JPH0653702A - Mount structure for microwave integrated circuit - Google Patents

Abstract

PURPOSE:To improve the transmission characteristic by providing a structure fitting to each connecting part of metal carriers at a connection face of integrated circuit units to be connected so as to improve the impedance matching performance between the connecting parts. CONSTITUTION:A fitting part 9 (9') is provided to a connecting part of a metal carrier 4 (4') of a microwave integrated circuit unit 8 (8') on which a dielectric base 2 is mounted and bonded. Thus, the connection between ground conductor films 3, 3' is made by conductors of the metal carriers 4, 4' and the impedance matching at the connecting points is secured. Furthermore, the characteristic of the integrated circuit is improved by inserting a conductive sheet with excellent contact and conductivity to an upper face of the fitting part 9 in order to improve the contact between the earth conductor films 3, 3'.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a connection structure of a microwave integrated circuit unit in a microwave integrated circuit module, and particularly to a mounting structure suitable for eliminating impedance mismatch at the connection point of the unit. Regarding

[0002]

2. Description of the Related Art In general, when a plurality of microwave integrated circuit units forming a circuit are connected to a dielectric substrate to form a microwave integrated circuit module, the units are connected to each other on the dielectric substrate. Simply connecting the formed circuits by direct current is not sufficient for realizing the microwave transmission characteristics, and the connections must be made in consideration of matching at high frequencies.

FIG. 3 shows an embodiment of the prior art. FIG. 3 shows a conventional connection structure in which two microwave integrated circuit units 8 and 8'are simply arranged in mechanical contact with each other, and only the circuits on the dielectric substrate are DC-connected. That is, the dielectric substrates 2, 2'are bonded and mounted on the metal carriers 4, 4 ', mounted on the same plane base 5, and the transmission patterns 1, 1'on the respective dielectric substrates 2, 2'. Are connected by a conductor ribbon 6. However, in this structure according to the prior art, a gap 7 is generally formed between the connecting surfaces as shown in the figure, and therefore, the ground plane is the ground conductor on the back surface of each dielectric substrate 2, 2 '. The gap 7 between the membranes 3 and 3 ′ results in a discontinuity, which causes an impedance mismatch of the transmission line.

In order to solve this, conventionally, a matching circuit is provided around the shape of the conductor ribbon 6 and around the connection portion of the transmission lines 1, 1 ', and adjustment is performed. However, the degree of impedance mismatch is a manufacturing error. However, it is not always easy to obtain sufficient alignment.

[0005]

[Problems to be Solved by the Invention] As described above,
The conventional microwave integrated circuit mounting structure has an inconvenient problem that it requires individual high-frequency adjustment at connection points between integrated circuit units.

In order to solve the problems of the prior art, the object of the present invention is to reduce the discontinuity of the ground plane caused by the gap between the connecting surfaces of the microwave integrated circuit units, and to make an individual adjustment. It is to provide a mounting structure capable of impedance matching without any problem.

[0007]

In order to achieve the above object, the present invention provides, for example, as shown in FIG. 1 or FIG.
A microwave integrated circuit unit in which an integrated circuit 1 is formed on an upper surface of a dielectric substrate 2 and an earth conductor film 3 is formed on a lower surface thereof, and the dielectric substrate 2 is bonded and mounted on a metal carrier 4 via the earth conductor film 3. A microwave integrated circuit mounting structure having a configuration of 8 and a configuration of a microwave integrated circuit module in which a plurality of microwave integrated circuit units, for example, 8 and 8 ', are arranged and connected on a base 5 having the same conductor plane. The integrated circuit units 8 and 8 ′ are provided with structures 9 and 9 ′ which are fitted to the corresponding portions of the metal carrier on the connection circuit corresponding to the connection circuit.

[0008]

According to the present invention, as shown in FIG. 1 or 2, for example, the structures 9 and 9'to be fitted to the connecting circuit corresponding portions of the metal carrier on the connecting surfaces of the integrated circuit units 8 and 8'to be connected. When the integrated circuit units are connected to each other, even if there is a gap as shown in 7 of FIG. The problem of impedance mismatch at the connection point and the problem of inconvenience requiring individual adjustment will be solved.

[0009]

EXAMPLES Examples of the present invention will be described below.

FIG. 1 is a perspective view of an embodiment of the present invention, and FIG.
Is a sectional view thereof. Each of them shows a mounting structure focusing on the mutual connection of the microwave integrated circuit units.

1 and 2, in the microwave integrated circuit units 8 and 8 ', the dielectric substrates 2 and
2'is provided with the fitting portions 9, 9'at the connecting portions of the metal carriers 4, 4'which are jointed and mounted, so that the connection between the respective ground conductor films 3, 3'can be made by the metal carriers 4, 4 '. And the impedance matching at the connection point is ensured.

Furthermore, in order to improve the contact between the ground conductor films 3 and 3 ', a conductive sheet having good contact and conductivity is inserted on the upper surface of the fitting portion 9, or a conductive paint is applied. It may be used.

[0013]

By implementing the present invention, the impedance matching between the plurality of microwave integrated circuit units mutually connected can be improved. (1) Improvement of the transmission characteristics of the microwave module (2) Adjustment It is possible to reduce man-hours.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a sectional view of an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional example.

[Explanation of symbols]

 1, 1 '... Integrated circuit transmission pattern 2, 2' ... Dielectric substrate 3, 3 '... Earth conductor film 4, 4' ... Metal carrier 5 ... Conductor base 6 ... Conductor ribbon 7 ... Gap 8, 8 '... Microwave integrated circuit unit 9, 9 '... Fitting structure

Claims (1)

[Claims] 1. A microwave in which an integrated circuit is formed on the upper surface of a dielectric substrate and an earth conductor film is formed on the lower surface, and the dielectric substrate is bonded and mounted on a metal plate called a metal carrier through the earth conductor film. Connected in a structure of an integrated circuit unit and a mounting structure of a microwave integrated circuit having a structure of a microwave integrated circuit module in which a plurality of the microwave integrated circuit units are arranged and connected on a base having the same conductor plane. A mounting structure for a microwave integrated circuit, comprising a structure in which a portion corresponding to a connection circuit of a metal carrier on a connection surface of the integrated circuit unit is mutually fitted.