WO2004038507A1 - 感光性樹脂印刷版原版、その製造方法およびこれを用いた樹脂凸版印刷版の製造方法 - Google Patents
感光性樹脂印刷版原版、その製造方法およびこれを用いた樹脂凸版印刷版の製造方法 Download PDFInfo
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- WO2004038507A1 WO2004038507A1 PCT/JP2003/013478 JP0313478W WO2004038507A1 WO 2004038507 A1 WO2004038507 A1 WO 2004038507A1 JP 0313478 W JP0313478 W JP 0313478W WO 2004038507 A1 WO2004038507 A1 WO 2004038507A1
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- layer
- photosensitive resin
- heat
- printing plate
- sensitive
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
Definitions
- the present invention relates to a photosensitive resin printing plate precursor suitable for digital information transfer, which is developed with water or a liquid containing water as a main component after imagewise exposure, a method for producing the same, and a method for producing a resin relief printing plate thereby. It is about.
- Conventional technology a photosensitive resin printing plate precursor suitable for digital information transfer, which is developed with water or a liquid containing water as a main component after imagewise exposure, a method for producing the same, and a method for producing a resin relief printing plate thereby. It is about.
- a photosensitive resin composition as a printing plate material is generally performed, and has become mainstream in each of the fields of resin relief printing, planographic printing, intaglio printing, and flexographic printing.
- a portion that is soluble in a solvent and a portion that is not dissolved in a solvent are formed in the photosensitive resin layer by bringing the original film into close contact with the photosensitive resin layer and exposing the film with ultraviolet light through the original film. This forms a relief image and is used as a printing plate material.
- Such a printing plate material requires a negative or positive original film, and thus requires time and cost for production.
- the development of the original film requires chemical treatment and also requires treatment of the developing waste liquid.
- CTP computer to plate
- this method may cause damage such as scratches on the cover sheet, which also functions as a protective layer, and has a problem that information transfer is incomplete.
- the method of peeling and developing the infrared-sensitive layer easily peels off even the non-irradiated portion of the infrared laser, and is not suitable for forming a fine image mask.
- the proposal of the CTP method is common.
- the CTP method has also been proposed in the field of resin relief printing, in which a soluble resin is used as the resin instead of an elastomer binder and printing using an oil-based ink is possible.
- the polarities of the photosensitive resin layer composed of are easily similar, and the infrared-sensitive layer and the photosensitive resin layer are easily mixed with time.
- the printing between the plate cylinder and the impression cylinder is set weak because the relief for transferring the image is flexible.
- the flexographic printing plate is suitable for printing on step rolls with steps or soft packaging films that cannot withstand strong printing pressure.
- the printing pressure between the plate cylinder and the impression cylinder can be set to be strong. This is because the relief is hard, so that the relief does not lose its shape due to strong printing pressure, and does not cause deterioration in print quality such as thickening of characters. This is because By increasing the printing pressure using a resin relief printing plate, it is possible to print on metal, which is thickly embossed with ink and gives strength to printed matter, and on which ink is relatively difficult to be transferred.
- a photosensitive resin relief printing plate using the CTP method As a photosensitive resin relief printing plate using the CTP method, a photosensitive resin layer, an oxygen-permeable intermediate layer if necessary, an infrared-sensitive layer opaque to ultraviolet light, and a photosensitive resin formed from a protective layer A letterpress recording material has been proposed (see, for example, US Pat. No. 6,020,108 registration (columns 11 to 12)).
- an image mask is formed from the infrared-sensitive layer by irradiating an infrared laser and the entire surface is exposed to ultraviolet light. Then, the uncured portions of the image mask and the photosensitive layer are removed with the same developer.
- the oxygen-permeable intermediate layer has a role to prevent mass transfer between the photosensitive resin layer and the infrared-sensitive layer and to prevent laser-engraving removal of the photosensitive resin layer.
- the infrared-sensitive layer is a mixture of a water-soluble or water-dispersible binder and a substance that has a function of blocking ultraviolet light and absorbs infrared rays, such as carbon black.
- the infrared-sensitive layer does not have a crosslinked structure and is brittle against external damage, care must be taken when handling after peeling off the protective layer.
- an image mask is formed by irradiating an infrared laser beam onto a photosensitive resin relief printing plate formed of a photosensitive resin layer, a film layer, and an infrared-sensitive layer on a substrate (for example, in Europe). See Japanese Patent Publication No. 1152296 (column 26).
- the image mask is peeled off together with the film layer, and developed with water to obtain a resin relief printing plate.
- the material of the infrared sensitive layer constituting the image mask is not mixed into the developing solution, and it is easy to process the image waste liquid, but the film between the photosensitive resin layer and the infrared sensitive layer is advantageous. If the thickness of the layer is large, bending or scattering of ultraviolet light is apt to occur, and if an ultraviolet light source having low directivity is selected, disadvantages such as an increase in image thickness may be caused.
- an object of the present invention is to provide a photosensitive resin printing plate precursor capable of forming a convex relief image without using an original film, a method of manufacturing the same, and a resin relief plate using the same.
- a printing plate manufacturing method is provided. Disclosure of the invention
- a photosensitive resin 'printing plate precursor having the following constitution. That is,
- a photosensitive resin layer (A) containing a resin soluble or dispersible in water and a monomer curable by ultraviolet light, and a water-insoluble thermal mask layer (C) containing an infrared absorbing substance are provided.
- a method for producing a photosensitive resin printing plate precursor comprising: It is.
- An image mask (C ') is formed by imagewise irradiating the thermal mask layer (C) with an infrared laser
- a method for producing a resin relief printing plate comprising developing with a liquid containing water as a main component to remove an image mask (C ′) and a photosensitive resin layer ( ⁇ ) in an unexposed portion of ultraviolet light.
- the present invention can easily provide a photosensitive resin printing plate precursor capable of forming a convex relief image without requiring an original film. If a photosensitive resin is used, not only a resin relief plate, which is a printing plate having a convex relief, but also a resin relief plate. It can be applied to flexographic, intaglio, lithographic, and stencil printing, but the scope of application is not limited to these.
- the photosensitive resin printing plate precursor of the present invention has a configuration in which a photosensitive resin layer (A) and a heat-sensitive mask layer (C) are laminated in this order on a support.
- the photosensitive resin layer (A) in the present invention needs to contain a resin that can be dissolved or dispersed in water and a monomer that can be cured by ultraviolet light.
- the layer (A) is light-cured by irradiating it with ultraviolet light, preferably light having a wavelength of 300 to 400 nm.
- a photosensitive resin composition is used, and it is preferably formed into a sheet having a thickness of 0.1 to 10 mm.
- the above-described photosensitive resin composition contains a resin that can be dissolved or dispersed in water and a monomer that can be cured by ultraviolet light. Further, a photopolymerization initiator is preferably contained.
- the water-soluble or dispersible resin in the present invention has a function as a carrier resin for keeping the photosensitive resin composition in a solid state and maintaining its form, and also has an effect of improving the water developability of the photosensitive resin layer (A). Used to grant.
- a resin for example, a hydrophilic group such as polyvinyl alcohol, polyvinyl acetate, partially saponified polyvinyl acetate (partially derivatized polyvinyl alcohol), a cellulose resin, an acrylic resin, or a polyethylene oxide is introduced.
- examples include polyamide resins, ethylene-vinyl acetate copolymers and the like, and modified products of these resins. Among them, polyvinyl alcohol, partially degraded polyvinyl alcohol, a polyamide resin having a hydrophilic group introduced therein, and modified products of these resins are preferably used.
- the monomer that can be cured by ultraviolet light is generally a substance that can be crosslinked by radical polymerization.
- the substance is not particularly limited as long as it is a substance which can be cross-linked by radical polymerization, and examples thereof include the following. 2-hydroxyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate,) 5-hydroxy (8)-(meth) acrylate having a hydroxyl group such as (meth) acryloyloxyshethyl phthalate; Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, Alkyl (meth) acrylates such as 2-ethylhexyl (meth) acrylate, lauryl (meth)
- Creat examples thereof include compounds having two or more ethylenic unsaturated bonds, such as polyvalent (meth) acrylamides such as methylenebis (meth) acrylamide, polyvalent vinyl compounds such as divinylbenzene, and the like.
- polyvalent (meth) acrylamides such as methylenebis (meth) acrylamide
- polyvalent vinyl compounds such as divinylbenzene, and the like.
- the photopolymerization initiator preferably used in the present invention is not particularly limited as long as it can polymerize a polymerizable carbon-carbon unsaturated group by light. Among them, those having a function of generating a radical by self-cleavage or hydrogen abstraction are preferably used. Examples include benzoin alkyl ethers, benzophenones, anthraquinones, benzyls, acedophenones, diacetyls and the like.
- ethylene glycol diethylene glycol, triethylene glycol, polyethylene glycol, glycerin, trimethylolpropane, and trimethylolethane are used for the purpose of enhancing compatibility and flexibility.
- Polyhydric alcohols can be added, and a conventionally known polymerization inhibitor can be added in order to increase the thermal stability.
- Preferred polymerization inhibitors include phenols, hydroquinones, and carcols. Further, dyes, pigments, surfactants, ultraviolet absorbers, fragrances, antioxidants and the like can be added.
- the method for obtaining the photosensitive resin layer (A) from the photosensitive resin composition is not particularly limited. For example, after a carrier resin is dissolved in a solvent, a monomer curable by ultraviolet light and a photopolymerization initiator are added. After sufficiently stirring to obtain a photosensitive resin composition solution, the solvent is removed from the solution, and then the mixture is preferably melt-extruded onto a support coated with an adhesive. Alternatively, it can also be obtained by melt-extruding a solution in which a part of the solvent remains on a support coated with an adhesive, and allowing the remaining solvent to air-dry over time.
- the material used for the support in the present invention is not particularly limited, but is preferably a dimensionally stable material.
- a metal plate such as steel, stainless steel or aluminum
- a plastic sheet such as polyester
- a synthetic material such as styrene-butadiene rubber is used. Rubber sheet is an example.
- the heat-sensitive mask layer (C) in the present invention (1) efficiently absorbs infrared laser light. Then, part or all of the layer is temporarily evaporated or ablated by the heat, and a difference occurs between the optical density of the irradiated portion of the laser and the optical density of the non-irradiated portion. (2) It has the function of practically blocking ultraviolet light.
- the heat-sensitive mask layer (C) is a water-insoluble heat-sensitive layer containing an infrared absorbing substance.
- the layer (C) preferably has, in addition to an infrared absorbing substance having a function of absorbing an infrared laser and converting it into heat, a heat decomposable compound having a function of evaporating and ablating by heat and a function of blocking ultraviolet light It contains an ultraviolet absorbing substance having
- having the function of blocking ultraviolet light means that the optical density of the heat-sensitive mask layer (C) is 2.5 or more, and more preferably 3.0 or more.
- the optical density is generally represented by D and is defined by the following equation.
- T is the transmittance (unit:%)
- I 0 is the incident light intensity when measuring the transmittance
- I is the transmitted light intensity
- optical density in the present invention refers to a value calculated from the former transmitted light intensity.
- the optical density can be measured by using a Macbeth transmission densitometer “TR-927J” (manufactured by Kollmorgen Instruments Corp.) using an orthochromatic filter.
- the infrared absorbing material is not particularly limited as long as it can absorb infrared light and convert it into heat.
- black pigments such as carbon black, aniline black, and cyanine black, phthalocyanine, naphthalocyanine-based green pigments, monodamine dyes, naphthoquinone-based dyes, polymethine dyes, dimonium salts, azomonium dyes, chalcogens Dyes, carbon graphite, iron powder, diamine-based metal complexes, dithiol-based metal complexes, phenolthiol-based metal complexes, mercaptophenol-based metal complexes, aryl aluminum metal salts, inorganic compounds containing crystal water, sulfuric acid Copper, chromium sulfide, silicate compound, titanium oxide, acid Metal oxides such as vanadium oxide, manganese oxide, iron oxide, cobalt oxide, and tungsten oxide; hydroxides and sulfates of these metals; and metal powders of
- Ripbon black is particularly preferable in terms of light-to-heat conversion rate, economy, handleability, and ultraviolet absorption function described later.
- Ribbon black is classified into furnace black, channel black, thermal black, acetylene black, lamp black, etc. according to the manufacturing method.
- Fluness black is available in various types in terms of particle size and other aspects.
- y is preferably used because it is commercially inexpensive.
- the amount of the infrared absorbing material used is preferably from 2 to 7% by weight, more preferably from 5 to 70% by weight, based on the total composition of the heat-sensitive mask layer (C). When the content is 2% by weight or more, light-to-heat conversion is performed efficiently. When the content is 75% by weight or less, other components are insufficient, and the problem that the thermal mask layer (C) is easily damaged does not occur.
- thermally decomposable compound preferably used in the layer (C) examples include dinitro compounds such as ammonium nitrate, potassium nitrate, sodium nitrate, and nitrocellulose; organic peroxides; Examples include the metals, metal oxides, and the like listed in the section of the infrared-absorbing substance, such as a lidon, an azo compound, a diazo compound, or a hydrazine derivative. Vinylpyrrolidone and nitrocellulose are preferred.
- the viscosity of the nitrocellulose is preferably 1/16 second to 1 second according to the measurement method specified in ASTMD 301-72, and 1 to 8 seconds to 12 seconds. More preferred.
- the viscosity corresponds to the degree of polymerization of nitrocellulose, and a lower viscosity means a lower degree of polymerization. If the viscosity is at least 116 seconds, the surface of the thermal mask layer (C) will not be easily scratched because the degree of polymerization of nitrocellulose is sufficiently high, and if it is at most 1 second, the viscosity will increase. Inconvenience of handling due to is not caused.
- Nitrocellulose is liable to generate harmful NOX gas when pyrolyzed. If sensitive thermal mask layer (C) contains nitrocellulose, the plate setter for performing mask writing by infrared laser foremost, collecting gas facility inhale the generated NO X. It is necessary to directly connect a facility that decomposes NOx and NOx into harmless compounds, and there is a problem that the plate setter becomes large and expensive.
- This problem can be solved by using a thermally decomposable compound that does not contain a NOX source, such as a nitro group.
- Acrylic resins are relatively easily decomposed by heat and do not contain nitrogen atoms at all, so there is no fear of generating NOX. Therefore, they are particularly preferably used as heat-decomposable compounds replacing nitrocellulose.
- the thermal decomposition temperature of a general acryl resin is 190 ° C to 250 ° C.
- nitrocellulose is not substantially contained.
- substantially free of nitrogen means that the content is 2% by weight or less based on the total composition of the heat-sensitive mask layer (C). This is because if the content of nitrocellulose is 2% by weight or less, the generation amount of NO X can be suppressed to a level that is not problematic for environmental hygiene.
- the acrylic resin refers to a polymer or copolymer of one or more monomers selected from the group consisting of acrylic acid, methacrylic acid, acrylates and methacrylates.
- the amount of the thermally decomposable compound used is preferably 80% by weight or less, more preferably 15 to 60% by weight, based on the total composition of the heat-sensitive mask layer (C). If the amount used is 80% by weight or less, there is no problem that the easily decomposable compound cannot be decomposed well due to a decrease in the amount of the light-to-heat conversion substance described later.
- the ultraviolet absorbing substance preferably used for the layer (C) is not particularly limited, but is preferably a compound having an absorption in the range of 300 nm to 400 nm.
- examples include benzotriazole-based compounds, triazine-based compounds, benzophenone-based compounds, carbon black, and the metals or metal oxides listed for the infrared-absorbing substance.
- bonbon black is particularly preferably used because it has absorption characteristics not only in the ultraviolet light region but also in the infrared light region and functions as a light-to-heat conversion material.
- the amount of the ultraviolet absorbing material used is preferably from 0.1% by weight to 5% by weight, more preferably from 50% by weight to the total composition of the heat-sensitive mask layer (C).
- the heat-sensitive mask layer (C) is laminated directly on the photosensitive resin layer (A) or via an adhesion adjusting layer (B)
- the photosensitive resin layer (A) is a resin soluble or dispersible in water.
- the adhesion adjusting layer (B) described later also contains a resin that can be dissolved or dispersed in water, and is a so-called hydrophilic composition, the heat-sensitive mask layer If (C) has a hydrophilic composition, substance transfer occurs between the layers, and the function unique to each layer is reduced.
- the monomer of the photosensitive resin layer (A) moves to the thermal mask layer (C)
- the laser ablation property of the thermal mask layer (C) will be impaired, and the photosensitive resin layer (A) If an ultraviolet absorbing substance is mixed in, curing by ultraviolet light is inhibited.
- the heat-sensitive mask layer (C) used in the present invention needs to be hydrophobic.
- hydrophobic means that the layer alone has a property that water development is impossible, so-called water-insoluble.
- a metal or metal oxide When used, it is hydrophobic itself, but when an organic substance such as carbon black is used, it is necessary to take measures. Gives water insolubility!
- the method is not particularly limited, but can be achieved by, for example, a method in which the entire composition of the heat-sensitive mask layer (C) is composed of a hydrophobic component, or a method in which a curable resin is used as a binder to crosslink the layer.
- the latter method is preferable because it has the effect of further preventing interlayer mass transfer by polymerizing the composition component and the effect of imparting scratch resistance to the surface of the heat-sensitive mask layer (C).
- a 500 g load (of which the self-weight of the friction element was 200%) was applied to a white cotton cloth wetted with water using a friction tester for dyeing fastness test ⁇ type described in JIS standard L0823. 0 g and an additional weight of 300 g), and rub the surface of the heat-sensitive mask layer (C) with a test method. More preferably, no penetrating scratches are made even after recirculation.
- thermosetting resin used as a binder include, for example, at least one compound selected from the group consisting of a polyfunctional epoxy resin and a polyfunctional epoxy compound, and a urea resin, an amine compound, and a cadmium. And a combination with at least one compound selected from the group consisting of a compound having a hydroxyl group, a compound having a hydroxyl group, a carboxylic acid compound, and a thiol compound.
- a polyfunctional isocyanate compound When a polyfunctional isocyanate compound is used, the reaction is not completed in a short time, so it is necessary to cure at a high temperature.However, when nitrocellulose is used as a thermally decomposable compound, the decomposition temperature is 180 ° C. Therefore, there is a restriction that curing cannot be performed at a higher temperature. Therefore, as a crosslinking method, at least one selected from the group consisting of a polyfunctional epoxy compound and a urea resin, an amine compound, an amide compound, a hydroxyl group-containing compound, a carboxylic acid compound, and a thiol compound is used. Are preferably used.
- examples of the polyfunctional epoxy compound include a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, and a glycidyl ether type epoxy resin.
- Urea resins include butylated urea resin, butylated melamine resin, butylated benzoguanamine resin, butylated urea melamine cocondensation resin, aminoalkyl resin, iso-butylated melamine resin, and methylated meminin resin. Hexamethoxymethyl melamine, methylated benzoguanamine resin, butylated benzoguanamine resin, and the like.
- Examples of the amine compound include diethylenetriamine, triethylenetriamine, tetraethylenepentamine, getylaminopropylamine, N-aminoethylbiperazine, metaxylenediamine, metaphenylenediamine, diaminodiphenylmethane, and diaminotriamine. Diphenyl sulfone, isophorone diamine and the like.
- Examples of the amide compound include a polyamide-based curing agent and dicyandiamide used as a curing agent for an epoxy resin, and examples of the hydroxyl-containing compound include a phenol resin and a polyhydric alcohol. Yes, as Zol-based compounds, many There is a price tag.
- carboxylic acid phthalic acid, hexahydrophthalic acid, phthalic acid phthalic acid, dodecyl succinic acid, pyromellitic acid, oxalic acid, maleic acid, fumaric acid and anhydrides thereof are preferable. used.
- a resin having a single component or a curable resin may be used.
- the resin having curability even when used alone include epoxy resin, melamine resin, urethane resin, crosslinkable polyester resin, crosslinkable polyimide resin, and the like. These resins can be used in combination.
- the amount of the thermosetting resin used is preferably from 10% by weight to 75% by weight, more preferably from 30% by weight to 60% by weight, based on the total composition of the heat-sensitive mask layer (C).
- a crosslinked structure sufficient to impart water insolubility can be obtained, and if it is 75% by weight or less, laser ablation of the heat-sensitive mask layer (C) can be efficiently performed.
- a pigment such as carbon black is used as the infrared absorbing substance, a plasticizer, a surfactant or a dispersing aid may be added to facilitate the dispersion.
- the method for forming the heat-sensitive mask layer (C) is not particularly limited.
- a metal oxide for example, it can be obtained by vapor deposition / sputtering, and when an organic substance such as a carbon black is used,
- the composition can be obtained by coating the heat-sensitive mask layer composition as it is or by dissolving it in an appropriate solvent, followed by heat curing.
- the thickness of the heat-sensitive mask layer (C) obtained by coating is preferably 0.5 ⁇ m to 10j (im, more preferably 1 jUm to 3 jUm, and more preferably 0.5 flm.
- the thermal mask layer (C) obtained by vapor deposition or sputtering of a metal or metal oxide is preferably a thin film as long as a high optical density can be obtained. Thin
- the thickness of the film greatly affects the sensitivity. That is, if the film thickness is too large, the energy required for evaporating and melting the thin film is required extra, and the ablation sensitivity of the thermal mask layer (C) is reduced. Therefore, the thickness of the thin film is preferably 100 nm or less, more preferably 2 to 100 nm, and particularly preferably 4 to 20 nm. Even if the film thickness is thinner than 2 nm, the sensitivity is reduced.
- Vacuum evaporation is preferably used which is one of vapor deposition, specifically, 1 0 one 4 - in a vacuum vessel 1 0- 7 mm H g, vaporized by heating the metal and carbon, thin film on the surface of the substrate Is used.
- a thin film can be formed on the substrate by utilizing the sputtering phenomenon of the earth electrode.
- a carbon thin film layer As a thin film layer that provides a high optical density required in the present invention, a carbon thin film layer can be cited first.
- the carbon thin film here is not a so-called diamond thin film or graphite thin film but an amorphous carbon thin film.
- the amorphous carbon thin film can be selectively obtained by performing ordinary vacuum evaporation such as ion beam evaporation or ionization evaporation or sputtering such as ion beam sputtering.
- the vacuum vapor deposition conditions for forming the thin carbon film for example, in 1 0 one 4-vacuo container 1 0- 7 mm H g, vaporized by heating the carbon, preferably a method for forming a thin film on the surface of the substrate used. Since carbon has a high melting point of 3923 K, it is preferable to elongate the heating temperature and the vapor deposition time of carbon for vapor deposition.
- a method of forming a thin film on a substrate using the sputtering phenomenon is preferably used. In this method, a thin film can be formed relatively easily even with carbon having a high melting point.
- the thin film layer that provides the heat-sensitive mask layer (C) include a carbon thin film layer and a metal thin film layer. Specific examples of the metal include the following, but are not limited thereto.
- tellurium, tin, antimony, gallium, magnesium, polonium, selenium, thallium, zinc, bismuth, and aluminum are used.
- the metal preferably used for the layer (C) the higher the metallic gloss, the greater the reflection of the laser on the surface. Therefore, from the viewpoint of sensitivity, the metal is preferably a material with low metallic gloss.
- any metal can be preferably used as long as it is a metal that evaporates or melts instantaneously or partially and has a melting point of 2000 K or less. . If the melting point is higher than 2000 K, it takes a long time to evaporate or melt even when irradiating the laser, and as a result, the sensitivity to ablate the layer (C) will be reduced. . As for the melting point, it is more preferably 100 K or less.
- tellurium, tin, antimony, gallium, magnesium, polonium, selenium, thallium, zinc, bismuth, and aluminum are preferably used, and more preferably tellurium (melting point: 449.8 ° C), tin ( Melting point: 2332 ° C), zinc (melting point: 49.5 ° C), aluminum (melting point: 66.4 ° C).
- tellurium, tin, antimony, gallium, magnesium, polonium, selenium, thallium, zinc, bismuth, and aluminum are preferably used, and more preferably tellurium (melting point: 449.8 ° C), tin ( Melting point: 2332 ° C), zinc (melting point: 49.5 ° C), aluminum (melting point: 66.4 ° C).
- the metal preferably used in the layer (C) it is particularly preferable to use two or three or more alloys of the above-mentioned metals because the melting point is easily reduced and the sensitivity is improved. .
- tellurium and tin, tellurium And antimony, tellurium and gallium, perlul and bismuth, perlul and zinc alloys are preferred, and more preferably tellurium and zinc, and tellurium and tin alloys.
- the alloys of tellurium and tin and zinc, tellurium and gallium and zinc, tin, antimony and zinc, tin, bismuth and zinc are preferred, and more preferably perl, tin and zinc, and tin And bismuth and zinc alloys.
- the method for forming such a metal thin film is not particularly limited, but is preferably performed by any one of vacuum deposition and sputtering.
- a thin film layer containing carbon and metal can also be used as the thin film layer for providing the thermal mask layer (C).
- C thermal mask layer
- many metals can be used.
- the metal or alloy used at this time is not particularly limited as long as it can perform vapor deposition and sputtering, but a metal having a melting point of 200 K or less is preferable, and 100 K or less is more preferable. If the melting point is higher than 2000 K, it is difficult to form an image even when carbon is simultaneously deposited or sputtered.
- the weight percent of carbon in the formed thin film is preferably 10% by weight or more, more preferably 30% by weight or more. If the amount of carbon is less than 10% by weight, the absorptivity of the infrared laser is reduced and the sensitivity is apt to be reduced.
- An adhesion adjusting layer (B) may be provided between the photosensitive resin layer (A) and the thermal mask layer (C).
- the adhesion adjusting layer (B) has a too strong adhesion between the layers (A) / (C) in order to strengthen the adhesion between the layers (A) / (C) when the adhesion of the layers (A) / (C) is weak.
- the layer (C) is provided to suppress the adhesive strength between the layers.
- the adhesion adjusting layer (B) has a function of reliably preventing mass transfer between the layers (A) and Z (C) and a role of preventing the photosensitive resin layer (A) from being ablated by laser.
- the adhesion between the layers (A) and Z (C) is too strong, there may be cases where one or both layers have strong adhesion or each layer contains a functional group that contributes to adhesion. . In such cases, adjust the adhesion to suppress the adhesion between the layers Layer (B) can be installed.
- the layer (A) / (C) has strong adhesion, the object can be achieved by using a resin used for preventing adhesion, for example, polyvinyl alcohol / cellulose. If each layer contains their respective a functional group contributing to the adhesion, have yo be used those functional groups and low interaction resin 0
- (B) is preferably a compound having both a hydrophilic group and a hydrophobic group.
- a resin soluble or dispersible in water may be used, and the resin soluble or dispersible in water described in the section of the photosensitive resin layer (A) may be used. It is preferably used.
- polyvinyl alcohol, polyvinyl acetate, partially modified polyvinyl acetate (partially modified polyvinyl alcohol), cellulose resin having a hydrophilic group such as cellulose resin, acryl resin, polyethylene oxide, and ethylene acetate A vinyl copolymer is preferably used. It is optional to add additives such as a surfactant to these resins.
- the adhesion adjusting layer (B) may be diffused and moved to the photosensitive resin layer (A) to be assimilated with the layer (A).
- the thickness of the adhesion adjusting layer (B) is preferably 15 jUm or less, more preferably from 0.3 m to 5 m. When it is 15 / m or less, bending and scattering of light due to the layer upon exposure to ultraviolet light are suppressed, and a sharp relief image is obtained. When the thickness is 0.3 / m or more, the formation of the adhesion adjusting layer (B) becomes easy.
- a protective layer (E) may be provided on the thermal mask layer (C).
- the layer (E) can be used for the purpose of protecting the thermal mask layer (C) from damage.
- a polymer film that can be peeled off from the heat-sensitive mask layer (G) is preferably used.
- Such protective layers (E) include, for example, polyesters, polyforces—ponates, polyamides, fluoropolymers, polystyrene, polyethylene, Examples include films such as polypropylene. Alternatively, release paper coated with silicone or the like can be used as the layer (E).
- the thickness of the protective layer (E) is preferably from 25 to 200 m, more preferably from 50 to 150 m. If it is 25 m or more, it is easy to handle, and the function of protecting the heat-sensitive mask layer (C) from trauma is exhibited. If it is 200 jum or less, it is inexpensive and economically advantageous. In addition, it has the advantage of being easily peeled.
- An auxiliary release layer (D) may be provided on the heat-sensitive mask layer (C).
- Layer (D) is preferably provided between layer (C) and layer (E).
- the release auxiliary layer (D) has a function of easily releasing only the release auxiliary layer (D), only the protective layer (E), or both the protective layer (E) and the release auxiliary layer (D) from the photosensitive resin printing plate precursor. It is preferred to have. If the protective layer (E) and the thermal mask layer (C) are directly laminated and the adhesion between the two layers is strong, the protective layer (E) cannot be peeled off or the thermal mask layer (C) peels off together. there is a possibility.
- the release assisting layer (D) has a strong adhesive strength with the thermal mask layer (C) and a weak adhesive strength with the protective layer (E) so that it can be peeled off. It is preferable that the adhesive layer be made of a material having a weak adhesive strength and a strong adhesive strength with the protective layer (E). After the protective layer (E) is peeled off, the peeling assisting layer (D) may remain on the heat-sensitive mask layer side and become the outermost layer. It is preferably substantially transparent to be exposed.
- Materials used for the release auxiliary layer (D) include polyvinyl alcohol, polyvinyl acetate, partially degraded polyvinyl alcohol, hydroxyalkyl cellulose, alkyl cellulose, and polyamide resin, which can be dissolved or dispersed in water. It is preferable to use a resin having low tackiness as a main component. Among them, from the viewpoint of adhesiveness, partially degraded polyvinyl alcohol having a degree of degradation of 60 to 9.9 mol%, hydroxyalkyl cellulose having an alkyl group having 1 to 5 carbon atoms, and alkylcell mouth are used. Particularly preferably used.
- the layer (D) may further contain an infrared absorbing substance and / or a thermally decomposable substance so as to be easily ablated by infrared rays.
- an infrared absorbing substance and / or a thermally decomposable substance so as to be easily ablated by infrared rays.
- infrared-absorbing substances and pyrolytic substances those described above can be used.
- a surfactant may be added for improving coating properties and wettability.
- the thickness of the release auxiliary layer (D) is preferably 6 m or less, more preferably 0.1 m or more and 3 m or less. If it is 6 m or less, the laser ablation property of the lower thermal mask layer (C) is not impaired. When the thickness is 0.1 m or more, formation of the layer (D) is easy.
- the peeling force per cm is preferably 0.5 to 20 gZ cm, and 1 ⁇ 15 gcm is more preferred. If it is 0.5 gZcm or more, it is possible to work without peeling the protective layer (E) during the work.If it is 20 gZcm or less, the protective layer (E) should be peeled off without difficulty. Is preferred.
- a photosensitive resin layer (A;), an optional adhesive adjustment layer (B), a heat-sensitive mask layer (C), a release auxiliary layer (D), and a protective layer (E) are sequentially formed on a substrate. It is an original plate with a laminated structure.
- a thermal mask sheet comprising a layer (D), a layer (C) and, if necessary, a layer (B) laminated on the protective layer (E) by a coating method, and a photosensitive layer comprising a layer (A) laminated on a substrate. It can be obtained by laminating with a conductive resin sheet.
- the lamination method is not particularly limited.
- a method in which the surface of the layer (A) or the layer (B) is swollen with water and / or alcohol, and a heat-sensitive mask sheet is bonded, or the same as or similar to the layer (A) There are a method of pouring a high-viscosity liquid having a composition between a light-sensitive resin sheet and a heat-sensitive mask sheet and bonding them together, and a method of pressing with a press at room temperature or while heating.
- the second example is an original having a structure in which a photosensitive resin layer (A :), an optional adhesion adjustment layer (B), and a heat-sensitive mask layer (C) are sequentially laminated on a substrate.
- the layer (B) is provided on the photosensitive resin sheet obtained by laminating the photosensitive resin layer (A) on the substrate by the method described in the first example, the components of the layer (B) are dissolved.
- the liquid in which the components of the heat-sensitive mask layer (C) are dissolved or dispersed is coated, heated and cured by coating and drying the liquid.
- a layer (C) and optionally a layer can be applied to the release paper using a similar coating method.
- a heat-sensitive mask sheet in which (B) is sequentially laminated is prepared.
- a photosensitive resin sheet in which layer (A) is laminated on a substrate and a heat-sensitive mask sheet, and layer (A) is layer (B) it can be obtained by laminating so as to be in contact with layer (C) and then peeling off the release paper. Peeled release paper has the advantage that it can be reused for the same purpose.
- the third example is an original plate having a structure in which a photosensitive resin layer, an optional adhesive adjustment layer (say), a heat-sensitive mask layer (C), and a release auxiliary layer (D) are sequentially laminated on a substrate.
- This master can be obtained by removing the protective layer (E) from the master obtained in the first example.
- This example has the advantage that the protective layer (E) can be reused.
- the fourth example is an original plate having a structure in which a photosensitive resin layer (A), an optional adhesion adjusting layer (B), a heat-sensitive mask layer (C), and a protective layer (E) are sequentially laminated on a substrate.
- a heat-sensitive mask sheet in which a layer (G) and, if necessary, a layer (B) are laminated on the protective layer (E) by a coating method, and a photosensitive resin sheet in which a layer (A) is laminated on a substrate. can be obtained by laminating
- the photosensitive resin printing plate precursor obtained as described above can be used to produce a resin relief printing plate through the following steps.
- the method for producing a resin relief printing plate according to the present invention includes: (1) a step of preparing the above-described photosensitive resin printing plate precursor; and (2) imagewise irradiation of the heat-sensitive mask layer (C) with an infrared laser. (3) a step of forming a latent image on the photosensitive resin layer (A) by exposing from the side of the formed image mask (C ') using ultraviolet light, and (4) The process comprises developing with a liquid containing water as a main component, removing the image mask (C ') and the photosensitive resin layer (A) in the unexposed portion of the ultraviolet light, and thereafter, drying the developer.
- an infrared laser beam is imagewise applied to the thermal mask layer (G). Irradiation preferably forms an image mask (C '). More preferably, the layer (D) and the layer (E) are present, and after peeling off only the layer (E), the thermal mask layer (C) is irradiated imagewise with an infrared laser to form an image mask. Forming (C ') It is.
- the step of forming an image mask (C ') by imagewise irradiating the thermal mask layer (C) with an infrared laser is to turn on and off the infrared laser based on the image data, This is a step of performing scanning irradiation on (C).
- the infrared laser is irradiated, the heat-sensitive mask layer (C) generates heat due to the action of the infrared absorbing substance, and the heat decomposes the heat-decomposable compound to remove the heat-sensitive mask layer (C).
- Laser is ablated.
- the laser ablated portion has a significantly reduced optical density and is substantially transparent to ultraviolet light.
- An image mask (C ') capable of forming a latent image on the photosensitive resin layer (A) can be obtained by selectively ablating the heat-sensitive mask layer (C) based on the image data.
- An infrared laser having an oscillation wavelength in the range of 750 nm to 300 rim is used for one irradiation with the infrared laser.
- lasers include, for example, ruby lasers, alexandrite lasers, perovskite lasers, solid state lasers such as Nd-YAG lasers and emerald glass lasers, ⁇ n GaAsP, Examples include semiconductor lasers such as InGaAs and GaAsAI, and dye lasers such as oral damine dyes.
- a fiber laser that amplifies these light sources by a fiber can also be used.
- semiconductor lasers are preferable because they are downsized due to recent technological advances, and are economically more advantageous than other laser light sources.
- Nd-YAGG lasers are also preferable because they have high output, are widely used for dental and medical purposes, and are economically inexpensive.
- the step of forming a latent image on the photosensitive resin layer (A) by exposing from the side of the image mask (C ') using ultraviolet rays includes the step of forming a latent image on the photosensitive resin printing plate material which has been irradiated with laser by the above method. Then, the entire surface is exposed to ultraviolet light, preferably ultraviolet light having a wavelength of 300 to 400 nm, through an image mask (C ′) on which an image has been formed by a laser. This is the step of selectively curing the photosensitive resin layer (A) below the laser ablation part in the above.
- UV light enters from the side surface of the photosensitive resin printing plate material, it is preferable to cover the side surface with a cover that does not transmit ultraviolet light.
- a cover that does not transmit ultraviolet light high-pressure mercury lamps, ultra-high pressure mercury lamps, meta Luhalide lamps, xenon lamps, carbon arc lamps, chemical lamps, etc. can be used.
- the portion of the photosensitive resin layer (A) exposed to ultraviolet light changes to a substance that cannot be eluted and dispersed by the developer.
- the step of developing with a liquid containing water as a main component to remove the image mask ( ⁇ ') and the photosensitive resin layer ( ⁇ ) in the unexposed portion of the ultraviolet light includes, for example, a photosensitive resin layer.
- This can be achieved by developing using a brush type washer or a spray type washer having a developer containing water as a main component capable of dissolving and dispersing (A).
- A dissolving and dispersing
- the developer containing water as a main component may contain tap water, distilled water or water as a main component, and may contain an alcohol having 1 to 6 carbon atoms.
- the main component means that the content is 70% by weight or more.
- those obtained by mixing the components of the photosensitive resin layer (A;), the adhesion adjusting layer (B), the heat-sensitive mask layer (C), and the release auxiliary layer (D) into these liquids can also be used.
- the image mask (C ') is made water-insoluble for the purpose of improving scratch resistance, and does not dissolve in water or a developing solution composed of alcohol. However, since it is a thin film that is superior in cost, it can be physically removed by rubbing with a strong stiffness, for example, a brush made of PBT (polybutylene terephthalate). At this time, the removal of the image mask (C ′) can be efficiently performed by using a relatively high-temperature developing water of 30 ° C. to 70 ° C.
- the resin relief printing plate produced by the production method of the present invention is preferably used as a resin relief printing plate that can be mounted on a printing press.
- the water-soluble polyamide resin 1 synthesized above was converted to water ethanol: 50/50
- the resulting mixture was dissolved in a mixed solvent (weight ratio) at 80 ° C. so as to have a solid content of 15% by weight to obtain a coating liquid composition 2 for an adhesion adjusting layer (B 1).
- a coating solution composition for the photosensitive resin layer (A 1) on a substrate obtained by applying a polyester adhesive to a 250-m-thick polyester film “Lumila-I” S 10 (manufactured by Toray Industries, Inc.). Was cast and dried at 60 ° C. for 2 hours to obtain a photosensitive resin sheet 1 having a thickness of 950 m including the substrate.
- the thickness of the photosensitive resin sheet 1 is set on a substrate with a spacer having a predetermined thickness, and the coating solution composition 1 in the portion protruding from the spacer is measured with a horizontal metal scale. I did it by pumping out. ⁇ Manufacture of thermal mask element 1>
- a polyester film "Lumira I” S10 manufactured by Toray Industries, Inc. having a thickness of 1 OO jl / m was used as a layer (E), and a coating liquid composition 4 was applied on the film using a bar coater. The resultant was applied to a dry film thickness of 0.5 m and dried at 120 ° C for 30 seconds to obtain a laminate of a peeling auxiliary layer (D 1) and a protective layer (E).
- the coating liquid composition 3 was applied using a bar coater so that the dry film thickness became 2 / m, 140 °
- the resultant was dried at C for 20 seconds to obtain a heat-sensitive mask element 1 which is a laminate of the heat-sensitive mask layer (C 1), the peeling auxiliary layer (D 1), and the protective layer (E).
- the optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 1 was 3.3.
- the coating liquid composition 5 was applied to a 100 m thick polyester film "Lumirror” S10 (manufactured by Toray Industries, Ltd.) using a bar coater to a dry film thickness of 0.5 jwm. Coating and drying at 120 ° C. for 30 seconds to obtain a laminate of a release auxiliary layer (D 2) and a protective layer (E). ,
- the coating solution composition 3 was applied to the release auxiliary layer (D 2) side of the laminate thus obtained using a bar coater so that the dry film thickness became 2 ⁇ m, and 140 °
- the resultant was dried with C for 20 seconds to obtain a heat-sensitive mask element 2 which was a laminate of the heat-sensitive mask layer (C 1), the peeling auxiliary layer (D 2) and the protective layer (E).
- the optical density (Ol Socchromatic filter, transmission mode) was 3.5.
- the coating composition 3 was applied to the release auxiliary layer (D 2) side of the thus obtained laminate using a bar coater so that the dry film thickness became 2 m, 140 ° C For 20 seconds, to obtain a laminate of the heat-sensitive mask layer (C 1) / the release auxiliary layer (D 2) and the protective layer (E).
- the coating liquid composition 2 is applied on the heat-sensitive mask layer (C 1) using a bar coater to a dry film thickness of 1 m, dried at 120 ° C. for 30 seconds, and adhered.
- a heat-sensitive mask element 3 which was a laminate of the adjustment layer (B 1), the heat-sensitive mask layer (C 1), the release auxiliary layer (D 2), and the Z protective layer ( ⁇ ) was obtained.
- the optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 3 was 3.5.
- a photosensitive resin printing plate precursor 1 was obtained in which the resin layer (A 1), the heat-sensitive mask layer (C 1), the release assisting layer (D 1) ′ and the protective layer (E) were laminated in this order.
- the outer drum type plate setter "CDISPARK" manufactured by Esco Graphics Co., Ltd. equipped with a fiber laser having a light emitting region in the infrared Attached so that the substrate side is in contact with the drum, a test pattern with a resolution of 156 lines (solid area, 1% to 99% halftone dots, 1 to 8 point thin lines, 1 to 8 point white areas) ), And A thermal mask layer (C 1) was formed on the image mask (C 1 ′).
- the solid thermal mask layer (C 1) is substantially laser-ablated and laser excavation on the surface of the lower photosensitive resin layer (A 1) is performed. No adverse effects due to excessive laser output such as distortion of the drawing pattern occurred.
- the heat-sensitive mask layer (C 1) was cross-linked, so it was resistant to trauma and was easy to handle such as mounting the platesetter.
- a dye-friction fastness tester type ⁇ , tester described in JIS standard L0823, manufactured by Daiei Kagaku Seiki Seisakusho Co., Ltd. was used.
- the heat-sensitive mask layer (C 1) itself is cross-linked and hydrophobic, so it is insoluble in water. However, by reducing the thickness of the layer (C 1) to 2 jW m, it can be removed with a stiff brush. As a result, the layer (C 1J was developed with water. The resulting relief did not contain the black image mask (C 1 ′) and only the photosensitive resin layer (A 1) The heat-sensitive mask layer (C 1) was cross-linked and had a water-insoluble property, so that the hydrophilic photosensitive resin layer (A 1) This was because each layer existed independently without being mixed with the first embodiment.
- Example 1 was the same as Example 1 except that the thermal mask element 2 was used.
- a photosensitive resin printing plate precursor 2 in which the photosensitive resin layer (A 1), the Z thermal mask layer (C 1), the release auxiliary layer (D 2), and the protective layer (E) were laminated in this order was obtained.
- Drawing was performed in the same manner as in Example 1, except that the thermal mask layer (C 1) in the solid portion was substantially ablated by laser with an output of 6 W and a drum rotation speed of 500 rpm. No adverse effects due to excessive laser output such as laser excavation on the surface of the resin layer (A 1) and distortion of the drawing pattern occurred.
- Example 3 Since the infrared absorbing agent was added to the release auxiliary layer (D 2) on the thermal mask layer (C 1), the release auxiliary layer (D 2) was easily ablated by laser. It is now possible to draw at higher drum rotation speeds (that is, lower laser output per spot). Further, as in Example 1, when exposure was performed using an ultrahigh-pressure mercury lamp and development was performed using a brush-type developing machine, a sharp relief was obtained.
- Example 3 when exposure was performed using an ultrahigh-pressure mercury lamp and development was performed using a brush-type developing machine, a sharp relief was obtained.
- a mixed solvent of water / ethanol 70/30% by weight is applied using a bar coater # 20 to form a photosensitive resin.
- the resin layer (A 1) is swollen, and a roller is pressed so that the adhesive adjustment layer (B 1) of the thermal mask element 3 comes in contact with the photosensitive resin (A 1).
- a photosensitive resin printing plate precursor 3 was obtained in which the resin layer (A 1), the Z adhesion adjusting layer (B 1), the thermal mask layer ( ⁇ ), the release auxiliary layer (D 2), and the protective layer (E) were laminated in this order. .
- a 100 jum-thick polyester film "Lumira I” S10 (manufactured by Toray Industries, Inc.) was used as the layer (E), and the coating liquid composition 7 was applied on the film using a bar coater. Coating was performed to a dry film thickness of 6 m, and drying was performed at 120 ° C for 30 seconds to obtain a laminate of a heat-sensitive mask layer (C 2) and a protective layer (E).
- the coating liquid composition 6 was applied to the heat-sensitive mask layer (C 2) side of the thus obtained laminate using a bar coater so that the dry film thickness became 5 ⁇ 1 m, 1 2 After drying at 0 ° C. for 20 seconds, a heat-sensitive mask element 4 as a laminate of the adhesion control layer (B 2) and the heat-sensitive mask layer (C 2) and the protective layer (E) was obtained.
- the optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 4 was 3.4. Comparative Example 1 '
- a mixed solvent of water / ethanol 70/30% by weight is applied using a bar coater # 20 to form a photosensitive resin.
- the layer (A 1) is swollen, and a roller is pressed so that the adhesive adjustment layer (B 2) of the thermal mask element 4 is in contact with the photosensitive resin (A 1).
- the photosensitive resin printing plate precursor 4 was obtained in which the layer (A 1), the adhesion adjusting layer (B 2), the heat-sensitive mask layer (C 2), and the protective layer (E) were laminated in this order.
- drawing using a plate setter, exposure using an ultra-high pressure mercury lamp, and development using a brush type developing machine were performed.
- the heat-sensitive mask layer (C 2) is made of water-soluble black and water-soluble resin.
- the film strength was weak because it was only dispersed in a partially modified polyvinyl alcohol, and the plate was easily scratched during handling.
- the scratch resistance of the heat-sensitive mask layer (C 2) was evaluated in the same manner as in Example 1, a penetrating scratch was found in a single reciprocal rub. If the heat-sensitive mask layer (C 2) is damaged, there is no function of blocking ultraviolet light at that part, and the part that is desired to be prevented from being cured by ultraviolet light is cured. As a result, unnecessary relief is formed, which is not preferable as a printing plate.
- the heat-sensitive mask layer (C 2) uses a water-soluble resin as a binder in order to develop water development, and with the passage of time, the adhesion control layer (B 2) and the photosensitive resin layer (A It was observed that the components of the thermal mask layer (C 2) were mixed in 1). Since the components of the heat-sensitive mask layer (C 2) were mixed in the photosensitive resin layer (A 1), photo-curing failure was likely to occur in the mixed portion, and satisfactory relief could not be obtained. Synthesis of water-soluble polyamide resin 2>
- IRGACURE 65 1 (Benzyldimethylketal, Ciba Geigy Corporation) 0.1 part by weight, "IRGACURE” 184 1.5 parts by weight, "Suminol Fast Cyanine Green G cone.” (Acid dye, Color Index C.
- Byron 31 SS toluene solution of unsaturated polyester resin, manufactured by Toyobo Co., Ltd.
- PS-8A benzoine ethyl ether, manufactured by Wako Pure Chemical Industries, Ltd.
- Gohsenol 17 polyvinyl alcohol with a degree of degradation of 78.5% to 81.5%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.
- Solmix H111 (alcohol The mixture was dissolved in a mixed solvent of 200 parts by weight and 200 parts by weight of water at 200 ° C. for 2 hours at 70 ° C., followed by “Blemma-1” G (glycidyl methacrylate, Japan) 1.5 parts by weight were added and mixed for 1 hour.
- (dimethylaminoethyl methacrylate) Z (2-hydroxyethyl methacrylate) (methacrylic acid) copolymer ( Kyoeisha Chemical Co., Ltd.) 3 parts by weight, "IRGACURE” 651 (benzyl dimethyl ketal, Ciba 'Geigy Corporation) 5 parts by weight, "Epoxy ester” 70 PA (propylene glycol monodiglycidyl ether) Acrylic acid adduct from Kyoeisha Chemical Co., Ltd. ) 21 parts by weight and 20 parts by weight of ethylene glycol diglycidyl ether dimethacrylate are added, mixed for 90 minutes, cooled to 50 ° C, and then cooled to 50 ° C. "Florald” TMFC-430 (Sumitomo 3LEM Co., Ltd.) 0.1 part by weight was added and mixed for 30 minutes to obtain an adhesive composition 2.
- the adhesive layer composition 1 is applied on a 250 / im thick "Lumirror” T60 (polyester film, manufactured by Toray Industries, Inc.) with a bar coater to a thickness of 40 / m after drying. Then, the mixture was placed in an oven at 180 ° C for 3 minutes to remove the solvent, and then the adhesive layer composition 2 was coated thereon with a bar coater so as to have a dry film thickness of 30 m. The substrate was dried for 3 minutes with the first step to obtain an adhesive-coated substrate 2.
- the coating liquid composition 8 for the photosensitive resin layer (A 2) is cast on the adhesive-coated surface of the adhesive-coated substrate 2 and dried in an oven at 60 ° C. for 5 hours.
- a photosensitive resin sheet 2 having a thickness of about 900 m was obtained.
- the thickness of the photosensitive resin sheet 2 is determined by setting a predetermined thickness of a spacer on the substrate, and applying a coating solution composition 8 protruding from the spacer using a horizontal metal scale. Controlled by pumping.
- Gothsenol AL-06 (Polyvinyl alcohol with a chemical degree of 91% to 94%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 4 parts by weight of water 55 parts by weight, methanol 14 parts by weight was dissolved in 10 parts by weight of n-propanol and 10 parts by weight of n-butanol to obtain a coating liquid composition 9 for a release auxiliary layer (D 3).
- Dispersion 3 contains "Alaldite” 607 1 epoxy resin, Asahi Chiba Co., Ltd.) 20 parts by weight, “Uban” 2061 (melamine resin, Mitsui Chemicals, Inc.) 2 7 parts by weight, 0.7% by weight of “light ester” P-1M (phosphoric acid monomer, manufactured by Kyoeisha Chemical Co., Ltd.) and 140 parts by weight of methyl isobutyl ketone were added, and the mixture was added for 30 minutes. Thereafter, dimethylene glycol monoethyl acetate was added so that the solid content concentration was 33% by weight to obtain a coating liquid composition 11 for the heat-sensitive mask layer (C 3). Was.
- the coating liquid composition 10 was applied using a bar coater so that the dry film thickness became 2 m, and 140 ° C.
- the resultant was dried with C for 90 seconds to obtain a heat-sensitive mask element 5 which was a laminate of the heat-sensitive mask layer (C 3), the release assisting layer (D 3), and the protective layer (E).
- the optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 5 was 3.8.
- the coating liquid composition 9 was applied on the top using a bar coater to a dry film thickness of 0.25 jUm. The coating liquid was dried at 100 ° C for 25 seconds. A laminate of a protective layer (E) was obtained. On the release auxiliary layer (D 3) side of the thus obtained laminate, the coating liquid composition 11 was applied using a bar coater so that the dry film thickness became 2 m. The resultant was dried at 90 ° C. for 90 seconds to obtain a heat-sensitive mask element 6 which is a laminate of the heat-sensitive mask layer (C 4) / the release auxiliary layer (D 3) and the protective layer (E). The optical density (slochromatic filter 1, transmission mode) of the thermal mask element 6 was 3.8. ⁇ Production of thermal mask element 7>
- a 100- ⁇ m-thick polyester film "Lumira-I" S10 (manufactured by Toray Industries, Inc.). Coating was performed as described above, and the coating was dried at 100 ° C. for 25 seconds to obtain a laminate of a release auxiliary layer (D 3) and a protective layer (E). On the release auxiliary layer (D 3) side of the thus obtained laminate, the coating liquid composition 10 was applied using a bar coater so that the dry film thickness became 2 m, and 140 ° C. After drying at C for 90 seconds, a laminate of a heat-sensitive mask layer (C 3), a Z release assist layer (D 3), and a protective layer (E) was obtained.
- the coating liquid composition 12 was applied using a bar coater so that the dry film thickness became 1 j m m, and 140 ° After drying with C for 60 seconds, a heat-sensitive mask element 7 was obtained, which was a laminate of the adhesion control layer (B 3), the heat-sensitive mask layer (C 3), the release auxiliary layer (D 3), and the Z protective layer (E).
- the optical density (orthochromatic filter, transmission mode) of the thermal mask element 7 was 3.8.
- the coating liquid composition 8 is spread on the photosensitive resin layer (A 2) of the photosensitive resin sheet 2, and the heat-sensitive mask layer (C 3) of the heat-sensitive mask element 5 is coated thereon with the coating liquid composition 8. Cover the exposed photosensitive resin layer (A 2) so as to be in contact with it, and perform lamination with a force renderer roll heated to 80 ° C to obtain an adhesive-coated substrate 2 photosensitive resin layer (A 2) Thermal mask layer (C 3) Laminating auxiliary layer (D 3) Protective layer (E) Thus, a photosensitive resin printing plate precursor 5 was obtained. The clearance of the force roll was adjusted so that the thickness of the laminate after peeling the protective layer (E) from the master 5 was 950 m. The developed coating liquid composition 8 is allowed to stand for one week after lamination, and the residual solvent is allowed to dry naturally to form an additional photosensitive resin layer (A 2).
- the solid thermal mask layer (C 3) was practically laser-ablated and the lower photosensitive resin layer (A 2) No harm was caused by excessive laser output such as laser excavation or distortion of the drawing pattern.
- the heat-sensitive mask layer (C3) was cross-linked, so it was resistant to trauma and was easy to handle, such as mounting it on a plate setter.
- the scratch resistance of the heat-sensitive mask layer (C 3) was evaluated in the same manner as in Example 1, the black heat-sensitive mask layer (C 3) penetrated through the black heat-sensitive mask layer (C 3) even after rubbing the surface 10 times. Did not enter.
- the coating liquid composition 8 is spread on the photosensitive resin layer (A 2) of the photosensitive resin sheet 2, and the thermal mask layer (C 4) of the thermal mask element 6 is coated thereon with the coating liquid composition 8. Cover the exposed photosensitive resin layer (A 2) so that it is in contact with the exposed photosensitive resin layer (A 2).
- a photosensitive resin printing plate precursor 6 in which a heat-sensitive mask layer (C 4), a release assist layer (D 3) and a protective layer (E) were laminated in this order was obtained.
- the clearance of the force render roll was adjusted so that the thickness of the laminate after peeling the protective layer (E) from the master plate 6 was 950 m.
- the developed coating liquid composition 8 is allowed to stand for one week after laminating, whereby the remaining solvent is naturally dried to form an additional photosensitive resin layer (A 2).
- the thermal mask layer (C 4) on the solid portion is practically laser-ablated and the laser beam on the surface of the lower photosensitive resin layer (A 2) is removed. No harm was caused by excessive laser output such as excavation or distortion of the drawing pattern.
- the heat-sensitive mask layer (C 3) was cross-linked, so it was resistant to trauma and was easy to handle, such as being mounted on a plate setter.
- the scratch resistance of the heat-sensitive mask layer (C4) was evaluated in the same manner as in Example 1, it was found that the heat-sensitive mask was rubbed 10 times. No penetrating scratch was made in the layer (C 4).
- the resulting relief was not mixed with a black image mask (C 4 ′), was formed only of the photosensitive resin layer (A 2), and had a sharp shape. This is because the heat-sensitive mask layer (C 4) is crosslinked and has a water-insoluble property, so that it does not mix with the hydrophilic photosensitive resin layer (A 2), and each layer exists independently. It is because.
- Example 6
- the coating liquid composition 8 is spread on the photosensitive resin layer (A 2) of the photosensitive resin sheet 2, and the adhesion adjusting layer of the heat-sensitive mask element 7 (B 3) is coated thereon. 8 is covered so as to be in contact with the developed photosensitive resin layer (A 2), and laminated with a calendar roll heated to 80 ° C. ) Adhesion control layer (S 3) No heat-sensitive mask layer (C 3) Release assist layer (D 3) Protective layer ( ⁇ ). The clearance of the calendar roll was adjusted so that the thickness of the laminate after peeling the protective layer ( ⁇ ) from the master plate was 9500 ⁇ m. The developed coating liquid composition 8 is allowed to stand for one week after laminating, whereby the remaining solvent is naturally dried to form an additional photosensitive resin layer (A 2).
- the outer drum type plate setter "CDISPARK" (Esco-Graphics Co., Ltd.) equipped with a fiber-laser that has a light emitting region in the infrared.
- a test pattern with a resolution of 156 lines solid area, 1% to 9.9% halftone dots, 1 to 8 point thin lines, 1 to 8 points having a void portion> drawn, to form an image mask (C 3 ') from the heat-sensitive mask layer (C 3).
- the heat-sensitive mask of the solid portion layer (C 3) was practically laser ablated, and no adverse effects were caused by excessive laser output such as laser excavation on the surface of the lower photosensitive resin layer (A 2) and distortion of the drawing pattern.
- the heat-sensitive mask layer (C 3) is cross-linked and resistant to trauma. Tosetta - handling, such as attachment to it was easy.
- the release auxiliary layer (D 3), the image mask (C 3 ′) and the portion of the photosensitive resin layer (A 2) blocked by the image mask and not exposed to ultraviolet rays were selectively developed, The negative relief was faithfully reproduced for the image mask (C 3 ').
- the heat-sensitive mask layer (C 3) itself is crosslinked and water-insoluble, the heat-sensitive mask layer can be formed by reducing the thickness of the layer (C 3) to 2 m or less and developing it with a stiff brush. (C 3) was mechanically scraped off, and as a result the layer (C 3) was developed.
- the resulting relief did not contain a black image mask (C 3 ′), was formed only of the photosensitive resin layer (A 2), and had a sharp shape. This is because the heat-sensitive mask layer (C 3) is cross-linked and has water-insoluble properties. Therefore, it does not mix with the hydrophilic photosensitive resin layer (A 2), and each layer exists independently. It was because it was.
- thermo mask element 8 having an optical density (Olmatic filter-, transmission mode) of 3.5 was manufactured.
- the heat-sensitive mask element 9 was manufactured in the same procedure except that the layer (C 6), which is a metal deposition film of tellurium, was provided in place of the layer (C 5) in the heat-sensitive mask element 8.
- the optical density of element 9 (orthochromatic filter 1, transmission mode) was 3.8.
- the coating liquid composition 8 was spread on the photosensitive resin layer (A 2) of the photosensitive resin sheet 2, and the coating liquid composition 8 was spread on the heat-sensitive mask layer (G 5) of the heat-sensitive mask element 8. Cover the photo-sensitive resin layer (A 2) so as to be in contact with it, and laminate with a calendar roll heated to 80 ° C. Adhesive coated substrate 2 Photo-sensitive resin layer (A 2) Heat-sensitive mask layer ( C5) A photosensitive resin printing original plate 8 laminated in the order of the peeling auxiliary layer (D3) / protective layer (E) was obtained. The clearance of the force render roll was adjusted so that the thickness of the laminate after peeling the protective layer (E) from the master 8 was 950 m. The developed coating liquid composition 8 is allowed to stand still for one week after lamination, whereby the remaining solvent is naturally dried to form an additional photosensitive resin layer (A 2).
- the laser writing property of the heat-sensitive mask layer (C 5) was the same as in Example 4, and it was possible to write under the conditions of a laser output of 9 W and a drum rotation speed of 500 rpm. Laser drilling and drawing pattern distortion do not occur on the surface of the conductive resin layer (A 2).
- the entire surface was exposed using an ultra-high pressure mercury lamp, and water development was performed to obtain a relief printing plate having a sharp relief.
- the heat-sensitive mask layer (C 5) is a thin metal film of aluminum, it does not mix with the photosensitive resin layer (A 2) and does not adversely affect the photo-curing of the photosensitive resin layer (A 2).
- aluminum metal itself is insoluble in water
- the heat-sensitive mask layer (C5) is an extremely thin film, so it can be scraped off with a stiff brush. As a result, the layer (C5) is developed with water.
- a photosensitive resin printing plate precursor 9 was obtained in the same manner as in Example 7, except that a heat-sensitive mask element 9 was used instead of the heat-sensitive masking element 8.
- the laser writeability of the heat-sensitive mask layer (C 6) was lower than that of Example 7 using an aluminum vapor-deposited film.
- the laser energy was 6 W and the drum rotation speed was 500 rpm. In this case, laser excavation and distortion of the drawing pattern on the surface of the lower photosensitive resin layer (A 2) do not occur.
- the scratch resistance of the thermal mask layer (C 6) was penetrated by seven reciprocations, but there was no practical problem. No mass transfer between the heat-sensitive mask layer (C 6) and the photosensitive resin layer (A 2) is confirmed, and the photo-curing property of the photosensitive resin layer (A 2) is not adversely affected. In addition, tellurium metal itself is insoluble in water, but the heat-sensitive mask layer (C 6) is an extremely thin film, so that it can be removed with a stiff brush. As a result, the layer (C 6) Developed with water.
- thermal mask element 1 used in Example 1, the coating liquid 7 for the layer (C 2) was used instead of the coating liquid 3 for the layer (C 1), and the dry film thickness of the layer (C 2) was changed. All layers were prepared in the same procedure except that the drying condition of the layer (C 2) was changed to 120 ° C. for 30 seconds at 6 m, and the heat-sensitive mask layer (C 2) and the release auxiliary layer (D 1) A laminate of a protective layer (E) A heat-sensitive mask element 10 was obtained. The optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 10 was 3.4. Manufacturing of thermal mask elements 1 1>
- Example 4 the coating liquid 7 for the layer (C 2) was used in place of the coating liquid 10 for the layer (C 3), and the dry film thickness of the layer (C 2) was used. 6 m and the drying condition of the layer (C 2) was changed to 120 ° C. for 30 seconds, except that the heat-sensitive mask layer (C 2) and the release auxiliary layer (D 3) Thus, a heat-sensitive mask element 11 which is a laminate of the protective layer (E) was obtained. The optical density (orthochromatic filter 1, transmission mode) of this thermal mask element 11 was 3.4. Comparative Example 2
- An original plate was manufactured in the same manner as in Example 1 except that the heat-sensitive mask element 10 was used instead of the heat-sensitive mask element 1, and the substrate photosensitive resin layer (A 1) heat-sensitive mask layer (C 2) A photosensitive resin printing plate precursor 10 was obtained as a laminate of the auxiliary layer (D 1) and the protective layer (E).
- the only difference from the master 1 evaluated in Example 1 was that a non-crosslinked and water-soluble heat-sensitive mask layer (C 2) was used instead of the heat-sensitive mask layer (C 1) having a cross-linked structure.
- Example 4 an original plate was manufactured in the same manner except that the heat-sensitive mask element 11 was used instead of the heat-sensitive mask element 5, and the substrate Z photosensitive resin layer (A 2) and heat-sensitive mask layer (C 2) were peeled off. A photosensitive resin printing plate precursor 11 as a laminate of the auxiliary layer (D 3) and the protective layer (E) was obtained.
- the difference from the master 5 evaluated in Example 4 is that, instead of the heat-sensitive mask layer (C 3) having a cross-linked structure, a non-cross-linked water-soluble heat-sensitive mask layer (C 2) has only been used.
- Modified polyvinyl 7col 1 47.5 parts by weight
- Step (3) latent image formation by ultraviolet light
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03758771A EP1555572B1 (en) | 2002-10-24 | 2003-10-22 | Photosensitive resin printing plate original, process for producing the same and process for producing resin relief printing plate therewith |
DE60325257T DE60325257D1 (de) | 2002-10-24 | 2003-10-22 | Druckplattenoriginal mit lichtempfindlichem harz, prozess zu seiner herstellung und prozess zur herstellung einer harzreliefdruckplatte damit |
AU2003275582A AU2003275582B2 (en) | 2002-10-24 | 2003-10-22 | Photosensitive resin printing plate original, process for producing the same and process for producing resin relief printing plate therewith |
CA2502254A CA2502254C (en) | 2002-10-24 | 2003-10-22 | Photosensitive resin printing plate precursor, method for producing the same, and method for producing letterpress printing plate using the same |
US10/530,632 US7205092B2 (en) | 2002-10-24 | 2003-10-22 | Photosensitive resin printing plate original, process for producing the same and process for producing resin relief printing plate therewith |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-309435 | 2002-10-24 | ||
JP2002309435 | 2002-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004038507A1 true WO2004038507A1 (ja) | 2004-05-06 |
Family
ID=32171006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013478 WO2004038507A1 (ja) | 2002-10-24 | 2003-10-22 | 感光性樹脂印刷版原版、その製造方法およびこれを用いた樹脂凸版印刷版の製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7205092B2 (ja) |
EP (1) | EP1555572B1 (ja) |
AT (1) | ATE417301T1 (ja) |
AU (1) | AU2003275582B2 (ja) |
CA (1) | CA2502254C (ja) |
DE (1) | DE60325257D1 (ja) |
ES (1) | ES2319117T3 (ja) |
WO (1) | WO2004038507A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7998659B2 (en) * | 2005-03-11 | 2011-08-16 | Eastman Kodak Company | Photosensitive laminated original printing plate for letterpress printing and process for producing letterpress printing plate using the photosensitive laminated original printing plate |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110262675A1 (en) * | 2006-08-31 | 2011-10-27 | Bridgestone Corporation | Photo-curable transfer sheet, process for the preparation of optical information recording medium using the sheet, and optical information recording medium |
JP5322575B2 (ja) * | 2008-03-28 | 2013-10-23 | 富士フイルム株式会社 | レーザー彫刻用樹脂組成物、画像形成材料、レーザー彫刻用レリーフ印刷版原版、レリーフ印刷版、及びレリーフ印刷版の製造方法 |
US8991312B2 (en) * | 2008-05-23 | 2015-03-31 | Toyo Boseki Kabushiki Kaisha | Flexographic printing original plate |
JP4200510B1 (ja) * | 2008-06-11 | 2008-12-24 | 東洋紡績株式会社 | 感光性フレキソ印刷原版 |
US20090311494A1 (en) * | 2008-06-17 | 2009-12-17 | Fujifilm Corporation | Relief printing plate precursor for laser engraving, relief printing plate, and process for producing relief printing plate |
JP4247725B1 (ja) | 2008-07-16 | 2009-04-02 | 東洋紡績株式会社 | 感光性凸版印刷原版 |
US8883399B2 (en) | 2008-12-18 | 2014-11-11 | Asahi Kasei E-Materials Corporation | Ablation layer, photosensitive resin structure, and method for producing relief printing plate using the photosensitive resin structure |
US8663808B2 (en) | 2009-07-30 | 2014-03-04 | Toyo Boseki Kabushiki Kaisha | Flexographic printing original plate |
JP5710961B2 (ja) * | 2010-12-24 | 2015-04-30 | 住友理工株式会社 | フレキソ印刷版原版 |
AR096578A1 (es) * | 2013-06-11 | 2016-01-20 | Ulterra Drilling Tech Lp | Elementos de pcd y proceso para elaborarlos |
JP2016191813A (ja) * | 2015-03-31 | 2016-11-10 | 東京応化工業株式会社 | ドライエッチング用感光性樹脂組成物、及びドライエッチング用レジストパターンの製造方法 |
EP3323017B1 (de) * | 2015-07-15 | 2019-04-10 | Flint Group Germany GmbH | Laserablatierbarer maskenfilm |
KR102109456B1 (ko) * | 2016-11-10 | 2020-05-13 | (주)엘지하우시스 | 미세 패턴을 가지는 데코레이션 시트 및 이의 제조방법 |
CN111448518B (zh) * | 2017-12-08 | 2023-08-01 | 恩熙思德国有限公司 | 识别用于制造凸版结构的凸版前体的方法 |
TWI717133B (zh) * | 2019-12-06 | 2021-01-21 | 財團法人工業技術研究院 | 鈣鈦礦層的形成方法以及包含鈣鈦礦層的結構的形成方法 |
Citations (4)
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---|---|---|---|---|
US4132168A (en) * | 1974-01-17 | 1979-01-02 | Scott Paper Company | Presensitized printing plate with in-situ, laser imageable mask |
WO1994003838A1 (en) * | 1992-08-07 | 1994-02-17 | E.I. Du Pont De Nemours And Company | A flexographic printing element having an ir ablatable layer and process for making a flexographic printing plate |
EP0741330A1 (en) * | 1995-05-01 | 1996-11-06 | E.I. Du Pont De Nemours And Company | Flexographic element having an infrared ablatable layer and process for making a flexographic printing plate |
EP1152296A1 (en) * | 1999-09-02 | 2001-11-07 | Toray Industries, Inc. | Photosensitive resin printing plate and method for producing photosensitive printing plate having projection |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1296975B (de) * | 1967-11-09 | 1969-06-04 | Kalle Ag | Lichtempfindliches Gemisch |
DE2027467C3 (de) * | 1970-06-04 | 1974-08-15 | Kalle Ag, 6202 Wiesbaden-Biebrich | Photopolymerisierbare Kopiermasse |
US6245486B1 (en) * | 2000-06-30 | 2001-06-12 | Gary Ganghui Teng | Method for imaging a printing plate having a laser ablatable mask layer |
-
2003
- 2003-10-22 EP EP03758771A patent/EP1555572B1/en not_active Expired - Lifetime
- 2003-10-22 US US10/530,632 patent/US7205092B2/en not_active Expired - Lifetime
- 2003-10-22 AU AU2003275582A patent/AU2003275582B2/en not_active Ceased
- 2003-10-22 AT AT03758771T patent/ATE417301T1/de active
- 2003-10-22 WO PCT/JP2003/013478 patent/WO2004038507A1/ja active Application Filing
- 2003-10-22 CA CA2502254A patent/CA2502254C/en not_active Expired - Fee Related
- 2003-10-22 DE DE60325257T patent/DE60325257D1/de not_active Expired - Lifetime
- 2003-10-22 ES ES03758771T patent/ES2319117T3/es not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4132168A (en) * | 1974-01-17 | 1979-01-02 | Scott Paper Company | Presensitized printing plate with in-situ, laser imageable mask |
WO1994003838A1 (en) * | 1992-08-07 | 1994-02-17 | E.I. Du Pont De Nemours And Company | A flexographic printing element having an ir ablatable layer and process for making a flexographic printing plate |
EP0741330A1 (en) * | 1995-05-01 | 1996-11-06 | E.I. Du Pont De Nemours And Company | Flexographic element having an infrared ablatable layer and process for making a flexographic printing plate |
EP1152296A1 (en) * | 1999-09-02 | 2001-11-07 | Toray Industries, Inc. | Photosensitive resin printing plate and method for producing photosensitive printing plate having projection |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7998659B2 (en) * | 2005-03-11 | 2011-08-16 | Eastman Kodak Company | Photosensitive laminated original printing plate for letterpress printing and process for producing letterpress printing plate using the photosensitive laminated original printing plate |
Also Published As
Publication number | Publication date |
---|---|
AU2003275582A1 (en) | 2004-05-13 |
AU2003275582B2 (en) | 2009-01-08 |
US20060008729A1 (en) | 2006-01-12 |
US7205092B2 (en) | 2007-04-17 |
CA2502254A1 (en) | 2004-05-06 |
EP1555572A1 (en) | 2005-07-20 |
CA2502254C (en) | 2010-10-19 |
ATE417301T1 (de) | 2008-12-15 |
EP1555572B1 (en) | 2008-12-10 |
EP1555572A4 (en) | 2007-05-09 |
ES2319117T3 (es) | 2009-05-04 |
DE60325257D1 (de) | 2009-01-22 |
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