WO2004064135A1 - Composite shape electroforming member, its electroforming master and method for manufacturing the same - Google Patents

Composite shape electroforming member, its electroforming master and method for manufacturing the same Download PDF

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Publication number
WO2004064135A1
WO2004064135A1 PCT/KR2004/000021 KR2004000021W WO2004064135A1 WO 2004064135 A1 WO2004064135 A1 WO 2004064135A1 KR 2004000021 W KR2004000021 W KR 2004000021W WO 2004064135 A1 WO2004064135 A1 WO 2004064135A1
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WO
WIPO (PCT)
Prior art keywords
electroforming
electrode base
exposing portions
pin portion
metal layers
Prior art date
Application number
PCT/KR2004/000021
Other languages
French (fr)
Inventor
Jeong-Sik Kim
Original Assignee
Graphion Technologies Usa Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graphion Technologies Usa Llc filed Critical Graphion Technologies Usa Llc
Publication of WO2004064135A1 publication Critical patent/WO2004064135A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Definitions

  • the present invention relates to a composite shape electroforming member, its electroforming master and a method for manufacturing the same, in which an electroforming member for a minute conducting circuit used in semiconductor and other electronic devices is made by an electroforming process.
  • the electroforming member is manufactured by performing an electroforming process in an electroforming tub.
  • the electroforming member of the present invention has various shapes.
  • the electroforming master is digested in the electroforming tub to obtain the electroforming member of a metal minute pattern.
  • the electroforming member is then detached from the electroforming master to be produced as a product.
  • a pin portion having elasticity is used as the electroforming master in the present invention.
  • the electroforming master is again digested in the electroforming tub to repeatedly form a new minute pattern.
  • the present invention is characterized in that an electroforming member of a metal minute pattern for a minute conducting circuit is made by an electroforming process.
  • the metal minute pattern is formed of metals having various patterns and is used in various fields such as a conducting circuit for semiconductor and other electronic devices.
  • the metal minute pattern has been conventionally obtained by an etching process. However, in the present invention, it can be obtained by the electroforming process.
  • the electroforming member of the pattern may be obtained by a laminate layered with different kinds of metals.
  • the pattern can be used for a metal laminate or different kinds of metal laminates, and more particularly for a laminate manufactured by layered metals.
  • the laminate has a thickness of several microns or several tens of microns.
  • the laminate has a thickness of several hundreds of microns as the case may be.
  • a composite shape electroforming member is defined one with a section varied vertically, i.e., in a thickness direction.
  • the composite shape electroforming member can have various shapes by gradually varying the size and the position of an exposing portion when the exposing portion is formed using a film. That is, a pin portion of insulating material protruded upward of the surface of an electrode base is formed with a varied section in a vertical direction by gradually varying the size and the position of the exposing portion. As a result, the electroforming member having various shaped sections varied vertically can be obtained.
  • a metal minute pattern used for a conducting circuit has been conventionally obtained by an etching process.
  • the conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion.
  • the etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained.
  • the etching process has limitation in a processing pitch and height due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed.
  • a metal minute pattern is formed by an electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process.
  • a pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for electroforming master in the present invention, waste of material is avoided.
  • each product is repeatedly formed in an electroforming tub by an electroforming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
  • the electroforming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
  • a conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist.
  • an electroforming member of the present invention can obtain a desired height by forming a high pin portion.
  • the conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various shaped sections such as a stepped section or a curved section.
  • Such a desired section can be obtained by an electroforming master that can form a pin portion in a three-dimensional shape.
  • the present invention is directed to a composite shape electroforming master, its electroforming master and a method for manufacturing the same that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
  • An object of the present invention is to provide a composite shape electroforming master, its electroforming master and a method for manufacturing the same, in which the electroforming member has various sections .
  • the electroforming master is made by the steps of forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member, forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion, sequentially increasing the height of the metal layers and the height of the exposing portions, removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height, forming a pin portion by filling an insulating material in the space portion, and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened, wherein the height of the exposing portions and the height of the metal layers are increased as they are repeatedly formed in turn, and the size and the position of the exposing portions are gradually varied by a film
  • a concave portion is formed below the pin portion at the position lower than that of the electrode base, and an insulating material is filled in the concave portion in an integral form with the pin portion to form a root portion.
  • the concave portion is formed by an etching process.
  • the pin portion has elasticity.
  • An example of the pin portion includes a material having silicon with elasticity and hetero- characteristics as a main component.
  • the electroforming member has a section varied in a vertical direction.
  • an electroforming master includes a concave portion formed on an upper surface of an electrode base, a root portion formed by filling an insulating material in the concave portion, and a pin portion formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
  • the insulating portion protruded higher than the surface of the electrode base is defined as the pin portion.
  • the insulating material formed below the pin portion is defined as the root portion.
  • the root portion serves to fasten the pin portion to the electrode base.
  • the electroforming process is performed two or more times to protrude the insulating' material at a certain height upward of the surface of the electrode base.
  • the pin portion serves to limit growth of electroforming metal in a certain shape. That is, since the shape of the electroforming member is made like the shape of the pin portion, the shape of the pin portion affects the shape of the electroforming member.
  • a register used for electroforming is formed in a vertical direction, i.e., a linear direction which is a thickness direction of the electroforming member. Therefore, the conventional electroforming member has only a vertical post shape.
  • the present invention is characterized in that the pin portion has a composite three-dimensional shape in addition to the vertical post shape so as to obtain the electroforming member of various shapes in the thickness direction of the electroforming member. In the present invention, if the exposing portions are formed with the same shape in the same position, the electroforming member has a linear section.
  • the electroforming member of the present invention may include different kinds of metal layers.
  • the pin portion of the present invention serves as a factor that determines the thickness of the electroforming member as well as its shape.
  • the thickness of the electroforming member is limited at the height of the pin portion.
  • To form the electroforming member at a desired thickness it is necessary to increase the height of the pin portion in response to the thickness of the electroforming member.
  • the thickness of the electroforming member is limited by the limited height of the register.
  • the height of the pin portion can be increased by a desired height.
  • the insulating portion of the present invention has elasticity.
  • the insulating portion having elasticity includes silicon as a main component. More preferably, the insulating material has elasticity and insulating and hetero-characteristics .
  • the silicon based material can satisfy the characteristics. That is, silicon has elasticity in addition to excellent insulating and hetero characteristics.
  • the silicon based material means that various additives may be added to silicon if necessary.
  • the electroforming master can repeatedly be used.
  • the pin portion does not cause stress the electroforming member due to its elasticity when the electroforming member is detached from the electroforming master. Therefore, the pin portion and the electroforming member are not damaged, and the electroforming master of the present invention is characterized by its repeated use.
  • FIG. 1 illustrates a metal minute pattern
  • FIG. 2 illustrates a method for forming a root portion of an electroforming master according to one embodiment of the present invention
  • FIG. 3 illustrates the state that electroforming is implemented by digesting an incipient electroforming master in an electroforming tub;
  • FIG. 4 illustrates the processes of forming an exposing portion, and forming a metal layer through an electroforming process
  • FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process
  • FIG. 6 illustrates a pin portion having a desired height
  • FIGs. 7a and 7b illustrate a method for manufacturing a composite shape electroforming master according to other embodiment of the present invention
  • FIG. 8 illustrates detachment of a composite shape electroforming member according to the present invention
  • FIGs. 9a and 9b illustrate a composite shape electroforming member in which different kinds of metal layers are formed.
  • FIG. 10 illustrates a composite shape electroforming member in which gears of different kinds of metals having a step difference are formed.
  • an electrode base of an electroforming master includes a conducting portion and an insulating portion on its surface.
  • the conducting portion has the same shape as that of an electroforming member.
  • the insulating portion of the present invention limits electroforming metal to be grown in an electroforming tub. Once an electroforming process is performed in the electrode base within the electroforming tub, metal ion of the conducting portion is grown in the electroforming tub. In the present invention, the height of metal layers and the height of exposing portions are sequentially increased.
  • the electroforming master for a composite shape electroforming member can be manufactured by controlling the shape of the exposing portions.
  • the present invention is characterized by a composite shape electroforming master, its electroforming master and a method for manufacturing the same.
  • FIG. 1 illustrates a metal minute pattern.
  • a pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits.
  • an electroforming member is manufactured by performing an electroforming process through an electroforming master.
  • the metal minute pattern is also manufactured through the electroforming master of the present invention.
  • the metal minute pattern and all the products manufactured by the electroforming master of the present invention are defined as the electroforming member in the present invention.
  • a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as the metal minute pattern.
  • the electrode base having a pattern is formed using a film.
  • the electrode base having a pattern is used to form an electroforming master that can repeatedly be used.
  • the electroforming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
  • FIGs. 2 to 6 illustrate the processes of manufacturing a composite shape electroforming master according to one embodiment of the present invention.
  • FIG. 2 illustrates a method for forming a root portion of an electroforming master according to the present invention.
  • a photoresist 2 is deposited on an electrode base basic material 101, and a film having a specific pattern is exposed to form an exposing portion 3.
  • the upper surface of the electrode base basic material 101 is etched at a certain depth to form a concave portion 4.
  • the electrode base basic material in which the concave portion 4 is formed is defined as the electrode base 5 of the electroforming master.
  • the concave portion may be formed by a mechanical process or a laser process.
  • a filling material 6 is filled in the concave portion 4 of the electrode base. The filling material 6 is then arranged to be flush with the upper surface of the electrode base.
  • FIG. 3 illustrates the state that electroforming is implemented by digesting the incipient master in an electroforming tub.
  • FIG. 4 illustrates the processes of forming an exposing portion, and forming a metal layer through an electroforming process.
  • a photoresist layer 9 is deposited on the incipient master in a state that the first metal layer 8 is grown at the height of the exposing portion 7.
  • An exposing portion 10 is formed in the photoresist layer.
  • the photoresist except for that of the exposing portion 10 is removed by a washing process to form a space portion.
  • the electroforming process is then implemented in the electrode base 5 so that a second metal layer 11 is grown in the space portion at the height of the exposing portion 10.
  • FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process.
  • a photoresist layer 12 is again deposited on the electrode base where the exposing portion 10 and the second metal layer 11 are formed.
  • An exposing portion 13 is formed in the photoresist layer.
  • a film having a small difference from that of the incipient master in its pattern is used. Therefore, the exposing portion 13 has a different shape from that of the incipient master.
  • the photoresist except for that of the exposing portion 13 is removed by a washing process to form a space portion.
  • the electroforming process is then implemented in the electrode base 5 so that a third metal layer 14 is grown in the space portion at the height of the exposing portion 13.
  • FIG. 6 illustrates a pin portion having a desired height.
  • the exposing portions and the metal layers are formed at a desired height
  • the exposing portions layered on the electrode base and the filling material filled in the concave portion are removed to form a space portion 15.
  • An insulating material 16 is filled in the space portion 15 at the height of the metal layers.
  • the metal layers are removed from the electrode base.
  • the electroforming master is manufactured.
  • a root portion and a pin portion are formed in the space portion of the electrode base 5, the root portion is formed in the concave portion by the insulating material 16, and a pin portion having various shapes is formed at a certain height on the top of the root portion in an integral form with the root portion.
  • the shape of the pin portion serves as a factor that determines the shape of the electroforming member. Also, the height of the pin portion determines the thickness of the electroforming member.
  • the photoresist generally used fails to form the thick exposing portions at once. However, the pin portion can thickly be formed by the processes of the present invention. In this respect, the present invention will be remarkable.
  • FIGs. 7a and 7b illustrate a method for manufacturing a composite shape electroforming master according to other embodiment of the present invention.
  • an electroforming master having a pin portion of a certain height is manufactured without forming a root portion.
  • an electroforming master is manufactured by forming exposing portions and metal layers on a plane electrode base basic material.
  • a photoresist layer 19 is deposited on an electrode base basic material 17, and a film is exposed to form an exposing portion 20.
  • a portion that is not exposed is removed by a washing process to form a space portion 21.
  • the electroforming master having the electrode base 18 constructed as above is defined as the incipient master.
  • the electroforming process is implemented in the electroforming tub of the incipient master so that a first metal layer 22 is grown in the space portion at the height of the exposing portion 20.
  • a photoresist layer is again deposited on the exposing portion 20 and the first metal layer 22.
  • an exposing portion 23 is formed on the exposing portion 20 by the exposing process.
  • the exposing portion 23 has a small difference from that of the incipient master in its shape.
  • the photoresist except for that of the exposing portion 23 is removed by the washing process to form a space portion.
  • the electroforming process is then implemented in the electrode base 18 so that a second metal layer 24 is grown in the space portion at the height of the exposing portion 23.
  • a photoresist layer is again deposited on the electrode base where the exposing portion 23 and the second metal layer 24 are formed.
  • the photoresist layer is exposed to form an exposing portion 25.
  • the shape of the film is determined by that of the composite shape electroforming member.
  • the photoresist except for that of the exposing portion 25 is removed by the washing process to form a space portion.
  • the electroforming process is then implemented in the electrode base so that a third metal layer 26 is grown in the space portion at the height of the exposing portion 25. Afterwards, when the exposing portions and the metal layers are formed at a desired height, the exposing portions 20, 23 and 25 are removed from the electrode base to form a space portion 27.
  • An insulating material 28 is filled in the space portion 27 at the height of the metal layers. Once the insulating material 28 is hardened, the metal layers 29 are removed from the electrode base. As a result, the composite shape electroforming master is manufactured in which the insulating material 28 is formed in the electrode base at a certain height.
  • FIG. 8 illustrates detachment of a composite shape electroforming member according to the present invention.
  • the electroforming member is formed at a desired height by performing the electroforming process in the composite shape electroforming master, the metal layers 30 are removed from the electrode base 5 so that a desired composite shape electroforming member can be obtained.
  • the shape of the pin portion protruded upward of the surface of the electrode base 5 serves as a factor that determines the shape of the composite shape electroforming member.
  • FIGs. 9a and 9b illustrates a composite shape electroforming member of different kinds of metals.
  • the composite shape electroforming member can be formed by sequentially layering different kinds of metals such as copper, nickel, and gold through the electroforming process.
  • the metal layers are grown by digesting the composite shape electroforming master in electroforming tubs of different metals through the electroforming process.
  • the metal pattern of a specific pattern or the composite shape electroforming member can be formed by varying the shape of the exposing portions depending on the pattern of the film.
  • the composite shape electroforming member can be grown vertically with various sections . That is, the composite shape electroforming member may be grown either vertically in a curve or with a step difference.
  • the composite shape electroforming member can be grown vertically in various shapes by forming an exposing portion varied depending on patterns of a film. This is because that the varied exposing portion is used as the pin portion in the composite shape electroforming master. In case that the exposing portions are formed a number of times and the height of the exposing portions is low, the composite shape electroforming member having a curved shape can be obtained. To obtain a laminated electroforming member with multiple layers, if the exposing portions are formed in the same position using the same film, they are accumulated vertically.
  • FIG. 10 illustrates a composite shape electroforming member in which gears of different kinds of metals having a step difference are formed.
  • a pin portion 32 of an insulating material including silicon as a main component is formed on the surface of the electrode base 31.
  • the pin portion formed on the electrode base has a shape of gears 33 and 34.
  • the gears are formed by layering metals in the order of nickel, copper and nickel.
  • the gears have a height of several microns or several tens of microns and an outer diameter of several tens of microns.
  • the gears can be manufactured in various shapes by the process for mass production.
  • the electrode base and the insulating material can be formed of various materials .
  • stainless steel may be used as the electrode base.
  • Stainless steel has excellent durability and serves to facilitate detachment of the electroforming member formed of a minute pattern of thin metal such as copper or nickel.
  • the insulating material has elasticity. If the insulating material has elasticity, stress does not occur between the electroforming member grown by the electroforming process and the insulating material. In this case, the electroforming master is detached from the insulating material without any damage.
  • silicon is used as the insulating material.
  • the insulating material is not damaged in spite of detachment of the electroforming member because the insulating material has elasticity and hetero- characteristics . Also, silicon has excellent hetero- characteristics so that it serves to facilitate detachment of the electroforming member.
  • the electroforming member of the metal minute pattern is manufactured by the electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process.
  • the pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch.
  • the etching process since only material required for a metal minute pattern is used for electroforming master in the present invention, waste of material is avoided.
  • each product is repeatedly formed in an electroforming tub by an electroforming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
  • the electroforming master can repeatedly be used.
  • the pin portion does not cause stress the electroforming member due to its elasticity when the electroforming member is detached from the electroforming master. Therefore, the pin portion and the electroforming member are not damaged, and the electroforming master of the present invention is characterized by its repeated use.
  • the conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist.
  • an electroforming member of the present invention can obtain a desired height by forming the pin portion having a high thickness.
  • the conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various sections such as a stepped section or a curved section.
  • Such a desired section can be obtained by an electroforming master that can form a pin portion in a three-dimensional shape.

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Abstract

A composite shape electroforming master, its electroforming master and a method for manufacturing the same are disclosed, in which the electroforming member has various sections. The electroforming master is made by the steps of forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member, forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion, sequentially increasing the height of the metal layers and the height of the exposing portions, removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height, forming a pin portion by filling an insulating material in the space portion, and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened. The composite shape electroforming member can have various shapes by gradually varying the size and the position of the exposing portions when the exposing portions are formed using a film. That is, the pin portion of the insulating material protruded upward of the surface of the electrode base is formed with a varied section in a vertical direction by gradually varying the size and the position of the exposing portions. As a result, the electroforming member having various sections varied vertically can be obtained.

Description

COMPOSITE SHAPE ELECTROFORMING MEMBER,
ITS ELECTROFORMING MASTER AND
METHOD FOR MANUFACTURING THE SAME
TECHNICAL FIELD
The present invention relates to a composite shape electroforming member, its electroforming master and a method for manufacturing the same, in which an electroforming member for a minute conducting circuit used in semiconductor and other electronic devices is made by an electroforming process.
In the present invention, the electroforming member is manufactured by performing an electroforming process in an electroforming tub. The electroforming member of the present invention has various shapes. Also, in the present invention, the electroforming master is digested in the electroforming tub to obtain the electroforming member of a metal minute pattern. The electroforming member is then detached from the electroforming master to be produced as a product. A pin portion having elasticity is used as the electroforming master in the present invention. In this case, the electroforming master is again digested in the electroforming tub to repeatedly form a new minute pattern.
The present invention is characterized in that an electroforming member of a metal minute pattern for a minute conducting circuit is made by an electroforming process. The metal minute pattern is formed of metals having various patterns and is used in various fields such as a conducting circuit for semiconductor and other electronic devices. The metal minute pattern has been conventionally obtained by an etching process. However, in the present invention, it can be obtained by the electroforming process. In the present invention, the electroforming member of the pattern may be obtained by a laminate layered with different kinds of metals. The pattern can be used for a metal laminate or different kinds of metal laminates, and more particularly for a laminate manufactured by layered metals. In the present invention, the laminate has a thickness of several microns or several tens of microns. The laminate has a thickness of several hundreds of microns as the case may be.
In the present invention, a composite shape electroforming member is defined one with a section varied vertically, i.e., in a thickness direction. The composite shape electroforming member can have various shapes by gradually varying the size and the position of an exposing portion when the exposing portion is formed using a film. That is, a pin portion of insulating material protruded upward of the surface of an electrode base is formed with a varied section in a vertical direction by gradually varying the size and the position of the exposing portion. As a result, the electroforming member having various shaped sections varied vertically can be obtained.
BACKGROUND ART
A metal minute pattern used for a conducting circuit has been conventionally obtained by an etching process. However, the conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion. The etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained. Also, the etching process has limitation in a processing pitch and height due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed. However, in the present invention, a metal minute pattern is formed by an electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, since a pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for electroforming master in the present invention, waste of material is avoided.
In the present invention, each product is repeatedly formed in an electroforming tub by an electroforming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
There has " been a conventional method for forming a metal minute pattern by an electroforming process. In the prior art, a disposable electroforming master has been mainly used. To manufacture an electroforming master that can repeatedly be used, a hardened register formed on an electrode base has been conventionally used. The hardened register generates stress with the electroforming member. When the electroforming member is detached from the register as the electroforming process is finished, the stress fails to easily detach the electroforming member from the register. That is, when the electroforming member is detached from the register, the electroforming member affects the register and vice versa. This leads the electroforming member or the register to be damaged. For this reason, the electroforming process has been conventionally considered a temporary process. However, since a pin portion having elasticity is used instead of the hardened register in the present invention, the insulating material does not affect the electroforming member when the electroforming member is detached. Therefore, the electroforming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
A conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist. However, an electroforming member of the present invention can obtain a desired height by forming a high pin portion. The conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various shaped sections such as a stepped section or a curved section. Such a desired section can be obtained by an electroforming master that can form a pin portion in a three-dimensional shape.
DISCLOSURE OF THE INVENTION Accordingly, the present invention is directed to a composite shape electroforming master, its electroforming master and a method for manufacturing the same that substantially obviates one or more of the problems due to limitations and disadvantages of the related art. An object of the present invention is to provide a composite shape electroforming master, its electroforming master and a method for manufacturing the same, in which the electroforming member has various sections .
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the scheme particularly pointed out in the written description and claims hereof as well as the appended drawings .
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, in an electroforming master which forms a composite shape electroforming member with various sections, the electroforming master is made by the steps of forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member, forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion, sequentially increasing the height of the metal layers and the height of the exposing portions, removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height, forming a pin portion by filling an insulating material in the space portion, and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened, wherein the height of the exposing portions and the height of the metal layers are increased as they are repeatedly formed in turn, and the size and the position of the exposing portions are gradually varied by a film. A concave portion is formed below the pin portion at the position lower than that of the electrode base, and an insulating material is filled in the concave portion in an integral form with the pin portion to form a root portion. The concave portion is formed by an etching process. The pin portion has elasticity. An example of the pin portion includes a material having silicon with elasticity and hetero- characteristics as a main component. The electroforming member has a section varied in a vertical direction.
To further achieve these and other advantages and in accordance with the purpose of the present invention, an electroforming master includes a concave portion formed on an upper surface of an electrode base, a root portion formed by filling an insulating material in the concave portion, and a pin portion formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base. In the present invention, the insulating portion protruded higher than the surface of the electrode base is defined as the pin portion. The insulating material formed below the pin portion is defined as the root portion. The root portion serves to fasten the pin portion to the electrode base. In the present invention, the electroforming process is performed two or more times to protrude the insulating' material at a certain height upward of the surface of the electrode base. The pin portion serves to limit growth of electroforming metal in a certain shape. That is, since the shape of the electroforming member is made like the shape of the pin portion, the shape of the pin portion affects the shape of the electroforming member. In the conventional electroforming member, a register used for electroforming is formed in a vertical direction, i.e., a linear direction which is a thickness direction of the electroforming member. Therefore, the conventional electroforming member has only a vertical post shape. The present invention is characterized in that the pin portion has a composite three-dimensional shape in addition to the vertical post shape so as to obtain the electroforming member of various shapes in the thickness direction of the electroforming member. In the present invention, if the exposing portions are formed with the same shape in the same position, the electroforming member has a linear section. The electroforming member of the present invention may include different kinds of metal layers.
The pin portion of the present invention serves as a factor that determines the thickness of the electroforming member as well as its shape. The thickness of the electroforming member is limited at the height of the pin portion. To form the electroforming member at a desired thickness, it is necessary to increase the height of the pin portion in response to the thickness of the electroforming member. In the prior art, if the electroforming process is performed using a conventional register, the thickness of the electroforming member is limited by the limited height of the register. However, in the present invention, since the electroforming process and the exposing process are performed in the electrode base several times to form layered electroforming metals and exposing portions, the height of the pin portion can be increased by a desired height.
Preferably, the insulating portion of the present invention has elasticity. The insulating portion having elasticity includes silicon as a main component. More preferably, the insulating material has elasticity and insulating and hetero-characteristics . The silicon based material can satisfy the characteristics. That is, silicon has elasticity in addition to excellent insulating and hetero characteristics. The silicon based material means that various additives may be added to silicon if necessary.
In the present invention, since the insulating material having elasticity is used as the pin portion, the electroforming master can repeatedly be used. The pin portion does not cause stress the electroforming member due to its elasticity when the electroforming member is detached from the electroforming master. Therefore, the pin portion and the electroforming member are not damaged, and the electroforming master of the present invention is characterized by its repeated use.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 illustrates a metal minute pattern; FIG. 2 illustrates a method for forming a root portion of an electroforming master according to one embodiment of the present invention; FIG. 3 illustrates the state that electroforming is implemented by digesting an incipient electroforming master in an electroforming tub;
FIG. 4 illustrates the processes of forming an exposing portion, and forming a metal layer through an electroforming process;
FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process; FIG. 6 illustrates a pin portion having a desired height;
FIGs. 7a and 7b illustrate a method for manufacturing a composite shape electroforming master according to other embodiment of the present invention;
FIG. 8 illustrates detachment of a composite shape electroforming member according to the present invention;
FIGs. 9a and 9b illustrate a composite shape electroforming member in which different kinds of metal layers are formed; and
FIG. 10 illustrates a composite shape electroforming member in which gears of different kinds of metals having a step difference are formed.
BEST MODE FOR CARRYING OUT THE INVENTION
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
In the present invention, an electrode base of an electroforming master includes a conducting portion and an insulating portion on its surface. The conducting portion has the same shape as that of an electroforming member. The insulating portion of the present invention limits electroforming metal to be grown in an electroforming tub. Once an electroforming process is performed in the electrode base within the electroforming tub, metal ion of the conducting portion is grown in the electroforming tub. In the present invention, the height of metal layers and the height of exposing portions are sequentially increased. The electroforming master for a composite shape electroforming member can be manufactured by controlling the shape of the exposing portions. The present invention is characterized by a composite shape electroforming master, its electroforming master and a method for manufacturing the same.
FIG. 1 illustrates a metal minute pattern. A pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits. In the present invention, an electroforming member is manufactured by performing an electroforming process through an electroforming master. The metal minute pattern is also manufactured through the electroforming master of the present invention. The metal minute pattern and all the products manufactured by the electroforming master of the present invention are defined as the electroforming member in the present invention. To obtain such a metal minute pattern, a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as the metal minute pattern. In the present invention, the electrode base having a pattern is formed using a film. The electrode base having a pattern is used to form an electroforming master that can repeatedly be used. The electroforming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
FIGs. 2 to 6 illustrate the processes of manufacturing a composite shape electroforming master according to one embodiment of the present invention.
FIG. 2 illustrates a method for forming a root portion of an electroforming master according to the present invention. A photoresist 2 is deposited on an electrode base basic material 101, and a film having a specific pattern is exposed to form an exposing portion 3. The upper surface of the electrode base basic material 101 is etched at a certain depth to form a concave portion 4. The electrode base basic material in which the concave portion 4 is formed is defined as the electrode base 5 of the electroforming master. The concave portion may be formed by a mechanical process or a laser process. A filling material 6 is filled in the concave portion 4 of the electrode base. The filling material 6 is then arranged to be flush with the upper surface of the electrode base. Once the arranged filling material is hardened, the photoresist is again deposited on the filling material and the upper surface of the electrode base to form an exposing portion 7 in the photoresist portion using the same film. An unexposed portion is washed to form a space portion. The electrode base constructed as above is defined as an incipient master. FIG. 3 illustrates the state that electroforming is implemented by digesting the incipient master in an electroforming tub. Once the electroforming process is started in the electroforming tub by connecting a negative electrode (-) to the electrode base 5, ionized metal starts to be coupled with the electrode base 5. The ionized metal starts to be formed in the electrode base as a minute pattern of a thin metal. Once the electroforming process is implemented in the electrode base within the electroforming tub, metal ion starts to be grown on the surface of the electrode base exposed in the exposing portion 7. With the lapse of time, a first metal layer 8 is formed at the height of the exposing portion 7.
FIG. 4 illustrates the processes of forming an exposing portion, and forming a metal layer through an electroforming process. A photoresist layer 9 is deposited on the incipient master in a state that the first metal layer 8 is grown at the height of the exposing portion 7. An exposing portion 10 is formed in the photoresist layer. In this case, a film having a small difference from that of the incipient master in its pattern is used. Therefore, the exposing portion 10 has a different shape from that of the incipient master. The photoresist except for that of the exposing portion 10 is removed by a washing process to form a space portion. The electroforming process is then implemented in the electrode base 5 so that a second metal layer 11 is grown in the space portion at the height of the exposing portion 10. FIG. 5 illustrates the processes of forming an exposing portion, and forming a third metal layer through an electroforming process. A photoresist layer 12 is again deposited on the electrode base where the exposing portion 10 and the second metal layer 11 are formed. An exposing portion 13 is formed in the photoresist layer. In this case, a film having a small difference from that of the incipient master in its pattern is used. Therefore, the exposing portion 13 has a different shape from that of the incipient master. The photoresist except for that of the exposing portion 13 is removed by a washing process to form a space portion. The electroforming process is then implemented in the electrode base 5 so that a third metal layer 14 is grown in the space portion at the height of the exposing portion 13. FIG. 6 illustrates a pin portion having a desired height. When the exposing portions and the metal layers are formed at a desired height, the exposing portions layered on the electrode base and the filling material filled in the concave portion are removed to form a space portion 15. An insulating material 16 is filled in the space portion 15 at the height of the metal layers. Once the insulating material 16 is hardened, the metal layers are removed from the electrode base. As a result, the electroforming master is manufactured. In the electroforming master, a root portion and a pin portion are formed in the space portion of the electrode base 5, the root portion is formed in the concave portion by the insulating material 16, and a pin portion having various shapes is formed at a certain height on the top of the root portion in an integral form with the root portion. The shape of the pin portion serves as a factor that determines the shape of the electroforming member. Also, the height of the pin portion determines the thickness of the electroforming member. The photoresist generally used fails to form the thick exposing portions at once. However, the pin portion can thickly be formed by the processes of the present invention. In this respect, the present invention will be remarkable.
FIGs. 7a and 7b illustrate a method for manufacturing a composite shape electroforming master according to other embodiment of the present invention.
In this embodiment, an electroforming master having a pin portion of a certain height is manufactured without forming a root portion.
In FIG. 7a, an electroforming master is manufactured by forming exposing portions and metal layers on a plane electrode base basic material. A photoresist layer 19 is deposited on an electrode base basic material 17, and a film is exposed to form an exposing portion 20. A portion that is not exposed is removed by a washing process to form a space portion 21. The electroforming master having the electrode base 18 constructed as above is defined as the incipient master. The electroforming process is implemented in the electroforming tub of the incipient master so that a first metal layer 22 is grown in the space portion at the height of the exposing portion 20. A photoresist layer is again deposited on the exposing portion 20 and the first metal layer 22. Thus, an exposing portion 23 is formed on the exposing portion 20 by the exposing process. In this case, a film having a small difference from that of the incipient master in its pattern is used, and the shape of the film is determined by that of the composite shape electroforming member. Therefore, the exposing portion 23 has a small difference from that of the incipient master in its shape. The photoresist except for that of the exposing portion 23 is removed by the washing process to form a space portion. The electroforming process is then implemented in the electrode base 18 so that a second metal layer 24 is grown in the space portion at the height of the exposing portion 23.
In FIG. 7b, a photoresist layer is again deposited on the electrode base where the exposing portion 23 and the second metal layer 24 are formed. The photoresist layer is exposed to form an exposing portion 25. In this case, the shape of the film is determined by that of the composite shape electroforming member. The photoresist except for that of the exposing portion 25 is removed by the washing process to form a space portion. The electroforming process is then implemented in the electrode base so that a third metal layer 26 is grown in the space portion at the height of the exposing portion 25. Afterwards, when the exposing portions and the metal layers are formed at a desired height, the exposing portions 20, 23 and 25 are removed from the electrode base to form a space portion 27. An insulating material 28 is filled in the space portion 27 at the height of the metal layers. Once the insulating material 28 is hardened, the metal layers 29 are removed from the electrode base. As a result, the composite shape electroforming master is manufactured in which the insulating material 28 is formed in the electrode base at a certain height.
FIG. 8 illustrates detachment of a composite shape electroforming member according to the present invention. When the electroforming member is formed at a desired height by performing the electroforming process in the composite shape electroforming master, the metal layers 30 are removed from the electrode base 5 so that a desired composite shape electroforming member can be obtained. The shape of the pin portion protruded upward of the surface of the electrode base 5 serves as a factor that determines the shape of the composite shape electroforming member.
FIGs. 9a and 9b illustrates a composite shape electroforming member of different kinds of metals. The composite shape electroforming member can be formed by sequentially layering different kinds of metals such as copper, nickel, and gold through the electroforming process. The metal layers are grown by digesting the composite shape electroforming master in electroforming tubs of different metals through the electroforming process. Thus, the composite shape electroforming member of two kinds of metals can be formed. The metal pattern of a specific pattern or the composite shape electroforming member can be formed by varying the shape of the exposing portions depending on the pattern of the film. In the present invention, the composite shape electroforming member can be grown vertically with various sections . That is, the composite shape electroforming member may be grown either vertically in a curve or with a step difference. The composite shape electroforming member can be grown vertically in various shapes by forming an exposing portion varied depending on patterns of a film. This is because that the varied exposing portion is used as the pin portion in the composite shape electroforming master. In case that the exposing portions are formed a number of times and the height of the exposing portions is low, the composite shape electroforming member having a curved shape can be obtained. To obtain a laminated electroforming member with multiple layers, if the exposing portions are formed in the same position using the same film, they are accumulated vertically. FIG. 10 illustrates a composite shape electroforming member in which gears of different kinds of metals having a step difference are formed. A pin portion 32 of an insulating material including silicon as a main component is formed on the surface of the electrode base 31. The pin portion formed on the electrode base has a shape of gears 33 and 34. The gears are formed by layering metals in the order of nickel, copper and nickel. The gears have a height of several microns or several tens of microns and an outer diameter of several tens of microns. The gears can be manufactured in various shapes by the process for mass production.
In the present invention, the electrode base and the insulating material can be formed of various materials . As an example, stainless steel may be used as the electrode base. Stainless steel has excellent durability and serves to facilitate detachment of the electroforming member formed of a minute pattern of thin metal such as copper or nickel. More preferably, the insulating material has elasticity. If the insulating material has elasticity, stress does not occur between the electroforming member grown by the electroforming process and the insulating material. In this case, the electroforming master is detached from the insulating material without any damage. In the present invention, silicon is used as the insulating material. If silicon is used as the insulating material, the insulating material is not damaged in spite of detachment of the electroforming member because the insulating material has elasticity and hetero- characteristics . Also, silicon has excellent hetero- characteristics so that it serves to facilitate detachment of the electroforming member.
INDUSTRIAL APPLICABILITY
In the present invention, the electroforming member of the metal minute pattern is manufactured by the electroforming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, since the pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for electroforming master in the present invention, waste of material is avoided. In the present invention, each product is repeatedly formed in an electroforming tub by an electroforming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
In the present invention, since the insulating material having elasticity is used as the pin portion, the electroforming master can repeatedly be used. The pin portion does not cause stress the electroforming member due to its elasticity when the electroforming member is detached from the electroforming master. Therefore, the pin portion and the electroforming member are not damaged, and the electroforming master of the present invention is characterized by its repeated use.
The conventional electroforming member higher than a certain height could not be obtained due to limited conditions of photoresist. However, an electroforming member of the present invention can obtain a desired height by forming the pin portion having a high thickness. The conventional electroforming member generally has a linear section such as a vertical section while the electroforming member of the present invention has various sections such as a stepped section or a curved section. Such a desired section can be obtained by an electroforming master that can form a pin portion in a three-dimensional shape.
While the present invention has been described and illustrated herein with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made therein without departing from the spirit and scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention that come within the scope of the appended claims and their equivalents.

Claims

What is claimed is
1. An electroforming master which forms a composite shape electroforming member with various sections, the electroforming master being made by the steps of: forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member; forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and forming exposing portions in the insulating portion; sequentially increasing the height of the metal layers and the height of the exposing portions; removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height; forming a pin portion by filling an insulating material in the space portion; and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened, wherein the height of the exposing portions and the height of the metal layers are increased as they are repeatedly formed in turn, and the size and the position of the exposing portions are gradually varied by a film.
2. The electroforming master according to claim 1, wherein a concave portion is formed below the pin portion at the position lower than that of the electrode base, and the insulating material is filled in the concave portion in an integral form with the pin portion to form a root portion .
3. The electroforming master according to claim 2, wherein the concave portion is formed by an etching process.
4. The electroforming master according to claim 1, 2 or 3, wherein the pin portion has an increased height by forming the metal layers and the exposing portions.
5. The electroforming master according to claim 1, 2 or 3, wherein the pin portion has elasticity.
6. The electroforming master according to claim 5, wherein the pin portion having elasticity includes silicon as a main component.
7. An electroforming master which forms a composite shape electroforming member with various sections, the electroforming master comprising an electrode base including a pin portion of an insulating material protruded upward of the surface of the electrode base, the pin portion having a section varied vertically.
8. The electroforming master according to claim 7, wherein a concave portion is formed below the pin portion, and a root portion is formed in the concave portion in an integral form with the pin portion.
9. The electroforming master according to claim 8, wherein the concave portion is formed by an etching process .
10. The electroforming master according to claim 7, 8 or 9, wherein the pin portion is formed in such a manner that metal layers and exposing portions are formed in turn by performing an electroforming process in the electrode base, the exposing portions are removed to form a space portion when they reach a certain height, and an insulating material is filled in the space portion.
11. The electroforming master according to claim 7, 8, or 9, wherein the insulating material includes silicon as a main component .
12. A method for manufacturing an electroforming master which forms a composite shape electroforming member with various sections, the method comprising the steps of: forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member; forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion; sequentially increasing the height of the metal layers and the height of the exposing portions; removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height; forming a pin portion by filling an insulating material in the space portion; and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened, wherein the height of the exposing portions and the height of the metal layers are increased as they are repeatedly formed in turn, and the size and the position of the exposing portions are gradually varied by a film.
13. The method according to claim 12, wherein a concave portion is formed below the pin portion at the position lower than that of the electrode base, and an insulating material is filled in the concave portion in an integral form with the pin portion to form a root portion.
14. The method according to claim 13, wherein the concave portion is formed by an etching process.
15. The method according to claim 12, 13 or 14, wherein the pin portion has an increased height by forming the metal layers and the exposing portions.
16. The method according to claim 12, 13 or 14, wherein the pin portion has elasticity.
17. The method according to claim 16, wherein the pin portion having elasticity includes silicon as a main component .
18. A method for manufacturing an electroforming master which forms a composite shape electroforming member with various sections, the method comprising the step of forming an electrode base including a pin portion of an insulating material protruded upward of 'the surface of the electrode base, the pin portion having a section varied vertically.
19. The method according to claim 18, wherein a concave portion is formed below the pin portion, and a root portion is formed in , the concave portion in an integral form with the pin portion.
20. The method according to claim 19, wherein the concave portion is formed by an etching process.
21. The method according to claim 18, 19 or 20, wherein the pin portion is formed in such a manner that metal layers and exposing portions are formed in turn by performing an electroforming process in the electrode base, the exposing portions are removed to form a space portion when they reach a certain height, and an insulating material is filled in the space portion.
22. The method according to claim 18, 19, or 20, wherein the insulating material includes silicon as a main component .
23. A composite shape electroforming member made by being detached from an electroforming master which forms the composite shape electroforming member, the electroforming master being made by the steps of: forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member; forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion; sequentially increasing the height of the metal layers and the height of exposing portions; removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height; forming a pin portion by filling an insulating material in the space portion; and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened, wherein the height of the exposing portions and the height of the metal layers are increased as they are repeatedly formed in turn, and the size and the position of the exposing portions are gradually varied by a film.
24. A composite shape electroforming member made by performing an electroforming process in an electroforming master which forms the composite shape electroforming member and detaching the electroforming member from the electroforming master, the electroforming master comprising an electrode base including a pin portion of an insulating material protruded upward of the surface of the electrode base, the pin portion having a section varied vertically.
25. The composite shape electroforming member according to claim 24, wherein a concave portion is formed below the pin portion, and a root portion is formed in the concave portion in an integral form with the pin portion.
26. The composite shape electroforming member according to claim 25, wherein the concave portion is formed by an etching process.
27. The composite shape electroforming member according to claim 24, 25 or 26, wherein the pin portion is formed in such a manner that metal layers and exposing portions are formed in turn by performing an electroforming process in the electrode base, the exposing portions are removed to form a space portion when they reach a certain height, and an insulating material is filled in the space portion.
28. The composite shape electroforming member according to claim 24, 25, or 26, wherein the insulating material includes silicon as a main component.
29. An electroforming member made by performing an electroforming process in an electroforming tub, the electroforming member having a section varied in a horizontal direction or a vertical direction.
PCT/KR2004/000021 2003-01-09 2004-01-09 Composite shape electroforming member, its electroforming master and method for manufacturing the same WO2004064135A1 (en)

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KR102138719B1 (en) * 2013-09-27 2020-07-28 인텔 코포레이션 Forming layers of materials over small regions by selective chemical reaction including limiting encroachment of the layers over adjacent regions

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