JPS5892102A - Connecting method for triplate line - Google Patents
Connecting method for triplate lineInfo
- Publication number
- JPS5892102A JPS5892102A JP56191164A JP19116481A JPS5892102A JP S5892102 A JPS5892102 A JP S5892102A JP 56191164 A JP56191164 A JP 56191164A JP 19116481 A JP19116481 A JP 19116481A JP S5892102 A JPS5892102 A JP S5892102A
- Authority
- JP
- Japan
- Prior art keywords
- triplate
- conductor
- small piece
- notch
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
Abstract
Description
【発明の詳細な説明】
この発明はマイクロ波伝送線路、特にトリプレート構造
のマイクロ紗伝送線路の接続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting a microwave transmission line, particularly a microgauze transmission line having a triplate structure.
マイクロ波伝送線路としては通常、導波管、同軸線路な
どが用いられる場合が多いが、機器の小形化、軽量化の
ために、誘電体基板に回路を形成した平面回路も多く使
用されるようになってきた。Waveguides, coaxial lines, etc. are usually used as microwave transmission lines, but planar circuits with circuits formed on dielectric substrates are also increasingly being used to make devices smaller and lighter. It has become.
そして、この平面回路としては、コプレーナ線路、マイ
クロストリップ線路、トリプレート線路等がある。以下
この説明の対象とするトリプレート線路について説明す
る。Examples of this planar circuit include a coplanar line, a microstrip line, and a triplate line. The triplate line, which is the subject of this description, will be explained below.
第1図は一般的なトリフレート線路の構成を示す斜視図
で、(1)は中心導体、(2)および(3)は中心導体
(1)を狭む誘電体板、(4)および(5)はそれぞれ
誘電体板(2)および(3)の外側表面に接着された接
地導体である。トリプレート線路はこのように、中心導
体(1)を接地導体(4)、。(5)で囲んだ構造にな
っているので、放射損失が少なく、マイクロストリップ
線路など、他の平面回路に比して損失の少ないマイクロ
波伝送線路を構成できる。Figure 1 is a perspective view showing the configuration of a general triflate line, where (1) is the center conductor, (2) and (3) are dielectric plates narrowing the center conductor (1), and (4) and ( 5) are ground conductors bonded to the outer surfaces of dielectric plates (2) and (3), respectively. The tri-plate line thus connects the center conductor (1) to the ground conductor (4). Since the structure is surrounded by (5), it is possible to construct a microwave transmission line with less radiation loss and less loss than other planar circuits such as a microstrip line.
第2図はこのトリプレート線路の製造方法の例を示す斜
視図で、まず、テフロンなどの高周波損失の少ない誘電
体を主成分とする誘電体板の両面に銅箔などを貼りつけ
た板を材料とし、一方の面の銅箔をそのまま残して接地
導体(4)とし、他方の□面の導箔に、その所要部分を
残してエツチングを施して中心導体(1)を誘電体(2
)の上に有する第1の基板を形成する。また、一方の面
にのみ銅箔を貼りつけた誘電体板を用い、または前述と
同様の両面銅箔貼付誘電体板の片面の銅箔を全部除去し
て、誘電体板(3)と接地導体(6)とからなる第2の
基板を形成する。その後に、これら第1及び第2の基板
を第2図の示す向きに矢印のように重ね合わせ、第1図
に示したようなトリプレート線路を構成する。そして、
第2図に示す2つの基板を重ね合わせ固着させるには、
接着剤で貼り合わせる方法と両液地導体(4)幻よび(
5)の外表面から金属部材で挟みつける方法とがあるが
、通常は簡単のため後者の方法が用いられている。Figure 2 is a perspective view showing an example of the manufacturing method of this triplate line. First, a dielectric plate whose main component is a dielectric material with low high frequency loss such as Teflon is pasted with copper foil etc. on both sides. The center conductor (1) is made into a dielectric material (2) by leaving the copper foil on one side as it is and etching the conductive foil on the other side, leaving the required part.
) is formed. Also, use a dielectric plate with copper foil pasted on only one side, or remove all the copper foil on one side of the dielectric plate with copper foil pasted on both sides as described above, and ground the dielectric plate (3). A second substrate consisting of a conductor (6) is formed. Thereafter, these first and second substrates are stacked in the direction shown in FIG. 2 in the direction of the arrow to form a triplate line as shown in FIG. 1. and,
To overlay and secure the two substrates shown in Figure 2,
Method of bonding with adhesive and both liquid ground conductors (4) Phantom and (
There is a method of 5) in which the outer surface is sandwiched between metal members, but the latter method is usually used because it is simple.
トリプレート回路は、前にも述べたように放射損失が少
ないなど良好な性能を有しているが、第1図からも明ら
かなように回路が、誘電体媒質の中にうめ込まれている
ので、例えば2つの基板に作られた回路同士を接続する
ことは困難であり、従来適当な方法が無かった。As mentioned earlier, the triplate circuit has good performance such as low radiation loss, but as is clear from Figure 1, the circuit is embedded in a dielectric medium. Therefore, for example, it is difficult to connect circuits formed on two substrates, and there has been no suitable method in the past.
本発明はこのような点に鑑みてなされたもので、2つの
トリプレート回路を接続する方法を提供するものである
。The present invention has been made in view of these points, and provides a method for connecting two triplate circuits.
第8図は本発明の一実施例を示すもので、2枚のトリプ
レート回路((2))と(200)を接続する方法を示
すものである。FIG. 8 shows an embodiment of the present invention, and shows a method of connecting two triplate circuits ((2)) and (200).
まず、接続すべき部分に切り欠h (a)を設け、中心
導体(1)を露出させる。次に、この切り欠き部にはま
り込むような小片(7)を用意する。小片(7)は誘電
体(3)と同じ材料e珍に片面は全面メタライズ抑と片
面は中心導体(1)と同じ巾のメタライズ(ロ)を施こ
しである。トリプレート回路(向)と(圓)を接続する
には、両回路を矢印Aの方向に合わせ密着させ、次いで
小片(7)番矢印Bの向きに切り欠き部にはめ込む。小
片(1)の固定法としては接着剤によるか、ハンダ付け
するか、または金属板等で押えつけ機械的に固定する方
法がある。First, a notch h (a) is provided in the part to be connected to expose the center conductor (1). Next, prepare a small piece (7) that fits into this notch. The small piece (7) is made of the same material as the dielectric (3), and one side is entirely metallized and the other side is metallized to the same width as the center conductor (1). To connect the tri-plate circuit (direction) and (circle), align both circuits in the direction of arrow A and bring them into close contact, and then fit the small piece (7) into the notch in the direction of arrow B. The small piece (1) may be fixed using adhesive, soldering, or mechanically fixed by pressing with a metal plate or the like.
以上、本発明によれば簡単にトリプレート回路同士を接
続することができる。なお、1ケ所の接続では機械的強
度が不足する場、184図に示すように、多数の切り欠
き部を設け、同様の小片(2)をうめ込み補強すること
もできる。As described above, according to the present invention, triplate circuits can be easily connected to each other. In addition, if the mechanical strength is insufficient for a single connection, as shown in Fig. 184, a large number of notches can be provided and similar pieces (2) can be inserted to reinforce them.
第1図はトリプレート線路を説明するための斜斜図、第
2図はその構成法を示す分解斜視図、第8図、許キ各は
本発明の一実施例を示す分解斜視図、第4図は本発明の
他の実施例を示す斜視図である。図中(1)は中心導体
、<2) 、 (S)は誘電体板、(4)。
(15) ハ接地導体、(6)ハ切り欠き部、(7Le
nllは小片、(2)は小片の誘電体部、旬、(ロ)は
メタ、ライズ部を示す。図中、同一符号は同−又は相当
部分を示す。
代理人 葛舒信−FIG. 1 is a perspective view for explaining the triplate line, FIG. 2 is an exploded perspective view showing its construction method, FIG. FIG. 4 is a perspective view showing another embodiment of the present invention. In the figure, (1) is the center conductor, <2), (S) is the dielectric plate, and (4). (15) C ground conductor, (6) C notch, (7Le
nll indicates a small piece, (2) indicates a dielectric portion of the small piece, and (b) indicates a metal rise portion. In the figures, the same reference numerals indicate the same or corresponding parts. Agent Ge Shuxin
Claims (1)
する際、接給すべき部分の誘電体部分を一部切り欠いて
線路を露出させ、−面は接続すベキ線路と同一のメタラ
イズを施こし、他面は全面メタライズした銹導体小片を
、上記接続すべき部分に形成された切り欠き部にはめ込
むことにより、トリプレート線路相互間を接続するよう
にしたトリプレート線路の接続方法。When connecting a microwave circuit with two triplate lines, the dielectric part of the part to be connected is partially cut out to expose the line, and the - side is metallized in the same way as the power line to be connected. A method for connecting triplate lines, in which the triplate lines are connected to each other by fitting a small conductor piece whose other surface is entirely metallized into a notch formed in the part to be connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56191164A JPS5892102A (en) | 1981-11-27 | 1981-11-27 | Connecting method for triplate line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56191164A JPS5892102A (en) | 1981-11-27 | 1981-11-27 | Connecting method for triplate line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5892102A true JPS5892102A (en) | 1983-06-01 |
Family
ID=16269960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56191164A Pending JPS5892102A (en) | 1981-11-27 | 1981-11-27 | Connecting method for triplate line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5892102A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6444703U (en) * | 1987-09-14 | 1989-03-17 | ||
EP0318309A2 (en) * | 1987-11-27 | 1989-05-31 | General Electric Company | A disconnectable microstrip to stripline transition |
US5148135A (en) * | 1991-09-04 | 1992-09-15 | Raytheon Company | Electronic hardware package |
US5508666A (en) * | 1993-11-15 | 1996-04-16 | Hughes Aircraft Company | Rf feedthrough |
EP0865093A1 (en) * | 1997-03-11 | 1998-09-16 | Com Dev Ltd. | Non-etched high power HTS circuits and method of construction thereof |
-
1981
- 1981-11-27 JP JP56191164A patent/JPS5892102A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6444703U (en) * | 1987-09-14 | 1989-03-17 | ||
EP0318309A2 (en) * | 1987-11-27 | 1989-05-31 | General Electric Company | A disconnectable microstrip to stripline transition |
US5148135A (en) * | 1991-09-04 | 1992-09-15 | Raytheon Company | Electronic hardware package |
US5508666A (en) * | 1993-11-15 | 1996-04-16 | Hughes Aircraft Company | Rf feedthrough |
EP0865093A1 (en) * | 1997-03-11 | 1998-09-16 | Com Dev Ltd. | Non-etched high power HTS circuits and method of construction thereof |
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