WO2004046643A1 - Dispositif et procede d'acquisition d'images d'un circuit electronique - Google Patents

Dispositif et procede d'acquisition d'images d'un circuit electronique Download PDF

Info

Publication number
WO2004046643A1
WO2004046643A1 PCT/JP2003/014758 JP0314758W WO2004046643A1 WO 2004046643 A1 WO2004046643 A1 WO 2004046643A1 JP 0314758 W JP0314758 W JP 0314758W WO 2004046643 A1 WO2004046643 A1 WO 2004046643A1
Authority
WO
WIPO (PCT)
Prior art keywords
image
electronic circuit
circuit component
light
imaging
Prior art date
Application number
PCT/JP2003/014758
Other languages
English (en)
Japanese (ja)
Inventor
Shinsuke Suhara
Hiroshi Katsumi
Yusuke Tsuchiya
Seigo Kodama
Original Assignee
Fuji Machine Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Mfg. Co., Ltd. filed Critical Fuji Machine Mfg. Co., Ltd.
Publication of WO2004046643A1 publication Critical patent/WO2004046643A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Definitions

  • the present invention relates to an electronic circuit component image acquiring apparatus and method, and more particularly to an electronic circuit component mounting system or the like that sucks and holds electronic circuit components by a suction nozzle and mounts them on a circuit board to assemble an electronic circuit.
  • the present invention relates to an electronic circuit component image acquiring apparatus and method for acquiring information on a holding state of an electronic circuit component by a suction nozzle.
  • a front image or a side image of an electronic circuit component is acquired.
  • An image of the electronic circuit component sucked by the suction nozzle viewed from a direction parallel to the axis of the suction nozzle is a front image
  • an image viewed from a direction perpendicular to the axis of the suction nozzle is a side image.
  • the front and side images are obtained as a reflection image formed by the light reflected on the surface of the electronic circuit component, and when the image is illuminated from behind the electronic circuit component and passes through the periphery of the electronic circuit component. It may be obtained as a formed silette image.
  • the front image and the side image were acquired at different times by different image acquisition devices.
  • Japanese Patent Application Publication No. 2000-29995 the front image and the side image are acquired simultaneously. It was suggested that
  • the time required to acquire the information on the holding state of the electronic circuit components by the suction nozzles is reduced as compared with the case where the images are acquired at different times. be able to.
  • an electronic circuit component mounting system when an electronic circuit component is sucked and held by a suction nozzle in the middle of being mounted on a circuit board, if the time required for image acquisition can be shortened, the The efficiency of circuit assembly work can be improved. Disclosure of the invention
  • the front image and the side image are acquired by separate imaging devices.
  • the electronic circuit components are illuminated by the first and second light sources that emit light of different colors, and the front and side images are simultaneously formed by the first and second imaging devices having different wavelength regions with high sensitivity. Is to be obtained. Therefore, even if the time required for acquiring electronic circuit component images can be reduced, the need for both a front image acquisition device and a side image acquisition device remains unchanged.
  • the present invention has been made in view of the above circumstances as an object to enable a front image and a side image of an electronic circuit component to be acquired by a common imaging device.
  • An electronic circuit component image obtaining apparatus, an electronic circuit component image obtaining method, and an electronic circuit component mounting system can be obtained.
  • each aspect is divided into sections, each section is numbered, and if necessary, the other section numbers are cited. This is merely to facilitate understanding of the present invention, and it should not be construed that the technical features and combinations thereof described in this specification are limited to those described in the following sections. Absent.
  • two or more items are described in one section, it is not always necessary to adopt these items together. It is also possible to select and adopt only some of the matters.
  • an imaging device having at least one row of light receiving elements
  • An electronic circuit component image acquiring apparatus comprising:
  • a front image and a side image of an electronic circuit component can be acquired by a common imaging device, and the cost of the device can be reduced.
  • the front view and the side view may be acquired at different times or may be acquired at the same time. In the latter case, it is necessary to acquire both the front view and the side view. The effect that the required time can be shortened is obtained.
  • the imaging device has light-receiving elements arranged in a line, May be arranged.
  • the row of light receiving elements and the image forming light that forms the front image or the side image are relatively moved in the direction intersecting the row of light receiving elements, and at a constant relative moving distance.
  • a two-dimensional image can be obtained by reading a signal related to the amount of light received by the light-receiving element array at a time.
  • the imaging device includes a light receiving element arranged in a plane, and the optical system simultaneously forms the front image and the side image on the light receiving element arranged in the plane.
  • An electronic circuit component image acquisition apparatus according to (1).
  • the image pickup device includes a light receiving element arranged in a line
  • the electronic circuit component image acquiring device includes:
  • a relative movement device that relatively moves the suction nozzle and the imaging device in a direction intersecting the row of the light receiving elements
  • a reading device for reading out information on the amount of light received by the light receiving elements arranged in a line each time a certain amount of relative movement is performed by the relative moving device;
  • the electronic circuit component image acquisition device further comprising: acquiring the front image and the side image in parallel during one relative movement by the movement device.
  • the front image and the side image of the electronic circuit component are acquired in parallel during one relative movement between the suction nozzle and the imaging device by the relative movement device. It is possible to efficiently obtain information on the holding state of electronic circuit components by using an inexpensive device.
  • the optical system reflects one of the light forming the front image and the light forming the side image and changes the direction of the other by 90 degrees, so that the light forming the front image and the side image are changed.
  • the electronic circuit component image acquiring apparatus according to any one of the above modes (1) to (3), including a reflector that makes the light forming the light beam substantially parallel to each other.
  • the optical system includes a lens system including at least one lens that focuses the light forming the front image and the light forming the side image on the light receiving element.
  • the lens system is disposed so that the focal point is located on the surface (side surface or bottom surface) of the electronic circuit component and on the light receiving element of the imaging device.
  • the light radiated from one point on the surface of the electronic circuit component is focused on the light receiving element by the lens system.
  • optical system includes an optical path difference influence reducing unit configured to reduce an influence of a difference in an optical path length between the light forming the front image and the light forming the side image.
  • optical path difference influence reducing unit configured to reduce an influence of a difference in an optical path length between the light forming the front image and the light forming the side image.
  • the lens system is disposed so that the focal point is located on the surface of the electronic circuit component and on the light receiving element of the image pickup device.
  • the optical path and the side image of the light forming the front image If the length of the light forming the light path is different from the optical path, the focal point of the common lens system cannot be located on the surface (on the side surface and on the bottom surface) of the electronic circuit component or on the light receiving element. Therefore, in addition to the common lens system, there may be provided an optical path difference influence reducing means for reducing the influence of the difference in the optical path length between the case of acquiring a front image and the case of acquiring a side image. desirable.
  • the side view is often obtained to check whether the electronic circuit component is suctioned by the suction nozzle in a correct posture, and in such a case, the purpose is also obtained by the side view which is somewhat less clear. Can often be reached. Therefore, the means for reducing the effect of optical path difference is not always necessary.However, if the means for reducing the effect of optical path difference described in this section is provided, both the front and side images can be obtained as clear images. .
  • the optical path difference effect reducing means makes the focal position of the lens system at the time of acquiring the front image and the side image become the same as the position of the surface (side surface and bottom surface) of the electronic circuit component or the position of the light receiving element, respectively. However, it is not essential that they be the same, as long as they are close to the range where a sufficiently clear front and side images can be obtained for practical use.
  • optical path difference effect reducing means includes at least one lens.
  • the focus position can be easily changed by using a lens.
  • the at least one lens is one lens, and the focal length of a portion of the one lens through which the light forming the front image passes and a portion through which the light forming the side image passes.
  • the electronic circuit component image acquisition device according to the above mode (7) which is different from the first embodiment and has a configuration that constitutes the optical path difference effect reducing means.
  • one of the lenses included in the common optical system for the light forming the front image and the light forming the side image has a partially different focal length, so that the front image is obtained and the side image is obtained. It is possible to reduce the influence of the difference in the length of the optical path between when the image is obtained and when the image is obtained.
  • the common lens system can be used to acquire the front image and the side image.
  • the difference between the position of the focal point at the time of acquisition and the position of the surface (side surface and bottom surface) of the electronic circuit component or the position of the light receiving element can be reduced.
  • the optical path difference effect reducing means is made of a material having a different refractive index of light from air, and has a small number of optical paths for forming the front image and optical paths for forming the side images.
  • the electronic circuit component image acquiring apparatus according to any one of the above modes (6) to (9), including the transparent body disposed on one side.
  • the optical path difference effect reducing means includes a reflective surface that is a convex curved surface or a concave curved surface, and is disposed on at least one of an optical path of light forming the front image and an optical path of light forming the side image.
  • the electronic circuit component image acquiring apparatus according to any one of the above modes (6) to (10), including the curved reflector. For example, if the reflecting surface of the reflector that reflects the image forming light and guides it to the lens system is changed from a flat surface to a concave surface, the focal length on the electronic circuit component side of the lens system becomes shorter, and if the reflecting surface is changed to a convex surface, it becomes longer.
  • the object of the light forming the side image can be obtained.
  • the focal position on the side can be closer to the position on the side of the electronic circuit component.
  • a moving device such as an image pickup device that brings the focal position closer to the position of the surface of the electronic circuit component during both the acquisition of the front image and the acquisition of the side image;
  • the imaging device takes a front image while the focus of the optical system is positioned on the bottom surface of the electronic circuit component by the moving device such as the imaging device, and is positioned on the side surface of the electronic circuit component.
  • An imaging device control device for causing the imaging device to capture a side image in the state;
  • the electronic circuit component image acquiring apparatus according to the above mode (4).
  • the image pickup device and the optical system by a moving device allows the objective of the optical system to be moved.
  • the side focus can be located on the bottom or side of the electronic circuit component. If the imaging device control device causes the imaging device to capture a front image when the focus is on the bottom surface and captures a side image when the focus is on the side surface, the length of the optical path of both light beams Even if they are different from each other, clear front and side images can both be obtained.
  • the electronic device according to any one of (1) to (12), including a lighting device, wherein the lighting device is configured such that the side image is obtained as a silhouette image. Both the front image and the front image can be obtained as a silhouette image or a reflection image by changing the illumination device.
  • the electronic device according to any one of the above modes (1) to (13), including an illumination device, wherein the illumination device is configured to acquire the side image as a reflection image.
  • the aspect in which the term depends on the term (13) is effective, for example, when it is desired to be able to select whether to acquire a side image as a silhouette image or a reflected image.
  • the electronic device including an illumination device, wherein the illumination device is configured to acquire the front image as a reflection image.
  • the aspect in which the term depends on the term 5) is effective, for example, when it is desired to select whether to acquire the front image as a silhouette image or as a reflection image.
  • a plurality of the suction nozzles are arranged in such a manner that each axis is parallel to a straight line and the axes are orthogonal to a circle around the straight line, and the straight line is closer to the straight line than the one circle.
  • the light forming a side image of the electronic circuit component sucked by each of the plurality of suction nozzles is bent from a direction substantially parallel to the radial direction of the circumference to a direction substantially parallel to the straight line.
  • the electronic circuit component image acquiring apparatus according to any one of (1) to (16), including a plurality of parallelizing reflectors.
  • a front image and side images of a plurality of electronic circuit components can be acquired by a common imaging device.
  • a common imaging device in which three or more suction nozzles are arranged on one circle and each of them has a mounting head configured to hold one electronic circuit component.
  • the entire imaging area of the imaging device can be effectively used.
  • a plurality of front images are formed in the periphery of the imaging region of the imaging device, and a relatively large non-use region is generated in the center. This is because if it is disposed closer to the center than the circumference, a side image will be formed in the unused area.
  • the imaging device is configured to generate the side image based on the reflected light from the parallel reflector.
  • the ⁇ field of view that can be imaged '' is the size of the area that can be imaged at once without the relative movement between the image forming light and the light receiving element surface when the imaging device is a device in which the light receiving elements are arranged in a plane.
  • the imaging device has light receiving elements arranged in a straight line, it means the size of the area that can be imaged by one relative movement between the image forming light and the light receiving element array. It shall be.
  • the imaging method according to the present mode can be performed, for example, by the device according to the above mode (2) or (3).
  • the imaging method according to this mode can be performed by, for example, the apparatus according to the above mode (12).
  • a mounting device including a mounting head, receiving the electronic circuit component from the component supply device by the mounting head, and mounting the electronic circuit component on a circuit board held by the board holding device;
  • An electronic circuit component image acquiring apparatus according to any one of paragraphs 19 to 19, and a front image and a side image of the electronic circuit component acquired by the electronic circuit component image acquiring apparatus.
  • An electronic circuit component mounting system comprising: BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a perspective view, excluding a part of a mounting unit including an electronic circuit component image acquiring apparatus according to one embodiment of the present invention.
  • FIG. 2 is a perspective view showing the mounting head of the mounting unit and a device for moving the mounting head.
  • FIG. 3 is a perspective view showing the mounting head and its periphery.
  • FIG. 4 is a diagram conceptually showing the electronic circuit component image acquiring apparatus.
  • FIG. 5 is an enlarged view of the side view in FIG.
  • FIG. 6 is a view showing a reflector of an electronic circuit component image acquiring apparatus according to another embodiment of the present invention.
  • FIG. 7 is a view conceptually showing an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • FIG. 8 is a view conceptually showing an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • FIG. 9 is a diagram conceptually showing an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • FIG. 10 is a view conceptually showing a reflector of an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • FIG. 11 is a side view showing a part of an electronic circuit component imaging apparatus according to still another embodiment of the present invention.
  • FIG. 12 is a view conceptually showing a part of an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • FIG. 13 is a view conceptually showing an electronic circuit component image acquiring apparatus according to still another embodiment of the present invention.
  • BEST MODE FOR CARRYING OUT THE INVENTION will be described with reference to the drawings. It should be noted that the present invention is not necessarily limited to the following embodiments, and various modifications and improvements may be made based on the knowledge of those skilled in the art, including the aspects described in the above section “Disclosure of the Invention”. It can be carried out in the form in which
  • FIG. 1 is a perspective view of a mounting unit 1 provided with an electronic circuit component image acquiring apparatus according to an embodiment of the present invention.
  • the plurality of mounting units 1 are used in series, and constitute an electronic circuit component mounting system as a whole.
  • the mounting unit 1 includes a base module 10, a plurality of (two in the illustrated example) mounting modules 12 arranged adjacent to each other and aligned on the base module 10, and the base module 10. And a control module 13 as a control device separate from the mounting module 12.
  • the mounting modules 12 have the same configuration except for replaceable parts such as a mounting head, a component supply device, and a nozzle stocker, which will be described later, and the direction in which they are arranged is the circuit board transport direction.
  • the direction in which the mounting modules 12 are arranged is referred to as the left-right direction, and the horizontal direction orthogonal thereto is referred to as the front-back direction. That is, the left front in FIG. 1 is the front of the mounting unit 1 and the electronic circuit component mounting system. The left side of the mounting unit 1 is the upstream side and the right side is the downstream side. The circuit board is transported from the mounting module 12 located on the left to the mounting module 12 located on the right. The component mounting work in each module is performed sequentially.
  • Each of the mounting modules 12 arranged in the mounting unit 1 is assumed to have a function as an electronic circuit component mounting machine, and in the context of the present invention, one of the mounting modules 12 Each one can be thought of as an electronic circuit component placement machine, or an assembly of mounting units 1 can be considered as one electronic circuit component placement machine.
  • the mounting module 12 on the right side is shown without an outer plate.
  • each mounting module 12 is configured to include a frame 14 functioning as a frame of the module and various devices disposed on the frame 14.
  • a component feeder 18 equipped with a plurality of tape feeders 16 (hereinafter sometimes abbreviated as “feeders”), each of which feeds a circuit component one by one at a predetermined component supply location, and transports a circuit board Predetermined function and circuit board work
  • feeders tape feeders 16
  • a board holding device or board conveyor 20 having a function of fixedly holding at a position, a mounting head 21, the mounting head 21 are moved in a work area, and mounting work is performed on the mounting head 21.
  • Head moving device 22 and the like.
  • the mounting module 12 houses an image acquisition device 24 as an electronic circuit component image acquisition device and a suction nozzle which is a component holder described later, between the component supply device 18 and the board conveyor 20. Nozzle stop force 25 is provided as a component holder storage device.
  • each mounting module 12 has a module control device 26 for controlling itself, and the above devices are controlled by the module control device 26.
  • each of the mounting modules 1 and 2 has an operation / display panel 28 as an input / output device at an upper portion thereof. The operation / display panel 28 is connected to a module control device 26 and various commands, information, etc. Of the mounting module 12 and the state of the components of the mounting module 12 and the like are displayed.
  • FIG. 2 shows the mounting head 21 and the head moving device 22 taken out.
  • the head moving device 22 is an XY robot type moving device.
  • the head moving device 22 includes a Y slide device 30 for moving the mounting head 21 forward and backward, and an X slide device 32 for moving the mounted head 21 left and right. It is comprised including.
  • the Y slide device 30 is provided on a beam 34 forming a part of the frame 14, and driven by a Y-axis motor 36 to move the Y slide 38 along a Y guide 40 via a ball screw mechanism.
  • the X slide device 32 is provided on the Y slide 38, and drives the X axis motor 46 to move the X slide 48 along the X guide 50 via a ball screw mechanism.
  • the mounting head 21 is configured to be detachably attached to the X slide 48.
  • the mounting head 21 is moved by the head moving device 22 across the component supply / supply device 18 and the circuit board supported by the board conveyor 20.
  • the X slide 48 is provided with a mark camera 56 (which is a CCD camera) below the X slide 48.
  • This mark force camera 56 functions as a substrate imaging device, and images a reference mark or the like attached to the surface of the circuit board.
  • the mark camera 56 is moved by the head moving device 22 together with the mounting head 21.
  • Fig. 3 shows the mounting head 21.
  • a shield plate 102 described later is omitted in order to clearly show the chil holder 62 and the like.
  • the mounting head 21 includes a head main body 60 and a plurality of generally axial nozzle holding parts 62 held by the head main body 60.
  • Each of the nozzle holding portions 62 has a state in which each axis is parallel to the rotation axis of the head body 60 and the axes are orthogonal to one circumference centered on the rotation axis of the head body 60.
  • suction nozzles 64 as component holders for holding components at the lower ends thereof are detachably held.
  • the nozzle holding portion 62 With the mounting head 21 positioned above the component supply device 18, the nozzle holding portion 62 is lowered, and the suction nozzle 64 at the lower end supplies the component to the feeder 16. The circuit components are taken out. Subsequently, the head body 60 is rotated intermittently, the X slide 48 is moved in the X-axis direction, and the next suction nozzle 64 removes the electronic circuit component. By repeating this operation, electronic circuit components are held in all of the plurality of suction nozzles 64.
  • the mounting head 21 is moved above the image obtaining device 24, and the front images and the side images of all the electronic circuit components held by the mounting head 21 are obtained at once.
  • This imaging will be described later in detail.
  • the mounting head 21 is moved by a force above the circuit board fixedly held by the board conveyor 20. During the movement, the image data of the acquired side image and front image is obtained.
  • the process is performed to determine whether or not the holding posture of the electronic circuit component by the suction nozzle 64 is appropriate and a holding position error.
  • the mounting head 21 is moved above the circuit board, the electronic circuit components are held at the holding position by repeating the rotation and elevation of the nozzle holding part 62 and the intermittent rotation of the head body 60. It is mounted on the circuit board while correcting the error.
  • the bracket 70 detachably attached to the X slide 48 is equipped with a head body rotating device 72 that rotates the head body 60 intermittently, and a nozzle holding part 62.
  • a holding unit elevating device 74 for raising and lowering the head body 60 and a holding unit rotating device 76 for rotating the nozzle holding unit 62 about its axis are provided.
  • the intermittent rotating device 72, the holding portion elevating device 74, and the holding portion rotating device 76 serve as driving sources for the head body rotating motor 80, the holding portion elevating motor 82, and the holding device, respectively. It has a holding part rotating motor 84. Each of these motors is an electric motor capable of accurately controlling the rotation angle of a servomotor or the like.
  • FIGS. 4 and 5 show an imaging state for acquiring a holding state of a plurality of electronic circuit components held by the mounting head 21.
  • the image acquisition device 24 includes a CCD camera 94 including a first lens system 90 and an imaging unit 92, an illumination device 96, and a reflector 98.
  • the imaging section 92 includes a CCD (charge coupled device) image sensor, which is a type of solid-state image sensor in which light receiving elements are arranged in a plane, and the first lens system 90 includes the CCD image sensor.
  • CCD charge coupled device
  • the light that forms all the front and side images of the plurality of electronic circuit components 110 held by the mounting head 21 is condensed and imaged on the imaging surface (light receiving element surface) of the It is.
  • the lighting device 96 has an LED group 114 as a light emitter on the concave spherical surface of the lighting device body 112 and an opening 116 formed in the center of the bottom.
  • the bottom and side surfaces of all electronic circuit components 110 held by the electronic circuit components 110 are illuminated with visible light, and a front image (reflection image of the bottom surface) and a side image of the electronic circuit components are formed. Light is allowed to enter the first lens system 90 and the imaging unit 92 via the aperture 116.
  • the shielding plate 102 has a black inner surface, and absorbs incident light almost completely.
  • the background forming plate 118 provided behind the suction end face of the suction nozzle 64 is also black. Note that the inner surface of the shield plate 102 and the background forming plate 118 do not necessarily have to be blackened, but are colored in blue, and the dark background of the image of the bright electronic circuit component 110 is not required. What is necessary is just to be formed.
  • each of the suction nozzles 64 has its axis also rotated by the head body 60. They are arranged at equal angular intervals in a state parallel to the axes and orthogonal to one circumference centered on the rotation axis of the head body 60.
  • the reflector 98 is provided on the rotation axis of the mounting head 21, has a plurality of reflecting surfaces 120 corresponding to the suction nozzles 64, and has a truncated pyramid shape.
  • Each reflecting surface 120 is defined by each radius of a circle defined by the above-described one circumference (the radius of the circle and each plane including the axis of each suction nozzle 64 and the axis of rotation of the head body 60). (Intersecting line) and the intersection of each radius and each reflecting surface 120 The head body 60 is inclined by 45 degrees with respect to each straight line parallel to the rotation axis of the head body 60. Therefore, the light reflected on the side surface of each electronic circuit component 110 is turned 90 degrees by each reflection surface 120, and the light reflected on the bottom surface of each electronic circuit component 110 is The light is made incident on the first lens system 90 and the imaging unit 92 in a state substantially parallel to.
  • each of the plurality of reflecting surfaces 120 of the reflector 98 is formed by the light forming the side image of the electronic circuit component 110 sucked by each of the plurality of suction nozzles 64.
  • the second lens system 100 is set to the first lens system.
  • the second lens system 100 includes a prism 130 and a lens 132 arranged so as to cover the reflecting surface 120 of the reflector 98.
  • the prism 13 2 is also made of a transparent material having a higher refractive index of light than air. It has a lightening effect.
  • the focus position can only be brought closer to the side surface position and cannot be matched, the depth of field is further increased in this embodiment by increasing the aperture of the CCD camera 94.
  • both the front image 1 2 6 and the side image 1 2 4 Practical enough clarity (sharpness) Has been to be obtained at.
  • the image data representing the side image 1 24 and the front image 1 26 is processed by an image processing computer included in the module control device 26.
  • an electronic circuit by a suction nozzle 64 is provided.
  • Information as to whether or not the holding posture of the component 110 is appropriate is acquired, and a holding position error of the electronic circuit component 110 by the suction nozzle 64 is acquired from the front image 126.
  • the holding position error is a position error in a direction perpendicular to the axis of the suction nozzle 64 at the reference point (for example, the center point) of the electronic circuit component (for example, perpendicular to the axis of the suction nozzle 64).
  • the module control device 26 holds the mounting head 21 with the electronic circuit component 110 whose holding posture of the electronic circuit component 110 due to the suction nozzle 64 is inappropriate, without mounting the electronic circuit component 110 on the circuit board. Correcting only the electronic circuit components 110 whose postures are appropriate and their holding position errors, and correcting the position errors of the circuit board obtained by imaging the reference marks of the circuit board by the mark camera. Attach it.
  • the mounting head 21 stops above the image acquisition device 24 while receiving the electronic circuit component 110 from the component supply device 18 and moving to a position above the circuit board. This is performed in a state where the electronic circuit components 110 are side-view images 124 and the front images 126 of the plurality of electronic circuit components 110 are imaged at once, so that the stop time can be extremely short.
  • the LED group 114 which is the light source of the lighting device 96, can emit light only once to the plurality of electronic circuit components 110, the deterioration is small, the life is long, and the energy is low. Low consumption.
  • both the side image 1 24 and the front image 1 26 are obtained as images based on the visible light reflected on the surface of the electronic circuit component 110.
  • it can also be acquired as a seat image.
  • the background forming plate 118 of the suction nozzle 64 and the inner surface of the shielding plate 100 are made white.
  • the illuminating device 96 emits ultraviolet rays and that the fluorescent material is applied to the lower surface of the background forming plate 118 of the suction nozzle 64 and the inner surface of the shielding plate 100.
  • a silhouette image is obtained.
  • the phosphor layer absorbs ultraviolet light and emits visible light instead.
  • This visible light passes around the electronic circuit component 110 and passes through the first lens system 90 Then, the light enters the imaging unit 92.
  • Ultraviolet rays reflected on the surface of the electronic circuit component 110 also enter the first lens system 90 and the imaging unit 92, but the CCD image sensor of the imaging unit 92 has high sensitivity to visible light, If the sensitivity to ultraviolet light is low, the area corresponding to the electronic circuit component 110 becomes darker, and the area corresponding to the surrounding area becomes brighter. Is obtained as a silhouette image.
  • the second lens system 100 instead of the second lens system 100, as shown in FIG. 6, it is also possible to provide a lens 1334 in close contact with the reflecting surface 120 of the reflector 98, and If the difference between the optical path of the light forming 24 and the optical path of the light forming the front image 1 26 is relatively small, the second lens system 100 or the lens 13 4 is omitted. It is also possible. Instead of providing the second lens system 100 or the lens 134, at least one of the lenses constituting the first lens system 90 has a different focal length between the central part and the outer peripheral part. By doing so, it is also possible to use it as a means for reducing the effect of optical path difference. Further, as shown in FIG.
  • the first lens system 90 includes a lens 140 for condensing light forming the side image 124 and a lens condensing light forming the front image 126. It is also possible to provide a means for reducing the influence of the optical path difference by including both the lenses 140 and 142 with different focal lengths. Further, as shown in FIG. 8, a lens 144 is disposed between the reflector 98 and the first lens system 90 as a means for reducing the influence of an optical path difference, or as shown in FIG. It is also possible to dispose a lens 146 between the container 98 and the electronic circuit component 110 as means for reducing the influence of the optical path difference. It is also possible to use a convex mirror or a concave mirror as means for reducing the effect of the optical path difference. For example, instead of the reflector 98, a reflector 148 having a convex spherical reflecting surface 147 is provided as shown in FIG.
  • a moving device 160 such as an imaging device shown in FIG. 11 is an example.
  • the imaging device or other moving device 160 has the first lens system 90, the imaging unit 92, and the illumination device 96 attached to a bracket 162, and the bracket 162 is attached to a slider 164 and a guide 16 6 Guided to move linearly It is moved by a driving device such as an air cylinder 168.
  • a driving device such as an air cylinder 168.
  • the focal point on the object side is made to coincide with the side surface and the bottom surface of the electronic circuit component 110, respectively, so that a clear side image 124 and a front image 126 can be obtained.
  • the imaging device is not limited to a device in which light receiving elements are arranged in a plane, but may employ a device in which light receiving elements are arranged in a line.
  • Fig. 12 shows an example.
  • Reference numeral 170 denotes a line sensor in which light receiving elements are linearly arranged.
  • the mounting head 21 provided with the head main body 60 and the plurality of nozzle holding portions 62 is attached to the imaging device 17 2 provided with the 170.
  • the electronic circuit component 11 As shown by A, by moving the line sensor 170 along a straight line that intersects at right angles to the longitudinal direction of the line sensor 170 and reading out the signal of the line sensor 170 every time it moves a certain distance, the electronic circuit component 11 The side image 1 2 4 of 0 and the front image 1 2 6 can be acquired by one relative movement. It is needless to say that the illuminating device, the optical system, and the like are desirably suitable for the imaging device 172.
  • the lighting device is not limited to the lighting device 96.
  • a lighting device including half mirrors 180, 182 and a light source 184
  • the half mirror 180 reflects the illumination light from the light source 184 toward the reflector 98, and forms a side image 124 of the electronic circuit component 110 reflected by the reflector 98. It functions to transmit the transmitted light to the first lens system 90 and the imaging unit 92 in a directed manner.
  • the half mirror 18 2 reflects the illumination light from the light source 18 4 toward the bottom surface of the electronic circuit component 110, and transmits the light forming the front image 1 26 reflected by the bottom surface to the first lens. It has a function of transmitting light toward the system 90 and the imaging unit 92. It is also possible to provide a plurality of types of lighting devices. For example, the lighting device 186 shown in FIG. 13 is provided below the lighting device 96 shown in FIG.
  • the electronic circuit components having a ball grid array are the former, and the chips such as resistors and capacitors are the latter. Light it up. Also, one of the front image and the side image may be obtained as a reflection image, and the other may be obtained as a silette image.
  • the arrangement position and orientation of the imaging device are not limited to those of the above embodiment. Les ,.
  • the direction of the light forming the front image and the light forming the side image can be arbitrarily changed using a reflector, and the light can be guided to the imaging devices arranged at various positions in various directions. is there.
  • the present invention is applicable not only to a case where side images and a front image of a plurality of electronic circuit components are acquired, but also to a case where a side image and a front image of a single electronic circuit component are acquired. It is.
  • the mounting head is moved by the head moving device to any position on the XY coordinate plane.
  • the mounting head is held not only by an XY robot type mounting device but also by an intermittent rotating body that rotates intermittently at a fixed position. While the component supply device is moved in the direction of the tangent to the trajectory of the mounting head while the circuit board is held by the board holding device on the XY table, and the XY coordinates are set.
  • the present invention is also applicable to an index type mounting device that can be moved to an arbitrary position in the plane.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un dispositif unique d'acquisition de la vue de face et des vues latérales d'un circuit électronique tenu par une suceuse. Les axes des suceuses (64) sont perpendiculaires au plan d'un cercle et parallèles à l'axe passant par le centre de ce cercle. La surface réfléchissante (120) d'un miroir (98) placé au centre de la suceuse (64) est inclinée à 45°. Une partie de la lumière réfléchie par le côté du circuit (110) tenu par la suceuse (64) ou une partie de la lumière traversant horizontalement le circuit électronique (110) est dirigée vers le bas par la surface réfléchissante (120), puis focalisée par deux optiques (90, 100) sur la surface sensible du capteur CCD d'un module d'imagerie (92), donnant ainsi une image correspondant à une vue latérale (124). De la même façon, une partie de la lumière renvoyée par le fond du circuit électronique (110), ou une partie de la lumière ayant traversé de haut en bas le circuit électronique (110), est focalisée par la première optique (90) sur la surface sensible du capteur d'image CCD de l'unité d'imagerie (92) de façon à former une image correspondant à la vue de face (126).
PCT/JP2003/014758 2002-11-21 2003-11-19 Dispositif et procede d'acquisition d'images d'un circuit electronique WO2004046643A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002338144A JP4234402B2 (ja) 2002-11-21 2002-11-21 電子回路部品像取得装置
JP2002-338144 2002-11-21

Publications (1)

Publication Number Publication Date
WO2004046643A1 true WO2004046643A1 (fr) 2004-06-03

Family

ID=32321878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/014758 WO2004046643A1 (fr) 2002-11-21 2003-11-19 Dispositif et procede d'acquisition d'images d'un circuit electronique

Country Status (2)

Country Link
JP (1) JP4234402B2 (fr)
WO (1) WO2004046643A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104137241A (zh) * 2012-07-12 2014-11-05 株式会社新川 晶粒接合器及接合工具与半导体晶粒的相对位置的检测方法
EP2838333A4 (fr) * 2012-04-12 2015-07-29 Fuji Machine Mfg Machine de montage de composant
EP2882272A4 (fr) * 2012-08-01 2015-07-29 Fuji Machine Mfg Appareil de montage de composants
CN104137241B (zh) * 2012-07-12 2016-11-30 株式会社新川 晶粒接合器及接合工具与半导体晶粒的相对位置检测方法
EP4312251A1 (fr) * 2022-07-26 2024-01-31 Fasford Technology Co., Ltd. Appareil de montage et procédé de fabrication de dispositif à semi-conducteur

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4783335B2 (ja) * 2007-06-19 2011-09-28 ヤマハ発動機株式会社 部品認識装置、表面実装機
JP5014083B2 (ja) * 2007-11-21 2012-08-29 富士機械製造株式会社 吸着ノズルと被吸着部品の側面画像取得装置
JP5202100B2 (ja) * 2008-05-20 2013-06-05 富士機械製造株式会社 撮像装置付保持装置
KR101575286B1 (ko) 2009-04-17 2015-12-22 한화테크윈 주식회사 부품 실장기용 헤드 어셈블리
JP5253540B2 (ja) * 2011-04-14 2013-07-31 富士機械製造株式会社 電子部品装着装置
JP5090583B1 (ja) * 2011-08-29 2012-12-05 パナソニック株式会社 部品実装装置、ヘッド及び部品姿勢認識方法
KR20140071265A (ko) * 2011-08-29 2014-06-11 파나소닉 주식회사 부품 실장 장치, 헤드 및 부품 자세 인식 방법
JP5963500B2 (ja) * 2012-03-29 2016-08-03 ヤマハ発動機株式会社 電子部品装着装置
WO2014147806A1 (fr) * 2013-03-22 2014-09-25 富士機械製造株式会社 Monteur de composants
WO2015001633A1 (fr) * 2013-07-03 2015-01-08 富士機械製造株式会社 Dispositif imageur et équipement de production
JP7316488B2 (ja) * 2019-05-17 2023-07-28 パナソニックＩｐマネジメント株式会社 部品実装装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480802A (en) * 1987-09-24 1989-03-27 Echo Kk Bottle mouth inspecting device
JPH0829146A (ja) * 1994-07-18 1996-02-02 Sanyo Electric Co Ltd 物品側面撮像装置
JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
EP0919804A1 (fr) * 1997-12-01 1999-06-02 Hewlett-Packard Company Système d'inspection d'objet plan
US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
US6307210B1 (en) * 1996-09-17 2001-10-23 Cognex Technology And Investment Corporation Device for imaging object to be inspected and device for inspecting semiconductor package
JP2002280799A (ja) * 2001-03-21 2002-09-27 Fuji Mach Mfg Co Ltd リード位置検出方法，電気部品装着方法およびリード位置検出装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480802A (en) * 1987-09-24 1989-03-27 Echo Kk Bottle mouth inspecting device
JPH0829146A (ja) * 1994-07-18 1996-02-02 Sanyo Electric Co Ltd 物品側面撮像装置
JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
US6307210B1 (en) * 1996-09-17 2001-10-23 Cognex Technology And Investment Corporation Device for imaging object to be inspected and device for inspecting semiconductor package
US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
EP0919804A1 (fr) * 1997-12-01 1999-06-02 Hewlett-Packard Company Système d'inspection d'objet plan
JP2002280799A (ja) * 2001-03-21 2002-09-27 Fuji Mach Mfg Co Ltd リード位置検出方法，電気部品装着方法およびリード位置検出装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2838333A4 (fr) * 2012-04-12 2015-07-29 Fuji Machine Mfg Machine de montage de composant
CN104137241A (zh) * 2012-07-12 2014-11-05 株式会社新川 晶粒接合器及接合工具与半导体晶粒的相对位置的检测方法
CN104137241B (zh) * 2012-07-12 2016-11-30 株式会社新川 晶粒接合器及接合工具与半导体晶粒的相对位置检测方法
EP2882272A4 (fr) * 2012-08-01 2015-07-29 Fuji Machine Mfg Appareil de montage de composants
US9438777B2 (en) 2012-08-01 2016-09-06 Fuji Machine Mfg. Co., Ltd. Component-mounting machine
EP4312251A1 (fr) * 2022-07-26 2024-01-31 Fasford Technology Co., Ltd. Appareil de montage et procédé de fabrication de dispositif à semi-conducteur

Also Published As

Publication number Publication date
JP2004172465A (ja) 2004-06-17
JP4234402B2 (ja) 2009-03-04

Similar Documents

Publication Publication Date Title
WO2004046643A1 (fr) Dispositif et procede d'acquisition d'images d'un circuit electronique
US7089656B2 (en) Electric parts mounting apparatus
EP0966871B1 (fr) Dispositif pour montage d'un composant electronique
KR20010033900A (ko) 스테레오 비젼 라인스캔 센서를 갖는 전자 조립 장치
JP2000504501A (ja) 担体上に構成要素を配置する方法及び機械、並びにこの方法及び機械に使用する較正担体検出装置
JP6138127B2 (ja) 部品実装機
JP2000031697A (ja) 電子部品実装装置における電子部品認識装置および電子部品認識方法
JP2013206910A (ja) 照明装置、撮像装置、部品実装装置、及び基板の製造方法
JP4227833B2 (ja) 部品実装装置
JP2001522997A (ja) 構成素子の位置を検出しかつ／または構成素子の接続部の位置を検出する装置および方法ならびに構成素子の位置を検出しかつ／または構成素子の接続部の位置を検出する装置を備えた装着ヘッド
JP2006140391A (ja) 部品認識装置及び部品実装装置
JP3269045B2 (ja) 電子部品認識装置
CN116520623A (zh) 元件识别装置、识别机构、贴片机及识别方法
JP4278386B2 (ja) 改良された照明器を有するカメラ
JP6721716B2 (ja) 撮像装置及びこれを用いた表面実装機
JPH10176905A (ja) 光沢を有する球冠状突起の撮像，位置特定方法およびシステム
JP2013145123A (ja) 広角反射同軸照明付光学系
US20240214664A1 (en) Camera illumination device with a common lens array for different illumination structures
JP4783335B2 (ja) 部品認識装置、表面実装機
JP4221630B2 (ja) 部品認識装置及び部品実装機
JPH11205000A (ja) 電子部品観察装置および電子部品観察方法
JP3750383B2 (ja) 電子部品実装装置における電子部品認識装置および電子部品認識方法
JP3757662B2 (ja) 電子部品認識装置
JP6001361B2 (ja) 電子部品の搭載方法、部品搭載ヘッドおよび電子部品搭載装置
CN118259519A (en) Camera lighting device with common lens array for different lighting structures

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN US