JPH0425721B2 - - Google Patents
Info
- Publication number
- JPH0425721B2 JPH0425721B2 JP57221146A JP22114682A JPH0425721B2 JP H0425721 B2 JPH0425721 B2 JP H0425721B2 JP 57221146 A JP57221146 A JP 57221146A JP 22114682 A JP22114682 A JP 22114682A JP H0425721 B2 JPH0425721 B2 JP H0425721B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- integrated circuit
- circuit boards
- metal carrier
- millimeter wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は誘電体基板にマイクロ波ミリ波伝送線
路あるいはマイクロ波ミリ波回路を構成する複数
のマイクロ波ミリ波集積回路基板を同一平面のメ
タルキヤリヤ上に接合搭載してなるマイクロ波ミ
リ波集積回路に関し、特にマイクロ波ミリ波集積
回路基板の接続方法の改良に関す。[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a dielectric substrate having a plurality of microwave and millimeter wave integrated circuit boards constituting a microwave and millimeter wave transmission line or a microwave and millimeter wave circuit on a metal carrier on the same plane. This invention relates to microwave and millimeter-wave integrated circuits that are bonded and mounted on microwave and millimeter-wave integrated circuit boards, and in particular to improvements in connection methods for microwave and millimeter-wave integrated circuit boards.
(b) 従来技術と問題点
一般に、誘電体基板にマイクロ波ミリ波伝送線
路あるいはマイクロ波ミリ波回路を構成するマイ
クロ波ミリ波集積回路基板を複数ケ接続して回路
を構成する場合、その接続点の結合は単なる直流
的接続でなくマイクロ波ミリ波の伝送特性に適合
した接続でなければならない。(b) Prior art and problems In general, when a circuit is constructed by connecting multiple microwave and millimeter wave transmission lines or microwave and millimeter wave integrated circuit boards constituting a microwave and millimeter wave circuit to a dielectric substrate, the connection The point connections must be not just direct current connections but connections that are compatible with the transmission characteristics of microwaves and millimeter waves.
第１図は従来例の複数個のマイクロ波ミリ波集
積回路の接続を示す。 FIG. 1 shows the connection of a plurality of conventional microwave and millimeter wave integrated circuits.
同図に示す如く、メタルキヤリヤ１上に接合搭
載されたマイクロ波集積回路２，２′の伝送線路
３，３′の接続は伝送線路パターン間を導体リボ
ン４で接続して行つているが、誘電体基板５，
５′の裏面にあるアース導体６，６′の接続はマイ
クロ波集積回路基板２，２′をメタルキヤリヤ１
に接合する導電性接合材７，７′例えば半田、導
電性接着材を介し、メタルキヤリヤ１で接続され
ている。 As shown in the figure, the transmission lines 3 and 3' of the microwave integrated circuits 2 and 2' bonded and mounted on the metal carrier 1 are connected by connecting the transmission line patterns with a conductor ribbon 4. body substrate 5,
The ground conductors 6, 6' on the back side of the microwave integrated circuit boards 2, 2' are connected to the metal carrier 1.
They are connected by the metal carrier 1 through a conductive bonding material 7, 7' such as solder or a conductive adhesive.
マイクロ波集積回路基板２，２′をメタルキヤ
リヤ１に接合搭載する場合、第２図のマイクロ波
集積回路基板２，２′の接続部拡大図に示す如く
マイクロ波集積回路基板２，２′側に接合材を塗
布してメタルキヤリヤ１を接合する場合接合材
７，７′の凝縮によりマイクロ波集積回路２，
２′の接続部端面にアース導体６，６′とメタルキ
ヤリヤ１との間隙２１，２１′が出来る。またメ
タルキヤリヤ１側に接合材を塗布あるいはシート
を設けてメタルキヤリヤと接合する場合、接合材
７，７′がマイクロ波集積回路基板２，２′の接続
部間隙に第３図に示す如く盛り上り３１を形成
し、アース部に不連続部が形成される。 When the microwave integrated circuit boards 2, 2' are bonded and mounted on the metal carrier 1, the microwave integrated circuit boards 2, 2' are mounted on the microwave integrated circuit boards 2, 2' side as shown in the enlarged view of the connection part of the microwave integrated circuit boards 2, 2' in FIG. When applying a bonding material to bond the metal carrier 1, the condensation of the bonding material 7, 7' causes the microwave integrated circuits 2,
A gap 21, 21' is formed between the ground conductor 6, 6' and the metal carrier 1 at the end face of the connection part 2'. Furthermore, when a bonding material is applied or a sheet is provided on the metal carrier 1 side and the metal carrier is bonded to the metal carrier, the bonding material 7, 7' is applied to the gap between the connecting portions of the microwave integrated circuit boards 2, 2' as a bulge 31 as shown in FIG. , and a discontinuous portion is formed in the ground portion.
また接合材７，７′は半田、導電接着材から構
成されるといつてもマイクロ波集積回路基板２，
２′のアース導体６，６′を構成する薄膜あるいは
厚膜材料及び接続導体リボン４等に使用される純
金と比較すると、抵抗が大きい等の理由により特
に高度の整合特性を必要とする準ミリ、ミリ波集
積回路の伝送特性への影響が大きく、伝送線路接
続リボンの形状あるいは接合部周辺回路に種々の
工夫を行つているが、接合部の形態の製造、組立
の際の誤差により必然的に発生するので、定量的
でなく、従来の方法では充分な調整をなくし得な
い。そのため、複数個の集積回路の接続に際し整
合特性の良い接続方法が行える構造を有する集積
回路が要望される。 Furthermore, the bonding materials 7 and 7' are composed of solder and conductive adhesive.
Compared to pure gold used for the thin film or thick film materials constituting the ground conductors 6, 6' of 2' and the connecting conductor ribbon 4, sub-millimeter metals require particularly high matching characteristics due to their high resistance. , which has a large effect on the transmission characteristics of millimeter-wave integrated circuits, and various improvements have been made to the shape of the transmission line connection ribbon or the circuits surrounding the joint, but due to errors in manufacturing and assembly of the shape of the joint, Since it occurs in a large amount of time, it is not quantitative, and conventional methods cannot eliminate sufficient adjustment. Therefore, there is a need for an integrated circuit having a structure that allows a connection method with good matching characteristics when connecting a plurality of integrated circuits.
(c) 発明の目的
本発明は上記問題点を解決するため、集積回路
基板の接続部の下部位置に逃げ穴を設けて該基板
のアース部を導電性材料で接合する新規なマイク
ロ波ミリ波集積回路の構造を提供することを目的
とする。(c) Purpose of the Invention In order to solve the above-mentioned problems, the present invention provides a novel microwave and millimeter wave system in which an escape hole is provided at the lower part of the connection part of an integrated circuit board and the ground part of the board is bonded with a conductive material. The purpose is to provide the structure of integrated circuits.
(d) 発明の構成
誘電体基板にマイクロストリツプライン構成の
伝送線路及びマイクロ波ミリ波回路を形成してな
る複数のマイクロ波集積回路基板を、同一平面の
メタルキヤリヤにアース導体面を接合、搭載し配
置接続するマイクロ波ミリ波集積回路において、
前記メタルキヤリヤのマイクロ波集積回路基板の
接続部の下部位置に貫通する逃げ穴を有し、逃げ
穴より接合したマイクロ波集積回路基板のアース
導体を導電性部材にて接合することにより達成さ
れる。(d) Structure of the invention A plurality of microwave integrated circuit boards each having a microstrip line configuration transmission line and a microwave millimeter wave circuit formed on a dielectric substrate are mounted by bonding the ground conductor surface to a metal carrier on the same plane. In microwave and millimeter wave integrated circuits that are arranged and connected,
This is achieved by having an escape hole penetrating the metal carrier at a lower position of the connecting portion of the microwave integrated circuit board, and joining the ground conductor of the microwave integrated circuit board connected through the escape hole with a conductive member.
(e) 発明の実施例 以下本発明を図面に基づいて説明する。(e) Examples of the invention The present invention will be explained below based on the drawings.
第４図は本発明実施例要部の断面図であり、第
５図は分解斜視図である。 FIG. 4 is a sectional view of essential parts of an embodiment of the present invention, and FIG. 5 is an exploded perspective view.
第４図において１〜７，２′，３′，５′，６′，
７′、は第１図と同一機能を有する同一部材を示
す。 In Figure 4, 1 to 7, 2', 3', 5', 6',
7' indicates the same member having the same function as in FIG.
第４図において、マイクロ波集積回路基板２，
２′が接続される部分のメタルキヤリヤ１には逃
げ穴８を設け、メタルキヤリヤ１にマイクロ波集
積回路基板２，２′を接合材７，７′で搭載接合を
行う。この際、第３図で示すような接合材７，
７′の盛り上り３１はマイクロ波集積回路基板２，
２′の伝送線路３，３′の接合部には生じない。こ
の状態でメタルキヤリヤ１の逃げ穴８からマイク
ロ波集積回路基板２，２′の接続部のアース導体
６，６′にアース導体接続シート９をボンデング
等で接合することにより伝送線路３，３′を接続
する導体リボン４と同一レベルの接合を得ること
が出来る。其れ故第２図に示した接合材７，７′
の凝縮になる間隙２１，２１′も伝送線路３，
３′の接続整合特性に何等影響を与えない。また
マイクロ波集積回路基板２，２′のアース導体６，
６′と同一平面のアース導体接続シート９で接続
できるため、マイクロ波集積回路基板２，２′の
接続整合特性が改良される。 In FIG. 4, the microwave integrated circuit board 2,
An escape hole 8 is provided in the metal carrier 1 at the portion where the metal carrier 2' is connected, and the microwave integrated circuit boards 2 and 2' are mounted and bonded to the metal carrier 1 using bonding materials 7 and 7'. At this time, the bonding material 7 as shown in FIG.
The bulge 31 at 7' is the microwave integrated circuit board 2,
This does not occur at the junction between the transmission lines 3 and 3' of 2'. In this state, the transmission lines 3, 3' are connected by bonding the ground conductor connection sheet 9 from the escape hole 8 of the metal carrier 1 to the ground conductors 6, 6' at the connection parts of the microwave integrated circuit boards 2, 2'. It is possible to obtain the same level of bonding as the conductor ribbon 4 to be connected. Therefore, the bonding materials 7, 7' shown in FIG.
The gaps 21, 21' where condensation occurs also in the transmission lines 3,
3' connection matching characteristics are not affected in any way. Also, the ground conductor 6 of the microwave integrated circuit board 2, 2',
Since the connection can be made using the ground conductor connection sheet 9 which is on the same plane as the microwave integrated circuit boards 2 and 6', the connection matching characteristics of the microwave integrated circuit boards 2 and 2' are improved.
第６図は本発明の他の実施例を示す。同図はア
ース導体接続シート９をボンデング接合でなく、
機械的に接合させるものを示す。同図において１
０はアース導体接続シート９を押えるためのかん
しよう部材である。これは押えネジ１１の回転負
荷が直接、アース導体接続シート９に加わらない
ように考慮されている。１２は押えネジ１１が嵌
合すメネジ部で、この構成により伝送線路３，
３′の接合特性が正常のものになる。 FIG. 6 shows another embodiment of the invention. In the figure, the earth conductor connection sheet 9 is not bonded.
Indicates something to be joined mechanically. In the same figure, 1
0 is a support member for pressing down the ground conductor connection sheet 9. This is designed to prevent the rotational load of the cap screw 11 from being applied directly to the ground conductor connection sheet 9. Reference numeral 12 denotes a female screw portion into which the cap screw 11 is fitted, and with this configuration, the transmission line 3,
The bonding characteristics of 3' become normal.
(f) 発明の効果
以上説明した如く、本発明によれば、複数のマ
イクロ波集積回路を接続しても伝送特性を損うこ
とがないので複数のマイクロ波集積回路を接続し
て所望のマイクロ波ミリ波集積回路が実現できる
利点を有する。(f) Effects of the Invention As explained above, according to the present invention, the transmission characteristics are not impaired even when a plurality of microwave integrated circuits are connected, so that a desired microwave can be obtained by connecting a plurality of microwave integrated circuits. It has the advantage that wave millimeter wave integrated circuits can be realized.
第１図、第２図、第３図は従来例の複数のマイ
クロ波ミリ波集積回路の接続の説明図、第４図は
本発明の実施例、第５図は第４図の要部斜視図、
第６図は本発明の他の実施例を示す。
図中、１はメタルキヤリヤ、２，２′はマイク
ロ波集積回路基板、３，３′は伝送線路、４は伝
送線路接続用導体リボン、５，５′は誘電体基板、
６，６′はアース導体、７，７′は接合材、８はメ
タルキヤリヤの逃げ穴、９はアース導体接続シー
ト、１０は接続シート９を押えるかんしよう部
材、１１は押えネジ、１２はメネジ部、２１，２
１′は間隙、３１は盛り上りを示す。
Figures 1, 2, and 3 are explanatory diagrams of the connection of multiple microwave and millimeter wave integrated circuits in the conventional example, Figure 4 is an embodiment of the present invention, and Figure 5 is a perspective view of the main part of Figure 4. figure,
FIG. 6 shows another embodiment of the invention. In the figure, 1 is a metal carrier, 2 and 2' are microwave integrated circuit boards, 3 and 3' are transmission lines, 4 is a conductor ribbon for connecting the transmission line, 5 and 5' are dielectric substrates,
6 and 6' are ground conductors, 7 and 7' are bonding materials, 8 is an escape hole in the metal carrier, 9 is a ground conductor connection sheet, 10 is a support member that holds down the connection sheet 9, 11 is a retaining screw, and 12 is a female screw part ,21,2
1' indicates a gap, and 31 indicates a swell.
Claims (1)
イン構成の伝送線路３，３′及びマイクロ波ミリ
波回路を形成してなる複数のマイクロ波集積回路
基板２，２′を、同一平面のメタルキヤリヤ１に
アース導体６，６′面を接合、搭載し配置接続す
るマイクロ波ミリ波集積回路において、 前記メタルキヤリヤ１のマイクロ波集積回路基
板２，２′の接続部の下部位置に貫通する逃げ穴
８を有し、該逃げ穴８より接合した該マイクロ波
集積回路基板２，２′のアース導体６，６′を導電
性部材９にて接合することを特徴としたマイクロ
波ミリ波集積回路の構造。[Claims] 1. A plurality of microwave integrated circuit boards 2, 2' each having a microstrip line configuration transmission line 3, 3' and a microwave millimeter wave circuit formed on a dielectric substrate 5, 5'. , in a microwave and millimeter wave integrated circuit in which ground conductors 6 and 6' surfaces are bonded, mounted, and arranged and connected to a metal carrier 1 on the same plane, at a lower position of the connecting portion of the microwave integrated circuit boards 2 and 2' of the metal carrier 1. A microwave miller characterized in that it has an escape hole 8 passing through it, and the ground conductors 6, 6' of the microwave integrated circuit boards 2, 2' connected through the escape hole 8 are connected with a conductive member 9. Structure of wave integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22114682A JPS59111401A (en) | 1982-12-17 | 1982-12-17 | Construction of microwave and millimeter wave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22114682A JPS59111401A (en) | 1982-12-17 | 1982-12-17 | Construction of microwave and millimeter wave integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59111401A JPS59111401A (en) | 1984-06-27 |
| JPH0425721B2 true JPH0425721B2 (en) | 1992-05-01 |
Family
ID=16762182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22114682A Granted JPS59111401A (en) | 1982-12-17 | 1982-12-17 | Construction of microwave and millimeter wave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59111401A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69107082T2 (en) * | 1991-11-16 | 1995-05-24 | Hewlett Packard Gmbh | A connector assembly for detachable connection between two conductor strips. |
| EP1180918B1 (en) | 2000-08-16 | 2010-01-27 | Ericsson AB | Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6110321Y2 (en) * | 1980-11-17 | 1986-04-03 |
-
1982
- 1982-12-17 JP JP22114682A patent/JPS59111401A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59111401A (en) | 1984-06-27 |
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