JPH1154657A - Package structure of electronic circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package structure of an electronic circuit that can be easily mounted on a device, that has superior high frequency characteristic and that ensures reliable connections of signal terminals within a small space. SOLUTION: This structure includes a package block 1 that can accommodate an electronic circuit, and a signal terminal 3 that is provided on a side surface of the block 1 and that electrically connects a main signal of the electronic circuit to external circuits. In this case, the terminal 3 is formed into a microstrip line structure, including a conductor strip 3a on the front surface and a dielectric body 4 on the back surface, and a through-hole 7 that passes the dielectric body 4 therethrough downward is connected to an end of the strip 3a, that is developed outside the block 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package structure of an electronic circuit, and more particularly, to a package block capable of accommodating an electronic circuit (such as a microwave circuit) and a package block provided on a side surface of the package block. The present invention relates to a package structure of an electronic circuit including a signal terminal for electrically connecting a signal to an external circuit.

[0002]

2. Description of the Related Art FIGS. 7 and 8 are diagrams (1) and (2) for explaining a conventional technology. 7A and 7B are diagrams illustrating an example of a conventional electronic module 101. FIG. 7A is a plan view of a module mounted state, FIG. 7B is a front view of the module, and FIG. 7C is a module mounted state. Each side view is shown.

In the figure, 1 is a package block for accommodating a microwave circuit, 2 is a cover member thereof, 3 is an RF (high frequency signal) terminal for connecting a main signal, and 4 is a dielectric made of glass, ceramic or the like. , 40 is an external printed circuit board, 41 is a conductor strip constituting a microstrip line, and 50 is a chassis (housing) made of Al or the like. The illustration of the power supply (bias) terminal of the module 101 is omitted.

[0004] The package block 1 is made of a molded product of oxygen-free copper, and its surface is plated with gold. Lid member 2
The same is true for The RF terminal 3 is made of a lead piece made of copper and is plated with gold. The package block 1 is surrounded by a dielectric 4 (insulated) and its tip is projected outside. It is fixed to. For this reason, this module 101 is also called a lead type module.

The dimensions of an example of the RF terminal 3 are as follows: the length of the portion protruding from the package block 1 is 4 mm or more, the width is 0.6 ± 0.15 mm, and the thickness is 0.05 to 0.2 m.
m. On the other hand, the conductor strip 41 of the external circuit sandwiches the intermediate dielectric substrate 40 and has a rear conductor (chassis 50).
) Constitute a microstrip line.

When mounting such an electronic module 101, the module 101 is screwed to the chassis 50 with the RF terminals 3 superimposed on the conductor strips 41, and the RF terminals 3 and the The conductor strip 41 is soldered. Since the RF terminal 3 made of a lead element is easily bent, it can be easily soldered even if there is a slight step between the RF terminal 3 and the conductor strip 41.

However, since the structure of the RF terminal 3 is not the same as the microstrip line structure of the external circuit, it has been difficult to obtain good impedance matching over an extremely wide band. However, because of the simple structure,
It is widely used in applications of up to around DC~12GH _Z. Further, since the RF terminal 3 has a structure in which soft lead pieces protrude outside the block, it is difficult to cascode-connect the RF terminals 3 of a plurality of modules. If a plurality of modules are cascode-connected, it is necessary to interpose the printed circuit board 40 in the middle, which requires a large mounting space.

FIG. 8 shows another conventional electronic module 10.
FIG. In this module 102, the power supply (bias) terminal 5 is shown. FIG.
The same or corresponding parts are denoted by the same reference numerals. However,
The RF terminal 3 has a metal (Cu,
A conductor strip made of Au plating or the like is deposited, and has a microstrip line structure together with a back conductor (such as the support surface of the package block 1).

When mounting such a module 102, the module 10 is placed in a state where the RF terminals 3 and the conductor strips of a printed circuit board (not shown) are aligned.
2 to the chassis 50, and a small piece of gold ribbon 6
The connection (soldering, crimping, etc.) between the RF terminal 3 and the external conductor strip is performed by using the method described above. This RF terminal 3
Since it has the same microstrip line structure and an external circuit, broadband (DC～26GH _Z vicinity) to over good impedance matching (e.g. 50 [Omega) is obtained.

[0010] Further, such an electronic module 102 includes:
For example, as shown in FIGS. 8C and 8D, the cascode connection between the plurality of modules 102 can be easily performed by using the small piece of the gold ribbon 6.

[0011]

However, according to the package structure shown in FIG. 8, if there is a step between the RF terminal 3 and the external printed circuit board (or the RF terminal of another module 102), the connection is made. The gold ribbon 6 is not stable,
The bonding work has been difficult. In particular, when a plurality of modules 102 are cascode-connected, a step is likely to occur at the connection portion due to a dimensional error of each package block 1 or a fine unevenness existing on a flat bottom surface, a chassis surface, or the like of the block 1. . Moreover, for example, FIG.
As shown in (C), if the back surface portion corresponding to the signal terminal 3 of the package block 1 floats from the surface of the chassis 50, it often adversely affects the high-frequency characteristics of the signal terminal 3.

When the plurality of modules 102 are cascode-connected, the gap between the RF terminals 3 becomes extremely narrow as shown in FIGS. 8C and 8D, so that a bonder tool or the like must be inserted. It became difficult, and mounting work became difficult. The present invention has been made in view of the above-described conventional technology, and has as its object to provide an electronic device that can be easily mounted on a device, has excellent high-frequency characteristics, and can reliably connect signal terminals in a small space. An object of the present invention is to provide a circuit package structure.

[0013]

The above-mentioned problem is solved, for example, by referring to FIG.
Is solved. That is, the package structure of the present invention (1) includes a package block 1 capable of housing an electronic circuit and a side surface of the package block 1 for electrically connecting a main signal of the electronic circuit to an external circuit. In a package structure of an electronic circuit including the signal terminal 3, the signal terminal 3 has a microstrip line structure including a conductor strip 3a on the front surface and a dielectric 4 on the back surface, and the conductor extending outside the package block 1. A through hole 7 penetrating the dielectric 4 downward is connected to the tip of the strip 3a.

According to the present invention (1), since the signal terminal 3 has a microstrip line structure, it has excellent high frequency characteristics. Further, since the through-hole 7 penetrating the dielectric 4 downward is connected to the tip of the conductor strip 3a extending outside the package block 1, the end face (lower surface) of the through-hole 7 is connected to the conductor strip 41 of the external circuit. Easy connection (crimping) on top. Moreover, this crimp is applied to the signal terminal 3
By applying pressure or ultrasonic vibration to the (through hole 7) by screwing or the like, it can be performed in a small space, so that a plurality of such electronic modules can be mounted at a high density.

As the ground conductor on the back of the signal terminal 3 having a microstrip line structure, the support surface of the package block 1 which is usually made of metal can be used, but the back surface of the dielectric 4 is in contact with the through hole 7. A metal film may be provided so as not to do so. Further, in the package structure of the present invention (2), in the package structure of the electronic circuit as the premise, for example, as shown in FIG. 2, the signal terminal 3 is formed by a coaxial line comprising a center conductor 8a, a dielectric 8b, and an outer conductor 8c. In addition to the above structure, the distal end portion of the coaxial cable (signal terminal 3) that extends to the outside of the package block is bent below the coaxial cable.

According to the present invention (2), since the signal terminal 3 has a coaxial structure, it is excellent in high frequency characteristics and noise resistance.
Further, since the distal end portion of the coaxial wire that extends to the outside of the package block 1 is bent in the vertical direction (downward) of the coaxial line, the center conductor 8a protruding from the end surface can be easily placed on the conductor strip 41 of the external circuit. (Such as crimping).
Moreover, this crimping is performed on the signal terminal 3 (that is, the center conductor 8a).
A plurality of electronic modules of this type can be mounted at a high density, because it can be performed in a small space by applying pressure by means of a screw or the like or applying ultrasonic vibration.

Further, according to the package structure of the present invention (3), in the package structure of the electronic circuit based on the above-mentioned premise, a conductor surrounded by a dielectric 4 is provided on at least one side wall of the package block 1 as shown in FIG. The signal terminals 3A / 3B of the strip 3a are buried, and the outer surface of the side wall is formed as a slope inclined in the height direction of the package block 1.

According to the present invention (3), the cascode connection can be easily performed by overlapping the slopes of the plurality of electronic modules 203A and 203B. In this case, the signal terminals 3 are connected to each other while having a coaxial structure, so that they have excellent high-frequency characteristics and noise resistance. Further, since the contact such as bonding the two slopes can be performed without taking up a space, a plurality of such electronic modules can be mounted at a high density.

Each electronic module 203A, 203
B may be a package structure having slopes parallel to both side walls as shown in the figure. For example, the left side of the electronic module 203A and the right side of the electronic module 203B may be provided with an external structure as shown in FIG. A signal terminal structure that can be easily connected to the printed board 40 may be used. In the package structure of the present invention (4), in the package structure of the electronic circuit on which the above is premised, as shown in FIG. 4, for example, as shown in FIG. The signal terminals 3A and 3B of the microstrip line structure including the first and second conductive strips 4 are provided so as to be symmetrical with respect to the both side walls and project so that the conductor strips 3a are turned upside down.

According to the present invention (4), the signal terminals 3A, 3A of the plurality of electronic modules 204A, 204B are used.
Cascode connection can be easily performed by overlapping B in a complementary manner. In this case, the signal terminals 3A and 3B are connected to each other while having a microstrip line structure, and thus have excellent high-frequency characteristics. In addition, since the contact such as overlapping the two signal terminals 3A and 3B can be performed without taking up space, a plurality of such electronic modules can be mounted at a high density.

As the back conductor of each signal terminal 3A, 3B having a microstrip line structure, the support surface of the package block 1, which is usually made of metal, can be used.
A metal film may be provided on the back surface of the dielectric 4. Further, for example, the left side surface of the electronic module 204A and the right side surface of the electronic module 204B may have a signal terminal structure that can be easily connected to the external printed circuit board 40 as shown in FIGS.

In the package structure of the present invention (5), the signal terminal 3 includes a conductor strip 3a on the front surface and a dielectric 4 on the back surface as shown in FIG. It has a microstrip line structure and the signal terminals 3 are provided so as to protrude from the side surfaces of the package block 1. According to the present invention (5), since the signal terminal 3 has a microstrip line structure, the signal terminal 3 is excellent in high frequency characteristics. Further, since the signal terminals 3 are provided so as to protrude from the side surfaces of the package block 1, connection with an external circuit can be easily and stably performed.

For example, a plurality of such electronic modules 2
The signal terminals 3A, 3B of the microstrip line structure 05A, 205B are abutted against each other in a line, and a connector 30 having the same microstrip line structure is brought into contact therewith.
By electrically connecting B, cascode connection can be easily performed. In this case, the signal terminals 3A and 3B and the connector 30 are connected to each other while having a microstrip line structure, and thus have excellent high-frequency characteristics. Further, since the contact such as bonding the connector 30 between the signal terminals 3A and 3B can be performed without taking up space, a plurality of such electronic modules can be mounted at a high density.

As the back conductor of each signal terminal 3A, 3B having a microstrip line structure, the support surface of the package block 1, which is usually made of metal, can be used.
A metal film may be provided on the back surface of the dielectric 4. Although the signal terminals 3A and 3B shown in the figure have the conductor strip 3a on the upper side, they may be configured on the lower side. The connection tool 30 in this case is placed between the connection tool 30 and the chassis 50.

Further, according to the package structure of the present invention (6), in the package structure of the electronic circuit based on the above premise, for example, as shown in FIG. Of the lead terminals 3 _{1 to} 3 _n (in the figure, n = 2), and the respective lead terminals 3 _{1 to} 3 _n
Are projected out of the package block 1.

According to the invention (6), the first signal terminals 3 are branched different n to the lead terminals 3 ₁ to 3 _n of stages of height, when the module implementation of desired height By cutting the other lead terminals while leaving the lead terminals, it can be easily connected to an external circuit of an arbitrary height. Preferably, in the present invention (7), the above-mentioned present invention (1) to (7)
In (6), for example, as shown in FIGS. 1 to 6, a concave groove 9 is provided on the bottom surface of the package block 1 in parallel with the side surface on which the signal terminal 3 is provided.

Therefore, even if there are minute irregularities on the surface of the chassis 50, the ground can be reliably taken on the lower surfaces of the input / output terminals of the package block 1, and the high-frequency characteristics of the signal terminals 3 can be more reliable. In addition, such a concave groove 9 is usually obtained by counterboring the bottom surface of the package block 1 or the like, but may be processed so that a signal terminal corresponding portion on the bottom surface of the block is projected (a plate or the like is attached). .

[0028]

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the same reference numerals indicate the same or corresponding parts throughout the drawings. FIG. 1 is a view for explaining a package structure according to the first embodiment.
The case where the F terminal is provided with a through hole for signal connection at the end thereof is shown.

In the figure, reference numeral 201 denotes an electronic module according to the first embodiment, 1 denotes a package block, 2 denotes a cover member, 3 denotes an RF (high frequency signal) terminal, 3a denotes a conductor strip thereof, 4 denotes glass or ceramic or the like. , A through hole, 9 a concave groove, 10 an internal substrate on which a microwave circuit is mounted, 40 an external printed circuit board,
1 is a conductor strip of an external circuit, 50 is a chassis (housing) made of Al or the like. The illustration of the power supply (bias) terminal 5 of the electronic module is omitted.

The package block 1 is made of, for example, a molded product of oxygen-free copper, and its surface is plated with gold. The same applies to the lid member 2. The RF terminal 3 has a microstrip line structure including a conductor strip 3a on the front surface and a dielectric 4 on the back surface. The contact surface between the dielectric 4 and the package block 1 can be used as the back conductor of the microstrip line structure. Preferably, a metal film is formed on the lower surface of the dielectric 4 and the metal film is formed on the support surface of the package block 1. Make contact. However, it goes without saying that the back conductor is provided so as not to contact the through hole 7 and the conductor strip 41 of the substrate 40.

The conductor strip 3a of the RF terminal 3 and the internal substrate 10 are connected by wire bonding or the like. On the other hand, a through hole 7 (e.g., diameter = 0.2 mm) penetrating the dielectric 4 downward is provided at the tip of the conductor strip 3a that extends to the outside of the package block 1. The lower end of the through hole 7 slightly protrudes from the lower surface of the dielectric 4, and its end face is plated with, for example, gold. On the other hand, the surface of the outer conductor strip 41 is also plated with gold.

At the time of mounting such a module 201, the through holes 7 of the respective RF terminals 3 are superimposed on the respective conductor strips 41 (for example, 0.36 mm in width), and these are crimped. The dimensional tolerance of the package block 1 is ±
Since the thickness is about 0.1 to ± 0.05 mm, each through hole 7 is securely pressed onto each conductor strip 41. In this case, by allowing the holes in the screwing portions to have play, the positioning can be easily performed. After this crimping, the module 201 is screwed.

On the lower surface of the package block 1, a concave groove 9 is provided in parallel with the side wall on which the signal terminal 3 is provided. For this reason, when the package block 1 is screwed, the force concentrates on the lower surface of the block where each signal terminal 3 exists. Therefore, each signal terminal 3 is not affected by delicate irregularities on the surface of the chassis 50 or variations in module mounting work.
A reliable ground contact is obtained at the lower part of the device, and sufficient high-frequency characteristics are obtained.

In the first embodiment, DC to 1
When used near 0GH _Z, increase of loss from the nominal value is obtained has the following characteristics 0.02 dB. FIG. 2 is a view for explaining a package structure according to a second embodiment.
The figure shows a case where the terminal is made of a pipe cable having a coaxial cable structure. In the figure, reference numeral 202 denotes an electronic module according to the second embodiment.

The RF terminal 3 has a coaxial line structure (pipe cable) composed of a center conductor 8a, an intermediate dielectric 8b, and an outer conductor 8c. Are bent downward. The outer conductor 8c is brazed to the support surface (earth) of the package block 1, and a required characteristic impedance (for example, 50Ω) as a coaxial line is obtained. The end of the center conductor 8a bent downward projects slightly beyond the end face of the pipe cable, and the center conductor 8a is plated with gold. On the other hand, the surface of the outer conductor strip 41 is also plated with gold.

At the time of mounting such a module 202, the respective center conductors 8a of the respective RF terminals 3 are superimposed on the respective conductor strips 41 and these are crimped. At this time, the tip of each central conductor 8a has sufficient contact on each conductor strip 41 due to the flexibility of the pipe cable. After this crimping, the module 202 is screwed.
In this second embodiment, sufficient connection characteristics when used in the vicinity DC～12GH _Z was obtained.

FIG. 3 is a view for explaining a package structure according to the third embodiment, in which the signal terminal surface of the package block 1 is formed on a slope. In the figure, reference numeral 203 denotes an electronic module according to the third embodiment. The signal terminals 3A / 3B are formed by embedding a conductor strip 3a surrounded by a dielectric 4 in a side wall of the package block 1 and forming an outer surface of the side wall on a slope inclined in the height direction of the package block 1. Have been.

Preferably, a metal (gold-plated) plate piece 11 is provided at the tip of the conductor strip 3a as shown in the figure.
Is provided in parallel with the slope and slightly protruding from the slope. In this way, regardless of the dimensional error between modules,
Sufficient contact between the respective flat plate pieces 11 is obtained. Alternatively, if the conductor strip 3a itself is made thick, the area of the slope is large, so that a contact surface having a sufficient area can be obtained without providing the flat plate piece 11.

By the way, the conductor strip 3a of this example
Is a package block 1 surrounded by a dielectric 4
Can be considered as a kind of coaxial (pipe) cable. If the cross section of the dielectric 4 is provided horizontally long, it can be considered as a kind of microstrip line. Either of the above,
A connection structure that is robust and has excellent high-frequency characteristics and noise resistance can be obtained.

A plurality of such electronic modules 203A,
The cascode connection can be easily performed by overlapping the slopes of 203B. At the time of the cascode connection, each RF terminal 3A of the module 203B is superimposed on each RF terminal 3B of the module 203A already positioned, and the module 203B is screwed. Electronic module 203
When both sides of the signal input / output are formed on parallel inclined surfaces as in A and 203B, a large number of electronic modules can be cascode-connected in the same manner as described above. The left side surface of the electronic module 203A and the right side surface of the electronic module 203B may have a signal terminal structure that can be easily connected to the external printed circuit board 40 as shown in FIG.

FIG. 4 is a view for explaining the package structure according to the fourth embodiment. Each signal terminal 3 having a microstrip line structure is provided on the opposing side surfaces of the package block 1 so as to project upside down. Shows the case where In the figure, reference numeral 204 denotes an electronic module according to the fourth embodiment. Each RF terminal 3 has a microstrip line structure including a conductor strip 3a on the front surface and a dielectric 4 on the back surface, and the RF terminal 3A on one side of the package block 1 has the conductor strip 3a facing upward and the other side. The RF terminals 3B on the side surfaces are provided such that the conductor strips 3a face downward. In this case, the conductor strips 3a are provided so that the positions (such as heights) of the conductor strips 3a are the same. Each signal terminal 3
Although the support surface of the package block 1 can be used as the back conductor of A and 3B, a metal film may be provided on the back surface of the dielectric 4.

A plurality of such electronic modules 204A,
By overlapping the RF terminal 3A and the RF terminal 3B of 204B, cascode connection can be easily performed. When the cascode is connected, the already positioned module 204B
RF terminal 3 of module 204A on RF terminal 3A of
B is overlapped, and the module 204A is screwed.

If there is a possibility that contact failure may occur between the RF terminals 3A and 3B due to dimensional errors of the modules 204A and 204B and minute irregularities on the surface of the chassis 50, etc. It is possible to sandwich a flexible gold ribbon 6 or the like. There are abundant gold ribbons and gold blocks with a thickness of 10 μm, which can be arbitrarily selected.

FIG. 5 is a view for explaining a package structure according to the fifth embodiment, in which a signal terminal 3 having a microstrip line structure is provided so as to protrude from the side surface of the package block 1. In the figure, 205
Is an electronic module according to the fifth embodiment. RF
The terminals 3A and 3B have a microstrip line structure including a conductor strip 3a on the front surface and a dielectric 4 on the back surface. In this example, the arrangement of the RF terminals 3A and 3B on the opposing side surfaces of the package block 1 is symmetric. It is provided as follows. As the back conductor of each signal terminal 3A, 3B, the support surface of the package block 1 can be used.
A metal film may be provided on the back surface of the dielectric 4.

A plurality of such electronic modules 205A,
The cascode connection can be easily performed by abutting the RF terminal 3A and the RF terminal 3B of 205B. When the cascode is connected, the already positioned module 205B
The module 205A is screwed by abutting the tip of the RF terminal 3B of the module 205A against the tip of the RF terminal 3A. Further, a connecting member 30 to be described later is bridged between the two RF terminals 3A and 3B, and the connecting member 30 is
It is screwed to the chassis 50 via 0A.

FIG. 5D is a perspective view of the connection tool 30.
The connector 30 has a microstrip line structure including a conductor strip 3a on the front surface and a dielectric 4 on the back surface, and these are fixed by a metal block 31 (back conductor). In use, the conductor strips 3a of the connector 30 are superimposed on the mating portions of the RF terminals 3A and 3B to obtain electrical contact therebetween.

In place of the block 31 made of metal, the support substrate 40A is made of metal (ie, the RF terminal 3).
A, 3B). FIG. 6 shows the sixth
1A and 1B are diagrams illustrating a package structure according to an embodiment.
Is divided into n-stage lead terminals having different heights, and these are projected outside the package block. In the figure, reference numeral 206 denotes an electronic module according to the sixth embodiment.

The RF terminals 3A / 3B are composed of n stages of lead terminals 3 _{1 having} different heights with one signal terminal sandwiching the dielectric 4 therebetween.
３3 _n (where n = 2 in the figure), and a structure is provided in which these are projected outside the package block 1. At the time of mounting such an electronic module 206, external terminals of various heights (printed circuit boards, other modules, etc.) are cut by cutting the other lead terminals while leaving the lead terminals of a required height. And can be easily connected.

For example, the RF terminal 3A of the module 206
For, for example, to connect to an external printed circuit board 40 is utilized to cut the higher lead terminals 3 ₁ of the lead terminals 3 ₂ having a lower remaining connection between the conductor strip 41. With respect to the RF terminal 3B, for example, conductor strips 3a of Figure to 5 Type of connection of the electronic module 205 and cascode, lower lead terminals 3 ₂ rest of higher lead terminals 3 ₁ module 205 cuts the Use to connect with

Therefore, unlike the related art, it is not necessary to cut the chassis (housing) 50 one by one and adjust the height of the signal terminals, and the processing and mounting costs of the housing are greatly reduced. In each of the above embodiments, an example of application to a microwave circuit has been described. However, the present invention can be applied to a package structure of any electronic circuit that requires high frequency characteristics for input / output signals.

Although a plurality of preferred embodiments of the present invention have been described, it is to be understood that various changes can be made in the shape and structure of each part and combinations thereof without departing from the spirit of the present invention. Not even.

[0052]

As described above, according to the present invention, since the main signal terminal structure of the electronic module is improved, the labor for connecting the printed circuit boards or the modules is greatly reduced, and the module is removed. Can be easily performed. Also, the mounting space for the module can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a package structure according to a first embodiment.

FIG. 2 is a diagram illustrating a package structure according to a second embodiment.

FIG. 3 is a diagram illustrating a package structure according to a third embodiment.

FIG. 4 is a diagram illustrating a package structure according to a fourth embodiment.

FIG. 5 is a diagram illustrating a package structure according to a fifth embodiment.

FIG. 6 is a diagram illustrating a package structure according to a sixth embodiment.

FIG. 7 is a diagram (1) for explaining a conventional technique;

FIG. 8 is a diagram (2) illustrating a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package block 2 Lid member 3 RF terminal 3a Conductive strip 4 Dielectric 5 Power supply (bias) terminal 6 Gold ribbon 7 Through hole 8a Center conductor 8b Dielectric 8c External conductor 9 Depression groove 10 Internal substrate 11 Flat plate element 30 Connector 31 Metal Block 40 Printed Circuit Board 41 Conductor Strip 50 Chassis (Housing) 101, 102, 201-206 Electronic Module

Claims (7)

[Claims] An electronic circuit package, comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. In the structure, the signal terminal has a microstrip line structure including a conductor strip on the front surface and a dielectric on the back surface, and a through hole penetrating the dielectric downward at a tip end of the conductor strip extending outside the package block. Is connected to the package structure. 2. A package for an electronic circuit, comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. In the structure, the signal terminal has a coaxial line structure including a center conductor, a dielectric, and an outer conductor, and a distal end portion of the coaxial line extending outside the package block is bent below the coaxial line. Characterized by the package structure. 3. A package of an electronic circuit, comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. In the structure, a signal terminal of a conductor strip surrounded by a dielectric is buried in at least one side wall of the package block, and an outer surface of the side wall is formed as a slope inclined in a height direction of the package block. A package structure characterized by the following. 4. An electronic circuit package, comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. In the structure, signal terminals of a microstrip line structure including a conductor strip on the front surface and a dielectric on the back surface are provided on opposite side walls of the package block, and the respective conductor strips are symmetrically positioned on the both side walls and the conductor strips are turned upside down. A package structure characterized by being provided so as to protrude so as to face each other. 5. An electronic circuit package comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. In the structure, the signal terminal may have a microstrip line structure including a conductor strip on a front surface and a dielectric on a rear surface, and the signal terminal may be provided to protrude from a side surface of the package block. 6. An electronic circuit package, comprising: a package block capable of housing an electronic circuit; and a signal terminal provided on a side surface of the package block for electrically connecting a main signal of the electronic circuit to an external circuit. A package structure, wherein one signal terminal is branched into n-stage lead terminals having different heights with a dielectric material interposed therebetween, and each lead terminal is projected outside a package block. 7. The package structure according to claim 1, wherein a concave groove is provided on a bottom surface of the package block in parallel with a side surface on which a signal terminal is provided.