JP4388284B2 - High frequency circuit package and its mounting structure - Google Patents

High frequency circuit package and its mounting structure Download PDF

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Publication number
JP4388284B2
JP4388284B2 JP2003024474A JP2003024474A JP4388284B2 JP 4388284 B2 JP4388284 B2 JP 4388284B2 JP 2003024474 A JP2003024474 A JP 2003024474A JP 2003024474 A JP2003024474 A JP 2003024474A JP 4388284 B2 JP4388284 B2 JP 4388284B2
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package
ground
frequency circuit
substrate
circuit board
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JP2004235558A (en
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與慶 山下
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Koa Corp
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Koa Corp
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は高周波回路用パッケージ及びその実装構造に関し、更に詳しくは、高周波用ＭＭＩＣ(Microwave Monorithic Integrated Circuit)等を実装するための高周波回路用パッケージの構造及びそのプリント基板への実装構造に関する。
【０００２】
高周波回路用パッケージの実装構造で重要な点は、グランド線及び信号線の接続であり、特に高周波回路用パッケージのグランド電極はプリント基板裏面の接地導体及び筐体アースと電気的にも熱的にも一体に近い関係にあることが望ましい。
【０００３】
【従来の技術】
図７は従来の高周波回路用パッケージの一実装例を示す図で、図において、６０ＡはＭＭＩＣ等を実装するための高周波回路用パッケージ、６１は金属からなるパッケージグランド基板、６２はパッケージ誘電体基板、６３は高周波回路素子を保護するための蓋体、６４は信号線や電源線を接続するための電極端子、６６は接続線（リボン，ボンディングワイヤ等）、７０はストリップ線路によるプリント基板、７１はアルミナ等による誘電体基板、７２は誘電体基板上面の信号導体線、７３は誘電体基板背面の接地導体、７４はプリント基板７０に設けたパッケージグランド基板６１に対応した開口部、５０は電子回路装置の筐体、５１はその窪み加工部である。
【０００４】
高周波回路用パッケージ６０Ａの平面視外形に合わせてプリント基板７０に開口部７４を設けると共に、パッケージグランド基板６１とプリント基板背面の接地導体７３とをそれぞれ共通の筐体５０に接触させて固定し、かつプリント基板７０の上面側でパッケージ電極端子６４に必要な電気的接続を行っている。その際には、もしパッケージ電極端子６４とプリント基板７０の上面との間の段差が大きいと、接続線６６の曲がりによりインダクタンス成分が増加して電気的特性を悪化させるため、この影響を軽減すべく、筐体５０に窪み加工部５１を施している。
【０００５】
図８は従来の高周波回路用パッケージの他の実装例を示す図で、表面実装型高周波回路用パッケージの実装例を示している。図８（Ａ）は高周波回路用パッケージの底面図、図８（Ｂ）はプリント基板への実装例の側面図、図８（Ｃ）は同じく底面図（プリント基板の背面から見た透視図）であり、図において、６０Ｂは表面実装型の高周波回路用パッケージ、６３はパッケージ上部の蓋体、６４ａは外部回路と接続すべくパッケージ底面に設けられた信号端子、６４ｂは同じく電源端子、６４ｃは同じくグランド電極、７０はストリップ線路によるプリント基板、７１はその誘電体基板、７２ａはプリント基板上面の信号導体線、７２ｂは同じく電源導体線、７２ｃは同じくグランド電極、７３はプリント基板背面の接地導体、７４ｃはプリント基板上面のグランド電極７２ｃと背面の接地導体７３との間を接続するための複数のバイアホール（via hole）、５０は電子回路装置の筐体である。
【０００６】
図８（Ｂ），（Ｃ）において、高周波回路用パッケージ６０Ｂは、プリント基板７０の上側に置かれ、その信号端子６４ａは基板上面の信号導体線７２ａに、電源端子６４ｂは同じく電源導体線７２ｂに、そして中央のグランド電極６４ｃは同じくグランド電極７２ｃに、それぞれ半田付け等により接続される。その際には、パッケージグランド電極６４ｃをより確実にアース電位に近付けるために、プリント基板上面のグランド電極７２ｃと背面の接地導体７３との間に多数のバイアホール（ビアホールとも呼ばれる）７４ｃを設けている。
【０００７】
また、図示しないが、従来は、プリント基板（１４）に設けられた開口部（４）内に、表面実装部品搭載基板（２）に搭載されている表面実装部品（８）を嵌入し、プリント基板（１４）と表面実装部品搭載基板（２）とを接合固定するところの表面実装部品の実装構造が知られている（例えば特許文献１）。
【０００８】
【特許文献１】
特開平１０−１２６０３２号公報（要約，図）。
【０００９】
【発明が解決しようとする課題】
しかし、上記図７に示した如く、一旦、プリント基板開口部７４で切断された信号導体線７２とパッケージ電極端子６４との間を接続線６６により接続する方式であると、その接続部分では、プリント基板表面の信号導体線７２と、背面の接地導体７３との間の一様な関係（即ち、ストリップ線路としての断面形状，寸法，誘電率等）が維持されなくなるため、線路の高周波特性（特性インピーダンス，伝送線波長，減衰量等）が著しく劣化するという問題があった。
【００１０】
また上記の如く、パッケージグランド基板６１とプリント基板背面の接地導体７３との間のグランド接続を、これらに共通の筐体５０への接触を介して行う方式であると、筐体５０とパッケージグランド基板６１又はプリント基板接地導体７３との間に存在するような僅かな隙間が回路の高周波特性に大きく影響するばかりか、これを阻止するためには、高周波回路用パッケージ６０Ａ及びプリント基板７０を共に筐体５０にネジ止め又は導電接着する必要があり、これがコスト増加の一要因となっていた。
【００１１】
また上記図８に示した如く、パッケージグランド電極６４ｃとプリント基板背面の接地導体７３との間のグランド接続を、複数のバイアホール７４ｃを介して行う方式であると、該バイアホール７４ｃのインダクタンスが高周波特性に大きく影響するという問題があった。また、一般にプリント基板７０の熱伝導特性は良好ではないため、図示の如く筐体５０との間にバイアホール７４ｃが介在していても、高周波回路素子の放熱の点で不利であった。
【００１２】
本発明は上記従来技術の問題点に鑑みなされたもので、その目的とする所は、プリント基板及び筐体への実装が容易であると共に、良好な高周波特性が得られる高周波回路用パッケージ及びその実装構造を提供することにある。
【００１３】
【課題を解決するための手段】
上記の課題は例えば図１、図２の構成により解決される。即ち、図１において、この高周波回路用パッケージ１０Ａは、高周波回路素子１５を搭載するためのパッケージグランド基板１１の上面に前記高周波回路素子１５に接続される電極端子１４ａ，１４ｂを有する誘電体基板１２を備え、前記パッケージグランド基板１１の上面が前記誘電体基板１２よりも幅広に設けられている。
【００１４】
本発明では、パッケージグランド基板１１の上面が誘電体基板１２よりも幅広に設けられているため、この様な高周波回路用パッケージ１０Ａはプリント基板や筐体への実装が容易であると共に、パッケージグランド基板１１の上面とプリント基板背面の接地導体とを直接に接合可能となり、よって、良好な高周波特性が得られる。
【００１５】
図２において、更に本発明の実装構造は、上記高周波回路用パッケージ１０Ａにつき、前記誘電体基板１２の部分を可撓性プリント基板３０に設けた該誘電体基板と略同一サイズの開口部に嵌入し、前記パッケージグランド基板１１の上面と前記開口部３５の周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００１６】
本発明（２）によれば、パッケージグランド基板１１の上面とプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、幅広のパッケージグランド基板１１の背面を装置の筐体５０に直接接触させることが可能となり、高周波回路素子の十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１，プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。また、このような各部品の実装配置では、パッケージ電極端子１４ａ，１４ｂとプリント基板上面の導体線３２ａ，３２ｂとの間を短い距離で、かつ段差少なく接続可能であり、よって、不要なリアクタンス（インダクタンス）分を介することなく、高周波でも良好・安定に動作可能となる。
【００１７】
また上記の課題は例えば図４の構成により解決される。即ち、本発明（２）の高周波回路用パッケージ１０Ｂは、高周波回路素子１５を搭載するためのパッケージグランド基板１１の上面に設置される誘電体基板１２であって、その上面に高周波回路素子１５に接続するための信号用電極１４ａと、電源用電極１４ｂと、これらの電極の周囲を囲んで設けられたグランド電極１４ｃとを備え、該グランド電極１４ｃが複数のバイアホール１７ｃを介して前記パッケージグランド基板１１の上面に接合しており、前記誘電体基板１２の中央部に内部保護のための蓋体突起部を有するものである。
【００１８】
本発明（２）によれば、パッケージ誘電体基板１２の上面にその周囲を囲むように設けられたパッケージグランド電極１４ｃを備えるため、該グランド電極１４ｃの上面とプリント基板背面の接地導体とを直接に接合可能となり、よって、良好な高周波特性が得られる。また、高周波回路素子１５を直接支持可能なパッケージグランド基板１１を筐体上面に直接接触させることが可能であり，よって、十分な放熱効果が得られる。
【００１９】
好ましくは、例えば図４に示す如く、パッケージグランド基板１１は、金属基板、もしくは上面にメタライズ層１１ａを設けた誘電体基板からなるものである。パッケージグランド基板１１としては、高周波回路素子１５の確実なグランド接続と十分な放熱効果を得るために、好ましくは、金属板を使用する。但し、例えば図２に示す実装構造では、パッケージグランド基板１１の上側露出面がプリント基板３０背面の接地導体３３と直接に接合することになるため、高周波回路パッケージ１０Ａとプリント基板３０との間には一様かつ確実なグランド接続が得られる。このような場合には、アルミナ基板等の上面を銅等によりメタライズした基板をパッケージグランド基板１１としても良い。こうすれば、パッケージグランド基板１１を安価に構成できる。また、図４の場合でも、プリント基板３０背面の接地導体３３に直接接続する複数のグランド電極１４ｃが複数のバイアホール１７ｃを介してパッケージグランド基板１１の上面１１ａに接合するため、高周波回路パッケージ１０Ｂと、プリント基板背面の接地導体３３との間のグランド接続には支障が生じず、よって、この種の高周波回路装置を多様な態様で安価に構成できる。
【００２０】
また上記の課題は例えば図５の構成により解決される。即ち、本発明（３）の高周波回路用パッケージの実装構造は、上記本発明（２）の高周波回路用パッケージ１０Ｂにつき、少なくとも前記誘電体基板上面中央に接合されている蓋体突起部分（即ち、例えば図５の蓋体１３の部分）を可撓性プリント基板３０に設けた該蓋体突起部分と略同一サイズの開口部３５に嵌入し、前記誘電体基板１２上面のグランド電極１４ｃと、前記開口部３５周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００２１】
本発明（３）によれば、パッケージ誘電体基板１２上面のグランド電極１４ｃと、プリント基板開口部３５周辺におけるプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られ、よって良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、高周波回路素子を支持するためのパッケージグランド基板（金属基板あるいは上面をメタライズしたアルミナ基板）１１を装置の筐体５０に直接接触させることが可能となり、高周波回路素子の十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１，プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。
【００２２】
本発明（４）の高周波回路用パッケージの実装構造は、上記本発明（１）において、例えば図３に示す如く、パッケージ誘電体基板１２上面の電極端子１４ａ，１４ｂと、可撓性プリント基板３０上面の開口部３５付近で導体線用に舌状に切り込まれた部分３４ａ，３４ｂ上の該導体線の先端部とを、該先端部に設けたバイアホール３８を介して接合したものである。従って、別段の接続線３６やその接続工程を必要としないため、接続安定であると共に、製造容易である。
【００２３】
本発明（５）の高周波回路用パッケージの実装構造は、例えば図６に示す如く、高周波回路素子を搭載するためのパッケージグランド基板１１の上面に前記高周波回路素子に接続される電極端子を有する誘電体基板１２を備えた高周波回路用パッケージ１０Ｃにつき、そのパッケージグランド基板１１の部分を可撓性プリント基板３０に設けた前記誘電体基板と略同一サイズの開口部３５に嵌入し、前記パッケージグランド基板１１の周囲面と前記開口部３５周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００２４】
従って、上記図７に示した従来の高周波回路用パッケージ６０Ａと同様の形状を有するような通常の高周波回路用パッケージ１０Ｃについても、パッケージグランド基板１１の周囲面と、開口部３５周辺におけるプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。
【００２５】
【発明の実施の形態】
以下、添付図面に従って本発明に好適なる複数の実施の形態を詳細に説明する。なお 、全図を通して同一符号は同一又は相当部分を示すものとする。図１は第１の実施の形態による高周波回路用パッケージの構造を示す図で、パッケージグランド基板１１の上面がパッケージ誘電体基板１２よりも幅広に設けられている場合を示している。図１（Ａ）はその側面図、図１（Ｂ）は上面図、図１（Ｃ）は側断面図であり、図において、１０Ａは第１の実施の形態による高周波回路用パッケージ、１１は金属からなるグランド基板、１２はアルミナ等による誘電体基板、１３は内部の高周波回路素子を保護するための蓋体、１４ａは外部回路と接続すべく誘電体基板１２の上面に設けられた信号端子、１４ｂは同じく電源端子、１５はＭＭＩＣ等による高周波回路素子、１６は高周波回路素子と電極端子１４ａ , １４ｂ間を接続する接続線（リボン，ボンディングワイヤ等）である。
【００２６】
パッケージグランド基板１１の上に高周波回路素子１５を接着し、該素子１５と信号端子１４ａ及び電源端子１４ｂとの間を接続線１６により接続する。更に、これらを保護すべくパッケージ誘電体基板１２の上側に蓋体１３を接着し、全体として高周波回路パッケージとなすことが可能である。
【００２７】
本第１の実施の形態では、パッケージグランド基板１１の面積を誘電体基板１２の面積よりも広くすることにより、パッケージグランド基板１１の上面が誘電体基板１２の周囲に露出することとなり、この露出部分にプリント基板背面の接地導体を直接に接合（半田付け等）可能となっている。
【００２８】
パッケージグランド基板１１としては、高周波回路素子１５の確実なグランド接続と十分な放熱効果を得るために、好ましくは、金属板を使用する。但し、後述の本第１の実施の形態による実装構造では、パッケージグランド基板１１の上側露出面がプリント基板背面の接地導体３３と直接に接合することになるため、高周波回路用パッケージ１０Ａとプリント基板３０との間には一様かつ確実なグランド接続が得られる。このような場合には、アルミナ基板等の上面を銅等によりメタライズした基板をパッケージグランド基板１１としても良い。こうすれば、パッケージグランド基板１１を安価に構成できる。
【００２９】
図２は第１の実施の形態による高周波回路用パッケージの実装構造を示す図（１）で、上記図１の高周波回路用パッケージ１０Ａをフレキシブルなプリント基板３０に実装する場合を示している。図２（Ａ）は実装状態の側面図、図２（Ｂ）は上面図であり、図において、１０Ａは上記図１に示した高周波回路用パッケージ、１４ａは該パッケージの信号端子、１４ｂは同じく電源端子である。更に、３０は例えばストリップ線路による可撓性のプリント基板、３１はその誘電体基板｛テフロン（登録商標）系等｝、３２ａは誘電体基板上面の信号導体線、３２ｂは同じく電源導体線、３３は誘電体基板背面の接地導体、３５はプリント基板３０につきパッケージ誘電体基板１２の上面視形状に対応して設けた開口部、３６は接続線（リボン，ボンディングワイヤ等）、３７はパッケージグランド基板１１の上面とプリント基板３０背面の接地導体３３との間のグランド接触面、４０はプリント基板押え、５０は電子回路装置の筐体である。
【００３０】
高周波回路用パッケージ１０Ａの蓋体１３とパッケージ誘電体基板１２の部分をプリント基板３０の背面より開口部３５に嵌入すると共に、プリント基板背面の接地導体３３をパッケージグランド基板１１の上側露出面に接触させてグランド接触面３７となし、これらの間を半田付け等により接着・固定する。更に、パッケージの信号端子１４ａ及び電源端子１４ｂとプリント基板上面の信号導体線３２ａ及び電源導体線３２ｂとの間をそれぞれ接続線３６により接続し、こうしてプリント回路基板アセンブリを形成する。
【００３１】
更に、このアセンブリにつき、パッケージグランド基板１１の背面及びプリント基板背面の接地導体３３の各部分をそれぞれ筐体５０の上面に接触させて、固定する。その際には、フレキシブルなプリント基板３０背面の接地導体３３がパッケージグランド基板１１の周囲のできるだけ近くで筐体５０に密着するように、高周波回路用パッケージ１０Ａ周囲のプリント基板３０の部分をプリント基板押え４０により筐体５０に押し付け、ネジ等により固定する。
【００３２】
なお、本第１の実施の形態においても、高周波回路用パッケージ１０Ａの一部を沈めるための窪み加工部を筐体５０の表面に設けることが可能であり、こうすれば、可撓性プリント基板３０の撓み量を十分に小さくできる。この場合には、上記のようにプリント基板押え４０を用いないで、プリント基板３０を筐体５０にネジ止めするだけでも良い。
【００３３】
本第１の実施の形態によれば、パッケージグランド基板１１の上面とプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、幅広のパッケージグランド基板１１の背面を装置の筐体５０に直接接触させることが可能となり、高周波回路素子１５に十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１、プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。また、このような各部品の実装配置では、パッケージ電極端子１４ａ，１４ｂとプリント基板上面の導体線３２ａ，３２ｂとの間を短い距離で、かつ段差少なく接続可能であり、よって、不要なリアクタンス（インダクタンス）分を介することなく、高周波でも良好・安定に動作可能となる。
【００３４】
図３は第１の実施の形態による高周波回路用パッケージの実装構造を示す図（２）で、高周波回路用パッケージ１０Ａの信号端子１４ａ及び電源端子１４ｂと、プリント基板３０の信号導体線３２ａ及び電源導体線３２ｂとを、別段の接続線３６を介することなく、直接的に接続可能な場合を示している。図３（Ａ）は実装状態の側面図、図３（Ｂ）は上面図であり、図において、３４ａはプリント基板３０の開口部３５付近で可撓性誘電体基板３１が信号導体線３２ａ用に舌状に切り込まれた信号導体用舌状部、３４ｂは同じく電源導体線３２ｂ用に舌状に切り込まれた電源導体用舌状部、３８は信号導体用舌状部３４ａや電源導体用舌状部３４ｂの上面にある信号導体線３２ａや電源導体線３２ｂの各先端部に設けられたバイアホール（スルホールとも呼ばれる）である。 図３（Ｂ）の挿入図（ａ），（ｂ）に信号導体用舌状部３４ａと電源導体用舌状部３４ｂの部分拡大図を示す。
【００３５】
プリント基板３０のうちの信号導体用舌状部３４ａの背面には接地導体３３が設けられておらず、よって、この部分をパッケージ信号端子１４ａの上面に展開（延展）させて半田付け等により直接的に接続可能である。これにより、プリント基板３０上面の信号導体線３２ａとパッケージ信号端子１４ａとが基板先端部のバイアホール３８を介して接続される。電源導体用舌状部３４ｂとパッケージ電源端子１４ｂとの間の接続についても同様である。それ以外の部分の実装構造については上記図２で述べたものと同様で良い。本実装構造によれば、別途に接続線３６による接続を必要としない簡単な構成であるため、信号線接続及び電源線接続の信頼性が高いと共に、高周波特性が改善される。また製造コストを低減できる。
【００３６】
図４は第２の実施の形態による高周波回路用パッケージの構造を示す図で、パッケージ信号端子１４ａ及び電源端子１４ｂの周囲の同一面上にパッケージグランド電極１４ｃを備える場合を示している。図４（Ａ）はその側面図、図４（Ｂ）は上面図、図４（Ｃ）は側断面図であり、図において、１０Ｂは第２の実施の形態による高周波回路用パッケージ、１１はそのグランド基板、１１ａは該グランド基板上面のメタライズ層、１２はパッケージ誘電体基板、１３は蓋体、１４ａは誘電体基板１２の上面に設けた信号端子、１４ｂは同じく電源端子、１４ｃは同じくグランド電極、１７ｃは該グランド電極１４ｃから誘電体基板１２の背面に貫通するバイアホール（スルーホール）、１５はＭＭＩＣ等による高周波回路素子、１６は接続線（リボン，ボンディングワイヤ等）である。
【００３７】
メタライズ層１１ａの上に高周波回路素子１５を接着し、その周囲を、パッケージ中央部に開口部を有するようなパッケージ誘電体基板１２により囲む。高周波回路素子１５への信号及び電源の接続はパッケージ誘電体基板１２上面の信号端子１４ａ及び電源端子１４ｂを介してそれぞれに接続線１６により行うと共に、これらを保護すべく上部に蓋体１３を接着し、全体として高周波回路パッケージとなすことが可能である。
【００３８】
パッケージ誘電体基板１２の上面には信号端子１４ａ、電源端子１４ｂ、及びこれらを取り囲む形でグランド電極１４ｃが同一面上に設けられている。更に、このグランド電極１４ｃには多数のバイアホール１７ｃが設けられており、グランド電極１４ｃと誘電体基板１２の背面に接触(接合）するメタライズ層１１ａとの間が多数のバイアホール１７ｃを介して電気的に接続される。なお、パッケージグランド基板１１が金属板で構成されていても良いことは言うまでもない。
【００３９】
図５は第２の実施の形態による高周波回路用パッケージの実装構造を示す図で、上記図４の高周波回路用パッケージ１０Ｂをフレキシブルなプリント基板３０に実装する場合を示している。図５（Ａ）は実装状態の側面図、図５（Ｂ）は上面図であり、図において、３５はプリント基板３０につき蓋体１３の上面視形状に対応して設けられた開口部、３２ａは開口部３５の端面にまで展開する信号導体線、３２ｂは同じく電源導体線、３８ａは開口部端面にまで展開する信号導体線３２ａの先端部に設けられたバイアホール、３８ｂは同じく電源導体線３２ｂの先端部に設けられたバイアホールである。
【００４０】
なお、この例のプリント基板裏面の接地導体３３においては、その内側開口部３５ｃがパッケージグランド電極１４ｃの上面視開口面全面と接合するが他のパッケージ端子１４ａ及び１４ｂとは接触しないように設けられている。これに対して、プリント基板表面の信号導体線３２ａおよび電源導体線３２ｂはそれぞれパッケージ信号端子１４ａ及び電源端子１４ｂの真上まで延びている。
【００４１】
プリント基板３０の開口部３５に高周波回路用パッケージ１０Ｂの蓋体１３の部分を裏面から挿入し、パッケージ誘電体基板１２の上面のグランド電極１４ｃをプリント基板裏面の接地導体３３に半田付け等により接着・固定する。また、図５（Ｂ）に示す如く、信号端子１４ａへの信号の接続は信号導線３２ａの先端部に設けられたバイアホール３８ａを介して行い、また電源端子１４ｂへの電源の接続は電源導体線３２ｂの先端部に設けられたバイアホール３８ｂを介して行う。こうして得られたプリント基板アセンブリの筐体５０への取り付けに際しては、上記同様の目的でプリント基板押え４０が使用される。なお、上記バイアホール３８ａ，３８ｂを介する接続に代えて、別途に接続線３６を使用しても良いことは言うまでもない。
【００４２】
図６は第３の実施の形態による高周波回路用パッケージの実装構造を示す図で、従来型の高周波回路用パッケージの実装に関して特徴を有する構成を示している。図において、１０Ｃは高周波回路用パッケージであり、該パッケージ１０Ｃのグランド基板１１と誘電体基板１２とは通常同一の面積となっている。また３５はプリント基板３０につきパッケージ誘電体基板１２の上面視形状に対応して設けられた開口部である。
【００４３】
高周波回路用パッケージ１０Ｃの全体をプリント基板３０の背面より開口部３５に嵌入すると共に、プリント基板３０背面の接地導体３３をパッケージグランド基板１１の周囲側面に接触させてこれらの間を半田付け３９等により接着・固定する。更に、パッケージ誘電体基板１２上面の信号端子１４ａ及び電源端子１４ｂとプリント基板上面の信号導体線３２ａ及び電源導体線３２ｂとの間をそれぞれ接続線３６により接続し、こうしてプリント回路基板アセンブリを形成する。
【００４４】
更に、このアセンブリのパッケージグランド基板１１及びプリント基板背面の接地導体３３の各部分を筐体５０の上面に接触させて、固定する。その際には、可撓性プリント基板背面の接地導体３３がパッケージグランド基板１１周囲のできるだけ近くで筐体５０に密着するように、パッケージグランド基板１１周囲のプリント基板３０の部分をプリント基板押え４０により筐体５０に押し付け、ネジ等により固定する。
【００４５】
その際には、高周波回路用パッケージ１０Ｃの裏面及び周辺でプリント基板３０と筐体５０との間にある隙間を埋めるようにシリコングリース等による熱伝導剤４１を充填することが可能である。この例のパッケージグランド基板１１はプリント基板背面の接地導体３３に密着固定されているため、パッケージグランド基板１１と筐体５０の間は必ずしも電気的接続がなくてもよく、よってパッケージグランド基板１１と筐体５０との間、更には前述のような高周波回路用パッケージ１０Ｃの近傍のプリント基板３０と筐体５０との間の空間に熱伝導剤４１を充填することにより高周波回路素子からの発熱を効率よく放熱できる。
【００４６】
なお、この熱伝導剤４１の使用は、上記第１，第２の実施の形態による実装構造における各部位の放熱にも適用可能であることは言うまでもない。
【００４７】
また、上記各実施の形態では筐体５０にパッケージグランド基板１１の部分を嵌入可能な窪み加工部を設けない場合を示したが、これに限らない。筐体５０に窪み加工部を設け、ここに高周波回路用パッケージ１０の一部を沈めれば、可撓性プリント基板３０の曲がりを少なくできることは明らかであり、こうすれば、更なる高周波特性の改善が図れる。
【００４８】
また、上記各実施の形態では高周波回路素子１５を備える形の各種高周波回路用パッケージを示したが、これに限らない。本発明は高周波回路素子を備えない形の高周波回路用パッケージとして実現（提供）できることは言うまでもない。また、上記本発明に好適なる複数の実施の形態を述べたが、本発明思想を逸脱しない範囲内で各部の構成及び組合せの様々な変更が行えることは言うまでも無い。
【００４９】
【発明の効果】
以上述べた如く本発明によれば、高周波回路用パッケージのプリント基板及び筐体への実装が容易であると共に、例えば２０ＧＨｚを越えるような超高周波に対しても良好な電気的特性が得られる。
【図面の簡単な説明】
【図１】第１の実施の形態による高周波回路用パッケージの構造を示す図である。
【図２】第１の実施の形態による高周波回路用パッケージの実装構造を示す図（１）である。
【図３】第１の実施の形態による高周波回路用パッケージの実装構造を示す図（２）である。
【図４】第２の実施の形態による高周波回路用パッケージの構造を示す図である。
【図５】第２の実施の形態による高周波回路用パッケージの実装構造を示す図である。
【図６】第３の実施の形態による高周波回路用パッケージの実装構造を示す図である。
【図７】従来技術を説明する図（１）である。
【図８】従来技術を説明する図（２）である。
【符号の説明】
１０ 高周波回路用パッケージ
１１ パッケージグランド基板
１２ パッケージ誘電体基板
１３ 蓋体
１４ パッケージ端子
１５ 高周波回路素子
１６ 接続線
１７ｃ バイアホール
３０ プリント基板
３１ 誘電体基板
３２ａ 信号導体線
３２ｂ 電源導体線
３３ 接地導体
３４ａ 信号導体用舌状部
３４ｂ 電源導体用舌状部
３５ 開口部
３６ 接続線
３７ グランド接触面
３８ バイアホール
３９ 半田付け部
４０ プリント基板押え
４１ 熱伝導剤
５０ 筐体[0001]
BACKGROUND OF THE INVENTION
The present invention is a high frequency circuit.forFor more details on the package and its mounting structure, please refer to MMIC (Microwave Monorithic Integrated Circuit) for high frequency.To implementHigh frequency circuitforThe present invention relates to the structure of a package and its mounting structure on a printed circuit board.
[0002]
High frequency circuitforAn important point in the package mounting structure is the connection of ground lines and signal lines, especially high-frequency circuits.forIt is desirable that the ground electrode of the package has a close integration with the ground conductor on the back surface of the printed circuit board and the housing ground both electrically and thermally.
[0003]
[Prior art]
FIG. 7 shows a conventional high-frequency circuitforIt is a figure which shows one mounting example of a package. In the figure, 60A is MMIC etc.To implementHigh frequency circuitforPackage, 61 is a package ground substrate made of metal, 62 is a package dielectric substrate, 63 is a lid for protecting the high-frequency circuit element, 64 is an electrode terminal for connecting a signal line and a power line, and 66 is a connection line (Ribbons, bonding wires, etc.), 70 is a printed circuit board using strip lines, 71 is a dielectric board made of alumina, 72 is a signal conductor wire on the top surface of the dielectric board, 73 is a ground conductor on the back surface of the dielectric board, and 74 is a printed circuit board. 70Provided inPackage ground substrate 61InCorrespondencedidAn opening, 50 is a housing of the electronic circuit device, and 51 is a recess processing portion thereof.
[0004]
High frequency circuitforAn opening 74 is provided in the printed circuit board 70 in accordance with the outline of the package 60A in plan view, the package ground board 61 and the ground conductor 73 on the back surface of the printed circuit board are fixed in contact with the common housing 50, and the printed circuit board. Necessary electrical connections are made to the package electrode terminals 64 on the upper surface side of 70. In this case, if the step between the package electrode terminal 64 and the upper surface of the printed circuit board 70 is large, the inductance component increases due to the bending of the connection line 66 and the electrical characteristics are deteriorated. Therefore, the hollow processing part 51 is given to the housing | casing 50. FIG.
[0005]
FIG. 8 shows a conventional high-frequency circuit.forPackageTheThe figure which shows the other mounting example of the surface mount type high frequency circuitforAn example of packaging is shown. FIG. 8A shows a high frequency circuit.forFIG. 8 (B) is a side view of an example of mounting on a printed circuit board, and FIG. 8 (C) is also a bottom view (perspective view seen from the back of the printed circuit board). In FIG. Mounting type high frequency circuitforA package, 63 is a lid on the top of the package, 64a is a signal terminal provided on the bottom of the package for connection to an external circuit, 64b is also a power supply terminal, 64c is also a ground electrode, 70 is a printed circuit board by stripline, and 71 is its A dielectric substrate, 72a is a signal conductor line on the top surface of the printed circuit board, 72b is also a power source conductor line, 72c is also a ground electrode, 73 is a ground conductor on the back surface of the printed circuit board, and 74c is a ground electrode 72c on the top surface of the printed circuit board. A plurality of via holes 50 for connecting between the electronic circuit device 73 and the housing of the electronic circuit device.
[0006]
8B and 8C, the high frequency circuitforThe package 60B is placed on the upper side of the printed circuit board 70, its signal terminal 64a is connected to the signal conductor line 72a on the upper surface of the board, the power supply terminal 64b is also connected to the power supply conductor line 72b, and the central ground electrode 64c is also connected to the ground electrode 72c. Are connected by soldering or the like. In that case, in order to bring the package ground electrode 64c closer to the earth potential more reliably, a number of via holes (also referred to as via holes) 74c are provided between the ground electrode 72c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface. Yes.
[0007]
Although not shown, conventionally, the surface mounting component (8) mounted on the surface mounting component mounting board (2) is inserted into the opening (4) provided in the printed circuit board (14).Printed circuit board (14) and surface mount component mounting board (2);2. Description of the Related Art A surface mounting component mounting structure is known (for example, Patent Document 1).
[0008]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-126032 (summary, figure).
[0009]
[Problems to be solved by the invention]
However, as shown in FIG. 7, if the signal conductor line 72 once cut at the printed circuit board opening 74 and the package electrode terminal 64 are connected by the connection line 66, Since the uniform relationship between the signal conductor line 72 on the printed circuit board surface and the ground conductor 73 on the back surface (that is, the cross-sectional shape, dimensions, dielectric constant, etc. as a strip line) is not maintained, the high-frequency characteristics of the line ( Characteristic impedance, transmission line wavelength, attenuation, etc.)ThatThere was a problem.
[0010]
Further, as described above, when the ground connection between the package ground substrate 61 and the ground conductor 73 on the back surface of the printed circuit board is performed through contact with the common housing 50, the housing 50 and the package ground are connected. A slight gap such as that existing between the substrate 61 or the printed circuit board ground conductor 73 not only greatly affects the high-frequency characteristics of the circuit, but in order to prevent this, the high-frequency circuitforBoth the package 60A and the printed circuit board 70 must be screwed or conductively bonded to the housing 50, which has been a factor in increasing costs.
[0011]
Further, as shown in FIG. 8, when the ground connection between the package ground electrode 64c and the ground conductor 73 on the back surface of the printed board is performed via a plurality of via holes 74c, the inductance of the via hole 74c is reduced. Significantly affects high frequency characteristicsThatThere was a problem. In general, the heat conduction characteristics of the printed circuit board 70 are not good, and even if the via hole 74c is interposed between the printed circuit board 70 and the housing 50 as shown in the drawing, it is disadvantageous in terms of heat dissipation of the high-frequency circuit element.
[0012]
The present invention has been made in view of the above-mentioned problems of the prior art, and the object of the present invention is a high-frequency circuit that can be easily mounted on a printed circuit board and a casing, and can provide good high-frequency characteristics.forIt is to provide a package and its mounting structure.
[0013]
[Means for Solving the Problems]
  The above problem is illustrated in FIG., FIG.This is solved by the configuration. That is,In FIG.The high frequency circuit package 10A includes a dielectric substrate 12 having electrode terminals 14a and 14b connected to the high frequency circuit element 15 on an upper surface of a package ground substrate 11 on which the high frequency circuit element 15 is mounted, and the package ground substrate. 11 is wider than the dielectric substrate 12.
[0014]
  The present inventionThenSince the upper surface of the package ground substrate 11 is wider than the dielectric substrate 12, such a high-frequency circuit package 10A can be easily mounted on a printed circuit board or a housing, and the package ground substrate 11 It is possible to directly join the upper surface and the ground conductor on the back surface of the printed circuit board, thereby obtaining good high frequency characteristics.
[0015]
  In FIG.The mounting structure isthe aboveIn the high-frequency circuit package 10A, the dielectric substrate 12 is inserted into an opening having substantially the same size as that of the dielectric substrate provided on the flexible printed circuit board 30, and the upper surface of the package ground substrate 11 and the opening A grounding conductor 33 on the back surface of the printed circuit board 35 is joined (soldered, conductively bonded, etc.).
[0016]
According to the present invention (2), the structure in which the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board are directly joined allows uniform, stable and reliable ground connection between them. Therefore, good high frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board assembly when assembling this type of high-frequency circuit device. Furthermore, the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the apparatus, and a sufficient heat dissipation effect of the high-frequency circuit element can be obtained. Further, the ground conductor 33 on the back surface of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground circuit board 11, so that the package ground circuit board 11, the printed circuit board 30 and the housing body can be contacted. A high-frequency potential difference is unlikely to occur between the bodies 50. Further, in such mounting arrangement of each component, it is possible to connect the package electrode terminals 14a and 14b and the conductor wires 32a and 32b on the upper surface of the printed circuit board at a short distance and with few steps, and therefore, an unnecessary reactance ( It is possible to operate stably and stably even at high frequencies without going through the (inductance) component.
[0017]
  The above problem is solved by the configuration of FIG. 4, for example. That is, the present invention (2The high-frequency circuit package 10 </ b> B is a dielectric substrate 12 installed on the upper surface of the package ground substrate 11 for mounting the high-frequency circuit element 15. The high-frequency circuit package 10 </ b> B is for signal connection to the high-frequency circuit element 15 on the upper surface. Electrode 14a, power supply electrode 14b, and surroundings of these electrodesAroundA ground electrode 14c provided on the upper surface of the package ground substrate 11 through a plurality of via holes 17c, and a central portion of the dielectric substrate 12 for internal protection. It has a lid protrusion.
[0018]
  The present invention (2) On the upper surface of the package dielectric substrate 12.It was provided to surround itSince the package ground electrode 14c is provided, the upper surface of the ground electrode 14c and the ground conductor on the back surface of the printed circuit board can be directly joined, thereby obtaining good high-frequency characteristics. In addition, the package ground substrate 11 that can directly support the high-frequency circuit element 15 can be brought into direct contact with the upper surface of the housing, so that a sufficient heat dissipation effect can be obtained.
[0019]
  Preferably,For example, as shown in FIG. 4, the package ground substrate 11 is made of a metal substrate or a dielectric substrate having a metallized layer 11a on the upper surface. As the package ground substrate 11, a metal plate is preferably used in order to obtain a reliable ground connection of the high-frequency circuit element 15 and a sufficient heat dissipation effect. However, in the mounting structure shown in FIG. 2, for example, the upper exposed surface of the package ground substrate 11 is directly bonded to the ground conductor 33 on the back surface of the printed circuit board 30, and therefore, between the high frequency circuit package 10 </ b> A and the printed circuit board 30. Provides a uniform and reliable ground connection. In such a case, a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11. In this way, the package ground substrate 11 can be configured at low cost. Also in the case of FIG. 4, since the plurality of ground electrodes 14c directly connected to the ground conductor 33 on the back surface of the printed circuit board 30 are joined to the upper surface 11a of the package ground substrate 11 through the plurality of via holes 17c, the high-frequency circuit package 10B And a ground connection between the printed circuit board and the ground conductor 33 are not hindered. Therefore, this type of high-frequency circuit device can be configured in various manners at low cost.
[0020]
  Further, the above problem is solved by the configuration of FIG. That is, the present invention (3The mounting structure of the high-frequency circuit package of the above-described invention (2) Of the high-frequency circuit package 10 </ b> B, the lid is provided with a lid protrusion (that is, for example, the lid 13 of FIG. 5) on the flexible printed board 30. It fits into the opening 35 having the same size as the body protrusion, and joins the ground electrode 14c on the top surface of the dielectric substrate 12 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 (soldering, conductive bonding, etc.) ).
[0021]
  The present invention (3), The ground electrode 14c on the top surface of the package dielectric substrate 12 and the ground conductor 33 on the back surface of the printed circuit board in the periphery of the printed circuit board opening 35 are directly joined to each other. In addition, a reliable ground connection can be obtained, and thus good high frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board assembly when assembling this type of high-frequency circuit device. Furthermore, a package ground substrate (a metal substrate or an alumina substrate having a metallized upper surface) 11 for supporting the high-frequency circuit element can be brought into direct contact with the housing 50 of the apparatus, and a sufficient heat dissipation effect of the high-frequency circuit element can be obtained. can get. Further, the ground conductor 33 on the back surface of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground circuit board 11, so that the package ground circuit board 11, the printed circuit board 30 and the housing body can be contacted. A high-frequency potential difference is unlikely to occur between the bodies 50.
[0022]
  The present invention (4The mounting structure of the high-frequency circuit package of the above-described invention (13), for example, as shown in FIG. 3, the electrode terminals 14a and 14b on the upper surface of the package dielectric substrate 12 and the portion 34a cut into a tongue shape for the conductor wire in the vicinity of the opening 35 on the upper surface of the flexible printed circuit board 30. , 34b are joined to the tip end portions of the conductor wires via via holes 38 provided at the tip end portions. Therefore, since a separate connection line 36 and its connection process are not required, the connection is stable and the manufacturing is easy.
[0023]
  The present invention (56), for example, as shown in FIG. 6, a dielectric substrate 12 having electrode terminals connected to the high-frequency circuit element is provided on the upper surface of a package ground substrate 11 for mounting the high-frequency circuit element. In the high-frequency circuit package 10 </ b> C provided, the portion of the package ground substrate 11 is fitted into the opening 35 having the same size as the dielectric substrate provided on the flexible printed circuit board 30, and the peripheral surface of the package ground substrate 11 is And a ground conductor 33 on the back surface of the printed circuit board around the opening 35 (soldering, conductive bonding, etc.).
[0024]
Therefore, the conventional high frequency circuit shown in FIG.forOrdinary high-frequency circuit having the same shape as the package 60AforThe package 10C also has a configuration in which the peripheral surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are directly bonded, so that a uniform, stable and reliable ground connection is provided between them. Therefore, good high frequency characteristics can be obtained.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a plurality of preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that the same reference numerals denote the same or corresponding parts throughout the drawings. FIG. 1 shows a high-frequency circuit according to the first embodiment.forFIG. 6 is a diagram showing a package structure, and shows a case where the upper surface of the package ground substrate 11 is provided wider than the package dielectric substrate 12. 1A is a side view thereof, FIG. 1B is a top view thereof, and FIG. 1C is a side sectional view thereof. In FIG. 1A, reference numeral 10A denotes a high-frequency circuit according to the first embodiment.forPackage, 11 is a ground substrate made of metal, 12 is a dielectric substrate made of alumina or the like, 13 is a lid for protecting internal high-frequency circuit elements, and 14a is provided on the upper surface of the dielectric substrate 12 to be connected to an external circuit. 14b is a power supply terminal, 15 is a high-frequency circuit element such as an MMIC, and 16 is a high-frequency circuit element and an electrode terminal.14a , 14bIt is a connection line (ribbon, bonding wire, etc.) that connects between the two.
[0026]
A high frequency circuit element 15 is bonded on the package ground substrate 11, and the element 15 is connected to the signal terminal 14 a and the power supply terminal 14 b by a connection line 16. Further, a lid 13 is bonded to the upper side of the package dielectric substrate 12 in order to protect them, and the high frequency circuit package as a whole.Can be.
[0027]
In the first embodiment, by making the area of the package ground substrate 11 larger than the area of the dielectric substrate 12, the upper surface of the package ground substrate 11 is exposed around the dielectric substrate 12, and this exposure is performed. The ground conductor on the back of the printed circuit board can be directly joined (soldered) to the portion.
[0028]
As the package ground substrate 11, a metal plate is preferably used in order to obtain a reliable ground connection of the high-frequency circuit element 15 and a sufficient heat dissipation effect. However, in the mounting structure according to the first embodiment, which will be described later, the upper exposed surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the back surface of the printed circuit board.forA uniform and reliable ground connection is obtained between the package 10A and the printed circuit board 30. In such a case, a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11. In this way, the package ground substrate 11 can be configured at low cost.
[0029]
FIG. 2 shows a high frequency circuit according to the first embodiment.forFIG. 1A shows a package mounting structure, and the high frequency circuit of FIG.forThe case where the package 10A is mounted on the flexible printed circuit board 30 is shown. 2A is a side view of the mounted state, FIG. 2B is a top view, and in FIG. 2A, 10A is the high-frequency circuit shown in FIG.forA package 14a is a signal terminal of the package, and 14b is a power supply terminal. Further, 30 is a flexible printed circuit board using, for example, a strip line, 31 is a dielectric substrate thereof (Teflon (registered trademark), etc.), 32a is a signal conductor wire on the top surface of the dielectric substrate, 32b is a power supply conductor wire, 33 Is a grounding conductor on the back surface of the dielectric substrate, and 35 is a top view shape of the package dielectric substrate 12 per printed circuit board 30.InCorrespondencedo itThe provided opening, 36 is a connection line (ribbon, bonding wire, etc.), 37 is a ground contact surface between the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board 30, 40 is a printed circuit board retainer, and 50 is It is a housing of an electronic circuit device.
[0030]
High frequency circuitforThe lid body 13 and the package dielectric substrate 12 of the package 10A are inserted into the opening 35 from the back surface of the printed circuit board 30, and the ground conductor 33 on the back surface of the printed circuit board is brought into contact with the upper exposed surface of the package ground substrate 11 to ground. There is no contact surface 37, and these are bonded and fixed by soldering or the like. Further, the signal terminals 14a and power supply terminals 14b of the package and the signal conductor lines 32a and power supply conductor lines 32b on the upper surface of the printed circuit board are respectively connected by connection lines 36, thus forming a printed circuit board assembly.
[0031]
Further, with respect to this assembly, each part of the ground conductor 33 on the back surface of the package ground substrate 11 and the back surface of the printed circuit board is brought into contact with the upper surface of the housing 50 and fixed. At that time, the high-frequency circuit is arranged so that the ground conductor 33 on the back surface of the flexible printed board 30 is in close contact with the casing 50 as close as possible to the periphery of the package ground board 11.forThe portion of the printed circuit board 30 around the package 10A is pressed against the housing 50 by the printed circuit board retainer 40 and fixed by screws or the like.
[0032]
In the first embodiment, the high frequency circuit is also used.forA recessed portion for sinking a part of the package 10 </ b> A can be provided on the surface of the housing 50, so that the amount of bending of the flexible printed board 30 can be sufficiently reduced. In this case, the printed circuit board 30 may be simply screwed to the housing 50 without using the printed circuit board retainer 40 as described above.
[0033]
According to the first embodiment, the structure in which the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board are directly joined together provides a uniform, stable and reliable ground connection therebetween. Therefore, good high frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board assembly when assembling this type of high-frequency circuit device. Furthermore, the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the apparatus, and a sufficient heat dissipation effect can be obtained for the high-frequency circuit element 15. In addition, the ground conductor 33 on the back surface of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground circuit board 11, so that the package ground circuit board 11, the printed circuit board 30, and the housing can be attached. A high-frequency potential difference is unlikely to occur between the bodies 50. Further, in such mounting arrangement of each component, it is possible to connect the package electrode terminals 14a and 14b and the conductor wires 32a and 32b on the upper surface of the printed circuit board at a short distance and with few steps, and therefore, an unnecessary reactance ( It is possible to operate stably and stably even at high frequencies without going through the (inductance) component.
[0034]
FIG. 3 shows a high frequency circuit according to the first embodiment.forFigure 2 shows the package mounting structure.forPackage 10ASignal terminal 14a and power supply terminal 14bAnd the printed circuit board 30Signal conductor line 32a and power supply conductor line 32bAre shown as being directly connectable without using a separate connection line 36. 3A is a side view of the mounted state, and FIG. 3B is a top view. In FIG. 3A, 34a is the vicinity of the opening 35 of the printed circuit board 30, and the flexible dielectric substrate 31 is used for the signal conductor line 32a. The signal conductor tongue 34b is cut into a tongue-like shape, and the power conductor tongue 34b is also cut into a tongue for the power supply conductor line 32b.Signal conductor tongue 34a and power conductor tongue 34bOn the top ofSignal conductor line 32a and power supply conductor line 32bVia holes (also referred to as through-holes) provided at the respective tip portions of the. Insets (a) and (b) of FIG.Signal conductor tongue 34a and power conductor tongue 34bThe partial enlarged view of is shown.
[0035]
The ground conductor 33 is not provided on the back surface of the signal conductor tongue 34a of the printed circuit board 30. Therefore, this portion is developed (extended) on the upper surface of the package signal terminal 14a and directly soldered or the like. Can be connected. Thereby, the signal conductor line 32a on the upper surface of the printed circuit board 30 and the package signal terminal 14a are connected via the via hole 38 at the front end of the circuit board. The same applies to the connection between the power supply conductor tongue 34b and the package power supply terminal 14b. The other part of the mounting structure may be the same as that described in FIG. According to this mounting structure, since it is a simple configuration that does not require connection by the connection line 36 separately,Signal line connection and power line connectionHigh reliability and high frequency characteristics are improved. Further, the manufacturing cost can be reduced.
[0036]
FIG. 4 shows a high-frequency circuit according to the second embodiment.forThe diagram showing the structure of the packageSignal terminal 14a and power supply terminal 14bThe case where the package ground electrode 14c is provided on the same surface around is shown. 4A is a side view, FIG. 4B is a top view, and FIG. 4C is a side sectional view. In the figure, 10B is a high-frequency circuit according to the second embodiment.for11 is a metallized layer on the top surface of the ground substrate, 12 is a package dielectric substrate, 13 is a lid, 14a is a signal terminal provided on the top surface of the dielectric substrate 12, 14b is a power supply terminal, 14c is also a ground electrode, 17c is a via hole (through hole) penetrating from the ground electrode 14c to the back surface of the dielectric substrate 12, 15 is a high frequency circuit element such as MMIC, and 16 is a connection line (ribbon, bonding wire, etc.). is there.
[0037]
A high-frequency circuit element 15 is bonded on the metallized layer 11a, and the periphery thereof is surrounded by a package dielectric substrate 12 having an opening at the center of the package. The signal and the power source are connected to the high frequency circuit element 15 through the connection line 16 via the signal terminal 14a and the power source terminal 14b on the upper surface of the package dielectric substrate 12, and the lid 13 is bonded to the upper portion to protect them. And high frequency circuit package as a wholeCan be.
[0038]
On the upper surface of the package dielectric substrate 12, a signal terminal 14a, a power supply terminal 14b, and a ground electrode 14c are provided on the same surface so as to surround them. Further, the ground electrode 14c is provided with a large number of via holes 17c, and the gap between the ground electrode 14c and the metallized layer 11a that contacts (joins) the back surface of the dielectric substrate 12 via the large number of via holes 17c. Electrically connected. Needless to say, the package ground substrate 11 may be made of a metal plate.
[0039]
FIG. 5 shows a high frequency circuit according to the second embodiment.for4 is a diagram showing a package mounting structure, and the high-frequency circuit of FIG.forThe case where the package 10B is mounted on the flexible printed circuit board 30 is shown. 5A is a side view of the mounted state, FIG. 5B is a top view, and in FIG. 5, 35 is a top view shape of the lid 13 per printed circuit board 30.InCorrespondencedo itThe provided opening, 32a is a signal conductor line that extends to the end face of the opening 35, 32b is also a power supply conductor line, and 38a is a via hole provided at the tip of the signal conductor line 32a that extends to the end face of the opening. , 38b are via holes provided at the tip of the power supply conductor line 32b.
[0040]
The ground conductor 33 on the back surface of the printed circuit board in this exampleInThe inner opening 35c is an opening in the top view of the package ground electrode 14c.Bonds to the entire surface but does not contact other package terminals 14a and 14bIt is provided as follows. In contrast, printed circuit boardssurfaceThe signal conductor line 32a and the power supply conductor line 32b extend up to just above the package signal terminal 14a and the power supply terminal 14b, respectively.
[0041]
A high frequency circuit is provided in the opening 35 of the printed circuit board 30.forThe lid 13 portion of the package 10B is inserted from the back surface, and the ground electrode 14c on the top surface of the package dielectric substrate 12 is bonded and fixed to the ground conductor 33 on the back surface of the printed circuit board by soldering or the like. Further, as shown in FIG. 5B, the signal is connected to the signal terminal 14a through a via hole 38a provided at the tip of the signal conducting wire 32a, and the power supply to the power supply terminal 14b is connected to the power supply conductor. This is done through a via hole 38b provided at the tip of the line 32b. When the printed circuit board assembly thus obtained is attached to the housing 50, the printed circuit board retainer 40 is used for the same purpose as described above. Needless to say, instead of the connection via the via holes 38a and 38b, a connection line 36 may be used separately.
[0042]
FIG. 6 shows a high-frequency circuit according to the third embodiment.forFigure showing the package mounting structure, a conventional high-frequency circuitforThe structure which has the characteristic regarding mounting of a package is shown. In the figure, 10C is a high frequency circuitforThis is a package, and the ground substrate 11 and the dielectric substrate 12 of the package 10C usually have the same area. 35 is a package per printed circuit board 30.DielectricBoard 12Top view shapeInCorrespondencedo itIt is the provided opening.
[0043]
High frequency circuitforThe entire package 10C is fitted into the opening 35 from the back surface of the printed circuit board 30, and the ground conductor 33 on the back surface of the printed circuit board 30 is brought into contact with the peripheral side surface of the package ground substrate 11, and the space between them is bonded by soldering 39 or the like Fix it. Further, the signal terminals 14a and power supply terminals 14b on the upper surface of the package dielectric substrate 12 and the signal conductor lines 32a and power supply conductors 32b on the upper surface of the printed circuit board are respectively connected by connection lines 36, thereby forming a printed circuit board assembly. .
[0044]
Further, the respective parts of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board of the assembly are brought into contact with the upper surface of the housing 50 and fixed. At that time, the portion of the printed circuit board 30 around the package ground substrate 11 is placed on the printed circuit board retainer 40 so that the ground conductor 33 on the back surface of the flexible printed circuit board is in close contact with the housing 50 as close as possible around the package ground substrate 11. Is pressed against the housing 50 and fixed with screws or the like.
[0045]
In that case, high-frequency circuitforIt is possible to fill the thermal conductive agent 41 with silicon grease or the like so as to fill a gap between the printed board 30 and the casing 50 on the back surface and the periphery of the package 10C. Since the package ground substrate 11 in this example is closely fixed to the ground conductor 33 on the back surface of the printed circuit board, the package ground substrate 11 and the housing 50 do not necessarily have to be electrically connected. A high-frequency circuit as described above between the housing 50 andforBy filling the space between the printed board 30 and the casing 50 in the vicinity of the package 10C with the thermal conductive agent 41, heat generated from the high-frequency circuit element can be efficiently radiated.
[0046]
Needless to say, the use of the thermal conductive agent 41 is also applicable to heat radiation at each part in the mounting structure according to the first and second embodiments.
[0047]
In each of the above embodiments, the case has been described in which the recess 50 in which the portion of the package ground substrate 11 can be inserted is not provided in the housing 50, but the present invention is not limited thereto. The housing 50 is provided with a recess processing portion, where a high-frequency circuit is provided.forIt is clear that bending of the flexible printed circuit board 30 can be reduced if a part of the package 10 is submerged. In this way, further improvement of high frequency characteristics can be achieved.
[0048]
In the above embodiments, various high frequency circuit packages including the high frequency circuit element 15 are shown, but the present invention is not limited to this. It goes without saying that the present invention can be realized (provided) as a high-frequency circuit package that does not include a high-frequency circuit element.Moreover, although several embodiment suitable for the said this invention was described, it cannot be overemphasized that various changes of the structure and combination of each part can be performed within the range which does not deviate from this invention thought.
[0049]
【The invention's effect】
As described above, according to the present invention, the high frequency circuitforThe package can be easily mounted on a printed circuit board and a housing, and good electrical characteristics can be obtained even for an ultrahigh frequency exceeding, for example, 20 GHz.
[Brief description of the drawings]
FIG. 1 shows a high-frequency circuit according to a first embodiment.forIt is a figure which shows the structure of a package.
FIG. 2 shows a high frequency circuit according to the first embodiment.forIt is a figure (1) which shows the mounting structure of a package.
FIG. 3 shows a high frequency circuit according to the first embodiment.forIt is a figure (2) which shows the mounting structure of a package.
FIG. 4 is a high-frequency circuit according to a second embodimentforIt is a figure which shows the structure of a package.
FIG. 5 is a high-frequency circuit according to a second embodiment.forIt is a figure which shows the mounting structure of a package.
FIG. 6 is a high-frequency circuit according to a third embodiment.forIt is a figure which shows the mounting structure of a package.
FIG. 7 is a diagram (1) for explaining the prior art.
FIG. 8 is a diagram (2) for explaining the prior art.
[Explanation of symbols]
10 High frequency circuitforpackage
11 Package ground substrate
12 Package dielectric substrate
13 Lid
14 Package terminal
15 High frequency circuit elements
16 connection lines
17c Viahole
30 Printed circuit board
31 Dielectric substrate
32a Signal conductor wire
32b Power supply conductor wire
33 Grounding conductor
34a Tongue for signal conductor
34b Tongue for power supply conductor
35 opening
36 connection lines
37 Ground contact surface
38 Bahia Hall
39 Soldering part
40 PCB holder
41 Thermal conductivity agent
50 cases

Claims (5)

高周波回路素子を搭載するためのパッケージグランド基板の上面に前記高周波回路素子に接続される電極端子を有する誘電体基板を備え、前記パッケージグランド基板の上面が前記誘電体基板よりも幅広に設けられている高周波回路用パッケージにつき、前記誘電体基板の部分を可撓性プリント基板に設けた該誘電体基板と略同一サイズの開口部に嵌入し、前記パッケージグランド基板の上面と前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路用パッケージの実装構造。A dielectric substrate having electrode terminals connected to the high frequency circuit element is provided on the upper surface of the package ground substrate for mounting the high frequency circuit element, and the upper surface of the package ground substrate is provided wider than the dielectric substrate. For the high-frequency circuit package , the portion of the dielectric substrate is fitted into an opening having substantially the same size as that of the dielectric substrate provided on the flexible printed circuit board, and the upper surface of the package ground substrate and the print around the opening A package structure for a high-frequency circuit package, wherein the ground conductor on the back of the substrate is joined . 高周波回路素子を搭載するためのパッケージグランド基板の上面に設置される誘電体基板であって、その上面に高周波回路素子に接続するための信号用電極と、電源用電極と、これらの電極の周囲を囲んで設けられたグランド電極とを備え、該グランド電極が複数のバイアホールを介して前記パッケージグランド基板の上面に接合しており、前記誘電体基板の中央部に内部保護のための蓋体突起部を有することを特徴とする高周波回路用パッケージ。A dielectric substrate installed on the upper surface of a package ground substrate for mounting a high-frequency circuit element, on which the signal electrode for connecting to the high-frequency circuit element, the power supply electrode, and the periphery of these electrodes And a ground electrode that is bonded to the upper surface of the package ground substrate via a plurality of via holes, and a lid for internal protection at the center of the dielectric substrate. A package for a high-frequency circuit, comprising a protrusion. 請求項２記載の高周波回路用パッケージにつき、少なくとも前記誘電体基板上面中央に接合されている蓋体突起部分を可撓性プリント基板に設けた該蓋体突起部分と略同一サイズの開口部に嵌入し、前記誘電体基板上面のグランド電極と、前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路用パッケージの実装構造。 3. The high frequency circuit package according to claim 2 , wherein at least a lid projection portion joined to the center of the upper surface of the dielectric substrate is fitted into an opening having substantially the same size as the lid projection portion provided on the flexible printed board. A mounting structure for a package for a high-frequency circuit, wherein a ground electrode on the top surface of the dielectric substrate and a ground conductor on the back surface of the printed circuit board around the opening are joined. 誘電体基板上面の電極端子と、可撓性プリント基板上面の開口部付近で導体線用に舌状に切り込まれた部分上の該導体線の先端部とを、該先端部に設けたバイアホールを介して接合したことを特徴とする請求項１記載の高周波回路用パッケージの実装構造。Via terminals provided at the tip end of the electrode terminal on the top surface of the dielectric substrate and the tip end portion of the conductor wire on the portion cut in a tongue shape for the conductor wire near the opening on the top surface of the flexible printed circuit board 2. The package structure for a high frequency circuit package according to claim 1 , wherein the package is bonded through a hole. 高周波回路素子を搭載するためのパッケージグランド基板の上面に前記高周波回路素子に接続される電極端子を有する誘電体基板を備えた高周波回路用パッケージにつき、そのパッケージグランド基板の部分を可撓性プリント基板に設けた前記誘電体基板と略同一サイズの開口部に嵌入し、前記パッケージグランド基板の周囲面と前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路用パッケージの実装構造。  A high frequency circuit package having a dielectric substrate having an electrode terminal connected to the high frequency circuit element on an upper surface of a package ground substrate for mounting the high frequency circuit element. A package for a high-frequency circuit, which is fitted into an opening having substantially the same size as that of the dielectric substrate provided on the substrate, and a peripheral surface of the package ground substrate and a ground conductor on the back surface of the printed circuit board around the opening are joined. Implementation structure.
JP2003024474A 2003-01-31 2003-01-31 High frequency circuit package and its mounting structure Expired - Lifetime JP4388284B2 (en)

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PCT/JP2003/016562 WO2004068580A1 (en) 2003-01-31 2003-12-24 High-frequency circuit package and mounting configuration thereof

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