AU2003289514A1 - Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master - Google Patents
Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the masterInfo
- Publication number
- AU2003289514A1 AU2003289514A1 AU2003289514A AU2003289514A AU2003289514A1 AU 2003289514 A1 AU2003289514 A1 AU 2003289514A1 AU 2003289514 A AU2003289514 A AU 2003289514A AU 2003289514 A AU2003289514 A AU 2003289514A AU 2003289514 A1 AU2003289514 A1 AU 2003289514A1
- Authority
- AU
- Australia
- Prior art keywords
- master
- electro
- manufacturing
- pin portion
- pattern made
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005323 electroforming Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Cold Cathode And The Manufacture (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0002231 | 2003-01-09 | ||
KR1020030002231A KR20040064191A (en) | 2003-01-09 | 2003-01-09 | Electroforming material of stacked thin film and fabricating method thereof |
PCT/KR2003/002804 WO2004064155A1 (en) | 2003-01-09 | 2003-12-23 | Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003289514A1 true AU2003289514A1 (en) | 2004-08-10 |
Family
ID=32709865
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003289514A Abandoned AU2003289514A1 (en) | 2003-01-09 | 2003-12-23 | Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master |
AU2003289537A Abandoned AU2003289537A1 (en) | 2003-01-09 | 2003-12-26 | Laminate made by electro-forming and method for manufacturing the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003289537A Abandoned AU2003289537A1 (en) | 2003-01-09 | 2003-12-26 | Laminate made by electro-forming and method for manufacturing the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20040064191A (en) |
AU (2) | AU2003289514A1 (en) |
WO (3) | WO2004064155A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100980217B1 (en) * | 2004-12-17 | 2010-09-06 | 삼원에프에이 (주) | Master of Electro-forming |
JP5786906B2 (en) * | 2013-08-02 | 2015-09-30 | オムロン株式会社 | Manufacturing method of electroformed parts |
CN105556644B (en) * | 2013-09-27 | 2019-04-19 | 英特尔公司 | By including the chemical reaction for the selectivity for limiting erosion of the material layer above adjacent area come rectangular at material layer over small areas |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55100557A (en) * | 1979-01-25 | 1980-07-31 | Dainippon Printing Co Ltd | Electroforming method |
JPS61208245A (en) * | 1985-03-13 | 1986-09-16 | Kyushu Hitachi Maxell Ltd | Manufacture of lead frame for semiconductor device |
JPS62241347A (en) * | 1986-04-14 | 1987-10-22 | Hitachi Ltd | Manufacture of carrier tapes through electroforming |
JPH02132834A (en) * | 1988-11-14 | 1990-05-22 | Toshiba Corp | Wiring structure of semiconductor device |
JPH02137915A (en) * | 1988-11-18 | 1990-05-28 | Sharp Corp | Manufacture of stamper |
JPH03146652A (en) * | 1989-11-02 | 1991-06-21 | Kenseidou Kagaku Kogyo Kk | Production of metallic parts having holes of fine pattern and master used therein |
JP3588879B2 (en) * | 1995-11-09 | 2004-11-17 | 松下電器産業株式会社 | Fine pattern forming method |
JPH10319222A (en) * | 1997-05-16 | 1998-12-04 | Matsushita Electric Ind Co Ltd | Production of fine pattern |
JP2000313985A (en) * | 1999-04-27 | 2000-11-14 | Ricoh Co Ltd | Electroforming original plate and its production, electroforming parts and their production as well as production of diaphragm |
KR20000030903A (en) * | 2000-03-28 | 2000-06-05 | 김정식 | Shadow mask and method of manufacturing the same |
-
2003
- 2003-01-09 KR KR1020030002231A patent/KR20040064191A/en not_active Application Discontinuation
- 2003-12-23 WO PCT/KR2003/002804 patent/WO2004064155A1/en not_active Application Discontinuation
- 2003-12-23 AU AU2003289514A patent/AU2003289514A1/en not_active Abandoned
- 2003-12-26 WO PCT/KR2003/002856 patent/WO2004064156A1/en not_active Application Discontinuation
- 2003-12-26 AU AU2003289537A patent/AU2003289537A1/en not_active Abandoned
-
2004
- 2004-01-09 WO PCT/KR2004/000021 patent/WO2004064135A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20040064191A (en) | 2004-07-16 |
WO2004064135A1 (en) | 2004-07-29 |
WO2004064155A1 (en) | 2004-07-29 |
AU2003289537A1 (en) | 2004-08-10 |
WO2004064156A1 (en) | 2004-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |