JPH091806A - Ink jet head - Google Patents
Ink jet headInfo
- Publication number
- JPH091806A JPH091806A JP15745895A JP15745895A JPH091806A JP H091806 A JPH091806 A JP H091806A JP 15745895 A JP15745895 A JP 15745895A JP 15745895 A JP15745895 A JP 15745895A JP H091806 A JPH091806 A JP H091806A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat storage
- inorganic
- ink jet
- storage layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はオンデマンド型のインク
ジェットの構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an on-demand type ink jet structure.
【０００２】[0002]
【従来の技術】オンデマンド型インクジェットヘッドを
使用したプリンタは、印字の静寂性、ランニングコスト
の安さから広く使用されている。2. Description of the Related Art Printers using an on-demand type ink jet head are widely used because of quiet printing and low running cost.
【０００３】従来のインクジェットヘッドの構造は、図
９に示すようにＳｉウェハーまたはＳｉ基板１上に蓄熱
層３、発熱抵抗体５、配線導体４、抵抗保護膜（不図
示）等々を薄膜形成して、できている。また、他の方法
によると、前記Ｓｉウェハー、Ｓｉ基板に変わって、金
属基板を用いる発明もあるが、前記Ｓｉウェハー、Ｓｉ
基板を用いたヘッドは、基板製造コストが高くウェハー
では大型のヘッドが作りにくいこと、Ｓｉ基板を用いる
ヘッドは、大型のヘッドは形成できるが、基板製造コス
トはＳｉウェハーより高くなるので、ヘッドのコストが
高くなる欠点を有する。As shown in FIG. 9, the structure of a conventional ink jet head is such that a heat storage layer 3, a heating resistor 5, a wiring conductor 4, a resistance protection film (not shown), etc. are formed in a thin film on a Si wafer or Si substrate 1. It's done. According to another method, there is an invention in which a metal substrate is used instead of the Si wafer and the Si substrate.
A head using a substrate has a high substrate manufacturing cost and it is difficult to make a large head with a wafer.A head using a Si substrate can form a large head, but since the substrate manufacturing cost is higher than that of a Si wafer, It has the disadvantage of high cost.
【０００４】また上記Ｓｉウェハー、Ｓｉ基板に変わっ
て金属を用いたヘッドもある。例えば、特許公開昭和５
５−１２３４７８（キヤノン 原 利民他）に金属基板
上に、低熱伝導性の薄膜を設けるものが見られる。しか
し、基板に直接低熱伝導性薄膜を形成しているので、金
属上に蓄熱層を設けるときに蓄熱層と基板との密着性を
考慮すると基板材料の金属の選択範囲が狭まり、十分な
性能のヘッドを提供することが難しいこと、また金属を
基板としているのでその上に設けられる蓄熱層だけで
は、基板と発熱抵抗体の電気的絶縁性を保つことが、蓄
熱層の形成方法を考慮すると、難しいという問題を有す
る。There is also a head using a metal instead of the Si wafer and the Si substrate. For example, the patent publication Showa 5
There is one in which a thin film having low thermal conductivity is provided on a metal substrate in 5-123478 (Canon, Haramin, et al.). However, since the low thermal conductive thin film is formed directly on the substrate, when the heat storage layer is provided on the metal and the adhesiveness between the heat storage layer and the substrate is taken into consideration, the selection range of the metal of the substrate material is narrowed and sufficient performance is It is difficult to provide the head, and since the metal is used as the substrate, only the heat storage layer provided thereon can maintain the electrical insulation between the substrate and the heating resistor, considering the method for forming the heat storage layer, It has the problem of being difficult.
【０００５】[0005]
【発明が解決しようとする課題】本発明は前記の問題を
解決した新規なインクジェットヘッドを提供することを
目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a novel ink jet head which solves the above problems.
【０００６】[0006]
【課題を解決するための手段】前記の目的は以下の手段
によって達成される。すなわち、本発明は複数のインク
吐出口を有し、この吐出口からインクを飛翔させること
により印字を可能とするインクジェットヘッドにおい
て、前記インクジェットヘッドを設けるための基板が金
属からなり、前記金属基板上に設けられた、基板より熱
伝導率の低い材料からなる蓄熱層と前記基板との間に無
機または有機膜が一層設けられていることを特徴とする
インクジェットヘッドを提案するものであり、前記無機
または有機膜が絶縁性を有するものであること、前記基
板上に設けられた蓄熱層がポリイミド、ポリエーテルア
ミド、ポリアミドイミド、またはポリアミドであるこ
と、前記無機膜の形成方法が前記基板を陽極酸化してな
ること、前記無機または有機膜の形成方法がスパッタ、
ＣＶＤ、蒸着等真空成膜によるものであること、前記無
機または有機膜の形成方法が予め膜として形成された材
料を接着することによることを含む。The above object is achieved by the following means. That is, according to the present invention, in an inkjet head having a plurality of ink ejection ports and capable of printing by ejecting ink from the ejection ports, the substrate for providing the inkjet head is made of metal, and The inkjet head is characterized in that a single inorganic or organic film is provided between the substrate and the heat storage layer made of a material having a lower thermal conductivity than the substrate. Alternatively, the organic film has an insulating property, the heat storage layer provided on the substrate is polyimide, polyether amide, polyamide imide, or polyamide, and the method for forming the inorganic film anodizes the substrate. The method of forming the inorganic or organic film is sputtering,
The method includes vacuum deposition such as CVD and vapor deposition, and the method of forming the inorganic or organic film includes bonding a material previously formed as a film.
【０００７】以下、本発明を図面を参照して更に詳細に
説明する。図１は本発明の一実施例を示すインクジェッ
トヘッドの断面部分図である。本発明のインクジェット
ヘッドは図１に示すように金属からなる基板１と該基板
１より熱伝導率の低い材料からなる蓄熱層３との間に無
機または有機膜２が設けられてなり、該蓄熱層３上には
発熱抵抗体５と配線導体４が設けられている。Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a partial sectional view of an inkjet head showing an embodiment of the present invention. As shown in FIG. 1, the inkjet head of the present invention comprises an inorganic or organic film 2 provided between a substrate 1 made of metal and a heat storage layer 3 made of a material having a lower thermal conductivity than the substrate 1, and A heating resistor 5 and a wiring conductor 4 are provided on the layer 3.
【０００８】本発明において使用される金属からなる基
板１としてはアルミニウム、銅、Ｎｉ、Ｆｅ、Ｗ等が挙
げられ、熱伝導率は７０〜４００Ｗ／ｍＫ、厚み１〜５
ｍｍのものが好ましく用いられる。The substrate 1 made of a metal used in the present invention includes aluminum, copper, Ni, Fe, W, etc., and has a thermal conductivity of 70 to 400 W / mK and a thickness of 1 to 5.
mm is preferably used.
【０００９】また金属基板１上に設けられる該金属基板
１より熱伝導率の低い材料からなる蓄熱層３としてはポ
リイミド、ポリエーテルアミド、ポリアミドイミド、ポ
リアミド等が挙げられる。蓄熱層の熱伝導率が低い材料
であっても、比重が大きいものや比熱の大きいものは、
蓄熱層での熱の消費が大きく、放熱にも時間がかかるこ
とから好ましくない。本発明者は種々の材料を検討した
ところどの材料であっても、比熱は１〜２の間であって
殆ど変わらないことが判明した。そこで熱伝導率の低い
材料であって比重の低いものを蓄熱層３とすることとし
た。この場合無機の材料は、分子または元素が緻密に結
合していることが多く、密度の高いものが多い。そこで
前述の有機樹脂を用いることとした。また金属基板１と
該金属基板１より熱伝導率の低い材料からなる蓄熱層３
の間に設けられる無機膜２としてはＣｒ、Ｔｉ、Ｓｉ3
Ｎ4 、Ａｌ箔、Ｔａ等が挙げられ、金属基板と該金属基
板より熱伝導率の低い材料からなる蓄熱層３との間に設
けられる有機膜２としてはポリイミド、ポリアミド、ポ
リエーテルアミド、ポリアミドイミド等が挙げられる。The heat storage layer 3 formed on the metal substrate 1 and made of a material having a lower thermal conductivity than the metal substrate 1 may be polyimide, polyether amide, polyamide imide or polyamide. Even if the thermal conductivity of the heat storage layer is low, those with large specific gravity or large specific heat
This is not preferable because the heat storage layer consumes a large amount of heat and it takes time to dissipate heat. The present inventor has studied various materials and found that the specific heat of any material is between 1 and 2 and hardly changes. Therefore, a material having a low thermal conductivity and a low specific gravity is used as the heat storage layer 3. In this case, the inorganic materials are often densely bonded with molecules or elements, and often have a high density. Therefore, the above-mentioned organic resin is used. Also, the metal substrate 1 and the heat storage layer 3 made of a material having a lower thermal conductivity than the metal substrate 1.
As the inorganic film 2 provided between the two, Cr, Ti, Si 3
N 4, Al foil, Ta and the like, the organic film as the second polyimide, polyamide, polyetheramide provided between the heat storage layer 3 made of a material having low metal substrate and the thermal conductivity than the metal substrate, a polyamide Examples thereof include imide.
【００１０】上記無機または有機膜２はスパッタ、ＣＶ
Ｄ、蒸着等適宜の公知の手段により厚み０．０１〜０．
３μｍ程度に形成するのが好ましい。The above-mentioned inorganic or organic film 2 is formed by sputtering, CV
The thickness is 0.01 to 0.
The thickness is preferably about 3 μm.
【００１１】上記無機または有機膜の絶縁抵抗は１ＫΩ
以上程度のものが好ましく用いられる。無機または有機
膜の絶縁抵抗が１ＫΩ未満では金属基板と配線とのショ
ートの問題があり好ましくない。The insulation resistance of the inorganic or organic film is 1 KΩ.
Those having the above levels are preferably used. If the insulation resistance of the inorganic or organic film is less than 1 KΩ, there is a short circuit problem between the metal substrate and the wiring, which is not preferable.
【００１２】本発明のインクジェットヘッドの基板１と
発熱抵抗体５との好適な電気絶縁性を保持させるために
は無機膜は陽極酸化することが好ましい。また前記の無
機または有機膜２は予め膜として形成された膜を公知の
接着剤により接着してもよい。In order to maintain suitable electrical insulation between the substrate 1 and the heating resistor 5 of the ink jet head of the present invention, the inorganic film is preferably anodized. Further, as the inorganic or organic film 2, a film previously formed as a film may be adhered by a known adhesive.
【００１３】以下本発明を実施例に基ずき説明する。The present invention will be described below based on examples.
【００１４】[0014]
実施例１ 本発明の実施例の断面図を図１に、工程説明図を図５に
示す。熱伝導率２２３Ｗ／ｍＫである金属基板（Ａｌ）
１上に密着性を備えたＣｒをスパッタした。膜厚は、５
ｎｍとした。蓄熱層として、熱伝導率０．１５Ｗ／ｍＫ
であるポリイミド（ＤｕＰｏｎｔＰｌ２６１１）をスピ
ンコーティングで塗布した。膜厚は０．５μｍである。
不活性ガス雰囲気炉でキュアしたのち、発熱抵抗体とし
てＴａを１００ｎｍ、配線導体材料としてＡｌを５００
ｎｍスパッタした。フォトリソでパターニングしたの
ち、保護膜としてＡｌを１００ｎｍスパッタし、伝導性
を維持したい部分はレジストで覆ったのち図２に示すよ
うな装置により陽極酸化で前記保護膜のＡｌを酸化膜と
した。インク流路を形成後天板を被せて切断し、本発明
によるヘッドは完成した。Embodiment 1 A sectional view of an embodiment of the present invention is shown in FIG. 1, and a process explanatory drawing is shown in FIG. Metal substrate (Al) with a thermal conductivity of 223 W / mK
Cr having adhesiveness was sputtered on top of No. 1. Film thickness is 5
nm. As a heat storage layer, thermal conductivity 0.15 W / mK
Was applied by spin coating. The film thickness is 0.5 μm.
After curing in an inert gas atmosphere furnace, Ta as a heating resistor is 100 nm and Al as a wiring conductor material is 500 nm.
nm sputtered. After patterning by photolithography, Al was sputtered to a thickness of 100 nm as a protective film, a portion where conductivity was to be maintained was covered with a resist, and then Al of the protective film was used as an oxide film by anodic oxidation by an apparatus as shown in FIG. After forming the ink flow path, the head plate was covered and cut to complete the head according to the present invention.
【００１５】実施例２ 実施例１においてＣｒの代りにＴｉを用いる以外は同様
の方法によってヘッドを製造した。Example 2 A head was manufactured in the same manner as in Example 1 except that Ti was used instead of Cr.
【００１６】実施例３ 図４に本発明によるインクジェットヘッドの断面図を示
す。熱伝導率２２３Ｗ／ｍＫである金属基板（Ａｌ）を
図２に示すような陽極酸化液に浸漬し、ＤＣ電圧を１０
０Ｖ与え、基板を陽極酸化して、厚み約１００ｎｍのＡ
ｌ2 Ｏ3 を設けた。このＡｌ2 Ｏ3 膜の絶縁抵抗は１０
ＫΩであった。蓄熱層として、熱伝導率０．１５Ｗ／ｍ
Ｋであるポリイミド（ＤｕＰｏｎｔＰｌ２６１１）をス
ピンコーティングで塗布した。膜厚は０．５μｍであ
る。発熱抵抗体としてＴａを１００ｎｍ、配線導体材料
としてＡｌを５００ｎｍスパッタした。フォトリソでパ
ターニングしたのち、保護膜としてＡｌを１００ｎｍス
パッタし、伝導性を維持したい部分はレジストで覆った
のち陽極酸化で前記保護膜のＡｌを酸化膜とした。イン
ク流路を形成後天板を被せて切断し、本発明によるヘッ
ドは完成した。（図５参照） 実施例４ 本発明の他の実施例として、工程図２（図６）を示す。
金属基板Ａｌ上に絶縁性と密着性を兼ね備えたＳｉ3 Ｎ
4 をスパッタした。スパッタのＳｉＮは、バルクと熱的
特性が大きく異なり余りに厚みを大きくすると、蓄熱効
果が起こり、インクジェットヘッドの高速駆動に影響を
及ぼすので今回は０．２μｍとした、蓄熱層として、ポ
リイミド（ＤｕＰｏｎｔＰｌ２６１１）をスピンコーテ
ィングで塗布した。膜厚は０．５μｍである。発熱抵抗
体としてＴａを１００ｎｍ、配線導体材料としてＡｌを
５００ｎｍスパッタした。フォトリソでパターニングし
たのち、保護膜としてＡｌを１００ｎｍスパッタし、伝
導性を維持したい部分はレジストで覆ったのち陽極酸化
で前記保護膜のＡｌを酸化膜とした。インク流路を形成
後天板を被せて切断し、本発明によるヘッドは完成し
た。Embodiment 3 FIG. 4 shows a sectional view of an ink jet head according to the present invention. A metal substrate (Al) having a thermal conductivity of 223 W / mK was immersed in an anodizing solution as shown in FIG.
The substrate is anodized by applying 0 V, and the thickness of A is about 100 nm.
l 2 O 3 was provided. The insulation resistance of this Al 2 O 3 film is 10
It was KΩ. As a heat storage layer, thermal conductivity 0.15 W / m
A polyimide of K (DuPont Pl2611) was applied by spin coating. The film thickness is 0.5 μm. As a heating resistor, Ta was sputtered to 100 nm, and as a wiring conductor material, Al was sputtered to 500 nm. After patterning by photolithography, Al was sputtered to a thickness of 100 nm as a protective film, and a portion where conductivity was to be maintained was covered with a resist, and then Al of the protective film was used as an oxide film by anodic oxidation. After forming the ink flow path, the head plate was covered and cut to complete the head according to the present invention. (Refer to FIG. 5) Fourth Embodiment A process drawing 2 (FIG. 6) is shown as another embodiment of the present invention.
Si 3 N that has both insulation and adhesion on the metal substrate Al
4 was sputtered. The thermal characteristics of sputtered SiN are greatly different from those of the bulk, and if the thickness is too large, a heat storage effect occurs, which affects the high-speed drive of the inkjet head, so this time was 0.2 μm. Was applied by spin coating. The film thickness is 0.5 μm. As a heating resistor, Ta was sputtered to 100 nm, and as a wiring conductor material, Al was sputtered to 500 nm. After patterning by photolithography, Al was sputtered to a thickness of 100 nm as a protective film, and a portion where conductivity was to be maintained was covered with a resist, and then Al of the protective film was used as an oxide film by anodic oxidation. After forming the ink flow path, the head plate was covered and cut to complete the head according to the present invention.
【００１７】実施例５ 本発明の他の実施例を図３に示す。金属基板として厚み
１．０ｍｍの熱伝導率３９５Ｗ／ｍＫの銅板３（Ｃｕ）
を用いＡｌ箔に接着剤を塗布し乾燥してなる厚さ０．３
μｍの薄膜フィルムからなる密着層９を接着した。（図
３）この上に蓄熱層の熱伝導率０．１５Ｗ／ｍＫのポリ
イミドをスピンコーティングで塗布し硬化したのち（厚
み０．５μｍ）、発熱抵抗体としてＴａを１００ｎｍ、
配線導体としてＡｌを５００ｎｍスパッタにて形成し
た。フォトリソでパターニングしたのち、全面にＡｌを
スパッタして外部接続部はレジストで覆ったまま陽極酸
化して絶縁化した。インク流路を形成して天板を接続し
て本発明によるヘッドは完成する。また前述のＡｌ箔フ
ィルムを基板に接着したのち陽極酸化して絶縁化しても
よい。Embodiment 5 Another embodiment of the present invention is shown in FIG. Copper plate 3 (Cu) with a thickness of 1.0 mm and a thermal conductivity of 395 W / mK as a metal substrate
Thickness of 0.3 after applying adhesive to Al foil using
The adhesion layer 9 made of a thin film of μm was adhered. (FIG. 3) A polyimide having a thermal conductivity of 0.15 W / mK of the heat storage layer was applied thereon by spin coating and cured (thickness 0.5 μm), and then Ta was 100 nm as a heating resistor
As a wiring conductor, Al was formed by 500 nm sputtering. After patterning by photolithography, Al was sputtered on the entire surface, and the external connection portion was anodized and insulated while being covered with a resist. The head according to the present invention is completed by forming the ink flow path and connecting the top plate. Alternatively, the Al foil film described above may be adhered to the substrate and then anodized to be insulated.
【００１８】表１に、従来構造と本発明による密着層を
形成したサンプルの膜の密着性をＰＣＴに入れて比較し
た表を示す。これによっても明らかなように、従来構造
ではＰＣＴ１０時間後で、膜が基板から部分的に剥離し
たのに対し、本発明の構造では、１００時間後も剥離は
発生していない。このように、本発明によれば、従来基
板として使用できなかった金属材料が密着と、絶縁性を
保ったまま使用出来るようになり、安定にヘッドを形成
し、安価なヘッドを提供することが出来るようになっ
た。Table 1 shows a table in which the adhesion of the film of the sample having the adhesion layer according to the present invention and the adhesion of the film of the conventional structure is compared in the PCT. As is also clear from this, in the conventional structure, the film was partially peeled from the substrate after 10 hours of PCT, whereas in the structure of the present invention, peeling did not occur even after 100 hours. As described above, according to the present invention, a metal material that could not be used as a substrate in the past can be used while being in close contact with the insulating material, and a stable head can be formed and an inexpensive head can be provided. I can do it.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】以上述べたように本発明によれば、従来
基板として使用できなかった金属材料が良好な密着性と
絶縁性を保持したまま使用可能となり、安定にかつ安価
にインクジェットヘッドを提供することができる。As described above, according to the present invention, a metal material that could not be used as a substrate in the past can be used while maintaining good adhesion and insulation, and a stable and inexpensive inkjet head can be provided. can do.
【図１】本発明の一例を示す実施例の断面図である。FIG. 1 is a sectional view of an embodiment showing an example of the present invention.
【図２】本発明において使用される基板陽極酸化装置の
一例を示す側面図である。FIG. 2 is a side view showing an example of a substrate anodizing apparatus used in the present invention.
【図３】本発明の他の実施例を示す側面断面図である。FIG. 3 is a side sectional view showing another embodiment of the present invention.
【図４】本発明の更に他の実施例を示す側面断面図であ
る。FIG. 4 is a side sectional view showing still another embodiment of the present invention.
【図５】金属密着改良層形成による構成方法を示す工程
説明図である。FIG. 5 is a process explanatory view showing a configuration method by forming a metal adhesion improving layer.
【図６】金属陽極酸化層形成による構成方法を示す工程
説明図である。FIG. 6 is a process explanatory diagram showing a configuration method by forming a metal anodized layer.
【図７】絶縁層スパッタ形成による構成方法を示す工程
説明図である。7A to 7C are process explanatory diagrams showing a configuration method by forming an insulating layer by sputtering.
【図８】絶縁層貼りつけ形成による構成方法を示す工程
説明図である。FIG. 8 is a process explanatory diagram illustrating a configuration method by forming and attaching an insulating layer.
【図９】従来構造によるインクジェットヘッドの断面図
である。FIG. 9 is a cross-sectional view of an inkjet head having a conventional structure.
１ 基板 ２ 無機または有機膜 ３ 蓄熱層 ４ 配線導体 ５ 発熱抵抗体 ６ 白金電極 ７ 陽極酸化液 ８ 接着剤 ９ 密着層 1 Substrate 2 Inorganic or Organic Film 3 Heat Storage Layer 4 Wiring Conductor 5 Heating Resistor 6 Platinum Electrode 7 Anodizing Liquid 8 Adhesive 9 Adhesion Layer
Claims (6)
からインクを飛翔させることにより印字を可能とするイ
ンクジェットヘッドにおいて、前記インクジェットヘッ
ドを設けるための基板が金属からなり、前記金属基板上
に設けられた、基板より熱伝導率の低い材料からなる蓄
熱層と前記基板との間に無機または有機膜が設けられて
いることを特徴とするインクジェットヘッド。1. In an ink jet head having a plurality of ink ejection ports and capable of printing by ejecting ink from the ejection ports, a substrate on which the ink jet head is provided is made of a metal, and the substrate is provided on the metal substrate. An ink jet head, characterized in that an inorganic or organic film is provided between the substrate and a heat storage layer made of a material having a lower thermal conductivity than the substrate.
ものである請求項１に記載のインクジェットヘッド。2. The inkjet head according to claim 1, wherein the inorganic or organic film has an insulating property.
ミド、ポリエーテルアミド、ポリアミドイミド、または
ポリアミドである請求項１または２に記載のインクジェ
ットヘッド。3. The ink jet head according to claim 1, wherein the heat storage layer provided on the substrate is polyimide, polyether amide, polyamide imide, or polyamide.
酸化してなる請求項１〜４のうちいずれか１項に記載の
インクジェットヘッド。4. The ink jet head according to claim 1, wherein the method of forming the inorganic film is performed by anodizing the substrate.
ッタ、ＣＶＤ、蒸着等真空成膜による請求項１〜４のう
ちいずれか１項に記載のインクジェットヘッド。5. The ink jet head according to claim 1, wherein the inorganic or organic film is formed by vacuum film formation such as sputtering, CVD, vapor deposition.
膜として形成された材料を接着することによる請求項１
乃至４のうちいずれか１項に記載のインクジェットヘッ
ド。6. The method of forming the inorganic or organic film comprises adhering a material previously formed as a film.
5. The inkjet head according to any one of 4 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15745895A JPH091806A (en) | 1995-06-23 | 1995-06-23 | Ink jet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15745895A JPH091806A (en) | 1995-06-23 | 1995-06-23 | Ink jet head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH091806A true JPH091806A (en) | 1997-01-07 |
Family
ID=15650108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15745895A Pending JPH091806A (en) | 1995-06-23 | 1995-06-23 | Ink jet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH091806A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5992982A (en) * | 1996-11-12 | 1999-11-30 | Canon Kabushiki Kaisha | Ink jet head and method for fabricating the ink jet head |
| EP0962320A1 (en) * | 1998-06-03 | 1999-12-08 | Canon Kabushiki Kaisha | Ink-Jet head, ink-jet head substrate, and a method for making the head |
| EP1043158A2 (en) * | 1999-04-06 | 2000-10-11 | Canon Kabushiki Kaisha | Ink jet recording head and ink jet recording apparatus |
| US6379571B1 (en) * | 1998-06-11 | 2002-04-30 | Canon Kabushiki Kaisha | Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus |
-
1995
- 1995-06-23 JP JP15745895A patent/JPH091806A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5992982A (en) * | 1996-11-12 | 1999-11-30 | Canon Kabushiki Kaisha | Ink jet head and method for fabricating the ink jet head |
| EP0962320A1 (en) * | 1998-06-03 | 1999-12-08 | Canon Kabushiki Kaisha | Ink-Jet head, ink-jet head substrate, and a method for making the head |
| US6390606B1 (en) | 1998-06-03 | 2002-05-21 | Canon Kabushiki Kaisha | Ink-jet head, ink-jet head substrate, and a method for making the head |
| US6379571B1 (en) * | 1998-06-11 | 2002-04-30 | Canon Kabushiki Kaisha | Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus |
| EP1043158A2 (en) * | 1999-04-06 | 2000-10-11 | Canon Kabushiki Kaisha | Ink jet recording head and ink jet recording apparatus |
| EP1043158A3 (en) * | 1999-04-06 | 2002-05-15 | Canon Kabushiki Kaisha | Ink jet recording head and ink jet recording apparatus |
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