, and the ground electrode 14c and the metallized layer 11a contacting (joining) the back surface of the dielectric substrate 12 are provided. Are electrically connected via a number of via holes 17c. Needless to say, the package ground substrate 11 may be made of a metal plate.
図 5は第 2の実施の形態による高周波回路用パッケージの実装構造を 示す図で、 上記図 4の高周波回路用パッケージ 1 0 Bをフレキシブルな プリント基板 3 0に実装する場合を示している。 図 5 (A) は実装状態 の側面図、 図 5 (B ) は上面図であり、 図において、 3 5はプリ ント基 板 3 0にっき蓋体 1 3の上面視形状]^対応して設けられた開口部、 3 2 aは開口部 3 5の端面にまで展開する信号導体線、 3 2 bは同じく電源 導体線、 3 8 aは開口部端面にまで展開する信号導体線 3 2 aの先端部 に設けられたバイァホール、 3 8 bは同じく電源導体線 3 2 bの先端部 に設けられたバイァホールである。  FIG. 5 is a diagram showing a mounting structure of a high-frequency circuit package according to the second embodiment, and shows a case where the high-frequency circuit package 10 B of FIG. 4 is mounted on a flexible printed circuit board 30. FIG. 5 (A) is a side view of a mounted state, and FIG. 5 (B) is a top view. In the drawing, reference numeral 35 denotes a printed board 30 and a cover 13 in a top view shape] ^ 3a, the signal conductor extending to the end face of the opening 35, 32b is the power supply conductor, and 38a is the signal conductor 32a extending to the end face of the opening. A via hole provided at the tip, 38b is a via hole provided at the tip of the power supply conductor 32b.
なお、 この例のプリ ント基板裏面の接地導体 3 3においては、 その内 側開口部 3 5 cがパッケージグランド電極 1 4 cの上面視開口面全面と' 接合するが他のパッケージ端子 1 4 a及び 1 4 b とは接触しないように 設けられている。 これに対して、 プリント基板表面の信号導体線 3 2 a および電源導体線 3 2 bはそれぞれパッケージ信号端子 1 4 a及び電源 端子 1 4 bの真上まで延びている。  In the ground conductor 33 on the back surface of the printed circuit board in this example, the inner opening 35 c is joined to the entire opening surface of the package ground electrode 14 c when viewed from above, but the other package terminals 14 a And 14b so that they do not come into contact with it. On the other hand, the signal conductor line 32a and the power supply conductor line 32b on the surface of the printed circuit board extend right above the package signal terminal 14a and the power supply terminal 14b, respectively.
プリ ント基板 3 0の開口部 3 5に高周波回路用パッケージ 1 0 Bの蓋 体 1 3の部分を裏面から揷入し、 パッケージ誘電体基板 1 2の上面の グランド電極 1 4 cをプリ ント基板裏面の接地導体 3 3に半田付け等に より接着 · 固定する。 また、 図 5 ( B ) に示す如く、 信号端子 1 4 aへ の信号の接続は信号導線 3 2 aの先端部に設けられたバイァホール 3 8 aを介して行い、 また電源端子 1 4 bへの電源の接続は電源導体線 3 2 の先端部に設けられたバイァホール 3 8 bを介して行う。 こう して得 られたプリ ン ト基板アセンブリ の筐体 5 0への取り付けに際しては、 上 記同様の目的でプリ ント基板押え 4 0が使用される。 なお、 上記バイァ ホール 3 8 a , 3 8 bを介する接続に代えて、 別途に接続線 3 6を使用 しても良いことは言うまでもない。 High-frequency circuit package 10 B lid on opening 35 of printed circuit board 30 The part of the body 13 is inserted from the back, and the ground electrode 14c on the top of the package dielectric substrate 12 is bonded and fixed to the ground conductor 33 on the back of the printed board by soldering or the like. Also, as shown in FIG. 5 (B), the connection of the signal to the signal terminal 14a is made through a via hole 38a provided at the end of the signal conductor 32a, and to the power terminal 14b. The power supply is connected through a via hole 38b provided at the end of the power supply conductor wire 32. When the thus-obtained printed circuit board assembly is attached to the housing 50, the printed circuit board retainer 40 is used for the same purpose as described above. Needless to say, a connection line 36 may be separately used instead of the connection via the via holes 38a and 38b.
図 6は第 3の実施の形態による高周波回路用パッケージの実装構造を 示す図で、 従来型の高周波回路用パッケージの実装に ¾して特徴を有す る構成を示している。 図において、 1 0 Cは高周波回路用パッケージで あり、 該パッケージ 1 0 Cのグランド基板 1 1 と誘電体基板 1 2 とは通 常同一の面積となっている。 また 3 5はプリ ント基板 3 0にっきパッケ 一ジ誘電体基板 1 の上面視形状]^対応して設けられた開口部である。 高周波回路用パッケージ 1 0 Cの全体をプリント基板 3 0の背面より 開口部 3 5に嵌入すると共に、 プリント基板 3 0背面の接地導体 3 3を パッケージグランド基板 1 1の周囲側面に接触させてこれらの間を半田 付け 3 9等により接着 · 固定する。 更に、 パッケージ誘電体基板 1 2上 面の信号端子 1 4 a及び電源端子 1 4 b とプリント基板上面の信号導体 線 3 2 a及び電源導体線 3 2 b との間をそれぞれ接続線 3 6により接続 し、 こう してプリント回路基板アセンブリを形成する。  FIG. 6 is a diagram showing a mounting structure of a high-frequency circuit package according to the third embodiment, and shows a configuration having characteristics different from those of a conventional high-frequency circuit package. In the figure, 10 C denotes a high-frequency circuit package, and the ground substrate 11 and the dielectric substrate 12 of the package 10 C usually have the same area. Reference numeral 35 denotes an opening provided corresponding to the shape of the printed substrate 30 as viewed from above of the package dielectric substrate 1]. The entire high-frequency circuit package 10 C is inserted into the opening 35 from the back of the printed circuit board 30, and the ground conductor 33 on the back of the printed circuit board 30 is brought into contact with the peripheral side surface of the package ground board 11. Adhere and fix by soldering. Furthermore, connection lines 36 connect between the signal terminals 14a and the power supply terminals 14b on the upper surface of the package dielectric substrate 12 and the signal conductor lines 32a and the power supply conductor lines 32b on the upper surface of the printed circuit board, respectively. Connections, thus forming a printed circuit board assembly.
更に、 このァセンブリのパッケージグランド基板 1 1及びプリント基 板背面の接地導体 3 3の各部分を筐体 5 0の上面に接触させて、 固定す る。 その際には、 可撓性プリント基板背面の接地導体 3 3がパッケージ グランド基板 1 1周囲のできるだけ近くで筐体 5 0に密着するように、 パッケージグランド基板 1 1周囲のプリント基板 3 0の部分をプリン ト基板押え 4 0により筐体 5 0に押し付け、 ネジ等により固定する。 その際には、 高周波回路用パッケージ 1 0 Cの裏面及ぴ周辺でプリン ト基板 3 0 と筐体 5 0 との間にある隙間を埋めるようにシリコンダリー ス等による熱伝導剤 4 1を充填することが可能である。 この例のパッケ ージグランド基板 1 1はプリント基板背面の接地導体 3 3に密着固定さ れているため、 パッケージグランド基板 1 1 と筐体 5 0の間は必ずしも 電気的接続がなくてもよく、 よってパッケージグランド基板 1 1 と筐体 5 0 との間、 更には前述のような高周波回路用パッケージ 1 0 Cの近傍 のプリント基板 3 0 と筐体 5 0 との間の空間に熱伝導剤 4 1を充填する ことにより高周波回路素子からの発熱を効率よく放熱できる。 Further, each part of the package ground substrate 11 of this assembly and the ground conductor 33 on the back of the printed circuit board is brought into contact with the upper surface of the housing 50 and fixed. At that time, the ground conductor 33 on the back of the flexible printed circuit board should be in close contact with the housing 50 as close as possible to the periphery of the package ground board 11. The printed circuit board 30 surrounding the package ground board 11 is pressed against the housing 50 with the printed board presser 40 and fixed with screws or the like. At that time, a thermal conductive agent 41 such as silicon dally is filled so as to fill the gap between the print substrate 30 and the housing 50 on the back and periphery of the high-frequency circuit package 10C. It is possible to do. Since the package ground substrate 11 in this example is tightly fixed to the ground conductor 33 on the back of the printed circuit board, there is no need to provide an electrical connection between the package ground substrate 11 and the housing 50. The heat conductive agent 41 is placed in the space between the package ground substrate 11 and the housing 50 and in the space between the printed circuit board 30 and the housing 50 near the high-frequency circuit package 10 C as described above. By filling, heat generated from the high-frequency circuit element can be efficiently dissipated.
なお、 この熱伝導剤 4 1の使用は、 上記第 1 , 第 2の実施の形態によ る実装構造における各部位の放熱にも適用可能であることは言うまでも ない。  Needless to say, the use of the heat conductive agent 41 can be applied to heat radiation of each part in the mounting structure according to the first and second embodiments.
また、 上記各実施の形態では筐体 5 0にパッケージグランド基板 1 1 の部分を嵌入可能な窪み加工部を設けない場合を示したが、 これに限ら ない。 筐体 5 0に窪み加工部を設け、 ここに高周波回路用パッケージ 1 0の一部を沈めれば、 可撓性プリント基板 3 0の曲がりを少なくできる ことは明らかであり、 こうすれば、 更なる高周波特性の改善が図れる。 また、 上記各実施の形態では高周波回路素子 1 5を備える形の各種高 周波回路用パッケージを示したが、 これに限らない。 本発明は高周波回 路素子を備えない形の高周波回路用パッケージと して実現 （提供） でき ることは言うまでもない。  Further, in each of the above-described embodiments, a case is described in which the housing 50 is not provided with a recessed portion into which the portion of the package ground substrate 11 can be fitted. However, the present invention is not limited to this. It is clear that bending the flexible printed circuit board 30 can be reduced by providing a recessed part in the housing 50 and submerging a part of the high-frequency circuit package 10 here. The high frequency characteristics can be improved. In each of the above embodiments, various high-frequency circuit packages each including the high-frequency circuit element 15 have been described. However, the present invention is not limited to this. Needless to say, the present invention can be realized (provided) as a high-frequency circuit package having no high-frequency circuit element.
また、 上記本発明に好適なる複数の実施の形態を述べたが、 本発明思 想を逸脱しない範囲内で各部の構成及び組合せの様々な変更が行えるこ とは言うまでも無い。  In addition, although a plurality of embodiments suitable for the present invention have been described, it goes without saying that various changes in the configurations and combinations of the respective components can be made without departing from the spirit of the present invention.
以上述べた如く本発明によれば、 高周波回路用パッケージのプリント 基板及び筐体への実装が容易であると共に、 例えば 2 0 G H zを越え るような超高周波に対しても良好な電気的特性が得られる。 As described above, according to the present invention, printing of a package for a high-frequency circuit It is easy to mount on a board and a housing, and has good electrical characteristics even at an ultra-high frequency exceeding, for example, 20 GHz.

Claims

請 求 の 範 囲 高周波回路素子を搭載するためのパッケージグランド基板の上面 に前記高周波回路素子に接続される電極端子を有する誘電体基板 を備え、 前記パッケージグランド基板の上面が前記誘電体基板よ りも幅広に設けられていることを特徴とする高周波回路用パッケ 一ジ。 Claims: A dielectric substrate having an electrode terminal connected to the high-frequency circuit element is provided on an upper surface of a package ground substrate for mounting the high-frequency circuit element, and the upper surface of the package ground substrate is higher than the dielectric substrate. A package for a high-frequency circuit, which is also provided in a wide range.
請求項 1記載の高周波回路用パッケージにっき、 前記誘電体基板 の部分を可撓性プリ ント基板に設けた該誘電体基板と略同一サイ ズの開口部に嵌入し、 前記パッケージグランド基板の上面と前記 開口部周辺におけるプリ ント基板背面の接地導体とを接合したこ とを特徴とする高周波回路用パッケージの実装構造。 2. The package for a high-frequency circuit according to claim 1, wherein the portion of the dielectric substrate is fitted into an opening having substantially the same size as the dielectric substrate provided on the flexible print substrate, and A mounting structure for a high-frequency circuit package, wherein a ground conductor on the back side of the printed circuit board in the vicinity of the opening is joined.
高周波回路素子を搭載するためのパッケージグランド基板の上面 に設置される誘電体基板であって、 その上面に高周波回路素子に 接続するための信号用電極と、 電源用電極と、 これらの電極の周 囲に展開するように設けられたグランド電極とを備え、 該グラン ド電極が複数のバイァホールを介して前記パッケージグランド基 板の上面に接合しており、 前記誘電体基板の中央部に内部保護の ための蓋体突起部を有することを特徴とする高周波回路用パッケ ージ。 A dielectric substrate installed on the upper surface of a package ground substrate for mounting high-frequency circuit elements, on the upper surface of which a signal electrode for connecting to the high-frequency circuit element, a power supply electrode, and a periphery of these electrodes. And a ground electrode provided so as to extend to the periphery of the package. The ground electrode is joined to an upper surface of the package ground substrate via a plurality of via holes, and a central portion of the dielectric substrate is provided with an internal protection. For a high-frequency circuit, having a cover projection for use.
パッケージグランド基板は、 金属基板、 もしくは上面にメタライ ズ層を設けた誘電体基板からなることを特徴とする請求項 1又は 3記載の高周波回路用パッケージ。 4. The high-frequency circuit package according to claim 1, wherein the package ground substrate is formed of a metal substrate or a dielectric substrate provided with a metallized layer on an upper surface.
請求項 3記載の高周波回路用パッケージにっき、 少なく とも前記 誘電体基板上面中央に接合されている蓋体突起部分を可撓性プリ ント基板に設けた該蓋体突起部分と略同一サイズの開口部に嵌入 し、 前記誘電体基板上面のグランド電極と、 前記開口部周辺にお けるプリント基板背面の接地導体とを接合したことを特徴とす る高周波回路用パッケージの実装構造。 4. The high-frequency circuit package according to claim 3, wherein at least the lid protruding portion joined to the center of the upper surface of the dielectric substrate has an opening having substantially the same size as the lid protruding portion provided on the flexible print substrate. Into the ground electrode on the upper surface of the dielectric substrate and around the opening. A high-frequency circuit package mounting structure characterized by bonding to a ground conductor on the back of a printed circuit board.
誘電体基板上面の電極端子と、 可撓性プリント基板上面の開口部 付近で導体線用に舌状に切り込まれた部分上の該導体線の先端部 とを、 該先端部に設けたバイァホールを介して接合したことを特 徴とする請求項 2記載の高周波回路用パッケージの実装構造。 高周波回路素子を搭載するためのパッケージグランド基板の上面 に前記高周波回路素子に接続される電極端子を有する誘電体基板 を備えた高扃波回路用パッケージにっき、 そのパッケージグラン ド基板の部分を可撓性プリント基板に設けた前記誘電体基板と略 同一サイズの 口部に嵌入し、 前記パッケージグランド基板の周 囲面と前記開口部周辺におけるプリ ント基板背面の接地導体とを 接合したことを特徴とする高周回路用パッケージの実装構造。 A via hole provided at the tip of the electrode terminal on the top surface of the dielectric substrate, and the tip of the conductor wire on a portion cut in a tongue shape for the conductor wire near the opening on the top surface of the flexible printed circuit board 3. The mounting structure for a high-frequency circuit package according to claim 2, wherein the bonding is performed via a wire. A high-frequency circuit package including a dielectric substrate having electrode terminals connected to the high-frequency circuit element on an upper surface of a package ground substrate for mounting the high-frequency circuit element. An opening having a size substantially the same as that of the dielectric substrate provided on the substrate, and joining a peripheral surface of the package ground substrate and a ground conductor on the back surface of the printed substrate around the opening. Mounting structure of the package for the peripheral circuit.
PCT/JP2003/016562 2003-01-31 2003-12-24 High-frequency circuit package and mounting configuration thereof WO2004068580A1 (en)

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US7705445B2 (en) * 2005-02-11 2010-04-27 Rambus Inc. Semiconductor package with low and high-speed signal paths

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154657A (en) * 1997-07-29 1999-02-26 Fujitsu Ltd Package structure of electronic circuit
JP2000243877A (en) * 1999-02-24 2000-09-08 Nec Corp Package for semiconductor device and its packaging structure
EP1085594A2 (en) * 1999-09-17 2001-03-21 Kabushiki Kaisha Toshiba High frequency circuit apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154657A (en) * 1997-07-29 1999-02-26 Fujitsu Ltd Package structure of electronic circuit
JP2000243877A (en) * 1999-02-24 2000-09-08 Nec Corp Package for semiconductor device and its packaging structure
EP1085594A2 (en) * 1999-09-17 2001-03-21 Kabushiki Kaisha Toshiba High frequency circuit apparatus

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