WO2004068580A1 - Module de circuit haute frequence et configuration de montage de ce module - Google Patents

Module de circuit haute frequence et configuration de montage de ce module Download PDF

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Publication number
WO2004068580A1
WO2004068580A1 PCT/JP2003/016562 JP0316562W WO2004068580A1 WO 2004068580 A1 WO2004068580 A1 WO 2004068580A1 JP 0316562 W JP0316562 W JP 0316562W WO 2004068580 A1 WO2004068580 A1 WO 2004068580A1
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WO
WIPO (PCT)
Prior art keywords
package
substrate
frequency circuit
ground
dielectric substrate
Prior art date
Application number
PCT/JP2003/016562
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English (en)
Japanese (ja)
Inventor
Tomoyoshi Yamashita
Original Assignee
Ai Electronics Ltd.
Koa Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ai Electronics Ltd., Koa Kabushiki Kaisha filed Critical Ai Electronics Ltd.
Publication of WO2004068580A1 publication Critical patent/WO2004068580A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present invention relates to a high-frequency circuit package and a mounting structure thereof, and more particularly, to a structure of a high-frequency circuit package for mounting an r3 ⁇ 4′-frequency MMIC (Microwave Monolithic Integrated Circuit) and the like and a printed circuit board thereof. It relates to a mounting structure on a board.
  • MMIC Microwave Monolithic Integrated Circuit
  • FIG. 7 is a diagram showing an example of mounting a conventional high-frequency circuit package.
  • 60 A is a high-frequency circuit package for mounting an MM IC, etc.
  • 61 is a package ground substrate made of metal
  • 6 2 is a package dielectric substrate
  • 6 3 is a cover for protecting high frequency circuit elements
  • 6 4 is an electrode terminal for connecting a signal line and a power line
  • 6 6 is a connection line (ribbon, bonding wire, etc.)
  • 70 is a printed circuit board made of a strip line
  • ⁇ 1 is a dielectric board made of alumina or the like
  • 72 is a signal conductor on the top of the dielectric board
  • 73 is a ground conductor on the back of the dielectric board
  • 74 Denotes an opening corresponding to the package ground substrate 61 provided on the printed circuit board 70
  • 50 denotes a housing of the electronic circuit device
  • 51 denotes a recessed portion thereof.
  • An opening 74 is provided in the printed circuit board 70 in conformity with the external shape of the high-frequency circuit package 60 A in plan view, and the package ground board 61
  • the ground conductors 73 on the back of the printed circuit board are respectively fixed by contacting the common housing 50, and necessary electrical connection to the package electrode terminals 64 is made on the upper surface side of the printed circuit board 70.
  • the housing 50 is provided with a recessed portion 51.
  • FIG. 8 is a diagram illustrating another example of mounting a conventional high-frequency circuit package, and illustrates a mounting example of a surface-mount type high-frequency circuit package.
  • Fig. 8 (A) is the bottom view of the high-shoulder circuit package
  • Fig. 8 (B) is the side view of an example of mounting on a printed circuit board
  • Fig. 8 (C) is the same bottom view (viewed from the back of the printed circuit board).
  • 60 B is a package for a surface-mount type high-frequency circuit
  • 63 is a lid at the top of the package
  • 64 a is provided on the bottom of the package for connection to an external circuit.
  • Signal terminals, 64b are also power terminals, 64c are also ground electrodes, 70 is a printed circuit board with strip lines, 71 is its dielectric substrate, and 72a is the top surface of the printed circuit board. 7b is the power supply conductor, 72c is the ground electrode, 73 is the ground conductor on the back of the printed circuit board, and 74c is the ground electrode on the top of the printed circuit board.
  • a plurality of via holes for connecting between the ground conductor 73 and 50 are the housing of the electronic circuit device. .
  • the high-frequency circuit package 60B is placed on the upper side of the printed board 70, and its signal terminal 64a is connected to the signal conductor wire 72a on the upper surface of the board.
  • the power supply terminal 64b is connected to the power supply conductor wire 72b, and the center ground electrode 64c is connected to the ground electrode 72c by soldering or the like.
  • a large number of via holes are provided between the ground electrode 72 c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface. Also called 7) 4c.
  • the surface mounting component (8) mounted on the surface mounting component mounting board (2) is inserted into the opening (4) provided in the printed circuit board (14).
  • a mounting structure of a surface mounting component in which a printed circuit board (14) and a surface mounting component mounting substrate (2) are joined and fixed Japanese Patent Application Laid-Open No. Hei 10-12632.
  • connection wire 66 In the connection part, the uniform relationship between the signal conductor wire 72 on the printed circuit board surface and the ground conductor 73 on the back surface (that is, the cross-sectional shape, dimensions, permittivity as a strip line) is obtained. ), The high-frequency characteristics (characteristic impedance, transmission line wavelength, attenuation, etc.) of the line deteriorate significantly.
  • the present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure have been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a high frequency circuit which can be easily mounted on a printed circuit board and a housing and has good high frequency characteristics.
  • Package and its mounting structure has been made in view of the above-menti
  • the high-frequency circuit package 10 A of the present invention (1) has an electrode terminal 14 a connected to the high-frequency circuit element 15 on an upper surface of a package ground substrate 11 for mounting the high-frequency circuit element 15. , 14b, and an upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12.
  • the package ground substrate 11 since the upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12, such a high-frequency circuit package 10 A can be mounted on a printed circuit board or a housing. Mounting is easy, and the top surface of the package ground substrate 11 can be directly joined to the ground conductor on the back surface of the printed substrate, so that good high-frequency characteristics can be obtained.
  • the mounting structure of the high-frequency circuit package of the present invention (2) is similar to that of the high-frequency circuit package 10 A of the present invention (1), except that the dielectric substrate 12 is replaced by a flexible print substrate 3. 0, and is fitted into an opening of substantially the same size as the dielectric substrate provided on the printed circuit board.
  • the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (solder Attachment, conductive bonding, etc.).
  • the structure in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the print substrate provides a uniform, stable and reliable ground therebetween. Good connection with good circumference Wave characteristics are obtained.
  • the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and a sufficient heat radiation effect of the high-frequency circuit element can be obtained.
  • the ground conductor 33 on the back of the flexible print substrate 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground substrate 11, so that the package ground substrate 11 Therefore, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50.
  • the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 32b on the upper surface of the printed circuit board can be made with a short distance and with little step. Therefore, it is possible to operate satisfactorily and stably even at high frequency without using unnecessary reactance (inductance).
  • the high-frequency circuit package 10 B of the present invention (3) is a dielectric substrate 12 installed on the upper surface of the package ground substrate 11 for mounting the high-frequency circuit element 15, It comprises a signal electrode 14 a for connection to the high-frequency circuit element 15, a power supply electrode 14 b, and a ground electrode 14 c provided so as to extend around these electrodes.
  • a ground electrode 14c is joined to the upper surface of the package ground substrate 11 via a plurality of via holes 17c, and has a lid protrusion for internal protection at the center of the dielectric substrate 12 Things.
  • the package ground electrode 14c is provided on the upper surface of the package dielectric substrate 12, the upper surface of the ground electrode 14c and the ground conductor on the rear surface of the print substrate are directly connected. Joining is possible, so that good high-frequency characteristics can be obtained.
  • the package ground substrate 11 that can directly support the high-frequency circuit element 15 can be brought into direct contact with the upper surface of the housing, so that a sufficient heat radiation effect can be obtained.
  • the package for a high-frequency circuit according to the present invention (1) or (3) is, for example, as shown in FIG. 4, the package ground substrate 11 is a metal substrate or a metallized layer 11 a on the upper surface. It consists of a provided dielectric substrate.
  • a metal plate is used as the package ground substrate 11 in order to secure the ground connection of the high-frequency circuit element 15 and obtain a sufficient heat radiation effect.
  • the high-frequency circuit package 10A A uniform and reliable ground connection is obtained between the substrate and the printed circuit board 30.
  • a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11.
  • the package ground substrate 11 can be configured at low cost. Also, in the case of FIG.
  • the plurality of ground electrodes 14 c directly connected to the ground conductor 33 on the back of the printed circuit board 30 are connected to the upper surface 1 of the package ground substrate 11 via the plurality of via holes 17 c. 1a, there is no problem in ground connection between the high-frequency circuit package 10B and the ground conductor 33 on the back of the printed circuit board. Therefore, this type of high-frequency circuit device is inexpensive in various modes. Can be configured.
  • the above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (5) is the same as that of the high-frequency circuit package 10 B of the present invention (3), and at least the lid joined to the center of the upper surface of the dielectric substrate.
  • the projecting portion (that is, for example, the portion of the lid 13 in FIG. 5) is fitted into an opening 35 provided on the flexible print substrate 30 and having substantially the same size as the lid projecting portion.
  • the ground electrode 14c on the upper surface and the ground conductor 33 on the back of the printed circuit board around the opening 35 are joined (solder, conductive bonding, etc.).
  • the ground electrode 14c on the top surface of the package dielectric substrate 12 and the back surface of the print substrate around the print substrate opening 35 are provided.
  • a uniform, stable, and reliable ground connection can be obtained between them, and thus good high-frequency characteristics can be obtained.
  • a package ground substrate (a metal substrate or an aluminum substrate having a metallized upper surface) 11 for supporting a high-frequency circuit element can be brought into direct contact with the housing 50 of the device, and a sufficient amount of the high-frequency circuit element can be obtained. A heat radiation effect is obtained.
  • the ground conductor 33 on the back side of the flexible printed board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is unlikely to occur between the printed circuit board 30 and the housing 50.
  • the mounting structure of the high-frequency circuit package according to the present invention (6) is different from the above-mentioned present invention (2) in that the electrode terminals 14a and 14b on the upper surface of the package dielectric substrate 12 as shown in FIG.
  • a flexible printed circuit board 30 is provided with a tongue-shaped portion 34a, 34b near the opening 35 on the upper surface of the conductor wire at the tip thereof. Via holes 38. Accordingly, since a separate connection line 36 and a connection step for the connection line are not required, the connection is stable and the production is easy.
  • the mounting structure of the high-frequency circuit package of the present invention (7) has, for example, as shown in FIG. 6, an electrode terminal connected to the high-frequency circuit element on the upper surface of a package ground substrate 11 for mounting the high-frequency circuit element.
  • a high-frequency circuit package 10 C having a dielectric substrate 12 is mounted, and the package ground substrate 11 is provided on a flexible printed circuit board 30 with an opening 35 having substantially the same size as the dielectric substrate. Then, the peripheral surface of the package 'ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (soldering, conductive bonding, etc.).
  • FIG. 1 is a diagram showing the structure of the high-frequency circuit package according to the first embodiment
  • FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment
  • FIG. FIG. 2 shows a mounting structure of the high-frequency circuit package according to the embodiment (2)
  • FIG. 4 shows a structure of the high-frequency circuit package according to the second embodiment
  • FIG. 5 shows a high-frequency circuit according to the second embodiment
  • FIG. 6 is a diagram showing a mounting structure of a package for a high frequency circuit according to a third embodiment
  • FIG. 6 is a diagram illustrating a conventional technology (1)
  • FIG. FIG. 2 is a diagram (2) explaining a conventional technique.
  • FIG. 1 is a diagram showing the structure of a high-frequency circuit package according to the first embodiment, in which the upper surface of a package ground substrate 11 is provided wider than the package dielectric substrate 12.
  • 1 (A) is a side view
  • FIG. 1 (B) is a top view
  • FIG. 1 (C) is a side sectional view, where 10A is a high-frequency circuit according to the first embodiment.
  • 11 is a ground substrate made of metal
  • 12 is a dielectric substrate made of alumina or the like
  • 13 is a cover for protecting internal high-frequency circuit elements
  • 14a is a dielectric to connect to external circuits.
  • Signal terminals provided on the upper surface of the board 12, 14b are the same
  • the power supply terminal, 15 is a high-frequency circuit element such as an MM IC
  • 16 is a connection wire (ribbon, bonding wire, etc.) connecting the high-frequency circuit element and the electrode terminals 14a and 14b.
  • the high-frequency circuit element 15 is adhered on the package ground substrate 11, and the element 15 is connected to the signal terminal 14 a and the power supply terminal 14 b by a connection line 16. Furthermore, they were adhered to the lid 1 3 _ on the side of the package the dielectric substrate 1 2 to protect, it is possible to form a high-frequency circuit package as a whole.
  • the upper surface of the package ground substrate 11 is exposed around the dielectric substrate 12.
  • the ground conductor on the back of the printed circuit board can be directly joined (soldered, etc.) to this exposed part.
  • a metal plate is used as the package ground substrate 11 in order to obtain a reliable ground connection of the high-frequency circuit 15 and a sufficient heat radiation effect.
  • the high-frequency circuit package 10 A uniform and reliable ground connection is obtained between A and the printed circuit board 30.
  • a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11.
  • the package ground substrate 11 can be configured at low cost.
  • FIG. 2 is a diagram (1) showing the mounting structure of the high-frequency circuit package according to the first embodiment, showing a case where the high-frequency circuit package 10A of FIG. 1 is mounted on a flexible printed circuit board 30. ing.
  • Figure 2 (A) is a side view of the mounted state
  • Figure 2 (B) is a top view, where 10A is the high-frequency circuit package shown in Figure 1 above, and 14a is the package.
  • signal Terminal 14b is also a power supply terminal.
  • reference numeral 30 denotes a flexible printed circuit board made of, for example, a strip line
  • 31 denotes a dielectric substrate thereof (Teflon (registered trademark) or the like)
  • 32a denotes a signal conductor line on the upper surface of the dielectric substrate
  • 3 2b is the same power supply conductor wire
  • 33 is the ground conductor on the back of the dielectric substrate
  • 35 is the printed circuit board 30, and it is provided corresponding to the top view shape of the package dielectric substrate 12
  • An opening, 36 is a connection line (a repong, a bonding wire, etc.)
  • 37 is a ground contact surface between the upper surface of the package ground substrate 11 and the ground conductor 33 on the back of the printed substrate 30, and 40 is a ground contact surface.
  • the printed circuit board holder 50 is a housing of the electronic circuit device.
  • the back surface of the printed circuit board 30 is fitted into the opening 35, and the ground conductor 33 on the back of the printed circuit board is brought into contact with the exposed surface on the upper side of the package ground substrate 11 to form a ground contact surface 37, between them. Adhere and fix by soldering. Further, the signal terminals 14a and the power terminals 14b of the package and the signal conductors 32a and the power conductors 32 on the upper surface of the printed circuit board are connected by the connection wires 36, respectively. Form a printed circuit board assembly.
  • the respective portions of the ground conductors 33 on the rear surface of the package ground substrate 11 and the rear surface of the printed circuit board are brought into contact with the upper surface of the housing 50 and fixed.
  • the high-frequency circuit package 10 A must be mounted so that the ground conductor 33 on the back of the flexible printed circuit board 30 adheres to the housing 50 as close as possible to the package ground substrate 11.
  • the printed circuit board 30 is pressed against the housing 50 by the printed circuit board retainer 40 and fixed with screws or the like.
  • the first embodiment it is possible to provide a recessed portion for sinking a part of the high-frequency circuit package 10 A on the surface of the housing 50.
  • the amount of flexure of the flexible printed circuit board 30 is sufficiently small I can do it.
  • the printed circuit board 30 may be simply screwed to the housing 50 without using the printed circuit board retainer 40 as described above.
  • the configuration in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the rear surface of the printed circuit board is uniform, stable and reliable between them. Good high-frequency characteristics are obtained because a ground connection is obtained. It is also easy to handle this type of printed circuit board assembly when assembling this type of high-frequency circuit device.
  • the rear surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and the high-frequency circuit element 15 can have a sufficient heat radiation effect.
  • the ground conductor 33 on the back of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, a high-frequency potential difference is hardly generated between the printed circuit board 30 and the housing 50.
  • the connection between the package electrode terminals 14a, 14b and the conductor wires 32a, 3.2b on the upper surface of the printed circuit board is made with a short distance and with little step. It is possible to operate satisfactorily and stably even at high frequencies without any unnecessary reactance (inductance).
  • FIG. 3 is a diagram (2) showing the mounting structure of the high-frequency circuit package according to the first embodiment.
  • the signal terminal 14a and the power supply terminal 14b of the high-frequency circuit package 1OA are connected to the printed circuit board 30.
  • the figure shows a case where the signal conductor line 32a and the power supply conductor line 32b can be directly connected without passing through a separate connection line 36.
  • FIG. 3 (A) is a side view of a mounted state
  • FIG. 3 (B) is a top view.
  • 34 a is a flexible dielectric substrate 3 near the opening 35 of the printed substrate 30.
  • FIG. 1 is a tongue for a signal conductor cut into a tongue for a signal conductor line 32a
  • 34b is a tongue for a power conductor also cut tongue for a power conductor wire 32b , 38 are the tip ends of the signal conductor wire 32a and the power conductor wire 32b on the upper surface of the signal conductor tongue 34a and the power conductor tongue 34b.
  • It is a fire hole (also called a through hole) provided in the section.
  • the ground conductor 33 is not provided on the back surface of the signal conductor tongue 34 a of the printed circuit board 30.
  • the signal conductor wire 32 a on the upper surface of the printed board 30 is connected to the package signal terminal 14 a via the via hole 38 at the tip of the board.
  • the mounting structure of the other parts may be the same as that described in FIG. According to this mounting structure, since it is a simple configuration that does not require a separate connection by the connection line 36, the reliability of the signal line connection and the power supply line connection is high, and the high-frequency characteristics are improved. Also, manufacturing costs can be reduced.
  • FIG. 4 is a diagram showing the structure of a high-frequency circuit package according to the second embodiment, in which a package ground electrode 14c is provided on the same surface around a package signal terminal 14a and a power supply terminal 14b. Is shown. 4 (A) is a side view, FIG. 4 (B) is a top view, and FIG. 4 (C) is a side sectional view.
  • 10 B is a high-frequency circuit package according to the second embodiment
  • 11 is a ground substrate
  • 11 a is a metallized layer on the top surface of the ground substrate
  • 12 is a package dielectric substrate
  • 13 is a lid
  • 14 a is a signal terminal provided on the upper surface of the dielectric substrate 12
  • 14b is also a power supply terminal
  • 14c is also a dull electrode
  • 17c is a via hole (through hole) penetrating from the ground electrode 14c to the back of the dielectric substrate 12
  • 15 is an MM IC etc.
  • And 16 are connection wires (ribbon, bonding wire, etc.).
  • a high-frequency circuit element 15 is bonded on the metallized layer 11a, and the periphery thereof is bonded to a package dielectric substrate 12 having an opening in the center of the package. Surround more.
  • the signal and power supply are connected to the high-frequency circuit element 15 via the signal terminal 14 a and the power supply terminal 14 b on the top surface of the package dielectric substrate 12, respectively, and are protected by connecting wires 16 respectively. It is possible to bond the lid 13 to the upper part as much as possible to form a high-frequency circuit package as a whole.
  • a signal terminal 14a, a power supply terminal 14b, and a ground electrode 14c are provided on the same surface so as to surround them.
  • the package ground substrate 11 may be made of a metal plate.
  • FIG. 5 is a diagram showing a mounting structure of a high-frequency circuit package according to the second embodiment, and shows a case where the high-frequency circuit package 10 B of FIG. 4 is mounted on a flexible printed circuit board 30.
  • FIG. 5 (A) is a side view of a mounted state
  • FIG. 5 (B) is a top view.
  • reference numeral 35 denotes a printed board 30 and a cover 13 in a top view shape] ⁇ 3a
  • the signal conductor extending to the end face of the opening 35, 32b is the power supply conductor
  • 38a is the signal conductor 32a extending to the end face of the opening.
  • a via hole provided at the tip, 38b is a via hole provided at the tip of the power supply conductor 32b.
  • the inner opening 35 c is joined to the entire opening surface of the package ground electrode 14 c when viewed from above, but the other package terminals 14 a And 14b so that they do not come into contact with it.
  • the signal conductor line 32a and the power supply conductor line 32b on the surface of the printed circuit board extend right above the package signal terminal 14a and the power supply terminal 14b, respectively.
  • High-frequency circuit package 10 B lid on opening 35 of printed circuit board 30
  • the part of the body 13 is inserted from the back, and the ground electrode 14c on the top of the package dielectric substrate 12 is bonded and fixed to the ground conductor 33 on the back of the printed board by soldering or the like.
  • the connection of the signal to the signal terminal 14a is made through a via hole 38a provided at the end of the signal conductor 32a, and to the power terminal 14b.
  • the power supply is connected through a via hole 38b provided at the end of the power supply conductor wire 32.
  • the printed circuit board retainer 40 is used for the same purpose as described above.
  • a connection line 36 may be separately used instead of the connection via the via holes 38a and 38b.
  • FIG. 6 is a diagram showing a mounting structure of a high-frequency circuit package according to the third embodiment, and shows a configuration having characteristics different from those of a conventional high-frequency circuit package.
  • 10 C denotes a high-frequency circuit package
  • the ground substrate 11 and the dielectric substrate 12 of the package 10 C usually have the same area.
  • Reference numeral 35 denotes an opening provided corresponding to the shape of the printed substrate 30 as viewed from above of the package dielectric substrate 1].
  • the entire high-frequency circuit package 10 C is inserted into the opening 35 from the back of the printed circuit board 30, and the ground conductor 33 on the back of the printed circuit board 30 is brought into contact with the peripheral side surface of the package ground board 11. Adhere and fix by soldering.
  • connection lines 36 connect between the signal terminals 14a and the power supply terminals 14b on the upper surface of the package dielectric substrate 12 and the signal conductor lines 32a and the power supply conductor lines 32b on the upper surface of the printed circuit board, respectively. Connections, thus forming a printed circuit board assembly.
  • each part of the package ground substrate 11 of this assembly and the ground conductor 33 on the back of the printed circuit board is brought into contact with the upper surface of the housing 50 and fixed.
  • the ground conductor 33 on the back of the flexible printed circuit board should be in close contact with the housing 50 as close as possible to the periphery of the package ground board 11.
  • the printed circuit board 30 surrounding the package ground board 11 is pressed against the housing 50 with the printed board presser 40 and fixed with screws or the like.
  • a thermal conductive agent 41 such as silicon dally is filled so as to fill the gap between the print substrate 30 and the housing 50 on the back and periphery of the high-frequency circuit package 10C. It is possible to do.
  • the heat conductive agent 41 is placed in the space between the package ground substrate 11 and the housing 50 and in the space between the printed circuit board 30 and the housing 50 near the high-frequency circuit package 10 C as described above. By filling, heat generated from the high-frequency circuit element can be efficiently dissipated.
  • the use of the heat conductive agent 41 can be applied to heat radiation of each part in the mounting structure according to the first and second embodiments.
  • the housing 50 is not provided with a recessed portion into which the portion of the package ground substrate 11 can be fitted.
  • the present invention is not limited to this. It is clear that bending the flexible printed circuit board 30 can be reduced by providing a recessed part in the housing 50 and submerging a part of the high-frequency circuit package 10 here. The high frequency characteristics can be improved.
  • various high-frequency circuit packages each including the high-frequency circuit element 15 have been described.
  • the present invention is not limited to this. Needless to say, the present invention can be realized (provided) as a high-frequency circuit package having no high-frequency circuit element.
  • printing of a package for a high-frequency circuit It is easy to mount on a board and a housing, and has good electrical characteristics even at an ultra-high frequency exceeding, for example, 20 GHz.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un module de circuit haute fréquence et une configuration de montage de ce module qui permet de le monter aisément sur une carte et un boîtier de circuits imprimés, afin de permettre la mise en oeuvre d'une caractéristique haute fréquence recherchée. Cette configuration de montage comprend un substrat (11) de connexion de module, qui comporte un espace destiné au montage du composant (15) circuit haute fréquence, et qui possède, sur sa surface supérieure, des bornes (14a, 14b) d'électrode destinées à être connectées au composant (15) circuit haute fréquence. La surface supérieur du substrat (11) de connexion au module est plus large que le substrat (12) diélectrique. En outre dans un tel module (10A) de circuit haute fréquence, une partie du substrat (12) diélectrique est insérée dans une ouverture (35) de dimension sensiblement identique à celle du substrat diélectrique monté sur une carte (30) à circuit imprimé flexible. La surface supérieure du substrat (11) de connexion au module est directement raccordée (par soudage) à un conducteur (33) de mise à la terre sur l'arrière de la carte à circuit imprimé, à la périphérie de l'ouverture (35).
PCT/JP2003/016562 2003-01-31 2003-12-24 Module de circuit haute frequence et configuration de montage de ce module WO2004068580A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-24474 2003-01-31
JP2003024474A JP4388284B2 (ja) 2003-01-31 2003-01-31 高周波回路用パッケージ及びその実装構造

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WO2004068580A1 true WO2004068580A1 (fr) 2004-08-12

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WO (1) WO2004068580A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7705445B2 (en) * 2005-02-11 2010-04-27 Rambus Inc. Semiconductor package with low and high-speed signal paths

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154657A (ja) * 1997-07-29 1999-02-26 Fujitsu Ltd 電子回路のパッケージ構造
JP2000243877A (ja) * 1999-02-24 2000-09-08 Nec Corp 半導体装置用パッケージとその実装構造
EP1085594A2 (fr) * 1999-09-17 2001-03-21 Kabushiki Kaisha Toshiba Dispositif à hautes fréquences

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154657A (ja) * 1997-07-29 1999-02-26 Fujitsu Ltd 電子回路のパッケージ構造
JP2000243877A (ja) * 1999-02-24 2000-09-08 Nec Corp 半導体装置用パッケージとその実装構造
EP1085594A2 (fr) * 1999-09-17 2001-03-21 Kabushiki Kaisha Toshiba Dispositif à hautes fréquences

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JP4388284B2 (ja) 2009-12-24
JP2004235558A (ja) 2004-08-19

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