WO2004064156A1 - Laminate made by electro-forming and method for manufacturing the same - Google Patents

Laminate made by electro-forming and method for manufacturing the same Download PDF

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Publication number
WO2004064156A1
WO2004064156A1 PCT/KR2003/002856 KR0302856W WO2004064156A1 WO 2004064156 A1 WO2004064156 A1 WO 2004064156A1 KR 0302856 W KR0302856 W KR 0302856W WO 2004064156 A1 WO2004064156 A1 WO 2004064156A1
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WO
WIPO (PCT)
Prior art keywords
exposing
electroforming
forming
metal layers
electrode base
Prior art date
Application number
PCT/KR2003/002856
Other languages
French (fr)
Inventor
Jeong-Sik Kim
Original Assignee
Graphion Technologies Usa, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graphion Technologies Usa, Llc filed Critical Graphion Technologies Usa, Llc
Priority to AU2003289537A priority Critical patent/AU2003289537A1/en
Publication of WO2004064156A1 publication Critical patent/WO2004064156A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Definitions

  • the present invention relates to a laminate made by an electroforming process, which is used for a minute conducting circuit in semiconductor and other electronic devices.
  • the laminate has various shapes. That is, a pattern of different kinds of layered metals may be used as the laminate.
  • the present invention relates to a method for manufacturing a metal laminate or different kinds of metal laminates, and more particularly to a laminate manufactured by layered metals.
  • the laminate has a thickness of several microns or several tens of microns.
  • the laminate has a thickness of several hundreds of microns as the case may be.
  • Such a laminate having various shapes is defined as a laminated electroforming member.
  • metal laminates a metal laminate having a pattern is used in various fields.
  • a minute metal pattern has been conventionally manufactured by an etching process.
  • the minute metal pattern is manufactured by an electroforming process in the present invention.
  • a conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist.
  • a laminated electroforming member of the present invention can obtain a desired height by repeatedly performing an electroforming process.
  • the conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various sections such as a stepped section or a curved section. Such a desired section can be obtained by repeatedly layering metal with varying the position of exposing portions.
  • the conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion.
  • the etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained.
  • the etching process has limitation in a processing pitch due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed.
  • a metal minute pattern or a laminated electroforming member is formed by an electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process.
  • an exposing portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch.
  • etching process since only material required for a metal minute pattern is used for an electroforming master in the present invention, waste of material is avoided.
  • the present invention is directed to a laminated electroforming member and a method for manufacturing the same that ' substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
  • An object of the present invention is to provide an electroforming member and a method for manufacturing the same in which a photoresist is deposited on an electrode base to obtain electroforming metal of a certain thickness. Whenever the thickness of the electroforming member can be increased at a desired height by layering electroforming metals by performing an electroforming process in an electrode base. In the conventional electroforming method based on a register, since the height of the register is limited, the thickness of the electroforming member is also limited by the register. However, in the present invention, the height of the electroforming member can be adjusted by repeatedly performing the electroforming process.
  • a method for manufacturing a laminated electroforming member includes the steps of forming a conducting portion on a surface of an electrode base at the same shape as that of the laminated electroforming member, forming an insulating portion insulated by an exposing portion of photoresist and interposed in the conducting portion, forming metal layers on the conducting portion by repeatedly performing an electroforming process in the electrode base, and forming exposing portions in the insulating portion by repeatedly performing an exposing process, the height of the exposing portions and the height of the metal layers being increased as they are repeatedly formed in turn.
  • a laminated electroforming member is made by including a basic process forming a first metal layer in a first space portion by performing an electroforming process in an electrode base, the electrode base being made by forming a first exposing portion and the first space portion through exposing and washing processes of photoresist deposited on an electrode base basic material, and a layering process forming metal layers by depositing again the photoresist on the first metal layer and the first exposing portion, forming exposing portions and a space portion through exposing and washing processes of the photoresist, and forming the metal layers by performing the electroforming process in the space portion.
  • the layering process is repeated two or more times.
  • the exposing portions have the same shape as that of the first exposing portion in the same position while the metal layers have the same shape as that of the first metal layer in the same position.
  • the exposing portions and the metal layers have small difference from the first exposing portion and the first metal layer in their shapes.
  • the metal layers are formed of different kinds of metals.
  • FIG. 1 illustrates a metal minute pattern which is one example of an electroforming member according to the present invention
  • FIG. 2 illustrates a basic process for forming an electroforming member according to the present invention
  • FIG. 3 illustrates an electroforming member formed by performing an electroforming process in an electrode base in the basic process
  • FIG. 4 illustrates the processes of forming an exposing portion, and forming metal layers through a repeated electroforming process
  • FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process
  • FIG. 6 illustrates detachment of a laminated electroforming member
  • FIG. 7 illustrates a laminated electroforming member of different kinds of metals
  • FIG. 8 illustrates a laminated electroforming member grown with various sections.
  • a conducting portion and an insulating portion are formed on the surface of an electrode base.
  • the conducting portion has the same shape as that of a desired electroforming member.
  • the insulating portion is formed by an exposing portion of photoresist and interposed in the conducting portion. Metals are layered on the conducting portion by repeatedly performing an electroforming process. Exposing portions are accumulated on the insulating portion.
  • the laminated electroforming member is made by including a basic process forming a first metal layer by performing an electroforming process in an electrode base and a layering process forming metal layers and exposing portions on the electrode base. In case that the exposing portions are formed in the same position as that of the first exposing portion, the laminated electroforming member has a linear shaped section. However, if the positions of the first exposing portion and the laminated exposing portions are varied in the layering process, the laminated electroforming member can obtain various sections, not the linear section.
  • FIG. 1 illustrates a metal minute pattern which is one example of an electroforming member according to the present invention.
  • a pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits.
  • a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as metal minute patterns.
  • a conducting portion and an insulating portion are formed on the surface of the electrode base using a film.
  • FIGs. 2 to 6 illustrate the processes of manufacturing a laminated electroforming member according to the present invention.
  • FIG. 2 illustrates the basic process in the present invention.
  • a photoresist 2 is deposited on an electrode base basic material 101, and light is scanned onto the film to expose the photoresist.
  • the exposed photoresist is removed by a washing process to form a space portion 4.
  • the exposing portion is defined as the first exposing portion 3 and the space portion is defined as the first space portion 4.
  • the electrode base basic material in which the exposing portion and the space portion are formed is defined as the electrode base 1.
  • the electrode base basic material is generally of a plate shaped material of conductor.
  • An example of the electrode base basic material includes stainless steel plate which is well polished.
  • the stainless steel plate of nickel or copper is widely used because it is likely to be detached from the electroforming member and has strong intensity. Since the portion below the electrode base is not important technically in the present invention, its description will be omitted. However, it is preferable that the portion below the electrode base is to be insulated so that it does not undergo the electroforming process.
  • FIG. 3 illustrates an electroforming member formed by performing an electroforming process in an electrode base in the basic process.
  • FIG. 4 illustrates the processes of forming an exposing portion, and forming metal layers through an electroforming process.
  • a first metal layer 6 is grown in the electrode base 1 at the height of the first exposing portion 3.
  • a photoresist layer 7 is deposited in a state that the first metal layer is grown.
  • An exposing portion 9 is formed in the photoresist layer.
  • the photoresist except for that of the exposing portion is removed by a washing process to form a space portion 9.
  • the electroforming process is then implemented in the electrode base 1 so that a second metal layer 10 is grown in the space portion at the height of the exposing portion 8.
  • FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process.
  • a photoresist layer 12 is again deposited on the electrode base where the exposing portion 8 and the second metal layer 10 are formed.
  • An exposing portion 13 is formed in the photoresist layer.
  • the photoresist except for that of the exposing portion 13 is removed by a washing process to form a space portion 14.
  • the electroforming process is then implemented in the electrode base so that a third metal layer 16 is grown in the space portion at the height of the exposing portion 13.
  • FIG. 6 illustrates detachment of the laminated electroforming member.
  • FIG. 7 illustrates a laminated electroforming member of different kinds of metals.
  • the laminated electroforming member can be formed by sequentially layering different kinds of metals such as copper, nickel, and gold through the electroforming process. Also, the metal pattern of a specific pattern or the laminated electroforming member can be formed by varying the shape of the exposing portions depending on the pattern of the film.
  • FIG. 8 illustrates a laminated member grown with various sections.
  • the electroforming member may be grown in various sections. That is, the electroforming member may be grown either vertically in a curve or with a step difference.
  • the electroforming member can be grown vertically in various shapes by forming an exposing portion varied depending on patterns of a film.
  • the shape of metal layers can be varied by sequentially performing the electroforming process in the varied exposing portion. That is, metal layers can be formed in various shapes by varying the pattern of the film little by little.
  • exposing portions 17, 18 and 19 are formed with varied shapes over three times and metal layers 22, 21 and 20 are formed on the space formed by the exposing portions. Therefore, the laminated electroforming member can be obtained in various shapes.
  • the laminated electroforming member having a curved shape can be obtained.
  • the laminated electroforming member with multiple layers if the exposing portions are formed in the same position using the same film, the exposing portions are accumulated vertically. In this case, metal layers are also grown vertically. However, if the film is exposed with varying its pattern little by little and the metal layers are formed with varying the position of the exposing portions, the multi-layered electroforming member can be varied vertically in its shapes. In other words, the laminated electroforming member of various shapes can be obtained. In FIG. 8, the laminated electroforming member that can be grown vertically in various shapes is shown and it is detached from the electrode base.
  • the laminated electroforming member of the present invention growth of electroforming metal is limited by the shape of the exposing portion. Therefore, a desired metal pattern can be obtained by varying the shape of the exposing portion. Also, to form the laminated electroforming member at a desired thickness, the height of the exposing portion can be increased by increasing metal layers in response to the thickness of the electroforming member. In the conventional electroforming process, the electroforming member higher than a certain height cannot be obtained because the photoresist has limitation in its thickness. However, in the present invention, the electroforming member of which laminate has an increased height at a desired thickness can be obtained by repeatedly performing the electroforming process.

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Abstract

A method for manufacturing a laminated electroforming member includes the steps of forming a conducting portion on a surface of an electrode base at the same shape as that of the laminated electroforming member, forming an insulating portion insulated by an exposing portion of photoresist and interposed in the conducting portion, forming metal layers on the conducting portion by repeatedly performing an electroforming process in the electrode base, forming exposing portions in the insulating portion by repeatedly performing an exposing process, the height of the exposing portions and the height of the metal layers being increased as they are repeatedly formed in turn, and removing the metal layers from the electrode base when the metal layers and the exposing portions reach a certain height. The layering process is repeated two or more times. If the exposing portions are formed at the same position as that of the first exposing portion, the electroforming member has a linear shaped section. However, if not so, the electroforming member has various curved sections, not linear shaped section.

Description

LAMINATE MADE BY ELECTRO-FORMING AND METHOD FOR MANUFACTURING THE SAME
TECHNICAL FIELD The present invention relates to a laminate made by an electroforming process, which is used for a minute conducting circuit in semiconductor and other electronic devices. The laminate has various shapes. That is, a pattern of different kinds of layered metals may be used as the laminate. The present invention relates to a method for manufacturing a metal laminate or different kinds of metal laminates, and more particularly to a laminate manufactured by layered metals. In the present invention, the laminate has a thickness of several microns or several tens of microns. The laminate has a thickness of several hundreds of microns as the case may be. Such a laminate having various shapes is defined as a laminated electroforming member.
Of metal laminates, a metal laminate having a pattern is used in various fields. A minute metal pattern has been conventionally manufactured by an etching process. However, the minute metal pattern is manufactured by an electroforming process in the present invention.
BACKGROUND ART
A conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist. However, a laminated electroforming member of the present invention can obtain a desired height by repeatedly performing an electroforming process. The conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various sections such as a stepped section or a curved section. Such a desired section can be obtained by repeatedly layering metal with varying the position of exposing portions. The conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion. The etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained. Also, the etching process has limitation in a processing pitch due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed.
However, in the present invention, a metal minute pattern or a laminated electroforming member is formed by an electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, since an exposing portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for an electroforming master in the present invention, waste of material is avoided.
DISCLOSURE OF THE INVENTION
Accordingly, the present invention is directed to a laminated electroforming member and a method for manufacturing the same that ' substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide an electroforming member and a method for manufacturing the same in which a photoresist is deposited on an electrode base to obtain electroforming metal of a certain thickness. Whenever the thickness of the electroforming member can be increased at a desired height by layering electroforming metals by performing an electroforming process in an electrode base. In the conventional electroforming method based on a register, since the height of the register is limited, the thickness of the electroforming member is also limited by the register. However, in the present invention, the height of the electroforming member can be adjusted by repeatedly performing the electroforming process.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the scheme particularly pointed out in the written description and claims hereof as well as the appended drawings .
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a method for manufacturing a laminated electroforming member includes the steps of forming a conducting portion on a surface of an electrode base at the same shape as that of the laminated electroforming member, forming an insulating portion insulated by an exposing portion of photoresist and interposed in the conducting portion, forming metal layers on the conducting portion by repeatedly performing an electroforming process in the electrode base, and forming exposing portions in the insulating portion by repeatedly performing an exposing process, the height of the exposing portions and the height of the metal layers being increased as they are repeatedly formed in turn.
A laminated electroforming member is made by including a basic process forming a first metal layer in a first space portion by performing an electroforming process in an electrode base, the electrode base being made by forming a first exposing portion and the first space portion through exposing and washing processes of photoresist deposited on an electrode base basic material, and a layering process forming metal layers by depositing again the photoresist on the first metal layer and the first exposing portion, forming exposing portions and a space portion through exposing and washing processes of the photoresist, and forming the metal layers by performing the electroforming process in the space portion. The layering process is repeated two or more times. The exposing portions have the same shape as that of the first exposing portion in the same position while the metal layers have the same shape as that of the first metal layer in the same position. The exposing portions and the metal layers have small difference from the first exposing portion and the first metal layer in their shapes. The metal layers are formed of different kinds of metals. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings: FIG. 1 illustrates a metal minute pattern which is one example of an electroforming member according to the present invention;
FIG. 2 illustrates a basic process for forming an electroforming member according to the present invention; FIG. 3 illustrates an electroforming member formed by performing an electroforming process in an electrode base in the basic process;
FIG. 4 illustrates the processes of forming an exposing portion, and forming metal layers through a repeated electroforming process;
FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process;
FIG. 6 illustrates detachment of a laminated electroforming member;
FIG. 7 illustrates a laminated electroforming member of different kinds of metals; and
FIG. 8 illustrates a laminated electroforming member grown with various sections.
BEST MODE FOR CARRYING OUT THE INVENTION
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings . A conducting portion and an insulating portion are formed on the surface of an electrode base. The conducting portion has the same shape as that of a desired electroforming member. The insulating portion is formed by an exposing portion of photoresist and interposed in the conducting portion. Metals are layered on the conducting portion by repeatedly performing an electroforming process. Exposing portions are accumulated on the insulating portion.
Once the electroforming process is implemented in the electrode base within the electroforming tub, metal ion starts to be grown in the conducting portion. When the metal layers and the exposing portions are grown at a desired height, the metal layers are removed from the electrode base. Thus, the laminated electroforming member is completed. In the present invention, the layering processes are repeated twice or more. The laminated electroforming member is made by including a basic process forming a first metal layer by performing an electroforming process in an electrode base and a layering process forming metal layers and exposing portions on the electrode base. In case that the exposing portions are formed in the same position as that of the first exposing portion, the laminated electroforming member has a linear shaped section. However, if the positions of the first exposing portion and the laminated exposing portions are varied in the layering process, the laminated electroforming member can obtain various sections, not the linear section.
FIG. 1 illustrates a metal minute pattern which is one example of an electroforming member according to the present invention. A pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits. To obtain such a metal minute pattern, a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as metal minute patterns. In the present invention, to manufacture the laminated electroforming member having a pattern, a conducting portion and an insulating portion are formed on the surface of the electrode base using a film.
FIGs. 2 to 6 illustrate the processes of manufacturing a laminated electroforming member according to the present invention.
FIG. 2 illustrates the basic process in the present invention. A photoresist 2 is deposited on an electrode base basic material 101, and light is scanned onto the film to expose the photoresist. The exposed photoresist is removed by a washing process to form a space portion 4. The exposing portion is defined as the first exposing portion 3 and the space portion is defined as the first space portion 4. The electrode base basic material in which the exposing portion and the space portion are formed is defined as the electrode base 1.
The electrode base basic material is generally of a plate shaped material of conductor. An example of the electrode base basic material includes stainless steel plate which is well polished. The stainless steel plate of nickel or copper is widely used because it is likely to be detached from the electroforming member and has strong intensity. Since the portion below the electrode base is not important technically in the present invention, its description will be omitted. However, it is preferable that the portion below the electrode base is to be insulated so that it does not undergo the electroforming process.
FIG. 3 illustrates an electroforming member formed by performing an electroforming process in an electrode base in the basic process. Once the electroforming process is started in an electroforming tub by connecting a negative electrode (-) to the electrode base 1, ionized metal starts to be coupled with the electrode base 1. The ionized metal starts to be formed in the electrode base as a minute pattern of a thin metal. Once the electroforming process is implemented in the electroforming tub, metal ion starts to be grown on the surface of the electrode base exposed in the first exposing portion 3. With the lapse of time, a first metal layer 3 is formed at the height of the first exposing portion.
FIG. 4 illustrates the processes of forming an exposing portion, and forming metal layers through an electroforming process. A first metal layer 6 is grown in the electrode base 1 at the height of the first exposing portion 3. A photoresist layer 7 is deposited in a state that the first metal layer is grown. An exposing portion 9 is formed in the photoresist layer. The photoresist except for that of the exposing portion is removed by a washing process to form a space portion 9. The electroforming process is then implemented in the electrode base 1 so that a second metal layer 10 is grown in the space portion at the height of the exposing portion 8.
FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process. A photoresist layer 12 is again deposited on the electrode base where the exposing portion 8 and the second metal layer 10 are formed. An exposing portion 13 is formed in the photoresist layer. The photoresist except for that of the exposing portion 13 is removed by a washing process to form a space portion 14. The electroforming process is then implemented in the electrode base so that a third metal layer 16 is grown in the space portion at the height of the exposing portion 13. FIG. 6 illustrates detachment of the laminated electroforming member. When the exposing portions and metal layers 6, 10 and 16 are formed at a desired height, the metal layers are removed from the electrode base so that a desired laminated electroforming member can be obtained. A shape of the exposing portion protruded upward of the surface of the electrode base serves as a factor that determines a shape of the laminated electroforming member. The photoresist generally used fails to form the thick exposing portion at once. However, the laminated electroforming member can thickly be formed by the layering process of the exposing portion and the metal layers according to the present invention. In this respect, the present invention will be remarkable. FIG. 7 illustrates a laminated electroforming member of different kinds of metals. The laminated electroforming member can be formed by sequentially layering different kinds of metals such as copper, nickel, and gold through the electroforming process. Also, the metal pattern of a specific pattern or the laminated electroforming member can be formed by varying the shape of the exposing portions depending on the pattern of the film.
FIG. 8 illustrates a laminated member grown with various sections. The electroforming member may be grown in various sections. That is, the electroforming member may be grown either vertically in a curve or with a step difference. The electroforming member can be grown vertically in various shapes by forming an exposing portion varied depending on patterns of a film. The shape of metal layers can be varied by sequentially performing the electroforming process in the varied exposing portion. That is, metal layers can be formed in various shapes by varying the pattern of the film little by little. In FIG. 8, exposing portions 17, 18 and 19 are formed with varied shapes over three times and metal layers 22, 21 and 20 are formed on the space formed by the exposing portions. Therefore, the laminated electroforming member can be obtained in various shapes. In case that metal layers are formed a number of times and the height of metal layers and exposing portions is low, the laminated electroforming member having a curved shape can be obtained. To obtain the laminated electroforming member with multiple layers, if the exposing portions are formed in the same position using the same film, the exposing portions are accumulated vertically. In this case, metal layers are also grown vertically. However, if the film is exposed with varying its pattern little by little and the metal layers are formed with varying the position of the exposing portions, the multi-layered electroforming member can be varied vertically in its shapes. In other words, the laminated electroforming member of various shapes can be obtained. In FIG. 8, the laminated electroforming member that can be grown vertically in various shapes is shown and it is detached from the electrode base.
INDUSTRIAL APPLICABILITY In the laminated electroforming member of the present invention, growth of electroforming metal is limited by the shape of the exposing portion. Therefore, a desired metal pattern can be obtained by varying the shape of the exposing portion. Also, to form the laminated electroforming member at a desired thickness, the height of the exposing portion can be increased by increasing metal layers in response to the thickness of the electroforming member. In the conventional electroforming process, the electroforming member higher than a certain height cannot be obtained because the photoresist has limitation in its thickness. However, in the present invention, the electroforming member of which laminate has an increased height at a desired thickness can be obtained by repeatedly performing the electroforming process.
Furthermore, in the present invention, since various kinds of metals can sequentially be layered by the electroforming process, the boundary that can be formed when the metal layers are formed does not occur.
While the present invention has been described and illustrated herein with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made therein without departing from the spirit and scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention that come within the scope of the appended claims and their equivalents.

Claims

What is claimed is:
1. A laminated electroforming member made by comprising: a basic process forming a first metal layer in a first space portion by performing an electroforming process in an electrode base, the electrode base being made by forming a first exposing portion and the first space portion through exposing and washing processes of photoresist deposited on an electrode base basic material; and a layering process forming metal layers by 'depositing again the photoresist on the first metal layer and the first exposing portion, forming exposing portions and a space portion through exposing and washing processes of the photoresist, and forming the metal layers by performing the electroforming process in the space portion.
2. The laminated electroforming member according to claim 1, wherein the layering process is repeated two or more times .
3. The laminated electroforming member according to claim 1 or 2, wherein the exposing portions have the same shape as that of the first exposing portion in the same position while the metal layers have the same shape as that of the first metal layer in the same position.
. The laminated electroforming member according to claim 1 or 2, wherein the exposing portions and the metal layers have small difference from the first exposing portion and the first metal layer in their shapes.
5. The laminated electroforming member according to claim 1 or 2, wherein the metal layers are formed of different kinds of metals.
6. A method for manufacturing a laminated electroforming member comprising: a basic process forming a first metal layer in a first space portion by performing an electroforming process in an electrode base, the electrode base being made by forming a first exposing portion and the first space portion through exposing and washing processes of photoresist deposited on an electrode base basic material; and a layering process forming metal layers by depositing again the photoresist on the first metal layer and the first exposing portion, forming exposing portions and a space portion through exposing and washing processes of the photoresist, and forming the metal layers by performing the electroforming process in the space portion.
7. The method according to claim 6, wherein the layering process is repeated two or more times.
8. The method according to claim 6 or 7, wherein the exposing portions have the same shape as that of the first exposing portion in the same position while the metal layers have the same shape as that of the first metal layer in the same position.
9. The method according to claim 6 or 7 , wherein the exposing portions and the metal layers have small difference from the first exposing portion and the first metal layer in their shapes.
10. The method according to claim 6 or 7, wherein the metal layers are formed of different kinds of metals.
11. A method for manufacturing a laminated electroforming member comprising the steps of: forming a conducting portion on a surface of an electrode base at the same shape as that of the laminated electroforming member; forming an insulating portion insulated by an exposing portion of photoresist and interposed in the conducting portion; forming metal layers on the conducting portion by repeatedly performing an electroforming process in the electrode base; forming exposing portions in the insulating portion by repeatedly performing an exposing process, the height of the exposing portions and the height of the metal layers being increased as they are repeatedly formed in turn; and removing the metal layers from the electrode base when the metal layers and the exposing portions reach a certain height.
PCT/KR2003/002856 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same WO2004064156A1 (en)

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KR1020030002231A KR20040064191A (en) 2003-01-09 2003-01-09 Electroforming material of stacked thin film and fabricating method thereof
KR10-2003-0002231 2003-01-09

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PCT/KR2003/002856 WO2004064156A1 (en) 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same
PCT/KR2004/000021 WO2004064135A1 (en) 2003-01-09 2004-01-09 Composite shape electroforming member, its electroforming master and method for manufacturing the same

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KR100980217B1 (en) * 2004-12-17 2010-09-06 삼원에프에이 (주) Master of Electro-forming
JP5786906B2 (en) * 2013-08-02 2015-09-30 オムロン株式会社 Manufacturing method of electroformed parts
KR102138719B1 (en) * 2013-09-27 2020-07-28 인텔 코포레이션 Forming layers of materials over small regions by selective chemical reaction including limiting encroachment of the layers over adjacent regions

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JP2000313985A (en) * 1999-04-27 2000-11-14 Ricoh Co Ltd Electroforming original plate and its production, electroforming parts and their production as well as production of diaphragm

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AU2003289537A1 (en) 2004-08-10
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WO2004064155A1 (en) 2004-07-29
KR20040064191A (en) 2004-07-16

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