JPH10319222A - Production of fine pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively produce fine patterns of high accuracy by improving the reliability and durability of a master plate in a process for producing the fine patterns by a transfer method. SOLUTION: Groove parts 3 having the reverse patterns of the fine patterns of prescribed shapes are formed on the surface of a metallic substrate 1 by a prescribed processing method. Insulative low melting glass 5 consisting essentially of lead oxide or tellurium oxide is melted and is packed into these groove parts 3. Thereafter, the surface described above of the metallic substrate 1 is subjected to polishing, by which the master plate for transfer comprising metallic electrode parts 7 and insulating parts 6 consisting of the low melting glass 5 is manufactured. The fine pattern thin films are formed by an electrodeposition method or plating method on the electrode parts 7 via water-repellent release layers on this master plate. At least these fine pattern thin films are transferred to another substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a master substrate serving as an electrodeposition substrate or a plating substrate when a metal film, a resin film, or the like is produced by transfer in a method for producing a fine pattern, and relates to a wiring pattern, an optical scale and a color filter. And the like.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a fine pattern, a photolithography technique often used in a semiconductor process is representative. Photolithography technology forms a fine pattern on a metal film by applying a series of steps such as applying a photoresist, exposing using a photomask, and developing and cleaning using a specific chemical for each product. A fine color filter made of a resin film is made by forming a photoresist of a fine pattern and then performing etching to produce a wiring pattern made of a metal film, or by repeatedly forming a resist pattern colored for each color repeatedly. ing. This method can produce very fine patterns with high precision and thus is of high quality, but on the other hand, the manufacturing process is complicated and requires a laborious manufacturing process for each product. As a result, the manufactured product is expensive because an expensive apparatus is required. On the other hand, as a method for forming a fine pattern at low cost, there is a printing method for directly forming a fine pattern on a substrate surface. The printing method includes an offset printing method, a screen printing method, and the like. In any of the methods, the pattern accuracy is low due to the fluidity or transfer failure of the ink or paste, and the reproducibility is poor. Because
It was not suitable for forming a fine pattern. Therefore, a photolithography technique which is expensive but has high accuracy and excellent quality is mainly used.

[0003] Under such circumstances, there has been a demand for a method capable of forming a fine pattern with high precision, which simplifies the manufacturing process and is economically inexpensive.
Therefore, in forming a fine pattern, in order to simplify the manufacturing method and reduce the cost, a transfer method has been devised which has improved manufacturing accuracy while having a manufacturing process similar to the printing method. The transfer method described here is to prepare a transfer substrate as a master plate on which an electrode having a high-precision fine pattern is formed in advance by using a photolithography technique or the like, and to perform electrodeposition on the electrode of the master plate. Form a fine pattern thin film such as a resin film or a metal film by the method or plating method,
In this method, a fine pattern is transferred onto another substrate to be transferred by peeling off the fine pattern thin film. In this transfer method, high accuracy is ensured by preparing a master plate having a fine pattern in advance, and if the reliability and durability of the master plate are good, photolithography is performed for each product when manufacturing the product. This is a method that can achieve economical cost reduction because there is no need to use technology. A conventional device relating to this transfer method will be described below.

According to Japanese Patent Application Laid-Open No. 52-50572, a substrate in which a plating resist pattern is formed on a mirror plate such as a stainless steel plate by a silk screen method or a resist pattern is formed by a photoresist method is called a so-called substrate. As a master plate for transfer, a wiring pattern formed on the master plate is pressed against a prepreg and adhered by heating. The master plate used here is formed by forming a resist having a so-called negative pattern on the surface of a conductive mirror plate. According to the disclosure of JP-A-54-7170, an electrically insulating resist film showing a negative image of a wiring pattern is formed on the surface of a conductive substrate such as a stainless steel plate or an electrically insulating resist such as glass or ceramic. A substrate on which a conductive metal thin-film image showing a positive image of a wiring pattern is formed on the surface of the substrate is referred to as a master plate, and a metal and an electrically insulating support formed on the master plate by an electrodeposition method. Is to be peeled off. The master plate used here has a structure in which a resist having a so-called negative pattern is formed on the surface of a conductive mirror plate, or a structure in which a conductive metal film having a positive pattern is arranged on the surface of an insulating mirror plate. It has become. Similarly, according to the disclosure of Japanese Patent Application Laid-Open No. 4-9902, an electrodeposition substrate having an insulating resist such as a photoresist remaining in a pattern on a conductive layer is used as a so-called master plate, and a resin paint is electrodeposited. The formed electrodeposition resin paint is transferred onto the pattern forming substrate by applying a high voltage or the like.

As described above, various methods have been devised for the transfer method. However, in order to achieve a low price in the production of fine patterns, the reliability and durability of a master plate prepared in advance are good. It is assumed that the accuracy of the fine pattern on the master plate is good in order to ensure the accuracy of the fine pattern.
The master plate according to the above invention forms a negative pattern made of a resist on a flat conductive substrate or forms a positive pattern of a conductive metal thin film on a flat insulating substrate, and has a predetermined pattern. The structure is such that the resist is easily damaged during peeling transfer. The tendency of the resist and the like to be damaged becomes remarkable when the fine pattern thin film formed on the master plate is dried or forcibly peeled off by heating, voltage application or the like.

[0006] In the transfer method, the master plate is extremely important, but many of the conventional master plates are not particularly satisfactory in terms of reliability and durability. Attention has been paid to such a master version, and a device for improving reliability has been devised. According to the disclosure of JP-A-61-170091,
As a method of manufacturing a printed wiring board, a groove was provided on the surface of the metal plate leaving a portion corresponding to the conductor pattern, the board surface was covered with resin so that the resin was embedded in the groove, and the resin surface was ground and left. The original plate having the exposed metal surface is used as a so-called master plate, in which the surface of the exposed metal plate is plated for wiring, and then the conductor pattern is transferred onto an adhesive substrate. Similarly, according to the disclosure of Japanese Patent Application Laid-Open No. Hei 7-15115, a so-called electrodeposition transfer master in which a concave portion is formed in a conductive substrate and various resins such as an acrylic resin and an alkyd resin are disposed in the concave portion is provided. , Used as a master version. Further, according to the disclosure of Japanese Patent Application Laid-Open No. 8-125308, an insulating material having a convex pattern corresponding to a wiring pattern to be transferred onto a transfer surface of a transfer plate body, and a plastic material such as Teflon coated between the convex patterns. The transfer plate on which the pattern is formed transfers a wiring pattern formed by plating or the like as a so-called master plate.

[0007] The above-mentioned invention has a configuration in which a groove such as a concave portion is formed in a conductive substrate as a master plate, and a filler such as various resins is arranged in the groove. Since the object and the conductive electrode portion become substantially flat, the durability of the master plate when peeling the fine pattern thin film formed by the electrodeposition method or the plating method is improved. However, since the filler formed in the groove of the master plate is the above-mentioned resin or the like, the mechanical strength and the adhesive force to the conductive substrate are not sufficient, and when the fine pattern thin film is peeled off, these fillers may be removed. They are easily damaged or missing, and are likely to cause deterioration of fine patterns during peeling transfer.
When heat and pressure are used for peeling transfer, the fine pattern is forcibly peeled off, and the possibility of shortening the life of the master plate and deteriorating the fine pattern due to damage to the filler increases.

[0008]

In the transfer method described above, a fine pattern thin film is formed on a master plate by various methods, and the thin film is formed on another substrate. It is not necessary to use a photolithography method for each product when forming the fine pattern, and the master substrate can be used repeatedly, so that the fine pattern can be easily and inexpensively manufactured in a very simple process. It is with.

However, in the above-described transfer method, it is difficult to say that the reliability and durability of the important master plate are necessarily good. This is because the master plate requires a rigid body that does not expand or contract to ensure high accuracy.To do so, a conductive positive pattern electrode must be formed on a glass or ceramic insulating substrate, Alternatively, it is necessary to form a negative pattern insulating layer on a conductive substrate such as a metal. Here, when an insulating substrate made of glass or ceramic is used, there are problems that it is easily broken, requires delicate care in handling, and makes it difficult to produce a large-area master plate. Conversely, when forming a negative pattern insulating layer on a conductive substrate,
Since the insulating layer itself is formed of a resin such as a resist, there is a problem in repetition durability and reliability due to peeling or chipping at the same time as peeling and transferring of the fine pattern thin film. However, simply providing a groove in the conductive master plate and filling the resin such as a resist with the resin does not provide sufficient mechanical strength and adhesion to the conductive substrate, leading to a significant improvement in durability and the like. In addition, it becomes difficult to secure the precision of the fine pattern on the master plate.

Therefore, in the transfer method, the durability and the service life of the master plate are improved by repeated use so that high reliability in handling can be obtained.
In addition, a method of manufacturing a high-precision fine pattern at low cost and with high reliability is to prevent the fine pattern from being forcibly peeled off from the master plate by heating at a high temperature or the like.

The present invention relates to a method for manufacturing a fine pattern by a transfer method, wherein a high precision fine pattern can be produced inexpensively and reliably by improving the reliability and durability of the master plate. The purpose is to provide.

[0012]

According to the present invention, there is provided a method for manufacturing a fine pattern, comprising the steps of: forming a reverse pattern of a fine pattern having a predetermined shape on a surface of a conductive metal substrate by a predetermined processing method; To form a groove portion, melt the insulating low-melting glass containing lead oxide or tellurium oxide as a main component, fill the groove portion, and then polished the surface of the metal substrate, metal A master plate preparing step of preparing a transfer master plate composed of an electrode portion and an insulating portion made of the low-melting glass, and a water-repellent release layer made of a terminal-based fluorine compound on the master plate. Forming a fine pattern thin film by electrodeposition or plating on the electrode portion, and transferring a fine pattern thin film to a substrate to be transferred via at least the adhesive layer through an adhesive layer; The master is made by filling an insulating low-melting glass with good fluidity, high mechanical strength and strong adhesion to the grooves in the grooves of the reverse pattern provided on the conductive metal substrate. Not only can the durability and reliability of the plate be improved, but also a fluorine compound with a terminal base is provided as a release layer, so that fine patterns can be repeatedly peeled and transferred with good reproducibility, and high-precision fine patterns can be manufactured at low cost. It can be manufactured with high reliability. Here, by forming a protective layer selected from chromium, chromium nitride, silicon oxide, and aluminum oxide in the groove, a reaction between the low-melting glass and the metal substrate can be suppressed, and the accuracy of the electrode portion is stably secured. , A high-precision fine pattern can be manufactured. These glasses have a softening point of 6
A sealing glass at a temperature of 00 ° C. or lower is desirable. Furthermore, if a nickel-based or copper-based metal substrate is used as a metal substrate, not only can a groove having an inverse pattern of a fine pattern be easily formed, but also a fine pattern thin film can be formed by an electrodeposition method or a plating method. Can be repeatedly performed with high reliability.

The method for producing a fine pattern according to the present invention comprises:
On a surface of a metal substrate having conductivity and ferromagnetism, a groove having a reverse pattern of a fine pattern of a predetermined shape is formed by a predetermined processing method, and the groove is formed by a sputtering method, an evaporation method, a plating method, or an electrophoresis method. Chrome in the groove,
Forming a protective layer selected from chromium nitride, silicon oxide and aluminum oxide, melting an insulating low-melting glass containing lead oxide or tellurium oxide as a main component on the protective layer and filling the groove; A master plate preparation step of polishing the surface of the metal substrate later to prepare a transfer master plate composed of a metal electrode part and an insulating part made of the low-melting glass, After magnetizing in the direction, a fine pattern thin film is formed on the master plate by an electrodeposition method or a plating method via a water-repellent release layer made of a fluorine compound with a terminal group on the master plate. The fine pattern thin film is transferred to the substrate to be transferred via the adhesive layer while applying a magnetic field in the direction in which the master plate is adsorbed from the material side, and then the master is transferred from the substrate to be transferred. A fine pattern thin film forming step of applying a magnetic field in a direction that repels the magnetic field, and filling an insulating low-melting-point glass in a reverse pattern groove provided on a conductive and ferromagnetic metal substrate. The durability and reliability of the master plate can be improved by doing so, and the adhesion and removal of the master plate to and from the substrate to be transferred can be indirectly performed by magnetic force. Since the fine pattern can be repeatedly peeled and transferred with good reproducibility, a high-precision fine pattern can be manufactured at low cost and with high reliability. Here, as these glasses, a sealing glass or a bonding glass having a softening point of 330 ° C. or more and 600 ° C. or less is desirable. Further, by using a ferromagnetic metal substrate containing nickel as a main component or an alloy of manganese and aluminum as a main component as a metal substrate, a groove forming process is easy and the effect of magnetic force can be enhanced.

As a predetermined processing method in the present invention, a resist layer having a reverse pattern of a fine pattern having a predetermined shape is formed by a photolithography technique using a photosensitive resist and a photomask. Alternatively, when an etching method using a reactive ion etching apparatus or the like to form a groove portion and then remove the resist layer is used, a highly accurate fine pattern can be obtained. In addition, a blast method of forming a groove by a sand blasting device or a water blasting device using a metal mask in which a fine pattern portion of a predetermined shape becomes a mechanical shield, or a blade or a high-hardness drill with abrasive grains attached thereto When using a mechanical cutting method to form a groove directly on the surface of a metal substrate using a laser or a laser drawing method to form a groove by drawing using a high-power laser, photolithography technology can be used. Therefore, a fine pattern can be obtained particularly at low cost.

Further, the method for producing a fine pattern according to the present invention comprises:
On a surface of a plurality of plate-shaped metal substrates having conductivity, an insulating portion made of low-melting glass is formed using a sputtering method, an evaporation method, a precipitation method, or the like, and the plurality of metal substrates are bonded by heating and pressing. Forming a laminate in which the insulating portions are alternately laminated, and then polishing the end face of the laminate to form the end face including the metal electrode portion and the insulating portion made of the low-melting glass. A master plate preparing step of preparing a transfer master plate to be a thin film forming surface, and electrodeposition through a water-repellent release layer made of a fluorine compound having a terminal group on the thin film forming surface, which is the end surface of the master plate. A fine pattern thin film forming step of forming a long fine pattern thin film by a method or a plating method, and transferring at least the fine pattern thin film to a substrate to be transferred via an adhesive layer, A plate-shaped metal substrate having a conductivity,
By forming a laminated body in which an insulating layer made of insulating low-melting glass having strong mechanical strength and adhesiveness is laminated, not only can the durability and reliability of the master plate be improved, but also By providing a fluorine compound with a terminal group as a release layer, a fine pattern having a long shape can be repeatedly peel-transferred with good reproducibility, and a high-precision fine pattern can be manufactured at low cost and with high reliability. As these glasses, sealing glass containing lead oxide or tellurium oxide as a main component and having a softening point of 330 ° C. or more and 600 ° C. or less, or crystallized glass is desirable.

In the above method for producing a fine pattern according to the present invention, when an electrode portion having a plating film made of nickel on the surface is used as the electrode portion, the fine pattern can be formed with high precision without roughening the surface of the electrode. When transferring the fine pattern to the transfer substrate after immersing the fine pattern thin film in warm water when transferring the fine pattern thin film to the transfer substrate, it was immersed in the water repellency of the release layer The peeling transfer of the fine pattern can be performed extremely easily by the repulsive force of moisture. When a water-repellent release layer made of perfluoropolyether having a silane coupling group as a terminal group is used as the release layer, these are particularly effective in releasing and transferring fine patterns.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method for manufacturing a fine pattern according to the first aspect of the present invention, a groove which forms a reverse pattern of a fine pattern having a predetermined shape is formed on the surface of a metal substrate, and the groove is melted. Filling with insulating low melting point glass, polishing the surface of the metal substrate, having a pattern corresponding to the fine pattern, having an electrode portion made of the metal substrate and a pattern corresponding to the reverse pattern, A master plate preparation step of exposing an insulating portion made of a melting point glass to prepare a master plate for transfer, forming a water-repellent release layer on the master plate, and performing an electrodeposition method and a plating method on the release layer. A fine pattern thin film transfer step of forming a fine pattern thin film in a shape corresponding to the fine pattern by any of the above, and transferring the fine pattern thin film onto an adhesive layer on a substrate to be transferred,
This is a method for producing a fine pattern comprising: A master plate composed of an insulating portion provided with a low melting point glass having a strong adhesive force to a groove portion of a metal substrate having a reverse pattern of a fine pattern and a metal electrode portion can be easily manufactured. Since both parts have strong mechanical strength and strong adhesive force, high durability and long life of the master plate can be achieved during repeated use, high reliability in handling is obtained, and high precision Master version can be used. In addition, by forming a fine pattern thin film on the master plate via a water-repellent release layer made of a fluorine compound with terminal groups, the fine pattern thin film is not forcibly peeled off from the master plate, and the fine pattern thin film is damaged. Therefore, there is an effect that a high-precision fine pattern thin film can be manufactured at low cost and with high reliability.

In the method of manufacturing a fine pattern according to a second aspect of the present invention, the method of forming the groove in the master plate manufacturing step includes forming a predetermined shape by a photolithography technique using a photosensitive resist and a photomask. Forming a resist layer having a reverse pattern of the fine pattern,
2. The method for producing a fine pattern according to claim 1, wherein the groove is formed by an etching treatment using an acidic solution or an etching treatment using any of a reactive ion etching apparatus, and thereafter, the resist layer is removed. .
Basically, since a master plate is formed by photolithography technology, it is possible to obtain an electrode portion having an extremely high-precision fine pattern. An inexpensive, high-precision fine pattern thin film is used because the master plate is repeatedly used to perform subsequent steps. Can be produced.

The method of manufacturing a fine pattern according to claim 3 of the present invention is characterized in that, as the method of forming the groove in the master plate manufacturing step, a blast method using a metal blast, a blast method using a water blast apparatus, or a blade. 2. The method for manufacturing a fine pattern according to claim 1, wherein any one of a mechanical cutting method using any one of a drill and a laser and a laser drawing method is used. Since an electrode portion having a fine pattern can be formed on a master plate without using photolithography technology, it has an effect that a particularly inexpensive fine pattern thin film can be produced.

In the method of manufacturing a fine pattern according to a fourth aspect of the present invention, in the master plate forming step, the metal substrate is ferromagnetic, and in the fine pattern thin film transferring step, the master plate is moved in one direction. After magnetization, the fine pattern thin film is formed, and the fine pattern thin film is transferred onto the adhesive layer on the transfer substrate while applying a magnetic field in a direction to attract the master plate from the transfer substrate side. The method according to any one of claims 1 to 3, wherein a magnetic field is applied in a direction that rejects the master plate from the transfer-receiving substrate side thereafter. High durability and long service life of the master plate during repeated use can be achieved,
The ability to use a high-precision master plate that ensures high reliability in handling, the fact that the fine pattern thin film is not forcibly peeled off from the master plate and does not damage the fine pattern thin film, By forming a predetermined protective layer on the substrate, it is possible to manufacture a master plate having a stable fine pattern shape without deteriorating the accuracy of the end portion of the electrode portion having the predetermined shape fine pattern. Same as the invention. Further, according to the invention of claim 5, the use of a metal substrate having conductivity and hard magnetic properties enables the intimate contact and removal of the master plate with respect to the base material to be transferred by magnetic force, thereby achieving high precision. It has an effect that a fine pattern thin film can be manufactured very easily.

According to a fifth aspect of the present invention, there is provided the method of manufacturing a fine pattern, wherein insulating portions made of low-melting glass are formed on a plurality of metal substrates, and the metal substrates and the insulating portions are alternately laminated. Forming a laminate, polishing the end face of the laminate, exposing the electrode portion made of the metal substrate and the insulating portion made of the low-melting glass, and producing a master plate for transfer, A water-repellent release layer is formed on the master plate, a fine pattern thin film is formed on the release layer by any one of an electrodeposition method and a plating method, and the fine pattern thin film is transferred onto an adhesive layer on a substrate to be transferred. And a fine pattern thin film manufacturing step. The durability and reliability of the master plate are improved by forming a laminated body consisting of a conductive plate-shaped metal substrate and an insulating layer made of insulating low-melting glass with strong mechanical strength and adhesion. Not only can it be improved, but also a fluorine compound with a terminal group is provided as a peeling layer, and a fine pattern having a long shape can be repeatedly peeled and transferred with good reproducibility, and a long-sized fine pattern thin film can be manufactured at low cost and with high reliability It has the effect that it can be manufactured.

According to a sixth aspect of the present invention, in the method for manufacturing a fine pattern, the metal substrate is any one of a metal substrate mainly composed of nickel and a metal substrate mainly composed of copper. The method for producing a fine pattern according to any one of claims 1 to 4. By using a predetermined metal substrate,
In addition to the ability to easily form a groove having an inverse pattern to the fine pattern, the method has the effect that the formation of a fine pattern thin film by an electrodeposition method or a plating method can be repeatedly performed with high reliability.

According to a seventh aspect of the present invention, in the method for manufacturing a fine pattern, the metal substrate may be a ferromagnetic metal substrate mainly containing nickel or a ferromagnetic metal substrate mainly containing an alloy of manganese and aluminum. The method for producing a fine pattern according to claim 5, wherein By using a predetermined alloy as a metal substrate having ferromagnetic properties, not only can a groove of a reverse pattern of a fine pattern be easily formed, but also the formation of a fine pattern thin film by an electrodeposition method or a plating method with high reliability. It has the effect that it can be performed repeatedly.

The method of manufacturing a fine pattern according to claim 8 of the present invention, wherein a plating film containing nickel is provided on the surface of the electrode portion. It is a manufacturing method. By arranging a plating film made of nickel on the surface as the electrode part, it is possible to cover the rough surface of the electrode part which cannot be sufficiently removed even by polishing, and to produce a fine pattern thin film with high precision without roughness. Having.

In the method for manufacturing a fine pattern according to a ninth aspect of the present invention, the method of forming the insulating portion made of the low melting point glass is any one of a sputtering method, a vapor deposition method, and a sedimentation method. The method for producing a fine pattern according to claim 5, wherein This has the effect of forming a laminate in which insulating layers made of insulating low-melting glass having strong adhesiveness are laminated.

According to a tenth aspect of the present invention, in the method of manufacturing a master pattern, in the step of preparing a master plate, any one of a sputtering method, an evaporation method, a plating method, and an electrophoresis method is applied to the surface of the metal substrate. Using one, chrome,
The fine pattern according to any one of claims 1 to 9, wherein a protective layer containing any one of chromium nitride, silicon oxide, and aluminum oxide is formed, and the low-melting glass is formed on the protective layer. It is a manufacturing method of. The high durability and long life of the master plate during repeated use can be achieved, and a highly accurate master plate can be used that has high reliability in handling, and the fine pattern thin film is forcibly pulled from the master plate. It is the same as the first aspect of the present invention that the fine pattern thin film is not damaged without being peeled off. Further, according to the present invention, a predetermined protective layer is formed in a groove portion and a low melting point glass is filled to prevent a chemical reaction between the metal substrate and the low melting point glass. Since the precision of the end portion of the electrode portion having the pattern is not deteriorated, a master plate having a stable fine pattern shape can be manufactured, and a high-precision fine pattern thin film can be manufactured inexpensively and reliably.

[0027] In the method of manufacturing a fine pattern according to the present invention, the low melting point glass is a sealing glass mainly containing either lead oxide or tellurium oxide. It is a manufacturing method of the fine pattern of 1-10. This has the effect that an insulating part having a low-melting glass with a strong adhesive force can be manufactured.

[0028] In the method for producing a fine pattern according to the twelfth aspect of the present invention, the low melting glass has a softening point of 330 ° C.
The method for producing a fine pattern according to claim 11, wherein the sealing glass is 600 ° C or less.
By using a sealing glass or an adhesive glass having a softening point of 330 ° C. or higher as the low melting glass, a master plate having strong mechanical strength and sufficiently high reliability upon repeated use can be obtained. The use of sealing glass or adhesive glass at a temperature of 600 ° C. or less has an effect that a stable master plate can be easily manufactured without causing deterioration of the metal substrate.

A method for manufacturing a fine pattern according to a thirteenth aspect of the present invention is characterized in that, in the fine pattern thin film transfer step, the release layer is a water-repellent thin film made of a terminal-based fluorine compound. A method for manufacturing a fine pattern according to claim 1. By forming the fine pattern thin film on the master plate via a water-repellent release layer made of a terminal-based fluorine compound, the fine pattern thin film is not forcibly peeled off from the master plate, and the fine pattern thin film is damaged. Since it is not provided, it has the effect of producing a highly accurate fine pattern thin film at low cost and with high reliability.

The method for producing a fine pattern according to the present invention is characterized in that the release layer is a water-repellent release layer made of perfluoropolyether having a silane coupling group as a terminal group. A method for producing a fine pattern according to claim 13. By using perfluoropolyethylene having a silane coupling group as a terminal group, a uniform and stable water-repellent release layer can be produced, and a uniform fine pattern thin film can be formed on the electrode portion, and in particular, peel transfer of the fine pattern thin film It has the effect of being excellent in properties.

The method of manufacturing a fine pattern according to claim 15 of the present invention, in the fine pattern thin film transferring step, the fine pattern thin film is immersed in warm water, and then the fine pattern thin film is disposed on a substrate to be transferred. The method for producing a fine pattern according to any one of claims 1 to 14, wherein the image is transferred onto the provided adhesive layer. By immersing the fine pattern thin film in warm water, the water repellency of the release layer and the repulsive force of the immersed water have an effect that the fine pattern thin film can be peeled off from the master plate very easily.

An embodiment of the present invention will be described below. (Embodiment 1) A method of manufacturing a fine pattern according to Embodiment 1 of the present invention will be described with reference to FIGS.
In the first embodiment of the present invention, a method for manufacturing a fine pattern is used for manufacturing a fine optical scale.

FIGS. 1A to 1G are cross-sectional views of a main part showing a master plate manufacturing process according to the first embodiment of the present invention. First, as shown in FIG. 1A, a resist layer 2 having a fine pattern of a predetermined shape is formed on a surface of a metal substrate 1 having conductivity such as nickel by a photolithography technique using a photosensitive resist and a photomask. Using the resist layer 2 as an etching mask, an etching process is performed using an acidic solution such as a nitric acid solution or a reactive ion etching apparatus to form a groove 3 on the surface of the metal substrate 1 as shown in FIG. I do. Thereafter, the resist layer 2 is removed with an alkaline aqueous solution or the like, whereby the resist layer 2 shown in FIG.
A metal substrate 1 having a groove 3 having a reverse pattern of a fine pattern having a predetermined shape on the surface as shown in FIG.
Here, as shown in FIG. 1D, a protective layer 4 of chromium or the like is formed on the surface of the metal substrate 1 for the purpose of preventing a chemical reaction with the low melting point glass used in the subsequent steps. The protection layer 4 can be easily formed by using a vacuum thin film forming technique such as a sputtering method or a vapor deposition method or by using a wet thin film forming technique such as a plating method or an electrophoresis method, and is simple and practical. For this purpose, the thickness is desirably in the range of 0.1 μm or more and 10 μm or less. Next, as shown in FIG. 1E, a plate-like low melting point glass 5 is formed on the surface of the metal substrate 1 on which the protective layer 4 is formed.
And the low melting point glass 5 is heated and melted. FIG.
(F) shows a state in which the low melting glass 5 is filled in the grooves 3 on the surface of the metal substrate 1 after melting. The low melting glass 5 has an insulating property and can be melted at a low heating temperature. A sealing glass containing lead oxide or tellurium oxide as a main component is suitable. Here, as shown in FIG. 1 (g), the surface of the metal substrate 1 is mechanically polished using a grindstone, abrasive grains, or the like, which is called lapping or polishing, and unnecessary portions are removed. A master plate having a mirror-finished surface composed of a metal electrode portion 7 from which the substrate 1 is exposed and an insulating portion 6 made of low-melting glass 5 is manufactured. Since the insulating portion 6 filled with the low-melting glass 5 has a highly accurate reverse pattern of a fine pattern of a predetermined shape, the metal electrode portion 7 from which the metal substrate 1 is exposed has a predetermined shape. Has a fine pattern with high precision. Therefore, the master plate manufactured in this manner is composed of the insulating portion 6 in which the low-melting glass 5 having a strong adhesive force to the groove portion 3 of the metal substrate 1 is arranged, and the metal electrode portion 7.
Since both the electrode portion 7 and the insulating portion 6 have strong mechanical strength and strong adhesive force, it is possible to achieve high durability and long life of the master plate during repeated use and high handling. It is a high-accuracy master version that can obtain reliability.

The process of manufacturing a fine pattern thin film by repeatedly using the master plate manufactured as described above will be described below. 2 (a) to 2 (d) are cross-sectional views of essential parts showing a step of manufacturing a fine pattern thin film according to Embodiment 1 of the present invention. As shown in FIG. 2A, a repellent material made of a fluorine compound such as perfluoropolyether having a terminal group such as a silane coupling group attached to a surface formed of the electrode unit 7 and the insulating unit 6 on the surface of the metal substrate 1. The aqueous release layer 8 is formed thin.
This terminal group is composed of an insulating part 6 and an electrode part 7 made of low-melting glass.
This makes it possible to easily form a perfluoropolyether or the like having a strong water repellency as a release layer 8 in a thin state of about a monomolecular layer using a dip coating method or a coating method. Next, as shown in FIG. 2B, the electrodeposition method is performed by applying a voltage between the counter electrode and the electrode portion 7 of the metal substrate 1 in an electrodeposition solution containing a black pigment or the like. An electrodeposition film is formed on the electrode section 7 via the layer 8. This electrodeposition film becomes a fine pattern thin film 9 because the electrode portion 7 has a fine pattern shape on the metal substrate 1. The fluorine compound used as the water-repellent release layer 8 generally serves as an electrical insulator. However, if the release layer 8 is very thin and close to a monolayer, it can be electrodeposited in an electrodeposition solution. In this case, an electrodeposition film can be formed on the release layer 8. In this master plate, a fine pattern thin film 9 is formed on a metal substrate 1 with a release layer 8 interposed therebetween. In this state, as shown in FIG. Is immersed in warm water 10 at about 50 ° C. for about 1 minute to sufficiently impregnate the fine pattern thin film 9 with water. Thereafter, by removing the master plate from the warm water, the surface of the fine pattern thin film 9 is evaporated and removed, and the inside of the fine pattern thin film 9 in contact with the electrode portion 7 contains water and the repelling of the release layer 8 The adhesion is weakened by the water. Here, FIG.
As shown in FIG. 5, the fine pattern thin film 9 is peeled off from the electrode portion 7 of the master plate, and the transfer substrate 12 is
The fine pattern thin film 9 is transferred upward. The direction of the peeling transfer of the fine pattern thin film 9 is indicated by an arrow in FIG. 2D, and the fine pattern thin film 9 is in a state where the moisture on the surface is removed and the adhesive force to the electrode portion 7 is weakened. Therefore, peeling transfer can be easily performed with high precision by closely contacting and pressing the fine pattern thin film 9 to the transfer substrate 12 side on the master plate. In the process of manufacturing such a fine pattern thin film, peeling transfer is easily performed without damaging the fine pattern thin film, and the manufacturing method is to manufacture a high-precision fine pattern at low cost and with high reliability.

In the first embodiment of the present invention, the low melting point glass 5 containing lead oxide or tellurium oxide as a main component is used.
This is because not only is the mechanical strength and adhesion sufficiently high, but also it can be easily melted at a lower heating temperature as compared with a high melting point glass containing silicon oxide as a main component. . Here, the low-melting glass having a softening point of 330 ° C. or less has low mechanical strength and low reliability when the master plate is repeatedly used. Also, during the formation of the electrodeposited film, a large amount of lead or tellurium is eluted into the electrodeposition solution. Conversely, low-melting glass having a softening point of 600 ° C. or more easily causes deterioration of the metal substrate, and the characteristics of the master plate are unstable. Typical low-melting glass is a sealing glass containing lead oxide as a main component and sodium oxide or the like having a softening point of 330 ° C. and a thermal linear expansion coefficient of 130 × 10 ⁻⁷ per 1 ° C., Similarly, the sealing glass has a softening point of 520 ° C. and a linear expansion coefficient of 103 ×.
10 ^-7 and others. Similarly, the metal substrate 1 needs to be a material which is easy to etch and polish and has a small amount of elution in the electrodeposition solution. In particular, if a metal substrate containing nickel or copper as a main component is used, a nitric acid solution or hydrochloric acid can be used. Not only can grooves be easily formed by an etching method using a solution or the like, but also the formation of a fine pattern thin film by an electrodeposition method or a plating method can be repeatedly performed with high reliability. Have close thermal linear expansion coefficients, so that the matching between the low-melting glass and the metal substrate is good. In addition, with respect to the polished electrode portion 7 in which the metal substrate is exposed on the surface of the master plate, a high-precision fine pattern can be manufactured without roughening the surface by disposing a plating film made of nickel on the surface. .

The protective layer 4 is used to prevent a chemical reaction such as deterioration of the metal substrate when the low-melting glass is melted.
It is formed on the surface of the metal substrate 1 on which the grooves 3 are formed by using a sputtering method, a vapor deposition method, a plating method, an electrophoresis method, or the like. At least chromium, chromium nitride, silicon oxide, aluminum oxide, etc. has an effect of preventing the reaction. Is high. Although it is not always necessary to use a metal substrate that has little reaction with the low melting point glass, by providing this protective layer 4, even if various types of low melting point glass are used, a fine pattern having a predetermined shape can be obtained. Since the accuracy of the end of the electrode portion is not deteriorated, a master plate having a stable fine pattern shape can be manufactured, and the manufacturing method can reliably manufacture a high-precision fine pattern thin film.

Further, if the release layer 8 is a thin thin film of a fluorine compound having terminal groups, an electrodeposition film can be formed and water repellency can be imparted to the surface of the master plate. The terminal group is desirably a low-melting glass or a silane coupling group that easily adheres to the electrode portion, and a fluorine compound having strong water repellency is desirably perfluoropolyether or the like. Fluoropolyethers are particularly suitable.

As described above, the method for producing a fine pattern according to the first embodiment of the present invention has a good durability due to repeated use of the master plate, and has high reliability in handling because it is hard to break. Also, regarding the peeling transfer of the fine pattern thin film using this master plate, there is no need to forcibly peel off the fine pattern thin film by heating at a high temperature, etc. ing. Therefore, the method for manufacturing a fine pattern according to the first embodiment of the present invention is a method for manufacturing a fine pattern capable of producing a high-precision fine pattern inexpensively and reliably by improving the reliability and durability of the master plate. is there.

(Embodiment 2) A method of manufacturing a fine pattern according to Embodiment 2 of the present invention will be described below with reference to FIGS.
This will be described with reference to FIG. The second embodiment of the present invention is similar to the first embodiment, but uses a method for manufacturing a fine pattern for manufacturing a wiring board and the like.

FIGS. 3A to 3F are cross-sectional views of a main part showing a master plate manufacturing process according to the second embodiment of the present invention. First, as shown in FIG. 3A, a through-hole 14 having a reverse pattern of a fine pattern having a predetermined shape is provided, and a metal mask 13 in which the fine pattern portion serves as a mechanical shield.
And a metal substrate 1 having conductivity such as copper is prepared.
As shown in FIG. 2B, blast processing is performed with the metal mask 13 disposed on the surface of the metal substrate 1 to form the groove 3 having an inverted pattern. After cleaning the groove 3, FIG.
As shown in (c), a protective layer 4 made of silicon oxide or the like is formed on the surface of the metal substrate 1 by a sputtering method, a vapor deposition method, a plating method, It is formed using an electrophoresis method or the like. Next, FIG.
As shown in FIG. 1, a plate-shaped low-melting glass 5 is disposed on the surface of the metal substrate 1 on which the protective layer 4 is formed, and the low-melting glass 5 is heated and melted. FIG. 3E shows a state in which the low-melting glass 5 is filled in the groove 3 on the surface of the metal substrate 1 after being melted.
The low-melting glass 5 has an insulating property, and a sealing glass or an adhesive glass containing lead oxide or tellurium oxide as a main component is suitable. Here, as shown in FIG. 3 (f), the surface of the metal substrate 1 is mechanically polished using a grindstone, abrasive grains, or the like to remove unnecessary portions, and the metal substrate 1 is exposed. A master plate having a mirror-finished surface composed of an electrode portion 7 made of a metal and an insulating portion 6 made of low-melting glass 5 is produced. Since the insulating portion 6 filled with the low-melting glass 5 has an inverse pattern of a fine pattern of a predetermined shape, the metal electrode portion 7 from which the metal substrate 1 is exposed is replaced with a fine pattern of a predetermined shape. It has. Therefore, the master plate manufactured in this manner is composed of the insulating portion 6 in which the low-melting glass 5 having a strong adhesive force to the groove portion 3 of the metal substrate 1 is arranged, and the metal electrode portion 7. Since both the part 7 and the insulating part 6 have strong mechanical strength and strong adhesive force, it is possible to achieve high durability and long life of the master plate during repeated use, and high reliability in handling. It is a master version that can be obtained.

The process of manufacturing a fine pattern thin film by repeatedly using the master plate manufactured as described above will be described below. 4 (a) to 4 (d) are cross-sectional views of relevant parts showing a fine pattern thin film manufacturing process according to Embodiment 2 of the present invention. As shown in FIG. 4A, a repellent made of a fluorine compound such as perfluoropolyether having a terminal group such as a silane coupling group attached to a surface formed of the electrode portion 7 and the insulating portion 6 on the surface of the metal substrate 1. The aqueous release layer 8 is formed thin by using a dip coating method or a coating method. This terminal group is easily attached to the insulating portion 6 and the electrode portion 7, and a thin release layer 8 having strong water repellency can be easily formed. Next, as shown in FIG. 4B, the electrode portion 7 is formed on the electrode portion 7 via the release layer 8 by using an electrodeposition method in which a voltage is applied between the counter electrode and the electrode portion 7 of the metal substrate 1 in the electrodeposition solution. An electrodeposited film (not shown) made of resin is formed on the substrate, and an electrode is formed using a plating method in which a voltage is applied between the counter electrode and the electrode portion 7 of the metal substrate 1 in a plating solution containing copper ions or the like. A copper plating film (not shown) is formed on the portion 7. The electrodeposition film and the plating film are integrated to form a fine pattern thin film 9 corresponding to the shape of the electrode portion 7. In many cases, the fluorine compound used as the water-repellent release layer 8 becomes an electrical insulator. In this case, too, if the release layer 8 is very thin and close to a monomolecular layer, the electrical conductivity of the fluorine compound is high. The thin film of the electrodeposition film or the plating film is formed in the liquid for contact or in the plating solution, whereby the fine pattern thin film 9 can be formed on the peeling layer 8. In this state, as shown in FIG. 4C, the master plate on which the fine pattern thin film 9 is formed is immersed in warm water 10 at about 50 ° C. for about 1 minute, and the electrodeposition film constituting the fine pattern thin film 9 is To allow sufficient water impregnation. Thereafter, by removing the master plate from the warm water, the surface of the plating film in the fine pattern thin film 9 is evaporated and removed, and the inside of the electrodeposited film of the fine pattern thin film 9 in contact with the electrode portion 7 removes moisture. In this state, the adhesive force is weakened by the water repellency of the release layer 8. Here, as shown in FIG. 4D, the fine pattern thin film 9 is peeled from the electrode portion 7 of the master plate, and the fine pattern thin film 9 is transferred onto the base material 12 via the adhesive layer 11 or the like. . FIG. 4 shows the peel transfer direction of the fine pattern thin film 9
Since the adhesion of the electrodeposited film to the electrode portion 7 is weakened, the fine pattern thin film 9 is moved to the transfer substrate 12 side on the master plate, as indicated by arrows in FIG. Peeling transfer can be easily performed with high precision by applying close contact pressure. In the fine pattern thin film 9 after the transfer, the electrodeposition film portion such as the above-mentioned resin is not required for wiring and the like. Therefore, the fine pattern thin film of copper as a plating film is removed by washing and removing it with an organic solvent or the like. Only remains. In the process of producing such a fine pattern thin film, peeling transfer is easily performed without damaging the fine pattern thin film, and the production of a fine pattern thin film such as copper used for wiring at low cost and with high reliability. Has become the way.

In the above-described second embodiment of the present invention, the blast method using a metal mask and a sand blast apparatus has been described as a predetermined processing method for forming the groove 3 on the surface of the metal substrate 1. The same applies to the blasting method using a metal mask and a water blasting machine.Instead, a mechanical cutting method in which grooves are formed directly on the surface of the metal substrate using a blade with abrasive grains or a high-hardness drill is used. The same applies to the case of using the processing method and the laser drawing method of forming a groove by drawing using a high-power laser. By using these processing methods, an electrode portion having a fine pattern can be formed on a master plate without using a photolithography method, and therefore, a particularly inexpensive fine pattern thin film can be manufactured. On the other hand, when extremely high precision is required, a photolithography method and an etching method for forming a groove by etching may be used as predetermined processing methods.

Here, in the second embodiment of the present invention, the low-melting glass 5 containing lead oxide or tellurium oxide as the main component is used. This is because it can be easily melted at a lower heating temperature as compared with a high melting point glass containing silicon oxide as a main component. Here, the low-melting glass having a softening point of 330 ° C. or less has low mechanical strength and low reliability when the master plate is repeatedly used. Also, during the formation of the electrodeposited film, a large amount of lead or tellurium is eluted into the electrodeposition solution. Conversely, the softening point is 60
Low-melting glass of 0 ° C or higher tends to deteriorate the metal substrate,
The characteristics of the master plate are unstable. Similarly, as the metal substrate 1, a material that is easy to be etched or polished and that has a small amount of elution in the electrodeposition solution is required. Not only can it be formed easily, but it can also be used to reliably form a fine pattern thin film by electrodeposition or plating, and its thermal linear expansion coefficient is close to that of low-melting glass compared to aluminum. The matching between the low melting glass and the metal substrate is good. Also, regarding the electrode portion 7 where the metal substrate is exposed on the surface of the master plate,
When a plating film made of nickel is provided on the surface, a highly precise fine pattern can be manufactured without roughening of the polished surface.

The protective layer 4 is for preventing a chemical reaction such as oxidation of the metal substrate when the low-melting glass is melted. At least chromium, chromium nitride, silicon oxide or aluminum oxide is effective. is there. Although it is not always necessary to use a metal substrate that has little reaction with the low-melting glass, the accuracy of the end portion of the electrode portion having a fine pattern of a predetermined shape is not deteriorated by the protective layer 4, A master plate having a stable fine pattern shape can be manufactured, and this is a manufacturing method for reliably manufacturing a high-precision fine pattern thin film.

Furthermore, if the release layer 8 is a thin thin film of a fluorine compound having terminal groups, an electrodeposition film can be formed and water repellency can be imparted to the surface of the master plate. This terminal group is preferably a silane coupling group or the like as a substance that easily adheres to the low melting point glass or the electrode portion, and a fluorine compound having strong water repellency is perfluoropolyether or the like, so that the terminal group has a silane coupling group. Perfluoropolyether is particularly suitable.

As described above, the method for producing a fine pattern according to the second embodiment of the present invention provides a master plate having good durability by repeated use and high reliability in handling. Since the fine pattern thin film is not forcibly peeled off by heating at a high temperature or the like with respect to the peeling transfer of the fine pattern thin film using the method, a manufacturing method for producing a high-precision fine pattern at low cost and with high reliability is provided. Therefore, the method for manufacturing a fine pattern according to the second embodiment of the present invention is a method for manufacturing a fine pattern capable of inexpensively and reliably producing a high-precision fine pattern by improving the reliability and durability of the master plate. is there.

Embodiment 3 Hereinafter, a method for manufacturing a fine pattern according to Embodiment 3 of the present invention will be described with reference to FIG. Embodiment 3 of the present invention is similar to Embodiment 1, but uses a ferromagnetic metal substrate as the metal substrate of the master plate.

FIGS. 5A to 5E are cross-sectional views of a main part showing a method for manufacturing a fine pattern according to the third embodiment of the present invention. FIGS. 5A and 5B show a master plate manufacturing process. Is shown. As shown in FIG. 5A, a ferromagnetic material composed of an alloy mainly composed of manganese and aluminum having both conductivity and ferromagnetism is formed by etching using photolithography, blasting or mechanical cutting. A groove 3 having a reverse pattern of a fine pattern having a predetermined shape is formed on a metal substrate 15. After the cleaning of the groove 3, as shown in FIG. 5B, a protective layer 4 of chromium nitride or the like is formed on the surface of the ferromagnetic metal substrate 15 in the same manner as in the first embodiment. A low-melting glass 5 containing lead oxide or tellurium oxide as a main component is heated and melted on the surface on which the protective layer 4 is formed, and the surface of the ferromagnetic metal substrate 15 is mechanically polished using a grindstone or abrasive grains. Then, unnecessary portions are removed, and a master plate having a mirror-finished surface composed of a metal electrode portion 7 in which the ferromagnetic metal substrate 15 is exposed and an insulating portion 6 made of the low-melting glass 5 is manufactured. The master plate manufactured in this manner is composed of an insulating portion 6 provided with a low-melting glass 5 having a strong adhesive force to the groove portion 3 of the ferromagnetic metal substrate 15 and a metal electrode portion 7. Since the portion 7 and the insulating portion 6 both have strong mechanical strength and strong adhesive force, the master plate can achieve high durability and long life when repeatedly used, and has a hard magnetic property. It has become. The procedure so far is the same as that of the first embodiment of the present invention, but in the third embodiment, a magnetic field is applied to the master plate in this state to attach the metal substrate 15 having hard magnetic properties in one direction. Magnetize. FIG.
N and S in (b) indicate the magnetization direction of the ferromagnetic metal substrate 15 due to the magnetization.

FIGS. 5 (c) to 5 (e) show a fine pattern thin film forming process. As shown in FIG. 5 (c), a water-repellent release layer 8 made of a fluorine compound having a terminal group is formed on the surface of the ferromagnetic metal substrate 15 formed by the electrode portion 7 and the insulating portion 6 to form an electrode. A fine pattern thin film 9 made of an electrodeposited film is formed on the electrode portion 7 via the release layer 8 by using a deposition method. Here, after the master plate on which the fine pattern thin film 9 is formed is immersed in warm water, as shown in FIG. 5D, the master plate is transferred from the transfer substrate 12 side using an electromagnet 17 around which a coil 16 is wound. The fine pattern thin film 9 is pressed against the substrate to be transferred 12 via the adhesive layer 11 while applying a magnetic field in the direction in which the substrate is adsorbed. Thereby, the adhesion between the fine pattern thin film 9 and the adhesive layer 11 on the transfer substrate 12 is improved, and a sufficient pressing force is obtained, so that the fine pattern thin film 9 is transferred to the transfer substrate side. Thereafter, as shown in FIG. 5 (e), by applying a magnetic field from the side of the substrate to be transferred 12 by the electromagnet 17 in a direction to reject the master plate, only the fine pattern thin film 9 is placed on the substrate to be transferred 12. Only the master plate is separated while being adhered to the adhesive layer 11 of FIG. Therefore, in the third embodiment of the present invention, the use of the ferromagnetic metal substrate 15 having conductivity and hard magnetic characteristics allows the master plate to be closely attached to and removed from the transfer substrate 12 having the adhesive layer 11 by magnetic force. Therefore, a force for rubbing the fine pattern thin film 9 in the horizontal direction at the time of peeling transfer does not act. Therefore, the fine pattern thin film 9
Can be easily manufactured with high precision fine pattern thin film without being damaged during peeling transfer. Therefore, by using such a fine pattern thin film manufacturing step, a peeling transfer of the fine pattern thin film is easy, and a manufacturing method for manufacturing a fine pattern at low cost and with high reliability is provided.

In the third embodiment of the present invention, the low-melting glass 5 containing lead oxide or tellurium oxide as a main component is used. This is because it can be easily melted at a lower heating temperature as compared with a high melting point glass containing silicon as a main component. Here, the low-melting glass having a softening point of 330 ° C. or less is
Low mechanical strength, low reliability when master plate is used repeatedly. Also, during the formation of the electrodeposited film, a large amount of lead or tellurium is eluted into the electrodeposition solution. Conversely, the softening point is 600 ° C
The above-mentioned low-melting glass tends to cause deterioration of the metal substrate, and the characteristics of the master plate are unstable. Similarly, ferromagnetic metal substrate 1
For 5, a material having conductivity and good hard magnetic properties is required, for example, an alloy containing nickel as a main component and containing cobalt or an alloy containing manganese and aluminum as a main component containing carbon and the like. This is particularly useful because it not only has high saturation magnetization but also has excellent workability and can extremely easily perform formation of grooves and polishing of the surface.

As described above, the method for producing a fine pattern according to the third embodiment of the present invention provides a master plate having good durability due to repeated use and high reliability in handling. Because the magnetic force is used indirectly for peeling and transferring of fine pattern thin film using high temperature without forcibly peeling off by high temperature heating etc., it is a manufacturing method to manufacture high precision fine pattern at low cost and with high reliability. I have. Therefore, the method for manufacturing a fine pattern according to the third embodiment of the present invention is a method for manufacturing a fine pattern capable of producing a high-precision fine pattern inexpensively and reliably by improving the reliability and durability of the master plate. is there.

Embodiment 4 Hereinafter, a method for manufacturing a fine pattern according to Embodiment 4 of the present invention will be described.

The fourth embodiment of the present invention is an application of the method for producing a fine pattern to a color filter having a long shape used in an elongated color image sensor or the like.

FIGS. 6A to 6C are perspective views showing a master plate manufacturing process according to the fourth embodiment of the present invention.
First, as shown in FIG.
9b, 19c are formed, and a low melting point glass mainly composed of lead oxide or tellurium oxide is formed on one side surface of a plurality of conductive sheet metal substrates 18a, 18b, 18c by a sputtering method, a vapor deposition method, a sedimentation method, or the like. 5, a film-shaped insulating portion 6 is formed. Here, a plate-shaped thin metal substrate 18 on which the insulating portion 6 is formed is laminated in the direction shown by the arrow in FIG.
A laminated body 20 in which a plurality of thin metal substrates 18 and insulating layers 6 are alternately laminated as shown in FIG. In this state, the low-melting glass 5 constituting the insulating portion 6 has oozed out to the end face 21 of the laminated body 20 after bonding. After a while, FIG.
As shown in (c), the end face 21 of the laminate 20 is mechanically polished using a grindstone, abrasive grains, or the like to remove unnecessary portions to make the end face 21 a mirror surface. The insulating surrounding material 22 is formed so as to surround an unnecessary portion with an insulating material such as a resin. FIG. 6C shows a master plate in which the electrode portions 7 made of the bare thin metal substrate 18 and the insulating portions 6 made of the low-melting glass 5 are alternately arranged on the mirror end surface 21. . In the master plate manufactured in this manner, the plurality of thin metal substrates 18 constituting the electrode unit 7 are electrically insulated from each other,
Since independent extraction electrodes 19a, 19b, and 19c are formed for each of the thin metal substrates 18a, 18b, and 18c, a plurality of different types of electrodeposition films can be formed. Further, since the shape of the electrode portion 7 on the end face 21 is determined by the thickness and length of the thin metal substrate 18, a fine pattern having a predetermined shape having an elongated shape can be produced with high accuracy. Therefore, in this master version, the electrode portion 7
And the insulating part 6 both have strong mechanical strength and strong adhesive force, so that the master plate can achieve high durability and long life when used repeatedly, and high reliability can be obtained in handling. , Has become a highly accurate master version.

The process of producing a fine pattern thin film using the master plate produced as described above repeatedly will be described below. 7 (a) to 7 (c) are cross-sectional views of main parts showing a fine pattern thin film manufacturing step in the fine pattern manufacturing method according to the fourth embodiment of the present invention. As shown in FIG. 7A, a red pigment is contained in the electrode portion 7 via an end surface-attached water-repellent release layer made of a fluorine compound on the end surface 21 of the laminate 20 to be a master plate. A red electrodeposition film 23 is formed. The red electrodeposition film 23 is formed by forming the counter electrode and the thin metal substrate 1 in an electrodeposition solution containing a red pigment or the like.
This is performed by using an electrodeposition method in which a voltage is applied between the electrode portions 7 of the thin metal substrate 8a.
Since a is provided, voltage can be easily applied. The red electrodeposition film 23 thus formed is an elongated fine pattern thin film because the electrode portion 7 has an elongated fine pattern shape on the thin metal substrate 18a. Similarly, on the master plate, a voltage is applied to the extraction electrode 19b in an electrodeposition solution containing a green pigment to form a green electrodeposition film 24, and a voltage is applied to the extraction electrode 19c in the electrodeposition solution containing a blue pigment. A blue electrodeposition film 25 is formed by applying a voltage. In this master plate, a fine pattern thin film having an elongated shape is formed on a thin metal substrate 18 via a release layer. In this state, the fine pattern thin film and the master plate are heated with hot water of about 50 ° C. The red and green electrodeposited films 23, 24 are immersed in the fine pattern thin film so as to be impregnated with sufficient moisture.
In addition, the inside of the fine pattern thin film composed of the blue electrodeposition film 25 contains water and the adhesion to the master plate is weakened by the water repellency of the release layer. Here, FIG.
As shown in (c), the fine pattern thin film composed of the red electrodeposition film 23, the green electrodeposition film 24 and the blue electrodeposition film 25 is peeled off from the electrode part 7 of the master plate, Then, the fine pattern thin film is transferred onto the transfer substrate 12. The peel transfer direction of this fine pattern thin film is shown in FIG.
(C) is indicated by an arrow. Since the surface of the fine pattern thin film has been removed and the adhesive force to the electrode portion 7 has been weakened, the fine pattern thin film is bonded to the adhesive layer 11 on the master plate. The separation transfer can be easily performed with high precision by closely contacting and pressurizing the transfer-receiving substrate 12 side. In the process of manufacturing such a fine pattern thin film, peeling transfer is easily performed without damaging the fine pattern thin film having an elongated shape, and a high-precision fine pattern is manufactured at low cost and with high reliability. It is a manufacturing method. This fine pattern thin film is a red electrodeposition film 23,
It is composed of a green electrodeposition film 24 and a blue electrodeposition film 25 and is useful as a long color filter used for an optical signal input portion in an elongated color image sensor or the like.

In the fourth embodiment of the present invention, the low melting point glass 5 containing lead oxide or tellurium oxide as a main component is used.
This is because not only is the mechanical strength and adhesiveness sufficiently high, but also it can be easily bonded at a lower heating temperature as compared with a high melting point glass containing silicon oxide as a main component. . Here, the low-melting glass having a softening point of 330 ° C. or less has low mechanical strength and low reliability when the master plate is repeatedly used. Also, during the formation of the electrodeposited film, a large amount of lead or tellurium is eluted into the electrodeposition solution. Conversely, low-melting glass having a softening point of 600 ° C. or more easily causes deterioration of the metal substrate, and the characteristics of the master plate are unstable. However, a material suitable for bonding a plate-shaped metal substrate may be used here, and crystallized glass having a primary bonding temperature of about 500 ° C. can be used. Similarly, the thin metal substrate 18 needs to be a material that can be easily polished and has little elution in the electrodeposition solution. However, if a metal substrate mainly composed of nickel or copper is used, the laminate 20 can be formed. Not only can it be performed easily, but it is also possible to reliably and repeatedly form a fine pattern thin film by electrodeposition or plating, and it has a low coefficient of thermal linear expansion with low melting point glass compared to aluminum etc. Good matching between the melting point glass and the thin metal substrate. Here, the electrode portion 7 where the metal substrate is exposed on the surface of the master plate
Regarding the above, when a plating film made of nickel is provided on the surface, a highly accurate fine pattern can be manufactured without roughening of the polished surface.

Also in the fourth embodiment, the protective layer (not shown) is for preventing a chemical reaction such as oxidation of the metal substrate when the low-melting glass is melted.
At least chromium, chromium nitride, silicon oxide or aluminum oxide is effective. Although it is not always necessary to use a metal substrate that has a small reaction with the low melting point glass, the accuracy of the end portion of the electrode portion having a fine pattern of a predetermined shape is not deteriorated by this protective layer,
A master plate having a stable fine pattern shape can be manufactured, and this is a manufacturing method for reliably manufacturing a high-precision fine pattern thin film. Here, the release layer is not specifically described in detail in the fourth embodiment, but is similar to the first, second, and third embodiments of the present invention, and has a silane coupling group as the release layer. Perfluoropolyethers with terminal groups are particularly suitable.

As described above, the method for manufacturing a fine pattern according to the fourth embodiment of the present invention provides a master plate having good durability by repeated use and high reliability in handling. Since the fine pattern thin film is not forcibly peeled off by heating at a high temperature or the like with respect to the peeling transfer of the fine pattern thin film using the method, the manufacturing method is to manufacture the fine pattern thin film having an elongated shape at low cost and with high reliability. . Therefore, the method for manufacturing a fine pattern according to the fourth embodiment of the present invention is a method for manufacturing a fine pattern capable of producing a high-precision fine pattern inexpensively and reliably by improving the reliability and durability of the master plate. is there.

[0059]

As described above, according to the method for producing a fine pattern according to the present invention, in the method for producing a fine pattern by a transfer method, a master for a transfer method which has excellent durability in repeated use, high reliability and high accuracy. A plate can be obtained, and a highly reliable and accurate fine pattern can be produced at low cost and with good reproducibility using this master plate.

[Brief description of the drawings]

FIG. 1 is a fragmentary cross-sectional view showing a master plate manufacturing process according to Embodiment 1 of the present invention.

FIG. 2 is a fragmentary cross-sectional view showing a step of manufacturing a fine pattern thin film in Embodiment 1 of the present invention.

FIG. 3 is an essential part cross sectional view showing a master plate manufacturing step in Embodiment 2 of the present invention.

FIG. 4 is an essential part cross sectional view showing a fine pattern thin film manufacturing step according to Embodiment 2 of the present invention.

FIG. 5 is an essential part cross sectional view showing the method for manufacturing a fine pattern in Embodiment 3 of the present invention.

FIG. 6 is a perspective view showing a master plate manufacturing process according to a fourth embodiment of the present invention.

FIG. 7 is a perspective view showing a fine pattern thin film manufacturing process according to a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal substrate 2 Resist layer 3 Groove part 4 Protective layer 5 Low melting glass 6 Insulating part 7 Electrode part 8 Peeling layer 9 Fine pattern thin film 10 Hot water 11 Adhesive layer 12 Transfer receiving substrate 13 Metal mask 14 Through hole 15 Ferromagnetic metal substrate 16 Coil 17 Electromagnet 18, 18a, 18b, 18c Thin metal substrate 19, 19a, 19b, 19c Leader electrode 20 Laminated body 21 End face 22 Insulating surrounding material 23 Red electrodeposition film 24 Green electrodeposition film 25 Blue electrodeposition film

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hidetoshi Matsumoto 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (15)

[Claims] 1. A groove having an inverse pattern of a fine pattern having a predetermined shape is formed on a surface of a metal substrate, and the groove is filled with a molten insulating low-melting glass, and the surface of the metal substrate is polished. Then, a master plate for transfer is manufactured by exposing an electrode portion having a pattern corresponding to the fine pattern and formed of the metal substrate and an insulating portion having a pattern corresponding to the reverse pattern and formed of the low melting point glass. Master plate preparation step, forming a water-repellent release layer on the master plate, electrodeposition method on the release layer, forming a fine pattern thin film in a shape corresponding to the fine pattern by any one of plating method, A step of transferring the fine pattern thin film onto an adhesive layer on a substrate to be transferred. 2. A method of forming the groove in the master plate manufacturing step, wherein a resist layer having a reverse pattern of a fine pattern having a predetermined shape is formed by a photolithography technique using a photosensitive resist and a photomask;
2. The method for manufacturing a fine pattern according to claim 1, wherein the groove is formed by etching using an acidic solution or etching using a reactive ion etching apparatus, and thereafter, the resist layer is removed. 3. A method for forming the groove in the master plate forming step, a blast method using a metal blast, a blast method using a water blast apparatus, a mechanical cutting method using any of a blade or a drill, a laser, 2. The method for manufacturing a fine pattern according to claim 1, wherein any one of the drawing methods is used. 4. The method of manufacturing a master plate, wherein the metal substrate is ferromagnetic, and in the step of transferring a fine pattern thin film, the master pattern is magnetized in one direction, and then the fine pattern thin film is formed. The fine pattern thin film is transferred onto the adhesive layer on the transfer substrate while applying a magnetic field in a direction to attract the master plate from the transfer substrate side, and then the master plate is transferred from the transfer substrate side. The method for producing a fine pattern according to any one of claims 1 to 3, wherein a magnetic field is applied in a direction of exclusion. 5. An insulating portion made of low-melting glass is formed on a surface of a plurality of metal substrates, a laminate is formed by alternately laminating the metal substrate and the insulating portion, and an end face of the laminate is polished. Forming a master plate for transfer by exposing the electrode portion made of the metal substrate and the insulating portion made of the low-melting glass, and forming a water-repellent release layer on the master plate; A fine pattern thin film forming step of forming a fine pattern thin film on the layer by any one of a plating method and transferring the fine pattern thin film onto an adhesive layer on a substrate to be transferred, and Production method. 6. The method for producing a fine pattern according to claim 1, wherein said metal substrate is any one of a metal substrate containing nickel as a main component and a metal substrate containing copper as a main component. . 7. The fine pattern according to claim 5, wherein the metal substrate is a ferromagnetic metal substrate mainly composed of nickel and a ferromagnetic metal substrate mainly composed of an alloy of manganese and aluminum. Production method. 8. The method for manufacturing a fine pattern according to claim 1, wherein a plating film containing nickel is provided on a surface of said electrode portion. 9. The method for forming a fine pattern according to claim 5, wherein the method of forming the insulating portion made of the low-melting glass is any one of a sputtering method, a vapor deposition method, and a sedimentation method. Production method. 10. The method of manufacturing a master plate according to claim 1, wherein the surface of the metal substrate is formed of chromium by using any one of a sputtering method, an evaporation method, a plating method, and an electrophoresis method.
The fine pattern according to any one of claims 1 to 9, wherein a protective layer containing any one of chromium nitride, silicon oxide, and aluminum oxide is formed, and the low-melting glass is formed on the protective layer. Manufacturing method. 11. The method for producing a fine pattern according to claim 1, wherein said low-melting glass is a sealing glass containing one of lead oxide and tellurium oxide as a main component. 12. The low melting point glass has a softening point of 330 ° C.
The method for producing a fine pattern according to claim 11, wherein the sealing glass is at least 600 ° C. 13. The method for producing a fine pattern according to claim 1, wherein in the fine pattern thin film transfer step, the release layer is a water-repellent thin film made of a fluorine compound having a terminal group. 14. The method according to claim 13, wherein the release layer is a water-repellent release layer made of perfluoropolyether having a silane coupling group as a terminal group. 15. The method according to claim 15, wherein in the step of transferring the fine pattern thin film, the fine pattern thin film is immersed in warm water and then transferred onto an adhesive layer provided on a substrate to be transferred. A method for producing a fine pattern according to claim 1.