JP3441192B2 - Metal package for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal package for electronic parts, which is made of metal such as iron alloy and copper alloy for housing electronic parts such as semiconductor chips.

[0002]

2. Description of the Related Art In a conventional metal package for electronic parts, a semiconductor chip housed inside the metal package is electrically connected to an electronic part arranged outside the metal package or a wiring circuit of a metal package mounting substrate. The following connection means are provided.

That is, as shown in FIG. 8, a ceramic terminal 20 having a convex cross section is hermetically fitted in a rectangular hole 12 formed in a side wall of a metal package 10.

Alternatively, as shown in FIG. 9, an external lead 30 made of metal is inserted into a circular hole 12 formed in a side wall of the metal package 10, and the external lead 30 portion inserted into the hole 12 is inserted. Is hermetically sealed in the hole 12 through a glass 40 made of a dielectric material. The sealed portion of the external lead 30 inserted into the hole 12 is formed in the coaxial line structure.

In the metal package for electronic parts provided with these connecting means, as shown in FIG. 8 or 9, a submount 55 made of copper alloy, aluminum nitride or the like is provided on the inner bottom of the metal package 10. The electrode of the mounted semiconductor chip 50 is connected to the inner end of the connection line 22 provided on the ceramic terminal 20 or the inner end of the external lead 30 protruding inward of the metal package 10 via a wire 60, and the outside of the metal package 10 is connected. A part of the wiring terminal of the electronic component (not shown) and the wiring circuit of the metal package mounting board (not shown) arranged in the outer terminal of the external lead 30 connected to the outer end of the connecting line 22 of the ceramic terminal or The semiconductor chip 50 inside the metal package 10 is connected to the outer ends of the external leads 30 protruding outside the metal package 10. And it is electrically connected to the barrel package 10 outside the electronic component and the printed circuit board for metal packaging.

[0006]

However, in the metal package for electronic parts shown in FIG. 8, the hole 12 for fitting the ceramic terminal 20 is formed on the side wall of the metal package 10 according to the outer diameter dimension of the ceramic terminal 20. Therefore, it is necessary to open the hole 12 with high accuracy and to tightly fit the ceramic terminal 20 into the hole 12 by brazing or the like, which requires a great deal of work for opening the hole 12. Along with that
The corner portion of the hole 12 for fitting the ceramic terminal 20 must be formed into a sharp L-shape in accordance with the shape of the L-shaped sharp corner portion of the ceramic terminal 20, and the work of forming the corner portion of the hole 12 It took a lot of work.

Further, in the metal package for electronic parts shown in FIG. 9, a plurality of external leads 30 are formed in a plurality of circular holes 12 formed in the side wall of the metal package 10 and arranged side by side at a small pitch. In the case where it is attempted to match the characteristic impedances of the sealed portions of the external leads 30 having the coaxial line structure, which are respectively sealed through the glass 40 of FIG.
The diameter of the hole 12 for inserting the external lead 30 must be formed to be large according to the dielectric constant ε of the glass 40.
2 overlapped with a part of the hole 12 for inserting the external lead 30 adjacent to it. Then, the characteristic impedance of the sealed portion of the external lead 30 inserted into the hole 12 is set to 50Ω.
Etc. could not be matched.

At the same time, it was not possible to match the characteristic impedance of the inner end of the external lead 30 that protrudes inwardly of the metal package 10 to 50Ω or the like. Then, the high frequency signal could not be transmitted to the inner end of the external lead 30 with a small transmission loss.

The present invention has been made in view of the above problems, and an electric circuit is provided in a wiring circuit of an electronic component or a metal package mounting substrate in which a semiconductor chip housed inside the metal package is arranged outside the metal package. It is an object of the present invention to provide a metal package for electronic parts (hereinafter referred to as a metal package) in which the connecting means for connecting to the above is simplified and the connecting means can be easily attached to the side wall of the metal package.

At the same time, another object is to provide a metal package capable of matching the characteristic impedance of the connecting line provided in the connecting means to a predetermined value over substantially the entire length of the connecting line.

[0011]

To achieve the above object, the first metal package of the present invention has a hole in which one end of an insulating substrate provided with a connection line is opened in a side wall of the metal package. Is inserted into the metal package while the other end of the insulating substrate is projected into the metal package, and the hole is made of an insulating material from the outside of the metal package. It is characterized in that the cover is airtightly covered, the outer lead is airtightly inserted through the cover, and the inner end of the outer lead is electrically connected to the connection line.

In a second metal package of the present invention, one end of an insulating substrate provided with a connecting line is inserted into a hole opened in a side wall of the metal package, and the other end of the insulating substrate is inserted. The insulating substrate is joined to the metal package, and the hole is airtightly covered with a lid made of metal from the outside of the metal package, and the external lead is attached to the lid. Is hermetically inserted into the lid with electrical insulation, and the inner ends of the external leads are electrically connected to the connection line.

In the first or second metal package of the present invention, the connecting portion of the connecting line to the external lead is extended at one end of the insulating substrate inserted into the hole, and the connecting portion is connected to the connecting portion. It is preferable that the inner ends of the outer leads are electrically connected.

At the same time, it is preferable that the other end of the insulating substrate protruding inward of the metal package is provided with a connecting portion for connecting the electronic component of the connecting line.

In the first or second metal package of the present invention, it is preferable that the insulating substrate is made of ceramic and the connection line is made of metallized.

In the first or second metal package of the present invention, it is preferable that the insulating layer is provided with a ground layer for forming the connection line in the microstrip line structure, and the ground layer is metallized. It is preferable to consist of

In the first metal package of the present invention, the lid body is made of ceramic, and the external leads are hermetically brazed to the lid body via the metallization layer provided on the lid body. Is preferred.

In the second metal package of the present invention, it is preferable that the external lead is hermetically sealed to the lid body made of metal via glass.

[0019]

In the first or second metal package of the present invention, the electrode of the electronic component housed inside the metal package is connected to the connection portion of the connection line provided on the insulating substrate with the electronic component by a wire or the like. At the same time, the connection terminals of the electronic components placed outside the metal package and a part of the wiring circuit of the metal package mounting board are connected to the outer ends of the external leads to connect the electronic components inside the metal package and the electronic components outside the metal package. The wiring circuit of the metal package mounting board can be electrically connected via the connection line and the external lead.

Further, since the hole opened in the side wall of the metal package is airtightly covered with the lid from the outside of the metal package, the connecting means is provided on the side wall of the metal package so as not to impair the airtightness of the metal package. Connection, one end of the insulating substrate can be inserted, and a hole larger than the outer diameter of one end of the substrate can be opened in the side wall of the metal package. It is possible to greatly simplify and facilitate the work of opening the means mounting hole on the side wall of the metal package.

Further, according to the present invention, a connecting portion of the connecting line to the external lead is extended to one end of the insulating substrate inserted into the hole, and the inner end of the external lead is electrically connected to the connecting portion. In the first or second metal package, the connecting portion of the connection line to the external lead is brought closer to the lid body, and is the inner end of the outer lead projecting inside the lid body, and the outer lead of the connection line. The inner end of the external lead electrically connected to the connection portion can be shortened. Then, the high frequency characteristics of the inner ends of the external leads can be improved.

Further, in the first or second metal package of the present invention in which the connecting portion for connecting the electronic component of the connecting line is extended to the other end portion of the insulating substrate protruding inward of the metal package. , The connection portion of the connection line with the electronic component can be brought close to the electronic component housed inside the metal package, and the electrode of the electronic component can be electrically connected to the connection portion of the connection line with the electronic component with a wire or the like for a short distance. . Then, it is possible to improve high-frequency characteristics of a wire or the like that electrically connects a connecting portion between the electrode of the electronic component and the electronic component of the connection line. At the same time, a connection portion of the connection line with the electronic component can be arranged in a wide open space inside the side wall of the metal package, and a wire or the like can be electrically connected to the connection portion easily and accurately.

Further, in the first or second metal package of the present invention in which the insulating substrate is provided with the ground layer for forming the connection line in the microstrip line structure, the width and the thickness of the connection line. Can be adjusted or the distance between the connection line and the ground layer can be adjusted to match the characteristic impedance of the connection line with a predetermined value over substantially the entire length of the connection line.

Further, in the first metal package of the present invention in which the outer leads are hermetically inserted in the lid body made of an insulating material such as ceramic, the outer leads are electrically connected to the metal package through the lid body. The cover made of an insulating material can prevent a short circuit and an external lead from being electrically short-circuited with another external lead that is hermetically inserted in the same cover.

Further, in the second metal package of the present invention in which the outer leads are hermetically sealed to the lid body made of metal via the glass, the metal package is provided with the outer leads made of the metal body. The glass of the insulating material can prevent electrical short-circuiting, and electrical short-circuiting with other external leads that are hermetically inserted in the lid made of the same metal.

[0026]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 4 show a preferred embodiment of the first metal package of the present invention, FIG. 1 is a partial front sectional view thereof, FIG. 2 is a partial plan view thereof, and FIG. 3 is a partially exploded structure explanatory view thereof. ,
FIG. 4 is a partial perspective view thereof. The metal package will be described below.

In the figure, 70 is an insulating substrate made of a strip-shaped ceramic. On the insulating substrate 70, a strip-shaped connecting line 72 made of metallized is provided across the upper surface of the insulating substrate 70. The connecting line 72 portion extended to the upper surface of the one end 70a of the insulating substrate constitutes a connecting portion 74 with the external lead of the connecting line. At the same time, the connecting line 72 portion extending on the upper surface of the other end 70b of the insulating substrate constitutes a connecting portion 76 of the connecting line with the electronic component. A plurality of connection lines 72 are provided side by side on the upper surface of the insulating substrate 70 at a predetermined pitch.

A hole 12 is opened in the side wall of the metal package 10 made of a metal such as an iron alloy or a copper alloy. As shown in FIG. 3, the hole 12 has a horizontally elongated slot shape. The corner portion of the hole 12 is formed in an arc shape for easy processing. The hole 12 is formed at one end 70 of the insulating substrate.
It is formed larger than the outer diameter dimension of one end 70a of the substrate so that a can be inserted with a margin.

The insulating substrate 70 has one end 70a inserted into the hole 12 formed in the side wall of the metal package 10 and the other end 70b protruding inward of the metal package 10. , Metal package 10
Is joined to. Specifically, one end 70a of the insulating substrate is inserted into the hole 12 and one end 7a of the substrate is inserted.
0a is brazed to the lower inner wall of the hole 12 through a metal-plated ground layer 80, which will be described later, provided on the lower surface of the insulating substrate 70. At the same time, the other end 70b of the insulating substrate is projected inward of the metal package 10. A gap 32 is provided between the upper surface of the insulating substrate 70 and the upper inner wall of the hole 12 to prevent the connection line 72 from electrically contacting the metal package 10.

The hole 12 is airtightly covered with a lid 90 from the outside of the metal package 10. The lid 90 is made of insulating ceramic and has a plate shape. Lid 9
0 is hermetically brazed to the outer surface of the metal package 10 around the hole 12 through a metallized metallized layer 92 provided on the inner peripheral edge thereof.

The lid 90 is made of iron-nickel alloy or iron-
External lead 3 made of metal such as nickel-cobalt alloy
0 is airtightly inserted, and the inner end of the outer lead 30 is projected into the hole 12 opened in the metal package 10. Specifically, as shown in FIGS. 3 and 4, a plurality of insertion holes 94 are opened side by side in the lid 90 at a predetermined pitch, and the external leads 30 are inserted into the insertion holes 94, respectively. There is. A metallized layer 96 plated with metal is continuously provided on the inner peripheral surface of the insertion hole 94 and the outer peripheral surface portion of the lid 90 continuous with the inner peripheral surface. And the metallized layer 9
The portion of the external lead 30 inserted through the insertion hole 94 through 6 is airtightly brazed to the lid 90. And
The external lead 30 has the metal package 1 via the lid 90.
0 and the external lead 30 is the same as the lid 9
It is the lid 9 made of ceramic of an insulating material that electrically short-circuits to the other external lead 30 that is hermetically inserted in 0.
Prevented by 0.

The inner ends of the outer leads 30 protruding into the holes 12 are brazed to the connecting portions 74 of the connecting lines extending on the upper surface of one end 70a of the insulating substrate inserted into the holes 12 with the outer leads. Are electrically connected by.

In addition, in the illustrated metal package, the insulating substrate 70 is provided with the ground layer 80 for forming the connection line 72 in the microstrip line structure. Specifically, a ground layer 80 made of metallization is provided on the lower surface of the insulating substrate 70. The width and thickness of the connection line 72 are adjusted, the thickness of the insulating substrate 70 is adjusted, and the distance between the connection line 72 and the ground layer 80 is adjusted. Is matched with 50Ω or the like over substantially the entire length of the connection line 72.

The first metal package shown in FIGS. 1 to 4 is constructed as described above. In this metal package, as shown in FIG. 2, the semiconductor package housed inside the metal package 10 is used. The electrode of the electronic component 50 such as a chip is electrically connected to the connecting portion 76 of the connecting line extending to the upper surface of the other end 70b of the insulating substrate protruding inward of the metal package 10 with the electronic component via the wire 60 or the like. The external leads 30 are electrically connected to a connection terminal of an electronic component (not shown) disposed outside the metal package 10 or a part of a wiring circuit of a metal package mounting substrate (not shown). Connect to the metal package 10
The electronic component 50 inside and the electronic component outside the metal package 10 or the wiring circuit of the metal package mounting substrate can be electrically connected via the connection line 72 and the external lead 30. Then, the high frequency signal can be transmitted to the connection line 72 whose characteristic impedance is matched to 50Ω or the like with a small transmission loss.

FIG. 5 shows another preferred embodiment of the first metal package of the present invention, more specifically a partial plan view thereof. The metal package will be described below.

In the illustrated metal package, both ends of one end 70a of the insulating substrate are hollowed out in an L shape so that the width of one end 70a of the insulating substrate is equal to the width of the other insulating substrate 70. It is narrower than. Then, one end 70a of the insulating substrate is inserted with a margin into the hole 12 opened in the side wall of the metal package 10.

A metallized layer 98 plated with metal is provided on the stepped surface 70c, which is carved into the L shape on both sides of one end 70a of the insulating substrate, and the metallized layer 9 is provided.
Step surface 7 on both sides of one end 70a of the insulating substrate
0c is brazed to the inner surface of the metal package 10. The insulating substrate 70 is the metal package 10.
Is joined to.

Others are the same as those of the first metal package shown in FIGS. 1 to 4, and the operation is the same as that of the first metal package shown in FIGS. 1 to 4. .

FIG. 6 shows a preferred embodiment of the second metal package of the present invention, more specifically a partial front sectional view thereof. The metal package will be described below.

In the illustrated metal package, the lid 90 is made of metal such as iron or iron alloy and has a plate shape. The lid body 90 is brazed directly to the outer surface portion of the metal package 10 around the hole 12 and is hermetically joined by welding or the like.

The external lead 30 is hermetically inserted through the lid 90 so as to have electrical insulation. Specifically, a plurality of insertion holes 94 are opened side by side in the lid 90 at a predetermined pitch, and the external leads 30 are inserted into the insertion holes 94, respectively. The portion of the external lead 30 inserted through the insertion hole 94 is hermetically sealed to the lid 90 via the glass 40 such as borosilicate glass. And the insertion hole 9
The sealed portion of the outer lead 30 which is inserted through 4 is formed in a coaxial line structure. At the same time, the external lead 30 is electrically short-circuited to the metal package 10 via the lid 90 made of metal, or the external lead 30 is electrically connected to another external lead 30 hermetically inserted in the same lid 90. The short circuit or the like is prevented by the glass 40 of the insulating material.

The inner end of the outer lead 30 is connected to the outer lead connecting portion 74 of the connection line at a temperature lower than the temperature applied to the lid 90 or the like when the outer lead 30 is sealed to the lid 90 via the glass 40. It is electrically connected by soldering or the like. Then, when the inner end of the external lead 30 is connected to the connecting portion 74 of the connecting line with the external lead, the glass 4 is put on the lid 90.
It is prevented that the airtightness of the portion of the outer lead 30 which is sealed by the seal 0 is impaired.

Others are the same as those of the first metal package shown in FIG. 1 to FIG. 4 or FIG. 5, and the operation thereof is the same as that of the first metal package shown in FIG. 1 to FIG. 4 or FIG. Similar to metal package.

In the first or second metal package shown in FIG. 1 to FIG. 4, FIG. 5 or FIG. 6, a case where a low frequency signal or a power supply current is transmitted to the external lead 30 or the connection line 72, When it is not necessary to consider the high frequency characteristics of the external lead 30, the connecting portion 74 of the connecting line with the external lead is provided at one end 7 of the insulating substrate inserted in the hole 12.
0a inner end of the external lead 30 which is disposed in the middle of the upper surface of the insulating substrate 70 and does not extend to the upper surface of the insulating substrate 70, and penetrates the inside of the hole 12 through the connecting portion 74 with the external lead and projects inward of the metal package 10. May be electrically connected.

At the same time, the external lead 30 and the connecting line 7
2 is a case of transmitting a low frequency signal or a power supply current, and a high frequency wave such as a wire 60 that electrically connects the connection portion 76 between the electrode of the electronic component 50 housed inside the metal package 10 and the electronic component of the connection line. When it is not necessary to consider the characteristics, the connection portion 76 of the connection line with the electronic component is provided with the other end portion 7 of the insulating substrate protruding inward of the metal package 10.
0b is not extended to the upper surface of the insulating substrate 70, but is disposed in the middle of the upper surface of the insulating substrate 70, and the electrode of the electronic component 50 housed inside the metal package 10 is connected to the electronic component of the connection line by the wire 60 or the like. It may be electrically connected for a long distance.

Further, in the case of transmitting a low frequency signal or a power supply current to the connection line 72 in the first or second metal package shown in FIGS. 1 to 4, 5 or 6,
When it is not necessary to match the characteristic impedance of the connection line 72 to 50Ω or the like, the ground layer 80 for forming the connection line 72 in the microstrip line structure.
The insulating substrate 70 may not be provided. And the insulating substrate 7
0 may be bonded to the metal package 10 using an adhesive or the like.

Further, as described above, even when it is not necessary to match the characteristic impedance of the connection line 72 to 50Ω or the like, the ground layer 80 made of metallization is provided on the lower surface of the insulating substrate 70, and the ground layer 80 is interposed therebetween. The insulating substrate 70 may be brazed and joined to the metal package 10, but in such a case, the width and thickness of the connecting line 72 may be adjusted, or the thickness of the insulating substrate 70 may be adjusted to connect the connecting line 72. It goes without saying that the characteristic impedance of the connection line 72 need not be matched to 50Ω or the like by adjusting the distance between the 72 and the ground layer 80.

The lid 90 is attached to the metal package 10.
An adhesive may be used instead of brazing or the like for airtightly joining the outer surface.

Further, as shown in FIG. 7, the insulating substrate 70
Is formed into a multi-layered structure in which a plurality of insulating layers are laminated, and a connection portion 74 with an external lead of a connection line and a connection portion 76 with an electronic component of the connection line, which must be provided on the surface of the insulating substrate 70a.
The metallized line 72a provided with the middle part of the connection line 72 except for and between the insulating layers of the insulating substrate 70, and the via 72b filled with the metallized layer which vertically penetrates the insulating layer of the insulating substrate 70 are filled. Connect and form the connection line 7
2 may be disposed inside the insulating substrate 70. In such a case, the width and thickness of the metallized line 72a may be adjusted, or the distance between the metallized line 72a and the ground layer 80 may be adjusted. As a result, the characteristic impedance of the metallized line 72a arranged inside the insulating substrate 70 can be matched to 50Ω or the like.

When the insulating substrate 70 is formed in a multilayer structure as described above, the ground layer 80 for forming the connection line 72 in the microstrip line structure is provided between the insulating layers of the insulating substrate 70. Is also good.

Further, as shown in FIG. 5, the first or second
In the above metal package, the L-shaped stepped surfaces 70c on both sides of the one end 70a of the insulating substrate may be directly bonded to the inner surface of the metal package 10 using an adhesive or the like.

In the first or second metal package of the present invention, the connecting line 72 may be provided on the insulating substrate 70 instead of a plurality of lines, and only one line may be provided. A metal package having the same action as the first or second metal package shown in FIG. 4, FIG. 5 or FIG. 6 can be constructed.

In the first or second metal package of the present invention, the insulating substrate 70 is made of synthetic resin, or the metal foil such as copper provided on the insulating substrate 70 made of the synthetic resin is etched. For example, the insulating substrate 70 may be provided with the connection line 72, and even in that case, the same operation as that of the first or second metal package shown in FIGS. 1 to 4, 5 or 6 is performed. A metal package having

[0054]

As described above, according to the first or second metal package of the present invention, the semiconductor housed inside the metal package via the connection line and the external lead provided on the insulating substrate. It is possible to electrically connect an electronic component such as a chip to an electronic component arranged outside the metal package or a wiring circuit of a metal package mounting substrate.

When the connecting means is attached to the metal package, a hole larger than the outer diameter of one end of the insulating substrate is opened in the side wall of the metal package, and the one end of the insulating substrate is inserted into the hole. However, it is not necessary to form the corner portion of the hole that opens in the side wall of the package into an L-shape, and the work of opening the hole for mounting the connecting means in the side wall of the metal package is not required. It can be simplified and facilitated.

Further, according to the first or second metal package of the present invention in which the insulating substrate is provided with the ground layer for forming the connection line in the microstrip line structure, the width and thickness of the connection line can be reduced. By adjusting or adjusting the distance between the connection line and the ground layer, the characteristic impedance of the connection line can be matched to a predetermined value over substantially the entire length of the connection line. Then, the high-frequency signal can be efficiently transmitted to the connection line with little transmission loss.

[Brief description of drawings]

FIG. 1 is a partial front sectional view of a first metal package of the present invention.

FIG. 2 is a partial plan view of the first metal package of the present invention.

FIG. 3 is a partially exploded explanatory view of the first metal package of the present invention.

FIG. 4 is a partial perspective view of the first metal package of the present invention.

FIG. 5 is a partial plan view of the first metal package of the present invention.

FIG. 6 is a partial front sectional view of a second metal package of the present invention.

FIG. 7 is an enlarged front sectional view of an insulating substrate of the first or second metal package of the present invention.

FIG. 8 is a partial front sectional view of a conventional metal package.

FIG. 9 is a partial front sectional view of a conventional metal package.

[Explanation of symbols]

10 metal package 12 holes 20 ceramic terminals 30 external leads 40 glass 50 Electronic components such as semiconductor chips 55 submount 60 wires 70 Insulation board 70a One end of insulating substrate 70b The other end of the insulating substrate 70c Stairs 72 Connection line 72a Metallized track 72b via 74 Connection part with external lead of connection line 76 Connection part with electronic parts of connection line 80 ground layer 90 Lid 92, 96, 98 Metallized layer 94 insertion hole

Claims (7)

(57) [Claims] 1. A one end of the insulating substrate provided connection line is together with the extending <br/> into a hole opened in the side wall of the metal packaging, the other end of the insulating substrate is a metal in a state of being protruded inwardly of the package, the insulating substrate is joined to the metal package, and the hole is a metal package
Lid made of ceramic bonded to the outer surface of the side wall of the cage
Covered with outside people or we airtight metal package by the body, it is
Luo, the external leads are passed inserted in said top, said external lead
However, the lid does not touch the metallization layer provided on the lid.
Closely with brazed, electronic component metal packaging for the inner end of said outer leads, characterized in that it is electrically connected to the connecting line. Wherein one end portion of the insulating substrate provided connection line is together with the extending <br/> into a hole opened in the side wall of the metal packaging, the other end of the insulating substrate is a metal in a state of being protruded inwardly of the package, the insulating substrate is joined to the metal package, and the hole is a metal package
The metal lid joined to the outer surface of the side wall of the
Ri is covered by the outside people or we airtight metal package, further,
Lid body outer leads threaded through interpolation, the external lead metal
When it is hermetically sealed to the lid made of glass through glass,
The electronic component metal packaging for, characterized in that the inner end of said outer leads are electrically connected to the connecting line. 3. A connecting portion between the external lead connection line to one end of the insulating substrate, which is extending into the hole is extended, the inner end of the outer leads are electrically connected to the connecting portion The metal package for electronic parts according to claim 1 or 2. 4. according to any one of the connecting portions of claims 1, 2 or 3 are extended and connected line electronic components to the other end portion of the insulating substrate which is projected inwardly of metal packaging Metal package for electronic components. Wherein the insulating substrate is a ceramic, claims 1, 2, 3 or 4 noise connection line is made of metallized
The metal package for electronic parts described in one of them . 6. The metal electronic component according to any one of claims 1, 2, 3, 4 or 5 in which the ground layer is gills Bei for forming a connection line to the insulating substrate to the microstrip line structure package. 7. The metal package for electronic parts according to claim 6, wherein the ground layer is formed by metallization.