AU2003289537A1 - Laminate made by electro-forming and method for manufacturing the same - Google Patents

Laminate made by electro-forming and method for manufacturing the same

Info

Publication number
AU2003289537A1
AU2003289537A1 AU2003289537A AU2003289537A AU2003289537A1 AU 2003289537 A1 AU2003289537 A1 AU 2003289537A1 AU 2003289537 A AU2003289537 A AU 2003289537A AU 2003289537 A AU2003289537 A AU 2003289537A AU 2003289537 A1 AU2003289537 A1 AU 2003289537A1
Authority
AU
Australia
Prior art keywords
electro
manufacturing
forming
same
laminate made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003289537A
Inventor
Jeong-Sik Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRAPHION TECHNOLOGIES USA LLC
Original Assignee
GRAPHION TECHNOLOGIES USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GRAPHION TECHNOLOGIES USA LLC filed Critical GRAPHION TECHNOLOGIES USA LLC
Publication of AU2003289537A1 publication Critical patent/AU2003289537A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
AU2003289537A 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same Abandoned AU2003289537A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020030002231A KR20040064191A (en) 2003-01-09 2003-01-09 Electroforming material of stacked thin film and fabricating method thereof
KR10-2003-0002231 2003-01-09
PCT/KR2003/002856 WO2004064156A1 (en) 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same

Publications (1)

Publication Number Publication Date
AU2003289537A1 true AU2003289537A1 (en) 2004-08-10

Family

ID=32709865

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2003289514A Abandoned AU2003289514A1 (en) 2003-01-09 2003-12-23 Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master
AU2003289537A Abandoned AU2003289537A1 (en) 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AU2003289514A Abandoned AU2003289514A1 (en) 2003-01-09 2003-12-23 Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master

Country Status (3)

Country Link
KR (1) KR20040064191A (en)
AU (2) AU2003289514A1 (en)
WO (3) WO2004064155A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100980217B1 (en) * 2004-12-17 2010-09-06 삼원에프에이 (주) Master of Electro-forming
JP5786906B2 (en) * 2013-08-02 2015-09-30 オムロン株式会社 Manufacturing method of electroformed parts
EP3050084A4 (en) * 2013-09-27 2017-05-24 Intel Corporation Forming layers of materials over small regions by selective chemical reaction including limiting encroachment of the layers over adjacent regions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100557A (en) * 1979-01-25 1980-07-31 Dainippon Printing Co Ltd Electroforming method
JPS61208245A (en) * 1985-03-13 1986-09-16 Kyushu Hitachi Maxell Ltd Manufacture of lead frame for semiconductor device
JPS62241347A (en) * 1986-04-14 1987-10-22 Hitachi Ltd Manufacture of carrier tapes through electroforming
JPH02132834A (en) * 1988-11-14 1990-05-22 Toshiba Corp Wiring structure of semiconductor device
JPH02137915A (en) * 1988-11-18 1990-05-28 Sharp Corp Manufacture of stamper
JPH03146652A (en) * 1989-11-02 1991-06-21 Kenseidou Kagaku Kogyo Kk Production of metallic parts having holes of fine pattern and master used therein
JP3588879B2 (en) * 1995-11-09 2004-11-17 松下電器産業株式会社 Fine pattern forming method
JPH10319222A (en) * 1997-05-16 1998-12-04 Matsushita Electric Ind Co Ltd Production of fine pattern
JP2000313985A (en) * 1999-04-27 2000-11-14 Ricoh Co Ltd Electroforming original plate and its production, electroforming parts and their production as well as production of diaphragm
KR200203507Y1 (en) * 2000-03-28 2000-11-15 김정식 Shadow mask

Also Published As

Publication number Publication date
AU2003289514A1 (en) 2004-08-10
KR20040064191A (en) 2004-07-16
WO2004064156A1 (en) 2004-07-29
WO2004064155A1 (en) 2004-07-29
WO2004064135A1 (en) 2004-07-29

Similar Documents

Publication Publication Date Title
AU2003266682A1 (en) Laminated magnetic component and process for producing the same
AU2003301975A1 (en) An integrated structure and method for fabricating the same
AU2003273249A1 (en) Laminate structures, methods for production thereof and uses therefor
EP1784267A4 (en) Stent and method for manufacturing the stent
EP1818187A4 (en) Laminate, method for producing the same and tire using the same
AU2003252238A1 (en) Piezoelectric component and method for manufacturing the same
EP1743915A4 (en) Oriented film, process for producing the same and laminate thereof
AU2003224081A1 (en) Method for producing a semiconductor component, and semiconductor component produced by the same
AU2003291551A1 (en) Magnetoelectronics device and method for fabricating the same
AU2003297870A1 (en) Reinforced fabric substrate and method for making the same
AU2003248626A1 (en) Method for fabricating three dimensional sturctures
AU2003303291A1 (en) Composite camouflage construction and method for manufacturing composite camouflage construction
AU2003252239A1 (en) Piezoelectric component and method for manufacturing the same
PL1663669T3 (en) Decorative laminate and method for producing the same
AU2002359078A1 (en) Disasemble resin and the manufacturing method for thereof
EP1606108A4 (en) Double-sided metallic laminate and method for manufacturing the same
AU2003207217A1 (en) Method for manufacturing honeycomb structure
AU2003209383A1 (en) Photomask and method for manufacturing the same
AU2003242451A1 (en) Polymeric laminates, processes for producing the same, and use thereof
AU2003273369A1 (en) Driveway, driveway module, and method for the production thereof
AU2003215592A1 (en) Lightweight construction element and method for producing the same
PL371193A1 (en) Multilayered films, method for the production and use thereof
AU2003292754A1 (en) Composition for forming silicon7aluminum film, silicon7aluminum film and method for forming the same
AU2003289537A1 (en) Laminate made by electro-forming and method for manufacturing the same
AU2003223846A1 (en) Layered structures and method for producing the same

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase