JPH0374521B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a method of bonding a microwave and millimeter wave integrated circuit board constituting a microwave and millimeter wave transmission line or a microwave and millimeter wave circuit onto individual metal carriers on a dielectric substrate. The present invention relates to a microwave and millimeter wave circuit module in which a plurality of microwave and millimeter wave integrated circuits are mounted on a plane base, and particularly relates to improvements in the connection method of each microwave integrated circuit.

(b) Prior art and problems In general, when a circuit is constructed by connecting multiple microwave and millimeter wave transmission lines or microwave and millimeter wave integrated circuit boards constituting a microwave and millimeter wave circuit to a dielectric substrate, the connection The point connections must be not just direct current connections but connections that are compatible with the transmission characteristics of microwaves and millimeter waves.

FIG. 1 shows the connection of a plurality of conventional microwave and millimeter wave integrated circuits.

As shown in the figure, the transmission line patterns of microwave integrated circuits 2, 2' mounted on metal carriers 1, 1' are connected by a conductor ribbon 4, and dielectric substrates 5, 5' The groove 7 formed by the gap between the microwave integrated circuit connections and the thickness of the metal carriers 1, 1' creates a large discontinuity, especially in the ground area, and the transmission line is discontinuous. This results in matching and the transmission characteristics deteriorate. To this end, various improvements have been made to the shape of the transmission line connection ribbon and the circuits surrounding the joint.
Gaps in microwave integrated circuits are inevitably generated due to manufacturing and assembly errors and are not constant, making it impossible to obtain sufficient matching characteristics using conventional methods. Furthermore, for quasi-millimeter and millimeter-wave integrated circuits that require even higher matching characteristics, this is a factor that prevents the use of metal carrier systems, which are excellent for testing, adjusting, assembling, and maintaining integrated circuits.

Therefore, there is a need for a connection method with good matching characteristics when connecting a plurality of integrated circuits.

(c) Purpose of the Invention In order to solve the above-mentioned problems, the present invention provides a microwave/millimeter wave integrated circuit in which a transmission line or circuit is formed on a dielectric substrate, and the substrate is bonded and mounted on a metal carrier. When a plurality of integrated circuits are arranged and connected on the same plane base, a part of the metal carrier at the bottom of the part where the integrated circuit is connected is provided with a recess from the end surface to the ground conductor on the bottom surface of the connection of both integrated circuits to be connected. A method of connecting integrated circuits that reduces discontinuities in the ground plane caused by gaps in integrated circuit connections, particularly grooves formed in the thickness of the metal carrier, by providing and mounting the conductive material to be connected so that it fits into the recesses of both metal carriers. The purpose is to provide

(d) Structure of the Invention According to the present invention, the object is to: (1) produce a plurality of microwave and millimeter wave integrated circuits formed by forming a transmission line or circuit on a dielectric substrate and bonding and mounting the substrate on a metal carrier; In a microwave and millimeter wave circuit module in which two integrated circuits are arranged and connected on the same plane base, a part of the metal carrier where the integrated circuit is connected is provided with a recess from the end surface, and both integrated circuits to be connected are provided with a recess. A conductive block that spans over and fits into the recessed portion of the metal carrier is provided so as to contact the ground plane on the lower surface of the connection of both integrated circuits.

(2) In the above-mentioned mounting structure of the microwave and millimeter wave integrated circuit, this is achieved by making the block that connects the ground plane of the integrated circuit to be connected by using a conductive material and a conductive elastic material on the ground plane side. .

(e) Examples of the invention The present invention will be explained below with reference to the drawings. FIG. 2 is a perspective view of the main part of the embodiment of the present invention, and FIG.
A sectional view of the main part of the figure is shown. In FIGS. 2 and 3, numerals 1 to 8 and 1' to 6' indicate the same members having the same functions as those in FIG. 1. and microwave integrated circuit 2,
2' are mounted on metal carriers 1 and 1' respectively,
Furthermore, it is mounted on a base 8.

In this embodiment, the microwave integrated circuit 2,
A recessed portion 9, 9' is provided in a part of the metal carrier 1, 1' where the metal carrier 2' is connected, and the recessed portion 9,
9', and conductive sheet 1 is fitted on the upper surface.
1. For example; as a material with good contact and conductivity, a soft pure gold sheet, an indium sheet, etc. is used, and an elastic material block 10 is made of, for example, silicone rubber, in order to improve the contact between the conductive sheet and the ground surface. , integrated circuits 2, 2' as shown in FIG.
The conductive sheet 11 and the elastic material block 10 are mounted so as to fit into the recesses 9 and 9', and the conductive ribbon 4 is connected. Therefore, since the ground conductors 6, 6' are connected in the same plane by the conductive sheet 11, the discontinuity in the thickness direction of the metal carriers 1, 1' is eliminated, and the connection part of the microwave integrated circuits 2, 2' is Mismatch is reduced and transmission characteristics are improved. It should be noted that the connection block 10 need not be made of an elastic material, but can be sufficiently satisfied if it is made of a conductive sheet 11 or a conductive soft material. Further, the conductive sheet and the elastic material block 10 may be made of an integrated material without being separated.

(f) Effects of the Invention As explained above, in the present invention, the transmission characteristics of the transmission line or circuit are not impaired when a plurality of integrated circuits are connected, so that a desired circuit configuration can be created.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the mounting of a plurality of integrated circuits in a conventional example, FIG. 2 is a perspective view of a main part of an embodiment of the present invention, and FIG. 3 is a sectional view of a main part of FIG. In the figure, 1 and 1' are metal carriers, 2 and 2' are microwave integrated circuits, 3 and 3' are transmission lines, 4 is a conductor ribbon for connecting transmission lines, 5 and 5' are dielectric substrates,
6, 6' are ground conductors, 7 is a groove, 8 is a base, 9,
9' is a bridge, 10 is an elastic material block, and 11 is a conductive sheet.

Claims (1)

[Claims] 1 A plurality of microwave and millimeter wave integrated circuits formed by forming a transmission line or circuit on a dielectric substrate and bonding and mounting the substrate on a metal carrier are arranged and connected on the same plane base. In the microwave and millimeter wave circuit module, a part of the metal carrier to which the integrated circuit is connected has a structure in which a recess is provided from the end surface, and a recess is provided from the end face of the part of the metal carrier to which the integrated circuit is connected, and the recess extends over both integrated circuits to be connected and is fitted into the recess of the metal carrier. 1. A mounting structure for a microwave and millimeter wave integrated circuit, characterized in that a conductive block is provided so as to be in contact with a ground surface on the bottom surface of the connection of both integrated circuits. 2. A patent claim characterized in that, in the above-mentioned mounting structure of the microwave and millimeter wave integrated circuit, the block connecting the ground planes of the integrated circuits to be connected is made of a conductive material and a conductive elastic material on the ground plane side. The mounting structure of the microwave and millimeter wave integrated circuit in the first term of the range.