WO2004068566A1 - 真空紫外用光学系及び投影露光装置 - Google Patents
真空紫外用光学系及び投影露光装置 Download PDFInfo
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- WO2004068566A1 WO2004068566A1 PCT/JP2004/000823 JP2004000823W WO2004068566A1 WO 2004068566 A1 WO2004068566 A1 WO 2004068566A1 JP 2004000823 W JP2004000823 W JP 2004000823W WO 2004068566 A1 WO2004068566 A1 WO 2004068566A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
Definitions
- the present invention relates to a vacuum ultraviolet optical system and a projection exposure apparatus including, as constituent components, a reflective optical component or a transmission optical component having an optical thin film formed on a substrate.
- the exposure light source wavelength has been short, such as g-line (436 nm), i-line (365 nm), and KrF excimer laser (248 nm).
- fluorescence refers to light emitted from an object in a relaxation process when electrons constituting the object absorb light and are excited to a high energy state when the light enters the object.
- the energy generally relaxed by the fluorescence is a part of the incident energy because it passes through an intermediate level such as an impurity level, and the fluorescence has a lower energy than the input light, that is, a longer wavelength. Is the light.
- fluorescence is generated by optical components such as quartz glass and various fluoride crystal materials. Occurs inside the optical component when the exposure light passes. In addition, it may be caused by the reflection or scattering of the exposure light on the surface of each component such as the member supporting the optical component and the member arranged in a range that can be irradiated with the exposure light, such as the inner surface of the housing. is there. Fluorescence generated in an apparatus such as an exposure apparatus may be output together with output light.
- a lens Fluorescence 70 is generated inside 62.
- the fluorescent light 70 is reflected together with the input light 68 at the mirror 64, and the fluorescent light 70 passes through the window 66 and is output together with the output light 72.
- FIG. 11 even in an optical device in which lenses 76, 78, and 80 are arranged in parallel in a barrel 74, when input light 82 is incident on this optical device.
- the fluorescence 84 is generated inside the lens 78, and the fluorescence 84 is transmitted through the lens 80 and output together with the output light 86.
- the fluorescence generated in the device is output together with the output light, which adversely affects the function and performance of the device.
- the silicon laser die which is generally used as a photodetector, that there is a sensitivity peak in the visible region, and that the incidence of fluorescent light causes a large error in light quantity measurement. .
- an exposure apparatus including a filter for attenuating fluorescence having a wavelength longer than the exposure light (for example, Japanese Patent Application Laid-Open No. 2001-18989). See Japanese Patent Publication No. 270).
- the filter in the exposure apparatus described in JP-A-2001-189270 is a transmissive element, and the fluorescent light is reflected by the filter and is transmitted from the transmitted light (exposure light). Once removed, a new problem arises in that the reflected fluorescence is repeatedly reflected between other optical components or supporting members, etc., and remains in the optical system as stray light that is difficult to process.
- the filter disclosed in the present invention has a low transmittance of 80 to 90 ° / 0 for exposure light, and has a light amount loss as an optical component used in a semiconductor exposure apparatus in which throughput performance is regarded as important. It must be said that it is extremely large and lacks practicality. Disclosure of the invention
- a first object of the present invention is to provide a vacuum ultraviolet optical system capable of preventing fluorescent light from being output to the outside together with output light and remaining as stray light in the optical system, and an exposure apparatus including the same. That is.
- a second object of the present invention is to irradiate vacuum ultraviolet light. Reflective optical components that can effectively absorb the fluorescence generated by
- An object of the present invention is to provide a vacuum ultraviolet optical system including a transmission optical component capable of effectively reflecting fluorescence generated by irradiation with Z or vacuum ultraviolet light, and an exposure apparatus including the same. According to a first aspect of the present invention, there is provided a vacuum ultraviolet optical system,
- a reflective optical component having an optical thin film formed on the substrate, the optical thin film having a high reflection characteristic with respect to the input light, and having a longer wavelength A f Provided is a vacuum ultraviolet optical system having antireflection characteristics for light having Af> ⁇ i).
- the optical thin film has high reflection characteristics, for example, a reflectance of 90% or more with respect to the vacuum ultraviolet input light (wavelength ⁇ i).
- the optical thin film has antireflection characteristics, for example, a reflectance of 10% or less, for light having a longer wavelength than the input light (wavelength Af> ⁇ i).
- the optical thin film is optically controlled so as not to reflect light of the wavelength ⁇ f longer than the wavelength ⁇ i of the input light as described above.
- fluorescent light having a wavelength close to the wavelength ⁇ i of the input light exposes the photoresist resist applied to the substrate to be exposed. There is a fear.
- the optical thin film may have anti-reflective properties for light of a specific wavelength f in the range of 167-700 nm where fluorescence will occur.
- the substrate may be made of a material that absorbs light of wavelength ⁇ f
- the optical thin film may be made of a dielectric multilayer film (mirror).
- the light of wavelength A f that has passed through the dielectric multilayer film (mirror) reaches the substrate, which is the absorber, is converted into thermal energy, and disappears on the spot. Therefore, even if fluorescence of the wavelength Af is generated, it can be prevented from being separated from the input light and returning to the optical system to become stray light, thereby preventing the fluorescence from being output together with the output light. be able to.
- the substrate may be composed of carbon or silicon carbide.
- the substrate When the substrate is made of carbon or silicon carbide, it can work not only as an absorber for light of wavelength ⁇ f but also with a predetermined surface accuracy. Carbon or silicon carbide with low outgassing is physically and chemically stable, and does not contaminate the optical path of vacuum or nitrogen or a helium purge atmosphere generally used for optical devices used at vacuum ultraviolet wavelengths. Therefore, it is possible to prevent a decrease in light transmittance and prevent photodecomposition products from being deposited on the surface of the optical component, and to provide a highly accurate optical device. According to a second aspect of the present invention, there is provided a vacuum ultraviolet optical system,
- An optical component irradiated with vacuum ultraviolet light having a wavelength ⁇ as input light
- a vacuum ultraviolet optical system having high reflection characteristics for light having Af> ⁇ i) is provided.
- the transmission optical component has an anti-reflection property for input light, for example, a reflectance of 0.5% or less, and a high reflection property for fluorescence. , For example, it has a reflectance of 95% or more.
- the vacuum ultraviolet optical system according to the second aspect may further include a support member and a housing for the optical component.
- the surfaces of the support member and the housing may be formed of a material that absorbs light of wavelength ⁇ f, for example, carbon or silicon carbide.
- a plurality of optical components that receive vacuum ultraviolet light of wavelength i as input light
- f is provided, even if fluorescence is generated from the vacuum ultraviolet optical system, for example, a plurality of optical components Even if fluorescent or stray light is generated from the support member of those optical components, the vacuum ultraviolet optical system or the housing of the optical system, it can be prevented from being mixed into the output light Absorb light of wavelength f
- the member can be made of carbon or silicon carbide.
- a portion of the support member and the housing that may be irradiated with the generated fluorescence may be made of carbon or silicon carbide.
- the vacuum ultraviolet light may be argon fluoride excimer laser light or fluorine laser light.
- a projection exposure apparatus for exposing a substrate by projecting a pattern image of a mask onto the substrate, comprising:
- An illumination optical system for illuminating the mask using vacuum ultraviolet light as exposure light
- a projection exposure apparatus comprising: a projection optical system that includes the vacuum ultraviolet optical system according to any one of the first to third aspects of the present invention, and that projects a pattern image of the mask onto a substrate.
- a projection optical system that includes the vacuum ultraviolet optical system according to any one of the first to third aspects of the present invention, and that projects a pattern image of the mask onto a substrate.
- an exposure apparatus for exposing a substrate with a pattern image of a mask comprising: a vacuum ultraviolet light source;
- An exposure apparatus comprising: an illumination optical system that includes the vacuum ultraviolet optical system according to any one of the first to third aspects of the present invention and that illuminates a mask with the vacuum ultraviolet light as exposure light. .
- an illumination optical system that includes the vacuum ultraviolet optical system according to any one of the first to third aspects of the present invention and that illuminates a mask with the vacuum ultraviolet light as exposure light.
- FIG. 1 is a configuration diagram of a vacuum ultraviolet optical system according to a first embodiment of the present invention.
- FIG. 2 is a configuration diagram of a vacuum ultraviolet optical system according to the second embodiment of the present invention.
- FIG. 3 is a configuration diagram of a vacuum ultraviolet optical system according to the third embodiment of the present invention.
- FIG. 4 is a basic configuration diagram of a projection exposure apparatus according to a fourth embodiment of the present invention.
- FIG. 5 is a reflection spectrum showing a relationship between wavelength and reflectance when light is incident on the reflection optical component according to the first embodiment of the present invention.
- FIG. 6 is a reflection spectrum showing the relationship between the wavelength and the reflectance when light is incident on the transmission optical component according to the second embodiment of the present invention.
- FIG. 7 is a reflection spectrum showing a relationship between wavelength and reflectance when light is incident on the transmission optical component according to the third embodiment of the present invention.
- FIG. 8 is a reflection spectrum showing the relationship between the wavelength and the reflectance when light is incident on the transmission optical component according to the fourth embodiment of the present invention.
- FIG. 9 is a conceptual diagram of a reflective optical component used in the vacuum ultraviolet optical system according to the present invention.
- FIG. 10 is a configuration diagram of an optical device including a conventional reflective optical component.
- FIG. 11 is a configuration diagram of an optical device including a conventional transmission optical component. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a diagram showing a schematic configuration of a vacuum ultraviolet optical system according to a first embodiment of the present invention.
- a lens (optical member) 4 a mirror (reflective optical component) 6, and a window (optical member) 8 are arranged in this order from the input side of the input light 10 of the housing 2.
- the input light 10 transmitted through the lens 4 is reflected upward by a mirror 6 at right angles, and is output as output light 14 via a window 8.
- the input light is, for example, vacuum ultraviolet light having a wavelength of 140 to 200 nm.
- the mirror 6 includes a substrate 6a and a dielectric multilayer film (optical thin film) 6b formed on the substrate 6a.
- the substrate 6a is made of, for example, carbon or silicon carbide, and acts as an absorber for fluorescence (wavelength Af).
- the dielectric multilayer film 6b is formed of, for example, an alternately laminated multilayer film as shown in FIG. 9, and reflects the input light at a high reflectance, for example, 90% or more, and has a wavelength longer than that of the input light. To reflect long light with low reflectance, for example, less than 10%, The components (refractive index), thickness and number of layers of each layer are adjusted.
- a multilayer film is laminated on the substrate, and Interference (multiple interference) may be used, and for that purpose, the refractive index, thickness and number of layers are adjusted to desired values according to their wavelengths.
- the input light has a wavelength of 157 nm and a calcium fluoride substrate, the wavelength is not only in the visible region such as 400 to 450 nm, but also longer than 157 nm. Fluorescence also appears in the ultraviolet region on the wavelength side.
- the refractive index, the thickness, and the number of layers of the above-described layers can be adjusted to desired values according to the wavelength region to be removed (anti-reflection).
- G a F 3 and L a F 3 and as the low refractive index material, for example, M g F 2 and A 1 F 3 can be used.
- M g F 2 and A 1 F 3 can be used as shown in FIG.
- Fluorescence 12 can occur in Since the wavelength of the generated fluorescence 12; f is longer than the wavelength ⁇ i of the input light 10 (input f> ⁇ i), in the mirror 16, the fluorescence is formed by the dielectric multilayer film formed on the surface. It reflects only input light 10 upward at right angles without reflecting 1 2.
- the substrate 6a of the mirror 6 absorbs the leak light (A f) transmitted from the dielectric multilayer film 6b to the substrate 6a side. Therefore, it is possible to prevent the light leaking from the mirror 6 from being generated.
- the surface is made of carbon or silicon carbide.
- Means for forming the outermost surface of the portion to be irradiated with carbon or silicon carbide include not only a method of arranging a member made of carbon or carbon carbide on the surface, but also a method using chemical vapor deposition (CVD) or the like. A method of forming a carbon layer or a silicon carbide layer on the surface of the site is exemplified.
- the mirror 16 that reflects the input light 10 transmitted through the lens 4 has high reflection characteristics with respect to the input light 10 (wavelength ⁇ i).
- An anti-reflection property for the fluorescent light 12 (wavelength A f) is provided.
- An absorber that absorbs fluorescence 12 (wavelength f) is used for the substrate 6 a of the mirror 6. Therefore, in the mirror 6, the reflection of the fluorescence 12 generated when the input light 10 passes through the lens 4 is prevented, and the generation of the leak light in the mirror 6 is prevented. Therefore, only the output light 14 can be output through the window 8.
- FIG. 2 is a diagram showing a schematic configuration of a vacuum ultraviolet optical system according to the second embodiment.
- lenses (optical members) 22, 24, and 26 are arranged in a lens barrel (housing) 20 from an input side of an input light 28, and the input light 28 is a lens.
- the light passes through 22, 24, and 26 and is output as output light 32.
- the lenses 22 and 24 are provided with only the anti-reflection property for the input light 28 (wavelength ⁇ ⁇ '), and the lens 26 is provided with the anti-reflection property for the input light 28 (wavelength ⁇ i).
- high reflection characteristics for fluorescence 30 (wavelength Af).
- a dielectric multilayer film (optical thin film) 26 a having an antireflection property for the input light 28 and a high reflection property for light 30 having a longer wavelength than the input light 28 is formed on the lens 26.
- the dielectric multilayer film 26a is formed from alternately laminated films as shown in FIG.
- the dielectric multilayer film 26a reflects the input light at a low reflectance, for example, 10 ° / 0 or less, and reflects light having a longer wavelength than the input light at a high reflectance, for example, 90% or more.
- the components (refractive index), thickness and number of layers of each layer are adjusted.
- a multilayer film is laminated on the substrate and interference within the multilayer film ( (Multiple interference) may be used.
- the refractive index, thickness, and number of layers are adjusted to desired values according to their wavelengths. You.
- the substance for example, G a F 3 or L a F 3 can be used, and as the low refractive index substance, for example, M g F 2 or A 1 F 3 can be used.
- the vacuum ultraviolet light (A r F excimer one laser light or F 2 laser light) input light 2 8 a is incident to the lens barrel 2 0, the input light 2 8 through the lens 2 4
- fluorescence 30 may be generated inside the lens 24.
- the generated fluorescence 30 reaches the lens 26 on the output side.
- the lens 26 has high reflection characteristics with respect to light 30 having a longer wavelength than the input light 28, and has antireflection characteristics with respect to the input light 28.
- the fluorescent light 30 is reflected, and only the input light 28 is transmitted with high efficiency and output as the output light 32. Further, the fluorescence 30 reflected by the lens 26 is almost completely absorbed by the light absorbing member 31 made of carbon or silicon carbide coated on the inner surface of the lens barrel 20.
- the outermost surface be made of carbon or silicon carbide.
- Means for forming the outermost surface of the irradiated portion with carbon or silicon carbide include not only a method of arranging a member made of carbon or silicon carbide on the surface, but also a method using CVD (chemical vapor deposition) or the like.
- the lens 26 has an anti-reflection property for the input light 28 (wavelength A i) and a high reflection property for the fluorescence 30 (wavelength A f). Is given. Therefore, the fluorescence 30 generated inside the lens 24 when the input light 28 is transmitted is reflected by the lens 26, and it is possible to prevent the fluorescence 30 from being output together with the output light 32. . Further, the reflected fluorescent light 30 is absorbed by the light absorbing member 31 made of carbon or silicon carbide, and thus disappears without causing new stray light due to reflection on the inner surface of the lens barrel 20 or the like.
- FIG. 3 is a diagram showing a schematic configuration of a vacuum ultraviolet optical system according to the third embodiment.
- lenses (optical members) 44, 46, and 48 are arranged in a lens barrel (housing) 40 from the input side of input light 42, and the input light 42 is a lens 4 The light passes through 4, 46, 48 and is output as output light 50.
- each of the lenses 44, 46, and 48 has only an anti-reflection property with respect to the input light 42 (wavelength ⁇ "i).
- the entire surface is covered with a light-absorbing member 52 made of silicon, and when fluorescence 54 is generated from the lenses 44 and 46, a part of the fluorescence 54 enters the inner surface of the lens barrel 40 and is reflected by the mirror. The light is completely absorbed by the light-absorbing member 52 coated on the inner surface of the cylinder 40. The remaining fluorescent light 54 generated from the lenses 44, 46 is the lens 46, 4, which is the next-stage lens. Part of the fluorescence 54 is reflected and partially transmitted according to the spectral transmittance of the lenses 46 and 48. Among the fluorescence reflected or transmitted by the lenses 46 and 48 The component that has reached the inner surface of the lens barrel 40 is completely absorbed by the light-absorbing member 52 coated on the inner surface of the lens barrel 40.
- a support member for fixing the lenses 44, 46, 48 arranged in the lens barrel 40 (corresponding to the lens barrel 40 in contact with the lenses 44, 46, 48) and In a part (not shown) attached to the lens barrel, at a portion to which the fluorescent light 54 may be irradiated, it is preferable that the outermost surface of the portion is made of carbon or silicon carbide.
- Means for forming the outermost surface of a part with carbon or silicon carbide include a method of arranging a member made of carbon or silicon carbide on the surface, and a method of depositing carbon or silicon carbide on the part surface using CVD (chemical vapor deposition).
- a method for forming a layer or a silicon carbide layer The vacuum ultraviolet optics according to the third embodiment. According to the system, even if fluorescence 54 is generated inside the lenses 44 and 46, the light absorbing member 52 made of carbon or silicon carbide is Since the fluorescent light 54 is further absorbed, the fluorescent light 54 returns to the optical path again by reflection on the inner surface of the lens barrel 40 and disappears without causing new stray light. Therefore, it is possible to prevent the fluorescence 54 from being output together with the output light 50.
- FIG. 4 is a reflection optical component used in the vacuum ultraviolet optical system according to the first embodiment, a transmission optical component used in the vacuum ultraviolet optical system according to the second embodiment, or
- FIG. 13 is a diagram showing a basic structure of a projection exposure apparatus having a lens barrel used in a vacuum ultraviolet optical system according to a third embodiment.
- This projection exposure apparatus is particularly applied to a projection exposure apparatus called a stepper for projecting an image of a reticle pattern onto a wafer which has been cooled by a photo resist. As shown in FIG.
- this projection exposure apparatus is used to illuminate a reticle (mask) R with exposure light at least on a wafer stage 301 on which a substrate W coated with a photosensitive agent is placed on a surface 301a.
- a projection optical system 500 includes a lens barrel and a plurality of lenses housed therein, and has a first surface P 1 (object surface) on which the reticle R is arranged and a second surface P 1 (the object surface) aligned with the surface of the substrate W. It is placed between the surface (image plane).
- the illumination optical system 101 includes a plurality of lenses for guiding light from the light source 100 to the reticle R, a reflection mirror (deflection mirror), a beam splitter, and a wave plate for adjusting polarization characteristics.
- a fly-eye lens for adjusting the uniformity of the light intensity, a beam expander, etc., and an alignment optical system 110 for adjusting the relative position between the reticle R and the wafer W.
- Reticle R is arranged on reticle stage 201 which can move in parallel with the surface of wafer stage 301.
- the reticle exchange system 200 exchanges and transports the reticle R set on the reticle stage 201.
- Reticle exchange system 200 includes a stage driver for moving reticle stage 201 parallel to surface 301 a of wafer stage 301.
- Projection optics 5 Numeral 00 has an alignment optical system applied to a scan type exposure apparatus.
- the light source 100, the reticle exchange system 200, and the stage control system 300 are controlled by the main control unit 400.
- the illumination optical systems 101 and Z or the projection optical system 500 of the projection exposure apparatus include reflection optical components used in the vacuum ultraviolet optical system (FIG. 1) according to the first embodiment.
- the lens-reflection mirror included in the illumination optical system 101 and the lens barrel that houses them are used in the above-described transmission optical component, reflection optical component, and lens barrel used in the vacuum ultraviolet optical system of the above-described embodiment.
- the lens barrel and transmission optical components used in the vacuum ultraviolet optical system of the above embodiment can be used for the lens barrel of the projection optical system 500 and the lens housed therein.
- the reflective optical component used in the vacuum ultraviolet optical system according to the first embodiment and the vacuum ultraviolet component according to the second embodiment are used.
- At least one of the transmission optical component used in the optical system and the lens barrel used in the vacuum ultraviolet optical system according to the third embodiment is used as the projection optical system 500 or the illumination optical system 1. Therefore, the projection optical system 500 or the illumination optical system 101 can prevent fluorescence from being output together with the output light, and can provide a projection exposure apparatus having a high resolution.
- the reflective optical component according to the first embodiment as shown in FIG. 9, full Uz of the run button on a substrate of full Uz of calcium (C a F 2) (L a F 3) and aluminum fluoride (A 1 F 3 ) are alternately laminated to form a total of 46 layers.
- Table 1 shows the configuration of the thin film laminated on the substrate and details of the thickness of each layer.
- Fig. 5 shows the relationship between wavelength and reflectance when light is incident on this reflective optical component at an incident angle of 45 degrees. As shown in Fig. 5, the transmittance is maintained at 90% or more in the wavelength range of 150 to 165 nm.
- the transmittance is less than 10% in the wavelength region of 350 to 700 nm, and less than 5% in the wavelength region of 400 to 700 nm.
- the reflectance for light having a wavelength of 157 nm is 95% or more, which is almost 100%, while the reflectance for light in the visible region is less than 5%, which is almost 0%. I have.
- the reflectance in the near ultraviolet region of 300 to 400 nm is suppressed to 10% or less.
- the reflective optical component of the first embodiment the input light having the wavelength of 157 nm is reflected by about 100%, but the input light generates fluorescence in the near ultraviolet region and the visible region. It turns out that it does not reflect it substantially.
- the transmission optical component according to the second embodiment is obtained by alternately stacking a total of 32 thin films of lanthanum fluoride and aluminum fluoride on a substrate of calcium fluoride.
- Table 1 shows the configuration of the thin film laminated on the substrate and details of the thickness of each layer.
- FIG. 6 shows the relationship between the wavelength and the reflectance when light is incident on the transmission optical component at an incident angle of 0 °. As shown in Fig. 6, the reflectance for light with a wavelength of 157 nm (156 to 159 nm) is less than 5% and almost 0%, while that for light with a wavelength of 400 to 450 nm. The reflectivity is over 90% (over 95%), which is close to 100%.
- the transmission optical component of the second embodiment almost 100% of the input light having the wavelength of 157 nm is transmitted, but when this input light is transmitted through the transmission optical component, the wavelength of 400 to 450 nm is transmitted. It can be seen that even if fluorescence is generated in the range, such fluorescence is almost completely reflected.
- the transmission optical component according to the third embodiment is obtained by alternately laminating thin films of lanthanum fluoride and aluminum fluoride on a calcium fluoride substrate, so that a total of 34 layers are laminated.
- Table 1 shows details of the structure of the thin film laminated on the substrate and the thickness of each layer.
- FIG. 7 shows the relationship between the wavelength and the reflectance when light is incident on the transmission optical component at an incident angle of 0 °. As shown in Figure 7, the reflectance for light at 157 nm (156-159 nm) is nearly 0%, while the reflectance for light at 450-500 nm is at least 90%. , Almost 100%.
- 90% or more (95% or more) of the light in the wavelength range of 167 to 172 nm on the long wavelength side is 1 O nm or more than the wavelength of the input light of 157 nm, and almost 100%. You can also see that it is reflected by.
- the transmission optical component of the third embodiment approximately 100% of the input light having a wavelength of ⁇ 57 nm is transmitted, but when this input light passes through the transmission optical component, 167 to 172 ⁇ It can be seen that even if fluorescence is generated in the wavelength range of m and the wavelength range of 450 to 500 nm, it can be almost completely reflected.
- the transmission optical component of the fourth embodiment uses the thin film of the second embodiment on one surface of a calcium fluoride substrate and the thin film of the third embodiment on the other surface. That is, a total of 66 thin films of lanthanum fluoride and aluminum fluoride are alternately laminated.
- FIG. 8 shows the relationship between the wavelength and the reflectance when light is incident on the transmission optical component from the thin film side of the second embodiment at an incident angle of 0 °. As shown in FIG. 8, the reflectance for light having a wavelength of 157 nm (156 to 159 nm) is almost 0%, while the reflectance for light having a wavelength of 400 to 500 nm is 90% or more. Which is close to 100%.
- the wavelength of the input light is 10 nm or more than 157 nm, and 167 to 17 on the long wavelength side. It can be seen that the light in the wavelength range of 2 nm is reflected by more than 90% and almost 100%. According to the transmission optical component of the fourth embodiment, almost 100% of the input light having the wavelength of 157 nm is transmitted. On the other hand, when this input light passes through the transmission optical component, it can be almost completely reflected even if it generates fluorescence in the wavelength range of 167 to 172 nm and the wavelength of 400 to 500 nm. You.
- the exposure apparatus to which the vacuum ultraviolet optical system of the present invention is applied is not limited to the projection exposure apparatus shown in FIG. 4, but various projection exposure apparatuses or exposure apparatuses such as a collective type, an aligner type, and a mirror projection type. Can be. Industrial applicability
- the optical system for vacuum ultraviolet according to the present invention includes fluorescent light generated by irradiation with vacuum ultraviolet light and the fluorescent light. By removing stray light originating from the light from the vacuum ultraviolet optical system, only the necessary output light can be output. Therefore, a desired result using vacuum ultraviolet light can be obtained by using the optical system for vacuum ultraviolet light of the present invention in various inspection devices and measuring devices using vacuum ultraviolet light as a light source. Further, by incorporating the vacuum ultraviolet optical system of the present invention into the projection optical system and / or the illumination optical system of the exposure apparatus, unintended light sensitivity of the photoresist due to fluorescence or stray light can be prevented, and a short wavelength light source can be obtained. , And high-resolution exposure using. Therefore, the exposure apparatus of the present invention is extremely useful for exposing a substrate for manufacturing a highly integrated semiconductor integrated circuit, a liquid crystal substrate, or the like.
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JP2015045821A (ja) * | 2013-08-29 | 2015-03-12 | 旭硝子株式会社 | 波長選択光学フィルタ |
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JP2001350003A (ja) * | 2000-06-09 | 2001-12-21 | Nikon Corp | 黒色反射防止膜およびそれを用いた光学装置。 |
JP2002189101A (ja) * | 2000-12-21 | 2002-07-05 | Nikon Corp | 反射防止膜、光学素子及び露光装置 |
JP2003014905A (ja) * | 2001-07-04 | 2003-01-15 | Nikon Corp | 光学素子および投影露光装置 |
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JP2000173917A (ja) * | 1998-10-02 | 2000-06-23 | Canon Inc | 光学ユニット、光学ユニットを用いた光学機器 |
JP2000357654A (ja) * | 1998-10-13 | 2000-12-26 | Nikon Corp | 反射防止膜、光学素子、露光装置、及び電子物品 |
JP2001350003A (ja) * | 2000-06-09 | 2001-12-21 | Nikon Corp | 黒色反射防止膜およびそれを用いた光学装置。 |
JP2002189101A (ja) * | 2000-12-21 | 2002-07-05 | Nikon Corp | 反射防止膜、光学素子及び露光装置 |
JP2003014905A (ja) * | 2001-07-04 | 2003-01-15 | Nikon Corp | 光学素子および投影露光装置 |
Cited By (1)
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JP2015045821A (ja) * | 2013-08-29 | 2015-03-12 | 旭硝子株式会社 | 波長選択光学フィルタ |
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