JP2004235558A - Package for high frequency circuit and its packaging structure - Google Patents

Package for high frequency circuit and its packaging structure Download PDF

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Publication number
JP2004235558A
JP2004235558A JP2003024474A JP2003024474A JP2004235558A JP 2004235558 A JP2004235558 A JP 2004235558A JP 2003024474 A JP2003024474 A JP 2003024474A JP 2003024474 A JP2003024474 A JP 2003024474A JP 2004235558 A JP2004235558 A JP 2004235558A
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package
ground
frequency circuit
substrate
circuit board
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JP4388284B2 (en
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Tomoyoshi Yamashita
與慶 山下
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Koa Corp
AI Electronics Ltd
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Koa Corp
AI Electronics Ltd
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Priority to JP2003024474A priority Critical patent/JP4388284B2/en
Priority to PCT/JP2003/016562 priority patent/WO2004068580A1/en
Publication of JP2004235558A publication Critical patent/JP2004235558A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable easy packaging to a printed substrate and a housing and obtain good high frequency characteristics. <P>SOLUTION: The package has a dielectric substrate 12 which has electrode terminals 14a, 14b to be connected to a high frequency circuit element 15 on the upper surface of a package ground substrate 11 with an installation space for mounting the high frequency circuit element 15. The upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12. In such a high frequency circuit package 10A, the part of the dielectric substrate 12 is set in an opening part 35 which has almost the same size as the dielectric substrate provided to a flexible printed substrate 30, and the upper surface of the package ground substrate 11 and a grounding conductor 33 of a printed substrate rear surface in a periphery of the opening part 35 are directly joined (by soldering or the like). <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は高周波回路パッケージ及びその実装構造に関し、更に詳しくは、高周波用ＭＭＩＣ（Ｍｉｃｒｏｗａｖｅ Ｍｏｎｏｒｉｔｈｉｃ Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）等を含む高周波回路パッケージの構造及びそのプリント基板への実装構造に関する。
【０００２】
高周波回路パッケージの実装構造で重要な点は、グランド線及び信号線の接続であり、特に高周波回路パッケージのグランド電極はプリント基板裏面の接地導体及び筐体アースと電気的にも熱的にも一体に近い関係にあることが望ましい。
【０００３】
【従来の技術】
図７は従来の高周波回路パッケージの一実装例を示す図で、図において、６０ＡはＭＭＩＣ等を含む高周波回路パッケージ、６１は金属からなるパッケージグランド基板、６２はパッケージ誘電体基板、６３は高周波回路素子を保護するための蓋体、６４は信号線や電源線を接続するための電極端子、６６は接続線（リボン，ボンディングワイヤ等）、７０はストリップ線路によるプリント基板、７１はアルミナ等による誘電体基板、７２は誘電体基板上面の信号導体線、７３は誘電体基板背面の接地導体、７４はプリント基板７０のパッケージグランド基板６１対応に設けた開口部、５０は電子回路装置の筐体、５１はその窪み加工部である。
【０００４】
高周波回路パッケージ６０Ａの平面視外形に合わせてプリント基板７０に開口部７４を設けると共に、パッケージグランド基板６１とプリント基板背面の接地導体７３とをそれぞれ共通の筐体５０に接触させて固定し、かつプリント基板７０の上面側でパッケージ電極端子６４に必要な電気的接続を行っている。その際には、もしパッケージ電極端子６４とプリント基板７０の上面との間の段差が大きいと、接続線６６の曲がりによりインダクタンス成分が増加して電気的特性を悪化させるため、この影響を軽減すべく、筐体５０に窪み加工部５１を施している。
【０００５】
図８は従来の高周波回路パッケーの他の実装例を示す図で、表面実装型高周波回路パッケージの実装例を示している。図８（Ａ）は高周波回路パッケージの底面図、図８（Ｂ）はプリント基板への実装例の側面図、図８（Ｃ）は同じく底面図（プリント基板の背面から見た透視図）であり、図において、６０Ｂは表面実装型の高周波回路パッケージ、６３はパッケージ上部の蓋体、６４ａは外部回路と接続すべくパッケージ底面に設けられた信号端子、６４ｂは同じく電源端子、６４ｃは同じくグランド電極、７０はストリップ線路によるプリント基板、７１はその誘電体基板、７２ａはプリント基板上面の信号導体線、７２ｂは同じく電源導体線、７２ｃは同じくグランド電極、７３はプリント基板背面の接地導体、７４ｃはプリント基板上面のグランド電極７２ｃと背面の接地導体７３との間を接続するための複数のバイアホール（ｖｉａ ｈｏｌｅ）、５０は電子回路装置の筐体である。
【０００６】
図８（Ｂ），（Ｃ）において、高周波回路パッケージ６０Ｂは、プリント基板７０の上側に置かれ、その信号端子６４ａは基板上面の信号導体線７２ａに、電源端子６４ｂは同じく電源導体線７２ｂに、そして中央のグランド電極６４ｃは同じくグランド電極７２ｃに、それぞれ半田付け等により接続される。その際には、パッケージグランド電極６４ｃをより確実にアース電位に近付けるために、プリント基板上面のグランド電極７２ｃと背面の接地導体７３との間に多数のバイアホール（ビアホールとも呼ばれる）７４ｃを設けている。
【０００７】
また、図示しないが、従来は、プリント基板（１４）に設けられた開口部（４）内に、表面実装部品搭載基板（２）に搭載されている表面実装部品（８）を嵌入し、両者を接合固定するところの表面実装部品の実装構造が知られている（例えば特許文献１）。
【０００８】
【特許文献１】
特開平１０−１２６０３２号公報（要約，図）。
【０００９】
【発明が解決しようとする課題】
しかし、上記図７に示した如く、一旦、プリント基板開口部７４で切断された信号導体線７２とパッケージ電極端子６４との間を接続線６６により接続する方式であると、その接続部分では、プリント基板表面の信号導体線７２と、背面の接地導体７３との間の一様な関係（即ち、ストリップ線路としての断面形状，寸法，誘電率等）が維持されなくなるため、線路の高周波特性（特性インピーダンス，伝送線波長，減衰量等）が著しく劣化する問題があった。
【００１０】
また上記の如く、パッケージグランド基板６１とプリント基板背面の接地導体７３との間のグランド接続を、これらに共通の筐体５０への接触を介して行う方式であると、筐体５０とパッケージグランド基板６１又はプリント基板接地導体７３との間に存在するような僅かな隙間が回路の高周波特性に大きく影響するばかりか、これを阻止するためには、高周波回路パッケージ６０Ａ及びプリント基板７０を共に筐体５０にネジ止め又は導電接着する必要があり、これがコスト増加の一要因となっていた。
【００１１】
また上記図８に示した如く、パッケージグランド電極６４ｃとプリント基板背面の接地導体７３との間のグランド接続を、複数のバイアホール７４ｃを介して行う方式であると、該バイアホール７４ｃのインダクタンスが高周波特性に大きく影響する問題があった。また、一般にプリント基板７０の熱伝導特性は良好ではないため、図示の如く筐体５０との間にバイアホール７４ｃが介在していても、高周波回路素子の放熱の点で不利であった。
【００１２】
本発明は上記従来技術の問題点に鑑みなされたもので、その目的とする所は、プリント基板及び筐体への実装が容易であると共に、良好な高周波特性が得られる高周波回路パッケージ及びその実装構造を提供することにある。
【００１３】
【課題を解決するための手段】
上記の課題は例えば図１の構成により解決される。即ち、本発明（１）の高周波回路パッケージ１０Ａは、パッケージグランド基板１１の上面に高周波回路素子１５と該素子に接続するための電極端子１４ａ，１４ｂを有する誘電体基板１２とを備え、前記パッケージグランド基板１１の上面が前記誘電体基板１２よりも幅広に設けられているものである。
【００１４】
本発明（１）によれば、パッケージグランド基板１１の上面が誘電体基板１２よりも幅広に設けられているため、この様な高周波回路パッケージ１０Ａはプリント基板や筐体への実装が容易であると共に、パッケージグランド基板１１の上面とプリント基板背面の接地導体とを直接に接合可能となり、よって、良好な高周波特性が得られる。
【００１５】
また上記の課題は例えば図２の構成により解決される。即ち、本発明（２）の高周波回路パッケージの実装構造は、上記本発明（１）の高周波回路パッケージ１０Ａにつき、そのパッケージグランド基板１１以外の部分を可撓性プリント基板３０の対応する開口部３５に嵌入し、前記パッケージグランド基板１１の上面と前記開口部３５の周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００１６】
本発明（２）によれば、パッケージグランド基板１１の上面とプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、幅広のパッケージグランド基板１１の背面を装置の筐体５０に直接接触させることが可能となり、高周波回路素子の十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１，プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。また、このような各部品の実装配置では、パッケージ電極端子１４ａ，１４ｂとプリント基板上面の導体線３２ａ，３２ｂとの間を短い距離で、かつ段差少なく接続可能であり、よって、不要なリアクタンス（インダクタンス）分を介することなく、高周波でも良好・安定に動作可能となる。
【００１７】
また上記の課題は例えば図４の構成により解決される。即ち、本発明（３）の高周波回路パッケージ１０Ｂは、パッケージグランド基板１１の上面に高周波回路素子１５と該素子に接続するための電極端子１４を有する誘電体基板１２とを備え、該誘電体基板１２の上面に信号用電極１４ａと、電源用電極１４ｂと、これらの電極の周囲に展開するように設けられたグランド電極１４ｃとを含み、該グランド電極１４ｃが複数のバイアホール１７ｃを介して前記パッケージグランド基板１１の上面に接合しているものである。
【００１８】
本発明（３）によれば、パッケージ誘電体基板１２の上面にパッケージグランド電極１４ｃを備えるため、該グランド電極１４ｃの上面とプリント基板背面の接地導体とを直接に接合可能となり、よって、良好な高周波特性が得られる。また、高周波回路素子１５を直接支持するパッケージグランド基板１１を筐体上面に直接接触させることが可能であり，よって、十分な放熱効果が得られる。
【００１９】
本発明（４）の高周波回路パッケージは、上記本発明（１）又は（３）において、例えば図４に示す如く、パッケージグランド基板１１は誘電体基板の上面に設けたメタライズ層１１ａからなるものである。この様にしても、高周波回路パッケージ１０と、プリント基板背面の接地導体３３との間のグランド接続には支障が生じず、よって、この種の高周波回路装置を多様な態様で安価に構成できる。
【００２０】
また上記の課題は例えば図５の構成により解決される。即ち、本発明（５）の高周波回路パッケージの実装構造は、上記本発明（３）の高周波回路パッケージ１０Ｂにつき、そのパッケージグランド基板１１及び誘電体基板１２以外の部分（即ち、例えば図５の蓋体１３の部分）を可撓性プリント基板３０の対応する開口部３５に嵌入し、前記誘電体基板１２上面のグランド電極１４ｃと、前記開口部３５周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００２１】
本発明（５）によれば、パッケージ誘電体基板１２上面のグランド電極１４ｃと、プリント基板開口部３５周辺におけるプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られ、よって良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、高周波回路素子を支持するパッケージグランド基板（例えば上面をメタライズしたアルミナ基板）１１を装置の筐体５０に直接接触させることが可能となり、高周波回路素子の十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１，プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。
【００２２】
本発明（６）の高周波回路パッケージの実装構造は、上記本発明（２）において、例えば図３に示す如く、パッケージ誘電体基板１２上面の電極端子１４ａ，１４ｂと、可撓性プリント基板３０上面の開口部３５付近で導体線用に舌状に切り込まれた部分３４ａ，３４ｂ上の該導体線の先端部とを、該先端部に設けたバイアホール３８ａ，３８ｂを介して接合したものである。従って、別段の接続線３６やその接続工程を必要としないため、接続安定であると共に、製造容易である。
【００２３】
本発明（７）の高周波回路パッケージの実装構造は、例えば図６に示す如く、パッケージグランド基板１１の上面に高周波回路素子と該素子に接続するための電極端子を有する誘電体基板１２とを備えた高周波回路パッケージ１０Ｃにつき、そのパッケージグランド基板１１の部分を可撓性プリント基板３０の対応する開口部３５に嵌入し、前記パッケージグランド基板１１の周囲面と前記開口部３５周辺におけるプリント基板背面の接地導体３３とを接合（半田付け，導電接着等）したものである。
【００２４】
従って、上記図７に示した従来の高周波回路パッケージ６０Ａと同様の形状を有するような通常の高周波回路パッケージ１０Ｃについても、パッケージグランド基板１１の周囲面と、開口部３５周辺におけるプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。
【００２５】
【発明の実施の形態】
以下、添付図面に従って本発明に好適なる複数の実施の形態を詳細に説明する。なお 、全図を通して同一符号は同一又は相当部分を示すものとする。図１は第１の実施の形態による高周波回路パッケージの構造を示す図で、パッケージグランド基板１１の上面がパッケージ誘電体基板１２よりも幅広に設けられている場合を示している。図１（Ａ）はその側面図、図１（Ｂ）は上面図、図１（Ｃ）は側断面図であり、図において、１０Ａは第１の実施の形態による高周波回路パッケージ、１１は金属からなるグランド基板、１２はアルミナ等による誘電体基板、１３は内部の高周波回路素子を保護するための蓋体、１４ａは外部回路と接続すべく誘電体基板１２の上面に設けられた信号端子、１４ｂは同じく電源端子、１５はＭＭＩＣ等による高周波回路素子、１６は高周波回路素子と電極端子間を接続する接続線（リボン，ボンディングワイヤ等）である。
【００２６】
パッケージグランド基板１１の上に高周波回路素子１５を接着し、該素子１５と信号端子１４ａ及び電源端子１４ｂとの間を接続線１６により接続する。更に、これらを保護すべくパッケージ誘電体基板１２の上側に蓋体１３を接着し、全体として高周波回路パッケージ１０Ａとなしている。
【００２７】
本第１の実施の形態では、パッケージグランド基板１１の面積を誘電体基板１２の面積よりも広くすることにより、パッケージグランド基板１１の上面が誘電体基板１２の周囲に露出することとなり、この露出部分にプリント基板背面の接地導体を直接に接合（半田付け等）可能となっている。
【００２８】
パッケージグランド基板１１としては、高周波回路素子１５の確実なグランド接続と十分な放熱効果を得るために、好ましくは、金属板を使用する。但し、後述の本第１の実施の形態による実装構造では、パッケージグランド基板１１の上側露出面がプリント基板背面の接地導体３３と直接に接合することになるため、高周波回路パッケージ１０Ａとプリント基板３０との間には一様かつ確実なグランド接続が得られる。このような場合には、アルミナ基板等の上面を銅等によりメタライズした基板をパッケージグランド基板１１としても良い。こうすれば、パッケージグランド基板１１を安価に構成できる。
【００２９】
図２は第１の実施の形態による高周波回路パッケージの実装構造を示す図（１）で、上記図１の高周波回路パッケージ１０Ａをフレキシブルなプリント基板３０に実装する場合を示している。図２（Ａ）は実装状態の側面図、図２（Ｂ）は上面図であり、図において、１０Ａは上記図１に示した高周波回路パッケージ、１４ａは該パッケージの信号端子、１４ｂは同じく電源端子である。更に、３０は例えばストリップ線路による可撓性のプリント基板、３１はその誘電体基板｛テフロン（登録商標）系等｝、３２ａは誘電体基板上面の信号導体線、３２ｂは同じく電源導体線、３３は誘電体基板背面の接地導体、３５はプリント基板３０につきパッケージ誘電体基板１２の上面視形状の対応に設けた開口部、３６は接続線（リボン，ボンディングワイヤ等）、３７はパッケージグランド基板１１の上面とプリント基板３０背面の接地導体３３との間のグランド接触面、４０はプリント基板押え、５０は電子回路装置の筐体である。
【００３０】
高周波回路パッケージ１０Ａの蓋体１３とパッケージ誘電体基板１２の部分をプリント基板３０の背面より開口部３５に嵌入すると共に、プリント基板背面の接地導体３３をパッケージグランド基板１１の上側露出面に接触させてグランド接触面３７となし、これらの間を半田付け等により接着・固定する。更に、パッケージの信号端子１４ａ及び電源端子１４ｂとプリント基板上面の信号導体線３２ａ及び電源導体線３２ｂとの間をそれぞれ接続線３６により接続し、こうしてプリント回路基板アセンブリを形成する。
【００３１】
更に、このアセンブリにつき、パッケージグランド基板１１の背面及びプリント基板背面の接地導体３３の各部分をそれぞれ筐体５０の上面に接触させて、固定する。その際には、フレキシブルなプリント基板３０背面の接地導体３３がパッケージグランド基板１１の周囲のできるだけ近くで筐体５０に密着するように、高周波回路パッケージ１０Ａ周囲のプリント基板３０の部分をプリント基板押え４０により筐体５０に押し付け、ネジ等により固定する。
【００３２】
なお、本第１の実施の形態においても、高周波回路パッケージ１０Ａの一部を沈めるための窪み加工部を筐体５０の表面に設けることが可能であり、こうすれば、可撓性プリント基板３０の撓み量を十分に小さくできる。この場合には、上記のようにプリント基板押え４０を用いないで、プリント基板３０を筐体５０にネジ止めするだけでも良い。
【００３３】
本第１の実施の形態によれば、パッケージグランド基板１１の上面とプリント基板背面の接地導体３３とを直接に接合する構成により、これらの間には一様で、安定かつ確実なグランド接続が得られるため、良好な高周波特性が得られる。また、この種の高周波回路装置組立時のプリント基板回路アセンブリの取扱が容易である。更にまた、幅広のパッケージグランド基板１１の背面を装置の筐体５０に直接接触させることが可能となり、高周波回路素子１５に十分な放熱効果が得られる。また、可撓性プリント基板３０の背面の接地導体３３をパッケージグランド基板１１の周辺のできるだけ近傍で共通の筐体５０に密着させることが可能となり、よって、パッケージグランド基板１１、プリント基板３０及び筐体５０の間には高周波電位差が生じ難い。また、このような各部品の実装配置では、パッケージ電極端子１４ａ，１４ｂとプリント基板上面の導体線３２ａ，３２ｂとの間を短い距離で、かつ段差少なく接続可能であり、よって、不要なリアクタンス（インダクタンス）分を介することなく、高周波でも良好・安定に動作可能となる。
【００３４】
図３は第１の実施の形態による高周波回路パッケージの実装構造を示す図（２）で、高周波回路パッケージ１０Ａの信号／電源端子１４ａ／１４ｂと、プリント基板３０の信号／電源導体線３２ａ／３２ｂとを、別段の接続線３６を介することなく、直接的に接続可能な場合を示している。図３（Ａ）は実装状態の側面図、図３（Ｂ）は上面図であり、図において、３４ａはプリント基板３０の開口部３５付近で可撓性誘電体基板３１が信号導体線３２ａ用に舌状に切り込まれた信号導体用舌状部、３４ｂは同じく電源導体線３２ｂ用に舌状に切り込まれた電源導体用舌状部、３８は信号／電源導体用舌状部３４ａ／３４ｂの上面にある信号／電源導体線３２ａ／３２ｂの各先端部に設けられたバイアホール（スルホールとも呼ばれる）である。 図３（Ｂ）の挿入図（ａ），（ｂ）に信号／電源導体用舌状部３４ａ／３４ｂの部分拡大図を示す。
【００３５】
プリント基板３０のうちの信号導体用舌状部３４ａの背面には接地導体３３が設けられておらず、よって、この部分をパッケージ信号端子１４ａの上面に展開（延展）させて半田付け等により直接的に接続可能である。これにより、プリント基板３０上面の信号導体線３２ａとパッケージ信号端子１４ａとが基板先端部のバイアホール３８を介して接続される。電源導体用舌状部３４ｂとパッケージ電源端子１４ｂとの間の接続についても同様である。それ以外の部分の実装構造については上記図２で述べたものと同様で良い。本実装構造によれば、別途に接続線３６による接続を必要としない簡単な構成であるため、信号／電源線接続の信頼性が高いと共に、高周波特性が改善される。また製造コストを低減できる。
【００３６】
図４は第２の実施の形態による高周波回路パッケージの構造を示す図で、パッケージ信号／電源端子１４ａ，１４ｂの周囲の同一面上にパッケージグランド電極１４ｃを備える場合を示している。図４（Ａ）はその側面図、図４（Ｂ）は上面図、図４（Ｃ）は側断面図であり、図において、１０Ｂは第２の実施の形態による高周波回路パッケージ、１１はそのグランド基板、１１ａは該グランド基板上面のメタライズ層、１２はパッケージ誘電体基板、１３は蓋体、１４ａは誘電体基板１２の上面に設けた信号端子、１４ｂは同じく電源端子、１４ｃは同じくグランド電極、１７ｃは該グランド電極１４ｃから誘電体基板１２の背面に貫通するバイアホール（スルーホール）、１５はＭＭＩＣ等による高周波回路素子、１６は接続線（リボン，ボンディングワイヤ等）である。
【００３７】
メタライズ層１１ａの上に高周波回路素子１５を接着し、その周囲を、パッケージ中央部に開口部を有するようなパッケージ誘電体基板１２により囲む。高周波回路素子１５への信号及び電源の接続はパッケージ誘電体基板１２上面の信号端子１４ａ及び電源端子１４ｂを介してそれぞれに接続線１６により行うと共に、これらを保護すべく上部に蓋体１３を接着し、全体として高周波回路パッケージ１０Ｂとなしている。
【００３８】
パッケージ誘電体基板１２の上面には信号端子１４ａ、電源端子１４ｂ、及びこれらを取り囲む形でグランド電極１４ｃが同一面上に設けられている。更に、このグランド電極１４ｃには多数のバイアホール１７ｃが設けられており、グランド電極１４ｃと誘電体基板１２の背面に接触（接合）するメタライズ層１１ａとの間が多数のバイアホール１７ｃを介して電気的に接続される。なお、パッケージグランド基板１１が金属板で構成されていても良いことは言うまでもない。
【００３９】
図５は第２の実施の形態による高周波回路パッケージの実装構造を示す図で、上記図４の高周波回路パッケージ１０Ｂをフレキシブルなプリント基板３０に実装する場合を示している。図５（Ａ）は実装状態の側面図、図５（Ｂ）は上面図であり、図において、３５はプリント基板３０につき蓋体１３の上面視形状の対応に設けられた開口部、３２ａは開口部３５の端面にまで展開する信号導体線、３２ｂは同じく電源導体線、３８ａは開口部端面にまで展開する信号導体線３２ａの先端部に設けられたバイアホール、３８ｂは同じく電源導体線３２ｂの先端部に設けられたバイアホールである。
【００４０】
なお、この例のプリント基板裏面の接地導体３３は、その内側開口部３５ｃがパッケージグランド電極１４ｃの上面視開口形状と一致するように設けられている。これに対して、プリント基板の信号導体線３２ａおよび電源導体線３２ｂはそれぞれパッケージ信号端子１４ａ及び電源端子１４ｂの真上まで延びている。
【００４１】
プリント基板３０の開口部３５に高周波回路パッケージ１０Ｂの蓋体１３の部分を裏面から挿入し、パッケージ誘電体基板１２の上面のグランド電極１４ｃをプリント基板裏面の接地導体３３に半田付け等により接着・固定する。また、図５（Ｂ）に示す如く、信号端子１４ａへの信号の接続は信号導線３２ａの先端部に設けられたバイアホール３８ａを介して行い、また電源端子１４ｂへの電源の接続は電源導体線３２ｂの先端部に設けられたバイアホール３８ｂを介して行う。こうして得られたプリント基板アセンブリの筐体５０への取り付けに際しては、上記同様の目的でプリント基板押え４０が使用される。なお、上記バイアホール３８ａ，３８ｂを介する接続に代えて、別途に接続線３６を使用しても良いことは言うまでもない。
【００４２】
図６は第３の実施の形態による高周波回路パッケージの実装構造を示す図で、従来型の高周波回路パッケージの実装に関して特徴を有する構成を示している。図において、１０Ｃは高周波回路パッケージであり、該パッケージ１０Ｃのグランド基板１１と誘電体基板１２とは通常同一の面積となっている。また３５はプリント基板３０につきパッケージグランド基板１１の上面視形状の対応に設けられた開口部である。
【００４３】
高周波回路パッケージ１０Ｃの全体をプリント基板３０の背面より開口部３５に嵌入すると共に、プリント基板３０背面の接地導体３３をパッケージグランド基板１１の周囲側面に接触させてこれらの間を半田付け３９等により接着・固定する。更に、パッケージ誘電体基板１２上面の信号端子１４ａ及び電源端子１４ｂとプリント基板上面の信号導体線３２ａ及び電源導体線３２ｂとの間をそれぞれ接続線３６により接続し、こうしてプリント回路基板アセンブリを形成する。
【００４４】
更に、このアセンブリのパッケージグランド基板１１及びプリント基板背面の接地導体３３の各部分を筐体５０の上面に接触させて、固定する。その際には、可撓性プリント基板背面の接地導体３３がパッケージグランド基板１１周囲のできるだけ近くで筐体５０に密着するように、パッケージグランド基板１１周囲のプリント基板３０の部分をプリント基板押え４０により筐体５０に押し付け、ネジ等により固定する。
【００４５】
その際には、高周波回路パッケージ１０Ｃの裏面及び周辺でプリント基板３０と筐体５０との間にある隙間を埋めるようにシリコングリース等による熱伝導剤４１を充填することが可能である。この例のパッケージグランド基板１１はプリント基板背面の接地導体３３に密着固定されているため、パッケージグランド基板１１と筐体５０の間は必ずしも電気的接続がなくてもよく、よってパッケージグランド基板１１と筐体５０との間、更には前述のような高周波回路パッケージ１０Ｃの近傍のプリント基板３０と筐体５０との間の空間に熱伝導剤４１を充填することにより高周波回路素子からの発熱を効率よく放熱できる。
【００４６】
なお、この熱伝導剤４１の使用は、上記第１，第２の実施の形態による実装構造における各部位の放熱にも適用可能であることは言うまでもない。
【００４７】
また、上記各実施の形態では筐体５０にパッケージグランド基板１１の部分を嵌入可能な窪み加工部を設けない場合を示したが、これに限らない。筐体５０に窪み加工部を設け、ここに高周波回路パッケージ１０の一部を沈めれば、可撓性プリント基板３０の曲がりを少なくできることは明らかであり、こうすれば、更なる高周波特性の改善が図れる。
【００４８】
また、上記本発明に好適なる複数の実施の形態を述べたが、本発明思想を逸脱しない範囲内で各部の構成及び組合せの様々な変更が行えることは言うまでも無い。
【００４９】
【発明の効果】
以上述べた如く本発明によれば、高周波回路パッケージのプリント基板及び筐体への実装が容易であると共に、例えば２０ＧＨｚを越えるような超高周波に対しても良好な電気的特性が得られる。
【図面の簡単な説明】
【図１】第１の実施の形態による高周波回路パッケージの構造を示す図である。
【図２】第１の実施の形態による高周波回路パッケージの実装構造を示す図（１）である。
【図３】第１の実施の形態による高周波回路パッケージの実装構造を示す図（２）である。
【図４】第２の実施の形態による高周波回路パッケージの構造を示す図である。
【図５】第２の実施の形態による高周波回路パッケージの実装構造を示す図である。
【図６】第３の実施の形態による高周波回路パッケージの実装構造を示す図である。
【図７】従来技術を説明する図（１）である。
【図８】従来技術を説明する図（２）である。
【符号の説明】
１０ 高周波回路パッケージ
１１ パッケージグランド基板
１２ パッケージ誘電体基板
１３ 蓋体
１４ パッケージ端子
１５ 高周波回路素子
１６ 接続線
１７ｃ バイアホール
３０ プリント基板
３１ 誘電体基板
３２ａ 信号導体線
３２ｂ 電源導体線
３３ 接地導体
３４ａ 信号導体用舌状部
３４ｂ 電源導体用舌状部
３５ 開口部
３６ 接続線
３７ グランド接触面
３８ バイアホール
３９ 半田付け部
４０ プリント基板押え
４１ 熱伝導剤
５０ 筐体[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a high-frequency circuit package and a mounting structure thereof, and more particularly to a structure of a high-frequency circuit package including a high-frequency MMIC (Microwave Monolithic Integrated Circuit) and a mounting structure thereof on a printed circuit board.
[0002]
An important point in the mounting structure of the high-frequency circuit package is the connection of the ground line and the signal line. In particular, the ground electrode of the high-frequency circuit package is electrically and thermally integrated with the ground conductor and the housing ground on the back of the printed circuit board. It is desirable that the relationship be close to
[0003]
[Prior art]
FIG. 7 is a view showing an example of mounting a conventional high-frequency circuit package. In the figure, 60A is a high-frequency circuit package including an MMIC, etc., 61 is a package ground substrate made of metal, 62 is a package dielectric substrate, and 63 is a high-frequency circuit. A cover for protecting the device, 64 is an electrode terminal for connecting a signal line or a power supply line, 66 is a connection line (ribbon, bonding wire, etc.), 70 is a printed circuit board made of a strip line, 71 is a dielectric made of alumina or the like. 72, a signal conductor line on the upper surface of the dielectric substrate, 73, a ground conductor on the rear surface of the dielectric substrate, 74, an opening provided for the package ground substrate 61 of the printed circuit board 70, 50, a housing of the electronic circuit device, Reference numeral 51 denotes the recessed portion.
[0004]
An opening 74 is provided in the printed board 70 in accordance with the external shape of the high-frequency circuit package 60A in a plan view, and the package ground board 61 and the ground conductor 73 on the back of the printed board are brought into contact with and fixed to the common housing 50, respectively, and The necessary electrical connection to the package electrode terminals 64 is made on the upper surface side of the printed board 70. At this time, if the step between the package electrode terminal 64 and the upper surface of the printed circuit board 70 is large, the inductance component increases due to the bending of the connection line 66, thereby deteriorating the electrical characteristics. To this end, the housing 50 is provided with a recessed portion 51.
[0005]
FIG. 8 is a diagram showing another mounting example of a conventional high-frequency circuit package, and shows a mounting example of a surface-mounted high-frequency circuit package. 8A is a bottom view of the high-frequency circuit package, FIG. 8B is a side view of an example of mounting on a printed board, and FIG. 8C is a bottom view (a perspective view seen from the back of the printed board). In the drawing, 60B is a surface-mount type high-frequency circuit package, 63 is a lid on the top of the package, 64a is a signal terminal provided on the package bottom surface for connection to an external circuit, 64b is a power terminal, and 64c is a ground. Electrodes, 70 is a printed circuit board made of strip lines, 71 is its dielectric substrate, 72a is a signal conductor line on the upper surface of the printed circuit board, 72b is a power supply conductor line, 72c is also a ground electrode, 73 is a ground conductor on the back surface of the printed circuit board, 74c Are a plurality of via holes for connecting between the ground electrode 72c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface; Reference numeral 0 denotes a housing of the electronic circuit device.
[0006]
8B and 8C, the high-frequency circuit package 60B is placed on the upper side of the printed circuit board 70, and its signal terminals 64a are connected to the signal conductor lines 72a on the upper surface of the substrate, and the power supply terminals 64b are similarly connected to the power supply conductor lines 72b. The center ground electrode 64c is connected to the ground electrode 72c by soldering or the like. In this case, in order to more reliably bring the package ground electrode 64c closer to the ground potential, a number of via holes (also called via holes) 74c are provided between the ground electrode 72c on the upper surface of the printed circuit board and the ground conductor 73 on the rear surface. I have.
[0007]
Although not shown, conventionally, a surface mount component (8) mounted on a surface mount component mounting board (2) is fitted into an opening (4) provided in a printed circuit board (14), and both of them are fitted. There is known a mounting structure of a surface mounting component for joining and fixing the components (for example, Patent Document 1).
[0008]
[Patent Document 1]
JP-A-10-126032 (abstract, figure).
[0009]
[Problems to be solved by the invention]
However, as shown in FIG. 7, once the signal conductor line 72 cut at the printed board opening 74 and the package electrode terminal 64 are connected by the connection line 66, the connection portion is Since the uniform relationship between the signal conductor line 72 on the surface of the printed circuit board and the ground conductor 73 on the back surface (that is, the cross-sectional shape, dimensions, permittivity, etc. as a strip line) is not maintained, the high-frequency characteristics of the line ( Characteristic impedance, transmission line wavelength, attenuation, etc.).
[0010]
Further, as described above, if the ground connection between the package ground substrate 61 and the ground conductor 73 on the back of the printed circuit board is made through contact with the common housing 50, the housing 50 and the package ground are connected. A small gap between the substrate 61 and the printed circuit board ground conductor 73 not only greatly affects the high frequency characteristics of the circuit, but also prevents the high frequency circuit package 60A and the printed circuit board 70 from being encased together. It has to be screwed or conductively bonded to the body 50, which has been a factor in increasing the cost.
[0011]
As shown in FIG. 8, when the ground connection between the package ground electrode 64c and the ground conductor 73 on the back of the printed circuit board is made through a plurality of via holes 74c, the inductance of the via hole 74c is reduced. There is a problem that greatly affects high frequency characteristics. Further, since the thermal conductivity of the printed circuit board 70 is generally not good, even if the via hole 74c is interposed between the printed circuit board 70 and the case 50 as shown in the figure, it is disadvantageous in terms of heat radiation of the high-frequency circuit element.
[0012]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the related art, and an object of the present invention is to provide a high-frequency circuit package that can be easily mounted on a printed circuit board and a housing, and that provides good high-frequency characteristics and its mounting. It is to provide structure.
[0013]
[Means for Solving the Problems]
The above problem is solved by, for example, the configuration of FIG. That is, a high-frequency circuit package 10A of the present invention (1) includes a high-frequency circuit element 15 on the upper surface of a package ground substrate 11 and a dielectric substrate 12 having electrode terminals 14a and 14b for connecting to the element. The upper surface of the ground substrate 11 is provided wider than the dielectric substrate 12.
[0014]
According to the present invention (1), since the upper surface of the package ground substrate 11 is provided wider than the dielectric substrate 12, such a high-frequency circuit package 10A can be easily mounted on a printed circuit board or a housing. At the same time, the upper surface of the package ground substrate 11 and the ground conductor on the back surface of the printed circuit board can be directly joined, so that good high-frequency characteristics can be obtained.
[0015]
The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (2) is different from that of the high-frequency circuit package 10A of the present invention (1) in that the portions other than the package ground substrate 11 correspond to the corresponding openings 35 of the flexible printed circuit board 30. , And the upper surface of the package ground substrate 11 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined (solder, conductive bonding, etc.).
[0016]
According to the present invention (2), the structure in which the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the back surface of the printed circuit board allows a uniform, stable and reliable ground connection between them. Therefore, good high-frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board circuit assembly when assembling this type of high-frequency circuit device. Furthermore, the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and a sufficient heat radiation effect of the high-frequency circuit element can be obtained. Further, the ground conductor 33 on the back surface of the flexible printed board 30 can be brought into close contact with the common casing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, the printed board 30, and the casing A high-frequency potential difference hardly occurs between the bodies 50. Further, in such a mounting arrangement of each component, it is possible to connect the package electrode terminals 14a, 14b and the conductor wires 32a, 32b on the upper surface of the printed board with a short distance and with a small step, and therefore, unnecessary reactance ( It is possible to operate satisfactorily and stably even at a high frequency without intervening inductance.
[0017]
The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the high-frequency circuit package 10B of the present invention (3) includes a high-frequency circuit element 15 on the upper surface of a package ground substrate 11 and a dielectric substrate 12 having electrode terminals 14 for connecting to the element. 12 includes a signal electrode 14a, a power supply electrode 14b, and a ground electrode 14c provided so as to extend around these electrodes, and the ground electrode 14c is provided through a plurality of via holes 17c. It is joined to the upper surface of the package ground substrate 11.
[0018]
According to the present invention (3), since the package ground electrode 14c is provided on the upper surface of the package dielectric substrate 12, the upper surface of the ground electrode 14c can be directly joined to the ground conductor on the rear surface of the printed circuit board. High frequency characteristics can be obtained. Further, the package ground substrate 11 directly supporting the high-frequency circuit element 15 can be brought into direct contact with the upper surface of the housing, and thus a sufficient heat radiation effect can be obtained.
[0019]
In the high-frequency circuit package of the present invention (4), in the above-mentioned present invention (1) or (3), for example, as shown in FIG. 4, the package ground substrate 11 comprises a metallized layer 11a provided on the upper surface of a dielectric substrate. is there. Even in this case, the ground connection between the high-frequency circuit package 10 and the ground conductor 33 on the rear surface of the printed circuit board does not hinder, so that this type of high-frequency circuit device can be configured in various modes at low cost.
[0020]
The above-mentioned problem is solved by, for example, the configuration shown in FIG. That is, the mounting structure of the high-frequency circuit package of the present invention (5) is the same as that of the high-frequency circuit package 10B of the present invention (3) except for the parts other than the package ground substrate 11 and the dielectric substrate 12 (that is, for example, the lid of FIG. 5). The body 13) is fitted into the corresponding opening 35 of the flexible printed circuit board 30, and the ground electrode 14c on the upper surface of the dielectric substrate 12 and the ground conductor 33 on the back surface of the printed circuit board around the opening 35 are joined. (Soldering, conductive bonding, etc.).
[0021]
According to the present invention (5), the ground electrode 14c on the upper surface of the package dielectric substrate 12 and the ground conductor 33 on the rear surface of the printed circuit board in the vicinity of the printed circuit board opening 35 are directly joined. In this way, a stable and reliable ground connection can be obtained, and thus good high-frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board circuit assembly when assembling this type of high-frequency circuit device. Furthermore, a package ground substrate (for example, an alumina substrate having a metallized upper surface) 11 supporting the high-frequency circuit element can be brought into direct contact with the housing 50 of the device, and a sufficient heat radiation effect of the high-frequency circuit element can be obtained. Further, the ground conductor 33 on the back surface of the flexible printed board 30 can be brought into close contact with the common casing 50 as close as possible to the periphery of the package ground board 11, so that the package ground board 11, the printed board 30, and the casing A high-frequency potential difference hardly occurs between the bodies 50.
[0022]
The mounting structure of the high-frequency circuit package of the present invention (6) is different from that of the present invention (2) in that the electrode terminals 14a and 14b on the upper surface of the package dielectric substrate 12 and the upper surface of the flexible printed circuit board 30 as shown in FIG. Are formed by joining via-holes 38a, 38b provided at the distal ends of the conductor wires on portions 34a, 34b cut in a tongue shape for the conductor wires in the vicinity of opening 35. is there. Therefore, since a separate connection line 36 and a connection step are not required, the connection is stable and the manufacture is easy.
[0023]
The mounting structure of the high-frequency circuit package according to the present invention (7) includes, as shown in FIG. 6, for example, a high-frequency circuit element on a top surface of a package ground substrate 11 and a dielectric substrate 12 having electrode terminals for connecting to the element. For the high-frequency circuit package 10C, the portion of the package ground substrate 11 is fitted into the corresponding opening 35 of the flexible printed circuit board 30, and the peripheral surface of the package ground substrate 11 and the back surface of the printed circuit board around the opening 35 are fitted. The ground conductor 33 is joined (soldering, conductive bonding, etc.).
[0024]
Therefore, the normal high-frequency circuit package 10C having the same shape as the conventional high-frequency circuit package 60A shown in FIG. 7 also has the peripheral surface of the package ground substrate 11 and the ground on the back surface of the printed circuit board around the opening 35. With a configuration in which the conductor 33 and the conductor 33 are directly joined, a uniform, stable and reliable ground connection can be obtained therebetween, so that good high-frequency characteristics can be obtained.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a plurality of embodiments suitable for the present invention will be described in detail with reference to the accompanying drawings. Note that the same reference numerals indicate the same or corresponding parts throughout the drawings. FIG. 1 is a diagram showing the structure of the high-frequency circuit package according to the first embodiment, in which the upper surface of a package ground substrate 11 is provided wider than the package dielectric substrate 12. 1 (A) is a side view, FIG. 1 (B) is a top view, and FIG. 1 (C) is a side sectional view. In the figure, 10A is a high-frequency circuit package according to the first embodiment, and 11 is metal. A dielectric substrate 12 made of alumina or the like; 13 a cover for protecting the internal high-frequency circuit element; 14a a signal terminal provided on the upper surface of the dielectric substrate 12 for connection to an external circuit; 14b is a power supply terminal, 15 is a high-frequency circuit element such as an MMIC, and 16 is a connection line (ribbon, bonding wire, etc.) connecting the high-frequency circuit element and the electrode terminal.
[0026]
The high-frequency circuit element 15 is adhered on the package ground substrate 11, and the element 15 is connected to the signal terminal 14 a and the power terminal 14 b by a connection line 16. Further, a lid 13 is adhered to the upper side of the package dielectric substrate 12 to protect them, thereby forming a high-frequency circuit package 10A as a whole.
[0027]
In the first embodiment, by making the area of the package ground substrate 11 larger than the area of the dielectric substrate 12, the upper surface of the package ground substrate 11 is exposed around the dielectric substrate 12. The ground conductor on the back of the printed circuit board can be directly joined (soldered, etc.) to the portion.
[0028]
As the package ground substrate 11, a metal plate is preferably used in order to obtain a reliable ground connection of the high-frequency circuit element 15 and a sufficient heat radiation effect. However, in the mounting structure according to the first embodiment described later, since the upper exposed surface of the package ground substrate 11 is directly bonded to the ground conductor 33 on the back of the printed board, the high-frequency circuit package 10A and the printed board 30 And a uniform and reliable ground connection can be obtained. In such a case, a substrate whose upper surface such as an alumina substrate is metallized with copper or the like may be used as the package ground substrate 11. In this case, the package ground substrate 11 can be configured at low cost.
[0029]
FIG. 2 is a diagram (1) showing a mounting structure of the high-frequency circuit package according to the first embodiment, and shows a case where the high-frequency circuit package 10A of FIG. 1 is mounted on a flexible printed circuit board 30. 2A is a side view of a mounted state, and FIG. 2B is a top view. In the drawing, 10A is the high-frequency circuit package shown in FIG. 1, 14a is a signal terminal of the package, and 14b is a power supply. Terminal. Further, reference numeral 30 denotes a flexible printed board made of, for example, a strip line, reference numeral 31 denotes a dielectric substrate thereof (Teflon (registered trademark) or the like), reference numeral 32a denotes a signal conductor line on the upper surface of the dielectric substrate, reference numeral 32b denotes a power supply conductor line, and reference numeral 33 Is a ground conductor on the back of the dielectric substrate, 35 is an opening provided in the printed circuit board 30 corresponding to the shape of the package dielectric substrate 12 as viewed from above, 36 is a connection line (ribbon, bonding wire, etc.), 37 is the package ground substrate 11 Is a ground contact surface between the upper surface of the printed circuit board and the ground conductor 33 on the back surface of the printed circuit board 30; 40 is a printed circuit board holder;
[0030]
The cover 13 of the high-frequency circuit package 10A and the package dielectric substrate 12 are fitted into the opening 35 from the back of the printed circuit board 30, and the ground conductor 33 on the back of the printed circuit board is brought into contact with the upper exposed surface of the package ground substrate 11. To form a ground contact surface 37, which is bonded and fixed by soldering or the like. Further, the signal terminals 14a and the power terminals 14b of the package and the signal conductor lines 32a and the power conductor lines 32b on the upper surface of the printed circuit board are connected by the connection lines 36, respectively, thus forming a printed circuit board assembly.
[0031]
Further, in this assembly, the respective portions of the ground conductor 33 on the back surface of the package ground substrate 11 and the back surface of the printed circuit board are brought into contact with the upper surface of the housing 50 and fixed. At this time, the portion of the printed circuit board 30 around the high-frequency circuit package 10A is held down by the printed circuit board so that the ground conductor 33 on the back surface of the flexible printed circuit board 30 is in close contact with the housing 50 as close as possible to the periphery of the package ground board 11. It is pressed against the housing 50 by 40 and fixed by screws or the like.
[0032]
Also in the first embodiment, it is possible to provide a recessed portion for sinking a part of the high-frequency circuit package 10A on the surface of the housing 50. In this case, the flexible printed circuit board 30 can be provided. Can be sufficiently reduced. In this case, the printed board 30 may be simply screwed to the housing 50 without using the printed board holder 40 as described above.
[0033]
According to the first embodiment, the upper surface of the package ground substrate 11 is directly joined to the ground conductor 33 on the back surface of the printed circuit board, so that a uniform, stable and reliable ground connection is provided therebetween. As a result, good high-frequency characteristics can be obtained. Further, it is easy to handle the printed circuit board circuit assembly when assembling this type of high-frequency circuit device. Furthermore, the back surface of the wide package ground substrate 11 can be brought into direct contact with the housing 50 of the device, and the high-frequency circuit element 15 can obtain a sufficient heat radiation effect. In addition, the ground conductor 33 on the back surface of the flexible printed circuit board 30 can be brought into close contact with the common housing 50 as close as possible to the periphery of the package ground substrate 11, so that the package ground substrate 11, the printed circuit board 30, and the housing A high-frequency potential difference hardly occurs between the bodies 50. Further, in such a mounting arrangement of each component, it is possible to connect the package electrode terminals 14a, 14b and the conductor wires 32a, 32b on the upper surface of the printed board with a short distance and with a small step, and therefore, unnecessary reactance ( It is possible to operate satisfactorily and stably even at a high frequency without intervening inductance.
[0034]
FIG. 3 is a diagram (2) showing a mounting structure of the high-frequency circuit package according to the first embodiment. The signal / power supply terminals 14a / 14b of the high-frequency circuit package 10A and the signal / power supply conductor lines 32a / 32b of the printed circuit board 30 are shown. Are directly connectable without interposing a separate connection line 36. 3A is a side view of a mounted state, and FIG. 3B is a top view. In the drawing, reference numeral 34a denotes an area near an opening 35 of a printed circuit board 30, and a flexible dielectric substrate 31 is used for a signal conductor line 32a. The tongue portion for a signal conductor cut in a tongue shape, 34b is a tongue portion for a power supply conductor also cut in a tongue shape for a power supply conductor line 32b, and the 38 is a tongue portion for a signal / power supply conductor 34a / Via holes (also referred to as through holes) provided at the respective ends of the signal / power supply conductor lines 32a / 32b on the upper surface of 34b. FIGS. 3A and 3B are partially enlarged views of the signal / power supply conductor tongues 34a / 34b.
[0035]
The ground conductor 33 is not provided on the back surface of the signal conductor tongue 34a of the printed circuit board 30. Therefore, this part is developed (extended) on the upper surface of the package signal terminal 14a and directly soldered or the like. Can be connected. As a result, the signal conductor line 32a on the upper surface of the printed board 30 and the package signal terminal 14a are connected via the via hole 38 at the tip of the board. The same applies to the connection between the power supply conductor tongue 34b and the package power supply terminal 14b. The mounting structure of the other parts may be the same as that described with reference to FIG. According to the present mounting structure, since it is a simple configuration that does not require a separate connection by the connection line 36, the reliability of the signal / power supply line connection is high and the high-frequency characteristics are improved. Further, the manufacturing cost can be reduced.
[0036]
FIG. 4 is a diagram showing the structure of the high-frequency circuit package according to the second embodiment, in which a package ground electrode 14c is provided on the same surface around package signal / power supply terminals 14a and 14b. 4 (A) is a side view, FIG. 4 (B) is a top view, and FIG. 4 (C) is a side sectional view. In the drawing, 10B is a high-frequency circuit package according to the second embodiment, and 11 is the same. A ground substrate, 11a is a metallized layer on the upper surface of the ground substrate, 12 is a package dielectric substrate, 13 is a lid, 14a is a signal terminal provided on the upper surface of the dielectric substrate 12, 14b is a power supply terminal, and 14c is a ground electrode. , 17c are via holes (through holes) penetrating from the ground electrode 14c to the back surface of the dielectric substrate 12, 15 is a high-frequency circuit element such as an MMIC, and 16 is a connection line (ribbon, bonding wire, etc.).
[0037]
A high-frequency circuit element 15 is adhered on the metallization layer 11a, and the periphery thereof is surrounded by a package dielectric substrate 12 having an opening at the center of the package. The connection of the signal and the power supply to the high-frequency circuit element 15 is performed by the connection line 16 via the signal terminal 14a and the power supply terminal 14b on the upper surface of the package dielectric substrate 12, and the lid 13 is adhered on the upper part to protect these. The high-frequency circuit package 10B is formed as a whole.
[0038]
On the upper surface of the package dielectric substrate 12, a signal terminal 14a, a power terminal 14b, and a ground electrode 14c are provided on the same surface so as to surround them. Further, a large number of via holes 17c are provided in the ground electrode 14c, and a large number of via holes 17c are provided between the ground electrode 14c and the metallization layer 11a which is in contact with (joins to) the back surface of the dielectric substrate 12. It is electrically connected. Needless to say, the package ground substrate 11 may be formed of a metal plate.
[0039]
FIG. 5 is a diagram showing a mounting structure of the high-frequency circuit package according to the second embodiment, and shows a case where the high-frequency circuit package 10B of FIG. 5A is a side view of a mounted state, and FIG. 5B is a top view. In FIG. 5, reference numeral 35 denotes an opening provided in the printed circuit board 30 so as to correspond to the shape of the lid 13 in a top view, and 32 a denotes an opening. A signal conductor line extending to the end face of the opening 35, a power supply conductor 32b is also the power supply conductor, 38a is a via hole provided at the tip of the signal conductor wire 32a extending to the end face of the opening, and 38b is a power supply conductor wire 32b. Is a via hole provided at the front end of the device.
[0040]
The ground conductor 33 on the back surface of the printed circuit board in this example is provided such that the inner opening 35c matches the opening shape of the package ground electrode 14c when viewed from above. On the other hand, the signal conductor line 32a and the power supply conductor line 32b of the printed circuit board extend directly above the package signal terminal 14a and the power supply terminal 14b, respectively.
[0041]
The lid 13 of the high-frequency circuit package 10B is inserted into the opening 35 of the printed circuit board 30 from the back surface, and the ground electrode 14c on the upper surface of the package dielectric substrate 12 is bonded to the ground conductor 33 on the back surface of the printed circuit board by soldering or the like. Fix it. As shown in FIG. 5B, the connection of the signal to the signal terminal 14a is performed via a via hole 38a provided at the tip of the signal conductor 32a, and the connection of the power to the power terminal 14b is performed by a power conductor. This is performed via a via hole 38b provided at the end of the line 32b. When the thus obtained printed circuit board assembly is attached to the housing 50, the printed circuit board retainer 40 is used for the same purpose as described above. It goes without saying that a connection line 36 may be separately used instead of the connection via the via holes 38a and 38b.
[0042]
FIG. 6 is a diagram showing a mounting structure of a high-frequency circuit package according to the third embodiment, and shows a configuration having features regarding mounting of a conventional high-frequency circuit package. In the figure, reference numeral 10C denotes a high-frequency circuit package, and the ground substrate 11 and the dielectric substrate 12 of the package 10C usually have the same area. Reference numeral 35 denotes an opening provided for the printed board 30 so as to correspond to the shape of the package ground board 11 when viewed from above.
[0043]
The whole of the high-frequency circuit package 10C is fitted into the opening 35 from the back of the printed circuit board 30, and the ground conductor 33 on the back of the printed circuit board 30 is brought into contact with the peripheral side surface of the package ground board 11, and the space therebetween is soldered 39 or the like. Glue and fix. Further, the signal terminals 14a and the power supply terminals 14b on the upper surface of the package dielectric substrate 12 and the signal conductor lines 32a and the power supply conductor lines 32b on the upper surface of the printed circuit board are connected by connection lines 36, respectively, thus forming a printed circuit board assembly. .
[0044]
Further, each part of the package ground substrate 11 of this assembly and the ground conductor 33 on the back surface of the printed circuit board are brought into contact with the upper surface of the housing 50 and fixed. At this time, the portion of the printed board 30 around the package ground board 11 is fixed to the printed board presser 40 so that the ground conductor 33 on the back of the flexible printed board is in close contact with the housing 50 as close as possible around the package ground board 11. , And is fixed with screws or the like.
[0045]
At this time, it is possible to fill the heat conductive agent 41 with silicon grease or the like so as to fill the gap between the printed circuit board 30 and the housing 50 on the back surface and the periphery of the high-frequency circuit package 10C. Since the package ground substrate 11 of this example is tightly fixed to the ground conductor 33 on the back of the printed circuit board, the package ground substrate 11 and the housing 50 do not necessarily have to be electrically connected. The space between the housing 50 and the space between the printed circuit board 30 and the housing 50 near the high-frequency circuit package 10C as described above is filled with the heat conductive agent 41 to efficiently generate heat from the high-frequency circuit element. Can dissipate heat well.
[0046]
It is needless to say that the use of the heat conductive agent 41 can be applied to heat radiation of each part in the mounting structure according to the first and second embodiments.
[0047]
Further, in each of the above-described embodiments, a case is described in which the housing 50 is not provided with a recessed portion into which the portion of the package ground substrate 11 can be fitted, but the present invention is not limited to this. Obviously, if a recessed portion is provided in the housing 50 and a part of the high-frequency circuit package 10 is sunk here, the bending of the flexible printed circuit board 30 can be reduced, which further improves the high-frequency characteristics. Can be achieved.
[0048]
In addition, although a plurality of embodiments suitable for the present invention have been described, it goes without saying that various changes in the configuration and combination of each part can be made without departing from the spirit of the present invention.
[0049]
【The invention's effect】
As described above, according to the present invention, a high-frequency circuit package can be easily mounted on a printed circuit board and a housing, and good electrical characteristics can be obtained even at an ultra-high frequency exceeding, for example, 20 GHz.
[Brief description of the drawings]
FIG. 1 is a diagram showing a structure of a high-frequency circuit package according to a first embodiment.
FIG. 2 is a diagram (1) illustrating a mounting structure of the high-frequency circuit package according to the first embodiment;
FIG. 3 is a diagram (2) illustrating a mounting structure of the high-frequency circuit package according to the first embodiment;
FIG. 4 is a diagram illustrating a structure of a high-frequency circuit package according to a second embodiment.
FIG. 5 is a diagram showing a mounting structure of a high-frequency circuit package according to a second embodiment.
FIG. 6 is a diagram showing a mounting structure of a high-frequency circuit package according to a third embodiment.
FIG. 7 is a diagram (1) illustrating a conventional technique.
FIG. 8 is a diagram (2) illustrating a conventional technique.
[Explanation of symbols]
10 High frequency circuit package
11 Package ground board
12 Package dielectric substrate
13 Lid
14 Package terminals
15 High frequency circuit elements
16 Connection line
17c Via hole
30 Printed circuit board
31 Dielectric substrate
32a signal conductor wire
32b power supply conductor
33 Ground conductor
34a Tongue for signal conductor
34b Tongue for power conductor
35 opening
36 connection line
37 Ground contact surface
38 Via Hole
39 Soldering part
40 PCB holder
41 Thermal conductive agent
50 case

Claims (7)

パッケージグランド基板の上面に高周波回路素子と該素子に接続するための電極端子を有する誘電体基板とを備え、前記パッケージグランド基板の上面が前記誘電体基板よりも幅広に設けられていることを特徴とする高周波回路パッケージ。A high-frequency circuit element is provided on an upper surface of the package ground substrate, and a dielectric substrate having an electrode terminal for connecting to the element is provided. The upper surface of the package ground substrate is provided wider than the dielectric substrate. And high frequency circuit package. 請求項１記載の高周波回路パッケージにつき、そのパッケージグランド基板以外の部分を可撓性プリント基板の対応する開口部に嵌入し、前記パッケージグランド基板の上面と前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路パッケージの実装構造。2. The high-frequency circuit package according to claim 1, wherein a portion other than the package ground substrate is fitted into a corresponding opening of the flexible printed circuit board, and a ground conductor on the upper surface of the package ground substrate and on the rear surface of the printed circuit board around the opening. And a mounting structure for a high-frequency circuit package. パッケージグランド基板の上面に高周波回路素子と該素子に接続するための電極端子を有する誘電体基板とを備え、該誘電体基板の上面に信号用電極と、電源用電極と、これらの電極の周囲に展開するように設けられたグランド電極とを含み、該グランド電極が複数のバイアホールを介して前記パッケージグランド基板の上面に接合していることを特徴とする高周波回路パッケージ。A high-frequency circuit element on a top surface of the package ground substrate and a dielectric substrate having an electrode terminal for connecting to the element; a signal electrode, a power supply electrode, and a periphery of these electrodes on the top surface of the dielectric substrate; A high-frequency circuit package, comprising: a ground electrode provided so as to be unfolded on the upper surface of the package ground substrate via a plurality of via holes. パッケージグランド基板は、誘電体基板の上面に設けたメタライズ層からなることを特徴とする請求項１又は３記載の高周波回路パッケージ。4. The high-frequency circuit package according to claim 1, wherein the package ground substrate comprises a metallized layer provided on an upper surface of the dielectric substrate. 請求項３記載の高周波回路パッケージにつき、そのパッケージグランド基板及び誘電体基板以外の部分を可撓性プリント基板の対応する開口部に嵌入し、前記誘電体基板上面のグランド電極と、前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路パッケージの実装構造。4. The high-frequency circuit package according to claim 3, wherein a portion other than the package ground substrate and the dielectric substrate is fitted into a corresponding opening of the flexible printed circuit board, and a ground electrode on the upper surface of the dielectric substrate and the periphery of the opening. 3. A mounting structure for a high-frequency circuit package according to claim 1, wherein the grounding conductor is bonded to a back surface of the printed circuit board. パッケージ誘電体基板上面の電極端子と、可撓性プリント基板上面の開口部付近で導体線用に舌状に切り込まれた部分上の該導体線の先端部とを、該先端部に設けたバイアホールを介して接合したことを特徴とする請求項２記載の高周波回路パッケージの実装構造。An electrode terminal on the upper surface of the package dielectric substrate and a tip of the conductor wire on a portion cut in a tongue shape for the conductor wire near the opening on the upper surface of the flexible printed circuit board are provided at the tip. 3. The mounting structure for a high-frequency circuit package according to claim 2, wherein the mounting is performed via a via hole. パッケージグランド基板の上面に高周波回路素子と該素子に接続するための電極端子を有する誘電体基板とを備えた高周波回路パッケージにつき、そのパッケージグランド基板の部分を可撓性プリント基板の対応する開口部に嵌入し、前記パッケージグランド基板の周囲面と前記開口部周辺におけるプリント基板背面の接地導体とを接合したことを特徴とする高周波回路パッケージの実装構造。For a high-frequency circuit package including a high-frequency circuit element on a top surface of a package ground substrate and a dielectric substrate having an electrode terminal for connecting to the element, a portion of the package ground substrate corresponds to a corresponding opening of a flexible printed circuit board. Wherein a peripheral surface of the package ground substrate and a ground conductor on the back surface of the printed circuit board in the vicinity of the opening are joined to each other.
JP2003024474A 2003-01-31 2003-01-31 High frequency circuit package and its mounting structure Expired - Lifetime JP4388284B2 (en)

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JP2003024474A JP4388284B2 (en) 2003-01-31 2003-01-31 High frequency circuit package and its mounting structure
PCT/JP2003/016562 WO2004068580A1 (en) 2003-01-31 2003-12-24 High-frequency circuit package and mounting configuration thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248877A (en) * 2005-02-11 2012-12-13 Rambus Inc Semiconductor package having low speed and high speed signal paths

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* Cited by examiner, † Cited by third party
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JPH1154657A (en) * 1997-07-29 1999-02-26 Fujitsu Ltd Package structure of electronic circuit
JP3178452B2 (en) * 1999-02-24 2001-06-18 日本電気株式会社 Package for semiconductor device and its mounting structure
JP3500335B2 (en) * 1999-09-17 2004-02-23 株式会社東芝 High frequency circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248877A (en) * 2005-02-11 2012-12-13 Rambus Inc Semiconductor package having low speed and high speed signal paths

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